U.S. patent application number 16/460784 was filed with the patent office on 2020-07-09 for thermoelectric cooling devices, systems and methods.
The applicant listed for this patent is Matrix Industries, Inc.. Invention is credited to Akram I. Boukai, Tristan Day, Haifan Liang, Douglas W. Tham.
Application Number | 20200217565 16/460784 |
Document ID | / |
Family ID | 71403497 |
Filed Date | 2020-07-09 |
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United States Patent
Application |
20200217565 |
Kind Code |
A1 |
Boukai; Akram I. ; et
al. |
July 9, 2020 |
THERMOELECTRIC COOLING DEVICES, SYSTEMS AND METHODS
Abstract
The present disclosure provides thermoelectric cooling devices,
systems and methods. A thermoelectric system of the present
disclosure may comprise a chamber configured to hold the beverage
container; at least one actuator configured to rotate the beverage
container within the chamber; a source of a thermal coupling medium
in fluid communication with the chamber, wherein the thermal
coupling medium is configured to thermally couple the beverage
container to one or more walls of the chamber; a heat sink; and a
plurality of thermoelectric cooling elements surrounding the
chamber, wherein the plurality of thermoelectric cooling elements
is configured to transfer heat from the beverage container to the
heat sink upon application of power to the plurality of
thermoelectric cooling elements, thereby cooling the beverage
container.
Inventors: |
Boukai; Akram I.; (Menlo
Park, CA) ; Tham; Douglas W.; (Menlo Park, CA)
; Day; Tristan; (Menlo Park, CA) ; Liang;
Haifan; (Menlo Park, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Matrix Industries, Inc. |
Menlo Park |
CA |
US |
|
|
Family ID: |
71403497 |
Appl. No.: |
16/460784 |
Filed: |
July 2, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62788713 |
Jan 4, 2019 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F25D 31/002 20130101;
F25D 31/007 20130101; F25B 21/02 20130101; F25D 31/008
20130101 |
International
Class: |
F25B 21/02 20060101
F25B021/02; F25D 31/00 20060101 F25D031/00 |
Claims
1. A system for cooling a beverage container, comprising: a chamber
configured to hold said beverage container; at least one actuator
configured to rotate said beverage container within said chamber; a
source of a thermal coupling medium in fluid communication with
said chamber, wherein said thermal coupling medium is configured to
thermally couple said beverage container to one or more walls of
said chamber; a heat sink; and a plurality of thermoelectric
cooling elements surrounding said chamber, wherein said plurality
of thermoelectric cooling elements is configured to transfer heat
from said beverage container to said heat sink upon application of
power to said plurality of thermoelectric cooling elements, thereby
cooling said beverage container.
2. The system of claim 1, wherein said chamber is substantially
cylindrical in shape.
3. The system of claim 1, wherein said chamber is sized to hold at
most a single beverage container.
4. The system of claim 1, wherein said chamber comprises a drain
for draining said thermal coupling medium from said chamber.
5. The system of claim 1, wherein said heat sink comprises a
thermally conductive material.
6. The system of claim 1, wherein said heat sink is an air-cooled
heat sink comprising one or more fans. (Original) The system of
claim 1, wherein said heat sink is a liquid-cooled heat sink.
8. The system of claim 1, wherein said plurality of thermoelectric
elements comprises an n-type semiconductor element.
9. The system of claim 1, wherein said plurality of thermoelectric
elements comprises a p-type semiconductor element.
10. The system of claim 1, wherein said plurality of thermoelectric
elements comprises an n-type semiconductor element in series with a
p-type semiconductor element.
11. The system of claim 1, further comprising a direct current (DC)
source.
12. The system of claim 11, wherein said DC source is a
battery.
13. The system of claim 11, wherein said DC source is an adapter or
power supply.
14. The system of claim 1, wherein said thermoelectric cooling
device is configured to use at most 20 kilowatt-minutes of electric
power to cool a 12-ounce beverage in said beverage container from
about 20 degrees Celsius to about 4 degrees Celsius in
approximately 1 minute or less.
15. The system of claim 1, wherein said thermoelectric cooling
device is configured to use at most 25 kilowatt-minutes of electric
power to cool a 20-ounce beverage in said beverage container from
about 20 degrees Celsius to about 4 degrees Celsius in
approximately 1 minute or less.
16. The system of claim 1, wherein said rotating facilitates
cooling of said beverage container at a uniformity that deviates by
at most 10 degrees Celsius between any two points on a surface of
said container.
17. The system of claim 1, further comprising an electronic display
configured to display a current beverage container temperature and
a remaining cooling time of said beverage container.
18. The system of claim 17, wherein said electronic display is a
user interface, and wherein said user interface is configured to
enable a user to select a beverage temperature and a cooling cycle
time.
19. The system of claim 17, wherein said electronic display is a
capacitive touchscreen.
20. The system of claim 1, wherein said chamber comprises a
removable cap, and wherein said removable cap is transparent.
21. The system of claim 2, wherein said thermoelectric cooling
elements are arranged in a radial direction with respect to said
chamber.
22. The system of claim 1, further comprising a drink vending
machine comprising a dispensing slot, wherein said chamber is
disposed in said dispensing slot, and wherein said dispensing slot
is configured to dispense said beverage container subsequent to
cooling.
23. The system of claim 22, wherein said drink vending machine does
not have a refrigeration unit.
24. The system of claim 1, wherein said source of said thermal
coupling medium comprises a reservoir, wherein said system
comprises a pump, and wherein said pump is configured to pump said
thermal coupling medium from said reservoir to said chamber upon
activation of said system.
25. A method for cooling a beverage container, comprising: (a)
activating a cooling system comprising (i) a chamber configured to
hold said beverage container; (ii) at least one actuator configured
to rotate said beverage container within said chamber; (iii) a
source of a thermal coupling medium in fluid communication with
said chamber, wherein said thermal coupling medium is configured to
thermally couple said beverage container to one or more walls of
said chamber; (iv) a heat sink; and (v) a plurality of
thermoelectric cooling elements surrounding said chamber, wherein
said plurality of thermoelectric cooling elements is configured to
transfer heat from said beverage container to said heat sink upon
application of power to said plurality of thermoelectric cooling
elements, wherein upon activation, said chamber comprises said
thermal coupling medium from said source; and (b) with said
beverage container in said chamber, cooling said beverage
container.
26. The method of claim 25, wherein (a) comprises cooling said
thermal coupling medium to a temperature of at least 10 degrees
Celsius below ambient temperature.
27. The method of claim 26, further comprising receiving said
beverage container in said chamber subsequent to (a).
28. The method of claim 25, further comprising activating said
motor.
29. A thermoelectric cooling device, comprising: a chamber
configured to hold a liquid, wherein said chamber comprises a
plurality of sides, wherein a first side and a second side of said
plurality of sides each have an area that is at least double the
area of any other side of said plurality of sides; heat sinks
disposed adjacent to said first side and said second side; and
thermoelectric cooling elements disposed between each of said heat
sinks and said chamber, wherein said thermoelectric cooling
elements are configured to transfer heat from said liquid to said
heat sinks upon application of power to said thermoelectric cooling
elements.
30. The thermoelectric cooling device of claim 29, wherein said
chamber comprises a plurality of bores, wherein each of the
plurality of bores is physically separate.
Description
CROSS-REFERENCE
[0001] This application claims priority to U.S. Provisional Patent
Application No. 62/788,713, filed on Jan. 4, 2019, which is
entirely incorporated herein by reference.
BACKGROUND
[0002] The thermoelectric effect can be the direct conversion of a
temperature gradient to an electric voltage or an electric voltage
to a temperature gradient. The thermoelectric effect can result
from the diffusion of charge carriers from a hot side to a cold
side of the temperature gradient. The thermoelectric effect can
encompass the Seebeck effect, the Peltier effect, and the Thomson
effect. Thermoelectric cooling devices can employ the Peltier
effect for heat pumping.
[0003] Thermoelectric device performance may be captured by a
so-called thermoelectric figure-of-merit, Z=S.sup.2 .sigma./k,
where `S` is the Seebeck coefficient, `.sigma.` is electrical
conductivity, and `k` is thermal conductivity. Z can be employed as
an indicator of the coefficient-of-performance (COP) of a
thermoelectric cooling device. That is, COP may scale with Z. A
dimensionless figure-of-merit, ZT, may be employed to quantify
thermoelectric device performance, where `T` can be an average
temperature of the hot and the cold sides of the device.
SUMMARY
[0004] The present disclosure provides improved cooling devices.
Specifically, the thermoelectric cooling devices of the present
disclosure can enable rapid cooling of beverage containers, food,
or other objects. The thermoelectric cooling devices described
herein can (i) be smaller than traditional vapor-compression
refrigeration systems, (ii) operate without moving parts that may
require maintenance, and (iii) offer more precise control of
temperatures.
[0005] In an aspect, a system for cooling a beverage container can
comprise a chamber configured to hold the beverage container, at
least one actuator configured to rotate the beverage container
within the chamber, and a source of a thermal coupling medium in
fluid communication with the chamber. The thermal coupling medium
can be configured to thermally couple the beverage container to one
or more walls of the chamber. The system can also comprise a heat
sink and a plurality of thermoelectric cooling elements surrounding
the chamber. The plurality of thermoelectric cooling elements can
be configured to transfer heat from the beverage container to the
heat sink upon application of power to the plurality of
thermoelectric cooling elements, thereby cooling the beverage
container.
