U.S. patent application number 16/885421 was filed with the patent office on 2020-12-03 for photoelectric conversion module and photoelectric conversion module array.
This patent application is currently assigned to Ricoh Company, Ltd.. The applicant listed for this patent is Takahiro IDE, Naomichi KANEI. Invention is credited to Takahiro IDE, Naomichi KANEI.
Application Number | 20200382055 16/885421 |
Document ID | / |
Family ID | 1000004916092 |
Filed Date | 2020-12-03 |
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United States Patent
Application |
20200382055 |
Kind Code |
A1 |
IDE; Takahiro ; et
al. |
December 3, 2020 |
PHOTOELECTRIC CONVERSION MODULE AND PHOTOELECTRIC CONVERSION MODULE
ARRAY
Abstract
A photoelectric conversion module includes a substrate, a
photoelectric conversion element mounted on the substrate, and a
connector mounted on the substrate, the connector including a
terminal that is electrically coupled to the photoelectric
conversion element, wherein the connector is configured such that
coupling the connector to a connector of another photoelectric
conversion module causes the photoelectric conversion element to be
electrically coupled to a photoelectric conversion element of the
another photoelectric conversion module.
Inventors: |
IDE; Takahiro; (Shizuoka,
JP) ; KANEI; Naomichi; (Shizuoka, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
IDE; Takahiro
KANEI; Naomichi |
Shizuoka
Shizuoka |
|
JP
JP |
|
|
Assignee: |
Ricoh Company, Ltd.
Tokyo
JP
|
Family ID: |
1000004916092 |
Appl. No.: |
16/885421 |
Filed: |
May 28, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H02S 40/36 20141201;
H01G 9/2081 20130101; H01G 9/2068 20130101; H02S 40/38
20141201 |
International
Class: |
H02S 40/36 20060101
H02S040/36; H01G 9/20 20060101 H01G009/20 |
Foreign Application Data
Date |
Code |
Application Number |
May 31, 2019 |
JP |
2019-103120 |
Jan 29, 2020 |
JP |
2020-012080 |
Claims
1. A photoelectric conversion module comprising: a substrate; a
photoelectric conversion element mounted on the substrate; and a
connector mounted on the substrate, the connector including a
terminal that is electrically coupled to the photoelectric
conversion element, wherein the connector is configured such that
coupling the connector to a connector of another photoelectric
conversion module causes the photoelectric conversion element to be
electrically coupled to a photoelectric conversion element of the
another photoelectric conversion module.
2. The photoelectric conversion module as claimed in claim 1,
wherein the connector includes a male connector and a female
connector, wherein a male connector of the photoelectric conversion
module can be electrically and mechanically coupled to a female
connector of another photoelectric conversion module that is
disposed at one side of the photoelectric conversion module, and
wherein a female connector of the photoelectric conversion module
can be electrically and mechanically coupled to a male connector of
another photoelectric conversion module that is disposed at another
side of the photoelectric conversion module.
3. The photoelectric conversion module as claimed in claim 1,
wherein a plurality of said photoelectric conversion elements are
mounted on the substrate.
4. The photoelectric conversion module as claimed in claim 1,
comprising a power storage element mounted on the substrate, the
power storage element storing electric power generated by the
photoelectric conversion element.
5. The photoelectric conversion module as claimed in claim 1,
comprising a socket mounted on the substrate, the socket being
connectable to a terminal of the photoelectric conversion element,
wherein the photoelectric conversion element is mounted on the
substrate through the socket in a removable state.
6. The photoelectric conversion module as claimed in claim 1,
wherein substrate information including information indicating a
type of a component mounted on the substrate, and/or connection
information including information indicating the number of said
photoelectric conversion elements mounted on the substrate can be
read outside of the substrate.
7. The photoelectric conversion module as claimed in claim 6,
wherein the substrate information and/or the connection information
is electrically rewritable.
8. The photoelectric conversion module as claimed in claim 6,
wherein the substrate information and/or the connection information
is configurable by a switch.
9. A photoelectric conversion module array in which a plurality of
said photoelectric conversion modules as claimed in claim 1 are
coupled with each other through said connectors, the photoelectric
conversion module array comprising: a plurality of first
photoelectric conversion modules; and a second photoelectric
conversion module, wherein n said photoelectric conversion elements
(where n is a natural number equal to or greater than 2) are
mounted on a substrate of a first photoelectric conversion module
among the plurality of first photoelectric conversion modules, and
wherein m said photoelectric conversion elements (where m is a
natural number smaller than n) are mounted on a substrate of the
second photoelectric conversion module.
10. The photoelectric conversion module array as claimed in claim
9, comprising a power storage element mounted on the substrate of
the second photoelectric conversion module, the power storage
element storing electric power generated by the photoelectric
conversion elements of the plurality of first photoelectric
conversion modules and the second photoelectric conversion
module.
11. The photoelectric conversion module array as claimed in claim
9, the photoelectric conversion module array including the
plurality of first photoelectric conversion modules and one second
photoelectric conversion module.
12. The photoelectric conversion module array as claimed in claim
11, wherein the second photoelectric conversion module is disposed
on an end of the photoelectric conversion module array.
13. The photoelectric conversion module array as claimed in claim
9, comprising a power storage element mounted on the substrate of
the first photoelectric conversion module, the power storage
element storing electric power generated by the photoelectric
conversion elements of the plurality of first photoelectric
conversion modules and the second photoelectric conversion module,
wherein the first photoelectric conversion module is disposed on an
end of the photoelectric conversion module array.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application is based on and claims priority
under 35 U.S.C. .sctn. 119 to Japanese Patent Application No.
2019-103120, filed on May 31, 2019, and Japanese Patent Application
No. 2020-012080, filed on Jan. 29, 2020, the contents of which are
incorporated herein by reference in their entirety.
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0002] The present disclosure relates to a photoelectric conversion
module and a photoelectric conversion module array.
2. Description of the Related Art
[0003] In recent years, the importance of photoelectric conversion
modules has been increasing as alternative energy to fossil fuels
or as a global warming solution. In particular, much attention has
been given to photoelectric conversion elements for indoor use that
can efficiently generate power even using low illumination light
because wide applications as an autonomous power source, which does
not require battery replacement and power source wiring for
example, can be expected.
[0004] Examples of the photoelectric conversion elements include
amorphous silicon solar cells, organic solar cells, perovskite
solar cells, and dye-sensitized solar cells. For example, a solar
panel in which multiple solar cell units each having multiple solar
cells coupled in series are arranged in parallel in two dimensional
directions on one substrate, is disclosed (e.g., Patent Document
1).
