U.S. patent application number 16/841347 was filed with the patent office on 2020-07-23 for display apparatus.
The applicant listed for this patent is SAMSUNG DISPLAY CO., LTD.. Invention is credited to Junghoon Han, Kwansu Kim, Yongjin Kim, Jinwoo Park, Jiseok Ryu.
Application Number | 20200235339 16/841347 |
Document ID | / |
Family ID | 58314117 |
Filed Date | 2020-07-23 |
United States Patent
Application |
20200235339 |
Kind Code |
A1 |
Han; Junghoon ; et
al. |
July 23, 2020 |
DISPLAY APPARATUS
Abstract
A display apparatus includes a substrate including a bent area
between a first area and a second area, and bent about a bending
axis, a display unit over an upper surface of the substrate at the
first area, and a protective film over a lower surface of the
substrate that is opposite to the upper surface, and including an
opening corresponding to the bent area, wherein an inner side
surface of the opening is inclined with respect to the lower
surface of the substrate.
Inventors: |
Han; Junghoon; (Yongin-si,
KR) ; Kim; Kwansu; (Yongin-si, KR) ; Kim;
Yongjin; (Yongin-si, KR) ; Ryu; Jiseok;
(Yongin-si, KR) ; Park; Jinwoo; (Yongin-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG DISPLAY CO., LTD. |
Yongin-si |
|
KR |
|
|
Family ID: |
58314117 |
Appl. No.: |
16/841347 |
Filed: |
April 6, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15387570 |
Dec 21, 2016 |
10615366 |
|
|
16841347 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
Y02P 70/521 20151101;
H01L 51/0097 20130101; H01L 51/5253 20130101; Y02E 10/549 20130101;
H01L 27/3276 20130101; Y02P 70/50 20151101; H01L 2251/5338
20130101; H01L 27/3244 20130101 |
International
Class: |
H01L 51/52 20060101
H01L051/52; H01L 27/32 20060101 H01L027/32; H01L 51/00 20060101
H01L051/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 11, 2016 |
KR |
10-2016-0029691 |
Claims
1. A display apparatus comprising: a substrate comprising a bent
area between a first area and a second area; a display unit over a
first surface of the substrate at the first area; and a protective
film over a second surface of the substrate that is opposite to the
first surface, and defining an opening corresponding to the bent
area, wherein the protective film comprises: a first portion having
a first thickness; a second portion adjacent to the opening, and
having a second thickness that decreases in a direction toward the
opening; and a third portion between the first portion and the
second portion, and having a third thickness that is greater than
the first thickness.
2. The display apparatus of claim 1, wherein the third thickness is
greater than the second thickness.
3. The display apparatus of claim 1, wherein an inner surface of
the opening is inclined with respect to the second surface of the
substrate.
4. The display apparatus of claim 1, further comprising an adhesive
layer integrally formed throughout the first area, the bent area,
and the second area between the substrate and the protective
film.
5. The display apparatus of claim 1, further comprising an adhesive
layer between the substrate and the protective film, wherein a
portion of the adhesive layer corresponding to the opening has a
thickness that is less than a thickness of a portion of the
adhesive layer between the substrate and the protective film.
6. The display apparatus of claim 1, wherein the second thickness
of the protective film gradually decreases in a direction toward
the opening.
7. The display apparatus of claim 1, wherein the second thickness
of the protective film decreases at an inconsistent rate in a
direction toward the opening.
8. The display apparatus of claim 1, wherein the second thickness
of the protective film decreases at a decreasing rate in a
direction toward the opening.
9. The display apparatus of claim 1, wherein the bent area is in
the opening.
10. The display apparatus of claim 1, wherein the opening is in the
bent area.
11. A display apparatus comprising: a substrate comprising a bent
area between a first area and a second area; a display unit over a
first surface of the substrate at the first area; and a protective
film over a second surface of the substrate that is opposite to the
first surface, wherein the protective film comprises: a first
portion having a first thickness; a concave portion corresponding
to the bent area and having a second thickness; and a third portion
between the first portion and the second portion, and having a
third thickness that is greater than the first thickness.
12. The display apparatus of claim 11, wherein the third thickness
is greater than the second thickness.
13. The display apparatus of claim 11, wherein the concave portion
of the protective film has a first part where a thickness of the
concave portion gradually decreases toward a center of the concave
portion.
14. The display apparatus of claim 11, wherein the concave portion
of the protective film has a first part where a thickness of the
concave portion decreases toward the center of the concave portion
at an inconsistent rate.
15. The display apparatus of claim 11, wherein the concave portion
of the protective film has a second part where the thickness of the
concave portion is constant.
16. The display apparatus of claim 15, wherein the second part
corresponds to the center of the concave portion.
17. The display apparatus of claim 11, wherein the concave portion
of the protective film comprising: a first part where a thickness
of the concave portion decreases toward a center of the concave
portion; and a second part closer to the center of the concave
portion than the first part.
18. The display apparatus of claim 11, the thickness of the first
part is greater than the thickness of the second part.
19. The display apparatus of claim 11, wherein the bent area is in
the concave portion.
20. The display apparatus of claim 11, further comprising an
adhesive layer integrally formed throughout the first area, the
bent area, and the second area between the substrate and the
protective film.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 15/387,570, filed Dec. 21, 2016, which claims
priority to and the benefit of Korean Patent Application No.
10-2016-0029691, filed Mar. 11, 2016, the entire content of both of
which is incorporated herein by reference.
BACKGROUND
1. Field
[0002] One or more embodiments relate to a display apparatus
capable of reducing manufacturing costs and a defective rate during
manufacturing processes.
2. Description of the Related Art
[0003] In general, a display apparatus includes a display unit on a
substrate. In such a display apparatus, at least a part of the
display apparatus may be bent to improve visibility from various
angles, and to reduce an area of a non-display area.
[0004] However, in the related art, defects may occur during
manufacture of a display apparatus that is bent, or manufacturing
costs may excessively increase to produce the display apparatus
that is bent.
SUMMARY
[0005] One or more embodiments include a display apparatus capable
of reducing a defect rate during manufacturing processes, and
capable of reducing manufacturing costs.
[0006] Additional aspects will be set forth in part in the
description that follows and, in part, will be apparent from the
description, or may be learned by practice of the presented
embodiments.
[0007] According to one or more embodiments, a display apparatus
includes a substrate including a bent area between a first area and
a second area, and bent about a bending axis, a display unit over
an upper surface of the substrate at the first area, and a
protective film over a lower surface of the substrate that is
opposite to the upper surface, and including an opening
corresponding to the bent area, wherein an inner side surface of
the opening is inclined with respect to the lower surface of the
substrate.
[0008] The display apparatus may further include an adhesive layer
integrally formed throughout the first area, the bent area, and the
second area between the substrate and the protective film.
[0009] A portion of the adhesive layer corresponding to the opening
may have a thickness that is less than a thickness of a portion of
the adhesive layer between the substrate and the protective
film.
[0010] A portion of the protective film that is adjacent the
opening may have a gradually decreasing thickness in a direction
toward the opening.
[0011] The gradually decreasing thickness may decrease at an
inconsistent rate.
[0012] The gradually decreasing thickness may decrease at a
decreasing rate in the direction toward the opening.
[0013] The protective film may include a first portion having a
constant thickness, a second portion adjacent the opening, and
having a thickness that gradually decreases in a direction toward
the opening, and a third portion between the first portion and the
second portion, and having a thickness that is greater than the
thickness of the first portion.
