U.S. patent application number 17/010641 was filed with the patent office on 2020-12-24 for hot melt apparatus and method of use.
This patent application is currently assigned to Oceaneering International, Inc.. The applicant listed for this patent is Oceaneering International, Inc.. Invention is credited to Peter Carow, Marc Christensen, Eric Curley, Andrew Curtis, James Stein, Lee Vyoral, Michael M Withey.
Application Number | 20200398498 17/010641 |
Document ID | / |
Family ID | 1000005064910 |
Filed Date | 2020-12-24 |
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United States Patent
Application |
20200398498 |
Kind Code |
A1 |
Christensen; Marc ; et
al. |
December 24, 2020 |
Hot Melt Apparatus and Method of Use
Abstract
In various embodiments, a hot melt device comprising a heating
device that is automatically or manually triggered is configured so
as to have its melt surface applied bringing a thermoplastic
material in its solid form into contact with a surface via
mechanical extrusion; using a heater to heat the thermoplastic
material to a temperature above a melting temperature of the
thermoplastic material while maintaining the contact of the
thermoplastic material with the surface; allowing the heated
thermoplastic material to cool to a temperature that is below the
thermoplastic material's melting temperature; and allowing the
heated thermoplastic material to bond the hot melt apparatus to the
contacted surface without a solvent or use of a curing chemical
reaction when the heated thermoplastic material is cooled to below
the thermoplastic material's melting temperature while remaining
connected to the structural body.
Inventors: |
Christensen; Marc;
(Friendswood, TX) ; Carow; Peter; (Pearland,
TX) ; Curley; Eric; (League City, TX) ;
Curtis; Andrew; (Seabrook, TX) ; Stein; James;
(Houston, TX) ; Vyoral; Lee; (League City, TX)
; Withey; Michael M; (Seabrook, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Oceaneering International, Inc. |
Houston |
TX |
US |
|
|
Assignee: |
Oceaneering International,
Inc.
Houston
TX
|
Family ID: |
1000005064910 |
Appl. No.: |
17/010641 |
Filed: |
September 2, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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16037930 |
Jul 17, 2018 |
|
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17010641 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F16B 11/006 20130101;
B29C 65/525 20130101; B29C 65/4815 20130101; B29C 65/4855
20130101 |
International
Class: |
B29C 65/48 20060101
B29C065/48; B29C 65/52 20060101 B29C065/52; F16B 11/00 20060101
F16B011/00 |
Claims
1. A method of applying a thermoplastic material to a surface using
a hot melt apparatus comprising a structural body, a solid form
thermoplastic material connected to the structural body, the solid
form thermoplastic material mechanically extrudable onto a surface
to be joined when the solid form thermoplastic material is heated
where the solid form thermoplastic material solidifies while
remaining connected to the structural body as the heated solid form
thermoplastic material cools, and a controllable heater connected
to the structural body and to the solid form thermoplastic material
where the controllable heater comprises a heat generator which is
adapted to actively heat the solid form thermoplastic material to a
temperature above its melting temperature and which is able to
actively cool to a temperature which allows the heated solid form
thermoplastic material to cool and solidify without the use of a
solvent, the method comprising: a. bringing the thermoplastic
material in its solid form into contact with a surface to be
joined; b. using the controllable heater to actively heat the
thermoplastic material to a temperature above a melting temperature
of the thermoplastic material while maintaining the contact of the
thermoplastic material with the surface; c. mechanically extruding
the solid form thermoplastic material when the solid form
thermoplastic material is heated; d. after being mechanically
extruded, using the selectively controllable heater to actively
cool the heated thermoplastic material to a temperature that is
below the thermoplastic material's melting temperature; e. as the
heated solid form thermoplastic material cools, allowing the heated
thermoplastic material to solidify while remaining connected to the
structural body; and f. allowing the heated thermoplastic material
to bond the hot melt apparatus to the contacted surface without a
solvent or use of a curing chemical reaction when the heated
thermoplastic material is cooled to below the thermoplastic
material's melting temperature while remaining connected to the
structural body.
2. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, wherein the thermoplastic
material in solid form further comprises a predetermined shape, the
method further comprising selecting the predetermined shape as
shape a that improves the bond of the thermoplastic material with
the contacted surface, the shape comprising a geometric profile
when the connection of complex surfaces are completed.
3. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 2, wherein the surface
comprises a rough or uneven surface, the method further comprising
varying a thickness of the selected shape of the thermoplastic
material wherein the connection of rough or uneven surfaces are
completed.
4. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, the hot melt apparatus
further comprising a separable interface disposed intermediate the
selectively controllable heater and the thermoplastic material, the
separable interface comprising an upper portion connected to the
heating mechanism and a lower portion selectively detachable from
the upper portion, the lower portion permanently attached to the
thermoplastic material, the method further comprising using the
separable interface to create an evenly distributed thermal
transfer of heat into the thermoplastic material.
5. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, further comprising reheating
the cooled thermoplastic material to allow removal of the hot melt
apparatus from the surface to which the thermoplastic material is
bonded.
6. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 5, further comprising: a.
allowing multiple heating and cooling cycles of the hot melt
apparatus; and b. reusing the hot melt apparatus a plurality of
times.
7. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, the hot melt apparatus
further comprising a mechanical integrator, the method further
comprising mechanically integrating the hot melt apparatus to an
object to become a tool or structural extension of the object.
8. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 7, further comprising: a.
temporarily attaching the hot melt apparatus to a placement device
using the mechanical integrator; and b. disconnecting the placement
device from the hot melt apparatus after the thermoplastic material
bond is created to a surface.
9. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, the hot melt apparatus
further comprising an electrical integrator, the method further
comprising: a. electrically integrating the hot melt apparatus with
an object; and b. providing an electrical pathway from the object
to support the operation of the hot melt apparatus.
10. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 9, further comprising: a.
temporary attachment of the hot melt apparatus to any placement
device using the electrical integrator; and b. disconnecting the
placement device from the hot melt device after the thermoplastic
material bond is created to any object.
11. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 9, further comprising using a
pair of hot melt apparatuses, the method further comprising: a.
using an electrically conductive cable to operatively interconnect
the electrical integrator of a first hot melt apparatus of the pair
of hot melt apparatus to electrical integrator a second hot melt
apparatus of the pair of hot melt apparatus; and b. creating an
electrical ground path through the electrically conductive cable
when the hot melt apparatuses are bonded separately to any object
and any secondary object.
12. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, wherein the hot melt
apparatuses are connected by mechanical integrators and electrical
integrators and used to bond the object to any other secondary
object.
13. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, further comprising: a.
integrating a pair of hot melt apparatus within a common structural
body with thermoplastic material at both ends to create a double
sided hot melt apparatus; and b. using the double-sided hot melt
apparatus to bond the object to any other secondary object.
14. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 13, further comprising using a
plurality of pairs of hot melt apparatuses, the plurality of paired
hot melt apparatuses equal in number to a number of objects to be
joined.
15. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 14, further comprising: a.
using a thermoplastic material that is electrically conductive; and
b. providing a grounding path through the electrically conductive
thermoplastic material.
16. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, the selectively controllable
heater comprising an electro-chemical heater, the method further
comprising activating the electro-chemical heater using a low power
electrical signal.
17. The method of applying a thermoplastic material to a surface
using a hot melt apparatus of claim 1, the selectively controllable
heater comprising a chemical-based selectively controllable heater,
the method further comprising activating the chemical-based
selectively controllable heater through mixing of chemicals in the
chemical-based selectively controllable heater.
Description
RELATION
[0001] This application is a divisional application of U.S. patent
application Ser. No. 16/037,930 filed on 17 Jul. 2018 and claims
priority through U.S. Provisional Application 62/533,608, filed
Jul. 17, 2017.
BACKGROUND OF THE INVENTION
[0002] A hot melt device comprising a heating device that is
automatically or manually triggered to heat a pre-formed
thermoplastic feedstock is recognized as an existing technology.
Applications using such devices allow connection of objects to
provide mechanical and./or electrical bonding and incorporate
flexibility, repeatability and reusability of the connections.
[0003] A hot melt apparatus typically includes a structural body, a
heating element of various designs, and an automatic or manual
control system to melt thermoplastic materials. In operation,
mechanical extrusion of a heated thermoplastic material onto a
surface to be joined as the thermoplastic material cools and
solidifies is used.