[0006] In some embodiments the chamber can be substantially
cylindrical in shape. The thermoelectric cooling elements can be
arranged in a radial direction with respect to the chamber. In some
embodiments, the chamber can be sized to hold at most a single
beverage container. In some embodiments, the chamber can comprises
a drain for draining the thermal coupling medium from the
chamber.
[0007] In some embodiments, the heat sink can comprise a thermally
conductive material.
[0008] In some embodiments, the heat sink can be an air-cooled heat
sink comprising one or more fans. In some embodiments, the heat
sink can be a liquid-cooled heat sink.
[0009] In some embodiments, the plurality of thermoelectric
elements can comprise an n-type semiconductor element. In some
embodiments, the plurality of thermoelectric elements can comprise
a p-type semiconductor element. In some embodiments, the plurality
of thermoelectric elements can comprise an n-type semiconductor
element in series with a p-type semiconductor element.
[0010] In some embodiments, the system can comprise a direct
current (DC) source. The DC source can be a battery. The DC source
can be an adapter or power supply.
[0011] In some embodiments, the thermoelectric cooling device can
be configured to use at most 20 kilowatt-minutes of electric power
to cool a 12-ounce beverage in the beverage container from about 20
degrees Celsius to about 4 degrees Celsius in approximately 1
minute or less. In some embodiments, the thermoelectric cooling
device can be configured to use at most 25 kilowatt-minutes of
electric power to cool a 20-ounce beverage in the beverage
container from about 20 degrees Celsius to about 4 degrees Celsius
in approximately 1 minute or less.
[0012] In some embodiments, the rotating facilitates cooling of the
beverage container at a uniformity that deviates by at most 10
degrees Celsius between any two points on a surface of the
container.
[0013] In some embodiments, the system can further comprise an
electronic display configured to display a current beverage
container temperature and a remaining cooling time of the beverage
container. The electronic display can be a user interface. The user
interface can be configured to enable a user to select a beverage
temperature and a cooling cycle time. The electronic display can be
a capacitive touchscreen.
[0014] In some embodiments, the chamber can comprise a removable
cap. The removable cap can be transparent.
[0015] In some embodiments, the system can further comprise a drink
vending machine comprising a dispensing slot. The chamber can be
disposed in the dispensing slot. The dispensing slot can be
configured to dispense the beverage container subsequent to
cooling. In some embodiments, the drink vending machine may not
have a refrigeration unit.
[0016] In some embodiments, the source of the thermal coupling
medium can comprise a reservoir. The system can comprise a pump,
and the pump can be configured to pump the thermal coupling medium
from the reservoir to the chamber upon activation of the
system.
[0017] In another aspect, a method for cooling a beverage container
can comprise activating a cooling system comprising: (i) a chamber
configured to hold a beverage container, (ii) at least one actuator
configured to rotate the beverage container within the chamber, and
(iii) a source of a thermal coupling medium in fluid communication
with the chamber. The thermal coupling medium can be configured to
thermally couple the beverage container to one or more walls of the
chamber. The cooling system can further comprise (iv) a heat sink
and (v) a plurality of thermoelectric cooling elements surrounding
the chamber. The plurality of thermoelectric cooling elements can
be configured to transfer heat from said beverage container to said
heat sink upon application of power to said plurality of
thermoelectric cooling elements. Upon activation, the chamber of
the cooling system can comprise the thermal coupling medium from
the source. The method can further comprise cooling the beverage
container with the beverage container in the chamber.
[0018] In some embodiments, activating the cooling system can
comprise cooling the thermal coupling medium to a temperature of at
least 10 degrees Celsius below ambient temperature. In some
embodiments, the method can further comprise receiving the beverage
container in the chamber subsequent to activating the cooling
system. In some embodiments, the method can further comprise
activating the motor.
[0019] In another aspect, a thermoelectric cooling device can
comprise a chamber configured to hold a liquid. The chamber can
comprise a plurality of sides. A first side and a second side of
the plurality of sides can each have an area that is at least
double the area of any other side of the plurality of sides. The
thermoelectric cooling device can further comprise heat sinks
disposed adjacent to the first side and the second side and
thermoelectric cooling elements disposed between each of the heat
sinks and the chamber. The thermoelectric cooling elements can be
configured to transfer heat from the liquid to the heat sinks upon
application of power to the thermoelectric cooling elements.
[0020] In some embodiments, the chamber can comprise a plurality of
bores. Each of the plurality of bores can be physically
separate.
[0021] Additional aspects and advantages of the present disclosure
will become readily apparent to those skilled in this art from the
following detailed description, wherein only illustrative
embodiments of the present disclosure are shown and described. As
will be realized, the present disclosure is capable of other and
different embodiments, and its several details are capable of
modifications in various obvious respects, all without departing
from the disclosure. Accordingly, the drawings and description are
to be regarded as illustrative in nature, and not as
restrictive.
INCORPORATION BY REFERENCE
[0022] All publications, patents, and patent applications mentioned
in this specification are herein incorporated by reference to the
same extent as if each individual publication, patent, or patent
application was specifically and individually indicated to be
incorporated by reference. To the extent publications and patents
or patent applications incorporated by reference contradict the
disclosure contained in the specification, the specification is
intended to supersede and/or take precedence over any such
contradictory material.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The novel features of the invention are set forth with
particularity in the appended claims. A better understanding of the
features and advantages of the present invention will be obtained
by reference to the following detailed description that sets forth
illustrative embodiments, in which the principles of the invention
are utilized, and the accompanying drawings (also "figure" and
"FIG." herein), of which:
[0024] FIG. 1 is a top view of a first example of a thermoelectric
cooling device;
[0025] FIG. 2 is a diagram of a circuit with p-type and n-type
thermoelectric cooling elements;
[0026] FIG. 3 is an isometric view of the thermoelectric cooling
device of FIG. 1;
[0027] FIG. 4 is a top view of a second example of a thermoelectric
cooling device;
[0028] FIG. 5 is an isometric view of the thermoelectric cooling
device of FIG. 4;
[0029] FIG. 6 is a schematic perspective view of a thermoelectric
element, in accordance with an embodiment of the present
disclosure;
[0030] FIG. 7 is a schematic top view of the thermoelectric element
of FIG. 6, in accordance with an embodiment of the present
disclosure;
[0031] FIG. 8 is a schematic side view of the thermoelectric
element of FIG. 6, in accordance with an embodiment of the present
disclosure;
[0032] FIG. 9 is a schematic perspective view of a thermoelectric
element of FIG. 6, in accordance with an embodiment of the present
disclosure;
[0033] FIG. 10 is a schematic top view of the thermoelectric
element of FIG. 6, in accordance with an embodiment of the present
disclosure;
[0034] FIG. 11 shows a computer control system that is programmed
or otherwise configured to implement methods provided herein;
[0035] FIG. 12 is an isometric view of a commercial implementation
of a thermoelectric cooling device;
[0036] FIG. 13 is a front view of the thermoelectric cooling device
of FIG. 12;
[0037] FIG. 14 is a back view of the thermoelectric cooling device
of FIG. 12;
[0038] FIG. 15 is a second isometric view of the thermoelectric
cooling device of FIG. 12;
[0039] FIG. 16A and FIG. 16B are top and isometric views of a third
example of a thermoelectric cooling device, respectively; and
[0040] FIG. 17A and FIG. 17B are isometric and top views of a
pour-in thermoelectric cooling device.
DETAILED DESCRIPTION
[0041] While various embodiments of the invention have been shown
and described herein, it will be obvious to those skilled in the
art that such embodiments are provided by way of example only.
Numerous variations, changes, and substitutions may occur to those
skilled in the art without departing from the invention. It should
be understood that various alternatives to the embodiments of the
invention described herein may be employed.
[0042] The term "nanostructure," as used herein, generally refers
to structures having a first dimension (e.g., width) along a first
axis that is less than about 1 micrometer ("micron") in size. Along
a second axis orthogonal to the first axis, such nanostructures can
have a second dimension from nanometers or smaller to microns,
millimeters or larger. The dimension (e.g., width) may be less than
about 1000 nanometers ("nm"), or 500 nm, or 100 nm, or 50 nm, or
smaller. Nanostructures can include holes formed in a substrate
material. The holes can form a mesh having an array of holes. In
other cases, nanostructure can include rod-like structures, such as
wires, cylinders or box-like structure. The rod-like structures can
have circular, elliptical, triangular, square, rectangular,
pentagonal, hexagonal, heptagonal, octagonal or nonagonal, or other
cross-sections.
[0043] The term "nanowire," as used herein, generally refers to a
wire or other elongate structure having a width or diameter that is
less than or equal to about 1000 nm, or 500 nm, or 100 nm, or 50
nm, or smaller.
[0044] The term "n-type," as used herein, generally refers to a
material that is chemically doped ("doped") with an n-type dopant.
For instance, silicon can be doped n-type using phosphorous or
arsenic.
[0045] The term "p-type," as used herein, generally refers to a
material that is doped with a p-type dopant. For instance, silicon
can be doped p-type using boron or aluminum.
[0046] The term "metallic," as used herein, generally refers to a
substance exhibiting metallic properties. A metallic material can
include one or more elemental metals.
[0047] The term "adjacent" or "adjacent to," as used herein,
includes "next to," "adjoining," "in contact with," and "in
proximity to."
[0048] Whenever the term "at least," "greater than," or "greater
than or equal to" precedes the first numerical value in a series of
two or more numerical values, the term "at least," "greater than"
or "greater than or equal to" applies to each of the numerical
values in that series of numerical values. For example, greater
than or equal to 1, 2, or 3 is equivalent to greater than or equal
to 1, greater than or equal to 2, or greater than or equal to
3.
