U.S. patent application number 16/996624 was filed with the patent office on 2020-12-03 for radiation imaging apparatus and radiation imaging system.
The applicant listed for this patent is CANON KABUSHIKI KAISHA. Invention is credited to Tomohiro Hoshina, Takamasa Ishii, Kota Nishibe.
Application Number | 20200379130 16/996624 |
Document ID | / |
Family ID | 1000005047580 |
Filed Date | 2020-12-03 |
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United States Patent
Application |
20200379130 |
Kind Code |
A1 |
Hoshina; Tomohiro ; et
al. |
December 3, 2020 |
RADIATION IMAGING APPARATUS AND RADIATION IMAGING SYSTEM
Abstract
A scintillator panel including a scintillator layer that
converts incident radiation into light and a scintillator base that
supports the scintillator layer, a sensor panel including a sensor
substrate that is disposed on a side of the scintillator layer that
is opposite to the scintillator base and has a photoelectric
conversion portion that converts the light into an electric signal,
and a sensor base that is disposed on the side of the sensor
substrate that is opposite to the scintillator layer and supports
the sensor substrate, and a sealing member that seals a gap between
the scintillator panel and the sensor panel at an edge of the
scintillator panel are comprised. The sensor panel is provided with
a convex member for narrowing the gap at a position in a vertical
direction to a surface of the sensor panel from the edge of the
scintillator panel.
Inventors: |
Hoshina; Tomohiro;
(Kawasaki-shi, JP) ; Ishii; Takamasa; (Honjo-shi,
JP) ; Nishibe; Kota; (Kawasaki-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CANON KABUSHIKI KAISHA |
Tokyo |
|
JP |
|
|
Family ID: |
1000005047580 |
Appl. No.: |
16/996624 |
Filed: |
August 18, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
PCT/JP2019/006454 |
Feb 21, 2019 |
|
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16996624 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01T 1/2006 20130101;
G01T 1/2002 20130101 |
International
Class: |
G01T 1/20 20060101
G01T001/20 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 1, 2018 |
JP |
2018-036569 |
Claims
1. A radiation imaging apparatus comprising: a scintillator panel
including a scintillator layer that converts incident radiation
into light and a first base that supports the scintillator layer; a
sensor panel including a sensor substrate that is disposed on a
side of the scintillator layer that is opposite to the first base
and has a photoelectric conversion portion that converts the light
into an electric signal, and a second base that is disposed on the
side of the sensor substrate that is opposite to the scintillator
layer and supports the sensor substrate; and a sealing member that
seals a gap between the scintillator panel and the sensor panel at
an edge of the scintillator panel, wherein the sensor panel is
provided with a convex member for narrowing the gap at a position
in a vertical direction to a surface of the sensor panel from the
edge of the scintillator panel.
2. The radiation imaging apparatus according to claim 1, wherein
the convex member is provided to be adhered to the second base.
3. The radiation imaging apparatus according to claim 1, wherein
the convex member is provided integrally with the second base.
4. The radiation imaging apparatus according to claim 1, wherein a
surface of the convex member on a side of the scintillator panel is
closer to a surface of the first base that supports the
scintillator layer than to a surface of the sensor panel where the
convex member is not provided.
5. The radiation imaging apparatus according to claim 1, wherein a
wire is provided between the convex member and the scintillator
panel, the wire being connected to the sensor substrate.
6. The radiation imaging apparatus according to claim 5, wherein
the wire is sealed by the sealing member so as to pass through the
sealing member.
7. The radiation imaging apparatus according to claim 5, further
comprising: a first bonding layer that bonds the scintillator panel
and the sensor panel together at a position different from the edge
of the scintillator panel, wherein the scintillator panel is
configured to further include a scintillator-protection layer for
protecting the scintillator layer, the sensor panel is configured
to further include a second bonding layer that bonds the second
base and the sensor substrate, and
t.sub.b+t.sub.c+t.sub.d.ltoreq.D<t.sub.a+t.sub.b where D is the
gap, t.sub.a is a thickness of the scintillator layer and the
scintillator-protection layer, t.sub.b is a thickness of the first
bonding layer, t.sub.c is a thickness of the second bonding layer,
and t.sub.d is a thickness of the wire.
8. The radiation imaging apparatus according to claim 1, wherein
the convex member is a shape of a trapezoid whose width is shorter
on a side of the scintillator panel.
