U.S. patent application number 16/273734 was filed with the patent office on 2020-08-13 for three terminal isolation elements and methods.
This patent application is currently assigned to SANDISK TECHNOLOGIES LLC. The applicant listed for this patent is SANDISK TECHNOLOGIES LLC?. Invention is credited to Abhijit Bandyopadhyay, Brian Le, Christopher J. Petti.
Application Number | 20200258572 16/273734 |
Document ID | 20200258572 / US20200258572 |
Family ID | 1000004986791 |
Filed Date | 2020-08-13 |
Patent Application | download [pdf] |
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United States Patent
Application |
20200258572 |
Kind Code |
A1 |
Bandyopadhyay; Abhijit ; et
al. |
August 13, 2020 |
THREE TERMINAL ISOLATION ELEMENTS AND METHODS
Abstract
A monolithic three-dimensional memory array is provided that
includes a plurality of global bit lines disposed above a
substrate, a plurality of vertically-oriented bit lines disposed
above the global bit lines, a plurality of word lines disposed
above the global bit lines, a plurality of memory cells coupled
between the vertically-oriented bit lines and the word lines, and a
plurality of isolation elements coupled between the
vertically-oriented bit lines and the global bit lines. Each
isolation element includes a vertical thin-film transistor and a
threshold selector device.
Inventors: |
Bandyopadhyay; Abhijit; (San
Jose, CA) ; Petti; Christopher J.; (Mountain View,
CA) ; Le; Brian; (San Jose, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SANDISK TECHNOLOGIES LLC? |
Addison |
TX |
US |
|
|
Assignee: |
SANDISK TECHNOLOGIES LLC
Addison
TX
|
Family ID: |
1000004986791 |
Appl. No.: |
16/273734 |
Filed: |
February 12, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/11551 20130101;
G11C 13/0026 20130101; G11C 7/12 20130101; G11C 13/0028
20130101 |
International
Class: |
G11C 13/00 20060101
G11C013/00; G11C 7/12 20060101 G11C007/12; H01L 27/11551 20060101
H01L027/11551 |
Claims
1. A three-dimensional memory array comprising: a plurality of
global bit lines disposed above a substrate; a plurality of
vertically-oriented bit lines disposed above the global bit lines;
a plurality of word lines disposed above the global bit lines; a
plurality of memory cells coupled between the vertically-oriented
bit lines and the word lines; and a plurality of isolation elements
coupled between the vertically-oriented bit lines and the global
bit lines, each isolation element comprising a vertical thin-film
transistor coupled in series with a threshold selector device.
2. The three-dimensional memory array of claim 1, wherein each
isolation element may be operated as a unipolar or a bipolar
device.
3. The three-dimensional memory array of claim 1, wherein each
isolation element comprises a three-terminal isolation element.
4. (canceled)
5. The three-dimensional memory array of claim 1, wherein the
vertical thin-film transistor is disposed above or below the
threshold selector device.
6. The three-dimensional memory array of claim 1, wherein the
vertical thin-film transistor comprises a floating body
transistor.
7. The three-dimensional memory array of claim 1, wherein the
threshold selector device comprises a bipolar threshold selector
device.
8. The three-dimensional memory array of claim 1, wherein the
threshold selector device comprises a first region and a second
region disposed above the first region.
9. The three-dimensional memory array of claim 8, wherein the first
region comprises a solid electrolyte region, and the second region
comprises an ion source region.
10. The three-dimensional memory array of claim 8, wherein the
threshold selector device further comprises barrier layer disposed
between the first region and the second region.
11. The three-dimensional memory array of claim 8, wherein the
first region comprises silicon, germanium, silicon-germanium,
hafnium oxide, silicon oxide, titanium oxide, tungsten oxide and
zinc oxide.
12. The three-dimensional memory array of claim 8, wherein the
second region comprises one or more of copper, silver, and
nickel.
13. The three-dimensional memory array of claim 1, wherein the
non-volatile memory material comprises a reversible
resistance-switching memory element.
14. The three-dimensional memory array of claim 1, wherein the
non-volatile memory material comprises one or more of a phase
change material, a ferroelectric material, a metal oxide, and a
barrier modulated switching structure.
15. Apparatus comprising: a global bit line disposed above a
substrate; a vertically-oriented bit line disposed above the global
bit line; a plurality of word lines disposed above the global bit
line; a plurality of memory cells coupled between the
vertically-oriented bit line and the word lines; and an isolation
element coupled between the vertically-oriented bit line and the
global bit line, the isolation element comprising a transistor
coupled in series with a bipolar threshold selector device.
16. The apparatus of claim 15, wherein the isolation element
comprises a three-terminal isolation element.
17. The apparatus of claim 15, wherein the transistor is disposed
above or below the bipolar threshold selector device.
18. The apparatus of claim 15, wherein the transistor comprises a
floating body transistor.
19. The apparatus of claim 15, wherein the bipolar threshold
selector device comprises a solid electrolyte region and an ion
source region.
20. A three-dimensional memory array comprising: a plurality of
global bit lines disposed above a substrate; a plurality of
vertically-oriented bit lines disposed above the global bit lines;
a plurality of word lines disposed above the global bit lines; a
plurality of memory cells coupled between the vertically-oriented
bit lines and the word lines; and a plurality of isolation elements
coupled between the vertically-oriented bit lines and the global
bit lines, each isolation element comprising a vertical thin-film
transistor coupled in series with a threshold selector device,
wherein each threshold selector device comprises a solid
electrolyte region, an ion source region, and a barrier layer
disposed between the solid electrolyte region and the ion source
region.
Description
BACKGROUND
[0001] Semiconductor memory is widely used in various electronic
devices such as mobile computing devices, mobile phones,
solid-state drives, digital cameras, personal digital assistants,
medical electronics, servers, and non-mobile computing devices.
Semiconductor memory may include non-volatile memory or volatile
memory. A non-volatile memory device allows information to be
stored or retained even when the non-volatile memory device is not
connected to a source of power (e.g., a battery).
[0002] Examples of non-volatile memory include flash memory (e.g.,
NAND-type and NOR-type flash memory), Electrically Erasable
Programmable Read-Only Memory (EEPROM), ferroelectric memory (e.g.,
FeRAM), magnetoresistive memory (e.g., MRAM), and phase change
memory (e.g., PRAM). In recent years, non-volatile memory devices
have been scaled in order to reduce the cost per bit. However, as
process geometries shrink, many design and process challenges are
presented. These challenges include increased variability in memory
cell I-V characteristics, reduced memory cell sensing currents, and
increased bit line settling times.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] FIG. 1A depicts an embodiment of a memory system and a
host.
[0004] FIG. 1B depicts an embodiment of memory core control
circuits.
[0005] FIG. 1C depicts an embodiment of a memory core.
[0006] FIG. 1D depicts an embodiment of a memory bay.
[0007] FIG. 1E depicts an embodiment of a memory block.
[0008] FIG. 1F depicts another embodiment of a memory bay.
[0009] FIG. 2A depicts another embodiment of a portion of a
monolithic three-dimensional memory array.
[0010] FIG. 2B depicts an embodiment of a portion of a monolithic
three-dimensional memory array that includes a memory material.
[0011] FIGS. 2C1-2C3 depict an embodiment of a portion of a
monolithic three-dimensional memory array.
[0012] FIG. 3A depicts a diagram of an example current versus
voltage characteristic for an example isolation element.
[0013] FIG. 3B depicts an embodiment of an isolation element.
[0014] FIG. 3C depicts an example current-voltage characteristic of
a threshold selector device of the isolation element of FIG.
3B.
[0015] FIG. 3D depicts an example current-voltage characteristic of
the isolation element of FIG. 3B.
[0016] FIG. 3E depicts an embodiment of an isolation element of
FIG. 3B.
[0017] FIG. 3F depicts an embodiment of an isolation element of
FIG. 3B.
[0018] FIG. 3G depicts operating conditions of an isolation element
of FIG. 3B.
[0019] FIG. 4A depicts a cross-point memory cell that includes an
isolation element of FIG. 3B coupled in series with a memory
element.
[0020] FIG. 4B depicts an embodiment of a cross-point memory array
including the memory cell of FIG. 4A.
[0021] FIG. 4C depicts an embodiment of the memory cell of FIG.
4A.
[0022] FIGS. 5A-5C depict various views of an embodiment of a
monolithic three-dimensional memory array.
[0023] FIGS. 6A1-6M3 are cross-sectional views of a portion of a
substrate during an example fabrication of the monolithic
three-dimensional memory array of FIGS. 5A-5C.
DETAILED DESCRIPTION
[0024] Technology is described for memory cells and memory arrays.
In an embodiment, a monolithic three-dimensional memory array is
provided that includes a plurality of global bit lines disposed
above a substrate, a plurality of vertically-oriented bit lines
disposed above the global bit lines, a plurality of word lines
disposed above the global bit lines, a plurality of memory cells
coupled between the vertically-oriented bit lines and the word
lines, and a plurality of isolation elements coupled between the
vertically-oriented bit lines and the global bit lines.
[0025] In another embodiment, a cross-point memory array is
provided that includes two-terminal memory cells placed at the
intersections of a first set of control lines (e.g., word lines)
arranged in a first direction and a second set of control lines
(e.g., bit lines) arranged in a second direction perpendicular to
the first direction. In an embodiment, the two-terminal memory
cells are resistance-switching memory elements that include a
resistance-switching material, such as a phase change material, a
ferroelectric material, or a metal oxide (e.g., nickel oxide or
hafnium oxide). In embodiments, each memory cell includes a
resistance-switching memory element in series with an isolation
element to reduce leakage currents.
[0026] In an embodiment, each isolation element includes a
transistor coupled in series with a threshold selector device. In
an embodiment, the isolation element is a three-terminal device. In
an embodiment, the isolation element is a bi-directional selector
element. In an embodiment, the transistor is a vertical thin-film
transistor. In an embodiment, the transistor is a floating-body
transistor.
[0027] In one embodiment, a storage system may include one or more
two-dimensional arrays of memory cells. The memory cells within a
two-dimensional memory array may form a single layer of memory
cells and may be selected via control lines (e.g., word lines and
bit lines) in the X and Y directions. In another embodiment, a
storage system may include one or more monolithic three-dimensional
memory arrays in which two or more layers of memory cells may be
formed above a single substrate without any intervening
substrates.
[0028] In some cases, a three-dimensional memory array may include
one or more vertical columns of memory cells located above and
orthogonal to a substrate. In one example, a storage system may
include a memory array with vertical bit lines or bit lines that
are arranged orthogonal to a semiconductor substrate. The substrate
may include a silicon substrate. The memory array may include
non-volatile or volatile memory cells. The memory array may include
rewriteable non-volatile memory cells, wherein each memory cell
includes a reversible resistance-switching element without an
isolation element in series with the reversible
resistance-switching element (e.g., no diode in series with the
reversible resistance-switching element).
[0029] In some embodiments, a storage system may include a
non-volatile memory that is monolithically formed in one or more
physical levels of arrays of memory cells having an active area
disposed above a silicon substrate. The non-volatile storage system
may also include circuitry associated with the operation of the
memory cells (e.g., decoders, state machines, page registers, or
control circuitry for controlling the reading or programming of the
memory cells). The circuitry associated with the operation of the
memory cells may be located above the substrate or located within
the substrate.
[0030] In some embodiments, a storage system may include a
monolithic three-dimensional memory array. The monolithic
three-dimensional memory array may include one or more levels of
memory cells. Each memory cell within a first level of the one or
more levels of memory cells may include an active area that is
located above a substrate (e.g., above a single-crystal substrate
or a crystalline silicon substrate). In one example, the active
area may include a semiconductor junction (e.g., a P-N junction).
The active area may include a portion of a source or drain region
of a transistor. In another example, the active area may include a
channel region of a transistor.
[0031] FIG. 1A depicts one embodiment of a memory system 100 and a
host 102. Memory system 100 may include a storage system
interfacing with host 102 (e.g., a mobile computing device). In
some cases, memory system 100 may be embedded within host 102. In
other cases, memory system 100 may include a memory card. As
depicted, memory system 100 includes a memory chip controller 104
and a memory chip 106. Although a single memory chip 106 is
depicted, memory system 100 may include more than one memory chip
(e.g., four, eight or some other number of memory chips). Memory
chip controller 104 may receive data and commands from host 102 and
provide memory chip data to host 102.
