U.S. patent application number 16/840312 was filed with the patent office on 2020-10-08 for abrasive article, abrasive system and method for using and forming same.
The applicant listed for this patent is SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC.. Invention is credited to Robin Chandras JAYARAM, Arunvel THANGAMANI.
Application Number | 20200316754 16/840312 |
Document ID | / |
Family ID | 1000004902970 |
Filed Date | 2020-10-08 |
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United States Patent
Application |
20200316754 |
Kind Code |
A1 |
JAYARAM; Robin Chandras ; et
al. |
October 8, 2020 |
ABRASIVE ARTICLE, ABRASIVE SYSTEM AND METHOD FOR USING AND FORMING
SAME
Abstract
An abrasive article includes a body and an electronic assembly
coupled to the body, the electronic assembly including an
electronic device, and a first portion between the body and the
communication device, the first portion having a material of an
average relative magnetic permeability of not greater than 15.
Inventors: |
JAYARAM; Robin Chandras;
(Thiruvananthapuram, IN) ; THANGAMANI; Arunvel;
(Chennai, IN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAINT-GOBAIN ABRASIVES, INC.
SAINT-GOBAIN ABRASIFS |
Worcester
Conflans-Sainte-Honorine |
MA |
US
FR |
|
|
Family ID: |
1000004902970 |
Appl. No.: |
16/840312 |
Filed: |
April 3, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B24D 3/346 20130101;
B24D 3/10 20130101; B24D 11/001 20130101 |
International
Class: |
B24D 11/00 20060101
B24D011/00; B24D 3/10 20060101 B24D003/10; B24D 3/34 20060101
B24D003/34 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 3, 2019 |
IN |
201941013460 |
Claims
1. An abrasive article comprising: a body; an electronic assembly
coupled to the body, wherein the electronic assembly comprises: an
electronic device; and a first portion disposed between the body
and the communication device, wherein the first portion comprises a
material having an average relative magnetic permeability of not
greater than 15.
2. The abrasive article of claim 1, wherein the electronic assembly
comprises a first portion and a second portion, wherein the first
portion comprises a first average relative magnetic permeability
and the second portion comprises a second average relative magnetic
permeability, and wherein the first average relative magnetic
permeability is different than the second average relative magnetic
permeability.
3. The abrasive article of claim 2, further comprising at least one
of: 1) a magnetic permeability difference value (.DELTA.MP=MP2/MP1)
within a range of at least 1.1 and not greater than 100, wherein
MP1 is the first average relative magnetic permeability and MP2 is
the second average relative magnetic permeability; 2) a dielectric
difference value (.DELTA.DV=DV1/DV2) of at least 1.1 and not
greater than 1000, wherein DV1 is the first average dielectric
value of the first portion and DV2 is the second average dielectric
value of the second portion; 3) a reflection difference value
(.DELTA.RFR=RFR1/RFR2) of at least 1.1 and not greater than 100,
wherein RFR1 is a RF reflectance of the first portion and RFR2 is a
RF reflectance of the second portion; or 4) a combination
thereof.
4. The abrasive article of claim 2, further comprising at least one
of: 1) a first average relative magnetic permeability of the first
portion within a range of at least 1 and not greater than 15 for
electromagnetic radiation of at least 3 kHz and not greater than
300 GHz, and a second average relative magnetic permeability of the
second portion within a range of at least 1 and not greater than 15
for electromagnetic radiation of at least 3 kHz and not greater
than 300 GHz. 2) a first portion comprising a first dielectric
value of at least 1 and not greater than 20, and wherein the second
portion comprises a second dielectric value of at least 1 and not
greater than 20, and wherein the first dielectric value is
different than the second dielectric value; 3) a first RF
reflectance of the first portion of at least 50% and not greater
than 90% for electromagnetic radiation of at least 3 kHz and not
greater than 3 GHz, and a second RF reflectance of the second
portion of not greater than 40% for electromagnetic radiation of at
least 3 kHz and not greater than 300 GHz; or 4) a combination
thereof.
5. The abrasive article of claim 1, wherein the electronic device
is configured for wireless communication and has a minimum
effective communication range of at least 0.3 meters and a minimum
data transmission rate of at least 4 kbps.
6. The abrasive article of claim 1, wherein the first portion is
disposed between the body and the electronic assembly and is in
direct contact with the body.
7. The abrasive article of claim 1, further comprising a second
portion different than the first portion, wherein the second
portion is overlying the first portion.
8. The abrasive article of claim 7, wherein the electronic device
is disposed between the first portion and the second portion.
9. The abrasive article of claim 8, wherein the electronic assembly
is surrounded by the first portion and the second portion.
10. The abrasive article of claim 1, wherein the electronic device
includes a device selected from the group of an electronic tag,
electronic memory, a sensor, an analog-to-digital converter, a
transmitter, a receiver, a transceiver, a modulator circuit, a
multiplexer, an antenna, a near-field communication device, a power
source a display, an optical device, a global positioning system, a
data transponder, a secure data storage device, a secure logic
device, or any combination thereof.
11. The abrasive article of claim 1, wherein the electronic device
comprises at least one of a passive radio frequency identification
(RFID) tag, an active radio frequency identification (RFID) tag, a
sensor, a passive near-field communication device (passive NFC), an
active near-field communication device (active NFC), or any
combination thereof.
12. The abrasive article of claim 1, wherein the first portion is
surrounding at least 10% and not greater than 90% of a total
surface area of the electronic device as viewed in
cross-section.
13. The abrasive article of claim 1, wherein the first portion is
part of a package of the electronic assembly, and the first portion
defines at least 10 vol % of a total volume of the package.
14. The abrasive article of claim 1, wherein the first portion is
part of a package of the electronic assembly, and the first portion
defines at least 10 vol % of a total volume of the package 14. The
abrasive article of claim 1, further comprising a second portion
different from the first portion, wherein the first portion and
second portion are part of a package of the electronic assembly and
the first portion defines a lesser volume as compared to the second
portion, wherein the first portion comprises polyimide,
polyethylene terephthalate, polytetrafluoroethylene, and further
wherein the second portion comprises PDMS, PEN, polyimide, PEEK or
any combination thereof.
15. The abrasive article of claim 1, wherein the body comprises an
abrasive portion and a non-abrasive portion, and wherein the first
portion is coupled to the abrasive portion, wherein the first
portion is at least partially embedded in the abrasive portion, and
wherein the abrasive portion comprises a metal or metal alloy
comprising including a conductivity of at least 10.times.103
Siemens/meter at 25.degree. C. or a RF attenuation value of at
least 40 dB.
16. The abrasive article of claim 1, wherein the body comprises an
abrasive portion and a non-abrasive portion, and wherein the first
portion is coupled to the non-abrasive portion that is free of
abrasive particles, wherein the first portion is at least partially
embedded in the non-abrasive portion, and wherein the non-abrasive
portion comprises a metal or metal alloy including a conductivity
of at least 10.times.10.sup.3 Siemens/meter at 25.degree. C. or a
RF attenuation value of at least 40 dB.
17. An abrasive article comprising: a body; and an electronic
assembly coupled to the body, wherein the electronic assembly is
releasably secured to the body by one or more securing assemblies
configured to facilitate selective removal of the electronic
assembly from the body.
18. The abrasive article of claim 17, wherein the securing assembly
comprises a complementary engagement structure including at least
one engagement element coupled to the electronic assembly and
configured for complementary engagement with at least one receiving
element, and further wherein the complementary engagement structure
includes an engaged position and a disengaged position, wherein in
the engaged position the at least one engagement element is engaged
with the at least one receiving element, and further wherein the
electronic assembly is oriented in a non-parallel configuration,
wherein the body comprises a radial axis and an axial axis and the
electronic assembly comprises a longitudinal axis that is not
parallel to either the radial axis or the axial axis.
19. An abrasive article comprising: a body comprising: a cavity
extending into the body; an electronic assembly in the cavity; and
a spacing factor of the electronic assembly of at least 0.65, the
spacing factor defined as Dw/Dt, wherein Dw is the distance from an
outer edge of the electronic assembly to an outer edge of the
cavity at the exterior surface of the body, and Dt is a depth of
the cavity.
20. The abrasive article of claim 19, further comprising at least
one of 1) a wall of the cavity having an angle of at least 100
degrees and not greater than 170 degrees relative to the exterior
surface; 2) an adapter configured to at least partially contain the
electronic assembly and be disposed within the cavity to center the
electronic assembly within the cavity; 3) a spacing factor of at
least 0.9; 4) a bottom surface of the cavity having a normalized
average flatness between 0.00001 mm.sup.-1 to 0.0001 mm.sup.-1; or
5) any combination thereof.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application claims priority to Indian Patent
Application No. 201941013460, entitled "ABRASIVE ARTICLES, ABRASIVE
SYSTEMS, AND METHODS OF FORMING AND USING SAME," by Robin Chandras
JAYARAM et al., filed Apr. 3, 2019, which is assigned to the
current assignee hereof and incorporated herein by reference in its
entirety.
FIELD OF THE DISCLOSURE
[0002] The present disclosure relates to abrasive articles and
abrasive systems, and more particularly, abrasive articles and/or
abrasive systems including an electronic assembly.
BACKGROUND
[0003] Abrasive articles can include abrasive particles attached to
a matrix material and be used to remove material from an object.
Various types of abrasive articles can be formed, including but not
limited to, coated abrasive articles, bonded abrasive articles,
convoluted abrasive articles, abrasive brushes, and the like.
Coated abrasive articles generally include one or more layers of
abrasive material overlying a substrate. The abrasive particles can
be affixed to the substrate using one or more adhesive layers. A
bonded abrasive article can include a three dimensional matrix of
bond material and abrasive particles contained within the matrix of
bond material. Bonded abrasive articles may include some content of
porosity within the body.
[0004] The manufacturing and use of abrasive articles can vary
widely and the industry continues to demand improved abrasive
articles.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Embodiments are illustrated by way of example and are not
limited to the accompanying figures.
[0006] Skilled artisans appreciate that elements in the figures are
illustrated for simplicity and clarity and have not necessarily
been drawn to scale.
[0007] FIG. 1A includes a flow chart for forming an abrasive
article according to an embodiment.
[0008] FIG. 1B includes a flow chart for forming an abrasive
article according to an embodiment.
[0009] FIG. 1C includes a flow chart for forming an abrasive
article according to an embodiment.
[0010] FIG. 2A includes a cross-sectional illustration of a portion
of an abrasive article according to an embodiment.
[0011] FIG. 2B includes a top-down illustration of the abrasive
article of FIG. 2A according to an embodiment.
[0012] FIG. 2C includes a cross-sectional illustration of a portion
of an abrasive article according to an embodiment.
[0013] FIGS. 2D-2J include cross-sectional illustrations of
portions of an electronic assemblies according to embodiments.
[0014] FIG. 2K includes a top-down illustration of a portion of an
abrasive article according to an embodiment.
[0015] FIG. 2L includes a cross-sectional illustration of a first
portion according to an embodiment.
[0016] FIGS. 3A-3E include cross-sectional illustrations of
portions of abrasive articles according to embodiments.
[0017] FIG. 4A includes a cross-sectional illustration of a portion
of a coated abrasive article according to an embodiment.
[0018] FIG. 4B includes a top-down illustration of a portion of a
coated abrasive article according to an embodiment.
[0019] FIG. 4C includes an illustration of a portion of a coated
abrasive article according to an embodiment.
[0020] FIG. 4D includes an illustration of a portion of an abrasive
article according to an embodiment.
[0021] FIG. 5 includes a diagram of a supply chain and function of
an abrasive article according to an embodiment.
[0022] FIG. 6 includes a diagram of a supply chain and function of
an abrasive article according to an embodiment.
[0023] FIG. 7A includes a cross-sectional illustration of a portion
of an abrasive article including a securing assembly according to
an embodiment.
[0024] FIG. 7B includes a top-down view of the embodiment of FIG.
7A.
[0025] FIG. 8A includes a cross-sectional illustration of a portion
of an abrasive article including a securing assembly according to
an embodiment.
[0026] FIG. 8B includes a magnified illustration of a portion of
the embodiment of FIG. 8A.
[0027] FIGS. 9A and 9B include perspective-view illustrations of a
portion of a body of an abrasive article and a portion of an
electronic assembly according to an embodiment.
[0028] FIG. 10A includes a cross-sectional illustration of a
portion of an abrasive article including a securing assembly
according to an embodiment.
[0029] FIG. 10B includes a cross-sectional illustration of a
portion of an abrasive article including a securing assembly
according to an embodiment.
[0030] FIG. 10C includes a top-down illustration of the embodiment
of FIG. 10B.
[0031] FIG. 11 includes a cross-sectional illustration of a portion
of an abrasive article including a securing assembly according to
an embodiment.
[0032] FIG. 12 includes a cross-sectional illustration of a portion
of an abrasive article including a window according to an
embodiment.
[0033] FIGS. 13A and 13B include abrasive systems according to an
embodiment.
[0034] FIGS. 14A and 14B include cross-sectional illustrations of
portions of abrasive articles according to embodiments.
[0035] FIG. 15 includes a cross-sectional illustration of a portion
of an abrasive article according to an embodiment.
[0036] FIG. 16 illustrates a block diagram of an electronic
assembly according to an example embodiment.
[0037] FIG. 17 includes a top-down illustration of an abrasive
article according to an embodiment.
[0038] FIG. 18 includes a schematic illustration of a transceiver
and transponder that may be used in an abrasive system or abrasive
article of the embodiments herein.
[0039] FIG. 19A includes a cross-sectional illustration of a
portion of an abrasive article including a cavity according to one
embodiment.
[0040] FIG. 19B includes a cross-sectional illustration of a
portion of an abrasive article including a cavity according to one
embodiment.
[0041] FIG. 20 includes a graph showing a relationship between the
spacing factor and communication distance according to one
embodiment.
[0042] FIG. 21A includes a top view of an adapter containing an
electronic assembly according to one embodiment.
[0043] FIG. 21B includes a top view of an adapter containing an
electronic assembly according to one embodiment.
[0044] FIG. 21C includes a top view of an adapter containing an
electronic assembly according to one embodiment.
[0045] FIG. 21D includes a top view of an adapter containing an
electronic assembly according to one embodiment.
[0046] FIG. 21E includes an image of an adaptor containing an RFID
tag attached to a wheel cavity according to one embodiment.
[0047] FIG. 21F includes an image of an adaptor containing an RFID
tag attached to a wheel cavity according to one embodiment.
[0048] FIG. 21G includes a scheme placing an electronic assembly on
an adapter and a wheel cavity according to one embodiment.
[0049] FIG. 22 includes a cross-sectional illustration of a
multi-layer adapter and an electronic assembly contained in a
cavity of a body according to one embodiment.
[0050] FIG. 23A includes a top view of a line drawing illustrating
positions for coupling an electronic assembly on a wheel surface
according to one embodiment.
[0051] FIG. 23B includes an image of a section of an abrasive wheel
comprising a cavity including an electronic assembly according to
one embodiment.
[0052] FIG. 23C includes an image of a section of an abrasive wheel
comprising a cavity including an electronic assembly according to
one embodiment.
[0053] FIG. 24A includes a cross-section of a body illustrating an
electronic assembly contained in a cavity according to one
embodiment.
[0054] FIG. 24B includes a cross-section of a body illustrating an
electronic assembly contained in a cavity.
[0055] FIG. 24C includes a cross-section of a body illustrating an
electronic assembly contained in a cavity.
DETAILED DESCRIPTION
[0056] The following discussion will focus on specific
implementations and embodiments of the teachings. The detailed
description is provided to assist in describing certain embodiments
and should not be interpreted as a limitation on the scope or
applicability of the disclosure or teachings. It will be
appreciated that other embodiments can be used based on the
disclosure and teachings as provided herein.
[0057] The terms "comprises," "comprising," "includes,"
"including," "has," "having" or any other variation thereof, are
intended to cover a non-exclusive inclusion. For example, a method,
article, or apparatus that comprises a list of features is not
necessarily limited only to those features but may include other
features not expressly listed or inherent to such method, article,
or apparatus. Further, unless expressly stated to the contrary,
"or" refers to an inclusive-or and not to an exclusive-or. For
example, a condition A or B is satisfied by any one of the
following: A is true (or present) and B is false (or not present),
A is false (or not present) and B is true (or present), and both A
and B are true (or present).
[0058] Also, the use of "a" or "an" is employed to describe
elements and components described herein. This is done merely for
convenience and to give a general sense of the scope of the
invention. This description should be read to include one, at least
one, or the singular as also including the plural, or vice versa,
unless it is clear that it is meant otherwise. For example, when a
single item is described herein, more than one item may be used in
place of a single item. Similarly, where more than one item is
described herein, a single item may be substituted for that more
than one item.
[0059] The abrasive articles of the embodiments herein can have
various structures, grades and architectures and can be used in a
variety of material removal operations. In an embodiment, the
abrasive articles can include a fixed abrasive article. In a
particular embodiment, the abrasive article can include bonded
abrasive articles, coated abrasive articles and the like.
[0060] FIG. 1A includes a flow chart providing steps for forming an
abrasive article according to an embodiment. As illustrated, the
process begins at step 101 with forming of abrasive body precursor.
An abrasive body precursor can be a green body or unfinished
abrasive article, wherein at least one more process is needed to
transform the abrasive body precursor into a finally-formed
abrasive body. Such processes can include, but are not limited to
curing, heating, sintering, cooling, drying, pressing, molding,
casting, punching, or any combination thereof.
[0061] According to one embodiment, the abrasive body precursor can
be a liquid material, such as a liquid mixture. The liquid mixture
can include some or all of the components configured to form the
finally-formed abrasive article. For example, the liquid mixture
can include the abrasive particles and a bond precursor
material.
[0062] In still another embodiment, the abrasive body precursor can
be a solid green body. Reference herein to a green body, is an
object that is formed into a solid three-dimensional body, but will
undergo a final treatment, such as curing or a heat treatment to
further solidify and/or densify the body. In particular, a green
body includes a precursor bond material that is solid, but will
undergo further treatment to transform the precursor bond material
into a finally-formed bond material in the finally-formed abrasive
article.
[0063] As noted herein, the abrasive body precursor may include a
bond precursor material. A bond precursor material can include one
or more components that can undergo a process to transform from the
bond precursor material into the finally-formed bond material. Some
suitable bond precursor materials can include an organic or
inorganic material. For example, the bond precursor material can
include a resin, an epoxy, a polyamide, a metal, a metal alloy, a
vitreous material (e.g., a frit), a ceramic, or any combination
thereof.
[0064] The abrasive body precursor may also include abrasive
particles. The abrasive particles may include one or more various
types, including for example, a mix of different types of abrasive
particles. The abrasive particles can include any type of abrasive
particle used and known by those of skill in the art. For example,
the abrasive particles can include an inorganic material, including
but not limited to, an oxide, a carbide, a nitride, a boride, a
carbon-based materials (e.g., diamond), an oxycarbides, an
oxynitride, an oxyboride, a superabrasive material, or any
combination thereof. The abrasive particles can include shaped
abrasive particles, crushed abrasive particles, exploded abrasive
particles, agglomerated particles, unagglomerated particles,
monocrystalline particles, polycrystalline particles, or any
combination thereof. The abrasive particles can include a material
selected from the group of silicon dioxide, silicon carbide,
alumina, zirconia, flint, garnet, emery, rare earth oxides, rare
earth-containing materials, cerium oxide, sol-gel derived
particles, gypsum, iron oxide, glass-containing particles, brown
fused alumina (57A), seeded gel abrasive, sintered alumina with
additives, shaped and sintered aluminum oxide, pink alumina, ruby
alumina (e.g., 25A and 86A), electrofused monocrystalline alumina
32A, MA88, alumina zirconia abrasives (NZ, NV,ZF), extruded
bauxite, cubic boron nitride, diamond, aluminum oxy-nitride,
extruded alumina (e.g., SR1, TG, and TGII), or any combination
thereof. In certain instances, the abrasive particles can be
particularly hard, having for example, a Mohs hardness of at least
6, such as at least 6.5, at least 7, at least 8, at least 8.5, at
least 9. The finally-formed abrasive article can include any of the
types of abrasive particles included in the precursor abrasive
body.
[0065] The abrasive particles can have an average particle size
(D50) of at least 0.1 microns, such as at least 1 micron, at least
5 microns, at least 10 microns, at least 20 microns, at least 30
microns, at least 40 microns or at least 50 microns or at least 100
microns or at least 200 microns or at least 500 microns or at least
1000 microns. Still, in another non-limiting embodiment, the
abrasive particles can have an average particle size (D50) of not
greater than 5000 microns, such as not greater than 4000 microns or
not greater than 3000 microns or not greater than 2000 microns or
not greater than 1000 microns or not greater than 500 microns or
not greater than 200 microns or not greater than 100 microns or not
greater than 80 microns or not greater than 60 microns or not
greater than 30 microns or not greater than 10 microns or not
greater than 1 micron. It will be appreciated that the abrasive
particles can have an average particle size within a range
including any of the minimum and maximum values noted above.
Moreover, it will be appreciated that the finally-formed abrasive
article can have abrasive particles having an average particles
size within a range including any of the minimum and maximum
percentages noted above.
[0066] The abrasive particles can include blends of different
particles, which may differ from each other based on one or more
abrasive characteristics, such as hardness, average particle size,
average grain (i.e., crystallite size), toughness, two-dimensional
shape, three-dimensional shape, composition, or any combination
thereof. The blends of abrasive particles can include a primary and
a secondary abrasive particle. The primary and secondary abrasive
particles can include any of the compositions of abrasive particles
described herein.
[0067] The abrasive body precursor can include a content of
abrasive particles suitable for use as an abrasive article. For
example, the abrasive body precursor can include at least 0.5 vol %
abrasive particles for a total volume of the abrasive body
precursor. In still other embodiments, the abrasive body precursor
can include at least 1 vol % abrasive particles, such as at least 5
vol % or at least 10 vol % or at least 15 vol % or at least 20 vol
% or at least 30 vol % or at least 40 vol % or at least 50 vol % or
at least 60 vol % or at least 70 vol % or at least 80 vol %
abrasive particles for a total volume of the abrasive body
precursor. In yet another non-limiting embodiment, the abrasive
body precursor can have not greater than 90 vol % abrasive
particles for the total volume of the abrasive body precursor, such
as not greater than 80 vol % or not greater than 70 vol % or not
greater than 60 vol % or not greater than 50 vol % or not greater
than 40 vol % or not greater than 30 vol % or not greater than 20
vol % or not greater than 10 vol % or not greater than 5 vol %
abrasive particles. It will be appreciated that the abrasive body
precursor can have a content of abrasive particles within a range
including any of the minimum and maximum percentages noted above.
Moreover, it will be appreciated that the finally-formed abrasive
article can have a content of abrasive particles within a range
including any of the minimum and maximum percentages noted
above.
[0068] The abrasive body precursor may further include one or more
types of fillers as known by those of skill in the art. The filler
can be distinct from the abrasive particles and may have a hardness
less than a hardness of the abrasive particles. The filler may
provide improved mechanical properties and facilitate formation of
the abrasive article. In at least one embodiment, the filler can
include various materials, such as fibers, woven materials,
non-woven materials, particles, minerals, nuts, shells, oxides,
alumina, carbide, nitrides, borides, organic materials, polymeric
materials, naturally occurring materials, pore-formers (solid or
hollow), and a combination thereof. In particular instances, the
filler can include a material such as wollastonite, mullite, steel,
iron, copper, brass, bronze, tin, aluminum, kyanite, alusite,
garnet, quartz, fluoride, mica, nepheline syenite, sulfates (e.g.,
barium sulfate), carbonates (e.g., calcium carbonate), cryolite,
glass, glass fibers, titanates (e.g., potassium titanate fibers),
rock wool, clay, sepiolite, an iron sulfide (e.g., Fe.sub.2S.sub.3,
FeS.sub.2, or a combination thereof), fluorspar (CaF.sub.2),
potassium sulfate (K.sub.2SO.sub.4), graphite, potassium
fluoroborate (KBF.sub.4), potassium aluminum fluoride (KAlF.sub.4),
zinc sulfide (ZnS), zinc borate, borax, boric acid, fine alundum
powders, P15A, bubbled alumina, cork, glass spheres, silver,
Saran.TM. resin, paradichlorobenzene, oxalic acid, alkali halides,
organic halides, and attapulgite. Some fillers can volatilize or be
consumed during later processing. Some fillers may become part of
the finally-formed abrasive article. It will be appreciated that
the body can include one or more reinforcing articles (e.g., woven
or non-woven materials) that are incorporated into the body and are
part of the finally-formed abrasive article.
[0069] The abrasive body precursor may further include one or more
additives, including for example, but not limited to stabilizers,
binders, plasticizers, surfactants, friction-reducing materials,
rheology modifying materials, and the like.
[0070] In certain abrasive articles, such as coated abrasive
articles, the abrasive body precursor may include a substrate or
backing, upon which, may be formed one or more abrasive layers.
According to one embodiment, the substrate can include an organic
material, inorganic material, or any combination thereof. In
certain instances, the substrate can include a woven material.
However, the substrate may be made of a non-woven material.
Particularly suitable substrate materials can include organic
materials, including polymers such as polyester, polyurethane,
polypropylene, and/or polyimides such as KAPTON from DuPont, and
paper. Some suitable inorganic materials can include metals, metal
alloys, and particularly, foils of copper, aluminum, steel, and a
combination thereof. The backing can include one or more additives
selected from the group of catalysts, coupling agents, curants,
anti-static agents, suspending agents, anti-loading agents,
lubricants, wetting agents, dyes, fillers, viscosity modifiers,
dispersants, defoamers, and grinding agents.
[0071] In some abrasive articles, such as those utilizing a
substrate, a polymer formulation may be used to form any of a
variety of layers such as, for example, a frontfill, a pre-size,
the make coat, the size coat, and/or a supersize coat. When used to
form the frontfill, the polymer formulation generally includes a
polymer resin, fibrillated fibers (preferably in the form of pulp),
filler material, and other optional additives. Suitable
formulations for some frontfill embodiments can include material
such as a phenolic resin, wollastonite filler, defoamer,
surfactant, a fibrillated fiber, and a balance of water. Suitable
polymeric resin materials include curable resins selected from
thermally curable resins including phenolic resins,
urea/formaldehyde resins, phenolic/latex resins, as well as
combinations of such resins. Other suitable polymeric resin
materials may also include radiation curable resins, such as those
resins curable using electron beam, UV radiation, or visible light,
such as epoxy resins, acrylated oligomers of acrylated epoxy
resins, polyester resins, acrylated urethanes and polyester
acrylates and acrylated monomers including monoacrylated,
multiacrylated monomers. The formulation can also comprise a
nonreactive thermoplastic resin binder that may enhance the
self-sharpening characteristics of the deposited abrasive particles
by enhancing the erodability. Examples of such thermoplastic resin
include polypropylene glycol, polyethylene glycol, and
polyoxypropylene-polyoxyethene block copolymer, etc. Use of a
frontfill on the substrate can improve the uniformity of the
surface, for suitable application of the make coat and improved
application and orientation of shaped abrasive particles in a
predetermined orientation.
[0072] After forming the abrasive body precursor at step 101, the
process continues at step 102 by combining at least one electronic
assembly with the abrasive body precursor. According to an
embodiment, the electronic assembly can include at least one
electronic device. The electronic device can be configured to store
and/or transmit information to one or more systems and/or
individuals in the life of the abrasive article, including for
example, those systems and/or individuals included in the
manufacturing, sale, distribution, storage, use, maintenance and/or
quality of the abrasive article.
[0073] The process of combining the electronic assembly with the
abrasive body precursor can vary depending upon the nature of the
abrasive body precursor. In one example, the process of combining
the abrasive body precursor with the electronic assembly can
include depositing the electronic assembly on or within the mixture
of material defining the abrasive body precursor. In particular,
the process of depositing the electronic assembly on or with the
mixture can include incorporation of the electronic assembly into
the mixture prior to formation of the finally-formed abrasive
article. In such instances, the electronic assembly can be
configured to survive one or more forming processes used to create
the finally-formed abrasive article from the mixture. For example,
the electronic assembly can be configured to survive and function
after the mixture and electronic assembly are subjected to one or
more processes including, for example, but not limited to,
pressing, heating, drying, curing, cooling, molding, stamping,
cutting, machining, dressing, and the like.
[0074] In one particular embodiment, the electronic assembly can be
deposited on the mixture, such that at least a portion of the
electronic assembly can be in contact with and overlying an
exterior surface of the mixture. For example, the entire electronic
assembly can be overlying the exterior surface of the mixture. Such
a deposition process may facilitate forming an abrasive article
having at least a portion of the electronic assembly at an exterior
surface of the abrasive body.
[0075] In another embodiment, the electronic assembly can be
deposited such that a portion of the electronic assembly can be
contained within the mixture, such that at least a portion of the
electronic assembly is positioned below the exterior surface of the
mixture. For example, in one instance, a portion of the electronic
assembly can be embedded within the mixture and another separate
portion of the electronic assembly can be overlying the exterior
surface of the mixture. Such a deposition process may facilitate
formation of an electronic assembly in which a portion of the
electronic assembly is embedded within the body of the abrasive
article below an exterior surface of the body. In yet another
embodiment, the entire electronic assembly can be embedded within
the mixture. Such a deposition process may facilitate formation of
an abrasive article, wherein the electronic assembly can be
embedded entirely within the body of the abrasive article, such
that no portion of the electronic assembly is protruding through
the exterior surface of the body. It may be desirable to utilize a
configuration in which the electronic assembly is partially or
entirely embedded within the body of the abrasive article to reduce
the likelihood of tampering with the electronic assembly and one or
more electronic devices contained therein.
[0076] In still another embodiment, the process of depositing the
electronic assembly on or within the mixture can further include
applying the electronic assembly to one or more components and then
applying the mixture to the component. For example, the electronic
assembly can be placed on or within an article (e.g., a substrate,
a backing, a reinforcing member, a partially-cured or completely
cured abrasive portion, or the like) to be part of the
finally-formed abrasive article and the mixture can be deposited
onto the article. According to one embodiment, the electronic
assembly may be adhered to the article and the mixture can be
deposited over at least a portion or all of the electronic
assembly. Further details regarding the placement of the electronic
assembly are described herein.
[0077] Manufacturing information can be stored on the electronic
assembly during or after one or more forming processes. The
electronic assembly can include one or more electronic devices that
can facilitate the measurement and/or storage of manufacturing
data. Such manufacturing data may be helpful for manufacturers to
know the manufacturing conditions used to form the abrasive
article, and may further be useful in assessing the quality of the
abrasive article. According to one embodiment, one or more read,
write or erase operations can be conducted with each process. For
example, a first process may be conducted in the manufacturing of
the abrasive article and a first set of manufacturing information
can be written to the electronic device. After completing the first
process a read, write, or erase information can be performed. For
example, manufacturing information can be read from the electronic
device. Alternatively, or additionally, a write operation may be
conducted to write new manufacturing information to the electronic
device. Alternatively, or additionally, an erase operation may be
conducted to remove all or a portion of the first set of
manufacturing information. Thereafter, further processes can be
conducted, and each process may include one or more read, write, or
erase operations. In a particular embodiment, the electronic device
can include partitioned portions. A partitioned portion may include
a memory, and certain data may be stored in the memory. In some
instances, one or more partitioned portions may be
access-restricted to protect data from being read or edited by
personnel who does not have the access. For example, manufacturing
data may be stored in a partitioned portion for manufacturer use
only so that others, such as users or distributors, may not make
changes to the manufacturing data. In another instance, restriction
of access to data stored in a partitioned portion may be changed to
allow the data to be read or updated by personnel who is restricted
from accessing the data previously.
[0078] In an alternative embodiment, the process of combining the
at least one electronic assembly with the abrasive body precursor
can include depositing the electronic assembly on a portion of a
solidified green body. As disclosed herein, a green body can be an
object that will undergo further processing. The process of
depositing the electronic assembly on at least a portion of a green
body can include attaching at least a portion of the electronic
assembly to an exterior surface of the green body. In such
instances, the electronic assembly is processed with the green body
through one or more processes to form the finally-formed abrasive
article. Various processes for depositing the electronic assembly
on at least a portion of the green body can be used. For example,
the electronic assembly can be bonded to a portion of the green
body, such as the exterior surface of the green body. A bonding
agent may be used, such as by an adhesive. In another embodiment,
the electronic assembly can be fastened to at least a portion of
the green body by one or more various types of fasteners. In still
another embodiment, a portion of the electronic assembly can be
pressed into a portion of the green body to facilitate attachment,
such that a portion of the electronic assembly is embedded within
the body of the green body.
[0079] In yet another embodiment, the abrasive body precursor can
include an unfinished abrasive body that is a portion of a finally
formed body. In an example, a portion of an abrasive body can be
formed first, and in some instances, may undergo a further
treatment during the process of forming a finally-formed abrasive
body. In another instance, the abrasive body precursor may include
a portion of a finally formed body and a green body of another
portion. In still another instance, the abrasive body precursor may
include a portion of a finally formed body and a material or
material precursor for forming another portion of the finally
formed body. In a further embodiment, an electronic assembly can be
disposed over a portion of the abrasive body precursor, a material
for forming another portion of the finally formed body can be
applied to the abrasive body precursor and the electronic assembly.
The electronic assembly can be coupled to the abrasive body after
further treatment for forming the finally formed abrasive body.
[0080] After combining the at least one electronic assembly with
the abrasive body precursor at step 102, the process can continue
at step 103 by forming the abrasive body precursor into an abrasive
body. Various suitable processes for forming the abrasive body
precursor into an abrasive body can include, but is not limited to,
curing, heating, sintering, firing, cooling, molding, pressing, or
any combination thereof. It will be appreciated that in such
instances, the electronic assembly can survive and function after
one or more forming processes used to form the finally-formed
abrasive article. Such forming processes may be used on a mixture
or a solidified green body.
