U.S. patent application number 16/714678 was filed with the patent office on 2020-12-03 for multi-purpose heat sink, method of manufacturing the same, board card, and multi-purpose heat sink platform.
The applicant listed for this patent is Cambricon Technologies Corporation Limited. Invention is credited to Deheng CHEN, Shuai CHEN, Kun HE, Huijun LAN, Kai YE, Chongxing ZHU.
Application Number | 20200376614 16/714678 |
Document ID | / |
Family ID | 1000004700666 |
Filed Date | 2020-12-03 |
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United States Patent
Application |
20200376614 |
Kind Code |
A1 |
ZHU; Chongxing ; et
al. |
December 3, 2020 |
MULTI-PURPOSE HEAT SINK, METHOD OF MANUFACTURING THE SAME, BOARD
CARD, AND MULTI-PURPOSE HEAT SINK PLATFORM
Abstract
The present disclosure provides a multi-purpose heat sink, a
method of manufacturing the same, a board card, and a multi-purpose
heat sink platform, where the multi-purpose heat sink is composed
of a bracket (310) and heat dissipation components. The cost of the
multi-purpose heat sink in the present disclosure is low.
Inventors: |
ZHU; Chongxing; (Beijing,
CN) ; LAN; Huijun; (Beijing, CN) ; HE;
Kun; (Beijing, CN) ; YE; Kai; (Beijing,
CN) ; CHEN; Deheng; (Beijing, CN) ; CHEN;
Shuai; (Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Cambricon Technologies Corporation Limited |
Beijing |
|
CN |
|
|
Family ID: |
1000004700666 |
Appl. No.: |
16/714678 |
Filed: |
December 13, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 2215/00 20130101;
B23P 2700/10 20130101; F28D 15/0275 20130101; F28D 2021/0029
20130101; B23P 15/26 20130101; F28F 3/12 20130101 |
International
Class: |
B23P 15/26 20060101
B23P015/26; F28F 3/12 20060101 F28F003/12 |
Foreign Application Data
Date |
Code |
Application Number |
May 31, 2019 |
CN |
201910471371.0 |
Claims
1. A manufacturing method of a multi-purpose heat sink, comprising:
providing a platform part, wherein the platform part includes a
bracket and heat dissipation components, and the bracket limits a
frame of the platform part and includes a primary panel; and
providing an additional part, wherein the additional part includes
a plurality of convex plates, wherein at least part of the heat
dissipation components are set on a back side of the primary panel
of the bracket, and the plurality of convex plates are combined
with a front side of the primary panel and are used for heat
conduction in contact with heat dissipation sources of a
corresponding circuit board assembly, the platform part is
configured to be universal for a variety of heat sinks, and the
plurality of convex plates are prepared and/or selected according
to an arrangement of the heat dissipation sources of the
corresponding circuit board assembly.
2. The manufacturing method of claim 1, wherein the platform part
further includes a cover installed to a back side of the bracket,
so that at least part of the heat dissipation components are
clamped on the cover and the primary panel.
3. The manufacturing method of claim 1, wherein the heat
dissipation components include heat fins.
4. The manufacturing method of claim 3, wherein the heat
dissipation components further include a plurality of heat pipes,
the heat fins include a first heat fin, wherein the plurality of
heat pipes are set between the first heat fin and the primary
panel, and the plurality of heat pipes are in contact with the
first heat fin.
5. A multi-purpose heat sink, comprising: a platform part, wherein
the platform part includes a bracket and heat dissipation
components, and the bracket limits a frame of the platform part and
includes a primary panel; and an additional part, where the
additional part includes a plurality of convex plates; at least
part of the heat dissipation components are set on a back side of
the primary panel of the bracket, and the plurality of convex
plates are combined with a front side of the primary panel and are
used for heat conduction in contact with heat dissipation sources
of a corresponding circuit board assembly; the platform part is
configured to be universal for a variety of heat sinks, and the
plurality of convex plates are prepared and/or selected according
to an arrangement of the heat dissipation sources of the
corresponding circuit board assembly.
6. A multi-purpose heat sink, comprising: a platform part, wherein
the platform part includes a bracket and heat dissipation
components, and the bracket limits a frame of the platform part and
includes a primary panel; and an additional part, wherein the
additional part includes a plurality of convex plates; at least
part of the heat dissipation components are set on a back side of
the primary panel of the bracket, and the plurality of convex
plates are welded or glued to a front side of the primary panel and
are used for heat conduction in contact with heat dissipation
sources of a corresponding circuit board assembly.