[0014] The bent area may be in the opening.
[0015] The opening may be in the bent area.
[0016] According to one or more embodiments, a display apparatus
includes a substrate including a bent area between a first area and
a second area, and bent about a bending axis, a display unit over
an upper surface of the substrate in the first area, and a
protective film over a lower surface of the substrate that is
opposite to the upper surface, and including a concave portion
corresponding to the bent area.
[0017] The concave portion of the protective film may have a first
part where a thickness of the concave portion gradually decreases
toward a center of the concave portion.
[0018] The thickness of the concave portion in the first part may
decrease toward the center of the concave portion at an
inconsistent rate.
[0019] The thickness of the concave portion in the first part may
have a subpart where the thickness of the concave portion decreases
toward the center of the concave portion at a decreasing rate.
[0020] The concave portion of the protective film may have a second
part where the thickness of the concave portion is constant.
[0021] The second part may correspond to the center of the concave
portion.
[0022] The protective film may include a first portion having a
constant thickness, and a third portion between the first portion
and the concave portion having a thickness that is greater than the
thickness of the first portion.
[0023] The bent area may be in the concave portion.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] These and/or other aspects will become apparent and more
readily appreciated from the following description of the
embodiments, taken in conjunction with the accompanying drawings in
which:
[0025] FIG. 1 is a schematic perspective view of a part of a
display apparatus according to an embodiment;
[0026] FIGS. 2 to 4 are schematic cross-sectional views of
processes of manufacturing the display apparatus of FIG. 1;
[0027] FIG. 5 is a schematic cross-sectional view of a part of the
display apparatus of FIG. 1;
[0028] FIG. 6 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0029] FIG. 7 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0030] FIG. 8 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0031] FIG. 9 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0032] FIG. 10 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0033] FIG. 11 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0034] FIG. 12 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0035] FIG. 13 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment;
[0036] FIG. 14 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment; and
[0037] FIG. 15 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment.
DETAILED DESCRIPTION
[0038] Features of the inventive concept and methods of
accomplishing the same may be understood more readily by reference
to the following detailed description of embodiments and the
accompanying drawings. Hereinafter, example embodiments will be
described in more detail with reference to the accompanying
drawings, in which like reference numbers refer to like elements
throughout. The present invention, however, may be embodied in
various different forms, and should not be construed as being
limited to only the illustrated embodiments herein. Rather, these
embodiments are provided as examples so that this disclosure will
be thorough and complete, and will fully convey the aspects and
features of the present invention to those skilled in the art.
Accordingly, processes, elements, and techniques that are not
suitable to those having ordinary skill in the art for a complete
understanding of the aspects and features of the present invention
may not be described. Unless otherwise noted, like reference
numerals denote like elements throughout the attached drawings and
the written description, and thus, descriptions thereof will not be
repeated. In the drawings, the relative sizes of elements, layers,
and regions may be exaggerated for clarity.
[0039] It will be understood that, although the terms "first,"
"second," "third," etc., may be used herein to describe various
elements, components, regions, layers and/or sections, these
elements, components, regions, layers and/or sections should not be
limited by these terms. These terms are used to distinguish one
element, component, region, layer or section from another element,
component, region, layer or section. Thus, a first element,
component, region, layer or section described below could be termed
a second element, component, region, layer or section, without
departing from the spirit and scope of the present invention.
[0040] Spatially relative terms, such as "beneath," "below,"
"lower," "under," "above," "upper," and the like, may be used
herein for ease of explanation to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. It will be understood that the spatially relative
terms are intended to encompass different orientations of the
device in use or in operation, in addition to the orientation
depicted in the figures. For example, if the device in the figures
is turned over, elements described as "below" or "beneath" or
"under" other elements or features would then be oriented "above"
the other elements or features. Thus, the example terms "below" and
"under" can encompass both an orientation of above and below. The
device may be otherwise oriented (e.g., rotated 90 degrees or at
other orientations) and the spatially relative descriptors used
herein should be interpreted accordingly.
[0041] It will be understood that when an element, layer, region,
or component is referred to as being "on," "connected to," or
"coupled to" another element, layer, region, or component, it can
be directly on, connected to, or coupled to the other element,
layer, region, or component, or one or more intervening elements,
layers, regions, or components may be present. In addition, it will
also be understood that when an element or layer is referred to as
being "between" two elements or layers, it can be the only element
or layer between the two elements or layers, or one or more
intervening elements or layers may also be present.
[0042] In the following examples, the x-axis, the y-axis and the
z-axis are not limited to three axes of a rectangular coordinate
system, and may be interpreted in a broader sense. For example, the
x-axis, the y-axis, and the z-axis may be perpendicular to one
another, or may represent different directions that are not
perpendicular to one another.
[0043] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the present invention. As used herein, the singular forms "a" and
"an" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises," "comprising," "includes," and
"including," when used in this specification, specify the presence
of the stated features, integers, steps, operations, elements,
and/or components, but do not preclude the presence or addition of
one or more other features, integers, steps, operations, elements,
components, and/or groups thereof. As used herein, the term
"and/or" includes any and all combinations of one or more of the
associated listed items. Expressions such as "at least one of,"
when preceding a list of elements, modify the entire list of
elements and do not modify the individual elements of the list.
[0044] As used herein, the term "substantially," "about," and
similar terms are used as terms of approximation and not as terms
of degree, and are intended to account for the inherent deviations
in measured or calculated values that would be recognized by those
of ordinary skill in the art. Further, the use of "may" when
describing embodiments of the present invention refers to "one or
more embodiments of the present invention." As used herein, the
terms "use," "using," and "used" may be considered synonymous with
the terms "utilize," "utilizing," and "utilized," respectively.
Also, the term "exemplary" is intended to refer to an example or
illustration.
[0045] When a certain embodiment may be implemented differently, a
specific process order may be performed differently from the
described order. For example, two consecutively described processes
may be performed substantially at the same time or performed in an
order opposite to the described order.
[0046] The electronic or electric devices and/or any other relevant
devices or components according to embodiments of the present
invention described herein may be implemented utilizing any
suitable hardware, firmware (e.g. an application-specific
integrated circuit), software, or a combination of software,
firmware, and hardware. For example, the various components of
these devices may be formed on one integrated circuit (IC) chip or
on separate IC chips. Further, the various components of these
devices may be implemented on a flexible printed circuit film, a
tape carrier package (TCP), a printed circuit board (PCB), or
formed on one substrate. Further, the various components of these
devices may be a process or thread, running on one or more
processors, in one or more computing devices, executing computer
program instructions and interacting with other system components
for performing the various functionalities described herein. The
computer program instructions are stored in a memory which may be
implemented in a computing device using a standard memory device,
such as, for example, a random access memory (RAM). The computer
program instructions may also be stored in other non-transitory
computer readable media such as, for example, a CD-ROM, flash
drive, or the like. Also, a person of skill in the art should
recognize that the functionality of various computing devices may
be combined or integrated into a single computing device, or the
functionality of a particular computing device may be distributed
across one or more other computing devices without departing from
the spirit and scope of the exemplary embodiments of the present
invention.
[0047] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which the present
invention belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and/or the present
specification, and should not be interpreted in an idealized or
overly formal sense, unless expressly so defined herein.
[0048] FIG. 1 is a schematic perspective view of a part of a
display apparatus according to an embodiment. In the display
apparatus according to the embodiment, a substrate 100 that is a
part of the display apparatus is partially bent, and thus, the
display apparatus also has a partially bent shape like the
substrate 100.
