U.S. patent application number 16/215009 was filed with the patent office on 2020-06-11 for device structural assemblies.
This patent application is currently assigned to Microsoft Technology Licensing, LLC. The applicant listed for this patent is Microsoft Technology Licensing, LLC. Invention is credited to Guang Lei WANG, Zhicong YAO, Tianyu Zhao.
Application Number | 20200187393 16/215009 |
Document ID | / |
Family ID | 68988314 |
Filed Date | 2020-06-11 |
United States Patent
Application |
20200187393 |
Kind Code |
A1 |
YAO; Zhicong ; et
al. |
June 11, 2020 |
DEVICE STRUCTURAL ASSEMBLIES
Abstract
The description relates to devices, such as computing devices
that can include structural assemblies. One example can include a
structural component defining a periphery of the structural
assembly and an internal region of the structural assembly. The
example can also include a sacrificial component positioned in the
internal region and secured to the structural component by a
breakaway connector that defines a first void and an opposing
second void that is at least partially offset from the first
void.
Inventors: |
YAO; Zhicong; (Seattle,
WA) ; WANG; Guang Lei; (Wuhu, CN) ; Zhao;
Tianyu; (Kirkland, WA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Microsoft Technology Licensing, LLC |
Redmond |
WA |
US |
|
|
Assignee: |
Microsoft Technology Licensing,
LLC
Redmond
WA
|
Family ID: |
68988314 |
Appl. No.: |
16/215009 |
Filed: |
December 10, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 1/181 20130101;
G06F 1/1658 20130101; G06F 1/1656 20130101; G06F 1/183 20130101;
H05K 2201/10371 20130101; G06F 1/1628 20130101; H05K 9/0032
20130101 |
International
Class: |
H05K 9/00 20060101
H05K009/00; H05K 1/18 20060101 H05K001/18; G06F 1/16 20060101
G06F001/16 |
Claims
1. A device, comprising: an electronic component positioned on a
base; and, a structural component surrounding the electronic
component to provide at least a portion of a shield can around the
electronic component; the structural component having a first
thickness defined between opposing first and second surfaces and an
inwardly facing tab, and, the inwardly facing tab defines: an upper
surface extending downwardly from the first surface, an offset
lower surface extending upwardly from the second surface past at
least a portion of the upper surface, and a surface connecting the
upper surface and the offset lower surface and having a second
thickness that is less than the first thickness.
2. The device of claim 1, wherein the electronic component
comprises a processor and the base comprises a circuit board.
3. The device of claim 2, wherein the structural component
comprises a sidewall of the shield can.
4. The device of claim 1, wherein the structural component further
comprises a strengthening structure that separates the tab from a
remainder of the structural component.
5. The device of claim 4, wherein the strengthening structure
comprises a work-hardened region.
6. The device of claim 4, wherein the strengthening structure
extends above a plane that is coplanar with a majority of the
structural component.
7. The device of claim 1, wherein the upper surface is curved.
8. The device of claim 1, wherein the upper surface is
straight.
9. The device of claim 8, wherein the upper surface is orthogonal
to the first surface.
10. A structural assembly, comprising: a structural component
defining a periphery of the structural assembly and an internal
region of the structural assembly; and, a sacrificial component
positioned in the internal region and secured to the structural
component by a breakaway connector that defines a first void and an
opposing second void that is at least partially offset from the
first void, and a thickness of material between the first void and
the second void is less than a thickness of the sacrificial
component.
11. The structural assembly of claim 10, wherein combined depths of
the first and second voids is greater than the thickness of the
sacrificial component.
12.-20. (canceled)
21. The device of claim 1, wherein the second thickness is measured
at a narrowest point between the upper surface and the lower
surface.
22. The device of claim 21, wherein the second thickness is less
than 1/4 of the first thickness.
23. The structural assembly of claim 10, wherein the thickness of
the material between the first void and the second void is measured
at a narrowest point between the first void and the second
void.
