U.S. patent application number 16/599312 was filed with the patent office on 2020-10-22 for chip transferring machine.
The applicant listed for this patent is ASTI GLOBAL INC., TAIWAN. Invention is credited to CHIEN-SHOU LIAO.
Application Number | 20200335374 16/599312 |
Document ID | / |
Family ID | 1000004409513 |
Filed Date | 2020-10-22 |
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United States Patent
Application |
20200335374 |
Kind Code |
A1 |
LIAO; CHIEN-SHOU |
October 22, 2020 |
CHIP TRANSFERRING MACHINE
Abstract
A chip transferring machine includes a chip carrier, a chip
transferring module, and a chip carrier substrate. The chip carrier
carries a plurality of chips. The chip transferring module includes
at least one conveyor belt having an adhesive surface. The chip
carrier substrate carries the plurality of chips. The chip carrier,
the chip transferring module, and the chip carrier substrate are
disposed on a same production line, and the chip carrier and the
chip carrier substrate are disposed under or above the adhesive
surface of the conveyor belt.
Inventors: |
LIAO; CHIEN-SHOU; (New
Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASTI GLOBAL INC., TAIWAN |
Taichung City |
|
TW |
|
|
Family ID: |
1000004409513 |
Appl. No.: |
16/599312 |
Filed: |
October 11, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/67333 20130101;
H01L 21/67706 20130101; B65G 47/91 20130101; H01L 21/6838 20130101;
H01L 21/6836 20130101; H01L 21/67736 20130101 |
International
Class: |
H01L 21/677 20060101
H01L021/677; H01L 21/683 20060101 H01L021/683; H01L 21/673 20060101
H01L021/673; B65G 47/91 20060101 B65G047/91 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 19, 2019 |
TW |
108113905 |
Claims
1. A chip transferring machine, comprising: a chip carrier carrying
a plurality of chips; a chip transferring module including at least
one conveyor belt having an adhesive surface; a chip carrier
substrate carrying the plurality of chips; and a laser generating
module and a vacuum suction module. wherein the laser generating
module and the vacuum suction module are disposed above or under
the conveyor belt, and a laser beam generated by the laser
generating module passes through the conveyor belt to project onto
a solder disposed on at least one of the chips. and the vacuum
suction module suctions a non-adhesive surface of the conveyor belt
to adjust the flatness of the conveyor belt: wherein the chip
carrier, the chip transferring module, and the chip carrier
substrate are disposed on a same production line, and the chip
carrier and the chip carrier substrate are both disposed under or
above the adhesive surface of the conveyor belt.
2. The chip transferring machine according to claim 1, further
comprising a thimble module disposed under the chip carrier,
wherein at least one of the chips disposed on the chip carrier is
transferred and disposed on the adhesive surface of the conveyor
belt by the thimble module abutting upwardly.
3. The chip transferring machine according to claim 2, further
comprising a push module disposed above the conveyor belt, wherein
the at least one of the chips adhered to the adhesive surface is
transferred and disposed on the chip carrier substrate by the push
module abutting downwardly.
4. The chip transferring machine according to claim 1, further
comprising a thimble module disposed above the chip carrier,
wherein at least one of the chips disposed on the chip carrier is
transferred and disposed on the adhesive surface of the conveyor
belt by the thimble module abutting downwardly.
5. The chip transferring machine according to claim 4, further
comprising a push module disposed under the conveyor belt, wherein
the at least one of the chips adhered to the adhesive surface is
transferred and disposed on the chip carrier substrate by the push
module abutting upwardly.
6. (canceled)
7. (canceled)
8. The chip transferring machine according to claim 1, wherein the
chip transferring module includes at least two rollers, and the
conveyor belt is transported by one of the rollers to another
roller, and the conveyor belt is a light transmissive single-sided
tape.