Patent Document 1: Japanese Unexamined Patent Application
Publication No. 2006-173539
SUMMARY OF THE INVENTION
[0005] According to one aspect of an embodiment, a photoelectric
conversion module includes a substrate, a photoelectric conversion
element mounted on the substrate, and a connector mounted on the
substrate, the connector including a terminal that is electrically
coupled to the photoelectric conversion element, wherein the
connector is configured such that coupling the connector to a
connector of another photoelectric conversion module causes the
photoelectric conversion element to be electrically coupled to a
photoelectric conversion element of the another photoelectric
conversion module.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is a plan view illustrating an example of a
photoelectric conversion module according to a first
embodiment;
[0007] FIG. 2A is a first cross-sectional view illustrating an
example of the photoelectric conversion module according to the
first embodiment;
[0008] FIG. 2B is an example of an enlarged view of a part near a
positive terminal in FIG. 2A;
[0009] FIG. 2C is another example 1 of an enlarged view of a part
near the positive terminal in FIG. 2A;
[0010] FIG. 2D is another example 2 of an enlarged view of a part
near the positive terminal in FIG. 2A;
[0011] FIG. 2E is another example 3 of an enlarged view of a part
near the positive terminal in FIG. 2A;
[0012] FIG. 3 is a second cross-sectional view illustrating an
example of the photoelectric conversion module according to the
first embodiment;
[0013] FIG. 4 is a cross-sectional view illustrating an example of
a power generator of a photoelectric conversion element;
[0014] FIG. 5 is a first plan view illustrating an example of
connections of multiple photoelectric conversion modules;
[0015] FIG. 6 is a first schematic diagram illustrating an example
of interconnects on a substrate of the photoelectric conversion
module according to the first embodiment;
[0016] FIG. 7 is a second schematic diagram illustrating an example
of interconnects on the substrate of the photoelectric conversion
module according to the first embodiment;
[0017] FIG. 8 is a plan view illustrating an example of a
photoelectric conversion module according to a second
embodiment;
[0018] FIG. 9 is a schematic diagram illustrating an example of
interconnects on a substrate of the photoelectric conversion module
according to the second embodiment;
[0019] FIG. 10 is a cross-sectional view illustrating an example of
a connection between a battery and the photoelectric conversion
module according to the second embodiment;
[0020] FIG. 11 is a second plan view illustrating an example of
connections of multiple photoelectric conversion modules;
[0021] FIG. 12 is a plan view illustrating an example of a
photoelectric conversion module according to a third
embodiment;
[0022] FIG. 13 is a schematic diagram illustrating an example of
interconnects on a substrate of the photoelectric conversion module
according to the third embodiment; and
[0023] FIG. 14 is a schematic diagram illustrating an example of
interconnects on a substrate of a photoelectric conversion module
according to a modified example of the third embodiment.
DESCRIPTION OF THE EMBODIMENTS
[0024] When photoelectric conversion modules in which the
photoelectric conversion elements are mounted, are mutually
coupled, a lead wire, for example, is required for a connection
between the photoelectric conversion modules, and the wiring
resistance between the photoelectric conversion elements of each
photoelectric conversion module is increased. As a result, a large
voltage drop might occur in output of the photoelectric conversion
elements.
[0025] According to an embodiment of the present invention, a
voltage drop in output of the photoelectric conversion elements
that occurs when multiple photoelectric conversion modules are
mutually coupled, can be suppressed.
[0026] In the following, the embodiment of the present invention
will be described with reference to the drawings. In the drawings,
the same components are referenced by the same reference numerals
and an overlapping description may be omitted.
First Embodiment
[0027] FIG. 1 is a plan view illustrating an example of a
photoelectric conversion module according to a first embodiment.
FIG. 2A is a first cross-sectional view illustrating an example of
the photoelectric conversion module according to the first
embodiment, and illustrates a cross-section taken along the line
A-A of FIG. 1. FIG. 3 is a second cross-sectional view illustrating
an example of the photoelectric conversion module according to the
first embodiment, and illustrates a cross-section taken along the
B-B line of FIG. 1.
[0028] With reference to FIGS. 1 to 3, a photoelectric conversion
module 1 includes a substrate 10, a photoelectric conversion
element 20, sockets 31 and 32, male connectors 41 and 42, and
female connectors 51 and 52.
[0029] The substrate 10 is a substrate on which the photoelectric
conversion element 20, the sockets 31 and 32, the male connectors
41 and 42, the female connectors 51 and 52, and so on, are mounted.
The substrate 10 includes lands on which these components are
mounted and a wiring pattern that electrically couples necessary
parts of these components. The substrate 10 may be, for example, a
resin substrate (such as a glass epoxy substrate), a silicon
substrate, or a ceramic substrate.
[0030] In the present embodiment, the following description assumes
that the planar shape of the substrate 10 is a rectangle shape, for
example. However, the planar shape of the substrate 10 is not
limited to a rectangular shape. Here, planar view indicates viewing
an object from a normal direction of an upper surface 10a of the
substrate 10, and the planar shape indicates a shape of an object
that is viewed from the normal direction of the upper surface 10a
of the substrate 10.
[0031] The photoelectric conversion element 20 includes a substrate
21, a power generator 22, and a substrate 23. The power generator
22 is sandwiched between the substrate 21 and the substrate 23 in
an up and down direction. The periphery of the power generator 22
may be sealed by a resin, for example.
[0032] The photoelectric conversion element 20 is mounted on the
upper surface 10a of the substrate 10 with a light receiving
surface facing upwards (i.e., in a direction that is not facing the
upper surface 10a of the substrate 10). The substrate 23 is
transparent, and sunlight, for example, enters the light receiving
surface of the power generator 22 through the substrate 23. The
substrates 21 and 23 are, for example, glass. The photoelectric
conversion element 20 includes a positive terminal 24 (i.e., a plus
terminal) and a negative terminal 25 (i.e., a minus terminal).
[0033] The photoelectric conversion element 20 is an element that
converts light energy to electrical energy, and is, for example, a
solar cell or a photodiode. Examples of the solar cells include
amorphous silicon solar cells, organic thin film solar cells,
perovskite solar cells, and dye-sensitized solar cells.
[0034] Among these examples, the dye-sensitized solar cells are
preferable in that the dye-sensitized solar cells are advantageous
for cost reduction because the dye-sensitized solar cells can be
manufactured using a conventional printing means. Particularly,
solid-state dye-sensitized solar cells that use a solid material as
a hole transport layer forming the dye-sensitized solar cells, are
preferable in that the solid-state dye-sensitized solar cells can
maintain high durability to a load.