[0049] Whenever the term "no more than," "less than," or "less than
or equal to" precedes the first numerical value in a series of two
or more numerical values, the term "no more than," "less than," or
"less than or equal to" applies to each of the numerical values in
that series of numerical values. For example, less than or equal to
3, 2, or 1 is equivalent to less than or equal to 3, less than or
equal to 2, or less than or equal to 1.
[0050] The present disclosure provides an improved thermoelectric
cooling device. In an aspect, the thermoelectric cooling device can
include a chamber configured to hold a beverage container; a
thermal coupling medium surrounding the beverage container that
thermally couples the beverage container to the walls of the
chamber; a heat sink; and a plurality of thermoelectric cooling
elements surrounding the chamber. The plurality of thermoelectric
cooling elements can be configured to transfer heat from the
beverage container to the heat sink when a direct current is
provided to the plurality of thermoelectric cooling elements.
[0051] The thermoelectric cooling device described herein can be
used to rapidly cool the beverage inside the beverage container.
For example, a thermoelectric cooling device as described herein
can have 9 thermoelectric elements and use at most about 20
kilowatt-minutes (kW-m), 15 kW-m, 10 kW-m, 9 kW-m, 8 kW-m, 7 kW-m,
6 kW-m, 5 kW-m, 4 kW-m, 3 kW-m, or 2 k-Wm of electric power to cool
a 12-ounce beverage container from about 25 degrees Celsius to
about 4 degrees Celsius, from about 20 degrees Celsius to about 4
degrees Celsius, from about 15 degrees Celsius to about 4 degrees
Celsius, or from about 10 degrees Celsius to about 4 degrees
Celsius in less than about 1 minute. Alternatively, a
thermoelectric cooling device as described herein can have 24
thermoelectric elements and use at most about 25 kilowatt-minutes
(kW-m), 20 kW-m, 15 kW-m, 10 kW-m, 9 kW-m, 8 kW-m, 7 kW-m, 6 kW-m,
or 5 kW-m of electric power to cool a 20-ounce beverage container
from about 25 degrees Celsius to about 4 degrees Celsius, from
about 20 degrees Celsius to about 4 degrees Celsius, from about 15
degrees Celsius to about 4 degrees Celsius, or from about 10
degrees Celsius to about 4 degrees Celsius in less than about 1
minute.
[0052] Reference will now be made to the figures, wherein like
numerals refer to like parts throughout. It will be appreciated
that the figures and features therein are not necessarily drawn to
scale.
[0053] FIG. 1 is a top view of an example thermoelectric cooling
device 100. The thermoelectric cooling device 100 can rapidly cool
a beverage container such as an aluminum can, a glass bottle, or a
plastic bottle. Alternatively or in addition, the thermoelectric
cooling device 100 can cool food or another object.
[0054] The thermoelectric cooling device 100 can include a chamber
105 that is configured to hold the beverage container or other
object. The chamber 105 can be made of a metallic (or
metal-containing) material. The metallic material can include one
or more elemental metals. For example, the metallic material can
include one or more of aluminum, titanium, iron, steel, tin,
tungsten, molybdenum, tantalum, cobalt, bismuth, cadmium, titanium,
zirconium, antimony, manganese, beryllium, chromium, germanium,
vanadium, gallium, hafnium, indium, niobium, rhenium and thallium,
and their alloys. The chamber 105 can be made of a
semiconductor-containing material, such as silicon or a silicide.
The chamber 105 can be made of a polymeric material. The polymeric
material can include one or more polymers. For example, the
polymeric material can include one or more of polyvinyl chloride,
polyvinylidene chloride, polyethylene, polyisobutene, and
poly[ethylene-vinylacetate] copolymer. The chamber 105 can be made
of a composite material. The composite material can include, for
example, reinforced plastics, ceramic matrix composites, and metal
matrix composites. The chamber 105 can include a composite of flame
retardant 4 ("FR4") with copper.
[0055] The chamber 105 can have a circular, triangular,
rectangular, pentagonal, or hexagonal cross-section, or a partial
shape or combination of shapes thereof. In some cases, the chamber
105 can be substantially cylindrical in shape so that it can
accommodate a cylindrical beverage container. The height of the
chamber 105 can be at least about 4 inches, 5 inches, 10 inches, 15
inches, 20 inches, or more. In some cases, the chamber 105 can be
approximately the height of (i) a 12-ounce aluminum can, (ii) a
20-ounce bottle, or (iii) a 2-liter bottle. The diameter or length
of the chamber 105 can be at least about 2 inches, 3 inches, 4
inches, 5 inches, 10 inches, or more. In some cases, the diameter
of the chamber 105 can be slightly larger than the diameter of (i)
a 12-ounce aluminum can, (ii) a 20-ounce bottle, or (iii) a 2-liter
bottle so that the chamber can accommodate both a container of that
size and a thermal coupling medium. The chamber 105 may be sized to
hold at most a single beverage container.
[0056] The thermoelectric cooling device 100 can have a source of a
thermal coupling medium in fluid communication with the chamber
105. The source can be an opening in the chamber 105 that is
configured to receive the thermal coupling medium from an outside
source. In some cases, the source can instead be a reservoir built
into the thermoelectric cooling device. In such cases, a pump in
the thermoelectric cooling device 100 can pump the thermal coupling
medium from the reservoir into the chamber 105 upon activation of
the thermoelectric cooling device. The thermal coupling medium can
be a fluid with a high thermal conductivity. For example, the
thermal coupling medium can be water, saline, or an organic
compound (e.g., propylene glycol). The thermal coupling medium can
surround the beverage container or other object and can thermally
couple the beverage container to the walls of the chamber 105. That
is, the thermal coupling medium can facilitate heat transfer
between the beverage container or other object and the walls of the
chamber 105.
[0057] The chamber 105 can include a drain 109 configured to drain
the thermal coupling medium from the chamber 105 after the
thermoelectric cooling device 100 cools a beverage container or
other object. An actuator can open and close the drain 109. A
controller electrically coupled to the actuator can control the
actuator's motion via application of a particular magnitude,
duration, and polarity of an electric voltage. A user input can
trigger opening of the drain 109. For example, the exterior of the
thermoelectric cooling device 100 can have a drain button that,
when depressed, causes the controller to apply a voltage across the
actuator to open the drain 109. Alternatively, the drain 109 can
open automatically after the thermoelectric cooling device 100
completes a cooling cycle.
[0058] The drain 109 can be coupled to a removable container, e.g.,
on the underside of the thermoelectric cooling device 100, that
collects the thermal coupling medium after it is drained from the
chamber 105. A user can remove the removable container and dispose
of the thermal coupling material in an appropriate manner without
transporting the entire thermoelectric cooling device 100.
[0059] The thermoelectric cooling device 100 can also include a
plurality of thermoelectric cooling elements 110. The
thermoelectric cooling elements 110 can surround the chamber 105.
The thermoelectric cooling elements 110 can project from the
chamber 105 to a heat sink 115. The thermoelectric cooling elements
110 can be arranged like the spokes on a wheel (i.e., in a radial
direction), for example. A particular thermoelectric cooling
element can be parallel to another thermoelectric cooling element.
Alternatively, a particular thermoelectric cooling element may not
be parallel to another thermoelectric cooling element. The
thermoelectric cooling device 100 can have at least about 2, 3, 4,
5, 6, 7, 8, 9, 10, 15, 20, 25, 30, or greater thermoelectric
cooling elements 110.
[0060] An adhesive can coat one or both sides of the thermoelectric
cooling elements 110. The adhesive can permit the thermoelectric
cooling elements 110 to be securely coupled to the chamber 105 and
the heat sink 115. The adhesive can be sufficiently thermally
conductive.
[0061] The thermoelectric cooling elements 110 can be configured to
transfer heat from the beverage container to a heat sink 115 when a
voltage is applied across the thermoelectric cooling elements 110.
In general, the thermoelectric cooling elements comprise an n-type
semiconductor element, a p-type semiconductor element, or n-type
and p-type semiconductor elements connected electrically in series
but thermally in parallel, as depicted in FIG. 2.
[0062] When a voltage is applied across the thermoelectric cooling
elements 110, current flows in the thermoelectric cooling elements
110 in the direction indicated by the arrow in FIG. 2.
Specifically, holes in the p-type semiconductor elements and
electrons in n-type semiconductors elements diffuse from the top
side 205 to the bottom side 210. Thus, the concentration of charge
carriers can increase on the bottom side 205 and can decrease on
the top side 210, resulting in a transfer of heat from the top side
205 to the bottom side 210. More specifically, the decrease in the
concentration of charge carriers in the metal contacts 207 on the
top side 205 results in fewer charge carrier collisions with atomic
ions in the metal contacts 207, which reduces their
temperature.
[0063] The thermoelectric cooling elements 110 can be configured to
have a large figure-of-merit (Z) to facilitate significant heat
transfer between the beverage container and the heat sink 115. Z
can be an indicator of coefficient-of-performance (COP) and the
efficiency of the given thermoelectric element, and T can be an
average temperature of the hot and the cold sides of the given
thermoelectric element. The figure-of-merit (ZT) of the given
thermoelectric element can be at least about 0.01, 0.02, 0.03,
0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, 0.15, 0.2, 0.25, 0.3,
0.35, 0.4, 0.45 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9,
0.95, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1,
2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0 or greater at
25.degree. C. The figure-of-merit can be from about 0.01 to 3, 0.1
to 2.5, 0.5 to 2.0 or 0.5 to 1.5 at 25.degree. C. The figure of
merit (ZT) can be a function of temperature. The ZT can increase
with temperature. The thermoelectric cooling elements 110 will be
described in more detail in reference to FIGS. 6-10.