9. The chip transferring machine according to claim 1, wherein the
chip carrier includes a carrier adjustment mechanism and a carrier
film for carrying the chip, and the carrier film is disposed on the
carrier adjustment mechanism; wherein the chip carrier substrate
includes a carrier substrate adjustment mechanism and a circuit
substrate for carrying the chip, and the circuit substrate is
disposed on the carrier substrate adjustment mechanism.
10. A chip transferring machine comprising a chip carrier, a chip
transferring module, a chip carrier substrate. a laser generating
module and a vacuum suction module, wherein the chip transferring
module includes at least one conveyor belt having an adhesive
surface, and the chip carrier and the chip carrier substrate are
disposed under or above the adhesive surface of the conveyor belt,
and wherein the laser generating module and the vacuum suction
module are disposed above or under the conveyor belt, and a laser
beam generated by the laser generating module passes through the
conveyor belt to project onto a solder disposed on at least one
chip, and the vacuum suction module suctions a non-adhesive surface
of the conveyor belt to adjust the flatness of the conveyor belt.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATION
[0001] This application claims the benefit of priority to Taiwan
Patent Application No. 108113905, filed on Apr. 19, 2019. The
entire content of the above identified application is incorporated
herein by reference.
[0002] Some references, which may include patents, patent
applications and various publications, may be cited and discussed
in the description of this disclosure. The citation and/or
discussion of such references is provided merely to clarify the
description of the present disclosure and is not an admission that
any such reference is "prior art" to the disclosure described
herein. All references cited and discussed in this specification
are incorporated herein by reference in their entireties and to the
same extent as if each reference was individually incorporated by
reference.
FIELD OF THE DISCLOSURE
[0003] The present disclosure relates to a transferring machine,
and more particularly to a chip transferring machine.
BACKGROUND OF THE DISCLOSURE
[0004] Generally, when the prepared chip array is transferred to a
substrate or panel of different size, the time required for the
migration is long due to the complicated process involved.
[0005] Therefore, improving the efficiency and speed of chip
transferring through structural design or procedural improvement
has become one of the important issues to be solved in the
technical field of the present disclosure.
SUMMARY OF THE DISCLOSURE
[0006] In response to the above-referenced technical inadequacies,
the present disclosure provides a chip transferring machine.
[0007] In one aspect, the present disclosure provides a chip
transferring machine including: a chip carrier, a chip transferring
module, and a chip carrier substrate. The chip carrier carries a
plurality of chips. The chip transferring module includes at least
one conveyor belt having an adhesive surface. The chip carrier
substrate carries the plurality of chips. The chip carrier, the
chip transferring module, and the chip carrier substrate are
disposed on a same production line, and the chip carrier and the
chip carrier substrate are disposed under or above the adhesive
surface of the conveyor belt.
[0008] In one aspect, the present disclosure provides a chip
transfer machine including a chip carrier, a chip transferring
module, and a chip carrier substrate. The chip transferring module
includes at least one conveyor belt having an adhesive surface, and
the chip carrier and the chip carrier substrate is disposed under
or above the adhesive surface of the conveyor belt.
[0009] Therefore, one of the beneficial effects of the present
disclosure is that by the technical features of "the chip
transferring module including the at least one conveyor belt having
the adhesive surface" and "the chip carrier, the chip transferring
module, and the chip carrier substrate being disposed on the same
production line, and the chip carrier and the chip carrier
substrate being disposed under or above the adhesive surface of the
conveyor belt," the efficiency and speed of chip transferring can
be improved.
[0010] These and other aspects of the present disclosure will
become apparent from the following description of the embodiment
taken in conjunction with the following drawings and their
captions, although variations and modifications therein may be
affected without departing from the spirit and scope of the novel
concepts of the disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The present disclosure will become more fully understood
from the following detailed description and accompanying
drawings.
[0012] FIG. 1 is a structural schematic view of a chip transferring
machine according to a first embodiment of the present
disclosure.