FIGURES
[0004] Various figures are included herein which illustrate aspects
of embodiments of the disclosed inventions.
[0005] FIG. 1 is a block diagrammatic view in partial perspective
of a first exemplary system;
[0006] FIG. 2 is an illustration of various shapes adapted to
improve a bond of thermoplastic material 2 with a the contacted
surface;
[0007] FIG. 3 is a block diagrammatic view in partial perspective
of a second exemplary system where one or more interchangeable
interfaces 5 are disposed intermediate structural body 3 and heater
4 and comprises upper portion 5a connected to structural body 3 and
lower portion 5b connected to heater 4, where upper portion 5a and
lower portion 5n are selectively disconnectable from each
other;
[0008] FIG. 4 is a block diagrammatic view in partial perspective
of a further exemplary system illustrating a separable
interface;
[0009] FIG. 5 is a block diagrammatic view in partial perspective
of a further exemplary system illustrating a mechanical
integrator;
[0010] FIG. 6 is a block diagrammatic view in partial perspective
of a further exemplary system illustrating an electrical
integrator;
[0011] FIG. 7 is a block diagrammatic view in partial perspective
of a further exemplary system illustrating a mechanical
integrator;
[0012] FIG. 8 is a block diagrammatic view in partial perspective
of a further exemplary system illustrating a mechanical integrator
and an electrical integrator;
[0013] FIG. 9 is a block diagrammatic view in partial perspective
of a further exemplary system illustrating use of a cable
manager;
[0014] FIG. 10 is a block diagrammatic view in partial perspective
of a further exemplary system illustrating an electrical integrator
and various electrical ground paths;
[0015] FIG. 11 is a block diagrammatic view in partial perspective
of a further exemplary system;
[0016] FIG. 12 is a block diagrammatic view in partial perspective
of an exemplary system;
[0017] FIG. 13 is a block diagrammatic view in partial perspective
of a further exemplary system integrated within a common structural
body 3 with thermoplastic material 2 at both ends to create a
double sided hot melt apparatus 15; and
[0018] FIG. 14 is a view in partial perspective of an exemplary
system illustrating that system in use.
DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0019] Referring now to FIG. 1, in a first embodiment hot melt
apparatus 1 comprises structural body 3; thermoplastic material 2,
in a solid form, connected to structural body 3, where the solid
form thermoplastic material 2 is mechanically extrudable onto a
surface to be joined as the heated solid form thermoplastic
material 2 cools and solidifies; and controllable heater 4
connected to the structural body and to the solid form
thermoplastic material 2, heater 4 controllable to heat the solid
form thermoplastic material 2 to a temperature above its melting
temperature and to allow the heated solid form thermoplastic
material 2 to cool and solidify without the use of a solvent.
[0020] Referring additionally to FIG. 2, solid form thermoplastic
material 2 may comprise a shaped thermoplastic material 2, where
the shape is adapted to improve a bond of thermoplastic material 2
with a the contacted surface. By way of example and not limitation,
the shape may comprises a geometric profile and/or pattern and may
further comprise varying thicknesses when melted wherein the
connection of rough or uneven surfaces are completed.
[0021] Heater 4 may be an electro-chemical heater activated using a
low power electrical signal. In other embodiments, heater 4 may be
chemical based and activated through mixing of various
chemicals.
[0022] Referring additionally to FIG. 3, in embodiments hot melt
apparatus 1 may further comprise one or more interchangeable
interfaces 5 disposed intermediate structural body 3 and heater 4.
Interchangeable interface 5 may comprises upper portion 5a
connected to structural body 3 and lower portion 5b connected to
heater 4, where upper portion 5a and lower portion 5n are
selectively disconnectable from each other. In some of these
embodiments, heater 4 and thermoplastic material 2 are integral and
may be integrated to, but remain separable from, structural body
3.
[0023] Referring additionally to FIG. 4, in embodiments separable
interface 6 is present and disposed intermediate heater 4 and
thermoplastic material 2. Typically, separable interface 6 is
adapted to create an evenly distributed thermal transfer of heat
into thermoplastic material 2. Separable interface 6 comprises a
metal, a plastic, a ceramic, or a composite, or the like, or a
combination thereof.