7. (canceled)
8. (canceled)
9. A multi-purpose heat sink platform, comprising: a bracket and
heat dissipation components, wherein the bracket limits a frame of
the platform part and includes a primary panel, and at least part
of the heat dissipation components are set on a back side of the
primary panel of the bracket; a front side of the primary panel is
used to install a plurality of convex plates by welding or gluing,
and the plurality of convex plates are used for heat conduction in
contact with heat dissipation sources of a corresponding circuit
board assembly.
10. (canceled)
Description
TECHNICAL FIELD
[0001] The disclosure relates to the field of electronic device
technologies, and specifically to a multi-purpose heat sink, a
method of manufacturing the same, a board card, and a multi-purpose
heat sink platform.
BACKGROUND
[0002] A Printed Circuit Board Assembly (PCBA) integrates a
plurality of electronic parts that generate heat. The heat
dissipation sources (or "heat sources") is mainly some
high-power-density integrated circuits (ICs) or memory granules. If
the heat is not dissipated, it may affect system stability and even
cause downtime.
[0003] At present, the general heat dissipation method is to
manufacture a heat sink for each type of board card corresponding
to the circuit board of the board card. Since the positions of a
plurality of heat sources are different on each circuit board, the
heat sinks need to match the position and height of the convex
plate according to different heat sinks.
[0004] The disadvantage of the above heat dissipation method is
that each type of board card needs a type of brand new heat sink,
which needs a long research and development (R & D) cycle, a
long processing cycle, and a high cost.
SUMMARY
[0005] The present disclosure is intended to provide a
multi-purpose heat sink, a method of manufacturing the same, a
board card, and a multi-purpose heat sink platform to solve the
above-mentioned technical problems.
[0006] Solution 1: a manufacturing method of a multi-purpose heat
sink, comprising:
[0007] providing a platform part (300), wherein the platform part
(300) includes a bracket (310) and heat dissipation components, and
the bracket (310) limits a frame of the platform part (300) and
includes a primary panel (311); and
[0008] providing an additional part (400), where the additional
part (400) includes a plurality of convex plates, in particular, a
plurality of convex plates of different sizes and/or thicknesses;
wherein at least part of the heat dissipation components are set on
a back side of the primary panel (311) of the bracket (310), and
the plurality of convex plates are combined with a front side of
the primary panel (311) and are used for heat conduction in contact
with heat dissipation sources of a corresponding circuit board
assembly (100); the platform part (300) is configured to be
universal for a variety of heat sinks, and the plurality of convex
plates are prepared and/or selected according to an arrangement of
the heat dissipation sources of the corresponding circuit board
assembly (100).
[0009] Solution 2: the manufacturing method of solution 1, wherein
the platform part (300) further includes a cover (330) installed to
the back side of the bracket (310), so that at least part of the
heat dissipation components may be clamped on the cover (330) and
the primary panel (311).
[0010] Solution 3: the manufacturing method of solution 1, wherein
the heat dissipation components include heat fins (340, 314, and
315).
[0011] Solution 4: the manufacturing method of solution 3, wherein
the heat dissipation components further include a plurality of heat
pipes (350), the heat fins (340, 314, 315) include a first heat fin
(340), where the plurality of heat pipes (350) are set between the
first heat fin (340) and the primary panel (311), and the plurality
of heat pipes (350) are in contact with the first heat fin
(340).
[0012] Solution 5: the manufacturing method of any one of solutions
1-4, wherein the heat dissipation components further include a heat
conducting plate (360) for contacting and conducting heat with a
primary chip of the corresponding circuit board assembly (100).
[0013] Solution 6: the manufacturing method of any one of solutions
1-5, wherein the platform part (300) further includes a support
ring (320) for providing strength support to the heat dissipation
components.
[0014] Solution 7: the manufacturing method of solution 6, wherein
the heat dissipation components further include a heat conducting
plate (360) for contacting and conducting heat with a primary chip
of the corresponding circuit board assembly (100), the material
strength of the support ring (320) is greater than the material
strength of the heat conducting plate (360), the support ring (320)
is set around the heat conducting plate (360), and a thermal
conductivity of the heat conducting plate (360) is greater than a
thermal conductivity of the support ring (320).
[0015] Solution 8: the manufacturing method of solution 6 or
solution 7, wherein the primary panel (311) is provided with a
raised part (311S) raised toward the corresponding circuit board
assembly (100), and the support ring (320) is clamped between the
raised part (311S) and the heat dissipation components.
[0016] Solution 9: the manufacturing method of any one of solutions
1-4, wherein the additional part (400) further includes a heat
conducting plate (360) for contacting and conducting heat with a
primary chip of the corresponding circuit board assembly (100).
