U.S. patent application number 16/341900 was filed with the patent office on 2020-10-08 for display panel and preparation method therefor, and display device.
The applicant listed for this patent is WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.. Invention is credited to Chen XIA.
Application Number | 20200321411 16/341900 |
Document ID | / |
Family ID | 1000004622931 |
Filed Date | 2020-10-08 |
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United States Patent
Application |
20200321411 |
Kind Code |
A1 |
XIA; Chen |
October 8, 2020 |
DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY
DEVICE
Abstract
A display panel and a preparation method therefor, and a display
device are disclosed. The display panel includes a first base
layer; a barrier layer, disposed on the first base layer; a second
base layer, disposed on the barrier layer; a first
high-temperature-resistant adhesive layer, configured to adhere the
first base layer to the barrier layer; and a second
high-temperature-resistant adhesive layer, configured to adhere the
barrier layer to the second base layer. Beneficial effects: An
inorganic high-temperature-resistant adhesive layer is coated
between the base layer and the barrier layer, so that the base
layer can be adhered to the barrier layer more firmly, to improve
bending performance of the base layer, and reduce a risk of a
fracture between the base layer and the barrier layer, thereby
improving a bending capability of the flexible display panel, and
improving a product yield, controllability, and endurance.
Inventors: |
XIA; Chen; (Wuhan,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY
CO., LTD. |
Wuhan, Hubei |
|
CN |
|
|
Family ID: |
1000004622931 |
Appl. No.: |
16/341900 |
Filed: |
April 2, 2019 |
PCT Filed: |
April 2, 2019 |
PCT NO: |
PCT/CN2019/081090 |
371 Date: |
April 14, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/3244 20130101;
H01L 2227/323 20130101; H01L 51/56 20130101; H01L 51/5253
20130101 |
International
Class: |
H01L 27/32 20060101
H01L027/32; H01L 51/52 20060101 H01L051/52; H01L 51/56 20060101
H01L051/56 |
Claims
1. A display panel, comprising: a first base layer; a barrier
layer, disposed on the first base layer; a second base layer,
disposed on the barrier layer; a first high-temperature-resistant
adhesive layer, configured to adhere the first base layer to the
barrier layer; and a second high-temperature-resistant adhesive
layer, configured to adhere the barrier layer to the second base
layer; wherein melting points of the first
high-temperature-resistant adhesive layer and the second
high-temperature-resistant adhesive layer are 500.degree. C. to
1300.degree. C.
2. The display panel according to claim 1, further comprising a
thin film transistor (TFT) structural layer, disposed on the second
base layer; an organic light-emitting diode (OLED), disposed on the
TFT structural layer; and a thin film encapsulation (TFE) layer,
configured to package the TFT structural layer and the OLED.
3. The display panel according to claim 1, wherein the barrier
layer is a single-layer structure of a silica layer, or a
single-layer structure of a silicon nitride layer, or a multi-layer
structure in which silica layers and silicon nitride layers are
alternately disposed; and materials used for the first base layer
and the second base layer are polyimide (PI).
4. The display panel according to claim 1, wherein materials of the
first high-temperature-resistant adhesive layer and the second
high-temperature-resistant adhesive layer are inorganic nanometer
materials, comprising at least one of inorganic copper oxide,
inorganic silicate, inorganic phosphate, and inorganic acid
salt.
5. (canceled)
6. The display panel according to claim 1, wherein a thickness of
the barrier layer is 0.1 .mu.m to 1.0 .mu.m; thicknesses of the
first base layer and the second base layer are 5 .mu.m to 15 .mu.m;
and thicknesses of the first high-temperature-resistant adhesive
layer and the second high-temperature-resistant adhesive layer are
0.1 .mu.m to 1.0 .mu.m.
7. A method for preparing a display panel, comprising the following
steps: (S1) providing a substrate; (S2) forming a first base layer
on the substrate; (S3) coating or spraying a
high-temperature-resistant adhesive on the first base layer, to
form a first high-temperature-resistant adhesive layer; (S4)
forming a barrier layer on the first high-temperature-resistant
adhesive layer; (S5) coating or spraying a
high-temperature-resistant adhesive on the barrier layer, to form a
second high-temperature-resistant adhesive layer; and (S6) forming
a second base layer on the second high-temperature-resistant
adhesive layer; wherein melting points of the first
high-temperature-resistant adhesive layer and the second
high-temperature-resistant adhesive layer are 500.degree. C. to
1300.degree. C.