[0081] According to one embodiment, the forming process can include
heating of the body to a forming temperature. The forming
temperature can affect a transformation of one or more components
in the mixture to form the finally-formed abrasive article. For
example, the forming temperature can be at least 25.degree. C.,
such as at least 40.degree. C. or at least 60.degree. C. or at
least 80.degree. C. or at least 100.degree. C. or at least
150.degree. C. or at least 200.degree. C. or at least 300.degree.
C. or at least 400.degree. C. or at least 500.degree. C. or at
least 600.degree. C. or at least 700.degree. C. or at least
800.degree. C. or at least 900.degree. C. or at least 1000.degree.
C. or at least 1100.degree. C. or at least 1200.degree. C. or at
least 1300.degree. C. Still, in one non-limiting embodiment, the
forming temperature can be not greater than 1500.degree. C. or not
greater than 1400.degree. C. or not greater than 1300.degree. C. or
not greater than 1200.degree. C. or not greater than 1100.degree.
C. or not greater than 1000.degree. C. or not greater than
900.degree. C. or not greater than 800.degree. C. or no greater
than 700.degree. C. or not greater than 600.degree. C. or not
greater than 500.degree. C. or not greater than 400.degree. C. or
not greater than 300.degree. C. or not greater than 200.degree. C.
or not greater than 100.degree. C. or not greater than 80.degree.
C. or not greater than 60.degree. C. It will be appreciated that
the forming temperature can be within a range including any of the
minimum and maximum values noted above.
[0082] In another embodiment, the forming process can include
curing the electronic assembly. For instance, the electronic
assembly can include a material or a material precursor that can
undergo a curing process. Curing the electronic assembly can
include curing of the material or material precursor. In another
instance, curing of the electronic assembly can be conducted by
heating, irradiation, chemical reactions, or any other means known
in the art. In another instance, the forming process can include
heating to cure the electronic assembly, heating to cure the
abrasive body precursor, or heating to cure both. Curing of the
abrasive body precursor can include curing of a precursor material
of the abrasive body precursor. In an aspect, curing the electronic
assembly or the abrasive body can facilitate coupling of the
electronic assembly to the abrasive body, and particularly, curing
can facilitate directly coupling the electronic assembly to the
finally formed abrasive body in a tamper-proof manner. As used
herein, the term, tamper-proof, is intended to mean that the manner
of coupling may not allow the electronic assembly to be removed or
extracted from the abrasive article without damaging the abrasive
article. In a particular example, curing the electronic assembly
and curing the abrasive body precursor can take place in the same
heating process. In another particular embodiment, heating the
electronic assembly and abrasive body precursor can allow the
electronic assembly and abrasive body precursor to co-cure. In yet
another embodiment, curing the electronic assembly and curing the
abrasive body precursor can occur at the same heating temperature.
In yet another instance, the abrasive body can be finally formed by
co-curing the abrasive body precursor and the electronic
assembly.
[0083] In another embodiment, the forming process can include
heating the electronic assembly and heating at least a portion of
the abrasive body precursor. Heating can be conducted at a
temperature at that the abrasive body precursor and/or the
electronic assembly can cure. Particularly, heating can be
performed at the temperature that can allow both the abrasive body
precursor and the electronic assembly to cure. In an aspect,
co-curing the electronic assembly and the abrasive body can be
performed at a temperature that can facilitate improved coupling of
the electronic assembly to the abrasive body and formation of the
abrasive article. For instance, co-curing the electronic assembly
and the abrasive body precursor can be performed at a temperature
of at least 90.degree. C., at least 95.degree. C., at least
100.degree. C., at least 105.degree. C., at least 108.degree. C.,
at least 110.degree. C., at least 115.degree. C., at least
120.degree. C., at least 130.degree. C., at least 140.degree. C.,
at least 150.degree. C., at least 155.degree. C., at least
160.degree. C., at least 165.degree. C., at least 170.degree. C.,
at least 175.degree. C., at least 180.degree. C., at least
190.degree. C., at least 200.degree. C., at least 210.degree. C.,
at least 220.degree. C., at least 230.degree. C., at least
240,.degree. C., or at least 250.degree. C. In another instance,
co-curing the abrasive body precursor and the electronic assembly
may be performed at a temperature of not greater than 250.degree.
C., not greater than 245.degree. C., not greater than 240.degree.
C., not greater than 235.degree. C., not greater than 230.degree.
C., not greater than 220.degree. C., not greater than 215.degree.
C., not greater than 210.degree. C., not greater than 200.degree.
C., not greater than 195.degree. C., not greater than 185.degree.
C., not greater than 180.degree. C., or not greater than
170.degree. C., not greater than 165.degree. C., not greater than
160.degree. C., not greater than 155.degree. C., not greater than
150.degree. C., not greater than 145.degree. C., not greater than
140.degree. C., not greater than 135.degree. C., not greater than
130.degree. C., not greater than 125.degree. C., or not greater
than 120.degree. C. Moreover, co-curing the abrasive body precursor
and the electronic assembly can be performed at a temperature
including any of the minimum and maximum values noted herein. For
instance, co-curing may be performed at a temperature in a range
including at least 90.degree. C. and not greater than 250.degree.
C., such as in a range including at least 120.degree. C. and not
greater than 140.degree. C., or in a range including at least
150.degree. C. and not greater than 190.degree. C.
[0084] In a further aspect, co-curing the abrasive body precursor
and the electronic assembly can be performed for a certain period
of time to facilitate improved coupling of the electronic assembly
to the abrasive body and formation of the abrasive article. For
instance, co-curing can be performed for at least 0.5 hours, at
least 1 hour, at least 2 hours, at least 3 hours, at least 4 hours,
at least 5 hours, at least 6 hours, at least 7 hours, at least 8
hours, at least 10 hours, at least 12 hours, at least 15 hours, at
least 18 hours, at least 20 hours, at least 30 hours, at least 26
hours, at least 28 hours, at least 30 hours, at least 32 hours, at
least 35 hours, or at least 36 hours. In another instance,
co-curing may be performed for not greater than 38 hours, not
greater than 36 hours, not greater than 32 hours, not greater than
30 hours, not greater than 28 hours, not greater than 25 hours, not
greater than 21 hours, not greater than 18 hours, not greater than
16 hours, not greater than 14 hours, not greater than 12 hours, not
greater than 10 hours, not greater than 8 hours, not greater than 7
hours, not greater than 6 hours, not greater than 5 hours, not
greater than 4 hours, not greater than 3 hours, or not greater than
2 hours. Moreover, co-curing the abrasive body precursor and the
electronic assembly can be performed for a period of time including
any of the minimum and maximum values noted herein. For instance,
co-curing may be performed for a period of time in a range
including at least 0.5 hours and not greater than 38 hours, such as
in a range including at least 4 hours and not greater than 10
hours, or in a range including at least 20 hours and not greater
than 32 hours.
[0085] After reading this disclosure, a skilled artisan would
understand that conditions for co-curing the abrasive body
precursor and the electronic assembly can be determined, taking
into consideration factors that can affect temperatures at that the
abrasive body precursor and the electronic assembly cure, such as
the nature of the precursor materials to be cured, to suit
particular implementations.
[0086] In another aspect, the process illustrated in FIG. 1A may
also be used to combine an electronic assembly with a non-abrasive
precursor body. The non-abrasive precursor body will form a
non-abrasive portion of the finally-formed abrasive body, which
will be a region of the abrasive article that is free of abrasive
particles. The non-abrasive precursor body and a non-abrasive
portion of the body may include a precursor bond material or bond
material. In an alternative embodiment, the non-abrasive precursor
body and a non-abrasive portion of the body may be free of a
precursor bond material or bond material.
[0087] FIG. 1B includes a flow chart for forming an abrasive
article according to an embodiment. As illustrated in FIG. 1B, the
process can be initiated at step 110 forming an abrasive body
precursor. The abrasive body precursor can be formed using any of
the processes described in embodiments herein. The abrasive body
precursor can include any of the features of abrasive body
precursors as described in embodiments herein. The process of
forming the abrasive body precursor can include forming a mixture
as described in embodiments herein.
[0088] After forming the abrasive body precursor at step 110, the
process can continue at step 111 by forming the abrasive body
precursor into a finally-formed abrasive body. Suitable forming
processes can include those described in embodiments herein,
including for example, but not limited to, curing, heating,
sintering, firing, cooling, pressing, molding or any combination
thereof. According to one embodiment, the process of forming the
abrasive body precursor into a finally-formed abrasive body can
include heating the abrasive body precursor to a forming
temperature as described in embodiments herein.
[0089] After forming the abrasive body precursor into a
finally-formed abrasive body at step 111, the process can continue
at step 112 by attaching an electronic assembly to the abrasive
body, wherein the electronic assembly comprises at least one
electronic device. The process of attaching can include adhering,
chemical bonding, sinter-bonding, brazing, puncturing, fastening,
connecting, heating, pressing, curing, or any combination thereof.
Moreover, it will be appreciated that the method of attaching may
determine the placement, orientation and exposure of the electronic
assembly. For example, at least a portion of the electronic
assembly can be attached and exposed at an exterior surface of the
body of the abrasive article. In one embodiment, at least a portion
of the electronic assembly can be embedded within the body of the
abrasive article and another portion of the electronic assembly can
be exposed and protruding from the exterior surface of the body of
the abrasive article.
[0090] In an embodiment, attaching an electronic assembly to the
abrasive body can include disposing the electronic assembly over a
surface of the abrasive body. In a particular embodiment, the
electronic assembly can be disposed on an exterior surface of the
abrasive body. An example of an exterior surface can include a
major surface or a peripheral surface the abrasive body. In a
particular instance, the electronic assembly may be disposed on an
exterior surface that is not a grinding surface of the abrasive
body to reduce the likelihood of being damaged during a material
removal operation. In another particular instance, the exterior
surface can include a major surface of the abrasive body, such as a
major surface of a grinding wheel or a major surface of a cut-off
wheel. In yet another particular instance, the exterior surface can
be the surface of an inner circumferential wall of the abrasive
body with a central opening.
[0091] In an embodiment, attaching an electronic assembly to the
abrasive body can include heating the electronic assembly. Heating
can be performed at a temperature that can facilitate improved
bonding of the electronic assembly to the abrasive body. For
instance, heating can be performed at a temperature such that a
portion of the electronic assembly can reach its glass transition
temperature and adhere to the abrasive body in the subsequent
cooling step. In another embodiment, the attaching can include
heating the abrasive body and the electronic assembly such that a
portion of the abrasive body and a portion of the electronic
assembly can reach their respective glass transition temperature
and bonding of the abrasive body and the electronic assembly can be
formed during subsequent cooling.
[0092] In another embodiment, attaching an electronic assembly to
the abrasive body can include pressing the electronic assembly at
an elevated temperature to facilitate improved coupling of the
electronic assembly to the abrasive body. The elevated temperature
can include a temperature higher than room temperature (i.e.,
20.degree. C. to 25.degree. C.). In a particular example, the
elevated temperature can include a glass transition temperature of
a material forming a portion of the electronic assembly, a glass
transition temperature of the bond material, or both. In another
particular instance, pressing the electronic assembly can be
performed at a temperature of at least 90.degree. C., such as at
least 100.degree. C., at least 110.degree. C., at least 120.degree.
C., at least 125.degree. C., at least 130.degree. C., at least
150.degree. C., at least 150.degree. C., or at least 160.degree. C.
Alternatively or additionally, pressing the electronic assembly may
be performed at a temperature of not greater than 180.degree. C.,
not greater than 175.degree. C., not greater than 170.degree. C.,
not greater than 165.degree. C., not greater than 160.degree. C.,
not greater than 155.degree. C., not greater than 150.degree. C.,
not greater than 145.degree. C., not greater than 140.degree. C.,
not greater than 130.degree. C., or not greater than 125.degree. C.
Moreover, pressing the electronic assembly may be performed at a
temperature in a range including any of the minimum and maximum
values noted herein. For example, pressing the electronic assembly
may be performed at a temperature in a range from at least
90.degree. C. to not greater than 180.degree. C.
[0093] In a further example, pressing the electronic assembly can
be performed for a certain period of time to facilitate improved
coupling of the electronic assembly to the bonded body and
formation of the abrasive article, such as at least 10 seconds, at
least 30 seconds, at least 1 minute, at least 2 minutes, at least 5
minutes, at least 10 minutes, at least 15 minutes, at least 20
minutes, at least 25 minutes, or at least 30 minutes.
Alternatively, or additionally, pressing the electronic assembly
may be performed for not greater than 35 minutes, not greater than
30 minutes, not greater than 25 minutes, or not greater than 20
minutes. Moreover, pressing the electronic assembly may be
performed for a time period in a range including any of the minimum
and maximum values noted herein. For example, pressing the
electronic assembly may be performed for at least 10 seconds to not
greater than 35 minutes.
[0094] In a further example, pressing the electronic assembly can
be performed at a certain pressure to facilitate attaching the
electronic assembly to the bonded body and formation of the
abrasive article, such as at least 0.3 bars, at least 1 bar, at
least 3 bars, at least 5 bars, at least 10 bars, at least 15 bars,
at least 20 bars, at least 25 bars, at least 30 bars, at least 35
bars, at least 40 bars, at least 45 bars or at least 50 bars, at
least 60 bars, at least 65 bars, at least 70 bars, at least 75
bars, at least 80 bars, at least 85 bars, at least 90 bars, at
least 100 bars, at least 120 bars, at least 130 bars, at least 135
bars, at least 140 bars, at least 150 bars, at least 160 bars, at
least 170 bars, or at least 180 bars. Alternatively, or
additionally, the pressure may be at most 200 bars, at most 190
bars, at most 180 bars, at most 170 bars, at most 160 bars, at most
150 bars, at most 140 bars, at most 130 bars, at most 120 bars, at
most 110 bars, at most 100 bars, at most 90 bars, at most 80 bars,
at most 70 bars, at most 60 bars, or at most 50 bars. Moreover,
pressing can be operated at the pressure in a range including any
of the minimum and maximum values noted herein. For example,
pressing can be performed at a pressure in a range including at
least 10 bars and at most 200 bars.
[0095] In a particular example, attaching an electronic assembly to
the abrasive body can include subjecting the electronic assembly
and at least a portion of the abrasive body to an autoclaving
operation. In a particular instance, autoclaving can be performed
to attach a plurality of the electronic assemblies to the abrasive
body. In an aspect, the autoclaving operation can include applying
a pressure to the electronic assembly, such as a pressure of at
least 2 bars, at least 5 bars, at least 8 bars, at least 10 bars,
at least 12 bars, at least 13 bars, at least 15 bars or at least 16
bars. Alternatively, or additionally, the pressure may be at most
16 bars, at most 13 bars, at most 11 bars, at most 10 bars, at most
9 bars, at most 7 bars, at most 5 bars, at most 3 bars or at most 2
bars. Moreover, autoclaving can be operated at the pressure
including any of the minimum and maximum values noted herein. For
instance, autoclaving pressure can be in a range including at least
0.3 bars and at most 16 bars.
[0096] The autoclaving operation can also include heating the
electronic assembly at a temperature of at least 90.degree. C.,
such as at least at least 100.degree. C., at least 110.degree. C.,
at least 120.degree. C., at least 125.degree. C., at least
130.degree. C., at least 150.degree. C., at least 150.degree. C.,
or at least 160.degree. C. Alternatively, or additionally, the
heating temperature for performing autoclaving may be not greater
than 160.degree. C., not greater than 155.degree. C., not greater
than 150.degree. C., not greater than 145.degree. C., not greater
than 140.degree. C., not greater than 130.degree. C., not greater
than 125.degree. C., or not greater than 120.degree. C. Moreover,
autoclaving can be operated at a temperature including any of the
minimum and maximum values noted herein. Autoclaving can be
operated for a certain period of time to facilitate coupling the
electronic assembly to the abrasive body, such as for at least 10
minutes to not greater than 30 minutes.
[0097] In another embodiment, attaching an electronic assembly to
the abrasive body can include applying a bonding material over at
least a portion of the abrasive assembly, at least a portion of an
exterior surface of the abrasive body, or both. The bonding
material can include a polymer, an inorganic material, a cement
material, or any combination thereof. A particular example of the
bonding material can include a cement material. The cement material
can be organic or non-organic. A further example of a cement
material can include an oxide, a silicate, such as calcium-based
silicate, aluminum-based silicate, magnesium-based silicate, or any
combination thereof. Another exemplary of the bonding material can
include an adhesive, and in some particular instance, the adhesive
can include epoxy. In a further embodiment, attaching an electronic
assembly to the abrasive body can include curing the bonding
material to form the abrasive article including the abrasive body
coupled to the electronic assembly. In some instances, curing may
be performed at a temperature of at least 15.degree. C., and
additionally or alternatively, curing may be performed at a
temperature of not greater than 40.degree. C., such as not greater
than 35.degree. C. or not greater than 30.degree. C. or not greater
than 25.degree. C. Particularly, curing the cement material may be
performed at a temperature from 20.degree. C. to 40.degree. C.,
such as at room temperature.
[0098] In an embodiment, the electronic assembly can be coupled to
and in direct contact with at least a portion of the abrasive body.
In some particular instances, the electronic assembly can bond to a
portion of the abrasive body. For instance, the electronic assembly
can bond to a component of the abrasive body, such as the bond
material, the abrasive particles, an additive, or any combination
thereof. In particular embodiments, the electronic assembly can be
coupled to the abrasive body in a tamper-proof manner.
[0099] In another aspect, the process illustrated in FIG. 1B may
also be used to combine an electronic assembly with a non-abrasive
precursor body. The non-abrasive precursor body will form a
non-abrasive portion of the finally-formed abrasive body, which
will be a region of the abrasive article that is free of abrasive
particles. The non-abrasive precursor body and a non-abrasive
portion of the body may include a precursor bond material or bond
material. In an alternative embodiment, the non-abrasive precursor
body and a non-abrasive portion of the body may be free of a
precursor bond material or bond material.
[0100] FIG. 1C includes a flow chart providing a process for
forming an abrasive article having an electronic assembly coupled
to a non-abrasive portion of the body of the abrasive article. The
process can be initiated at step 121 by forming an abrasive article
having an abrasive portion and non-abrasive portion. The abrasive
portion includes abrasive particles. The abrasive portion may
further include an abrasive surface having abrasive particles
capable of conducting a material removal operation. The abrasive
portion may include one or more bond materials configured to
contain the abrasive particles or bond the abrasive particles to a
non-abrasive portion. A non-abrasive portion can be free of
abrasive particles. A non-abrasive portion may also be free of bond
material. Still, in at least one embodiment the nonabrasive portion
may comprise only bond material such that it consists essentially
of bond material. An example of the non-abrasive portion can
include a material including a fabric, a fiber, a film, a woven
material, a non-woven material, a glass, a fiberglass, a ceramic, a
polymer, a resin, a polymer, a fluorinated polymer, an epoxy resin,
a polyester resin, a polyurethane, a polyester, a rubber, a
polyimide, a polybenzimidazole, an aromatic polyamide, a modified
phenolic resin, paper, or any combination thereof.
[0101] In a particular embodiment, the non-abrasive portion can
include a reinforcement component, a layer of fabric, a layer
including a woven or non-woven material, a layer including fiber,
blotter paper, or the like, or any combination thereof. In another
particular embodiment, the abrasive body can be a bonded body of a
grinding wheel, a thin wheel, such as a cut-off wheel, a
combination wheel, or an ultra-thin wheel. In more particular
embodiments, the bonded body can include an organic bond material,
and in even more particular embodiments, the bond material can
consist essentially of an organic material. In a particular example
of a thin wheel, the bonded body can include in the body, at least
one abrasive portion and at least one non-abrasive portion that can
be the same as or different from the non-abrasive portion attached
to the surface of the bonded body. An example of the non-abrasive
portion in the abrasive body can include a reinforcement
component.
[0102] In certain instances, the non-abrasive portion may be
integrally formed with the abrasive portion, such as a core or hub
containing abrasive particles on at least a portion of the surface
of the core or hub. The non-abrasive portion may be integrally
bonded to the abrasive portion and facilitate mounting or coupling
of the abrasive article with a tool. Any one or more suitable
methods of joining the abrasive and non-abrasive portions may be
used as known by those of skill in the art. Suitable examples can
include, but is not limited to, pressing, sintering, curing,
bonding, infiltrating, drying, heating, cooling, mechanical
fastening, chemical bonding, welding, brazing, and the like.
[0103] The hub can be configured to facilitate mounting of the body
to a tool. In certain instances, the non-abrasive portion may
include a metal, and more particularly, may consist essentially of
a metal or metal alloy including a transition metal element,
aluminum or any combination thereof. In particular instances, the
metal can include an element such as iron, copper, nickel, silver,
aluminum, cobalt, or any combination thereof.
[0104] In another embodiment, the non-abrasive portion may include
a material having a particular electrical conductivity, such as at
least 10.times.103 Siemens/meter at 25.degree. C. or at least
12.times.103 Siemens/meter at 25.degree. C. or at least
15.times.103 Siemens/meter at 25.degree. C. or at least
20.times.103 Siemens/meter at 25.degree. C. or at least
30.times.103 Siemens/meter at 25.degree. C. or at least
50.times.103 Siemens/meter at 25.degree. C. or at least
100.times.103 Siemens/meter at 25.degree. C. or at least
500.times.103 Siemens/meter at 25.degree. C. or at least
1000.times.103 Siemens/meter at 25.degree. C.
[0105] The process may further continue at step 123 by coupling
electronic assembly to the non-abrasive portion of the abrasive
article. Notably, unlike the processes described in the embodiments
above, the process of FIG. 1C facilitates the coupling of an
electronic assembly to a nonabrasive portion of an abrasive
article. Coupling can include direct or indirect contact the
abrasive and nonabrasive portion. Various orientations and
placements of the electronic assembly is described in more detail
in embodiments herein.
[0106] FIG. 2A includes a cross-sectional illustration of a portion
of an abrasive article according to an embodiment. FIG. 2B includes
a top-down illustration of the abrasive article of FIG. 2A
according to an embodiment.
[0107] As illustrated in FIGS. 2A and 2B, the abrasive article 200
includes a bonded abrasive including a body 201, a first major
surface 202, a second major surface 203 and a side or a peripheral
surface extending between the first major surface 202 and second
major surface 203. The body 201 can further include abrasive
particles 207 contained in a bond material 206. The body 201 can
further include optional porosity 208 that may be distributed
throughout the body 201. The abrasive particles 207 can have any of
the features of abrasive particles described in any of the
embodiments herein.
[0108] In accordance with an embodiment, the bond material 206 can
be an inorganic material, organic material, or any combination
thereof. For example, suitable inorganic materials can include a
metal, a metal alloy, a vitreous material, a monocrystalline
material, a polycrystalline material, a glass, a ceramic, or any
combination thereof. Suitable examples of organic materials can
include, but is not limited to, thermoplastic materials,
thermosets, elastomers, or any combination thereof. In a particular
embodiment, the bond material 206 can include a resin, epoxy, or
any combination thereof.
[0109] In accordance with an embodiment, the bond material 206 may
have a particular forming temperature that is the same as the
forming temperatures used to form the abrasive body as described in
embodiments herein. For example, the bond material 206 may have a
forming temperature of at least 25.degree. C., such as at least
40.degree. C. or at least 60.degree. C. or at least 80.degree. C.
or at least 100.degree. C. or at least 150.degree. C. or at least
200.degree. C. or at least 300.degree. C. or at least 400.degree.
C. or at least 500.degree. C. or at least 600.degree. C. or at
least 700.degree. C. or at least 800.degree. C. or at least
900.degree. C. or at least 1000.degree. C. or at least 1100.degree.
C. or at least 1200.degree. C. or at least 1300.degree. C. Still,
in one non-limiting embodiment, the forming temperature can be not
greater than 1500.degree. C. or not greater than 1400.degree. C. or
not greater than 1300.degree. C. or not greater than 1200.degree.
C. or not greater than 1100.degree. C. or not greater than
1000.degree. C. or not greater than 900.degree. C. or not greater
than 800.degree. C. or not greater than 700.degree. C. or not
greater than 600.degree. C. or not greater than 500.degree. C. or
not greater than 400.degree. C. or not greater than 300.degree. C.
or not greater than 200.degree. C. or not greater than 100.degree.
C. or not greater than 80.degree. C. or not greater than 60.degree.
C. It will be appreciated that the forming temperature of the bond
material 206 can be within a range including any of the minimum and
maximum values noted above.
[0110] As noted herein, the body 201 can include porosity 208
contained within the body. For example, the body 201 may include
closed prosody, open porosity, or any combination thereof. Closed
pores are generally discrete and separate pores contained within
the bond material 206. In contrast, open porosity can define
interconnected channels extending through the body 201. In one
particular embodiment, the abrasive body may have a content of
porosity 208 within a range of at least 0.5 vol % to not greater
than 95 vol % for a total volume of the body 201.
[0111] According to one embodiment, the abrasive article 200 can
include an electronic assembly 220 attached to an exterior surface
of the body 201, such as the first major surface 202. In one
embodiment, the electronic assembly 220 can include at least one
electronic device 222 that may be contained within a package 221.
The package 221 may be suitable for attaching the electronic
assembly 220 to the body 201, and may provide some suitable
protection of the one or more electronic devices contained therein.
In particular examples, the electronic device 222 can be
encapsulated within the package 221.
[0112] According to one embodiment, the electronic device 222 can
be configured to be written-to with information, store information,
or provide information to other objects during a read operation.
Such information may be relevant to the manufacturing of the
abrasive article, operation of the abrasive article or conditions
encountered by the electronic assembly 220. Reference herein to the
electronic device will be understood to be reference to at least
one electronic device, which can include one or more electronic
devices. In at least one embodiment, the electronic device 222 can
include at least one device selected from the group including an
integrated circuit and chip, data transponder, a radio frequency
based tag or sensor with or without chip, an electronic tag,
electronic memory, a sensor, an analog to digital converter, a
transmitter, a receiver, a transceiver, a modulator circuit, a
multiplexer, an antenna, a near-field communication device, a power
source, a display (e.g., LCD or OLED screen), optical devices
(e.g., LEDs), global positioning system (GPS) or device, or any
combination thereof. In some instances, the electronic device may
optionally include a substrate, a power source, or both. In one
particular embodiment, the electronic device 222 can include a tag,
such as a passive radio frequency identification (RFID) tag. In
another embodiment, the electronic device 222 can include an active
radio frequency identification (RFID) tag. An active RFID tag can
include a power supply, such as a batter or inductive capacitive
(LC) tank circuit. In a further embodiment, the electronic device
222 can be wired or wireless.
[0113] According to one aspect, the electronic device 222 can
include a sensor. The sensor may be selectively operated by any
system and/or individual within the supply chain. For example, the
sensor can be configured to sense one or more processing conditions
during the formation of the abrasive article. In another
embodiment, the sensor may be configured to sense a condition
during use of the abrasive article. In yet another embodiment, the
sensor can be configured to sense a condition in the environment of
the abrasive article. The sensor can include an acoustic sensor
(e.g., ultrasound sensor), force sensor, vibration sensor,
temperature sensor, moisture sensor, pressure sensor, gas sensor,
timer, accelerometer, gyroscope, or any combination thereof. The
sensor can be configured to alert any system and/or individual
associated with the abrasive article, such as a manufacturer and/or
customer to a particular condition sensed by the sensor. The sensor
may be configured to generate an alarm signal to one or more
systems and/or individuals in the supply chain, including but not
limited to, manufacturers, distributors, customers, users, or any
combination thereof.
[0114] In another embodiment, the electronic device 222 may include
a near-field communication device. A near field communication
device can be any device capable of transmitting information via
electromagnetic radiation within a certain defined radius of the
device, typically less than 20 meters. The near-field communication
device can be coupled to one or more electronic devices, including
for example a sensor. In one particular embodiment, a sensor can be
coupled to the near-field communication device and configured to
relay information to one or systems and/or individuals in the
supply chain via the near-field communication device.
[0115] In an alternative embodiment, the electronic device 222 can
include a transceiver. A transceiver can be a device that can
receive information and/or transmit information. Unlike passive
RFID tags or passive near-field communication devices, which are
generally read-only devices that store information for a read
operation, a transceiver can actively transmit information without
having to conduct an active read operation. Moreover, the
transceiver may be capable of transmitting information over various
select frequencies, which may improve the communication
capabilities of the electronic assembly with a variety of systems
and/or individuals in the supply chain.
[0116] In another embodiment, the electronic assembly 220 can
include a flexible electronic device. For instance, the electronic
device can have a certain bend radius, such as not greater than 13
times the thickness of the electronic device, not greater than 12
times the thickness of the electronic device, not greater than 10
times the thickness of the electronic device, not greater than 9
times the thickness of the electronic device, not greater than 8
times the thickness of the electronic device, not greater than 7
times the thickness of the electronic device, not greater than 6
times the thickness of the electronic device, not greater than 5
times the thickness of the electronic device. Alternatively, or
additionally, the electronic device can have a bend radius at least
half the thickness of the electronic device, or at least the
thickness the electronic device. It is to be understood the
flexible electronic device can have a bend radius within a range
including any of the minimum and maximum values noted herein. As
used herein, bend radius is measured to the inside curvature and is
the minimum radius that the electronic device can be bent without
being damaged. In an embodiment, bend radius may be affected by the
structure of the flexible electronics. For example, a
single-layered flexible electronic device may have a bending radius
not greater than 5 times its thickness, while a flexible electronic
device having a plurality of layers may have bending radius not
greater than 12 times its thickness.
[0117] In an aspect, the flexible electronic device can include a
substrate, wherein the substrate can include a flexible material.
In another aspect, the flexible electronic device can include a
flexible substrate. For instance, the substrate can include an
organic material, such as a polymer. In another example, the
substrate can include a flexible conductive material, such as
conductive polyester. In a particular example, the substrate can
consist essentially of an organic material, and in more particular
examples, the substrate can consist essentially of a polymer. A
particular example of a polymer can include a plastic material,
including for example, but not limited to a polyimide, a polyether
ether ketone (PEEK), a fluoropolymer, or a combination thereof.
Another example of the substrate can include a Pyralux.RTM.
material. In some even more particular examples, the substrate can
consist essentially of at least one of the materials noted herein.
In another embodiment, the substrate can include a flexible thin
silicon layer or monocrystalline silicon.
[0118] In a further example, the substrate can include at least one
layer. In a further aspect, the flexible electronic device can
include a printed circuit. In another aspect, the electronic device
can include a plurality of layers. In a particular aspect, the
flexible electronic device can include a substrate that consists
essentially of one layer. In a more particular aspect, the flexible
electronic device can be a singled-layered electronic device.
[0119] In a particular embodiment, the flexible electronic device
can have a thickness of not greater than 1 mm, such as not greater
than 0.80 mm, not greater than 0.60 mm, not greater than 0.50 mm,
not greater than 0.40 mm, not greater than 0.30 mm, not greater
than 0.20 mm, not greater than 0.15 mm, or not greater than 0.12
mm, or not greater than 0.10 mm. Alternatively, or additionally,
the flexible electronic device can have a thickness of at least
0.06 mm, such as at least 0.08 mm, at least 0.10 mm, at least 0.12
mm, at least 0.15 mm, or at least 0.20 mm. Moreover, the flexible
electronic device can have a thickness including any of the minimum
and maximum values noted herein.
[0120] In an embodiment, the electronic assembly 220 can include a
flexible printed circuit. In an example, the flexible printed
circuit can be contained within the package 221, as illustrated in
FIGS. 2A and 2B. In particular instances, the flexible printed
circuit can be encapsulated in the package. The flexible electronic
device, such as flexible printed circuit (FPC), disclosed in
embodiments herein is considered distinct from printed circuit
board (PCB) at least due to architecture characteristics. Such
characteristics can allow particular placement and orientation to
be implemented for coupling the electronic assembly to the abrasive
body. For instance, such characteristics can allow the electronic
assembly to be coupled in tamper-proof manner.
[0121] In an embodiment, a flexible electronic device described in
embodiments herein may be particularly suited for abrasive articles
including coated abrasives, non-woven abrasives, thin wheels, or
the like. In some situations, coupling a single-layered flexible
electronics to a coated or non-woven abrasive may not cause
detectable or noticeable changes to thickness, flexibility, or
other performance of the abrasive. In certain situations, utilizing
a flexible electronics can help to prevent issues, such as
imbalance of wheels, that can be caused by uneven weight
distribution due to coupling of an electronic assembly to the
wheels.
[0122] In an embodiment, the electronic device can have a certain
communication range while the electronic assembly is coupled to the
abrasive body. As used herein, the communication range can be
determined using the near field or far field method as applicable
and according to ISO/IEC 18000 (125 Khz-5.8 Ghz), or related
standards such as ISO/IEC 15693, ISO/IEC 14443, EPC Global Gen2, or
ISO/IEC 24753. The applicable standard is selected based on the
radio frequency of the electronic device. An abrasive article can
be placed in a 3-axis turntable, and a transmitting or receiving
antenna can be arranged such that communication ranges in different
orientations can be tested.
[0123] In an embodiment, the electronic device can have a
communication range of at least 1.0 meter, at least 1.5 meters, at
least 2.0 meters, at least 2.5 meters, at least 3.0 meters, at
least 3.5 meters, at least 4.0 meters, at least 4.5 meters, at
least 5.0 meters, at least 5.5 meters, at least 6.0 meters, at
least 6.5 meters, at least 7.0 meters, at least 7.5 meters, at
least 8.0 meters, at least 8.5 meters, at least 9.0 meters, at
least 9.5 meters, at least 10 meters, at least 11 meters, at least
12 meters, at least 13 meters, at least 14 meters, at least 15
meters, at least 16 meters, at least 17 meters, at least 18 meters,
at least 19 meters, or at least 20 meters. Additionally or
alternatively, the electronic device may have a communication range
of not greater than 20 meters, not greater than 19 meters, not
greater than 18 meters, not greater than 17 meters, not greater
than 16 meters, not greater than 15 meters, not greater than 14
meters, not greater than 13 meters, not greater than 12 meters, not
greater than 11 meters, not greater than 10 meters, not greater
than 9.0 meters, not greater than 8.5 meters, not greater than 8.0
meters, not greater than 7.5 meters, not greater than 7.0 meters,
not greater than 6.5 meters, not greater than 6.0 meters, not
greater than 5.5 meters, not greater than 5.0 meters, not greater
than 4.5 meters, not greater than 4.0 meters, not greater than 3.5
meters, not greater than 3.0 meters, not greater than 2.5 meters,
or not greater than 2.0 meters. Moreover, the communication range
of the electronic device can be in a range including any of the
minimum and maximum values noted herein.
