U.S. patent application number 16/261869 was filed with the patent office on 2020-07-30 for three-dimensional memory device with logic signal routing through a memory die and methods of making the same.
The applicant listed for this patent is SANDISK TECHNOLOGIES LLC. Invention is credited to Johann ALSMEIER, Kwang-Ho KIM, Yanli ZHANG.
Application Number | 20200243498 16/261869 |
Document ID | 20200243498 / US20200243498 |
Family ID | 1000004954571 |
Filed Date | 2020-07-30 |
Patent Application | download [pdf] |
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United States Patent
Application |
20200243498 |
Kind Code |
A1 |
ZHANG; Yanli ; et
al. |
July 30, 2020 |
THREE-DIMENSIONAL MEMORY DEVICE WITH LOGIC SIGNAL ROUTING THROUGH A
MEMORY DIE AND METHODS OF MAKING THE SAME
Abstract
A memory device includes a memory die containing memory
elements, a support die containing peripheral devices and bonded to
the memory die, and an electrically conductive path between two of
the peripheral devices which extends at least partially through the
memory die. The electrically conductive path is electrically
isolated from the memory elements.
Inventors: |
ZHANG; Yanli; (San Jose,
CA) ; KIM; Kwang-Ho; (Pleasanton, CA) ;
ALSMEIER; Johann; (San Jose, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SANDISK TECHNOLOGIES LLC |
ADDISON |
TX |
US |
|
|
Family ID: |
1000004954571 |
Appl. No.: |
16/261869 |
Filed: |
January 30, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/11529 20130101;
H01L 25/18 20130101; H01L 27/1157 20130101; H01L 24/80 20130101;
G11C 16/26 20130101; G11C 16/0483 20130101; H01L 25/0657 20130101;
H01L 2924/14511 20130101; H01L 27/11582 20130101; H01L 27/11524
20130101; H01L 27/11556 20130101; H01L 2225/06524 20130101; H01L
2224/80894 20130101; H01L 25/50 20130101; H01L 24/08 20130101; H01L
2224/08146 20130101; H01L 23/481 20130101; H01L 2924/1431 20130101;
H01L 2225/06541 20130101; H01L 27/11573 20130101 |
International
Class: |
H01L 25/18 20060101
H01L025/18; H01L 25/065 20060101 H01L025/065; H01L 25/00 20060101
H01L025/00; H01L 23/00 20060101 H01L023/00; H01L 23/48 20060101
H01L023/48; H01L 27/11524 20060101 H01L027/11524; H01L 27/11556
20060101 H01L027/11556; H01L 27/11529 20060101 H01L027/11529; H01L
27/1157 20060101 H01L027/1157; H01L 27/11582 20060101
H01L027/11582; H01L 27/11573 20060101 H01L027/11573; G11C 16/04
20060101 G11C016/04 |
Claims
1. (canceled)
2. A memory device of comprising: a memory die comprising memory
elements; a support die comprising peripheral devices, wherein the
support die is bonded to the memory die; and an electrically
conductive path between two of the peripheral devices extends at
least partially through the memory die, wherein the electrically
conductive path is electrically isolated from the memory elements,
wherein: the memory elements comprise at least one
three-dimensional array of memory elements; the memory die further
comprises memory-die interconnect dielectric layers including
memory-die metal interconnect structures, and first memory-die
bonding pads that are located on or within the memory-die
interconnect dielectric layers and electrically connected to a
respective node of the at least one three-dimensional array of
memory elements through a first subset of the memory-die metal
interconnect structures; the support die further comprises at least
one peripheral circuitry containing the peripheral devices and
configured to generate control signals for, and receive sense
signals from, the at least one three-dimensional array of memory
elements and comprising first support-die bonding pads bonded to
the first memory-die bonding pads and electrically connected to a
respective node of the at least one peripheral circuitry through a
first subset of support-die metal interconnect structures within
the support die; the electrically conductive path is electrically
isolated from the at least one three-dimensional array of memory
elements is located in the memory-die interconnect dielectric
layers; the electrically conductive path comprises a pair of second
memory-die bonding pads that are located on or within the
memory-die interconnect dielectric layers, metal via structures
contacting a respective one of the pair of second memory-die
bonding pads, and a metal line contacting the metal via structures;
and each pair of second memory-die bonding pads is bonded to a
respective pair of second support-die bonding pads that are
electrically connected to a respective node of the at least one
peripheral circuitry through a second subset of support-die metal
interconnect structures within the support die.
3. The memory device of claim 2, wherein the electrically
conductive path is electrically isolated from the first subset of
the memory-die metal interconnect structures, and wherein each
metal line within the electrically conductive path is spaced from
an interface between the memory die and the support die.
4. The memory device of claim 2, wherein: the at least one
three-dimensional array of memory elements comprises a plurality of
three-dimensional arrays of memory elements; and a metal line
within the electrically conductive path laterally extends from a
first region of the memory-die interconnect dielectric layers
located between a first three-dimensional array of memory elements
among the plurality of three-dimensional arrays of memory elements
and an interface between the memory die and the support die and a
second region of the memory-die interconnect dielectric layers
located between a second three-dimensional array of memory elements
among the plurality of three-dimensional arrays of memory elements
and the interface between the memory die and the support die.
5. The memory device of claim 4, wherein: the memory die comprises
a plurality of planes configured to simultaneously execute a
plurality of external commands; the first three-dimensional array
of memory elements is located within a first plane among the
plurality of planes; and the second three-dimensional array of
memory elements is located within a second plane among the
plurality of planes.
6. The memory device of claim 4, wherein: the first
three-dimensional array of memory elements comprises a first
two-dimensional array of vertical NAND strings extending through a
first alternating stack of first insulating layers and first
electrically conductive layers located within the memory die; and
the second three-dimensional array of memory elements comprises a
second two-dimensional array of vertical NAND strings extending
through a second alternating stack of second insulating layers and
second electrically conductive layers located within the memory die
and laterally spaced from the first two-dimensional array of
vertical NAND strings by a dielectric material portion.
7. The memory device of claim 6, further comprising: first bit
lines electrically connected to a respective subset of vertical
NAND strings within the first two-dimensional array of vertical
NAND strings and located between the first two-dimensional array of
vertical NAND strings and the interface between the memory die and
the support die; and second bit lines electrically connected to a
respective subset of vertical NAND strings within the second
two-dimensional array of vertical NAND strings, located between the
second two-dimensional array of vertical NAND strings and the
interface between the memory die and the support die, and
electrically isolated from the first bit lines, wherein the metal
line is located between the interface between the memory die and
the support die and a collection of the first bit lines and the
second bit lines.
8. The memory device of claim 4, wherein the at least one
peripheral circuitry comprises a plurality of peripheral
circuitries configured to control operation of a respective one of
the plurality of three-dimensional arrays of memory elements.
9. The memory device of claim 8, wherein: a first support circuitry
region including a first support circuitry among the plurality of
peripheral circuitries faces the first region of the memory-die
interconnect dielectric layers; a second support circuitry region
including a second support circuitry among the plurality of
peripheral circuitries faces the second region of the memory-die
interconnect dielectric layers; a node of the first support
circuitry is electrically connected to the metal line; and a node
of the second support circuitry is electrically connected to the
metal line.
10. The memory device of claim 9, wherein: the metal line is
configured to transmit at least one control signal between the node
of the first support circuitry and the node of the second support
circuitry; the plurality of three-dimensional arrays of memory
elements are provided within a plurality of planes configured to
simultaneously execute a plurality of external commands; and the at
least one control signal controls simultaneous execution of two
external commands among the plurality of external commands in two
planes among the plurality of planes that are controlled by the
first support circuitry and by the second support circuitry.
11. The memory device of claim 2, wherein each of the at least one
peripheral circuitry comprises: sense amplifier and bit line driver
circuits; word line driver circuits; word line decoder circuits;
source power supply circuits; and well bias voltage supply
circuits.
12. The memory device of claim 2, further comprising:
through-substrate via structures extending through a substrate of
the support die, wherein the at least one peripheral circuitry is
located on a first side of the substrate; and external bonding pads
located on a second side of the substrate and contacting a
respective one of the through-substrate via structures.
13. A method of operating the memory device of claim 2, comprising
providing an electrical signal between the two of the peripheral
devices through the electrically conductive path without passing
through the memory elements.
14. (canceled)
15. A method for forming a memory device, comprising: providing a
memory die comprising memory elements and an interconnect which is
electrically isolated from the memory elements; providing a support
die comprising peripheral devices; and bonding the memory die to
the support die such that an electrically conductive path between
two of the peripheral devices includes the interconnect, wherein:
the memory elements comprise at least one three-dimensional array
of memory elements; the memory die further comprises memory-die
interconnect dielectric layers including memory-die metal
interconnect structures, and first memory-die bonding pads that are
located on or within the memory-die interconnect dielectric layers
and electrically connected to a respective node of the at least one
three-dimensional array of memory elements through a first subset
of the memory-die metal interconnect structures, wherein the
interconnect is provided in the memory-die interconnect dielectric
layers, the electrically conductive path is electrically isolated
from the at least one three-dimensional array of memory elements,
and the electrically conductive path comprises a pair of second
memory-die bonding pads that are located on or within the
memory-die interconnect dielectric layers, metal via structures
contacting a respective one of the pair of second memory-die
bonding pads, and a metal line contacting the metal via structures;
the support die comprises at least one peripheral circuitry
containing the peripheral devices configured to generate control
signals for, and receive sense signals from, the at least one
three-dimensional array of memory elements, wherein the support die
comprises first support-die bonding pads electrically connected to
a respective node of the at least one peripheral circuitry through
a first subset of support-die metal interconnect structures within
the support die; and the first support-die bonding pads are bonded
to the first memory-die bonding pads during bonding; and each pair
of second memory-die bonding pads is bonded to a respective pair of
second support-die bonding pads that are electrically connected to
a respective node of the at least one peripheral circuitry through
a second subset of support-die metal interconnect structures within
the support die.
16. The method of claim 15, wherein: the electrically conductive
path is electrically isolated from the first subset of the
memory-die metal interconnect structures; the at least one
three-dimensional array of memory elements comprises a plurality of
three-dimensional arrays of memory elements; and a metal line
within the electrically conductive path laterally extends from a
first region of the memory-die interconnect dielectric layers
located between a first three-dimensional array of memory elements
among the plurality of three-dimensional arrays of memory elements
and an interface between the memory die and the support die and a
second region of the memory-die interconnect dielectric layers
located between a second three-dimensional array of memory elements
among the plurality of three-dimensional arrays of memory elements
and the interface between the memory die and the support die.
17. The method of claim 16, wherein: the memory die comprises a
plurality of planes configured to simultaneously execute a
plurality of external commands; the first three-dimensional array
of memory elements is located within a first plane among the
plurality of planes; and the second three-dimensional array of
memory elements is located within a second plane among the
plurality of planes.
18. The method of claim 16, wherein: the first three-dimensional
array of memory elements comprises a first two-dimensional array of
vertical NAND strings extending through a first alternating stack
of first insulating layers and first electrically conductive layers
located within the memory die; and the second three-dimensional
array of memory elements comprises a second two-dimensional array
of vertical NAND strings extending through a second alternating
stack of second insulating layers and second electrically
conductive layers located within the memory die and laterally
spaced from the first two-dimensional array of vertical NAND
strings by a dielectric material portion.
19. The method of claim 16, wherein the memory die comprises: first
bit lines electrically connected to a respective subset of vertical
NAND strings within the first two-dimensional array of vertical
NAND strings and located between the first two-dimensional array of
vertical NAND strings and the interface between the memory die and
the support die; and second bit lines electrically connected to a
respective subset of vertical NAND strings within the second
two-dimensional array of vertical NAND strings, located between the
second two-dimensional array of vertical NAND strings and the
interface between the memory die and the support die, and
electrically isolated from the first bit lines, wherein the metal
line is located between the interface between the memory die and
the support die and a collection of the first bit lines and the
second bit lines.
20. The method of claim 16, wherein: the at least one peripheral
circuitry comprises a plurality of peripheral circuitries
configured to control operation of a respective one of the
plurality of three-dimensional arrays of memory elements; a first
support circuitry region including a first support circuitry among
the plurality of peripheral circuitries faces the first region of
the memory-die interconnect dielectric layers after bonding the
memory die with the support die; a second support circuitry region
including a second support circuitry among the plurality of
peripheral circuitries faces the second region of the memory-die
interconnect dielectric layers after bonding the memory die with
the support die; a node of the first support circuitry is
electrically connected to the metal line; and a node of the second
support circuitry is electrically connected to the metal line.
Description
FIELD
[0001] The present disclosure relates generally to the field of
semiconductor devices, and particular to a three-dimensional memory
chip using logic signal routing through a memory die and methods of
manufacturing the same.
BACKGROUND
[0002] Three-dimensional vertical NAND strings having one bit per
cell are disclosed in an article by T. Endoh et al., titled "Novel
Ultra High Density Memory With A Stacked-Surrounding Gate
Transistor (S-SGT) Structured Cell", IEDM Proc. (2001) 33-36.
Support circuitry is required to perform write, read, and erase
operations of the memory cells in the vertical NAND strings. The
support circuitry can be provided by forming complementary metal
oxide semiconductor (CMOS) devices on a same substrate as the
three-dimensional memory device. Alternatively, the support
circuitry can be provided in a support die that is bonded to a
memory die including a three-dimensional memory device.
SUMMARY
[0003] According to an embodiment of the present disclosure, a
memory device includes a memory die containing memory elements, a
support die containing peripheral devices and bonded to the memory
die, and an electrically conductive path between two of the
peripheral devices which extends at least partially through the
memory die. The electrically conductive path is electrically
isolated from the memory elements.
[0004] According to another embodiment of the present disclosure, a
method for forming a memory device comprises providing a memory die
comprising memory elements and an interconnect which is
electrically isolated from the memory elements, providing a support
die comprising peripheral devices, and bonding the memory die to
the support die such that an electrically conductive path between
two of the peripheral devices includes the interconnect.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] FIG. 1 is a schematic vertical cross-sectional view of an
exemplary structure after formation of an alternating stack of
insulating layers and sacrificial material layers according to an
embodiment of the present disclosure.
[0006] FIG. 2A is a schematic vertical cross-sectional view of the
exemplary structure after formation of stepped terraces and a
retro-stepped dielectric material portion according to an
embodiment of the present disclosure.
[0007] FIG. 2B is a top-down view of the exemplary structure of
FIG. 2A. The vertical plane A-A' is the plane of the cross-section
for FIG. 2A.
[0008] FIG. 3A is a schematic vertical cross-sectional view of the
exemplary structure after formation of memory openings and support
openings according to an embodiment of the present disclosure.
