U.S. patent application number 16/906392 was filed with the patent office on 2020-12-24 for unit for supplying liquid, apparatus and method for treating substrate having the unit.
This patent application is currently assigned to SEMES CO., LTD.. The applicant listed for this patent is SEMES CO., LTD.. Invention is credited to Gi Hun CHOI, Myung A JEON, Buyoung JUNG, Seong Soo LEE, Soo Young PARK.
Application Number | 20200402818 16/906392 |
Document ID | / |
Family ID | 1000004943308 |
Filed Date | 2020-12-24 |
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United States Patent
Application |
20200402818 |
Kind Code |
A1 |
LEE; Seong Soo ; et
al. |
December 24, 2020 |
UNIT FOR SUPPLYING LIQUID, APPARATUS AND METHOD FOR TREATING
SUBSTRATE HAVING THE UNIT
Abstract
An apparatus and a method for performing liquid treatment for a
substrate are provided. The apparatus for treating the substrate
includes a treating container having a treatment space inside the
treating container, a substrate support unit to support a substrate
in the treatment space, and a liquid supply unit to supply
treatment liquid to the substrate supported by the substrate
support unit. The liquid supply unit includes a nozzle, a supply
line to supply the treatment liquid to the nozzle and having a
first valve mounted in the supply line, and a discharge line
branching from a branch point which is a point downstream of the
first valve in the supply line to discharge the treatment liquid
from the supply line, and having a second valve mounted in the
discharge line. A valve is absent in an area between the branch
point and the nozzle, in the supply line.
Inventors: |
LEE; Seong Soo; (Cheonan-si,
KR) ; JUNG; Buyoung; (Cheonan-si, KR) ; CHOI;
Gi Hun; (Changwon-si, KR) ; JEON; Myung A;
(Yeosu-si, KR) ; PARK; Soo Young; (Incheon,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SEMES CO., LTD. |
Cheonan-si |
|
KR |
|
|
Assignee: |
SEMES CO., LTD.
Cheonan-si
KR
|
Family ID: |
1000004943308 |
Appl. No.: |
16/906392 |
Filed: |
June 19, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/67309 20130101;
H01L 21/67253 20130101; H01L 21/6715 20130101 |
International
Class: |
H01L 21/67 20060101
H01L021/67; H01L 21/673 20060101 H01L021/673 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 24, 2019 |
KR |
10-2019-0075144 |
Claims
1. An apparatus for treating a substrate, the apparatus comprising:
a treating container having a treatment space inside the treating
container; a substrate support unit configured to support a
substrate in the treatment space; and a liquid supply unit
configured to supply treatment liquid to the substrate supported by
the substrate support unit, wherein the liquid supply unit
includes: a nozzle; a supply line configured to supply the
treatment liquid to the nozzle and having a first valve mounted in
the supply line; and a discharge line branching from a branch point
which is a point downstream of the first valve in the supply line
to discharge the treatment liquid from the supply line, and having
a second valve mounted in the discharge line, and wherein a valve
is absent in an area between the branch point and the nozzle, in
the supply line.
2. The apparatus of claim 1, wherein an end of a downstream area of
the supply line based on the branch point is positioned higher than
the discharge line.
3. The apparatus of claim 2, wherein the end of the downstream area
is positioned higher than the branch point.
4. The apparatus of claim 3, wherein an area of the downstream
area, which extends from the branch point in a downstream
direction, has a curved shape.
5. The apparatus of claim 4, wherein the downstream direction is
downward provided in an upstream area of the supply line based on
the branch point, and wherein the curved shape is provided in a
convex-upward shape.
6. The apparatus of claim 5, wherein the liquid supply unit further
includes: a first sensor configured to sense a first water level of
the treatment liquid in the downstream area, wherein the downstream
area includes: a first part extending from the branch point and
having the curved shape; a second part extending from the first
part and provided at a position in a line with a position of the
first part or lower than the position of the first part; and a
third part extending from the second part, positioned higher than
the first part, and including the end, and wherein the first sensor
is installed in the third part.
7. The apparatus of claim 6, wherein the liquid supply unit further
includes: a buffer mounted downstream of the second valve in the
discharge line and configured to store temporarily the treatment
liquid in the buffer.
8. The apparatus of claim 7, wherein the buffer includes: a housing
mounted in the discharge line and having a buffer space in the
housing; and a second sensor configured to sense a second water
level of the treatment liquid filled in the buffer space.
9. The apparatus of claim 6, wherein the liquid supply unit further
includes: a pump configured to apply flow pressure to the treatment
liquid flowing along the supply line; and a controller configured
to adjust supply of the treatment liquid to the nozzle, and wherein
the controller controls the second valve such that the second valve
is cut off in a supply mode to supply the treatment liquid to the
nozzle, and open in a standby mode to stop the supply of the
treatment liquid to the nozzle.