[0124] In another embodiment, the abrasive article can include
certain electronic devices, such as an active RFID, that have
higher communication ranges. In some instances, the communication
range can be at least 100 meters, at least 200 meters, at least 400
meters, at least 500 meters, or at least 700 meters. In another
instance, the communication range may be not greater than 1000
meters, such as not greater than 800 meters, or not greater than
700 meters. It is to be understood that the communication range can
be in a range including any of the minimum and maximum values noted
herein.
[0125] In another embodiment, the abrasive article can include an
electronic device having a communication range of not greater than
35 mm, not greater than 30 mm, or not greater than 25 mm.
Additionally, or alternatively, the electronic device can have a
communication range of at least 10 mm, at least 15 mm, at least 20
mm, or at least 25 mm. Moreover, the communication range of the
electronic device can be in a range including any of the minimum
and maximum values noted herein. After reading the present
disclosure, a skilled artisan would understand that the
communication range can be affected by factors, such as the nature
of the electronic device, the configuration and materials of the
electronic assembly, the manner of coupling, the composition and
type of the abrasive article, or any combination thereof. A skilled
artisan would also understand that the choice for any or all
factors can be made and combined for forming an abrasive article
that can suit particular applications.
[0126] According to one embodiment, the package 221 can include a
thermal barrier material. For example a thermal barrier material
can include material from the group of materials including, but not
limited to, thermoplastic polymers (e.g., polycarbonates,
polyacrylates, polyamides, polyimides, polysulphones, polyketones,
polybenzimidizoles, polyesters), blends of thermoplastic polymers,
thermoset polymers (e.g., epoxies, cyanoesters, phenol
formaldehyde, polyurethanes, polyamides, polyimides, cross-linkable
unsaturated polyesters) blends of thermoset polymers, ceramics,
cermets, metals, metal alloys, glass, or any combination thereof.
In accordance with one particular embodiment, the package 221 can
include a thermal barrier material suitable for surviving one or
more processes, including the forming temperature used to form the
finally form abrasive article.
[0127] In accordance with another embodiment, thermal barrier
material of the package 221 can have a particular thermal
conductivity which may be suitable for protecting the one or more
electronic devices contained therein. For example the thermal
barrier package may have a thermal conductivity of at least 0.33
W/m/K, such as at least about 0.40 W/m/K, such as at least 0.50
W/m/K or at least 1 W/m/K or at least 2 W/m/K or at least 5 W/m/K
or at least 10 W/m/K or at least 20 W/m/K or at least 50 W/m/K or
at least 80 W/m/K or at least 100 W/m/K or at least 120 W/m/K or at
least 150 W/m/K or at least 180 W/m/K. In still another
non-limiting embodiment, the thermal barrier material can have a
thermal conductivity that is not greater than 200 W/m/K, such as
not greater than 180 W/m/K or not greater than 150 W/m/K or not
greater than 120 W/m/K or not greater than 100 W/m/K or not greater
than 80 W/m/K or not greater than 60 W/m/K or not greater than 40
W/m/K or not and 20 W/m/K or not greater than 10 W/m/K. It will be
appreciated that the thermal barrier material can have a thermal
conductivity within a range including any of the minimum and
maximum values noted above, including for example within a range of
at least 0.33 W/m/K to not greater than 200 W/m/K.
[0128] According to one embodiment, the package 221 can include a
thermal barrier material that encapsulates some volume of space
between the thermal barrier material and the electronic device
contained therein. In one embodiment, the volume of space may
include a particular gaseous material that may be suitable for
survival of the electronic device through one or more manufacturing
processes and/or improved performance of the electronic assembly.
Some suitable examples of the gaseous materials can include noble
gases, nitrogen, air, oxygen, or any combination thereof.
[0129] In another embodiment, the volume of space may have a
particular pressure that may facilitate survival of the electronic
device during one or more manufacturing processes and/or improved
performance of the electronic assembly. For example, in one
embodiment, the pressure within the electronic assembly can be less
than atmospheric pressure. In still another embodiment, the
pressure within the electronic assembly can be greater than
atmospheric pressure. In still another embodiment, at least a
portion of the volume of space can be filled with a liquid
material, which may facilitate survival of the electronic device
during one or more manufacturing operations and/or improved
performance of the electronic assembly. The gaseous material or
liquid material may have particularly suitable thermal conductivity
to limit thermal damage to the electronic device.
[0130] In yet another aspect the package 221 can include one or
more materials having a particular water vapor transmission rate to
reduce or eliminate water and water vapor being transferred from
the exterior of the package 222 the interior. Such a package may be
suitable to reduce or eliminate damage to the one or more
electronic devices 222 contained within the electronic assembly
220. In accordance with an embodiment, the package 221 can include
a material having a water vapor transmission rate. In an
embodiment, the barrier layer can prevent or reduce water vapor
transmission into the bonded abrasive body, compared to a
conventional abrasive tool. In a non-limiting embodiment, the
package 221 and/or one or more materials comprising the package
221, can have a water vapor transmission rate (WVTR), as measured
according to ASTM F1249-01 (Standard Test Method for Water Vapor
Transmission Rate Through Plastic Film and Sheeting Using a
Modulated Infrared Sensor), of not greater than about 2.0
g/m.sup.2-day (i.e., grams per square meter, per 24 hours), such as
not greater than about 1.5 g/m.sup.2-day, such as not greater than
about 1 g/m.sup.2-day or not greater than about 0.1 g/m.sup.2-day
or not greater than about 0.015 g/m.sup.2-day or not greater than
about 0.010 g/m.sup.2-day or not greater than about 0.005
g/m.sup.2-day or not greater than about 0.001 g/m.sup.2-day or even
not greater than about 0.0005 g/m.sup.2-day. In another
non-limiting embodiment, the WVTR of the one or more materials of
the package 2221, and thus the package 221, can be greater than 0
g/m.sup.2-day, such as at least 0.00001 g/m.sup.2-day. It will be
appreciated that the WVTR can be within a range including any of
the minimum and maximum values noted herein. For instance, the WVTR
may be within a range including greater than 0 g/m.sup.2-day and
not greater than 2.0 g/m.sup.2-day, such as within a range
including at least 0.00001 g/m.sup.2-day and not greater than 2.0
g/m.sup.2-day.
[0131] In another aspect, the electronic device 222 may be
configured to transmit information via one or more electromagnetic
radiation wavelengths. Accordingly, the package to 221 can be
substantially transparent or transmissive to the frequencies or
wavelengths of electromagnetic radiation used by the electronic
device 222 to receive and/or transmit information. For example, the
package 221 can include one or more materials that are transparent
to electromagnetic radiation in the radio frequency spectrum, such
as electromagnetic radiation having a frequency of 3 kHz to 300 GHz
and an approximate wavelength within a range of 1 mm to 100 km.
Some suitable examples of such materials can include non-metallic
materials, such as glasses, ceramic, thermoplastics, elastomers,
thermosets, and the like.
[0132] As noted in embodiments herein, the electronic device 222
can be configured to communicate with one or more systems and/or
individuals. In particular instances, the electronic device 222 can
be configured to communicate with a mobile device. A mobile device
will be understood as an electronic device intended for personal
use and configured to be carried on or used by an individual.
[0133] In accordance with one embodiment, the electronic device 222
can include a read-only device. In an alternative embodiment, the
electronic device 222 can be a read-write device. It will be
understood that a read-only device is a device that can store
information, which can be read by a system and/or individual in an
active read operation. An active read operation includes any action
by a system and/or individual to access the information stored on
the electronic device 222. A read-only device cannot be written to
in an active write operation to store information. By contrast a
read-write device can be an electronic device wherein information
can be read from the device in an active read operation or
information can be stored to the electronic device by one or more
systems and/or individuals in an active writing operation. Some
suitable examples of information that can be stored on the
electronic device 222 can include manufacturing information and/or
customer information. According to one embodiment, manufacturing
information can include, but is not limited to, processing
information, manufacturing date, shipment information, or any
combination thereof. In accordance with another embodiment,
customer information can include, but is not limited to,
registration information, product identification information,
product cost information, manufacturing date, shipment date,
environmental information, use information, or any combination
thereof. The customer registration information may include certain
information such as an account number of the customer.
Environmental information may include details regarding the age or
general information about the conditions encountered by the
abrasive article (e.g., water vapor, temperature, etc.) during
shipment, storage or use. Use information can include details
regarding the conditions for use of the wheel, including for
example, but not limited to the appropriate wheel speed, force,
power of the machine to be used, burst speed, and the like.
[0134] In a further embodiment, the package 221 can include a
protective layer that can help the electronic device survive one or
more forming process, environmental conditions, or grinding
operations, or facilitate bonding of the electronic assembly to the
abrasive body. For instance, the protective layer may facilitate
improved resistance against moisture or humidity of the electronic
assembly. In another instance, the protective layer can facilitate
improved mechanical integrity, resistance against certain pressure
or chemical corrosion, or improved electrical insulation, or
improved thermal resistance in some instances. In an aspect, the
protective layer can overlie at least a portion of the electronic
device. In an aspect, the protective layer can be in contact with
the electronic device. In a further aspect, the protective layer
may be spaced apart from the abrasive body. In another embodiment,
the protective layer can be in contact with at least a portion of
the abrasive body. In still another embodiment, the protective
layer can encapsulate the electronic device.
[0135] FIG. 2C includes a cross-sectional illustration of an
abrasive article according to an embodiment. For all embodiments
herein, the electronic assembly may be coupled to, partially
contained within, or completely embedded within, an abrasive
portion and/or non-abrasive portion.
[0136] In the embodiment of FIG. 2C, the abrasive article 200
includes an abrasive portion 232 and a non-abrasive portion 231,
and an electronic assembly 220 coupled to the non-abrasive portion
231 of an abrasive article 200. The nonabrasive portion 231 can
have a first surface 233, a second surface 234, and a side surface
235 extending between the first surface 233 and second surface 234.
The first and second surfaces 233 and 234 may be major planar
surfaces. The second surface 234 may be a major planar surface of
the same size or different size relative to the first surface 233.
As further illustrated, the non-abrasive portion 231 may include an
opening 205, such as an arbor hole. The electronic assembly 220 can
be coupled to the first surface 233. The electronic assembly may
include an electronic device 222 and package 221 as described in
embodiments herein.
[0137] In accordance with one aspect, as illustrated in FIG. 2D,
the electronic assembly 220 may include one or more electronic
devices, including for example electronic device 256 and electronic
device 257. In certain instances, the electronic assembly 220 may
include a substrate 259 upon which the one or more electronic
devices 256 and 257 can be disposed. In yet other instances, the
electronic assembly 220 may further include a first portion 271 and
a second portion 272. The first portion 271 and second portion 272
may be part of a package 270 that may overlie at least a portion of
the electronic assembly 220. The package 270 may consist
essentially of the first and second portions 271 and 272. The
package 270 may partially surround at least a portion of the one or
more electronic devices 256 and 257. In one particular embodiment,
the package 270 may completely surround at least a portion, or even
all of, the one or more electronic devices 256 and 257. It is to be
understood that the electronic devices 256 and 257 can include any
electronic devices noted in embodiments herein.
[0138] FIGS. 2D-2J, include cross-sectional illustrations of
various arrangements of the first and second portions 271 and 272
with respect to each other, the one or more electronic devices 256
and 257, and the substrate 259. FIGS. 2D-2J provide illustrations
of electronic assemblies having different arrangements of the first
and second portions 271 and 272. Those of skill in the art will
appreciate that other possible arrangements are possible.
[0139] For example, as illustrated in FIGS. 2D-2J the first portion
271 can be underlying the substrate 259 and one or more electronic
devices 256 and 257. In certain instances, the first portion 271
can be coupled to, such as directly contacting, the second portion
272. In still another embodiment, electronic assembly 220 may
include a first portion 271 that is underlying and partially
enveloping at least a portion of the substrate 259 and the one or
more electronic devices 256 and 257. The second portion 272 can be
overlying at least a portion of the one or more electronic devices
256 and 257. The second portion 272 may be indirectly coupled or
directly coupled (e.g., directly contacting or bonded to) the first
portion 271. As illustrated, the first portion and second portion
272 can substantially surround the entire one or more electronic
devices 256 and 257 as well as substrate 259.
[0140] FIG. 2I includes an illustration of an electronic assembly
220 having a first portion 271, a second portion 270, a substrate
259, and one or more electronic devices 256 and 257. In particular,
the embodiment of FIG. 2J demonstrates a 180 wireless communication
hemisphere for all signals emitted from the one or more electronic
devices 256 and 257. Notably, the second portion 272 may be
significantly transparent to the RF radiation, whereas the first
portion 271 may have a significantly lower RF transmission value as
compared to the second portion 272. RF electromagnetic radiation
may be transmitted freely through the second portion 272.
[0141] FIG. 2J includes an alternative illustration an electronic
assembly 220 including a first portion 271 and a second portion
272. The first portion 271 may substantially envelop the one or
more electronic devices 256 and 257 such that any RF frequency
electromagnetic radiation emitted from the one of more electronic
devices 256 and 257 is transmitted only through the second portion
272. In such instances, the second portion 272 may define a
transmission window in the package 270 of the electronic assembly
220 that may facilitate directional control of the transmitted
radiation and thus the transmitted data.
[0142] FIG. 2K is a top-down view of an abrasive article according
to an embodiment. The embodiment includes an abrasive article 260
including a body having a non-abrasive portion 261 and an abrasive
portion 262. The body further includes an electronic assembly
including an antenna 257, which may be a secondary antenna apart
from an antenna contained on one or more other electronic device,
such as an on chip antenna. In one embodiment, the antenna 257 can
be a booster antenna configured to expand the wireless transmission
range and accuracy of one or more electronic devices to which is
coupled. A first portion 271 can underlie at least a portion, such
as at least 50% of the electronic device 257. The first portion 271
can electrically insulate and isolate the antenna 257 from the
non-abrasive portion 261 to which it is coupled. In particular
instances, the first portion 271 can be disposed between and
electrically insulating at least one of the at least one or more
electronic devices 256 and 257 from the body of the abrasive
article. More particularly, the electronic devices 256 and/or 257
may include at least one antenna, and the first portion 271 can be
disposed between and electrically insulating the antenna from the
body of the abrasive article.
[0143] In certain instances, the one or more electronic devices 256
and 257 may have a footprint surface area. The footprint surface
area may be the surface area of the one or more electronic devices
256 at 257 as viewed top-down. In particular instances, the
footprint surface area of the at least one or more electronic
devices 256 and 257 may be defined as that portion of the surface
area taken up by the device on the substrate 259 or on the body 301
to which the electronic assembly is attached. In particular
instances, the first portion 271 may be underlying at least 10% of
the footprint surface area of any one or all of the one or more
electronic devices 256 and/or 257, such as at least 20% or at least
30% or at least 40% or at least 50% or at least 60% or at least 70%
or at least 80% or at least 90% or at least 100%. In another
embodiment, the first portion 271 may be partially enveloping at
least a portion of the one or more electronic devices 256 and 257.
In such instances, a bottom surface of the one or more electronic
devices 256 and 257, such as the surface in contact with the
substrate to 59 may be below an upper surface of the first portion
252 71 is viewed in cross-section.
[0144] In other embodiments, the first portion 271 may be
surrounding a particular percentage of the total surface area of
the one or more electronic devices 256 and 257 is viewed in
cross-section. For example, the first portion 271 may be surrounded
at least 10% of the total surface area of the one or more
electronic devices 256 and 257, such as at least 20% or at least
30% or at least 40% or at least 50% or at least 60% or at least 70%
or at least 80% or at least 90%.
[0145] The first portion 271 or the second portion 272 may be made
of more than one layer of material (i.e., multi-layered articles).
FIG. 2L includes a cross-sectional illustration of a first portion
271 having a first layer 273 and a second layer 274. The
composition, position, and characteristics of the first layer 273
and second layer 274 can have any of the characteristics of the
first and second portions 271 and 272 of any one or more of the
embodiments herein.
[0146] In certain instances, second portion 272 may act as a
protective layer. In some instances, the substrate can serve as a
protective layer or facilitate bonding of the electronic assembly
to a body to obviate the use of a protective layer that is disposed
underlying the substrate. In another instance, the protective layer
may be disposed to underlie the electronic device, and an upper
surface and side surfaces of the electronic devices 257 or 256 may
not be covered by the protective layer. In a further embodiment,
the electronic assembly 220 can include an extra protection layer
that is disposed over and/or under the second portion for
additional protection. The second portion 272 can act as a
protective layer to limit impact of coolant and swarf on the
electronic assembly. In other instances, the protective layer may
protect the electronic devices from mechanical damage or chemical
damage during re-profiling, dressing, maintenance of the abrasive
portion or non-abrasive portion, and the like.
[0147] In an embodiment, a protective layer can include an organic
material, an inorganic material, or any combination thereof. In
some instances, a protective layer can include parylene, silicone,
acrylic, an epoxy based resin, ceramics, metal, such as an alloy
(e.g., stainless steel), polycarbonate (PC), polyvinyl chloride
(PVC), polyimide, polyvinyl butyral (PVB), polyurethane (PU),
polytetrafluoroethylene (PTFE), a high performance polymer, such as
polyester, polyurethane, polypropylene, polyimides, polysulfone
(PSU), polyethersulfone (PES), polyetherimide (PEI), poly(phenylene
sulfide) (PPS), polyetheretherketone (PEEK), polyether ketones
(PEK), aromatic polymers, poly(p-phenylene), ethylene propylene
rubber and/or cross-linked polyethylene, or a fluoropolymer such as
PTFE. In some instances, the protective layer can include the same
metal as an antenna contained in the electronic assembly. In some
examples, the protective layer can be in the form of a coating,
such as a polymer coating, e.g., epoxy-based resin coating, a
ceramic coating, or a ceramic coated layer. In another instance,
the protective layer may be in the form of a tape, such as a
Teflon.RTM. tape, a PET tape, or a polyimide film with an adhesive
on one side, such as Kapton.RTM. tape.
[0148] In some instances, the protective layer can include at least
one opening to allow a sensing element to be exposed for the
sensing element to perform its function, such as sensing
environmental conditions the abrasive article is exposed to, e.g.,
temperature or humidity.
[0149] In a further embodiment, the protective layer can include a
hydrophobic layer to help to protect the electronic device from
potential damage caused by certain fluid, such as coolant or
slurries used in some operations. An exemplary hydrophobic layer
can include a material including manganese oxide polystyrene
(MnO.sub.2/PS) nano-composite, zinc oxide polystyrene (ZnO/PS)
nano-composite, calcium carbonate (e.g., precipitated calcium
carbonate), carbon nano-tubes, silica nano-coating, fluorinated
silanes, fluoropolymer, or any combination thereof. In an exemplary
forming process, a hydrophobic layer can be formed by preparing and
applying a gel-based or aerosol based solutions including any of
the materials noted herein to the electronic device or over a
protection layer.
[0150] In a further embodiment, the protective layer can include an
autoclavable material that can help the electronic assembly survive
an autoclave operation and facilitate bonding of the electronic
assembly to the abrasive body. In some instances, the autoclavable
material can also facilitate improved environmental resistance and
electrical integrity of the electronic assembly. An exemplary
material can include poly vinyl butyral (PVB), polycarbonate (PC),
acoustic PVB, thermal control PVB, ethylene vinyl acetate (EVA),
thermoplastic polyurethane (TPU), ionomer, a thermoplastic
material, polybutylene terephthalate (PBT),
polyethylenevinylacetate (PET), polyethylene naphthalate (PEN),
polyvinyl chloride (PVC), polyvinyl fluorides (PVf), polyacrylate
(PA), polymethyl methacrylate (PMMA), polyurethane (PUR), or
combinations thereof.
[0151] In an embodiment, the package can include any of the
protection layer, thermal barrier, pressure barrier, as noted in
embodiments herein, or any combination thereof. Any of the
component layer of the package can be formed by extrusion,
printing, spraying on, coating or the like. The package including a
plurality of layers can be formed by adhesion, lamination, coating,
printing, or the like. In particular embodiments, treatment, such
as heating, curing, pressing, or any combination thereof, can be
performed to form a component layer or the package. For instance, a
precursor material may be used and cured to form a protection
layer.
[0152] In accordance with aspects herein the electronic assembly
220 may include a first portion 271 and a second portion 272. The
first and second portions 271 and 272 may be part of the electronic
assembly, and may form at least a portion of the packaging 270
surrounding one or more portions of the electronic assembly 220,
including the one or more electronic devices 256 and 257. In
certain instances, the first portion 271 can be disposed between
the body 301 and the one or more electronic devices may have a
particular magnetic permeability. It is noted in certain instances,
a certain magnetic permeability of the first portion or a material
of the first portion may be suitable to enhance the performance of
the electronic assembly in real-world material removal operations.
For example, in one embodiment the first portion 271 may have a
material having a magnetic permeability of not greater than 15,
such as not greater than 14.5 or not greater than 14 or not greater
than 13.5 or not greater than 13 or not greater than 12.5 or not
greater than 12 or not greater than 11.5 or not greater than 11 or
not greater than 10.5 or not greater than 10 or not greater than
9.5 or not greater than 9 or not greater than 8.5 or not greater
than 8 or not greater than 7.5 or not greater than 7 or not greater
than 6.5 or not greater than 6 or not greater than 5.5 or not
greater than 5 or not greater than 4.5 or not greater than 4 or not
greater than 3.5 or not greater than 3 or not greater than 2.5 or
not greater than 2 or not greater than 1.5 or not greater than
1.25. In another non-limiting embodiment, the relative magnetic
permeability can be at least 1 or at least 1.1 or at least 1.2 or
at least 1.4 or at least 1.6 or at least 1.8 or at least 2 or at
least 2.2 or at least 2.5 or at least 2.8 or at least 3 or at least
3.2 or at least 3.5 or at least 3.8 or at least 4 or at least 4.2
or at least 4.5 or at least 4.8 or at least 5 or at least 5.2 or at
least 5.5 or at least 5.8 or at least 6 or at least 6.2 or at least
6.5 or at least 6.8 or at least 7 or at least 7.5 or at least 8 or
at least 8.5 or at least 9 or at least 9.5 or at least 10. The
relative magnetic permeability can be within a range of any of the
minimum and maximum values noted above. The relative magnetic
permeability of a material of the first portion 271 and/or the
first portion 271 in its entirety may be measured according to ASTM
A596, ASTM D5568, ASTM A343, ASTM A804, or ASTM A342.
[0153] The relative magnetic permeability may be for a frequency of
electromagnetic radiation of at least 3 kHz or at least 5 kHz or at
least 10 kHz or at least 20 kHz or at least 30 kHz or at least 40
kHz or at least 50 kHz or at least 60 kHz or at least 70 kHz or at
least 80 kHz or at least 90 kHz or at least 100 kHz or at least 200
kHz or at least 300 kHz or at least 400 kHz or at least 500 kHz or
at least 600 kHz or at least 700 kHz or at least 800 kHz or at
least 900 kHz or at least 1 MHz or at least 2 MHz or at least 3 MHz
or at least 4 MHz or at least 5 MHz or at least 6 MHz or at least 7
MHz or at least 8 MHz or at least 9 MHz or at least 10 MHz or at
least 12 MHz. Still, in other embodiments, the relative magnetic
permeability of the material may be relative to electromagnetic
radiation having a frequency of not greater than 3 GHz or not
greater than 2 GHz or not greater than 1 GHz or not greater than
900 MHz or not greater than 500 MHz or not greater than 200 MHz or
not greater than 150 MHz or not greater than 100 MHz or not greater
than 80 MHz or not greater than 60 MHz or not greater than 40 MHz
or not greater than 30 MHz or not greater than 20 MHz. It will be
appreciated that the frequency of the electromagnetic radiation may
be within a range including any of the minimum and maximum
frequencies noted above.
[0154] In certain other instances, the first portion 271 may have a
particular dielectric value that may facilitate improved
performance of the electronic assembly in real-world material
removal operations. For example, the first portion 271 may have a
first dielectric value of at least 1 or at least 1.1 or at least
1.2 or at least 1.4 or at least 1.6 or at least 1.8 or at least 2
or at least 2.2 or at least 2.5 or at least 2.8 or at least 3 or at
least 3.2 or at least 3.5 or at least 3.8 or at least 4 or at least
4.2 or at least 4.5 or at least 4.8 or at least 5 or at least 5.2
or at least 5.5 or at least 5.8 or at least 6 or at least 6.2 or at
least 6.5 or at least 6.8 or at least 7 or at least 7.5 or at least
8 or at least 8.5 or at least 9 or at least 9.5 or at least 10 or
at least 10.5 or at least 11 or at least 11.5 or at least 12 or at
least 12.5 or at least 13 or at least 13.5 or at least 14. Still,
and a non-limiting embodiment, a material of the first portion 271
may have a first dielectric value of not greater than 20 or not
greater than 19 or not greater than 18 or not greater than 17 or
not greater than 16 or not greater than 15 or not greater than 14
or not greater than 13 or not greater than 12 or not greater than
11 or not greater than 10 or not greater than 9 or not greater than
8 or not greater than 7 or not greater than 6 or not greater than 5
or not greater than 4 or not greater than 3. It will be appreciated
that the first dielectric value may be within a range including any
of the minimum and maximum values noted above. In certain
instances, the material of the first portion 271 may consist
essentially of a dielectric material having a dielectric value
within a range of at least 1 to not greater than 20. The dielectric
value of the material and/or the first portion may be measured
according to ASTM STP 926, ASTM STP 783, ASTM D2149, or ASTM
D3380.
[0155] In certain instances, the first portion 271 itself,
including all of its component layers (if any), may have an average
relative magnetic permeability and dielectric value within a range
of any of the values noted above with respect to a single layer of
the first portion 271. The average relative magnetic permeability
values may be relative to an electromagnetic radiation having a
frequency of at least 3 kHz to not greater than 300 GHz and those
values in between as described above. The first portion 271 may
consist essentially of a dielectric material having a first
relative magnetic permeability within a range of those values noted
above. In still another embodiment, the second portion 272 may be
free of a dielectric material.
[0156] In certain instances, it may be desirable that the second
portion 272 have particular characteristics that may facilitate
improved operation of the electronic assembly 220 in real-world
material-removal operations. For example, the second portion 272
may have a particular dielectric value that may facilitate improved
performance. In one instance, the second portion 272 may have a
second dielectric value of at least 1, such as at least 2 or at
least 3 or at least 4 or at least 4.2 or at least 4.5 or at least
4.8 or at least 5 or at least 5.2 or at least 5.5 or at least 5.8
or at least 6 or at least 6.2 or at least 6.5 or at least 6.8 or at
least 7 or at least 7.5 or at least 8 or at least 8.5 or at least 9
or at least 9.5 or at least 10 or at least 10.5 or at least 11 or
at least 11.5 or at least 12 or at least 12.5 or at least 13 or at
least 13.5 or at least 14. In another non-limiting embodiment, the
second portion 272 can have a second dielectric value of not
greater than 100 or not greater than 70 or not greater than 50 or
not greater than 40 or not greater than 30 or not greater than 20,
such as not greater than 19 or not greater than 18 or not greater
than 17 or not greater than 16 or not greater than 15 or not
greater than 14 or not greater than 13 or not greater than 12 or
not greater than 11 or not greater than 10 or not greater than 9 or
not greater than 8 or not greater than 7 or not greater than 6 or
not greater than 5 or not greater than 4 or not greater than 3. It
will be appreciated that the second dielectric value can be within
a range including any of the minimum and maximum values noted
above.
[0157] In another embodiment, the second portion 272 may have a
particular relative average magnetic permeability that may enhance
performance of the electronic assembly in real-world material
removal operations. For example, the second portion 272 may have a
second average relative magnetic permeability of not greater than
15, such as not greater than 14.5 or not greater than 14 or not
greater than 13.5 or not greater than 13 or not greater than 12.5
or not greater than 12 or not greater than 11.5 or not greater than
11 or not greater than 10.5 or not greater than 10 or not greater
than 9.5 or not greater than 9 or not greater than 8.5 or not
greater than 8 or not greater than 7.5 or not greater than 7 or not
greater than 6.5 or not greater than 6 or not greater than 5.5 or
not greater than 5 or not greater than 4.5 or not greater than 4 or
not greater than 3.5 or not greater than 3 or not greater than 2.5
or not greater than 2 or not greater than 1.5 or not greater than
1.25. In another non-limiting embodiment, the second portion 272
may have a second average relative magnetic permeability of at
least 1, such as at least 1.1 or at least 1.2 or at least 1.4 or at
least 1.6 or at least 1.8 or at least 2 or at least 2.2 or at least
2.5 or at least 2.8 or at least 3 or at least 3.2 or at least 3.5
or at least 3.8 or at least 4 or at least 4.2 or at least 4.5 or at
least 4.8 or at least 5 or at least 5.2 or at least 5.5 or at least
5.8 or at least 6 or at least 6.2 or at least 6.5 or at least 6.8
or at least 7 or at least 7.5 or at least 8 or at least 8.5 or at
least 9 or at least 9.5 or at least 10. It will be appreciated that
the second average relative magnetic permeability may be within
range including any of the minimum and maximum values noted above.
The frequency of the electromagnetic radiation for which the second
portion 272 has a particular average relative magnetic permeability
can be for frequency of at least 3 kHz and not greater than 300
GHz, including any of those alternative minimum and maximum values
as noted above.
[0158] In certain instances, the first portion 271 may have a
different first average relative magnetic permeability as compared
to the second average relative magnetic permeability of the second
portion 272. This may facilitate improved operation of the abrasive
article and associated systems using such abrasive articles. For
example, in certain instances the first average relative magnetic
permeability may be greater than the second average relative
magnetic permeability. More particularly, the difference in the
magnetic permeability may be defined as a magnetic permeability
difference value (.DELTA.MP), which is defined by the equation
(.DELTA.MP=MP2/MP1), wherein MP1 is the first average relative
magnetic permeability and MP2 is the second average relative
magnetic permeability. The magnetic permeability difference value
(.DELTA.MP) can be at least 1.1, such as at least 1.2 or at least
1.5 or at least 1.8 or at least 2 or at least 2.5 or at least 3 or
at least 3.5 or at least 4 or at least 4.5 or at least 5 or at
least 5.5 or at least 6 or at least 6.5 or at least 7 or at least 8
or at least 9 or at least 10 or at least 20 or at least 30 or at
least 40 or at least 50 or at least 60 or at least 70 or at least
80 or at least 90 or at least 95 or at least 99 or at least 100 or
at least 1000. In another non-limiting embodiment, the magnetic
permeability difference value (.DELTA.MP) can be not greater than
1,000,000 or not greater than 100,000 or not greater than 10,000 or
not greater than 1,000 or not greater than 100 or not greater than
10 or even not greater than 5. It will be appreciated that
reference herein to the average magnetic permeability may be
reference to an average relative magnetic permeability of the first
portion 271 or second portion 272 in totality. In the alternative,
reference to the first average relative magnetic permeability may
be reference to the average relative magnetic permeability of a
material of the first portion 271, such as a layer contained within
the first portion 271. Likewise, reference to a second average
relative magnetic permeability may be reference to the relative
magnetic permeability of a material, such as at layer contained
within the second portion 272.
[0159] In another aspect, the package can include the first portion
and the second portion and each the first portion and second
portion may define and have a first average dielectric value the
second average dielectric value, respectively, in certain instances
the first dielectric first average dielectric value can be
different than the second average dielectric value. For example,
the first average dielectric value can be less than the second
average dielectric value. More particularly, the difference in the
dielectric values between the first portion 271 of the second
portion 272 may be defined as a dielectric difference value
(.DELTA.DV), which is defined by the equation (.DELTA.DV=DV1/DV2),
wherein DV1 is the first average dielectric value and DV2 is the
second average dielectric value. In one embodiment, the dielectric
difference value (.DELTA.DV) can be at least 1.1, such as at least
1.2 or at least 1.5 or at least 1.8 or at least 2 or at least 2.5
or at least 3 or at least 3.5 or at least 4 or at least 4.5 or at
least 5 or at least 5.5 or at least 6 or at least 6.5 or at least 7
or at least 8 or at least 9 or at least 10 or at least 20 or at
least 30 or at least 40 or at least 50 or at least 60 or at least
70 or at least 80 or at least 90 or at least 95 or at least 99 or
at least 100 or at least 1000.
[0160] Reference herein to a first average dielectric value can be
reference to the dielectric value of the first portion 271 in its
entirety. In the alternative, reference to a first average
dielectric value can be reference to a dielectric value of a
material of the first portion 271, such as a layer, of the first
portion 271. Likewise, reference herein to a second average
dielectric value can be reference to the second dielectric value of
the second portion 272 in its entirety. In the alternative,
reference to the second average dielectric value can be reference
to a material of the second portion 272, such as a layer, of the
second portion 272.
[0161] In certain instances, the first portion 271 may have a
particular average RF reflectance, which may facilitate improved
performance of the electronic assembly in real-world material
removal operations. For example, first portion 271 may have an RF
reflectance of at least 50% for electromagnetic radiation having a
frequency between 3 kHz and 300 GHz. In other embodiments, the
first portion 271 can have a first average reflectance of at least
51%, such as at least 52% or at least 53% or at least 54% or at
least 55% or at least 56% or at least 57% or at least 58% or at
least 59% or at least 60% or at least 61% or at least 62% or at
least 63% or at least 64% or at least 65% or at least 66% or at
least 67% or at least 68% or at least 69% or at least 70% or at
least 71% or at least 72% or at least 73% or at least 74% or at
least 75% or at least 76% or at least 77% or at least 78% or at
least 79% or at least 80% or at least 81% or at least 82% or at
least 83% or at least 84% or at least 85% or at least 86% or at
least 87% or at least 88% or at least 89% or at least 90% or at
least 91% or at least 92% or at least 93% or at least 94% or at
least 95% or at least 96% or at least 97% or at least 98% or at
least 99%. It will be understood that reference to the first
average RF reflectance can be reference to the total RF reflectance
of the first portion 271 as a whole. Alternatively, the first
average RF reflectance may be the RF reflectance of a material
within the first portion, such as a layer of material, contained
within the first portion 271.