[0013] FIG. 2 is a schematic diagram of an operation of a thimble
module of the chip transfer machine according to the first
embodiment of the present disclosure.
[0014] FIG. 3 is a schematic diagram of a state in which the chip
transferring machine transfers a chip to a chip carrier substrate
according to the first embodiment of the present disclosure.
[0015] FIG. 4 is a schematic diagram of an operation of a push
module of the chip transfer machine according to the first
embodiment of the present disclosure.
[0016] FIG. 5 is a schematic diagram showing a first state in a
chip transfer process of the chip transferring machine according to
the first embodiment of the present disclosure.
[0017] FIG. 6 is a schematic diagram showing a second state in the
chip transfer process of the chip transferring machine according to
the first embodiment of the present disclosure; wherein FIG. 6 and
FIG. 5 depict the same chip transfer process.
[0018] FIG. 7 is a structural schematic view of the chip
transferring machine according to the first embodiment of the
present disclosure.
[0019] FIG. 8 is a schematic diagram of an operation of the push
module and the laser generating module of the chip transfer machine
according to the first embodiment of the present disclosure.
[0020] FIG. 9 is a top view of the circuit substrate of the chip
transfer machine according to the first embodiment of the present
disclosure.
[0021] FIG. 10 is a structural schematic view of a chip
transferring machine according to a second embodiment of the
present disclosure.
[0022] FIG. 11 is a structural schematic view of the chip
transferring machine according to the second embodiment of the
present disclosure.
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0023] The present disclosure is more particularly described in the
following examples that are intended as illustrative only since
numerous modifications and variations therein will be apparent to
those skilled in the art. Like numbers in the drawings indicate
like components throughout the views. As used in the description
herein and throughout the claims that follow, unless the context
clearly dictates otherwise, the meaning of "a", "an", and "the"
includes plural reference, and the meaning of "in" includes "in"
and "on". Titles or subtitles can be used herein for the
convenience of a reader, which shall have no influence on the scope
of the present disclosure.
[0024] The terms used herein generally have their ordinary meanings
in the art. In the case of conflict, the present document,
including any definitions given herein, will prevail. The same
thing can be expressed in more than one way. Alternative language
and synonyms can be used for any term(s) discussed herein, and no
special significance is to be placed upon whether a term is
elaborated or discussed herein. A recital of one or more synonyms
does not exclude the use of other synonyms. The use of examples
anywhere in this specification including examples of any terms is
illustrative only, and in no way limits the scope and meaning of
the present disclosure or of any exemplified term. Likewise, the
present disclosure is not limited to various embodiments given
herein. Numbering terms such as "first", "second" or "third" can be
used to describe various components, signals or the like, which are
for distinguishing one component/signal from another one only, and
are not intended to, nor should be construed to impose any
substantive limitations on the components, signals or the like.
First Embodiment
[0025] Referring to FIG. 1 to FIG. 9, a first embodiment of the
present disclosure provides a chip transfer machine Z including a
chip carrier 1, a chip transferring module 2, and a chip carrier
substrate 3.
[0026] Firstly, as shown in FIG. 1, the chip carrier 1 may be
disposed under at least one conveyor belt 20 of the chip
transferring module 2 and correspond to an adhesive surface 20A of
the conveyor belt 20. For example, the chip carrier 1 can carry a
plurality of chips C, each of the chips C has at least one solder
Cl, and the solder Cl can be solder paste or other conductive
materials. Further, the chip carrier 1 may include a carrier
adjustment mechanism 10 and a carrier film 11 for carrying the chip
C, and the carrier film 11 is disposed on the carrier adjustment
mechanism 10. The carrier adjustment mechanism 10 can be an X-Y
table, but the present disclosure is not limited thereto. The
carrier film 11 can be a blue PVC film, but the present disclosure
is not limited thereto. The carrier adjustment mechanism 10 can be
fixed onto the carrier film 11 by suction or clamping, but the
present disclosure is not limited thereto. The carrier film 11 can
carry the plurality of chips C, and there is a spacing D1 between
the adjacent two chips C.