9. The radiation imaging apparatus according to claim 1, wherein
the convex member is disposed to surround a periphery of the second
base.
10. The radiation imaging apparatus according to claim 1, wherein
the first base is made of a carbon material or glass.
11. A radiation imaging system, comprising: the radiation imaging
apparatus according to claim 1; and a radiation generating
apparatus for generating the radiation.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a Continuation of International Patent
Application No. PCT/JP2019/006454, filed Feb. 21, 2019, which
claims the benefit of Japanese Patent Application No. 2018-036569,
filed Mar. 1, 2018, both of which are hereby incorporated by
reference herein in their entirety.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The present invention relates to a radiation imaging
apparatus and a radiation imaging system that perform imaging by
using radiation.
Background Art
[0003] A radiation imaging apparatus developed in recent years
includes a sensor panel equipped with multiple photoelectric
conversion portions and a scintillator panel, which converts
incident radiation such as X-ray into light having a wavelength
detectable by the photoelectric conversion portions, stacked
(disposed) on the sensor panel.
[0004] For example, Japanese Patent Laid-Open No. 2000-009845
discloses a sealing technique for such a radiation imaging
apparatus, in which when a scintillator panel and a sensor panel is
adhered together, the periphery of these panels is sealed with a
resin (sealing member).
[0005] For example, in the case in which highly hygroscopic cesium
iodide (CsI) is used as a scintillator for the scintillator panel,
the sealing member for the radiation imaging apparatus requires a
high level of moisture-proofing or moisture-resisting performance.
In addition, the larger the area of the sealing member in contact
with the outside air, the worse the moisture-proofing or
moisture-resisting performance may be.
[0006] Japanese Patent Laid-Open No. 2000-009845 does not take into
account the moisture-proofing or moisture-resisting performance of
the sealing member and is insufficient in the moisture-proofing or
moisture-resisting performance of the radiation imaging
apparatus.
[0007] The present invention is made with such circumstances, and
an aspect of the present invention provides a mechanism for
improving the moisture-proofing or moisture-resisting performance
of the radiation imaging apparatus.
SUMMARY OF THE INVENTION
[0008] A radiation imaging apparatus according to the present
invention comprises: a scintillator panel including a scintillator
layer that converts incident radiation into light and a first base
that supports the scintillator layer; a sensor panel including a
sensor substrate that is disposed on a side of the scintillator
layer that is opposite to the first base and has a photoelectric
conversion portion that converts the light into an electric signal,
and a second base that is disposed on the side of the sensor
substrate that is opposite to the scintillator layer and supports
the sensor substrate; and a sealing member that seals a gap between
the scintillator panel and the sensor panel at an edge of the
scintillator panel, wherein the sensor panel is provided with a
convex member for narrowing the gap at a position in a vertical
direction to a surface of the sensor panel from the edge of the
scintillator panel.
[0009] The present invention also covers a radiation imaging system
that includes the above radiation imaging apparatus.
[0010] Further features of the present invention will become
apparent from the following description of exemplary embodiments
with reference to the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1A is a view schematically illustrating a first
configuration example of a radiation imaging apparatus according to
an embodiment of the present invention.
[0012] FIG. 1B is a view schematically illustrating the first
configuration example of the radiation imaging apparatus according
to the embodiment of the present invention.
[0013] FIG. 2A is a plan view schematically illustrating an example
of a positional relationship between a sensor base and a convex
member of FIGS. 1A and 1B according to the embodiment of the
present invention.
[0014] FIG. 2B is a plan view schematically illustrating another
example of the positional relationship between the sensor base and
the convex member of FIGS. 1A and 1B according to the embodiment of
the present invention.
[0015] FIG. 2C is a plan view schematically illustrating another
example of the positional relationship between the sensor base and
the convex member of FIGS. 1A and 1B according to the embodiment of
the present invention.
[0016] FIG. 2D is a plan view schematically illustrating another
example of the positional relationship between the sensor base and
the convex member of FIGS. 1A and 1B according to the embodiment of
the present invention.
[0017] FIG. 2E is a plan view schematically illustrating another
example of the positional relationship between the sensor base and
the convex member of FIGS. 1A and 1B according to the embodiment of
the present invention.