[0032] Memory chip controller 104 may include one or more state
machines, page registers, SRAM, and control circuitry for
controlling the operation of memory chip 106. The one or more state
machines, page registers, SRAM, and control circuitry for
controlling the operation of memory chip 106 may be referred to as
managing or control circuits. The managing or control circuits may
facilitate one or more memory array operations, such as forming,
erasing, programming, or reading operations.
[0033] In some embodiments, the managing or control circuits (or a
portion of the managing or control circuits) for facilitating one
or more memory array operations may be integrated within memory
chip 106. Memory chip controller 104 and memory chip 106 may be
arranged on a single integrated circuit. In other embodiments,
memory chip controller 104 and memory chip 106 may be arranged on
different integrated circuits. In some cases, memory chip
controller 104 and memory chip 106 may be integrated on a system
board, logic board, or a PCB.
[0034] Memory chip 106 includes memory core control circuits 108
and a memory core 110. Memory core control circuits 108 may include
logic for controlling the selection of memory blocks (or arrays)
within memory core 110, controlling the generation of voltage
references for biasing a particular memory array into a read or
write state, or generating row and column addresses.
[0035] Memory core 110 may include one or more two-dimensional
arrays of memory cells or one or more three-dimensional arrays of
memory cells. In one embodiment, memory core control circuits 108
and memory core 110 are arranged on a single integrated circuit. In
other embodiments, memory core control circuits 108 (or a portion
of memory core control circuits 108) and memory core 110 may be
arranged on different integrated circuits.
[0036] A memory operation may be initiated when host 102 sends
instructions to memory chip controller 104 indicating that host 102
would like to read data from memory system 100 or write data to
memory system 100. In the event of a write (or programming)
operation, host 102 will send to memory chip controller 104 both a
write command and the data to be written. The data to be written
may be buffered by memory chip controller 104 and error correcting
code (ECC) data may be generated corresponding with the data to be
written. The ECC data, which allows data errors that occur during
transmission or storage to be detected and/or corrected, may be
written to memory core 110 or stored in non-volatile memory within
memory chip controller 104. In one embodiment, the ECC data are
generated and data errors are corrected by circuitry within memory
chip controller 104.
[0037] Memory chip controller 104 controls operation of memory chip
106. In one example, before issuing a write operation to memory
chip 106, memory chip controller 104 may check a status register to
make sure that memory chip 106 is able to accept the data to be
written. In another example, before issuing a read operation to
memory chip 106, memory chip controller 104 may pre-read overhead
information associated with the data to be read. The overhead
information may include ECC data associated with the data to be
read or a redirection pointer to a new memory location within
memory chip 106 in which to read the data requested. Once a read or
write operation is initiated by memory chip controller 104, memory
core control circuits 108 may generate the appropriate bias
voltages for word lines and bit lines within memory core 110, and
generate the appropriate memory block, row, and column
addresses.
[0038] In some embodiments, one or more managing or control
circuits may be used for controlling the operation of a memory
array. The one or more managing or control circuits may provide
control signals to a memory array to perform a read operation
and/or a write operation on the memory array. In one example, the
one or more managing or control circuits may include any one of or
a combination of control circuitry, state machine, decoders, sense
amplifiers, read/write circuits, and/or controllers. The one or
more managing circuits may perform or facilitate one or more memory
array operations including erasing, programming, or reading
operations. In one example, one or more managing circuits may
include an on-chip memory controller for determining row and column
address, word line and bit line addresses, memory array enable
signals, and data latching signals.
[0039] FIG. 1B depicts an embodiment of memory core control
circuits 108. As depicted, memory core control circuits 108 include
address decoders 120, voltage generators for selected control lines
122, voltage generators for unselected control lines 124 and signal
generators for reference signals 126 (described in more detail
below). Control lines may include word lines, bit lines, or a
combination of word lines and bit lines. Selected control lines may
include selected word lines and/or selected bit lines that are used
to place memory cells into a selected state. Unselected control
lines may include unselected word lines and/or unselected bit lines
that are used to place memory cells into an unselected state.
[0040] Address decoders 120 may generate memory block addresses, as
well as row addresses and column addresses for a particular memory
block. Voltage generators (or voltage regulators) for selected
control lines 122 may include one or more voltage generators for
generating selected control line voltages. Voltage generators for
unselected control lines 124 may include one or more voltage
generators for generating unselected control line voltages. Signal
generators for reference signals 126 may include one or more
voltage and/or current generators for generating reference voltage
and/or current signals.
[0041] FIGS. 1C-1F depict one embodiment of a memory core
organization that includes a memory core having multiple memory
bays, and each memory bay having multiple memory blocks. Although a
memory core organization is disclosed where memory bays include
memory blocks, and memory blocks include a group of memory cells,
other organizations or groupings also can be used with the
technology described herein.
[0042] FIG. 1C depicts one embodiment of memory core 110 in FIG.
1A. As depicted, memory core 110 includes memory bay 130 and memory
bay 132. In some embodiments, the number of memory bays per memory
core can be different for different implementations. For example, a
memory core may include only a single memory bay or multiple memory
bays (e.g., 16 or other number of memory bays).
[0043] FIG. 1D depicts one embodiment of memory bay 130 in FIG. 1C.
As depicted, memory bay 130 includes memory blocks 140-144 and
read/write circuits 146. In some embodiments, the number of memory
blocks per memory bay may be different for different
implementations. For example, a memory bay may include one or more
memory blocks (e.g., 32 or other number of memory blocks per memory
bay). Read/write circuits 146 include circuitry for reading and
writing memory cells within memory blocks 140-144.
[0044] As depicted, read/write circuits 146 may be shared across
multiple memory blocks within a memory bay. This allows chip area
to be reduced because a single group of read/write circuits 146 may
be used to support multiple memory blocks. However, in some
embodiments, only a single memory block may be electrically coupled
to read/write circuits 146 at a particular time to avoid signal
conflicts.
[0045] In some embodiments, read/write circuits 146 may be used to
write one or more pages of data into memory blocks 140-144 (or into
a subset of the memory blocks). The memory cells within memory
blocks 140-144 may permit direct over-writing of pages (i.e., data
representing a page or a portion of a page may be written into
memory blocks 140-144 without requiring an erase or reset operation
to be performed on the memory cells prior to writing the data).
[0046] In one example, memory system 100 in FIG. 1A may receive a
write command including a target address and a set of data to be
written to the target address. Memory system 100 may perform a
read-before-write (RBW) operation to read the data currently stored
at the target address and/or to acquire overhead information (e.g.,
ECC information) before performing a write operation to write the
set of data to the target address.
[0047] In some cases, read/write circuits 146 may be used to
program a particular memory cell to be in one of three or more
data/resistance states (i.e., the particular memory cell may
include a multi-level memory cell). In one example, read/write
circuits 146 may apply a first voltage difference (e.g., 2V) across
the particular memory cell to program the particular memory cell
into a first state of the three or more data/resistance states or a
second voltage difference (e.g., 1V) across the particular memory
cell that is less than the first voltage difference to program the
particular memory cell into a second state of the three or more
data/resistance states.
[0048] Applying a smaller voltage difference across the particular
memory cell may cause the particular memory cell to be partially
programmed or programmed at a slower rate than when applying a
larger voltage difference. In another example, read/write circuits
146 may apply a first voltage difference across the particular
memory cell for a first time period (e.g., 150 ns) to program the
particular memory cell into a first state of the three or more
data/resistance states or apply the first voltage difference across
the particular memory cell for a second time period less than the
first time period (e.g., 50 ns). One or more programming pulses
followed by a memory cell verification phase may be used to program
the particular memory cell to be in the correct state.
[0049] FIG. 1E depicts one embodiment of memory block 140 in FIG.
1D. As depicted, memory block 140 includes a memory array 150, row
decoder 152, and column decoder 154. Memory array 150 may include a
contiguous group of memory cells having contiguous word lines and
bit lines. Memory array 150 may include one or more layers of
memory cells. Memory array 150 may include volatile memory cells,
non-volatile memory cells, or a combination of volatile memory
cells and non-volatile memory cells. Memory array 150 may include a
two-dimensional memory array or a three-dimensional memory
array.
[0050] Row decoder 152 decodes a row address and selects a
particular word line in memory array 150 when appropriate (e.g.,
when reading or writing memory cells in memory array 150). Column
decoder 154 decodes a column address and selects one or more bit
lines in memory array 150 to be electrically coupled to read/write
circuits, such as read/write circuits 146 in FIG. 1D. In one
embodiment, the number of word lines is 4K per memory layer, the
number of bit lines is 1K per memory layer, and the number of
memory layers is 4, providing a memory array 150 containing 16 L
memory cells.
[0051] FIG. 1F depicts one embodiment of a memory bay 134. Memory
bay 134 is one example of an alternative implementation for memory
bay 130 in FIG. 1D. In some embodiments, row decoders, column
decoders, and read/write circuits may be split or shared between
memory arrays. As depicted, row decoder 152b is shared between
memory arrays 150a and 150b because row decoder 152b controls word
lines in both memory arrays 150a and 150b (i.e., the word lines
driven by row decoder 152b are shared).
[0052] Row decoders 152a and 152b may be split such that even word
lines in memory array 150a are driven by row decoder 152a and odd
word lines in memory array 150a are driven by row decoder 152b. Row
decoders 152c and 152b may be split such that even word lines in
memory array 150b are driven by row decoder 152c and odd word lines
in memory array 150b are driven by row decoder 152b.
[0053] Column decoders 154a and 154b may be split such that even
bit lines in memory array 150a are controlled by column decoder
154b and odd bit lines in memory array 150a are driven by column
decoder 154a. Column decoders 154c and 154d may be split such that
even bit lines in memory array 150b are controlled by column
decoder 154d and odd bit lines in memory array 150b are driven by
column decoder 154c.
[0054] The selected bit lines controlled by column decoder 154a and
column decoder 154c may be electrically coupled to read/write
circuits 146a. The selected bit lines controlled by column decoder
154b and column decoder 154d may be electrically coupled to
read/write circuits 146b. Splitting the read/write circuits into
read/write circuits 146a and 146b when the column decoders are
split may allow for a more efficient layout of the memory bay.
[0055] FIG. 2A depicts an embodiment of a portion of a monolithic
three-dimensional memory array 220 that includes a first memory
level 222, and a second memory level 224 positioned above first
memory level 210. Memory array 220 is one example of an
implementation for memory array 150 of FIG. 1E. Local bit lines
LBL.sub.11-LBL.sub.33 are arranged in a first direction (e.g., a
vertical or z-direction) and word lines WL.sub.10-WL.sub.23 are
arranged in a second direction (e.g., an x-direction) perpendicular
to the first direction. This arrangement of vertical bit lines in a
monolithic three-dimensional memory array is one embodiment of a
vertical bit line memory array.
[0056] As depicted, disposed between the intersection of each local
bit line and each word line is a particular memory cell M.sub.xyz
(e.g., memory cell M.sub.111 is disposed between local bit line
LBL.sub.11 and word line WL.sub.10). Memory cells M.sub.xyz may
include volatile memory cells or non-volatile memory cells. Memory
cells M.sub.xyz may include a floating gate memory element, a
charge trap memory element (e.g., using a silicon nitride
material), a reversible resistance-switching memory element, a
phase change memory element, a ferroelectric memory element, a
magnetoresistive memory element, or other similar device. The
global bit lines GBL.sub.1-GBL.sub.3 are arranged in a third
direction (e.g., a y-direction) that is perpendicular to both the
first direction and the second direction.
[0057] Each local bit line LBL.sub.11-LBL.sub.33 has an associated
isolation element S.sub.11-S.sub.33, respectively. As described in
more detail below, in an embodiment each of isolation elements
S.sub.11-S.sub.33 includes a transistor (e.g., a
vertically-oriented transistor) coupled in series with a threshold
selector device. As depicted, isolation elements S.sub.11,
S.sub.21, S.sub.31 are associated with local bit lines LBL.sub.11,
LBL.sub.21, LBL.sub.31, respectively, and may be used to connect
local bit lines LBL.sub.11, LBL.sub.21, LBL.sub.31 to global bit
lines GBL.sub.1, GBL.sub.2, GBL.sub.3, respectively, using row
select line SG.sub.1. In particular, each of isolation elements
S.sub.11, S.sub.21, S.sub.31 has a first terminal coupled to a
corresponding one of local bit lines LBL.sub.11, LBL.sub.21,
LBL.sub.31, respectively, a second terminal coupled to a
corresponding one of global bit lines GBL.sub.1, GBL.sub.2,
GBL.sub.3, respectively, and a third terminal coupled to row select
line SG.sub.1.