[0035] FIG. 4 is a cross-sectional view illustrating an example of
the power generator of the photoelectric conversion element. When
the photoelectric conversion element 20 is the dye-sensitized solar
cell, the power generator 22 has, for example, a cross-sectional
structure illustrated in FIG. 4.
[0036] The power generator 22 illustrated in FIG. 4, is an example
of a configuration in which a first electrode 222 is formed on a
substrate 221, a hole blocking layer 223 is formed on the first
electrode 222, an electron transport layer 224 is formed on the
hole blocking layer 223, a photosensitizing compound 225 is
adsorbed on an electron transport material in the electron
transport layer 224, and a hole transport layer 226 is between the
first electrode 222 and a second electrode 227 facing the first
electrode 222. The first electrode 222 is coupled to the positive
terminal 24 through, for example, a lead wire, and the second
electrode 227 is coupled to the negative terminal 25 through, for
example, a lead wire. In the following, the power generator 22 will
be described in detail.
[0037] [Substrate]
[0038] The substrate 221 is not particularly limited and a publicly
known substrate can be used. The substrate 221 is preferably a
transparent material. Examples of the substrate 221 include glass,
a transparent plastic plate, a transparent plastic film, and an
inorganic transparent crystal.
[0039] [First Electrode]
[0040] For the first electrode 222, there is no particular
limitation as long as the first electrode 222 is a conductive
material that is transparent to visible light. Any material can be
appropriately selected according to a purpose, and a normal
photoelectric conversion element or a publicly known material used
for a liquid crystal panel or the like can be used.
[0041] Materials of the first electrode 222 include, for example,
indium-tin oxide (ITO), fluorine-doped tin oxide (FTO),
antimony-doped tin oxide (ATO), indium-zinc oxide, niobium-titanium
oxide, and graphene. These may be used either singly or in
combination of two or more materials.
[0042] The thickness of the first electrode 222 is preferably 5 nm
to 100 .mu.m and more preferably 50 nm to 10 .mu.m.
[0043] The first electrode 222 is preferably provided on the
substrate 221 made of a material that is transparent to visible
light in order to maintain constant hardness. A publicly known
material in which the first electrode 222 and the substrate 221 are
integrated, may be used, and may be FTO coated glass, ITO coated
glass, zinc oxide-doped aluminum coated glass, an FTO coated
transparent plastic film, or an ITO coated transparent plastic
film, for example.
[0044] [Hole Blocking Layer]
[0045] The hole blocking layer 223 is provided to suppress power
reduction caused by recombination of holes in an electrolyte and
electrons on an electrode surface with the electrolyte contacting
the electrode surface (what is called back electron transfer). The
effect of the hole blocking layer 223 is particularly remarkable in
solid-state dye-sensitized solar cells. This is because solid-state
dye-sensitized solar cells using, for example, an organic hole
transport material, have a faster rate of recombination (i.e., back
electron transfer) of holes in the hole transport material and
electrons on the electrode surface compared with wet dye-sensitized
solar cells using electrolyte.
[0046] The hole blocking layer 223 preferably includes a metal
oxide including titanium and niobium atoms. If required, another
metal atom may be included, but a metal oxide consisting of
titanium and niobium atoms may be preferred. The hole blocking
layer 223 is preferably transparent to visible light, and the hole
blocking layer 223 is preferably dense in order to achieve a
function as a hole blocking layer.
[0047] The average thickness of the hole blocking layer 223 is
preferably 1,000 nm or less, and more preferably 0.5 nm to 500 nm.
When the average thickness is in the range of 0.5 nm to 500 nm, the
back electron transfer can be prevented without interfering with
transfer of electrons to the transparent conductive film (i.e., the
first electrode 222), thereby improving the efficiency of
photoelectric conversion. Also, when the average thickness is less
than 0.5 nm, film density is low and the back electron transfer
cannot be sufficiently prevented. When the average thickness
exceeds 500 nm, internal stress increases and cracks tend to
occur.
[0048] [Electron Transport Layer]
[0049] The electron transport layer 224 is formed on the hole
blocking layer 223, for example, as a porous layer. Preferably, the
electron transport layer 224 includes an electron transport
material, such as a semiconductor particle, and the
photosensitizing compound 225, which will be described below, is
adsorbed on the electron transport material.
[0050] For the electron transport material, there is no particular
limitation, and any material can be appropriately selected
according to a purpose. However, the semiconductor material, such
as a rod-shaped or a tube-shaped semiconductor material, is
preferred. In the following, the semiconductor particle may be
described as an example, but the electron transport material is not
limited to this.
[0051] The electron transport layer 224 may be a single layer or
includes multiple layers. When the electron transport layer 224
includes multiple layers, dispersion liquids of the semiconductor
particles with different particle sizes can be applied as multiple
layers, or different types of semiconductors or coating layers
having different compositions of resin and additive, can be applied
as multiple layers. When the film thickness is insufficient in a
single coating, coating in multiple layers is an effective
means.
[0052] For a semiconductor, there is no particular limitation, and
a publicly known semiconductor may be used. Specifically, a single
semiconductor, such as silicon and germanium, a compound
semiconductor, such as a metal chalcogenide, or a compound having a
perovskite structure, etc. may be used.
[0053] The particle diameter of the semiconductor particle is not
particularly limited and may be appropriately selected according to
a purpose, but the average particle diameter of the primary
particle is preferably from 1 nm to 100 nm, and more preferably
from 5 nm to 50 nm. Additionally, it is possible to improve
efficiency by scattering incident light with semiconductor
particles having the larger average particle diameter being mixed
or laminated. In this case, the average particle diameter of the
semiconductor particle is preferably 50 nm to 500 nm.
[0054] In general, the greater the thickness of the electron
transport layer 224 is, the greater the amount of carried
photosensitizing compounds per a projection area is, and the higher
the light capture rate is. But, the diffusion length of injected
electrons also becomes greater, and a loss of electrons caused by
recombination increases. Thus, the thickness of the electron
transport layer 224 is preferably from 100 nm to 100 .mu.m, more
preferably from 100 nm to 50 .mu.m, and even more preferably from
100 nm to 10 .mu.m.
[0055] [Photosensitizing Compounds]
[0056] In order to further improve conversion efficiency, the
electron transport layer 224 preferably includes an electron
transport material on which the photosensitizing compound 225 is
adsorbed. A specific example of the photosensitizing compound 225
is described in detail, for example, in Japanese Patent No.
