U.S. patent application number 16/804805 was filed with the patent office on 2020-10-08 for antenna module supporting dual bands and electronic device including the same.
The applicant listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Jihoon KIM, Chaejun Lee, Junghwan Son.
Application Number | 20200321686 16/804805 |
Document ID | / |
Family ID | 1000004702793 |
Filed Date | 2020-10-08 |
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United States Patent
Application |
20200321686 |
Kind Code |
A1 |
KIM; Jihoon ; et
al. |
October 8, 2020 |
ANTENNA MODULE SUPPORTING DUAL BANDS AND ELECTRONIC DEVICE
INCLUDING THE SAME
Abstract
An electronic device including a housing; a display; a wireless
communication circuit comprising a first port, a second port, a
third port, and a fourth port, wherein the wireless communication
circuit is configured to transmit a first signal having a first
frequency via the first port; receive a second signal having the
first frequency via the second port; transmit a third signal having
a second frequency different from the first frequency via the third
port; and receive a fourth signal having the second frequency via
the fourth port; and an antenna structure disposed inside the
housing, wherein the antenna structure comprises: a conductive
pattern; a first node, a second node, and a third node electrically
connected to the conductive pattern; a first electrical path; a
second electrical path; a third electrical path; a fourth
electrical path; a fifth electrical path; a sixth electrical path;
and a seventh electrical path.
Inventors: |
KIM; Jihoon; (Gyeonggi-do,
KR) ; Son; Junghwan; (Gyeonggi-do, KR) ; Lee;
Chaejun; (Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Gyeonggi-do |
|
KR |
|
|
Family ID: |
1000004702793 |
Appl. No.: |
16/804805 |
Filed: |
February 28, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01Q 1/273 20130101;
H01Q 5/30 20150115; H01Q 1/24 20130101; H01Q 1/38 20130101 |
International
Class: |
H01Q 1/24 20060101
H01Q001/24; H01Q 1/38 20060101 H01Q001/38; H01Q 5/30 20060101
H01Q005/30 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 28, 2019 |
KR |
10-2019-0023866 |
Claims
1. An electronic device, comprising: a housing comprising a first
plate, a second plate facing away from the first plate, and a side
member surrounding a space between the first plate and the second
plate and coupled with the second plate or integrally formed with
the second plate; a display exposed through at least part of the
first plate; a wireless communication circuit comprising a first
port, a second port, a third port, and a fourth port, wherein the
wireless communication circuit is configured to: transmit a first
signal having a first frequency via the first port; receive a
second signal having the first frequency via the second port;
transmit a third signal having a second frequency different from
the first frequency via the third port; and receive a fourth signal
having the second frequency via the fourth port; and an antenna
structure disposed inside the housing, wherein the antenna
structure comprises: a conductive pattern; a first node, a second
node, and a third node electrically connected to the conductive
pattern; a first electrical path extending between the first port
and the first node and having a first length that is an odd
multiple of 1/4 of a first wavelength of the first signal; a second
electrical path extending between the second port and the first
node and having the first length; a third electrical path extending
between the third port and the second node and having a second
length that is an odd multiple of 1/4 of a second wavelength of the
second signal; a fourth electrical path extending between the
fourth port and the second node and having the second length; a
fifth electrical path extending between the first node and the
third node and having a third length, wherein a sum of the first
length and the third length is an odd multiple of 1/4 of the second
wavelength; a sixth electrical path extending between the second
node and the third node and having a fourth length, wherein a sum
of the second length and the fourth length is an odd multiple of
1/4 of the first wavelength; and a seventh electrical path
electrically connected between the third node and the conductive
pattern.
2. The electronic device of claim 1, wherein each of the first
electrical path, the second electrical path, the third electrical
path, and the fourth electrical path is selectively connected to a
ground through at least one switch.
3. The electronic device of claim 2, wherein the at least one
switch is included in the wireless communication circuit.
4. The electronic device of claim 3, wherein the wireless
communication circuit is further configured to connect remaining
electrical paths other than an electrical path used for
transmission or reception among the first electrical path, the
second electrical path, the third electrical path, and the fourth
electrical path, to the ground through the at least one switch.
5. The electronic device of claim 1, wherein the antenna structure
includes a printed circuit board including a first surface, on
which the conductive pattern is formed, and a second surface facing
away from the first surface, wherein the printed circuit board
comprises a plurality of layers, and wherein the wireless
communication circuit is positioned on the second surface of the
printed circuit board.
6. The electronic device of claim 5, wherein each of the first
electrical path, the second electrical path, the third electrical
path, the fourth electrical path, the fifth electrical path, the
sixth electrical path, and the seventh electrical path is formed
through at least one layer of the plurality of layers of the
printed circuit board.
7. The electronic device of claim 6, wherein the first node and the
second node are positioned on different layers from each other
among the plurality of layers.
8. The electronic device of claim 7, wherein the third node is
positioned on a layer more adjacent to the conductive pattern among
the plurality of layers than the first node and the second
node.
9. The electronic device of claim 1, wherein the antenna structure
further comprises a plurality of conductive patterns.
10. The electronic device of claim 1, wherein the first frequency
is not greater than 30 GHz, and wherein the second frequency
exceeds 30 GHz.
11. An antenna module, comprising: a wireless communication circuit
comprising a first port, a second port, a third port, and a fourth
port, wherein the wireless communication circuit is configured to:
transmit a first signal having a first frequency via the first
port; receive a second signal having the first frequency via the
second port; transmit a third signal having a second frequency
different from the first frequency via the third port; and receive
a fourth signal having the second frequency via the fourth port;
and a printed circuit board in which a conductive pattern is formed
on a first surface and in which the wireless communication circuit
is positioned on a second surface facing away from the first
surface, wherein the printed circuit board comprises: a first node,
a second node, and a third node electrically connected to the
conductive pattern; a first electrical path extending between the
first port and the first node and having a first length that is an
odd multiple of 1/4 wavelength of a first wavelength of the first
signal; a second electrical path extending between the second port
and the first node and having the first length; a third electrical
path extending between the third port and the second node and
having a second length that is an odd multiple of 1/4 wavelength of
a second wavelength of the second signal; a fourth electrical path
extending between the fourth port and the second node and having
the second length; a fifth electrical path extending between the
first node and the third node and having a third length, wherein a
sum of the first length and the third length is an odd multiple of
1/4 wavelength of the second wavelength; a sixth electrical path
extending between the second node and the third node and having a
fourth length, wherein a sum of the second length and the fourth
length is an odd multiple of 1/4 wavelength of the first
wavelength; and a seventh electrical path electrically connected
between the third node and the conductive pattern.
12. The antenna module of claim 11, wherein each of the first
electrical path, the second electrical path, the third electrical
path, and the fourth electrical path is selectively connected to a
ground through at least one switch.
13. The antenna module of claim 12, wherein the at least one switch
is included in the wireless communication circuit.
14. The antenna module of claim 13, wherein the wireless
communication circuit is further configured to connect remaining
electrical paths other than an electrical path used for
transmission or reception among the first electrical path, the
second electrical path, the third electrical path, and the fourth
electrical path, to the ground through the at least one switch.
15. The antenna module of claim 12, wherein the wireless
communication circuit further comprises a first communication
circuit for transmitting the first signal, a second communication
circuit for receiving the second signal, a third communication
circuit for transmitting the third signal, and a fourth
communication circuit for receiving the fourth signal, and wherein,
using the at least one switch, the wireless communication circuit
is further configured to: selectively connect the first electrical
path to the first communication circuit or the ground; selectively
connect the second electrical path to the second communication
circuit or the ground; selectively connect the third electrical
path to the third communication circuit or the ground; and
selectively connect the fourth electrical path to the fourth
communication circuit or the ground.
16. The antenna module of claim 11, wherein each of the first
electrical path, the second electrical path, the third electrical
path, the fourth electrical path, the fifth electrical path, the
sixth electrical path, and the seventh electrical path is formed
through at least one layer of a plurality of layers of the printed
circuit board.
17. The antenna module of claim 16, wherein the first node and the
second node are positioned on different layers from each other
among the plurality of layers.
18. The antenna module of claim 16, wherein the third node is
positioned on a layer more adjacent to the conductive pattern among
the plurality of layers than the first node and the second
node.
19. The antenna module of claim 11, further comprising: a plurality
of conductive patterns disposed on the first surface, wherein each
of the plurality of conductive patterns comprises a plurality of
electrical paths, each of which connects a plurality of ports of
the wireless communication circuit to the plurality of conductive
patterns, respectively, and wherein the plurality of ports and the
electrical paths are configured to be substantially same as the
first port, the second port, the third port, the fourth port, the
first electrical path, the second electrical path, the third
electrical path, the fourth electrical path, the fifth electrical
path, the sixth electrical path, and the seventh electrical
path.
