U.S. patent application number 16/714681 was filed with the patent office on 2020-11-19 for heat dissipation device and board card.
The applicant listed for this patent is Cambricon Technologies Corporation Limited. Invention is credited to Deheng CHEN, Shuai CHEN, Jun HE, Kun HE, Huijun LAN, Kai YE, Zhihang ZHANG, Chongxing ZHU.
Application Number | 20200363135 16/714681 |
Document ID | / |
Family ID | 1000004700667 |
Filed Date | 2020-11-19 |
United States Patent
Application |
20200363135 |
Kind Code |
A1 |
HE; Kun ; et al. |
November 19, 2020 |
HEAT DISSIPATION DEVICE AND BOARD CARD
Abstract
The present disclosure provides a heat dissipation device and a
board card. The heat dissipation device includes a fin group
provided with a plurality of heat dissipation fins, and a heat pipe
group provided with at least one heat pipe. The fin group is wholly
located on one side of the heat pipe group in a first direction.
The heat dissipation device and the board card have high heat
dissipation efficiency.
Inventors: |
HE; Kun; (Beijing, CN)
; LAN; Huijun; (Beijing, CN) ; ZHU; Chongxing;
(Beijing, CN) ; HE; Jun; (Beijing, CN) ;
ZHANG; Zhihang; (Beijing, CN) ; YE; Kai;
(Beijing, CN) ; CHEN; Deheng; (Beijing, CN)
; CHEN; Shuai; (Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Cambricon Technologies Corporation Limited |
Beijing |
|
CN |
|
|
Family ID: |
1000004700667 |
Appl. No.: |
16/714681 |
Filed: |
December 13, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 2215/04 20130101;
F28D 15/0275 20130101; F28D 2021/0029 20130101; F28F 3/12
20130101 |
International
Class: |
F28D 15/02 20060101
F28D015/02; F28F 3/12 20060101 F28F003/12 |
Foreign Application Data
Date |
Code |
Application Number |
May 15, 2019 |
CN |
201910406766.2 |
Claims
1. A heat dissipation device, comprising: a fin group including a
plurality of heat dissipation fins that form a whole structure; and
a heat pipe group including at least one heat pipe, wherein the fin
group is wholly located on one side of the heat pipe group in a
first direction, the fin group contacts the heat pipe group in the
first direction, the heat dissipation fins include a first heat
dissipation fin that contacts the heat pipe in a second direction
so as to locate the heat pipe in the second direction.
2. The heat dissipation device of claim 1, wherein the heat pipe
group includes a plurality of heat pipes that are arranged
parallelly in the second direction to form the heat pipe group.
3. The heat dissipation device of claim 1, wherein the plurality of
heat dissipation fins are arranged parallelly to form the fin
group.
4. The heat dissipation device of claim 1, wherein the first heat
dissipation fin includes a first fin body and a first fin inner
edgefold, wherein the first fin body contacts the heat pipe in the
second direction, the first fin inner edgefold protrudes angularly
from the first fin body, and the first fin inner edgefold contacts
the heat pipe on one side of the heat pipe in the first
direction.
5. The heat dissipation device of claim 4, wherein the first fin
inner edgefold is formed on part of the first heat dissipation fin
in a length direction of the heat pipe.
6. The heat dissipation device of claim 4, wherein the first fin
inner edgefold contacts adjacent heat dissipation fins in the fin
group.
7. The heat dissipation device of claim 4, wherein the first heat
dissipation fin further includes a first fin outer edgefold,
wherein the first fin outer edgefold and the first fin inner
edgefold are located at two ends of the first fin body in the first
direction.
8. The heat dissipation device of claim 1, wherein the heat
dissipation fins further include a second heat dissipation fin,
wherein the second heat dissipation fin and the first heat
dissipation fin form a whole structure, and the second heat
dissipation fin contacts the heat pipes on one side of the heat
pipe in the first direction.
9. The heat dissipation device of claim 8, wherein the second heat
dissipation fin includes a second fin body and a second fin inner
edgefold, wherein the second fin inner edgefold is bent from the
second fin body and contacts the heat pipe in the first
direction.