[0049] As shown in FIG. 1, the substrate 100 of the display
apparatus according to the embodiment includes a bent area BA
extending in a first direction (+y direction). The bent area BA is
located between a first area 1A and a second area 2A in a second
direction (+x direction) crossing the first direction. In addition,
the substrate 100 is bent about a bending axis BAX that extends in
the first direction (+y direction) as shown in FIG. 1. In the bent
area BA, tensile stress may be applied to an upper surface (an
outer surface) of the substrate 100 and compressive stress may be
applied to a lower surface (an inner surface) of the substrate 100.
The substrate 100 may include various materials having flexible or
bendable characteristics, e.g., polymer resins such as
polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI),
polyethylene napthalate (PEN), polyethyleneterephthalate (PET),
polyphenylene sulfide (PPS), polyarylate, polyimide (PI),
polycarbonate (PC), and cellulose acetate propionate (CAP). A
display unit DU including a display device and a thin film
transistor may be located at the first area 1A. If necessary, the
display unit DU may be extended to the bent area BA or even to the
second area 2A.
[0050] FIGS. 2 to 4 are schematic cross-sectional views of
processes of manufacturing the display apparatus of FIG. 1. First,
a display panel, as shown in FIG. 2, is prepared. As shown in FIG.
2, the first area 1A of the substrate 100 includes a display area
DA. The first area 1A may further include a part of a non-display
area at an outer portion of the display area DA, in addition to a
part at the display area DA, as shown in FIG. 2. The second area 2A
may also include the non-display area. A display unit including a
display device, such as an organic light-emitting device 300, and
also including a thin film transistor 210, may be located in the
first area 1A. The substrate 100 includes the bent area BA between
the first area 1A and the second area 2A so as to be bent at the
bent area BA to have a shape as shown in FIG. 1.
[0051] The display panel includes a protective film 170 at a lower
surface of the substrate 100, that is, in a direction (-z
direction) that is opposite to a direction of the display unit (+z
direction). The protective film 170 may be attached to the lower
surface of the substrate 100 via an adhesive layer 180. A detailed
structure of the display panel, to which the protective film 170 is
attached, will be described in more detail below.
[0052] The thin film transistor 210, to which the organic
light-emitting device 300 is electrically connected, may be in the
display area DA of the display panel, similarly to the display
device such as the organic light-emitting device 300. Electric
connection of the organic light-emitting device 300 to the thin
film transistor 210 may be understood that a pixel electrode 310 is
electrically connected to the thin film transistor 210.
[0053] If suitable, a thin film transistor may also be at a
peripheral area on the outer portion of the display area DA on the
substrate 100. The thin film transistor on the peripheral area may
be, for example, a part of a circuit unit for controlling electric
signals applied to the display area DA.
[0054] The thin film transistor 210 may include a semiconductor
layer 211 including amorphous silicon, polycrystalline silicon, or
an organic semiconductor material. The thin film transistor 210 may
also include a gate electrode 213, a source electrode 215a, and a
drain electrode 215b. To ensure an insulating property between the
semiconductor layer 211 and the gate electrode 213, a gate
insulating layer 120 may be between the semiconductor layer 211 and
the gate electrode 213, the gate insulating layer 120 including an
inorganic material, such as silicon oxide, silicon nitride, and/or
silicon oxynitride.
[0055] In addition, an interlayer insulating layer 130 may be on
the gate electrode 213, and the source electrode 215a and the drain
electrode 215b may be on the interlayer insulating layer 130, the
interlayer insulating layer 130 including an inorganic material
such as silicon oxide, silicon nitride, and/or silicon oxynitride.
The insulating layers including the inorganic material (e.g., the
gate insulating layer 120 and the interlayer insulating layer 130)
may be formed through chemical vapor deposition (CVD) or atomic
layer deposition (ALD). This will be applied to other embodiments
and modifications thereof that will be described later.
[0056] A buffer layer 110 may be between the thin film transistor
210 and the substrate 100. The buffer layer 110 may include an
inorganic material, such as silicon oxide, silicon nitride, and/or
silicon oxynitride. The buffer layer 110 may improve smoothness of
the upper surface of the substrate 100, or may prevent or reduce
infiltration of impurities from the substrate 100 into the
semiconductor layer 211 of the thin film transistor 210.
[0057] A planarization layer 140 may be arranged on the thin film
transistor 210. For example, as shown in FIG. 2, when the organic
light-emitting device 300 is arranged over the thin film transistor
210, the planarization layer 140 may planarize an upper portion of
a protective layer that covers the thin film transistor 210, and
the organic light-emitting device 300 may be arranged on the
planarization layer 140. The planarization layer 140 may include,
for example, an organic material such as acryl, benzocyclobutene
(BCB), polyimide, and hexamethyldisiloxane (HMDSO). In FIG. 2, the
planarization layer 140 has a single-layered structure, but the
planarization layer 140 may be variously modified. For example, the
planarization layer 140 may have a multi-layered structure.
[0058] In addition, as shown in FIG. 2, the planarization layer 140
may have an opening at an outer portion of the display area DA, so
that a part of the planarization layer 140 in the display area DA
and another part of the planarization layer 140 in the second area
2A may be physically separate from each other. Then, external
impurities may be unable to reach the display area DA via the
planarization layer 140.
[0059] In the display area DA, the organic light-emitting device
300 may be on the planarization layer 140, the organic
light-emitting device 300 including the pixel electrode 310, an
opposite electrode 330, and an intermediate layer 320 that is
between the pixel electrode 310 and the opposite electrode 330 and
that includes an emission layer. The pixel electrode 310 may
contact one of the source electrode 215a and the drain electrode
215b via an opening formed in the planarization layer 140, and may
be electrically connected to the thin film transistor 210, as shown
in FIG. 2.
[0060] A pixel defining layer 150 may be on the planarization layer
140. The pixel defining layer 150 includes openings respectively
corresponding to sub-pixels, that is, includes at least an opening
exposing a center portion of the pixel electrode 310, to define
pixels. Also, in the example shown in FIG. 2, the pixel defining
layer 150 increases a distance between an edge of the pixel
electrode 310 and the opposite electrode 330, which is above the
pixel electrode 310, to prevent an arc, or electric short, from
generating at the edge of the pixel electrode 310. The pixel
defining layer 150 may include an organic material, for example,
polyimide or HMDSO.
[0061] The intermediate layer 320 of the organic light-emitting
device 300 may include low-molecular weight organic materials or
polymer organic materials. When the intermediate layer 320 includes
a low-molecular weight organic material, the intermediate layer may
include a hole injection layer (HIL), a hole transport layer (HTL),
an emission layer (EML), an electron transport layer (ETL), and/or
an electron injection layer (EIL) in a single or multiple-layered
structure. The low-molecular weight organic materials may be
deposited by a vacuum deposition method.
[0062] When the intermediate layer 320 includes a polymer material,
the intermediate layer 320 may include a hole transport layer (HTL)
and an emission layer (EML). Here, the HTL may include PEDOT, and
the EML may include a poly-phenylenevinylene (PPV)-based or
polyfluorene-based polymer material. The intermediate layer 320
above may be formed by a screen printing method, an inkjet printing
method, or a laser induced thermal imaging (LITI) method.