8. The method for preparing a display panel according to claim 7,
wherein after step (S6), the method further comprises the following
steps: (S7) forming a thin film transistor (TFT) structural layer
on the second base layer; (S8) correspondingly forming an organic
light-emitting diode (OLED) on the TFT structural layer; (S9)
forming a thin film encapsulation (TFE) layer for packaging the TFT
structural layer and the OLED; and (S10) removing the
substrate.
9. The method for preparing a display panel according to claim 7,
wherein in step (S2), a polyimide (PI) material is coated on the
substrate, to form the first base layer after defoaming and curing;
and in step (S6), a PI material is coated on the barrier layer, to
form the second base layer after defoaming and curing.
10. A display device, comprising the display panel according to
claim 1.
11. The display device according to claim 10, further comprising: a
thin film transistor (TFT) structural layer, disposed on the second
base layer; an organic light-emitting diode (OLED), disposed on the
TFT structural layer; and a thin film encapsulation (TFE) layer,
configured to package the TFT structural layer and the OLED.
12. The display device according to claim 10, wherein the barrier
layer is a single-layer structure of a silica layer, or a
single-layer structure of a silicon nitride layer, or a multi-layer
structure in which silica layers and silicon nitride layers are
alternately disposed; and materials used for the first base layer
and the second base layer are polyimide (PI).
13. The display device according to claim 10, wherein materials of
the first high-temperature-resistant adhesive layer and the second
high-temperature-resistant adhesive layer are inorganic nanometer
materials, comprising at least one of inorganic copper oxide,
inorganic silicate, inorganic phosphate, and inorganic acid
salt.
14. (canceled)
15. The display device according to claim 10, wherein a thickness
of the barrier layer is 0.1 .mu.m to 1.0 .mu.m; thicknesses of the
first base layer and the second base layer are 5 .mu.m to 15 .mu.m;
and thicknesses of the first high-temperature-resistant adhesive
layer and the second high-temperature-resistant adhesive layer are
0.1 .mu.m to 1.0 .mu.m.
Description
FIELD OF INVENTION
[0001] The present invention relates to the display field, and in
particular, to a display panel and a preparation method therefor,
and a display device.
BACKGROUND OF INVENTION
[0002] An organic light-emitting diode (OLED) display panel has
such advantages as self-illumination, high contrast, a small
thickness, a wide viewing angle, and a high response speed, is the
representative of a new-generation plane display technology, and is
increasingly praised highly by the industry. A flexible OLED
display panel is one of the important development trends.
[0003] A flexible OLED display panel is lighter and thinner, and
can reduce power consumption, thereby helping improve a battery
life of a corresponding product. In addition, because of
bendability and flexibility of the flexible OLED display panel, the
flexible OLED display panel is also more durable than an ordinary
hard display panel. Flexible OLED display panels can be widely
applied to products having a display function, such as tablet
computers, televisions, mobile terminals, and a wide range of
wearable devices.
[0004] With development of display technologies, there are
increasingly high requirements on a color and lightness, and a
flexible OLED display is gradually entering the consumer electronic
market of mobile devices, televisions, and the like. As a flexible
display, a base layer prepared by using polyimide (PI) as a main
component is a flexible substrate of a thin film transistor (TFT)
structure and an OLED structure. However, a poor capability of the
base layer to block oxygen (O.sub.2) and water (H.sub.2O) causes a
part of water or oxygen to pass through the base layer into a
circuit of the TFT structure, and affects a service life of OLED
light-emitting materials.
[0005] In recent years, an OLED display technology has developed
rapidly, and OLED products have gained more attention and are more
widely applied because of such advantages as a light and thin body,
a fast response, a wide viewing angle, high contrast, and
flexibility, and are mainly applied to mobile phones, tablet
computers, televisions, and other display fields.