[0018] FIG. 2F is a plan view schematically illustrating another
example of the positional relationship between the sensor base and
the convex member of FIGS. 1A and 1B according to the embodiment of
the present invention.
[0019] FIG. 3 is a view schematically illustrating a second
configuration example of a radiation imaging apparatus according to
the embodiment of the present invention.
[0020] FIG. 4 is a view schematically illustrating a third
configuration example of a radiation imaging apparatus according to
the embodiment of the present invention.
[0021] FIG. 5 is a view schematically illustrating a fourth
configuration example of a radiation imaging apparatus according to
the embodiment of the present invention.
[0022] FIG. 6 is a view schematically illustrating a fifth
configuration example of a radiation imaging apparatus according to
the embodiment of the present invention.
[0023] FIG. 7 is a view schematically illustrating a configuration
example of a radiation imaging system that includes the radiation
imaging apparatus according to the embodiment of the present
invention.
DESCRIPTION OF THE EMBODIMENTS
[0024] Aspects (embodiments) of the present invention will be
described with reference to the drawings.
[0025] FIGS. 1A and 1B is a view schematically illustrating a first
configuration example of a radiation imaging apparatus 100
according to an embodiment of the present invention. A radiation
imaging apparatus applicable to a medical diagnostic imaging
apparatus, an analyzer, or the like, is preferred as the radiation
imaging apparatus 100, but the present invention is not limited to
these apparatuses. Although a type of radiation to be used for
imaging of the radiation imaging apparatus 100 is preferably X-rays
for example, the present invention is not limited to these X-rays
and other types of radiation, such as alpha rays, beta rays, and
gamma rays, are also applicable.
[0026] Specifically, FIG. 1A is a plan view schematically
illustrating the radiation imaging apparatus 100. Also, FIG. 1B is
a cross section of the radiation imaging apparatus 100 taken along
line A-A in FIG. 1A. In FIGS. 1A and 1B, like elements are denoted
by like reference signs.
[0027] As illustrated in FIG. 1B, the radiation imaging apparatus
100 according to the present embodiment is configured to include a
scintillator panel (fluorescent plate) 110, a sensor panel (a
photosensor or a photoelectric conversion panel) 120, a bonding
layer 130, and a sealing member 140.
[0028] The scintillator panel 110 is configured to include a
scintillator base 111, a base-protection layer 112, a scintillator
layer 113, and a scintillator-protection layer 114.
[0029] The scintillator base 111 is a base (first base) for
supporting the scintillator layer 113. This scintillator base 111
is made of a material having a high radiation (X-ray)
transmittance. For example, the scintillator base 111 is preferably
made of a carbon material (a-C, CFRP) or glass. Also, a reflective
layer for facilitating effective use of light converted from
radiation in the scintillator layer 113 may be disposed on the
scintillator base 111. For example, such a reflective layer may be
made of a material, such as silver (Ag) or aluminum (Al), having a
high reflectance.
[0030] The base-protection layer 112, which is a layer for
protecting the scintillator base 111, is disposed between the
scintillator base 111 and the scintillator layer 113.
[0031] The scintillator layer 113 converts incident radiation into
light. Here, the light converted in the scintillator layer 113 may
include visible rays and infrared rays. Also, in an example
illustrated in FIG. 1B, the scintillator layer 113 is formed with
an area smaller than the area of the scintillator base 111. Also,
for example, the scintillator layer 113 is made of a columnar
crystal scintillator typified by CsI:Tl or cesium iodide slightly
doped with thallium (Tl), or made of a granular scintillator
typified by GOS:Tb or gadolinium oxysulfide slightly doped with
terbium (Tb). In the present embodiment, for example, the
scintillator layer 113 is made of the columnar crystal scintillator
containing cesium iodide as a main ingredient.
[0032] The scintillator-protection layer 114, which is a protection
layer for protecting the scintillator layer 113, is disposed
between the scintillator layer 113 and the bonding layer 130. For
example, the scintillator-protection layer 114 has a function of
protecting the scintillator layer 113 from deterioration caused by
moisture (moisture-proofing or moisture-resisting function).