[0063] However, the intermediate layer 320 is not limited to the
above example, and may have various structures. In addition, the
intermediate layer 320 may include a layer that is integrally
formed over a plurality of pixel electrodes 310, or may include a
layer that is patterned to correspond to each of the plurality of
pixel electrodes 310.
[0064] The opposite electrode 330 is arranged above the display
area DA, and as shown in FIG. 2, may cover the display area DA.
That is, the opposite electrode 330 may be integrally formed with
respect to a plurality of organic light-emitting devices, so as to
correspond to, or cover, a plurality of pixel electrodes 310.
[0065] Because the organic light-emitting device 300 may be easily
damaged by external moisture or oxygen, an encapsulation layer 400
may cover the organic light-emitting device 300 to protect the
organic light-emitting device 300. The encapsulation layer 400
covers the display area DA, and may also extend outside the display
area DA. The encapsulation layer 400 may include a first inorganic
encapsulation layer 410, an organic encapsulation layer 420, and a
second inorganic encapsulation layer 430, as shown in FIG. 2.
[0066] The first inorganic encapsulation layer 410 covers the
opposite electrode 330, and may include silicon oxide, silicon
nitride, and/or silicon oxynitride. If suitable, other layers, such
as a capping layer, may be arranged between the first inorganic
encapsulation layer 410 and the opposite electrode 330. Because the
first inorganic encapsulation layer 410 is formed to have a shape
corresponding to a structure thereunder, the first inorganic
encapsulation layer 410 may have an uneven upper surface.
[0067] The organic encapsulation layer 420 covers the first
inorganic encapsulation layer 410, and unlike the first inorganic
encapsulation layer 410, the organic encapsulation layer 420 may
have an even, or planar, upper surface. In more detail, the organic
encapsulation layer 420 may have a roughly, or substantially, even
upper surface at a portion corresponding to the display area DA.
The organic encapsulation layer 420 may include at least one
material selected from the group consisting of polyethylene
terephthalate, polyethylene naphthalate, polycarbonate, polyimide,
polyethylene sulfonate, polyoxymethylene, polyarylate, and
hexamethyldisiloxane.
[0068] The second inorganic encapsulation layer 430 covers the
organic encapsulation layer 420, and may include silicon oxide,
silicon nitride, and/or silicon oxynitride. The second inorganic
encapsulation layer 430 may contact the first inorganic
encapsulation layer 410 at an edge thereof at an outer portion of
the display area DA, thereby preventing exposure of the organic
encapsulation layer 420 to the outside.
[0069] As described above, because the encapsulation layer 400
includes the first inorganic encapsulation layer 410, the organic
encapsulation layer 420, and the second inorganic encapsulation
layer 430, even if there is a crack in the encapsulation layer 400
in the above multi-layered structure, the crack may be
disconnected, or may be stopped, between the first inorganic
encapsulation layer 410 and the organic encapsulation layer 420, or
between the organic encapsulation layer 420 and the second
inorganic encapsulation layer 430. As such, forming of a path
through which external moisture or oxygen may infiltrate into the
display area DA may be prevented or reduced.
[0070] If suitable, processes of forming a touch electrode of
various patterns for implementing a touch screen function, or of
forming a touch protective layer for protecting the touch electrode
on the encapsulation layer 400, may be further performed.
[0071] The display panel includes the protective film 170 on the
lower surface of the substrate 100, that is, the surface that is in
an opposite direction (-z direction) to the direction of the
surface on which the display unit is located (+z direction). The
protective film 170 may include polyethylene terephthalate (PET).
As described above, the protective film 170 may be adhered to the
lower surface of the substrate 100 via the adhesive layer 180. The
adhesive layer 180 may include, for example, a pressure sensitive
adhesive (PSA). A point in time at which the protective film 170 is
attached to the lower surface of the substrate 100 may vary
depending on circumstances.
[0072] For example, when a plurality of display units are formed on
one mother substrate, a carrier substrate, which is solid, may be
located under the mother substrate to easily handle the mother
substrate, which has flexible or bendable characteristics, during
the manufacturing processes. After forming the plurality of display
units and the encapsulation layers 400 for encapsulating the
display units on the mother substrate, the carrier substrate may be
separated from the mother substrate. Otherwise, the carrier
substrate may be separated from the mother substrate after forming
a touch electrode and/or a touch protective layer for protecting
the touch electrode on the encapsulation layers 400. In either
case, after separating the carrier substrate from the mother
substrate, the protective film 170 is attached to a surface of the
mother substrate that contacted the carrier substrate. In this
state, the mother substrate and the protective film 170 are cut to
obtain a plurality of display panels. The substrate 100 may be
understood as a substrate cut from the mother substrate.
[0073] After obtaining the plurality of panels by cutting the
mother substrate and the protective film 170, a polarization plate
520 is attached to the encapsulation layer 400 by an optically
clear adhesive (OCA) 510, and if suitable, a printed circuit board
or an electronic chip may be attached to the second area 2A. If
there is a touch electrode or a touch protective layer on the
encapsulation layer 400, the OCA 510 and the polarization plate 520
may be located over the above elements. In addition, a bending
protection layer (BPL) 600 may be at an outer portion of the
display area or at a portion outside the display area.
[0074] Instead of obtaining the plurality of display panels at the
same time from the mother substrate, a single display unit may be
formed on one substrate 100. In this case, a carrier substrate that
is solid may be located under the substrate 100 to easily handle
the substrate 100 having flexible or bendable characteristics
during the manufacturing processes. After forming the display unit
and the encapsulation layer 400 for encapsulating the display unit
on the substrate 100, the carrier substrate may be separated from
the substrate 100. Otherwise, if suitable, after forming the touch
electrode and/or the touch protective layer for protecting the
touch electrode on the encapsulation layer 400, the carrier
substrate may be separated from the substrate 100. In either case,
after separating the carrier substrate from the substrate 100, the
protective film 170 may be attached to the surface of the substrate
100 toward the carrier substrate. After that, the polarization
plate 520 may be attached to the encapsulation layer 400 or to the
touch protective layer via the OCA 510, and if suitable, a printed
circuit board or an electronic chip may be attached to the second
area 2A. In addition, the BPL 600 may be formed on an outer portion
of the display area DA.
[0075] The polarization plate 520 may reduce reflection of external
light. For example, when external light that passed through the
polarization plate 520 is reflected by an upper surface of the
opposite electrode 330, and that then passes through the
polarization plate 520 again, the external light passes through the
polarization plate 520 twice, and a phase of the external light may
be changed. Therefore, a phase of reflected light is different from
the phase of the external light entering the polarization plate 520
so that a destructive interference occurs. Accordingly, reflection
of the external light may be reduced, and visibility of displayed
images may be improved. The OCA 510 and the polarization plate 520
may cover the opening in the planarization layer 140, as shown in
FIG. 2.
[0076] The method of manufacturing the display apparatus according
to the embodiment need not include forming the polarization plate
520, and if suitable, the polarization plate 520 may be omitted or
replaced with another component. For example, instead of attaching
the polarization plate 520, a black matrix and a color filter may
be formed to reduce the reflection of external light.
[0077] The BPL 600 may be over a first conductive layer 215c,
corresponding at least to the bent area BA. When a stack structure
is bent, there is a stress neutral plane in the stack structure. If
there is no BPL 600, when the substrate 100 is bent, an excessive
tensile stress may be applied to the first conductive layer 215c in
the bent area BA, because the location of the first conductive
layer 215c may not correspond to a stress neutral plane. However,
by forming the BPL 600 and adjusting a thickness and a modulus of
the BPL 600, a location of the stress neutral plane in the
structure including the substrate 100, the first conductive layer
215c, and the BPL 600 may be adjusted. Therefore, the stress
neutral plane may be adjusted to be around the first conductive
layer 215c via the BPL 600, and thus, the tensile stress applied to
the first conductive layer 215c may be reduced.