[0058] Similarly, isolation elements S.sub.12, S.sub.22, S.sub.32
are associated with local bit lines LBL.sub.12, LBL.sub.22,
LBL.sub.32, respectively, and may be used to connect local bit
lines LBL.sub.12, LBL.sub.22, LBL.sub.32 to global bit lines
GBL.sub.1, GBL.sub.2, GBL.sub.3, respectively, using row select
line SG.sub.2. In particular, each of isolation elements S.sub.12,
S.sub.22, S.sub.32 has a first terminal coupled to a corresponding
one of local bit lines LBL.sub.12, LBL.sub.22, LBL.sub.32,
respectively, a second terminal coupled to a corresponding one of
global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3, respectively, and
a third terminal coupled to row select line SG.sub.2.
[0059] Likewise, isolation elements S.sub.13, S.sub.23, S.sub.33
are associated with local bit lines LBL.sub.13, LBL.sub.23,
LBL.sub.33, respectively, and may be used to connect local bit
lines LBL.sub.13, LBL.sub.23, LBL.sub.33 to global bit lines
GBL.sub.1, GBL.sub.2, GBL.sub.3, respectively, using row select
line SG.sub.3. In particular, each of isolation elements S.sub.13,
S.sub.23, S.sub.33 has a first terminal coupled to a corresponding
one of local bit lines LBL.sub.13, LBL.sub.23, LBL.sub.33,
respectively, a second terminal coupled to a corresponding one of
global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3, respectively, and
a third terminal coupled to row select line SG.sub.3.
[0060] Because a single isolation element is associated with a
corresponding local bit line, the voltage of a particular global
bit line may be applied to a corresponding local bit line.
Therefore, when a first set of local bit lines (e.g., LBL.sub.11,
LBL.sub.21, LBL.sub.31) is biased to global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3, the other local bit lines (e.g., LBL.sub.12,
LBL.sub.22, LBL.sub.32, LBL.sub.13, LBL.sub.23, LBL.sub.33) must
either also be driven to the same global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3 or be floated.
[0061] In an embodiment, during a memory operation, all local bit
lines within the memory array are first biased to an unselected bit
line voltage by connecting each of the global bit lines to one or
more local bit lines. After the local bit lines are biased to the
unselected bit line voltage, then only a first set of local bit
lines LBL.sub.11, LBL.sub.21, LBL.sub.31 are biased to one or more
selected bit line voltages via the global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3, while the other local bit lines (e.g.,
LBL.sub.12, LBL.sub.22, LBL.sub.32, LBL.sub.13, LBL.sub.23,
LBL.sub.33) are floated. The one or more selected bit line voltages
may correspond with, for example, one or more read voltages during
a read operation or one or more programming voltages during a
programming operation.
[0062] In an embodiment, a vertical bit line memory array, such as
memory array 220, includes a greater number of memory cells along
the word lines as compared with the number of memory cells along
the vertical bit lines (e.g., the number of memory cells along a
word line may be more than 10 times the number of memory cells
along a bit line). In one example, the number of memory cells along
each bit line may be 16 or 32, whereas the number of memory cells
along each word line may be 2048 or more than 4096. Other numbers
of memory cells along each bit line and along each word line may be
used.
[0063] In an embodiment of a read operation, the data stored in a
selected memory cell (e.g., memory cell M.sub.111) may be read by
biasing the word line connected to the selected memory cell (e.g.,
selected word line WL.sub.10) to a selected word line voltage in
read mode (e.g., 0V). The local bit line (e.g., LBL.sub.11) coupled
to the selected memory cell (M.sub.111) is biased to a selected bit
line voltage in read mode (e.g., 1 V) via the associated isolation
element (e.g., S.sub.11) coupled to the selected local bit line
(LBL.sub.11), and the global bit line (e.g., GBL.sub.1) coupled to
the isolation element (S.sub.11). A sense amplifier may then be
coupled to the selected local bit line (LBL.sub.11) to determine a
read current I.sub.READ of the selected memory cell (M.sub.111).
The read current I.sub.READ is conducted by the isolation element
S.sub.11, and may be between about 100 nA and about 500 nA,
although other read currents may be used.
[0064] In an embodiment of a write operation, data may be written
to a selected memory cell (e.g., memory cell M.sub.221) by biasing
the word line connected to the selected memory cell (e.g.,
WL.sub.20) to a selected word line voltage in write mode (e.g.,
5V). The local bit line (e.g., LBL.sub.21) coupled to the selected
memory cell (M.sub.221) is biased to a selected bit line voltage in
write mode (e.g., 0 V) via the associated isolation element (e.g.,
S.sub.21) coupled to the selected local bit line (LBL.sub.21), and
the global bit line (e.g., GBL.sub.2) coupled to the isolation
element (S.sub.21). During a write operation, a programming current
I.sub.PGRM is conducted by the associated isolation element
S.sub.21, and may be between about 3 uA and about 6 uA, although
other programming currents may be used.
[0065] FIG. 2B depicts an embodiment of a portion of a monolithic
three-dimensional memory array 230 that includes a memory material.
The portion of monolithic three-dimensional memory array 230
depicted in FIG. 2B may include an implementation for a portion of
the monolithic three-dimensional memory array 220 depicted in FIG.
2A2.
[0066] Monolithic three-dimensional memory array 230 includes word
lines WL.sub.10, WL.sub.11, WL.sub.12, . . . , WL.sub.42 that are
formed in a first direction (e.g., an x-direction), vertical bit
lines LBL.sub.11, LBL.sub.12, LBL.sub.13, . . . , LBL.sub.33 that
are formed in a second direction perpendicular to the first
direction (e.g., a z-direction), and memory material 232 formed in
the second direction (e.g., the z-direction). A spacer 234 made of
a dielectric material (e.g., silicon dioxide, silicon nitride, or
other dielectric material) is disposed between adjacent word lines
WL.sub.10, WL.sub.11, WL.sub.12, . . . , WL.sub.42.
[0067] In an embodiment, memory material 232 is a non-volatile
memory material, for example, an oxide material, a reversible
resistance-switching memory material (e.g., one or more metal oxide
layers such as nickel oxide, hafnium oxide, or other similar metal
oxide materials, a phase change material, a barrier modulated
switching structure or other similar reversible
resistance-switching memory material), a ferroelectric material, or
a charge trapping material (e.g., a layer of silicon nitride). In
an embodiment, memory material 232 may include a single continuous
layer of material that may be used by a plurality of memory cells
or devices.
[0068] In an embodiment, portions of memory material 232 may
include a part of a first memory cell associated with the cross
section between WL.sub.12 and LBL.sub.13 and a part of a second
memory cell associated with the cross section between WL.sub.22 and
LBL.sub.13. In some cases, a vertical bit line, such as LBL.sub.13,
may include a vertical structure (e.g., a rectangular prism, a
cylinder, or a pillar) and the memory material may completely or
partially surround the vertical structure (e.g., a conformal layer
of phase change material surrounding the sides of the vertical
structure).
[0069] As depicted, each of the vertical bit lines LBL.sub.11,
LBL.sub.12, LBL.sub.13, . . . , LBL.sub.33 may be connected to one
of a set of global bit lines via an associated isolation element
(e.g., S.sub.11, S.sub.12, S.sub.13, S.sub.23). As describe in more
detail below, in an embodiment each isolation element (e.g.,
S.sub.11, S.sub.12, S.sub.13, S.sub.23) includes a transistor
coupled in series with a threshold selector device. In an
embodiment, each isolation element (e.g., S.sub.11, S.sub.12,
S.sub.13, S.sub.23) includes a vertical thin-film transistor (TFT)
coupled in series with a threshold selector device, and is coupled
between an associated local bit line pillar and a global bit line.
In an embodiment, the isolation elements are formed in a pillar
select layer formed above a CMOS substrate, and a memory layer that
includes multiple layers of word lines and memory elements is
formed above the pillar select layer.
[0070] FIGS. 2C1-2C3 depict an embodiment of a portion of a
monolithic three-dimensional memory array 240 that includes a first
memory level 242, a second memory level 244 positioned above first
memory level 242, a third memory level 246 positioned above second
memory level 244, and a fourth memory level 248 positioned above
third memory level 246. Memory array 240 is one example of an
implementation for memory array 150 of FIG. 1E.
[0071] As depicted, disposed between the intersection of each local
bit line and each word line is a particular memory cell
M.sub.111-M.sub.436. For example, memory cell M.sub.111 is disposed
between local bit line LBL.sub.11 and word line WL.sub.10, memory
cell M.sub.225 is disposed between local bit line LBL.sub.23 and
word line WL.sub.22, and memory cell M.sub.433 is disposed between
local bit line LBL.sub.32 and word line WL.sub.41. In an
embodiment, each memory cell M.sub.111-M.sub.436 includes a
reversible resistance-switching memory element.
[0072] As described above, in an embodiment each of isolation
elements S.sub.11-S.sub.33 includes a transistor (e.g., a vertical
transistor) coupled in series with a threshold selector device. In
an embodiment, each of isolation elements S.sub.11-S.sub.33
exhibits an ON-state current density of greater than about 1-5
MA/cm.sup.2, an OFF-state leakage current of less than about 0.1-1
nA @ 1V, and an ON/OFF current ratio of greater than about
10.sup.4. In addition, in an embodiment, each of isolation elements
S.sub.11-S.sub.33 exhibits bipolar operation, such as depicted in
the current versus voltage diagram depicted in FIG. 3A.
[0073] FIG. 3B is a circuit diagram of an isolation element 300.
Isolation element 300 is one example of an implementation for
isolation elements S.sub.11-S.sub.33 of FIGS. 2A-2C3. In an
embodiment, isolation element 300 includes a transistor 302
(V.sub.TFT 302) coupled in series with a threshold selector device
304. In embodiments, threshold selector device 304 may be
positioned above or below V.sub.TFT 302.
[0074] Isolation element 300 is a three-terminal isolation element,
having a first terminal T1, a second terminal T2 and a third
terminal T3. In an embodiment, V.sub.TFT 302 is a vertical
transistor that includes a drain terminal 306, a source terminal
308 and a gate terminal 310. In an embodiment, V.sub.TFT 302 does
not include a body terminal, and is sometimes referred to as a
floating body transistor. Persons of ordinary skill in the art will
understand that the positions of drain terminal 306 and source
terminal 308 may be interchanged.
[0075] In an embodiment, threshold selector device 304 includes a
first node N1 coupled to source terminal 308 and a second node N2.
In an embodiment, first terminal T1 of isolation element 300 is
second node N2 of threshold selector device 304, second terminal T2
of isolation element 300 is drain terminal 306 of V.sub.TFT 302,
and third terminal T3 of isolation element 300 is gate terminal 310
of V.sub.TFT 302. Persons of ordinary skill in the art will
understand that the drain terminal 306, gate terminal 310 and
second node N2 may be assigned any combination of first terminal
T1, second terminal T2 and third terminal T3 designations.
[0076] In an embodiment, threshold selector device 304 is a
conductive bridge threshold selector device. In other embodiments,
threshold selector device 304 may be an ovonic threshold switch
(e.g., binary SiTe, CTe, BTe, AlTe, etc., or the ternary type
AsTeSi, AsTeGe or AsTeGeSiN, etc.), a Metal Insulator Transition
(MIT) of a Phase Transition Material type (e.g., VO.sub.2,
NbO.sub.2 etc.), or other similar threshold selector device.
[0077] FIG. 3C is a diagram depicting example current-voltage (I-V)
characteristics of a volatile conductive bridge threshold selector
device 304. Each threshold selector device 304 is initially in a
high resistance (OFF) state. To operate threshold selector device
304 as a threshold switch, an initial forming step may be necessary
so that threshold selector device 304 operates in a current range
in which switching can occur. Following forming, threshold selector
device 304 may be switched ON and OFF, and may be used as either a
unipolar or a bipolar threshold selector device. Accordingly,
threshold selector device 304 may be referred to as a bipolar
threshold selector device.
