U.S. patent application number 16/354158 was filed with the patent office on 2020-09-17 for electronic device and electronic apparatus.
The applicant listed for this patent is InnoLux Corporation. Invention is credited to Kuan-Feng Lee, Jui-Jen Yueh.
Application Number | 20200295119 16/354158 |
Document ID | / |
Family ID | 1000004127182 |
Filed Date | 2020-09-17 |
United States Patent
Application |
20200295119 |
Kind Code |
A1 |
Yueh; Jui-Jen ; et
al. |
September 17, 2020 |
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
Abstract
An electronic device for tiling another electronic device of the
present disclosure includes a supporting substrate having a first
edge and a second edge, and a flexible substrate disposed on the
supporting substrate, wherein the flexible substrate extends beyond
the first edge and the second edge so as to define a first
extension region and a second extension region of the flexible
substrate, respectively.
Inventors: |
Yueh; Jui-Jen; (Miao-Li
County, TW) ; Lee; Kuan-Feng; (Miao-Li County,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
InnoLux Corporation |
Miao-Li County |
|
TW |
|
|
Family ID: |
1000004127182 |
Appl. No.: |
16/354158 |
Filed: |
March 14, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/3293 20130101;
G06F 3/1446 20130101; G06F 1/1652 20130101 |
International
Class: |
H01L 27/32 20060101
H01L027/32; G06F 1/16 20060101 G06F001/16; G06F 3/14 20060101
G06F003/14 |
Claims
1. An electronic device for tiling another electronic device,
comprising: a supporting substrate having a first edge and a second
edge; and a flexible substrate disposed on the supporting
substrate; wherein the flexible substrate extends beyond the first
edge and the second edge to define a first extension region and a
second extension region of the flexible substrate,
respectively.
2. The electronic device according to claim 1, wherein at least one
of the first extension region and the second extension region is
used for tiling the another electronic device.
3. The electronic device according to claim 1, wherein the first
edge is opposite to the second edge.
4. The electronic device according to claim 1, wherein an extension
length of the first extension region is different from an extension
length of the second extension region.
5. The electronic device according to claim 1, further comprising
an external driving circuit disposed in the first extension
region.
6. The electronic device according to claim 1, further comprising a
coupling member disposed in the second extension region, wherein
the coupling member is used for tiling the another electronic
device.
7. The electronic device according to claim 1, further comprising a
coupling member disposed in the first extension region, wherein the
coupling member is used for tiling the another electronic
device.
8. The electronic device according to claim 1, further comprising a
plurality of electronic units disposed on the flexible substrate
excluding the first extension region and the second extension
region.
9. The electronic device according to claim 8, further comprising a
conductive pattern layer disposed on the flexible substrate, and
the conductive pattern layer electrically connects at least one of
the plurality of electronic units with another electronic unit.
10. The electronic device according to claim 8, wherein the
plurality of electronic units comprise light emitting diodes,
antenna units, sensor units, or combinations thereof.
11. The electronic device according to claim 1, further comprising
a plurality of electronic units disposed on the flexible substrate,
wherein when viewed in a cross-sectional view, the supporting
substrate comprises a front side and a back side, and the plurality
of electronic units are disposed on the front side of the
supporting substrate.
12. The electronic device according to claim 11, wherein the first
extension region is partially disposed on the back side.
13. The electronic device according to claim 1, wherein when viewed
in a top view, the supporting substrate further comprises a third
edge, the first edge is disposed adjacent to the third edge, and
the first edge is opposite to the second edge.
14. The electronic device according to claim 13, wherein when
viewed in a top view, the flexible substrate extends beyond the
third edge to define a third extension region.
15. The electronic device according to claim 14, wherein when
viewed in a top view, the flexible substrate further comprises a
corner extension region disposed adjacent to the first extension
region and the third extension region.
16. The electronic device according to claim 1, wherein when viewed
in a top view, a width of the first extension region is smaller
than a width of the first edge.
