U.S. patent application number 16/212863 was filed with the patent office on 2020-06-11 for ultrasound probe and method of making the same.
The applicant listed for this patent is General Electric Company. Invention is credited to Warren Lee, Brian Magann Rush, Naveenan Thiagarajan.
Application Number | 20200178941 16/212863 |
Document ID | / |
Family ID | 69143650 |
Filed Date | 2020-06-11 |
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United States Patent
Application |
20200178941 |
Kind Code |
A1 |
Thiagarajan; Naveenan ; et
al. |
June 11, 2020 |
ULTRASOUND PROBE AND METHOD OF MAKING THE SAME
Abstract
An ultrasound probe is presented. The ultrasound probe includes
an ultrasound probe handle. Moreover, the ultrasound probe also
includes a phase change chamber monolithic with respect to a
portion of the ultrasound probe handle, where the phase change
chamber includes hermetic chamber walls extending around and
defining an enclosed chamber and a material disposed within the
hermetic chamber walls, where the material is configured to change
phase in response to heat from a component of the ultrasound
probe.
Inventors: |
Thiagarajan; Naveenan;
(Niskayuna, NY) ; Lee; Warren; (Niskayuna, NY)
; Rush; Brian Magann; (Niskayuna, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
General Electric Company |
Schenectady |
NY |
US |
|
|
Family ID: |
69143650 |
Appl. No.: |
16/212863 |
Filed: |
December 7, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01N 29/226 20130101;
A61B 8/4483 20130101; A61B 8/546 20130101; A61B 8/4444 20130101;
A61B 8/4455 20130101; A61B 8/56 20130101; G01N 29/326 20130101 |
International
Class: |
A61B 8/00 20060101
A61B008/00; G01N 29/32 20060101 G01N029/32; G01N 29/22 20060101
G01N029/22 |
Claims
1. An ultrasound probe, comprising: an ultrasound probe handle; a
phase change chamber monolithic with respect to a portion of the
ultrasound probe handle, wherein the phase change chamber
comprises: hermetic chamber walls extending around and defining an
enclosed chamber; and a material disposed within the hermetic
chamber walls, wherein the material is configured to change phase
in response to heat from a component of the ultrasound probe.
2. The ultrasound probe of claim 1, wherein the ultrasound probe
handle comprises at least two segments coupled together.
3. The ultrasound probe of claim 2, wherein the phase change
chamber comprises at least two phase change chambers.
4. The ultrasound probe of claim 1, wherein the phase change
chamber comprises a vapor chamber extending along at least two
orthogonal dimensions, wherein the material comprises a working
fluid disposed in the vapor chamber, and wherein the working fluid
comprises a liquid phase and a gas phase.
5. The ultrasound probe of claim 4, wherein the vapor chamber
further comprises a porous wick structure disposed inside and
lining one or more interior surfaces of the hermetic chamber walls,
and wherein the porous wick structure comprises pores configured to
hold the liquid phase of the working fluid inside the vapor
chamber.
6. The ultrasound probe of claim 1, wherein the phase change
chamber comprises a thermal energy storage chamber, wherein the
material comprises a phase change material disposed within the
thermal energy storage chamber, and wherein the phase change
material comprises a solid phase, a liquid phase, or a combination
thereof.
7. The ultrasound probe of claim 6, wherein the phase change
chamber comprises two or more thermal energy storage chambers,
wherein the two or more thermal energy storage chambers are
distributed within an inner volume of the at least one monolithic
phase change chamber; wherein each of the two or more thermal
energy storage chambers comprises a corresponding phase change
material disposed within a corresponding thermal energy storage
chamber, and wherein each phase change material comprises a solid
phase, a liquid phase, or a combination thereof.