[0009] FIG. 3B is a top-down view of the exemplary structure of
FIG. 3A. The vertical plane A-A' is the plane of the cross-section
for FIG. 3A.
[0010] FIGS. 4A-4H are sequential schematic vertical
cross-sectional views of a memory opening within the exemplary
structure during formation of a memory stack structure, an optional
dielectric core, and a drain region therein according to an
embodiment of the present disclosure.
[0011] FIG. 5 is a schematic vertical cross-sectional view of the
exemplary structure after formation of memory stack structures and
support pillar structures according to an embodiment of the present
disclosure.
[0012] FIG. 6A is a schematic vertical cross-sectional view of the
exemplary structure after formation of backside trenches according
to an embodiment of the present disclosure.
[0013] FIG. 6B is a partial see-through top-down view of the
exemplary structure of FIG. 6A. The vertical plane A-A' is the
plane of the schematic vertical cross-sectional view of FIG.
6A.
[0014] FIG. 7 is a schematic vertical cross-sectional view of the
exemplary structure after formation of backside recesses according
to an embodiment of the present disclosure.
[0015] FIGS. 8A-8D are sequential vertical cross-sectional views of
a region of the exemplary structure during formation of
electrically conductive layers according to an embodiment of the
present disclosure.
[0016] FIG. 9 is a schematic vertical cross-sectional view of the
exemplary structure at the processing step of FIG. 8D.
[0017] FIG. 10A is a schematic vertical cross-sectional view of the
exemplary structure after removal of a deposited conductive
material from within the backside trench according to an embodiment
of the present disclosure.
[0018] FIG. 10B is a top-down view of the exemplary structure of
FIG. 10A.
[0019] FIG. 11A is a schematic vertical cross-sectional view of the
exemplary structure after formation of an insulating spacer and a
source contact structure within each backside trench according to
an embodiment of the present disclosure.
[0020] FIG. 11B is a magnified view of a region of the exemplary
structure of FIG. 11A.
[0021] FIG. 12A is a schematic vertical cross-sectional view of the
exemplary structure after formation of contact level dielectric
material layers and contact via structures according to an
embodiment of the present disclosure.
[0022] FIG. 12B is a top-down view of the exemplary structure of
FIG. 12A. The vertical plane A-A' is the plane of the schematic
vertical cross-sectional view of FIG. 12A.
[0023] FIG. 13A is a schematic vertical cross-sectional view of the
exemplary structure after formation of first-level dielectric
material layers and first-level metal interconnect structures
according to an embodiment of the present disclosure.
[0024] FIG. 13B is a top-down view of the exemplary structure of
FIG. 13A. The vertical plane A-A' is the plane of the schematic
vertical cross-sectional view of FIG. 13A.
[0025] FIG. 14A is a schematic vertical cross-sectional view of the
exemplary structure after formation of memory-side bonding pads
according to an embodiment of the present disclosure.
[0026] FIG. 14B is a top-down view of an in-process memory die
including the exemplary structure of FIG. 14A.
[0027] FIG. 15A is a schematic vertical cross-sectional view of the
exemplary structure after formation of pad connection via
structures and memory-die bonding pads according to an embodiment
of the present disclosure.
[0028] FIG. 15B is a top-down view of a memory die including the
exemplary structure of FIG. 15A.
[0029] FIG. 16A is a vertical cross-sectional view of a region of a
support die according to an embodiment of the present
disclosure.
[0030] FIG. 16B is an exemplary layout of the support die of FIG.
16A.
[0031] FIG. 16C is a top-down view of the support die of FIGS. 16A
and 16B.
[0032] FIG. 17 is a vertical cross-sectional view of a
three-dimensional memory device of the support die and a first
memory die according to an embodiment of the present
disclosure.
[0033] FIG. 18 is a vertical cross-sectional view of the
three-dimensional memory device after thinning the support die
according to an embodiment of the present disclosure.
[0034] FIG. 19 is a vertical cross-sectional view of the
three-dimensional memory device after formation of tubular
insulating spacers and through-substrate via structures according
to an embodiment of the present disclosure.
[0035] FIG. 20 is a vertical cross-sectional view of the
three-dimensional memory device after formation of backside
support-die bonding pads according to an embodiment of the present
disclosure.
[0036] FIG. 21 is a schematic vertical cross-sectional view of the
three-dimensional memory device after attaching bonding wires to
the external bonding pads according to an embodiment of the present
disclosure.
DETAILED DESCRIPTION
[0037] As discussed above, various embodiments of the present
disclosure are directed to a bonded chip using logic signal routing
through a memory die and methods of manufacturing the same, the
various aspects of which are described below. Three-dimensional
memory chips can be formed using vertical NAND strings. Support
circuitry is required to perform write, read, and erase operations
of the memory cells in the vertical NAND strings. Typically,
complementary metal oxide semiconductor (CMOS) devices are formed
on a same substrate as the three-dimensional memory device.
However, degradation of peripheral circuitry due to collateral
thermal cycling and hydrogen diffusion during manufacture of the
three-dimensional memory device places a severe constraint on
performance of the support circuitry including the peripheral
circuitry. Further, the number of word lines in an alternating
stack of insulating layers and word lines is limited due to
constraints of the etch process used to pattern the alternating
stack. Thus, the total number of word lines that can be vertically
stacked is limited in a three-dimensional memory device under the
scheme proposed by Endoh et al. Therefore, a structure is desired
that may incorporate a greater number of word lines and a
high-performance support circuitry. The embodiments of the
disclosure can be used to form various structures including a
multilevel memory structure, non-limiting examples of which include
semiconductor devices such as three-dimensional monolithic memory
array devices comprising a plurality of NAND memory strings. The
embodiments of the disclosure can be used to form a
three-dimensional memory device of a memory die and a semiconductor
die, which can be a support die or an additional memory die.
[0038] The drawings are not drawn to scale. Multiple instances of
an element may be duplicated where a single instance of the element
is illustrated, unless absence of duplication of elements is
expressly described or clearly indicated otherwise. Ordinals such
as "first," "second," and "third" are used merely to identify
similar elements, and different ordinals may be used across the
specification and the claims of the instant disclosure. The same
reference numerals refer to the same element or similar element.
Unless otherwise indicated, elements having the same reference
numerals are presumed to have the same composition. Unless
otherwise indicated, a "contact" between elements refers to a
direct contact between elements that provides an edge or a surface
shared by the elements. As used herein, a first element located
"on" a second element may be located on the exterior side of a
surface of the second element or on the interior side of the second
element. As used herein, a first element is located "directly on" a
second element if there exist a physical contact between a surface
of the first element and a surface of the second element. As used
herein, a first element is "electrically connected to" a second
element if there exists a conductive path consisting of at least
one conductive material between the first element and the second
element. As used herein, a "prototype" structure or an "in-process"
structure refers to a transient structure that is subsequently
modified in the shape or composition of at least one component
therein.
[0039] As used herein, a "layer" refers to a material portion
including a region having a thickness. A layer may extend over the
entirety of an underlying or overlying structure, or may have an
extent less than the extent of an underlying or overlying
structure. Further, a layer can be a region of a homogeneous or
inhomogeneous continuous structure that has a thickness less than
the thickness of the continuous structure. For example, a layer can
be located between any pair of horizontal planes between, or at, a
top surface and a bottom surface of the continuous structure. A
layer may extend horizontally, vertically, and/or along a tapered
surface. A substrate may be a layer, may include one or more layers
therein, or may have one or more layer thereupon, thereabove,
and/or therebelow.
[0040] A monolithic three-dimensional memory array is one in which
multiple memory levels are formed above a single substrate, such as
a semiconductor wafer, with no intervening substrates. The term
"monolithic" means that layers of each level of the array are
directly deposited on the layers of each underlying level of the
array. In contrast, two dimensional arrays can be formed separately
and then packaged together to form a non-monolithic memory device.
For example, non-monolithic stacked memories have been constructed
by forming memory levels on separate substrates and vertically
stacking the memory levels, as described in U.S. Pat. No. 5,915,167
titled "Three-dimensional Structure Memory." The substrates can be
thinned or removed from the memory levels before bonding, but as
the memory levels are initially formed over separate substrates,
such memories are not true monolithic three-dimensional memory
arrays. Three-dimensional memory devices of various embodiments of
the present disclosure include monolithic three-dimensional NAND
string memory devices, and can be fabricated using the various
embodiments described herein.
[0041] Generally, a semiconductor package (or a "package") refers
to a unit semiconductor device that can be attached to a circuit
board through a set of pins or solder balls. A semiconductor
package may include a semiconductor chip (or a "chip") or a
plurality of semiconductor chips that are bonded throughout, for
example, by flip-chip bonding or another chip-to-chip bonding. A
package or a chip may include a single semiconductor die (or a
"die") or a plurality of semiconductor dies. A die is the smallest
unit that may independently execute external commands or report
status. Typically, a package or a chip with multiple dies is
capable of simultaneously executing as many external commands as
the total number of planes therein. Each die includes one or more
planes. Identical concurrent operations can be executed in each
plane within a same die, although there can be some restrictions.
When a die is a memory die, i.e., a die including memory elements,
concurrent read operations, concurrent write operations, or
concurrent erase operations can be performed in each plane within a
same memory die. Each plane contains a number of memory blocks (or
"blocks"), which are the smallest unit that can be erased by in a
single erase operation. Each memory block contains a number of
pages, which are the smallest units that can be selected for
programming.
[0042] Referring to FIG. 1, an exemplary structure according to an
embodiment of the present disclosure is illustrated, which can be
used, for example, to fabricate a device structure containing
vertical NAND memory devices. The exemplary structure includes a
substrate (9, 10), which can be a semiconductor substrate. The
substrate may include a substrate semiconductor layer 9 and an
optional semiconductor material layer 10. The substrate
semiconductor layer 9 may be a semiconductor wafer or a
semiconductor material layer, and may include at least one
elemental semiconductor material (e.g., single crystal silicon
wafer or layer), at least one III-V compound semiconductor
material, at least one II-VI compound semiconductor material, at
least one organic semiconductor material, or other semiconductor
materials known in the art.
[0043] As used herein, a "semiconducting material" refers to a
material having electrical conductivity in the range from
1.0.times.10.sup.-5 S/m to 1.0.times.10.sup.5 S/m. As used herein,
a "semiconductor material" refers to a material having electrical
conductivity in the range from 1.0.times.10.sup.-5 S/m to 1.0 S/m
in the absence of electrical dopants therein, and is capable of
producing a doped material having electrical conductivity in a
range from 1.0 S/m to 1.0.times.10.sup.5 S/m upon suitable doping
with an electrical dopant. As used herein, an "electrical dopant"
refers to a p-type dopant that adds a hole to a valence band within
a band structure, or an n-type dopant that adds an electron to a
conduction band within a band structure. As used herein, a
"conductive material" refers to a material having electrical
conductivity greater than 1.0.times.10.sup.5 S/m. As used herein,
an "insulator material" or a "dielectric material" refers to a
material having electrical conductivity less than
1.0.times.10.sup.-5 S/m. As used herein, a "heavily doped
semiconductor material" refers to a semiconductor material that is
doped with electrical dopant at a sufficiently high atomic
concentration to become a conductive material either as formed as a
crystalline material or if converted into a crystalline material
through an anneal process (for example, from an initial amorphous
state), i.e., to have electrical conductivity greater than
1.0.times.10.sup.5 S/m. A "doped semiconductor material" can be a
heavily doped semiconductor material, or can be a semiconductor
material that includes electrical dopants (i.e., p-type dopants
and/or n-type dopants) at a concentration that provides electrical
conductivity in the range from 1.0.times.10.sup.-5 S/m to
1.0.times.10.sup.5 S/m. An "intrinsic semiconductor material"
refers to a semiconductor material that is not doped with
electrical dopants. Thus, a semiconductor material can be
semiconducting or conductive, and can be an intrinsic semiconductor
material or a doped semiconductor material. A doped semiconductor
material can be semiconducting or conductive depending on the
atomic concentration of electrical dopants therein. As used herein,
a "metallic material" refers to a conductive material including at
least one metallic element therein. All measurements for electrical
conductivities are made at the standard condition.
[0044] A stack of an alternating plurality of first material layers
(which can be insulating layers 32) and second material layers
(which can be sacrificial material layer 42) can be formed over the
top surface of the substrate (9, 10). As used herein, a "material
layer" refers to a layer including a material throughout the
entirety thereof. As used herein, an alternating plurality of first
elements and second elements refers to a structure in which
instances of the first elements and instances of the second
elements alternate. Each instance of the first elements that is not
an end element of the alternating plurality is adjoined by two
instances of the second elements on both sides, and each instance
of the second elements that is not an end element of the
alternating plurality is adjoined by two instances of the first
elements on both ends. The first elements may have the same
thickness throughout, or may have different thicknesses. The second
elements may have the same thickness throughout, or may have
different thicknesses. The alternating plurality of first material
layers and second material layers can begin with an instance of the
first material layers or with an instance of the second material
layers, and may end with an instance of the first material layers
or with an instance of the second material layers. In one
embodiment, an instance of the first elements and an instance of
the second elements may form a unit that is repeated with
periodicity within the alternating plurality.
[0045] Each first material layer includes a first material, and
each second material layer includes a second material that is
different from the first material. In one embodiment, each first
material layer can be an insulating layer 32, and each second
material layer can be a sacrificial material layer. In this case,
the stack may include an alternating plurality of insulating layers
32 and sacrificial material layers 42, and constitutes a prototype
stack of alternating layers comprising insulating layers 32 and
sacrificial material layers 42.
[0046] The stack of the alternating plurality is herein referred to
as an alternating stack (32, 42). In one embodiment, the
alternating stack (32, 42) may include insulating layers 32
composed of the first material, and sacrificial material layers 42
composed of a second material different from that of insulating
layers 32. The first material of the insulating layers 32 can be at
least one insulating material. As such, each insulating layer 32
can be an insulating material layer. Insulating materials that can
be used for the insulating layers 32 include, but are not limited
to, silicon oxide (including doped or undoped silicate glass),
silicon nitride, silicon oxynitride, organosilicate glass (OSG),
spin-on dielectric materials, dielectric metal oxides that are
commonly known as high dielectric constant (high-k) dielectric
oxides (e.g., aluminum oxide, hafnium oxide, etc.) and silicates
thereof, dielectric metal oxynitrides and silicates thereof, and
organic insulating materials. In one embodiment, the first material
of the insulating layers 32 can be silicon oxide.
[0047] The second material of the sacrificial material layers 42 is
a sacrificial material that can be removed selective to the first
material of the insulating layers 32. As used herein, a removal of
a first material is "selective to" a second material if the removal
process removes the first material at a rate that is at least twice
the rate of removal of the second material. The ratio of the rate
of removal of the first material to the rate of removal of the
second material is herein referred to as a "selectivity" of the
removal process for the first material with respect to the second
material.