20. The antenna module of claim 11, wherein the first frequency is
not greater than 30 GHz, and wherein the second frequency exceeds
30 GHz.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application is based on and claims priority under 35
U.S.C. .sctn. 119 to Korean Patent Application No. 10-2019-0023866,
filed on Feb. 28, 2019, in the Korean Intellectual Property Office,
the disclosure of which is incorporated by reference herein its
entirety.
BACKGROUND
1. Field
[0002] The disclosure relates to an antenna module supporting dual
bands and an electronic device including the same.
2. Description of Related Art
[0003] As mobile communication technologies develop, an electronic
device equipped with an antenna, such as a smartphone or a wearable
device, is being widely supplied. An electronic device may receive
or transmit a signal including data (e.g., a message, a photo, a
video, a music file, or a game) through an antenna.
[0004] An antenna module of an electronic device may be implemented
using a plurality of antenna elements to receive or transmit a
signal more efficiently. For example, an electronic device may
include one or more antenna arrays in each of which a plurality of
antenna elements are arranged in a regular shape. An antenna array
may have an effective isotropically radiated power (EIRP) greater
than one antenna element.
[0005] In 5G mobile communication, for the purpose of improving
data throughput, a wireless signal in a relatively high frequency
band may be used as compared to 4G mobile communication.
Furthermore, in 5G mobile communication, an electronic device may
support dual bands to efficiently use radio resources. For example,
an electronic device may be configured to support a first band
(e.g., a band of about 26 GHz or more but less than about 30 GHz)
and a second band (e.g., a band of about 37 GHz or more but less
than about 40 GHz). In this case, an electronic device may include
a transmission/reception path for a first band and a
transmission/reception path for a second band at least partly
different from the first band, due to a frequency characteristic of
a power amplifier.
[0006] To support dual bands, a plurality of transmission and
reception paths may be electrically connected to a single antenna
element. In 5G mobile communication, an electronic device may
perform wireless communication depending on a time division
multiplexing scheme. In this case, an electronic device may switch
a single antenna element so as to be connected to a transmission
path or a reception path depending on a configuration of wireless
resources. Moreover, an electronic device may switch a single
antenna element so as to be associated with a first frequency band
or a second frequency band.
[0007] For switching transmission and reception paths associated
with an antenna element, an electronic device may use a switching
element or a switching circuit. When a switching element or a
switching circuit is used, the performance of an antenna may
degrade due to the switching element or the switching circuit. For
example, an insertion loss may occur due to a switching element or
a switching circuit. In addition, due to a switching element or a
switching circuit, system complexity of an antenna module may
increase and linearity of the antenna module may degrade.
SUMMARY
[0008] In accordance with an aspect of the disclosure, an
electronic device is provided. The electronic device includes a
housing including a first plate, a second plate facing away from
the first plate, and a side member surrounding a space between the
first plate and the second plate and coupled with the second plate
or integrally formed with the second plate, a display exposed
through at least part of the first plate, a wireless communication
circuit including a first port, a second port, a third port, and a
fourth port, wherein the wireless communication circuit is
configured to transmit a first signal having a first frequency via
the first port; receive a second signal having the first frequency
via the second port; transmit a third signal having a second
frequency different from the first frequency via the third port;
and receive a fourth signal having the second frequency via the
fourth port; and an antenna structure disposed inside the housing,
wherein the antenna structure includes a conductive pattern, a
first node, a second node, and a third node electrically connected
to the conductive pattern, a first electrical path extending
between the first port and the first node and having a first length
that is an odd multiple of 1/4 of a first wavelength of the first
signal, a second electrical path extending between the second port
and the first node and having the first length, a third electrical
path extending between the third port and the second node and
having a second length that is an odd multiple of 1/4 of a second
wavelength of the second signal, a fourth electrical path extending
between the fourth port and the second node and having the second
length, a fifth electrical path extending between the first node
and the third node and having a third length, wherein a sum of the
first length and the third length is an odd multiple of 1/4 of the
second wavelength, a sixth electrical path extending between the
second node and the third node and having a fourth length, wherein
a sum of the second length and the fourth length is an odd multiple
of 1/4 of the first wavelength, and a seventh electrical path
electrically connected between the third node and the conductive
pattern.
[0009] In accordance with another aspect of the disclosure, an
antenna module is provided. The antenna module includes a wireless
communication circuit including a first port, a second port, a
third port, and a fourth port, wherein the wireless communication
circuit is configured to transmit a first signal having a first
frequency via the first port, receive a second signal having the
first frequency via the second port, transmit a third signal having
a second frequency different from the first frequency via the third
port, and receive a fourth signal having the second frequency via
the fourth port, and a printed circuit board in which a conductive
pattern is formed on a first surface and in which the wireless
communication circuit is positioned on a second surface facing away
from the first surface, wherein the printed circuit board includes
a first node, a second node, and a third node electrically
connected to the conductive pattern, a first electrical path
extending between the first port and the first node and having a
first length that is an odd multiple of 1/4 wavelength of a first
wavelength of the first signal, a second electrical path extending
between the second port and the first node and having the first
length, a third electrical path extending between the third port
and the second node and having a second length that is an odd
multiple of 1/4 wavelength of a second wavelength of the second
signal, a fourth electrical path extending between the fourth port
and the second node and having the second length, a fifth
electrical path extending between the first node and the third node
and having a third length, wherein a sum of the first length and
the third length is an odd multiple of 1/4 wavelength of the second
wavelength, a sixth electrical path extending between the second
node and the third node and having a fourth length, wherein a sum
of the second length and the fourth length is an odd multiple of
1/4 wavelength of the first wavelength, and a seventh electrical
path electrically connected between the third node and the
conductive pattern.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The above and other aspects, features, and advantages of
certain embodiments of the present disclosure will be more apparent
from the following description, taken in conjunction with the
accompanying drawings, in which:
[0011] FIG. 1 is a block diagram of an electronic device in a
network, according to an embodiment;
[0012] FIG. 2 is a block diagram of an electronic device for
supporting legacy network communication and 5G network
communication, according to an embodiment;
[0013] FIG. 3 is a cross-sectional view of a third antenna module
taken along a line 3-3 of FIG. 4;
[0014] FIG. 4 is various perspective views of the third antenna
module of FIG. 2;
[0015] FIG. 5 is a block diagram of a feed network, according to an
embodiment;
[0016] FIG. 6 is a block diagram of a feed network for transmitting
a signal in a first band, according to an embodiment;
[0017] FIG. 7 is a block diagram of a feed network for receiving a
signal in a first band, according to an embodiment;
[0018] FIG. 8 is a block diagram of a feed network for transmitting
a signal in a second band, according to an embodiment;
[0019] FIG. 9 is a block diagram of a feed network for receiving a
signal in a second band, according to an embodiment;
[0020] FIG. 10 is a block diagram of a radio frequency integrated
circuit (RFIC), according to an embodiment;
[0021] FIG. 11 is an illustration of a feed network of an antenna
module, according to an embodiment;
[0022] FIG. 12 illustrates charts of response characteristics of an
antenna module, according to an embodiment; and
[0023] FIG. 13 illustrates charts of response characteristics of an
antenna module, according to an embodiment.
DETAILED DESCRIPTION
[0024] Hereinafter, various embodiments of the disclosure are
described with reference to the accompanying drawings. The
embodiments and terms used with regard to the embodiments are not
intended to limit the present disclosure, but should be understood
to include various modifications, equivalents, and/or alternatives
of the disclosure.
[0025] FIG. 1 is a block diagram illustrating an electronic device
101 in a network environment 100 according to various embodiments.
Referring to FIG. 1, the electronic device 101 in the network
environment 100 may communicate with an electronic device 102 via a
first network 198 (e.g., a short-range wireless communication
network), or an electronic device 104 or a server 108 via a second
network 199 (e.g., a long-range wireless communication network).
According to an embodiment, the electronic device 101 may
communicate with the electronic device 104 via the server 108.
According to an embodiment, the electronic device 101 may include a
processor 120, memory 130, an input device 150, a sound output
device 155, a display device 160, an audio module 170, a sensor
module 176, an interface 177, a haptic module 179, a camera module
180, a power management module 188, a battery 189, a communication
module 190, a subscriber identification module (SIM) 196, or an
antenna module 197. In some embodiments, at least one (e.g., the
display device 160 or the camera module 180) of the components may
be omitted from the electronic device 101, or one or more other
components may be added in the electronic device 101. In some
embodiments, some of the components may be implemented as single
integrated circuitry. For example, the sensor module 176 (e.g., a
fingerprint sensor, an iris sensor, or an illuminance sensor) may
be implemented as embedded in the display device 160 (e.g., a
display).
