U.S. patent application number 16/558185 was filed with the patent office on 2020-12-17 for immersion cooling module and electronic apparatus having the same.
This patent application is currently assigned to Wiwynn Corporation. The applicant listed for this patent is Wiwynn Corporation. Invention is credited to Chin-Han Chan, Shih-Lung Lin, Tsung-Lin Liu, Ting-Yu Pai.
Application Number | 20200393206 16/558185 |
Document ID | / |
Family ID | 1000004317990 |
Filed Date | 2020-12-17 |
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United States Patent
Application |
20200393206 |
Kind Code |
A1 |
Liu; Tsung-Lin ; et
al. |
December 17, 2020 |
IMMERSION COOLING MODULE AND ELECTRONIC APPARATUS HAVING THE
SAME
Abstract
An electronic apparatus including a box body, at least one heat
generating element and an immersion cooling module are provided.
The immersion cooling module includes a condensing structure and an
airflow guiding device. The box body has a containing space, and
the containing space is adapted to contain a heat dissipation
medium. The heat generating element is disposed in the containing
space to be immersed in the heat dissipation medium which is in the
liquid state. The condensing structure is disposed in the
containing space and includes a first condensing portion. The
airflow guiding device is disposed in the box body and is adapted
to guide the heat dissipation medium which is in the gaseous state
toward the first condensing portion.
Inventors: |
Liu; Tsung-Lin; (New Taipei
City, TW) ; Pai; Ting-Yu; (New Taipei City, TW)
; Lin; Shih-Lung; (New Taipei City, TW) ; Chan;
Chin-Han; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Wiwynn Corporation |
New Taipei City |
|
TW |
|
|
Assignee: |
Wiwynn Corporation
New Taipei City
TW
|
Family ID: |
1000004317990 |
Appl. No.: |
16/558185 |
Filed: |
September 2, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/20554 20130101;
H05K 7/20663 20130101; H05K 7/20327 20130101; H05K 7/208 20130101;
F28F 9/0265 20130101; H05K 7/20318 20130101; H05K 7/203
20130101 |
International
Class: |
F28F 9/00 20060101
F28F009/00; H05K 7/20 20060101 H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 17, 2019 |
TW |
108120829 |
Claims
1. An electronic apparatus, comprising: a box body, having a
containing space, wherein the containing space is adapted to
contain a heat dissipation medium; at least one heat generating
element, disposed in the containing space and immersed in the
liquid heat dissipation medium, wherein the liquid heat dissipation
medium is adapted to be gasified into a gaseous heat dissipation
medium through thermal energy of the at least one heat generating
element; and an immersion cooling module, comprising a condensing
structure and an airflow guiding device, wherein the condensing
structure is disposed in the containing space and comprises a first
condensing portion, the airflow guiding device is disposed in the
box body, and is adapted to guide the gaseous heat dissipation
medium toward the first condensing portion, wherein the condensing
structure and the airflow guiding device are disposed along side
walls of the box body.
2. The electronic apparatus of claim 1, comprising a cover body,
wherein the cover body is adapted to cover the box body to seal the
containing space, and the cover body is adapted to be opened
relative to the box body to expose the containing space to the
outside.
3. The electronic apparatus of claim 2, wherein the airflow guiding
device is activated when the cover body is opened relative to the
box body.
4. The electronic apparatus of claim 1, wherein the immersion
cooling module comprises at least one sensor, the at least one
sensor is disposed in the containing space, when the at least one
sensor senses that an air temperature in the containing space is
higher than a temperature threshold or an air pressure in the
containing space is higher than a pressure threshold, the airflow
guiding device is activated.
5. The electronic apparatus of claim 4, wherein the immersion
cooling module comprises a control unit, when the at least one
sensor senses that the air temperature in the containing space is
higher than the temperature threshold or the air pressure in the
containing space is higher than the pressure threshold, the control
unit controls a flow speed of a condensate in the condensing
structure to increase.