[0162] The second portion 272 may have a particular second average
RF reflectance, which may facilitate improved performance of the
electronic assembly in real-world material removal operations. For
example, second portion 272 may have an RF reflectance of not
greater than 50% for electromagnetic radiation have a frequency
between 3 kHz and 300 GHz, such as not greater than 40% or not
greater than 30% or not greater than 20% or not greater than 10% or
not greater than 5%. It will be understood that reference to the
second average RF reflectance can be reference to the total RF
reflectance of the second portion 272 as a whole. Alternatively,
the second average RF reflectance may be the RF reflectance of a
material within the second portion 272, such as a layer of
material, contained within the second portion 272.
[0163] In another embodiment, second portion 272 may have a
particular RF reflectance that may facilitate improved performance
of the electronic assembly 220. For example, the second portion 272
may have a second average RF reflectance that may be different than
the first average RF reflectance. For example, the second average
RF reflectance can be less than the first average RF reflectance.
In particular instances, the difference between the first average
RF reflectance and the second average RF reflectance can be defined
as a reflection difference value (.DELTA.RFR), which is defined by
the equation (.DELTA.RFR=RFR1/RFR2), wherein RFR1 is the first
average RF reflectance and RFR2 is the second average RF
reflectance. In one embodiment, the reflection difference value
(.DELTA.RFR) can be at least 1.1, such as at least 1.2 or at least
1.5 or at least 1.8 or at least 2 or at least 2.5 or at least 3 or
at least 3.5 or at least 4 or at least 4.5 or at least 5 or at
least 5.5 or at least 6 or at least 6.5 or at least 7 or at least 8
or at least 9 or at least 10 or at least 20 or at least 30 or at
least 40 or at least 50 or at least 60 or at least 70 or at least
80 or at least 90 or at least 95 or at least 99 or at least 100. In
another embodiment, .DELTA.RFR may be not greater than 1000, or not
greater than 500 or not greater than 300 or not greater than 200 or
not greater than 100 or not greater than 50. The .DELTA.RFR can be
a value within any of the lower and upper values noted above. It
will be appreciated that reference to the second average RF
reflectance can be reference to the average RF reflectance of the
second portion 272 as a whole. Alternatively, the second average
article reflectance may be the RF reflectance of a material, such
as a layer, contained within the second portion 272.
[0164] In yet another embodiment, the first portion 271 may have a
particular RF transmittance, such as a first average RF
transmittance that may facilitate improved operation of the
electronic assembly in real-world material removal operations. The
first portion 271 may have a first average RF transmittance that is
different than an RF transmittance of the second portion 272. For
example, the first average RF transmittance can be less than the
second average RF transmittance. The difference in RF transmittance
may be defined as a transmit difference value (.DELTA.RFT), which
is defined by the equation (.DELTA.RFT=RFT2/RFT1), wherein RFT1 is
the first average RF transmittance and RFT2 is the second average
RF transmittance. The transmit difference value (.DELTA.RFT) can be
at least 1.1, such as at least 1.2 or at least 1.5 or at least 1.8
or at least 2 or at least 2.5 or at least 3 or at least 3.5 or at
least 4 or at least 4.5 or at least 5 or at least 5.5 or at least 6
or at least 6.5 or at least 7 or at least 8 or at least 9 or at
least 10 or at least 20 or at least 30 or at least 40 or at least
50 or at least 60 or at least 70 or at least 80 or at least 90 or
at least 95 or at least 99 or at least 100. It will be appreciated
that reference herein to the first or second RF transmittance can
be reference to the average RF transmittance of the either of the
portions 271 or 272 as a whole or a component of such portions 271
and 272, such as a material layer contained within either of the
first or second portions 271 and 272.
[0165] In certain instances, the first portion 271 may be part of a
package 270 of the electronic assembly 220. In at least one
embodiment, the first portion 271 may define a particular volume
percent of the total volume of the package 270, which may in
facilitate improved performance of the electronic assembly 220. For
example, the first portion 271 can define at least 10 vol % of a
total volume of the package 270, such as least 20% or at least 30%
or at least 40% or at least 50% or at least 60% or at least 70% or
at least 80% or at least 90% or at least 100%. Still, in at least
one non-limiting embodiment, the first portion 271 can define not
greater than 90% of the total volume of the package or not greater
than 80% or not greater than 70% or not greater than 60% or not
greater than 50%.
[0166] In certain embodiments, the first portion 271 and the second
portion 272 are part of a package 270 of the electronic assembly
220, and the first portion 271 can account for a greater volume
percent of the total volume of the package as compared to the
volume percent of the second portion 272. Still, another
non-limiting embodiment, the first portion 271 can define a lesser
volume percent of the total volume of the package 270 as compared
to the volume percent of the second portion 272 for the total
volume of the package 270.
[0167] The first portion 271 may have a first average thickness
(T1) and the second portion 272 may have a second average thickness
(T2) that may facilitate improved performance. For example, the
first average thickness (T1) can be different than the second
average thickness (T2). It will be appreciated the average
thickness may be measured utilizing a plurality of thickness
measurements as measured in cross-section at different, randomly
selected places in the portions. In certain embodiments, T1 may be
greater than T2. Still, in other instances, T1 can be less than T2.
In still another embodiment, T1 and T2 can be substantially the
same.
[0168] The particular instances, the first portion 271 may have an
average thickness of at least 0.1 mm, such as at least 0.2 mm or at
least 0.3 mm or at least 0.4 mm or at least 0.5 mm or at least 0.6
mm or at least 0.7 mm or at least 0.8 mm or at least 0.9 mm or at
least 1 mm or at least 1.2 mm or at least 1.5 mm or at least 1.8 mm
or at least 2 mm or at least 2.5 mm or at least 3 mm or at least
3.5 mm or at least 4 mm or at least 4.5 mm or at least 5 mm. Still,
the first average thickness may be not greater than 10 mm or not
greater than 9 mm or not greater than 8 mm or not greater than 7 mm
or not greater than 6 mm or not greater than 5 mm or not greater
than 4 mm or not greater than 3 mm or not greater than 2 mm. It
will be appreciated that the first average thickness can be within
a range including any of the minimum and maximum values noted
above.
[0169] The second portion 272 may have an average thickness of at
least 0.1 mm, such as at least 0.2 mm or at least 0.3 mm or at
least 0.4 mm or at least 0.5 mm or at least 0.6 mm or at least 0.7
mm or at least 0.8 mm or at least 0.9 mm or at least 1 mm or at
least 1.2 mm or at least 1.5 mm or at least 1.8 mm or at least 2 mm
or at least 2.5 mm or at least 3 mm or at least 3.5 mm or at least
4 mm or at least 4.5 mm or at least 5 mm. Still, the second average
thickness may be not greater than 10 mm or not greater than 9 mm or
not greater than 8 mm or not greater than 7 mm or not greater than
6 mm or not greater than 5 mm or not greater than 4 mm or not
greater than 3 mm or not greater than 2 mm. It will be appreciated
that the second average thickness can be within a range including
any of the minimum and maximum values noted above.
[0170] The first portion 271 may include one or more particular
types of material that have one or more characteristics of the
embodiments herein. For example, the first portion 271 may be a
material from the group of inorganic materials, ceramics, glass,
organic materials, or any combination thereof. In more particular
instances, the first portion may include a material selected from
the group of fluoropolymers, polyester, polyimide, polyamide
thermoplastics, thermosets, rubber, or any combination thereof.
Thermoplastic polymers may include, but is not limited to
polycarbonates, polyacrylates, polyamides, polyimides,
polysulphones, polyketones, polybenzimidizoles, polyesters, and
blends of the above-mentioned polymers. Thermoset polymers may
include, but is not limited to, epoxies, cyanoesters, phenol
formaldehyde, polyurethanes, poly (amide/imide), cross-linkable
unsaturated polyesters, polypropylene, polyimides, polysulfone
(PSU), poly(ethersulfone) (PES) and polyetherimide (PEI),
poly(phenylene sulfide) (PPS), polyetheretherketone (PEEK),
polyether ketones (PEK), aromatic polymers, poly(p-phenylene),
ethylene propylene rubber and/or cross-linked polyethylene, a
fluoropolymer including polytetrafluorethylene, or any combination
thereof. In more particular instances, the first portion 271 may
include at least one of polyimide, polyethylene terephthalate,
polytetrafluoroethylene, polyvinyl chloride, polycarbonate,
polypropylene, polyvinyl butyral, polyethylene naphthalate,
polydimethylsiloxane, polyether ether keytone (PEEK) or any
combination thereof. More particularly, the first portion 271 may
consist of or consist essentially of, polyimide, polyethylene
terephthalate or polytetrafluoroethylene.
[0171] The second portion 272 may include one or more particular
types of material that have one or more characteristics of the
embodiments herein. For example, the second portion 271 may be a
material from the group of inorganic materials, ceramics, glass,
organic materials, or any combination thereof. In more particular
instances, the second portion 272 may include a material selected
from the group of fluoropolymers, polyester, polyimide, polyamide
thermoplastics, thermosets, rubber, or any combination thereof.
Thermoplastic polymers may include, but is not limited to
polycarbonates, polyacrylates, polyamides, polyimides,
polysulphones, polyketones, polybenzimidizoles, polyesters, and
blends of the above mentioned polymers. Thermoset polymers may
include, but is not limited to, epoxies, cyanoesters, phenol
formaldehyde, polyurethanes, poly (amide/imide), cross-linkable
unsaturated polyesters, polypropylene, polyimides, polysulfone
(PSU), poly(ethersulfone) (PES) and polyetherimide (PEI),
poly(phenylene sulfide) (PPS), polyetheretherketone (PEEK),
polyether ketones (PEK), aromatic polymers, poly(p-phenylene),
ethylene propylene rubber and/or cross-linked polyethylene, a
fluoropolymer including polytetrafluorethylene, or any combination
thereof. In more particular instances, the second portion 272 may
include at least one of polytetrafluoroethylene, polyimide,
polyethylene naphthalate, polydimethylsiloxane, phthalazinone ether
ketone or any combination thereof. More particularly, the second
portion 272 may consist of or consist essentially of a
polytetrafluoroethylene, polyimide, polyethylene naphthalate,
polydimethylsiloxane, phthalazinone ether ketone or any combination
thereof.
[0172] In an embodiment, the electronic assembly can be coupled to
the body of the abrasive article in an abrasive portion or a
non-abrasive portion. In some instances, the coupling can be direct
or indirect, wherein indirect coupling includes at least one
intermediate component between the electronic assembly and the
body. In particular instances, the electronic assembly can be
coupled to the abrasive body in a tamper-proof manner.
[0173] Any one or more electronic devices and/or electronic
assemblies may have improved operation based on the embodiments
including at least a first portion. For example, any one of the
electronic devices and/or electronic assemblies of the embodiments
herein may have a minimum effective communication range of at least
0.01 meters or at least 0.02 meters or at least 0.04 meters or at
least 0.06 meters or at least 0.08 meters or at least 0.1 meters or
at least 0.2 meters or at least 0.25 meters or at least 0.3 meters
or at least 0.35 meters or at least 0.4 meters or at least 0.5
meters or at least 0.6 meters or at least 0.7 meters or at least
0.8 meters or at least 0.9 meters or at least 1 meter or at least
1.2 meters or at least 1.4 meters or at least 1.6 meters or at
least 1.8 meters or at least 2 meters or at least 2.2 meters or at
least 2.4 meters or at least 2.6 meters or at least 2.8 meters or
at least 3 meters or at least 3.2 meters or at least 3.4 meters or
at least 3.6 meters or at least 3.8 meters or at least 4 meters or
at least 5 meters or at least 6 meters or at least 7 meters or at
least 8 meters or at least 9 meters or at least 10 meters. In
another aspect, any one of the electronic devices and/or electronic
assemblies may have a minimum data transmission rate of at 4 kbps
or at least 8 kbps or at least 10 kbps or at least 15 kbps or at
least 20 kbps or at least 40 kbps or at least 60 kbps or at least
80 kbps or at least 100 kbps or at least 150 kbps or at least 200
kbps or at least 250 kbps or at least 300 kbps or at least 400 kbps
or at least 500 kbps or at least 600 kbps. In still other
instances, the electronic devices and/or electronic assemblies may
have a maximum loss of not more than 50 dB [absolute value] over a
range of frequencies of at least 3 kHz to not greater than 300
GHz.
[0174] FIGS. 3A-3E include embodiments demonstrating various
arrangements that may be utilized between the body 301 and the
electronic assembly 310. Other arrangements are possible. For
example, the electronic assembly 310 can be bonded directly to an
exterior surface of the abrasive body 301, such as the first major
surface 302. It will be appreciated that the electronic assembly
310 can be bonded directly to other surfaces of the body 301
depending upon the desired transmission direction, shape of the
body, potential RF transmission blocking structures, and the
like.
[0175] As illustrated in FIG. 3A, the electronic assembly 310,
including the one or more electronic devices 312, the first portion
313 and the second portion 314 are coupled to a body 301. The
coupling can be direct or indirect. The body 301 may be an abrasive
portion or a non-abrasive portion of the body 301. In particular
instances, the first portion 313 may be directly coupled to the
surface 302 of the body 301. In another embodiment, such as
illustrated in FIG. 3B, at least a portion of the electronic
assembly 310 may be partially embedded in the body 301. For
example, the bottom surface 315 of the first portion 313 may be
below a surface 302 of the body 301.
[0176] FIG. 3C includes an illustration of an electronic assembly
310 partially embedded in a portion of the body 301. As
illustrated, the electronic assembly 310 is partially embedded such
that an upper surface 316 of the first portion 313 is at or below
the surface 302 of the body 301. In certain partially-embedded
embodiments, at least a portion of the second portion 314, such as
the uppermost surface of the second portion 314 may extend above
the surface 302, such as illustrated in FIG. 3C.
[0177] FIG. 3D includes an illustration of a partially-embedded
electronic assembly 310 in a portion of a body 301. The electronic
assembly 310 can be partially-embedded such that at least a portion
of the upper surface 317 of the second portion 314 intersects the
surface 302. For example, at least a portion of the upper surface
317 can be substantially continuous and co-planar with the surface
302.
[0178] In accordance with an embodiment, the embedded portion of
the electronic assembly 310 may have a particular size relative to
the total volume of the electronic assembly 310 that facilitates
suitable engagement with the body 301. For example, the embedded
portion can be at least 1% of the total volume of the electronic
assembly 310, such as at least 5% or at least 10% or at least 15%
or at least 20% or at least 30% or at least 40% or at least 50% or
at least 60% or at least 70% or at least 80% or even at least 90%
of the total volume of electronic assembly 310. Still, in another
non-limiting embodiment, the embedded portion can have a particular
size such as not greater than 95% of the total volume of electronic
assembly 310, such as not greater than 90%, or not greater than 80%
or not greater than 70% or not greater than 60% or not greater than
50% or not greater than 40% or not greater than 30% or not greater
than 20% or not greater than 10% or not greater than 5% of the
total volume of the electronic assembly. It will be appreciated
that the embedded portion can have a size relative to the volume of
electronic assembly 310 that is within a range including any of the
minimum and maximum percentages noted above. Furthermore, will be
appreciated that alternative size and shaped embedded portions may
be utilized to facilitate suitable attachment of electronic
assembly 310 in the body 301.
[0179] In still another embodiment, as illustrated in FIG. 3E, the
electronic assembly 310 can be completely embedded in the body 301.
As illustrated, in a completely embedded embodiment, the entirety
of the electronic assembly 310 can be displaced below the surface
302, as viewed in cross-section. For example, in the embodiment of
FIG. 3E, the upper surface 317 of the second portion 314 is
disposed beneath the surface 302 as viewed in cross-section.
[0180] In accordance with an embodiment, the electronic assembly
310 can be embedded at a particular depth that is suitable for
protecting the electronic assembly 310 while maintaining suitable
capabilities to allow information to be sent to and/or received by
the electronic device 362. For example, the electronic assembly 310
can be embedded at a depth (D) of less than 50% of the total
thickness of the body (TB). In other instances, the embedded depth
of electronic assembly 310 can be less, such as not greater than
45% or not greater than 40% or not greater than 35% or not greater
than 30% or not greater than 25% or not greater than 20% or not
greater than 15% or not greater than 10% or not greater than 5% or
not greater than 3% of the total thickness of the body (TB). Still
in one non-limiting embodiment, the electronic assembly 310 can be
embedded at a depth of at least 1% of the total thickness of the
body (TB), such as at least 2% or at least 3% or at least 5% or at
least 8% or at least 10% or at least 12% or at least 13% or at
least 15% or at least 20% or at least 25% or at least 30% or even
at least 40% of the total thickness of the body (TB). It will be
appreciated that the embedded depth of the electronic assembly 310
can be within a range including any of the minimum and maximum
percentages noted above.
[0181] The abrasive articles herein can include a plurality of
electronic assemblies distributed over the body in controlled
orientations and placements relative to each other. The plurality
of electronic assemblies may be coupled to, partially embedded
within, or completely embedded in the abrasive portion,
non-abrasive portion, or a combination thereof.
[0182] FIG. 4A includes a cross-sectional illustration of a coated
abrasive article according to an embodiment. As illustrated, the
coated abrasive 400 can include a substrate 401 and a make coat 402
overlying a surface of the substrate 401. The coated abrasive 400
can further include one or more types of particulate material 404,
which can include abrasive particles (e.g., primary abrasive
particles and/or secondary abrasive particles), filler particles,
additive particles, or any combination thereof. The coated abrasive
400 may further include size coat 403 overlying and bonded to the
particulate material 404 and the make coat 402.
[0183] According to one embodiment, the substrate 401 can include
an organic material, inorganic material, and a combination thereof.
In certain instances, the substrate 401 can include a woven
material. However, the substrate 401 may be made of a non-woven
material. Particularly suitable substrate materials can include
organic materials, including polymers, and particularly, polyester,
polyurethane, polypropylene, polyimides such as KAPTON from DuPont,
paper or any combination thereof. Some suitable inorganic materials
can include metals, metal alloys, and particularly, foils of
copper, aluminum, steel, and a combination thereof.
[0184] The make coat 402 can be applied to the surface of the
substrate 401 in a single process, or alternatively, the
particulate material 404 can be combined with a make coat 402
material and the combination of the make coat 402 and particulate
material 404 can be applied as a mixture to the surface of the
substrate 401. In certain instances, controlled deposition or
placement of the particulate material 404 in the make coat 402 may
be better suited by separating the processes of applying the make
coat 402 from the deposition of the particulate material 404 in the
make coat 402. Still, it is contemplated that such processes may be
combined. Suitable materials of the make coat 402 can include
organic materials, particularly polymeric materials, including for
example, polyesters, epoxy resins, polyurethanes, polyamides,
polyacrylates, polymethacrylates, polyvinylchlorides, polyethylene,
polysiloxane, silicones, cellulose acetates, nitrocellulose,
natural rubber, starch, shellac, and mixtures thereof. In one
embodiment, the make coat 402 can include a polyester resin. The
coated substrate can then be heated in order to cure the resin and
the particulate material 404 to the substrate 401. In general, the
coated substrate 401 can be heated to a temperature of between
about 100.degree. C. to less than about 250.degree. C. during this
curing process.
[0185] The particulate material 404 can include different types of
abrasive particles according to embodiments herein. The different
types of abrasive particles can include different types of shaped
abrasive particles, different types of secondary particles or any
combination thereof. The different types of particles can be
different from each other in composition, two-dimensional shape,
three-dimensional shape, grain size, particle size, hardness,
friability, agglomeration, or any combination thereof.
[0186] After sufficiently forming the make coat 402 with the
particulate material 404 contained therein, the size coat 403 can
be formed to overlie and bond the particulate material 404 to the
make coat 402 and the substrate 401. The size coat 403 can include
an organic material, and may be made essentially of a polymeric
material, and notably, can use polyesters, epoxy resins,
polyurethanes, polyamides, polyacrylates, polymethacrylates, poly
vinyl chlorides, polyethylene, polysiloxane, silicones, cellulose
acetates, nitrocellulose, natural rubber, starch, shellac, and
mixtures thereof.
[0187] As further illustrated in FIG. 4A, the coated abrasive 400
can include an electronic assembly 420 including an electronic
device 422 contained within a package 421. According to an
embodiment, the package may be optional and one may opt to utilize
the make coat 402 and/or size coat 403 as a material suitable for
packaging and enclosing at least a portion of the electronic device
422. The electronic assembly 420 can have any of the features of
electronic assemblies described in embodiments herein. The
electronic device 422 may have any of the features of other
electronic devices described in embodiments herein. The package 421
may have any of the features of any of the other packages described
in embodiments herein, including a first portion and a second
portion.
[0188] According to one particular embodiment, the electronic
assembly 420 can be overlying and/or coupled to the substrate 401.
In a particular embodiment, at least a portion of the electronic
device 422 can be in contact with the substrate 401. Furthermore,
as illustrated in FIG. 4, at least a portion of the electronic
device 422 can be encompassed by the package 421. According to one
embodiment, the electronic assembly 420 can be embedded within the
make coat 402 such that the make coat 402 covers the entirety of
the electronic assembly 420. However, in other embodiments, at
least a portion of the electronic assembly 410 may be protruding
from the make coat 402 and/or size coat 403 such that at least a
portion of the electronic assembly 420 can be exposed above the
exterior surface 431 of the size coat 403.
[0189] FIG. 4A provides one potential embodiment for the
incorporation of the electronic assembly 420 into a coated abrasive
article 400. Other possible placements and orientations of the
electronic assembly for 20 are possible. For example, the
electronic assembly 420 may be placed on the opposite side of the
backing 401, such as the backside 425 of the backing 401. In still
another embodiment, the electronic assembly 420 can be overlying at
least a portion of the exterior surface 431 of the abrasive article
400, and particularly the size coat 403. In certain instances, none
of the electronic assembly 420 may be embedded within the size coat
403 or make coat 402 of the coated abrasive article 400.
[0190] In an embodiment, an abrasive article can include a
substrate and an abrasive coating overlying the substrate. The
substrate can be any substrate disclosed in embodiments herein. For
instance, the abrasive article can include a non-woven abrasive
article, wherein the substrate can include a fibrous web. The
abrasive coating can include any composition that is known to a
skilled artisan for forming the non-woven abrasive article. In
another instance, the abrasive article can include a coated
abrasive article including a substrate similar to the backing 401,
and the abrasive coating can include the make coat 402 and abrasive
particles 404, and optionally the size coat 403. In some instances,
the abrasive coating can include a top coat overlying the size coat
403. In an embodiment, the abrasive coating can include an exterior
surface that can be a grinding surface. For instance, the grinding
surface can be the upper surface of the size coat 403, as
illustrated in FIG. 4A.
[0191] In an embodiment, an electronic assembly can be coupled to
the abrasive coating in a manner such that at least a portion of
the electronic assembly is in direct contact with a portion of the
abrasive coating. For instance, as illustrated in FIG. 4A, the
electronic assembly 420 is in direct contact with the make coat
402. In a particular embodiment, the electronic assembly can be
coupled to the abrasive coating in a tamper-proof manner.
[0192] In an embodiment, the electronic assembly 420 can be at
least partially embedded in the abrasive coating. For instance, the
electronic assembly 420 can be disposed such that at least a
portion of the electronic assembly 420 can be beneath the grinding
surface of the abrasive coating. In a particular embodiment, the
electronic assembly 420 can be fully embedded within the abrasive
coating. For example, the electronic assembly 420 can be fully
enveloped in the abrasive coating. In another instance, the entire
electronic assembly 420 can be beneath the grinding surface of the
abrasive coating.
[0193] In a further embodiment, the electronic assembly can be
disposed over the substrate, such as between the substrate and the
abrasive coating. In an example, the electronic assembly can be on
the substrate. Alternatively, the electronic assembly can be spaced
apart from the substrate. In some instances, the electronic
assembly may be partially embedded or completely embedded in the
substrate (i.e., a non-abrasive portion).
[0194] In another embodiment, the electronic assembly 420 can have
a certain thickness that can facilitate placement and coupling of
the electronic assembly to the body. In one instance, the
electronic assembly 420 can have a thickness of at least 1 micron,
such as at least 2 microns, at least 3 microns, or at least 4
microns. In another instance, the electronic assembly can be
thicker, having a thickness of at least 0.5 mm, at least 0.7 mm, at
least 0.8 mm, at least 1 mm, or at least 2 mm. Alternatively, or
additionally, the electronic assembly 420 may have a thickness of
not greater than 5 mm, such as not greater than 4 mm, not greater
than 3 mm, not greater than 2 mm, or not greater than 1 mm. In some
instances, the electronic assembly can be thinner, such as having a
thickness of not greater than 10 microns, not greater than 9
microns, not greater than 7 microns, not greater than 5 microns, or
not greater than 4 microns. Moreover, the thickness of the
electronic assembly can be in a range including any of the minimum
and maximum values noted herein. For example, the electronic
assembly 420 may have a thickness in a range including at least 1
micron and not greater than 5 mm, or in a range including at least
1 microns and not greater than 10 microns, or in a range including
at least 1 mm and not greater than 5 mm. After reading the instant
disclosure, a skilled artisan would understand that the thickness
of the electronic assembly 420 can be selected to suit a forming
process of the abrasive article, such as placement and coupling of
the electronic assembly or surviving a condition used to form the
abrasive article, or to improve use of the abrasive article having
the electronic assembly.
[0195] In another embodiment, the electronic assembly 420 can have
a certain thickness relative to the average thickness of the
abrasive coating that can facilitate formation of the abrasive
article. For instance, the thickness of the electronic assembly 420
may be not greater than 99% of the average thickness of the
abrasive coating, such as not greater than 98%, not greater than
96%, not greater than 94%, not greater than 92%, not greater than
90%, not greater than 88%, not greater than 86%, not greater than
84%, not greater than 82%, not greater than 80%, not greater than
78%, not greater than 76%, not greater than 75%, not greater than
73%, not greater than 71%, not greater than 70%, not greater than
68%, not greater than 66%, not greater than 64%, not greater than
62%, not greater than 60%, not greater than 58%, not greater than
55%, not greater than 53%, not greater than 51%, not greater than
50%, not greater than 48%, not greater than 45%, not greater than
43%, not greater than 41%, not greater than 40%, not greater than
38%, not greater than 36%, not greater than 34%, not greater than
32%, or not greater than 30% of the average thickness of the
abrasive coating. In another instance, the electronic assembly 420
can have a thickness of at least 5% of an average thickness of the
abrasive coating, such as at least 10%, at least 12%, at least 13%,
at least 15%, at least 17%, at least 18%, at least 20%, at least
22%, at least 24%, at least 25%, at least 27%, at least 30%, at
least 31%, at least 33%, at least 35%, at least 37%, at least 40%,
at least 42%, at least 44%, at least 46%, at least 48%, at least
50%, at least 52%, at least 54%, at least 55%, at least 58%, at
least 60%, at least 62%, at least 64%, at least 66%, at least 68%,
or at least 70% of the average thickness of the abrasive coating.
Moreover, the thickness of the electronic assembly 420 can include
any minimum and maximum percentages noted herein. For instance, the
electronic assembly 420 can have a thickness of at least 5% and at
most 99% of the average thickness of the abrasive coating. In
another embodiment, the abrasive coating can have an average
thickness from 0.015 mm to 1.5 mm. As used herein, average
thickness of the abrasive coating can be determined according to
ASTM D1777-96. The average thickness can be the average of 10
samples taken from the abrasive article in the same longitudinal
direction (or machine direction).
[0196] In another embodiment, the electronic assembly 420 can have
a certain thickness relative to the average thickness of the
abrasive article that can facilitate formation of the abrasive
article. A particular abrasive article can include a coated
abrasive, as illustrated in FIG. 4A, or a non-woven abrasive
article. For instance, the thickness of the electronic assembly 420
may be not greater than 55% of an average thickness of the abrasive
article, such as not greater than 53%, not greater than 51%, not
greater than 50%, not greater than 48%, not greater than 45%, not
greater than 43%, not greater than 41%, not greater than 40%, not
greater than 38%, not greater than 36%, not greater than 34%, not
greater than 32%, or not greater than 30% of the average thickness
of the abrasive article. In another instance, the electronic
assembly 420 can have a thickness of at least 1% of an average
thickness of the abrasive article, such as at least 3%, at least
5%, at least 7%, at least 10%, at least 12%, at least 13%, at least
15%, at least 17%, at least 18%, at least 20%, at least 22%, at
least 24%, at least 25%, at least 27%, at least 30%, at least 31%,
at least 33%, at least 35%, at least 37%, at least 40%, at least
42%, at least 44%, at least 46%, at least 48%, or at least 50% of
the average thickness of the abrasive article. Moreover, the
thickness of the electronic assembly 420 can include any minimum
and maximum percentages noted herein. For instance, the electronic
assembly 420 can have a thickness of at least 1% and at most 55% of
the average thickness of the abrasive article. In another
embodiment, the average thickness of the coated abrasive can be
from 0.2 mm to 3.5 mm. As used herein, average thickness of the
abrasive article can be determined according to ASTM D1777-96. The
average thickness can be the average of 10 samples taken from the
abrasive article in the same longitudinal direction (or machine
direction).
[0197] In an exemplary forming process for forming an exemplary
abrasive article, an electronic assembly can be disposed over the
substrate, such as the backing 401, and at least a portion of the
abrasive coating, such as at least a portion of the make coat 402,
can be disposed over the substrate and the electronic assembly 420.
In an instance, curing of the portion can be performed prior to
applying the rest of the abrasive coating. For instance, the make
coat 402 overlying the electronic assembly 420 can be cured prior
to application of abrasive particles 404, the size coat 403, or
both. The rest of the abrasive coating can be applied and cured to
form a finally-formed abrasive article. In another instance, a
first portion of the abrasive coating may be applied to the
substrate before an electronic assembly is disposed on the
substrate, and another portion or the rest of the abrasive coating
can be applied before or after curing of the first portion of the
abrasive coating and cured. The abrasive article may be formed when
all of the abrasive coating is applied and cured. In another
instance, the electronic assembly can be releasably coupled to at
least a portion of the body.
[0198] In one embodiment, the abrasive article can have a certain
flexibility difference that can allow the abrasive article to
perform and function in the similar manner as a same abrasive
article not including the electronic assembly, particularly when
the abrasive article is a non-woven or coated abrasive. A first
portion of the abrasive article including the electronic assembly
and a substantially same second portion not including the
electronic assembly can be cut from the abrasive article.
Flexibility of the first and second portions can be used to
determine the flexibility difference. Each of the first and second
portion samples can have a size of 75 mm.times.150 mm. Test of
flexibility can be performed using mandrel bend test according to
ASTM D4338-97 with modifications. Tests are conducted on freshly
prepared portion samples. Each portion sample is folded to form an
inverted U-shaped angle over the mandrel maintaining intimate
contact across the mandrel surface. The test is repeated with
progressively smaller diameter mandrels until the sample cracks or
fails in bending. Flexibility is considered as the smallest
diameter mandrel over which four out of five test portion samples
do not break. Test of flexibility of the first and second portions
can be performed in the longitudinal, transversal, or both
directions.
[0199] The flexibility difference can be determined using the
formula, .delta.F=[|(F2nd-F1st)|/F2nd].times.100%, wherein .delta.F
is the flexibility difference in the tested direction, F1st is the
first flexibility in the tested direction (i.e., longitudinal or
transversal), and F2nd is the second flexibility in the tested
direction. In an aspect, the first portion can have a first
flexibility in a longitudinal direction and the second portion can
have a second flexibility in the longitudinal direction, wherein
the flexibility difference between the first and the second
flexibility may be not greater than 50%, not greater than 45%, not
greater than 40%, not greater than 35%, not greater than 30%, not
greater than 25%, not greater than 20%, not greater than 15%, not
greater than 10%, not greater than 9%, not greater than 8%, not
greater than 6%, not greater than 5%, not greater than 4%, not
greater than 2%, or not greater than 1%. In another aspect, the
flexibility difference in the longitudinal direction can be greater
than 0, such as at least 0.001%, at least 0.005%, at least 0.01%,
at least 0.05%, at least 0.1%, at least 0.3%, at least 0.5%, at
least 0.8%, at least 1%, at least 2%, at least 5%, or at least 10%.
In a further aspect, the flexibility difference in the longitudinal
direction can be in a range including any of the minimum and
maximum percentages noted herein. In a particular aspect, the first
flexibility and the second flexibly in the longitudinal direction
can be substantially the same.
[0200] In a further aspect, the first portion can have a third
flexibility in a transversal direction and the second portion can
have a fourth flexibility in the transversal direction, wherein the
flexibility difference between the first and second portion in the
transversal direction may be not greater than 50%, not greater than
45%, not greater than 40%, not greater than 35%, not greater than
30%, not greater than 25%, not greater than 20%, not greater than
15%, not greater than 10% of the fourth flexibility or not greater
than 9% or not greater than 8% or not greater than 6% or not
greater than 5% or not greater than 4% or not greater than 2%. In
another aspect, the flexibility difference between the third and
fourth flexibility can be greater than 0, such as at least 0.001%,
at least 0.005%, at least 0.01%, at least 0.05%, at least 0.1%, at
least 0.3%, at least 0.5%, at least 0.8%, at least 1%, at least 2%,
at least 5%, or at least 10%. In a further aspect, the flexibility
difference between the third and fourth flexibility can be in a
range including any of the minimum and maximum percentages noted
herein. In a particular aspect, the third flexibility and the
fourth flexibly in the longitudinal direction can be substantially
the same.