[0027] Next, as shown in FIG. 1, the chip transferring module 2
includes the conveyor belt 20 having the adhesive surface 20A, and
the conveyor belt 20 may be a light-transmitting single-sided tape,
but present disclosure is not limited thereto. Further, the chip
transferring module 2 may further include at least two rollers 21,
one end of the conveyor belt 20 may be connected to one of the
rollers 21, and the other end of the conveyor belt 20 may be
connected to the other roller 21. Therefore, in a process of
transferring and retracting the conveyor belt 20, the conveyor belt
20 can be transferred from one of the rollers 21 to the other
roller 21, and is transferred in only one direction, but the
present disclosure is not limited thereto.
[0028] Next, as shown in FIG. 1, the chip carrier substrate 3 can
be used to carry a plurality of chips C, and the chip carrier
substrate 3 can be disposed under the conveyor belt 20 of the chip
transferring module 2 and corresponds to the adverse surface 20A of
the conveyor belt 20. Further, the chip carrier substrate 3 may
include a carrier substrate adjustment mechanism 30 and a circuit
substrate 31 for carrying the chip C, and the circuit substrate 31
is disposed on the carrier substrate adjustment mechanism 30. The
carrier substrate adjustment mechanism 30 can be an X-Y table, but
the present disclosure is not limited thereto.
[0029] Accordingly, as shown in FIG. 1, the chip carrier 1, the
chip transferring module 2, and the chip carrier substrate 3 may be
disposed on a same production line, and the chip carrier 1 and the
chip carrier substrate 3 are disposed under the adhesive surface
20A of the conveyor belt 20. Therefore, the chip C on the chip
carrier 1 can be transferred to the chip carrier substrate 3 by the
conveyor belt 20.
[0030] Further, as shown in FIG. 1 to FIG. 3, the chip transfer
machine Z provided by the present disclosure may further include: a
thimble module 4 disposed under the chip carrier 1, and the at
least one chip C disposed on the chip carrier 1 is transferred by
adhesion of the thimble module 4 to the adhesive surface 20A of the
conveyor belt 20. For example, the thimble module 4 can be disposed
under the carrier film 11 of the chip carrier 1. The material of
the thimble module 4 can be a metal or plastic thimble, and a
portion of the thimble module 4 that abuts against the chip C can
be a sharp or blunt, but the present disclosure is not limited
thereto. Therefore, as shown in FIG. 2, the thimble module 4 can
pass through the carrier film 11, and the chip C corresponding to
the thimble module 4 can be abutted against the adhesive surface
20A of the conveyor belt 20, so that the chip C is attached to the
adhesive surface 20A by detaching from the carrier film 11.
[0031] Further, as shown in FIG. 1 to FIG. 3, the above-mentioned
process is repeated by the thimble module 4, and the remaining
chips C on the carrier film 11 are sequentially detached from the
carrier film 11 and attached to the adhesive surface 20A. Further,
the chip transfer machine Z can also horizontally offset the
thimble module 4 relative to the carrier film 11 by controlling the
thimble module 4, or the carrier film 11 can be horizontally offset
relative to the thimble module 4, so that the chip C is attached to
the adhesive surface 20A by the thimble module 4 sequentially or
randomly abutting the chip C on the carrier film 11. However, the
above-mentioned examples illustrate only one of the embodiments,
and the present disclosure is not limited thereto.