Especially in the case of the scintillator layer 113 being made of
a columnar crystal scintillator, such as CsI:Tl, the
scintillator-protection layer 114 is necessary because
characteristics of the scintillator layer 113 deteriorate due to
moisture degradation. For example, a typical organic material, such
as a silicone resin, an acrylic resin, or an epoxy resin, or may be
a hot-melt resin, such as a polyester resin, a polyolefin resin, or
a polyamide resin may be used as a material of the
scintillator-protection layer 114. For example, the
scintillator-protection layer 114 may be made of a resin having a
low moisture permeability, such as an organic layer of
poly-para-xylylene formed by chemical vapor deposition, or a
hot-melt resin typified by a polyolefin resin. More specifically,
this scintillator-protection layer 114 has a protective function
against moisture so as to prevent moisture from entering the
scintillator layer 113 from outside and also has a protective
function against shock so as to prevent breakage of the
scintillator layer 113. For example, in the case of the
scintillator layer 113 being made of the scintillator having a
columnar crystal structure, the scintillator-protection layer 114
has a thickness of 10 .mu.m to 200 .mu.m. This is because if the
thickness of the scintillator-protection layer 114 is less than 10
.mu.m, it is difficult to completely cover the surface of the
scintillator layer 113 that has surface undulations and large
protrusions due to abnormal growth during vapor deposition, which
may lead to deterioration of the protective function against
moisture. Meanwhile, if the thickness of the
scintillator-protection layer 114 exceeds 200 .mu.m, the light
converted in the scintillator layer 113 (or the light reflected by
the reflective layer described above) is scattered more in the
scintillator-protection layer 114, which may lead to a
deterioration in resolution and in MTF (Modulation Transfer
Function) for radiation images provided by the radiation imaging
apparatus 100.
[0033] The sensor panel 120 is configured to include a sensor base
121, a bonding layer 122, a sensor substrate 123 having a
photoelectric conversion portion 124, a sensor-protection layer
125, a bonding layer 126, a convex member 127, and an external wire
128.
[0034] The sensor base 121 is a base (second base) for supporting
the sensor substrate 123, which is disposed on a side of the sensor
substrate 123 that is opposite to the side of the scintillator
layer 113. The sensor base 121 is preferably made, for example, of
a carbon material such as CFRP or amorphous carbon or of glass.
[0035] The bonding layer 122 is a bonding layer (second bonding
layer) for bonding the sensor base 121 and the sensor substrate 123
together.
[0036] The sensor substrate 123 is a substrate disposed on a side
of the scintillator layer 113 that is opposite to the side of the
scintillator base 111 and having the photoelectric conversion
portion 124 for converting the light converted in the scintillator
layer 113 into electric signals. The sensor substrate 123 is. This
sensor substrate 123 is adhered to the sensor base 121 with the
bonding layer 122 interposed therebetween, and, for example, is an
insulating substrate made of a material, such as glass. Also, the
photoelectric conversion portion 124 in which a photoelectric
conversion element (not illustrated) and a switching element (not
illustrated), such as a TFT, are arranged two-dimensionally is
provided at the sensor substrate 123. The sensor substrate 123 may
be a type of which one sheet of the sensor substrate 123 forms one
imaging field or a type of which multiple sheets of the sensor
substrate 123 form one imaging field. CMOS sensors using
crystalline silicon or PIN sensors or MIS sensors using amorphous
silicon can be used as a type of the photoelectric conversion
elements in the photoelectric conversion portion 124.
[0037] The sensor-protection layer 125, which is a layer for
protecting the sensor substrate 123, is disposed between the sensor
substrate 123 and the bonding layer 130. More specifically, the
sensor-protection layer 125 is disposed so as to cover and protect
the photoelectric conversion portion 124 of the sensor substrate
123. For example, the sensor-protection layer 125 is preferably
made of SiN, TiO.sub.2, LiF, Al.sub.2O.sub.3, or MgO.
Alternatively, the sensor-protection layer 125 may be made, for
example, of a polyphenylene sulfide resin, a fluororesin, a
polyether ether ketone resin, a liquid crystal polymer, a polyether
nitrile resin, a polysulfone resin, a polyether sulfone resin, or a
polyarylate resin. Alternatively, the sensor-protection layer 125
may be made, for example, of a polyamide-imide resin, a
polyether-imide resin, a polyimide resin, an epoxy resin, or a
silicon resin. Note that the sensor-protection layer 125 is
preferably made of a material having a high transmittance of light
with such wave lengths as converted in the scintillator layer 113
because the light converted by the scintillator layer 113 passes
through the sensor-protection layer 125 when radiation is incident
on the radiation imaging apparatus 100.