[0201] In another embodiment, the abrasive article can have a
certain flexural rigidity difference that can allow the abrasive
article to perform and function in the similar manner as a same
abrasive article not including the electronic assembly,
particularly when the abrasive article is a non-woven or coated
abrasive. The flexural rigidity difference can be determined based
on the flexural rigidity difference of the first portion and the
second portion and using the formula,
.delta.FX=[|(FX2nd-FX1st)|/FX2nd].times.100%, wherein .delta.FX is
the flexure rigidity difference, FX1st is flexure rigidity of the
first portion, and FX2nd is flexure rigidity of the second portion.
The first portion of the abrasive article includes the electronic
assembly and the second portion is substantially the same not
including the electronic assembly. The first portion and second
portion samples are cut in the machine direction having the
dimension of 200 mm.times.25 mm. Flexure rigidity of the first and
second portions can be determined according to ASTM D1388-96 using
a heart loop tester. 5 samples for each of the first and second
portions can be tested. Each sample is formed into a heart-shaped
loop. The length of the loop is measured when it is hanging
vertically under its own mass. From this measured length, the
bending length, and flexural rigidity can be calculated.
[0202] In an aspect, the flexural rigidity difference of the
abrasive article may be not greater than 50% or not greater than
45% or not greater than 40% or not greater than 35% or not greater
than 30% or not greater than 25% or not greater than 20% or not
greater than 19% or not greater than 18% or not greater than 16% or
not greater than 15% or not greater than 14% or not greater than
12% or not greater than 11% or not greater than 10% or not greater
than 9% or not greater than 8% or not greater than 6% or not
greater than 5% or not greater than 4% or not greater than 2% or
not greater than 1% of the second flexural rigidity. In another
aspect, the flexure rigidity difference can be greater than 0, such
as at least 0.001%, at least 0.005%, at least 0.01%, at least
0.05%, at least 0.1%, at least 0.3%, at least 0.5%, at least 0.8%,
at least 1%, at least 2%, at least 5%, or at least 10%. In a
further aspect, the flexure rigidity difference can be in a range
including any of the minimum and maximum percentages noted herein.
In a particular aspect, the flexure rigidity of the first portion
and the second portion can be substantially the same.
[0203] In another embodiment, the abrasive article can have a
certain tensile strength difference that can allow the abrasive
article to perform and function in the similar manner as a same
abrasive article not including the electronic assembly,
particularly when the abrasive article is a non-woven or coated
abrasive. The tensile strength difference can be determined based
on the tensile strength difference of a first portion and a second
portion of the abrasive article, using the formula,
.delta.T=[|(T2nd-T1st)|/T2nd].times.100%, wherein .delta.T is the
tensile strength difference, T1st is the tensile strength of the
first portion, and T2nd is the tensile strength of the second
portion. The tensile strength of the first and second portions is
determined using a method derived from ASTM D5035. The first
portion includes the electronic assembly, and the second portion is
substantially the same without the electronic assembly. The portion
samples are cut such that the gauge length is parallel to the
longitudinal (machine) direction or the radial axis based on the
type of abrasive article. 5 samples for each of the first and
second portions can be prepared having the size of 25 mm.times.50
mm. Each sample is clamped in a tensile testing machine and a force
is applied until the sample breaks at a loading rate of 300 mm/min.
The breaking force and elongation is recorded and used to determine
the tensile strength. The average of 5 samples is used as the
tensile strength of the abrasive article.
[0204] In an aspect, the tensile strength difference of the
abrasive article may be not greater than 50% or not greater than
45% or not greater than 40% or not greater than 35% or not greater
than 30% or not greater than 25% or not greater than 20% or not
greater than 19% or not greater than 18% or not greater than 16% or
not greater than 15% or not greater than 14% or not greater than
12% or not greater than 11% or not greater than 10% or not greater
than 9% or not greater than 8% or not greater than 6% or not
greater than 5% or not greater than 4% or not greater than 2% or
not greater than 1% of the second flexural strength. In another
aspect, the tensile difference can be greater than 0, such as at
least 0.001%, at least 0.005%, at least 0.01%, at least 0.05%, at
least 0.1%, at least 0.3%, at least 0.5%, at least 0.8%, at least
1%, at least 2%, at least 5%, or at least 10%. In a further aspect,
the tensile strength difference can be in a range including any of
the minimum and maximum percentages noted herein. In a particular
aspect, the tensile strength of the first portion and the second
portion can be substantially the same.
[0205] In an embodiment, the electronic assembly can be placed out
of the flange area to help to reduce the likelihood of damaging the
electronic assembly during a material removal operation of the
abrasive article. In a further embodiment, the electronic assembly
may be placed in an area between the discard diameter of a wheel
and the flange diameter. In another embodiment, the electronic
assembly can be placed in the inner circumferential region.
[0206] In another embodiment, the abrasive article can be in the
form of a disc or a wheel having a central opening. As illustrated
in FIG. 4B, the abrasive article 450 including an opening 451
having an inner radius 453, and an outer radius 452 (referred to as
"R"). In an embodiment, an electronic assembly 454 including a
package 458 containing at least one electronic device 459 can be
disposed at a position relative to the central opening 451 to
facilitate operations utilizing the abrasive article, facilitate
function and performance of the electronic assembly, and/or reduce
the likelihood of damaging the electronic assembly. For instance,
the electronic assembly can be adjacent the central opening 451,
wherein the distance 455 between the center of the abrasive article
and the electronic assembly 454 may be less than 0.5R, such as not
greater than 0.4R, not greater than 0.3R, not greater than 0.2R, or
not greater than 0.1R. Additionally, or alternatively, the distance
455 can be at least 0.05R, such as at least 0.08R or at least 0.1R.
Moreover, the distance 455 can be in a range including any of the
minimum and maximum values noted herein.
[0207] In another instance, the electronic assembly can be distal
to the central opening 451 and adjacent the outer circumference of
the abrasive article. For instance, the distance 455 between the
center of the abrasive article and the electronic assembly 454 may
be greater than 0.5R, such as at least 0.6R, at least 0.7R, at
least 0.8R, or at least 0.9R. Additionally, or alternatively, the
distance 455 may be not greater than 0.99R or not greater than
0.95R or not greater than 0.93R or not greater than 0.9R. Moreover,
the distance 455 can be in a range including any of the minimum and
maximum values noted herein.
[0208] In another embodiment, the electronic assembly 454 can have
a certain orientation that can facilitate improved performance of
the electronic assembly or help to reduce likelihood of damaging
the electronic assembly during operations utilizing the abrasive
article. For example, as illustrated in FIG. 4B, the abrasive
article 450 can have a radial axis 457, and the electronic assembly
454 can have a longitudinal axis 456, wherein the radial axis 457
and the longitudinal axis 456 can be angled.
[0209] In another embodiment, the abrasive article may be in the
form of a belt. As illustrated in FIG. 4C, a portion of an abrasive
belt 460 can include an edge 461 and an opposite edge 462, and a
longitudinal axis 471. As illustrated, the longitudinal axis 471
extends along a midline of the belt 460. The belt 460 can include a
width 465 (referred to as "W") across the belt in the lateral
direction. The electronic assembly 470 can include a package 467
and an electronic device 466. In an embodiment, the electronic
device 470 can be disposed at a position that is adjacent an edge,
such as 462 as illustrated, and distal to the midline of the belt,
which can facilitate operations utilizing the abrasive article,
facilitate function and performance of the electronic assembly,
and/or reduce the likelihood of damaging the electronic assembly
during operations utilizing the belt. For instance, the distance
475 between the edge 462 and the electronic assembly 470 may be
less than 0.5 W or not greater than 0.4 W or not greater than 0.3 W
or not greater than 0.2 W or not greater than 0.1 W, wherein W is a
width across the belt in lateral direction. In another instance,
the distance 475 from the edge 462 of the belt 460 to the
electronic assembly 470 can be at least 0.05 W or at least 0.07 W
or at least 0.09 W or at least 0.1 W or at least 0.15 W. Moreover,
the distance 475 can be in a range including any of the minimum and
maximum values noted herein.
[0210] In a further embodiment, the electronic assembly 470 can
have a certain orientation that can facilitate improved performance
of the electronic assembly or help to reduce likelihood of damaging
the electronic assembly during operations utilizing the abrasive
article. For example, as illustrated, the longitudinal axis 471 of
the electronic assembly 470 can substantially aligned with a
longitudinal axis 463 of the abrasive article 460. In another
example, a lateral axis of the electronic assembly can be
substantially aligned with the longitudinal axis of the abrasive
article. In another instance, the longitudinal axis of the
electronic assembly can be angled with respect to the longitudinal
axis of the abrasive article.
[0211] As illustrated in FIG. 4D, the abrasive article 480 can have
a curvature and a curvature axis 482. The electronic assembly 481
can include a package 483 and at least one electronic device 482.
As illustrated, the electronic assembly 481 can also have a
curvature, and in some particular instances, the curvature of the
electronic assembly can be co-axial with the curvature of the
abrasive article 480.
[0212] FIG. 5 includes a diagram of a supply chain and function of
an abrasive article according to an embodiment. The embodiments
provided in FIG. 5 include examples of using an electronic assembly
as part of an abrasive article, particularly as part of the
manufacturing portion of the supply chain. As illustrated in the
diagram of FIG. 5, the diagram includes forming an abrasive body
including an electronic assembly at 501. Forming of the abrasive
body can include any forming methods described in the embodiments
herein.
[0213] After forming the abrasive body with the electronic assembly
including the electronic device, the process can further include
writing manufacturing information to the electronic device at 502.
Writing information can be conducted during a write operation,
wherein information can be written to and stored on the electronic
device. Some suitable examples of manufacturing information can
include processing information, manufacturing date, shipment
information, product identification information or any combination
thereof. In certain instances, processing information can include
information pertaining to at least one processing condition used
during forming of the abrasive body. Some suitable examples of
processing information can include manufacturing machine data
(e.g., machine identification, serial number, etc.) processing
temperature, a processing pressure, processing time, processing
atmosphere, or any combination thereof.
[0214] According to one embodiment, writing manufacturing
information to the electronic device can occur during at least one
process of forming the abrasive body. The process of forming can
include any of the processes described herein, including for
example, but not limited to, pressing, molding, casting, heating,
curing, coating, cooling, stamping, drying, or any combination
thereof. In certain instances, a machine conducting the forming
process can conduct the writing operation and write the
manufacturing information onto the electronic device. It will be
appreciated that such manufacturing information can be processing
information.
[0215] In an alternative embodiment, a sensor included in the
electronic assembly can assist writing manufacturing information to
the electronic device during forming of the abrasive body. The
sensor may be configured to sense the conditions occurring during
processing and write this information to an electronic device as
manufacturing information. In still another embodiment, one or more
other systems and/or individuals may write the one or more
processing conditions used during the forming of the abrasive body
as manufacturing information to the electronic device.
[0216] In an alternative embodiment, the process of writing
manufacturing information to the electronic device can occur after
forming the abrasive body. One or more systems and/or individuals
may conduct a writing operation to write the manufacturing
information on the electronic device after forming of the abrasive
body.
[0217] In accordance with an embodiment, the manufacturing
information stored on the electronic device may be utilized to
conduct a quality control inspection of an abrasive article or a
plurality of abrasive articles. Review of the manufacturing
information, such as processing information, may assist with the
identification of processing conditions and identification of
abrasive articles that may not meeting a desired minimum quality
rating.
[0218] After writing information to the electronic device, the one
or more actions may be conducted using the manufacturing
information. For example, in one embodiment, a system and/or
individual may delete at least a portion of the manufacturing
information prior to sending the abrasive article to a customer. It
may be suitable to delete certain manufacturing information, such
as certain processing information pertaining to aspects of forming
the abrasive article.
[0219] In another embodiment, one or more write operations may be
conducted to write information to the electronic device prior to
sending the abrasive article to a customer. Such a writing
operation may include storing customer information on the
electronic device. The customer information may assist with the
shipment and/or use of the abrasive article. Various types of
customer information that can be included on the electronic device
are described herein.
[0220] In another embodiment, a read operation may be conducted
after writing information to the electronic device. For example,
the read operation may read information from the electronic device
prior to sending the abrasive article to a customer. Conducting a
read operation may facilitate a quality inspection of the abrasive
article and the information contained on the electronic device.
Upon finalizing of the manufacturing operation, the abrasive
article may be sent to shipping and thereafter sent to a customer
for use of the abrasive article.
[0221] FIG. 6 includes a diagram of a supply chain and function of
the abrasive article according to an embodiment. As illustrated,
the customer may obtain or be provided with an abrasive article
including an electronic device. Depending upon the one or more
electronic devices, the abrasive article may be supplied with
customer information or alternatively, the customer may conduct a
write operation to write certain customer information onto the
electronic device. According to an embodiment, customer information
can include information such as customer registration information,
product identification information, product cost information,
manufacturing date, shipment date, environmental information, use
information, or any combination thereof. The customer information
may be used to improve the use of the customer at 602. For example,
the customer information may facilitate improved information
exchange between the manufacturer and customer, and such feedback
of information from the customer to the manufacturer may facilitate
improved use of the abrasive article.
[0222] In one particular embodiment, customer information can
include use information pertaining to suitable use conditions of
the abrasive article. Accordingly, the customer may use the use
information to ensure that the abrasive article is used under the
proper operating conditions. Specific example of the use
information can include, but is not limited to, minimum operating
speed, maximum operating speed, burst speed, maximum power of the
machine, maximum depth of cut, maximum down force, optimal wheel
angle, and the like.
[0223] In still another embodiment the process of using customer
information can include alerting one or more systems and/or
individuals in the supply chain to a particular alert condition.
Alert conditions may be based upon one or more pre-programmed
thresholds, whereupon exceeding such a threshold, the electronic
device can be configured to generate an alert signal. The alert
signal can be any signal suitable to contact a system and/or
individual in the supply chain, including any system and/or
individual associated with manufacturing, shipping, and customers.
According to one embodiment, the alert signal may be a sound,
optical indicia, or a combination thereof intended to alert a user.
In another embodiment, the alert signal may be an electronic
communication sent to one or more remote systems or individuals.
For example, the alert signal can be sent to a customer-registered
device, a manufacturer-registered device, or any combination
thereof. Some examples of customer-registered devices can include a
customer-registered mobile device or a machine configured to use
the abrasive article. In one embodiment the alert signal can be in
the form of a text message to a customer-registered mobile device.
In another embodiment the alert signal can be an electronic mail
(i.e., email) communication to a customer-registered mobile device.
A manufacturer-registered device can include for example a
manufacturer-registered mobile device, or a manufacturer-registered
computer system configured to monitor alert signals from various
customers and associated abrasive articles.
[0224] In one embodiment, the alert condition can warn of potential
damage to the abrasive article. The alert signal can be sent to a
user, a system utilizing the abrasive article, and/or other systems
and/or individuals in the supply chain of the abrasive article.
According to a particular embodiment, the electronic device may
include one or more sensors be configured to sense one or more
operating conditions. When one of the operating conditions is
exceeded, the sensors can communicate with one or more other
electronic devices in the electronic assembly and create an alert
condition. The alert condition can generate an alert signal that
can be sent to one or more systems and/or individuals in the supply
chain. In particular instance, the alert signal can be sent to the
grinding machine using the abrasive article. The alert signal may
be used by the grinding machine to change the operating conditions
and eliminate the alert condition.
[0225] In another embodiment, the process of alerting the customer
can include alerting the customer to alert condition associated
with the age of the abrasive article. For example, the electronic
device may include one or more timers, wherein after a programmed
amount of time has elapsed without use of the abrasive article, the
timer can generate an alert condition warning the customer of the
age of the abrasive article. It will be appreciated that the other
systems and/or individuals in the supply chain can be alerted.
[0226] According to another aspect, alerting the customer can
include alerting the customer to an alert condition associated with
one or more environmental conditions of the abrasive article. For
example, in one embodiment, the electronic device can be coupled to
a sensor configured to sense one or more environmental conditions.
Some suitable examples of environmental conditions that may be
sensed by the sensor can include, but is not limited to, the
presence of a threshold amount of water vapor within the packaging
of the abrasive article, the presence of a threshold amount of
water vapor in the abrasive article, the temperature of the
abrasive article, the pressure on the abrasive article, the
presence of harmful chemicals in the packaging, the presence of
harmful chemicals in the abrasive article, damage to the abrasive
article, tampering, age of the abrasive article or any combination
thereof. The sensors can be pre-programmed with suitable threshold
values for certain environmental conditions. If any of the
pre-programmed threshold values are exceeded, the sensor can
communicate with an electronic device to generate an alert
condition and send an alert signal. The alert signal can be sent to
one or more systems and/or individuals in the supply chain.
[0227] In still another embodiment, alerting the customer can
include alerting the customer and/or manufacturer to an alert
condition associated with the shipment of the abrasive article.
Such an alert signal may facilitate improved distribution and
transfer of abrasive articles between a manufacturer and customer.
For example, the electronic assembly may include a GPS, which may
facilitate tracking of the abrasive article by a customer or
manufacturer. Customer information may be used to provide feedback
to other systems and/or individuals in the supply chain. For
example, customer information may be used to provide feedback to
systems and/or individuals associated with the shipping of abrasive
articles between the manufacturer and customer. As noted herein,
feedback of customer information may facilitate smoother and
improved sales, distribution and/or transportation of abrasive
articles to customers.
[0228] According to another aspect, customer information may be
utilized to provide feedback to a manufacturer. For example, in one
embodiment customer information such as product use information may
be utilized and provided to a manufacturer to better understand
conditions of use by customer for a given abrasive article. Such
information may be valuable to a manufacturer to assist with
providing a customer with optimized abrasive articles and or making
suggestions for alternative use conditions or alternative abrasive
products.
[0229] In another embodiment, the customer information may be used
to facilitate future exchanges between the manufacturer and the
customer. For example, one or more types of information, such as
environmental information or customer information may be used to
notify the manufacturer that the customer is in need of more
abrasive articles. In one particular embodiment, the customer
information may be used to alert the one or more systems or
individuals in the supply chain, including for example, an alert to
one or more website addresses, emails, and/or sales representatives
of the manufacturer.
[0230] As illustrated in FIG. 7A, an electronic assembly 702 may be
overlying and coupled to the body 701. While this illustration is
showing the electronic assembly 702 as being in an overlying
position relative to the body 701, it will be appreciated that the
elements herein may be utilized with an electronic assembly in
alternative positions, such as a partially embedded or fully
embedded position within the body 701. It will be appreciated that
reference herein to the body 701 will include an abrasive portion
or non-abrasive portion of the body. As further illustrated in FIG.
7A, the abrasive article may include a securing assembly 703. The
securing assembly 703 can be configured to facilitate releasable
coupling of the electronic assembly 702 relative to the body 701.
The securing assembly 703 may include one or more securing
elements, such as a securing element 704, a securing element 705,
and a securing element 706.
[0231] FIG. 7B includes a top-down illustration of the portion of
the abrasive article of FIG. 7A. In particular instances, the
securing assembly 703 can be configured for actuation of at least
one of the securing elements (e.g., 705) relative to the electronic
assembly 702. For example, the securing element 705 may be
configured for movement between an engaged position and a
disengaged position. In an engaged position, the securing element
705 can be overlying and engaging the electronic assembly 702, thus
securing the electronic assembly 702 to the body 701. In a
disengaged position, the securing element 705 may be moved to an
alternative position, such as translated in the X-direction,
Y-direction, and/or Z-direction (perpendicular to the plane defined
by the X and Y directions). In the disengaged position, the
securing element 705 may be spaced apart from and disengaged from
the electronic assembly 702. In the disengaged position, the
electronic assembly 702 is in a non-secure position and may be
readily removed from the body 701. In such instances, removal of
electronic assembly 702 from the body 701 may be accomplished
without need for applying heat or other chemical additives to
remove or dissolve an adhesive.
[0232] FIG. 8A includes a cross-sectional illustration of an
abrasive article including an electronic assembly and a securing
assembly according to one embodiment. As illustrated, the abrasive
article 800 includes a body 801. The body 801 may be an abrasive
portion or a non-abrasive portion. As further illustrated, the
abrasive article 800 may include an electronic assembly 802
including a first portion 811, second portion 812, and one or more
electronic devices 813 having any of the characteristics of
corresponding components in other embodiments herein. The abrasive
article 800 can include a securing assembly 803 including a
complementary engagement structure 804 including at least one
engagement element 805 coupled to the electronic assembly 802 and
configured for complementary engagement with at least one receiving
element 821. Further details of area 820 are provided in FIG. 8B.
As illustrated, the at least one engagement element 805 may be
configured for translation in the Y-direction such that it can move
between an engaged position in a disengaged position. In the
disengaged position, the at least one engagement element 805 may be
spaced apart from the at least one receiving surface 821. The at
least one receiving surface 821 can be in the form of a groove. The
at least one engagement element 805 can be in the form of an
extension that can be articulated into and out of the groove to
move between the engaged position and disengaged position,
respectively.
[0233] As further illustrated in FIG. 8B, the at least one
receiving element 821 can be in the surface 814 of at least a
portion of the electronic assembly 802, and more particularly, in
the one of the portions forming the packaging. Notably, the at
least one receiving element 821 can be in the surface 814 of the
second portion 812 of the electronic assembly 802.
[0234] Any of the embodiments herein directed to systems to
facilitate releasable coupling between the electronic assembly and
at least a portion of the body may include one or more secure
keying elements. For example, as illustrated in FIG. 7B, the
securing element 704 can include a secure keying element. A secure
keying element is an element allowing for selective removal of the
electronic assembly 702 by only those programs and/or individuals
with suitable credentials. Credentials can be presented in the form
of encrypted data, a mechanical key, electronic identification
device, biometric data, or any combination thereof. For example, in
one embodiment the secure keying element 704 may be adapted to
accept a key that can be engaged with a portion of the securing
assembly 703 and used to facilitate the articulation of the
securing element 705. It will be appreciated that one or more
secure keying elements may also be configured to work with the
complementary engagement structure of the embodiments of FIGS. 8A
and 8B or any other embodiments herein.
[0235] In particular instances, the securing assembly can include
at least one biometric security system. A biometric security system
may be configured to identify particular aspects of individuals,
thereby limiting and controlling the individuals who may access the
electronic assembly 702 contained on the body 702 by the securing
assembly 703. Some suitable examples of biometric security systems
may be fingerprint identification systems, iris identification
systems, facial recognition systems, and the like.
[0236] FIG. 9A includes a perspective-view illustration of a
portion of a body of an abrasive article according to an
embodiment. In particular, the body 901 may have a securing
assembly in the form of a shaped depression 902 in the surface of
the body 901. The shaped depression 902 may be one part of a
coupling connection configured to facilitate coupling between the
body 901 and at least a portion of electronic assembly, and
specifically, coupling of only electronic assemblies having a shape
feature on a surface that is complementary to the shaped depression
902.
[0237] FIG. 9B includes a perspective-view illustration of a
portion of an electronic assembly according to an embodiment. In
particular, the electronic assembly 903 may have a shaped
protrusion 904 that is complementary to the shaped depression 902
in the body 901. Accordingly, the shaped depression 902 and shaped
protrusion 904 can be a type of coupling connection between the
body 901 and electronic assembly 903 that may ensure use of the
proper assembly with the appropriate abrasive article, preferred
mounting placement and orientation of the electronic assembly on
the body to improve data transmission.
[0238] FIG. 10A includes a cross-sectional illustration of a
portion of an abrasive article according to an embodiment. As
illustrated, the body 1001 can have an upper surface 1002. The body
1001 may be an abrasive portion or a non-abrasive portion. The
abrasive article includes an electronic assembly 1003 in a
partially embedded configuration in the body 1001. The electronic
assembly 1003 can include a first portion 1004 and a second portion
1005. More particularly, the electronic assembly 1003 can be
contained within a cavity 1020 in the body 1001. The cavity may be
sized and shaped to facilitate a releasable connection between the
electronic assembly 1003 the body 1001. For example, the electronic
assembly 1003 may be press fit into the cavity 1020 of the body
1001.
[0239] FIG. 10 B includes a cross-sectional illustration of a
portion of an abrasive article according to an embodiment. FIG. 10C
includes a top-down illustration of the embodiment of FIG. 10B. As
illustrated, the body 1001 can include an upper surface 1002. An
electronic assembly 1003 including a first portion 1004 and a
second portion 1005 may be contained within a cavity 1020 in the
body 1001. The electronic assembly 1003 may be press-fit in the
cavity 1020. A securing assembly 1030 including a securing element
1031 may be configured to translate from and engage position to a
disengaged position. In an engaged position, as illustrated in
FIGS. 10B and 10C, the securing element 1031 can be overlying and
engaging the electronic assembly 1003, thus securing the electronic
assembly 1003 to the body 1001. In a disengaged position, the
securing element 1031 may be spaced apart from and disengaged from
the electronic assembly 1003. The securing element 1031 may
articulate between the engaged position and the disengaged position
by translating in the Y-direction. In the disengaged position, the
electronic assembly 1003 is in a non-secure position and may be
readily removed from the body 1003. In such instances, removal of
electronic assembly 702 from the body 701 may be accomplished
without need for applying heat or other chemical additives to
remove or dissolve an adhesive.
[0240] FIG. 11 includes a cross-sectional illustration of an
abrasive article according to an embodiment. As illustrated, the
body 1101 can include a surface 1102. The body 1101 may include an
abrasive portion or a non-abrasive portion. An electronic assembly
1103 can be contained in a cavity 1120 within the body 1101. The
cavity 1120 may include at least one fastener 1130 contained in, or
at least partially contained in the cavity 1120. The fastener may
be positioned and oriented relative to the electronic assembly 1103
to maintain the electronic assembly in the cavity 1120 as long as
the faster is engaged with the body 1101. Thus, in an engage
position, the faster 1130 is engaged with the body 1101 securing
the electronic assembly 1103 in the cavity 1120. To remove the
electronic assembly 1103 from the cavity 1120, the fastener 1130
must first be removed. While not illustrated, it will be
appreciated that in alternative embodiments, the packaging of the
electronic assembly 1103 may directly engage at least a portion of
a fastener which may facilitate releasable engagement between the
electronic assembly 1103 in the body 1101.
[0241] The foregoing embodiments provide various mechanisms to
facilitate the releasable coupling between an electronic assembly
and a body of an abrasive article. Such embodiments may facilitate
selective removal of the electronic assembly from the body. Such
embodiments may facilitate maintenance and replacement of an
electronic assembly that may become damaged or need maintenance.
Furthermore, such a releasable mechanism may facilitate an
alternative way to access the electronic devices contained in the
assembly. It will be appreciated that any of the embodiments herein
and the elements of those securing assemblies may be used alone or
in combination with each other. Furthermore, such assemblies may
have certain advantages over conventional approaches, which may
include only the use of adhesive to secure an abrasive and
electronic assembly to a body.
[0242] FIG. 12 includes a cross-sectional illustration of a portion
of an abrasive article according to an embodiment. As illustrated,
the abrasive article includes a body 1201. The body 1201 may be an
abrasive or a non-abrasive portion. The body 1201 can include a
window 1202 containing an electronic assembly 1203. The window 1202
may define a region of greater RF transmittance as compared to the
body 1201. The RF electromagnetic radiation can have a frequency
within a range including any of those frequencies noted in the
embodiments herein. It may be desirable to secure the electronic
assembly 1203 in a window. It may also be desirable to have one or
more releasable connections between the window 1202 and the body
1201. The window 1202 may facilitate enhanced transmission and
direction of transmission of signals of one or more wireless
electromagnetic radiation signals from the electronic assembly
1203.
[0243] In accordance with an embodiment, the window can extend for
a significant portion of the body 1201. For example, the window
1202 can extend through at least a portion of the body, more
particularly through the entire thickness T of the body 1201.
[0244] In certain instances, the window 1202 may be selectively
removable from the body 1201. For example, the window may be
releasably coupled to the body 1201 by a coupling mechanism such as
a keyed assembly, a complementary engagement structure, a threaded
connection, a fastener, a snap-fit element, a clip, an adhesive, a
tapered-fit connection, or any combination thereof. In certain
instances, the window 1202 and electronic assembly 1203 may be a
monolithic construction. In such instances, the electronic assembly
1203 can be permanently secured in the body of the window 1202 such
that the electronic assembly 1203 may not be removed from the
window 1202 without permanently damaging the electronic assembly
1203 and the window 1202. Still, in another non-limiting
embodiment, the window 1202 and electronic assembly 1203 may be a
modular construction. For example, the electronic assembly 1203 can
be releasably coupled within the body of the window 1202. For
example, the window 1202 may be made of two or more components that
can be separated from each other to facilitate the removal of the
electronic assembly 1203 from the interior of the body of the
window 1202.
[0245] The window 1202 may include one or more elements that
facilitate the control of the direction of electromagnetic
radiation emitted from the electronic assembly 1203. For example,
the window may include one or more devices contained within its
body to facilitate the direction of electromagnetic radiation from
the terminal ends 1211 and 1212 of the window 1202. It will be
appreciated that devices utilized to control the direction of
electromagnetic radiation will control the direction based upon the
orientation of the window 1202 relative to the body 1201. It will
be appreciated that various possible orientations may be utilized.
Furthermore, some suitable examples of elements that may facilitate
control electromagnetic radiation may include a coating on an
exterior surface of the window 1202. The coating may act as a
grating. In another embodiment, the window 1202 may have one or
more surface features that may facilitate the direction of
electromagnetic radiation within the window 1202. For example, in
one embodiment, the surface features on the window 1202 may act as
a grating to control the direction of electromagnetic radiation
through the body of the window 1202.
[0246] In certain instances, the window 1202 may include one or
more particular types and arrangements of materials that may
facilitate directional controlled RF electromagnetic radiation
through the body of window 1202. For example, the body may include
two or more concentrically arranged layers of different materials
to control the transmission of RF frequency electromagnetic
radiation within the window 1202.
[0247] In certain instances, the window 1202 may be made of an
organic material. For example, the window 1202 may include at least
one of a biopolymer, a conductive polymer, a copolymer, a
fluoropolymer, a polyterpene, a phenolic resin, a polyanhydrides, a
polyketone, a polyester, a polyolefin, a rubber, a silicone, a
silicone rubber, a vinyl polymer or any combination thereof.
[0248] FIG. 13 includes an illustration of an abrasive system
according to an embodiment. The abrasive system 1300 can include a
housing 1301, a body 1303 contained within the housing 1301, and an
electronic assembly 1304 coupled to the body 1303. In particular
instances, the housing 1301 may include metal, more particularly,
may be a metal or metal alloy. In certain instances, the housing
1301 may include a transition metal element. The metal of the
housing 1301 may include iron, copper, nickel, silver, aluminum,
cobalt, or any combination thereof.
[0249] As illustrated in FIG. 13, the housing 1301 may partially
surround at least a portion of the body 1303. Certain material
removal operations rely upon enclosing at least a portion of the
body 1303 in a housing 1301 to improve the grinding operation and
provide a safe environment. In certain instances, the housing 1301
may limit proper communication between devices configured to
communicate with each other via wireless RF frequencies.
[0250] The housing 1301 can define a receiving space where at least
a portion of the body 1303 and the electronic assembly 1304 may be
disposed during a material removal operation. The degree to which
the housing surrounds the body 1303 and the electronic assembly
1304 may vary from system-to-system, however it has been observed
that housings of a relatively small degree can significantly
interrupt wireless communication.
[0251] In accordance with one aspect, the housing 1301 may include
an electronic device 1305. The electronic device 1305 can include
any electronic device as defined in other embodiments herein. For
example, the electronic device 1305 may include from the group of
an electronic tag, electronic memory, a sensor, an
analog-to-digital converter, a transmitter, a receiver, a
transceiver, a modulator circuit, a multiplexer, an antenna, a
near-field communication device, a power source a display, an
optical device, a global positioning system, a data transponder, a
secure data storage device, a secure logic device, or any
combination thereof. In at least one embodiment, the electronic
device can be configured to communicate with the electronic
assembly 1304 and or the electronic device 1307 via wireless
communication 1306 using known RF communication protocols. For
example, the electronic device 1305 may include an antenna. More
particularly, the electronic device 1305 may include a booster
antenna configured to transmit one or more signals from the
electronic assembly 1304 to the electronic device 1307. The
electronic device 1305 may be securely connected to the housing,
such as integrated within the housing 1305. Alternatively, the
electronic device 1305 can be releasably coupled to the housing
1305, which may include any one or a combination of securing
assemblies described in embodiments herein to couple the electronic
device 1305 to the housing 1301.
[0252] The use of one or more electronic devices 1305 on or within
the housing 1301 may facilitate and improve communication range of
the system 1300. For example, the system 1300 may have a minimum
effective communication range of at least 0.01 meters or at least
0.02 meters or at least 0.04 meters or at least 0.06 meters or at
least 0.08 meters or at least 0.1 meters or at least 0.2 meters or
at least 0.3 meters or at least 0.4 meters or at least 0.5 meters
or at least 0.6 meters or at least 0.7 meters or at least 0.8
meters or at least 0.9 meters or at least 1 meter or at least 1.2
meters or at least 1.4 meters or at least 1.6 meters or at least
1.8 meters or at least 2 meters or at least 2.2 meters or at least
2.4 meters or at least 2.6 meters or at least 2.8 meters or at
least 3 meters or at least 3.2 meters or at least 3.4 meters or at
least 3.6 meters or at least 3.8 meters or at least 4 meters or at
least 5 meters or at least 6 meters or at least 7 meters or at
least 8 meters or at least 9 meters or at least 10 meters. In
another aspect, the system 1300 may have a minimum data
transmission rate of at 4 kbps or at least 8 kbps or at least 10
kbps or at least 15 kbps or at least 20 kbps or at least 40 kbps or
at least 60 kbps or at least 80 kbps or at least 100 kbps or at
least 150 kbps or at least 200 kbps or at least 250 kbps or at
least 300 kbps or at least 400 kbps or at least 500 kbps or at
least 600 kbps. In still other instances, the system may have a
maximum loss of not more than 50 dB [absolute value] over a range
of frequencies of at least 3 kHz to not greater than 300 GHz.