[0017] Solution 10: the manufacturing method of any one of
solutions 1-9, wherein the support ring (320) or the heat
dissipation components are provided with a plurality of convex
columns (321), the primary panel (311) is correspondingly provided
with a plurality of installation holes (317), and the convex
columns (321) pass through the installation holes (317) and allow
the heat dissipation components to float in a thickness direction
(H) of the multi-purpose heat sink.
[0018] Solution 11: the manufacturing method of solution 10,
wherein the plurality of convex columns (321) are provided with
threaded holes for installing to a corresponding circuit board
assembly (100) by screws.
[0019] Solution 12: the manufacturing method of any one of
solutions 1-11, wherein
[0020] the plurality of convex plates are welded to the primary
panel (311) by solder paste or laser.
[0021] Solution 13: the manufacturing method of any one of
solutions 1-11, wherein
[0022] the plurality of convex plates are glued to the primary
panel (311) by heat conductive adhesive.
[0023] Solution 14: the manufacturing method of any one of
solutions 1-13, wherein at least one of the plurality of convex
plates (411) includes a base-plate (411A) and a plurality of convex
part (411B), wherein the plurality of convex parts (411B) have a
surface area substantially equal to that of a plurality of heat
dissipation sources (121) set side by side, and protrude from the
base-plate (411A), and are respectively used to contact the
plurality of heat dissipation sources (121), the base-plate (411A)
is used to be combined with the primary panel (311).
[0024] Solution 15: a multi-purpose heat sink, comprising:
[0025] a platform part (300), where the platform part (300)
includes a bracket (310) and heat dissipation components, and the
bracket (310) limits a frame of the platform part (300) and
includes a primary panel (311); and
[0026] an additional part (400), where the additional part (400)
includes a plurality of convex plates, in particular, a plurality
of convex plates of different sizes and/or thicknesses; at least
part of the heat dissipation components are set on a back side of
the primary panel (311) of the bracket (310), and the plurality of
convex plates are combined with a front side of the primary panel
(311) and are used for heat conduction in contact with heat
dissipation sources of a corresponding circuit board assembly
(100); the platform part (300) is configured to be universal for a
variety of heat sinks, and the plurality of convex plates are
prepared and/or selected according to an arrangement of the heat
dissipation sources of the corresponding circuit board assembly
(100).
[0027] Solution 16: a multi-purpose heat sink, comprising:
[0028] a platform part (300), where the platform part (300)
includes a bracket (310) and heat dissipation components, and the
bracket (310) limits a frame of the platform part (300) and
includes a primary panel (311); and
[0029] an additional part (400), where the additional part (400)
includes a plurality of convex plates, in particular, a plurality
of convex plates of different sizes and/or thicknesses; at least
part of the heat dissipation components are set on a back side of
the primary panel (311) of the bracket (310), and the plurality of
convex plates are welded or glued to a front side of the primary
panel (311) and are used for heat conduction in contact with heat
dissipation sources of a corresponding circuit board assembly
(100).
[0030] Solution 17: the multi-purpose heat sink of solution 15 or
16, wherein the multi-purpose heat sink is manufactured according
to the method of manufacturing a multi-purpose heat sink of any one
of solutions 1-14.
[0031] Solution 18: a board card, comprising:
[0032] a circuit board assembly (100); and
[0033] the multi-purpose heat sink of any one of solutions
15-17.
[0034] Solution 19: a multi-purpose heat sink platform,
comprising:
[0035] a bracket (310) and heat dissipation components, wherein the
bracket (310) limits a frame of the platform part (300) and
includes a primary panel (311), and at least part of the heat
dissipation components are set on a back side of the primary panel
(311) of the bracket (310); a front side of the primary panel (311)
is used to install a plurality of convex plates (a plurality of
convex plates of different sizes and/or thicknesses in particular)
by welding or gluing, and the plurality of convex plates are used
for heat conduction in contact with heat dissipation sources of a
corresponding circuit board assembly (100).
[0036] Solution 20: the multi-purpose heat sink platform of
solution 19, wherein the multi-purpose heat sink platform is the
platform part (300) in the method of manufacturing a multi-purpose
heat sink of any one of solutions 1-14.
[0037] The method of manufacturing a multi-purpose heat sink
provided by the present disclosure may shorten the R & D and
manufacturing cycle. Compared with developing and manufacturing a
brand new heat sink, in the present disclosure, a common platform
part can be used and only additional parts need to be developed and
manufactured, so that the entire R & D and manufacturing cycle
can be greatly shortened. Besides, cost savings can be achieved
through high-volume production of the platform parts.