10. The apparatus of claim 9, wherein the controller cuts off the
first valve and the second valve, when receiving a sensing signal
for the treatment liquid from the first sensor or the second sensor
in the standby mode.
11. The apparatus of claim 9, wherein the controller adjusts the
pump such that the treatment liquid is filled in the second part in
the standby mode.
12. A liquid supply unit comprising: a nozzle; a supply line
configured to supply treatment liquid to the nozzle and having a
first valve mounted in the supply line; and a discharge line
branching from a branch point which is a point downstream of a
first valve in the supply line to discharge the treatment liquid
from the supply line, and having a second valve mounted in the
discharge line, wherein a valve is absent in an area between the
branch point and the nozzle, in the supply line.
13. The liquid supply unit of claim 12, wherein an end of a
downstream area of the supply line based on the branch point is
positioned higher than the branch point and the discharge line.
14. The liquid supply unit of claim 13, wherein an area of the
downstream area, which extends from the branch point in a
downstream direction, has a curved shape.
15. The liquid supply unit of claim 14, wherein the downstream
direction is downward provided in an upstream area of the supply
line based on the branch point, and wherein the curved shape is
provided in a convex-upward shape.
16. The liquid supply unit of claim 15, wherein the liquid supply
unit further includes: a first sensor configured to sense a first
water level of the treatment liquid in the downstream area, wherein
the downstream area includes: a first part extending from the
branch point and having the curved shape; a second part extending
from the first part and provided at a position in a line with a
position of the first part or lower than the position of the first
part; and a third part extending from the second part, positioned
higher than the first part, and including the end, and wherein the
first sensor is installed in the third part.
17. The liquid supply unit of claim 16, wherein the liquid supply
unit further includes: a buffer mounted downstream of the second
valve in the discharge line and configured to store temporarily the
treatment liquid in the buffer, and wherein the buffer includes: a
housing mounted in the discharge line and having a buffer space in
the housing; and a second sensor configured to sense a second water
level of the treatment liquid filled in the buffer space.
18. The liquid supply unit of claim 12, wherein the liquid supply
unit further includes: a controller configured to adjust supply of
the treatment liquid to the nozzle, and wherein the controller
controls the second valve such that the second valve is cut off in
a supply mode to supply the treatment liquid to the nozzle, and
open in a standby mode to stop the supply of the treatment liquid
to the nozzle.
19. (canceled)
20. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] A claim for priority under 35 U.S.C. .sctn. 119 is made to
Korean Patent Application No. 10-2019-0075144 filed on Jun. 24,
2019, in the Korean Intellectual Property Office, the entire
contents of which are hereby incorporated by reference.
BACKGROUND
[0002] Embodiments of the inventive concept described herein
relates to an apparatus and a method for treating a substrate, and
more particularly to an apparatus and a method for performing
liquid treatment for a substrate.
[0003] To fabricate a semiconductor device, a desired pattern is
formed on a substrate through various processes such as,
photolithography, etching, ashing, ion implantation, and thin film
deposition processes. The processes are varied and complicated with
time, so contaminants and particles are produced. Accordingly, a
cleaning process is performed in a stage before and after the
processes.
[0004] The cleaning process includes a liquid treatment process to
supply chemicals onto the substrate. FIG. 1 is a view illustrating
a typical unit for supplying liquid. Referring to FIG. 1, the unit
for supplying the liquid has a liquid supply line 2 and a valve 6.
The liquid supply line 2 is connected to a nozzle 4 to supply
liquid to the nozzle 4. The valve 6 is mounted in the liquid supply
line 2 to open or close the liquid supply line 2 so as to supply
liquid or stop the supply of the liquid. The valve 6 adjusts the
supply of the liquid by performing an opening or closing operation
for a fluid passage through which chemicals flow. Such opening or
closing operation of the valve 6 includes a collision process of a
diaphragm, which is a major cause for the production of the
particles.
[0005] Accordingly, chemicals containing particles are supplied to
cause the failure to the liquid treatment process.
SUMMARY
[0006] Embodiments of the inventive concept provide an apparatus
capable of supplying a purified liquid to a substrate.
[0007] Embodiments of the inventive concept provide an apparatus
capable of minimizing production of particles in a valve of a
liquid supply line.
[0008] According to an exemplary embodiment, an apparatus and a
method for performing liquid treatment for a substrate are
provided.