[0038] The bonding layer 126 is a bonding layer (third bonding
layer) for bonding the sensor base 121 (a surface of the sensor
base 121) and the convex member 127 together. This bonding layer
126 preferably has a small thickness in order to improve the
moisture-proofing or moisture-resisting performance. In addition,
although, in the example illustrated in FIG. 1B, the bonding layer
126 is separated from the bonding layer 122 or the sensor substrate
123, the bonding layer 126 may be formed so as to be in contact
with the bonding layer 122 or in contact with a side surface of the
sensor substrate 123. For example, the bonding layer 126 may be
made of a resin that have a low moisture permeability or a sheet
material that have a low moisture permeability. In this case, for
example, a typical organic material, such as a silicone resin, an
acrylic resin, or an epoxy resin, or a hot-melt resin, such as a
polyester resin, a polyolefin resin, or a polyamide resin may be
used as the material of the bonding layer 126.
[0039] As illustrated in FIG. 1B, the convex member 127 is a
peripheral member disposed at a position in a vertical direction to
a surface of the sensor panel 120 (more specifically, on a surface
of the sensor base 121) from the edge of the scintillator panel 110
(scintillator base 111), and for narrowing a gap between the
scintillator panel 110 and the sensor panel 120, and the gap is to
be sealed by the sealing member 140, which will be described later.
Also, a surface of the convex member 127 on a side of the
scintillator panel 110 is closer to the surface of the scintillator
base 111 on which the scintillator layer 113 is supported than to a
surface of the sensor panel 120 where the convex member 127 is not
formed. For example, this convex member 127 is preferably made of a
material having a low moisture permeability. For example, this
convex member 127 may be formed using a material formed by a resin
material, or formed using a carbon material or glass. Note that in
order to improve the moisture-proofing or moisture-resisting
performance, the convex member 127 is preferably made of a material
having a coefficient of thermal expansion close to that of the
sensor base 121 or made of the same material as that of the sensor
base 121.
[0040] The external wire 128 is a wire disposed between the convex
member 127 and the scintillator panel 110 and connected to the
sensor substrate 123. More specifically, the external wire 128 is
wire that couples the sensor substrate 123 electrically to an
external flexible board or the like. A bonding pad may be provided
at the contact points between the external wire 128 and the sensor
substrate 123.
[0041] As illustrated in FIG. 1B, the bonding layer 130 is a
bonding layer (first bonding layer) for bonding the scintillator
panel 110 and the sensor panel 120 together at a position different
from the edge of the scintillator panel 110 (the scintillator base
111). More specifically, the bonding layer 130 bonds the
scintillator panel 110 and the sensor panel 120 together in such a
manner that the scintillator-protection layer 114 of the
scintillator panel 110 and the sensor-protection layer 125 of the
sensor panel 120 are opposed and adhered to each other. Similarly
to the sensor-protection layer 125, the bonding layer 130 is
preferably made of a material having a high transmittance of light
with wave lengths converted in the scintillator layer 113.
[0042] The sealing member 140 is a member for sealing the gap
between the scintillator panel 110 and the sensor panel 120 at the
edge of the scintillator panel 110 (scintillator base 111). This
sealing member 140 conducts sealing that is spaced from the
scintillator panel 113 and fixes the convex member 127 to the edge
of the scintillator panel 110 (scintillator base 111). In order to
improve the moisture-proofing or moisture-resisting performance of
the scintillator panel 110, this sealing member 140 may be
preferably made by a resin having a low moisture permeability,
especially an epoxy resin, as is the scintillator-protection layer
114 or the bonding layer 126. The sealing member 140 may be made of
the same material as that of the bonding layer 126. Also, the
external wire 128 illustrated in FIG. 1B is sealed by the sealing
member 140 so as to pass through the sealing member 140.