BRIEF DESCRIPTION OF THE DRAWINGS
[0038] FIG. 1 is a structural diagram of a circuit board assembly
according to an embodiment of the present disclosure;
[0039] FIG. 2 is a structural diagram of a heat sink according to
an embodiment of the present disclosure;
[0040] FIG. 3 is diagram of the decomposition of the heat sink in
FIG. 2;
[0041] FIG. 4A and FIG. 4B are diagrams of the heat sink in FIG. 2
as viewed from the back, wherein a cover is omitted in FIG. 4B.
[0042] FIG. 5 and FIG. 6 are two sectional stereograms of the heat
sink in FIG. 2.
[0043] FIG. 7, FIG. 8, and FIG. 9 are diagrams of the decomposition
of the heat sink in FIG. 2, wherein some components such as a
cover, a complex plate are omitted.
DESCRIPTION OF MARKS OF DRAWINGS
[0044] 100: circuit board assembly; 110: circuit board; 120, 121,
122, 123, 124, 125, 126, 130: heat dissipation source; 140, 150:
installation hole; 160: raised part of a circuit board assembly;
200: heat sink; 300: platform part; 310: bracket; 311: primary
panel; 311A: first opening; 311B: second opening 311S: raised part
of a primary panel; 312, 313: side panel; 314: second heat fin;
315: third heat fin; 316: threaded column; 317: installation hole;
318: threaded hole;
[0045] 320: support ring; 321: convex column; 330: cover; 331:
screw; 340: heat fin (first heat fin)
[0046] 341: groove; 350: heat pipe; 360: heat conducting plate;
370: elastic member;
[0047] 400: additional part; 411, 412, 413, 414, 415, 416: convex
plate; 411A: base-plate; 411B: convex part;
[0048] L: length direction; W: width direction; H: thickness
direction
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0049] Exemplary embodiments of the present disclosure will be
described below with reference to the drawings. It should be
understood that these specific descriptions are only used to teach
those skilled in the art how to implement the present invention,
not to exhaust all possible ways of the present invention, nor to
limit the scope of the present invention.
[0050] FIG. 1 is a structural diagram of a circuit board assembly
100 which includes a printed circuit board (PCB, sometimes simply
referred to as a "circuit board") 110 and heat dissipation sources
installed on the circuit board 110. These heat dissipation sources
include a first heat dissipation source 120 and a second heat
dissipation source 130. The first heat dissipation source 120
includes heat dissipation sources 121, 122, 123, 124, 125, and 126.
For example, the heat dissipation source 121 may be a power
management chip, the heat dissipation sources 122 and 123 may be
memory granules, and the heat dissipation source 125 may be a power
management chip or other chips with high heat generation. The
second heat dissipation 130 may be a primary chip, for example, a
central processing unit (CPU), a graphics processor (GPU), an
application specific integrated circuit (ASIC) chip, etc.
[0051] In addition, the circuit board 110 is provided with a
plurality of installation holes 140 and 150 for connecting with the
heat sink. The circuit board assembly 100 and the heat sink can be
installed together through the installation holes 140 and 150 to
form a board card by means of screws or clips, etc.
[0052] As shown in FIG. 2-FIG. 9, the embodiments of the present
disclosure provide a multi-purpose heat sink 200, a method of
manufacturing the same, a multi-purpose heat sink platform (that
is, a platform part 300), and a board card including the
multi-purpose heat sink 200 and a circuit board assembly.
[0053] In the following description, a side of the multi-purpose
heat sink 200 facing the circuit board assembly is referred to as
the front side, and a side of the multi-purpose heat sink 200
remote from the circuit board assembly is referred to as the back
side.
[0054] As shown in FIG. 2 and FIG. 3, in the embodiment of the
present disclosure, the multi-purpose heat sink 200 (sometimes
simply referred to as "heat sink 200") includes a platform part 300
and an additional part 400. In the technical solution of the
present disclosure, different additional parts 400 can be installed
on the same platform part 300 to obtain a heat sink 200 suitable
for different circuit board assemblies. In other words, the
platform part 300 may be shared, and the additional part 400 is
manufactured in cooperation with each circuit board assembly. In
this technical solution, by simply modifying the additional part
400, the heat sink 200 can be matched to different circuit board
assemblies.
[0055] As shown in FIG. 2 and FIG. 3, the platform part 300 may be
a basic platform part that meets the requirements of a standard
heat sink, for example, the platform part 300 may meet PCIE
(Peripheral Component Interconnect Standard) specifications. The
additional part 400 may be adjusted according to the position and
height of different heat dissipation sources.