6249093.
[0057] As a method of adsorbing the photosensitizing compound 225
to the electron transport layer 224 (i.e., the electron transport
material), a method of immersing an electron collecting electrode
including the electron transport layer 224 (i.e., an electrode in
which the substrate 221, the first electrode 222, and the hole
blocking layer 223 are formed) in solution or dispersion of the
photosensitizing compound 225, is used. Alternatively, a method of
applying solution or dispersion to the electron transport layer 224
to be adsorbed, may be used.
[0058] In the former case, an immersion method, a dipping method, a
roller method, an air knife method, or the like may be used. In the
latter case, a wire bar method, a slide hopper method, an extrusion
method, a curtain method, a spin method, a spray method, or the
like may be used.
[0059] Additionally, the photosensitizing compound 225 may be
adsorbed in supercritical fluid using, for example, carbon
dioxide.
[0060] A condensation agent may also be used in adsorbing the
photosensitizing compound 225. The condensation agent may cause
either a catalytic action that is considered to physically or
chemically combine the photosensitizing compound 225 and the
electron transport material on the inorganic surface, or a
stoichiometric action to favorably shift a chemical
equilibrium.
[0061] [Hole Transport Layer]
[0062] For the hole transport layer 226, an electrolyte in which a
redox pair is dissolved in an organic solvent, a gel electrolyte in
which a liquid in which a redox pair is dissolved in an organic
solvent is impregnated in a polymer matrix, a molten salt including
a redox pair, a solid electrolyte, an inorganic hole transport
material, an organic hole transport material, or the like may be
used. Among these, the organic hole transport material is
preferred. Here, in the following, the organic hole transport
material may be described as an example, but the hole transport
layer 226 is not limited this.
[0063] The hole transport layer 226 may be a single layer structure
of a single material or a laminate structure of multiple compounds.
When the hole transport layer 226 is a laminate structure, it is
preferable to use a polymer material for the hole transport layer
226 near the second electrode 227. The surface of the porous
electron transport layer 224 can be smoothed by using a polymer
material with good film forming performance, and thereby improving
a photoelectric conversion characteristic.
[0064] Since the polymer material is difficult to permeate into the
porous electron transport layer 224, the polymer material is
superior in coating the surface of the porous electron transport
layer 224, and the polymer material exhibits an effect in
preventing a short circuit when the electrode is provided. This can
obtain higher performance.
[0065] For a single organic hole transport material used in a
single layer structure, there is no particular limitation, and a
publicly known organic hole transport compound may be used.
[0066] The thickness of the hole transport layer 226 is not
particularly limited and may be selected according to a purpose.
But, preferably, the hole transport layer 226 is configured to
enter pores of the porous electron transport layer 224, and the
thickness of the hole transport layer 226 is 0.01 .mu.m or greater,
and more preferably 0.1 .mu.m to 10 .mu.m, on the electron
transport layer 224.
[0067] [Second Electrode]
[0068] The second electrode 227 can be formed on the hole transport
layer 226 or on a metal oxide in the hole transport layer 226. For
the second electrode 227, an electrode similar to the first
electrode 222 may be used, and a support is not necessarily
required in a configuration in which the strength and sealing
performance are maintained sufficiently.
[0069] Examples of the material of the second electrode 227 include
metals, such as platinum, gold, silver, copper, and aluminum,
carbon-based compounds, such as graphite, fullerene, carbon
nanotubes, and graphene, conductive metal oxides, such as ITO, FTO,
and ATO, and conductive polymers, such as polythiophene and
polyaniline.
[0070] The thickness of the second electrode 227 is not
particularly limited and may be appropriately selected according to
a purpose. Depending on the type of a used material and the type of
the hole transport layer 226, the second electrode 227 may be
appropriately formed by a method such as applying, laminating,
depositing, CVD, sticking, or the like, on the hole transport layer
226.
[0071] At least one of the first electrode 222 and the second
electrode 227 must be substantially transparent for the
photoelectric conversion of the power generator 22. In the example
of FIG. 4, since the first electrode 222 is transparent, sunlight,
for example, enters from the first electrode 222 side.
[0072] That is, in the photoelectric conversion module 1, the power
generator 22 is disposed between the substrate 21 and the substrate
23 such that the first electrode 222 is positioned at the substrate
23 side. In this case, it is preferable to use a material that
reflects light for the second electrode 227 side, and for example,
a metal, glass on which a conductive oxide is deposited, a plastic,
or a thin metal film, may be used. It is also an effective means to
provide an anti-reflection layer on an incident light side.
[0073] The photoelectric conversion element 20 having the power
generator 22 can obtain good conversion efficiency even in the case
of weak incident light such as indoor light.
[0074] Returning to the description of FIGS. 1 to 3, the sockets 31
and 32 that can be coupled to the positive terminal 24 and the
negative terminal 25 of the photoelectric conversion element 20
respectively, are mounted on the substrate 10. The photoelectric
conversion element 20 is mounted through the sockets 31 and 32 to
the substrate 10 in a removable state.
[0075] Specifically, the sockets 31 and 32 are mounted at a
predetermined interval on the upper surface 10a of the substrate
10, substantially parallel to the shorter side direction of the
substrate 10 in planar view. The socket 31 includes an insertion
hole 311 through which the positive terminal 24 of the
photoelectric conversion element 20 is inserted, and the socket 31,
for example, is inserted into a through hole provided in the
substrate 10. The socket 32 includes an insertion hole through
which the negative terminal 25 of the photoelectric conversion
element 20 is inserted, and the socket 32, for example, is inserted
into a through hole provided in the substrate 10.
[0076] The positive terminal 24 of the photoelectric conversion
element 20 is inserted into the insertion hole 311 of the socket
31, the negative terminal 25 of the photoelectric conversion
element 20 is inserted into the insertion hole of the socket 32,
and the photoelectric conversion element 20 is electrically and
mechanically coupled to the sockets 31 and 32.
[0077] FIG. 2B is an example of an enlarged view of a part near the
positive terminal 24 in FIG. 2A. As illustrated in FIG. 2B, a seal
member 81 is provided between the substrate 23 and the substrate 21
in FIG. 4, so that at least the electron transport layer 224 and
the hole transport layer 226 are sealed. At the positive terminal
24 side, a through hole opened in the hole blocking layer 223 is
filled with a conductive part 82. A resin 83 is applied to cover a
junction region in which the conductive part 82 and the positive
terminal 24 join.