[0078] The BPL 600 may extend to an end of the substrate 100 in the
display apparatus, unlike the example of FIG. 2. For example, in
the second area 2A, the first conductive layer 215c, a second
conductive layer 213b, and/or other conductive layers electrically
connected to the first and second conductive layers 215c and 213b
might not be covered at least partially by the interlayer
insulating layer 130 or the planarization layer 140, but may
instead be electrically connected to various electronic devices or
printed circuit boards. Accordingly, the first conductive layer
215c, the second conductive layer 213b, and/or the other conductive
layers electrically connected to the first and second conductive
layers 215c and 213b may have portions that are electrically
connected to the various electronic devices or to the printed
circuit boards. Here, the electrically connected portions may be
protected against external impurities such as moisture, and thus,
the BPL 600 may cover the electrically connected portions to
perform as a protective layer as well. To do this, the BPL 600 may
extend to, for example, the end of the substrate 100 of the display
apparatus.
[0079] In addition, in FIG. 2, an upper surface of the BPL 600 in a
direction toward the display area DA (-x direction) coincides with
an upper surface of the polarization plate 520 (in +z direction),
but one or more embodiments are not limited thereto. For example,
an end of the BPL 600 in a direction toward the display area DA (-x
direction) may partially cover an upper surface of the polarization
plate 520 at the edge of the polarization plate 520. Otherwise, the
end of the BPL 600 in the direction toward the display area DA (-x
direction) might not contact the polarization plate 520 and/or the
OCA 510.
[0080] Referring to FIGS. 3 and 4, after attaching the protective
film 170 to the lower surface of the substrate 100, a laser beam is
irradiated to at least a portion of the protective film 170
corresponding to the bent area BA so that the protective film 170
may have an opening 170OP corresponding to the bent area BA, as
shown in FIG. 4. In FIG. 4, the laser beam is irradiated to the
portion of the protective film 170, wherein the portion of the
protective film 170 corresponds to an uneven surface 160a of an
organic material layer 160, which will be described later. Here,
inner side surfaces 170a and 170b defining the opening 170OP are
inclined with respect to the lower surface of the substrate 100.
The opening 170OP may extend in the first direction (+y direction)
such that a part of the protective film 170 corresponding to the
first area 1A is separated from a part of the protective film 170
corresponding to the second area 2A. As shown in FIG. 4, after
forming the opening 170OP in the protective film 170, the substrate
100 may be bent at the bent area BA so that the display panel may
have the shape shown in FIG. 1.
[0081] FIG. 5 is a schematic cross-sectional view of a part of the
display apparatus of FIG. 1, and shows the substrate 100, the
protective film 170, and the adhesive layer 180. As shown in FIG.
5, the substrate 100 may be bent at the bent area BA. The
protective film 170 protects the lower surface of the substrate
100, and accordingly, may have a stiffness or rigidity of its own.
Accordingly, when the substrate 100 is bent in a state where the
protective film 170 has low flexibility, the protective film 170
may be otherwise separated from the substrate 100. However,
according to the display apparatus of the embodiment, the
protective film 170 includes the opening 170OP corresponding to the
bent area BA. Accordingly, the separation between the protective
film 170 and the substrate 100 may be effectively prevented.
[0082] In particular, in the display apparatus according to the
embodiment, the inner side surfaces 170a and 170b of the opening
170OP in the protective film 170 are inclined with respect to the
lower surface of the substrate 100. Accordingly, the thickness of
the protective film 170 may decrease toward the opening 170OP.
Accordingly, even when stress is generated at the portion adjacent
to the opening 170OP of the protective film 170 as the substrate
100 is bent at the bent area BA, the amount of stress generated
from the portion may be reduced due to the decreasing thickness of
the protective film 170 toward the opening 170OP. Accordingly, the
separation of the protective film 170 from the substrate 100 may be
effectively prevented.
[0083] To reduce the stress applied to the protective film 170, the
bent area BA may be located within the opening 170OP of the
protective film 170, and it may be understood that an area of the
opening 170OP in the protective film 170 is greater than that of
the bent area BA, as shown in FIG. 5. However, one or more
embodiments are not limited thereto. That is, as shown in FIG. 6,
which is a schematic cross-sectional view of a part of a display
apparatus according to an embodiment, the opening 170OP of the
protective film 170 may be located within the bent area BA, meaning
that the area of the bent area BA may be greater than that of the
opening 170OP in the protective film 170. Even in the embodiment
shown in FIG. 6, the thickness of the protective film 170 around
the opening 170OP decreases toward the opening 170OP, as described
above with respect to the embodiment shown in FIG. 5, and the
stress generated from the opening 170OP may be reduced.
Accordingly, separation of the protective film 170 from the
substrate 100 may be effectively prevented.
[0084] In addition, the buffer layer 110, the gate insulating layer
120, and the interlayer insulating layer 130 including the
inorganic material shown in FIGS. 2 to 4 may be referred to as a
first inorganic insulating layer. The first inorganic insulating
layer may include a first opening corresponding to the bent area
BA, as shown in FIGS. 2 to 4. That is, the buffer layer 110, the
gate insulating layer 120, and the interlayer insulating layer 130
may respectively include openings 110a, 120a, and 130a
corresponding to the bent area BA. That the first opening
corresponds to the bent area BA may denote that the first opening
overlaps with the bent area BA. Here, an area of the first opening
may be greater than that of the bent area BA. To do this, in FIGS.
2 to 4, a width OW of the first opening is greater than that of the
bent area BA. Here, the area of the first opening may be defined as
an area of one of the openings 110a, 120a, and 130a respectively of
the buffer layer 110, the gate insulating layer 120, and the
interlayer insulating layer 130 that has a smallest area or width.
In addition, in FIGS. 2 to 4, the area of the first opening is
described to be defined by an area of the opening 110a in the
buffer layer 110.
[0085] In FIGS. 2 to 4, an inner side surface of the opening 110a
of the buffer layer 110 and an inner side surface of the opening
120a in the gate insulating layer 120 are described to correspond
to each other, but one or more embodiments are not limited thereto.
For example, an area of the opening 120a of the gate insulating
layer 120 may be greater than that of the opening 110a in the
buffer layer 110. In this case, the area of the first opening may
be also defined as an area of the one among a smallest of the
openings 110a, 120a, and 130a of the buffer layer 110, the gate
insulating layer 120, and the interlayer insulating layer 130,
respectively.
[0086] As described above, when the display unit is formed, an
organic material layer 160 that fills at least a part of the first
opening of the first inorganic insulating layer is formed. In FIGS.
2 to 4, the organic material layer 160 completely fills the first
opening. In addition, the display unit includes the first
conductive layer 215c that extends from the first area 1A toward
the second area 2A through the bent area BA, and that is over the
organic material layer 160. The first conductive layer 215c may be
on one of the inorganic insulating layers, such as the interlayer
insulating layer 130, if the organic material layer 160 does not
exist. The first conductive layer 215c may be formed during a same
process as (e.g., simultaneously with) a source electrode 215a or a
drain electrode 215b by using the same material as that of the
source electrode 215a or the drain electrode 215b.
