U.S. patent application number 16/901282 was filed with the patent office on 2020-10-01 for magnetoresistive element, manufacturing method thereof and magnetic sensor.
The applicant listed for this patent is TDK Corporation. Invention is credited to Kohei HONMA, Satoshi MIURA.
Application Number | 20200313083 16/901282 |
Document ID | / |
Family ID | 1000004885958 |
Filed Date | 2020-10-01 |
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United States Patent
Application |
20200313083 |
Kind Code |
A1 |
HONMA; Kohei ; et
al. |
October 1, 2020 |
MAGNETORESISTIVE ELEMENT, MANUFACTURING METHOD THEREOF AND MAGNETIC
SENSOR
Abstract
A magnetoresistive element has a magnetization free layer whose
magnetization direction changes in an external magnetic field; a
magnetization pinned layer whose magnetization direction is pinned
in the external magnetic field; and a barrier layer that is
positioned between the magnetization free layer and the
magnetization pinned layer and that exhibits a magnetoresistive
effect. The barrier layer is an oxide of an alloy that includes Mg
and Al, and the barrier layer includes a crystalline region and a
non-crystalline region.
Inventors: |
HONMA; Kohei; (Tokyo,
JP) ; MIURA; Satoshi; (Tokyo, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TDK Corporation |
Tokyo |
|
JP |
|
|
Family ID: |
1000004885958 |
Appl. No.: |
16/901282 |
Filed: |
June 15, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
16163703 |
Oct 18, 2018 |
10700267 |
|
|
16901282 |
|
|
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 43/10 20130101;
H01L 43/12 20130101; H01L 27/22 20130101; H01L 43/08 20130101; G01R
33/098 20130101 |
International
Class: |
H01L 43/08 20060101
H01L043/08; H01L 43/10 20060101 H01L043/10; G01R 33/09 20060101
G01R033/09; H01L 27/22 20060101 H01L027/22; H01L 43/12 20060101
H01L043/12 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 13, 2017 |
JP |
2017-217986 |
Aug 30, 2018 |
JP |
2018-161738 |
Claims
1-11. (canceled)
12. A method of manufacturing a magnetoresistive element comprising
the steps of: forming either a magnetization free layer whose
magnetization direction changes depending on an external magnetic
field or a metal layer that is to be a magnetization pinned layer
whose magnetization direction is pinned against the external
magnetic field, wherein either one of the magnetization free layer
and the metal layer includes a CoFe layer and the CoFe layer is a
top layer of said either one of the layers; forming a film that
includes Mg and Al atop said either one of the layers; oxidizing
the film in order to form a barrier layer that has a
magnetoresistive effect and that includes a crystalline region and
a non-crystalline region; forming a remaining one of the
magnetization free layer and the metal layer atop the barrier
layer; and pinning the magnetization direction of the metal layer
in order to form the magnetization pinned layer, wherein said
either one of the layers is amorphous, and a boundary portion
between the CoFe layer and the barrier layer is crystallized by
annealing.
13. The method according to claim 12, wherein the remaining one
includes another CoFe layer, and the remaining one is formed such
that said another CoFe layer is adjacent to the film, wherein the
remaining one is amorphous, and a boundary portion between said
another CoFe layer and the barrier layer is crystallized by
annealing.
14. The method according to claim 12, wherein the film includes a
Mg film and a MgAl film.
15. A magnetoresistive element comprising: a magnetization free
layer whose magnetization direction changes depending on an
external magnetic field; a magnetization pinned layer whose
magnetization direction is pinned against the external magnetic
field; and a barrier layer that is positioned between the
magnetization free layer and the magnetization pinned layer and
that exhibits a magnetoresistive effect; wherein the barrier layer
is an oxide of a film that includes Mg and Al, and includes a
crystalline region and a non-crystalline region, and at least
either the magnetization free layer or the magnetization pinned
layer includes a metal layer that is adjacent to the barrier layer,
wherein the metal layer contains at least either Co or Fe.