24. The structural assembly of claim 23, wherein the thickness of
the material between the first void and the second void is less
than 1/4 of the thickness of the sacrificial component.
25. A device, comprising: an electronic component positioned over a
base; and, a structural component positioned over the base and
around the electronic component; the structural component having a
first thickness defined between opposing first and second surfaces
and an inwardly facing tab, and, the inwardly facing tab defines:
an upper surface extending downwardly from the first surface, an
offset lower surface extending upwardly from the second surface
past at least a portion of the upper surface, and a surface
connecting the upper surface and the offset lower surface and
having a second thickness that is less than the first
thickness.
26. The device of claim 25, wherein the second thickness is
measured at a narrowest point between the upper surface and the
lower surface.
27. The device of claim 26, wherein the second thickness is less
than 1/4 of the first thickness.
28. The device of claim 25, wherein the surface is generally
parallel to the first surface.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0001] The accompanying drawings illustrate implementations of the
concepts conveyed in the present document. Features of the
illustrated implementations can be more readily understood by
reference to the following description taken in conjunction with
the accompanying drawings. Like reference numbers in the various
drawings are used wherever feasible to indicate like elements.
Further, the left-most numeral of each reference number conveys the
FIG. and associated discussion where the reference number is first
introduced.
[0002] FIGS. 1 and 3B-3D are partial cutaway perspective views of
example devices that can include the present structural assembly
implementations in accordance with the present concepts.
[0003] FIGS. 2A, 2B, 3A, and 8 are perspective views of example
structural assembly implementations in accordance with the present
concepts.
[0004] FIGS. 4A-4C, 6A-6E, and 7A-7F are sectional views of example
structural assembly implementations in accordance with the present
concepts.
[0005] FIGS. 5A-5D are sectional views of conventional devices.
[0006] FIGS. 9 and 10 are flowcharts of example structural assembly
methods in accordance with the present concepts.
DESCRIPTION
[0007] The present concepts relate to devices, such as computing
devices. Often such devices employ structural components in the
device, such as to define the periphery of a Faraday cage that
shields electronic components of the device. The structural
components can be formed from stock substrate, such as sheets or
rolls. Once formed, the structural components may be readily
deformed or damaged during assembly. For instance, the structural
components may deform from a rectangular shape to a parallelogram
shape during handling. This deformation could cause the device to
fall outside of design tolerances and fail inspection. To avoid
this scenario, sacrificial components have been maintained with the
structural components during assembly and then removed as one of
the final stages. Traditionally, a breakaway tab that includes a
pair of opposing V-shaped voids is formed at the border between the
sacrificial component and the structural component. However,
separation of the sacrificial component from the structural
component at the opposing V-shaped voids often inadvertently
deforms the structural component and can again cause the device to
fail inspection. The present concepts can employ a breakaway tab
that employs offset and at least partially overlapping voids. The
present breakaway tabs can maintain the sacrificial component and
the structural component as a structural assembly during the
assembly process, yet can be more readily separated without
damaging the structural component. Alternatively or additionally,
the present concepts can provide a strengthening structure on the
structural component proximate to the breakaway tab. This
strengthening structure can also reduce deformation of the
structural component during separation of the breakaway tab. These
and other aspects are described in more detail below.
[0008] FIG. 1 shows a partial cutaway view of an example device
100. In this example, device 100 is manifest as a tablet type
device, but the present concepts are equally applicable to other
types of devices. In this case, the device 100 includes a housing
102 and a display 104 positioned on the housing. The device 100 can
also include electronic components 106, such as a processor 108.
These electronic components 106 can be positioned on a base 110,
such as a circuit board 112. Device 100 can also include a
structural assembly 114. In this case, the structural assembly 114
can form a portion of a shield can or Faraday cage 116 around the
processor 108. (Note that not all of the shield can is shown so
that underlying components are visible).