[0009] The apparatus for treating the substrate includes a treating
container having a treatment space inside the treating container, a
substrate support unit to support a substrate in the treatment
space, and a liquid supply unit that supplies treatment liquid to
the substrate supported by the substrate support unit. The liquid
supply unit includes a nozzle, a supply line that supplies the
treatment liquid to the nozzle and has a first valve mounted in the
supply line, and a discharge line branching from a branch point
which is a point downstream of the first valve in the supply line
to discharge the treatment liquid from the supply line, and having
a second valve mounted in the discharge line. A valve is absent in
an area between the branch point and the nozzle, in the supply
line.
[0010] An end of a downstream area of the supply line based on the
branch point may be positioned higher than the discharge line.
[0011] The end of the downstream area may be positioned higher than
the branch point. An area of the downstream area, which extends
from the branch point in a downstream direction, may be provided to
have a curved shape. The downstream direction may be downward
provided in an upstream area of the supply line based on the branch
point, and the curved shape may be provided in a convex-upward
shape
[0012] The liquid supply unit may further include a first sensor to
sense a first water level of the treatment liquid in the downstream
area. The downstream area may include a first part extending from
the branch point and having the curved shape, a second part
extending from the first part and provided at a position in a line
with a position of the first part or lower than the position of the
first part, and a third part extending from the second part,
positioned higher than the first part, and including the end. The
first sensor may be installed in the third part.
[0013] The liquid supply unit may further include a buffer that
mounted downstream of the second valve in the discharge line to
store temporarily the treatment liquid in the buffer. The buffer
may include a housing mounted in the discharge line and having a
buffer space in the housing, and a second sensor to sense a second
water level of the treatment liquid filled in the buffer space.
[0014] The liquid supply unit may further include a pump to apply
flow pressure to the treatment liquid flowing along the supply
line, and a controller to adjust supply of the treatment liquid to
the nozzle, and the controller may control the second valve such
that the second valve is cut off in a supply mode to supply the
treatment liquid to the nozzle, and open in a standby mode to stop
the supply of the treatment liquid to the nozzle. The controller
may cut off the first valve and the second valve, when receiving a
sensing signal for the treatment liquid from the first sensor or
the second sensor in the standby mode.
[0015] The controller may adjust the pump such that the treatment
liquid is filled in the second part in the standby mode.
[0016] According to an exemplary embodiment, an apparatus for
supplying liquid to a substrate includes a nozzle, a supply line to
supply treatment liquid to the nozzle and having a first valve
mounted in the supply line, and a discharge line branching from a
branch point which is a point downstream of a first valve in the
supply line to discharge the treatment liquid from the supply line,
and having a second valve mounted in the discharge line. A valve is
absent in an area between the branch point and the nozzle, in the
supply line.
[0017] An end of a downstream area of the supply line based on the
branch point may be positioned higher than the branch point and the
discharge line.
[0018] An area of the downstream area, which extends from the
branch point in a downstream direction, may have a curved shape.
The downstream direction may be downward provided in an upstream
area of the supply line based on the branch point, and the curved
shape may be provided in a convex-upward shape. The liquid supply
unit may further include a first sensor to sense a first water
level of the treatment liquid in the downstream area. The
downstream area may include a first part extending from the branch
point and having the curved shape, a second part extending from the
first part and provided at a position in a line with a position of
the first part or lower than the position of the first part, and a
third part extending from the second part, positioned higher than
the first part, and including the end. The first sensor may be
installed in the third part.
[0019] The liquid supply unit may further includes a buffer mounted
downstream of the second valve in the discharge line to store
temporarily the treatment liquid in the buffer, and the buffer may
include a housing mounted in the discharge line and having a buffer
space in the housing, and a second sensor to sense a second water
level of the treatment liquid filled in the buffer space.
[0020] The liquid supply unit may further include a controller to
adjust supply of the treatment liquid to the nozzle, and the
controller may control the second valve such that the second valve
is cut off in a supply mode to supply the treatment liquid to the
nozzle, and open in a standby mode to stop the supply of the
treatment liquid to the nozzle.
[0021] According to an exemplary embodiment, a method for treating
a substrate using the apparatus for treating the substrate includes
applying flow pressure to the supply line to supply the treatment
liquid to a point higher than a highest point of the downstream
area in the supply line, in a state that the first valve is open
and the second valve is cut off, when supplying the treatment
liquid to the substrate, and opening the second valve, and
maintaining the flow pressure to prevent the treatment liquid from
flowing to the highest point, when stopping the supplying of the
treatment liquid to the substrate.
[0022] The first valve and the second valve may be cut off to
prevent the treatment liquid from flowing to the highest point,
when the supplying of the treatment liquid is stopped and when the
treatment liquid is overflown from the discharge line.