16. The magnetoresistive element according to claim 15, wherein the
metal layer is a CoFe layer.
17. The magnetoresistive element according to claim 16, wherein a
boundary portion between the metal layer and the barrier layer is
crystalline.
18. A magnetic sensor comprising the magnetoresistive element
according to claim 15.
Description
BACKGROUND OF THE INVENTION
Field of the Invention
[0001] The present application is based on, and claims priority
from, JP Application No. 2017-217986, filed on Nov. 13, 2017 and JP
Application No. 2018-161738, filed on Aug. 30, 2018, the disclosure
of which is hereby incorporated by reference herein in its
entirety.
[0002] The present invention relates to a magnetoresistive element,
manufacturing method thereof and a magnetic sensor, and
particularly to the configuration of a barrier layer of the
magnetoresistive element.
Description of the Related Art
[0003] In a magnetic sensor having a magnetoresistive element, the
magnetoresistive element is formed as a CIP (Current-In-Plane)-GMR
(Gigantic Magnetoresistive) element, an AMR (Anisotropic
Magnetoresistive) element and so on. JP5294043, JP5586028 and
JP5988019 disclose a magnetoresistive element using a TMR (Tunnel
Magnetoresistance) element that exhibits a relatively high MR
ratio. A magnetoresistive element using a TMR element is typically
constructed as a multilayer film that includes a magnetization free
layer whose magnetization direction changes depending on an
external magnetic field, a magnetization pinned layer whose
magnetization direction is pinned against the external magnetic
field and a barrier layer that is positioned between the
magnetization free layer and the magnetization pinned layer and
that exhibits a magnetoresistive effect. The barrier layer is
typically formed of a metal oxide, especially of MgO that is
capable of obtaining a high MR ratio that exceeds 100%.
SUMMARY OF THE INVENTION
[0004] In general, the electric resistance of a magnetic sensor has
to be kept within a desired range. In a magnetic sensor using a TMR
element, the electric resistance of the circuit is mainly
determined by the tunneling resistance of the TMR element. Thus, it
is important to accurately manage the tunneling resistance value of
the TMR element in the manufacturing process. A barrier layer that
consists of MgO may be formed by depositing a Mg film by means of
sputtering and then by oxidizating the Mg film. However, a Mg film,
when oxidized, tends to form passivity on the surface thereof and
to leave inside of the Mg film under-oxidized.
[0005] The electric resistance of a TMR element can be approximated
by an exponential, which is a function of the film thickness of the
barrier layer, the tunnel barrier height of the barrier layer and
so on. The tunnel barrier height is a variable that depends on
material and is largely changed, for example, depending on the
ratio of under-oxidized Mg that remains inside of the barrier
layer. Therefore, the tunnel barrier height is changed due to
variation of the manufacturing process, and accordingly, the
electric resistance of the TMR element, which is approximated by
the exponential of the tunnel barrier height, is also largely
changed. Since TMR elements are manufactured in a wafer process,
the variation in oxidization of a Mg film leads to a wafer level
variation in the electric resistance of TMR elements. This becomes
a big problem on yield and quality control of magnetic sensors.
[0006] The present invention aims at providing a magnetoresistive
element having a high MR ratio and a barrier layer having reduced
variation in electric resistance.
[0007] A magnetoresistive element of the present invention
comprises: a magnetization free layer whose magnetization direction
changes in an external magnetic field; a magnetization pinned layer
whose magnetization direction is pinned in the external magnetic
field; and a barrier layer that is positioned between the
magnetization free layer and the magnetization pinned layer and
that exhibits a magnetoresistive effect. The barrier layer is an
oxide of an alloy that includes Mg and Al, and the barrier layer
includes a crystalline region and a non-crystalline region.
[0008] An alloy film that includes Mg and Al is more apt to be
oxidized in the inside of the film than a Mg film. This means
higher repeatability in oxidization and less variation between
wafers. Such a barrier layer includes a crystalline region and a
non-crystalline region. Thus, according to the present invention,
it is possible to provide a magnetoresistive element having a high
MR ratio and a barrier layer having reduced variation in electric
resistance.