[0009] FIGS. 2A and 2B collectively show additional details about
example structural assembly 114. The structural assembly 114 can
include a structural element or component 202 and a sacrificial
element or component 204. FIG. 2A shows both the structural
component 202 and the sacrificial component 204. FIG. 2B shows the
structural component 202 after removal of the sacrificial component
204. The structural component 202 and the sacrificial component 204
can be joined at one or more breakaway connectors 206. Sacrificial
component 204 can help maintain integrity of the structural
component 202 during handling and/or assembly. For instance, the
sacrificial component 204 can help maintain the overall dimensions
of the structural component 202, help maintain the planar
configuration of the structural component 202, and/or help avoid
bending of the structural component 202.
[0010] The structural component 202 can include opposing first and
second surfaces 208 and 210. (In these views the first surface 208
is facing toward the reader and second surface 210 is facing away
from the reader.) The structural component 202 can define a
periphery of the structural assembly 114 as indicated generally at
212 and an inwardly facing surface 214. In this implementation, the
sacrificial component 204 can be located in an interior of the
structural component 202 as indicated at 216.
[0011] While a specific example of a structural assembly 114 is
shown in FIGS. 1-2B, the concepts described below can be applied to
any type of structural assembly utilized in a device. For instance,
the concepts can be applied to any type of structural assembly that
is partially prepared and then assembled onto the device (or a
greater component assembly of the device) before final processing
of the structural assembly.
[0012] FIGS. 3A-3D collectively show additional details of the
breakaway connector 206(3) of the structural assembly 114. FIG. 3A
is a perspective view and FIGS. 3B-3D are cutaway perspective views
along the plane indicated in FIG. 3A. The breakaway connector
206(3) can include a tab 302 on the structural component 202 and
another tab 304 on the sacrificial component 204. The tabs 302 and
304 can be separated by a void 306 formed through the first surface
208 and another void 308 formed through the second surface 210.
Void 306 can be offset from void 308 so that the combined depths of
the voids is greater than a thickness of the structural assembly
114, yet the voids 306 and 308 do not intersect (e.g., substrate
material 310 remains between them). This aspect will be discussed
in more detail relative to FIGS. 4A-4C. In this example, the
sacrificial component 204 includes a handle 312. As evidenced in
FIG. 3C, the handle 312 can be lifted to impart forces upon the
breakaway connector 206(3) that breaks the remaining substrate
material 310 between the voids 306 and 308. As evidenced in FIG.
3D, the sacrificial component 204 can then be removed so that only
the structural component 202 remains.
[0013] FIGS. 4A-4C and 5A-5D collectively show a comparison between
breakaway connector 206A that is consistent with the present
concepts and a conventional breakaway connector 602.
[0014] As shown in FIG. 4A, structural component 202 and
sacrificial component 204 have a thickness (e.g., dimension
D.sub.1) between the first surface 208 and the second surface 210.
In this example, voids 306 and 308 are both V-shaped. Voids of
other implementations can have other shapes. One such example is
described below relative to FIGS. 7A-7F. In this case, void 306 has
a depth (e.g., dimension D.sub.2) and void 308 has a depth (e.g.,
dimension D.sub.3). Void 306 can be partially defined by an upper
surface 502 and void 308 can be partially defined by a lower
surface 504 (see FIG. 4B). The remaining substrate material 310 can
lie between the upper surface 502 and the lower surface 504.
[0015] The voids 306 and 308 are offset from one another in the
x-reference direction (e.g., the deepest regions of the voids are
separated by a distance (e.g., dimension D.sub.4). This offset
results in substrate material 310 remaining between sides of the
voids (as evidenced by dimension D.sub.5). This offset allows the
voids to overlap (e.g., the sum of the depths of the voids
(D.sub.2+D.sub.3) is greater than the thickness of the substrate
(D.sub.1)). The offset further allows the thickness (dimension
D.sub.5) of the remaining substrate to be much thinner than the
conventional configuration of FIGS. 5A-5D while still maintaining
the integrity of the structural component 202. For instance,
dimension D.sub.5 of the remaining substrate 310 can be about 1/4
or less of the overall substrate thickness D.sub.1.