17. An electronic apparatus, comprising: a first electronic device
tiled with a second electronic device, each of the first electronic
device and the second electronic device comprising: a supporting
substrate having a first edge and a second edge; and a flexible
substrate disposed on the supporting substrate; wherein the
flexible substrate extends beyond the first edge and the second
edge to define a first extension region and a second extension
region of the flexible substrate, respectively.
18. The electronic apparatus according to claim 17, further
comprising at least one gap between a corner of the first
electronic device and a corner of the second electronic device.
19. The electronic apparatus according to claim 17, wherein at
least one of the first extension region and the second extension
region of the first electronic device is used for tiling the second
electronic device.
20. The electronic apparatus according to claim 17, wherein each of
the first electronic device and the second electronic device
further comprising an external driving circuit disposed in the
first extension region.
Description
BACKGROUND OF THE DISCLOSURE
1. Field of the Disclosure
[0001] The present disclosure relates to an electronic device and
an electronic apparatus, and more particularly, to an electronic
device for tiling another electronic device.
2. Description of the Prior Art
[0002] Large or special-shaped electronic devices are often formed
by tiling method (that is, many smaller electronic devices are
combined to form a larger electronic device). For example, a large
LED display board is combined by many small LED display boards. In
order to achieve a flexible tiled LED display device, first of all,
the flexible substrate should be used, in addition, it is necessary
to solve the technical problems of connecting multiple flexible LED
display boards together.
SUMMARY OF THE DISCLOSURE
[0003] An electronic device for tiling another electronic device of
the present disclosure includes a supporting substrate having a
first edge and a second edge, and a flexible substrate disposed on
the supporting substrate, wherein the flexible substrate extends
beyond the first edge and the second edge to define a first
extension region and a second extension region of the flexible
substrate, respectively.
[0004] The feature of the present disclosure is to provide
different electronic device tiling methods to form a larger area
electronic apparatus. Each electronic device may have the same
structure, so that it can be mass-produced, and then the electronic
devices are tiled into a larger electronic apparatus. It has the
advantages of simple process or cost saving.
[0005] These and other objectives of the present disclosure will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the embodiment that
is illustrated in the various figures and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1A and FIG. 1B show the schematic diagrams of the basic
structure of each electronic device in the present disclosure,
wherein FIG. 1A represents a cross-sectional view of the electronic
device, and FIG. 1B represents a top view of the electronic
device.
[0007] FIG. 2 shows the schematic diagram of an electronic device
according to a second embodiment of the present disclosure.
[0008] FIG. 3 shows the schematic diagram of an electronic device
according to a third embodiment of the present disclosure.
[0009] FIG. 4 shows the schematic diagram of an electronic device
according to a fourth embodiment of the present disclosure.
[0010] FIG. 5 shows the schematic diagram of an electronic device
according to a fifth embodiment of the present disclosure.
[0011] FIG. 6 shows the schematic diagram of an electronic device
according to a sixth embodiment of the present disclosure.
[0012] FIG. 7A shows the schematic diagram of an electronic device
according to a seventh embodiment of the present disclosure.
[0013] FIG. 7B shows the schematic diagram of an electronic device
according to an eighth embodiment of the present disclosure.
[0014] FIG. 8A shows the schematic diagram of an electronic device
according to a ninth embodiment of the present disclosure.
[0015] FIG. 8B shows the schematic diagram of an electronic device
according to a tenth embodiment of the present disclosure.
[0016] FIG. 9 shows the schematic diagram of an electronic device
according to an eleventh embodiment of the present disclosure.
[0017] FIG. 10A and FIG. 10B show the schematic diagrams of an
electronic device according to a twelfth embodiment of the present
disclosure, wherein FIG. 10A represents a top view of an electronic
device, and FIG. 10B represents a cross-sectional view of the
electronic device.
DETAILED DESCRIPTION
[0018] The present disclosure may be understood by reference to the
following detailed description, taken in conjunction with the
drawings as described below. It is noted that, for purposes of
illustrative clarity and being easily understood by the readers,
various drawings of this disclosure show a portion of the touch
display device, and certain elements in various drawings may not be
drawn to scale. In addition, the number and dimension of each
device shown in drawings are only illustrative and are not intended
to limit the scope of the present disclosure.