BRIEF DESCRIPTION OF THE FIGURES
[0023] The above and other objects and features will become
apparent from the following description with reference to the
following figures, wherein like reference numerals refer to like
parts throughout the various figures unless otherwise specified,
and wherein:
[0024] FIG. 1 is a view illustrating a typical unit for supplying
liquid;
[0025] FIG. 2 is a plan view illustrating a substrate treating
facility, according to an embodiment of the inventive concept;
[0026] FIG. 3 is a sectional view illustrating a substrate treating
apparatus of FIG. 2;
[0027] FIG. 4 is a view illustrating a liquid supply unit of FIG.
3;
[0028] FIG. 5 is a view illustrating an enlarged part of a branch
point and a downstream area of a supply line of FIG. 4;
[0029] FIG. 6 is a view illustrating a standby mode in a liquid
supply unit of FIG. 4;
[0030] FIG. 7 is a view illustrating a supply mode in a liquid
supply unit of FIG. 4;
[0031] FIG. 8 is a view illustrating a maintenance mode in a liquid
supply unit of FIG. 4; and
[0032] FIG. 9 is a view illustrating a liquid supply unit of FIG.
5, according to another embodiment.
DETAILED DESCRIPTION
[0033] The embodiments of the inventive concept may be modified in
various forms, and the scope of the inventive concept should not be
construed to be limited by the embodiments of the inventive concept
described in the following. The embodiments of the inventive
concept are provided to describe the inventive concept for those
skilled in the art more completely. Accordingly, the shapes and the
like of the components in the drawings are exaggerated to emphasize
clearer descriptions.
[0034] Hereinafter, one example of the inventive concept will be
described in detail with reference to FIGS. 2 to 9.
[0035] FIG. 2 is a plan view illustrating a substrate treating
facility, according to an embodiment of the inventive concept.
[0036] Referring to FIG. 2, a substrate treating facility 1 has an
index module 10 and a process treating module 20, and the index
module 10 includes a load port 120 and a feeding frame 140. The
load port 120, the feeding frame 140, and the process treating
module 20 may be sequentially arranged in a row. Hereinafter, a
direction in which the load port 120, the feeding frame 140, and
the process treating module 20 are arranged will be referred to as
a first direction 12, a direction, which is perpendicular to the
first direction 12 when viewed from above will be referred to as a
second direction 14, and a direction, which is normal to a plane
containing the first direction 12 and the second direction 14, will
be referred to as a third direction 16.
[0037] A carrier 18 having a substrate `W` received therein is
seated on the load port 120. A plurality of load ports 120 are
provided, and are arranged in the second direction 14 in a line.
FIG. 1 illustrates that four load ports 120 are provided. However,
the number of the load ports 120 may increase or decrease depending
on a condition, such as the process efficiency of the process
treating module 20 or a footprint. A slot (not illustrated) is
formed in the carrier 18 to support the edge of the substrate. A
plurality of slots are provided in the third direction 16, and
substrates are positioned in the carrier 18 such that the
substrates are stacked in the third direction 16 while being spaced
apart from each other. A front opening unified pod (FOUP) may be
used as the carrier 18.
[0038] The process treating module 20 includes a buffer unit 220, a
feeding chamber 240, and process chambers 260 and 280. The feeding
chamber 240 is disposed such that the longitudinal direction
thereof is in parallel to the first direction 12. The process
chambers 260 and 280 are arranged at opposite sides of the feeding
chamber 240 in the second direction 14. The process chambers 260
and 280 may be provided symmetrically to each other about the
feeding chamber 240. Some of the process chambers 260 and 280 are
arranged in the longitudinal direction of the feeding chamber 240.
In addition, some of the process chambers 260 and 280 are arranged
to be stacked on each other. In other words, the process chambers
260 and 280 may be arranged in the form of a matrix of A.times.B
(`A` and `B` are natural numbers) at opposite sides of the feeding
chamber 240. In this case, `A` is the number of the process
chambers 260 and 280 aligned in a line in the first direction 12,
and `B` is the number of the process chambers 260 and 280 aligned
in a line in the third direction 16. When four or six process
chambers 260 and 280 are provided at opposite sides of the feeding
chamber 240, the first process chambers 260 and 280 may be arranged
in 2.times.2 or 3.times.2. The number of the process chambers 260
may increase or decrease.
[0039] Unlikely, the process chamber 260 may be provided only at
any one side of the feeding chamber 240. In addition, the process
chambers 260 and 280 may be provided in a single layer at one side
and an opposite side of the feeding chamber 240. In addition,
unlike the above description, the process chambers 260 and 280 may
be variously arranged.