[0056] In the technical solution of the present disclosure, the
additional part 400 and the platform part 300 can be fully combined
by welding. For example, by using the solder paste or laser, the
additional part 400 can be firmly welded to the platform part 300.
At the same time, the flatness of the additional part 400 can be
guaranteed, so as to ensure that the additional part 400 can be in
full contact with the heat dissipation sources of the circuit board
assembly, thereby ensuring the heat dissipation effect.
[0057] The method of combining the additional part 400 and the
platform part 300 is not limited to welding. For example, the
additional part 400 may be glued to the platform part 300 by a heat
conductive adhesive. The heat conductive adhesive has fast surface
drying and curing speed, high flame retardant grade, and has good
thermal conductivity (heat dissipation) while playing an adhesive
role.
[0058] Referring to FIG. 2 to FIG. 9, the platform part 300 may
include a bracket 310, a support ring (or "auxiliary ring") 320
(please refer to FIG. 6 to FIG. 8), a cover 330, and a heat fin (a
first heat fin) 340 (please refer to FIG. 4B and FIG. 9), a heat
pipe 350 (please refer to FIG. 6 to FIG. 8), and a heat conducting
plate 360. The bracket (310) limits a frame of the entire platform
part (300) and an installation space of the additional part
400.
[0059] The bracket 310 may be stamped from a thermally conductive
material such as aluminum, and the bracket 310 may include a
primary panel 311 and two side panels 312 and 313. The primary
panel 311 extends along the length direction L and the width
direction W of the platform part 300 and limits an installation
space of the additional part 400. The primary panel 311 may be on
one plane, or may include multiple planes. For example, the primary
panel 311 may be raised away from the cover plate 330 at the
support ring 320 to form a raised part 311S, thereby accommodating
a support ring 320 between a heat fin 340 and a raised part 311S of
the primary panel 311. More specifically, the support ring 320 is
accommodated between a heat pipe 350 and the raised part 311S of
the primary panel 311. The height of the raised part 311S from
other surface parts of the primary panel 311 may be about 1.0 mm.
The raised part 311S may be in contact with, for example, the
circuit board 110 in FIG. 1. The setting of the raised part 311S
makes that at least the part on the back side of the primary panel
311 in contact with the heat pipe 350 is in the same plane even if
the supporting ring 320 is set, which increases the heat conduction
area of the primary panel 311 and the heat pipe 350, and improves
the heat dissipation effect.
[0060] The front side of the raised part 311S may also be provided
with one layer of insulating material board or insulating coating,
which can prevent conductive contact with the circuit board 110,
thus preventing the occurrence of short circuit.
[0061] The bracket 310 may also be formed by die casting using a
mold and/or milled by a CNC machine tool.
[0062] The primary panel 311 may include a first opening 311A, and
the first opening 311A may be set at the raised part 311S and
surrounded by the raised part 311S of the approximate mouth shape.
The first opening 311A may be used to place, for example, the
second heat dissipation source 130 shown in FIG. 1.
[0063] It can be understood that, in other embodiments, the
platform part 300 may not include the support ring 320, so that the
primary panel 311 may not be raised at the support ring 320. In
some other embodiments, the raised part 311S of the primary panel
311 may be removed to expose the support ring 320 on the surface
side of the primary panel 311.
[0064] The primary panel 311 may include a second opening 311B, and
the second opening 311B may be used to avoid, for example, a raised
part 160 on the circuit board assembly 100 shown in FIG. 1. The
raised part 160 may be, for example, an inductive element or an
inductor. The second opening 311B may also be used to reduce the
weight of the bracket 310 and the platform part 300.
[0065] The side panels 312 and 313 extend substantially along the
length direction L and the thickness direction H of the platform
part 300 and limit an installation space of a heat fin 340.
[0066] In an embodiment, the bracket 310 may have a length of about
167.5 mm, a width of about 62.7 mm, and a thickness of about 17.5
mm.
[0067] In a possible embodiment, the bracket 310 may further
include a second heat fin 314 and a third heat fin 315 formed at
both ends in the length direction L. Both the second heat fin 314
and the third heat fin 315 may include a plurality of heat
dissipation fins arranged in the width direction W or the length
direction L. It should also be understood that the second heat fin
314 and the third heat fin 315 may also be independently formed
with the bracket 310 and installed to the bracket 310. A plurality
of heat fins (340, 314, 315) are formed separately to achieve
thermal insulation (physical insulation). For example, the first
heat fin 340 may correspond to the second heat dissipation source
130 (such as the primary chip) and some other heat dissipation
sources (such as a heat dissipation source 122 and a heat
dissipation source 123), and the second heat fin 314 and the third
heat fin 315 may correspond to remaining heat sources.