[0026] The processor 120 may execute, for example, software (e.g.,
a program 140) to control at least one other component (e.g., a
hardware or software component) of the electronic device 101
coupled with the processor 120, and may perform various data
processing or computation. According to one embodiment, as at least
part of the data processing or computation, the processor 120 may
load a command or data received from another component (e.g., the
sensor module 176 or the communication module 190) in volatile
memory 132, process the command or the data stored in the volatile
memory 132, and store resulting data in non-volatile memory 134.
According to an embodiment, the processor 120 may include a main
processor 121 (e.g., a central processing unit (CPU) or an
application processor (AP)), and an auxiliary processor 123 (e.g.,
a graphics processing unit (GPU), an image signal processor (ISP),
a sensor hub processor, or a communication processor (CP)) that is
operable independently from, or in conjunction with, the main
processor 121. Additionally or alternatively, the auxiliary
processor 123 may be adapted to consume less power than the main
processor 121, or to be specific to a specified function. The
auxiliary processor 123 may be implemented as separate from, or as
part of the main processor 121.
[0027] The auxiliary processor 123 may control at least some of
functions or states related to at least one component (e.g., the
display device 160, the sensor module 176, or the communication
module 190) among the components of the electronic device 101,
instead of the main processor 121 while the main processor 121 is
in an inactive (e.g., sleep) state, or together with the main
processor 121 while the main processor 121 is in an active state
(e.g., executing an application). According to an embodiment, the
auxiliary processor 123 (e.g., an ISP or a CP) may be implemented
as part of another component (e.g., the camera module 180 or the
communication module 190) functionally related to the auxiliary
processor 123.
[0028] The memory 130 may store various data used by at least one
component (e.g., the processor 120 or the sensor module 176) of the
electronic device 101. The various data may include, for example,
software (e.g., the program 140) and input data or output data for
a command related thereto. The memory 130 may include the volatile
memory 132 or the non-volatile memory 134.
[0029] The program 140 may be stored in the memory 130 as software,
and may include, for example, an operating system (OS) 142,
middleware 144, or an application 146.
[0030] The input device 150 may receive a command or data to be
used by other component (e.g., the processor 120) of the electronic
device 101, from the outside (e.g., a user) of the electronic
device 101. The input device 150 may include, for example, a
microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus
pen).
[0031] The sound output device 155 may output sound signals to the
outside of the electronic device 101. The sound output device 155
may include, for example, a speaker or a receiver. The speaker may
be used for general purposes, such as playing multimedia or playing
record, and the receiver may be used for an incoming calls.
According to an embodiment, the receiver may be implemented as
separate from, or as part of the speaker.
[0032] The display device 160 may visually provide information to
the outside (e.g., a user) of the electronic device 101. The
display device 160 may include, for example, a display, a hologram
device, or a projector and control circuitry to control a
corresponding one of the display, hologram device, and projector.
According to an embodiment, the display device 160 may include
touch circuitry adapted to detect a touch, or sensor circuitry
(e.g., a pressure sensor) adapted to measure the intensity of force
incurred by the touch.
[0033] The audio module 170 may convert a sound into an electrical
signal and vice versa. According to an embodiment, the audio module
170 may obtain the sound via the input device 150, or output the
sound via the sound output device 155 or a headphone of an external
electronic device (e.g., an electronic device 102) directly (e.g.,
wiredly) or wirelessly coupled with the electronic device 101.
[0034] The sensor module 176 may detect an operational state (e.g.,
power or temperature) of the electronic device 101 or an
environmental state (e.g., a state of a user) external to the
electronic device 101, and then generate an electrical signal or
data value corresponding to the detected state. According to an
embodiment, the sensor module 176 may include, for example, a
gesture sensor, a gyro sensor, an atmospheric pressure sensor, a
magnetic sensor, an acceleration sensor, a grip sensor, a proximity
sensor, a color sensor, an infrared (IR) sensor, a biometric
sensor, a temperature sensor, a humidity sensor, or an illuminance
sensor.
[0035] The interface 177 may support one or more specified
protocols to be used for the electronic device 101 to be coupled
with the external electronic device (e.g., the electronic device
102) directly (e.g., wiredly) or wirelessly. According to an
embodiment, the interface 177 may include, for example, a high
definition multimedia interface (HDMI), a universal serial bus
(USB) interface, a secure digital (SD) card interface, or an audio
interface.
[0036] A connecting terminal 178 may include a connector via which
the electronic device 101 may be physically connected with the
external electronic device (e.g., the electronic device 102).
According to an embodiment, the connecting terminal 178 may
include, for example, a HDMI connector, a USB connector, a SD card
connector, or an audio connector (e.g., a headphone connector).
[0037] The haptic module 179 may convert an electrical signal into
a mechanical stimulus (e.g., a vibration or a movement) or
electrical stimulus which may be recognized by a user via his
tactile sensation or kinesthetic sensation. According to an
embodiment, the haptic module 179 may include, for example, a
motor, a piezoelectric element, or an electric stimulator.
[0038] The camera module 180 may capture a still image or moving
images. According to an embodiment, the camera module 180 may
include one or more lenses, image sensors, ISPs, or flashes.
[0039] The power management module 188 may manage power supplied to
the electronic device 101. According to one embodiment, the power
management module 188 may be implemented as at least part of, for
example, a power management integrated circuit (PMIC).
[0040] The battery 189 may supply power to at least one component
of the electronic device 101. According to an embodiment, the
battery 189 may include, for example, a primary cell which is not
rechargeable, a secondary cell which is rechargeable, or a fuel
cell.
[0041] The communication module 190 may support establishing a
direct (e.g., wired) communication channel or a wireless
communication channel between the electronic device 101 and the
external electronic device (e.g., the electronic device 102, the
electronic device 104, or the server 108) and performing
communication via the established communication channel. The
communication module 190 may include one or more communication
processors that are operable independently from the processor 120
(e.g., the AP) and supports a direct (e.g., wired) communication or
a wireless communication. According to an embodiment, the
communication module 190 may include a wireless communication
module 192 (e.g., a cellular communication module, a short-range
wireless communication module, or a global navigation satellite
system (GNSS) communication module) or a wired communication module
194 (e.g., a local area network (LAN) communication module or a
power line communication (PLC) module). A corresponding one of
these communication modules may communicate with the external
electronic device via the first network 198 (e.g., a short-range
communication network, such as Bluetooth.TM., wireless-fidelity
(Wi-Fi) direct, or a standard of the Infrared Data Association
(IrDA)) or the second network 199 (e.g., a long-range communication
network, such as a cellular network, the Internet, or a computer
network (e.g., LAN or wide area network (WAN)). These various types
of communication modules may be implemented as a single component
(e.g., a single chip), or may be implemented as multi components
(e.g., multi chips) separate from each other. The wireless
communication module 192 may identify and authenticate the
electronic device 101 in a communication network, such as the first
network 198 or the second network 199, using subscriber information
(e.g., international mobile subscriber identity (IMSI)) stored in
the subscriber identification module 196.
[0042] The antenna module 197 may transmit or receive a signal or
power to or from the outside (e.g., the external electronic device)
of the electronic device 101. According to an embodiment, the
antenna module 197 may include an antenna including a radiating
element composed of a conductive material or a conductive pattern
formed in or on a substrate (e.g., a printed circuit board (PCB)).
According to an embodiment, the antenna module 197 may include a
plurality of antennas. In such a case, at least one antenna
appropriate for a communication scheme used in the communication
network, such as the first network 198 or the second network 199,
may be selected, for example, by the communication module 190
(e.g., the wireless communication module 192) from the plurality of
antennas. The signal or the power may then be transmitted or
received between the communication module 190 and the external
electronic device via the selected at least one antenna. According
to an embodiment, another component (e.g., an RFIC) other than the
radiating element may be additionally formed as part of the antenna
module 197.
[0043] At least some of the above-described components may be
coupled mutually and communicate signals (e.g., commands or data)
therebetween via an inter-peripheral communication scheme (e.g., a
bus, general purpose input and output (GPIO), serial peripheral
interface (SPI), or mobile industry processor interface
(MIPI)).
[0044] According to an embodiment, commands or data may be
transmitted or received between the electronic device 101 and the
external electronic device 104 via the server 108 coupled with the
second network 199. Each of the electronic devices 102 and 104 may
be a device of a same type as, or a different type, from the
electronic device 101. According to an embodiment, all or some of
operations to be executed at the electronic device 101 may be
executed at one or more of the external electronic devices 102,
104, or 108. For example, if the electronic device 101 should
perform a function or a service automatically, or in response to a
request from a user or another device, the electronic device 101,
instead of, or in addition to, executing the function or the
service, may request the one or more external electronic devices to
perform at least part of the function or the service. The one or
more external electronic devices receiving the request may perform
the at least part of the function or the service requested, or an
additional function or an additional service related to the
request, and transfer an outcome of the performing to the
electronic device 101. The electronic device 101 may provide the
outcome, with or without further processing of the outcome, as at
least part of a reply to the request. To that end, a cloud
computing, distributed computing, or client-server computing
technology may be used, for example.