[0087] As described above, after forming the opening 170OP in the
protective film 170, as shown in FIG. 4, the display panel is bent
at the bent area BA, as shown in FIG. 5. Here, while the substrate
100 is bent at the bent area BA, although tensile stress may be
applied to the first conductive layer 215c, occurrence of defects
in the first conductive layer 215c during the bending process may
be prevented or reduced in the display apparatus according to the
embodiment.
[0088] If the first inorganic insulating layer including the buffer
layer 110, the gate insulating layer 120, and/or the interlayer
insulating layer 130 does not include the opening corresponding to
the bent area BA, but instead continuously extends from the first
area 1A to the second area 2A, and if the first conductive layer
215c is thereon, relatively large tensile stress is applied to the
first conductive layer 215c during bending of the substrate 100. In
particular, because the first inorganic insulating layer has
greater rigidity/stiffness than that of the organic material layer
160, cracks are more likely to form in the first inorganic
insulating layer in the bent area BA, and when a crack occurs in
the first inorganic insulating layer, the crack may also occur in
the first conductive layer 215c on the first inorganic insulating
layer, and thus the probability of generating defects, such as
disconnection in the first conductive layer 215c increases
greatly.
[0089] However, according to the display apparatus of the
embodiment, the first inorganic insulating layer includes the first
opening corresponding to the bent area BA, and the part of the
first conductive layer 215c, which corresponds to the bent area BA,
is on the organic material layer 160 that at least partially fills
the first opening of the first inorganic insulating layer. Because
the first inorganic insulating layer includes the first opening
corresponding to the bent area BA, the possibility of cracks
occurring in the first inorganic insulating layer is reduced, and
the organic material layer 160 is less likely to have cracks due to
characteristics of the organic material. Therefore, the occurrence
of cracks in the portion of the first conductive layer 215c on the
organic material layer 160 may be prevented or reduced, wherein the
portion of the first conductive layer 215c corresponds to the bent
area BA. Because the organic material layer 160 has a lower
hardness than that of an inorganic material layer, the organic
material layer 160 may absorb the tensile stress generated due to
the bending of the substrate 100 to reduce concentration of the
tensile stress on the first conductive layer 215c.
[0090] In addition, when the display unit is formed, second
conductive layers 213a and 213b may be formed, in addition to the
first conductive layer 215c. The second conductive layers 213a and
213b may be formed in the first area 1A and/or the second area 2A
(or respectively formed in the first and second areas 1A and 2A) at
a different layer level than the first conductive layer 215c, and
may be electrically connected to the first conductive layer 215c.
In FIGS. 2 to 4, the second conductive layers 213a and 213b may
include the same material as that of the gate electrode 213 of the
thin film transistor 210, and are at the same layer as the gate
electrode 213 (i.e., on the gate insulating layer 120). In
addition, the first conductive layer 215c contacts the second
conductive layers 213a and 213b via respective contact holes formed
in the interlayer insulating layer 130. In addition, the second
conductive layer 213a is located in the first area 1A, and the
second conductive layer 213b is located in the second area 2A.
[0091] The second conductive layer 213a in the first area 1A may be
electrically connected to the thin film transistor 210 within the
display area DA, and accordingly, the first conductive layer 213c
may be electrically connected to the thin film transistor 210 of
the display area DA via the second conductive layer 213a. The
second conductive layer 213b in the second area 2A may also be
electrically connected to the thin film transistor of the display
area DA via the first conductive layer 215c. As such, the second
conductive layers 213a and 213b that are at an outer portion of the
display area DA may be electrically connected to the elements in
the display area DA, or may extend toward the display area DA so
that at least some parts of the second conductive layers 213a and
213b may be located in the display area DA.
[0092] As described above, after the opening 170OP is formed in the
protective film 170, as shown in FIG. 4, the display panel is bent
at the bent area BA, as shown in FIG. 5. Here, because the
substrate 100 is bent at the bent area BA, the tensile stress may
be applied to the elements in the bent area BA.
[0093] Therefore, the first conductive layer 215c crossing over the
bent area BA includes a material having high flexibility, so that
defects such as cracks in the first conductive layer 215c or
disconnection of the first conductive layer 215c may be prevented.
In addition, the second conductive layers 213a and 213b including a
material having an elongation rate that is lower than that of the
first conductive layer 215c, and including electrical/physical
characteristics that are different from those of the first
conductive layer 215c, are formed in the first area 1A and/or the
second area 2A, and thus, an efficiency of transferring electric
signals may be improved, or a defect rate during the manufacturing
processes of the display apparatus may be reduced. For example, the
second conductive layers 213a and 213b may include molybdenum, and
the first conductive layer 215c may include aluminum. The first
conductive layer 215c and the second conductive layers 213a and
213b may have multi-layered structures, if suitable.
[0094] Unlike the example of FIGS. 2 to 4, at least a part of an
upper portion of the second conductive layer 213b in the second
area 2A may instead be uncovered by the planarization layer 140,
and may instead be exposed to the outside to be electrically
connected to various electronic devices or printed circuit
boards.
[0095] In addition, as shown in FIGS. 2 to 4, the organic material
layer 160 may have the uneven surface 160a at least partially in an
upper surface thereof (in +z direction). Because the organic
material layer 160 includes the uneven surface 160a, the first
conductive layer 215c on the organic material layer 160 may include
an upper surface and/or a lower surface having a shape
corresponding to the uneven surface 160a of the organic material
layer 160.
[0096] As described above, because the substrate 100 is bent at the
bent area BA during the manufacturing processes, the tensile stress
is applied to the first conductive layer 215c. Thus, when the upper
surface and/or the lower surface of the first conductive layer 215c
has the shape corresponding to the uneven surface 160a of the
organic material layer 160, an amount of the tensile stress applied
to the first conductive layer 215c may be reduced. That is, the
tensile stress that may occur during the bending process may be
reduced through deformation of the organic material layer 160
having a low rigidity/stiffness. At this time, the shape of the
first conductive layer 215c having the uneven shape at least before
the bending process is deformed to correspond to the shape of the
organic material layer 160 changed due to the bending, and thus,
generation of a defect, such as disconnection in the first
conductive layer 215c, may be effectively prevented.
[0097] Also, the uneven surface 160a is formed at least partially
at the upper surface of the organic material layer 160 (in +z
direction), and thus, a surface area of the upper surface of the
organic material layer 160, and respective surface areas of the
upper and lower surfaces of the first conductive layer 215c within
the first opening, may be increased. In addition, a relatively
large surface area of the upper surface of the organic material
layer 160 and the upper and lower surfaces of the first conductive
layer 215c may enable a large deformation margin for reducing the
tensile stress caused by the bending of the substrate 100.
[0098] Because the first conductive layer 215c is on the organic
material layer 160, the lower surface of the first conductive layer
215c has a shape corresponding to the uneven surface 160a of the
organic material layer 160. However, the upper surface of the first
conductive layer 215c may have an uneven surface that does not
correspond to the shape of the uneven surface 160a of the organic
material layer 160.
[0099] The uneven surface 160a of the organic material layer 160
(in the +z direction) may be formed in various ways. For example, a
photoresist material may be used to form the organic material layer
160, and an exposure amount may vary depending on locations of the
upper surface of the organic material layer 160, which is in a flat
state during the manufacturing processes, by using a slit mask or a
half-tone mask so that a certain part may be etched (removed)
relatively more than other parts. Here, the more etched part may be
understood as a concave portion in the upper surface of the organic
material layer 160. However, the forming of the organic material
layer 160 in the display apparatus according to one or more
embodiments is not limited to the above example. For example, after
forming the organic material layer 160 having the upper surface
that is flat, a certain portion may be removed by using a dry
etching method.