10. (canceled)
11. The heat dissipation device of claim 9, wherein the second fin
inner edgefold contacts adjacent heat dissipation fins in the fin
group.
12. The heat dissipation device of claim 9, wherein the second heat
dissipation fin further includes a second fin outer edgefold, the
second fin outer edgefold and the second fin inner edgefold are
located at two ends of the second fin body in the first
direction.
13. The heat dissipation device of claim 1, wherein the heat pipes
is a flattening heat pipes, and the flattening direction of the
flattening heat pipes is the first direction.
14. The heat dissipation device of claim 1, wherein the heat
dissipation device further includes a metal heat dissipation plate,
wherein the metal heat dissipation plate is located on the other
side of the heat pipe group in the first direction, and the metal
heat dissipation plate contacts the heat pipes.
15. The heat dissipation device of claim 13, wherein the heat
dissipation fins, the heat pipe group and the metal heat
dissipation plate are welded together by reflow soldering.
Description
TECHNICAL FIELD
[0001] The present disclosure relates to electronic products, and
specifically to a heat dissipation device and a board card.
BACKGROUND
[0002] In recent years, breakthroughs of artificial intelligence
have brought dramatic changes to the information industry.
Accelerator cards based on ASIC (Application Specific Integrated
Circuit) chips and FPGA (Field-Programmable Gate Array) chips have
increased the speed of data collection, data processing and
classification forecasting and have reduced the computing time by
orders of magnitude through artificial intelligence algorithms and,
especially, through deep learning algorithms.
[0003] This requires an increase in hardware computing power,
which, however, may cause an increase in the power consumption of a
board card, and consequently an increase in the heat generated by
the board card. It is urgent to solve the problem of board card
heat dissipation.
[0004] Existing heat dissipation devices dissipate heat mainly by
heat dissipation fins. In the use of the heat dissipation fins, the
contact surface between an electronic element and the heat
dissipation fins is generally coated with thermally conductive
silicone grease, which enables the heat emitted by the electronic
element to be transferred effectively to the heat dissipation fins
and then dispersed in the ambient air through the heat dissipation
fins. However, such heat dissipation device has low heat
dissipation efficiency, and it is hard to meet the requirement of
heat dissipation of the board card that causes large power
consumption.
SUMMARY
[0005] In view of this, the present disclosure provides a heat
dissipation device and a board card, which have higher heat
dissipation efficiency. Moreover, the heat dissipation device can
do self-localization and thus has high assembling efficiency.
[0006] The present disclosure provides a heat dissipation device
which may include:
[0007] a fin group including a plurality of heat dissipation fins
that form a whole structure; and
[0008] a heat pipe group including at least one heat pipe,
[0009] where the fin group may be wholly located on one side of the
heat pipe group in a first direction, the fin group may contact the
heat pipe group in the first direction, the heat dissipation fins
may include a first heat dissipation fin that contacts the heat
pipe in a second direction so as to localize the heat pipe in the
second direction.
[0010] Second embodiment: in the first embodiment, the heat pipe
group may include a plurality of heat pipes that are arranged
parallelly in the second direction to form the heat pipe group.
[0011] Third embodiment: in the first or second embodiment, the
plurality of heat dissipation fins may be arranged parallelly to
form the fin group.
[0012] Fourth embodiment: in one of the first to third embodiments,
the first heat dissipation fin may include a first fin body and a
first fin inner edgefold. The first fin body may contact the heat
pipe(s) in the second direction, the first fin inner edgefold may
protrude angularly from the first fin body, and the first fin inner
edgefold may contact the heat pipe(s) on one side of the heat
pipe(s) in the first direction.
[0013] Fifth embodiment: in the fourth embodiment, the first fin
inner edgefold may be formed on part of the first heat dissipation
fin in a length direction of the heat pipe(s).
[0014] Six embodiment: in the four or fifth embodiment, the first
fin inner edgefold may contact adjacent heat dissipation fins of
the fin group.