6. The electronic apparatus of claim 4, wherein the at least one
sensor comprises at least one of a temperature sensor and a
pressure sensor.
7. The electronic apparatus of claim 1, wherein the airflow guiding
device comprises at least one airflow generating device and an
airflow passage, the at least one airflow generating device is
adapted to generate a guiding airflow, the guiding airflow drives
the gaseous heat dissipation medium to flow toward the first
condensing portion along the airflow passage.
8. The electronic apparatus of claim 7, wherein the airflow passage
comprises at least one conduit extending along an edge of the
containing space and having at least one air inlet.
9. The electronic apparatus of claim 8, wherein the at least one
air inlet comprises a plurality of air inlets, an aperture of the
air inlets is proportional to a distance between the air inlets and
the at least one airflow generating device.
10. The electronic apparatus of claim 8, wherein the condensing
structure comprises a second condensing portion, the second
condensing portion is located below the at least one conduit, and
the at least one air inlet faces the second condensing portion.
11. The electronic apparatus of claim 8, wherein the condensing
structure comprises a second condensing portion surrounded by the
at least one conduit, the at least one air inlet faces the second
condensing portion.
12. The electronic apparatus of claim 7, wherein the airflow
guiding device comprises a mask connected between the at least one
airflow generating device and the airflow passage, the guiding
airflow from the airflow passage is adapted to flow through the
mask toward the at least one airflow generating device.
13. The electronic apparatus of claim 12, wherein a segment of the
airflow passage is connected to the mask, the guiding airflow flows
along a flow direction toward the center of the segment, the
airflow guiding device comprises a plurality of stoppers disposed
in the segment and arranged along the flow direction, a length of
the stoppers is inversely proportional to a distance between the
stoppers and the center of the segment.
14. The electronic apparatus of claim 7, wherein the at least one
airflow generating device and the airflow passage are formed in a
side wall of the box body.
15. The electronic apparatus of claim 1, wherein the condensing
structure comprises a second condensing portion extending along an
edge of the containing space.
16. The electronic apparatus of claim 1, comprising a display
interface, wherein the display interface is disposed outside the
box body and is adapted to display physical measurement parameters
and images in the containing space.
17. The electronic apparatus of claim 1, wherein the electronic
apparatus is a server, a storage or an exchanger.
18. An immersion cooling module, which is adapted for an electronic
apparatus, the electronic apparatus comprising a box body and at
least one heat generating element, the box body having a containing
space adapted to contain a heat dissipation medium, wherein the at
least one heat generating element is disposed in the containing
space and immersed in the liquid heat dissipation medium, and the
immersion cooling module comprising: a condensing structure,
disposed in the containing space and comprising a first condensing
portion; and an airflow guiding device, disposed in the box body
and is adapted to guide the gaseous heat dissipation medium toward
the first condensing portion, wherein the condensing structure and
the airflow guiding device are disposed along side walls of the box
body.
19. The immersion cooling module of claim 18, wherein the airflow
guiding device comprises at least one airflow generating device and
an airflow passage, the at least one airflow generating device is
adapted to generate a guiding airflow, the guiding airflow drives
the gaseous heat dissipation medium to flow along the airflow
passage toward the first condensing portion, the airflow guiding
device comprises a mask connected between the at least one airflow
generating device and the airflow passage, the guiding airflow from
the airflow passage is adapted to flow through the mask toward the
at least one airflow generating device.
20. The immersion cooling module of claim 18, wherein the
condensing structure comprises a second condensing portion
extending along an edge of the containing space.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 108120829, filed on Jun. 17, 2019. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND
Technical Field
[0002] The present disclosure relates to an immersion cooling
module and an electronic apparatus having the same, and more
particularly to an immersion cooling module having an airflow
guiding device and an electronic apparatus having the same.