[0048] The sacrificial material layers 42 may comprise an
insulating material, a semiconductor material, or a conductive
material. The second material of the sacrificial material layers 42
can be subsequently replaced with electrically conductive
electrodes which may function, for example, as control gate
electrodes of a vertical NAND device. Non-limiting examples of the
second material include silicon nitride, an amorphous semiconductor
material (such as amorphous silicon), and a polycrystalline
semiconductor material (such as polysilicon). In one embodiment,
the sacrificial material layers 42 can be spacer material layers
that comprise silicon nitride or a semiconductor material including
at least one of silicon and germanium.
[0049] In one embodiment, the insulating layers 32 may include
silicon oxide, and sacrificial material layers may include silicon
nitride sacrificial material layers. The first material of the
insulating layers 32 can be deposited, for example, by chemical
vapor deposition (CVD). For example, if silicon oxide is used for
the insulating layers 32, tetraethyl orthosilicate (TEOS) can be
used as the precursor material for the CVD process. The second
material of the sacrificial material layers 42 can be formed, for
example, CVD or atomic layer deposition (ALD).
[0050] The sacrificial material layers 42 can be suitably patterned
so that conductive material portions to be subsequently formed by
replacement of the sacrificial material layers 42 may function as
electrically conductive electrodes, such as the control gate
electrodes of the monolithic three-dimensional NAND string memory
devices to be subsequently formed. The sacrificial material layers
42 may comprise a portion having a strip shape extending
substantially parallel to a top surface of the substrate (9,
10).
[0051] The thicknesses of the insulating layers 32 and the
sacrificial material layers 42 can be in a range from 20 nm to 50
nm, although lesser and greater thicknesses can be used for each
insulating layer 32 and for each sacrificial material layer 42. The
number of repetitions of the pairs of an insulating layer 32 and a
sacrificial material layer (e.g., a control gate electrode or a
sacrificial material layer) 42 can be in a range from 2 to 1,024,
and typically from 8 to 256, although a greater number of
repetitions may also be used. The top and bottom gate electrodes in
the stack may function as the select gate electrodes. In one
embodiment, each sacrificial material layer 42 in the alternating
stack (32, 42) may have a uniform thickness that is substantially
invariant within each respective sacrificial material layer 42.
[0052] While the descriptions of the present disclosure use an
embodiment in which the spacer material layers are sacrificial
material layers 42 that are subsequently replaced with electrically
conductive layers, in other embodiments the sacrificial material
layers are formed as electrically conductive layers. In this case,
steps for replacing the spacer material layers with electrically
conductive layers can be omitted.
[0053] Optionally, an insulating cap layer 70 can be formed over
the alternating stack (32, 42). The insulating cap layer 70
includes a dielectric material that is different from the material
of the sacrificial material layers 42. In one embodiment, the
insulating cap layer 70 may include a dielectric material that can
be used for the insulating layers 32 as described above. The
insulating cap layer 70 may have a greater thickness than each of
the insulating layers 32. The insulating cap layer 70 can be
deposited, for example, by chemical vapor deposition. In one
embodiment, the insulating cap layer 70 can be a silicon oxide
layer.
[0054] Referring to FIGS. 2A and 2B, stepped surfaces are formed at
a peripheral region of the alternating stack (32, 42), which is
herein referred to as a terrace region. As used herein, "stepped
surfaces" refer to a set of surfaces that include at least two
horizontal surfaces and at least two vertical surfaces such that
each horizontal surface is adjoined to a first vertical surface
that extends upward from a first edge of the horizontal surface,
and is adjoined to a second vertical surface that extends downward
from a second edge of the horizontal surface. A stepped cavity is
formed within the volume from which portions of the alternating
stack (32, 42) are removed through formation of the stepped
surfaces. A "stepped cavity" refers to a cavity having stepped
surfaces.
[0055] The terrace region is formed in the staircase region 300,
which is located adjacent to the memory array region 100. The
stepped cavity may have various stepped surfaces such that the
horizontal cross-sectional shape of the stepped cavity changes in
steps as a function of the vertical distance from the top surface
of the substrate (9, 10). In one embodiment, the stepped cavity can
be formed by repetitively performing a set of processing steps. The
set of processing steps may include, for example, an etch process
of a first type that vertically increases the depth of a cavity by
one or more levels, and an etch process of a second type that
laterally expands the area to be vertically etched in a subsequent
etch process of the first type. As used herein, a "level" of a
structure including alternating plurality is defined as the
relative position of a pair of a first material layer and a second
material layer within the structure.
[0056] Each sacrificial material layer 42 other than a topmost
sacrificial material layer 42 within the alternating stack (32, 42)
laterally extends farther than any overlying sacrificial material
layer 42 within the alternating stack (32, 42) in the terrace
region. The terrace region includes stepped surfaces of the
alternating stack (32, 42) that continuously extend from a
bottommost layer within the alternating stack (32, 42) to a topmost
layer within the alternating stack (32, 42).
[0057] Each vertical step of the stepped surfaces may have the
height of one or more pairs of an insulating layer 32 and a
sacrificial material layer. In one embodiment, each vertical step
may have the height of a single pair of an insulating layer 32 and
a sacrificial material layer 42. In another embodiment, multiple
"columns" of staircases can be formed along a first horizontal
direction hd1 such that each vertical step has the height of a
plurality of pairs of an insulating layer 32 and a sacrificial
material layer 42, and the number of columns can be at least the
number of the plurality of pairs. Each column of staircase can be
vertically offset one from another such that each of the
sacrificial material layers 42 has a physically exposed top surface
in a respective column of staircases. In the illustrative example,
two columns of staircases are formed for each block of memory stack
structures to be subsequently formed such that one column of
staircases provide physically exposed top surfaces for odd-numbered
sacrificial material layers 42 (as counted from the bottom) and
another column of staircases provide physically exposed top
surfaces for even-numbered sacrificial material layers (as counted
from the bottom). Configurations using three, four, or more columns
of staircases with a respective set of vertical offsets formed
along the physically exposed surfaces of the sacrificial material
layers 42 may also be used. Each sacrificial material layer 42 has
a greater lateral extent, at least along one direction, than any
overlying sacrificial material layers 42 such that each physically
exposed surface of any sacrificial material layer 42 does not have
an overhang. In one embodiment, the vertical steps within each
column of staircases can be arranged along the first horizontal
direction hd1, and the columns of staircases can be arranged along
a second horizontal direction hd2 that is perpendicular to the
first horizontal direction hd1. In one embodiment, the first
horizontal direction hd1 can be perpendicular to the boundary
between the memory array region 100 and the staircase region
300.
[0058] A retro-stepped dielectric material portion 65 (i.e., an
insulating fill material portion) can be formed in the stepped
cavity by deposition of a dielectric material therein. For example,
a dielectric material such as silicon oxide can be deposited in the
stepped cavity. Excess portions of the deposited dielectric
material can be removed from above the top surface of the
insulating cap layer 70, for example, by chemical mechanical
planarization (CMP). The remaining portion of the deposited
dielectric material filling the stepped cavity constitutes the
retro-stepped dielectric material portion 65. As used herein, a
"retro-stepped" element refers to an element that has stepped
surfaces and a horizontal cross-sectional area that increases
monotonically as a function of a vertical distance from a top
surface of a substrate on which the element is present. If silicon
oxide is used for the retro-stepped dielectric material portion 65,
the silicon oxide of the retro-stepped dielectric material portion
65 may, or may not, be doped with dopants such as B, P, and/or
F.
[0059] Optionally, drain-select-level isolation structures 72 can
be formed through the insulating cap layer 70 and a subset of the
sacrificial material layers 42 located at drain-select-levels. The
drain-select-level isolation structures 72 can be formed, for
example, by forming drain-select-level isolation trenches and
filling the drain-select-level isolation trenches with a dielectric
material such as silicon oxide. Excess portions of the dielectric
material can be removed from above the top surface of the
insulating cap layer 70.
[0060] Referring to FIGS. 3A and 3B, a lithographic material stack
(not shown) including at least a photoresist layer can be formed
over the insulating cap layer 70 and the retro-stepped dielectric
material portion 65, and can be lithographically patterned to form
openings therein. The openings include a first set of openings
formed over the memory array region 100 and a second set of
openings formed over the staircase region 300. The pattern in the
lithographic material stack can be transferred through the
insulating cap layer 70 or the retro-stepped dielectric material
portion 65, and through the alternating stack (32, 42) by at least
one anisotropic etch that uses the patterned lithographic material
stack as an etch mask. Portions of the alternating stack (32, 42)
underlying the openings in the patterned lithographic material
stack are etched to form memory openings 49 and support openings
19. As used herein, a "memory opening" refers to a structure in
which memory elements, such as a memory stack structure, is
subsequently formed. As used herein, a "support opening" refers to
a structure in which a support structure (such as a support pillar
structure) that mechanically supports other elements is
subsequently formed. The memory openings 49 are formed through the
insulating cap layer 70 and the entirety of the alternating stack
(32, 42) in the memory array region 100. The support openings 19
are formed through the retro-stepped dielectric material portion 65
and the portion of the alternating stack (32, 42) that underlie the
stepped surfaces in the staircase region 300.
[0061] The memory openings 49 extend through the entirety of the
alternating stack (32, 42). The support openings 19 extend through
a subset of layers within the alternating stack (32, 42). The
chemistry of the anisotropic etch process used to etch through the
materials of the alternating stack (32, 42) may alternate to
optimize etching of the first and second materials in the
alternating stack (32, 42). The anisotropic etch can be, for
example, a series of reactive ion etches. The sidewalls of the
memory openings 49 and the support openings 19 can be substantially
vertical, or can be tapered. The patterned lithographic material
stack can be subsequently removed, for example, by ashing.
[0062] The memory openings 49 and the support openings 19 may
extend from the top surface of the alternating stack (32, 42) to at
least the horizontal plane including the topmost surface of the
semiconductor material layer 10. In one embodiment, an overetch
into the semiconductor material layer 10 can be optionally
performed after the top surface of the semiconductor material layer
10 is physically exposed at a bottom of each memory opening 49 and
each support opening 19. The overetch can be performed prior to, or
after, removal of the lithographic material stack. In other words,
the recessed surfaces of the semiconductor material layer 10 can be
vertically offset from the un-recessed top surfaces of the
semiconductor material layer 10 by a recess depth. The recess depth
can be, for example, in a range from 1 nm to 50 nm, although lesser
and greater recess depths may also be used. The overetch (as shown
in the figures) is optional, and can be omitted. If the overetch is
not performed, the bottom surfaces of the memory openings 49 and
the support openings 19 can be coplanar with the topmost surface of
the semiconductor material layer 10 (not shown).
[0063] Each of the memory openings 49 and the support openings 19
may include a sidewall (or a plurality of sidewalls) that extends
substantially perpendicular to the topmost surface of the
substrate. A two-dimensional array of memory openings 49 can be
formed in the memory array region 100. A two-dimensional array of
support openings 19 can be formed in the staircase region 300. The
substrate semiconductor layer 9 and the semiconductor material
layer 10 collectively constitutes a substrate (9, 10), which can be
a semiconductor substrate. Alternatively, the semiconductor
material layer 10 can be omitted, and the memory openings 49 and
the support openings 19 can be extend to a top surface of the
substrate semiconductor layer 9.
[0064] FIGS. 4A-4H illustrate structural changes in a memory
opening 49, which is one of the memory openings 49 in the exemplary
structure of FIGS. 3A and 3B. The same structural change occurs
simultaneously in each of the other memory openings 49 and in each
support opening 19.
[0065] Referring to FIG. 4A, a memory opening 49 in the exemplary
device structure of FIGS. 3A and 3B is illustrated. The memory
opening 49 extends through the insulating cap layer 70, the
alternating stack (32, 42), and optionally into an upper portion of
the semiconductor material layer 10. At this processing step, each
support opening 19 may extend through the retro-stepped dielectric
material portion 65, a subset of layers in the alternating stack
(32, 42), and optionally through the upper portion of the
semiconductor material layer 10. The recess depth of the bottom
surface of each memory opening with respect to the top surface of
the semiconductor material layer 10 can be in a range from 0 nm to
30 nm, although greater recess depths may also be used. Optionally,
the sacrificial material layers 42 can be laterally recessed
partially to form lateral recesses (not shown), for example, by an
isotropic etch.
[0066] Referring to FIG. 4B, an optional pedestal channel portion
(e.g., an epitaxial pedestal) 11 can be formed at the bottom
portion of each memory opening 49 and each support openings 19, for
example, by selective epitaxy. Each pedestal channel portion 11
comprises a single crystalline semiconductor material in epitaxial
alignment with the single crystalline semiconductor material of the
semiconductor material layer 10. In one embodiment, the pedestal
channel portion 11 can be doped with electrical dopants of the same
conductivity type as the semiconductor material layer 10. In one
embodiment, the top surface of each pedestal channel portion 11 can
be formed above a horizontal plane including the top surface of a
sacrificial material layer 42. In this case, at least one source
select gate electrode can be subsequently formed by replacing each
sacrificial material layer 42 located below the horizontal plane
including the top surfaces of the pedestal channel portions 11 with
a respective conductive material layer. The pedestal channel
portion 11 can be a portion of a transistor channel that extends
between a source region to be subsequently formed in the substrate
(9, 10) and a drain region to be subsequently formed in an upper
portion of the memory opening 49. A memory cavity 49' is present in
the unfilled portion of the memory opening 49 above the pedestal
channel portion 11. In one embodiment, the pedestal channel portion
11 may comprise single crystalline silicon. In one embodiment, the
pedestal channel portion 11 may have a doping of the first
conductivity type, which is the same as the conductivity type of
the semiconductor material layer 10 that the pedestal channel
portion contacts. If a semiconductor material layer 10 is not
present, the pedestal channel portion 11 can be formed directly on
the substrate semiconductor layer 9, which may have a doping of the
first conductivity type.
[0067] Referring to FIG. 4C, a stack of layers including a blocking
dielectric layer 52, a charge storage layer 54, a tunneling
dielectric 56, and an optional first semiconductor channel layer
601 can be sequentially deposited in the memory openings 49.
[0068] The blocking dielectric layer 52 may include a single
dielectric material layer or a stack of a plurality of dielectric
material layers. In one embodiment, the blocking dielectric layer
may include a dielectric metal oxide layer consisting essentially
of a dielectric metal oxide. As used herein, a dielectric metal
oxide refers to a dielectric material that includes at least one
metallic element and at least oxygen. The dielectric metal oxide
may consist essentially of the at least one metallic element and
oxygen, or may consist essentially of the at least one metallic
element, oxygen, and at least one non-metallic element such as
nitrogen. In one embodiment, the blocking dielectric layer 52 may
include a dielectric metal oxide having a dielectric constant
greater than 7.9, i.e., having a dielectric constant greater than
the dielectric constant of silicon nitride.