[0100] For the organic material layer 160 to have the uneven
surface 160a (in the +z direction), the organic material layer 160
may include a plurality of grooves extending in the first direction
(+y direction) in the upper surface (in the +z direction) thereof.
Here, the shape of the upper surface of the first conductive layer
215c on the organic material layer 160 corresponds to the shape of
the upper surface of the organic material layer 160.
[0101] The organic material layer 160 may have the uneven surface
160a only within the first opening of the first inorganic
insulating layer. In FIGS. 2 to 4, a width UEW of the uneven
surface 160a of the organic material layer 160 is less than a width
OW of the first opening of the first inorganic insulating layer. If
the organic material layer 160 has the uneven surface 160a both
inside and outside the first opening in the first inorganic
insulating layer, the organic material layer 160 has the uneven
surface 160a near the internal surface of the opening 110a in the
buffer layer 110, the internal surface of the opening 120a in the
gate insulating layer 120, or the internal surface of the opening
130a in the interlayer insulating layer 130. Because the organic
material layer 160 has a relatively smaller thickness on depressed
portions than on protruding portions, and thus, when the depressed
portions are located around the internal surface of the opening
110a in the buffer layer 110, the internal surface of the opening
120a in the gate insulating layer 120, or the internal surface of
the opening 130a in the interlayer insulating layer 130, the
organic material layer 160 may be disconnected. Therefore, the
organic material layer 160 may have the uneven surface 160a only
within the first opening of the first inorganic insulating layer,
and accordingly, the disconnection of the organic material layer
160 around the internal surface of the opening 110a in the buffer
layer 110, the internal surface of the opening 120a of the gate
insulating layer 120, or the internal surface of the opening 130a
in the interlayer insulating layer 130 may be prevented.
[0102] As described above, to reduce the likelihood of generation
of a disconnection in the first conductive layer 215c at the bent
area BA, the organic material layer 160 may have the uneven surface
160a in the bent area BA. Therefore, an area of the uneven surface
160a of the organic material layer 160 may be greater than an area
of the bent area BA, and may be smaller than the area of the first
opening. That is, as shown in FIGS. 2 to 4, the width UEW of the
uneven surface 160a of the organic material layer 160 is greater
than the width of the bent area BA and smaller than the width OW of
the first opening.
[0103] If at least one of the buffer layer 110, the gate insulating
layer 120, and the interlayer insulating layer 130 includes an
organic insulating material, the organic material layer 160 may be
formed during a same process as (e.g., simultaneously with) the
layer including the organic insulating material, and moreover, the
layer including the organic insulating material and the organic
material layer 160 may be integrally formed with each other.
Examples of the organic insulating material may include
polyethylene terephthalate, polyethylene naphthalate,
polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene,
polyarylate, and/or hexamethyldisiloxane.
[0104] The above-described structures with reference to FIGS. 2 to
4 may be applied to one or more embodiments that will be described
later, and may be applied to modifications thereof.
[0105] FIG. 7 is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment. For convenience of
description, the display apparatus of FIG. 7 is not bent. In the
cross-sectional views or plan views illustrating one or more
embodiments that will be described later, the display apparatus is
not in a bent state (e.g., not yet in a bent state) for convenience
of description. In a case of the display apparatus described above
with reference to FIG. 4, a width of the opening 170OP of the
protective film 170 is equal to the width UEW of the uneven surface
160a in the organic material layer 160, but the embodiment is not
limited thereto. For example, as shown in FIG. 7, the width of the
opening 170OP of the protective film 170 may be less than the width
UEW of the uneven surface 160a of the organic material layer
160.
[0106] As shown in FIGS. 3 and 4, when the opening 170OP is formed
in the protective film 170 by irradiating a laser beam to a portion
of the protective film 170 corresponding to the bent area BA, the
adhesive layer 180 may remain in an area corresponding to the
opening 170OP, as shown in FIGS. 4 to 7. Accordingly, the display
apparatus includes the adhesive layer 180 interposed between the
substrate 100 and the protective film 170, and the adhesive layer
180 may be integrally formed throughout the first area 1A, the bent
area BA, and the second area 2A.
[0107] When the opening 170OP is formed by irradiating the laser
beam to the protective film 170, the substrate 100 is not supposed
to be damaged. Therefore, damage to the substrate 100 may be
avoided by forming the opening 170OP in the protective film 170,
and by ensuring that the adhesive layer 180 remains in the opening
170OP, rather than by removing the adhesive layer 180 between the
protective film 170 and the substrate 100. That is, the adhesive
layer 180 may protect a portion of the substrate 100, which
corresponds to the opening 170OP, during the manufacturing
processes. In addition, if the adhesive layer 180 includes a PSA,
the stress generated in the adhesive layer 180 within the bent area
BA may be reduced due to characteristics of the PSA even when the
substrate 100 is bent at the bent area BA.
[0108] Here, the adhesive layer 180 may have a constant or
consistent thickness throughout the first area 1A, the bent area
BA, and the second area 2A. Otherwise, as shown in FIG. 8, which is
a schematic cross-sectional view of a part of a display apparatus
according to an embodiment, the adhesive layer 180 corresponding to
the opening 170OP may be partially removed (e.g., thinned) when the
opening 170OP is formed in the protective film 170. Accordingly, a
thickness t1 of the adhesive layer 180 at a portion corresponding
to the opening 170OP may be less than a thickness t2 of the
adhesive layer 180 at portions/areas between the substrate 100 and
the protective film 170. However, in this case, the adhesive layer
180, or at least a portion thereof, also remains in the opening
170OP of the protective film 170, and thus, damage to the substrate
100 may be prevented during forming the opening 170OP, and the
adhesive layer 180 may protect the substrate 100 corresponding to
the opening 170OP during the manufacturing processes.
[0109] Also, as shown in FIG. 9, which is a schematic
cross-sectional view of a part of a display apparatus according to
an embodiment, the adhesive layer 180 may have an uneven surface
180EP (in the -z direction) corresponding to the opening 170OP.
Here, the uneven portion is irregular, that is, a width, a height,
and an interval of peaks and/or valleys of the uneven surface 180EP
are not constant. As described above, because the adhesive layer
180 includes the uneven surface 180EP in the portion corresponding
to the opening 170OP, the stress generated in the adhesive layer
180 when the substrate 100 is bent be dispersed instead of being
concentrated at one point.
[0110] In FIGS. 7 to 9, the protective film 170 has the thickness
around the opening 170OP, wherein the thickness is gradually
smaller toward the opening 170OP at a constant rate. However, one
or more embodiments are not limited thereto. As shown in FIG. 10,
which is a schematic cross-sectional view of a part of a display
apparatus according to an embodiment, in a part(s) 170d of the
protective film 170 adjacent to the opening 170OP in the protective
film 170, a thickness of the protective film 170 might not decrease
at a constant rate. In particular, in the part(s) 170d, a rate of
reduction of the thickness may decrease toward the opening 170OP.
In this case, as shown in FIG. 10, inner side surfaces 170a and
170b at the opening 170OP in the protective film 170, along with
the surface of the adhesive layer 180 within the opening 170OP, may
form an entirely concave shape. Even in the structure shown in FIG.