[0078] FIG. 2C is another example 1 of an enlarged view of a part
near the positive terminal 24 in FIG. 2A. FIG. 2D is another
example 2 of an enlarged view of a part near the positive terminal
24 in FIG. 2A. FIG. 2E is another example 3 of an enlarged view of
a part near the positive terminal 24 in FIG. 2A.
[0079] As illustrated in FIGS. 2C to 2E, the seal member 81 is
provided to shield at least the electron transport layer 224 and
the hole transport layer 226 from an external environment. The seal
member 81 is not particularly limited as long as the seal member 81
inhibits inflow of water vapor of the outside air, and can be
appropriately selected according to a purpose. Examples of the seal
member 81 include low melting point frit glass, an ultraviolet
curing resin such as epoxy or acrylic, and a thermosetting resin.
These may be used either singly or in combination of two or more
materials. In addition to the constituent materials described
above, a desiccant may also be mixed to further inhibit inflow of
water vapor.
[0080] The conductive part 82 is provided to electrically couple
the positive terminal 24 to the first electrode 222, and
electrically couple the negative terminal 25 to the first electrode
222. Although it is not necessary to provide the conductive part
82, it is advantageous to provide the conductive part 82 because
electric resistance can be suppressed by increasing a contact area
between the positive terminal 24 (actually the conductive part 82)
and the first electrode 222 and a contact area between the negative
terminal 25 (actually the conductive part 82) and the first
electrode 222.
[0081] The through hole opened in the hole blocking layer 223 is
filled with the conductive part 82. The through hole may be
provided not only in the hole blocking layer 223 but also in the
first electrode 222. In this case, a through hole opened in the
first electrode 222 and the hole blocking layer 223 is filled with
the conductive part 82.
[0082] The conductive part 82 may be a conductive material that can
fill the through hole. Examples of a material of the conductive
part 82 include a paste made mainly of a metal, such as copper or
silver, or a paste made mainly of carbon, but the material is not
limited to this. In particular, a carbon paste is advantageous
because a carbon paste has a strong resistance to moisture and
oxidation.
[0083] The resin 83 is provided to fix the conductive part 82 to
the positive terminal 24, and fix the conductive part 82 to the
negative terminal 25. A material of the resin 83 is not
particularly limited as long as a material is for fixing, and can
be appropriately selected according to a purpose. Examples of the
material include low melting point frit glass, an ultraviolet
curing resin, such as epoxy or acrylic, and a thermosetting resin.
These may be used either singly or in combination of two or more
materials. The resin 83 is provided to cover at least the
conductive part 82, the positive terminal 24, and the negative
terminal 25.
[0084] When the positive terminal 24 is soldered, the temperature
is increased by the soldering temperature being transmitted to the
junction region in which the conductive part 82 and the positive
terminal 24 join. The length of the positive terminal 24 is
adjusted so that the temperature is equal to or lower than the
temperature at which the resin 83 does not melt (for example, when
a material of the resin 83 is an epoxy-based resin, the temperature
is equal to or lower than 200 degrees, and more preferably, the
temperature is equal to or lower than 100 degrees).
[0085] For example, when the length of the positive terminal 24 is
equal to or longer than 8 mm, the junction region is maintained at
a temperature equal to or lower than 100 degrees, so that the resin
83 does not melt, and the junction between the positive terminal 24
and the conductive part 82 is stable. When the length of the
positive terminal 24 is shortened and the positive terminal 24 is
soldered, the temperature of the resin 83 is required to be
adjusted so as to be equal to or lower than the temperature at
which the resin 83 does not melt. The means is not particularly
limited, but may include, for example, using a terminal having a
low thermal conductivity for the positive terminal 24, providing a
heat radiating unit on an outer peripheral portion of the positive
terminal 24, and using a low melting point solder material. These
may be used either singly or in combination of two or more
means.
[0086] The substrate 21 is fixed to the upper surface 10a of the
substrate 10 through an adhesive layer 60 on a side opposite to the
side at which the positive terminal 24 and the negative terminal 25
of the photoelectric conversion element 20 are provided. Examples
of the adhesive layer 60 include a resin-based adhesive and
double-sided tape. It is preferable to set the adhesion of the
adhesive layer 60 in consideration of the maintenance, such as
replacement of the photoelectric conversion element 20.
[0087] As described above, by mounting the photoelectric conversion
element 20 to the substrate 10 in a removable state, the
photoelectric conversion element 20 can be easily replaced when a
failure of the photoelectric conversion element 20, such as
deterioration or damage, occurs.
[0088] However, the above description is an example of a method of
mounting the photoelectric conversion element 20. If necessary, the
positive terminal 24 and the negative terminal 25 of the
photoelectric conversion element 20 may be coupled to the land of
the substrate 10 by soldering or the like without using the sockets
31 and 32. Alternatively, one socket with two insertion holes may
be used instead of the sockets 31 and 32.
[0089] The substrate 21 may be substituted for the substrate 10. In
this case, the sockets 31 and 32 are not required. When the
substrate 21 is glass, a semiconductor integrated circuit 72 and a
power storage element 71, which will be described later, can be
mounted by forming a wiring pattern on a glass surface opposite to
the power generator 22, for example. Further, glass processing of
the substrate 21 can form a female connector and a male connector.
This can eliminate the installation of the sockets 31 and 32, and
can achieve downsizing of the photoelectric conversion module
1.
[0090] The male connectors 41 and 42 are mounted at a predetermined
interval on a lower surface 10b of the substrate 10 at a side
surface 10c side in a direction approximately parallel to the
longitudinal direction of the substrate 10 in planar view. The male
connectors 41 and 42 include, for example, a male terminal
electrically coupled to the photoelectric conversion element 20
through a wiring pattern and a male housing holding the male
terminal, and are mounted on the lower surface 10b of the substrate
10 with sides, which are to be inserted into the female connectors,
facing the outside of the substrate 10 (i.e., the left side in FIG.
1).
[0091] The male connectors 41 and 42 are electrically and
mechanically coupled to the land provided on the lower surface 10b
of the substrate 10, for example, by solder. In planar view,
portions of the male connectors 41 and 42 protrude outward from the
side surface 10c of the substrate 10, and the protruding portions
can be inserted into the female connectors 51 and 52 of another
photoelectric conversion module 1.