[0009] The above and other objects, features and advantages of the
present invention will become apparent from the following
description with reference to the accompanying drawings which
illustrate examples of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a schematic perspective view of a magnetoresistive
element according to an embodiment of the present invention;
[0011] FIG. 2 is a schematic view showing an oxidation state in the
barrier layer;
[0012] FIGS. 3A to 3C are schematic views showing a manufacturing
process of a MTJ of Examples;
[0013] FIG. 4 is a graph showing a relationship between oxygen
exposure and RA;
[0014] FIG. 5 is a graph showing a relationship between a
normalized RA and a normalized MR ratio;
[0015] FIG. 6 is a graph showing a relationship between oxygen
exposure and the normalized MR ratio;
[0016] FIG. 7 is a graph showing a relationship between atomic
percent of Al and the normalized RA and between the atomic percent
of Al and the normalized MR ratio;
[0017] FIG. 8 is a graph showing a relationship between the atomic
percent of Al and the volume ratio of crystallized region;
[0018] FIG. 9 is a graph showing a relationship between the volume
ratio of the crystallized region and the normalized RA and between
the volume ratio of the crystallized region and the normalized MR
ratio; and
[0019] FIG. 10 is a schematic perspective view of a Z-axis magnetic
sensor.
DETAILED DESCRIPTION OF EMBODIMENTS
[0020] Hereinafter, an embodiment of a magnetoresistive element of
the present invention will be described with reference to the
drawings. In the following description, the X direction is a
direction in which the magnetoresistive element detects magnetic
field. The Y direction is orthogonal to the X direction. The X and
Y directions are parallel to the mounting surface of the
magnetoresistive element. The Z direction is orthogonal to the X
and Y directions and corresponds to a direction in which a
plurality of layers that constitute the magnetoresistive element
are stacked.
[0021] FIG. 1 is a sectional view schematically showing the
configuration of a magnetoresistive element. Magnetoresistive
effect element 1 has MTJ (magnetic tunnel junction) 2 and a pair of
lead electrodes 3, 4 that interpose MTJ 2 in the Z direction. MTJ 2
has magnetization free layer 24, magnetization pinned layer 22 and
barrier layer 23 that is interposed between magnetization free
layer 24 and magnetization pinned layer 2 and that has a
magnetoresistive effect. Thus, magnetoresistive element 1 according
to the present embodiment is a TMR element. Magnetization free
layer 24 is formed of a soft magnetic body, such as CoFe, and the
magnetization direction changes depending on an external magnetic
field in a plane that includes the X and Y directions. In the
present embodiment, magnetization free layer 24 consists of first
magnetization free layer 24a that is formed of CoFe and second
magnetization free layer 24b that is formed of CoFeB. Magnetization
free layer 24 is sufficiently longer in the Y direction than in the
X direction, and the magnetization direction is directed in the Y
direction due to the shape anisotropy thereof when there is no
external magnetic field or there is only a weak external magnetic
field. Bias magnetic layers that are formed of hard magnetic bodies
may be provided on both sides of magnetization free layer 24 with
regard to the Y direction in order to direct the magnetization
direction in the Y direction. The magnetization direction of
magnetization pinned layer 22 is pinned against the external
magnetic field.