[0064] Returning to FIG. 1, to dissipate the heat that accumulates
in the contacts 212, the thermoelectric cooling device can include
a heat sink 115. In the implementation depicted in FIG. 1, the heat
sink 115 is an air-cooled heat sink.
[0065] The heat sink 115 can be made of any sufficiently thermally
conductive but electrically insulating material. For example, the
heat sink 115 can be made of polymer foil (e.g., polyethylene,
polypropylene, polyester, polystyrene, polyimide, etc.);
elastomeric polymer foil (e.g., polydimethylsiloxane, polyisoprene,
natural rubber, etc.); fabric (e.g., conventional cloths,
fiberglass mat, etc.); ceramic, semiconductor, or insulator foil
(e.g., glass, silicon, silicon carbide, silicon nitride, aluminum
oxide, aluminum nitride, boron nitride, etc.); insulated metal foil
(e.g., anodized aluminum or titanium, coated copper or steel,
etc.); or combinations thereof.
[0066] The heat sink 115 can include a plurality of fins 117 that
extend radially away from the thermoelectric cooling device and
provide an increased heat transfer area, i.e., surface area. Gaps
can separate the plurality of fins 117 to facilitate convective
cooling.
[0067] In the implementation depicted in FIG. 1, the body of the
thermoelectric cooling device 100 is triangular in shape and
consequently includes three heat sinks, i.e., one on each side of
the body of the thermoelectric cooling device 100. However, in
alternative implementations, the body of the thermoelectric cooling
device 100 has a square, rectangular, pentagonal, or hexagonal
shape. In such implementations, the thermoelectric cooling device
100 can have 4, 4, 5, or 6 heat sinks, respectively. In general,
the heat sinks 115 can be larger than the chamber 105 because more
heat is released into the environment than is pulled out of the
beverage container.
[0068] The thermoelectric cooling device 100 can also include one
or more fans 120. Generally, the number of fans 120 can correspond
to the number of heat sinks 115. The fans 120 can draw hot air away
from the heat sinks 115.
[0069] The thermoelectric device 100 can also include insulation
130 to insulate the chamber 105 from the heat sinks 115. The
insulation 130 can be made of any thermally insulating material.
For example, the insulation 130 can be made of fiberglass or
ceramic.
[0070] Although not depicted in FIG. 1, in some implementations,
the thermoelectric cooling device 100 includes a user interface.
The user interface can include, for example, a power button, a
drain button, a programmable timer, and a programmable thermostat.
A user can use the power button to turn the thermoelectric cooling
device 100 on or off, the drain button to drain the thermal
coupling medium from the chamber 105 after a cooling cycle is
complete, the programmable timer to set a cooling cycle length, and
the thermostat to set a desired beverage temperature.
[0071] Alternatively or additionally, the user interface can
include an electronic display, e.g., a screen. The screen can be
accompanied by one or more speakers. The electronic display and
speakers can be configured to provide visual and audible
information and instructions to the user. The screen can be a
touchscreen. The touchscreen can be a capacitive or resistive touch
screen configured to receive user input that activates or operates
the thermoelectric cooling device.
[0072] A controller can electrically couple the user interface to
the thermoelectric cooling elements 110 and to the drain 109. The
controller can include memory and a central processing unit (CPU).
The memory can store programmable settings such as timer settings
and thermoset settings. The CPU can compute the amount and duration
of current that can be provided to the thermoelectric cooling
elements 110 to cool the beverage container to a desired
temperature in a specified amount of time. The controller can then
provide that amount and duration of current to the thermoelectric
cooling elements 110. The controller can also provide a particular
polarity of electric voltage to the actuator to open or close the
drain 109.
[0073] The memory can include a variety of computer-readable memory
that may be read by the CPU. For example, the memory may include
computer storage media in the form of volatile and/or nonvolatile
memory such as read only memory (ROM) and random access memory
(RAM). A basic input/output system (BIOS), containing the basic
routines that help to transfer information between elements, such
as during start-up, is typically stored in ROM. RAM typically
contains data and/or program modules that are immediately
accessible to and/or presently being operated on by processing unit
160. The data or program modules may include an operating system,
application programs, other program modules, and program data. The
operating system may be or include a variety of operating systems
such as Microsoft WINDOWS operating system, the Unix operating
system, the Linux operating system, the Xenix operating system, the
IBM AIX operating system, the Hewlett Packard UX operating system,
the Novell NETWARE operating system, the Sun Microsystems SOLARIS
operating system, the OS/2 operating system, the BeOS operating
system, the MACINTOSH operating system, the APACHE operating
system, an OPENSTEP operating system or another operating system of
platform.
[0074] Any suitable programming language may be used to implement
the functions described herein. Illustratively, the programming
language used may include assembly language, Ada, APL, Basic, C,
C++, C*, COBOL, dBase, Forth, FORTRAN, Java, Modula-2, Pascal,
Prolog, Python, REXX, and/or JavaScript for example. In some cases,
a single type of instruction or programming language may be
utilized in conjunction with the operation of systems and
techniques disclosed herein. In other cases, a single type of
instruction or programming language may not be utilized in
conjunction with the operation of systems and techniques disclosed
herein. Rather, any number of different programming languages may
be utilized.
[0075] The computing environment may also include other
removable/non-removable, volatile/nonvolatile computer storage
media. For example, a hard disk drive may read or write to
non-removable, nonvolatile magnetic media. A magnetic disk drive
may read from or writes to a removable, nonvolatile magnetic disk,
and an optical disk drive may read from or write to a removable,
nonvolatile optical disk such as a CD-ROM or other optical media.
Other removable/non-removable, volatile/nonvolatile computer
storage media that can be used in the exemplary operating
environment include, but are not limited to, magnetic tape
cassettes, flash memory cards, digital versatile disks, digital
video tape, solid state RAM, solid state ROM, and the like. The
storage media are typically connected to the system bus through a
removable or non-removable memory interface.
[0076] The CPU may be a general-purpose computer processor, but may
utilize any of a wide variety of other technologies including
special-purpose hardware, a microcomputer, mini-computer, mainframe
computer, programmed micro-processor, micro-controller, peripheral
integrated circuit element, a CSIC (Customer Specific Integrated
Circuit), ASIC (Application Specific Integrated Circuit), a logic
circuit, a digital signal processor, a programmable logic device
such as an FPGA (Field Programmable Gate Array), PLD (Programmable
Logic Device), PLA (Programmable Logic Array), RFID processor,
smart chip, or any other device or arrangement of devices that is
capable of implementing the steps of the processes disclosed
herein.
[0077] The thermoelectric cooling device 100 can also include a
direct current (DC) power source that provides DC current to the
thermoelectric cooling elements, the controller, and the user
interface. The controller can control precisely how much current
the thermoelectric cooling elements 110 receive so that they cool
the beverage container to a specified temperature in a specified
amount of time. The DC power source can be a battery, e.g., a
rechargeable lithium-ion battery, or it can be an adapter or power
supply that converts alternating (AC) current from main power to DC
current.
[0078] More portable and compact implementations of the
thermoelectric cooling device 100 may omit the heat sinks 115 and
the fans 120. Instead, the thermoelectric cooling device 100 may
have a single, air-cooled heat sink. The air-cooled heat sink may
be a heat exchange surface with a heat pipe. The heat exchange
surface may be disposed on the bottom surface of the thermoelectric
cooling device 100. The thermoelectric cooling device 100 may also
have fewer thermoelectric elements to further reduce the size of
the thermoelectric cooling device.
[0079] FIG. 3 is an isometric view of the thermoelectric device 100
depicted in FIG. 1. FIG. 3 more clearly depicts the fans 120 and
the heat sinks 115. As more clearly illustrated in FIG. 3, the
chamber 105 of the thermoelectric device 100 can have a top opening
that facilitates easy insertion of a beverage container into the
chamber 105. In some implementations, the chamber 105 has a lid,
which can facilitate faster cooling.
[0080] FIG. 4 is a top view of an example thermoelectric cooling
device 400. FIG. 5 is an isometric view of the thermoelectric
cooling device 400. The thermoelectric cooling device 400 can have
some or all of the components and capabilities of the
thermoelectric cooling device 100, except that the thermoelectric
cooling device 400 can have a liquid-cooled heat sink 415. The heat
sink 415 can include one or more pipes 417 that can hold coolant.
The pipes 417 can be made of a thermally conductive material such
as copper. The thermoelectric cooling device 400 can include, as
depicted in FIGS. 4 and 5, two pipes 417 per side of the
thermoelectric cooling device 400. In alternative implementations,
the thermoelectric cooling device 400 can have more or fewer pipes.
In some implementations, the pipes 417 are connected to form a
closed loop. In some implementations, a compressor can cause the
coolant to continuously flow in the pipes 417. The coolant can be a
fluid with a high thermal capacity and a low viscosity. For
example, the coolant can be air, helium, water, ethylene glycol,
diethylene glycol, or propylene glycol.
[0081] FIG. 6 is a schematic perspective view of a thermoelectric
element 600 having an array of holes 601 (select holes circled), in
accordance with an embodiment of the present disclosure. The array
of holes can be referred to as a "nanomesh" herein. FIGS. 7 and 8
are perspective top and side views of the thermoelectric element
600. The element 600 can be an n-type or p-type element, as
described elsewhere herein. The array of holes 601 may include
individual holes 601a that can have widths from several nanometers
or less up to microns, millimeters or more. The holes may have
widths (or diameters, if circular) ("d") between about 1 nm and 500
nm, or 5 nm and 100 nm, or 10 nm and 30 nm. The holes can have
lengths ("L") from about several nanometers or less up to microns,
millimeters or more. The holes may have lengths between about 0.5
microns and 1 centimeter, or 1 micron and 500 millimeters, or 10
microns and 1 millimeter.