[0019] Certain terms are used throughout the description and
following claims to refer to particular components. As one skilled
in the art will understand, electronic equipment manufacturers may
refer to a component by different names. This document does not
intend to distinguish between components that differ in name but
not function. In the following description and in the claims, the
terms "include", "comprise" and "have" are used in an open-ended
fashion, and thus should be interpreted to mean "include, but not
limited to . . . ".
[0020] It will be understood that when an element or layer is
referred to as being "on" or "connected to" another element or
layer, it can be directly on or directly connected to the other
element or layer, or intervening elements or layers may be
presented. In contrast, when an element is referred to as being
"directly on" or "directly connected to" another element or layer,
there are no intervening elements or layers presented.
[0021] It should be noted that the technical features in different
embodiments described in the following can be replaced, recombined,
or mixed with one another to constitute another embodiment without
departing from the spirit of the present disclosure.
[0022] FIG. 1A and FIG. 1B show the basic structure of an
electronic device 1 of the first embodiment in the present
disclosure. In the present disclosure, an electronic device 1 is
used to combine with other electronic devices to constitute a
larger area of electronic apparatus for example, the electronic
device comprise a display device, antenna device, sensor device, or
combination thereto. In some embodiments, each of the electronic
devices 1 may have the same structure, and thus can be fabricated
by the same process, thereby achieving the advantage of simplifying
the process. In one embodiment, the shapes of the electronic
devices could be similar or different, and the shape of the
electronic device could be in a rectangular, circle, polygon or
free shape, when viewed in a top view of the electronic device 1.
However, the disclosure is not limited thereto.
[0023] FIG. 1A represents a cross-sectional view of the electronic
device 1, and FIG. 1B represents a top view of the electronic
device 1. As shown in FIG. 1A, an electronic device 1 of the
present disclosure comprises a supporting substrate 10 and a
flexible substrate 12 disposed on the supporting substrate 10. In
the present disclosure, the flexible substrate 12 has a larger area
than the supporting substrate 10, so the flexible substrate 12
extends beyond at least two edges E1/E2 of the supporting substrate
10. More precisely, as shown in FIG. 1B, two regions are defined on
the flexible substrate 12: a first extension region 13 and a second
extension region 14, which extend beyond outwardly from a first
edge E1 of the supporting substrate 10 and a second edge E2 of the
supporting substrate 10 respectively, wherein the first edge E1 is
opposite to the second edge E2. In some embodiments, when viewed in
a top view (FIG. 1B) the first extension region 13 and the second
extension region 14 are in rectangular shapes, but not limited
thereto. In some embodiments, an area of the first extension region
13 is different from an area of the second extension region 14. In
another embodiment, the area of the first extension region 13 could
be larger than the area of the second extension region 14, but not
limited thereto. In some embodiments of the present disclosure, an
extension length L1 of the first extension region 13 is different
from an extension length L2 of the second extension region 14.
Besides, in this embodiment, a width W1 of the first extension
region 13 is substantially equal to a width W2 of the second
extension region 14 and a width W of the supporting substrate 10.
However, the present disclosure is not limited thereto, and in
another embodiment, the width W1 of the first extension region 13
may be different from the width W2 of the second extension region
14 or the width W of the supporting substrate 10 (the first edge E1
or the second edge E2).
[0024] The supporting substrate 10 may include rigid substrate or
flexible substrate. The material of the rigid supporting substrate
10 may include glass, and the material of the flexible supporting
substrate 10 may include glass, polyethylene terephthalate (PET),
polycarbonate (PC), polyethylene naphthalate (PEN), triacetate
(TAC), phenolic cotton paper, woven glass, epoxy resin, aluminum
nitride, silicon carbide or combinations thereof. The flexible
substrate 12 may include glass having thinner thickness, copper
foil, polyimide (PI), polycarbonate (PC), polyethylene naphthalate
(PEN), triacetate (TAC), epoxy resin or combinations thereof.