[0022] Magnetization pinned layer 22 is a multilayer film in which
first magnetization pinned layer 22a, nonmagnetic intermediate
layer 22b, second magnetization pinned layer 22c and thin CoFe
layer 22d that faces barrier layer 23 are sequentially stacked. MR
ratio can be enhanced by providing CoFe layer 22d as compared to an
arrangement in which second magnetization pinned layer 22c is
directly connected to barrier layer 23. CoFe layer 22d may also be
omitted. First magnetization pinned layer 22a and second
magnetization pinned layer 22c are formed of soft magnetic bodies,
such as CoFe, and nonmagnetic intermediate layer 22b is formed of
Ru, Rh, Ir or an alloy thereof. First magnetization pinned layer
22a and second magnetization pinned layer 22c are
anti-ferromagnetically coupled to each other via nonmagnetic
intermediate layer 22b. Anti-ferromagnetic layer 21 is provided
under first magnetization pinned layer 22a. Anti-ferromagnetic
layer 21 is formed of IrMn or the like and is exchange-coupled to
first magnetization pinned layer 22a. Magnetization free layer 24
is covered with protection layer 25 that is formed of Ta or the
like. Second magnetization pinned layer 22c that is adjacent to
barrier layer 23 via CoFe layer 22d, second magnetization free
layer 24b or both second magnetization pinned layer 22c and second
magnetization free layer 24b includes Co and Fe and may further
include at least any one of Si, B, N and P. MR ratio can be further
enhanced by adding any one of Si, B, N and P. In addition, second
magnetization pinned layer 22c and second magnetization free layer
24b are crystalized by annealing in the manufacturing process. It
is desirable that at least a portion of second magnetization pinned
layer 22c that is adjacent to the boundary between second
magnetization pinned layer 22c and CoFe layer 22d be crystalized in
order to form an atomic arrangement with periodic continuity from
the portion to CoFe layer 22d. It is also desirable that the
boundary portion between second magnetization free layer 24b and
first magnetization free layer 24a be crystalized in the same
manner. Further, it is also desirable that the boundary portion
between CoFe layer 22d and barrier layer 23 and the boundary
portion between first magnetization free layer 24a and barrier
layer 23 be crystalized. Such crystallization enhances the MR
ratio.
[0023] Lead electrodes 3, 4 supply sense current to MTJ 2. When the
magnetization direction of magnetization free layer 24 and the
magnetization direction of magnetization pinned layer 22 are
anti-parallel to each other, the electric resistance of MTJ 2 to
the sense current is maximized and the current that flows through
MTJ 2 is minimized. On the other hand, when the magnetization
direction of magnetization free layer 24 and the magnetization
direction of magnetization pinned layer 22 are parallel to each
other, the electric resistance of MTJ 2 is minimized and the
current that flows through MTJ 2 is maximized. Accordingly, the
strength and the direction of an external magnetic field can be
detected from the change in the electric resistance (the change in
voltage) of MTJ 2.
[0024] Barrier layer 23 is an oxide of an alloy that includes Mg
and Al. The alloy consists of Mg and Al, but may include Zn and/or
Ti in place of or in addition to Mg. This configuration prevents
passivity of Mg from being generated in the oxidization process
(described later) and promotes the formation of a mixture of
poly-crystal and amorphism of barrier layer 23 (described
later).
[0025] In contrast, a conventional barrier layer is formed, for
example, of MgO that is capable of obtaining a high MR ratio.
Explanation will be given about the problem of a barrier layer that
is formed of MgO. A MgO barrier layer can be formed by oxidizing a
Mg film that is deposited by means of sputtering or by directly
depositing MgO by means of sputtering. The former is advantageous
in that it can produce a TMR film having high reliability for
voltage resistance, as compared to the method of directly
depositing MgO by means of sputtering.
[0026] When the former method is adopted, it is important that the
Mg film that is formed be oxidized to the inside of the film. In
other words, since the tunneling effect is obtained by the tunnel
barrier effect of MgO that is an insulator, if magnesium oxide that
contains many oxygen defects due to shortage of oxygen remains in
the barrier layer, then a desired tunneling effect will not be
obtained. However, a Mg film tends to form passivity on the surface
thereof when the film is oxidized and to limit the progress of the
oxidation into the inside of the film. Here, the element electric
resistance of a TMR element is substantially determined by the
tunneling resistance of the barrier layer, and specifically there
is the following relationship.