[0006] A flexible OLED display panel device includes a PI flexible
layer, a TFT drive layer, an OLED light-emitting layer, a thin film
encapsulation (TFE) layer, and the like from bottom to top. A
luminescence principle of an OLED is to deposit an OLED
light-emitting layer between two electrodes, galvanize the OLED
light-emitting layer, and implement luminescence through carrier
injection and compounding. In a flexible OLED display technology,
PI is usually used to replace a conventional glass substrate to
implement foldable and flexible display. To implement better
bending and water and oxygen barrier performance, double-layer PI
is usually used to replace single-layer PI, namely, a PI-silicon
and nitride-PI structure. However, due to relatively poor
adhesiveness between organic PI and inorganic silicon nitride, the
double-layer PI structure is prone to a fracture between PI and
silicon nitride film layers during bending, causing water and
oxygen intrusion into the OLED display panel, causing an oxidation
failure of the OLED light-emitting layer, and reducing product
tolerance.
Technical Problem
[0007] To resolve the foregoing technical problem, the present
invention provides a display panel and a preparation method
therefor, and a display device, to resolve a prior-art problem that
during bending, a base layer is easily separated from a barrier
layer in the display panel, causing water and oxygen intrusion and
causing a failure of a light-emitting layer in the display
panel.
SUMMARY OF INVENTION
[0008] A technical solution to solve the foregoing problem is as
follows: The present invention provides a display panel, including
a first base layer; a barrier layer, disposed on the first base
layer; a second base layer, disposed on the barrier layer; a first
high-temperature-resistant adhesive layer, configured to adhere the
first base layer to the barrier layer; and a second
high-temperature-resistant adhesive layer, configured to adhere the
barrier layer to the second base layer.
[0009] Further, the display panel further includes a TFT structural
layer, disposed on the second base layer; an OLED, disposed on the
TFT structural layer; and a TFE layer, configured to package TFT
structural layer and the OLED.
[0010] Further, the barrier layer is a single-layer structure of a
silica layer, or a single-layer structure of a silicon nitride
layer, or a multi-layer structure in which silica layers and
silicon nitride layers are alternately disposed. Materials used for
the first base layer and the second base layer are PI.
[0011] Further, materials of the first high-temperature-resistant
adhesive layer and the second high-temperature-resistant adhesive
layer are inorganic nanometer materials, including at least one of
inorganic copper oxide, inorganic silicate, inorganic phosphate,
and inorganic acid salt.
[0012] Further, a melting point of each of the first
high-temperature-resistant adhesive layer and the second
high-temperature-resistant adhesive layer are 500.degree. C. to
1300.degree. C.
[0013] Further, a thickness of the barrier layer is 0.1 .mu.m to
1.0 .mu.m. Thicknesses of the first base layer and the second base
layer are 5 .mu.m to 15 .mu.m. Thicknesses of the first
high-temperature-resistant adhesive layer and the second
high-temperature-resistant adhesive layer are 0.1 .mu.m to 1.0
.mu.m.
[0014] The present invention further provides a method for
preparing a display panel, including the following steps: (S1)
providing a substrate; (S2) forming a first base layer on the
substrate; (S3) coating or spraying a high-temperature-resistant
adhesive on the first base layer, to form a first
high-temperature-resistant adhesive layer; (S4) forming a barrier
layer on the first high-temperature-resistant adhesive layer; (S5)
coating or spraying a high-temperature-resistant adhesive on the
barrier layer, to form a second high-temperature-resistant adhesive
layer; and (S6) forming a second base layer on the second
high-temperature-resistant adhesive layer.
[0015] Further, after step (S6), the method further includes the
following steps: (S7) forming a TFT structural layer on the second
base layer; (S8) correspondingly forming an OLED on the TFT
structural layer; (S9) forming a packaging layer for packaging the
TFT structural layer and the OLED; and (S10) removing the
substrate.
[0016] Further, in step (S2), a PI material is coated on the
substrate, to form the first base layer after defoaming and curing;
and in step (S6), a PI material is coated on the barrier layer, to
form the second base layer after defoaming and curing.
[0017] The present invention further provides a display device,
including the display panel.
Beneficial Effect
[0018] The present invention provides the display panel and the
preparation method therefor, and the display device. An inorganic
high-temperature-resistant adhesive layer is coated between the
first base layer and the barrier layer, and between the second base
layer and the barrier layer, so that the base layer can be adhered
to the barrier layer more firmly, to improve bending performance of
the base layer, and reduce a risk of a fracture between the base
layer and the barrier layer, thereby improving a bending capability
of the flexible display panel, and improving a product yield,
controllability, and endurance.