[0043] To improve the moisture-proofing or moisture-resisting
performance of the radiation imaging apparatus 100, the edge of the
scintillator panel 110 (scintillator base 111) preferably comes to
a position inside the width of the upper surface of the convex
member 127 as illustrated in FIG. 1B. Also, when D is a gap
(distance) necessary to be sealed by the sealing member 140,
t.sub.a is a total thickness of the scintillator layer 113 and the
scintillator-protection layer 114, t.sub.b is a thickness of the
bonding layer 130, t.sub.c is a thickness of the bonding layer 122,
and t.sub.d is a thickness of the external wire 128, the radiation
imaging apparatus 100 according to the present embodiment
preferably satisfies the formula (1) below.
t.sub.b+t.sub.c+t.sub.d.ltoreq.D<t.sub.a+t.sub.b (1)
[0044] Here, the left side of the formula (1) takes into account
the gap that is wider than a thickness of members that may deform
during bonding (the gap to prevent the convex member 127 from
abutting the scintillator base 111). The right side of the formula
(1) takes into account the gap in a condition that the height of
the convex member 127 is greater than the height of the
sensor-protection layer 125 of the sensor panel 120. In this case,
it is more preferable that the gap (distance) necessary to be
sealed by the sealing member 140 be closer to the value in the left
side of the formula (1) from a view point of improving the
moisture-proofing or moisture-resisting performance because the
area of the sealing member 140 coming into contact with the outside
air can be reduced.
[0045] FIG. 2 is a plan view schematically illustrating examples of
the positional relationship between the sensor base 121 and the
convex member 127 of FIGS. 1A and 1B according to the embodiment of
the present invention.
[0046] FIG. 2A illustrates a configuration in which the convex
member 127 (as well as the bonding layer 126) is disposed along
only one side of the sensor base 121. Also, FIGS. 2B and 2C
illustrate configurations in which the convex member 127 (as well
as the bonding layer 126) is disposed along two sides of the sensor
base 121. Also, FIG. 2D illustrates a configuration in which the
convex member 127 (as well as the bonding layer 126) is disposed
along three sides of the sensor base 121. Also, FIG. 2E illustrates
a configuration in which the convex member 127 (as well as the
bonding layer 126) is disposed partially along sides of the sensor
base 121. Also, FIG. 2F illustrates a configuration in which the
convex member 127 (as well as the bonding layer 126) is disposed
along all of the four sides of the sensor base 121 (in other words,
disposed along the periphery of the sensor base 121 so as to
surround the sensor base 121). From a viewpoint of further
improving the moisture-proofing or moisture-resisting performance,
it is more preferable that the convex member 127 be disposed so as
to surround the periphery of the sensor base 121 as illustrated in
FIG. 2F.
[0047] FIG. 3 is a view schematically illustrating a second
configuration example of the radiation imaging apparatus 100
according to the embodiment of the present invention. In FIG. 3,
elements similar to those in FIGS. 1A and 1B and in FIG. 2 are
denoted by the same reference signs, and detailed descriptions of
them will be omitted.
[0048] The second example illustrated in FIG. 3 is a configuration
in which the bonding layer 126 is included in the bonding layer
122, thereby forming the bonding layer 122 and the bonding layer
126 integrally, compared with the first example illustrated in FIG.
1B. The second example illustrated in FIG. 3 is preferable, for
example, in the case of the bonding layer 122 being made of a
material having better moisture barrier properties.
[0049] FIG. 4 is a view schematically illustrating a third
configuration example of the radiation imaging apparatus 100
according to the embodiment of the present invention. In FIG. 4,
elements similar to those in FIGS. 1A to 3 are denoted by the same
reference signs, and detailed descriptions of them will be
omitted.
[0050] The third example illustrated in FIG. 4 is a configuration
in which the shape of the convex member 127 is changed compared
with the first example illustrated in FIG. 1B. More specifically,
in the third example illustrated in FIG. 4, the convex member 127
is made to have a shape of a trapezoid that is shorter on a side of
the scintillator panel 110. The third example illustrated in FIG. 4
is a shape of the convex member 127 that considers, for example,
alleviating the stress concentrated on the external wire 128. To
alleviate the stress concentrated on the external wire 128, the
shape of the convex member 127 may be a shape of a polygon, such as
a pentagon or a hexagon.
[0051] FIG. 5 is a view schematically illustrating a fourth
configuration example of the radiation imaging apparatus 100
according to the embodiment of the present invention. In FIG. 5,
elements similar to those in FIGS. 1A to 4 are denoted by the same
reference signs, and detailed descriptions of them will be
omitted.