[0082] The holes 601a may be formed in a substrate 600a. The
substrate 600a may be a solid state material, such as e.g., carbon
(e.g., graphite or graphene), silicon, germanium, gallium arsenide,
aluminum gallium arsenide, silicides, silicon germanium, bismuth
telluride, lead telluride, oxides (e.g., SiOx, where `x` is a
number greater than zero), gallium nitride and tellurium silver
germanium antimony (TAGS) containing alloys. For example, the
substrate 600a can be a Group IV material (e.g., silicon or
germanium) or a Group III-V material (e.g., gallium arsenide). The
substrate 600a may be formed of a semiconductor material comprising
one or more semiconductors. The semiconductor material can be doped
n-type or p-type for n-type or p-type elements, respectively.
[0083] The holes 601a may be filled with a gas, such as He, Ne, Ar,
N.sub.2, H.sub.2, CO.sub.2, O.sub.2, or a combination thereof In
other cases, the holes 601a may be under vacuum. Alternatively, the
holes may be filled (e.g., partially filled or completely filled)
with a semiconductor material, an insulating (or dielectric)
material, or a gas (e.g., He, Ar, H.sub.2, N.sub.2, CO.sub.2).
[0084] A first end 602 and second end 603 of the element 600 can be
in contact with a substrate having a semiconductor-containing
material, such as silicon or a silicide. The substrate can aid in
providing an electrical contact to an electrode on each end 602 and
603. Alternatively, the substrate can be precluded, and the first
end 602 and second end 603 can be in contact with a first electrode
(not shown) and a second electrode (not shown), respectively.
[0085] The holes 601a may be substantially monodisperse.
Monodisperse holes may have substantially the same size, shape
and/or distribution (e.g., cross-sectional distribution). The holes
601a may be distributed in domains of holes of various sizes, such
that the holes 601a may be not necessarily monodisperse. For
example, the holes 601a may be polydisperse. Polydisperse holes can
have shapes, sizes and/or orientations that deviate from one
another by at least about 0.1%, 0.5%, 1%, 2%, 3%, 4%, 5%, 10%, 15%,
20%, 30%, 40%, or 50%. The thermoelectric element 600 may include a
first set of holes with a first diameter and a second set of holes
with a second diameter. The first diameter may be larger than the
second diameter. In other cases, the device 600 may include two or
more sets of holes with different diameters.
[0086] The holes 601a can have various packing arrangements. The
holes 601a, when viewed from the top (see FIG. 7), may have a
hexagonal close-packing arrangement. The holes 601a in the array of
holes 601 may have a center-to-center spacing between about 1 nm
and 500 nm, or 5 nm and 100 nm, or 10 nm and 30 nm. The
center-to-center spacing may be the same, which may be the case for
monodisperse holes 601a. The center-to-center spacing can be
different for groups of holes with various diameters and/or
arrangements.
[0087] The dimensions (lengths, widths) and packing arrangement of
the holes 601, and the material and doping configuration (e.g.,
doping concentration) of the thermoelectric element 600 can be
selected to effect a predetermined electrical conductivity and
thermal conductivity of the thermoelectric element 600. For
instance, the diameters and packing configuration of the holes 601
can be selected to minimize the thermal conductivity, and the
doping concentration can be selected to maximize the electrical
conductivity of the thermoelectric element 600.
[0088] The array of holes 601 can have an aspect ratio (e.g., the
length of the element 600 divided by width of an individual hole
601a) of at least about 1.5:1, or 2:1, or 5:1, or 10:1, or 20:1, or
50:1, or 100:1, or 1000:1, or 5,000:1, or 10,000:1, or 100,000:1,
or 1,000,000:1, or 10,000,000:1, or 100,000,000:1, or more.
[0089] The holes 601 can be ordered and have uniform sizes and
distributions. As an alternative, the holes 601 may not be ordered
and may not have a uniform distribution. For example, the holes 601
can be disordered such that there is no long range order for the
pattern of holes 601. In some embodiments, thermoelectric elements
can include an array of wires. The array of wires can include
individual wires that are, for example, rod-like structures.
[0090] As an alternative to the array of holes of the element 600,
the holes may not be ordered and may not have a uniform
distribution. In some examples, there is no long range order with
respect to the holes. The holes may intersect each other in random
directions. The holes may include intersecting holes, such as
secondary holes that project from the holes in various directions.
The secondary holes may have additional secondary holes. The holes
may have various sizes and may be aligned along various directions,
which may be random and not uniform.
[0091] FIG. 9 is a schematic perspective top view of a
thermoelectric element 600, in accordance with an embodiment of the
present disclosure. FIG. 10 is a schematic perspective top view of
the thermoelectric element 900. The thermoelectric element 900 may
be used with devices, systems and methods provided herein. The
thermoelectric element 900 may include an array of wires 901 having
individual wires 901a. The wires may have widths (or diameters, if
circular) ("d") between about 1 nm and 500 nm, or 5 nm and 100 nm,
or 10 nm and 30 nm. The wires can have lengths ("L") from about
several nanometers or less up to microns, millimeters or more. The
wires may have lengths between about 0.5 microns and 1 centimeter,
or 1 micron and 500 millimeters, or 10 microns and 1
millimeter.
[0092] The wires 901a may be substantially monodisperse.
Monodisperse wires may have substantially the same size, shape
and/or distribution (e.g., cross-sectional distribution). The wires
901a may be distributed in domains of wires of various sizes, such
that the wires 901a may not be necessarily monodisperse. For
example, the wires 901a may be polydisperse. Polydisperse wires can
have shapes, sizes and/or orientations that deviate from one
another by at least about 0.1%, 0.5%, 1%, 2%, 3%, 4%, 5%, 10%, 15%,
20%, 30%, 40%, or 50%.
[0093] The wires 901a in the array of wires 901 may have a
center-to-center spacing between about 1 nm and 500 nm, or 5 nm and
100 nm, or 10 nm and 30 nm. The center-to-center spacing may be the
same, which may be the case for monodisperse wires 901. The
center-to-center spacing can be different for groups of wires with
various diameters and/or arrangements.
[0094] The wires 901a may be formed of a solid state material, such
as a semiconductor material, such as, e.g., silicon, germanium,
gallium arsenide, aluminum gallium arsenide, silicide alloys,
alloys of silicon germanium, bismuth telluride, lead telluride,
oxides (e.g., SiOx, where `x` is a number greater than zero),
gallium nitride and tellurium silver germanium antimony (TAGS)
containing alloys. The wires 901a can be formed of other materials
disclosed herein. The wires 901a can be doped with an n-type dopant
or a p-type dopant.
[0095] The wires 901a may be attached to semiconductor substrates
at a first end 902 and second end 903 of the thermoelectric element
900. The semiconductor substrates can have the n-type or p- type
doping configuration of the individual wires 901a. The wires 901a
at the first end 902 and second end 903 may not be attached to
semiconductor substrates, but can be attached to electrodes. For
instance, a first electrode (not shown) can be in electrical
contact with the first end 902 and a second electrode can be
electrical contact with the second end 903.
[0096] With reference to FIG. 10, space 904 between the wires 901a
may be filled with a vacuum or various materials. The wires may be
laterally separated from one another by an electrically insulating
material, such as a silicon dioxide, germanium dioxide, gallium
arsenic oxide, spin on glass, and other insulators deposited using,
for example, vapor phase deposition, such as chemical vapor
deposition or atomic layer deposition. The wires may be laterally
separated from one another by vacuum or a gas, such as He, Ne, Ar,
N.sub.2, H.sub.2, CO.sub.2, O.sub.2, or a combination thereof.
[0097] The array of wires 901 can have an aspect ratio--length of
the thermoelectric element 900 divided by width of an individual
wire 901a--of at least about 1.5:1, or 2:1, or 5:1, or 10:1, or
20:1, or 50:1, or 100:1, or 1000:1, or 5,000:1, or 10,000:1, or
100,000:1, or 1,000,000:1, or 10,000,000:1, or 100,000,000:1, or
more. The length of the thermoelectric element 900 and the length
of an individual wire 901a may be substantially the same.
[0098] As an alternative to the array of wires of the
thermoelectric element 900, the wires may not be ordered and may
not have a uniform distribution. There may be no long range order
with respect to the wires. The wires may intersect each other in
random directions. The wires may have various sizes and may be
aligned along various directions, which may be random and not
uniform.
[0099] As another alternative, a thermoelectric element may not
include holes or wires (e.g., the thermoelectric may be
non-porous). Such a thermoelectric element may be formed of a solid
state material, such as, for example, carbon (e.g., graphite or
graphene), silicon, germanium, gallium arsenide, aluminum gallium
arsenide, silicides, silicon germanium, bismuth telluride, lead
telluride, oxides (e.g., SiOx, where `x` is a number greater than
zero), gallium nitride and tellurium silver germanium antimony
(TAGS) containing alloys. Such a thermoelectric element may be
formed by doping a solid state material, for example. As another
example, such a thermoelectric element may be formed according to
methods disclosed in U.S. Patent Publication No. 2016/0380175,
which is entirely incorporated herein by reference.
[0100] As another alternative, a thermoelectric element may be
formed according to methods disclosed in U.S. Patent Publication
No. 2015/0280099, which is entirely incorporated herein by
reference.