However, the present disclosure is not limited thereto, other
suitable materials may be used as the materials of the supporting
substrate 10 or the flexible substrate 12.
[0025] On the flexible substrate 12, a conductive pattern layer 16
and a protection layer 17 are formed, and a plurality of electronic
units 18 are disposed on the flexible substrate 12 within a display
region 19. The display region 19 is an area on the flexible
substrate 12 that at least partially overlaps with the supporting
substrate 10. In this embodiment, the display region 19 is an area
other than the first extension region 13 and the second extension
region 14 on the flexible substrate 12. In other words, the
electronic units 18 disposed on the flexible substrate 12 excluding
the first extension region 13 and the second extension region 14.
In one embodiment, when the first extension region 13 or the second
extension region 14 of the flexible substrate 12 has display
function, the electronic units 18 may also disposed on the first
extension region 13 or the second extension region 14 of the
flexible substrate 12 extension region 13 extension region 14 (not
drawing in FIG. 1A). The electronic units 18 may include light
emitting diodes (LEDs), antenna units, sensor units, or other
components such as display driver circuitry, one or more batteries,
sensors, microphones, speakers, integrated circuits,
microprocessors, power management units, radio-frequency
transceiver circuitry, baseband processor circuitry, discrete
components such as capacitors, resistors, and inductors, switches,
vibrators, connectors, printed circuit boards, wires, transmission
lines, and other electrical devices or combinations thereof, but
the present disclosure is not limited thereto. In some embodiment,
when the electronic units 18 is LED, the LED could be an organic
LED or inorganic LED (such as quantum-dot LED, Mini-LED, or
Micro-LED), and a type of LED could be a vertical type or flip-chip
type, however, the disclosure is not limited thereto. In some
embodiments, if the electronic units 18 is antenna units, the
antenna unit could be a Radio Frequency Identification (RFID)
antenna unit, a Near-field communication (NFC) antenna unit, a WiFi
antenna unit, a Bluetooth antenna unit, a phased array antenna
unit, or combinations thereof, but the present disclosure is not
limited thereto
[0026] Although the FIG. 1A shows each of the pitches 28 of the
electronic units 18 are substantially the same, but at least part
of the electronic units 18 also could be designed to have different
pitches 28 from each other (not drawing in FIG. 1A), for example,
the electronic units 18 closing to the first edge E1 or the second
edge E2 are different from other electronic units 18 closing to a
central position of supporting substrate 10, when an electronic
device 1 is tiled to another electronic device 1 for getting a
better display performance. The pitch 28 is defined as a distance
between an edge of an electronic unit 18-1 and an edge of another
electronic unit 18-2 closest to the electronic unit 18-1 along
X-axis direction as shown in FIG. 1A.
[0027] The electronic units 18 are disposed on the flexible
substrate 12 (the electronic units 18 can be formed on the flexible
substrate 12 such as by wire bonding method or flip-chip method, or
they can be connected together by magnetic force), and the
electronic units 18 can be respectively electrically connected to
the conductive pattern layer 16. In one embodiment, firstly, the
electronic units 18 can be electrically connected to each other,
and then electrically connected to the conductive pattern layer 16.
The material of the conductive pattern layer 16 may include metal
or transparent conductive material. Examples of the metal material
include Mg, Al, Ag, W, Cu, Ni, Cr, or an alloy thereof. Examples of
the transparent conductive material include indium tin oxide (ITO)
, indium zinc oxide (IZO), zinc oxide, or indium oxide. And the
protection layer 17 can be used for protecting the conductive
pattern layer 16 to avoid oxidation or damage, the protection layer
17 may include insulating materials, such as silicon oxide, silicon
nitride, polyimide, epoxy resin or other suitable materials.