[0045] The electronic device according to various embodiments may
be one of various types of electronic devices. The electronic
devices may include, for example, a portable communication device
(e.g., a smartphone), a computer device, a portable multimedia
device, a portable medical device, a camera, a wearable device, or
a home appliance. According to an embodiment of the disclosure, the
electronic devices are not limited to those described above.
[0046] It should be appreciated that various embodiments of the
present disclosure and the terms used therein are not intended to
limit the technological features set forth herein to particular
embodiments and include various changes, equivalents, or
replacements for a corresponding embodiment. With regard to the
description of the drawings, similar reference numerals may be used
to refer to similar or related elements. It is to be understood
that a singular form of a noun corresponding to an item may include
one or more of the things, unless the relevant context clearly
indicates otherwise. As used herein, each of such phrases as "A or
B," "at least one of A and B," "at least one of A or B," "A, B, or
C," "at least one of A, B, and C," and "at least one of A, B, or
C," may include any one of, or all possible combinations of the
items enumerated together in a corresponding one of the phrases. As
used herein, such terms as "1st" and "2nd," or "first" and "second"
may be used to simply distinguish a corresponding component from
another, and does not limit the components in other aspect (e.g.,
importance or order). It is to be understood that if an element
(e.g., a first element) is referred to, with or without the term
"operatively" or "communicatively", as "coupled with," "coupled
to," "connected with," or "connected to" another element (e.g., a
second element), it means that the element may be coupled with the
other element directly (e.g., wiredly), wirelessly, or via a third
element.
[0047] As used herein, the term "module" may include a unit
implemented in hardware, software, or firmware, and may
interchangeably be used with other terms, for example, "logic,"
"logic block," "part," or "circuitry". A module may be a single
integral component, or a minimum unit or part thereof, adapted to
perform one or more functions. For example, according to an
embodiment, the module may be implemented in a form of an
application-specific integrated circuit (ASIC).
[0048] Various embodiments as set forth herein may be implemented
as software (e.g., the program 140) including one or more
instructions that are stored in a storage medium (e.g., internal
memory 136 or external memory 138) that is readable by a machine
(e.g., the electronic device 101). For example, a processor (e.g.,
the processor 120) of the machine (e.g., the electronic device 101)
may invoke at least one of the one or more instructions stored in
the storage medium, and execute it, with or without using one or
more other components under the control of the processor. This
allows the machine to be operated to perform at least one function
according to the at least one instruction invoked. The one or more
instructions may include a code generated by a compiler or a code
executable by an interpreter. The machine-readable storage medium
may be provided in the form of a non-transitory storage medium.
Wherein, the term "non-transitory storage medium" means a tangible
device, and does not include a signal (e.g., an electromagnetic
wave), but this term does not differentiate between where data is
semi-permanently stored in the storage medium and where the data is
temporarily stored in the storage medium. For example, "the
non-transitory storage medium" may include a buffer where data is
temporally stored.
[0049] A method according to various embodiments of the disclosure
may be included and provided in a computer program product. The
computer program product may be traded as a product between a
seller and a buyer. The computer program product (e.g.,
downloadable app)) may be distributed in the form of a
machine-readable storage medium (e.g., compact disc read only
memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)
online via an application store (e.g., PlayStore.TM.), or between
two user devices (e.g., smart phones) directly. If distributed
online, at least part of the computer program product may be
temporarily generated or at least temporarily stored in the
machine-readable storage medium, such as memory of the
manufacturer's server, a server of the application store, or a
relay server.
[0050] According to various embodiments, each component (e.g., a
module or a program) of the above-described components may include
a single entity or multiple entities. According to various
embodiments, one or more of the above-described components may be
omitted, or one or more other components may be added.
Alternatively or additionally, a plurality of components (e.g.,
modules or programs) may be integrated into a single component. In
such a case, according to various embodiments, the integrated
component may still perform one or more functions of each of the
plurality of components in the same or similar manner as they are
performed by a corresponding one of the plurality of components
before the integration. According to various embodiments,
operations performed by the module, the program, or another
component may be carried out sequentially, in parallel, repeatedly,
or heuristically, or one or more of the operations may be executed
in a different order or omitted, or one or more other operations
may be added.
[0051] FIG. 2 is a block diagram 200 of the electronic device 101
for supporting legacy network communication and 5G network
communication, according to an embodiment.
[0052] Referring to FIG. 2, the wireless communication module 192
in the electronic device 101 may include a first communication
processor 212, a second communication processor 214, a first RFIC
222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a
first radio frequency front end (RFFE) 232, a second RFFE 234, a
first antenna module 242, a second antenna module 244, and an
antenna 248. The electronic device 101 may further include the
processor 120 and the memory 130. The second network 199 may
include a first cellular network 292 and a second cellular network
294. The electronic device 101 may further include at least one of
the components described above with reference to FIG. 1, and the
second network 199 may include at least one other network. The
first communication processor 212, the second communication
processor 214, the first RFIC 222, the second RFIC 224, the fourth
RFIC 228, the first RFFE 232, and the second RFFE 234 may form at
least part of the wireless communication module 192. The fourth
RFIC 228 may be omitted or included as a part of the third RFIC
226.
[0053] The first communication processor 212 may support the
establishment of a communication channel of a band to be used for
wireless communication with the first cellular network 292 and a
legacy network communication through the established communication
channel. The first cellular network 292 may be a legacy network
including a 2G, a 3G, a 4G, and/or a long term evolution (LTE)
network. The second communication processor 214 may support the
establishment of a communication channel corresponding to a
specified band (e.g., about 6 GHz-about 60 GHz) among bands to be
used for wireless communication with the second cellular network
294 and 5G network communication via the established communication
channel. The second cellular network 294 may be a 5G network
defined in 3GPP. Additionally, the first communication processor
212 or the second communication processor 214 may establish a
communication channel for a specified band (e.g., about 6 GHz or
lower) of the bands to be used for wireless communication with the
second cellular network 294 and may support 5G network
communication through the established communication channel. The
first communication processor 212 and the second communication
processor 214 may be implemented within a single integrated circuit
or chip or a single package. The first communication processor 212
or the second communication processor 214 may be implemented within
a single chip or a single package with the processor 120, the
auxiliary processor 123 of FIG. 1, or the communication module
190.
[0054] At the time of transmission, the first RFIC 222 may convert
a baseband signal generated by the first communication processor
212 to a radio frequency (RF) signal of about 700 MHz to about 3
GHz used for the first cellular network 292 (e.g., a legacy
network). At the time of reception, the RF signal may be obtained
from the first cellular network 292 (e.g., a legacy network) via an
antenna (e.g., the first antenna module 242) and may be
preprocessed via the first RFFE 232. The first RFIC 222 may convert
the preprocessed RF signal to a baseband signal so as to be
processed by the first communication processor 212.
[0055] In the case of transmitting a signal, the second RFIC 224
may convert a baseband signal generated by the first communication
processor 212 or the second communication processor 214 into an RF
signal (e.g., a 5G Sub6 RF signal) in a Sub6 band (e.g., about 6
GHz or lower) used in the second cellular network 294 (e.g., a 5G
network). At the time of reception, the 5G Sub6 RF signal may be
obtained from the second cellular network 294 (e.g., a 5G network)
via an antenna (e.g., the second antenna module 244) and may be
preprocessed via the second RFFE 234. The second RFIC 224 may
convert the preprocessed 5G Sub6 RF signal to a baseband signal so
as to be processed by a communication processor corresponding to
the first communication processor 212 or the second communication
processor 214.
[0056] At the time of transmission, the third RFIC 226 may convert
a baseband signal generated by the second communication processor
214 to an RF signal (e.g., a 5G Above6 RF signal) of a 5G Above6
band (e.g., about 6 GHz-about 60 GHz) to be used for the second
cellular network 294 (e.g., a 5G network). At the time of
reception, the 5G Above6 RF signal may be obtained from the second
cellular network 294 (e.g., a 5G network) via an antenna (e.g., the
antenna 248) and may be preprocessed via a third RFFE 236. For
example, the third RFFE 236 may perform preprocessing of a signal,
using a phase shifter 238. The third RFIC 226 may convert the
preprocessed 5G Above6 RF signal to a baseband signal so as to be
processed by the second communication processor 214. The third RFFE
236 may be formed as part of the third RFIC 226.
[0057] The electronic device 101 may include the fourth RFIC 228
independent of the third RFIC 226 or as at least part thereof. In
this case, the fourth RFIC 228 may convert the baseband signal
generated by the second communication processor 214, to an RF
signal (e.g., an intermediate frequency (IF) signal) of an
intermediate frequency band (e.g., about 9 GHz-about 11 GHz) and
then may transmit the IF signal to the third RFIC 226. The third
RFIC 226 may convert the IF signal to the 5G Above6 RF signal. At
the time of reception, the 5G Above6 RF signal may be received from
the second cellular network 294 (e.g., a 5G network) via an antenna
(e.g., the antenna 248) and converted to the IF signal by the third
RFIC 226. The fourth RFIC 228 may convert the IF signal to the
baseband signal such that the second communication processor 214 is
capable of processing the baseband signal.