[0015] Seventh embodiment: in one of the fourth to sixth
embodiments, the first heat dissipation fin may further include a
first fin outer edgefold. The first fin outer edgefold and the
first fin inner edgefold may be located at two ends of the first
fin body in the first direction.
[0016] Eighth embodiment: in one of the first to seventh
embodiments, the heat dissipation fins may further include a second
heat dissipation fin. The second heat dissipation fin and the first
heat dissipation fin may form a whole structure, and the second
heat dissipation fin may contact the heat pipe(s) on one side of
the heat pipe(s) in the first direction.
[0017] Ninth embodiment: in the eighth embodiment, the second heat
dissipation fin may include a second fin body and a second fin
inner edgefold. The second fin inner edgefold may be bent from the
second fin body and may contact the heat pipe(s) in the first
direction.
[0018] Tenth embodiment: in the ninth embodiment, the second fin
inner edgefold may contact adjacent heat dissipation fins in the
fin group.
[0019] Eleventh embodiment: in the ninth or tenth embodiment, the
second heat dissipation fin may further include a second fin outer
edgefold. The second fin outer edgefold and the second fin inner
edgefold may be located at two ends of the second fin body in the
first direction.
[0020] Twelfth embodiment: in one of the first to eleventh
embodiments, the heat pipe(s) may be a flattening heat pipe(s), and
the flattening direction of the flattening heat pipe(s) may be the
first direction.
[0021] Thirteenth embodiment: in one of the first to twelfth
embodiments, the heat dissipation device may further include a
metal heat dissipation plate. The metal heat dissipation plate may
be located on the other side of the heat pipe group in the first
direction, and the metal heat dissipation plate may contact the
heat pipe(s).
[0022] Fourteenth embodiment: in the thirteenth embodiment, the
heat dissipation fins, the heat pipe group and the metal heat
dissipation plate may be welded together by reflow soldering.
[0023] The present disclosure further provides a board card which
may include the heat dissipation device in any one of the above
embodiments.
[0024] The heat dissipation device and the board card of the
present disclosure may have the following technical effects:
[0025] in the heat dissipation device of the present disclosure,
the heat pipe(s) may receive heat and distribute the heat rapidly,
and transfer the heat to the fin group. The fin group may have
large heat dissipation area and thus can dissipate the heat into
the air rapidly. In assembling of the heat dissipation device,
relative positions of the first heat dissipation fin and the heat
pipe(s) can be designed properly to obtain expected locating
effect. In this way, the locating fixtures may be saved, and the
assembling efficiency may be improved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] FIG. 1 is a side view of a board card of the present
disclosure according to an embodiment, showing that a heat
dissipation device, a chip, and a printed circuit board (PCB) are
installed together.
[0027] FIG. 2 is a three-dimensional structure diagram of a fin
group of the heat dissipation device as shown in FIG. 1.
[0028] FIG. 3 is a three-dimensional structure diagram of the fin
group from another angle of viewpoint of the heat dissipation
device as shown in FIG. 1.
[0029] FIG. 4 is a three-dimensional structure diagram of a first
heat dissipation fin of the heat dissipation device as shown in
FIG. 1.
[0030] FIG. 5 is a three-dimensional structure diagram of a second
heat dissipation fin of the heat dissipation device as shown in
FIG. 1.
[0031] FIG. 6 is a three-dimensional structure diagram of a heat
pipe of the heat dissipation device as shown in FIG. 1.
[0032] FIG. 7 is a three-dimensional structure diagram of a first
heat dissipation fin of a board card according to another
embodiment.
[0033] FIG. 8 is a three-dimensional structure diagram of a first
heat dissipation fin of a board card according to another
embodiment.