[0040] The following description of the present embodiment will be
made regarding that a liquid treatment process is performed in one
(the process chamber 260) of the process chambers 260 and 280 and a
drying process is performed in another (the process chamber 380) of
the process chambers 260 and 280. The drying process may be a
supercritical treatment process.
[0041] The buffer unit 220 is interposed between the feeding frame
140 and the feeding chamber 240. The buffer unit 220 provides a
space in which the substrate `W` stays before the substrate `W` is
carried between the feeding chamber 240 and the feeding frame 140.
The buffer unit 220 is provided therein with a slot (not
illustrated) in which the substrate `W` is placed and a plurality
of slots (not illustrated) are spaced apart from each other in the
third direction 16. The buffer unit 220 is open in surfaces facing
the feeding frame 140 and the feeding chamber 240.
[0042] The feeding frame 140 carries the substrate `W` between the
carrier 18 seated in the load port 120 and the buffer unit 220. An
index rail 142 and an index robot 144 are provided on the feeding
frame 140. The index rail 142 is provided such that the
longitudinal direction thereof is in parallel to the second
direction 14. The index robot 144 is installed on the index rail
142 to be linearly moved in the second direction 14 along the index
rail 142. The index robot 144 has a base 114a, a body 114b, and a
plurality of index arms 141c. The base 114a is installed to be
movable along the index rail 142. The body 114b may be joined to
the base 114a. The body 114b may be provided to be movable on the
base 114a in the third direction 16. Furthermore, the body 114b may
be provided to be rotatable on the base 114a. The index arm 114c
may be joined to the body 114b such that the index arm 114c is
movable forward and backward with respect to the body 114b. A
plurality of index arms 114c may be provided, and may be driven
independently from each other. The index arms 114c are disposed to
be stacked while being spaced apart from each other in the third
direction 16. Some of the index arms 114c are used when carrying
the substrates `W` to the carrier 18 from the process treating
module 20, and others of the index arms 114c may be used when
carrying the substrates `W` from the carrier 18 to the process
treating module 20. This structure may prevent particles, which are
produced from the substrates `W` before the process treatment, from
sticking to the substrates `W` after the process treatment, in the
process that the index robot 144 introduces and withdraws the
substrates `W`.
[0043] The feeding chamber 240 carries the substrate `W` between
the buffer unit 220 and the process chambers 260. The feeding
chamber 240 includes a guide rail 242 and an index robot 244. The
guide rail 242 is disposed such that the longitudinal direction
thereof is parallel to the first direction 12. The main robot 244
is installed on the guide rail 242 to linearly move in the first
direction 12 on the guide rail 242.
[0044] Hereinafter, an apparatus (substrate treating apparatus) 300
for treating a substrate provided in the process chamber 260 will
be described. The following description of the present embodiment
will be described regarding that the substrate treating apparatus
300 performs a liquid treatment process. The liquid treatment
process includes a process of cleaning the substrate.
[0045] FIG. 3 is a sectional view illustrating the substrate
treating apparatus of FIG. 2. Referring to FIG. 3, the substrate
treating apparatus 300 may include a chamber 310, a treating
container 320, a spin head 340, a lifting unit 360, a unit (liquid
supply unit) 400 for supplying liquid (treatment liquid), and a
controller 500. The chamber 310 provides a space for performing a
process of treating the substrate `W`. A fan 314 is mounted on a
ceiling surface of the chamber 310 to form a down flow in a
treatment space. The fan 314 may be positioned to face the treating
container 310. The down flow formed by the fan 314 may be provided
to a substrate `W`positioned in the treating container 320.
[0046] The treating container 320 is positioned in the chamber 310,
and has the shape of a cup having an open upper portion. The
treating container 320 has a treatment space for treating a
substrate therein. The treatment container 320 includes an inner
recovery vessel 322 and an outer recovery vessel 326. The recovery
vessels 322 and 326 recover mutually different treatment liquids
used in the process. The inner recovery vessel 322 is provided to
have the shape of an annular ring that surrounds the spin head 340,
and the outer recovery vessel 326 is provided to have the shape of
an annular ring that surrounds the inner recovery vessel 322. An
inner space 322a of the inner recovery vessel 322 and a space 326a
between the outer recovery vessel 326 and the inner recovery vessel
322 serve as inlets for introducing the treatment liquids into the
inner recovery vessel 322 and the outer recovery vessel 326,
respectively. Recovery lines 322b and 326b are connected with the
recovery containers 822 and 826 to vertically extend downward from
the bottom surfaces of the recovery containers 822 and 826. The
recovery lines 322b and 326b serve as discharge pipes to discharge
the treatment liquids introduced into the recovery vessels 322 and
326, respectively. The discharged treatment liquids may be recycled
through an external treatment liquid recycling system (not
illustrated).