[0069] Non-limiting examples of dielectric metal oxides include
aluminum oxide (Al.sub.2O.sub.3), hafnium oxide (HfO.sub.2),
lanthanum oxide (LaO.sub.2), yttrium oxide (Y.sub.2O.sub.3),
tantalum oxide (Ta.sub.2O.sub.5), silicates thereof, nitrogen-doped
compounds thereof, alloys thereof, and stacks thereof. The
dielectric metal oxide layer can be deposited, for example, by
chemical vapor deposition (CVD), atomic layer deposition (ALD),
pulsed laser deposition (PLD), liquid source misted chemical
deposition, or a combination thereof. The thickness of the
dielectric metal oxide layer can be in a range from 1 nm to 20 nm,
although lesser and greater thicknesses may also be used. The
dielectric metal oxide layer may subsequently function as a
dielectric material portion that blocks leakage of stored
electrical charges to control gate electrodes. In one embodiment,
the blocking dielectric layer 52 includes aluminum oxide. In one
embodiment, the blocking dielectric layer 52 may include multiple
dielectric metal oxide layers having different material
compositions.
[0070] Alternatively or additionally, the blocking dielectric layer
52 may include a dielectric semiconductor compound such as silicon
oxide, silicon oxynitride, silicon nitride, or a combination
thereof. In one embodiment, the blocking dielectric layer 52 may
include silicon oxide. In this case, the dielectric semiconductor
compound of the blocking dielectric layer 52 can be formed by a
conformal deposition method such as low pressure chemical vapor
deposition, atomic layer deposition, or a combination thereof. The
thickness of the dielectric semiconductor compound can be in a
range from 1 nm to 20 nm, although lesser and greater thicknesses
may also be used. Alternatively, the blocking dielectric layer 52
can be omitted, and a backside blocking dielectric layer can be
formed after formation of backside recesses on surfaces of memory
films to be subsequently formed.
[0071] Subsequently, the charge storage layer 54 can be formed. In
one embodiment, the charge storage layer 54 can be a continuous
layer or patterned discrete portions of a charge trapping material
including a dielectric charge trapping material, which can be, for
example, silicon nitride. Alternatively, the charge storage layer
54 may include a continuous layer or patterned discrete portions of
a conductive material such as doped polysilicon or a metallic
material that is patterned into multiple electrically isolated
portions (e.g., floating gates), for example, by being formed
within lateral recesses into sacrificial material layers 42. In one
embodiment, the charge storage layer 54 includes a silicon nitride
layer. In one embodiment, the sacrificial material layers 42 and
the insulating layers 32 may have vertically coincident sidewalls,
and the charge storage layer 54 can be formed as a single
continuous layer.
[0072] In another embodiment, the sacrificial material layers 42
can be laterally recessed with respect to the sidewalls of the
insulating layers 32, and a combination of a deposition process and
an anisotropic etch process can be used to form the charge storage
layer 54 as a plurality of memory material portions that are
vertically spaced apart. While the descriptions in the present
disclosure use an embodiment in which the charge storage layer 54
is a single continuous layer, in other embodiments the charge
storage layer 54 is replaced with a plurality of memory material
portions (which can be charge trapping material portions or
electrically isolated conductive material portions) that are
vertically spaced apart.
[0073] The charge storage layer 54 can be formed as a single charge
storage layer of homogeneous composition, or may include a stack of
multiple charge storage layers. The multiple charge storage layers,
if used, may comprise a plurality of spaced-apart floating gate
material layers that contain conductive materials (e.g., metal such
as tungsten, molybdenum, tantalum, titanium, platinum, ruthenium,
and alloys thereof, or a metal silicide such as tungsten silicide,
molybdenum silicide, tantalum silicide, titanium silicide, nickel
silicide, cobalt silicide, or a combination thereof) and/or
semiconductor materials (e.g., polycrystalline or amorphous
semiconductor material including at least one elemental
semiconductor element or at least one compound semiconductor
material). Alternatively or additionally, the charge storage layer
54 may comprise an insulating charge trapping material, such as one
or more silicon nitride segments. Alternatively, the charge storage
layer 54 may comprise conductive nanoparticles such as metal
nanoparticles, which can be, for example, ruthenium nanoparticles.
The charge storage layer 54 can be formed, for example, by chemical
vapor deposition (CVD), atomic layer deposition (ALD), physical
vapor deposition (PVD), or any suitable deposition technique for
storing electrical charges therein. The thickness of the charge
storage layer 54 can be in a range from 2 nm to 20 nm, although
lesser and greater thicknesses may also be used.
[0074] The tunneling dielectric 56 includes a dielectric material
through which charge tunneling can be performed under suitable
electrical bias conditions. The charge tunneling can be performed
through hot-carrier injection or by Fowler-Nordheim tunneling
induced charge transfer depending on the mode of operation of the
monolithic three-dimensional NAND string memory device to be
formed. The tunneling dielectric 56 may include silicon oxide,
silicon nitride, silicon oxynitride, dielectric metal oxides (such
as aluminum oxide and hafnium oxide), dielectric metal oxynitride,
dielectric metal silicates, alloys thereof, and/or combinations
thereof. In one embodiment, the tunneling dielectric 56 may include
a stack of a first silicon oxide layer, a silicon oxynitride layer,
and a second silicon oxide layer, which is commonly known as an ONO
stack. In one embodiment, the tunneling dielectric 56 may include a
silicon oxide layer that is substantially free of carbon or a
silicon oxynitride layer that is substantially free of carbon. The
thickness of the tunneling dielectric 56 can be in a range from 2
nm to 20 nm, although lesser and greater thicknesses may also be
used.
[0075] The optional first semiconductor channel layer 601 includes
a semiconductor material such as at least one elemental
semiconductor material, at least one III-V compound semiconductor
material, at least one II-VI compound semiconductor material, at
least one organic semiconductor material, or other semiconductor
materials known in the art. In one embodiment, the first
semiconductor channel layer 601 includes amorphous silicon or
polysilicon. The first semiconductor channel layer 601 can be
formed by a conformal deposition method such as low pressure
chemical vapor deposition (LPCVD). The thickness of the first
semiconductor channel layer 601 can be in a range from 2 nm to 10
nm, although lesser and greater thicknesses may also be used. A
memory cavity 49' is formed in the volume of each memory opening 49
that is not filled with the deposited material layers (52, 54, 56,
601).
[0076] Referring to FIG. 4D, the optional first semiconductor
channel layer 601, the tunneling dielectric 56, the charge storage
layer 54, the blocking dielectric layer 52 are sequentially
anisotropically etched using at least one anisotropic etch process.
The portions of the first semiconductor channel layer 601, the
tunneling dielectric 56, the charge storage layer 54, and the
blocking dielectric layer 52 located above the top surface of the
insulating cap layer 70 can be removed by the at least one
anisotropic etch process. Further, the horizontal portions of the
first semiconductor channel layer 601, the tunneling dielectric 56,
the charge storage layer 54, and the blocking dielectric layer 52
at a bottom of each memory cavity 49' can be removed to form
openings in remaining portions thereof. Each of the first
semiconductor channel layer 601, the tunneling dielectric 56, the
charge storage layer 54, and the blocking dielectric layer 52 can
be etched by a respective anisotropic etch process using a
respective etch chemistry, which may, or may not, be the same for
the various material layers.
[0077] Each remaining portion of the first semiconductor channel
layer 601 may have a tubular configuration. The charge storage
layer 54 may comprise a charge trapping material or a floating gate
material. In one embodiment, each charge storage layer 54 may
include a vertical stack of charge storage regions that store
electrical charges upon programming. In one embodiment, the charge
storage layer 54 can be a charge storage layer in which each
portion adjacent to the sacrificial material layers 42 constitutes
a charge storage region.
[0078] A surface of the pedestal channel portion 11 (or a surface
of the semiconductor material layer 10 in case the pedestal channel
portions 11 are not used) can be physically exposed underneath the
opening through the first semiconductor channel layer 601, the
tunneling dielectric 56, the charge storage layer 54, and the
blocking dielectric layer 52. Optionally, the physically exposed
semiconductor surface at the bottom of each memory cavity 49' can
be vertically recessed so that the recessed semiconductor surface
underneath the memory cavity 49' is vertically offset from the
topmost surface of the pedestal channel portion 11 (or of the
semiconductor material layer 10 in case pedestal channel portions
11 are not used) by a recess distance. A tunneling dielectric 56 is
located over the charge storage layer 54. A set of a blocking
dielectric layer 52, a charge storage layer 54, and a tunneling
dielectric 56 in a memory opening 49 constitutes a memory film 50,
which includes a plurality of charge storage regions (comprising
the charge storage layer 54) that are insulated from surrounding
materials by the blocking dielectric layer 52 and the tunneling
dielectric 56. In one embodiment, the first semiconductor channel
layer 601, the tunneling dielectric 56, the charge storage layer
54, and the blocking dielectric layer 52 may have vertically
coincident sidewalls.
[0079] Referring to FIG. 4E, a second semiconductor channel layer
602 can be deposited directly on the semiconductor surface of the
pedestal channel portion 11 or the semiconductor material layer 10
if the pedestal channel portion 11 is optionally omitted, and
directly on the first semiconductor channel layer 601. The second
semiconductor channel layer 602 includes a semiconductor material
such as at least one elemental semiconductor material, at least one
III-V compound semiconductor material, at least one II-VI compound
semiconductor material, at least one organic semiconductor
material, or other semiconductor materials known in the art. In one
embodiment, the second semiconductor channel layer 602 includes
amorphous silicon or polysilicon. The second semiconductor channel
layer 602 can be formed by a conformal deposition method such as
low pressure chemical vapor deposition (LPCVD). The thickness of
the second semiconductor channel layer 602 can be in a range from 2
nm to 10 nm, although lesser and greater thicknesses may also be
used. The second semiconductor channel layer 602 may partially fill
the memory cavity 49' in each memory opening, or may fully fill the
cavity in each memory opening.
[0080] The materials of the first semiconductor channel layer 601
and the second semiconductor channel layer 602 are collectively
referred to as a semiconductor channel material. In other words,
the semiconductor channel material is a set of all semiconductor
material in the first semiconductor channel layer 601 and the
second semiconductor channel layer 602.
[0081] Referring to FIG. 4F, in case the memory cavity 49' in each
memory opening is not completely filled by the second semiconductor
channel layer 602, a dielectric core layer 62L can be deposited in
the memory cavity 49' to fill any remaining portion of the memory
cavity 49' within each memory opening. The dielectric core layer
62L includes a dielectric material such as silicon oxide or
organosilicate glass. The dielectric core layer 62L can be
deposited by a conformal deposition method such as low pressure
chemical vapor deposition (LPCVD), or by a self-planarizing
deposition process such as spin coating.
[0082] Referring to FIG. 4G, the horizontal portion of the
dielectric core layer 62L can be removed, for example, by a recess
etch from above the top surface of the insulating cap layer 70.
Each remaining portion of the dielectric core layer 62L constitutes
a dielectric core 62. Further, the horizontal portion of the second
semiconductor channel layer 602 located above the top surface of
the insulating cap layer 70 can be removed by a planarization
process, which may use a recess etch or chemical mechanical
planarization (CMP). Each remaining portion of the second
semiconductor channel layer 602 can be located entirety within a
memory opening 49 or entirely within a support opening 19.
[0083] Each adjoining pair of a first semiconductor channel layer
601 and a second semiconductor channel layer 602 may collectively
form a vertical semiconductor channel 60 through which electrical
current may flow when a vertical NAND device including the vertical
semiconductor channel 60 is turned on. A tunneling dielectric 56 is
surrounded by a charge storage layer 54, and laterally surrounds a
portion of the vertical semiconductor channel 60. Each adjoining
set of a blocking dielectric layer 52, a charge storage layer 54,
and a tunneling dielectric 56 collectively constitute a memory film
50, which may store electrical charges with a macroscopic retention
time. In some embodiments, a blocking dielectric layer 52 may not
be present in the memory film 50 at this step, and a blocking
dielectric layer can be subsequently formed after formation of
backside recesses. As used herein, a macroscopic retention time
refers to a retention time suitable for operation of a memory
device as a permanent memory device such as a retention time in
excess of 24 hours.
[0084] Referring to FIG. 4H, the top surface of each dielectric
core 62 can be further recessed within each memory opening, for
example, by a recess etch to a depth that is located between the
top surface of the insulating cap layer 70 and the bottom surface
of the insulating cap layer 70. Drain regions 63 can be formed by
depositing a doped semiconductor material within each recessed
region above the dielectric cores 62. The drain regions 63 may have
a doping of a second conductivity type that is the opposite of the
first conductivity type. For example, if the first conductivity
type is p-type, the second conductivity type is n-type, and vice
versa. The dopant concentration in the drain regions 63 can be in a
range from 5.0.times.10.sup.19/cm.sup.3 to
2.0.times.10.sup.21/cm.sup.3, although lesser and greater dopant
concentrations may also be used. The doped semiconductor material
can be, for example, doped polysilicon. Excess portions of the
deposited semiconductor material can be removed from above the top
surface of the insulating cap layer 70, for example, by chemical
mechanical planarization (CMP) or a recess etch to form the drain
regions 63.
[0085] Each combination of a memory film 50 and a vertical
semiconductor channel 60 within a memory opening 49 constitutes a
memory stack structure 55. The memory stack structure 55 is a
combination of a semiconductor channel, a tunneling dielectric, a
plurality of memory elements comprising portions of the charge
storage layer 54, and an optional blocking dielectric layer 52.
Each combination of a pedestal channel portion 11 (if present), a
memory stack structure 55, a dielectric core 62, and a drain region
63 within a memory opening 49 is herein referred to as a memory
opening fill structure 58. Each combination of a pedestal channel
portion 11 (if present), a memory film 50, a vertical semiconductor
channel 60, a dielectric core 62, and a drain region 63 within each
support opening 19 fills the respective support openings 19, and
constitutes a support pillar structure.
[0086] Referring to FIG. 5, the exemplary structure is illustrated
after formation of memory opening fill structures 58 and support
pillar structure 20 within the memory openings 49 and the support
openings 19, respectively. An instance of a memory opening fill
structure 58 can be formed within each memory opening 49 of the
structure of FIGS. 4A and 4B. An instance of the support pillar
structure 20 can be formed within each support opening 19 of the
structure of FIGS. 4A and 4B.