[0058] The first RFIC 222 and the second RFIC 224 may be
implemented as at least part of a single chip or a single package.
The first RFFE 232 and the second RFFE 234 may be implemented as at
least part of a single chip or a single package. At least one
antenna module of the first antenna module 242 or the second
antenna module 244 may be omitted or may be coupled to another
antenna module and then may process RF signals of a plurality of
corresponding bands.
[0059] The third RFIC 226 and the antenna 248 may be disposed on
the same substrate to form the third antenna module 246. For
example, the wireless communication module 192 or the processor 120
may be disposed on a first substrate (e.g., a main PCB). In this
case, the third RFIC 226 may be disposed in a partial region (e.g.,
a bottom surface) of a second substrate (e.g., a sub PCB)
separately of the first substrate; the antenna 248 may be disposed
in another partial region (e.g., an upper surface), and, thus, the
third antenna module 246 may be formed. For example, the antenna
248 may include an antenna array capable of being used for
beamforming. It is possible to reduce the length of the
transmission line between the third RFIC 226 and the antenna 248 by
positioning the third RFIC 226 and the antenna 248 on the same
substrate. The decrease in the transmission line may make it
possible to reduce the loss (or attenuation) of a signal in a
high-frequency band (e.g., approximately 6 GHz to approximately 60
GHz) used for the 5G network communication due to the transmission
line. For this reason, the electronic device 101 may improve the
quality or speed of communication with the second cellular network
294 (e.g., a 5G network).
[0060] The second cellular network 294 (e.g., a 5G network) may be
used independently of the first cellular network 292 (e.g., a
legacy network) (e.g., stand-alone (SA)) or may be used in
conjunction with the first cellular network 292 (e.g., non-stand
alone (NSA)). For example, only an access network (e.g., a 5G radio
access network (RAN) or a next generation RAN (NG RAN)) may be
present in the 5G network, and a core network (e.g., a next
generation core (NGC)) may be absent from the 5G network. In this
case, the electronic device 101 may access the access network of
the 5G network and may then access an external network (e.g., the
Internet) under control of the core network (e.g., an evolved
packed core (EPC)) of the legacy network. Protocol information
(e.g., LTE protocol information) for communication with the legacy
network or protocol information (e.g., new radio (NR) protocol
information) for communication with the 5G network may be stored in
the memory 130 so as to be accessed by another component (e.g., the
processor 120, the first communication processor 212, or the second
communication processor 214).
[0061] FIG. 3 illustrates a cross-sectional view of the third
antenna module 246 taken along a line B-B' 400a of FIG. 4.
[0062] Referring to FIG. 3, a PCB 410 may include an antenna layer
311 and a network layer 313.
[0063] The antenna layer 311 may include at least one dielectric
layer 337-1, and an antenna element 436 and/or a feed part 325
formed on an outer surface of the dielectric layer 337-1 or
therein. The feed part 325 may include a feed point 327 and/or a
feed line 329.
[0064] The network layer 313 may include at least one dielectric
layer 337-2 and at least one ground layer 333, at least one
conductive via 335, and/or a transmission line 323 formed on an
outer surface of the dielectric layer 337-2 or therein.
[0065] In addition, the third RFIC 226 may be electrically
connected with the network layer 313, for example, through first
solder bump 340-1 and the second solder bump 340-2. Various
connection structures (e.g., soldering or a ball grid array (BGA))
may be utilized instead of the first solder bump 340-1 and the
second solder bump 340-2. The third RFIC 226 may be electrically
connected with the antenna element 436 through the first solder
bump 340-1, the transmission line 323, and the feed part 325. In
addition, the third RFIC 226 may be electrically connected with the
ground layer 333 through the second solder bump 340-2 and the
conductive via 335.
[0066] FIG. 4 illustrates an embodiment of the third antenna module
246 described with reference to FIG. 2, for example. 400a of FIG. 4
is a perspective view of the third antenna module 246 when viewed
from one side, and 400b of FIG. 4 is a perspective view of the
third antenna module 246 when viewed from another side. 400c of
FIG. 4 is a cross-sectional view of the third antenna module 246
taken along a line A-A'.
[0067] Referring to FIG. 4, the third antenna module 246 may
include a PCB 410, an antenna array 430, RFIC 452, a power manage
integrated circuit (PMIC) 454, and/or a module interface.
Selectively, the third antenna module 246 may further include a
shielding member 490. At least one of the above components may be
omitted, or at least two of the components may be integrally
formed.
[0068] The PCB 410 may include a plurality of conductive layers and
a plurality of non-conductive layers, and the conductive layers and
the non-conductive layers may be alternately stacked. The PCB 410
may provide electrical connection with various electronic
components disposed on the PCB 410 or on the outside, using wires
and conductive vias formed in the conductive layers.
[0069] The antenna array 430 may include a plurality of antenna
elements 432, 434, 436, and 438 disposed to form a directional
beam. The antenna elements 432, 434, 436, and 438 may be formed on
a first surface of the PCB 410. The antenna array 430 may be formed
within the PCB 410. The antenna array 430 may include a plurality
of antenna arrays (e.g., a dipole antenna array and/or a patch
antenna array), the shapes or kinds of which are identical or
different.
[0070] The RFIC 452 may be disposed on another region (e.g., a
second surface facing away from the first surface) of the PCB 410
so as to be spaced from the antenna array 430. The RFIC 452 may be
configured to process a signal in the selected frequency band,
which is transmitted/received through the antenna array 430. In a
case of transmitting a signal, the RFIC 452 may convert a baseband
signal obtained from a communication processor into an RF signal.
In the case of receiving a signal, the RFIC 452 may convert an RF
signal received through the antenna array 430 into a baseband
signal and may provide the baseband signal to the communication
processor.
[0071] In a case of transmitting a signal, the RFIC 452 may
up-convert an IF signal (e.g., approximately 9 GHz to approximately
11 GHz) obtained from an intermediate frequency integrated circuit
(IFIC) into an RF signal. In a case of receiving a signal, the RFIC
452 may down-convert an RF signal obtained through the antenna
array 430 into an IF signal and may provide the IF signal to the
IFIC.
[0072] The PMIC 454 may be disposed on another region (e.g., the
second surface) of the PCB 410, which is spaced from the antenna
array. The PMIC 454 may be supplied with a voltage from a main PCB
and may provide power necessary for various components (e.g., the
RFIC 452) on an antenna module.
[0073] The shielding member 490 may be disposed at a portion (e.g.,
on the second surface) of the PCB 410 such that at least one of the
RFIC 452 or the PMIC 454 is electromagnetically shielded. The
shielding member 490 may include a shield can.
[0074] The third antenna module 246 may be electrically connected
with another PCB (e.g., a main circuit board) through a module
interface. The module interface may include a connection member,
for example, a coaxial cable connector, a board to board connector,
an interposer, or a flexible printed circuit board (FPCB). The RFIC
452 and/or the PMIC 454 of the third antenna module 246 may be
electrically connected with the PCB through the connection
member.
[0075] The third antenna module 246 may be positioned inside the
housing of the electronic device 101. The housing may form at least
part of the appearance of the electronic device 101. The housing
may include a first plate (e.g., the part of the housing
constituting at least part of the front surface of the electronic
device), a second plate (e.g., the part of the housing constituting
at least part of the rear surface of the electronic device 101)
facing away from the first plate, and a side member surrounding a
space between the first plate and the second plate. For example,
the side member may be formed integrally with the second plate. For
example, the side member may be coupled with the second plate. At
least part of the side member may be used as a conductive radiator
for the transmission and reception in a specified frequency. The
electronic device may include the display device 160. For example,
the display device 160 may be viewable through at least part of the
first plate. The third antenna module 246 is described below in
greater detail with reference to the accompanying drawings. The
third antenna module 246 may be referred to as an antenna
structure.
[0076] FIG. 5 is a block diagram of a feed network W1, according to
an embodiment.
[0077] Referring to FIG. 5, the third antenna module 246 may
include an RFIC 452 and a conductive pattern 530. For example, the
conductive pattern 530 may correspond to one of the plurality of
antenna elements 432, 434, 436, or 438 of FIG. 4. The third antenna
module 246 may include a feed network W1 for electrically
connecting the RFIC 452 to the conductive pattern 530.