[0101] FIG. 12 is an isometric view of a commercial implementation
of a thermoelectric cooling device for rapidly cooling a beverage
container. The thermoelectric cooling device can have a lower
volume 1205, an upper volume 1210, a cylindrical element 1215, a
window 1220, and a display panel 1225.
[0102] The lower volume 1205 can be the base of the thermoelectric
cooling device. The lower volume 1205 can hold the power
electronics of the thermoelectric cooling device, e.g., an AC-to-DC
converter, a DC-to-DC converter, control and switching circuitry,
and the like. The upper volume 1210 can hold heat sinks and
ventilation components that are configured to dissipate heat away
from the beverage container and route hot air away from the
thermoelectric cooling device. In some implementations, the back
face of the upper volume 1210 can have vents for expelling the hot
air.
[0103] The cylindrical element 1215 can include a chamber
configured to hold the beverage container and thermoelectric
cooling elements configured to transfer heat from the beverage
container to the heat sinks in the upper volume 1210 upon
application of power to the thermoelectric cooling elements. The
cylindrical element 1215 can also include at least one actuator
configured to rotate the beverage container in the chamber. The
actuator can be a motor. Rotating the beverage container can ensure
that heat dissipates uniformly from the beverage container, e.g.,
that no two points in the beverage container differ by more than
about 10.degree. C., 9.degree. C., 8.degree. C., 7.degree. C.,
6.degree. C., 5.degree. C., 4.degree. C., 3.degree. C., 2.degree.
C., or less. Rotating the beverage container can also cause the
thermal coupling medium to circulate, which can ensure that heat is
uniformly distributed in the thermal coupling medium. The
cylindrical element 1215 can also include a reservoir configured to
store a thermal coupling medium. A mechanical pump also disposed in
the cylindrical element 1215 can pump the thermal coupling medium
into the chamber during cooling cycles. The thermal coupling medium
can thermally couple the beverage container to the chamber walls to
facilitate heat exchange between the beverage container and the
chamber walls.
[0104] The window 1220 can be disposed in the top of the upper
volume 1210. The window 1220 can allow a user to watch the beverage
container while it is cooled. This can provide a more interactive
user experience.
[0105] The display panel 1225 can be disposed in the front face of
the upper volume 1210. The display panel 1225 can display the time,
date, and information about the cooling process, e.g., an amount of
time until the cooling process is complete and a current
temperature of the beverage container. The display panel 1225 can
be or include a user interface. For example, the display panel 1225
can be a capacitive or resistive touchscreen, and the
thermoelectric cooling device can have a touchscreen-based
operating system. The touchscreen can allow a user to start a
cooling cycle, set a cooling cycle length, set a desired beverage
temperature, and/or drain a thermal coupling medium from the
chamber of the thermoelectric cooling device after a cooling cycle
is complete.
[0106] In some implementations, a user interface can instead be
disposed adjacent to the display panel 1225. The user interface can
include a plurality of buttons and knobs. The buttons and knobs can
enable a user to control the thermoelectric cooling device as
described above.
[0107] FIG. 13 is a front view of the thermoelectric cooling device
of FIG. 12. FIG. 13 depicts the display panel 1225.
[0108] FIG. 14 is a back view of the thermoelectric cooling device
of FIG. 12. The upper volume 1210 can include vents 1230 configured
to dissipate heat from the thermoelectric cooling device.
[0109] FIG. 15 is a second isometric view of the thermoelectric
cooling device of FIG. 12. The thermoelectric cooling device can
include a release 1235. The release 1235 can be used to drain the
thermal coupling medium from the chamber. The bottom of the chamber
can have a valve that can open and close to facilitate movement of
the thermal coupling medium from the chamber to the drain. The
release 1235 can be lower than the valve so that the thermal
coupling medium can be drained without any pumping.
[0110] FIG. 16A is a top view of an example thermoelectric cooling
device 1600. The thermoelectric cooling device 1600 can rapidly
cool a beverage container such as an aluminum can, a glass bottle,
or a plastic bottle by maintaining a thermal coupling medium at a
temperature below ambient temperature. The ambient temperature may
be 25 degrees Celsius at an ambient pressure of at least 1
atmosphere (i.e., atmospheric pressure at sea level). This can
enable rapid cooling of the beverage container using fewer
thermoelectric elements and less power. In general, the
thermoelectric cooling device 1600 can operate in substantially the
same way and be made of substantially the same components and
materials as the thermoelectric cooling devices previously
described in this disclosure. The following paragraphs describe
certain differences between the thermoelectric cooling device 1600
and the previously described thermoelectric cooling devices.
[0111] The thermoelectric cooling device 1600 can include a chamber
1605 that is configured to hold the beverage container and a
thermal coupling medium. The thermal coupling medium can surround
the beverage container and thermally couple the beverage container
to the walls of the chamber 1605. By maintaining the thermal
coupling medium at a temperature below ambient temperature, the
thermoelectric cooling device 1600 can more quickly cool a beverage
container with fewer thermoelectric elements and less power. The
thermoelectric cooling device can maintain the thermal coupling
medium at least about 2 degrees Celsius (.degree. C.), 3.degree.
C., 4.degree. C., 5.degree. C., 6.degree. C., 7.degree. C.,
8.degree. C., 9.degree. C., 10.degree. C., 15.degree. C.,
20.degree. C. or more below ambient temperature.
[0112] The chamber 1605 can include drains 1609. The drains 1609
can be used to periodically drain and replace the thermal coupling
medium. The chamber 1605 can also include a beverage can holder
1611. The beverage can holder 1611 can be disposed within the
chamber 1605. The holders 1613 can hold the beverage can in place.
In some cases, the beverage can holder 1611 may be able to rotate
freely within the chamber 1605. In such cases, at least one
actuator can rotate the beverage can holder 1611 to ensure that the
beverage container is cooled uniformly. The actuator can be a
motor.
[0113] The thermoelectric cooling device 1600 can also include a
plurality of thermoelectric cooling elements 1610 similar to the
thermoelectric cooling elements 110 described in reference to FIG.
1. The thermoelectric cooling elements 1610 can be configured to
transfer heat from the beverage container to heat sinks 1615 when a
voltage is applied across the thermoelectric cooling elements
1610.
[0114] The heat sinks 1615 can be made of any sufficiently
thermally conductive but electrically insulating material. For
example, the heat sinks 1615 can be made of polymer foil (e.g.,
polyethylene, polypropylene, polyester, polystyrene, polyimide,
etc.); elastomeric polymer foil (e.g., polydimethylsiloxane,
polyisoprene, natural rubber, etc.); fabric (e.g., conventional
cloths, fiberglass mat, etc.); ceramic, semiconductor, or insulator
foil (e.g., glass, silicon, silicon carbide, silicon nitride,
aluminum oxide, aluminum nitride, boron nitride, etc.); insulated
metal foil (e.g., anodized aluminum or titanium, coated copper or
steel, etc.); or combinations thereof.
[0115] The heat sinks 1615 can be liquid-cooled heat sinks that
have pipes that hold and circulate coolant. The pipes can be made
of a thermally conductive material such as copper. In some
implementations, a compressor can cause the coolant to circulate
through the pipes. The coolant can be a fluid with a high thermal
capacity and a low viscosity. For example, the coolant can be air,
helium, water, ethylene glycol, diethylene glycol, or propylene
glycol. The thermoelectric cooling device 1600 can include at least
1, 2, 3, 4, 5, or more heat sinks 1615. The heat sinks 1615 can
instead be air-cooled heat sinks with fans as previously described
in this disclosure.
[0116] Although not depicted in FIG. 16, the thermoelectric cooling
device 1600 can include a user interface. The user interface can
perform substantially the same functions as the user interface
described in reference to FIG. 1. A controller can electrically
couple the user interface to the thermoelectric cooling elements
1610 and to the drain 1609. The controller can include memory and a
central processing unit (CPU). The memory and CPU can be similar to
the memory and CPU previously described in this disclosure.
[0117] The thermoelectric cooling device 1600 can also include a
direct current (DC) power source that provides DC current to the
thermoelectric cooling elements, the controller, and the user
interface. The controller can control precisely how much current
the thermoelectric cooling elements 1610 receive so that they cool
the beverage container to a specified temperature in a specified
amount of time. The DC power source can be a battery, e.g., a
rechargeable lithium-ion battery, or it can be an adapter or power
supply that converts alternating (AC) current from main power to DC
current.
[0118] FIG. 16B is an isometric view of the thermoelectric cooling
device 1600. From this view, an actuator 1620 is visible. The
actuator 1620 can cause the beverage can holder 1610 to rotate
within the chamber 1605. The actuator 1620 can be a motor.
[0119] FIG. 17A is an isometric view of a "pour-in" thermoelectric
cooling device 1700. The thermoelectric cooling device 1700 can be
used to cool a liquid directly.
[0120] The thermoelectric cooling device 1700 can have a chamber
1705. The chamber 1705 can be a rectangular prism with a length and
a width that are substantially greater than its thickness.
Alternatively, the chamber 1705 can have another shape that has a
large surface area to volume ratio (e.g., a tetrahedron). In some
cases, the large faces or sides of the chamber 1705 may be at least
about two, three, four five, six, or more time larger than the
remaining faces or sides. The shape of the chamber 1705 can
facilitate rapid cooling of a liquid within the chamber 1705 as a
result of the large surface area of liquid exposed directly to
thermoelectric cooling elements.