[0016] FIG. 5A shows conventional breakaway connector 602.
Conventional breakaway connector 602 has a thickness (dimension
D.sub.6) and aligned voids 604 and 606 between a structural
component 608 and a sacrificial component 610. A thickness
(dimension D.sub.7) of the substrate 612 remaining between the
bottoms of the aligned voids 604 and 606 has to be maintained at a
minimum of 1/3 of the thickness of the substrate to avoid breakage
during assembly. Thus, the depths of each void 604 and 606 is about
1/3 of the depth of the overall substrate and the substrate
material 612 remaining between the bottoms of the voids is about
1/3 of the thickness of the overall substrate.
[0017] As evidenced in FIGS. 5B and 5C, the thickness of the
remaining substrate 612 causes it to be difficult to break when the
sacrificial component is lifted. This force transfer is conveyed on
FIGS. 5B and 5C by the length of the force arrows (FA). Force arrow
one (FA.sub.1) represents the upward force applied to the
sacrificial component 610 in FIG. 5B and force arrow two (FA.sub.2)
represents the resulting force transferred to the structural
component 608.
[0018] The position of the remaining substrate material 612 also
causes the remaining substrate material to transfer stress forces
to the structural component 608 when the sacrificial component 610
is lifted. FIG. 5C shows that the upward force has been increased
(as represented by the length of FA.sub.3 relative to the length of
FA.sub.1 of FIG. 5B). This increased force has not broken the
remaining substrate material 612 and is being transferred to the
structural component 608 as represented by FA.sub.4.
[0019] FIG. 5D shows the sacrificial component 610 has been lifted
upward until the remaining substrate material 612 has finally
broken. The forces required to break the remaining substrate
material 612 can damage the structural component 608. Note also,
that the break (indicated generally at 614) in the remaining
substrate material 612 tends to be generally vertical and extends
between the bottom of the two voids through the substrate material.
To make this type of break imparts large stress forces on the
structural component 608 and increases the likelihood of
damage.
[0020] In contrast, FIG. 4B shows that with the configuration of
breakaway connector 206A, upward movement of sacrificial component
204 from forces represented by FA.sub.5, concentrates forces on
remaining substrate material 310.
[0021] FIG. 4C shows that remaining substrate material 310 readily
breaks without transferring large forces to structural component
202 (as represented by relatively short force arrow FA.sub.6). Note
also that the break tends to create a surface 506 that tends to be
horizontal (e.g., extends between the sides of the voids).
[0022] FIGS. 6A-6E collectively relate to another example breakaway
connector 206B between structural component 202 and sacrificial
component 204. This implementation introduces the addition of a
strengthening structure 702 in the structural component 202
proximate to the breakaway connector 206B. The strengthening
structure can function to limit force transfer from the breakaway
connector 206B to a remainder of the structural component 202. This
aspect is described in more detail below.
[0023] FIGS. 6A-6C show structural component 202 being stamped onto
a mandrel 704 to form the strengthening structure 702. Thus, in
this example, the strengthening structure 702 is generated by
work-hardening (in this case stamping) a region of the structural
component 202. In this case, the region extends above a plane
defined by the first surface 208 (e.g., extends above a plane that
is co-planar with a majority of the structural component). In other
implementations, work hardening can be achieved while maintaining
the region within or below the plane. In other cases, the
strengthening structure 702 can be formed by adding reinforcing
material to the region and/or otherwise changing the properties of
the region, such as by tempering, among others.