[0024] In certain of these embodiments, separable interface 6
comprises upper portion 6a connected to heater 4 and lower portion
6b selectively detachable from upper portion 6a, where lower
portion 6b is substantially permanently attached to thermoplastic
material 2.
[0025] In embodiments separable interface 6 further comprises a
thermally conductive material and a heating element operative to
melt thermoplastic material by transferring heat to the hot melt
pad.
[0026] In other embodiments, separable interface 6 comprises an
electrically conductive material and the hot melt pad comprises a
heater. For some of these embodiments, separable interface 6
further comprises an electrically conductive separable interface
configured to provide a grounding path through the hot melt
apparatus.
[0027] Referring additionally to FIGS. 5 and 7, in further
embodiments hot melt apparatus 1 comprises mechanical integrator 7
which is configured to allow hot melt apparatus 1 to be
mechanically integrated to object 8 such as to become a tool or
structural extension of object 8.
[0028] Referring additionally to FIGS. 6 and 10 in further
embodiments hot melt apparatus 1 comprises electrical integrator 9
which is configured to allow hot melt apparatus 1 to be
electrically integrated to object 8. Electrical integrator 9
provides a power and/or a ground path where power, and/or a ground,
may be obtained from object 8 to support the operation of hot melt
apparatus 1. Electrically conductive cable 13 may also be present
in such embodiments and operatively in communication with
electrical integrator 9 at a first end and with object 8 at a
second end. Electrically conductive cable 13 may be used to
implement an electrical ground path between object 8 and secondary
object 14 (FIG. 10).
[0029] Referring additionally to FIG. 11, in embodiments comprising
a pair of hot melt apparatuses 1, electrical integrators 9 of the
pair of hot melt apparatuses 1 may be operatively connected by
electrically conductive cable 13 which may further be operative to
create an electrical ground path when the pair of hot melt
apparatuses 1 are bonded separately to object 8 and secondary
object 14.
[0030] In other embodiments where there is a plurality of hot melt
apparatuses 1, the plurality of hot melt apparatuses 1 may be
connected by mechanical integrators 7 and electrical integrators 9
and one or more of the plurality of hot melt apparatuses 1 used to
bond object 8 to secondary object 14. These multiple hot melt
apparatus 1 may be integrated in a number equal to the number of
objects 8,14 to be joined. The plurality of paired hot melt
apparatuses may be equal in number to a number of objects 8 to be
joined.
[0031] Referring additionally to FIG. 13, the plurality of hot melt
apparatus 1, which may be a pair, may further be integrated within
a common structural body 3 with thermoplastic material 2 at both
ends to create a double sided hot melt apparatus 15 which may be
used to bond object 8 to secondary object 14. Double sided hot melt
apparatus 15 may achieve an electrical ground path between object 8
and secondary object 14.
[0032] Referring additionally to FIG. 9, for embodiments with
cables, cable manager 11 may be present and operatively connected
to hot melt apparatus 1, where cable manager 11 is configured to
provide positioning, placement and retention of cables, ropes, or
tethers. In certain embodiments, cable manager 11 comprises a hook
shape.
[0033] Still referring to FIG. 9, in one or more embodiments hot
melt apparatus 1 further comprises material manager 12 operatively
connected to hot melt apparatus 1. Material manager 12 may comprise
a plow or similar shape to aid in providing for the movement,
lifting, and retention of moveable surface materials of object
8.
[0034] In most of these embodiments, thermoplastic material 2 may
comprise an electrically conductive material which may further
provide a grounding path through thermoplastic material 2.
[0035] In the operation of exemplary embodiments, referring
generally to FIG. 14, a thermoplastic material may be applied to a
surface using hot melt apparatus 1 as described above in its
various embodiments, where the various embodiments and their
application methods illustrate a departure from the current
art.
[0036] Thermoplastic material 2 is brought in its solid form into
contact with a surface via mechanical extrusion of thermoplastic
material 2 and heater 4 used to heat thermoplastic material 2 to a
temperature at or above a melting temperature of thermoplastic
material 2 while maintaining the contact of thermoplastic material
2 with the surface. Thermoplastic material 2 may be electrically
conductive and providing a grounding path through the electrically
conductive thermoplastic material 2.