8. The ultrasound probe of claim 1, wherein the phase change
chamber comprises: a vapor chamber extending along at least two
orthogonal dimensions, wherein the material comprises a working
fluid disposed in the vapor chamber, and wherein the working fluid
comprises a liquid phase and a gas phase; and at least one thermal
energy storage chamber, wherein the material comprises a phase
change material disposed within the at least one thermal energy
storage chamber, and wherein the phase change material comprises a
solid phase, a liquid phase, or a combination thereof.
9. The ultrasound probe of claim 1, further comprising one or more
fins in thermal communication with the phase change chamber and
configured to transfer heat between one or more components of the
ultrasound probe and the phase change chamber.
10. The ultrasound probe of claim 1, wherein one or more portions
of the phase change chamber extend inward from at least one of the
hermetic chamber walls and at least partially towards an inner
section of the ultrasound probe handle.
11. The ultrasound probe of claim 1, wherein the phase change
chamber extends along at least a portion of a handle wall of the
ultrasound probe.
12. The ultrasound probe of claim 1, wherein the phase change
chamber forms at least a portion of a handle wall of the ultrasound
probe.
13. The ultrasound probe of claim 1, wherein the component
comprises a transducer assembly, a processor, a battery, a sensor,
an application specific integrated circuit, or combinations
thereof.
14. The ultrasound probe of claim 13, further comprising a thermal
mounting platform, wherein the thermal mounting platform is
directly coupled to the transducer assembly and configured to
transfer heat generated by the transducer assembly to the phase
change chamber.
15. The ultrasound probe of claim 1, wherein the phase change
chamber comprises an additively manufactured structure.
16. The ultrasound probe of claim 1, further comprising an outer
shell disposed around the phase change chamber.
17. An imaging system, the system comprising: an acquisition
subsystem configured to acquire image data corresponding to a
subject, wherein the acquisition subsystem comprises an ultrasound
probe comprising: an ultrasound probe handle; a phase change
chamber monolithic with respect to a portion of the ultrasound
probe handle, wherein the phase change chamber comprises: hermetic
chamber walls extending around and defining an enclosed chamber; a
material disposed within the hermetic chamber walls, wherein the
material is configured to change phase in response to heat from a
component of the ultrasound probe; and a processing subsystem in
operative association with the acquisition subsystem and configured
to process the image data to generate one or more images
corresponding to the subject.
18. A method, comprising: additively fabricating first and second
segments of an ultrasound probe handle, wherein at least one of the
first and second segments comprises a phase change chamber
monolithic with respect to the respective segment and comprising
hermetic chamber walls extending around and defining an enclosed
chamber, and a material disposed within the hermetic chamber walls,
and wherein the material is configured to change phase in response
to heat from one or more components of the ultrasound probe; and
operatively coupling the first and second segments.
19. The method of claim 18, further comprising prior to joining the
first and second segments of the ultrasound probe handle,
positioning one or more components of the ultrasound probe in
thermal communication with at least one phase change chamber,
wherein the one or more components of the ultrasound probe comprise
one or more of a transducer assembly, a processor, a battery, a
sensor, an application specific integrated circuit, or combinations
thereof.
20. The method of claim 18, further comprising providing an outer
shell such that the outer shell encompasses the phase change
chamber.
Description
BACKGROUND
[0001] Embodiments of the present specification generally relate to
ultrasound imaging and more specifically to an ultrasound probe
having a thermal management assembly and a method of making the
same.
[0002] Ultrasound imaging provides a relatively inexpensive method
of imaging. During the process of ultrasound scanning, a clinician
attempts to capture a view of a certain anatomy which confirms or
negates a particular medical condition. Once the clinician is
satisfied with the quality of a view or a scan plane, the image is
frozen to proceed to a measurement phase.
[0003] Recent developments in ultrasound imaging have led to
current state of the art ultrasound devices that boast of
relatively high image resolutions and ease of use. These
developments have in turn led to increased use of ultrasound for
clinical research as well as day to day point of care practice.
Consequently, the use of ultrasound imaging has been steadily
increasing over the years. Moreover, the improved ultrasound
technology has led to higher frequency ultrasound probes that are
well-suited for imaging relatively shallow anatomical structures,
as is generally the case for musculoskeletal imaging.