[0024] FIGS. 6D and 6E show that upward forces (FA.sub.5) applied
to the sacrificial component 204 are transferred to the remaining
substrate material 310. Any forces (FA.sub.6) that are transferred
by the remaining substrate material 310 to the structural component
202 tend to be localized by the strengthening structure 702. Thus,
deformation of the structural component 202 can be further reduced
by the strengthening structure 702. The strengthening structure
concepts can be applied to any type of breakaway structure,
including traditional designs, to reduce damage during
separation.
[0025] FIGS. 7A-7F and 8 collectively relate to another example
breakaway connector 206C between structural component 202 and
sacrificial component 204 of a structural assembly 114C.
[0026] FIGS. 7A-7C show mandrel 704 positioned relative to a
boundary of the structural assembly 114C to form a strengthening
structure 702 at a specified location proximate to the breakaway
connector 206C.
[0027] FIG. 7D shows examples of various other acts that can be
performed on the structural assembly 114C. For instance, the offset
and partially overlapping voids 306 and 308 can be formed, such as
by cutting and/or ablating material. In this case, the voids 306
and 308 have profiles with generally straight (e.g., vertical)
sidewalls and curved bottoms. Further, material can be removed from
the interior of the structural assembly 114C as indicated at 802.
See for instance, the skeletonized nature of the sacrificial
component 204 of FIG. 2A.
[0028] FIGS. 7E and 7F show how forces applied to the sacrificial
component 204 can easily break the remaining substrate material 310
to separate the sacrificial component 204 from the structural
component 202. This can be accomplished without imparting damaging
stress forces through the structural component 202.
[0029] FIG. 8 is a view of structural assembly 114C that is similar
to the view of FIG. 3A. In this case, the strengthening structure
702 is positioned on the structural assembly 114C proximate to the
breakaway connector 206C. The strengthening structure 702 can
extend along the breakaway connector to reduce force transfer
throughout the structural component 202.
[0030] FIG. 9 illustrates a flowchart of a method 1000 relating to
some of the current breakaway connector concepts. The method can
define boundaries of a structural assembly on a substrate at block
1002. In some cases, the substrate can be manifest as sheets of
substrate material, such as sheets of metal. In other cases, the
substrate can be manifest as a roll of substrate. Substrate
material of the roll can be passed through processing stations to
generate the structural assemblies that remain as part of the roll
until later stages of the assembly process. For instance, as part
of the process, at block 1004, the method can remove material from
the substrate to define a structural component and a sacrificial
component.
[0031] At block 1006, the method can form a breakaway connector
between the structural component and the sacrificial component. The
breakaway connector can be formed by removing material through a
first side of the structural assembly to form a void that extends
part way through a thickness of the substrate, and removing
additional material through a second side of the structural
assembly to form another void that is offset from the void and that
extends part way through the thickness of the substrate. Thus, the
void and the other void at least partially overlap but do not
intersect (at least continuously).
[0032] FIG. 10 illustrates a flowchart of a method 1100 relating to
some of the current breakaway connector concepts. The method can
incorporate a structural assembly on a device at block 1102. The
structural assembly can employ overlapping and partially offset
opposing voids that form a breakaway connector between a structural
component of the structural assembly and a sacrificial component of
the structural assembly.
[0033] At block 1104, the method can apply a force to the
sacrificial component until the breakaway structure fails. At block
1106, the sacrificial component can be removed from the device.
[0034] Various breakaway connector concepts are described above.
The present concepts can be implemented in other architectures that
are consistent with the described functionality. In some cases, the
present concepts lend themselves to progressive manufacturing
processes. For instance, the concepts can be applied to any part or
assembly that can be stamped with a progressive tool to define a
structural component and a sacrificial component. For instance,
this stamping could occur while the assembly is on a reel of
substrate material. Various processing can be preformed on the
assembly while on the reel and/or after removal from the reel. Such
processing can include plating, painting, and/or gluing, among
others. In such cases, the sacrificial component can provide
rigidity and/or a place to hold so that all portions of the
structural component can be processed. Employing the present
concepts can allow the sacrificial component to ultimately be
removed without damage to the remaining structural component.