[0047] The spin head 340 serve as a substrate support unit 340 to
support and rotate the substrate `W`. The spin head 340 is provided
in the treatment container 320. The spin head 340 supports the
substrate `W` and rotates the substrate `W` during the process. The
spin head 340 has a body 342, a support pin 344, a chuck pin 346,
and a support shaft 348. The body 342 has a top surface provided in
a substantially circular shape when viewed from above. The support
shaft 348 is fixedly coupled to the bottom surface of the body 342
to be rotatable by a motor 349. A plurality of support pins 344 are
provided. The support pins 344 may be arranged to be spaced apart
from each other at an edge part of the top surface of the body 342
while protruding upward from the body 342. The support pins 334 are
arranged to form the shape of a typical annular ring through
combination thereof. The support pins 344 support an edge of a rear
surface of the substrate `W` such that the substrate `W` is spaced
apart from the top surface of the body 342 by a specific distance.
A plurality of chuck pins 346 are provided. The chuck pins 346 may
be disposed to be farther away from the center of the body 342 than
the support pin 344. The chuck pins 346 are provided to protrude
upward from the body 342. The chuck pins 346 support side portions
of the substrate `W` such that the substrate `W` does not laterally
deviate from a right position thereof when the spin head 340
rotates. The chuck pins 346 are provided to be linearly movable
between a standby position and a support position in a radial
direction of the body 342. The standby position is farther apart
from the center of the body 342 than the support position. When the
substrate `W` is loaded onto on or unloaded from the spin head 340,
the chuck pins 346 are positioned at the standby position. When a
process is performed with respect to the substrate `W`, the chuck
pins 346 are positioned at the support position. The chuck pins 346
are in contact with the side portions of the substrate `W` at the
support position.
[0048] The lifting unit 360 may adjust the relative height between
the treating container 320 and the substrate `W`. The lifting unit
360 linearly moves the treatment container 320 upward and downward.
As the treating container 320 moves upward and downward, a relative
height of the treatment container 320 to the spin head 340 is
changed. The lifting unit 360 has a bracket 362, a movable shaft
364, and a driver 366. The bracket 362 is fixedly installed on an
outer wall of the treating container 320, and the movable shaft 364
is fixedly coupled to the bracket 362 to move upward and downward
by the driver 366 When the substrate `W` is placed on the spin head
340 or lifted from the spin head 340, the treating container 320
moves downward such that the spin head 340 protrudes upward from
the treating container 320. The height of the treating container
320 is adjusted such that the treatment liquid is introduced into
the recovery vessel 360 preset depending on the type of the
treatment liquid supplied to the substrate `W` when the process is
performed.
[0049] Alternatively, the lifting unit 360 may move the spin head
340 upward and downward instead of the treating container 320.
[0050] A liquid supply unit 400 may supply various treatment
liquids onto the substrate `W`. The liquid supply unit 400 includes
a nozzle 410, a supply line 420, a pump 428, a discharge line 440,
a buffer 450, a circulation line 460, and a controller 500.
[0051] The nozzle 410 moves a process position and a standby
position. In this case, the process position is defined as a
position in which the nozzle 410 is able to discharge liquid onto
the substrate `W` positioned in the treating container 320, and the
standby position is defined as a position in which the nozzle 410
deviates from the process position and stands by. According to an
example, in the process position, a position, in which the nozzle
410 supplies to the liquid, includes the center of the substrate
`W`. For example, when viewed from above, the nozzle 410 may
linearly move or rotate about an axis to move between the process
position and the standby position.
[0052] The treatment liquid discharged from the nozzle 410 may
include chemicals, a rinse liquid, and a dry fluid. For example,
the chemicals correspond to liquid to etch a film formed on the
substrate `W` or to remove remaining particles from the substrate
`W`. The chemicals may be liquid having the properties of a strong
acid or a strong base. The chemicals may include sulfuric acid,
phosphoric acid, hydrofluoric acid, or ammonia. The rinse liquid
may be liquid which is able to rinse the chemicals remaining on the
substrate `W`. For example, the rinse liquid may be pure water. The
dry fluid may be provided as liquid that is able to replace a rinse
liquid remaining on the substrate `W`. The dry fluid may be liquid
having a surface tension lower than that of the rinse liquid. The
dry fluid may be an organic solvent. The dry fluid may be isopropyl
alcohol (IPA).
[0053] FIG. 4 is a view illustrating the liquid supply unit of FIG.