R.varies.e.sup..gamma.ot
where R is the element resistance of the TMR element, .gamma. is a
constant, t is the film thickness of the barrier layer, and .PHI.
is the tunnel barrier height which depends on material. Thus, the
electric resistance of a TMR element depends on the film thickness
of the barrier layer and on the tunnel barrier height of the
barrier layer (or the material of the barrier layer) in an
exponential manner. The electric resistance R is changed by
changing the process conditions of oxidization because the
composition of the barrier layer is changed depending on the
process conditions of oxidization and thereby tunnel barrier height
.PHI. of the barrier layer is substantially changed. The
characteristics of electric resistance R being changed in an
exponential manner by the change of .PHI. is specific to a TMR
element, and this is one of the reasons for the variation in the
electric resistance of TMR elements. Since, the oxidization
processes are carried out on wafer level, only a small amount of
variation in the process conditions appears as a wafer level
variation in the electric resistance of TMR elements. In contrast,
in case of a CIP-GMR element and an AMR element, which are formed
of a metal film alone, the electric resistance is substantially in
inverse proportion to the sectional area of the element and in
proportion to the length of the element. Accordingly, the variation
in electric resistance and MR ratio substantially depends on the
variation in the deposition rate alone. This means that the
variation in characteristics that is caused by production processes
is smaller than that of a TMR element.
[0027] FIG. 2 schematically shows the progress of oxidization in
the barrier layer. Both a Mg film and a MgAl film are completely
oxidized on the surfaces thereof, but the MG film is less apt to be
oxidized in the film. Although not illustrated, an Al film has the
same tendency as a Mg film. In other words, there is a similar
problem when the barrier layer is formed of Al.sub.2O.sub.3. In
contrast, a MgAl film is less apt to form passivity in an oxygen
atmosphere and oxidization easily progresses to the inside of the
film. In the present embodiment, which uses a MgAl film, it is easy
to control the degree of oxidization of barrier layer 23 in the
film thickness direction, and the variation in the electric
resistance can be reduced.
[0028] Next, some Examples will be described. In each Example, MTJ
2 was manufactured according to the method shown in FIG. 3.
Specifically, as shown in FIG. 3A, poly-crystalline electrode film
32 that simulates lower lead 3, CoFeB layer 33, CoFe layer 34, Mg
film 35 and MgAl film 36 (an alloy layer) are sequentially formed
on wafer 31, which is a substrate. CoFeB layer 33 and CoFe layer 34
are metal layers to be formed into magnetization free layer 24.
CoFeB layer 33 corresponds to second magnetization free layer 24b
in the embodiment, and CoFe layer 34 corresponds to first
magnetization free layer 24a in the embodiment. CoFeB layer 33 is
amorphous at this stage. MgAl film 36 is formed by causing an inert
gas, such as argon gas, to collide against a Mg target and an Al
target at the same time. Mg film 35 having a film thickness of
about 0.4 to 1 nm may be formed between CoFe layer 34 and MgAl film
36 in order to increase the MR ratio. Next, as shown in FIG. 3B,
the wafer is housed in an oxidization chamber and an oxidization
process is carried out. MgAl film 36 is oxidized and barrier layer
361 that consists of MgAlO is formed in this process. Next, as
shown in FIG. 3C, CoFe layer 37, CoFeB layer 38, Ru layer 39, CoFe
layer 40 and anti-ferromagnetic layer 41 that is formed of IrMn are
formed on barrier layer 361. Finally, protection layer 42 that
consists of Ru and Ta is formed. CoFe layer 37, CoFeB layer 38, Ru
layer 39, CoFe layer 40 correspond to CoFe layer 22d, second
magnetization pinned layer 22c, nonmagnetic intermediate layer 22b
and first magnetization pinned layer 22a, respectively, and
anti-ferromagnetic layer 41 corresponds to anti-ferromagnetic layer
21. CoFeB layer 38 is amorphous at this stage. Next, annealing is
conducted while applying a magnetic field. Annealing temperature
was set at or above the blocking temperature of anti-ferromagnetic
layer 41 and at or below 300.degree. C. Thus, the magnetization
direction of CoFe layer 40 is pinned by anti-ferromagnetic layer
41, and CoFe layer 37 and CoFeB layer 38 are anti-ferromagnetically
coupled to CoFe layer 40 via Ru layer 39. The magnetization
directions of CoFe layer 37 and CoFeB layer 38 are pinned in a
direction anti-parallel to the magnetization direction of CoFe 40.