Description of Related Art
[0003] As the performance of server grows rapidly, the
high-performance server generates a lot of waste heat. In order to
avoid the poor operation of the host caused by the accumulation of
waste heat, some servers are designed to immerse the mainboard in
heat dissipation liquid, and the heat dissipation liquid absorbs
the heat generated by the heat generating elements of the mainboard
and is gasified and condensed on the condensing pipeline. The heat
dissipation droplets condensed on the condensing pipeline are
returned to the heat dissipation liquid through gravity, thereby
circulating to achieve the heat dissipation effect, which is known
as the two-phase immersion cooling technology in the field. The
cost of the heat dissipation liquid is usually expensive, and if
the heat dissipation liquid is unexpectedly dissipated to the
outside after being gasified, the maintenance cost of the server
will be excessively increased.
SUMMARY
[0004] The disclosure provides an electronic apparatus, which can
prevent the heat dissipation medium from escaping to the outside,
and can increase the condensation efficiency of the heat
dissipation medium and improve the heat dissipation capability of
the electronic apparatus.
[0005] The electronic apparatus of the present disclosure includes
a box body, at least one heat generating element and an immersion
cooling module. The immersion cooling module includes a condensing
structure and an airflow guiding device. The box body has a
containing space, and the containing space is adapted to contain a
heat dissipation medium. The heat generating element is disposed in
the containing space and immersed in the liquid heat dissipation
medium, wherein the liquid heat dissipation medium is adapted to be
gasified into a gaseous heat dissipation medium through the thermal
energy of the heat generating element. The condensing structure is
disposed in the containing space and includes a first condensing
portion. The airflow guiding device is disposed in the box body,
and is adapted to guide the gaseous heat dissipation medium toward
the first condensing portion.
[0006] The immersion cooling module of the present disclosure is
adapted for an electronic apparatus, the electronic apparatus
includes a box body and at least one heat generating element. The
box body has a containing space, and the containing space is
adapted to contain a heat dissipation medium. The heat generating
element is disposed in the containing space and immersed in the
liquid heat dissipation medium. The immersion cooling module
includes a condensing structure and an airflow guiding device. The
condensing structure is disposed in the containing space and
includes a first condensing portion. The airflow guiding device is
disposed in the box body, and is adapted to guide the gaseous heat
dissipation medium toward the first condensing portion.
[0007] In an embodiment of the disclosure, the electronic apparatus
includes a cover body, wherein the cover body is adapted to cover
the box body to seal the containing space, and the cover body is
adapted to be opened relative to the box body to expose the
containing space to the outside environment.
[0008] In an embodiment of the disclosure, when the cover body is
opened relative to the box body, the airflow guiding device is
activated.
[0009] In an embodiment of the present disclosure, the immersion
cooling module includes at least one sensor disposed in the
containing space. When the sensor senses that the temperature of
the air in the containing space is higher than a temperature
threshold or the air pressure in the containing space is higher
than a pressure threshold, the airflow guiding device is
activated.
[0010] In an embodiment of the disclosure, the immersion cooling
module includes a control unit, wherein when the sensor senses that
the temperature of the air in the containing space is higher than a
temperature threshold or the air pressure in the containing space
is higher than the pressure threshold, the control unit controls
the flow speed of the condensate in the condensing structure to
increase.
[0011] In an embodiment of the disclosure, the sensor includes at
least one of a temperature sensor and a pressure sensor.
[0012] In an embodiment of the disclosure, the airflow guiding
device includes at least one airflow generating device and an
airflow passage, and the at least one airflow generating device is
adapted to generate a guiding airflow. The guiding airflow drives
the gaseous heat dissipation medium to flow along the airflow
passage to the first condensing portion.
[0013] In an embodiment of the disclosure, the airflow passage
includes at least one conduit, and the at least one conduit extends
along an edge of the containing space and has at least one air
inlet.