[0068] The heat fin 340 is located between the second heat fin 314
and the third heat fin 315 in the length direction L and avoids the
second opening 311B. The heat fin 340 may include a plurality of
heat dissipation fins arranged along the length direction L or the
width direction W.
[0069] The plurality of heat pipes 350 may extend along the length
direction L and be arranged along the width direction W. A
plurality of heat pipes 350 are set between the heat fin 340 and
the primary panel 311 of the bracket 310, and are configured to
efficiently conduct heat from the side of the primary panel 311 of
the bracket 310 to the heat fin 340. The heat pipe 350 and the heat
fin 340 may be welded together.
[0070] The heat conducting plate 360 is set in the first opening
311A and is located on the front side of the heat pipe 350. The
heat conducting plate 360 is used for conducting heat by contacting
with, for example, the second heat dissipation source 130 in FIG.
1. The heat conducting plate 360 may be a rectangular flat plate
and may be made of highly thermally conductive materials. The heat
conducting plate 360 can be in surface contact with, for example,
the second heat dissipation source 130 of the primary chip, to
provide better thermal conductivity. The heat conducting plate 360
and the heat pipe 350 may be welded together.
[0071] In the embodiment of the present disclosure, the heat
conducting plate 360 is surrounded by the support ring 320. The
inner dimension of the support ring 320 is roughly the same as the
outer dimension of the heat conducting plate 360, so that they can
be nested. The material strength of the support ring 320 is
preferably greater than the material strength of the heat
conducting plate 360, and the thermal conductivity of the heat
conducting plate 360 may be greater than the thermal conductivity
of the support ring 320. For example, the support ring 320 may be
made of steel, and the heat conducting plate 360 may be made of
copper. It can be understood that the support ring 320 is mainly
used to support the heat dissipation components, and enable the
entire platform part 300 to have enough strength.
[0072] A cover 330 may be installed to the back of the bracket 310
by a plurality of screws 331. The bracket 310 is provided with a
plurality of protruding threaded columns 316, where the plurality
of threaded columns 316 are set on the inner side in the width
direction W of the two side panels 312, 313, and threaded holes are
set in the plurality of threaded columns 316. The cover 330 is
fixed to the bracket 310 by screwing screws 331 into threaded holes
in the threaded columns 316.
[0073] The heat fin 340 is provided with a groove 341 that avoids
the threaded columns 316. Through the cooperation of the groove 341
and the threaded columns 316, the heat fin 340 is positioned
relative to the bracket 310 in the length direction L and the width
direction W.
[0074] After the cover 330 is installed to the bracket 310, the
heat fin 340 is clamped between the primary panel 311 and the cover
330 in the thickness direction H. In this technical solution, a
plurality of elastic members 370 may be set between the heat fin
340 and the cover 330, so that the heat fin 340 can be more stably
clamped between the primary panel 311 and the cover 330 in the
thickness direction H. The elastic members 370 may be, for example,
sponge strips. The elastic members 370 can prevent the wind from
escaping from the back side of the heat fin 340 to achieve a good
heat dissipation effect. In addition to being used for positioning
the heat fin 340 relative to the bracket 310, the cover 330 can be
used for decoration.
[0075] The additional part 400 may include a plurality of convex
plates, where the convex plates may be in the form of heat
conducting plates. The plurality of convex plates can be made of
metals (including metal alloy) with good thermal conductivity, such
as copper or aluminum. The convex plates may be used to contact,
for example, the first heat dissipation source 120 in FIG. 1 to
conduct the heat from the first heat dissipation source 120 to the
platform part 300.
[0076] It should be understood that, in other embodiments, the
convex plates may also be used to contact the second heat
dissipation source 130, so as to conduct the heat from the second
heat dissipation source 130 to the platform part.
[0077] The plurality of convex plates may include convex plates
411, 412, 413, 414, 415, and 416, and the plurality of convex
plates may be combined to the primary panel 311 of the bracket 310
by welding or bonding. To match different heat dissipation sources
on the circuit board assembly, the plurality of convex plates can
be of different sizes and/or thicknesses.