In addition, during the annealing, CoFeB layer 33 is changed into a
crystalline structure and
[0029] CoFeB layer 33 is changed into a crystalline structure
having an atom arrangement that is continuous with CoFe layer 37.
Thus, magnetization free layer 24 and magnetization pinned layer 22
are formed. MTJs of Comparative Examples were manufactured
according to the same process as the process of Examples except for
the manufacturing process of barrier layer 361. The composition
(atomic percent) of the magnetic layers (CoFeB layers 33, 38) above
and under MgAl film 36 in Embodiments or above and under a Mg film
in Comparative Examples were Co.sub.17Fe.sub.59B.sub.24. In
addition, the composition (atomic percent) of anti-ferromagnetic
layer 41 was Ir23Mn77. It should be noted that magnetization free
layer 24 was formed on the side of the substrate in Examples, but
magnetization pinned layer 22 may be formed on the side of the
substrate, as shown in FIG. 1. In other word, magnetization pinned
layer 22 and magnetization free layer 24 may be arranged on any one
of both sides of barrier layer 23 as long as they interpose barrier
layer 23 from both sides in the Z direction.
Example 1
[0030] A plurality of MTJs were prepared with oxygen exposure as a
parameter, and a relationship between oxygen exposure and RA was
measured. RA is a product of electric resistance R of a MTJ and
area A of a cross section of the element through which the sense
current flows, indicating one of characteristics of a
magnetoresistive element. The target value of RA is determined for
each product to which a magnetoresistive element is incorporated,
such as a magnetic sensor, and RA is usually required to fall
within a predetermined range for each product. Accordingly, the RA
of a magnetoresistive element is required to be less variable or
less sensitive to oxygen exposure.
[0031] FIG. 4 shows a relationship between oxygen exposure and RA
in Examples and Comparative Examples. Oxygen exposure is defined to
be oxidization pressure in the oxidization chamber
(Pa).times.exposure time (sec). Denoting RA by y and denoting
oxygen exposure by x, a relationship between x and y was
approximated by the formula: y=.alpha..times.In(x)+.beta.. Gradient
.alpha. indicates sensitivity of Ra to oxygen exposure. The larger
.alpha. is, the larger is the sensitivity of RA to oxygen exposure,
i.e., the variation in the element electric resistance tends to
increase. .beta. is a constant. Since .alpha. depends on the
absolute value of RA, evaluation was made for four regions D1 to D4
shown in FIG. 3. The value of .alpha. for each region is shown in
Table 1. Denoting .alpha. of MgO by .alpha.MgO and denoting .alpha.
of MgAlO by .alpha.MgAlO, a ratio .alpha.MgAlO/.alpha.MgO for each
region D1 to D4 is shown in Table 2. In each region,
.alpha.MgAlO/.alpha.MgO was 21% or less. In other words, MgAlO was
found to be less sensitive to the change of oxidization condition
in a wide area of RA ranging from the order of 1.times.10.sup.1 to
the order of 1.times.10.sup.3.
TABLE-US-00001 TABLE 1 Film Thickness of MgAl Atomic Percent Firm
or Mg Film (nm) of Al .alpha. Example (D1) 2.5 40 564 Comp. Example
(D1) 2.6 0 6979 Example (D2) 2.2 38 56 Comp. Example (D2) 2.1 0 381
Example (D3) 2.2 58 61 Comp. Example (D3) 2.1 0 565 Example (D4)
1.9 35 21 Comp. Example (D4) 1.7 0 98
TABLE-US-00002 TABLE 2 D1 D2 D3 D4 .alpha.MgAlO/.alpha.MgO 0.08
0.15 0.11 0.21
Example 2
[0032] FIG. 5 shows a relationship between a normalized RA and a
normalized MR ratio. In FIG. 5, RA and MR ratio of Examples
(barrier layer 361 is formed of MgAlO) are normalized by setting RA
and MR ratio of Comparative Examples (barrier layer 361 is formed
of MgO) at 1. RA of Examples and RA of Comparative Example were
about the same level. MR ratio of Examples were about 85% of the MR
ratio of Comparative Examples. Based on the fact that the MR ratio
of a TMR element whose barrier layer is formed of MgO is typically
150 to 200% and that the MR ratio of a TMR element whose barrier
layer is formed of Al.sub.2O.sub.3 is typically no more than 80%,
it was found that, from the viewpoint of MR ratio, the TMR element
of Examples whose barrier layer is formed of MgAlO has MR
characteristics that enable the TMR element of Examples to be a
substitute for conventional TMR element whose barrier layer is
formed of MgO.