[0121] FIG. 17B is a top view of the thermoelectric cooling device
1700. As depicted, the top of the chamber 1705 can have one or more
bores 1707 for receiving a liquid to cool. Each bore can be
connected to the chamber 1705. Alternatively, the chamber 1705 can
include two or more distinct chambers, and each bore 1707 can be
connected to a different one of the two or more distinct chambers,
which can allow the thermoelectric cooling device 1700 to cool
multiple different liquids at once.
[0122] Thermoelectric coolers 1710 can be disposed on either or
both large sides of the chamber 1705. The thermoelectric coolers
1710 can be made of the thermoelectric cooling elements described
previously in this disclosure. The thermoelectric coolers 1710 can
be configured to transfer heat from the liquid in the chamber 1705
to heat sinks 1715 when power in provided to the thermoelectric
coolers. The heat sinks 1715 can be disposed on the outside of the
thermoelectric coolers 1710. The heat sinks 1715 can be made of any
sufficiently thermally conductive material. The heat sinks 1715 can
be air-cooled or liquid-cooled. Air-cooled heat sinks can include
one or more fans. The fans can draw hot air away from the heat
sinks 1715. Liquid-cooled heat sinks can have one or pipes filled
with coolant. A compressor can force circulation of the coolant in
the one or more pipes.
[0123] The bottom of the chamber 1705 can have a tap 1717. The tap
1717 can be used to drain the cooled liquid from the chamber 1705.
The tap can have a valve that can be controlled by a button or a
user interface.
[0124] In general, other than the features described above, the
thermoelectric cooling device 1700 can operate in substantially the
same way and be made of substantially the same components and
materials as the previously described implementations of the
thermoelectric cooling device. For example, the chamber 1705, the
thermoelectric coolers 1710, and the heat sinks 1715 can be made of
any of the same materials as the corresponding components in the
other implementations of the thermoelectric cooling device.
Additionally, the thermoelectric cooling device 1700 can include an
electronic display or user interface.
[0125] In some implementations, the thermoelectric cooling device
1700 can be used to make ice cores. In such implementations, the
chamber 1705 can include two or more distinct chambers, and each
bore 1707 can be connected to a different one of the two or more
distinct chambers, which can allow the thermoelectric cooling
device 1700 to make multiple ice cores at the same time. A user can
pour water into the bores 1707, activate the thermoelectric cooling
device 1700, and allow the thermoelectric cooling device to cool
the water below its freezing point, resulting in ice cores.
Applications of Thermoelectric Cooling Devices
[0126] The thermoelectric cooling devices described in the present
disclosure can be integrated into a refrigerator or a freezer. For
example, the thermoelectric cooling devices can be disposed in the
door of a refrigerator in a similar manner to a water or ice
dispenser. The chamber, thermoelectric cooling elements, and heat
sink of the thermoelectric cooling devices can be positioned within
or behind the door of the refrigerator, and an opening on the front
face of the door can provide a user easy access to the chamber.
[0127] The opening can have a door. The door can have hinges, a
fastening component and a seal. The hinges can be positioned on the
top, bottom, or side of the door and can allow the door to open and
close. The fastening component can secure the door in a closed
position during operation of the thermoelectric cooling device. The
fastening component can be a clamp, a latch, a flange, or the like.
The seal can thermally isolate the chamber of the thermoelectric
cooling device from the environment. The seal can be a strip of
insulating material disposed along each side of the door and/or
along each side of the body of the thermoelectric cooling device.
The seal can be made of fiberglass, ceramic, rubber, or another
insulating material. The seal can be coated with an adhesive to aid
the fastening component in securing the door in a closed position
during operation of the thermoelectric device.
[0128] The chamber of the thermoelectric device can be configured
to hold an object to be cooled. The object can be a beverage
container, food, or the like. The chamber can have a circular,
triangular, rectangular, pentagonal, or hexagonal cross-section. In
some cases, the chamber can be substantially cylindrical in shape
so that it can accommodate a cylindrical beverage container. The
height of the chamber can be at least about 4 inches, 5 inches, 10
inches, 15 inches, 20 inches, or more. In some cases, the chamber
can be approximately the height of (i) a 12-ounce aluminum can,
(ii) a 20-ounce bottle, or (iii) a 2-liter bottle. The diameter or
length of the chamber can be at least about 2 inches, about 3
inches, 4 inches, 5 inches, 10 inches, or more. In some cases, the
diameter of the chamber can be slightly larger than the diameter of
(i) a 12-ounce aluminum can, (ii) a 20-ounce bottle, or (iii) a
2-liter bottle so that the chamber can accommodate both a container
of that size and a thermal coupling medium.
[0129] The chamber can be oriented vertically, i.e., so that a
beverage container can be placed upright in the chamber, or the
chamber can be oriented horizontally, i.e., so that a beverage
container can be place on its side.
[0130] The door of the refrigerator or freezer can have a user
interface configured to control the thermoelectric cooling device.
The user interface can be similar to the user interface of the
thermoelectric cooling device described in reference to FIG. 1. The
user interface can include, for example, an activation button, a
programmable timer, and a programmable thermostat. A user can use
the activation button to start the thermoelectric cooling device,
the programmable timer to set a cooling cycle length, and the
thermostat to set a desired beverage temperature. Alternatively or
additionally, the user interface can include an electronic display,
e.g., a screen. The screen can be accompanied by one or more
speakers. The electronic display and speakers can be configured to
provide visual and audible information and instructions to the
user. The electronic display can be a touchscreen. The touchscreen
can be a capacitive or resistive touch screen configured to receive
user input that activates or operates the thermoelectric cooling
device.
[0131] A controller can electrically couple the user interface to
the thermoelectric cooling device. The controller can include
memory and a central processing unit (CPU). The memory can store
programmable settings such as timer settings and thermoset
settings. The CPU can compute the amount and duration of current
that can be provided to the thermoelectric cooling elements to cool
the object in the container to the desired temperature in a
specified amount of time. The controller can then provide that
amount and duration of current to the thermoelectric cooling
elements.
[0132] The thermoelectric cooling device can be electrically
coupled to the electric system of the refrigerator so the
thermoelectric cooling device and the refrigerator can use the same
power source. Similarly, the heat sink of the thermoelectric
cooling device can share a heat expelling unit with the
refrigerator.
[0133] In some implementations, the thermoelectric cooling device
can be integrated into the interior of the refrigerator. For
example, the thermoelectric cooling device can be disposed on a
shelf in the refrigerator. In such implementations, the
thermoelectric cooling device can be controlled by a user interface
that is built into the door of the refrigerator or one that is
disposed within the refrigerator.
[0134] The thermoelectric cooling devices provided in the present
disclosure can alternatively or additionally be integrated into a
vending machine. For example, a thermoelectric cooling device can
be disposed in or near the drink dispensing slot of a vending
machine. When a user purchases a drink, the drink can drop into the
chamber of the thermoelectric cooling device through an opening in
the top the device. After the drink is cooled, the chamber of the
thermoelectric cooling device can actuate out of the vending
machine, allowing a user to retrieve the drink.
[0135] The thermoelectric cooling device can have any of the
features or dimensions described above. The vending machine can
have some or all of the same features as the refrigerator, e.g., a
user interface configured to control the thermoelectric cooling
device. The thermoelectric cooling device can be electrically
coupled to the electric system of the vending machine so the
thermoelectric cooling device and the vending machine can use the
same power source. Similarly, the heat sink of the thermoelectric
cooling device can share a heat expelling unit with the vending
machine.
[0136] The use of a thermoelectric cooling device in a vending
machine can save significantly on refrigeration costs. Instead of
continuously cooling all of the drinks in a vending machine, use of
the thermoelectric cooling device can allow a drink to be cooled
only once, immediately after it is purchased. Other than the
thermoelectric cooling device, the vending machine may not have
refrigeration system.
[0137] The thermoelectric cooling device can alternatively or
additionally be integrated into or attached to the outside of a
portable cooler. Such a thermoelectric cooling device can have the
features and dimensions described above. A thermoelectric cooling
device that is integrated into a cooler can get power from
rechargeable batteries.
[0138] The thermoelectric cooling devices described in this
disclosure can alternatively or additionally be used to heat a
beverage container or other object. The thermoelectric cooling
elements can be arranged in the opposite direction of FIG. 2 to
achieve such heating.
Methods for Forming Thermoelectric Devices
[0139] The heat sink or the chambers may be formed by using one or
more manufacturing techniques. The one or more manufacturing
techniques may include subtractive manufacturing, injection
molding, blow molding, or additive manufacturing processes such as
3D printing. The subtractive manufacturing may be used to create
the heat sink or the chamber by successively cutting material away
from a solid block of material. The injection molding may comprise
a high pressure injection of raw materials into one or more molds.
The one or more molds may shape the raw material into the desired
shape of the heat sink or chamber. The blow molding may comprise
multiple steps. The multiple steps may comprise melting down the
raw material, forming the raw material into a parison, placing the
parison into a mold, and air blowing through the parison to push
the material out to match the mold. The additive manufacturing
processes may be used to create the heat sink or the chamber by
laying down successive layers of material, each of which can be
seen as a thinly sliced horizontal cross-section of the target heat
sink or chamber.
[0140] The heat sink and the chamber may be manufactured as a
single (or unitary) piece, thus no assembly may be required. The
heat sink and the chamber may be manufactured as two pieces, thus
at least one assembly step may be required. The two pieces may be
manufactured separately. The two pieces may be manufactured
simultaneously. The heat sink and the chamber may be manufactured
as three pieces, thus multiple assembly steps may be required. The
multiple assembly steps may include at least two, three, four, or
more steps. The heat sink and the chamber may be manufactured as
more than three pieces.