[0253] In certain instances, one or more electronic devices such as
the electronic device 1307, 1305 or 1304 may include a vertically
polarized antenna, 3D polarized antenna, booster atenna, or any
combination. For example, one particular embodiment the electronic
device 1305 may include a booster antenna which may not necessarily
include any on-chip or off chip logic components, and configured
simply to relay transmissions from the electronic assembly 1304 to
the electronic device 1307.
[0254] As further illustrated in FIG. 13A, the system 1300 may
include a plurality of electronic assemblies, including a first
electronic assembly 1304 and a second electronic assembly 1331.
Each of the electronic assemblies 1304 and 1331 may contain one or
more electronic devices. The electronic assemblies 1304 and 1331
may be spaced apart and distributed around the body 1303 relative
to each other. As with any of the embodiments herein, the
electronic assemblies 1304 and 1331 may be on an abrasive portion
or non-abrasive portion, and furthermore, may be coupled to a
surface, partially embedded or fully embedded in any portion of the
body 1303. The electronic assembly 1331 may communicate wirelessly
with the electronic assembly 1304, electronic devices 1305 and/or
1307 directly or indirectly.
[0255] A workpiece may be moved relative to the body 1303 to
conduct a material removal operation. It will be appreciated that
alternative orientations between the workpiece 1341 and the body
1303 can be used depending upon the type and nature of the material
removal operation. In one particular embodiment, the workpiece 1341
can include an electronic device 1342 that can be coupled to the
body of the workpiece 1341. The electronic device 1342 on a
workpiece can be used with any of the other embodiments herein. The
electronic device 1342 may be configured to communicate with any
communication devices of the abrasive system 1300, including for
example, the electronic assembly 1304, the electronic device 1305,
and/or the electronic device 1307.
[0256] The electronic device 1307 may include one or more logic
components (e.g., processor) and/or data storage components (e.g.,
RAM and/or ROM) configured to store data from the electronic
assemblies 1304 and 1331 and the electronic devices 1305 and 1342.
In certain instances, it may be suitable that the electronic device
1307 compare the data to or more of the electronic devices, analyze
such data, and make or suggested changes to the material removal
operation. Such changes may be automated or may be presented to a
controller, such as an individual, for confirmation of any
suggested changes.
[0257] FIG. 13B includes an abrasive system including a housing
1351 and a body 1352 contained within the housing 1351. The body
1352 may include an electronic assembly 1353 coupled to the body
1352. The body 1352, as illustrated, may be a particular type of
edge grinding tool, wherein the workpiece 1361 may be a piece of
glass. The housing 1351 may further include coolant 1354 that is
applied to the grinding interface during a material removal
operation. In one embodiment the housing 1351 may include at least
one electronic device 1355. The at least one electronic device 1355
can be coupled to a surface or embedded in the material of the
housing 1351. The electronic assembly 1353 includes one or more
electronic devices configured to communicate with the one or more
electronic devices 1355 in the housing 1351. Information received
by the electronic device 1355 may be related to a remote electronic
device 1356 which is positioned outside of the housing 1351.
[0258] As further illustrated, the workpiece 1361 may include one
or more electronic devices 1357 coupled to the workpiece 1361 and
configured to transmit and/or receive information from one of the
other electronic devices, such as the electronic assembly 1353, the
electronic device 1355, and/or the electronic device 1356. In
particular instances, it may be suitable that the electronic
assembly 1353 include a protective layer configured to protect
against corrosive effects of the coolant 1354.
[0259] In an alternative embodiment, the electronic assembly 1353
may also be coupled to, partially embedded, or fully embedded, in a
surface 1358 of the body 1352. The placement and position of the
electronic assembly may facilitate improved communication with the
electronic devices 1355, 1356, and/or 1361. Moreover, in certain
instances, of the electronic devices 1355, 1356, 1361 and/or
electronic assembly 1353 may utilize a vertically polarized
antenna, booster antenna, 3D polarized antenna, or any combination
thereof. It will also be appreciated that in certain instances, it
may be suitable to use a plurality of electronic assemblies located
at different positions and orientations on the body 1352.
[0260] FIGS. 14A and 14B include cross-sectional illustrations of a
portion of an abrasive article according to an embodiment. The
electronic assembly 1403 can be coupled to an exterior surface 1402
in a non-parallel configuration relative to the exterior surface of
the body 1401. In certain instances, the electronic assembly 1403
may have a longitudinal axis 1406 that is not parallel to either
the radial axis 1407 and/or the axial axis 1408 of the body 1401.
As illustrated in FIG. 14A, the electronic assembly 1403 can be
contained in a cavity 1405 of the body 1401. The cavity 1405 can
have a lower surface oriented in a non-parallel configuration
relative to another portion of the exterior surface 1402 of the
body 1401. The lower surface may be oriented in a non-parallel
configuration relative to the radial axis 1407 and/or the
longitudinal axis 1408 of the body 1401.
[0261] The lower surface 1404 may be a mounting surface configured
to receive at least a portion of the electronic assembly 1403
thereon. The mounting surface can be angled to facilitate tilting
of the electronic assembly 1403 in a preferred orientation to
improve transmission of data from the one or more electronic
devices in the electronic assembly. In FIG. 14B, the electronic
assembly 1403 includes a first portion having a particular shape
that facilitates tilting of the electronic assembly 1403 relative
to the radial axis 1407 and/or the longitudinal axis 1408 of the
body 1401.
[0262] FIG. 15A includes a cross-sectional illustration of a
portion of an abrasive article according to an embodiment. The
abrasive article 1500 includes a body 1501, which is primarily a
core (i.e., non-abrasive portion) of the body 1501. In the
peripheral side 1503 of the body 1501, between surfaces 1502 and
1504, are grooves containing abrasive portions 1511 and 1512
including abrasive particles and bond material. During use, the
abrasive portions 1511 and 1512 become warm and need to be dressed,
replenished, and/or re-profiled many times throughout the life of
the abrasive article 1500. In particular instances, data related to
the number of dressing operations, replenishing operations, and/or
re-profiling operations may be stored on one or more of the
electronic assemblies 1521 and 1522. Such information may be made
available to only the manufacturer. Alternatively, such information
may be accessible by the customer or the manufacturer.
[0263] Notably, investigation into utilization of certain
electronic assemblies in the context of real-world material removal
operations has shown that certain types of conventionally available
electronic devices may not be satisfactory. Accordingly, the
embodiments herein address certain issues identified in the use of
conventional technologies to make notable strides in the
application and deployment of electronic assemblies and electronic
devices in real-world grinding operations.
[0264] FIG. 16 illustrates a block diagram of an electronic
assembly according to one embodiment. The electronic assembly may
include one or more sensors 1616 for collecting data, a data
storage 1604, which may store the collected data and may include
instructions 1614, one or more processor(s) 1602, a communication
interface 1606 for communicating with a remote source (e.g., a
server or another device/sensor), and a display 1606. Additionally,
the electronic assembly may include one or more electronic devices,
such as, but not limited to, an audio output device (e.g., a
speaker) and a haptic feedback device (e.g., an eccentric rotating
mass (ERM) actuator, linear resonant actuator (LRA), or
piezoelectric actuators, among other examples).
[0265] The one or more sensors 1616 may be configured to collect
data in real-time from or associated with an environment of the
electronic assembly. Real-time collection of data may involve the
sensors periodically or continuously collecting data. For example,
the one or more sensors 1616 may include a sound detection device
(e.g., a microphone) that is configured to detect sound in the
environment of the sensor (e.g., from an abrasive tool operating in
proximity of the sensor). Additionally, and/or alternatively, the
sensors 1616 may be configured to collect data from or associated
with an operator of the electronic assembly. For example, the one
or more sensors 1616 may include an accelerometer (e.g., a tri-axis
accelerometer) that is configured to measure acceleration of the
operator (e.g., acceleration of a hand of the operator on which the
electronic assembly is mounted). As described herein, the data
collected by the one or more sensors 1616 may be used to determine
abrasive operational data, which could then be used for obtaining
real-time data about grinding/abrasive operations, capturing a user
experience of a user that is using the tool, and/or determining
operational and/or or enterprise improvements (e.g., based on data
collected over a period of time).
[0266] The one or more sensors 1616 may also include other sensors
for detecting movement, such IMUs and gyroscopes. Further, the one
or more sensors 1616 may include other types of sensors such as
location-tracking sensors (e.g., a GPS or other positioning
device), light intensity sensors, thermometers, clocks, force
sensors, pressure sensors, photo-sensors, Hall sensors, vibration
sensors, sound-pressure sensors, a magnetometer, an infrared
sensor, cameras, and piezo sensors, among other examples. These
sensors and their components may be miniaturized so that the
electronic assembly may be worn on the body without significantly
interfering with the wearer's usual activities.
[0267] The processor 1602 may be configured to control the one or
more sensors 1616 based, at least in part, on the instructions
1614. As will be explained below, the instructions 1614 may be for
collecting real-time data. Further, the processor 1602 may be
configured to process the real-time data collected by the one or
more sensors 1616. Yet further, the processor 1602 may be
configured to convert the data into information indicative of the
behavior of an abrasive tool or the user experience of the user
using the tool.
[0268] The data storage 1604 is a non-transitory computer-readable
medium that can include, without limitation, magnetic disks,
optical disks, organic memory, and/or any other volatile (e.g. RAM)
or non-volatile (e.g. ROM) storage system readable by the processor
1602. The data storage 1604 can include a data storage to store
indications of data, such as sensor readings, program settings
(e.g., to adjust behavior of the electronic assembly), user inputs
(e.g., from a user interface on the device 1600 or communicated
from a remote device), etc. The data storage 1604 can also include
program instructions 1614 for execution by the processor 1602 to
cause the device 1600 to perform operations specified by the
instructions. The operations could include any of the methods
described herein. As illustrated, all devices can be electrically
connected by at least one bus 1612.
[0269] The communication interface 1606 can include hardware to
enable communication within the electronic assembly and/or between
the electronic assembly and one or more other devices. The hardware
can include transmitters, receivers, and antennas, for example. The
communication interface 1606 can be configured to facilitate
communication with one or more other devices, in accordance with
one or more wired or wireless communication protocols. For example,
the communication interface 1606 can be configured to facilitate
wireless data communication for the electronic assembly according
to one or more wireless communication standards, such as one or
more IEEE 801.11 standards, ZigBee standards, Bluetooth standards,
etc. For instance, the communication interface 1606 could include
WiFi connectivity and access to cloud computing and/or cloud
storage capabilities. As another example, the communication
interface 1606 can be configured to facilitate wired data
communication with one or more other devices.
[0270] The display 1608 can be any type of display component
configured to display data. As one example, the display 1608 can
include a touchscreen display. As another example, the display 1608
can include a flat-panel display, such as a liquid-crystal display
(LCD) or a light-emitting diode (LED) display.
[0271] The user interface 1610 can include one or more pieces of
hardware used to provide data and control signals to the electronic
assembly. For instance, the user interface 1610 can include a mouse
or a pointing device, a keyboard or a keypad, a microphone, a
touchpad, or a touchscreen, among other possible types of user
input devices. Generally, the user interface 1610 can enable an
operator to interact with a graphical user interface (GUI) provided
by the electronic assembly (e.g., displayed by the display 1608).
As an example, the user interface 1610 may allow an operator to
provide an input indicative of a task to be performed by the
operator. As another example, the operator may provide an input
indicative of a tool to be used to perform the operation and/or an
input indicative of a workpiece on which the operator may perform
the abrasive operation.
[0272] FIG. 17 includes a top-down illustration of an abrasive
article according to an embodiment. In some instances, a plurality
of abrasive articles, such as grinding wheels may be stacked on top
of one another, particularly in storage. Applicants of the present
disclosure have found that the position of one or more electronic
assemblies on the body of the abrasive article may impact the
ability to identify and distinguish one or more abrasive articles
from a plurality of abrasive articles. This may be particularly
true when a plurality of abrasive articles are stored, such as a
stack configuration, as illustrated in FIG. 17. Each abrasive
article in the stack may have one or more electronic assemblies
including electronic devices, such as a RFID device. Such devices
may be contained in particular locations on the bodies of the
abrasive articles. In one embodiment, one may utilize an elongated
RF reader that may extend through the central annular openings of
the plurality of cylindrical shaped abrasive articles stacked on
one another, which may facilitate reading and identification of
each of the abrasive articles in the stack.
[0273] In at least one embodiment, the RF reader may include other
electronic devices that may be continuously gathering data from one
or more sensors in the electronic assemblies of the plurality of
electronic devices. As such, the RF reader may include logic that
is configured to transmit one or more data signals to one or more
remote devices (e.g., cloud-based server, mobile device, etc.).
Such data may include status indications of the one or more
abrasive articles. For example, the RF reader may have logic
configured to relay an alert signal if one or more unfavorable
conditions are sensed by any of the sensors in any of the
electronic assemblies of the plurality of abrasive articles.
[0274] FIG. 18 includes a schematic illustration of a transceiver
and transponder that may be used in an abrasive system or abrasive
article of the embodiments herein. As illustrated, the transceiver
can include a data decoder, filter and gain element, demodulator,
antenna driver, and oscillator. The transceiver can be any
electronic device of the embodiments herein, including part of an
electronic assembly attached to an abrasive article. The
transceiver can further include an antenna 1801 coupled to the
antenna driver and the demodulator. It will be appreciated that
other arrangements of similarly functioning elements may be
utilized without departing from the scope of embodiments herein.
The transponder 1802 may be a booster antenna that can be
configured to communicate with the transceiver, such by relaying
information via antenna 1803 and 1801.
[0275] FIG. 19A illustrates an embodiment of an abrasive article
wherein the abrasive article can comprise a body 1901 including a
cavity 1902. The cavity may be designed that it can provide a
suitable space for coupling an electronic assembly 1903 to the body
1901. In one aspect, the electronic assembly 1903 is positioned in
the center of the bottom surface cavity of the body. The cavity can
extend from an exterior surface 1904 of the body 1901 in an
orthogonal direction (y-direction) within the body relative to the
exterior surface (x-direction). In a particular aspect, the
abrasive article can be an abrasive wheel containing the cavity at
a non-abrasive section.
[0276] It has been observed that for an enhanced performance of the
electronic device, the ratio of Dw/Dt can be a parameter that
influences the read distance of the electronic device, with Dw
being the distance between the electronic assembly and the wall and
Dt being the distance of the of the depth of the cavity, from an
exterior surface of the cavity to the bottom surface of the cavity.
As used herein, the ratio of Dw/Dt is also called "spacing factor."
In one aspect, the spacing factor can be at least 0.65, or at least
0.7, or at least 0.8 or at least 0.9 or at least 1 or at least 1.1
at least 1.2 or at least 1.5 or at least 1.7 or at least 2 or at
least 3 or at least 5. In another aspect, the spacing factor may be
not greater than 20, or not greater than 15, or not greater than
10, or not greater than 5. The spacing factor can be a value within
any of the minimum and maximum values noted above.
[0277] In a particular aspect, the wall 1905 of the cavity can have
an angle 1906 of at least 100 degrees relative to the bottom
surface of the cavity 1908, such as at least 110 degrees, at least
115 degrees, or at least 120 degrees. In another aspect, the angle
1906 of the wall 1905 can be not greater than 170 degrees or not
greater than 160, or not greater than 150 degrees, or not greater
than 145 degrees, or not greater than 140 degrees, or not greater
than 130 degrees, or not greater than 120 degrees. The angle of the
wall can be a value between any of the minimum and maximum values
noted above. In another particular aspect, the wall 1905 of the
cavity 1902 can have an angle of 90 degrees, the angle 1905 being
orthogonal to the bottom surface 1908 of the cavity, as illustrated
in FIG. 19B.
[0278] In a further embodiment, the electronic device contained
within the electronic assembly can be positioned in the cavity such
that an outer surface of the device 1909 may be at least 1 mm below
a level of the exterior surface of the body 1904, such as at least
2 mm, at least 3 mm, at least 3.5 mm, at least 4 mm, at least 5 mm.
In another aspect, an the electronic assembly 1903 may be
positioned within the cavity that the complete electronic assembly
is at least 1 mm below a level of the exterior surface of the body,
such as at least 2 mm, at least 3 mm, at least 3.5 mm, at least 4
mm, at least 5 mm.
[0279] In a particular embodiment, the bottom surface of the cavity
can have a round shape having a diameter of at least 5 mm, or at
least 7 mm, or at least 10 mm, or at least 12 mm, or at least 15
mm. In other aspects, the shape of the bottom surface of the cavity
can be also a square or rectangular or polygonal.
[0280] The cavity of the body including an electronic assembly can
be contained in a non-abrasive portion or an abrasive portion of
the body. In a particular aspect, the cavity can be contained in a
non-abrasive portion of the body. In another particular aspect, the
cavity may be contained in an abrasive portion of the body. As
further shown in the examples, the cavity can be contained in a
non-abrasive portion of an abrasive wheel. In a particular aspect,
the wheel can comprise metal or a metal alloy.
[0281] The electronic assembly suitable for being placed in the
cavity can be any electronic assembly as described in embodiments
herein. In a particular embodiment, the electronic assembly can be
an RFID tag. The minimum effective communication range of the
electronic device contained in the electronic assembly may be at
least 0.02 meters or at least 0.03 meters or at least 0.05
meters.
[0282] In a certain embodiment, an adapter can be used to provide a
support structure for the electronic assembly or electronic device.
The adapter, herein also called a carrier or a support, can include
a coupling structure for fastening the electronic assembly within a
cavity of the body or to another structure element of the body. The
adapter can have a flat plate-like structure, and may not be
limited to a specific shape. FIGS. 21A-21D illustrate some examples
of adapter shapes with an attached electronic assemblies. In FIG.
21A, the adapter 2101 has a circular shape and contains a square
shaped electronic assembly (2102) positioned in the center of the
adapter. In FIG. 2B, both the adapter 2103 and the electronic
assembly 2102 have a square shape, while FIG. 21C shows an
octagonal shaped adapter 2104 having in the center a round shaped
electronic assembly 2102. In FIG. 21D, the adapter 2105 has a
cross-like shape, wherein the electronic assembly 2102 may be
placed in the center of the crossing.
[0283] The electronic assembly or just the electronic device can be
attached to the adapter with an adhesive, or may be completely
embedded by a material of the adapter. A material of the adapter
can be the same as described in embodiments herein for the first
and/or second portion of the electronic assembly.
[0284] The adapter can be designed as being an attachment which
matches the inner dimension of a cavity and an outer dimension of
an electronic assembly for fastening to a cavity, for example, a
metal mount RFID tag. In a certain aspects, the adapter can be
designed to provide a tolerance fit, a press fit, a threaded joint,
or a knurled surface for being coupled to a cavity of a body. FIG.
21E and FIG. 21F show images of adapters containing an electronic
tag placed as a tight fit structure on a cavity of a metal wheel.
FIG. 21G illustrates a perspective view of placing an RF tag 2107
unto an adapter having an exact spacing 2109 for the RF tag and
setting the composite of adapter and tag within a cavity of a wheel
2111. The concept of using an adapter for supporting and protecting
an electronic assembly or a plain electronic device may not be
limited to cavities of the body, but can be applied to any
structure element of the abrasive article that may benefit from
such a feature.
[0285] In a particular embodiment, the adapter can have a
multi-layer structure. An embodiment of a multi-layer structure is
shown in FIG. 22. In FIG. 22, the adapter can comprise a metal
layer 2203 and a non-conductive RF transparent layer 2204. The
metal layer 2203 can be positioned underneath the electronic
assembly (2202), and the RF transparent layer 2204 may be on both
side surfaces (2205) of the electronic assembly (2202). Such
multi-layer adapter can be suitable to compensate an uneven surface
structure of the bottom surface of the cavity, for example, if the
bottom surface of the cavity is curved or otherwise not flat, as
further demonstrated in the examples.
[0286] In one embodiment, an abrasive article can comprise a body,
a cavity extending within the body from an exterior surface of the
body, and an electronic assembly contained within the cavity of the
body, the electronic assembly including and electronic device,
wherein a bottom surface of the cavity can be substantially flat.
As further shown in the examples, it has been observed that the
effective communication of the electronic device contained within
the cavity can be influenced by the surface geometry of the bottom
surface of the cavity, wherein best results can be obtained with a
substantially flat surface.
[0287] In one aspect, the bottom surface of the cavity can have a
normalized average flatness between 0.00001 mm.sup.-1 to 0.0001
mm.sup.-1. In one aspect, the normalized average flatness can be at
least 0.00002 mm.sup.-1, or at least 0.00005 mm.sup.-1, or at least
0.00007 mm.sup.-1. In another aspect, the normalized average
flatness may be not greater than 0.0001 mm.sup.-1, or not greater
than 0.00009 mm.sup.-1, or not greater than 0.00008 mm.sup.-1, or
not greater than 0.00005 mm.sup.-1. The normalized average flatness
can be a value within any of the minimum and maximum values note
above. As used herein, the normalized average flatness is
calculated by using as flatness for milled or drilled surfaces a
value 0.01-0.06 mm elevation, and dividing the flatness by the
surface area of the cavity bottom surface, which can be in
embodiments between about 75 mm.sup.2 and 150 mm.sup.2. In a
further aspect, the bottom surface of the cavity can have a surface
which is substantially parallel to a bottom surface of the
electronic assembly.
[0288] The present disclosure is further directed to a process for
coupling an electronic device to an abrasive article. The process
can include providing an abrasive article having a body,
identifying a position on the body; and using a robot for placing
the electronic device at the position. As used herein the term
position refers to the location of the body of the abrasive article
where an electronic device should be coupled to.
[0289] In one aspect, providing the abrasive article can include
identifying the abrasive article from a plurality of abrasive
articles. In a particular aspect, identifying the abrasive body can
comprise using a vision system. In one aspect, the vision system
may identify a desired abrasive article by detecting a unique
indicia which encodes information related to the abrasive article.
A vision system can be further used for identifying the desired
position for placing the electronic device.
[0290] The process can further comprise selecting the electronic
device using a robot and coupling the electronic device to the
identified position of the body. In one aspect, the robot may
contain an end effector which can grab and place the electronic
device to the aimed position. The end effector can comprise an in
built force/torque sensor capable of detecting the maximum force to
be exerted to press the electronic device into the cavity.
[0291] In another aspect, the electronic device can be contained in
a packaging as described in embodiments herein.
[0292] In a particular aspect, the position for coupling the
electronic device to the body can be a cavity extending within the
body from an exterior surface of the body. In another aspect, the
electronic device can be coupled to an exterior surface of the
body.
[0293] Non-limiting examples of an electronic device can include an
electronic tag, an electronic memory, a sensor, an
analog-to-digital converter, a transmitter, a receiver, a
transceiver, a modulator circuit, a multiplexer, an antenna, a
near-field communication device, a power source a display, an
optical device, a global positioning system, a data transponder, a
secure data storage device, a secure logic device, or any
combination thereof.
[0294] Many different aspects and embodiments are possible. Some of
those aspects and embodiments are described herein. After reading
this specification, skilled artisans will appreciate that those
aspects and embodiments are only illustrative and do not limit the
scope of the present invention. Embodiments may be in accordance
with any one or more of the embodiments as listed below.
EMBODIMENTS
Embodiment 1
[0295] An abrasive article comprising: a body; an electronic
assembly coupled to the body, wherein the electronic assembly
comprises: an electronic device; and a first portion disposed
between the body and the communication device, wherein the first
portion comprises a material having an average relative magnetic
permeability of not greater than 15.
Embodiment 2
[0296] An abrasive article comprising: a body; an electronic
assembly coupled to the body, wherein the electronic assembly
comprises: an electronic device; and a package containing the
electronic device, wherein the package comprises a first portion
and a second portion, wherein the first portion comprises a
material having a first average relative magnetic permeability and
the second portion comprises a material having a second average
relative magnetic permeability, and wherein the first average
relative magnetic permeability is different than the second average
relative magnetic permeability.
Embodiment 3
[0297] An abrasive article comprising: a body; an electronic
assembly coupled to the body, wherein the electronic assembly
comprises: an electronic device; and a package containing the
electronic device, wherein the package comprises a first portion
and a second portion, wherein the first portion comprises a
material having a first average dielectric value and the second
portion comprises a material having a second average dielectric
value, and wherein the first average dielectric value is different
than the second average dielectric value.
Embodiment 4
[0298] An abrasive article comprising: a body; an electronic
assembly coupled to the body, wherein at least one of the body and
the electronic assembly comprise metal, the electronic assembly
comprising: an electronic device configured for wireless
communication and having a minimum effective communication range of
at least 0.1 meters.
Embodiment 5
[0299] The abrasive article of any one of Embodiments 1 and 4,
wherein the electronic assembly comprises a first portion and a
second portion.
Embodiment 6
[0300] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the first portion comprises a material having an average
relative magnetic permeability of not greater than 15.
Embodiment 7
[0301] The abrasive article of any one of Embodiments 1 and 6,
wherein the first portion comprises a material having an average
relative magnetic permeability of not greater than 14.5 or not
greater than 14 or not greater than 13.5 or not greater than 13 or
not greater than 12.5 or not greater than 12 or not greater than
11.5 or not greater than 11 or not greater than 10.5 or not greater
than 10 or not greater than 9.5 or not greater than 9 or not
greater than 8.5 or not greater than 8 or not greater than 7.5 or
not greater than 7 or not greater than 6.5 or not greater than 6 or
not greater than 5.5 or not greater than 5 or not greater than 4.5
or not greater than 4 or not greater than 3.5 or not greater than 3
or not greater than 2.5 or not greater than 2 or not greater than
1.5 or not greater than 1.25.
Embodiment 8
[0302] The abrasive article of Embodiment 7, wherein the relative
magnetic permeability is at least 1 or at least 1.1 or at least 1.2
or at least 1.4 or at least 1.6 or at least 1.8 or at least 2 or at
least 2.2 or at least 2.5 or at least 2.8 or at least 3 or at least
3.2 or at least 3.5 or at least 3.8 or at least 4 or at least 4.2
or at least 4.5 or at least 4.8 or at least 5 or at least 5.2 or at
least 5.5 or at least 5.8 or at least 6 or at least 6.2 or at least
6.5 or at least 6.8 or at least 7 or at least 7.5 or at least 8 or
at least 8.5 or at least 9 or at least 9.5 or at least 10.
Embodiment 9
[0303] The abrasive article of any one of Embodiments 1, 6, and 7,
wherein the relative magnetic permeability is for a frequency of
electromagnetic radiation of at least 3 kHz or at least 5 kHz or at
least 10 kHz or at least 20 kHz or at least 30 kHz or at least 40
kHz or at least 50 kHz or at least 60 kHz or at least 70 kHz or at
least 80 kHz or at least 90 kHz or at least 100 kHz or at least 200
kHz or at least 300 kHz or at least 400 kHz or at least 500 kHz or
at least 600 kHz or at least 700 kHz or at least 800 kHz or at
least 900 kHz or at least 1 MHz or at least 2 MHz or at least 3 MHz
or at least 4 MHz or at least 5 MHz or at least 6 MHz or at least 7
MHz or at least 8 MHz or at least 9 MHz or at least 10 MHz or at
least 12 MHz.
Embodiment 10
[0304] The abrasive article of any one of Embodiments 1, 6, 7 and
9, wherein the relative magnetic permeability is for
electromagnetic radiation of a frequency of not greater than 3 GHz
or not greater than 2 GHz or not greater than 1 GHz or not greater
than 900 MHz or not greater than 500 MHz or not greater than 200
MHz or not greater than 150 MHz or not greater than 100 MHz or not
greater than 80 MHz or not greater than 60 MHz or not greater than
40 MHz or not greater than 30 MHz or not greater than 20 MHz.
Embodiment 11
[0305] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion comprises a material having a first
dielectric value of at least 1 or at least 1.1 or at least 1.2 or
at least 1.4 or at least 1.6 or at least 1.8 or at least 2 or at
least 2.2 or at least 2.5 or at least 2.8 or at least 3 or at least
3.2 or at least 3.5 or at least 3.8 or at least 4 or at least 4.2
or at least 4.5 or at least 4.8 or at least 5 or at least 5.2 or at
least 5.5 or at least 5.8 or at least 6 or at least 6.2 or at least
6.5 or at least 6.8 or at least 7 or at least 7.5 or at least 8 or
at least 8.5 or at least 9 or at least 9.5 or at least 10 or at
least 10.5 or at least 11 or at least 11.5 or at least 12 or at
least 12.5 or at least 13 or at least 13.5 or at least 14.
Embodiment 12
[0306] The abrasive article of Embodiment 11, wherein the material
comprises a dielectric value of not greater than 100 or not greater
than 70 or not greater than 50 or not greater than 40 or not
greater than 30 or not greater than 20 or not greater than 19 or
not greater than 18 or not greater than 17 or not greater than 16
or not greater than 15 or not greater than 14 or not greater than
13 or not greater than 12 or not greater than 11 or not greater
than 10 or not greater than 9 or not greater than 8 or not greater
than 7 or not greater than 6 or not greater than 5 or not greater
than 4 or not greater than 3.
Embodiment 13
[0307] The abrasive article of any one of Embodiments 11 and 12,
wherein the material consists essentially of a dielectric material
having a dielectric value within a range of at least 1 to not
greater than 20.
Embodiment 14
[0308] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion comprises a relative magnetic
permeability of not greater than 15 or not greater than 14.5 or not
greater than 14 or not greater than 13.5 or not greater than 13 or
not greater than 12.5 or not greater than 12 or not greater than
11.5 or not greater than 11 or not greater than 10.5 or not greater
than 10 or not greater than 9.5 or not greater than 9 or not
greater than 8.5 or not greater than 8 or not greater than 7.5 or
not greater than 7 or not greater than 6.5 or not greater than 6 or
not greater than 5.5 or not greater than 5 or not greater than 4.5
or not greater than 4 or not greater than 3.5 or not greater than 3
or not greater than 2.5 or not greater than 2 or not greater than
1.5 or not greater than 1.25.
Embodiment 15
[0309] The abrasive article of Embodiment 14, wherein the relative
magnetic permeability is at least 1 or at least 1.1 or at least 1.2
or at least 1.4 or at least 1.6 or at least 1.8 or at least 2 or at
least 2.2 or at least 2.5 or at least 2.8 or at least 3 or at least
3.2 or at least 3.5 or at least 3.8 or at least 4 or at least 4.2
or at least 4.5 or at least 4.8 or at least 5 or at least 5.2 or at
least 5.5 or at least 5.8 or at least 6 or at least 6.2 or at least
6.5 or at least 6.8 or at least 7 or at least 7.5 or at least 8 or
at least 8.5 or at least 9 or at least 9.5 or at least 10.
Embodiment 16
[0310] The abrasive article of Embodiment 14, wherein the relative
magnetic permeability is of electromagnetic radiation of a
frequency of at least 5 kHz or at least 10 kHz or at least 20 kHz
or at least 30 kHz or at least 40 kHz or at least 50 kHz or at
least 60 kHz or at least 70 kHz or at least 80 kHz or at least 90
kHz or at least 100 kHz or at least 200 kHz or at least 300 kHz or
at least 400 kHz or at least 500 kHz or at least 600 kHz or at
least 700 kHz or at least 800 kHz or at least 900 kHz or at least 1
MHz or at least 2 MHz or at least 3 MHz or at least 4 MHz or at
least 5 MHz or at least 6 MHz or at least 7 MHz or at least 8 MHz
or at least 9 MHz or at least 10 MHz or at least 12 MHz.
Embodiment 17
[0311] The abrasive article of Embodiment 16, wherein the relative
magnetic permeability is of electromagnetic radiation of a
frequency of not greater than 3 GHz or not greater than 2 GHz or
not greater than 1 GHz or not greater than 900 MHz or not greater
than 500 MHz or not greater than 200 MHz or not greater than 150
MHz or not greater than 100 MHz or not greater than 80 MHz or not
greater than 60 MHz or not greater than 40 MHz or not greater than
30 MHz or not greater than 20 MHz.
Embodiment 18
[0312] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion comprises a first dielectric value of
at least 1 or at least 1.1 or at least 1.2 or at least 1.4 or at
least 1.6 or at least 1.8 or at least 2 or at least 2.2 or at least
2.5 or at least 2.8 or at least 3 or at least 3.2 or at least 3.5
or at least 3.8 or at least 4 or at least 4.2 or at least 4.5 or at
least 4.8 or at least 5 or at least 5.2 or at least 5.5 or at least
5.8 or at least 6 or at least 6.2 or at least 6.5 or at least 6.8
or at least 7 or at least 7.5 or at least 8 or at least 8.5 or at
least 9 or at least 9.5 or at least 10 or at least 10.5 or at least
11 or at least 11.5 or at least 12 or at least 12.5 or at least 13
or at least 13.5 or at least 14.
Embodiment 19
[0313] The abrasive article of Embodiment 18, wherein the first
dielectric value is not greater than 100 or not greater than 70 or
not greater than 50 or not greater than 40 or not greater than 30
or not greater than 20 or not greater than 19 or not greater than
18 or not greater than 17 or not greater than 16 or not greater
than 15 or not greater than 14 or not greater than 13 or not
greater than 12 or not greater than 11 or not greater than 10 or
not greater than 9 or not greater than 8 or not greater than 7 or
not greater than 6 or not greater than 5 or not greater than 4 or
not greater than 3.
Embodiment 20
[0314] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the second portion comprises a second dielectric value of
at least 1 or at least 2 or at least 3 or at least 4 or at least
4.2 or at least 4.5 or at least 4.8 or at least 5 or at least 5.2
or at least 5.5 or at least 5.8 or at least 6 or at least 6.2 or at
least 6.5 or at least 6.8 or at least 7 or at least 7.5 or at least
8 or at least 8.5 or at least 9 or at least 9.5 or at least 10 or
at least 10.5 or at least 11 or at least 11.5 or at least 12 or at
least 12.5 or at least 13 or at least 13.5 or at least 14.
Embodiment 21
[0315] The abrasive article of Embodiment 20, wherein the second
portion comprises a second dielectric value of not greater than 100
or not greater than 70 or not greater than 50 or not greater than
40 or not greater than 30 or not greater than 20 or not greater
than 19 or not greater than 18 or not greater than 17 or not
greater than 16 or not greater than 15 or not greater than 14 or
not greater than 13 or not greater than 12 or not greater than 11
or not greater than 10 or not greater than 9 or not greater than 8
or not greater than 7 or not greater than 6 or not greater than 5
or not greater than 4 or not greater than 3.