DESCRIPTION OF REFERENCE SIGNS
[0034] 1 PCB;
[0035] 2 chip;
[0036] 3 screw;
[0037] 9 heat dissipation device, 90 fin group, 910 second heat
dissipation fin, 911 second fin body, 912 second fin inner
edgefold, 913 second fin outer edgefold, 920 first heat dissipation
fin, 921 first fin body, 9211 first body portion, 9212 second body
portion, 922 first fin inner edgefold, 923 first fin outer
edgefold, 95 metal heat dissipation plate, 960 heat pipe group, 96
heat pipe, 961 main pipe wall, 962 side pipe wall;
[0038] T thickness direction, L layout direction.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0039] The exemplary embodiments of the present disclosure will be
described referring to the drawings. It should be understood that
the description is intended only to teach a person skilled in the
art how the present disclosure is implemented but is not intended
to show all practicable means of the present disclosure or to limit
the scope of the present disclosure.
[0040] The present disclosure provides a heat dissipation device
and a board card having the heat dissipation device. The heat
dissipation device may be installed in the board card to release
the heat generated by a heat-generating device (such as a chip) on
the board card.
[0041] The heat dissipation device can facilitate heat pipe
self-localization in a predetermined direction, thus requiring no
special locating fixtures, simplifying the welding procedures, and
increasing the contact area between a heat dissipation fin and a
heat pipe. In this way, the heat dissipation efficiency may be
improved.
[0042] The technical solutions of the present disclosure will be
detailedly described below.
[0043] As shown in FIG. 1 to FIG. 3, the heat dissipation device 9
may include a fin group 90, a heat pipe group 960, and a metal
dissipation plate 95 that are in contact successively. The heat
pipe group 960 may include a plurality of heat pipes 96 arranged in
parallel, the fin group 90 may include a plurality of heat
dissipation fins arranged in parallel, and a layout direction L (a
second direction) of the plurality of heat pipes 96 is the same as
the layout direction L of the plurality of heat dissipation fins.
The plurality of heat pipes 96 may extend along a straight line,
the heat dissipation fins as a whole may extend in a plane, and the
extension direction of plurality of the heat pipes 96 may be
parallel to the plane where the plurality of heat dissipation fins
are located.
[0044] It should be emphasized that in other embodiments, the heat
dissipation device 9 may not include the metal dissipation plate
95.
[0045] In the extension direction of the plurality of heat pipes
96, the plurality of heat pipes 96 and the plurality of heat
dissipation fins may have the same length. The plurality of heat
pipes 96 may have a high heat transfer efficiency from one end of
the extension direction to the other end. This may help to rapidly
transfer heat from one end of each of the plurality of the heat
dissipation fins to the other end.
[0046] In the present disclosure, the plurality of heat pipes 96
may be flattening pipes, and a flattening direction of the
plurality of heat pipes 96 may be a thickness direction T (a first
direction) of the plurality of heat pipes 96. The fin group 90, the
heat pipe group 960, and the metal heat dissipation plate 95 may be
arranged in the thickness direction T of the plurality of heat
pipes 96. In this way, the heat can be transferred from the metal
heat dissipation plate 95 to the heat pipe group 960 and then to
the fin group 90 in the thickness direction T of the plurality of
heat pipes 96.
[0047] It should be understood that "one side of the heat pipe
group 960" and "one side of the heat pipe(s) 96" refer to one side
of the heat pipe(s) 96 in the thickness direction T, and "the other
side of the heat pipe group 960" and "the other side of the heat
pipe(s) 96" refer to the other side of the heat pipe(s) 96 in the
thickness direction T.
[0048] As shown in FIG. 1, the fin group 90 may be located on one
side of the heat pipe group 960, and the metal heat dissipation
plate 95 may be located on the other side of the heat pipe group
960. The metal heat dissipation plate 95 may be located on one side
of a chip 2, and PCB1 may be located on other side of the chip 2.
The chip 2, the metal heat dissipation plate 95, the heat pipe
group 960 and the fin group 90 may be in contact successively.
[0049] The plurality of heat pipes 96 may be only arranged on a
single side of the fin group 90 in the thickness direction T, thus
reducing the installation space of the heat pipe group 90, enabling
the heat dissipation device to have a small size in the thickness
direction T, and facilitating miniaturization of products.