[0092] The female connectors 51 and 52 are mounted at a
predetermined interval on the lower surface 10b of the substrate 10
at a side surface 10d side in a direction approximately parallel to
the longitudinal direction of the substrate 10 in planar view. The
female connectors 51 and 52 include, for example, a female terminal
electrically coupled to the photoelectric conversion element 20
through a wiring pattern and a female housing holding the female
terminal, and are mounted on the lower surface 10b of the substrate
10 with sides, into which the male connectors are inserted, facing
the outside of the substrate 10 (i.e. the right side in FIG.
1).
[0093] The female connectors 51 and 52 are electrically and
mechanically coupled to the land provided on the lower surface 10b
of the substrate 10, for example, by solder. In planar view, the
female connectors 51 and 52 do not protrude outward from the side
surface 10d of the substrate 10, but may protrude outward from the
side surface 10d so as not to interfere with connections with the
male connectors 41 and 42 of another photoelectric conversion
module 1. Alternatively, the female connectors 51 and 52 may enter
inside the substrate 10 from the side surface 10d so as not to
interfere with connections with the male connectors 41 and 42 of
another photoelectric conversion module 1.
[0094] Thus, the male connector 41 is shaped to be insertable into
the female connector 51, and when the male connector 41 is inserted
into the female connector 51, the male terminal of the male
connector 41 contacts the female terminal of the female connector
51, and both are electrically coupled.
[0095] Similarly, the male connector 42 is shaped to be insertable
into a female connector 52, and when the male connector 42 is
inserted into the female connector 52, the male terminal of the
male connector 42 contacts the female terminal of the female
connector 52, and both are electrically coupled.
[0096] The pitch of the male connector 41 and the male connector 42
is equal to the pitch of the female connector 51 and the female
connector 52.
[0097] However, as long as the male connector 41 can be inserted
into the female connector 51 and the male connector 42 can be
inserted into the female connector 52, the shapes, sizes, and the
like of the male connectors 41 and 42 may or may not be the same,
and the shapes, sizes, and the like of the female connectors 51 and
52 may or may not be the same.
[0098] The male connectors 41 and 42 and the female connectors 51
and 52 are related as described above. Thus, the male connectors 41
and 42 of the photoelectric conversion module 1 can be electrically
and mechanically coupled with the female connectors 51 and 52 of
another photoelectric conversion module 1 disposed at one side of
the photoelectric conversion module 1. The female connectors 51 and
52 of the photoelectric conversion module 1 can be electrically and
mechanically coupled with the male connectors 41 and 42 of another
photoelectric conversion module 1 disposed on the other side of the
photoelectric conversion module 1. An example is illustrated in
FIG. 5.
[0099] FIG. 5 is a first plan view illustrating an example of
connections of multiple photoelectric conversion modules. As
illustrated in FIG. 5, the photoelectric conversion module array 5
includes three photoelectric conversion modules 1 that are coupled
with each other through the male connectors 41 and 42 and the
female connectors 51 and 52. That is, the photoelectric conversion
module array 5 includes three photoelectric conversion elements 20
in total. In FIG. 5, for convenience, three photoelectric
conversion modules 1 are referred to as photoelectric conversion
modules 1-1, 1-2, and 1-3.
[0100] In the photoelectric conversion module array 5, a male
connector 41 of the photoelectric conversion module 1-2 is inserted
into a female connector 51 of the photoelectric conversion module
1-1. A male terminal of the male connector 41 contacts a female
terminal of the female connector 51, and both are electrically
coupled. A male connector 42 of the photoelectric conversion module
1-2 is inserted into the female connector 52 of the photoelectric
conversion module 1-1. A male terminal of the male connector 42
contacts a female terminal of the female connector 52, and both are
electrically coupled.
[0101] Similarly, a male connector 41 of the photoelectric
conversion module 1-3 is inserted into a female connector 51 of the
photoelectric conversion module 1-2. A male terminal of the male
connector 41 contacts a female terminal of the female connector 51,
and both are electrically coupled. A male connector 42 of the
photoelectric conversion module 1-3 is inserted into a female
connector 52 of the photoelectric conversion module 1-2, and a male
terminal of the male connector 42 contacts a female terminal of the
female connector 52, and both are electrically coupled.
[0102] When multiple photoelectric conversion modules 1 are coupled
with each other as in the photoelectric conversion module array 5,
the photoelectric conversion elements 20 mounted on the
photoelectric conversion modules are electrically coupled. The
photoelectric conversion module array 5 can increase a light
receiving area of the photoelectric conversion elements 20.
[0103] FIG. 6 is a first schematic diagram illustrating an example
of interconnects on the substrate of the photoelectric conversion
module according to the first embodiment.
[0104] In the example of FIG. 6, in each of the photoelectric
conversion modules 1-1, 1-2, and 1-3, the socket 31, the male
connector 41, and the female connector 51 are electrically coupled,
as illustrated by a solid line. The socket 32, the male connector
42, and the female connector 52 are electrically coupled, as
illustrated by a dashed line.
[0105] Thus, in the photoelectric conversion elements 20 mounted in
the photoelectric conversion modules 1-1, 1-2, and 1-3, the
positive terminals 24 are electrically coupled, and the negative
terminals 25 are electrically coupled. That is, in the example of
FIG. 6, the photoelectric conversion elements 20 of the
photoelectric conversion modules 1-1, 1-2, and 1-3 are coupled in
parallel. In FIG. 6, for convenience, the photoelectric conversion
element 20 is represented by a circuit symbol of a diode, but this
does not accurately represent a circuit equivalent to the
photoelectric conversion element 20 (the same applies to the
subsequent figures).
[0106] FIG. 7 is a second schematic diagram illustrating an example
of interconnects on the substrate of the photoelectric conversion
module according to the first embodiment.
[0107] In the example of FIG. 7, in each of the photoelectric
conversion modules 1-1, 1-2, and 1-3, the socket 31 and the female
connector 51 are electrically coupled, and the socket 32 and the
male connector 41 are electrically coupled, as illustrated by a
solid line. The male connector 42 and the female connector 52 are
electrically coupled, as illustrated by a dashed line.
[0108] Therefore, the negative terminal 25 of the photoelectric
conversion element 20 mounted in the photoelectric conversion
module 1-3 and the positive terminal 24 of the photoelectric
conversion element 20 mounted in the photoelectric conversion
module 1-2 are electrically coupled. The negative terminal 25 of
the photoelectric conversion element 20 mounted in the
photoelectric conversion module 1-2 and the positive terminal 24 of
the photoelectric conversion element 20 mounted in the
photoelectric conversion module 1-1 are electrically coupled. That
is, in the example of FIG. 7, the photoelectric conversion elements
20 of the photoelectric conversion modules 1-1, 1-2, and 1-3 are
coupled in series.