[0037] Once applied, as illustrated in FIG. 2, heated thermoplastic
material 2 is allowed to cool to a temperature that is below
thermoplastic material's 2 melting temperature and the heated
thermoplastic material 2 allowed to bond hot melt apparatus 1 to
the contacted surface 14 without a solvent or use of a curing
chemical reaction when the heated thermoplastic material 2 is
cooled to below the melting temperature of thermoplastic material
2.
[0038] Thermoplastic material 2 in solid form may further comprise
a predetermined shape selected to comprise as shape that improves
the bond of thermoplastic material 2 with the contacted surface.
The shape typically comprises a predetermined geometric pattern.
Where the surface comprises a rough or uneven surface, the method
may further comprise varying a thickness of the selected shape of
thermoplastic material 2 wherein the connection of rough or uneven
surfaces are completed.
[0039] If present, as illustrated in FIG. 4, separable interface 6
may be disposed intermediate heater 4 and thermoplastic material 2,
where separable interface 6 comprises upper portion 6a connected to
heater 4 and lower portion 6b selectively attachable and detachable
from upper portion 6a which is substantially permanently attached
to thermoplastic material 2. In such embodiments, separable
interface 6 may be used to create an evenly distributed thermal
transfer of heat into thermoplastic material 2.
[0040] In embodiments comprising mechanical integrator 7 and
referring generally to FIG. 5, hot melt apparatus 1 may be
mechanically integrated onto and/or in to object 8 using mechanical
integrator 7 to become a tool or structural extension of object
8.
[0041] In other embodiments, hot melt apparatus 1 may be
temporarily attached to placement device 10 using mechanical
integrator 7 and subsequently disconnected from placement device 10
after a bond comprising thermoplastic material 2 is created to
object 8.
[0042] In embodiments where hot melt apparatus 1 further comprises
electrical integrator 9, and as generally illustrated in FIG. 8,
hot melt apparatus 1 may be electrically integrated with object 8
using electrical integrator 9 and one or more electrical pathways
provided from object 8 to support the operation of hot melt
apparatus 1. This may include temporarily attaching hot melt
apparatus 1 to placement device 10 using electrical integrator 9
disconnecting placement device 10 from hot melt apparatus 1 after a
bond comprising thermoplastic material 2 is created to object
8.
[0043] In embodiments comprising a plurality of hot melt
apparatuses 1, and as generally illustrated in FIG. 11, one or more
electrically conductive cables 13 may be used to operatively
interconnect electrical integrator 9 of a first hot melt apparatus
1 of the plurality of hot melt apparatuses 1 to electrical
integrator 9 a second hot melt apparatus 1 of the plurality of hot
melt apparatuses 1. Additionally, one or more electrical ground
paths may be created through electrically conductive cable 13 when
one or more of the plurality of hot melt apparatuses 1 are bonded
separately to object 8 and, optionally, secondary object 14. In
other of these embodiments, two or more of the plurality of hot
melt apparatuses 1 may be interconnected by mechanical integrators
7 and electrical integrators 9 and used to bond object 8 to
secondary object 1.
[0044] In other contemplated embodiments, and as generally
illustrated in FIGS. 13 and 14, two or more hot melt apparatus 1
may be integrated within a common structural body 3 with
thermoplastic material 2 at both ends to create a double-sided hot
melt apparatus 15. The double-sided hot melt apparatus 15 may be
used to bond object 8 to secondary object 14.
[0045] Where heater 4 comprises an electro-chemical heater, heater
4 may be activated using a low power electrical signal.
[0046] Where heater 4 comprises a chemical based heater, heater 4
may be activated through mixing of chemicals in heater 4.
[0047] In most of the contemplated embodiments, cooled
thermoplastic material 2 may be reheated to allow removal of hot
melt apparatus 1 from surface to which the thermoplastic material 2
has been bonded. In these embodiments, multiple heating and cooling
cycles of hot melt apparatus 1 may be allowed, further allowing use
and reuse of hot melt apparatus 1 multiple times.
[0048] The foregoing disclosure and description of the inventions
are illustrative and explanatory. Various changes in the size,
shape, and materials, as well as in the details of the illustrative
construction and/or an illustrative method may be made without
departing from the spirit of the invention.
* * * * *