[0087] Each memory stack structure 55 includes a vertical
semiconductor channel 60, which may comprise multiple semiconductor
channel layers (601, 602), and a memory film 50. The memory film 50
may comprise a tunneling dielectric 56 laterally surrounding the
vertical semiconductor channel 60 and a vertical stack of charge
storage regions laterally surrounding the tunneling dielectric 56
(comprising a charge storage layer 54) and an optional blocking
dielectric layer 52. While the descriptions in present disclosure
use the illustrated configuration for the memory stack structure,
the methods of various embodiments of the present disclosure can be
applied to alternative memory stack structures including different
layer stacks or structures for the memory film 50 and/or for the
vertical semiconductor channel 60.
[0088] Referring to FIGS. 6A and 6B, a contact-level dielectric
layer 73 can be formed over the alternating stack (32, 42) of
insulating layer 32 and sacrificial material layers 42, and over
the memory stack structures 55 and the support pillar structures
20. Contact via structures are subsequently formed through the
contact-level dielectric layer 73. The contact-level dielectric
layer 73 includes a dielectric material that is different from the
dielectric material of the sacrificial material layers 42. For
example, the contact-level dielectric layer 73 may include silicon
oxide. The contact-level dielectric layer 73 may have a thickness
in a range from 50 nm to 500 nm, although lesser and greater
thicknesses may also be used.
[0089] A photoresist layer (not shown) can be applied over the
contact-level dielectric layer 73, and is lithographically
patterned to form openings in areas between clusters of memory
stack structures 55. The pattern in the photoresist layer can be
transferred through the contact-level dielectric layer 73, the
alternating stack (32, 42) and/or the retro-stepped dielectric
material portion 65 using an anisotropic etch to form backside
trenches 79, which vertically extend from the top surface of the
contact-level dielectric layer 73 at least to the top surface of
the substrate (9, 10), and laterally extend through the memory
array region 100 and the staircase region 300.
[0090] In one embodiment, the backside trenches 79 may laterally
extend along a first horizontal direction hd1 and can be laterally
spaced apart one from another along a second horizontal direction
hd2 that is perpendicular to the first horizontal direction hd1.
The memory stack structures 55 can be arranged in rows that extend
along the first horizontal direction hd1. The drain-select-level
isolation structures 72 may laterally extend along the first
horizontal direction hd1. Each backside trench 79 may have a
uniform width that is invariant along the lengthwise direction
(i.e., along the first horizontal direction hd1). Each
drain-select-level isolation structure 72 may have a uniform
vertical cross-sectional profile along vertical planes that are
perpendicular to the first horizontal direction hd1 that is
invariant with translation along the first horizontal direction
hd1. Multiple rows of memory stack structures 55 can be located
between a neighboring pair of a backside trench 79 and a
drain-select-level isolation structure 72, or between a neighboring
pair of drain-select-level isolation structures 72. In one
embodiment, the backside trenches 79 may include a source contact
opening in which a source contact structure can be subsequently
formed. The photoresist layer can be removed, for example, by
ashing.
[0091] Referring to FIGS. 7 and 8A, an etchant that selectively
etches the second material of the sacrificial material layers 42
with respect to the first material of the insulating layers 32 can
be introduced into the backside trenches 79, for example, using an
etch process. FIG. 9A illustrates a region of the exemplary
structure of FIG. 8. Backside recesses 43 are formed in volumes
from which the sacrificial material layers 42 are removed. The
removal of the second material of the sacrificial material layers
42 can be selective to the first material of the insulating layers
32, the material of the retro-stepped dielectric material portion
65, the semiconductor material of the semiconductor material layer
10, and the material of the outermost layer of the memory films 50.
In one embodiment, the sacrificial material layers 42 may include
silicon nitride, and the materials of the insulating layers 32 and
the retro-stepped dielectric material portion 65 can be selected
from silicon oxide and dielectric metal oxides.
[0092] The etch process that removes the second material selective
to the first material and the outermost layer of the memory films
50 can be a wet etch process using a wet etch solution, or can be a
gas phase (dry) etch process in which the etchant is introduced in
a vapor phase into the backside trenches 79. For example, if the
sacrificial material layers 42 include silicon nitride, the etch
process can be a wet etch process in which the exemplary structure
is immersed within a wet etch tank including phosphoric acid, which
etches silicon nitride selective to silicon oxide, silicon, and
various other materials used in the art. The support pillar
structure 20, the retro-stepped dielectric material portion 65, and
the memory stack structures 55 provide structural support while the
backside recesses 43 are present within volumes previously occupied
by the sacrificial material layers 42.
[0093] Each backside recess 43 can be a laterally extending cavity
having a lateral dimension that is greater than the vertical extent
of the cavity. In other words, the lateral dimension of each
backside recess 43 can be greater than the height of the backside
recess 43. A plurality of backside recesses 43 can be formed in the
volumes from which the second material of the sacrificial material
layers 42 is removed. The memory openings in which the memory stack
structures 55 are formed are herein referred to as front side
openings or front side cavities in contrast with the backside
recesses 43. In one embodiment, the memory array region 100
comprises an array of monolithic three-dimensional NAND strings
having a plurality of device levels disposed above the substrate
(9, 10). In this case, each backside recess 43 may define a space
for receiving a respective word line of the array of monolithic
three-dimensional NAND strings.
[0094] Each of the plurality of backside recesses 43 may extend
substantially parallel to the top surface of the substrate (9, 10).
A backside recess 43 can be vertically bounded by a top surface of
an underlying insulating layer 32 and a bottom surface of an
overlying insulating layer 32. In one embodiment, each backside
recess 43 may have a uniform height throughout.
[0095] Physically exposed surface portions of the optional pedestal
channel portions 11 and the semiconductor material layer 10 can be
converted into dielectric material portions by thermal conversion
and/or plasma conversion of the semiconductor materials into
dielectric materials. For example, thermal conversion and/or plasma
conversion can be used to convert a surface portion of each
pedestal channel portion 11 into a tubular dielectric spacer 115,
and to convert each physically exposed surface portion of the
semiconductor material layer 10 into a planar dielectric portion
616. In one embodiment, each tubular dielectric spacer 115 can be
topologically homeomorphic to a torus, i.e., generally ring-shaped.
As used herein, an element is topologically homeomorphic to a torus
if the shape of the element can be continuously stretched without
destroying a hole or forming a new hole into the shape of a torus.
The tubular dielectric spacers 115 include a dielectric material
that includes the same semiconductor element as the pedestal
channel portions 11 and additionally includes at least one
non-metallic element such as oxygen and/or nitrogen such that the
material of the tubular dielectric spacers 115 is a dielectric
material. In one embodiment, the tubular dielectric spacers 115 may
include a dielectric oxide, a dielectric nitride, or a dielectric
oxynitride of the semiconductor material of the pedestal channel
portions 11. Likewise, each planar dielectric portion 616 includes
a dielectric material that includes the same semiconductor element
as the semiconductor material layer and additionally includes at
least one non-metallic element such as oxygen and/or nitrogen such
that the material of the planar dielectric portions 616 is a
dielectric material. In one embodiment, the planar dielectric
portions 616 may include a dielectric oxide, a dielectric nitride,
or a dielectric oxynitride of the semiconductor material of the
semiconductor material layer 10.
[0096] Referring to FIG. 8B, a backside blocking dielectric layer
44 can be optionally formed. The backside blocking dielectric layer
44, if present, comprises a dielectric material that functions as a
control gate dielectric for the control gates to be subsequently
formed in the backside recesses 43. In case the blocking dielectric
layer 52 is present within each memory opening, the backside
blocking dielectric layer 44 is optional. In case the blocking
dielectric layer 52 is omitted, the backside blocking dielectric
layer 44 is present.
[0097] The backside blocking dielectric layer 44 can be formed in
the backside recesses 43 and on a sidewall of the backside trench
79. The backside blocking dielectric layer 44 can be formed
directly on horizontal surfaces of the insulating layers 32 and
sidewalls of the memory stack structures 55 within the backside
recesses 43. If the backside blocking dielectric layer 44 is
formed, formation of the tubular dielectric spacers 115 and the
planar dielectric portion 616 prior to formation of the backside
blocking dielectric layer 44 is optional. In one embodiment, the
backside blocking dielectric layer 44 can be formed by a conformal
deposition process such as atomic layer deposition (ALD). The
backside blocking dielectric layer 44 may consist essentially of
aluminum oxide. The thickness of the backside blocking dielectric
layer 44 can be in a range from 1 nm to 15 nm, such as 2 to 6 nm,
although lesser and greater thicknesses may also be used.
[0098] The dielectric material of the backside blocking dielectric
layer 44 can be a dielectric metal oxide such as aluminum oxide, a
dielectric oxide of at least one transition metal element, a
dielectric oxide of at least one Lanthanide element, a dielectric
oxide of a combination of aluminum, at least one transition metal
element, and/or at least one Lanthanide element. Alternatively or
additionally, the backside blocking dielectric layer 44 may include
a silicon oxide layer. The backside blocking dielectric layer 44
can be deposited by a conformal deposition method such as chemical
vapor deposition or atomic layer deposition. The backside blocking
dielectric layer 44 is formed on the sidewalls of the backside
trenches 79, horizontal surfaces and sidewalls of the insulating
layers 32, the portions of the sidewall surfaces of the memory
stack structures 55 that are physically exposed to the backside
recesses 43, and a top surface of the planar dielectric portion
616. A backside cavity 79' is present within the portion of each
backside trench 79 that is not filled with the backside blocking
dielectric layer 44.
[0099] Referring to FIG. 8C, a metallic barrier layer 46A can be
deposited in the backside recesses 43. The metallic barrier layer
46A includes an electrically conductive metallic material that may
function as a diffusion barrier layer and/or adhesion promotion
layer for a metallic fill material to be subsequently deposited.
The metallic barrier layer 46A may include a conductive metallic
nitride material such as TiN, TaN, WN, or a stack thereof, or may
include a conductive metallic carbide material such as TiC, TaC,
WC, or a stack thereof. In one embodiment, the metallic barrier
layer 46A can be deposited by a conformal deposition process such
as chemical vapor deposition (CVD) or atomic layer deposition
(ALD). The thickness of the metallic barrier layer 46A can be in a
range from 2 nm to 8 nm, such as from 3 nm to 6 nm, although lesser
and greater thicknesses may also be used. In one embodiment, the
metallic barrier layer 46A may consist essentially of a conductive
metal nitride such as TiN.
[0100] Referring to FIGS. 8D and 9, a metal fill material is
deposited in the plurality of backside recesses 43, on the
sidewalls of the at least one the backside trench 79, and over the
top surface of the contact-level dielectric layer 73 to form a
metallic fill material layer 46B. The metallic fill material can be
deposited by a conformal deposition method, which can be, for
example, chemical vapor deposition (CVD), atomic layer deposition
(ALD), electroless plating, electroplating, or a combination
thereof. In one embodiment, the metallic fill material layer 46B
may consist essentially of at least one elemental metal. The at
least one elemental metal of the metallic fill material layer 46B
can be selected, for example, from tungsten, cobalt, ruthenium,
titanium, and tantalum. In one embodiment, the metallic fill
material layer 46B may consist essentially of a single elemental
metal. In one embodiment, the metallic fill material layer 46B can
be deposited using a fluorine-containing precursor gas such as
WF.sub.6. In one embodiment, the metallic fill material layer 46B
can be a tungsten layer including a residual level of fluorine
atoms as impurities. The metallic fill material layer 46B is spaced
from the insulating layers 32 and the memory stack structures 55 by
the metallic barrier layer 46A, which is a metallic barrier layer
that blocks diffusion of fluorine atoms therethrough.
[0101] A plurality of electrically conductive layers 46 can be
formed in the plurality of backside recesses 43, and a continuous
electrically conductive material layer 46L can be formed on the
sidewalls of each backside trench 79 and over the contact-level
dielectric layer 73. Each electrically conductive layer 46 includes
a portion of the metallic barrier layer 46A and a portion of the
metallic fill material layer 46B that are located between a
vertically neighboring pair of dielectric material layers such as a
pair of insulating layers 32. The continuous electrically
conductive material layer 46L includes a continuous portion of the
metallic barrier layer 46A and a continuous portion of the metallic
fill material layer 46B that are located in the backside trenches
79 or above the contact-level dielectric layer 73.
[0102] Each sacrificial material layer 42 can be replaced with an
electrically conductive layer 46. A backside cavity 79' is present
in the portion of each backside trench 79 that is not filled with
the backside blocking dielectric layer 44 and the continuous
electrically conductive material layer 46L. A tubular dielectric
spacer 115 laterally surrounds a pedestal channel portion 11. A
bottommost electrically conductive layer 46 laterally surrounds
each tubular dielectric spacer 115 upon formation of the
electrically conductive layers 46.
[0103] Referring to FIGS. 10A and 10B, the deposited metallic
material of the continuous electrically conductive material layer
46L is etched back from the sidewalls of each backside trench 79
and from above the contact-level dielectric layer 73, for example,
by an isotropic wet etch, an anisotropic dry etch, or a combination
thereof. Each remaining portion of the deposited metallic material
in the backside recesses 43 constitutes an electrically conductive
layer 46. Each electrically conductive layer 46 can be a conductive
line structure. Thus, the sacrificial material layers 42 are
replaced with the electrically conductive layers 46.
[0104] Each electrically conductive layer 46 may function as a
combination of a plurality of control gate electrodes located at a
same level and a word line electrically interconnecting, i.e.,
electrically connecting, the plurality of control gate electrodes
located at the same level. The plurality of control gate electrodes
within each electrically conductive layer 46 are the control gate
electrodes for the vertical memory devices including the memory
stack structures 55. In other words, each electrically conductive
layer 46 can be a word line that functions as a common control gate
electrode for the plurality of vertical memory devices.
[0105] In one embodiment, the removal of the continuous
electrically conductive material layer 46L can be selective to the
material of the backside blocking dielectric layer 44. In this
case, a horizontal portion of the backside blocking dielectric
layer 44 can be present at the bottom of each backside trench 79.
In another embodiment, the removal of the continuous electrically
conductive material layer 46L may not be selective to the material
of the backside blocking dielectric layer 44 or, the backside
blocking dielectric layer 44 may not be used. The planar dielectric
portions 616 can be removed during removal of the continuous
electrically conductive material layer 46L. A backside cavity 79'
is present within each backside trench 79.
[0106] Referring to FIGS. 11A and 11B, an insulating material layer
can be formed in the backside trenches 79 and over the
contact-level dielectric layer 73 by a conformal deposition
process. Exemplary conformal deposition processes include, but are
not limited to, chemical vapor deposition and atomic layer
deposition. The insulating material layer includes an insulating
material such as silicon oxide, silicon nitride, a dielectric metal
oxide, an organosilicate glass, or a combination thereof. In one
embodiment, the insulating material layer may include silicon
oxide. The insulating material layer can be formed, for example, by
low pressure chemical vapor deposition (LPCVD) or atomic layer
deposition (ALD). The thickness of the insulating material layer
can be in a range from 1.5 nm to 60 nm, although lesser and greater
thicknesses may also be used.