[0014] In an embodiment of the disclosure, the at least one air
inlet includes a plurality of air inlets, and the apertures of the
air inlet are proportional to the distance between the air inlets
and the at least one airflow generating device.
[0015] In an embodiment of the disclosure, the condensing structure
includes a second condensing portion, the second condensing portion
is located under the at least one conduit, and the at least one air
inlet faces the second condensing portion.
[0016] In an embodiment of the disclosure, the condensing structure
includes a second condensing portion, the second condensing portion
is surrounded by the at least one conduit, and the at least one air
inlet faces the second condensing portion.
[0017] In an embodiment of the disclosure, the airflow guiding
device includes a mask connected between the at least one airflow
generating device and the airflow passage, and the guiding airflow
from the airflow passage is adapted to pass through the mask to
flow toward the at least one airflow generating device.
[0018] In an embodiment of the disclosure, a segment of the airflow
passage is connected to the mask, and the guiding airflow flows
toward the center of the segment along a flow direction. The
airflow guiding device includes a plurality of stoppers. The
stoppers are disposed in the segment and arranged along the flow
direction. The length of the stoppers is inversely proportional to
the distance between the stoppers and the center of the
segment.
[0019] In an embodiment of the disclosure, the at least one airflow
generating device and the airflow passage are formed in a side wall
of the box body.
[0020] In an embodiment of the disclosure, the condensing structure
includes a second condensing portion, and the second condensing
portion extends along an edge of the containing space.
[0021] In an embodiment of the disclosure, the electronic apparatus
includes a display interface, wherein the display interface is
disposed outside the box body and is adapted to display physical
measurement parameters and images in the containing space.
[0022] In an embodiment of the disclosure, the electronic apparatus
is a server, a storage or an exchanger.
[0023] In order to make the aforementioned features and advantages
of the disclosure more comprehensible, embodiments accompanying
figures are described in detail below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] FIG. 1 is a perspective view of an electronic apparatus
according to an embodiment of the present disclosure.
[0025] FIG. 2 illustrates a cover body of FIG. 1 opened relative to
a box body.
[0026] FIG. 3 is a perspective view of a condensing structure and
an airflow guiding device of FIG. 1.
[0027] FIG. 4 is an exploded view of the condensing structure and
the airflow guiding device of FIG. 3.
[0028] FIG. 5 is a schematic view of some elements of the
electronic apparatus of FIG. 1.
[0029] FIG. 6 is a flow chart of the actuation of the electronic
apparatus of FIG. 1.
[0030] FIG. 7 is an exploded view of the airflow guiding device of
FIG. 4.
[0031] FIG. 8 is a perspective view of the airflow guiding device
of FIG. 4.
[0032] FIG. 9 is a partial cross-sectional view of the airflow
guiding device of FIG. 4.
[0033] FIG. 10 is a front view of the airflow guiding device of
FIG. 4.
[0034] FIG. 11 illustrates a vapor line in the containing space of
the box body of FIG. 1.
[0035] FIG. 12 illustrates the configuration of the immersion
cooling module of FIG. 3 omitting part of the structure.
DESCRIPTION OF THE EMBODIMENTS
[0036] FIG. 1 is a perspective view of an electronic apparatus
according to an embodiment of the present disclosure. FIG. 2
illustrates a cover body of FIG. 1 opened relative to a box body.
FIG. 3 is a perspective view of a condensing structure and an
airflow guiding device of FIG. 1. FIG. 4 is an exploded view of the
condensing structure and the airflow guiding device of FIG. 3.
Referring to FIG. 1 to FIG. 4, an electronic apparatus 100 of the
embodiment is, for example, a server, a storage or an exchanger,
and includes a box body 110, a cover body 120, at least one heat
generating element 130, and an immersion cooling module M. The
immersion cooling module M includes a condensing structure 140 and
an airflow guiding device 150. The containing space of the box body
110 is adapted to contain a heat dissipation medium. The heat
generating element 130 is disposed in the containing space of the
box body 110 and immersed in the liquid heat dissipation medium.