[0050] As shown in FIG. 1 and FIG. 6, each of the plurality of heat
pipes 96 has an oblong-shaped cross section. The thickness
direction T of the plurality of heat pipes 96 is the direction
where in a minor axis of the cross section is located, and the
layout direction L of the plurality of heat pipes 96 is the
direction where a major axis is located.
[0051] Each of the plurality of heat pipes 96 is a flattening heat
pipe and thus includes main pipe walls 961 and side pipe walls 962.
The main pipe walls 961 refer to pipe walls on one side and the
other side of the plurality of heat pipes 96, and the side pipe
walls 962 are connected to the two main pipe walls (an upper pipe
wall and a lower pipe wall) 961. One heat pipe 96 may have two main
pipe walls 961 and two side pipe walls 962, and the two main pipe
walls 961 and the two side pipe walls 962 may extend along the
length direction of the heat pipe 96.
[0052] The main pipe walls 961 may have a plane shape, and the side
pipe walls 962 may have an arcuate shape. For example, the
plurality of heat pipes 96 may be shaped by pressing or flattening
in opposite directions from two sides of an axis of a cylindrical
heat pipe. In this way, the main pipe walls 961 of a plane shape
are formed on two opposite sides that are perpendicular to the
axis.
[0053] The main pipe wall 961 on the other side of the plurality of
heat pipes 96 may contact a surface of the metal heat dissipation
plate 95. Since the plurality of heat pipes 96 and the metal heat
dissipation plate 95 have a large contact area, the heat of the
metal heat dissipation plate 95 can be quickly transferred to the
plurality of heat pipes 96.
[0054] As shown in FIGS. 1 to 3, a plurality of second heat
dissipation fins 910 and a plurality of first heat dissipation fins
920 may be connected together and form the fin group 90.
[0055] As shown in FIG. 4, a first heat dissipation fin 920 may
include a first fin body 921, a first fin inner edgefold 922, and a
first fin outer edgefold 923. The first fin body 921 may extend in
a plane perpendicular to the layout direction L of the plurality of
heat dissipation fins (parallel to the thickness direction T). The
first fin inner edgefold 922 and the first fin outer edgefold 923
may be located at two ends of the first heat dissipation fin 920 in
the thickness direction T of the heat pipes 96. Specifically, the
first fin inner edgefold 922 and the first fin outer edgefold 923
may extend in a direction perpendicular to the first fin body 921.
The first fin body 921 may include a first body portion 9211 and a
second body portion 9212, and the second body portion 9212 may
extend in the thickness direction T of the plurality of heat pipes
96 from the first body portion 9211 to the plurality of heat pipes
96.
[0056] As shown in FIG. 5, a second heat dissipation fin 910 may
have a second fin body 911, a second fin inner edgefold 912, and a
second fin outer edgefold 913.
[0057] The second fin body 911 may extend in the plane
perpendicular to the layout direction L of the plurality of heat
dissipation fins (parallel to the thickness direction T). The
second fin inner edgefold 912 and the second fin outer edgefold 913
may be bent from two opposite edges of the second fin body 911 in
the thickness direction T. Specifically, the second fin inner
edgefold 912 and the second fin outer edgefold 913 may extend in a
direction perpendicular to the second fin body 911.
[0058] The plurality of second heat dissipation fins 910 may
contact sides of the plurality of heat pipes 96 in the thickness
direction T so as to receive heat from the plurality of heat pipes
96. Specifically, a plurality of second fin inner edgefolds 912 may
wholly contact the sides of the plurality of heat pipes 96 in the
thickness direction T, or may partly contact the sides of the
plurality of heat pipes 96 in the thickness direction T.
[0059] In the embodiment, the second fin inner edgefolds 912 of the
plurality of second heat dissipation fins 910 may contact surfaces
of the plurality of heat pipes 96. It should be understood that in
some embodiments, the second fin inner edgefold 912 of only one of
the second heat dissipation fins 910 may contact the surface of the
plurality of heat pipes 96.
[0060] Solder paste may be coated between the fin group 90 and the
heat pipe group 960 and coated between the heat pipe group 960 and
the metal heat dissipation plate 95. The fin group 90, the heat
pipe group 960 and the metal heat dissipation plate 95 may be
welded together by reflow soldering.