[0052] The fourth example illustrated in FIG. 5 is a configuration
in which the shape of convex member 127 is changed compared with
the first example illustrated in FIG. 1B. More specifically, in the
fourth example illustrated in FIG. 5, the convex member 127 is made
with a shape formed with straight lines and a curved line.
[0053] FIG. 6 is a view schematically illustrating a fifth
configuration example of the radiation imaging apparatus 100
according to the embodiment of the present invention. In FIG. 6,
elements similar to those in FIGS. 1A to 5 are denoted by the same
reference signs, and detailed descriptions of them will be
omitted.
[0054] The fifth example illustrated in FIG. 6 is a configuration
in which the convex member 127 is formed integrally with the sensor
base 121 compared with the first example illustrated in FIG. 1B. In
this configuration, the bonding layer 126 as illustrated in FIG. 1B
is not necessary. The fifth example illustrated in FIG. 6 is a
preferable configuration for further improving the
moisture-proofing or moisture-resisting performance. Note that in
the case of the convex member 127 being formed integrally with the
sensor base 121 in the fifth example illustrated in FIG. 6, the
shape of the convex member 127 may be the trapezoid as illustrated
in FIG. 4, the polygon such as the pentagon or the hexagon as
described above, or the shape formed by combining straight lines
and a curved line as illustrated in FIG. 5.
[0055] FIG. 7 is a view schematically illustrating a configuration
example of a radiation imaging system 6000 that includes the
radiation imaging apparatus 100 according to the embodiment of the
present invention. The radiation imaging apparatus 100 illustrated
in FIG. 7 may be any one of the radiation imaging apparatuses
illustrated in FIGS. 1A to 6.
[0056] The radiation imaging system 6000 illustrated in FIG. 7
includes the radiation imaging apparatus 100, an image processor
6070 equipped with a signal processor and other components, a
display 6080 serving as a display device, and an X-ray tube 6050
serving as a radiation generating apparatus for generating
radiation.
[0057] For example, as illustrated in FIG. 7, X-ray 6060 generated
by the X-ray tube 6050 in an X-ray room penetrates the chest 6062
of a patient (subject) 6061 and is incident on the radiation
imaging apparatus 100. The X-ray incident on the radiation imaging
apparatus 100 contains information on the interior of the body of
the patient 6061. In the radiation imaging apparatus 100, the
scintillator layer 113 scintillates in response to the incident
X-ray. The photoelectric conversion portion 124 of the sensor panel
120 detects the scintillation light and produces electrical
information. Subsequently, the image processor 6070 (signal
processor) converts the electrical information into digital
signals, performs image processing, and displays an X-ray image on
the display 6080 in a control room. The X-ray image data obtained
by the image processor 6070 can be transmitted to a remote place by
using transmission devices including a telephone line 6090 and a
network, such as a LAN or the Internet. This enables a doctor at a
different location to examine the X-ray image displayed on another
display 6081 in a doctor room and to diagnose remotely. For
example, the X-ray image can be stored on an optical disk or
recorded on a medium such as a film 6110 by a film processor
6100.
[0058] In the radiation imaging apparatus 100 according to the
present embodiment, the convex member 127 for narrowing the gap
between the scintillator panel 110 and the sensor panel 120 is
disposed at a position in a vertical direction to a surface of the
sensor panel 120 (more specifically, for example, on the surface of
the sensor base 121) from the edge of the scintillator panel
110.
[0059] With this configuration, the area of the sealing member 140
in contact with the outside air can be reduced, which can thereby
improve the moisture-proofing or moisture-resisting performance of
the radiation imaging apparatus 100. In addition, if, for example,
the thixotropic properties of a resin to be used for the sealing
member 140 is low and the gap between the scintillator panel 110
and the sensor panel 120 is large, the application thickness of the
resin becomes uneven, and the moisture-proofing or
moisture-resisting performance may deteriorate at thin resin
portions. In the present embodiment, however, the deterioration of
the moisture-proofing or moisture-resisting performance can be
prevented by reducing the width of the gap.
[0060] According to the present invention, the moisture-proofing or
moisture-resisting performance of a radiation imaging apparatus can
be improved.
[0061] While the present invention has been described with
reference to exemplary embodiments, it is to be understood that the
invention is not limited to the disclosed exemplary embodiments.
The scope of the following claims is to be accorded the broadest
interpretation so as to encompass all such modifications and
equivalent structures and functions.
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