3, and FIG. 5 is a view illustrating an enlarged part of a branch
point and a downstream area of the supply line of FIG. 4. Referring
to FIGS. 4 and 5, the supply line 420 connects a liquid tank 415 to
the nozzle 410. The liquid stored in the liquid tank 415 is
supplied to the nozzle 410 through the supply line 420. The pump
428 and a first valve 424 are mounted in the supply line 420, the
pump 428 applies flow pressure to the treatment liquid, and the
first valve 424 opens/closes the supply line 420. For example, the
first valve 424 is positioned downstream of the pump 428. The
discharge line 440 branches from the supply line 420 to discharge
the liquid. A second valve 442 is mounted in the discharge line
440, and the discharge line 440 is open and closed by the second
valve 442. The branch point of the discharge line 440 is positioned
downstream of the first valve 424 in the supply line 420. For
example, the discharge line 440 may branch from the supply line 420
and may be connected to the liquid tank 415. The second valve 442
may be positioned lower than the branch point.
[0054] According to the present embodiment, the supply line 420 is
divided into an upstream area and a downstream area 430 based on
the branch point of the discharge line 440.
[0055] An end of the downstream area 430 extending in a downstream
direction from the branch point is positioned higher than the
branch point, and an additional unit is not provided in the
downstream area 430 to open or close the supply line 420 or to
adjust the supply of the liquid. In other words, a valve is not
mounted in the downstream area 430 and the supply of the liquid is
adjusted using the difference in height between the branch point
and the end of the downstream area 430.
[0056] The downstream area 430 has a first part 432, a second part
434, and a third part 436. The first part 432 extends from the
branch point, has a curved shape, is positioned lower than the end
of the downstream area 430. The second part 434 extends in the
downstream direction from the first part 432. The second part 434
is positioned in a line with the first part 432 or lower than the
first part 432. The third part 436 extends from the second part 434
and is connected to the nozzle 410. The third part 436 is
positioned higher than the second part 434 and includes the end.
For example, the downstream direction may be downward provided in
an upstream area.
[0057] The curved shape of the first part 432 may be provided to
have a convex-upward shape. Accordingly, the upstream area, the
downstream area 430, and the discharge line 440, which are adjacent
to the branch point, may have a substantially `Y` shape. The `Y`
shape may prevent the treatment liquid, which is supplied from the
upstream area to the discharge line 440, from flowing to the
downstream area 430. A first sensor 426 is mounted in the third
part 436 to sense a first water level of the treatment liquid. The
first sensor 426 is positioned higher than the first part 432. The
first sensor 426 may be a level sensor. When sensing that the
treatment liquid reaches the first water level in the third part
436, the first sensor 426 transmits a sensed signal to the
controller 500.
[0058] The buffer 450 is mounted in the discharge line 440. The
buffer 450 includes a housing 452 and a second sensor 454. The
housing 452 is provided in the shape of a tub having a buffer space
therein. The housing 452 is positioned downstream of the second
valve 442 on the discharge line 440. The housing 452 has opposite
ends, which are open, one of the opposite end serves as an entrance
for the treatment liquid, and another of the opposite end serves as
an exit for the treatment liquid. Accordingly, during discharging,
the treatment liquid flows through the housing 452 without being
filled in the buffer space beyond a specific water level. The
second sensor 454 senses a second water level of the treatment
liquid filled in the buffer space. The second sensor 454 senses the
second water level higher than the specific water level in the
space for the buffer 450. Accordingly, when sensing that the
treatment liquid reaches the second water level in the space for
the buffer 450, the second sensor 454 transmits a sensing signal to
the controller 500.
[0059] The circulation line 460 circulates liquid, which flows
along the supply line 420, to the liquid tank 415. The circulation
line 460 branches from the supply line 420 in the upstream area of
the supply line 420 and is connected to the liquid tank 415. The
circulation line 460 branches upstream of the first valve 424 and a
third valve 462 is mounted in the circulation line 460.
[0060] The controller 500 adjusts the valves 424, 442, and 462, and
the pump 428 to control the flow of the liquid. The controller 500
may differently adjust each valve depending on a supply mode, a
standby mode, and a maintenance mode. According to an embodiment,
the supply mode may be a mode to supply the treatment liquid to the
nozzle 410. The standby mode may be a mode in which the treatment
liquid is not supplied to the nozzle 410. The maintenance mode is a
mode to solve the problem that the treatment liquid is supplied to
the nozzle 410 even in the standby mode due to the backflow and the
overflow of the treatment liquid.
[0061] The controller 500 opens the first valve 424 and cuts off
the second valve 442 and the third valve 462, in the supply mode.
Accordingly, the treatment liquid may be supplied from the liquid
tank 415 to the nozzle 410.
[0062] The controller 500 opens the first valve 424 and the second
valve 442 and cuts off the third valve 462, in the standby mode.