[0107] If a backside blocking dielectric layer 44 is present, the
insulating material layer can be formed directly on surfaces of the
backside blocking dielectric layer 44 and directly on the sidewalls
of the electrically conductive layers 46. If a backside blocking
dielectric layer 44 is not used, the insulating material layer can
be formed directly on sidewalls of the insulating layers 32 and
directly on sidewalls of the electrically conductive layers 46.
[0108] An anisotropic etch is performed to remove horizontal
portions of the insulating material layer from above the
contact-level dielectric layer 73 and at the bottom of each
backside trench 79. Each remaining portion of the insulating
material layer constitutes an insulating spacer 74. A backside
cavity 79' is present within a volume surrounded by each insulating
spacer 74. A top surface of the semiconductor material layer 10 can
be physically exposed at the bottom of each backside trench 79.
[0109] A source region 61 can be formed at a surface portion of the
semiconductor material layer 10 under each backside cavity 79' by
implantation of electrical dopants into physically exposed surface
portions of the semiconductor material layer 10. Each source region
61 is formed in a surface portion of the substrate (9, 10) that
underlies a respective opening through the insulating spacer 74.
Due to the straggle of the implanted dopant atoms during the
implantation process and lateral diffusion of the implanted dopant
atoms during a subsequent activation anneal process, each source
region 61 may have a lateral extent greater than the lateral extent
of the opening through the insulating spacer 74.
[0110] An upper portion of the semiconductor material layer 10 that
extends between the source region 61 and the plurality of pedestal
channel portions 11 constitutes a horizontal semiconductor channel
59 for a plurality of field effect transistors. The horizontal
semiconductor channel 59 is connected to multiple vertical
semiconductor channels 60 through respective pedestal channel
portions 11. The horizontal semiconductor channel 59 contacts the
source region 61 and the plurality of pedestal channel portions 11.
A bottommost electrically conductive layer 46 provided upon
formation of the electrically conductive layers 46 within the
alternating stack (32, 46) may comprise a select gate electrode for
the field effect transistors. Each source region 61 is formed in an
upper portion of the substrate (9, 10). Semiconductor channels (59,
11, 60) extend between each source region 61 and a respective set
of drain regions 63. The semiconductor channels (59, 11, 60)
include the vertical semiconductor channels 60 of the memory stack
structures 55.
[0111] A source contact via structure 76 can be formed within each
backside cavity 79'. Each source contact via structure 76 may fill
a respective backside cavity 79'. The source contact via structures
76 can be formed by depositing at least one conductive material in
the remaining unfilled volume (i.e., the backside cavity 79') of
the backside trench 79. For example, the at least one conductive
material may include a conductive liner 76A and a conductive fill
material portion 76B. The conductive liner 76A may include a
conductive metallic liner such as TiN, TaN, WN, TiC, TaC, WC, an
alloy thereof, or a stack thereof. The thickness of the conductive
liner 76A can be in a range from 3 nm to 30 nm, although lesser and
greater thicknesses may also be used. The conductive fill material
portion 76B may include a metal or a metallic alloy. For example,
the conductive fill material portion 76B may include W, Cu, Al, Co,
Ru, Ni, an alloy thereof, or a stack thereof.
[0112] The at least one conductive material can be planarized using
the contact-level dielectric layer 73 overlying the alternating
stack (32, 46) as a stopping layer. If chemical mechanical
planarization (CMP) process is used, the contact-level dielectric
layer 73 can be used as a CMP stopping layer. Each remaining
continuous portion of the at least one conductive material in the
backside trenches 79 constitutes a source contact via structure
76.
[0113] The source contact via structure 76 extends through the
alternating stack (32, 46), and contacts a top surface of the
source region 61. If a backside blocking dielectric layer 44 is
used, the source contact via structure 76 may contact a sidewall of
the backside blocking dielectric layer 44.
[0114] Referring to FIGS. 12A and 12B, layer contact via structures
86 can be formed through the contact-level dielectric layer 73 and
the retro-stepped dielectric material portion 65 to a top surface
of a respective one of the electrically conductive layers 46 in the
staircase region. The layer contact via structures 86 include word
line contact via structures that contact a subset of the
electrically conductive layers 46 that functions as word lines. In
one embodiment, top surfaces of the layer contact via structures 86
can be coplanar with the top surface of the contact-level
dielectric layer 73.
[0115] Further, drain contact via structures 88 can be formed on a
respective one of the drain regions 63. The drain contact via
structures 88 extend through the contact-level dielectric layer 73,
and contact a top surface of a respective one of the drain regions
63. Each drain contact via structure 88 may have a cylindrical
shape, i.e., a shape having horizontal cross-sectional area that is
invariant with translation along the vertical direction.
[0116] Referring to FIGS. 13A and 13B, a base-line-level dielectric
layer 181 can be deposited over the contact-level dielectric layer
73. Base-level metal lines, i.e., bottommost metal lines, are
subsequently formed through the base-line-level dielectric layer
181. The base-line-level dielectric layer 181 includes a dielectric
material such as silicon oxide. Line trenches can be formed through
the base-line-level dielectric layer 181 over the layer contact via
structures 86. The line trenches in the base-line-level dielectric
layer 181 can be filled with at least one conductive material to
form base-level metal lines 182 that contact a top surface of a
respective underlying one of the layer contact via structures
181.
[0117] Alternatively, the base-line-level dielectric layer 181 can
be formed over the contact-level dielectric layer 73 prior to
formation of the layer contact via structures 86, and integrated
line and via cavities can be formed through the base-line-level
dielectric layer 181, the contact-level dielectric layer 73, and
the retro-stepped dielectric material portion 65. Each integrated
line and via cavity may include a combined volume for a layer
contact via structure 86 and a base-level metal line 182. The
integrated line and via cavities are filled with at least one
conductive material to form integrated line and via structures.
Each integrated line and via structure may include a combination of
a layer contact via structure 86 and a base-level metal line
182.
[0118] A connection-via-level dielectric layer 183 can be formed
over the base-line-level dielectric layer 181. Connection via
structures are subsequently formed through the connection-via-level
dielectric layer 183. The connection-via-level dielectric layer 183
includes a dielectric material such as silicon oxide. Connection
via cavities extending through the connection-via-level dielectric
layer 183 and optionally extending through the base-line-level
dielectric layer 181 can be formed, for example, by application and
patterning of a photoresist layer (not shown) over the
connection-via-level dielectric layer 183, and by an anisotropic
etch process that transfers the pattern in the photoresist layer
through underlying portions of the connection-via-level dielectric
layer 183 and optionally through the base-line-level dielectric
layer 181. The connection via cavities can be formed over the
base-level metal line 182, the drain contact via structures 88, and
the source contact via structures 76, which may function as etch
stop structures during formation of the connection via cavities.
The photoresist layer can be removed, for example, by ashing.
[0119] At least one conductive material can be deposited in the
connection via cavities, and excess portions of the at least one
conductive material can be removed from above the horizontal plane
including the top surface of the connection-via-level dielectric
layer 183 by a planarization process such as a recess etch or
chemical mechanical planarization. Various connection via
structures (116, 114, 118) can be formed through the
connection-via-level dielectric layer 183 and optionally through
the base-line-level dielectric layer 181. The connection via
structures (116, 114, 118) can include, for example,
word-line-connection via structures 116 contacting a respective one
of the base-level metal line 182 and connected to a respective word
line contact via structure and an electrically conductive layer,
source-connection via structures 114 contacting a respective one of
the source contact via structures 76, and bit-line-connection via
structures 118 contacting a respective one of the drain contact via
structures 88. The bit-line-connection via structures 118 can be
elongated along the direction of bit lines to be subsequently
formed, which can be the second horizontal direction hd2.
[0120] A first line-level dielectric layer 120 can be deposited
over the connection-via-level dielectric layer 183. First-level
metal line structures are subsequently formed in the first
line-level dielectric layer 120. The first line-level dielectric
layer 120 includes a dielectric material such as silicon oxide, and
can have a thickness in a range from 100 nm to 400 nm, although
lesser and greater thicknesses can also be used. Line trenches can
be formed through the first line-level dielectric layer 120 over
the connection via structures (116, 114, 118). The line trenches in
the first line-level dielectric layer 120 can be filled with at
least one conductive material to form first-level metal line
structures (124, 126, 128) that contact a top surface of a
respective underlying one of the connection via structures (116,
114, 118). The first-level metal line structures (124, 126, 128)
can include first word-line-interconnect metal lines 126 contacting
a respective one of the word-line-connection via structures 116,
first source-interconnect metal lines 124 contacting a respective
one of the source-connection via structures 114, and bit lines 128
contacting a respective one of the bit-line-connection via
structures 118
[0121] Alternatively, the first line-level dielectric layer 120 can
be formed over the connection-via-level dielectric layer 183 prior
to formation of the connection via structures (116, 114, 118), and
integrated line and via cavities can be formed through the first
line-level dielectric layer 120 and the connection-via-level
dielectric layer 183. Each integrated line and via cavity may
include a combined volume for an adjoining pair of a first-level
metal line structure (124, 126, 128) and a connection via structure
(116, 114, 118). The integrated line and via cavities are filled
with at least one conductive material to form integrated line and
via structures. Each integrated line and via structure may include
a combination of a first-level metal line structure (124, 126, 128)
and a connection via structure (116, 114, 118).
[0122] In one embodiment, the bit lines 128 may laterally extend
along the second horizontal direction (e.g., bit line direction)
hd2, and can be laterally spaced apart along the first horizontal
direction (e.g., word line direction) hd1 with a uniform pitch,
which is herein referred to as a bit line pitch. The first
source-interconnect metal lines 124 and the first
word-line-interconnect metal lines 126 may laterally extend along
the first horizontal direction hd1, and can be formed in the
staircase region 300. Each source region 61 can be electrically
connected to a respective set of at least one first
source-interconnect metal line 124 through a respective source
contact via structure 76 and a respective at least one
source-connection via structure 114.
[0123] Referring to FIGS. 14A and 14B, a first via-level dielectric
layer 130 can be deposited over the first line-level dielectric
layer 120. The first via-level dielectric layer 130 includes a
dielectric material such as undoped silicate glass, a doped
silicate glass, or an organosilicate glass. The thickness of the
first via-level dielectric layer 130 can be in a range from 50 nm
to 300 nm, although lesser and greater thicknesses may also be
used.
[0124] Via cavities are formed through the first via-level
dielectric layer 130, for example, by applying and patterning of a
photoresist layer (not shown) over the first via-level dielectric
layer 130 and by anisotropically etching unmasked portions of the
first via-level dielectric layer 130. The photoresist layer can be
subsequently removed. At least one conductive material can be
deposited in the via cavities to form first metal via structures
(134, 136). The first metal via structures (134, 136) may include
first source-interconnect via structures 134 that are formed on a
respective one of the first source-interconnect metal lines 124,
first word-line-interconnect via structures 136 that are formed on
a respective one of the first word-line-interconnect metal lines
126, and first bit-line-interconnect via structures (not shown)
that are formed on a top surface of a respective one of the bit
lines 128.
[0125] A second line-level dielectric layer 140 can be deposited
over the first via-level dielectric layer 130. The second
line-level dielectric layer 140 includes a dielectric material such
as undoped silicate glass, a doped silicate glass, or an
organosilicate glass. The thickness of the second line-level
dielectric layer 140 can be in a range from 50 nm to 300 nm,
although lesser and greater thicknesses may also be used.
[0126] Line cavities are formed through the second line-level
dielectric layer 140, for example, by application and patterning of
a photoresist layer (not shown) over the second line-level
dielectric layer 140 and by anisotropically etching unmasked
portions of the second line-level dielectric layer 140. The
photoresist layer can be subsequently removed. A conductive
material can be deposited in the line cavities to form various
second-level metal line structures (142, 148, 144, 146). The
second-level metal line structures (142, 148, 144, 146) may include
bit-line-interconnect metal lines 148 that are formed on a top
surface of a respective one of the first bit-line-interconnect via
structures, second source-interconnect metal lines 144 that are
formed on a top surface of a respective one of the first
source-interconnect via structures 134, and second
word-line-interconnect metal lines 146 that are formed on a top
surface of a respective one of the first word-line-interconnect via
structures 136.
[0127] In one embodiment, the bit-line-interconnect metal lines 148
may be formed in a respective peripheral region 200, which can be
located adjacent to a memory array region 100 and a staircase
region 300. The second source-interconnect metal lines 144 can be
formed throughout memory array regions 100 to facilitate
distribution of a source bias voltage throughout each memory array
region 100. The second word-line-interconnect metal lines 146 can
be formed in the staircase regions 300.
[0128] The second-level metal line structures (142, 148, 144, 146)
can include interconnects, e.g., metal lines, that are used to
provide an electrically conductive connection between semiconductor
devices within a support die to be subsequently bonded to the
memory die incorporating the exemplary structure. The semiconductor
devices in the support die 700 include peripheral devices 710, such
as transistors (e.g., CMOS configuration transistors) that are
configured to control operation of the memory elements within the
memory die. The metal lines can be used to provide electrically
conductive signal paths between various nodes of the peripheral
devices of the support die. Such interconnects (e.g., metal lines)
are herein referred to as peripheral-signal-path metal lines 142,
which can be a subset of the second-level metal line structures
(142, 148, 144, 146). Thus, the peripheral-signal-path metal lines
142 provide signal paths through the memory die 900 between the
peripheral devices 710 in a support die 700 to be subsequently
bonded to the memory die 900 that incorporate the exemplary
structure.
[0129] In one embodiment, a memory die that that incorporates the
exemplary structure can include a plurality of planes, i.e., an
assembly of devices that is capable of independently executing an
external command without being limited by operational status of any
external device. In one embodiment, a combination of a memory array
region 100, at least one staircase region 300, and a peripheral
region 200 constitutes a plane 500. A memory die can include a
plurality of planes 500. In one embodiment, a subset of the
peripheral-signal-path metal lines 142 can continuously extend
between two planes 500 over the memory devices and the bit lines
128. Additionally or alternatively, a subset of the
peripheral-signal-path metal lines 142 can be confined within a
plane 500 over the memory devices and the bit lines 128. The
peripheral-signal-path metal lines 142 can extend between a pair of
memory array regions 100 located within different planes 500,
between a pair of staircase regions 300 located within different
planes 500, between a pair of peripheral regions 200 located within
different planes 500, and/or between any one of a memory array
region 100, a staircase region 300, and a peripheral region 200 of
a first plane 500 and any one of memory array region 100, a
staircase region 300, and a peripheral region 200 of a second plane
500.