[0078] In the example I-V characteristics of FIG. 3C, for positive
applied voltages, threshold selector device 304 remains in a high
resistance state (HRS) (e.g., OFF) until the voltage across the
device meets or exceeds a first threshold voltage, V.sub.TP, at
which point threshold selector device 304 switches to a low
resistance state (LRS) (e.g., ON). Threshold selector device 304
remains turned ON until the voltage across the device drops to or
below a first hold voltage, V.sub.HP, at which point threshold
selector device 304 turns OFF.
[0079] For negative applied voltages, threshold selector device 304
remains in a HRS (e.g., OFF) until the voltage across the device
meets or exceeds a second threshold voltage, V.sub.TN, at which
point threshold selector device 304 switches to a LRS (e.g., ON).
Threshold selector device 304 remains turned ON until the voltage
across the device increases to or exceeds a second hold voltage,
V.sub.HN, at which point threshold selector device 304 turns
OFF.
[0080] Referring again to FIG. 3B, isolation element 300 includes
V.sub.TFT 302 coupled in series with threshold selector device 304.
FIG. 3D is a diagram depicting example (ideal) current-voltage
(I-V) characteristics for isolation element 300 of FIG. 3B (e.g.,
following a forming operation). As depicted in FIG. 3D, isolation
element 300 may be operated as a unipolar or a bipolar device. In
either polarity, isolation element 300 switches between a HRS
(e.g., OFF) and a LRS (e.g., ON).
[0081] Without wanting to be bound by any particular theory, it is
believed that when threshold selector device 304 is in a HRS (e.g.,
OFF), the gate-to-source voltage across V.sub.TFT 302 is reduced
exponentially, reducing the off-current (e.g., by about two orders
of magnitude) of V.sub.TFT 302. In addition, without wanting to be
bound by any particular theory, it is believed that as the
gate-to-source voltage across V.sub.TFT 302 increases, additional
channel current flows, until the voltage across the device meets or
exceeds second threshold voltage, V.sub.TN, at which point
threshold selector device 304 switches to a LRS (e.g., ON).
[0082] Without wanting to be bound by any particular theory, it is
believed that isolation element 300 may have a high ratio of
ON-current (I.sub.ON) to OFF-current (I.sub.OFF) (e.g., greater
than 10.sup.4) and a low I.sub.OFF current (e.g., pA or lower). For
example, in the illustrated example, isolation element 300 has an
I.sub.ON of about 10 .mu.A and the OFF-current (I.sub.OFF) is about
1 pA. Persons of ordinary skill in the art will understand that
other I.sub.ON and I.sub.OFF values may be used.
[0083] Without wanting to be bound by any particular theory, it is
believed that isolation element 300 may be operated as a
gate-controlled bi-directional selector device. That is, gate
terminal 310 of V.sub.TFT 302 may be used to control the current of
threshold selector device 304. In particular, V.sub.TFT 302 may be
used to reduce high current parasitic stress for the threshold
selector device 304, and may thereby improve the endurance of
isolation element 300.
[0084] Isolation element 300 is one example of an implementation
for isolation elements S.sub.11-S.sub.33 of monolithic
three-dimensional memory array 200 of FIG. 2A, isolation elements
S.sub.11-S.sub.23 of monolithic three-dimensional memory array 202
of FIG. 2B, and isolation elements S.sub.11-S.sub.33 of FIG.
2C1-2C3. In such implementations, the reduced off-current I.sub.OFF
of isolation element 300 may reduce gate-induced drain leakage in
vertical bit line memory array architectures.
[0085] FIG. 3E is a perspective view of an embodiment of an
isolation element 300a, which is an example implementation of
isolation element 300 of FIG. 3B. Isolation element 300a includes a
V.sub.TFT 302a coupled in series with a threshold selector device
304a. V.sub.TFT 302a is an example implementation of V.sub.TFT 302
of FIG. 3B, and threshold selector device 304a is an example
implementation of threshold selector device 304 of FIG. 3B. In
embodiments, threshold selector device 304a may be positioned above
or below V.sub.TFT 302 a.
[0086] V.sub.TFT 302a includes a drain region 306a, a body region
312 disposed above drain region 306a, a source region 308a disposed
above body region 312, and a gate region 310a disposed on opposite
sides of body region 312. Persons of ordinary skill in the art will
understand that the positions of drain region 306a and source
region 308a may be interchanged. In an embodiment, body region 312
is not coupled to any bias potential, but instead floats. In this
regard, V.sub.TFT 302a is sometimes referred to as a floating body
transistor.
[0087] Threshold selector device 304a includes a first region 314
and a second region 316 disposed above first region 314. In an
embodiment, first region 314 is a solid electrolyte region, and
second region 316 is an ion source region. In an embodiment, first
terminal T1 of isolation element 300a is second region 316 of
threshold selector device 304a, second terminal T2 of isolation
element 300a is drain region 306a of V.sub.TFT 302a, and third
terminal T3 of isolation element 300a is gate region 310a of
V.sub.TFT 302 a.
[0088] In embodiments, first region 314 may be one or more of
silicon, germanium, Si.sub.xGe.sub.1-x or other similar
semiconductor materials or low density oxides such as hafnium oxide
(HfO.sub.2), silicon oxide (SiO.sub.x), titanium oxide (TiO.sub.2),
tungsten oxide (WO), zinc oxide ZnO or other similar low density
oxides. In embodiments, first region 314 may be a doped or an
undoped semiconductor material, and may be amorphous or
polycrystalline. In embodiments, second region 316 may be one or
more of Cu, silver (Ag), nickel (Ni) or other metal.
[0089] In an embodiment, first region 314 is hafnium oxide (e.g.,
low temperature titanium-laminated hafnium oxide or Hf/HfO.sub.2),
and second region 316 is nickel. In an embodiment, first region 314
is amorphous silicon-germanium (.alpha.-Si.sub.xGe.sub.1-x), and
can be deposited by low pressure chemical vapor deposition (LPCVD),
plasma-enhanced chemical vapor deposition (PECVD), physical vapor
deposition (PVD) (e.g., sputtering), or other process. Amorphous
silicon (.alpha.-Si) is a non-crystalline form of silicon in which
the silicon atoms form a continuous random network. In an
embodiment, first region 314 may be polycrystalline
silicon-germanium. In an embodiment, first region 314 is
silicon-germanium (Si.sub.xGe.sub.1-x, with x between about 0.3 to
about 0.7), with a thickness of between about 5 nm and about 20 nm,
and second region 316 is Ag or Cu, with a thickness of between
about 10 nm and about 100 nm. In other embodiments, various
combinations of materials may be used for first region 314 and
second region 316. In embodiments in which second region 316 is Ag,
a thin (e.g., 1-2 nm) layer of Al.sub.2O.sub.3 on top of Ag may be
used to improve the thermal stability of Ag.
[0090] In embodiments, first region 314 has a thickness t1 that may
be used to control a magnitude of first threshold voltage V.sub.TP
and second threshold voltage V.sub.TN of threshold selector device
304a. In embodiments, the magnitude of first threshold voltage
V.sub.TP and second threshold voltage V.sub.TN is proportional to
thickness t1. Thus, decreasing thickness t1 decreases a magnitude
of first threshold voltage V.sub.TP and second threshold voltage
V.sub.TN, whereas increasing thickness t1 decreases a magnitude of
first threshold voltage V.sub.TP and second threshold voltage
V.sub.TN. Persons of ordinary skill in the art will understand that
other parameters may be used to control a magnitude of first
threshold voltage V.sub.TP and second threshold voltage V.sub.TN of
threshold selector device 304a. Note that first threshold voltage
VTN and second threshold voltage VTP may depend on the selector
type. For example, for an ovonic threshold switch type selector
these parameters depend on the material composition, deposition
conditions, etc.
[0091] FIG. 3F is a perspective view of an embodiment of an
isolation element 300b, which is an example implementation of
isolation element 300 of FIG. 3B. Isolation element 300b includes
V.sub.TFT 302a coupled in series with a threshold selector device
304b. Threshold selector device 304b is an example implementation
of threshold selector device 304 of FIG. 3B. In embodiments,
threshold selector device 304b may be positioned above or below
V.sub.TFT 302 a.
[0092] Threshold selector device 304b is similar to threshold
selector device 304a of FIG. 3E, but also includes one or more
barrier layers 318a, 318b and 318c. In an embodiment, a first
barrier layer 318a is disposed between source region 308a of
V.sub.TFT 302a and first region 314, a second barrier layer 318b is
disposed between first region 314 and second region 316, and a
third barrier layer 318c is disposed above second region 316. In
embodiments, threshold selector device 304b need not include all
three barrier layers 318a, 318b and 318c, or may include additional
barrier layers.
[0093] In an embodiment, first terminal T1 of isolation element
300b is third barrier layer 318c of threshold selector device 304b,
second terminal T2 of isolation element 300b is drain region 306a
of V.sub.TFT 302a, and third terminal T3 of isolation element 300b
is gate region 310a of V.sub.TFT 302a.
[0094] In embodiments, each of first barrier layer 318a, second
barrier layer 318b and third barrier layer 318c may be one or more
of TiN, TaN, tungsten nitride (WN), tantalum carbide (TaC),
conductive carbon or other barrier layer material. In embodiments,
each of first barrier layer 318a, second barrier layer 318b and
third barrier layer 318c may be have a thickness of between about 2
nm and about 10 nm, although other thicknesses may be used. In
embodiments, first barrier layer 318a, second barrier layer 318b
and third barrier layer 318c may be the same material and
thickness, or may be different materials and/or thicknesses. In an
embodiment, first barrier layer 318a, second barrier layer 318b and
third barrier layer 318c are each TaN, with a thickness of between
about 1 nm and about 5 nm.
[0095] In embodiments, first region 314 has a thickness t1 that may
be used to control a magnitude of first threshold voltage V.sub.TP
and second threshold voltage V.sub.TN of threshold selector device
304b. In embodiments, the magnitude of first threshold voltage
V.sub.TP and second threshold voltage V.sub.TN is proportional to
thickness t1. Thus, decreasing thickness t1 decreases a magnitude
of first threshold voltage V.sub.TP and second threshold voltage
V.sub.TN, whereas increasing thickness t1 decreases a magnitude of
first threshold voltage V.sub.TP and second threshold voltage
V.sub.TN. Persons of ordinary skill in the art will understand that
other parameters may be used to control a magnitude of first
threshold voltage V.sub.TP and second threshold voltage V.sub.TN of
threshold selector device 304a. As mentioned above, thickness t1
control alone may not show much of a difference in first threshold
voltage V.sub.TN and second threshold voltage V.sub.TP for other
types of selector device, such as ovonic threshold switch type
selectors (primarily composition and crystalline phase dependent)
and MIT (deposition condition, electrode material, temperature
confinement, etc.).
[0096] Without wanting to be bound by any particular theory, it is
believed that second region 316 may function as an active electrode
(ion source), first region 314 may function as an ion conducting
layer (solid electrolyte), second barrier layer 318b may limit ion
movement from second region 316 to first region 314 during
switching and may function as a local resistor to limit capacitive
surge currents during switching.
[0097] In an embodiment, during fabrication of threshold selector
device 304, first region 314 is annealed in H.sub.2 (30-50%) at a
temperature of between about 350.degree. C. and about 450.degree.
C. for between about 30 minutes and about 120 minutes. Other
temperatures and processing times may be used. Without wanting to
be bound by any particular theory, it is believed that annealing
threshold selector device 304 may reduce leakage current of
threshold selector device 304 by reducing the trap levels in
.alpha.-Si.sub.xGe.sub.1-x, for example, from several hundreds of
nano-amps without annealing to tens of nano-amps with annealing.
Other leakage current values may be used. Note that .alpha.-Si and
SiGe can also be deposited by sputter deposition of Si and Ge in an
Ar-- 10-15% H.sub.2 mixture. Persons of ordinary skill in the art
will understand that H.sub.2 reduces the intrinsic dangling defects
existing in .alpha.-Si/Ge film by passivating the defect sites.
This reduces the leakage of the film significantly from lower nA to
lower pA level. For this flow no extra post-H.sub.2 anneal is
necessary. The film deposition is done at room temperature with
about 10-20 mTorr pressure using about 20-150 mW of power.
[0098] In an embodiment, the above-specified anneal may be
performed immediately after silicon deposition. Other anneals such
as an H.sub.2/D.sub.2 high pressure anneal (HPA) (e.g., 9-20 atm/30
min./350 C) also can be employed to achieve similar or better
results. HPA is particularly useful as it is normally done at lower
temperature than furnace anneal and may be employed after the
complete processing of a wafer.