[0078] The RFIC 452 may support signal transmission and reception
in dual bands. For example, the RFIC 452 may include a first port
TX1 and a second port RX1, which are associated with transmission
and reception of a signal in a first band. For example, the signal
in the first band may have a first wavelength U. The RFIC 452 may
include a third port TX2 and a fourth port RX2, which are
associated with transmission and reception of a signal in a second
band different from the first band. For example, the signal in the
second band may have a second wavelength .lamda.2. For example, the
RFIC 452 may transmit the first signal in the first band, using the
first port TX1. The RFIC 452 may receive the second signal in the
first band, using the second port RX1. The RFIC 452 may transmit
the third signal in the second band, using the third port TX2. The
RFIC 452 may receive the fourth signal in the second band, using
the fourth port RX2. For example, the RFIC 452 may be referred to
as a wireless communication circuit.
[0079] The feed network W1 may include a plurality of
transmission/reception paths 601, 602, 603, and 604 for
electrically connecting the conductive pattern 530 to the RFIC 452.
For example, the feed network W1 may include a first node P1, a
second node P2, and a third node P3, which are electrically
connected to the conductive pattern 530.
[0080] For example, the first signal transmission path 601 for
transmitting the first signal in the first band may extend between
the first port TX1 and the conductive pattern 530. The first signal
transmission path 601 may include a first electrical path 501
extending between the first port TX1 and the first node P1 and
having a first length L1. For example, the first electrical path
501 may have the first length L1 corresponding to the odd multiple
(e.g., 1, 3, 5, . . . ) of 1/4 of the wavelength .lamda.1 of the
second signal. The first signal transmission path 601 may further
include a fifth electrical path 505 extending between the first
node P1 and the third node P3 and having a third length L3. For
example, the sum of the first length L1 and the third length L3 may
have a length corresponding to the odd multiple (e.g., 1, 3, 5, . .
. ) of 1/4 of the wavelength .lamda.2 of the third signal or the
fourth signal in the second band. The first transmission path 601
may include a seventh electrical path 507 extending between the
third node P3 and the conductive pattern 530. For example, the
seventh electrical path 507 may correspond to the feed part
325.
[0081] For example, the second signal reception path 602 for
receiving the second signal in the first band may extend between
the second port RX1 and the conductive pattern 530. The second
signal reception path 602 may include a second electrical path 502
extending between the second port RX1 and the first node P1 and
having the first length L1. For example, the second electrical path
502 may have the first length L1 corresponding to the odd multiple
(e.g., 1, 3, 5, . . . ) of 1/4 of the wavelength .lamda.1 of the
first signal. The second signal reception path 602 may further
include the fifth electrical path 505 extending between the first
node P1 and the third node P3 and having the third length L3. The
sum of the first length L1 and the third length L3 may have a
length corresponding to the odd multiple (e.g., 1, 3, 5, . . . ) of
1/4 of the wavelength .lamda.2 of the third signal or the fourth
signal in the second band. The second signal reception path 602 may
further include the seventh electrical path 507 extending between
the third node P3 and the conductive pattern 530.
[0082] For example, the third signal transmission path 603 for
transmitting the third signal in the second band may extend between
the third port TX2 and the conductive pattern 530. The third signal
transmission path 603 may include the third electrical path 503
extending between the third port TX2 and the second node P2 and
having the third length L2. For example, the third electrical path
503 may have the length corresponding to the odd multiple (e.g., 1,
3, 5, . . . ) of 1/4 of the wavelength .lamda.2 of the fourth
signal. The third signal transmission path 603 may include a sixth
electrical path 506 extending between the second port P2 and the
third node P3 and having the fourth length L4. For example, the sum
of the second length L2 and the fourth length L4 may correspond to
the odd multiple (e.g., 1, 3, 5, . . . ) of 1/4 of the wavelength
.lamda.1 of the first signal or the second signal in the first
band. The third signal transmission path 603 may include the
seventh electrical path 507 extending between the third node P3 and
the conductive pattern 530.
[0083] For example, the fourth signal reception path 604 for
receiving the fourth signal in the second band may extend between
the fourth port RX2 and the conductive pattern 530. The fourth
signal reception path 604 may include a fourth electrical path 504
extending between the fourth port RX2 and the second node P2 and
having the second length L2. For example, the fourth electrical
path 504 may have the second length L2 corresponding to the odd
multiple (e.g., 1, 3, 5, . . . ) of 1/4 of the wavelength .lamda.2
of the third signal in the second band. The fourth signal reception
path 604 may further include the sixth electrical path 506
extending between the second node P2 and the third node P3 and
having the fourth length L4. For example, the sum of the second
length L2 and the fourth length L4 may have a length corresponding
to the odd multiple (e.g., 1, 3, 5, . . . ) of 1/4 of the
wavelength .lamda.1 of the first signal or the second signal. The
fourth signal reception path 604 may further include the seventh
electrical path 507 extending between the third node P3 and the
conductive pattern 530.
[0084] The shape of the antenna module illustrated in FIG. 5 is
exemplary; as shown in FIG. 4, the antenna module may include a
plurality of conductive patterns. In this case, a feed network
(e.g., the feed network W1) supporting dual bands may be connected
to each of a plurality of conductive patterns.
[0085] The antenna module may be included in the electronic device
101. For example, the electronic device 101 may include a housing.
The housing may include a first plate, a second plate facing away
from the first plate, and a side member surrounding a space between
the first plate and the second plate and coupled with the second
plate or integrally formed with the second plate. The electronic
device 101 may include the display device 160 exposed through at
least part of the first plate.
[0086] The RFIC 452 may open an electrical path connected to the
corresponding port by short circuiting or shorting a port not used
for transmission or reception. For example, when the RFIC 452
shorts one port by connecting the port to the ground, when viewed
from the conductive pattern 530, the electrical path connected to
the corresponding port may operate in a state substantially the
same as the opened state. Accordingly, the RFIC 452 may connect an
arbitrary path to the conductive pattern 530 or may open the
arbitrary path from the conductive pattern 530, without using a
switch element for selecting a transmission/reception path of a
signal in the first band or the second band connected to the
conductive pattern 530, a switch element for selecting the
transmission or reception path of a signal in the first band, and a
switch element for selecting the transmission or reception path of
a signal in the second band. Hereinafter, signal
transmitting/receiving methods using each of the
transmission/reception paths are described in greater detail with
reference to FIGS. 6 to 9.
[0087] FIG. 6 is a block diagram of a feed network for transmitting
a signal in a first band, according to an embodiment.
[0088] Referring to FIG. 6, the RFIC 452 may be configured to
transmit the first signal in the first band. The RFIC 452 may
connect the remaining ports RX1, TX2, and RX2 to ground other than
the first port TX1 for transmitting the first signal. The RFIC 452
may feed the first signal to the conductive pattern 530 via the
first signal transmission path 601.
[0089] Since the second port RX1 is shorted and the length of the
second electrical path 502 between the first node P1 and the second
port RX1 corresponds to the first length L1 corresponding to the
odd multiple of 1/4 of the first wavelength .lamda.1 of the first
signal, the second electrical path 502 may operate to be
substantially the same as the opened state for a signal of a first
wavelength. For example, the second signal reception path 602 may
be regarded as being opened, due to the opening of the second
electrical path 502.
[0090] Since the third port TX2 is shorted and the sum of the
fourth length L4 of the sixth electrical path 506 between the
second node P2 and the third node P3 and the second length L2 of
the third electrical path 503 between the third port TX2 and the
second node P2 corresponds to the odd multiple of 1/4 of the first
wavelength .lamda.1 of the first signal, the third signal
transmission path 603 may operate to be substantially the same as
the opened state.
[0091] Since the fourth port RX2 is shorted and the sum of the
fourth length L4 of the sixth electrical path 506 between the
second node P2 and the third node P3 and the second length L2 of
the fourth electrical path 504 between the fourth port TX4 and the
second node P2 corresponds to the odd multiple of 1/4 of the first
wavelength .lamda.1 of the first signal, the fourth signal
transmission path 604 may operate to be substantially the same as
the opened state.
[0092] In this case, only the first signal transmission path 601
may operate as an electrical path connected between the conductive
pattern 530 and the RFIC 452.
[0093] FIG. 7 is a block diagram of a feed network for receiving a
signal in a first band, according to an embodiment.
[0094] Referring to FIG. 7, the RFIC 452 may be configured to
receive the second signal in the first band. The RFIC 452 may
connect the remaining ports TX1, TX2, and RX2 to ground other than
the second port RX1 for receiving the second signal. The RFIC 452
may receive the second signal from the conductive pattern 530
through the second signal reception path 602.
[0095] Since the first port TX1 is shorted and the length of the
first electrical path 501 between the first node P1 and the first
port TX1 corresponds to the first length L1 corresponding to the
odd multiple of 1/4 of the first wavelength .lamda.1 of the second
signal, the first electrical path 501 may operate to be
substantially the same as the opened state for a signal of a first
wavelength. For example, the first signal transmission path 601 may
operate to be substantially the same as the opened state, due to
the opening of the first electrical path 501.