[0033] FIG. 6 shows a relationship between the oxygen exposure and
the normalized MR ratio, along with exposure range .alpha. in which
the MR ratio is 98.5% of the maximum value or more. .alpha.MgO
denotes range .alpha. for Comparative Examples and .alpha.MgAlO
denotes range .alpha. for Examples. Since .alpha.MgAlO=720000
(Pasec), and .alpha.MgO=30000 (Pasec), .alpha.MgAlO is 20 times or
more larger than .alpha.MgO. This means that the change in MR ratio
to the change in oxygen exposure is much smaller in Examples. In
other words, it is found that there is small variation in MR ratio
in Examples on the wafer level.
Example 3
[0034] A preferable range of the ratio (atomic percent) of Mg and
Al in MgAl film 36 was studied. Specifically, a plurality of MTJs
having MgAl film 36 that has a film thickness of 1.5 nm and
different atomic percents of Al were prepared. In all cases, the
same oxidization conditions were used. FIG. 7 shows a relationship
between the atomic percent of Al and RA and a relationship between
the atomic percent of Al and MR ratio. In the range of atomic
percent of Al of 78% at or more, MR ratio tends to be significantly
reduced. Thus, from the viewpoint of MR ratio, the atomic percent
of Al is preferably 75% at or less. RA is reduced to about 20 to
30% of the maximum value when the atomic percent of Al is about 20%
at and about 78% at. In these ranges, many under-oxidized regions
or non-oxidized regions are believed to exist in barrier layer 361.
The existence of these regions is disadvantageous not only from the
viewpoint of MR ratio but also from the viewpoint of reliability,
such as reliability for voltage resistance. From the viewpoint of
RA (or the existence of non-oxidized regions), the atomic percent
of Al is preferably 30% at or more and 75% at or less, and more
preferably, 40% at or more and 60% at or less.
[0035] (Composition of Barrier Layer 361 in Each Example)
[0036] After annealing, Mg elements, Al elements and O elements
were uniformly distributed in barrier layer 361. Barrier layer 361
was in a state of a mixture of poly-crystal and amorphism. "Mixture
of poly-crystal and amorphism" means a state in which crystallized
layers and amorphous layers coexist and the crystallized layers are
in a poly-crystalline state. It was found that the MgAlO barrier
layer is in a solid phase that is different from the MgO barrier
layer (crystallized) or the AlO barrier layer (amorphous).
Specifically, the MgAlO barrier layer of the Examples was partially
in the form of crystallized oxide and partially in the form of
amorphous oxide and was finely oxidized in the depth direction. In
the crystalized region, different deposition surfaces were observed
depending on the orientation plane of the magnetic seed layer
(CoFeB layer 33). In the magnetic seed layer, a plurality types of
regions were found, such as a domain having a bcc(001) surface
facing the deposition direction and a domain having a distorted
(112) surface of a bcc structure that is in contact with barrier
layer 361 at angles of about 15.degree..
Example 4
[0037] First, a TEM analysis was carried out on the MTJs of Example
3. When the atomic percent of Al was 65%, about 80% of the total
volume of barrier layer 361 was crystallized regions. When the
atomic percent of Al was 35%, about 90% of the total volume of
barrier layer 361 was crystallized regions. FIG. 8 shows a
relationship between the atomic percent of Al and the volume ratio
of the crystallized regions. From the graph, it is found that ratio
of amorphous layers depends on the composition (atomic percent) of
Mg and Al.