[0078] The convex plate 411 may be used to conduct heat by contact
with the heat dissipation sources 121 shown in FIG. 1. The convex
plate 411 may be composed of a base-plate 411A and a plurality of
convex parts 411B, where the plurality of convex parts 411B have
the surface areas substantially equal to the surface areas of a
plurality of heat dissipation sources 121 and protrude from the
base-plate 411A for direct contact with the plurality of heat
dissipation sources 121. The base-plate 411A is used to be combined
to the primary panel 311 of the bracket 310. For example, the
base-plate 411A can be welded to the primary panel 311 in the gap
between the plurality of convex parts 411B, so that deformation of
the convex parts 411B can be avoided, and the gap between the
plurality of convex parts 411B can also be used for ventilation and
heat dissipation. The convex plate 411 may have a width of about
5.6 mm and a length of about 48.2 mm. The length direction of the
convex plate 411 may be consistent with the width direction W of
the platform part 300 of the heat sink 200.
[0079] The convex plate 412 may be used to conduct heat by contact
with the heat dissipation sources 122 shown in FIG. 1. The convex
plate 412 may have a rectangular plate shape so as to be in direct
contact with the plurality of heat dissipation sources 122 at the
same time. The convex plate 412 may have a width of about 15.0 mm,
a length of about 52.0 mm, and a thickness of about 1.2 mm. The
length direction of the convex plate 412 may be consistent with the
width direction W of the platform part 300 of the heat sink
200.
[0080] The convex plate 413 may be used to conduct heat by contact
with the heat dissipation sources 123 shown in FIG. 1. The convex
plate 413 may have a rectangular plate shape so as to be in direct
contact with the plurality of heat dissipation sources 123 at the
same time. The convex plate 413 may have a width of about 14.7 mm,
a length of about 52.2 mm, and a thickness of about 1.4 mm. The
length direction of the convex plate 413 may be consistent with the
width direction W of the platform part 300 of the heat sink
200.
[0081] The convex plates 414 may be used to conduct heat by contact
with the heat dissipation sources 124 shown in FIG. 1. A plurality
of convex plates 414 may have a rectangular plate shape so as to be
in direct contact with the plurality of heat dissipation sources
124 at the same time. The convex plates 414 may have a width of
about 4.6 mm, a length of about 4.6 mm, and a thickness of about
0.8 mm.
[0082] The convex plate 415 may be used to conduct heat by contact
with the heat dissipation sources 125 shown in FIG. 1. The convex
plate 415 may have a rectangular plate shape so as to be in direct
contact with two heat dissipation sources 125 at the same time. The
convex plate 415 may have a width of about 6.0 mm, a length of
about 18.5 mm, and a thickness of about 0.8 mm. The length
direction of the convex plate 415 may be consistent with the width
direction W of the platform part 300 of the heat sink 200.
[0083] The convex plate 416 may be used to conduct heat by contact
with the heat dissipation sources 126 shown in FIG. 1. The convex
plate 416 may have a rectangular plate shape so as to be in direct
contact with the heat dissipation sources 126 at the same time. The
convex plate 416 may have a width of about 7.7 mm, a length of
about 7.7 mm, and a thickness of about 0.2 mm.
[0084] It should be understood that the size and position of the
above-mentioned convex plates are merely exemplary. In this
technical solution of the present disclosure, the size and position
of the convex plates can be determined by the size and position of
the corresponding heat dissipation source 120. Although the heat
dissipation source 120 from different brands or manufacturers have
different sizes, the heat dissipation source 120 from the same
brand or same manufacturer usually have relatively fixed sizes.
Different circuit board assemblies sometimes use multiple
combinations of specific heat dissipation source 120.
[0085] In this technical solution of the present disclosure, convex
plates of different sizes can be used according to the combinations
of the heat dissipation source 120, therefore, a plurality of
predetermined convex plates of different sizes can be commonly used
for a plurality of different board cards. In this way, the
manufacturers can produce a large number of platform parts 300 at a
time, manufacture and/or combine some appropriate additional parts
400 (convex plates) for different board cards, so that the heat
sink 200 can be produced in a short time to match the desired
circuit board assembly.
[0086] It should be understood that, in the above description, the
heat conducting plate 360 is used as a part of the platform part
300, which is not limited in the present disclosure. The heat
conducting plate 360 can also be used as a part of the additional
part 400, in this case, the heat conducting plate 360 can be used
as a part of the plurality of convex plates.