[0096] Since the third port TX2 and the fourth port RX2 are shorted
and the sum of the second length L2 and the fourth length L4 of the
sixth electrical path 506 between the second node P2 and the third
node P3 corresponds to the odd multiple of 1/4 of the first
wavelength .lamda.1 of the first signal, the third signal
transmission path 603 and the fourth signal reception path 604 may
operate to be substantially the same as the opened state.
[0097] Accordingly, in this case, only the second signal reception
path 602 may operate as an electrical path connected between the
conductive pattern 530 and the RFIC 452.
[0098] FIG. 8 is a block diagram of a feed network for transmission
in a second band, according to an embodiment.
[0099] Referring to FIG. 8, the RFIC 452 may be configured to
transmit the third signal in the second band. The RFIC 452 may
connect the remaining ports TX1, RX1, and RX2 to ground other than
the third port TX2 for transmitting the third signal. The RFIC 452
may feed the third signal to the conductive pattern 530 via the
third signal transmission path 603.
[0100] Since the first port TX1 and the second port RX1 are shorted
and the sum of the first length L1 and the third length L3 of the
fifth electrical path 505 between the first node P1 and the third
node P3 corresponds to the odd multiple of 1/4 of the second
wavelength .lamda.2 of the third signal, the first signal
transmission path 601 and the second signal reception path 602 may
operate to be substantially the same as the opened state.
[0101] Since the fourth port RX2 is shorted and the length of the
fourth electrical path 504 between the second node P2 and the
second port RX2 corresponds to the second length L2 corresponding
to the odd multiple of 1/4 of the second wavelength .lamda.2 of the
third signal, the fourth electrical path 504 may operate to be
substantially the same as the opened state for a signal of a second
wavelength. For example, the fourth signal reception path 604 may
operate to be substantially the same as the opened state, due to
the opening of the fourth electrical path 504.
[0102] Accordingly, in this case, only the third signal
transmission path 603 may operate as an electrical path connected
between the conductive pattern 530 and the RFIC 452.
[0103] FIG. 9 is a block diagram of a feed network for receiving a
signal in a second band, according to an embodiment.
[0104] Referring to FIG. 9, the RFIC 452 may be configured to
receive the fourth signal in the second band. According to an
embodiment, the RFIC 452 may connect the remaining ports TX1, RX1,
and TX2 to ground other than the second port RX2 for receiving the
fourth signal. The RFIC 452 may receive the fourth signal from the
conductive pattern 530 through the fourth signal reception path
604.
[0105] Since the first port TX1 and the second port RX1 are shorted
and the sum of the first length L1 and the third length L3 of the
fifth electrical path 505 between the first node P1 and the third
node P3 corresponds to the odd multiple of 1/4 of the second
wavelength .lamda.2 of the fourth signal, the first signal
transmission path 601 and the second signal reception path 602 may
operate to be substantially the same as the opened state.
[0106] Since the third port TX2 is shorted and the length of the
third electrical path 503 between the second node P2 and the third
port TX2 corresponds to the second length L2 corresponding to the
odd multiple of 1/4 of the second wavelength of the fourth signal,
the third electrical path 503 may operate to be substantially the
same as the opened state for a signal of a second wavelength. For
example, the third signal transmission path 603 may operate to be
substantially the same as the opened state, due to the opening of
the third electrical path 503.
[0107] Accordingly, in this case, only the fourth signal reception
path 604 may operate as an electrical path connected between the
conductive pattern 530 and the RFIC 452.
[0108] FIG. 10 is a block diagram of an RFIC, according to an
embodiment.
[0109] Referring to FIG. 10, the RFIC 452 may include at least one
switch for selectively connecting to each of the first port TX1,
the second port RX1, the third port TX2, and the fourth port RX2.
For example, the RFIC 452 may include a first switch 1011 for
selectively connecting the first signal transmission path 601 to a
first RF circuit 1001 or ground, a second switch 1012 for
selectively connecting the second signal reception path 602 to a
second RF circuit 1002 or the ground, a third switch 1013 for
selectively connecting the third signal transmission path 603 to a
third RF circuit 1003 or the ground, and/or a fourth switch 1014
for selectively connecting the fourth signal reception path 604 to
a fourth RF circuit 1004 or the ground. For example, the first RF
circuit 1001, the second RF circuit 1002, the third RF circuit
1003, and/or the fourth RF circuit 1004 may include an amplifier
for amplifying a signal and/or a phase shifter. For example, the
amplifiers of the first RF circuit 1001 and the second RF circuit
1002 may have linearity in a frequency band corresponding to the
first frequency band. The amplifiers of the third RF circuit 1003
and the fourth RF circuit 1004 may have linearity in a frequency
band corresponding to the second frequency band.
[0110] The RFIC 452 may receive the fourth signal, using the fourth
port RX2. For example, the RFIC 452 may control the fourth switch
1014 to connect the fourth port RX2 to the fourth RF circuit 1004.
For example, the RFIC 452 may connect the remaining ports to the
ground, using the first switch 1011, the second switch 1012, and
the third switch 1013. As described above with reference to FIG. 9,
in this case, the remaining signal transmission/reception paths
601, 602, and 603 other than the fourth signal reception path 604
may operate to be substantially the same as the opened state.
[0111] FIG. 11 is an illustration of a feed network of an antenna
module, according to an embodiment.
[0112] Referring to FIG. 11, an antenna module may include the PCB
410, the conductive pattern 530, and the RFIC 452. For example, the
PCB 410 may include a first surface, on which the conductive
pattern 530 is formed, and a second surface facing away from the
first surface. For example, the RFIC 452 may be positioned on the
second surface. The PCB 410 may be formed of a plurality of layers.
For example, the PCB 410 may include the feed network W1, which is
formed through the plurality of layers of the PCB 410 and which
electrically connects the RFIC 452 to the conductive pattern 530.
For example, the antenna module may include an antenna structure
including the feed network W1 and the conductive pattern 530. The
antenna module may include the RFIC 452 and the antenna
structure.
[0113] The first port TX1 of the RFIC 452 may be connected to the
first electrical path 501 through a first connection part 1141. The
second port RX1 may be connected to the second electrical path 502
through a second connection part 1142. The third port TX2 may be
connected to the third electrical path 503 through a third
connection part 1143. The fourth port RX2 may be connected to the
fourth electrical path 504 through a fourth connection part
1144.
[0114] The RFIC 452 may transmit a first signal having a first
frequency and a first wavelength .lamda.1, using the first port TX1
and may receive a second signal having the first frequency and the
first wavelength .lamda.1, using the second port RX1. The RFIC 452
may transmit a third signal having a second frequency and a second
wavelength .lamda.2, using the third port TX2 and may receive a
fourth signal having the second frequency and the second wavelength
.lamda.2, using the fourth port RX2.
[0115] For example, the first electrical path 501 may extend
between the first port TX1 and the first node 1121 and may have a
first length L1. The second electrical path 502 may extend between
the second port RX1 and the first node 1121 and may have the first
length L1. The fifth electrical path 505 may extend between the
first node 1121 and the third node 1123 and may have a third length
L3. The seventh electrical path 507 may extend between the third
node 1123 and the conductive pattern 530. For example, the seventh
electrical path 507 may correspond to the feed part 325.
[0116] For example, the first length L1 may correspond to the odd
multiple of 1/4 of the first wavelength .lamda.1 of the first
signal or the second signal; the second length L2 may correspond to
the odd multiple 1/4 of the second wavelength .lamda.2 of the third
signal or the fourth signal. According to an embodiment, the sum of
the first length L1 and the third length L3 may correspond to the
odd multiple of 1/4 of the second wavelength .lamda.2 of the third
signal or the fourth signal. The sum of the second length L2 and
the fourth length L4 may correspond to the odd multiple of 1/4 of
the first wavelength .lamda.1 of the first signal or the second
signal.
[0117] For example, the third electrical path 503 may extend
between the third port TX2 and the second node 1122 and may have
the second length L2. The fourth electrical path 504 may extend
between the fourth port RX2 and the second node 1122 and may have
the second length L2. The sixth electrical path 506 may extend
between the second node 1122 and the third node 1123 and may have
the fourth length L4. The seventh electrical path 507 may extend
between the third node 1123 and the conductive pattern 530.
[0118] Each of the first electrical path 501, the second electrical
path 502, the third electrical path 503, and the fourth electrical
path 504 may be selectively connected to the ground through at
least one switch. For example, at least one switch may be a switch
included in the RFIC 452. The RFIC 452 may be configured to connect
the remaining electrical paths other than the electrical path used
for transmission or reception among the first electrical path 501,
the second electrical path 502, the third electrical path 503, and
the fourth electrical path 504, to the ground through at least one
switch.