[0004] Notwithstanding the various advantages of ultrasound, an
important factor that restricts the use of ultrasound has been the
fact that performing ultrasound scanning requires extended
operation of an ultrasound probe at high power to render higher
image resolution, while maintaining the surface and key component
temperatures under their respective limits. Many of the currently
available advanced probes are limited thermally owing to the
limited surface area available for convection and numerous
interfaces in the conductive heat transfer path from the heat
dissipating internal components of the probe to the surface of the
probe.
[0005] Some conventional approaches to ultrasound probe design to
improve conductive heat transfer internal to the probe entail use
of heat pipes along a heat spreader bonded to a plastic housing.
This design of the probe disadvantageously leads to multiple parts
and interfaces. Certain other currently available probes include
conventional heat pipes that are incorporated with the probes.
However, these probes can offer only incremental gains in thermal
performance at a cost of significantly increased complexity and
part count.
BRIEF DESCRIPTION
[0006] In accordance with aspects of the present specification, an
ultrasound probe is presented. The ultrasound probe includes an
ultrasound probe handle. Moreover, the ultrasound probe also
includes a phase change chamber monolithic with respect to a
portion of the ultrasound probe handle, where the phase change
chamber includes hermetic chamber walls extending around and
defining an enclosed chamber and a material disposed within the
hermetic chamber walls, where the material is configured to change
phase in response to heat from a component of the ultrasound
probe.
[0007] In accordance with another aspect of the present
specification, an imaging system is presented. The imaging system
includes an acquisition subsystem configured to acquire image data
corresponding to a subject, where the acquisition subsystem
includes an ultrasound probe including an ultrasound probe handle
and a phase change chamber monolithic with respect to a portion of
the ultrasound probe handle, where the phase change chamber
includes hermetic chamber walls extending around and defining an
enclosed chamber and a material disposed within the hermetic
chamber walls, where the material is configured to change phase in
response to heat from a component of the ultrasound probe. In
addition, the imaging system includes a processing subsystem in
operative association with the acquisition subsystem and configured
to process the image data to generate one or more images
corresponding to the subject.
[0008] In accordance with yet another aspect of the present
specification, a method is presented. The method includes
additively fabricating first and second segments of an ultrasound
probe handle, where at least one of the first and second segments
includes a phase change chamber monolithic with respect to the
respective segment and including hermetic chamber walls extending
around and defining an enclosed chamber, and a material disposed
within the hermetic chamber walls, and where the material is
configured to change phase in response to heat from one or more
components of the ultrasound probe. Furthermore, the method
includes operatively coupling the first and second segments.
DRAWINGS
[0009] These and other features, aspects, and advantages of the
present disclosure will become better understood when the following
detailed description is read with reference to the accompanying
drawings in which like characters represent like parts throughout
the drawings, wherein:
[0010] FIG. 1 is a diagrammatical illustration of a system for
ultrasound imaging, in accordance with aspects of the present
specification;
[0011] FIGS. 2-5 are diagrammatical illustrations of different
embodiments of an ultrasound probe having various configurations of
a thermal management assembly in the form of a phase change
chamber, where the ultrasound probe is configured for use in the
system of FIG. 1, in accordance with aspects of the present
specification;
[0012] FIGS. 6-9 are cross-sectional views of different embodiments
of an ultrasound probe having various configurations of a thermal
management assembly in the form of a phase change chamber, where
the ultrasound probe is configured for use in the system of FIG. 1,
in accordance with aspects of the present specification;
[0013] FIG. 10 is a diagrammatical illustration of an ultrasound
imaging system for use in the system of FIG. 1; and
[0014] FIG. 11 is a flow chart depicting a method for manufacturing
an ultrasound probe having an exemplary phase change chamber, in
accordance with aspects of the present specification.