BRIEF DESCRIPTION OF DRAWINGS
[0019] To describe the technical solutions in the embodiments of
the present invention more clearly, the following briefly describes
the accompanying drawings required for describing the embodiments.
Apparently, the accompanying drawings in the following description
show merely some embodiments of the present invention, and a person
skilled in the art may still derive other drawings from these
accompanying drawings without creative efforts.
[0020] FIG. 1 is a schematic diagram of forming a first base layer
in a method for preparing a display panel according to an
embodiment.
[0021] FIG. 2 is a schematic diagram of forming a first
high-temperature-resistant adhesive layer in a method for preparing
a display panel according to an embodiment.
[0022] FIG. 3 is a schematic diagram of forming a barrier layer in
a method for preparing a display panel according to an
embodiment.
[0023] FIG. 4 is a schematic diagram of forming a second
high-temperature-resistant adhesive layer in a method for preparing
a display panel according to an embodiment.
[0024] FIG. 5 is a schematic diagram of forming a second base layer
in a method for preparing a display panel according to an
embodiment.
[0025] FIG. 6 is a schematic diagram of a display panel and a
display device according to an embodiment.
[0026] FIG. 7 is a schematic flowchart of a method for preparing a
display panel according to an embodiment.
REFERENCE NUMERALS
[0027] 1: Display device [0028] 10: Display panel [0029] 110: First
base layer 120: Barrier layer [0030] 130: Second base layer 140:
High-temperature-resistant adhesive layer [0031] 1410: First
high-temperature-resistant adhesive layer 1420: Second
high-temperature-resistant adhesive layer [0032] 150: TFT
structural layer 160: OLED 170: TFE layer 111: Substrate
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0033] The following embodiments are described with reference to
the accompanying drawings, and are used to exemplify specific
embodiments for implementation of the present invention. Terms
about directions mentioned in the present invention, such as
"upper", "lower", "front", "rear", "left", "right", "top", and
"bottom" merely refer to directions in the accompanying drawings.
Therefore, the used terms about directions are used to describe and
understand the present invention, and are not intended to limit the
present invention.
Embodiment
[0034] As shown in FIG. 6, in the present embodiment, a display
panel 10 in the present invention includes a first base layer 110,
a barrier layer 120, a second base layer 130,
high-temperature-resistant adhesive layer 140, a TFT structural
layer 150, an OLED 160, and a TFE layer 170.
[0035] Materials used for the first base layer 110 and the second
base layer 130 are PI. The barrier layer 120 is disposed between
the first base layer 110 and the second base layer 130. The barrier
layer 120 may be prepared by a silica (SiO2) material, or may be
prepared by a silicon nitride (SiNx) material. Thicknesses of the
first base layer 110 and the second base layer 130 are 5 .mu.m to
15 .mu.m. A thickness of the barrier layer 120 is 0.1 .mu.m to 2.0
.mu.m, and specifically, may be 0.2 .mu.m, or 0.5 .mu.m, or 1.1
.mu.m, or 1.9 .mu.m.
[0036] In the present embodiment, the barrier layer may be a
single-layer silica layer, or may be a single-layer silicon nitride
layer, or certainly, may be a multi-layer structure in which silica
layers and silicon nitride layers are alternately disposed.
[0037] In the multi-layer structure of the barrier layer 120, an
arrangement form of the silica layers and the silicon nitride
layers may be written as A-B-A-B-A-B- . . . , namely, (AB)n, where
n is an integer greater than or equal to 1, A indicates the silica
layer, and B indicates the silicon nitride layer. The barrier layer
120 of the multi-layer structure can extend a penetration path of
water and oxygen and has a better capability of blocking steam and
oxygen.
[0038] In a specific implementation of the present invention, in
comparison with a flexible substrate prepared by using a separate
PI flexible substrate or another organic polymer material, a
composite substrate structure formed by the first base layer 110,
the barrier layer 120, and the second base layer 130 has the
following features: On one hand, the composite substrate structure
formed by the first base layer 110, the barrier layer 120, and the
second base layer 130 has good performance of blocking water and
oxygen, thereby greatly reducing a probability that water and
oxygen pass through the flexible substrate, protecting the TFT
structural layer and an OLED structure, and prolonging a service
life of an OLED display panel. On the other hand, the composite
flexible substrate structure also has good flexibility, and can be
widely applied to preparing flexible panels.