[0099] For simplicity, the remaining description assumes that first
region 314 is .alpha.-Si.sub.xGe.sub.1-x, second region 316 is Ag
and first barrier layer 318a, second barrier layer 318b and third
barrier layer 318c are each TaN. As described above, in embodiments
in which second region 316 is Ag, a thin (e.g., 1-2 nm) layer of
Al.sub.2O.sub.3 (not shown in FIGS. 3E and 3F) on top of Ag may be
used to improve the thermal stability of Ag. For example, in the
embodiment of FIG. 3F, the layer of Al.sub.2O.sub.3 may be disposed
between Ag second region 316 and TaN third barrier layer 318c. In
some embodiments, a via contact (not shown) may be disposed between
TaN third barrier layer 318c and the layer of Al.sub.2O.sub.3 to
form a region of TaN third barrier layer 318c directly in contact
with Ag second region 316.
[0100] As described above, threshold selector device 304 (e.g.,
threshold selector device 304a of FIG. 3E and threshold selector
device 304b of FIG. 3F) is initially in a high resistance (OFF)
state. To operate threshold selector device 304 as a threshold
switch, an initial electro-forming step (also known as a first fire
operation) may be necessary to form a nano-filament between a top
electrode (e.g., first terminal T1 in FIG. 3F) and a bottom
electrode (e.g., first barrier layer 318a in FIG. 3F) so that
threshold selector device 304 operates in a current range in which
switching can occur.
[0101] FIG. 3G depicts example operating conditions of isolation
element 300 of FIG. 3B. In an example forming process, a positive
voltage pulse or sweep is applied to first terminal T1, second
terminal T2 is grounded, and a voltage of between about 1-2V is
applied to third terminal T3 to turn ON V.sub.TFT 302. A forming
bias condition is chosen to obtain a desired cell conductivity,
which is monitored by a cell current (Icell) measurement after each
pulse (or during a voltage sweep). In an embodiment, a target Icell
(@ 1.5V) is in the range of between about 0.5 .mu.A to about 5
.mu.A. Other Icell read conditions may be used.
[0102] Persons of ordinary skill in the art will understand that
during the forming operation when a positive polarity voltage is
applied to the silver top electrode, silver ions are ionized from
the silver top electrode, injected into the .alpha.-Si first region
314, and migrate towards the bottom electrode. This results a
metallic nano-filament formation between the top electrode and the
bottom electrode that results in increase in Icell. To ensure
volatile switching, a thin filament is preferable. Vertical TFT
gate control forming avoids larger filament formation by
controlling the current flowing through threshold selector device
304. The forming operation may be repeated a few times at low
current level to ensure enough silver ions move to the bottom
electrode. This accumulation of silver ions can serve as an ion
source for bi-directional switching of the device.
[0103] In an embodiment, a forming step uses an incremental step
pulse program (ISPP) algorithm in which a voltage amplitude applied
to first terminal T1 is increased gradually for a fixed pulse width
with I-limit Forming (FIG. 3C) set to a desired value (e.g. values
are between about 5 .mu.A and about 50 .mu.A) and Icell is
monitored after each pulse. In an embodiment, the pulse width may
be looped until Icell reaches the target range. Note that careful
forming is crucial for good threshold switching. In that regard, it
is preferred to perform a single or multiple soft forming with
lower Icell. Vertical TFT gate control helps to achieve that by
controlling the voltage at third terminal T3 in small incremental
steps. Example forming parameters are specified in Table 1:
TABLE-US-00001 TABLE 1 EXAMPLE FORMING PARAMETERS PARAMETER EXAMPLE
VALUES Pulse Magnitude (V) 1-6 (applied to first terminal T1) Pulse
Duration (.mu.sec) 1-5 Pulse Rise Time (nsec) 20-200 Pulse Fall
Time (nsec) 20-200 Second Terminal T2 Voltage (V) 0 Third terminal
T3 Voltage (V) 1-2 Icell (@ 1 V) (uA) 0.5-5.sup.
Persons of ordinary skill in the art will understand that forming
pulses may be current pulses, and that other pulse magnitude, pulse
duration, pulse rise time, pulse fall time, T2/T3 voltages and
Icell values may be used. Persons of ordinary skill in the art will
understand that the forming step may be performed using multiple
pulse (burst mode), DC sweep, multilevel soft forming, a
combination of forward and reverse forming (e.g., for better
filament control), or other similar forming methods.
[0104] Following the forming step, voltage (or current) pulses may
be applied to isolation element 300 to switch threshold selector
device 304. In an embodiment, if positive voltage pulses exceeding
a first threshold voltage V.sub.THP are applied to first terminal
T1, second terminal T2 is grounded and a voltage of between about
3-5V is applied to third terminal T3 to turn ON V.sub.TFT 302,
threshold selector device 304 switches from OFF to ON, and stays ON
until the voltage pulse applied to first terminal T1 falls below a
first hold voltage, V.sub.HP.
[0105] For positive polarity switching, an ISPP algorithm is used
in which the pulse voltage is incremented (positive) and the pulse
current is measured (e.g., using an oscilloscope) until an "I-limit
switching" point is reached, as illustrated in FIG. 3C. A sudden
current jump is observed at V.sub.THP and threshold selector device
304 moves to a low resistance state (LRS) (sometimes called an ON
state). In an embodiment, "I-limit-switching" is between about 20
.mu.A and about 100 .mu.A. To capture the hysteresis and the HOLD
point of the threshold selector, the pulse voltage amplitude can be
gradually decremented in steps (but can't be below V.sub.THP). The
reduction in voltage reduces the electric field across the device
which allows silver ions to dissociate that subsequently rupture
the filament to bring threshold selector device 304 to a high
resistance state (HRS) (sometimes called an OFF state). For the
pulse voltage below V.sub.THP, threshold selector device 304 will
move/remain in OFF state. In an embodiment, after threshold
selector device 304 has reached "I-limit switching," the pulse
voltage amplitude applied to first terminal T1 is decremented to
move threshold selector device 304 to a high resistance state (HRS)
(sometimes called an OFF state).
[0106] In an embodiment, during this sequence of pulsing, the pulse
current also is measured (e.g., using an oscilloscope). In an
embodiment, a sharp drop in current is observed at V.sub.HP
(Holding Voltage) and threshold selector device 304 moves to the
OFF state. In an embodiment, to measure endurance of the threshold
selector device after each pulse, Icell @ VREAD is monitored to
check cell damage. In embodiments, VREAD=1V or other value,
typically much less than V.sub.THP. In an embodiment, this
completes one cycle (in positive polarity) of threshold switching
(TS) of the cell from the first terminal T1 side.
[0107] In embodiments, first threshold voltage V.sub.THP may be
between about 1.2 V and about 2.5 V, and first hold voltage
V.sub.HP may be between about 1.0 V and about 2 V, although other
values may be obtained based on choice of selector, the switching
algorithm, the transistor current drive etc. that is used. In an
embodiment, voltage (or current) pulses having a trapezoidal shape
(e.g., rise time less than fall time) are used, although other
pulse shapes may be used. Example positive polarity switching
parameters are specified in Table 2:
TABLE-US-00002 TABLE 2 EXAMPLE POSITIVE POLARITY SWITCHING
PARAMETERS PARAMETER EXAMPLE VALUES Pulse Magnitude (V) 1-4
(applied to first terminal T1) Pulse Duration (.mu.sec) 0.05-200
Pulse Rise Time (nsec) 20-200 Pulse Fall Time (nsec) 20-200 Second
Terminal T2 Voltage (V) 0 Third terminal T3 Voltage (V) 3-5
[0108] In embodiments, between about 10 to about 50 positive
threshold switching operations are performed before opposite
polarity (negative polarity) switching is started so that there is
enough silver ions move and accumulate to the bottom electrode side
(in the first region 314) to form a reservoir which is believed to
act as a virtual silver electrode and enable stable bipolar
threshold switching I-V characteristics, such as shown in FIG. 3C.
This can be called cell "training," "stabilization, or
initialization."
[0109] In another embodiment, if positive voltage pulses (dc sweep
voltage) exceeding a second threshold voltage V.sub.THN are applied
to second terminal T2, first terminal T1 is grounded and a voltage
of between about 3-5V is applied to third terminal T3 to turn ON
V.sub.TFT 302 fully, threshold selector device 304 switches from
OFF to ON, and stays ON until the voltage pulse (dc sweep voltage)
at T2 falls below a second hold voltage, V.sub.HN. For the pulse
voltage amplitude of less than V.sub.THN, threshold selector device
304 will remain in OFF state. In an embodiment, for reverse
operation of threshold selector device 304 the same flow as
described above is used with voltage pulses applied from second
terminal T2. This will result in the negative I-V characteristic
shown in FIG. 3C.
[0110] In embodiments, second threshold voltage V.sub.THN may be
between about 1.5V and about 2.7 V, and second hold voltage
V.sub.HN may be between about 1.2V and about 2 V, although other
values may be used. In an embodiment, voltage (or current) pulses
having a trapezoidal shape (e.g., rise time less than fall time)
are used, although other pulse shapes may be used. Example negative
polarity switching parameters are specified in Table 3:
TABLE-US-00003 TABLE 3 EXAMPLE NEGATIVE POLARITY SWITCHING
PARAMETERS PARAMETER EXAMPLE VALUES Pulse Magnitude (V) 1-4
(applied to second terminal T2) Pulse Duration (.mu.sec) 0.05-200
Pulse Rise Time (nsec) 20-200 Pulse Fall Time (nsec) 20-200 First
Terminal T1 Voltage (V) 0 Third terminal T3 Voltage (V) 3-5
[0111] In an embodiment, an alternative forming step uses a DC
sweep algorithm in which a voltage amplitude applied to first
terminal T1 is incrementally increased. Example forming parameters
are specified in Table 4:
TABLE-US-00004 TABLE 4 EXAMPLE FORMING PARAMETERS PARAMETER EXAMPLE
VALUES DC Sweep Voltage (V) 2-4 (applied to first terminal T1) 20
mV increments Second Terminal T2 Voltage (V) 0 Third terminal T3
Voltage (V) 1-2
[0112] Following the DC forming step, a DC voltage sweep may be
applied to isolation element 300 to switch threshold selector
device 304. Example positive polarity switching parameters are
specified in Table 5:
TABLE-US-00005 TABLE 5 EXAMPLE POSITIVE POLARITY SWITCHING
PARAMETERS PARAMETER EXAMPLE VALUES DC Sweep Voltage (V) 0-3
(applied to first terminal T1) 50 mV increments Second Terminal T2
Voltage (V) 0 Third terminal T3 Voltage (V) 5
[0113] Example negative polarity switching parameters are specified
in Table 6:
TABLE-US-00006 TABLE 6 EXAMPLE NEGATIVE POLARITY SWITCHING
PARAMETERS PARAMETER EXAMPLE VALUES DC Sweep Voltage (V) 0-3
(applied to second terminal T2) 50 mV increments First Terminal T1
Voltage (V) 0 Third terminal T3 Voltage (V) 5
[0114] The monolithic three-dimensional memory array 240
illustrated in FIGS. 2C1-2C3 includes vertical bit lines and
horizontal word lines. The technology described above also may be
used in other monolithic three-dimensional memory array
configurations. For example, a cross-point memory array may include
memory cells each having a memory element (e.g., a reversible
resistance-switching memory element, a phase-change memory element,
a magnetoresistive memory element, or other similar memory element)
coupled in series with an isolation element such as isolation
element 300 described above and illustrated in FIG. 3B.
[0115] FIG. 4A is a circuit diagram of a cross-point memory cell
400 that includes an isolation element 300 coupled in series with a
memory element 402, both coupled between a first conductor (e.g., a
bit line BL) and a second conductor (e.g., a ground terminal). A
third conductor (e.g., a word line WL) is coupled to a third
terminal T3 of isolation element 300. Memory element 402 may be a
reversible resistance-switching memory element, a phase-change
memory element, a magnetoresistive memory element, or other similar
memory element.
[0116] In an embodiment, memory element 402 is coupled between
first terminal T1 of isolation element 300 and the second conductor
(e.g., a ground line), second terminal T2 of isolation element 300
is coupled to the first conductor (e.g., a bit line BL), and third
terminal T3 of isolation element 300 is coupled to the third
conductor (e.g., a word line WL).