[0130] Referring to FIGS. 15A and 15B, a second via-level
dielectric layer 150 can be deposited over the second line-level
dielectric layer 140. The second via-level dielectric layer 150
includes a dielectric material such as undoped silicate glass, a
doped silicate glass, or an organosilicate glass. The thickness of
the second via-level dielectric layer 150 can be in a range from 50
nm to 300 nm, although lesser and greater thicknesses may also be
used.
[0131] Via cavities are formed through the second via-level
dielectric layer 150, for example, by applying and patterning of a
photoresist layer (not shown) over the second via-level dielectric
layer 150 and by anisotropically etching unmasked portions of the
second via-level dielectric layer 150. The photoresist layer can be
subsequently removed. At least one conductive material can be
deposited in the via cavities to form second metal via structures
(152, 154, 156). The second metal via structures (152, 154, 156)
may include second source-interconnect via structures 154 that are
formed on a respective one of the second source-interconnect metal
lines 144, second word-line-interconnect via structures 156 that
are formed on a respective one of the second word-line-interconnect
metal lines 146, and second bit-line-interconnect via structures
(not shown) that are formed on a top surface of a respective one of
the bit-line-interconnect metal lines 148. Further, the second
metal via structures (152, 154, 156) can include metal via
structures that contact a respective one of the
peripheral-signal-path metal lines 142. Each metal via structure
that contacts a peripheral-signal-path metal line 142 can be used
as a component of a signal path for signals between nodes of the
peripheral devices to be bonded to the memory die 900 including the
exemplary structure, and is herein referred to as
peripheral-signal-path metal via structure 152. In one embodiment,
at least two peripheral-signal-path metal via structure 152 can be
formed on a peripheral-signal-path metal line 142. The least two
peripheral-signal-path metal via structure 152 contacting a same
peripheral-signal-path metal line 142 can be formed in a pair of
memory array regions 100 located within different planes 500, in a
pair of staircase regions 300 located within different planes 500,
in a pair of peripheral regions located within different planes
500, and/or in any one of a memory array region 100, a staircase
region 300, and a peripheral region 200 of a first plane 500 and in
any one of memory array region 100, a staircase region 300, and a
peripheral region 200 of a second plane 500.
[0132] Optionally, at least one additional line-level dielectric
layer including additional metal lines and/or at least one
additional via-level dielectric layer including additional metal
via structures can be formed over the second via-level dielectric
layer 150. In this case, the additional metal lines and the
additional metal via structures can provide electrical connection
through the at least one additional line-level dielectric layer
and/or the at least one additional via-level dielectric layer for
each of the second metal via structures (152, 154, 156).
[0133] A memory-side pad-level dielectric layer 980 can be
deposited over the second via-level dielectric layer 150 (and over
any additional line-level dielectric layer and/or any additional
via-level dielectric layer, if present). The memory-side pad-level
dielectric layer 980 includes a dielectric material such as silicon
nitride, undoped silicate glass, a doped silicate glass, and/or an
organosilicate glass. The thickness of the memory-side pad-level
dielectric layer 980 can be in a range from 50 nm to 300 nm,
although lesser and greater thicknesses may also be used.
[0134] The set of all dielectric material layers that overlie the
insulating cap layer 70 is collectively referred to as memory-die
interconnect dielectric layers (73, 181, 183, 120, 130, 140, 150,
980). The memory-die interconnect dielectric layers (73, 181, 183,
120, 130, 140, 150, 980) can include the contact-level dielectric
layer 73, the base-line-level dielectric layer 181, the
connection-via-level dielectric layer 183, the first line-level
dielectric layer 120, the first via-level dielectric layer 130, the
second line-level dielectric layer 140, the second via-level
dielectric layer 150, any additional line-level dielectric layer
(if present), any additional via-level dielectric layer (if
present), and the memory-side pad-level dielectric layer 980. The
set of all metal line structures and all metal via structures
embedded in the memory-die interconnect dielectric layers (73, 181,
183, 120, 130, 140, 150, 980) is herein referred to as memory-die
metal interconnect structures.
[0135] Pad cavities are formed through the memory-side pad-level
dielectric layer 980, for example, by application and patterning of
a photoresist layer (not shown) over the memory-side pad-level
dielectric layer 980 and by anisotropically etching unmasked
portions of the memory-side pad-level dielectric layer 980. The
photoresist layer can be subsequently removed.
[0136] A conductive material can be deposited in the pad cavities
to form various memory-die bonding pads 988. The memory-die bonding
pads 988 may include memory-die source-interconnect bonding pads
988A that are formed on a top surface of a respective one of the
second source-interconnect via structures 154, memory-die
word-line-interconnect bonding pads 988B that are formed on a top
surface of a respective one of the second word-line-interconnect
via structures 156, and memory-die bit-line-interconnect bonding
pads 988C that are formed on a top surface of a respective one of
the second bit-line-interconnect via structures. Further, the
memory-die bonding pads 988 can include memory-die
peripheral-signal-path bonding pads 988D each of which contacts, or
is electrically connected to, a respective one of the
peripheral-signal-path metal via structures 152. The memory-die
peripheral-signal-path bonding pads 988D can be located in any of
the memory array regions 100, staircase regions 300, and peripheral
regions 200 over multiple planes 500.
[0137] Referring to FIGS. 16A and 16B, a support die 700 including
various semiconductor devices 710 is provided. The semiconductor
devices 710 include at least one peripheral circuitry (i.e., driver
circuits) 740 for operation of the three-dimensional array of
memory elements in the memory die 900. Each peripheral circuitry
740 may include a word line driver that drives word lines
(comprising the electrically conductive layers 46) of the
three-dimensional memory array within the memory die 900, a bit
line driver that drives the bit lines 128 in the memory die 900, a
word line decoder circuit that decodes the addresses for the
electrically conductive layers 46, a bit line decoder circuit that
decodes the addresses for the bit lines 128, a sense amplifier
circuit that senses the states of memory elements within the memory
stack structures 55 in the memory die 900, a source power supply
circuit that provides power to source regions 61 the memory die
900, a data buffer and/or latch, or any other semiconductor circuit
that can be used to operate the array of memory stack structures 55
in the memory die 900.
[0138] In embodiments in which the memory die 900 includes a
plurality of planes, the support die 700 can include a plurality of
support circuitries 740, such as a first support circuitry 740A
configured to drive a first plane 500 in the memory die 900 and a
second support circuitry 740B configured to drive a second plane
500 in the memory die 900. FIG. 16B illustrates an example layout
of peripheral circuitry 740 according to an embodiment. Each
peripheral circuitry 740 can include driver circuits, including
sense amplifier and bit line driver circuits (including bit line
hook up/connection regions) located in areas labeled with "SA/BLS,"
and word line driver circuits (including word line X-direction
decoder) located in areas labeled with "XDL." Each peripheral
circuitry 740 can include column direction logic control circuits
located in areas labeled with "YLOG." Each peripheral circuitry 740
can include source power supply circuits (e.g., source line bias
voltage supply circuits) and doped well (e.g., when the
semiconductor material layer 10 comprises p-well) bias voltage
supply circuits located in areas labeled with "CELSRC/CPWELL." Each
peripheral circuitry 740 can include electrical connections from
the source power supply circuits located between SA/BLS in areas
labeled with `Shunt." Each peripheral circuitry 740 can include
word line decoder circuits (e.g., word line control transistors and
low voltage decoders) located in areas labeled with "WLTR/LVDEC,"
and other miscellaneous circuits located in areas labeled with
"MISC." Each peripheral circuitry 740 can include input/output
control circuits in areas labeled with "IO_PADS." The input/output
control circuits can be used to receive external commands that can
be simultaneously executed in the multiple planes 500 of the memory
die 900, and to simultaneously or sequentially provide data output
from the multiple planes 500 of the memory die 900.
[0139] The support die 700 may include a support-die substrate 708,
which may include a support-die semiconductor layer 706. The
support-die semiconductor layer 706 may include at least one
elemental semiconductor material (e.g., single crystal silicon
wafer or layer), at least one III-V compound semiconductor
material, at least one II-VI compound semiconductor material, at
least one organic semiconductor material, or other semiconductor
materials known in the art.
[0140] Shallow trench isolation structures 720 can be provided in a
surface region of the support-die semiconductor layer 706 to
provide electrical isolation from semiconductor devices of the
peripheral circuitry 740. The various semiconductor devices 710 may
include field effect transistors, which include respective
transistor active regions 742 (i.e., source regions and drain
regions), a channel 746, and a gate structure 750. The field effect
transistors can be arranged in a CMOS configuration. Each gate
structure 750 may include, for example, a gate dielectric 752, a
gate electrode 754, a dielectric gate spacer 756 and a gate cap
dielectric 758. For example, the semiconductor devices 710 may
include word line drivers for electrically biasing word lines of
the memory die 900, which comprise the electrically conductive
layers 46, and source power supply field effect transistors that
generate power to be supplied to the source regions 61 the memory
die 900
[0141] Dielectric material layers are formed over the semiconductor
devices 710, which are herein referred to as support-die dielectric
layers 760. Optionally, a dielectric liner 762 (such as a silicon
nitride liner) can be formed to apply mechanical stress to the
various field effect transistors and/or to prevent diffusion of
hydrogen or impurities from the support-die dielectric layers 760
into the semiconductor devices 710. Support-die metal interconnect
structures 780 are formed within the support-die dielectric layers
760. The support-die metal interconnect structures 780 may include
various device contact via structures 782 (e.g., source and drain
electrodes which contact the respective source and drain nodes of
the device or gate electrode contacts), interconnect-level metal
line structures 784, interconnect-level metal via structures 786,
and support-die bonding pads 788. The support-die bonding pads 788
are configured to mate with the memory-die bonding pads 988 to
provide electrically conductive paths between the memory die 900
and the support die 700. The support-die bonding pads 788 can be
arranged as a mirror image of the memory-die bonding pads 988.
[0142] The support-die bonding pads 788 may include support-die
source-interconnect bonding pads 788A that are electrically
connected to output nodes of the source power supply circuits of
the support die 700, support-die word-line-interconnect bonding
pads 788B that are electrically connected to output nodes of the
word line driver circuits of the support die 700, and support-die
bit-line-interconnect bonding pads 788C that are electrically
connected to various nodes of the sense amplifier and bit line
driver circuits. Further, the support-die bonding pads 788 can
include support-die peripheral-signal-path bonding pads 788D that
are electrically connected to a respective pair of signal nodes of
the peripheral circuitry 740. The support-die
peripheral-signal-path bonding pads 788D can be located in areas of
each of the support circuitries 740. The support-die metal
interconnect structures 780 can provide connecting signal paths
between each support-die peripheral-signal-path bonding pad 788D
and a respective node of the peripheral circuitries 740. Further,
the support-die metal interconnect structures 780 may provide
additional electrically conductive paths between a support-die
peripheral-signal-path bonding pad 788D and any other type of
support-die bonding pad 788, including the support-die
source-interconnect bonding pads 788A, the support-die
word-line-interconnect bonding pads 788B, and/or the support-die
bit-line-interconnect bonding pads 788C.
[0143] Referring to FIG. 17, a three-dimensional memory device in
the form of a bonded assembly of the support die 700 and the memory
die 900 can be formed. The memory-die bonding pads 988 of the
memory die 900 can be bonded to the support-die bonding pads 788 of
the support die 700 via metal-to-metal bonding or through an array
of solder balls (not shown). Specifically, each support-die
source-interconnect bonding pad 788A can be bonded to a respective
one of the memory-die source-interconnect bonding pads 988A, each
support-die word-line-interconnect bonding pad 788B can be bonded
to a respective one of the memory-die word-line-interconnect
bonding pads 988B, each support-die bit-line-interconnect bonding
pad 788C can be bonded to a respective one of the memory-die
bit-line-interconnect bonding pads 988C, and each support-die
peripheral-signal-path bonding pad 788D can be bonded to a
respective one of the memory-die peripheral-signal-path bonding
pads 988D.
[0144] Referring to FIG. 18, the support-die semiconductor layer
706 can be thinned from the backside, for example, by grinding to
provide a thinned support-die semiconductor layer 709, which is a
semiconductor material layer. The thinned support-die semiconductor
layer 709 may have a thickness in a range from 1 micron to 100
microns, such as from 3 microns to 30 microns, although lesser and
greater thicknesses may also be used.
[0145] Referring to FIG. 19, a backside insulating layer 714 can be
deposited on the backside surface of the thinned support-die
semiconductor layer 709. The backside insulating layer 714 includes
a dielectric material such as silicon oxide, and may have a
thickness in a range from 30 nm to 1,000 nm, although lesser and
greater thicknesses may also be used. A photoresist layer (not
shown) can be applied over the backside of the thinned support-die
semiconductor layer 709, and is lithographically patterned to form
openings therein. The openings in the photoresist layer can be
formed directly above a respective one of the support-die metal
interconnect structures 780.
[0146] An anisotropic etch process can be performed using the
photoresist layer as an etch mask layer to etch through the thinned
support-die semiconductor layer 709 to a surface of a respective
one of the support-die metal interconnect structures 780.
Through-substrate via cavities are formed through the backside
insulating layer 714 and the thinned support-die semiconductor
layer 709. The photoresist layer can be subsequently removed, for
example, by ashing. An insulating liner layer can be deposited in
the through-substrate via cavities and over the backside insulating
layer 714. Horizontal portions of the insulating liner layer can be
removed from above the backside insulating layer 714 by an
anisotropic etch process. Each remaining tubular portion of the
insulating liner layer constitutes a tubular insulating spacer 711.
The tubular insulating spacers 711 include a dielectric material
such as silicon oxide, and may have a lateral thickness in a range
from 10 nm to 300 nm between an inner sidewall and an outer
sidewall. At least one conductive material such as a combination of
a metallic liner (e.g., TiN) and a metallic fill material (e.g., W)
can be deposited in remaining volumes of the through-substrate via
cavities to form through-substrate via structures 712.
[0147] Referring to FIG. 20, external bonding pads 716 can be
optionally formed directly on a respective one of the
through-substrate via structures 712. In case the external bonding
pads 716 are formed, the external bonding pads 716 may have a
mirror image pattern of the pattern of the support-die bonding pads
788. Each combination of a through-substrate via structure 712 and
an external bonding pad 716 constitutes a backside bonding
structure (712, 716). Each of the backside bonding structures (712,
716) may comprise a through-substrate via structure 712 extending
through a semiconductor substrate (comprising the support-die
substrate 708) of the support die 700 and laterally electrically
insulated from the semiconductor substrate by a tubular insulating
spacer 711, and an external bonding pad 716 contacting the
through-substrate via structure 712.
[0148] Referring to FIG. 21, a solder ball 718 can be bonded to
each external bonding pad 716. A bonding wire 719 can be attached
to each solder ball 718. The memory-die interconnect dielectric
layers 960 within the memory die 900 can include each of the
contact-level dielectric layer 73, the base-line-level dielectric
layer 181, the connection-via-level dielectric layer 183, the first
line-level dielectric layer 120, the first via-level dielectric
layer 130, the second line-level dielectric layer 140, the second
via-level dielectric layer 150, any additional line-level
dielectric layer (if present), any additional via-level dielectric
layer (if present), and the memory-side pad-level dielectric layer
980.