[0039] However, because adhesiveness between the first base layer
110 and the barrier layer 120, and adhesiveness between the barrier
layer 120 and the second base layer 130 are relatively poor, during
bending, a fracture easily occurs, causing water and oxygen
intrusion, and causing an oxidation failure of a light-emitting
layer of the display panel 10. In the present embodiment, one
high-temperature-resistant adhesive layer 140 is added between the
first base layer 110 and the barrier layer 120, and between the
barrier layer 120 and the second base layer 130. Specifically, the
high-temperature-resistant adhesive layer 140 includes a first
high-temperature-resistant adhesive layer 1410 and a second
high-temperature-resistant adhesive layer 1420. The first
high-temperature-resistant adhesive layer 1410 is configured to
adhere the first base layer 110 to the barrier layer 120. The
second high-temperature-resistant adhesive layer 1420 is configured
to adhere the barrier layer 120 to the second base layer 130. The
high-temperature-resistant adhesive layer 140 has relatively strong
adhesiveness, and a thickness of 0.1 .mu.m to 1.0 .mu.m, which may
be specifically 0.3 .mu.m, 0.5 .mu.m, 0.7 .mu.m, or 0.9 .mu.m, and
can withstand a high temperature of 500.degree. C. to 1300.degree.
C. and more. That is, a melting point of the
high-temperature-resistant adhesive layer 140 is at least
500.degree. C. to 1300.degree. C. The high-temperature-resistant
adhesive layer 140 can maintain an excellent adhering function and
erosion-resistance at a high temperature, and a material thereof is
an inorganic nanometer composite adhesive that is specifically at
least one of an inorganic copper oxide material, an inorganic
silicate material, an inorganic phosphate material, and an
inorganic sulfate material.
[0040] The TFT structural layer 150 is disposed on the second base
layer 130. The OLED 160 is disposed on the TFT structural layer
150. The TFE layer 170 packages the OLED 160 and the TFT structural
layer 150.
[0041] To more clearly explain the display panel of the present
invention, the present invention is further described below with
reference to a method for preparing a display panel.
[0042] As shown in FIG. 7, a method for preparing a display panel
of the present invention includes step (S1) to step (S10):
[0043] (S1) Provide a substrate 111. In the present embodiment, the
substrate 111 selects a glass substrate.
[0044] (S2) Form a first base layer 110 on the substrate 111. As
shown in FIG. 1, in the present embodiment, a PI material is coated
on the substrate 111, to form the first base layer 110 after
defoaming and curing.
[0045] (S3) As shown in FIG. 2, coat or spray a
high-temperature-resistant adhesive on the first base layer 110, to
form a first high-temperature-resistant adhesive layer 1410.
[0046] (S4) As shown in FIG. 3, form a barrier layer 120 on the
first high-temperature-resistant adhesive layer 1410. In the
present embodiment, a PI material is coated on the barrier layer
120, to form a second base layer 130 after defoaming and
curing.
[0047] (S5) As shown in FIG. 4, coat or spray a
high-temperature-resistant adhesive on the barrier layer 120, to
form a second high-temperature-resistant adhesive layer 1420.
[0048] (S6) As shown in FIG. 5, form the second base layer 130 on
the second high-temperature-resistant adhesive layer 1420.
[0049] (S7) Form a TFT structural layer 150 on the second base
layer 130.
[0050] (S8) Correspondingly form an OLED 160 on the TFT structural
layer 150.
[0051] (S9) Form a TFE layer 170 for packaging the TFT structural
layer 150 and the OLED 160.
[0052] (S10) Remove the substrate 111.
[0053] The present invention further provides a display device 1. A
main improvement and a feature of the display device are both
revealed by the display panel 10. For other components of the
display device, details are not described one by one.
[0054] The above descriptions are merely preferred embodiments of
the present invention, but are not intended to limit the present
invention. Any modification, equivalent replacement, and
improvement made without departing from the spirit and principle of
the present invention shall fall within the protection scope of the
present invention.
* * * * *