[0109] As described, the photoelectric conversion module 1 can be
mutually coupled with another photoelectric conversion module 1
through a connector, and when the photoelectric conversion modules
1 are coupled with each other, the photoelectric conversion
elements 20 mounted in the photoelectric conversion modules 1 are
electrically coupled.
[0110] That is, it is not necessary to couple the photoelectric
conversion modules with a lead wire or the like as in the related
art, and the photoelectric conversion modules 1 can be coupled with
each other through a connector with the shortest distance.
Therefore, it is possible to reduce the wiring resistance between
the photoelectric conversion elements 20, and to suppress the
voltage drop of the output of the photoelectric conversion elements
20.
[0111] In the conventional method of connecting the photoelectric
conversion modules with a lead wire or the like, it is difficult to
accommodate the increase or decrease in the number of the
photoelectric conversion modules to be coupled. With respect to the
above, since the photoelectric conversion module 1 can be mutually
coupled with another photoelectric conversion module 1 through a
connector, it is easy to accommodate an increase or decrease in the
number of photoelectric conversion modules 1, which is caused by a
specification change of the solar power generation system, for
example.
Second Embodiment
[0112] In a second embodiment, an example of a photoelectric
conversion module including a power storage function will be
described. In the second embodiment, a description of the same
component as the component of the embodiment previously described
may be omitted.
[0113] FIG. 8 is a plan view illustrating an example of the
photoelectric conversion module according to the second embodiment.
FIG. 9 is a schematic diagram illustrating an example of
interconnects on a substrate of the photoelectric conversion module
according to the second embodiment.
[0114] With reference to FIGS. 8 and 9, the photoelectric
conversion module 1A is different from the photoelectric conversion
module 1 (see FIG. 1 and other figures) in that the semiconductor
integrated circuit 72, the power storage element 71, and a male
connector 73 are further mounted on the substrate 10. The
semiconductor integrated circuit 72, the power storage element 71,
and the male connector 73 are, for example, mounted on the lower
surface 10b of the substrate 10.
[0115] The semiconductor integrated circuit 72 is, for example, a
power management IC for energy harvesting to which power to the
photoelectric conversion element 20 is supplied. The power storage
element 71 is, for example, an electric double layer capacitor and
stores power generated by the photoelectric conversion element 20.
Specifically, the output of the semiconductor integrated circuit 72
is coupled to the power storage element 71 and the power storage
element 71 is charged.
[0116] The output of the semiconductor integrated circuit 72 (i.e.,
the output of the power storage element 71) is output to the
outside from the male connector 73. The male connector 73 may be
grouped into one connector common to the male connector 41 and/or
the male connector 42, and the output of the semiconductor
integrated circuit 72 may be assigned to any pin of the
connector.
[0117] The photoelectric conversion module 1A can charge a battery.
FIG. 10 is a cross-sectional view illustrating an example of a
connection between the battery and the photoelectric conversion
module according to the second embodiment. With reference to FIG.
10, the photoelectric conversion module 1A is disposed on a
substrate 110 including a battery 100. The male connector 73 of the
photoelectric conversion module 1A is electrically coupled to a
power connector 120 of the battery 100 to enable the battery 100 to
be charged.
[0118] FIG. 11 is a second plan view illustrating an example of
connections of multiple photoelectric conversion modules. As
illustrated in FIG. 11, in a photoelectric conversion module array
6, two photoelectric conversion modules 2 each including five
photoelectric conversion elements 20 mounted on one substrate 10
and one photoelectric conversion module 3 including three
photoelectric conversion elements 20 mounted on one substrate 10
are coupled with each other through connectors. That is, the
photoelectric conversion module array 6 includes 13 photoelectric
conversion elements 20 in total. The photoelectric conversion
module 3 is disposed at an end of the photoelectric conversion
module array 6.
[0119] As illustrated in FIG. 11, when multiple photoelectric
conversion elements 20 are mounted on one substrate 10, the
connection between the photoelectric conversion elements 20 on the
substrate 10 can be determined as desired. That is, in the
photoelectric conversion modules 2 and 3, the photoelectric
conversion elements 20 may be coupled in parallel, in series, or in
another complicated connection.
[0120] It should be noted that the connection of FIG. 11 is an
example, and, as long as the photoelectric conversion module array
6 includes the photoelectric conversion module 2 including n
photoelectric conversion elements 20 (where n is a natural number
equal to or greater than 2) mounted on one substrate 10, and the
photoelectric conversion module 3 including m photoelectric
conversion elements 20 (where m is a natural number smaller than n)
mounted on one substrate 10, n and m may be arbitrary. In the
photoelectric conversion module array 6, the number of the
photoelectric conversion modules 2 and the number of the
photoelectric conversion modules 3 can be determined as
desired.
[0121] As in the photoelectric conversion module array 6, when
multiple photoelectric conversion modules are coupled with each
other, the photoelectric conversion elements 20 separately mounted
are electrically coupled. In the photoelectric conversion module
array 6, the light receiving area of the photoelectric conversion
element 20 can be increased.
[0122] As described below, it is preferable that in the
photoelectric conversion module array 6, the power storage element
71 for storing power generated by the photoelectric conversion
elements 20 of the photoelectric conversion modules 2 and 3, is
mounted on the substrate 10 of the photoelectric conversion module
3, and a power storage function similar to the power storage
function of the photoelectric conversion module 1A is provided.
[0123] That is, since a location where the photoelectric conversion
module array 6 is disposed has a predetermined length, the
longitudinal length of the photoelectric conversion module array 6
needs to be adjusted to the predetermined length of the location
where the photoelectric conversion module array 6 is disposed. The
power storage function is concentrated on the photoelectric
conversion module 3, so that the photoelectric conversion modules 2
can be made common. Therefore, by adjusting the number of the
photoelectric conversion modules 2, the longitudinal length of the
photoelectric conversion module array 6 can be easily adjusted to
the predetermined length. This can achieve a flexible response to a
customer specification.
[0124] Additionally, the photoelectric conversion module 3
including the power storage element 71 is disposed at the end of
the photoelectric conversion module array 6, so that it is easy to
be coupled to the outside when voltage stored by the power storage
element 71 is output to the outside. Furthermore, it is preferable
that the photoelectric conversion module 3 including the power
storage element 71 is disposed at the end of the photoelectric
conversion module array 6, in that the voltage drop can be reduced
when the power storage element 71 outputs the stored voltage to the
outside.