[0117] FIG. 4B is a simplified schematic diagram of an example
cross-point memory array 410, which includes word lines WL1, WL2,
WL3, WL4, bit lines BL1, BL2, BL3, BL4, and memory cells
400.sub.11, 400.sub.12, . . . , 400.sub.44 coupled to the word
lines and the bit lines. Memory array 410 is one example of an
implementation for memory array 150 of FIG. 1E. In an embodiment,
each of memory cells 400.sub.11, 400.sub.12, . . . , 400.sub.44 is
an implementation of memory cell 400 of FIG. 4A. Persons of
ordinary skill in the art will understand that memory array 410 may
include more or less than four word lines, more or less than four
bit lines, and more or less than sixteen memory cells 400.sub.11,
400.sub.12, . . . , 400.sub.44.
[0118] Each memory cell 400.sub.11, 400.sub.12, . . . , 400.sub.44
is coupled to one of the word lines and one of the bit lines, and
includes a corresponding isolation element 300.sub.11, 300.sub.12,
. . . , 300.sub.44, respectively, coupled in series with a
corresponding memory element 402.sub.11, 402.sub.12, . . . ,
402.sub.44, respectively. In an embodiment, each of isolation
elements 300.sub.11, 300.sub.12, . . . , 300.sub.44 is an
implementation of isolation element 300 of FIG. 3B.
[0119] Each isolation element 300.sub.11, 300.sub.12, . . . ,
300.sub.44 has a first terminal coupled to one of bit lines BL1,
BL2, BL3, BL4, a second terminal coupled to one of word lines WL1,
WL2, WL3, WL4, and a third terminal coupled to a first terminal of
a corresponding memory element 402.sub.11, 402.sub.12, . . . ,
402.sub.44. Each memory element 402.sub.11, 402.sub.12, . . . ,
402.sub.44 also includes a second terminal coupled to a common
potential (e.g., ground, virtual ground, or some other
potential).
[0120] For example, memory cell 400.sub.13 includes isolation
element 300.sub.13 coupled in series with memory element
402.sub.13. Isolation element 300.sub.13 has a first terminal
coupled to bit line BL3, a second terminal coupled to word line
WL1, and a third terminal coupled to a first terminal of memory
element 402.sub.13. Memory element 402.sub.13 has a second terminal
coupled to ground. Isolation element 300.sub.13 includes a
transistor 302.sub.13 (V.sub.TFT 302.sub.13) coupled in series with
a threshold selector device 304.sub.13.
[0121] Likewise, memory cell 400.sub.22 includes isolation element
300.sub.22 coupled in series with memory element 402.sub.22.
Isolation element 300.sub.22 has a first terminal coupled to bit
line BL2, a second terminal coupled to word line WL2, and a third
terminal coupled to a first terminal of memory element 402.sub.22.
Memory element 402.sub.22 has a second terminal coupled to ground.
Isolation element 300.sub.22 includes a transistor 302.sub.22
(V.sub.TFT 302.sub.22) coupled in series with a threshold selector
device 304.sub.22.
[0122] Similarly, memory cell 400.sub.41 includes isolation element
300.sub.41 coupled in series with memory element 402.sub.41.
Isolation element 300.sub.41 has a first terminal coupled to bit
line BL1, a second terminal coupled to word line WL4, and a third
terminal coupled to a first terminal of memory element 402.sub.41.
Memory element 402.sub.41 has a second terminal coupled to ground.
Isolation element 300.sub.41 includes a transistor 302.sub.41
(V.sub.TFT 302.sub.41) coupled in series with a threshold selector
device 304.sub.41.
[0123] FIG. 4C is a perspective view of an embodiment of a
cross-point memory cell 400a, which is an example implementation of
cross-point memory cell 400 of FIG. 4A. Cross-point memory cell
400a includes an isolation element 300b (such as described above
and depicted in FIG. 3F) coupled in series with a memory element
402a, both coupled between a first conductor (e.g., a bit line BL)
and a second conductor (e.g., a ground line). A third conductor
(e.g., a word line WL) is coupled to a third terminal T3 of
isolation element 300b. Memory element 402a may be a reversible
resistance-switching memory element, a phase-change memory element,
a magnetoresistive memory element, or other similar memory
element.
[0124] In an embodiment, threshold selector device 304b includes
first region 314, second region 316, first barrier layer 318a,
second barrier layer 318b and third barrier layer 318c. In an
embodiment, first region 314 is hydrogen-doped .alpha.-silicon
(.alpha.-Si:H), having a thickness of between about 10 nm to about
55 nm, second region 316 is Ag, with a thickness of between about 5
nm to about 25 nm, first barrier layer 318a is TiN, having a
thickness of between about 5 nm to about 10 nm, second barrier
layer 318b is TaN, having a thickness between about 1 nm and about
5 nm, and third barrier layer 318c is TaN, having a thickness
between about 5 nm and about 20 nm. A thin (e.g., 1-2 nm) layer of
Al.sub.2O.sub.3 (not shown) disposed between Ag second region 316
and TaN third barrier layer 318c may be used to improve the thermal
stability of Ag. In some embodiments, a via contact (not shown) may
be disposed between TaN third barrier layer 318c and the layer of
Al.sub.2O.sub.3 to form a region of TaN third barrier layer 318c
directly in contact with Ag second region 316. Other materials
and/or thicknesses may be used. In an embodiment, memory element
402a is a magnetoresistive memory element, having a thickness of
between about 20 nm and about 80 nm. Other memory elements and/or
thicknesses may be used.
[0125] In an embodiment, first terminal T1 of isolation element
300b is third barrier layer 318c of threshold selector device 304b,
second terminal T2 of isolation element 300b is drain region 306a
of V.sub.TFT 302 a, and third terminal T3 of isolation element 300b
is gate region 310a of V.sub.TFT 302a.
[0126] FIGS. 5A-5C depict various views of an embodiment of a
portion of a monolithic three-dimensional memory array 500 that
includes strips of a memory material. The physical structure
depicted in FIGS. 5A-5C may include one implementation for a
portion of the monolithic three-dimensional memory array depicted
in FIGS. 2C1-2C3.
[0127] Monolithic three-dimensional memory array 500 includes
vertical bit lines LBL.sub.11-LBL.sub.33 arranged in a first
direction (e.g., a z-direction), word lines WL.sub.10, WL.sub.11, .
. . , WL.sub.43 arranged in a second direction (e.g., an
x-direction) perpendicular to the first direction, row select lines
SG.sub.1, SG.sub.2, SG.sub.3 arranged in the second direction, and
global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3 arranged in a
third direction (e.g., a y-direction) perpendicular to the first
and second directions. Vertical bit lines LBL.sub.11-LBL.sub.33 are
disposed above global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3,
which each have a long axis in the second (e.g., x-direction).
Persons of ordinary skill in the art will understand that
monolithic three-dimensional memory arrays, such as monolithic
three-dimensional memory array 500 may include more or fewer than
twenty-four word lines, three row select lines, three global bit
lines, and nine vertical bit lines.
[0128] In an embodiment, global bit lines GBL.sub.1, GBL.sub.2,
GBL.sub.3 are disposed above a substrate 502, such as a silicon,
germanium, silicon-germanium, undoped, doped, bulk, SOI or other
substrate with or without additional circuitry. In an embodiment,
an isolation layer 504, such as a layer of silicon dioxide, silicon
nitride, silicon oxynitride or any other suitable insulating layer,
is formed above substrate 502. In an embodiment, global bit lines
GBL.sub.1, GBL.sub.2, GBL.sub.3 are formed of a conductive material
506 (e.g., tungsten or other conductive material).
[0129] In an embodiment, a first dielectric material layer 508
(e.g., silicon dioxide), a gate dielectric material 510 (e.g.,
silicon dioxide), a liner material 512 (e.g., silicon nitride), a
spacer dielectric 514 (e.g., silicon dioxide), and a second
dielectric material layer 516 (e.g., silicon dioxide) are formed
above isolation layer 504. Global bit lines GBL.sub.1, GBL.sub.2,
GBL.sub.3 are disposed above isolation layer 504 and are separated
by first dielectric material layer 508. Row select lines SG.sub.1,
SG.sub.2, SG.sub.3 are disposed above global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3.
[0130] In an embodiment, isolation elements 518 are formed above
global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3. In embodiments,
any of isolation element 300 of FIG. 3B, isolation element 300a of
FIG. 3E and isolation element 300b of FIG. 3F may be used for
isolation elements 518. In an embodiment, each isolation element
518 includes one of vertically-oriented transistors
Q.sub.11-Q.sub.33 and a threshold selector device 520.
[0131] In embodiments, any of threshold selector device 304a of
FIG. 3E and threshold selector device 304b of FIG. 3F may be used
for threshold selector devices 520. In an embodiment, each
threshold selector device 520 includes a first region 522 (e.g.,
.alpha.-Si:H), and a second region 524 (e.g., Ag) disposed above
first region 522. In an embodiment, each first selector device 520
also includes a first barrier layer 526 (e.g., TiN) and a second
barrier layer 528 (e.g., TaN). Threshold selector devices 520 are
separated by a third dielectric material layer 530 (e.g., silicon
dioxide). In embodiments in which second region 524 is Ag, a thin
(e.g., 1-2 nm) layer of Al.sub.2O.sub.3 (not shown) on top of Ag
second region 524 may be used to improve the thermal stability of
Ag.
[0132] A stack of word lines WL.sub.10, WL.sub.11, . . . ,
WL.sub.43 is disposed above third dielectric material layer 530,
with a fourth dielectric material layer 532 (e.g., silicon dioxide)
separating adjacent word lines. An etch stop layer 534 (e.g.,
silicon nitride) is disposed above the stack of word lines
WL.sub.10, WL.sub.11, . . . , WL.sub.43.
[0133] In an embodiment, strips of a non-volatile memory material
536 are disposed adjacent word lines WL.sub.10, WL.sub.11, . . . ,
WL.sub.43. The strips of non-volatile memory material 536 may be
formed in the first direction (e.g., the z-direction). A strip of
non-volatile memory material 536 may include, for example, an oxide
layer, a reversible resistance-switching material (e.g., a metal
oxide material, a phase change material or other similar reversible
resistance-switching material), a charge trapping layer (e.g., a
layer of silicon nitride), or other non-volatile memory material. A
strip of non-volatile memory material 536 may include a single
continuous layer of material that may be used by a plurality of
memory cells or devices. In an embodiment, a strip of non-volatile
memory material 536 includes one or more of HfO.sub.2,
Al.sub.2O.sub.3, HfSiO.sub.x, HfSiO.sub.xN.sub.y, HfAlO.sub.x,
Nb.sub.2O.sub.5, Ta.sub.2O.sub.5, ZrO.sub.2, Cr.sub.2O.sub.3,
Fe.sub.2O.sub.3, Ni.sub.2O.sub.3, Co.sub.2O.sub.3, WO.sub.3,
TiO.sub.2, SrZrO.sub.3, or SrTiO.sub.3.
[0134] Vertical bit lines LBL.sub.11-LBL.sub.33 are formed of a
conductive material 538 (e.g., a highly doped polysilicon
material), with a fifth dielectric material layer 540 (e.g.,
silicon dioxide) separating adjacent vertical bit lines. Vertical
bit lines LBL.sub.11-LBL.sub.33 also may include an adhesion layer
(e.g., titanium nitride) (not shown) disposed on an outer surface
of each vertical bit line LBL.sub.11-LBL.sub.33. In some
embodiments, each of a vertical bit lines LBL.sub.11-LBL.sub.33
includes a vertical structure (e.g., a rectangular prism, a
cylinder, or a pillar), and the vertical strip of non-volatile
memory material 536 may completely or partially surround the
vertical structure (e.g., a conformal layer of reversible
resistance-switching material surrounding the sides of the vertical
structure).
[0135] A memory cell is disposed between the intersection of each
vertical bit line and each word line. For example, a memory cell
M.sub.111 is disposed between vertical bit line LBL.sub.11 and word
line WL.sub.10, a memory cell M.sub.116 is disposed between
vertical bit line LBL.sub.13 and word line WL.sub.13, a memory cell
M.sub.411 is disposed between vertical bit line LBL.sub.11 and word
line WL.sub.40, a memory cell M.sub.432 is disposed between
vertical bit line LBL.sub.31 and word line WL.sub.41, and a memory
cell M.sub.436 is disposed between vertical bit line LBL.sub.33 and
word line WL.sub.43. In an embodiment, monolithic three-dimensional
memory array 500 includes seventy-two memory cells M.sub.111,
M.sub.112, . . . , M.sub.436. Persons of ordinary skill in the art
will understand that monolithic three-dimensional memory arrays may
include more or fewer than seventy-two memory cells.