Accordingly, the treatment liquid may be discharged through the
discharge line 440. For example, the treatment liquid discharged
through the discharge line 440 may be circulated to the liquid tank
415. In addition, the controller 500 may adjust, in the standby
mode, the flow pressure of the pump 428, such that the treatment
liquid is filled in the first part 432 and the second part 434 of
the downstream area 430 of the supply line 420 without being filled
in the third part 436. This is to prevent foreign matters from
being introduced into the pipe through the nozzle 410 by filling
the treatment liquid in the first part 432 and the second part
434.
[0063] The controller 500 may cut off the first valve 424 and the
second valve 442 and open the third valve 462 in the maintenance
mode. Accordingly, the treatment liquid may be prevented from being
supplied to the downstream area 430 of the supply line 420.
[0064] Hereinafter, a procedure of performing the liquid treatment
for the substrate `W` will be described. FIG. 6 is a view
illustrating a standby mode in the liquid supply unit of FIG. 4,
FIG. 7 is a view illustrating a supply mode in the liquid supply
unit of FIG. 4, and FIG. 8 is a view illustrating a maintenance
mode in the liquid supply unit of FIG. 4. Referring to FIGS. 6 to
8, the standby mode is applied before the substrate `W` is placed
on the substrate support unit 340 or when the nozzle 410 stands by.
In other words, the first valve 424 and the second valve 442 are
open, but the third valve 462 is cut off. In the standby mode, the
treatment liquid may be circulated through the supply line 420 and
the discharge line 440.
[0065] When the substrate `W` is placed on the substrate support
unit 340, the nozzle 410 moves to the process position to discharge
liquid, and the supply mode is applied to the liquid supply unit
400. In the supply mode, the first valve 424 is open, and the
second valve 442 and the third valve 462 are cut off. Accordingly,
the treatment liquid in the liquid tank 415 is transferred to the
nozzle 410 along the supply line 420 and supplied onto the
substrate `W`. When the treatment liquid is completely supplied to
the substrate `W`, the standby mode is applied to the liquid supply
unit again, so the first valve 424 and the second valve 442 are
open, and the third valve 462 is cut off. While the standby mode is
being applied, backflow and overflow of the treatment liquid may
occur in the discharge line 440 due to high pressure. In this case,
the treatment liquid may be filled in the space for the buffer 450
and the third part 436. In this case, the first sensor 426 and the
second sensor 454 sense that treatment liquid at the first water
level reaches the third part 436 or treatment liquid at the second
water level reaches the space for the buffer 459, and transmits the
sensing signal to the controller 500. The controller 500 prevents
the treatment liquid from being transferred to the nozzle 410 by
cutting off the first valve 424 and the second valve 442 based on
the sensing signal. However, even if receiving the sensing signal
in the supply mode, the controller 500 may maintain the first valve
424 to be open.
[0066] According to the above-described embodiment, when the
treatment liquid is supplied or the supply of the treatment liquid
is stopped, the first valve 424 is always open. Accordingly,
particles may be prevented in the procedure of opening or closing
the first valve 424. In addition, as the treatment liquid is
supplied or the supply of the treatment liquid is stopped, the
second valve 442 is closed or open. However, the particles produced
in the second valve 442 may be prevented from flowing downstream of
the second valve 442 and being transferred to the nozzle 410.
Accordingly, particles produced due to the opening/closing
operation of a valve may be prevented from being transferred to the
nozzle 410.
[0067] In addition, the above-described embodiment has been
described in that the first part 432 of the supply line 420 has the
convex-upward shape. However, as illustrated in FIG. 9, the first
part 432 has no height difference from the second part 434 in the
longitudinal direction.
[0068] According to an embodiment of the inventive concept, the
liquid may be supplied by the head difference of the supply line,
and a valve is not provided in the downstream area of the branch
point. Accordingly, the production of particles by the valve may be
prevented, and a cleaning liquid may be supplied.
[0069] In addition, according to an embodiment of the inventive
concept, the level sensor installed in the supply line and the
buffer may sense the backflow and the overflow of the liquid, and
cut off each valve to prevent the liquid from being supplied to the
nozzle at undesirable timing.
[0070] In addition, according to an embodiment of the inventive
concept, the downstream area of the supply line is maintained to be
filled with a specific amount of liquid. Accordingly, the
introduction of the external particles of the nozzle into the
supply line may be minimized.
[0071] While the inventive concept has been described with
reference to exemplary embodiments, it will be apparent to those
skilled in the art that various changes and modifications may be
made without departing from the spirit and scope of the inventive
concept. Therefore, it should be understood that the above
embodiments are not limiting, but illustrative.
* * * * *