[0032] Further, as shown in FIG. 3 to FIG. 6, the chip transfer
machine Z provided by the present disclosure may further include: a
push module 5 disposed on at least one conveyor belt 20 and adhered
to at least one chip C on the adhesive surface 20A by the push
module 5 abutting downwardly. For example, as shown in FIG. 3 to
FIG. 6, the push module 5 may be disposed above the conveyor belt
20 and face a non-adhesive surface 20B. The push module 5 may be a
pillar of a metal or plastic material, but the present disclosure
is not limited thereto. Therefore, when the chip C is transferred
above the circuit substrate 31 through the adhesive surface 20A of
the conveyor belt 20, the chip C adhered to the adhesive surface
20A is transferred and disposed on the chip carrier substrate 31 by
the push module 5 abutting downwardly. In addition, by repeating
the above process through the push module 5, the remaining chips C
on the conveyor belt 20 can be transferred from the adhesive
surface 20A sequentially and then disposed on the circuit substrate
31. However, the above-mentioned examples illustrate only one of
the embodiments, and the present disclosure is not limited
thereto.
[0033] Finally, the circuit substrate 31 provided with the chips C
is subjected to a heating process so that the chips C are fixed by
the solder C1 and electrically connected to the circuit substrate
31. However, the above-mentioned examples illustrate only one of
the embodiments, and the present disclosure is not limited
thereto.
[0034] Further, as shown in FIG. 6 and FIG. 7, the chip transfer
machine Z provided by the present disclosure may further include: a
laser generating module 6 and a vacuum suction module 7. The laser
generating module 6 and the vacuum suction module 7 are disposed
above at least one conveyor belt 20, and a laser beam L generated
by the laser generating module 6 passes through at least one
conveyor belt 20 to project onto the solder Cl disposed on at least
one chip C. The vacuum suction module 7 suctions at least one
non-adhesive surface 20B of the conveyor belt 20 to adjust the
flatness of at least one conveyor belt 20. For example, as shown in
FIG. 6 and FIG. 7, the chip transfer machine Z of the present
disclosure can also be provided with the laser generating module 6
and the vacuum suction module 7 above the conveyor belt 20.
Therefore, after the chip C is transferred to the circuit substrate
31, the laser beam L can be projected toward the chip C through the
laser generating module 6, and the laser beam L is projected
through the conveyor belt 20 and projected on the solder C1
disposed on the chip C, so that the solder C1 is heated to be fixed
and electrically connected to the circuit substrate 31. In
addition, by suctioning the non-adhesive surface 20B of the
conveyor belt 20 through the vacuum suction module 7, the flatness
of the conveyor belt 20 can be maintained to avoid affecting the
flatness of the conveyor belt 20 while the push module 5 is
abutting downwardly against the conveyor belt 20 and the chip C, so
that the chip C cannot easily attach to the adhesive surface 20A,
and other manufacturing problems can be avoided.
[0035] In addition, as shown in FIG. 6 to FIG. 8, the laser
generating module 6 can also be operated together with the push
module 5. Further, the laser generating module 6 and the push
module 5 may be in the same axial direction, or a laser beam L
projection path of the laser generating module 6 can correspond to
the abutting surface of the push module 5. Therefore, when the push
module 5 abuts the chip C and the chip C is transferred to the
circuit substrate 31, the laser beam can be projected to the chip C
through the laser generating module 6, so that the chip C can be
fixed and electrically connected to the circuit substrate 31
through the solder C1.
[0036] Further, as shown in FIG. 1 and FIG. 6, the chip transfer
machine Z provided by the present disclosure can also be
horizontally offset from the circuit substrate 31 by controlling
the push module 5, or the carrier substrate adjustment mechanism 30
drives the circuit substrate 31 to perform the horizontal offset
relative to the push module 5, so that after the chip C is
transferred to the circuit substrate 31, the spacing D2 between the
two adjacent chips C may be greater than or less than the spacing
D1, but the present disclosure is not limited thereto, and the
spacing D2 may be equal to the spacing D1. Further, in the
above-mentioned method, the circuit substrate 31 having damaged
chips C can be repaired. For example, as shown in FIG. 1 to FIG. 9,
after the circuit substrate 31 having the damaged chip C is placed
in the carrier substrate adjustment mechanism 30, the damaged chip
C on the conveyor belt 20 can be transferred to a patch position P
on the circuit substrate 31 through the push module 5, thereby
achieving the effect of chip patching. However, the above-mentioned
examples illustrate only one of the embodiments, and the present
disclosure is not limited thereto.