[0136] In one example, portions of the strip of non-volatile memory
material 536 may include a part of memory cell M.sub.111 associated
with the cross section between WL.sub.10 and LBL.sub.11, and a part
of memory cell M.sub.211 associated with the cross section between
WL.sub.20 and LBL.sub.11.
[0137] Each of memory cells M.sub.111, M.sub.112, . . . , M.sub.436
may include a floating gate device, a charge trap device (e.g.,
using a silicon nitride material), a resistive change memory
device, or other type of memory device. Isolation elements 518 may
be used to select a corresponding one of vertical bit lines
LBL.sub.11-LBL.sub.33.
[0138] Vertically-oriented transistors Q.sub.11-Q.sub.33 may be
field effect transistors, although other transistors types may be
used. In an embodiment, each of vertically-oriented transistors
Q.sub.31-Q.sub.33 has a height between about 150 nm and about 500
nm. Other height values may be used.
[0139] Each of vertically-oriented transistors Q.sub.11-Q.sub.33
has a first terminal 542a (e.g., a drain/source terminal), a second
terminal 542b (e.g., a source/drain terminal), a first control
terminal 542c1 (e.g., a first gate terminal) and a second control
terminal 542c2 (e.g., a second gate terminal). First gate terminal
542c1 and second gate terminal 542c2 may be disposed on opposite
sides of the vertically-oriented transistor. Gate dielectric
material 510 (e.g., SiO.sub.2) is disposed between first gate
terminal 542c1 and first terminal 542a and second terminal 542b,
and also is disposed between second gate terminal 542c2 and first
terminal 542a and second terminal 542b.
[0140] First gate terminal 542c1 may be used to selectively induce
a first electrically conductive channel between first terminal 542a
and second terminal 542b of the transistor, and second gate
terminal 542c2 may be used to selectively induce a second
electrically conductive channel between first terminal 542a and
second terminal 542b of the transistor. In an embodiment, first
gate terminal 542c1 and second gate terminal 542c2 are coupled
together to form a single control terminal 542c that may be used to
collectively turn ON and OFF the vertically-oriented
transistor.
[0141] Row select lines SG.sub.1, SG.sub.2, SG.sub.3 are disposed
above global bit lines GBL.sub.1, GBL.sub.2 and GBL.sub.3, and form
gate terminals 542c of vertically-oriented transistors
Q.sub.11-Q.sub.33. In particular, row select line SG.sub.1 forms
the gate terminals of vertically-oriented transistors Q.sub.11,
Q.sub.21 and Q.sub.31, row select line SG.sub.2 forms the gate
terminals of vertically-oriented transistors Q.sub.12, Q.sub.22 and
Q.sub.32, and row select line SG.sub.3 forms the gate terminals of
vertically-oriented transistors Q.sub.13, Q.sub.23 and Q.sub.33.
Other configurations also may be used.
[0142] Isolation elements 518 are used to selectively
connect/disconnect vertical bit lines LBL.sub.11, LBL.sub.12,
LBL.sub.13 to/from global bit line GBL.sub.1 using row select lines
SG.sub.1, SG.sub.2, SG.sub.3, respectively. In particular, each of
vertically-oriented transistors Q.sub.11, Q.sub.12, Q.sub.13 has a
first terminal 542a (e.g., a drain/source terminal) coupled to
global bit line GBL.sub.1, a second terminal 542b (e.g., a
source/drain terminal) coupled to a corresponding one of threshold
selector devices 520, and a first gate terminal 542c1 and a second
gate terminal 542c2 coupled to row select line SG.sub.1, SG.sub.2,
SG.sub.3, respectively.
[0143] Row select lines SG.sub.1, SG.sub.2, SG.sub.3 are used to
turn ON/OFF isolation elements 518 to connect/disconnect vertical
bit lines LBL.sub.11, LBL.sub.12, LBL.sub.13, respectively, to/from
global bit line GBL.sub.1. A gate dielectric layer 510 (e.g.,
silicon dioxide) is disposed between row select lines SG.sub.1,
SG.sub.2, SG.sub.3 and vertically-oriented transistors Q.sub.11,
Q.sub.12, Q.sub.13.
[0144] Likewise, isolation elements 518 are used to selectively
connect/disconnect vertical bit lines LBL.sub.11, LBL.sub.21,
LBL.sub.31 to global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3,
respectively, using row select line SG.sub.1. In particular, each
of vertically-oriented transistors Q.sub.11, Q.sub.21, Q.sub.31 has
a first terminal 542a (e.g., a drain./source terminal) coupled to a
corresponding one of global bit lines GBL.sub.1, GBL.sub.2,
GBL.sub.3, respectively, a second terminal 542b (e.g., a
source/drain terminal) coupled to a corresponding one of threshold
selector devices 520, and a first gate terminal 542c1 and a second
gate terminal 542c2 coupled to row select line SG.sub.1. Row select
line SG.sub.1 is used to turn ON/OFF isolation elements 518 to
connect/disconnect vertical bit lines LBL.sub.11, LBL.sub.21,
LBL.sub.31, respectively, to/from global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3, respectively.
[0145] Similarly, vertically-oriented transistors Q.sub.13,
Q.sub.23, Q.sub.33 are used to selectively connect/disconnect
vertical bit lines LBL.sub.13, LBL.sub.23, LBL.sub.33 to/from
global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3, respectively,
using row select line SG.sub.3. In particular, each of
vertically-oriented transistors Q.sub.13, Q.sub.23, Q.sub.33 has a
first terminal 542a (e.g., a drain./source terminal) coupled to a
corresponding one of global bit lines GBL.sub.1, GBL.sub.2,
GBL.sub.3, respectively, a second terminal 542b (e.g., a
source/drain terminal) coupled to a corresponding one of threshold
selector devices 520, and a first gate terminal 542c1 and a second
gate terminal 542c2 coupled to row select line SG.sub.3. Row select
line SG.sub.3 is used to turn ON/OFF isolation elements 518 to
connect/disconnect vertical bit lines LBL.sub.13, LBL.sub.23,
LBL.sub.33, respectively, to/from global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3, respectively.
[0146] A spacer dielectric 514 (e.g., silicon dioxide) is disposed
below first gate terminal 542c1 and a second gate terminal 542c2 of
each of vertically-oriented transistors Q.sub.11, Q.sub.12, . . . ,
Q.sub.33, and electrically isolates first gate terminals 542c1 and
a second gate terminals 542c2 from global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3.
[0147] Referring now to FIGS. 6A1-6M3, an example method of forming
a portion of a monolithic three-dimensional memory array, such as
monolithic three-dimensional memory array 500 of FIGS. 5A-5C, is
described.
[0148] With reference to FIGS. 6A1-6A3, substrate 502 is shown as
having already undergone several processing steps. Substrate 502
may be any suitable substrate such as a silicon, germanium,
silicon-germanium, undoped, doped, bulk, SOI or other substrate
with or without additional circuitry. For example, substrate 502
may include one or more n-well or p-well regions (not shown).
Isolation layer 504 is formed above substrate 502. In some
embodiments, isolation layer 504 may be a layer of silicon dioxide,
silicon nitride, silicon oxynitride or any other suitable
insulating layer.
[0149] Following formation of isolation layer 504, a conductive
material layer 506 is deposited over isolation layer 504.
Conductive material layer 506 may include any suitable conductive
material such as tungsten or another appropriate metal, heavily
doped semiconductor material, a conductive silicide, a conductive
silicide-germanide, a conductive germanide, or the like deposited
by any suitable method (e.g., CVD, PVD, etc.). In at least one
embodiment, conductive material layer 506 may be between about 20
nm and about 250 nm of tungsten. Other conductive material layers
and/or thicknesses may be used. In some embodiments, an adhesion
layer (not shown), such as titanium nitride or other similar
adhesion layer material, may be disposed between isolation layer
504 and conductive material layer 506, and/or between conductive
material layer 506 and subsequent vertically-oriented transistors
layers.
[0150] Persons of ordinary skill in the art will understand that
adhesion layers may be formed by PVD or another method on
conductive material layers. For example, adhesion layers may be
between about 2 nm and about 50 nm, and in some embodiments about
10 nm, of titanium nitride or another suitable adhesion layer such
as tantalum nitride, tungsten nitride, tungsten, molybdenum,
combinations of one or more adhesion layers, or the like. Other
adhesion layer materials and/or thicknesses may be employed.
[0151] Following formation of conductive material layer 506,
conductive material layer 506 is patterned and etched. For example,
conductive material layer 506 may be patterned and etched using
conventional lithography techniques, with a soft or hard mask, and
wet or dry etch processing. In at least one embodiment, conductive
material layer 506 is patterned and etched to form global bit lines
GBL.sub.1, GBL.sub.2, GBL.sub.3. Example widths for global bit
lines GBL.sub.1, GBL.sub.2, GBL.sub.3 and/or spacings between
global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3 range between
about 48 nm and about 100 nm, although other conductor widths
and/or spacings may be used.
[0152] After global bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3 have
been formed, a first dielectric material layer 508 is formed over
substrate 502 to fill the voids between global bit lines GBL.sub.1,
GBL.sub.2, GBL.sub.3. For example, approximately 300-700 nm of
silicon dioxide may be deposited on the substrate 502 and
planarized using chemical mechanical polishing or an etchback
process to form a planar surface 600. Other dielectric materials
such as silicon nitride, silicon oxynitride, low K dielectrics,
etc., and/or other dielectric material layer thicknesses may be
used. Example low K dielectrics include carbon doped oxides,
silicon carbon layers, or the like.
[0153] In other embodiments, global bit lines GBL.sub.1, GBL.sub.2,
GBL.sub.3 may be formed using a damascene process in which first
dielectric material layer 508 is formed, patterned and etched to
create openings or voids for global bit lines GBL.sub.1, GBL.sub.2,
GBL.sub.3. The openings or voids then may be filled with conductive
material 506 (and/or a conductive seed, conductive fill and/or
barrier layer if needed). Conductive material layer 506 then may be
planarized to form planar surface 600.
[0154] Following planarization, the semiconductor material used to
form vertically-oriented transistors Q.sub.11-Q.sub.33 is formed
over planar surface 600 of substrate 502. In some embodiments, each
vertically-oriented transistor is formed from a polycrystalline
semiconductor material such as polysilicon, an epitaxial growth
silicon, a polycrystalline silicon-germanium alloy, polygermanium
or any other suitable material. Alternatively, vertically-oriented
transistors Q.sub.11-Q.sub.33 may be formed from a wide band-gap
semiconductor material, such as ZnO, InGaZnO, or SiC, which may
provide a high breakdown voltage, and typically may be used to
provide junctionless FETs. Persons of ordinary skill in the art
will understand that other materials may be used.
[0155] In some embodiments, each vertically-oriented transistor
Q.sub.11-Q.sub.33 may include a first region (e.g., n+
polysilicon), a second region (e.g., p polysilicon) and a third
region (e.g., n+ polysilicon) to form drain/source, body, and
source/drain regions, respectively, of a vertical FET. For example,
a heavily doped n+ polysilicon layer 602 may be deposited on planar
surface 600. In some embodiments, n+ polysilicon layer 602 is in an
amorphous state as deposited. In other embodiments, n+ polysilicon
layer 602 is in a polycrystalline state as deposited. CVD or
another suitable process may be employed to deposit n+ polysilicon
layer 602.
[0156] In an embodiment, n+ polysilicon layer 602 may be formed,
for example, from about 10 nm to about 50 nm, of phosphorus or
arsenic doped silicon having a doping concentration of about
10.sup.21 cm.sup.-3. Other layer thicknesses, doping types and/or
doping concentrations may be used. N+ polysilicon layer 602 may be
doped in situ, for example, by flowing a donor gas during
deposition. Other doping methods may be used (e.g.,
implantation).
[0157] After deposition of n+ silicon layer 602, a doped p-type
silicon layer 604 may be formed over n+ polysilicon layer 602.