DETAILED DESCRIPTION
[0015] Ultrasound imaging is being increasingly used to image
anatomical regions of interest in a patient. As will be
appreciated, an important factor that restricts the use of
ultrasound at high power to render higher image resolution is the
requirement to maintain the surface and key component temperatures
under their respective limits. Systems and methods of the present
application present an exemplary design of a three-dimensional (3D)
phase change chamber that is configured to provide a thermal
management structure for an ultrasound probe. The phase change
chamber may be in the form of a 3D vapor chamber (VC), a thermal
energy storage chamber, or a combination thereof. Also, the phase
change chamber provides enhanced heat transport from internal heat
generating components of the ultrasound probe to an outer surface
of the phase change chamber for cooling by the ambient environment
and/or to phase change material volumes for thermal energy
absorption and storage. Additionally, the phase change chamber may
also be configured to provide a mechanical support structure for
the ultrasound probe.
[0016] It may be noted that although the various systems and
methods are described in the context of a medical imaging system,
these systems and methods may also be used in the imaging of
non-living objects such as but not limited to pipes, tubes,
luggage, packages, and the like.
[0017] FIG. 1 is a block diagram of an exemplary system 100 for use
in diagnostic imaging, in accordance with aspects of the present
specification. More particularly, the system 100 is configured to
aid a clinician in imaging a patient 102 to deliver consistent
clinical outcomes.
[0018] During imaging, the clinician typically positions an image
acquisition device on or about a region of interest in a patient
102 being imaged. In one example, the patient 102 may be positioned
in a supine position on a patient support 106. Furthermore, an
image acquisition device 104 that is operatively coupled to a
medical imaging system 108 may be used to acquire image data
corresponding to an object or a region of interest in the patient
102. In one embodiment, the image acquisition device 104 may be a
probe configured to acquire image data corresponding to one or more
anatomical regions of interest in the patient 102.
[0019] In a presently contemplated configuration, the system 100
may be configured to acquire image data representative of the
patient 102 via the image acquisition device 104. Also, in one
embodiment, the probe 104 may include an invasive probe or a
non-invasive or external probe, such as an external ultrasound
probe, that is configured to aid in the acquisition of image data.
In one example, the image acquisition device 104 may include a
two-dimensional (2D) or a three-dimensional (3D) ultrasound probe.
Additionally, the probe 104 may be a wired probe or a wireless
probe. Also, in certain other embodiments, image data may be
acquired via one or more sensors (not shown) that may be disposed
on the patient 102. By way of example, the sensors may include
physiological sensors (not shown) such as positional sensors. In
some embodiments, the positional sensors may include
electromagnetic field sensors or inertial sensors. These sensors
may be operatively, coupled to a data acquisition device, such as
an imaging system, via leads (not shown), for example.
[0020] It may also be noted that although the embodiments
illustrated herein are described in the context of an ultrasound
probe, other types of probes such as endoscopes, laparoscopes,
surgical probes, probes adapted for interventional procedures, or
combinations thereof are also contemplated in conjunction with the
present specification. An external probe may also be employed in
situations where a user such as a sonographer guiding an imaging
procedure is located at a remote location and therefore unable to
see the probe or the patient 102.
[0021] Furthermore, in one example, the acquired image data may
include a two-dimensional (2D)) B-mode ultrasound image. Also, in
certain embodiments, the image data may include pre-scan-converted
or radio frequency (RF) ultrasound data. Additionally, the 2D
images may include static 2D images or cine loops that include a
series of 2D images or image frames acquired over time. It may be
noted that the acquired image data may include 2D ultrasound
images, 3D ultrasound images, four-dimensional (4D) ultrasound
images, or combinations thereof. Other modes of ultrasound imaging
such as Doppler modes of ultrasound imaging may also be used to
acquired image data. Some non-limiting examples of the Doppler
modes of ultrasound imaging include color, pulsed wave, continuous
wave, power doppler, and the like.