[0038] Next, MTJs with different atomic percent of Al, and
accordingly with different volume ratios of the crystallized
regions, were prepared and a relationship between the volume ratio
of the crystallized regions and the MR ratio and a relationship
between the volume ratio of the crystallized regions and RA were
obtained. The results are shown in FIG. 9. When the volume ratio of
the crystallized regions is less than 75%, the MR ratio is sharply
reduced. Especially, RA was significantly reduced in the range of a
large volume ratio of the crystallized regions and in the range of
a small volume ratio of the crystallized regions, and a high RA was
obtained between these ranges. This suggests, as mentioned above,
that non-oxidized regions remain in barrier layer 361 in the ranges
of large and small volume ratios of the crystallized regions.
Accordingly, the volume ratio of the crystallized regions in
barrier layer 361 is preferably 75% or more and 90% or less.
[0039] Next, an example of a magnetic sensor that utilizes the
magnetoresistive element mentioned above will be described. The
magnetoresistive element according to the present invention may be
applied to any type of a magnetic sensor that detects a magnetic
field. Examples of the magnetic sensor include not only a sensor
for detecting a magnetic field itself, such as a geomagnetic field,
but also a current sensor for measuring a current by detecting a
magnetic field that is induced by a current that flows in a current
line. FIG. 10 shows an example of so-called Z-axis sensor 10 that
detects a magnetic field that is perpendicular to the multi-layers
of a magnetoresistive element, but the present invention is not
limited to this. Magnetic sensor 10 has substrate 6 and first to
fourth magnetoresistive elements 1a to 1d that are arranged in the
X direction on substrate 6. First to fourth magnetoresistive
elements 1a to 1d are arranged in a plane that includes the X
direction and the Y direction and detects a magnetic field in the X
direction. First to fourth magnetoresistive elements 1a to 1d have
substantially rectangular shapes with longer dimensions in the Y
direction than in the X direction, as viewed in the Z direction.
First to fourth magnetoresistive elements 1a to 1d are
interconnected to each other in a bridge circuit (not shown),
allowing magnetic sensor 10 to detect an external magnetic
field.
[0040] First yoke 5a that is formed of a soft magnetic body is
arranged between first magnetoresistive element 1a and second
magnetoresistive element 1b, and second yoke 5b that is formed of a
soft magnetic body is arranged between third magnetoresistive
element 1c and fourth magnetoresistive element 1d. First and second
yoke 5a, 5b are formed of NiFe or the like. First yoke 5a is
adjacent to first and second magnetoresistive elements 1a, 1b in
the X direction, and second yoke 5b is adjacent to third and fourth
magnetoresistive elements 1c, 1d in the X direction. First and
second yokes 5a, 5b guide a magnetic flux that is applied in third
direction Z and that is absorbed by yokes 5a, 5b toward the
magnetic field detecting direction of magnetoresistive elements 1a
to 1d, that is the X direction. When an external magnetic field is
applied to magnetic sensor 10 in third direction Z, the magnetic
flux is absorbed by first and second yokes 5a, 5b (shown by the
bold arrows in the figure) and is bent in the X direction.
[0041] A magnetic field whose component in the X direction is
increased by the magnetic flux passing through first yoke 5a is
applied to first and second magnetoresistive elements 1a, 1b, and
magnetic field whose component in the X direction is increased by
the magnetic flux passing through second yoke 5b is applied to
third and fourth magnetoresistive elements 1c, 1d. Therefore,
magnetic sensor 10 can detect a magnetic field component in the Z
direction more efficiently than a magnetic sensor that does not
have first and second yokes 5a, 5b.
[0042] Although a certain preferred embodiment(s) of the present
invention has (have) been shown and described in detail, it should
be understood that various changes and modifications may be made
without departing from the spirit or scope of the appended
claims.
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