[0028] Furthermore, an external driving circuit 20 may be disposed
in the first extension region 13 of the flexible substrate 12. In
this embodiment, the external driving circuit 20 may include an
integrated circuit (IC) 26 formed on a FPC (flexible printed
circuit) 24, and electrically connected to the conductive pattern
layer 16 by an anisotropic conductive film (ACF) 22. In one
embodiment, the "dispose in" is defined as the external driving
circuit 20 overlaps the first extension region 13, when viewed in
viewed in a top view (Z-axis direction). The external driving
circuit 20 is used to control the electronic units 18. For example,
if the electronic units 18 include a light emitting diode, the
external driving circuit 20 can be used to control whether the
electronic units 18 are illuminating or not. Similarly, when the
electronic units 18 include other components, the external driving
circuit 20 can perform similar functions.
[0029] In this embodiment, FIG. 2 shows that two electronic devices
are provided, they are labeled as an electronic device 1A and an
electronic device 1B respectively. Specifically, at least one of
the first extension region 13 and the second extension region 14 of
the electronic device 1A is used for tiling another electronic
device 1B. It should be noted that the electronic device 1A and the
electronic device 1B described herein each include the same
components as the above electronic device 1 shown in FIG. 1, at
least including the first extension region 13, the second extension
region 14, the conductive pattern layer 16, the protection layer
17, the electronic units 18, the external driving circuit 20 and
other components. To simplify the illustration, some components are
not labeled in FIG. 2. However, the structures and functions of the
components can be referred to the first embodiment described
above.
[0030] Referring to FIG. 2, which shows the schematic diagram of an
electronic device 1 according to a second embodiment of the present
disclosure, the structure is formed by tiling at least two
electronic devices 1 described in FIG. 1 above. It is worth noting
that in some embodiments of the present disclosure, in order to
reduce the border region of the electronic device 1, the external
driving circuit 20 disposed on the first extension region 13 of the
flexible substrate 12 maybe selectively bent to the back side of
the supporting substrate 10, the border region of the electronic
device 1 mentioned here is defined as the area of the flexible
substrate 12 that is not overlapping with the supporting substrate
10, for example, as shown in FIG. 1B above, a border region 21
includes a border region 21a and a border region 21b. As shown in
FIG. 2, when viewed in a cross-sectional view, the supporting
substrate 10 includes a front side 10A and a back side 10B disposed
opposite to the front side 10A. The electronic units 18 described
above are formed on the front side 10A of the supporting substrate
10, the first extension region 13 is partially disposed on the back
side 10B, and the external driving circuit 20 is formed in the
first extension region 13 of the flexible substrate 12. In other
words, the external driving circuit 20 is formed on the back side
10B of the supporting substrate 10, so that the external driving
circuit 20 will not occupy an area of the front side 10A of the
supporting substrate 10, and the front side 10A of the supporting
substrate 10 can accommodate more electronic units 18.
[0031] In this embodiment, the first extension region 13 of the
electronic device 1A is tiled with the second extension region 14
of the electronic device 1B through a coupling member 30. In other
words, the coupling member 30 is used for tiling another electronic
device 1A/1B. The coupling member 30 may include a conductive or
non-conductive adhesive, such as a glue layer or the ACF mentioned
above. Besides, in this embodiment, the second extension region 14
of the electronic device 1A or the first extension region 13 of the
electronic device 1B may be further tiled with other electronic
devices. It should be noting that if the first extension region 13
or second extension region 14 of an electronic device 1A/1B is at
the outermost boundary and will not tiled with other electronic
devices, such as the second extension region 14 of the electronic
device 1A, in this situation, the second extension region 14 of the
electronic device 1A can be bent to the back side 10B of the
supporting substrate 10 (as shown in FIG. 2) to avoid the second
extension region 14 of the electronic device 1A from contacting
other components or get a narrow border region of the electronic
device 1A.
[0032] In addition, the electronic device 1A and an electronic
device 1B mentioned above are tiled to each other along a first
direction (such as the X-axis shown in FIG. 2), but the present
disclosure is not limited to tile along only one direction, the
electronic devices may be tiled to each other along other
directions (such as along the Y-direction shown in FIG. 2). It
should also be within the scope of the present disclosure.
[0033] Except for the features mentioned above, the other
components, material properties, and manufacturing method of this
embodiment are similar to the first embodiment detailed above and
will not be redundantly described. In addition, the embodiments
mentioned below also follow this rule, except for the differences
that are specifically mentioned, the other features are the same as
those described in the above first embodiment.