[0061] Molten solder paste can be filled in a gap between the side
pipe walls 962 of two adjacent heat pipes 96. For connection of the
first heat dissipation fin 920 and the heat pipes 96, the solder
paste may contact both of the second body portion 9212 and the side
pipe walls 962.
[0062] As shown in FIG. 2 and FIG. 3, the plurality of second heat
dissipation fins 910 and one first heat dissipation fin 920 may be
arranged alternatively and connected to form the fin group 90. The
first fin inner edgefold 922 and the first fin outer edgefold 923
of the first heat dissipation fin 920 between two heat dissipation
fins may contact adjacent heat dissipation fins, such as second fin
bodies 911 of adjacent second heat dissipation fins 910, or first
fin bodies 921 of adjacent first heat dissipation fins 920.
[0063] The first fin inner edgefold 922 may contact a side of the
plurality of heat pipes 96 in the thickness direction T so that it
can receive heat of the plurality of heat pipes 96.
[0064] The first fin inner edgefold 922 may be connected with the
second fin inner edgefold 912 to form a plane. The first fin inner
edgefold 922 and the second fin inner edgefold 912 may both contact
the main pipe wall 961 on one side of the plurality of heat pipes
96.
[0065] In this way, the heat dissipation fins can contact the sides
of the heat pipes 96 in the thickness direction T in a
surface-to-surface contact manner. Since the heat pipes 96 and the
heat dissipation fins have a large contact area, the heat absorbed
by the heat pipes 96 can be quickly transferred to the heat
dissipation fins.
[0066] As shown in FIG. 1 and FIG. 4, in the thickness direction T
of the heat pipes 96, the first body portion 9211 of the first heat
dissipation fin 920 is located within a span of the second heat
dissipation fin 910, and the second body portion 9212 of the first
heat dissipation fin 920 is located within a span of the heat pipes
96.
[0067] It should be understood that a span of a component in a
direction refers to space that the component spans in the
direction.
[0068] The heat dissipation device 9 may include some first heat
dissipation fins 920, each of which may be located between two
adjacent second heat dissipation fins 910. The first body portion
9211 may be located between two adjacent second fin bodies 911, and
the second body portion 9212 may be located between two adjacent
heat pipes 96.
[0069] Two opposite main surfaces of each of the second body
portions 9212 of these first heat dissipation fins 920 may contact
side pipe walls 962 of two adjacent heat pipes 96. In this way, the
heat pipes 96 may transfer heat to the heat dissipation fins not
only in the thickness direction T but also in the layout direction
L by the second body portions 9212, thus increasing the contact
area of heat transfer of the heat dissipation device 9. In
addition, the heat dissipation device 9 can facilitate
self-localization of the heat pipes 96 in the layout direction L by
the second body portions 9212 of the first heat dissipation fins
920, thus requiring no locating fixtures and simplifying
installation procedures before welding.
[0070] It should be understood that plate-shaped main surfaces
refer to surfaces perpendicular to the thickness direction.
[0071] In some embodiments, the number of and positional
relationship of the first heat dissipation fins 920 and the second
heat dissipation fins 910 may be adjusted according to parameters
of the heat pipes 96, such as number, size and space.
[0072] For example, the number of the first heat dissipation fins
920 and the second heat dissipation fins 910 may be set flexibly.
For example, one second heat dissipation fin 910 and one first heat
dissipation fin 920 may be arranged alternatively, or one second
heat dissipation fin 910 and a plurality of first heat dissipation
fins 920 may be arranged alternatively, or a plurality of second
heat dissipation fins 910 and a plurality of first heat dissipation
fins 920 may be arranged alternatively, or only first heat
dissipation fins 920 may be arranged but no second heat dissipation
fin 910 is arranged.
[0073] The heat dissipation device 9 may further include some first
heat dissipation fins 920 that contact the side pipe walls 962 of
the heat pipes 96 at one end and/or the other end of the heat pipe
group 960, where only one main surface of each of the second body
portions 9212 contacts the side pipe walls 962 of the heat pipes 96
at one end and/or the other end of the heat pipe group 960.