[0037] Furthermore, referring to FIG. 1 to FIG. 9, the present
disclosure may further provide a chip transfer machine Z including
a chip carrier 1, a chip transferring module 2 and a chip carrier
substrate 3. The chip transferring module 2 includes at least one
conveyor belt 20 having an adhesive surface 20A, both of which are
disposed under or above the adhesive surface 20A of the conveyor
belt 20.
[0038] However, the above-mentioned examples illustrate only one of
the embodiments, and the present disclosure is not limited
thereto.
Second Embodiment
[0039] Referring to FIG. 10 and FIG. 11 together with FIG. 1 to
FIG. 9, a second embodiment of the present disclosure provides a
chip transferring machine Z that is slightly similar to the chip
transferring machine Z of the first embodiment. Therefore, similar
steps will not be repeated herein. Further, according to FIG. 10,
FIG. 11, FIG. 5 and FIG. 7, the difference between the second
embodiment of the present disclosure and the first embodiment is
that, both a chip carrier 1 and a chip carrier substrate 3 are
disposed above an adhesive surface 20A of at least one conveyor
belt 20 and face the adhesive surface 20A. Therefore, the chip C on
the chip carrier 1 can be transported to the chip carrier substrate
3 by conveyance of the conveyor belt 20.
[0040] Further, as shown in FIG. 10, the chip transfer machine Z
according to the second embodiment of the present disclosure may
further include: a thimble module 4 disposed above the chip carrier
1, and at least one chip C disposed on the chip carrier 1 is
transferred and adhered to the adhesive surface 20A of the at least
one conveyor belt 20 by the thimble module 4 abutting downwardly.
For example, as shown in FIG. 10, the thimble module 4 can be
disposed above the carrier film 11 of the chip carrier 1.
Therefore, the thimble module 4 passes downward through the carrier
film 11, and the chip C corresponding to the thimble module 4 can
be abutted against the adhesive surface 20A of the conveyor belt
20, so that the chip C is detached from the carrier film 11 and
attached to the adhesive surface 20A. However, the present
disclosure is not limited thereto. In addition, by repeating the
above method, the remaining chips C on the carrier film 11 are
detached from the carrier film 11 sequentially and attached to the
adhesive surface 20A, and a more detailed description thereof can
be referred to in the first embodiment so that details are not
described herein again.
[0041] Further, as shown in FIG. 10, the chip transfer machine Z
provided by the second embodiment may further include: a push
module 5 disposed under the conveyor belt 20 and adhered to at
least one of the chips C on the adhesive surface 20A by the push
module 5 abutting upwardly. For example, as shown in FIG. 10, the
push module 5 may be disposed under the conveyor belt 20 and face a
non-adhesive surface 20B. Therefore, when the chip C is transferred
under the circuit substrate 31 through the adhesive surface 20A of
the conveyor belt 20, the chip C adhered to the adhesive surface
20A is transferred and disposed on the chip carrier substrate 31 by
the push module 5 abutting upwardly. In addition, by repeating the
above method through the push module 5, the remaining chips C on
the conveyor belt 20 can be sequentially transferred from the
adhesive surface 20A, and then disposed on the circuit substrate
31. However, the above-mentioned examples illustrate only one of
the embodiments, and the present disclosure is not limited
thereto.
[0042] Finally, the circuit substrate 31 provided with the chips C
is subjected to a heating process so that the chips C are fixed by
the solder C1 and electrically connected to the circuit substrate
31. However, the above-mentioned examples illustrate only one of
the embodiments, and the present disclosure is not limited
thereto.