[0034] Referring to FIG. 3, which shows the schematic diagram of an
electronic device according to a third embodiment of the present
disclosure. In this embodiment, the second extension region 14 of
the electronic device 1A is tiled with the second extension region
14 of the electronic device 1B through the coupling member 30, and
the coupling member 30 disposed between a back side 12B of the
flexible substrate 12 of the electronic device 1A and a front side
12A of the flexible substrate 12 of the electronic device 1B along
Z-axis direction.
[0035] Referring to FIG. 4, which shows the schematic diagram of an
electronic device according to a fourth embodiment of the present
disclosure. In this embodiment, the first extension region 13 of
the electronic device 1A is tiled with the first extension region
13 of the electronic device 1B through the coupling member 30, and
the coupling member 30 disposed between a front side 12A of the
flexible substrate 12 of the electronic device 1A and a front side
12A of the flexible substrate 12 of the electronic device 1B. In
another embodiment, the coupling member 30 can be disposed between
a protection layer 17 of the electronic device 1A and a protection
layer 17 of the electronic device 1B along X-axis direction. In
addition, the coupling member 30 contacts the protection layer 17
of the electronic device 1A and the protection layer 17 of the
electronic device 1B directly.
[0036] Referring to FIG. 5, which shows the schematic diagram of an
electronic device according to a fifth embodiment of the present
disclosure. This embodiment is similar to the third embodiment
mentioned above, but compared with the third embodiment mentioned
above, in this embodiment, the electronic units 18 are divided into
a plurality of groups, each group containing a specific number of
electronic units 18, and the electronic units 18 are previously
formed on a plurality of substrates 31, and the substrates 31
containing a plurality of electronic units 18 are then disposed on
the flexible substrate 12 in the following steps.
[0037] By the method described in this embodiment, a plurality of
substrates 31 including electronic units 18 can be completed in a
process, or can be formed in some batch steps, since the substrate
31 has a larger area, so that the difficulty of the process can be
reduced while the substrates 31 are disposed on the flexible
substrate 12. The differences between this embodiment and the third
embodiment mentioned above is that the embodiment further comprises
a plurality of substrates 31 having the electronic units 18
disposed thereon. Besides, the coupling member 30 of this
embodiment is disposed between a front side 17A of a protection
layer 17 of the electronic device 1A and a back side 12B of the
flexible substrate 12 of the electronic device 1B along the Z-axis.
However, the present disclosure is not limited thereto, and the
position of the coupling member 30 can be adjusted according to
actual requirements.
[0038] In this embodiment, the electronic device 1A and the
electronic device 1B are tiled in the same manner as described in
FIG. 2 above, but the present disclosure is not limited thereto,
and the electronic devices may also be tiled according to the
tiling manner described in other embodiments (for example, FIGS.
2-4 or other tiling structures mentioned in the following
paragraphs).
[0039] Referring to FIG. 6, which shows the schematic diagram of an
electronic device according to a sixth embodiment of the present
disclosure. This embodiment is similar to the third embodiment and
the fifth embodiment mentioned above, but compared with the third
embodiment and the fifth embodiment mentioned above, in this
embodiment, the coupling member 30 is made of conductive materials,
and the conductive pattern layer 16 of the electronic device 1A and
the conductive pattern layer 16 of the electronic device 1B are
electrically connected to the conductive coupling member 30
respectively. In other words, the conductive pattern layer 16 of
the electronic device 1A is electrically connected to the
conductive pattern layer 16 of the electronic device 1B through the
coupling member 30.
[0040] In this embodiment, take the electronic device 1A and the
electronic device 1B as examples, since the conductive pattern
layer 16 of the electronic device 1A is electrically connected to
the conductive pattern layer 16 of the electronic device 1B, so
only one external driving circuit 20 can control the electronic
units 18 on the electronic device 1A and the electronic units 18 on
the electronic device 1B simultaneously. In other words, another
external driving circuit 20 can be omitted in this embodiment, to
achieve cost savings. Or in another case, the external driving
circuit 20 can still be reserved for use as a spare external
driving circuit. It should also be within the scope of the present
disclosure.