[0087] The primary panel 311 may be provided with a plurality of
installation holes 317. In an optional manner, a support ring 320
is provided with a plurality of convex columns 321 (please refer to
FIG. 2, FIG. 7, FIG. 8, etc.), and the plurality of convex columns
321 are inserted into the installation holes 317. In the present
technical solution, one convex column 321 is respectively set near
each of the four corners of the rectangular ring-shaped support
ring 320, which is not limited in the present disclosure. In the
present technical solution, threaded holes may be set in the
plurality of convex columns 321, so that a circuit board 110 can be
installed to the heat sink 200 by screws and, for example, the
installation holes 150 shown in FIG. 1. Since the convex columns
321 can be movably installed in the installation holes 317 along
the thickness direction H, the components (such as the support ring
320, the heat pipe 350, and the heat fin 340) between the bracket
310 and the cover 330 can move (float) in the thickness direction
H, which may adapt to production errors, and adapt to, for example,
the second heat dissipation source 130 (such as the primary chip)
of different thicknesses shown in FIG. 1.
[0088] It should be understood that the support ring 320 and the
heat conducting plate 360 are not necessary. When the support ring
320 is not provided, the convex columns 321 may be set on the heat
conducting plate 360; while when the heat conducting plate 360 and
the support ring 320 are not provided, the convex columns 321 may
be directly set on the heat fin 340 or the heat pipe 350, which can
also play a role of floating and connecting with the circuit board,
which is not limited in the present disclosure.
[0089] Moreover, in the present technical solution, a plurality of
threaded holes 318 may be set in the primary panel 311, so that a
circuit board 110 can be installed to the heat sink 200 by screws
and, for example, the installation holes 140 shown in FIG. 1.
Preferably, for example, as shown in FIG. 2, a plurality of convex
columns are formed on the primary panel 311, and the threaded holes
318 are formed in the convex columns. The convex columns can
provide support for the circuit board 110, thereby achieving stable
threaded joint.
[0090] In the prior art, the convex plate and the bracket are
integrally formed by, for example, die-casting, therefore, it is
necessary to separately design the integrally formed convex plate
and bracket, and the mold used for die-casting, for each circuit
board, which results in a long development cycle and high cost.
[0091] The method of manufacturing a multi-purpose heat sink 200
provided by the present disclosure may shorten the R & D and
manufacturing cycle. Compared with developing and manufacturing a
brand new heat sink, in the present disclosure, a common platform
part 300 can be used and only additional parts 400 need to be
developed and manufactured, so that the entire R & D and
manufacturing cycle can be greatly shortened.
[0092] Cost savings can be achieved through high-volume production
of the platform parts 300. In the prior art, a large area is uneven
due to a plurality of convex plates, while in the present
disclosure, the primary panel 311 of the bracket 310 of the
platform part 300 has a large-area flat surface. Therefore, whether
by stamping or die-casting, the bracket 310 can be produced more
simply and with higher accuracy.
[0093] Since the platform part 300 is universal and the production
volume thereof is large, manufactures can improve the quality to
make the final heat sinks more stable.
[0094] It should be understood that, while the multi-purpose heat
sink of the present disclosure is described above, the
manufacturing method of the multi-purpose heat sink of the present
invention is also described. In addition to the above-mentioned
heat sink, the present disclosure also provides a board card of the
above-mentioned heat sink and a corresponding circuit board
assembly. The platform part 300, that is, the multi-purpose heat
sink platform, can also be sold separately for customers to further
manufacture heat sinks. Therefore, a multi-purpose heat sink
platform is also one of the subjects of the present disclosure.
[0095] It should be understood that the above-mentioned contacting
or direct contacting between the convex plate and the heat
dissipation source 120, and the contacting or direct contacting
between the heat conducting plate 360 and the heat dissipation
source 130 include: setting heat-conducting medium such as silicone
grease between the convex plates and the heat dissipation sources
120, and between the heat conducting plate 360 and the heat
dissipation source 130.
[0096] It should be understood that although the platform part 300
described above may include the heat fins 340, 314, 315, the heat
pipe 350, and the heat conducting plate 360, they are merely
examples of the heat dissipation components of the present
disclosure. The heat dissipation components in the present
disclosure may include, but are not limited to, one or more of a
heat sink, a heat pipe, a heat conducting plate, and the like. The
heat dissipation components in the present disclosure may also have
other types, for example, the heat dissipation components may be
flowing or non-flowing refrigerant (such as refrigerant liquid) and
a heat dissipation component for containing the container of the
refrigerant.
[0097] It should be understood that the heat pipe 350 may be used
not only as part of the platform part 300 but also as part of the
additional parts 400. When the heat pipe 350 is used as part of the
additional parts 400, the heat pipe 350 may be set on the front
side of the primary panel 311.
[0098] It should be understood that the above-mentioned embodiments
are merely exemplary and are not intended to limit the present
disclosure. Those skilled in the art can make various
transformations and changes to the above embodiments under the
guidance of the present disclosure without departing from the scope
of the present invention.
* * * * *