[0022] Additionally, in one example, the medical imaging system 108
is an ultrasound imaging system. The ultrasound imaging system 108
is in operative association with the image acquisition device 104
and is configured to receive ultrasound image data corresponding to
the patient 102 and process the ultrasound image data to generate
one or more images corresponding to the patient 102.
[0023] It should be noted that although the exemplary embodiments
illustrated hereinafter are described in the context of a medical
imaging system, other imaging systems and applications such as
industrial imaging systems and non-destructive evaluation and
inspection systems, such as pipeline inspection systems, liquid
reactor inspection systems, are also contemplated. Additionally,
the exemplary embodiments illustrated and described hereinafter may
find application in multi-modality imaging systems that employ
ultrasound imaging in conjunction with other imaging modalities,
position-tracking systems or other sensor systems. In one example,
the multi-modality imaging system may include a positron emission
tomography (PET) imaging system-ultrasound imaging system.
Furthermore, in other non-limiting examples of the multi-modality
imaging systems, the ultrasound imaging system may be used in
conjunction with other imaging systems, such as, but not limited
to, a computed tomography (CT) imaging system, a contrast enhanced
ultrasound imaging system, an X-ray imaging system, an optical
imaging system, a magnetic resonance (MR) imaging system, an
optical imaging system, virtual/augmented reality imaging systems,
and other imaging systems, in accordance with aspects of the
present specification.
[0024] As noted hereinabove, in a presently contemplated
configuration, the medical imaging system 108 is an ultrasound
imaging system. Further, the medical imaging system 108 may include
an acquisition subsystem 110 and a processing subsystem 112, in one
embodiment. Moreover, the acquisition subsystem 110 of the medical
imaging system 108 is configured to receive image data
representative of the patient 102 from the image acquisition device
104, in one embodiment. For example, the acquired image data may
include a plurality of 2D ultrasound images or slices. In other
embodiments, 3D images or 4D images may be acquired. It may be
noted that the terms images and image frames may be used
interchangeably.
[0025] In addition, the acquisition subsystem 110 may also be
configured to acquire images stored in the optical data storage
article. It may be noted that the optical data storage article may
be an optical storage medium, such as a compact disc (CD), a
digital versatile disc (DVD), multi-layer structures, such as DVD-5
or DVD-9, multi-sided structures, such as DVD-10 or DVD-18, a high
definition digital versatile disc (HD-DVD), a Blu-ray disc, a near
field optical storage disc, a holographic storage medium, or
another like volumetric optical storage medium, such as, for
example, two-photon or multi-photon absorption storage format.
Further, the 2D images so acquired by the acquisition subsystem 110
may be stored locally on the medical imaging system 108 in a data
repository 116, for example.
[0026] Moreover, the image data acquired from the patient 102 may
then be processed by the processing subsystem 112. The processing
subsystem 112, for example, may include one or more
application-specific processors, graphical processing units,
digital signal processors, microcomputers, microcontrollers,
Application Specific Integrated Circuits (ASICs), Field
Programmable Gate Arrays (FPGAs), Programmable Logic Arrays (PLAs),
and/or other suitable processing devices. Alternatively, the
processing subsystem 112 may be configured to store the acquired
image data and/or the user input in the data repository 116 for
later use. In one embodiment, the data repository 116, for example,
may include a hard disk drive, a floppy disk drive, a compact
disk-read/write (CD-R/W) drive, a Digital Versatile Disc (DVD)
drive, a flash drive, and/or a solid-state storage device.
[0027] The image data acquired and/or processed by the medical
imaging system 108 may be employed to generate an ultrasound image
that is used to aid a clinician in making measurements and/or
providing a diagnosis based on the generated image. In certain
embodiments, the processing subsystem 112 may be further coupled to
a storage system, such as the data repository 116, where the data
repository 116 is configured to store the generated image(s). In
certain embodiments, the data repository 116 may include a local
database.