The heat generating element 130 is, for example, a central
processing unit or other kinds of chips on a plurality of pluggable
mainboards in the server, the present disclosure provides no
limitation thereto. The liquid heat dissipation medium is gasified
into a gaseous heat dissipation medium through the thermal energy
of the heat generating element 130.
[0037] The condensing structure 140 is disposed in the containing
space of the box body 110 and includes a first condensing portion
142 and a second condensing portion 144. The first condensing
portion 142 is, for example, a main condensing portion, and the
second condensing portion 144 is, for example, a sub-condensing
portion and extends along an edge of the containing space of the
box body 110 without occupying and blocking the electronic element
configuration region in the center of the containing space. The
first condensing portion 142 is, for example, a condensing pipe set
and has a condensate inlet 142a and a condensate outlet 142b for
inputting and outputting the external condensate. Similarly, the
second condensing portion 144 is, for example, a condensing pipe
set and has a condensate inlet 144a and a condensate outlet 144b
for inputting and outputting the external condensate.
[0038] The heat dissipation medium is, for example, a dielectric
solution which is in the liquid state at normal temperature, and
is, for example, a fluorinated liquid having a boiling point of
40.degree. C. to 60.degree. C. or other suitable heat dissipation
medium, the present disclosure provides no limitation thereto. The
liquid heat dissipation medium absorbs the heat generated by the
heat generating element 130 (such as a central processing unit or
other type of chip on the mainboard in the server) to decrease the
temperature of the heat generating element 130, and is boiled and
gasified rapidly through the heat generated by the heat generating
element 130. When a gaseous heat dissipation medium having high
thermal energy flows to the condensing structure 140 in the sealed
containing space, it is cooled by the low-temperature condensate
flowing in the condensing structure 140 and condensed on the
condensing structure 140. The condensate in the condensing
structure 140 absorbs the thermal energy from the heat dissipation
medium and then flows to the outside of the electronic apparatus
100 for heat exchange to be cooled, and the cooled condensate flows
back to the condensing structure 140, thereby continuously
circulating. On the other hand, the droplets of the heat
dissipation medium condensed on the condensing structure 140 fall
back into the liquid heat dissipation medium through gravity,
thereby circulating to achieve the heat dissipation effect. The
cover body 120 is adapted to cover the box body 110 to seal the
containing space of the box body 110 as shown in FIG. 1, so that
the heat dissipation medium performs the above-mentioned
circulation in the sealed containing space. Moreover, the cover
body 120 is adapted to be opened relative the box body 110 as shown
in FIG. 2 to expose the containing space of the box body 110 to the
outside environment, so as to facilitate maintenance of the
electronic apparatus 100 or removal or replacement of elements.
[0039] The airflow guiding device 150 is disposed in the box body
110. When the cover body 120 is opened relative to the box body
110, the airflow guiding device 150 can be activated to guide the
gaseous heat dissipation medium toward the first condensing portion
142 to be instantly condensed into a liquid state. In this manner,
it is possible to prevent the gaseous heat dissipation medium from
unexpectedly escaping to the outside when the cover body 120 is
opened. In addition, the gaseous heat dissipation medium is
forcibly guided to the condensing structure 140 through the airflow
guiding device 150 to increase the condensation efficiency of the
heat dissipation medium, thereby improving the heat dissipation
capability of the electronic apparatus 100.
[0040] Please refer to FIG. 11 first, which schematically shows the
box body 110 and its containing space, wherein a gaseous heat
dissipation medium S2 is distributed between the vapor line V and
the liquid surface of the liquid heat dissipation medium S1, and
the air having smaller gravity than the gaseous heat dissipation
medium S2 is located above the vapor line. The higher the
temperature and/or pressure in the containing space, the more the
amount of the gaseous heat dissipation medium S2, that is, the
higher the position of the vapor line V, the more likely the
gaseous heat dissipation medium S2 will escape to the outside. FIG.