[0041] In this embodiment, the electronic device 1A and the
electronic device 1B are tiled in the same manner as described in
FIG. 2 above, but the present disclosure is not limited thereto,
and the electronic devices may also be tiled according to the
tiling manner described in other embodiments (for example, or other
tiling structures mentioned in the following paragraphs).
[0042] The embodiments of the present disclosure described in the
following paragraphs mainly focus on adjusting the shape of the
flexible substrate, and the different shapes of the flexible
substrate have different tiling structures. It is worth noting that
FIG. 7 to FIG. 9 are shown in the top view. For the sake of
simplicity, the components except the supporting substrate 10 and
the flexible substrate are omitted, the material features and
manufacturing methods of the remaining components are the same as
those of the other embodiments described above, and are not
described again.
[0043] Referring to FIG. 7A, which shows the schematic diagram of
an electronic device 1 according to a seventh embodiment of the
present disclosure. As shown in FIG. 7A, a flexible substrate 12A
is formed and at least partially overlaps the supporting substrate
10 when viewed in a top view. However, FIG. 7A shows that the width
W1 of the first extension region 13 and the width W2 of the second
extension region 14 are substantially the same, and smaller than
the width W of the supporting substrate 10. In one embodiment, an
area of the first extension region 13 is larger than an area of the
second extension region 14, and both of areas of the first
extension region 13 and the second extension region 14 are smaller
than an area of the supporting substrate 10. In this disclosure,
the length L1/L2 or the width W1/W2 of each extension region
(including the first extension region 13 and the second extension
region 14) can be adjusted according to actual requirements.
[0044] Referring to FIG. 7B, which shows the schematic diagram of
an electronic device 1 according to an eighth embodiment of the
present disclosure. As shown in FIG. 7B, a flexible substrate 12B
is formed and at least partially overlaps the supporting substrate
10. However, in this embodiment, the flexible substrate 12B further
comprises a third extension region 15 extends beyond a third edge
E3 of the supporting substrate 10. The third edge E3 is disposed
adjacent to the first edge E1 and the second edge E2, and the first
edge E1 is opposite to the second edge E2 along X-axis direction.
The third extension region 15 can be used to tile with another
electronic device along Y-axis direction. In addition, in another
embodiment of the present disclosure, a fourth extension region
(not shown) may be further formed, disposed opposite to the third
extension edge E3 along Y-axis direction. It should also be within
the scope of the present disclosure.
[0045] Referring to FIG. 8A, which shows the schematic diagram of
an electronic device 1 according to a ninth embodiment of the
present disclosure. As shown in FIG. 8A, a flexible substrate 12C
is formed and at least partially overlaps the supporting substrate
10. However, in this embodiment, the flexible substrate 12C further
comprises at least one corner extension region32C, in this
embodiment, two corner extension regions 32C disposed adjacent to
the third extension region 15 and the first extension region 13,
and disposed adjacent to the third extension region 15 and the
second extension region 14 respectively. In one embodiment, one of
the corner extension regions 32C directly connects the third
extension region 15 and the first extension region 13, and the
other corner extension regions 32C contacts the third extension
region 15 and the second extension region 14 directly. Besides,
both the two corner extension regions 32C are rectangular
patterns.
[0046] Referring to FIG. 8B, which shows the schematic diagram of
an electronic device 1 according to a tenth embodiment of the
present disclosure. As shown in FIG. 8B, a flexible substrate 12D
is formed and at least partially overlaps the supporting substrate
10. However, in this embodiment, the flexible substrate 12D further
comprises at least one corner extension region 32D, in this
embodiment, at least two corner extension regions 32D disposed
adjacent to the third extension region 15 and the first extension
region 13, and disposed adjacent to the third extension region 15
and the second extension region 14 respectively. In one embodiment,
one of the corner extension regions 32D contacts the third
extension region 15 and the first extension region 13 directly, and
the other corner extension regions 32D directly connects the third
extension region 15 and the second extension region 14. Besides,
both the two corner extension regions 32D have at least one curved
hypotenuse (such as the curved hypotenuse 33 shown in FIG. 8B). In
one embodiment of the present disclosure, the corner extension
regions 32D can be a triangle shaped pattern but has an inwardly
curved hypotenuse, and in another embodiment of the present
disclosure, the corner extension regions 32D can be a triangle
shaped pattern but has an outwardly curved hypotenuse.