Embodiment 22
[0316] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the second portion comprises a second relative magnetic
permeability of not greater than 15 or not greater than 14.5 or not
greater than 14 or not greater than 13.5 or not greater than 13 or
not greater than 12.5 or not greater than 12 or not greater than
11.5 or not greater than 11 or not greater than 10.5 or not greater
than 10 or not greater than 9.5 or not greater than 9 or not
greater than 8.5 or not greater than 8 or not greater than 7.5 or
not greater than 7 or not greater than 6.5 or not greater than 6 or
not greater than 5.5 or not greater than 5 or not greater than 4.5
or not greater than 4 or not greater than 3.5 or not greater than 3
or not greater than 2.5 or not greater than 2 or not greater than
1.5 or not greater than 1.25.
Embodiment 23
[0317] The abrasive article of Embodiment 22, wherein the second
portion comprises a second relative magnetic permeability of at
least 1 or at least 1.1 or at least 1.2 or at least 1.4 or at least
1.6 or at least 1.8 or at least 2 or at least 2.2 or at least 2.5
or at least 2.8 or at least 3 or at least 3.2 or at least 3.5 or at
least 3.8 or at least 4 or at least 4.2 or at least 4.5 or at least
4.8 or at least 5 or at least 5.2 or at least 5.5 or at least 5.8
or at least 6 or at least 6.2 or at least 6.5 or at least 6.8 or at
least 7 or at least 7.5 or at least 8 or at least 8.5 or at least 9
or at least 9.5 or at least 10.
Embodiment 24
[0318] The abrasive article of Embodiment 22, wherein the relative
magnetic permeability is of electromagnetic radiation of a
frequency of at least 5 kHz or at least 10 kHz or at least 20 kHz
or at least 30 kHz or at least 40 kHz or at least 50 kHz or at
least 60 kHz or at least 70 kHz or at least 80 kHz or at least 90
kHz or at least 100 kHz or at least 200 kHz or at least 300 kHz or
at least 400 kHz or at least 500 kHz or at least 600 kHz or at
least 700 kHz or at least 800 kHz or at least 900 kHz or at least 1
MHz or at least 2 MHz or at least 3 MHz or at least 4 MHz or at
least 5 MHz or at least 6 MHz or at least 7 MHz or at least 8 MHz
or at least 9 MHz or at least 10 MHz or at least 12 MHz.
Embodiment 25
[0319] The abrasive article of Embodiment 24, wherein the relative
magnetic permeability is of electromagnetic radiation of a
frequency of not greater than 300 GHz or not greater than 100 GHz
or not greater than 50 GHz or not greater than 10 GHz or not
greater than 3 GHz or not greater than 2 GHz or not greater than 1
GHz or not greater than 900 MHz or not greater than 500 MHz or not
greater than 200 MHz or not greater than 150 MHz or not greater
than 100 MHz or not greater than 80 MHz or not greater than 60 MHz
or not greater than 40 MHz or not greater than 30 MHz or not
greater than 20 MHz.
Embodiment 26
[0320] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion consists essentially of a dielectric
material having a dielectric value within a range of at least 1 to
not greater than 20.
Embodiment 27
[0321] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion consists essentially of a dielectric
material having a first relative magnetic permeability within a
range of at least 1 to not greater than 15.
Embodiment 28
[0322] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the second portion is free of a dielectric material.
Embodiment 29
[0323] The abrasive article of any one of Embodiments 1, 3, and 5,
further comprising a package containing the electronic device,
wherein the package comprises the first portion and the second
portion, wherein the first portion comprises a material having a
first average relative magnetic permeability and the second portion
comprises a material having a second average relative magnetic
permeability, and wherein the first average relative magnetic
permeability is different than the second average relative magnetic
permeability.
Embodiment 30
[0324] The abrasive article of any one of Embodiments 2 and 29,
wherein the first average relative magnetic permeability is greater
than the second average relative magnetic permeability.
Embodiment 31
[0325] The abrasive article of any one of Embodiments 2 and 29,
further comprising a magnetic permeability difference value
(.DELTA.MP=MP2/MP1) of at least 1.1, wherein MP1 is the first
average relative magnetic permeability and MP2 is the second
average relative magnetic permeability, or further wherein the
magnetic permeability difference value is at least 1.2 or at least
1.5 or at least 1.8 or at least 2 or at least 2.5 or at least 3 or
at least 3.5 or at least 4 or at least 4.5 or at least 5 or at
least 5.5 or at least 6 or at least 6.5 or at least 7 or at least 8
or at least 9 or at least 10 or at least 20 or at least 30 or at
least 40 or at least 50 or at least 60 or at least 70 or at least
80 or at least 90 or at least 95 or at least 99 or at least 100 or
at least 1000.
Embodiment 32
[0326] The abrasive article of any one of Embodiments 1, 2, 3, and
5, further comprising a package containing the electronic device,
wherein the package comprises the first portion and the second
portion, wherein the first portion comprises a first average
relative magnetic permeability and the second portion comprises a
second average relative magnetic permeability, and wherein the
first average relative magnetic permeability is different than the
second average relative magnetic permeability.
Embodiment 33
[0327] The abrasive article of Embodiment 32, wherein the first
average relative magnetic permeability is greater than the second
average relative magnetic permeability.
Embodiment 34
[0328] The abrasive article of Embodiment 32, further comprising a
magnetic permeability difference value (.DELTA.MP=MP2/MP1) of at
least 1.1, wherein MP1 is the first average relative magnetic
permeability and MP2 is the second average relative magnetic
permeability, or further wherein the magnetic permeability
difference value is at least 1.2 or at least 1.5 or at least 1.8 or
at least 2 or at least 2.5 or at least 3 or at least 3.5 or at
least 4 or at least 4.5 or at least 5 or at least 5.5 or at least 6
or at least 6.5 or at least 7 or at least 8 or at least 9 or at
least 10 or at least 20 or at least 30 or at least 40 or at least
50 or at least 60 or at least 70 or at least 80 or at least 90 or
at least 95 or at least 99 or at least 100 or at least 1000.
Embodiment 35
[0329] The abrasive article of any one of Embodiments 1, 2, and 5,
further comprising a package containing the electronic device,
wherein the package comprises the first portion and the second
portion, wherein the first portion comprises a material having a
first average dielectric value and the second portion comprises a
material having a second average dielectric value, and wherein the
first average dielectric value is different than the second average
dielectric value.
Embodiment 36
[0330] The abrasive article of any one of Embodiments 3 and 35,
wherein the first average dielectric value is less than the second
average dielectric value.
Embodiment 37
[0331] The abrasive article of any one of Embodiments 3 and 35,
further comprising a dielectric difference value
(.DELTA.DV=DV1/DV2) of at least 1.1, wherein DV1 is the first
average dielectric value and DV2 is the second average dielectric
value, or further wherein the dielectric difference value is at
least 1.2 or at least 1.5 or at least 1.8 or at least 2 or at least
2.5 or at least 3 or at least 3.5 or at least 4 or at least 4.5 or
at least 5 or at least 5.5 or at least 6 or at least 6.5 or at
least 7 or at least 8 or at least 9 or at least 10 or at least 20
or at least 30 or at least 40 or at least 50 or at least 60 or at
least 70 or at least 80 or at least 90 or at least 95 or at least
99 or at least 100 or at least 1000.
Embodiment 38
[0332] The abrasive article of any one of Embodiments 1, 2, 3, and
5, further comprising a package containing the electronic device,
wherein the package comprises the first portion and the second
portion, wherein the first portion comprises a first average
dielectric value and the second portion comprises a second average
dielectric value, and wherein the first average dielectric value is
different than the second average dielectric value.
Embodiment 39
[0333] The abrasive article of Embodiment 38, wherein the first
average dielectric value is less than the second average dielectric
value.
Embodiment 40
[0334] The abrasive article of Embodiment 38, further comprising a
dielectric difference value (.DELTA.DV=DV1/DV2) of at least 1.1,
wherein DV1 is the first average dielectric value and DV2 is the
second average dielectric value, or further wherein the dielectric
difference value is at least 1.2 or at least 1.5 or at least 1.8 or
at least 2 or at least 2.5 or at least 3 or at least 3.5 or at
least 4 or at least 4.5 or at least 5 or at least 5.5 or at least 6
or at least 6.5 or at least 7 or at least 8 or at least 9 or at
least 10 or at least 20 or at least 30 or at least 40 or at least
50 or at least 60 or at least 70 or at least 80 or at least 90 or
at least 95 or at least 99 or at least 100 or at least 1000.
Embodiment 41
[0335] The abrasive article of any one of Embodiments 1, 2, and 3,
wherein the electronic device is configured for wireless
communication and having a minimum effective communication range of
at least 0.05 meters.
Embodiment 42
[0336] The abrasive article of any one of Embodiments 4 and 41,
wherein the minimum effective communication range is at least at
least 0.2 meters or at least 0.25 meters or at least 0.3 meters or
at least 0.35 meters or at least 0.4 meters or at least 0.5 meters
or at least 0.6 meters or at least 0.8 meters or at least 1 meter
or at least 0.1 meters or at least 0.2 meters or at least 0.3
meters or at least 0.4 meters or at least 0.5 meters or at least
0.6 meters or at least 0.7 meters or at least 0.8 meters or at
least 0.9 meters or at least 1 meter or at least 1.2 meters or at
least 1.4 meters or at least 1.6 meters or at least 1.8 meters or
at least 2 meters or at least 2.2 meters or at least 2.4 meters or
at least 2.6 meters or at least 2.8 meters or at least 3 meters or
at least 3.2 meters or at least 3.4 meters or at least 3.6 meters
or at least 3.8 meters or at least 4 meters or at least 5 meters or
at least 6 meters or at least 7 meters or at least 8 meters or at
least 9 meters or at least 10 meters.
Embodiment 43
[0337] The abrasive article of Embodiment 42, wherein the minimum
effective communication range is not greater than 100 meters or not
greater than 75 meters or not greater than 50 meters or not greater
than 25 meters or not greater than 20 meters or not greater than 15
meters or not greater than 12 meters or not greater than 10
meters.
Embodiment 44
[0338] The abrasive article of any one of Embodiments 1, 2, and 3,
wherein at least one of the body and the electronic assembly
comprise metal.
Embodiment 45
[0339] The abrasive article of any one of Embodiments 1, 2, 3, and
4 wherein the electronic device comprises a minimum data
transmission rate of at least 4 kbps or at least 8 kbps or at least
10 kbps or at least 15 kbps or at least 20 kbps or at least 40 kbps
or at least 60 kbps or at least 80 kbps or at least 100 kbps or at
least 150 kbps or at least 200 kbps or at least 250 kbps or at
least 300 kbps or at least 400 kbps or at least 500 kbps or at
least 600 kbps.
Embodiment 46
[0340] The abrasive article of Embodiment 45, wherein the maximum
data transmission rate is not greater than 800 kbps or not greater
than 700 kbps or not greater than 600 kbps or not greater than 500
kbps.
Embodiment 47
[0341] The abrasive article of any one of Embodiments 1, 2, 3, and
4 wherein the electronic device comprises a maximum loss of not
greater than 50 dB over a range of frequencies of at least 3 kHz to
not greater than 300 GHz.
Embodiment 48
[0342] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is in direct contact with at least one
logic device.
Embodiment 49
[0343] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is disposed between the body and the
electronic assembly and is in direct contact with the body.
Embodiment 50
[0344] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is a multilayered article including a
first layer and a second layer, and wherein the first layer
comprises a material having an average relative magnetic
permeability of not greater than 15.
Embodiment 51
[0345] The abrasive article of Embodiment 50, wherein the first
layer is disposed between the second layer and the electronic
device.
Embodiment 52
[0346] The abrasive article of Embodiment 50, wherein the second
layer is disposed between the first layer and the electronic
device.
Embodiment 53
[0347] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is a monolithic construction.
Embodiment 54
[0348] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the second portion is overlying the first portion.
Embodiment 55
[0349] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the electronic device is disposed between the first portion
and the second portion.
Embodiment 56
[0350] The abrasive article of anyone of Embodiments 2, 3, and 5,
wherein the electronic device is surrounded by the first portion
and the second portion.
Embodiment 57
[0351] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the electronic assembly is disposed between the first
portion and the second portion.
Embodiment 58
[0352] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the electronic assembly is surrounded by the first portion
and the second portion.
Embodiment 59
[0353] The abrasive article of any one of Embodiments 1, 2, 3, and
4, wherein the electronic device includes a device selected from
the group of an electronic tag, electronic memory, a sensor, an
analog-to-digital converter, a transmitter, a receiver, a
transceiver, a modulator circuit, a multiplexer, an antenna, a
near-field communication device, a power source a display, an
optical device, a global positioning system, a data transponder, a
secure data storage device, a secure logic device, or any
combination thereof.
Embodiment 60
[0354] The abrasive article of Embodiment 59, wherein the
electronic device includes a wireless communication device
including a logic element and an antenna.
Embodiment 61
[0355] The abrasive article of Embodiment 59, wherein the
electronic device comprises at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 62
[0356] The abrasive article of Embodiment 61, wherein the sensor is
selected from the group of an acoustic sensor, force sensor,
vibration sensor, temperature sensor, moisture sensor, pressure
sensor, gas sensor, or any combination thereof.
Embodiment 63
[0357] The abrasive article of Embodiment 59, wherein the
electronic device is configured to communicate with a mobile
device.
Embodiment 64
[0358] The abrasive article of Embodiment 59, wherein the
electronic device includes at least one of a read-only device, a
read-write device, or any combination thereof.
Embodiment 65
[0359] The abrasive article of Embodiment 59, wherein the
electronic device includes manufacturing information selected from
the group of processing information, manufacturing date, shipment
information, product identification information or any combination
thereof.
Embodiment 66
[0360] The abrasive article of Embodiment 59, wherein the
electronic devices includes customer information selected from the
group of customer registration information, product identification
information, product cost information, manufacturing date, shipment
date, environmental information, use information, or any
combination thereof.
Embodiment 67
[0361] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is underlying at least 10% of a
footprint surface area of the electronic device, or at least 20% or
at least 30% or at least 40% or at least 50% or at least 60% or at
least 70% or at least 80% or at least 90% or at least 100%.
Embodiment 68
[0362] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is partially enveloping at least a
portion of the electronic device, such that a bottom surface of the
portion of the electronic device is below an upper surface of the
first portion as viewed in cross-section.
Embodiment 69
[0363] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion defines a cavity and at least a
portion of the electronic device is disposed in the cavity.
Embodiment 70
[0364] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is surrounding at least 10% of the
total surface area of the electronic device as viewed in
cross-section, or at least 20% or at least 30% or at least 40% or
at least 50% or at least 60% or at least 70% or at least 80% or at
least 90%.
Embodiment 71
[0365] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the first portion and second portion are part of a package
containing at least a portion of the electronic device, and wherein
the second portion defines a RF window in the package.
Embodiment 72
[0366] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the first portion comprises a material having an average RF
reflectance of at least 50% for electromagnetic radiation having a
frequency between 3 kHz and 300 GHz.
Embodiment 73
[0367] The abrasive article Embodiment 72, wherein the first
average RF reflectance is at least 51% for a range of 3 kHz and 300
GHz or at least 52% or at least 53% or at least 54% or at least 55%
or at least 56% or at least 57% or at least 58% or at least 59% or
at least 60% or at least 61% or at least 62% or at least 63% or at
least 64% or at least 65% or at least 66% or at least 67% or at
least 68% or at least 69% or at least 70% or at least 71% or at
least 72% or at least 73% or at least 74% or at least 75% or at
least 76% or at least 77% or at least 78% or at least 79% or at
least 80% or at least 81% or at least 82% or at least 83% or at
least 84% or at least 85% or at least 86% or at least 87% or at
least 88% or at least 89% or at least 90% or at least 91% or at
least 92% or at least 93% or at least 94% or at least 95% or at
least 96% or at least 97% or at least 98% or at least 99%.
Embodiment 74
[0368] The abrasive article of Embodiment 72, wherein the second
portion has a second average RF reflectance that is different than
the first average RF reflectance.
Embodiment 75
[0369] The abrasive article of Embodiment 74, wherein the second
portion has a second average RF reflectance that is less than the
first average RF reflectance.
Embodiment 76
[0370] The abrasive article Embodiment 72, further comprising a
reflection difference value (.DELTA.RFR=RFR1/RFR2) of at least 1.1,
wherein RFR1 is the first average RF reflectance and RFR2 is the
second average RF reflectance, or further wherein the reflection
difference value is at least 1.2 or at least 1.5 or at least 1.8 or
at least 2 or at least 2.5 or at least 3 or at least 3.5 or at
least 4 or at least 4.5 or at least 5 or at least 5.5 or at least 6
or at least 6.5 or at least 7 or at least 8 or at least 9 or at
least 10 or at least 20 or at least 30 or at least 40 or at least
50 or at least 60 or at least 70 or at least 80 or at least 90 or
at least 95 or at least 99 or at least 100.
Embodiment 77
[0371] The abrasive article of any one of Embodiments 2, 3, and 5,
further comprising a package comprising the first portion and the
second portion, wherein the first portion has a first average RF
transmittance and the second portion has a second average RF
transmittance, and wherein the first average RF transmittance is
different than the second average RF transmittance.
Embodiment 78
[0372] The abrasive article of Embodiment 77, wherein the first
average RF transmittance is less than the second average RF
transmittance.
Embodiment 79
[0373] The abrasive article of Embodiment 77, further comprising a
transmittance difference value (.DELTA.RFT=RFT2/RFT1) of at least
1.1, wherein RFT1 is the first average RF transmittance and RFT2 is
the second average RF transmittance, or further wherein the
transmittance difference value is at least 1.2 or at least 1.5 or
at least 1.8 or at least 2 or at least 2.5 or at least 3 or at
least 3.5 or at least 4 or at least 4.5 or at least 5 or at least
5.5 or at least 6 or at least 6.5 or at least 7 or at least 8 or at
least 9 or at least 10 or at least 20 or at least 30 or at least 40
or at least 50 or at least 60 or at least 70 or at least 80 or at
least 90 or at least 95 or at least 99 or at least 100.
Embodiment 80
[0374] The abrasive article of Embodiment 77, wherein the first
portion and the second portion envelop at least a portion of the
electronic device, and wherein the second portion defines a window
in the package having a greater RF transmittance as compared to the
RF transmittance of the first portion.
Embodiment 81
[0375] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the electronic device includes a communication device,
and the first portion is disposed between and electrically
insulting the communication device from the body.
Embodiment 82
[0376] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the electronic device includes at least one antenna and
the first portion is disposed between and electrically insulting
the antenna from the body.
Embodiment 83
[0377] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the first portion is part of a package of the electronic
assembly, and the first portion defines at least 10 vol % of a
total volume of the package or at least 20 vol % or at least 30 vol
% or at least 40 vol % or at least 50 vol % or at least 60 vol % or
at least 70 vol % or at least 80 vol % or at least 90 vol % or at
least 100 vol %.
Embodiment 84
[0378] The abrasive article of Embodiment 83, wherein the first
portion defines not greater than 90% of the total volume of the
package or not greater than 80% or not greater than 70% or not
greater than 60% or not greater than 50%.
Embodiment 85
[0379] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the first portion and second portion are part of a package
of the electronic assembly and the first portion defines a greater
volume as compared to the second portion.
Embodiment 86
[0380] The abrasive article of anyone of Embodiments 2, 3, and 5,
wherein the first portion and second portion are part of a package
of the electronic assembly and the first portion defines a lesser
volume as compared to the second portion.
Embodiment 87
[0381] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the first portion comprises a first average thickness and
the second portion comprises a second average thickness, and
wherein the first average thickness is different than the second
average thickness.
Embodiment 88
[0382] The abrasive article of Embodiment 87, wherein the first
average thickness is greater than the second average thickness.
Embodiment 89
[0383] The abrasive article of Embodiment 87, wherein the first
average thickness is less than the second average thickness.
Embodiment 90
[0384] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the first portion comprises a first average thickness and
the second portion comprises a second average thickness, and
wherein the first average thickness is the same as the second
average thickness.
Embodiment 91
[0385] The abrasive article of anyone of Embodiments 2, 3, and 5,
wherein the first portion comprise a first average thickness of at
least 0.1 mm or at least 0.2 mm or at least 0.3 mm or at least 0.4
mm or at least 0.5 mm or at least 0.6 mm or at least 0.7 mm or at
least 0.8 mm or at least 0.9 mm or at least 1 mm or at least 1.2 mm
or at least 1.5 mm or at least 1.8 mm or at least 2 mm or at least
2.5 mm or at least 3 mm or at least 3.5 mm or at least 4 mm or at
least 4.5 mm or at least 5 mm.
Embodiment 92
[0386] The abrasive article of Embodiment 91, wherein the first
average thickness is not greater than 10 mm or not greater than 9
mm or not greater than 8 mm or not greater than 7 mm or not greater
than 6 mm or not greater than 5 mm or not greater than 4 mm or not
greater than 3 mm or not greater than 2 mm.
Embodiment 93
[0387] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the second portion comprises an second average thickness of
at least 0.1 mm or at least 0.2 mm or at least 0.3 mm or at least
0.4 mm or at least 0.5 mm or at least 0.6 mm or at least 0.7 mm or
at least 0.8 mm or at least 0.9 mm or at least 1 mm or at least 1.2
mm or at least 1.5 mm or at least 1.8 mm or at least 2 mm or at
least 2.5 mm or at least 3 mm or at least 3.5 mm or at least 4 mm
or at least 4.5 mm or at least 5 mm.
Embodiment 94
[0388] The abrasive article of Embodiment 93, wherein the second
average thickness is not greater than 10 mm or not greater than 9
mm or not greater than 8 mm or not greater than 7 mm or not greater
than 6 mm or not greater than 5 mm or not greater than 4 mm or not
greater than 3 mm or not greater than 2 mm.
Embodiment 95
[0389] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the first portion comprises a material selected from the
group of inorganic materials, ceramics, glass, organic materials,
or any combination thereof.
Embodiment 96
[0390] The abrasive article of Embodiment 95, wherein the material
comprises a material selected from the group of fluoropolymers,
polyester, polyimide, polyamide thermoplastics, thermosets, rubber,
or any combination thereof.
Embodiment 97
[0391] The abrasive article of Embodiment 96, wherein the material
comprises at least one of polyimide, polyethylene terephthalate,
polytetrafluoroethylene.
Embodiment 98
[0392] The abrasive article of Embodiment 96, wherein the material
consists of one of polyimide, polyethylene terephthalate, and
polytetrafluoroethylene.
Embodiment 99
[0393] The abrasive article of Embodiment 96, wherein the first
portion consists of one of polyimide, polyethylene terephthalate,
and polytetrafluoroethylene.
Embodiment 100
[0394] The abrasive article of any one of Embodiments 2, 3, and 5,
wherein the second portion comprises a material selected from the
group of inorganic materials, ceramics, glass, organic materials,
or any combination thereof. [
Embodiment 101
[0395] The abrasive article of Embodiment 100, wherein the material
comprises a material selected from the group of fluoropolymers,
polyester, polyimide, thermoplastics, thermosets, or any
combination thereof.
Embodiment 102
[0396] The abrasive article of Embodiment 100, wherein the material
comprises at least one of thermoplastic polymers.
Embodiment 103
[0397] The abrasive article of Embodiment 100, wherein the material
consists of one of thermoset polymers.
Embodiment 104
[0398] The abrasive article of Embodiment 100, wherein the material
comprises PDMS, PEN, polyimide, PEEK or any combination
thereof.
Embodiment 105
[0399] The abrasive article of any one of Embodiments 1, 2, 3, and
5, wherein the body comprises an abrasive portion and a
non-abrasive portion, and wherein the first portion is coupled to
an abrasive portion.
Embodiment 106
[0400] The abrasive article of Embodiment 105, wherein the first
portion is in direct contact with the abrasive portion comprising
abrasive particles and a bond material.
Embodiment 107
[0401] The abrasive article of Embodiment 105, wherein the first
portion is directly coupled to an abrasive surface of the abrasive
portion, the abrasive surface comprising abrasive particles and a
bond material.
Embodiment 108
[0402] The abrasive article of Embodiment 105, wherein the abrasive
portion comprises a metal.
Embodiment 109
[0403] The abrasive article of Embodiment 108, wherein the abrasive
portion comprises a metal bond material.
Embodiment 110
[0404] The abrasive article of Embodiment 108, wherein the metal is
a metal or metal alloy including at least one transition metal
element.
Embodiment 111
[0405] The abrasive article of Embodiment 108, wherein the metal
includes at least one of iron, copper, nickel, silver, aluminum,
cobalt, or any combination thereof.
Embodiment 112
[0406] The abrasive article of Embodiment 108, wherein the metal
comprises a conductivity of at least 10.times.103 Siemens/meter at
25.degree. C. or at least 12.times.103 Siemens/meter at 25.degree.
C. or at least 15.times.103 Siemens/meter at 25.degree. C. or at
least 20.times.103 Siemens/meter at 25.degree. C. or at least
30.times.103 Siemens/meter at 25.degree. C. or at least
50.times.103 Siemens/meter at 25.degree. C. or at least
100.times.103 Siemens/meter at 25.degree. C. or at least
500.times.103 Siemens/meter at 25.degree. C. or at least
1000.times.103 Siemens/meter at 25.degree. C.
Embodiment 113
[0407] The abrasive article of Embodiment 108, wherein the metal
comprises a RF attenuation value of at least 40 dB or at least 50
dB or at least 60 dB or at least 70 dB or at least 80 dB or at
least 90 dB or at least 100 dB.
Embodiment 114
[0408] The abrasive article of Embodiment 105, wherein the first
portion is at least partially embedded in the abrasive portion,
wherein a bottom surface of the first portion is below an abrasive
surface of the abrasive portion.
Embodiment 115
[0409] The abrasive article of Embodiment 105, wherein the entirety
of the first portion is embedded in the abrasive portion, wherein
an upper surface of the first portion is below an abrasive surface
of the abrasive portion.
Embodiment 116
[0410] The abrasive article of any one of Embodiments 114 and 115,
wherein at least a portion of the electronic assembly extends above
the abrasive surface.
Embodiment 117
[0411] The abrasive article of any one of Embodiments 114 and 115,
wherein at least a portion of the second portion extends above the
abrasive surface.
Embodiment 118
[0412] The abrasive article of Embodiment 105, wherein the
electronic assembly is at least partially embedded in the abrasive
portion, wherein a bottom surface of the electronic assembly is
below an abrasive surface of the abrasive portion.
Embodiment 119
[0413] The abrasive article of Embodiment 105, wherein the entirety
of the electronic assembly is embedded in the abrasive portion.
Embodiment 120
[0414] The abrasive article of Embodiment 105, wherein the first
portion and second portion are embedded in the abrasive portion,
wherein the upper surface of the second portion is below an
abrasive surface of the abrasive portion.
Embodiment 121
[0415] The abrasive article of Embodiment 105, wherein the first
portion is in direct contact with the non-abrasive portion, the
non-abrasive portion being free of abrasive particles.
Embodiment 122
[0416] The abrasive article of Embodiment 121, wherein the
non-abrasive portion comprises only bond material.
Embodiment 123
[0417] The abrasive article of Embodiment 121, wherein the
non-abrasive portion is free of abrasive particles and bond
material.
Embodiment 124
[0418] The abrasive article of Embodiment 121, wherein the
non-abrasive portion includes a hub coupled to the abrasive
portion, wherein the hub is configured to facilitate mounting of
the body to a tool.
Embodiment 125
[0419] The abrasive article of Embodiment 121, wherein the
non-abrasive portion comprises a metal.
Embodiment 126
[0420] The abrasive article of Embodiment 125, wherein the
non-abrasive portion consists essentially of metal.
Embodiment 127
[0421] The abrasive article of Embodiment 125, wherein the metal is
a metal or metal alloy including a transition metal element,
aluminum or any combination thereof.
Embodiment 128
[0422] The abrasive article of Embodiment 125, wherein the metal is
selected from the group consisting of iron, copper, nickel, silver,
aluminum, cobalt, or any combination thereof.
Embodiment 129
[0423] The abrasive article of Embodiment 125, wherein the metal
comprises a conductivity of at least 10.times.103 Siemens/meter at
25.degree. C. or at least 12.times.103 Siemens/meter at 25.degree.
C. or at least 15.times.103 Siemens/meter at 25.degree. C. or at
least 20.times.103 Siemens/meter at 25.degree. C. or at least
30.times.103 Siemens/meter at 25.degree. C. or at least
50.times.103 Siemens/meter at 25.degree. C. or at least
100.times.103 Siemens/meter at 25.degree. C. or at least
500.times.103 Siemens/meter at 25.degree. C. or at least
1000.times.103 Siemens/meter at 25.degree. C.
Embodiment 130
[0424] The abrasive article of Embodiment 125, wherein the metal
comprises a RF attenuation value of at least 40 dB or at least 50
dB or at least 60 dB or at least 70 dB or at least 80 dB or at
least 90 dB or at least 100 dB.
Embodiment 131
[0425] The abrasive article of Embodiment 121, wherein the first
portion is directly coupled to the non-abrasive surface of the
non-abrasive portion.
Embodiment 132
[0426] The abrasive article of Embodiment 121, wherein the first
portion is at least partially embedded in the non-abrasive portion,
wherein a bottom surface of the first portion is below a
non-abrasive surface of the non-abrasive portion.
Embodiment 133
[0427] The abrasive article of Embodiment 121, wherein the entirety
of the first portion is embedded in the non-abrasive portion,
wherein an upper surface of the first portion is at or below a
non-abrasive surface of the non-abrasive portion.
Embodiment 134
[0428] The abrasive article of any one of Embodiments 132 and 133,
wherein at least a portion of the electronic assembly extends above
the non-abrasive surface.
Embodiment 135
[0429] The abrasive article of any one of Embodiments 132 and 133,
wherein at least a portion of the second portion extends above the
non-abrasive surface.
Embodiment 136
[0430] The abrasive article of Embodiment 121, wherein the
electronic assembly is at least partially embedded in the
non-abrasive portion, wherein a bottom surface of the electronic
assembly is below a non-abrasive surface of the non-abrasive
portion.
Embodiment 137
[0431] The abrasive article of Embodiment 121, wherein the entirety
of the electronic assembly is embedded in the non-abrasive
portion.
Embodiment 138
[0432] The abrasive article of Embodiment 121, wherein the first
portion and second portion are embedded in the non-abrasive
portion, wherein the upper surface of the second portion is below a
non-abrasive surface of the non-abrasive portion.
Embodiment 139
[0433] The abrasive article of any one of Embodiments 1, 2, 3, and
4, wherein the electronic device comprises at least one of a
vertically polarized antenna, booster antenna, 3D polarized
antenna, or any combination thereof.
Embodiment 140
[0434] The abrasive article of any one of Embodiments 1, 2, 3, and
4, further comprising a tool system coupled to the abrasive
article, wherein the tool system includes a housing at least
partially enclosing the body.
Embodiment 141
[0435] The abrasive article of any one of Embodiments 1, 2, 3, and
4, wherein the electronic assembly is releasably secured to the
body by one or more securing assemblies configured to facilitate
selective removal of the electronic assembly via at least one
secure keying element.
Embodiment 142
[0436] The abrasive article of any one of Embodiments 1, 2, 3, and
4, wherein the body comprises a window and the electronic assembly
is disposed in the window.
Embodiment 143
[0437] The abrasive article of any one of Embodiments 1, 2, 3, and
4, further comprising a plurality of electronic devices including a
first electronic device and a second electronic device, wherein the
first electronic device is disposed at a first position on the body
and the second electronic device is disposed at a second position
on the body, wherein the first position is different from the
second position.
Embodiment 144
[0438] An abrasive article comprising: a body; and an electronic
assembly coupled to the body, wherein the electronic assembly is
releasably secured to the body by one or more securing assemblies
configured to facilitate selective removal of the electronic
assembly from the body.
Embodiment 145
[0439] The abrasive article of Embodiment 144, wherein the securing
assembly comprises a complementary engagement structure including
at least one engagement element coupled to the electronic assembly
and configured for complementary engagement with at least one
receiving element.
Embodiment 146
[0440] The abrasive article of Embodiment 145, wherein the
complementary engagement structure includes an engaged position and
a disengaged position, wherein in the engaged position the at least
one engagement element is engaged with the at least one receiving
element.
Embodiment 147
[0441] The abrasive article of Embodiment 146, wherein in the
engaged position the electronic assembly is in a secured position
in the body.
Embodiment 148
[0442] The abrasive article of Embodiment 146, wherein in the
disengaged position the at least one engagement element is
disengaged from the at least one receiving element.
Embodiment 149
[0443] The abrasive article of Embodiment 148, wherein in the
disengaged position the electronic assembly is in a non-secured
position in the body and is configured for release and separation
from the body.
Embodiment 150
[0444] The abrasive article of Embodiment 144, wherein the securing
assembly includes at least one secure keying element.
Embodiment 151
[0445] The abrasive article of Embodiment 144, wherein the securing
assembly comprises at least one biometric security system.
Embodiment 152
[0446] The abrasive article of Embodiment 144, wherein in an
engaged position the electronic assembly is in a secured position
in the body.
Embodiment 153
[0447] The abrasive article of Embodiment 144, wherein the securing
assembly includes at least one coupling connection between at least
a portion of the body and at least a portion of the electronic
assembly.
Embodiment 154
[0448] The abrasive article of Embodiment 153, wherein the coupling
connection is between a coupling element of the body and a coupling
element on a package of the electronic assembly.
Embodiment 155
[0449] The abrasive article of Embodiment 144, wherein the securing
assembly comprises at least one fastener extending between at least
a portion of the electronic assembly and a portion of the body.
Embodiment 156
[0450] The abrasive article of Embodiment 144, wherein the securing
assembly includes a press-fit coupling between at least a portion
of the body and at least a portion of the electronic assembly.