5 is a schematic view of some elements of the electronic apparatus
of FIG. 1. As shown in FIG. 5, the electronic apparatus 100 of the
embodiment further includes a control unit 160, a temperature
sensor 170, and a pressure sensor 180. The temperature sensor 170
and the pressure sensor 180 are disposed in the containing space of
the box body 110 and respectively configured for sensing the
temperature of the air and the air pressure in the containing
space. The control unit 160 is coupled to the temperature sensor
170 and the pressure sensor 180, and can determine the level of the
vapor line V in the containing space according to at least one of
an air temperature sensed by the temperature sensor 170 and an air
pressure sensed by the pressure sensor 180, thereby controlling the
activation of the airflow guiding device 150 and controlling
whether the flow speed of the condensate in the condensing
structure 140 is increased or not. The following is a detailed
description of the relevant actuation process.
[0041] FIG. 6 is a flow chart of the actuation of the electronic
apparatus of FIG. 1. Referring to FIG. 6, when the cover body 120
is opened (step S601), the airflow guiding device 150 is activated
(step S602). On this occasion, the control unit 160 determines
whether the temperature of the air in the containing space of the
box body 110 is greater than the temperature threshold T1 according
to the temperature sensed by the temperature sensor 170 (step
S603). When the temperature sensor 170 senses that the temperature
of the air in the containing space is higher than the temperature
threshold T1, it represents that the amount of the gaseous heat
dissipation medium is greater than the critical value, which causes
that the position of the vapor line V is too high and the gaseous
heat dissipation medium is more likely to escape to the outside
environment. On this occasion, the control unit 160 controls the
flow speed of the condensate in the condensing structure 140 to
increase (step S604) to speed up the condensing speed of the heat
dissipation medium and avoid the escape of the gaseous heat
dissipation medium. Conversely, when the temperature sensor 170
senses that the temperature of the air in the containing space is
not higher than the temperature threshold T1, it represents that
the amount of the gaseous heat dissipation medium is less than the
critical value, and therefore the gaseous heat dissipation medium
is less likely to escape to the outside. On this occasion, the
control unit 160 can control the airflow guiding device 150 to turn
off (step S605) to save power consumption. In step S605, it is also
possible to choose not to turn off the airflow guiding device 150
to ensure that the gaseous heat dissipation medium does not escape
to the outside, the present disclosure provides no limitation
thereto.
[0042] On the other hand, when the cover body 120 is closed (step
S606) to cover the box body 110, the control unit 160 determines
whether the temperature of the air in the containing space of the
box body 110 is higher than the threshold T2 according to the
temperature sensed by the temperature sensor 170 (step S607). When
the temperature sensor 170 senses that the temperature of the air
in the containing space is higher than the temperature threshold
T2, it represents that the amount of the gaseous heat dissipation
medium is greater than a critical value, which causes that the
position of the vapor line V is too high and the gaseous heat
dissipation medium is more likely to escape to the outside from the
gap between the box body 110 and the cover body 120. On this
occasion, the control unit 160 controls the airflow guiding device
150 to activate and controls the flow speed of the condensate in
the condensing structure 140 to increase (step S608) to avoid the
escape of the gaseous heat dissipation medium. Conversely, when the
temperature sensor 170 senses that the temperature of the air in
the containing space is not higher than the temperature threshold
T2, it represents that the amount of the gaseous heat dissipation
medium is less than the critical value, and therefore the gaseous
heat dissipation medium is less likely to escape to the outside. On
this occasion, the control unit 160 can control the airflow guiding
device 150 to turn off (step S609) to save power consumption. In
step S609, it is also possible to choose not to turn off the
airflow guiding device 150 to ensure that the gaseous heat
dissipation medium does not escape to the outside, the present
disclosure provides no limitation thereto.