[0125] However, depending on the predetermined length of the
location where the photoelectric conversion module array 6 is
disposed, the number of the photoelectric conversion elements 20
mounted in the photoelectric conversion module 3 may be the same as
the number of the photoelectric conversion elements 20 mounted in
the photoelectric conversion module 2, and the photoelectric
conversion module 3 may include a power storage function.
Alternatively, a configuration in which the power storage element
71 that stores power generated by the photoelectric conversion
elements 20 of the photoelectric conversion module 2 and the
photoelectric conversion module 3, is mounted on the substrate 10
of the photoelectric conversion module 2, and is disposed at the
end of the photoelectric conversion module array 6, may be
used.
Third Embodiment
[0126] In a third embodiment, an example of a photoelectric
conversion module including an information storage function will be
described. In the third embodiment, a description of the same
component as the component of the embodiment previously described
may be omitted.
[0127] FIG. 12 is a plan view illustrating an example of the
photoelectric conversion module according to the third embodiment.
FIG. 13 is a schematic diagram illustrating an example of
interconnects on a substrate of the photoelectric conversion module
according to the third embodiment.
[0128] With reference to FIGS. 12 and 13, a photoelectric
conversion module 1B is different from the photoelectric conversion
module 1A (see FIG. 8 and other figures) in that a semiconductor
integrated circuit 74 and a female connector 75 are added. The
semiconductor integrated circuit 74 and the female connector 75
are, for example, mounted on the lower surface 10b of the substrate
10.
[0129] The semiconductor integrated circuit 74 is, for example, a
serial electrically erasable programmable read only memory (a
serial EEPROM) that stores predetermined information. The input and
output of the semiconductor integrated circuit 74 can be coupled to
a side of a circuit of the photoelectric conversion module 1B that
is operated by the power supply (i.e., a circuit including a
microcomputer) through the female connector 75. The female
connector 75 may be grouped into a connector common to the female
connector 51 and/or the female connector 52, and the input and
output of the semiconductor integrated circuit 74 may be assigned
to any pin of the connector.
[0130] The semiconductor integrated circuit 74 can be coupled to,
for example, a microcomputer outside of the substrate 10 of the
photoelectric conversion module 1B by I.sup.2C through the female
connector 75. The information stored in the semiconductor
integrated circuit 74 can be read from, for example, the
microcomputer outside of the substrate 10. The semiconductor
integrated circuit 74 can also be written from, for example, the
microcomputer outside of the substrate 10.
[0131] The photoelectric conversion module 1B can be mounted in the
photoelectric conversion module array 6 illustrated in FIG. 11 with
coupling multiple photoelectric conversion modules 1B instead of
the photoelectric conversion module 3. However, instead of coupling
multiple photoelectric conversion modules 1B, components
corresponding to multiple photoelectric conversion modules 1B may
be mounted on one substrate.
[0132] The semiconductor integrated circuit 74 can store substrate
information including, for example, information indicating a type
of a component mounted on the substrate 10 of the photoelectric
conversion module array 6. The information indicating the type of
the component is, for example, whether the power storage element is
mounted. Additionally, the semiconductor integrated circuit 74 may
store connection information including information indicating the
number of photoelectric conversion elements 20 mounted on the
substrate 10. The semiconductor integrated circuit 74 may store any
information including a lot number, a serial number, for
example.
[0133] The substrate information and/or the connection information
of the photoelectric conversion module array 6 is written to the
semiconductor integrated circuit 74 from a microcomputer or the
like in a manufacturing line of the photoelectric conversion module
array 6, for example. The substrate information and/or the
connection information written to the semiconductor integrated
circuit 74 may be electrically rewritten as required.
[0134] FIG. 14 is a schematic diagram illustrating an example of
interconnects on the substrate of the photoelectric conversion
module according to a modified example of the third embodiment.
[0135] With reference to FIG. 14, a photoelectric conversion module
1C is different from the photoelectric conversion module 1B (see
FIG. 13 and other figures) in that resistors R1 and R2, and
switches SW1 and SW2 are added instead of the semiconductor
integrated circuit 74. The switches SW1 and SW2 are, for example,
DIP switches.
[0136] One terminal of the switch SW1 is coupled to the positive
terminal 24 of the photoelectric conversion element 20 through the
resistor R1, and is coupled to a predetermined terminal of the
female connector 75. The other terminal of the switch SW1 is
coupled to the negative terminal 25 of the photoelectric conversion
element 20.
[0137] One terminal of the switch SW2 is coupled to the positive
terminal 24 of the photoelectric conversion element 20 through the
resistor R2, and is coupled to a predetermined terminal of the
female connector 75. The other terminal of the switch SW2 is
coupled to the negative terminal 25 of the photoelectric conversion
element 20.
[0138] For example, when the switches SW1 and SW2 are both off, H
and H are output from the female connector 75. When the switches
SW1 and SW2 are both on, L and L are output from the female
connector 75. By changing ON and OFF settings of the switches SW1
and SW2, four pieces of information can be output. By increasing
the number of switches, more information can be output.
[0139] That is, in the photoelectric conversion module 1C, the
substrate information and/or the connection information of the
photoelectric conversion module array 6 can be stored by a
combination of ON and OFF of the switches SW1 and SW2. A method of
enabling the switch to change the setting of the substrate
information and/or the connection information is preferred in that
it is easy to change the setting compared with a method of storing
the information in the semiconductor integrated circuit 74.
[0140] As described with reference to FIGS. 12 to 14, the substrate
information and/or the connection information can be read from the
circuit operated by the power supply of the photoelectric
conversion module. This enables the circuit operated by the power
supply of the photoelectric conversion module to determine what
type of photoelectric conversion module is coupled.
[0141] For example, the substrate information and/or the connection
information are read by a microcomputer or the like operated by the
power supply of the photoelectric conversion module before an
operation inspection process of the manufacturing line of the
photoelectric conversion module, so that it is possible to
determine whether the photoelectric conversion module is a module
to be inspected. In this case, when it is determined that the
photoelectric conversion module is a module to be inspected, the
photoelectric conversion module is input in the operation
inspection process. When it is determined that the photoelectric
conversion module is not a module to be inspected, the
photoelectric conversion module is rejected as a defective
product.
[0142] Although the preferred embodiments have been described in
detail above, the invention is not limited to the above-described
embodiments. Various modifications and substitutions can be applied
to the embodiments described above without departing from the scope
of the invention as recited in the claims.
* * * * *