[0043] Further, as shown in FIG. 11, the chip transfer machine Z
provided by the present embodiment may further include: a laser
generating module 6 and a vacuum suction module 7. The laser
generating module 6 and the vacuum suction module 7 are disposed
under at least one conveyor belt 20, and a laser beam L generated
by the laser generating module 6 passes through the at least one
conveyor belt 20 to project on the solder C1 disposed on the at
least one chip C. The vacuum suction module 7 suctions at least one
non-adhesive surface 20B of the conveyor belt 20 to adjust the
flatness of at least one conveyor belt 20. For example, as shown in
FIG. 11, the chip transfer machine Z of the present disclosure can
also be provided with the laser generating module 6 and the vacuum
suction module 7 under the conveyor belt 20. Therefore, after the
chip C is transferred to the circuit substrate 31, the laser beam L
can be projected toward the chip C through the laser generating
module 6, and the laser beam L is projected through the conveyor
belt 20 and projected onto the solder Cl disposed on the chip C, so
that the solder Cl is heated to be fixed and electrically connected
to the circuit substrate 31. In addition, by suctioning the
non-adhesive surface 20B of the conveyor belt 20 through the vacuum
suction module 7, the flatness of the conveyor belt 20 can be
maintained to avoid affecting the flatness of the conveyor belt 20
while the push module 5 is abutting upwardly against the conveyor
belt 20 and the chip C, so that the chip C cannot easily attach to
the adhesive surface 20A, and other manufacturing problems can be
avoided.
[0044] In addition, as shown in FIG. 8 to FIG. 10, the laser
generating module 6 can also be operated together with the push
module 5. Therefore, when the push module 5 is abuts the chip C and
the chip C is transferred to the circuit substrate 31, the laser
beam can be projected to the chip C through the laser generating
module 6, so that the chip C can be fixed and electrically
connected to the circuit substrate 31 through the solder C1.
Details on a particular implementation of this embodiment can be
referred to in the first embodiment, and will not be described
herein again.
[0045] However, the above-mentioned examples illustrate only one of
the embodiments, and the present disclosure is not limited
thereto.
[0046] In conclusion, one of the beneficial effects of the present
disclosure is that by the technical features of "the chip
transferring module 2 including the at least one conveyor belt 20
having the adhesive surface 20A" and "the chip carrier 1, the chip
transferring module 2, and the chip carrier substrate 3 being
disposed on the same production line, and the chip carrier 1 and
the chip carrier substrate 3 being disposed under or above the
adhesive surface 20A of the conveyor belt 20," the transferring
efficiency and speed of chip C can be improved.
[0047] Furthermore, the chip transfer machine Z provided by the
present disclosure can not only improve the efficiency and speed of
transferring the chips C, but also adjust the spacing D2 of the
chip C on the circuit substrate 31, thereby customizing the circuit
substrate 31. Moreover, the chip transfer machine Z of the present
disclosure can also repair the circuit substrate 31 having the
damaged chip C by the above-described technical solution, and fix
the new chip C onto the patch position P.
[0048] Further, the chip transferring method and chip transferring
apparatus provided by the present disclosure has the
above-mentioned technical features so as to improve the efficiency
and speed of the transferring of the chips 2 to the adhesive layer
4 of the substrate 5, and shorten the time taken for performing the
same.
[0049] The foregoing description of the exemplary embodiments of
the disclosure has been presented only for the purposes of
illustration and description and is not intended to be exhaustive
or to limit the disclosure to the precise forms disclosed. Many
modifications and variations are possible in light of the above
teaching.
[0050] The embodiments were chosen and described in order to
explain the principles of the disclosure and their practical
application so as to enable others skilled in the art to utilize
the disclosure and various embodiments and with various
modifications as are suited to the particular use contemplated.
Alternative embodiments will become apparent to those skilled in
the art to which the present disclosure pertains without departing
from its spirit and scope.
* * * * *