[0043] In addition, when the cover body 120 is closed (step S606)
to cover the box body 110, the control unit 160 can further
determine whether the air pressure in the containing space of the
box body 110 is greater than the pressure threshold P according to
the pressure sensed by the pressure sensor 180 (step S610). When
the pressure sensor 180 senses that the air pressure in the
containing space is higher than the pressure threshold P, it
represents that the amount of the gaseous heat dissipation medium
is greater than the critical value, which causes that the position
of the vapor line V is too high and the gaseous heat dissipation
medium is more likely to escape to the outside from the gap between
the box body 110 and the cover body 120. On this occasion, the
control unit 160 controls the airflow guiding device 150 to
activate and controls the flow speed of the condensate in the
condensing structure 140 to increase (step S611) to avoid the
escape of the gaseous heat dissipation medium. Conversely, when the
pressure sensor 180 senses that the air pressure in the containing
space is not higher than the pressure threshold P, it represents
that the amount of the gaseous heat dissipation medium is smaller
than the critical value, and therefore the gaseous heat dissipation
medium is less likely to escape to the outside. On this occasion,
the control unit 160 can control the airflow guiding device 150 to
turn off (step S612) to save power consumption. In step S612, it is
also possible to choose not to turn off the airflow guiding device
150 to ensure that the gaseous heat dissipation medium does not
escape to the outside, the present disclosure provides no
limitation thereto.
[0044] As shown in FIG. 1 and FIG. 2, the electronic apparatus 100
of the present embodiment further includes a display interface 190.
The display interface 190 is disposed outside the box body 110 and
is adapted to display information such as physical measurement
parameters (such as temperature, pressure) and images in the
containing space of the box body 110 for users to watch.
[0045] FIG. 7 is an exploded view of the airflow guiding device of
FIG. 4. Referring to FIG. 7, the airflow guiding device 150 of the
present embodiment includes at least one airflow generating device
152 and an airflow passage 154. The airflow generating device 152
is, for example, a fan and is adapted to generate a guiding airflow
for driving the gaseous heat dissipation medium to flow along the
airflow passage 154 to the first condensing portion 142 shown in
FIG. 3. Specifically, the rotation speed of the airflow generating
device 152 can be determined according to the heat dissipation
requirement of the electronic apparatus 100.
[0046] Further, the airflow generating device 152 includes an upper
housing 152a, a lower housing 152b, and a plurality of airflow
generating units 152c. The upper housing 152a and the lower housing
152b are assembled together to cover the airflow generating unit
152c. The airflow guiding device 150 further includes a guiding
structure 156 connected to the lower end of the airflow generating
device 152 for guiding the air from the airflow generating device
152 toward the first condensing portion 142 below the airflow
generating device.
[0047] FIG. 8 is a perspective view of the airflow guiding device
of FIG. 4. Specifically, the airflow passage 154 is constituted,
for example, by a plurality of conduits that extend along the edge
of the containing space of the box body 110 and has a plurality of
air inlets 154a as shown in FIG. 8, the guiding airflow enters the
conduit through the air inlets 154a and flow toward the airflow
generating device 152. Further, since the airflow generating device
152 generates a smaller airflow guiding force for the air inlet
154a farther from the airflow generating device 152, the apertures
of the air inlets 154a can be designed to be proportional to the
distance between the air inlets 154a and the airflow generating
device 152 as shown in FIG. 8. As such, the air inlets 154a farther
from the airflow generating device 152 have larger apertures to
make the amount of intake air of the air inlets 154a uniform.
[0048] In the present embodiment, the conduit includes a main body
portion (the airflow passage 154 indicated by a solid line in FIG.
8) corresponding to the airflow generating device 152, and includes
two arm portions (the airflow passage 154 indicated by a broken
line in FIG. 8) corresponding to the second condensing portion 144
and extending from both ends of the main body portion. In other
embodiments, the second condensing portion 144 may not be provided
and the arm portion may not be provided, the present disclosure
provides no limitation thereto.