10, the surface of the adhesive layer 180 corresponding to the
opening 170OP might not be flat, but may instead have an uneven
surface. Alternatively, the adhesive layer 180 may have a constant
thickness throughout the first area 1A, the bent area BA, and the
second area 2A.
[0111] In addition, as shown in FIG. 3, when the opening 170OP is
formed by irradiating the laser beam to the protective film 170,
particles may be generated from a portion where the protective film
170 is removed, and the particles may be attached onto the
protective film 170 around the opening 170OP. In this case, as
shown in FIG. 11, which is a schematic cross-sectional view of a
part of a display apparatus according to an embodiment, the
protective film 170 has a first portion(s) 171 having a constant
thickness, a second portion(s) 172 that is adjacent the opening
170OP and has a thickness that decreases toward the opening 170OP,
and a third portion(s) 173 located between the first portion 171
and the second portion 172 that is thicker than the first portion
171. As described above, because the relatively thick third portion
173 is located around the opening 170OP of the protective film 170,
degradation in the performance of the protective film 170 around
the opening 170OP may be reduced or prevented. In this case, the
adhesive layer 180 may also have an uneven surface (e.g., 180EP) in
the part corresponding to the opening 170OP as shown in FIG. 9.
[0112] If suitable, a laser beam may be additionally irradiated to
the third portion 173 to remove the particles, so that the third
portion 173 is not present between the first portion 171 and the
second portion 172. That is, the protective film 170 may have a
constant thickness except at the second portion 172. In this case,
because a bonding strength between particles, and a bonding
strength between the particles and the surface of the protective
film 170, are lower than a bonding strength between the elements in
the protective film 170, only the particles may be removed without
damaging the surface of the protective film 170.
[0113] So far, a case in which the protective film 170 includes one
opening 170OP corresponding to the bent area BA has been described,
but one or more embodiments are not limited thereto. For example,
as shown in FIG. 12, which is a schematic cross-sectional view of a
part of a display apparatus according to an embodiment, the
protective film 170 may include a plurality of openings 171OP,
172OP, and 173OP respectively corresponding to the bent area BA.
Each of the plurality of openings 171OP, 172OP, and 173OP may
extend in the first direction (+y direction), and may be
implemented by irradiating the laser beam only to their
corresponding parts.
[0114] In the display apparatus according to the embodiment,
because the protective film 170 includes the plurality of openings
171OP, 172OP, and 173OP corresponding to the bent area BA,
separation between the protective film 170 and the substrate 100
when the substrate 100 is bent may be prevented effectively. In
this case, an inner side surface 170b in the second direction (+x
direction) of the opening 173OP that is the last opening in the
second direction (+x direction), and an inner side surface 170a of
the opening 171OP that is the last opening in the direction toward
the display area DA (the inner side surface 170a being in a
direction toward the display area DA (-x direction) that is
opposite to the second direction (+x direction)), may be inclined
with respect to the lower surface of the substrate 100.
[0115] In FIG. 12, the thickness t1 of the adhesive layer 180
corresponding to the plurality of openings 171OP, 172OP, and 173OP
is less than the thickness t2 of the adhesive layer 180 between the
substrate 100 and the protective film 170. However, one or more
embodiments are not limited thereto, and the thickness of the
adhesive layer 180 may be constant throughout the first area 1A,
the bent area BA, and the second area 2A.
[0116] The protective film 170 has been described to have the
opening 170OP above, but one or more embodiments are not limited
thereto. For example, as shown in FIG. 13, which is a schematic
cross-sectional view of a part of a display apparatus according to
an embodiment, the protective film 170 may include a concave
portion 170CC corresponding to the bent area BA. The concave
portion 170CC may be implemented by not completely removing the
portion of the protective film 170 corresponding to the bent area
BA. The protective film 170 may have a first part 170d where a
thickness of the concave portion is gradually reduced toward a
center of the concave portion 170CC. For example, the thickness of
the protective film 170 in the first part 170d may be gradually
reduced toward the bending axis. Alternatively, the protective film
170 may have a second part 170c where the thickness of the concave
portion is constant. In the latter case, the second part 170c may
be located around the center of the concave portion 170CC.
[0117] Because the protective film 170 protects the lower surface
of the substrate 100, the protective film 170 may have stiffness of
its own (e.g., may be relatively rigid). Accordingly, if the
protective film 170 has low flexibility, the protective film 170
may be separated from the substrate 100 when the substrate 100 is
bent. However, according to the display apparatus of the
embodiment, because the protective film 170 includes the concave
portion 170CC corresponding to the bent area BA, the separation
between the protective film 170 and the substrate 100 may be
effectively prevented.
[0118] Here, the bent area BA may correspond to the concave portion
170CC as shown in FIG. 13. In particular, when the protective film
170 has the second part 170c having constant thickness around the
center of the concave portion 170CC, the bent area BA may be at the
second part 170c (e.g., width of the bent area BA is less than
width of the second part 170c). Otherwise, as shown in FIG. 14,
which is a schematic cross-sectional view of a part of a display
apparatus according to an embodiment, the second part 170c may be
located in the bent area BA, if suitable (e.g., width of the second
part 170c is less than width of the bent area BA).
[0119] In the first part(s) 170d adjacent the second part 170c of
the protective film 170, a rate of reduction of the thickness
toward the center of the concave portion 170CC may not be constant.
In detail, in the first part 170d, the reduction rate of the
thickness may decrease toward the center of the concave portion
170CC. In addition, when the laser beam is irradiated to the
protective film 170 to form the concave portion 170CC, particles
may be generated from the portion where the protective film 170 is
removed, and the particles may be attached onto the protective film
170 around the concave portion 170CC. In this case, as shown in
FIG. 15, which is a schematic cross-sectional view of a part of a
display apparatus according to an embodiment, the protective film
170 includes a first portion(s) 171 having a constant thickness,
and a third portion(s) 173 located between the first portion 171
and the concave portion 170CC, and having a thickness that is
greater than a thickness of the first portion 171. As described
above, because the third portion 173 that is relatively thick is
located around the concave portion 170CC of the protective film
170, degradation in performances of the protective film 170 around
the concave portion 170CC may be prevented.
[0120] If suitable, the laser beam may be additionally irradiated
to the third portion 173 to remove the attached particles, and the
third portion 173 may be omitted. That is, the protective film 170
may have the constant thickness at portions other than the concave
portion 170CC. In this case, because a bonding strength between the
attached particles, and a bonding strength between the attached
particles and the protective film 170, are lower than a coupling
strength between the elements in the protective film 170, the
attached particles may be removed without damaging the surface of
the protective film 170.
[0121] The display apparatus is described above, but one or more
embodiments are not limited thereto. For example, a method of
manufacturing the above display apparatus may be also included in
the scope of the one or more embodiments.
[0122] According to the one or more embodiments, the display
apparatus capable of reducing manufacturing costs and a defect rate
during the manufacturing processes may be implemented. However, the
scope of the one or more embodiments is not limited thereto.
[0123] It should be understood that embodiments described herein
should be considered in a descriptive sense only and not for
purposes of limitation. Descriptions of features or aspects within
each embodiment should typically be considered as available for
other similar features or aspects in other embodiments.
[0124] While one or more embodiments have been described with
reference to the figures, it will be understood by those of
ordinary skill in the art that various changes in form and details
may be made therein without departing from the spirit and scope as
defined by the following claims and their functional
equivalents.
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