Embodiment 157
[0451] The abrasive article of Embodiment 156, wherein the
press-fit coupling includes a cavity in a portion of the body.
Embodiment 158
[0452] The abrasive article of Embodiment 157, wherein at least a
portion of the electronic assembly is press-fit in the cavity.
Embodiment 159
[0453] The abrasive article of Embodiment 157, wherein the cavity
is defined by a cavity wall, and wherein the cavity wall includes
at least one of: a material having an average relative magnetic
permeability of not greater than 15; a material having an average
dielectric value of not greater than 20; a material having an
average RF reflectance of at least 50% for a range of 3 kHz and 300
GHz; or any combination thereof.
Embodiment 160
[0454] The abrasive article of Embodiment 157, wherein the cavity
defines a window in the body for containing the electronic
assembly, wherein the cavity extends through an entire length,
width, or thickness of the body.
Embodiment 161
[0455] The abrasive article of Embodiment 144, wherein the securing
assembly is on an abrasive portion of the body, wherein the
abrasive portion includes abrasive particles.
Embodiment 162
[0456] The abrasive article of Embodiment 144, wherein the securing
assembly is at least partially embedded in an abrasive portion of
the body, wherein the abrasive portion includes abrasive
particles.
Embodiment 163
[0457] The abrasive article of Embodiment 144, wherein the securing
assembly is completely embedded in an abrasive portion of the body,
wherein the abrasive portion includes abrasive particles.
Embodiment 164
[0458] The abrasive article of Embodiment 144, wherein the securing
assembly is contained on a non-abrasive portion of the body,
wherein the non-abrasive portion is free of abrasive particles.
Embodiment 165
[0459] The abrasive article of Embodiment 144, wherein the securing
assembly is at least partially embedded in a non-abrasive portion
of the body, wherein the non-abrasive portion is free of abrasive
particles.
Embodiment 166
[0460] The abrasive article of Embodiment 144, wherein the securing
assembly is completely embedded in a non-abrasive portion of the
body, wherein the non-abrasive portion is free of abrasive
particles.
Embodiment 167
[0461] The abrasive article of Embodiment 144, the electronic
assembly includes an electronic device from the group of an
electronic tag, electronic memory, a sensor, an analog-to-digital
converter, a transmitter, a receiver, a transceiver, a modulator
circuit, a multiplexer, an antenna, a near-field communication
device, a power source a display, an optical device, a global
positioning system, a data transponder, a secure data storage
device, a secure logic device, or any combination thereof.
Embodiment 168
[0462] The abrasive article of Embodiment 167, wherein the
electronic device includes a wireless communication device
including a logic element and an antenna.
Embodiment 169
[0463] The abrasive article of Embodiment 167, wherein the
electronic device comprises at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 170
[0464] The abrasive article of Embodiment 169, wherein the sensor
is selected from the group of an acoustic sensor, force sensor,
vibration sensor, temperature sensor, moisture sensor, pressure
sensor, gas sensor, or any combination thereof.
Embodiment 171
[0465] An abrasive article comprising: a body; and an electronic
assembly coupled to the body in a window of the body, wherein the
window extends through at least a portion of the body.
Embodiment 172
[0466] The abrasive article of Embodiment 171, wherein the window
in disposed in an abrasive portion of the body comprising abrasive
particles.
Embodiment 173
[0467] The abrasive article of Embodiment 171, wherein the window
intersects an abrasive surface of an abrasive portion of the
body.
Embodiment 174
[0468] The abrasive article of Embodiment 171, wherein the window
is disposed in a non-abrasive portion, the non-abrasive portion
being free of abrasive particles.
Embodiment 175
[0469] The abrasive article of Embodiment 171, wherein the window
extends through an entire thickness of the body.
Embodiment 176
[0470] The abrasive article of Embodiment 171, wherein the window
is selectively removable from the body.
Embodiment 177
[0471] The abrasive article of Embodiment 171, wherein the window
is releasably coupled to the body via at least one coupling
mechanism from the group of a keyed assembly, a complementary
engagement structure, a threaded connection, a fastener, a snap-fit
element, a clip, an adhesive, a tapered-fit connection, or any
combination thereof.
Embodiment 178
[0472] The abrasive article of Embodiment 171, wherein the window
and the electronic assembly are a monolithic construction, wherein
the electronic assembly is permanently secured in the body of the
window.
Embodiment 179
[0473] The abrasive article of Embodiment 171, wherein the window
and the electronic assembly a modular construction, wherein the
electronic assembly is releasably coupled within the body of the
window.
Embodiment 180
[0474] The abrasive article of Embodiment 171, wherein the window
comprises one or more elements configured to control the direction
of the electromagnetic radiation emitted from the electronic
assembly.
Embodiment 181
[0475] The abrasive article of Embodiment 180, wherein the window
comprises at least one of a grating as a coating, a grating as
surface features, or any combination thereof.
Embodiment 182
[0476] The abrasive article of Embodiment 171, wherein the window
has a greater RF transmittance as compared to the body.
Embodiment 183
[0477] The abrasive article of Embodiment 171, wherein the window
comprises an organic material.
Embodiment 184
[0478] The abrasive article of Embodiment 171, wherein the window
comprises at least one of biopolymer, conductive polymer,
copolymer, fluoropolymer, polyterpene, phenolic resin,
polyanhydrides, polyketone, polyester, polyolefin, rubber,
silicone, silicone rubber, vinyl polymer or any combination
thereof.
Embodiment 185
[0479] The abrasive article of Embodiment 171, wherein the
electronic assembly includes an electronic device from the group of
an electronic tag, electronic memory, a sensor, an
analog-to-digital converter, a transmitter, a receiver, a
transceiver, a modulator circuit, a multiplexer, an antenna, a
near-field communication device, a power source a display, an
optical device, a global positioning system, a data transponder, a
secure data storage device, a secure logic device, or any
combination thereof.
Embodiment 186
[0480] The abrasive article of Embodiment 171, wherein the
electronic device includes a wireless communication device
including a logic element and an antenna.
Embodiment 187
[0481] The abrasive article of Embodiment 171, wherein the
electronic device comprises at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 188
[0482] The abrasive article of Embodiment 187, wherein the sensor
is selected from the group of an acoustic sensor, force sensor,
vibration sensor, temperature sensor, moisture sensor, pressure
sensor, gas sensor, or any combination thereof.
Embodiment 189
[0483] An abrasive system comprising: a housing comprising metal; a
body contained within the housing; and an electronic assembly
coupled to the body, the electronic assembly comprising: an
electronic device configured for wireless communication and having
a minimum effective communication range of at least 0.1 meters.
Embodiment 190
[0484] The abrasive system of Embodiment 189, wherein the housing
comprises a transition metal element.
Embodiment 191
[0485] The abrasive system of Embodiment 190, wherein the metal
includes at least one of iron, copper, nickel, silver, aluminum,
cobalt, or any combination thereof.
Embodiment 192
[0486] The abrasive system of Embodiment 189, wherein the housing
is at least partially surrounding a portion of the body.
Embodiment 193
[0487] The abrasive system of Embodiment 189, wherein the housing
is at least partially surrounding a portion of the body and the
electronic assembly.
Embodiment 194
[0488] The abrasive system of Embodiment 189, wherein the housing
defines a receiving space, and at least a portion of the body is
contained in the receiving space.
Embodiment 195
[0489] The abrasive system of Embodiment 189, wherein the housing
completely surrounds the body and the electronic assembly.
Embodiment 196
[0490] The abrasive system of Embodiment 189, wherein the housing
comprises an electronic device.
Embodiment 197
[0491] The abrasive system of Embodiment 196, wherein the
electronic device of the housing is configured to communicate
wirelessly with the electronic device of the electronic
assembly.
Embodiment 198
[0492] The abrasive system of Embodiment 189, wherein the housing
comprises a booster antenna configured to receive and transmit one
or more signals from the electronic device of the electronic
assembly.
Embodiment 199
[0493] The abrasive system of Embodiment 189, wherein the housing
comprises an electronic device from the group of an electronic tag,
electronic memory, a sensor, an analog-to-digital converter, a
transmitter, a receiver, a transceiver, a modulator circuit, a
multiplexer, an antenna, a near-field communication device, a power
source a display, an optical device, a global positioning system, a
data transponder, a secure data storage device, a secure logic
device, or any combination thereof.
Embodiment 200
[0494] The abrasive system of Embodiment 199, wherein the
electronic device includes a wireless communication device
including a logic element and an antenna.
Embodiment 201
[0495] The abrasive system of Embodiment 199, wherein the
electronic device comprises at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 202
[0496] The abrasive system of Embodiment 201, wherein the sensor is
selected from the group of an acoustic sensor, force sensor,
vibration sensor, temperature sensor, moisture sensor, pressure
sensor, gas sensor, or any combination thereof.
Embodiment 203
[0497] The abrasive system of Embodiment 189, wherein the system
comprises a minimum effective communication range of at least at
least 0.2 meters or at least 0.25 meters or at least 0.3 meters or
at least 0.35 meters or at least 0.4 meters or at least 0.5 meters
or at least 0.6 meters or at least 0.8 meters or or at least 1
meter or at least 1.2 meters or at least 1.4 meters or at least 1.6
meters or at least 1.8 meters or at least 2 meters or at least 2.2
meters or at least 2.4 meters or at least 2.6 meters or at least
2.8 meters or at least 3 meters or at least 3.2 meters or at least
3.4 meters or at least 3.6 meters or at least 3.8 meters or at
least 4 meters or at least 5 meters or at least 6 meters or at
least 7 meters or at least 8 meters or at least 9 meters or at
least 10 meters.
Embodiment 204
[0498] The abrasive system of Embodiment 189, wherein the system
comprises a minimum data transmission rate of at least 4 kbps or at
least 8 kbps or at least 10 kbps or at least 15 kbps or at least 20
kbps or at least 40 kbps or at least 60 kbps or at least 80 kbps or
at least 100 kbps or at least 150 kbps or at least 200 kbps or at
least 250 kbps or at least 300 kbps or at least 400 kbps or at
least 500 kbps or at least 600 kbps.
Embodiment 205
[0499] The abrasive system of Embodiment 189, wherein the system
comprises a maximum loss of not more than 50 dB over a range of
frequencies of at least 3 kHz to not greater than 300 GHz.
Embodiment 206
[0500] The abrasive system of any one of Embodiments 203, 204, and
205, wherein: the electronic device of the electronic assembly
includes a wireless communication data transponder; and a wireless
communication data transponder on or within at least a portion of
the housing and configured to communicate with the electronic
device of the electronic assembly.
Embodiment 207
[0501] The abrasive system of Embodiment 189, wherein the
electronic device is configured for wireless communication and
having a minimum effective communication range of at least 0.2
meters or at least 0.25 meters or at least 0.3 meters or at least
0.35 meters or at least 0.4 meters or at least 0.5 meters or at
least 0.6 meters or at least 0.8 meters or or at least 1 meter or
at least 1.2 meters or at least 1.4 meters or at least 1.6 meters
or at least 1.8 meters or at least 2 meters or at least 2.2 meters
or at least 2.4 meters or at least 2.6 meters or at least 2.8
meters or at least 3 meters or at least 3.2 meters or at least 3.4
meters or at least 3.6 meters or at least 3.8 meters or at least 4
meters or at least 5 meters or at least 6 meters or at least 7
meters or at least 8 meters or at least 9 meters or at least 10
meters.
Embodiment 208
[0502] The abrasive system of Embodiment 207, wherein the minimum
effective communication range is not greater than 100 meters or not
greater than 75 meters or not greater than 50 meters or not greater
than 25 meters or not greater than 20 meters or not greater than 15
meters or not greater than 12 meters or not greater than 10
meters.
Embodiment 209
[0503] The abrasive system of Embodiment 189, wherein the
electronic device comprises a minimum data transmission rate of at
least 4 kbps or at least 8 kbps or at least 10 kbps or at least 15
kbps or at least 20 kbps or at least 40 kbps or at least 60 kbps or
at least 80 kbps or at least 100 kbps or at least 150 kbps or at
least 200 kbps or at least 250 kbps or at least 300 kbps or at
least 400 kbps or at least 500 kbps or at least 600 kbps.
Embodiment 210
[0504] The abrasive system of Embodiment 189, wherein the
electronic device comprises a maximum loss of not less than -50 dB
over a range of frequencies of at least 3 kHz to not greater than
300 GHz.
Embodiment 211
[0505] The abrasive system of Embodiment 189, wherein the
electronic device comprises at least one of a vertically polarized
antenna, booster antenna, 3D polarized antenna, or any combination
thereof.
Embodiment 212
[0506] The abrasive system of Embodiment 189, wherein the
electronic assembly is releasably secured to the body by one or
more securing assemblies configured to facilitate selective removal
of the electronic assembly via at least one secure keying
element.
Embodiment 213
[0507] The abrasive system of Embodiment 189, wherein the body
comprises a window and the electronic assembly is disposed in the
window.
Embodiment 214
[0508] The abrasive system of Embodiment 189, wherein comprising a
plurality of electronic devices including a first electronic device
and a second electronic device, wherein the first electronic device
is disposed at a first position on the body and the second
electronic device is disposed at a second position on the body,
wherein the first position is different from the second
position.
Embodiment 215
[0509] The abrasive system of Embodiment 189, wherein the
electronic assembly is on an abrasive portion of the body, wherein
the abrasive portion includes abrasive particles.
Embodiment 216
[0510] The abrasive system of Embodiment 189, wherein the
electronic assembly is at least partially embedded in an abrasive
portion of the body, wherein the abrasive portion includes abrasive
particles.
Embodiment 217
[0511] The abrasive system of Embodiment 189, wherein the
electronic assembly is completely embedded in an abrasive portion
of the body, wherein the abrasive portion includes abrasive
particles.
Embodiment 218
[0512] The abrasive system of Embodiment 189, wherein the
electronic assembly is contained on a non-abrasive portion of the
body, wherein the non-abrasive portion is free of abrasive
particles.
Embodiment 219
[0513] The abrasive system of Embodiment 189, wherein the
electronic assembly is at least partially embedded in a
non-abrasive portion of the body, wherein the non-abrasive portion
is free of abrasive particles.
Embodiment 220
[0514] The abrasive system of Embodiment 189, wherein the
electronic assembly is completely embedded in a non-abrasive
portion of the body, wherein the non-abrasive portion is free of
abrasive particles.
Embodiment 221
[0515] The abrasive system of Embodiment 189, further comprising a
workpiece configured to access an abrasive portion of the body,
wherein the workpiece comprises at least one electronic
assembly.
Embodiment 222
[0516] The abrasive system of Embodiment 221, wherein the
electronic assembly of the workpiece is configured to receive or
transmit data to the electronic assembly coupled to the body.
Embodiment 223
[0517] The abrasive system of Embodiment 221, wherein the
electronic assembly of the workpiece is configured to communicate
with at least one of: the electronic device of the electronic
assembly including a wireless communication data transponder; a
wireless communication data transponder on or within at least a
portion of the housing; or a combination thereof.
Embodiment 224
[0518] The abrasive system of Embodiment 221, wherein the
electronic assembly of the workpiece includes an electronic device
selected from the group of an electronic tag, electronic memory, a
sensor, an analog-to-digital converter, a transmitter, a receiver,
a transceiver, a modulator circuit, a multiplexer, an antenna, a
near-field communication device, a power source a display, an
optical device, a global positioning system, a data transponder, a
secure data storage device, a secure logic device, or any
combination thereof.
Embodiment 225
[0519] The abrasive system of Embodiment 224, wherein the
electronic device of the workpiece includes a wireless
communication device including a logic element and an antenna.
Embodiment 226
[0520] The abrasive system of Embodiment 224, wherein the
electronic device of the workpiece at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 227
[0521] The abrasive system of Embodiment 226, wherein the sensor is
selected from the group of an acoustic sensor, force sensor,
vibration sensor, temperature sensor, moisture sensor, pressure
sensor, gas sensor, or any combination thereof.
Embodiment 228
[0522] An abrasive article comprising: a body; and an electronic
assembly coupled to the body, the electronic assembly oriented in a
non-parallel configuration relative to a major exterior surface of
the body.
Embodiment 229
[0523] The abrasive article of Embodiment 228, wherein the body
comprises a radial axis and an axial axis, wherein the electronic
assembly comprises a longitudinal axis that is not parallel to
either the radial axis or the axial axis.
Embodiment 230
[0524] The abrasive article of Embodiment 228, wherein the
electronic assembly is contained in a cavity of the body, and
wherein the cavity has a lower surface oriented in a non-parallel
configuration relative to a major exterior surface of the body.
Embodiment 231
[0525] The abrasive article of Embodiment 228, wherein the
electronic assembly is contained in a cavity of the body, and
wherein the cavity has a lower surface oriented in a non-parallel
configuration relative to a radial axis or a longitudinal axis of
the body.
Embodiment 232
[0526] The abrasive article of Embodiment 228, wherein the
electronic assembly is contained in a cavity of the body, and
wherein the cavity has a lower surface oriented in a non-parallel
configuration relative to a radial axis or a longitudinal axis of
the body.
Embodiment 233
[0527] The abrasive article of Embodiment 228, wherein the body
comprises at least one mounting surface configured to receive at
least a portion of the electronic assembly, wherein the mounting
surface is angled relative to a radial axis or a longitudinal axis
of the body.
Embodiment 234
[0528] The abrasive article of Embodiment 228, wherein electronic
assembly is coupled to a surface of the body and the electronic
assembly is angled in a non-planar configuration relative to a
plane defined by the surface of the body.
Embodiment 235
[0529] The abrasive article of Embodiment 228, wherein electronic
assembly is coupled to a major surface of the body and the
electronic assembly is angled in a non-planar configuration
relative to a plane defined by the major surface of the body.
Embodiment 236
[0530] The abrasive article of Embodiment 228, wherein the
electronic assembly comprises an electronic device from the group
of an electronic tag, electronic memory, a sensor, an
analog-to-digital converter, a transmitter, a receiver, a
transceiver, a modulator circuit, a multiplexer, an antenna, a
near-field communication device, a power source a display, an
optical device, a global positioning system, a data transponder, a
secure data storage device, a secure logic device, or any
combination thereof.
Embodiment 237
[0531] The abrasive article of Embodiment 228, wherein the
electronic device includes a wireless communication device
including a logic element and an antenna.
Embodiment 238
[0532] The abrasive article of Embodiment 228, wherein the
electronic device comprises at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 239
[0533] The abrasive article of Embodiment 238, wherein the sensor
is selected from the group of an acoustic sensor, force sensor,
vibration sensor, temperature sensor, moisture sensor, pressure
sensor, gas sensor, or any combination thereof.
Embodiment 240
[0534] The abrasive article of Embodiment 228, wherein the
electronic device comprises at least one of a vertically polarized
antenna, booster antenna, 3D polarized antenna, or any combination
thereof.
Embodiment 241
[0535] An abrasive article comprising: a body, the body including a
cavity; and an electronic assembly coupled to the body, the
electronic assembly including an electronic device, wherein the
electronic assembly is positioned in the cavity of the body, the
cavity extends within the body from an exterior surface of the
cavity, and a spacing factor of the electronic assembly is at least
0.65, the spacing factor being a ratio of Dw/Dt, with Dw being a
distance from an outer edge of the electronic assembly to an outer
edge of the cavity at the exterior surface of the body, and Dt
being a depth of the cavity, the depth Dt being orthogonal to the
distance Dw.
Embodiment 244
[0536] The abrasive article of Embodiment 241, wherein a wall of
the cavity is orthogonal to the exterior surface of the body.
Embodiment 245
[0537] The abrasive article of Embodiment 241, wherein a wall of
the cavity has an angle of at least 100 degrees relative to a plane
bottom surface of the cavity, such as at least 110 degrees, at
least 115 degrees, or at least 120 degrees.
Embodiment 246
[0538] The abrasive article of Embodiment 241, wherein a wall of
the cavity has an angle of not greater than 170 degrees or not
greater than 160, or not greater than 150 degrees, or not greater
than 145 degrees, or not greater than 140 degrees, or not greater
than 130 degrees, or not greater than 120 degrees.
Embodiment 247
[0539] The abrasive article of Embodiment 241, wherein the
electronic device is positioned within the cavity at least 1 mm
below a level of the exterior surface of the body, such as at least
2 mm, at least 3 mm, at least 3.5 mm, at least 4 mm, at least 5
mm.
Embodiment 248
[0540] The abrasive article of Embodiment 241, wherein the
electronic assembly is positioned within the cavity at least 1 mm
below a level of the exterior surface of the body, such as at least
2 mm, at least 3 mm, at least 3.5 mm, at least 4 mm, at least 5
mm.
Embodiment 249
[0541] The abrasive article of Embodiment 241, wherein a diameter
of the cavity is at least 5 mm, or at least 7 mm, or at least 10
mm, or at least 12 mm.
Embodiment 250
[0542] The abrasive article of Embodiment 241, wherein the
electronic assembly comprises a first portion which is RF
transparent.
Embodiment 251
[0543] The abrasive article of Embodiment 241, wherein the
electronic assembly comprises a second portion which is not RF
transparent.
Embodiment 252
[0544] The abrasive article of Embodiment 241, wherein the
electronic assembly comprises a first portion which is RF
transparent, and a second portion which is not RF transparent.
Embodiment 253
[0545] The abrasive article of Embodiment 241, further comprising
an adapter, wherein the adapter provides a support structure for
the electronic assembly.
Embodiment 254
[0546] The abrasive article of Embodiment 253, wherein the
electronic assembly is positioned in a central region of the
adapter.
Embodiment 255
[0547] The abrasive article of Embodiment 253, wherein the adapter
comprises a multi-layer structure.
Embodiment 256
[0548] The abrasive article of Embodiment 255, wherein the
multi-layer structure is positioned underneath the electronic
assembly and comprises a metal layer and a non-metallic layer.
Embodiment 257
[0549] The abrasive article of Embodiment 256, wherein the
non-metallic layer comprises an organic polymer.
Embodiment 258
[0550] The abrasive article of Embodiment 253, wherein the adapter
comprises a coupling structure for fastening the electronic
assembly within the cavity.
Embodiment 259
[0551] The abrasive article of Embodiment 254, wherein the adapter
comprises a tolerance fit, a press fit, a threaded joint, or a
knurled surface for coupling to the cavity.
Embodiment 260
[0552] The abrasive article of Embodiment 241, wherein the spacing
factor is at least 0.7 or a least 0.8 or at least 0.9 or at least
1.0 or at least 1.1 or at least 1.2 or at least 1.5 or at least 1.7
or at least 2 or at least 3 or at least 5.
Embodiment 261
[0553] The abrasive article of Embodiment 241, wherein a distance
of minimum communication of the electronic device is at least 0.01
meters.
Embodiment 262
[0554] The abrasive article of Embodiment 241, wherein the body
comprises a metal wheel.
Embodiment 263
[0555] The abrasive article of Embodiment 241, wherein the
electronic assembly includes an electronic device selected from an
electronic tag, electronic memory, a sensor, an analog-to-digital
converter, a transmitter, a receiver, a transceiver, a modulator
circuit, a multiplexer, an antenna, a near-field communication
device, a power source a display, an optical device, a global
positioning system, a data transponder, a secure data storage
device, a secure logic device, or any combination thereof.
Embodiment 264
[0556] The abrasive article of Embodiment 263, wherein the
electronic device comprises at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 265
[0557] The abrasive article of Embodiment 241, wherein the cavity
is contained in an abrasive portion of the body.
Embodiment 266
[0558] The abrasive article of Embodiment 241, wherein the cavity
is contained in a non-abrasive portion of the body.
Embodiment 267
[0559] The abrasive article of Embodiment 241, wherein the cavity
further comprises a filling material.
Embodiment 268
[0560] The abrasive article of Embodiment 241, wherein the filling
material includes an organic polymer.
Embodiment 269
[0561] An abrasive article comprising: a body; a cavity extending
within the body from an exterior surface from the body; and an
electronic assembly contained within the cavity of the body, the
electronic assembly including an electronic device, wherein a
bottom surface of the cavity is substantially flat.
Embodiment 270
[0562] The abrasive article of Embodiment 269, wherein the bottom
surface of the cavity has a normalized average flatness between
0.00001 mm.sup.-1 to 0.0001 mm-1.
Embodiment 271
[0563] The abrasive article of Embodiment 269, wherein the bottom
surface of the cavity has a surface which is substantially parallel
to a bottom surface of the electronic assembly.
Embodiment 272
[0564] The abrasive article of Embodiment 269, wherein the
electronic device is completely contained within the cavity.
Embodiment 273
[0565] The abrasive article of Embodiment 269, wherein the
electronic assembly is completely contained within the cavity.
Embodiment 274
[0566] The abrasive article of Embodiment 269, wherein the
electronic assembly includes an electronic device selected from an
electronic tag, electronic memory, a sensor, an analog-to-digital
converter, a transmitter, a receiver, a transceiver, a modulator
circuit, a multiplexer, an antenna, a near-field communication
device, a power source a display, an optical device, a global
positioning system, a data transponder, a secure data storage
device, a secure logic device, or any combination thereof.
Embodiment 275
[0567] The abrasive article of Embodiment 274, wherein the
electronic device comprises at least one of a passive radio
frequency identification (RFID) tag, an active radio frequency
identification (RFID) tag, a sensor, a passive near-field
communication device (passive NFC), an active near-field
communication device (active NFC), or any combination thereof.
Embodiment 276
[0568] The abrasive article of Embodiment 269, wherein a minimum
effective communication range of the electronic device is at least
0.2 meters.
Embodiment 277
[0569] A process for attaching an electronic device to an abrasive
article, comprising: providing the abrasive article having a body,
identifying a position on the body; using a robot for placing the
electronic device at the position.
Embodiment 278
[0570] The process of Embodiment 277, wherein providing the
abrasive article includes identifying the abrasive article from a
plurality of abrasive articles.
Embodiment 279
[0571] The process of Embodiment 278, wherein identifying the
abrasive body comprises using a vision system.
Embodiment 280
[0572] The process of Embodiment 279, wherein the vision system
detects a unique indicia encoding information related to the
abrasive article.
Embodiment 281
[0573] The process of any one of Embodiments 278-280, wherein
identifying a position on the body comprises using a vision
system.
Embodiment 282
[0574] The process of any one of Embodiments 278-281, further
comprising selecting the electronic device by the robot and
coupling the electronic device to the identified position of the
body.
Embodiment 283
[0575] The process of any one of Embodiments 277-282, wherein the
position is a cavity extending within the body from an exterior
surface of the body.
Embodiment 284
[0576] The process of any one of Embodiments 277-282, wherein the
body includes a wheel.
Embodiment 285
[0577] The process of any one of Embodiments 277-284, wherein the
electronic device is contained in an electronic assembly.
Embodiment 286
[0578] The process of any one of Embodiments 277-285, wherein the
robot comprises an in built force/torque sensor capable of
detecting the maximum force to be exerted to press the electronic
device into the cavity.
Embodiment 287
[0579] The process of any one of Embodiments 277-286 wherein the
electronic device includes an electronic tag, electronic memory, a
sensor, an analog-to-digital converter, a transmitter, a receiver,
a transceiver, a modulator circuit, a multiplexer, an antenna, a
near-field communication device, a power source a display, an
optical device, a global positioning system, a data transponder, a
secure data storage device, a secure logic device, or any
combination thereof.
Embodiment 288
[0580] The process of any one of Embodiments 277-287, wherein the
electronic device is contained in a packaging.
Embodiment 289
[0581] An abrasive article comprising: a body; an electronic
assembly including an electronic device coupled to the body; and an
adapter coupled to the electronic assembly.
Embodiment 290
[0582] The abrasive article of Embodiment 289, wherein the adapter
comprises a coupling structure for fastening the electronic
assembly within a cavity of the body.
Embodiment 291
[0583] The abrasive article of Embodiment 290, wherein the adapter
comprises a tolerance fit, a press fit, a threaded joint, or a
knurled surface for coupling to the cavity.
Embodiment 292
[0584] The abrasive article of any one of Embodiments 289-291,
wherein the electronic device includes an electronic tag,
electronic memory, a sensor, an analog-to-digital converter, a
transmitter, a receiver, a transceiver, a modulator circuit, a
multiplexer, an antenna, a near-field communication device, a power
source a display, an optical device, a global positioning system, a
data transponder, a secure data storage device, a secure logic
device, or any combination thereof.
EXAMPLES
Example 1
[0585] RFID Tags Integrated within Abrasive Wheel.
[0586] Abrasive wheels designed for edge grinding were used for
drilling cavities (also called slots herein) in the wheel body for
inserting and testing different types RFID tags. The slots were
drilled at two different positions in the non-abrasive portion of
the wheel (position 1 and position 2) to investigate alternative
slot possibilities for placing the tags, see also FIG. 23A.
Position 1 was more in the center of an exterior surface of the
wheel, while Position 2 was close to the inner diameter of the
wheel. Three different types of RFID tags were tested: Omni ID Fit
220, Omni ID Fit 400 P and HID Ceramic Brick. As adhesive for
attaching and covering the tags were used Araldite Klear and
Technovit 3040.
[0587] After placing the tags in the slots of the wheel and curing
the adhesive, each wheel was submitted to an electrical discharge
machining (EDM) process to re-profile the abrasive layer. EDM
included soaking the wheel in EDM oil for about two hours.
Thereafter, the wheel was subjected to dynamic balancing to check
for imbalance. Furthermore, a spin test was conducted to check the
adhesive integrity at a speed 1.5 time of the wheel rated speed.
Finally, the wheel was used for grinding ten panels of glass.
[0588] Before and after the conducted tests and glass grinding, the
information contained on the RFID tags was measured with a wire
less read device (Zebra RFD 8500 handheld reader). It could be
assured that all tested RFID tags at both positions of the wheel
maintained their readability during the test and grinding
operations, such that all the stored information was always
accessible. Furthermore, the tags maintained their structural
integrity and adhesion within the slots. Images of sections of the
wheels shown the slot with the adhesive covered tag can be seen in
FIGS. 23 B and 23 C.
Example 2
[0589] Investigation of Influence of Spacing Factor on
Communication Range.
[0590] A variety of holes (cavities) having different diameter size
and depths were drilled at a side surface of a steel wheel. The
steel wheel was a wheel designed for glass edge grinding. The wheel
had a diameter size of 150 mm and a thickness of 15 mm.
[0591] In each of the test cavities, an RFID tag (UHF ceramic tag)
was placed in the center of the bottom surface using the same
adhesive as in Example 1. A Zebra RFD 8500 handheld reader was used
to test at which distance from the RFID tag the information
contained on the tag was readable. The information on the RFID tag
contained an electronic product code (EPC) and user data related to
the wheel type.
[0592] A summary of the measured maximum communication distance in
dependency to the space between tag and the wall of the cavity (Dw)
and the depth of the cavity (Dt) is shown in Table 1 and FIG.
20.
TABLE-US-00001 TABLE 1 Communication Dw Dt Dw/Dt Distance Sample
[mm] [mm] (Spacing Factor) [mm] 1 2.5 6.0 0.41 70 2 2.5 4.5 0.55 90
3 2.5 3.5 0.71 300 4 3.0 3.5 0.86 360 5 3.5 3.5 1.0 575 6 4.0 3.5
1.14 650
Example 3
[0593] Influence of Flatness of Cavity Bottom on Communication
Distance.
[0594] The same wheel, RFID tags and measuring device was used as
in Example 1, except that cavities were formed having a different
shape of the bottom. As illustrated in FIGS. 24A, B, and C, in
Sample 6 (FIG. 24A) the RFID tag 2401 was attached to a flat bottom
cavity surface of the wheel body 2403, while Sample 7 (FIG. 24B)
was placed in the middle of two inclining surfaces, and Sample 8
(FIG. 24C) was attached to a curved surface. Next to the change of
the surface geometry, no other changed were made, Dw and Dt was for
all samples the same.
[0595] A summary of the results can be seen in Table 2. It can be
seen that the best communication distance was obtained when the
RFID tag was place on a flat surface. It should be noted that
safety standards in industry require a certain minimum distance of
an operator to the abrasive article, e.g., an abrasive wheel.
Accordingly, in certain situations, the read or communication
distance of the electronic device should by at least 0.01 meters or
at least 0.02 meters.
TABLE-US-00002 TABLE 2 Communication Cavity bottom Distance Sample
Surface shape [mm] 6 flat 300 (180 degrees) 7 Inclined 110 (118
degrees) 8 curved 170
Example 4
[0596] Use of RFID Tags in Wheel for Tracing Wheels Subjected to
Different Grinding Time Exposure/Wear.
[0597] The same wheel type, RFID tags and measuring device was used
as in Example 1, except that RFID data was included and used to set
machining parameters before operation starts. The RFID
identification data was also utilized to map for each wheel a power
usage pattern with regard to the number of glasses that were
ground. The power was measured using additional sensors (current,
voltage, frequency) connected to the grinding machine and monitored
throughout the life of the wheel. The power variation due to
smoothening or damage of the grinding surface was detected and
alerted to the user to stop the operation when needed.
[0598] The alerts were also suitable to be generated via. sms or
indicators. This process can reduce defects in glasses and also may
improve the life of a wheel. One-to-one mapping/traceability was
conducted by encoding the information (re-profile number, number of
glasses, machine parameters etc.) in the user memory of the
tag.
[0599] In the foregoing specification, the concepts have been
described with reference to specific embodiments. However, one of
ordinary skill in the art appreciates that various modifications
and changes can be made without departing from the scope of the
invention as set forth in the claims below. Accordingly, the
specification and figures are to be regarded in an illustrative
rather than a restrictive sense, and all such modifications are
intended to be included within the scope of the invention.
[0600] In the foregoing specification, the concepts have been
described with reference to specific embodiments. However, one of
ordinary skill in the art appreciates that various modifications
and changes can be made without departing from the scope of the
invention as set forth in the claims below. Accordingly, the
specification and figures are to be regarded in an illustrative
rather than a restrictive sense, and all such modifications are
intended to be included within the scope of the invention.
* * * * *