[0119] Each of the first electrical path 501, the second electrical
path 502, the third electrical path 503, and the fourth electrical
path 504 may be formed through a plurality of layers of the PCB
410. For example, the numbers of layers associated with the first
electrical path 501 and the second electrical path 502 may be the
same as each other. For example, the numbers of layers associated
with the third electrical path 503 and the fourth electrical path
504 may be the same as each other. For example, the numbers of
layers associated with the first electrical path 501 and the third
electrical path 503 may be different from each other.
[0120] The first node 1121 and the second node 1122 may be
positioned at different layers. For example, the first node 1121
may be positioned on a layer more adjacent to the conductive
pattern 530 than the second node 1122. However, the present
disclosure is not intended to be limited thereto. For example, the
first node 1121 and the second node 1122 may be positioned on the
same layer. For example, the second node 1122 may be positioned on
a layer more adjacent to the conductive pattern 530 than the first
node 1121.
[0121] The third node 1123 may be positioned on a layer more
adjacent to the conductive pattern 530 than the first node 1121 and
the second node 1122. For example, the third node 1123 may be
positioned on the same layer as a ground layer. The third node 1123
may be positioned to be more adjacent to the second node 1122 than
the first node 1121.
[0122] FIG. 12 illustrates charts of response characteristics of an
antenna module, according to an embodiment.
[0123] Referring to FIG. 12, a simulation result of an antenna
module designed according to embodiments of the disclosure are
illustrated.
[0124] A signal response characteristic 1202 of a first signal
transmission path of the antenna module is illustrated. In the
response curve 1201, m1 indicates a point at 26 GHz, and m2
indicates a point at 30 GHz. The antenna module may have a loss of
between about 0.3 dB and about 0.4 dB in the first band.
[0125] A signal response characteristic 1202 of the third signal
transmission path of the antenna module is illustrated. In the
response curve 1202, m3 indicates a point at 37 GHz, and m4
indicates a point at 40 GHz. The antenna module may have a loss of
between about 0.2 dB and about 0.3 dB in the second band.
[0126] According to an embodiment, an electronic device may include
a housing including a first plate (e.g., a cover plate), a second
plate (e.g., a rear plate) facing away from the first plate, and a
side member (e.g., a side bezel structure) surrounding a space
between the first plate and the second plate and coupled with the
second plate or integrally formed with the second plate. The
electronic device may include a display exposed through at least
part of the first plate and a wireless communication circuit
including a first port, a second port, a third port, and a fourth
port. The wireless communication circuit may include a first port
TX1, a second port RX1, a third port TX2, and a fourth port RX2.
The wireless communication circuit may be configured to transmit a
first signal having a first frequency via the first port, to
receive a second signal having the first frequency via the second
port, to transmit a third signal having a second frequency
different from the first frequency via the third port, and to
receive a fourth signal having the second frequency via the fourth
port. The antenna structure disposed inside the housing may include
a conductive pattern and a first node P1, a second node P2, and a
third node P3, which are electrically connected to the conductive
pattern. The antenna structure may include the first electrical
path 501 extending between the first port and the first node and
having a first length that is an odd multiple of 1/4 of a first
wavelength of the first signal, a second electrical path extending
between the second port and the first node and having the first
length, a third electrical path extending between the third port
and the second node and having a second length that is an odd
multiple of 1/4 of a second wavelength of the second signal, a
fourth electrical path extending between the fourth port and the
second node and having the second length, a fifth electrical path
extending between the first node and the third node and having a
third length, wherein a sum of the first length and the third
length is an odd multiple of 1/4 of the second wavelength, a sixth
electrical path extending between the second node and the third
node and having a fourth length, wherein a sum of the second length
and the fourth length is an odd multiple of 1/4 of the first
wavelength, and a seventh electrical path electrically connected
between the third node and the conductive pattern.
[0127] Each of the first electrical path, the second electrical
path, the third electrical path, and the fourth electrical path may
be selectively connected to the ground through at least one switch.
For example, the at least one switch may be included in the
wireless communication circuit.
[0128] The wireless communication circuit may be configured to
connect remaining electrical paths other than an electrical path
used for transmission or reception among the first electrical path,
the second electrical path, the third electrical path, and the
fourth electrical path, to the ground through the at least one
switch.
[0129] The antenna structure may include a printed circuit board
including a first surface, on which the conductive pattern is
formed, and a second surface facing away from the first surface.
The PCB may include a plurality of layers. The wireless
communication circuit may be positioned on the second surface of
the PCB.
[0130] Each of the first electrical path, the second electrical
path, the third electrical path, the fourth electrical path, the
fifth electrical path, the sixth electrical path, and the seventh
electrical path may be formed through at least one layer of the
plurality of layers of the PCB. For example, the first node and the
second node may be positioned on different layers from each other
among the plurality of layers. For example, the third node may be
positioned on a layer more adjacent to the conductive pattern among
the plurality of layers than the first node and the second node.
For example, the antenna structure may include a plurality of
conductive patterns. For example, the first frequency may be not
greater than 30 GHz. The second frequency may exceed 30 GHz.
[0131] According to an embodiment, an antenna module may include a
wireless communication circuit including a first port, a second
port, a third port, and a fourth port. The wireless communication
circuit may be configured to transmit a first signal having a first
frequency via the first port, receive a second signal having the
first frequency via the second port, transmit a third signal having
a second frequency different from the first frequency via the third
port, and receive a fourth signal having the second frequency via
the fourth port. The antenna module may further include a PCB in
which a conductive pattern is formed on a first surface and in
which the wireless communication circuit is positioned on a second
surface facing away from the first surface. The PCB may include a
first node, a second node, and a third node electrically connected
to the conductive pattern. The PCB may include a first electrical
path extending between the first port and the first node and having
a first length that is an odd multiple of 1/4 of a first wavelength
of the first signal, a second electrical path extending between the
second port and the first node and having the first length, a third
electrical path extending between the third port and the second
node and having a second length that is an odd multiple of 1/4 of a
second wavelength of the second signal, a fourth electrical path
extending between the fourth port and the second node and having
the second length, a fifth electrical path extending between the
first node and the third node and having a third length, wherein a
sum of the first length and the third length is an odd multiple of
1/4 of the second wavelength, a sixth electrical path extending
between the second node and the third node and having a fourth
length, wherein a sum of the second length and the fourth length is
an odd multiple of 1/4 of the first wavelength, and a seventh
electrical path electrically connected between the third node and
the conductive pattern.
[0132] Each of the first electrical path, the second electrical
path, the third electrical path, and the fourth electrical path is
selectively connected to a ground through at least one switch. For
example, the at least one switch may be included in the wireless
communication circuit. The wireless communication circuit may be
configured to connect remaining electrical paths other than an
electrical path used for transmission or reception among the first
electrical path, the second electrical path, the third electrical
path, and the fourth electrical path, to the ground through the at
least one switch.
[0133] The wireless communication circuit may include a first
communication circuit for transmitting the first signal, a second
communication circuit for receiving the second signal, a third
communication circuit for transmitting the third signal, and a
fourth communication circuit for receiving the fourth signal. The
wireless communication circuit may be configured to selectively
connect the first electrical path to the first communication
circuit or the ground, to selectively connect the second electrical
path to the second communication circuit or the ground, to
selectively connect the third electrical path to the third
communication circuit or the ground, and to selectively connect the
fourth electrical path to the fourth communication circuit or the
ground, using the at least one switch.
[0134] Each of the first electrical path, the second electrical
path, the third electrical path, the fourth electrical path, the
fifth electrical path, the sixth electrical path, and the seventh
electrical path may be formed through at least one layer of the
plurality of layers of the PCB.
[0135] For example, the first node and the second node may be
positioned on different layers from each other among the plurality
of layers. For example, the third node may be positioned on a layer
more adjacent to the conductive pattern among the plurality of
layers than the first node and the second node.
[0136] The antenna module may further include a plurality of
conductive patterns disposed on the first surface. Each of the
plurality of conductive patterns may include a plurality of
electrical paths, each of which respectively connects a plurality
of ports of the wireless communication circuit to the plurality of
conductive patterns. A configuration of the plurality of ports and
the electrical paths may be substantially the same as the first
port, the second port, the third port, the fourth port, the first
electrical path, the second electrical path, the third electrical
path, the fourth electrical path, the fifth electrical path, the
sixth electrical path, and the seventh electrical path.
[0137] An electronic device may include an antenna module
supporting dual bands capable of securing the specified antenna
performance.
[0138] An antenna module having the improved linearity may be
provided.
[0139] An antenna module capable of minimizing internal loss may be
provided.
[0140] In addition, a variety of effects directly or indirectly
understood through the disclosure may be provided.
[0141] While the present disclosure has been shown and described
with reference to various embodiments thereof, it will be
understood by those skilled in the art that various changes in form
and details may be made therein without departing from the spirit
and scope of the present disclosure as defined by the appended
claims and their equivalents.
* * * * *