[0074] The number of such first heat dissipation fins 920 may be
two, so that the first heat dissipation fins 920 can contact two
heat pipes 96 at both ends of the heat pipe group 960.
[0075] Such first heat dissipation fins 920 may be heat dissipation
fins located at the outermost end of fin group 90 in the layout
direction L. In other words, these first heat dissipation fins 920
may be at the outermost end in the layout direction L, and the fin
group 90 may not include any other heat dissipation fins. In other
words, the heat pipe group 960 and the fin group 90 have roughly
the same length.
[0076] In this way, an installation space of the heat pipes 96 may
be formed, in the layout direction L, between the second body
portions 9212 of every two first heat dissipation fins 920. The
heat pipes 96 can be installed in the installation space and carry
out self-localization. In addition, this can avoid waste of the
heat dissipation fins and the heat pipes 96.
[0077] One first heat dissipation fin 920 may have two second body
portions 9212, and the two second body portions 9212 may be located
at both ends of the first fin body 921 in the length direction of
the heat pipes 96. The first fin inner edgefold 922 may be formed
on part of the first heat dissipation fin 920 in the length
direction of the heat pipes 96. For example, the first fin inner
edgefold 922 may be formed on the two second body portions 9212 in
the length direction of the heat pipes 96.
[0078] Specifically, in this embodiment, the first fin inner
edgefold 922 may extend from one second body portion 9212 to the
other second body portion 9212 and contact the surface of the main
pipe wall 961 on one side of the heat pipes 96. Or, as shown in
FIG. 7, in some embodiments, the first fin inner edgefold 922 may
extend between part of the two second body portions 9212.
[0079] In some embodiments, a first heat dissipation fin 920 may
have three or more second body portions 9212, and the first fin
inner edgefold 922 may be formed between every two second body
portions 9212; or, a first heat dissipation fin 920 may have a
second body portion 9212.
[0080] The plurality of heat dissipation fins may form the fin
group 90 in several ways, such as fastening (by providing a
fastening portion on each of the heat dissipation fins), welding,
or the like, that are commonly seen in the prior art.
[0081] All of cross sections of the second heat dissipation fin 910
with the fastening portion removed have the same shape, such as a
"U" shape or an "L" shape.
[0082] In the heat dissipation device 9 provided in the present
disclosure, heat of the chip 2 is transferred to the metal heat
dissipation plate 95. Since the metal heat dissipation plate 95 has
a high thermal conductivity, the heat can be quickly transferred to
the heat pipes 96. After the heat pipes 96 receive the heat from
the metal heat dissipation plate 95, the heat is distributed
rapidly and transferred to the fin group 90. The fin group 90 have
a large heat dissipation area, so the heat can be quickly
dissipated into the air.
[0083] In addition to distributing the heat, the metal heat
dissipation plate 95 can support the heat pipes 96 and heat
dissipation fins and ensure flatness of the contact area between
the heat dissipation device 9 and the chip 2.
[0084] The first heat dissipation fins 920 can contact the heat
pipes 96 in the layout direction L so as to locate the heat pipes.
Therefore, the heat dissipation device 9 may be assembled by just
abutting the heat pipes 96 on the second body portions 9212 of the
first heat dissipation fins 920. In this way, no locating fixtures
is required, and the assembling efficiency can be greatly
improved.
[0085] The heat dissipation fins installed between two heat pipes
96 may contact the heat pipes 96 through part of the bodies of the
fins extending along the thickness direction T of the heat pipes
96, thereby reducing the number of heat dissipation fins that do
not contact the heat pipes 96, or avoiding the case that the heat
dissipation fins do not contact the heat pipes 96. Therefore,
inefficient heat dissipation on both sides of each of the heat
pipes 96 can be reduced or avoided, the contact area between the
heat pipes 96 and the heat dissipation fins can be increased, and
the heat transfer efficiency of the heat dissipation device 9 can
be improved.