[0149] An electrically conductive path can be provided between two
peripheral devices 710 through the memory die (e.g., through the
interconnect 142 located in the memory device). In one embodiment,
The electrically conductive path is provide between a respective
node (e.g., source, drain or gate of a first peripheral transistor
device 710) of a first peripheral circuitry 740A configured to
control a first three-dimensional array 910A of memory elements in
a first plane 500A in the memory die 900 and a respective node
(e.g., source, drain or gate of a second peripheral transistor
device 710) of a second peripheral circuitry 740B configured to
control a second three-dimensional array 910B of memory elements in
a second plane 500B in the memory die 900. Each electrically
conductive path can include a first subset of the support-die metal
interconnect structures 780 overlying, or underlying, the first
peripheral circuitry 740A and electrically connected to a node of
the first peripheral circuitry 740A, a first support-die
peripheral-signal-path bonding pad 788D contacting or electrically
connected to the first subset of the support-die metal interconnect
structures 780, a first memory-die peripheral-signal-path bonding
pad 988D bonded to the first support-die peripheral-signal-path
bonding pad 788D, a first peripheral-signal-path metal via
structure 152 contacting the first memory-die
peripheral-signal-path bonding pad 988D, an interconnect, such as
the peripheral-signal-path metal line 142 extending across two
planes (500A, 500B) within the memory die 900 (e.g., above the bit
lines 128) and including a first end portion that contacts the
first peripheral-signal-path metal via structure 152, and a second
end portion that contacts the second peripheral-signal-path metal
via structure 152, a second memory-die peripheral-signal-path
bonding pad 988D contacting the second peripheral-signal-path metal
via structure 152, a second support-die peripheral-signal-path
bonding pad 788D that is bonded to the second memory-die
peripheral-signal-path bonding pad 988D, and a second subset of the
support-die metal interconnect structures 780 overlying, or
underlying, the second peripheral circuitry 740B, contacting or
electrically connected to the second support-die
peripheral-signal-path bonding pad 788D, with an electrical
connection to a node of the second peripheral circuitry 740B.
[0150] Referring to all drawings and according to various
embodiments of the present disclosure, a memory device includes a
memory die 900 containing memory elements (910A, 910B), a support
die 700 containing peripheral devices 710 bonded to the memory die
900, and an electrically conductive path 142 between two of the
peripheral devices 710 which extends at least partially through the
memory die 900. The electrically conductive path 142 is
electrically isolated from the memory elements (910A, 910B).
[0151] In one embodiment, a method of operating the memory device
includes providing an electrical signal between the two of the
peripheral devices 710 through the electrically conductive path 142
without passing the through the memory elements (910A, 910B). As
used herein, the term "the electrically conductive path is
electrically isolated from the memory elements" means that the
electrical signal from the first peripheral device to the second
peripheral device passes through the electrically conductive path
(e.g., interconnect 142) without passing through any of the memory
devices. However, once the signal reaches the second peripheral
device, it may be relayed to the memory device(s) through a
different electrically conductive path. Furthermore, an electrical
signal (e.g., a sense signal) may be provided from the memory
device(s) to the first peripheral device and then it can be relayed
from the first peripheral device to the second peripheral device
through the electrically conductive path (e.g., interconnect 142)
without passing through any of the memory devices.
[0152] In one embodiment, the memory device comprises a
three-dimensional memory device and the memory elements comprise at
least one three-dimensional array (910A, 910B) of memory elements.
The memory die further comprises memory-die interconnect dielectric
layers 960 including memory-die metal interconnect structures, and
first memory-die bonding pads (such as the memory-die
source-interconnect bonding pads 988A, the memory-die
word-line-interconnect bonding pads 988B, and the memory-die
bit-line-interconnect bonding pads 988C) that are located on or
within the memory-die interconnect dielectric layers 960 and
electrically connected to a respective node of the at least one
three-dimensional array (910A, 910B) of memory elements through a
first subset of the memory-die metal interconnect structures,
wherein at least one electrically conductive path (988D, 152, 142)
is provided in the memory-die interconnect dielectric layers 960,
each at least one electrically conductive path (988D, 152, 142) is
electrically isolated from the at least one three-dimensional array
(910A, 910B) of memory elements, and each of the at least one
electrically conductive path (988D, 152, 142) comprises a pair of
second memory-die bonding pads (such as memory-die
peripheral-signal-path bonding pads 988D) that are located on or
within the memory-die interconnect dielectric layers 960, metal via
structures (such as peripheral-signal-path metal via structures
152) contacting a respective one of the pair of second memory-die
bonding pads, and a metal line (such as a peripheral-signal-path
metal line 142) contacting the metal via structures.
[0153] The support die 700 comprises at least one peripheral
circuitry (740A, 740B) containing the peripheral devices 710 and
configured to generate control signals for, and receive sense
signals from, the at least one three-dimensional array (910A, 910B)
of memory elements. The support die 700 comprises first support-die
bonding pads (such as the support-die source-interconnect bonding
pads 788A, the support-die word-line-interconnect bonding pads
788B, and the support-die bit-line-interconnect bonding pads 788C)
electrically connected to a respective node of the at least one
peripheral circuitry (740A, 740B) through a first subset of
support-die metal interconnect structures 780 within the support
die 700.
[0154] The support die 700 is bonded to the memory die 900 to form
a bonded assembly via the bonding pads. Specifically, the first
support-die bonding pads (such as the support-die
source-interconnect bonding pads 788A, the support-die
word-line-interconnect bonding pads 788B, and the support-die
bit-line-interconnect bonding pads 788C) are bonded to the first
memory-die bonding pads (such as the memory-die source-interconnect
bonding pads 988A, the memory-die word-line-interconnect bonding
pads 988B, and the memory-die bit-line-interconnect bonding pads
988C). Each pair of second memory-die bonding pads (such as
memory-die peripheral-signal-path bonding pads 988D) is bonded to a
respective pair of second support-die bonding pads (such as
support-die peripheral-signal-path bonding pads 788D) that are
electrically connected to a respective node of the at least one
peripheral circuitry (740A, 740B) through a second subset of
support-die metal interconnect structures 780 within the support
die 700.
[0155] In one embodiment, each of the at least one electrically
conductive path (988D, 152, 142) is electrically isolated from the
first subset of the memory-die metal interconnect structures
780.
[0156] In one embodiment, each metal line (such as a
peripheral-signal-path metal line 142) within the at least one
electrically conductive path (988D, 152, 142) is spaced from an
interface between the memory die 900 and the support die 700.
[0157] In one embodiment, the at least one three-dimensional array
(910A, 910B) of memory elements comprises a plurality of
three-dimensional arrays (910A, 910B) of memory elements. In such
embodiment, a metal line (such as a peripheral-signal-path metal
line 142) within the at least one electrically conductive path
(988D, 152, 142) laterally extends from a first region of the
memory-die interconnect dielectric layers 960 located between a
first three-dimensional array 910A of memory elements among the
plurality of three-dimensional arrays (910A, 910B) of memory
elements and an interface between the memory die 900 and the
support die 700 and a second region of the memory-die interconnect
dielectric layers 960 located between a second three-dimensional
array 910B of memory elements among the plurality of
three-dimensional arrays (910A, 910B) of memory elements and the
interface between the memory die 900 and the support die 700.
[0158] In one embodiment, the memory die 900 comprises a plurality
of planes (500A, 500B) configured to simultaneously execute a
plurality of external commands; the first three-dimensional array
910A of memory elements is located within a first plane 500A of the
plurality of planes (500A, 500B); and the second three-dimensional
array 910B of memory elements is located within a second plane of
the plurality of planes (500A, 500B).
[0159] In one embodiment, the first three-dimensional array 910A of
memory elements comprises a first two-dimensional array of vertical
NAND strings extending through a first alternating stack of first
insulating layers 32 and first electrically conductive layers 46
located within the memory die 900; and the second three-dimensional
array 910B of memory elements comprises a second two-dimensional
array of vertical NAND strings extending through a second
alternating stack of second insulating layers 32 and second
electrically conductive layers 46 located within the memory die 900
and laterally spaced from the first two-dimensional array of
vertical NAND strings by a dielectric material portion, which may
include a retro-stepped dielectric material portion 65 and/or the
memory-die interconnect dielectric layers 960.
[0160] In one embodiment, the three-dimensional memory device can
comprise: first bit lines 128 electrically connected to a
respective subset of vertical NAND strings within the first
two-dimensional array of vertical NAND strings and located between
the first two-dimensional array of vertical NAND strings and the
interface between the memory die 900 and the support die 700; and
second bit lines 128 electrically connected to a respective subset
of vertical NAND strings within the second two-dimensional array of
vertical NAND strings, located between the second two-dimensional
array of vertical NAND strings and the interface between the memory
die 900 and the support die 700, and electrically isolated from the
first bit lines 128, wherein the metal line (such as a
peripheral-signal-path metal line 142) is located between the
interface between the memory die 900 and the support die 700 and a
collection of the first bit lines 128 and the second bit lines
128.
[0161] In one embodiment, the at least one peripheral circuitry
(740A, 740B) comprises a plurality of peripheral circuitries (740A,
740B) configured to control operation of a respective one of the
plurality of three-dimensional arrays (910A, 910B) of memory
elements.
[0162] In one embodiment, a first support circuitry region
including a first support circuitry 740A among the plurality of
peripheral circuitries (740A, 740B) faces the first region of the
memory-die interconnect dielectric layers 960; a second support
circuitry region including a second support circuitry 740B among
the plurality of peripheral circuitries (740A, 740B) faces the
second region of the memory-die interconnect dielectric layers 960;
a node of the first support circuitry 740A is electrically
connected to the metal line (such as the peripheral-signal-path
metal line 142); and a node of the second support circuitry 740B is
electrically connected to the metal line (such as the
peripheral-signal-path metal line 142).
[0163] In one embodiment, the metal line is configured to transmit
at least one control signal between the node of the first support
circuitry 740A and the node of the second support circuitry 740B.
The at least one control signal may be a clock signal, a read
signal, a programming signal, a write signal, an abort signal, a
synchronization signal, or any other signal that can be
communicated between the first support circuitry 740A and the
second support circuitry 740B to provide enhanced control of the
memory die 900.
[0164] In one embodiment, the plurality of three-dimensional arrays
(910A, 910B) of memory elements are provided within a plurality of
planes (500A, 500B) configured to simultaneously execute a
plurality of external commands; and the at least one control signal
controls simultaneous execution of two external commands among the
plurality of external commands in two planes (500A, 500B) among the
plurality of planes that are controlled by the first support
circuitry 740A and by the second support circuitry 740B.
[0165] In one embodiment, each of the at least one peripheral
circuitry (740A, 740B) comprises: sense amplifier and bit line
driver circuits; word line driver circuits; word line decoder
circuits; source power supply circuits; and well bias voltage
supply circuits.
[0166] In one embodiment, the three-dimensional memory device can
comprise: through-substrate via structures 712 extending through a
substrate (such as a thinned support-die semiconductor layer 709)
of the support die 700, wherein the at least one peripheral
circuitry (740A, 740B) is located on a first side of the substrate;
and external bonding pads 716 located on a second side of the
substrate and contacting a respective one of the through-substrate
via structures 712.
[0167] According to another embodiment of the present disclosure, a
method for forming a memory device comprises providing a memory die
comprising memory elements and an interconnect which is
electrically isolated from the memory elements, providing a support
die comprising peripheral devices, and bonding the memory die to
the support die such that an electrically conductive path between
two of the peripheral devices includes the interconnect.
[0168] In one embodiment, the memory elements comprise at least one
three-dimensional array of memory elements, and the memory die
further comprises memory-die interconnect dielectric layers
including memory-die metal interconnect structures, and first
memory-die bonding pads that are located on or within the
memory-die interconnect dielectric layers and electrically
connected to a respective node of the at least one
three-dimensional array of memory elements through a first subset
of the memory-die metal interconnect structures, wherein the
interconnect is provided in the memory-die interconnect dielectric
layers, the electrically conductive path is electrically isolated
from the at least one three-dimensional array of memory elements,
and the electrically conductive path comprises a pair of second
memory-die bonding pads that are located on or within the
memory-die interconnect dielectric layers, metal via structures
contacting a respective one of the pair of second memory-die
bonding pads, and a metal line contacting the metal via structures.
The support die comprises at least one peripheral circuitry
containing the peripheral devices configured to generate control
signals for, and receive sense signals from, the at least one
three-dimensional array of memory elements, wherein the support die
comprises first support-die bonding pads electrically connected to
a respective node of the at least one peripheral circuitry through
a first subset of support-die metal interconnect structures within
the support die. The first support-die bonding pads are bonded to
the first memory-die bonding pads during bonding, and each pair of
second memory-die bonding pads is bonded to a respective pair of
second support-die bonding pads that are electrically connected to
a respective node of the at least one peripheral circuitry through
a second subset of support-die metal interconnect structures within
the support die.
[0169] The various embodiments of the present disclosure can be
used to provide a signal routing path within the memory die 900 for
signal transmission between nodes of the support die 700.
Electrical wiring density in the support die 700 can be high, and
long electrical wiring lengths and/or an increased number of wiring
levels may be provided to route the wiring between the bit line
driver circuits around the word line driver circuits where the
WLTR/LVDEC regions shown in FIG. 16B are located between adjacent
sense amplifiers. Embodiments of the present disclosure route a
subset of the electrically conductive paths between different bit
line driver circuit elements through the memory die 900 where there
is additional space available above the bit lines. The total wiring
lengths and/or the total number of wiring levels in the support die
700 can be reduced by using the electrical wiring schemes of
various embodiments of the present disclosure.
[0170] Although the foregoing refers to particular preferred
embodiments, it will be understood that the disclosure is not so
limited. It will occur to those of ordinary skill in the art that
various modifications can be made to the disclosed embodiments and
that such modifications are intended to be within the scope of the
claims. Compatibility is presumed among all embodiments that are
not alternatives of one another. The word "comprise" or "include"
contemplates all embodiments in which the word "consist essentially
of" or the word "consists of" replaces the word "comprise" or
"include," unless explicitly stated otherwise. Where an embodiment
using a particular structure and/or configuration is illustrated in
the present disclosure, it is understood that the claims can be
practiced with any other compatible structures and/or
configurations that are functionally equivalent provided that such
substitutions are not explicitly forbidden or otherwise known to be
impossible to one of ordinary skill in the art. All of the
publications, patent applications and patents cited herein are
incorporated herein by reference in their entirety.
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