[0141] A thermoelectric cooling element can be formed using
electrochemical etching. The thermoelectric cooling element may be
formed by cathodic or anodic etching, in some cases without the use
of a catalyst. The thermoelectric cooling element can be formed
without use of a metallic catalysis. The thermoelectric cooling
element can be formed without providing a metallic coating on a
surface of a substrate to be etched. This can also be performed
using purely electrochemical anodic etching and suitable etch
solutions and electrolytes. As an alternative, a thermoelectric can
be formed using metal catalyzed electrochemical etching in suitable
etch solutions and electrolytes, as described in, for example,
PCT/US2012/047021, filed Jul. 17, 2012, PCT/US2013/021900, filed
Jan. 17, 2013, PCT/US2013/055462, filed Aug. 16, 2013,
PCT/US2013/067346, filed Oct. 29, 2013, each of which is entirely
incorporated herein by reference.
[0142] A thermoelectric cooling element can be formed using one or
more sintering processes. The one or more sintering processes
comprise spark plasma sintering, electro sinter forging,
pressureless sintering, microwave sintering, and liquid phase
sintering. The spark plasma sintering may be conducted by using a
spark plasma sintering instrument. The spark plasma sintering
instrument may apply external pressure and an electric field
simultaneously to enhance the densification of a precursor of the
thermoelectric element. The spark plasma sintering instrument may
use a direct current (DC) pulse as the electric current to create
spark plasma and spark impact pressure.
[0143] The chamber, the thermoelectric cooling elements, and/or the
heat sink may be assembled with surface-mount technology.
Surface-mount technology may be used to place the thermoelectric
cooling elements on the chamber and/or the heat sink.
Computer Control Systems
[0144] The present disclosure provides computer control systems
that are programmed or otherwise configured to implement methods of
the disclosure. FIG. 11 shows a computer system 1101 that is
programmed or otherwise configured to control thermoelectric
generators of the present disclosure. The computer system 1101 can
be part of an electronic device of a user. The electronic device
can be a mobile electronic device.
[0145] The computer system 1101 includes a central processing unit
(CPU, also "processor" and "computer processor" herein) 1105, which
can be a single core or multi core processor, or a plurality of
processors for parallel processing. The computer system 1101 also
includes memory or memory location 1110 (e.g., random-access
memory, read-only memory, flash memory), electronic storage unit
1115 (e.g., hard disk), communication interface 1120 (e.g., network
adapter) for communicating with one or more other systems, and
peripheral devices 1125, such as cache, other memory, data storage
and/or electronic display adapters. The memory 1110, storage unit
1115, interface 1120 and peripheral devices 1125 are in
communication with the CPU 1105 through a communication bus (solid
lines), such as a motherboard. The storage unit 1115 can be a data
storage unit (or data repository) for storing data. The computer
system 1101 can be operatively coupled to a computer network
("network") 1130 with the aid of the communication interface 1120.
The network 1130 can be the Internet, an internet and/or extranet,
or an intranet and/or extranet that is in communication with the
Internet. The network 1130 in some cases is a telecommunication
and/or data network. The network 1130 can include one or more
computer servers, which can enable distributed computing, such as
cloud computing. The network 1130, in some cases with the aid of
the computer system 1101, can implement a peer-to-peer network,
which may enable devices coupled to the computer system 1101 to
behave as a client or a server.
[0146] The CPU 1105 can execute a sequence of machine-readable
instructions, which can be embodied in a program or software. The
instructions may be stored in a memory location, such as the memory
1110. The instructions can be directed to the CPU 1105, which can
subsequently program or otherwise configure the CPU 1105 to
implement methods of the present disclosure. Examples of operations
performed by the CPU 1105 can include fetch, decode, execute, and
writeback.
[0147] The CPU 1105 can be part of a circuit, such as an integrated
circuit. One or more other components of the system 1101 can be
included in the circuit. In some cases, the circuit is an
application specific integrated circuit (ASIC).
[0148] The storage unit 1115 can store files, such as drivers,
libraries and saved programs. The storage unit 1115 can store user
data, e.g., user preferences and user programs. The computer system
1101 in some cases can include one or more additional data storage
units that are external to the computer system 1101, such as
located on a remote server that is in communication with the
computer system 1101 through an intranet or the Internet.
[0149] The computer system 1101 can communicate with one or more
remote computer systems through the network 1130. For instance, the
computer system 1101 can communicate with a remote computer system
of a user. Examples of remote computer systems include personal
computers (e.g., portable PC), slate or tablet PC's (e.g.,
Apple.RTM. iPad, Samsung.RTM. Galaxy Tab), telephones, Smart phones
(e.g., Apple.RTM. iPhone, Android-enabled device, Blackberry.RTM.),
or personal digital assistants. The user can access the computer
system 1101 via the network 1130.
[0150] Methods as described herein can be implemented by way of
machine (e.g., computer processor) executable code stored on an
electronic storage location of the computer system 1101, such as,
for example, on the memory 1110 or electronic storage unit 1115.
The machine executable or machine readable code can be provided in
the form of software. During use, the code can be executed by the
processor 1105. In some cases, the code can be retrieved from the
storage unit 1115 and stored on the memory 1110 for ready access by
the processor 1105. In some situations, the electronic storage unit
1115 can be precluded, and machine-executable instructions are
stored on memory 1110.
[0151] The code can be pre-compiled and configured for use with a
machine having a processer adapted to execute the code, or can be
compiled during runtime. The code can be supplied in a programming
language that can be selected to enable the code to execute in a
pre-compiled or as-compiled fashion.
[0152] Aspects of the systems and methods provided herein, such as
the computer system 1101, can be embodied in programming. Various
aspects of the technology may be thought of as "products" or
"articles of manufacture" typically in the form of machine (or
processor) executable code and/or associated data that is carried
on or embodied in a type of machine readable medium.
Machine-executable code can be stored on an electronic storage
unit, such as memory (e.g., read-only memory, random-access memory,
flash memory) or a hard disk. "Storage" type media can include any
or all of the tangible memory of the computers, processors or the
like, or associated modules thereof, such as various semiconductor
memories, tape drives, disk drives and the like, which may provide
non-transitory storage at any time for the software programming.
All or portions of the software may at times be communicated
through the Internet or various other telecommunication networks.
Such communications, for example, may enable loading of the
software from one computer or processor into another, for example,
from a management server or host computer into the computer
platform of an application server. Thus, another type of media that
may bear the software elements includes optical, electrical and
electromagnetic waves, such as used across physical interfaces
between local devices, through wired and optical landline networks
and over various air-links. The physical elements that carry such
waves, such as wired or wireless links, optical links or the like,
also may be considered as media bearing the software. As used
herein, unless restricted to non-transitory, tangible "storage"
media, terms such as computer or machine "readable medium" refer to
any medium that participates in providing instructions to a
processor for execution.
[0153] Hence, a machine readable medium, such as
computer-executable code, may take many forms, including but not
limited to, a tangible storage medium, a carrier wave medium or
physical transmission medium. Non-volatile storage media include,
for example, optical or magnetic disks, such as any of the storage
devices in any computer(s) or the like, such as may be used to
implement the databases, etc. shown in the drawings. Volatile
storage media include dynamic memory, such as main memory of such a
computer platform. Tangible transmission media include coaxial
cables; copper wire and fiber optics, including the wires that
comprise a bus within a computer system. Carrier-wave transmission
media may take the form of electric or electromagnetic signals, or
acoustic or light waves such as those generated during radio
frequency (RF) and infrared (IR) data communications. Common forms
of computer-readable media therefore include for example: a floppy
disk, a flexible disk, hard disk, magnetic tape, any other magnetic
medium, a CD-ROM, DVD or DVD-ROM, any other optical medium, punch
cards paper tape, any other physical storage medium with patterns
of holes, a RAM, a ROM, a PROM and EPROM, a FLASH-EPROM, any other
memory chip or cartridge, a carrier wave transporting data or
instructions, cables or links transporting such a carrier wave, or
any other medium from which a computer may read programming code
and/or data. Many of these forms of computer readable media may be
involved in carrying one or more sequences of one or more
instructions to a processor for execution.
[0154] The computer system 1101 can include or be in communication
with an electronic display 1135 that comprises a user interface
(UI) 1140 for providing, for example, information regarding the
manufacturing of the thermoelectric generator. Examples of UI's
include, without limitation, a graphical user interface (GUI) and
web-based user interface.
[0155] Methods and systems of the present disclosure can be
implemented by way of one or more algorithms. An algorithm can be
implemented by way of software upon execution by the central
processing unit 1105.
[0156] While preferred embodiments of the present invention have
been shown and described herein, it will be obvious to those
skilled in the art that such embodiments are provided by way of
example only. It is not intended that the invention be limited by
the specific examples provided within the specification. While the
invention has been described with reference to the aforementioned
specification, the descriptions and illustrations of the
embodiments herein are not meant to be construed in a limiting
sense. Numerous variations, changes, and substitutions will now
occur to those skilled in the art without departing from the
invention. Furthermore, it shall be understood that all aspects of
the invention are not limited to the specific depictions,
configurations or relative proportions set forth herein which
depend upon a variety of conditions and variables. It should be
understood that various alternatives to the embodiments of the
invention described herein may be employed in practicing the
invention. It is therefore contemplated that the invention shall
also cover any such alternatives, modifications, variations or
equivalents. It is intended that the following claims define the
scope of the invention and that methods and structures within the
scope of these claims and their equivalents be covered thereby.
* * * * *