P-type silicon may be either deposited and doped by ion
implantation or may be doped in situ during deposition to form a
p-type silicon layer 604. For example, an intrinsic silicon layer
may be deposited on n+ polysilicon layer 602, and a blanket p-type
implant may be employed to implant boron a predetermined depth
within the intrinsic silicon layer. Example implantable molecular
ions include BF.sub.2, BF.sub.3, B and the like. In some
embodiments, an implant dose of about 1-10.times.10.sup.13
ions/cm.sup.2 may be employed. Other implant species and/or doses
may be used. Further, in some embodiments, a diffusion process may
be employed. In an embodiment, the resultant p-type silicon layer
604 has a thickness of from about 80 nm to about 400 nm, although
other p-type silicon layer sizes may be used.
[0158] Following formation of p-type silicon layer 604, a heavily
doped n+ polysilicon layer 606 is deposited on p-type silicon layer
604. In some embodiments, n+ polysilicon layer 606 is in an
amorphous state as deposited. In other embodiments, n+ polysilicon
layer 606 is in a polycrystalline state as deposited. CVD or
another suitable process may be employed to deposit n+ polysilicon
layer 606.
[0159] In an embodiment, n+ polysilicon layer 606 may be formed,
for example, from about 10 nm to about 50 nm of phosphorus or
arsenic doped silicon having a doping concentration of about
10.sup.21 cm.sup.-3. Other layer thicknesses, doping types and/or
doping concentrations may be used. N+ polysilicon layer 606 may be
doped in situ, for example, by flowing a donor gas during
deposition. Other doping methods may be used (e.g., implantation).
Persons of ordinary skill in the art will understand that silicon
layers 602, 604 and 606 alternatively may be doped p+/n/p+,
respectively, or may be doped with a single type of dopant to
produce junction less-FETs.
[0160] Following formation of n+ polysilicon layer 606, a first
barrier layer 526 is deposited on n+ polysilicon layer 606,
resulting in the structure shown in FIGS. 6B1-6B3. First barrier
layer 526 may include any suitable barrier material such as TiN, or
the like deposited by any suitable method (e.g., CVD, PVD, etc.).
In at least one embodiment, first barrier layer 526 may comprise
between about 30 nm and about 80 nm of TiN. Other barrier materials
and/or thicknesses may be used.
[0161] First barrier layer 526 and silicon layers 602, 604 and 606
are patterned and etched to form rows 610 of silicon layers 602,
604 and 606 and first barrier layer 526, resulting in the structure
shown in FIGS. 6C1-6C3. For example, first barrier layer 526 and
silicon layers 602, 604 and 606 may be patterned and etched using
conventional lithography techniques, with wet or dry etch
processing.
[0162] First barrier layer 526 and silicon layers 602, 604 and 606
may be patterned and etched in a single pattern/etch procedure or
using separate pattern/etch steps. Any suitable masking and etching
process may be used to form vertical transistor pillars. For
example, silicon layers may be patterned with about 1 to about 1.5
micron, more preferably about 1.2 to about 1.4 micron, of
photoresist ("PR") using standard photolithographic techniques.
Thinner PR layers may be used with smaller critical dimensions and
technology nodes. In some embodiments, an oxide hard mask may be
used below the PR layer to improve pattern transfer and protect
underlying layers during etching.
[0163] In some embodiments, after etching, rows 610 may be cleaned
using a dilute hydrofluoric/sulfuric acid clean. Such cleaning may
be performed in any suitable cleaning tool, such as a Raider tool,
available from Semitool of Kalispell, Mont. Example post-etch
cleaning may include using ultra-dilute sulfuric acid (e.g., about
1.5 1.8 wt %) for about 60 seconds and/or ultra-dilute HF acid
(e.g., about 0.4-0.6 wt %) for 60 seconds. Megasonics may or may
not be used. Other clean chemistries, times and/or techniques may
be employed.
[0164] A gate dielectric layer 510 is deposited conformally over
substrate 502, and forms on sidewalls of first barrier layer 526
and silicon layers 602, 604 and 606. For example, between about 3
nm to about 10 nm of silicon dioxide may be deposited by atomic
layer deposition (ALD). Other dielectric materials, dielectric
material layer thicknesses, and deposition techniques may be used.
A liner material layer 512 is deposited conformally over substrate,
and forms on gate dielectric layer 510, resulting in the structure
shown in FIGS. 6D1-6D3. For example, between about 3 nm to about 10
nm of silicon nitride may be deposited by ALD. Other liner
materials, liner material layer thicknesses, and deposition
techniques may be used.
[0165] A spacer dielectric material 514 is deposited
anisotropically over substrate 502, filling voids between rows 610.
For example, between approximately 20 nm to about 90 nm of silicon
dioxide may be deposited on top of rows 610, and between
approximately 10 nm to about 90 nm of silicon dioxide may be
deposited on bottom of trenches between rows 610, resulting in the
structure shown in FIGS. 6E1-6E3. Other dielectric materials,
thicknesses and deposition techniques may be used.
[0166] Spacer dielectric material 514 is then isotropically etched,
for example by a wet etch process, removing spacer dielectric
material layer 514 from tops and sidewalls of rows 610, and leaving
between about 10 nm and about 70 nm of spacer dielectric material
layer 514 on bottom of trenches between rows 610, resulting in the
structure shown in FIGS. 6F1-6F3. Alternatively, a chemical dry
etching (CDE) process can be used to isotropically etch spacer
dielectric material 514. Other etch chemistries may be used.
[0167] Liner material layer 512 is then isotropically etched, for
example by a wet etch process or a CDE process, resulting in the
structure shown in FIGS. 6G1-6G3. Other etch chemistries may be
used.
[0168] A gate electrode material is deposited over substrate 502.
For example, approximately 5 nm to about 50 nm of a highly-doped
semiconductor, such as n+ polysilicon, p+ polysilicon, or other
similar conductive material may be deposited. The as-deposited gate
electrode material is subsequently etched back to form gate
electrodes 612, resulting in the structure shown in FIGS. 6H1-6H3.
Other conductive materials and/or thicknesses may be used for gate
electrodes 612.
[0169] Gate dielectric layer 510, first barrier layer 526, and
silicon layers 602, 604 and 606 are patterned and etched to form
vertical transistor pillars 614, resulting in the structure shown
in FIGS. 611-613. For example, gate dielectric layer 510, first
barrier layer 526, and silicon layers 602, 604 and 606 may be
patterned and etched using conventional lithography techniques,
with wet or dry etch processing.
[0170] In an embodiment, gate dielectric layer 510, first barrier
layer 526, and silicon layers 602, 604 and 606 are patterned and
etched to form vertical transistor pillars disposed above global
bit lines GBL.sub.1, GBL.sub.2, GBL.sub.3. The vertical transistor
pillars will be used to form vertically-oriented transistors
Q.sub.11-Q.sub.33.
[0171] A dielectric material 516 is deposited over substrate 502,
filling voids between pillars 614. For example, approximately 20 nm
to about 50 nm of silicon dioxide may be deposited and planarized
using chemical mechanical polishing or an etchback process to form
a planar surface 616, resulting in the structure shown in FIGS.
6J1-6J3. Other dielectric materials and thicknesses may be
used.
[0172] A stack of a first region layer 522, a second region layer
524, and a second barrier layer 528 are deposited over planar
surface 616, resulting in the structure shown in FIGS. 6K1-6K2. For
example, first region layer 522 may be between about 6 nm to about
25 nm of .alpha.-Si:H, second region layer 524 may be between about
5 nm to about 50 nm of Ag, and second barrier layer 528 may be
between about 5 nm to about 20 nm of TaN. Other materials and/or
thicknesses may be used.
[0173] In some embodiments, a thin (e.g., 1-2 nm) layer of
Al.sub.2O.sub.3 (not shown) may be disposed between Ag second
region layer 524 and TaN second barrier layer 528 may be used to
improve the thermal stability of Ag. In some embodiments, a via
contact (not shown) may be disposed between TaN second barrier
layer 528 and the layer of Al.sub.2O.sub.3 to form a region of TaN
second barrier layer 528 directly in contact with Ag second region
layer 524.
[0174] Next, first region layer 522, second region layer 524, and
second barrier layer 528 are patterned and etched to form pillars
618. In an embodiment, pillars 618 are substantially aligned with
pillars 614 (FIGS. 611-612).
[0175] A dielectric material 530 is deposited over substrate 502,
filling voids between pillars 618. For example, approximately 20 nm
to about 50 nm of silicon dioxide may be deposited and planarized
using chemical mechanical polishing or an etchback process to form
a planar surface 620, resulting in the structure shown in FIGS.
6L1-6L3. Other dielectric materials and thicknesses may be
used.
[0176] Following the example process illustrated in FIGS. 6A1-6L3,
additional process steps may be used to form word lines WL.sub.10,
WL.sub.11, . . . , WL.sub.43 arranged and vertical bit lines
LBL.sub.11-LBL.sub.33 above threshold selector devices 520,
vertically-oriented transistors Q.sub.11-Q.sub.33 and global bit
lines GBL.sub.1-GBL.sub.3, resulting in the structure shown in
FIGS. 6M1-6M3.
[0177] Thus, as described above, one embodiment of the disclosed
technology includes a method including forming a memory cell that
includes a memory element coupled in series with an isolation
element. The isolation element includes a vertical thin-film
transistor and a threshold selector device.
[0178] One embodiment of the disclosed technology includes a bit
line disposed in a first direction above a substrate, a word line
disposed in a second direction above the substrate, the second
direction perpendicular to the first direction, and a memory
element and an isolation element coupled in series between the bit
line and the word line. The isolation element includes a vertical
thin-film transistor coupled in series with a threshold selector
device.
[0179] One embodiment of the disclosed technology includes a
monolithic three-dimensional memory array including a plurality of
vertical bit lines arranged in a first direction, a plurality of
word lines arranged in a second direction perpendicular to the
first direction, and a plurality of memory cells. Each memory cell
is disposed between one of the bit lines and one of the word lines,
and includes an isolation element comprising a transistor coupled
in series with a threshold selector device. The threshold selector
device includes a solid electrolyte region, an ion source region,
and a barrier layer disposed between the solid electrolyte region
and the ion source region.
[0180] One embodiment of the disclosed technology includes a
monolithic three-dimensional memory array that includes a plurality
of global bit lines disposed above a substrate, a plurality of
vertically-oriented bit lines disposed above the global bit lines,
a plurality of word lines disposed above the global bit lines, a
plurality of memory cells coupled between the vertically-oriented
bit lines and the word lines, and a plurality of isolation elements
coupled between the vertically-oriented bit lines and the global
bit lines. Each isolation element includes a vertical thin-film
transistor and a threshold selector device.
[0181] One embodiment of the disclosed technology includes an
apparatus that includes a global bit line disposed above a
substrate, a vertically-oriented bit line disposed above the global
bit line, a plurality of word lines disposed above the global bit
line, a plurality of memory cells coupled between the
vertically-oriented bit line and the word lines, and an isolation
element coupled between the vertically-oriented bit line and the
global bit line. The isolation element includes a transistor and a
bipolar threshold selector device.
[0182] One embodiment of the disclosed technology includes a
monolithic three-dimensional memory array including a plurality of
global bit lines disposed above a substrate, a plurality of
vertically-oriented bit lines disposed above the global bit lines,
a plurality of word lines disposed above the global bit lines, a
plurality of memory cells coupled between the vertically-oriented
bit lines and the word lines, and a plurality of isolation elements
coupled between the vertically-oriented bit lines and the global
bit lines, each isolation element comprising a vertical thin-film
transistor and a threshold selector device. Each threshold selector
device comprises a solid electrolyte region, an ion source region,
and a barrier layer disposed between the solid electrolyte region
and the ion source region.
[0183] For purposes of this document, each process associated with
the disclosed technology may be performed continuously and by one
or more computing devices. Each step in a process may be performed
by the same or different computing devices as those used in other
steps, and each step need not necessarily be performed by a single
computing device.
[0184] For purposes of this document, reference in the
specification to "an embodiment," "one embodiment," "some
embodiments," or "another embodiment" may be used to described
different embodiments and do not necessarily refer to the same
embodiment.
[0185] For purposes of this document, a connection can be a direct
connection or an indirect connection (e.g., via another part).
[0186] For purposes of this document, the term "set" of objects may
refer to a "set" of one or more of the objects.
[0187] Although the subject matter has been described in language
specific to structural features and/or methodological acts, it is
to be understood that the subject matter defined in the appended
claims is not necessarily limited to the specific features or acts
described above. Rather, the specific features and acts described
above are disclosed as example forms of implementing the
claims.
* * * * *