[0035] The present breakaway connector concepts can be utilized
with various types of devices, such as computing devices that can
include but are not limited to notebook computers, tablet
computers, smart phones, wearable smart devices, headphones,
antennas, gaming devices, entertainment consoles, rigid devices,
flexible devices, home and enterprise appliances, automobiles,
machinery, and/or other developing or yet to be developed types of
devices. As used herein, a computing device can be any type of
device that has some amount of processing and/or storage
capacity.
[0036] Various examples are described above. Additional examples
are described below. One example includes a device comprising an
electronic component positioned on a base, a structural component
surrounding the electronic component to provide at least a portion
of a `shield can` around the electronic component, the structural
component defining opposing first and second surfaces and an
inwardly facing tab, and the inwardly facing tab defines: an upper
surface extending downwardly from the first surface, an offset
lower surface extending upwardly from the second surface past at
least a portion of the upper surface, and a surface connecting the
upper surface and the offset lower surface.
[0037] Another example can include any of the above and/or below
examples where the electronic component comprises a processor and
the base comprises a circuit board.
[0038] Another example can include any of the above and/or below
examples where the structural component comprises a sidewall of the
shield can.
[0039] Another example can include any of the above and/or below
examples where the structural component further comprises a
strengthening structure that separates the tab from a remainder of
the structural component.
[0040] Another example can include any of the above and/or below
examples where the strengthening structure extends above a plane
that is coplanar with a majority of the structural component.
[0041] Another example can include any of the above and/or below
examples where the upper surface is curved.
[0042] Another example can include any of the above and/or below
examples where the upper surface is straight.
[0043] Another example can include any of the above and/or below
examples where the upper surface is orthogonal to the first
surface.
[0044] Another example includes a structural assembly comprising a
structural component defining a periphery of the structural
assembly and an internal region of the structural assembly and a
sacrificial component positioned in the internal region and secured
to the structural component by a breakaway connector that defines a
first void and an opposing second void that is at least partially
offset from the first void.
[0045] Another example can include any of the above and/or below
examples where combined depths of the first and second voids is
greater than a thickness of the sacrificial component.
[0046] Another example includes a method comprising defining
boundaries of a structural assembly on a substrate, removing
material from the substrate to define a structural component and a
sacrificial component, and forming a breakaway connector between
the structural component and the sacrificial component by removing
material through a first side of the structural assembly to form a
void that extends part way through a thickness of the substrate,
and removing additional material through a second side of the
structural assembly to form another void that is offset from the
void and that extends part way through the thickness of the
substrate, such that the void and the another void at least
partially overlap but do not intersect.
[0047] Another example can include any of the above and/or below
examples where the substrate comprises a roll of substrate.
[0048] Another example can include any of the above and/or below
examples where the substrate comprises a sheet of metal.
[0049] Another example can include any of the above and/or below
examples where forming a breakaway connector comprises forming
multiple breakaway connectors.
[0050] Another example can include any of the above and/or below
examples where the sacrificial component and the structural
component are connected only at the breakaway connectors.
[0051] Another example can include any of the above and/or below
examples where a shape of the void is the same as a shape of the
(an)other void.
[0052] Another example can include any of the above and/or below
examples where a shape of the void is different than a shape of the
(an)other void.
[0053] Another example can include any of the above and/or below
examples where the method further comprises forming a strengthening
structure on the structural component proximate to the breakaway
connector.
[0054] Another example can include any of the above and/or below
examples where the forming a strengthening structure comprises
work-hardening a region of the structural component.
CONCLUSION
[0055] Although techniques, methods, devices, systems, etc.,
pertaining to breakaway connectors are described in language
specific to structural features and/or methodological acts, it is
to be understood that the subject matter defined in the appended
claims is not limited to the specific features or acts described.
Rather, the specific features and acts are disclosed as example
forms of implementing the claimed methods, devices, systems,
etc.
* * * * *