[0086] The heat dissipation efficiency of the heat dissipation
device may be higher if the first fin inner edgefold 922 and the
second body portions 9212 of each of the first heat dissipation
fins 920 all contact the heat pipes 96. In other words, the heat
dissipation efficiency of the heat dissipation device may be higher
if the main pipe wall 961 and the side pipe walls 962 of each of
the heat pipes 96 all contact the heat dissipation fins.
[0087] In the above embodiments, the heat dissipation fins of the
fin group 90 are arranged separately, so the heat dissipation fins
can be added or removed to form fin groups 90 of different sizes
for adapting to board cards having varied heat dissipation
requirements.
[0088] It should be understood that except for part of the bodies
(the second body portions 9212) of the first dissipation fins 920
that contact the heat pipes 96 in the layout direction L, in the
fin group 90, the rest of parts of the heat dissipation fins may be
arranged on one side of the fin group 960 in the thickness
direction T. Thus the fin group 90 can wholly contact the heat pipe
group 960 in the thickness direction T.
[0089] It should be understood that the present disclosure takes
the thickness direction T as the first direction and takes the
layout direction L as the second direction. However, the first
direction and the second direction may vary in other cases within
the idea of the disclosure.
[0090] As shown in FIG. 1, the board card provided in the present
disclosure may include the above-mentioned heat dissipation device
9. The heat dissipation device 9 can be installed on PCB 1 by
screwing. For example, screws 3 may be connected between the PCB 1
and the metal heat dissipation plate 95 to ensure close contact
between the heat dissipation device and the PCB 1.
[0091] The chip provided in the present disclosure may be an AI
accelerating card, a sound card, a display card, a graphics card,
or the like.
[0092] It should be understood that the embodiments are only
examples, but are not limited to the present disclosure. A person
skilled in the art may make various modifications or variations
within the range of the present disclosure.
[0093] (1) The metal heat dissipation plate 95 may be an aluminum
plate or a copper plate.
[0094] (2) The heat pipes 96 may have an oblong cross section after
being flattened. The "oblong" shape mentioned in the present
disclosure may include a standard oblong shape and a shape similar
to the standard oblong shape as long as planar main pipe walls 961
are formed on two opposite sides of the heat pipes 96 perpendicular
to the length direction.
[0095] (3) It should understood that the "plurality" in the present
disclosure refers to at least two, including two and more than
two.
[0096] (4) In some embodiments, only one heat pipe may be provided,
or a U-shaped heat pipe may be provided.
[0097] (5) In some embodiments, the fin group 90 may be a whole
structure. For example, the fin group 90 may include a substrate
and a plurality of heat dissipation fins extending along a
direction perpendicular to the substrate, the plurality of heat
dissipation fins and the substrate may be integrally connected, and
the plurality of heat dissipation fins may contact each other by
the substrate.
[0098] (6) In some embodiments, the heat dissipation 9 and the PCB
1 may be indirectly connected by an adaptor. The adaptor may be
fixed on the heat dissipation device 9 by welding or the like, and
connected to the PCB 1, for example, by the screws 3.
[0099] (7) In some embodiments, the first heat dissipation fin 920
may not include the first fin inner edgefold 922, and the complete
second body portion 9212 may extend from the first body portion
9211; or as shown in FIG. 8, the first fin inner edgefold 922 may
be formed on the complete first heat dissipation fin 920 in the
length direction of the plurality of heat pipes 96.
[0100] (8) In some embodiments, the plurality of heat dissipation
fins may not have outer edgefolds.
[0101] (9) The "contact" in the present disclosure may be direct
contact or indirect contact. The indirect contact may include
contact through heat conduction materials, such as heat conduction
silicone grease, heat conduction gel, or the like.
[0102] (10) It should be understood that the first fin inner
edgefold 922 may protrude angularly from the first fin body 921.
The first fin inner edgefold 922 may be perpendicular or not
perpendicular to the first fin body 921; the first fin inner
edgefold 922 and the first fin body 921 may be integrally connected
or separately formed.
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