[0047] Referring to FIG. 9, which shows the schematic diagram of an
electronic device 1 according to an eleventh embodiment of the
present disclosure. As shown in FIG. 9, a flexible substrate 12E is
formed and at least partially overlaps the supporting substrate 10.
However, in this embodiment, the flexible substrate 12E further
comprises at least one corner extension region 32E, in this
embodiment, two corner extension regions 32E disposed adjacent to
the third extension region 15 and the first extension region 13,
and disposed adjacent to the third extension region 15 and the
second extension region 14 respectively. In one embodiment, one of
the corner extension regions 32E contacts the third extension
region 15 and the first extension region 13 directly, and the other
corner extension regions 32E directly connects the third extension
region 15 and the second extension region 14. Besides, both the two
corner extension regions 32 are L-shaped patterns.
[0048] Referring to FIG. 10A and FIG. 10B, which show the schematic
diagrams of an electronic device according to a twelfth embodiment
of the present disclosure. This embodiment shows a schematic
diagram of a plurality of electronic devices tiled into a larger
area electronic apparatus 100, FIG. 10A represents a top view of
the electronic device 100, and FIG. 10b is a cross-sectional view
taken along a section line A-A'. As shown in FIG. 10A, a plurality
of electronic devices 1 are arranged in array and tiled to each
other, each electronic device 1 can be tiled with another
electronic device 1 along different directions (such as the X-axis
direction or the Y-axis direction of FIG. 10B). It should be noted
that the electronic device 1 described in FIG. 10A or FIG. 10B may
be replaced by the electronic devices described in any of the
foregoing embodiments, and the present disclosure is not limited
thereto. Besides, in one embodiment of the present disclosure, a
larger area electronic apparatus is not limited to be tiled with
only one tiling method. In other words, a larger area electronic
apparatus can be tiled by a plurality of electronic devices with
different tiling methods (such as the tiling methods mentioned in
each embodiment above).
[0049] In addition, in this embodiment, corners 41 are defined, and
each corner 41 is disposed between every two adjacent edges of the
flexible substrate 12 of the electronic device 1, and the two
adjacent edges have different extending direction, for example, one
extending direction is along the X-axis direction, and another
extending direction is along the Y-axis direction. The corners 41
of each electronic device 1 are chamfered, therefore, a gap 40 will
be left at the boundary of every four electronic devices 1, or
between the corners of every two adjacent electronic devices, in
other words, at least one gap 40 is between a corner 41 of one
electronic device 1 and a corner 41 of another electronic device 1.
In this embodiment, the gap 40 is defined as the area that is not
covered by the flexible substrate 12. The purpose of leaving the
gap 40 is that after the electronic apparatus is completed, the
electronic apparatus is a flexible device. When the electronic
apparatus is bent, the corners of each electronic device are more
easily contacted with the corners of other adjacent electronic
devices. It may even cause damage to some electronic devices.
Therefore, in this embodiment, the gaps 40 are leaved, and the
issue mentioned above can be prevented. Besides, in this
embodiment, when viewed from a top view, the gap 40 is a cross
pattern, however, the present disclosure is not limited thereto,
and the shape of each gap can be adjusted according to actual
requirements.
[0050] In summary, the feature of the present disclosure is to
provide different electronic device tiling methods to form a larger
area electronic apparatus. The electronic devices may have the same
structure, so that it can be mass-produced, and then the electronic
devices are tiled into a larger electronic apparatus. It has the
advantages of simple process or cost saving.
[0051] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the disclosure. Accordingly, the
above disclosure should be construed as limited only by the metes
and bounds of the appended claims.
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