[0049] FIG. 9 is a partial cross-sectional view of the airflow
guiding device of FIG. 4. In the present embodiment, the airflow
guiding device 150 includes a mask 158 that is connected between
the airflow generating device 152 and the airflow passage 154. The
guiding airflow from the airflow passage 154 is adapted to flow
through the mask 158 toward the airflow generating device 152 along
the flow direction shown in FIG. 9, and flows through the airflow
generating device 152 toward the first condensing portion 142 shown
in FIG. 1.
[0050] FIG. 10 is a front view of the airflow guiding device of
FIG. 4. Referring to FIG. 10, in the present embodiment, a segment
1541 of the airflow passage 154 is connected to the mask 158, and
the guiding airflow flows along the flow direction D toward the
center of the segment 1541 of the airflow passage 154. The airflow
guiding device 150 includes a plurality of stoppers 159 which are
disposed in the segment 1541 of the airflow passage 154 and are
arranged along the flow direction D. The length of the stoppers 159
is inversely proportional to the distance between the stoppers 139
and the center of the segment 1541 of the airflow passage 154, such
that the stoppers 159 closer to the center of the segment 1541 of
the airflow passage 154 have a greater length in the direction
perpendicular to the flow direction D. In this manner, it is
possible to avoid that the guiding airflow is excessively
concentrated in the center of the segment 1541 of the airflow
passage 154 before being driven downward by the airflow generating
device 152, so that the airflow generating device 152 can uniformly
drive the guiding airflow to flow downward.
[0051] As shown in FIG. 3, a part of the condensing pipe set
(second condensing portion 144) of the present embodiment is
located below the conduit (the airflow passage 154), and the air
inlet 154a (shown in FIG. 8) of the conduit (the airflow passage
154) is formed on the lower surface of the conduit (airflow passage
154) and faces the condensing pipe set (second condensing portion
144). However, the present disclosure provides no limitation to the
relative arrangement positions of the condensing pipe set and the
conduit. In other embodiments, a part of the condensing pipe set
(the second condensing portion 144) may be surrounded by the
conduit (the airflow passage 154) and located at the edge of the
conduit (the airflow passage 154), and the air inlet 154a (shown in
FIG. 8) of the conduit (the airflow passage 154) is formed on the
lateral surface of the conduit (the airflow passage 154) and faces
the condensing pipe set (the second condensing portion 144). In
addition, in other embodiments, the airflow generating device 152
and the airflow passage 154 may be formed in the side wall of the
box body 110 to further save the configuration space in the box
body 110.
[0052] FIG. 12 illustrates the configuration of the immersion
cooling module of FIG. 3 omitting part of the structure. Compared
with the embodiment shown in FIG. 3, the airflow passage 154 of the
airflow guiding device 150 can be changed to an extending arm
omitting both sides as shown in the embodiment of FIG. 12, and
correspondingly omitting the configuration of the second condensing
portion 144, thereby increasing the available area of the
containing space in the box body 110 (shown in FIG. 1).
[0053] In summary, the electronic apparatus of the present
disclosure is provided with an airflow guiding device, and the
gaseous heat dissipation medium in the box body can be forcibly
guided to the condensing structure through the airflow guiding
device. In this manner, it is possible to prevent the gaseous heat
dissipation medium from unexpectedly escaping to the outside
environment. In addition, by forcibly guiding the gaseous heat
dissipation medium to the condensing structure through the airflow
guiding device, the condensation efficiency of the heat dissipation
medium can be increased, thereby improving the heat dissipation
capability of the electronic apparatus.
[0054] Although the present disclosure has been disclosed in the
above embodiments, it is not intended to limit the present
disclosure, and those skilled in the art can make some
modifications and refinements without departing from the spirit and
scope of the disclosure. Therefore, the scope to be protected by
the present disclosure is subject to the scope defined by the
appended claims.
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