[0028] Moreover, as illustrated in FIG. 1, the medical imaging
system 108 may include a display 118 and a user interface 120. In
certain embodiments, such as in a touch screen, the display 118 and
the user interface 120 may overlap. Also, in some embodiments, the
display 118 and the user interface 120 may include a common area.
In accordance with aspects of the present specification, the
display 118 of the medical imaging system 108 may be configured to
display an image generated by the medical imaging system 108 based
on the acquired image data.
[0029] In addition, the user interface 120 of the medical imaging
system 108 may include a human interface device (not shown)
configured to aid the clinician in manipulating image data
displayed on the display 118. The human interface device may
include a mouse-type device, a trackball, a joystick, a stylus, or
a touch screen configured to facilitate the clinician to identify
the one or more regions of interest in the images. However, as will
be appreciated, other human interface devices, such as, but not
limited to, a touch screen, may also be employed. Furthermore, in
accordance with aspects of the present specification, the user
interface 120 may be configured to aid the clinician in navigating
through the images acquired by the medical imaging system 108.
Additionally, the user interface 120 may also be configured to aid
in manipulating and/or organizing the displayed images and/or
generated indicators displayed on the display 118.
[0030] As noted hereinabove, an important factor that restricts the
use of ultrasound has been the fact that performing ultrasound
scanning requires extended operation of an ultrasound probe at high
power to render higher image resolution, while maintaining the
surface and key component temperatures under their respective
limits. FIG. 2 presents an exemplary design of a structure
configured for use in an ultrasound probe such as the ultrasound
probe 104 of FIG. 1 that circumvents the shortcomings of the
presently available ultrasound probes. More particularly, an
exemplary design of a 3D thermal management assembly or structure
in the form of a phase change chamber that is configured to provide
enhanced thermal management for an ultrasound probe is presented.
The exemplary phase change chamber may also be configured to
simultaneously provide mechanical support to the various components
of the ultrasound probe 104.
[0031] Referring now to FIG. 2, a diagrammatical illustration 200
of one embodiment of an ultrasound probe for use in the system 100
of FIG. 1 is depicted. FIG. 2 is described in conjunction with the
components of FIG. 1.
[0032] The ultrasound probe 200 includes an ultrasound probe handle
202. In one embodiment, the ultrasound probe handle 202 may include
two or more segments that are operatively coupled to one another.
In the example depicted in FIG. 2, the ultrasound probe handle 202
is depicted as having a first segment 204 and a second segment 206.
Also, in FIG. 2, each segment 204, 206 is representative of one
half of the ultrasound probe handle 202. It may be noted that in
accordance with further aspects of the present specification, use
of a single segment or other number of segments for the ultrasound
probe handle 202 is also envisaged.
[0033] Further, the ultrasound probe 200 includes a thermal
management assembly in the form of a phase change chamber 208 that
is configured to provide enhanced thermal management for the
ultrasound probe 200. In particular, the phase change chamber 208
is monolithic with respect to a portion of the ultrasound probe
handle 202. The phase change chamber 208 is a monolithic structure
configured to thermally interface with one or more heat generating
components in the ultrasound probe 200 to dissipate the heat
generated by the components of the ultrasound probe 200. In one
embodiment, the phase change chamber 208 is thermally coupled to
one or more components of the ultrasound probe 200 to facilitate
dissipation of heat from the heat generating components of the
ultrasound probe 200. Moreover, in certain embodiments, the phase
change chamber 208 may include two or more phase change chambers.
Further, in certain embodiments, the phase change chamber 208
extends along at least a portion of a wall of the ultrasound probe
handle 202. In other embodiments, the phase change chamber 208
forms at least a portion of a wall of the ultrasound probe handle
202.
[0034] In one embodiment, the phase change chamber is a
three-dimensional (3D) vapor chamber 208. Additionally, the 3D
vapor chamber 208 extends along at least two orthogonal directions.
Furthermore, the embodiment illustrated in FIG. 2 depicts the phase
change chamber 208 as including two 3D vapor chambers. Each 3D
vapor chamber 208 corresponds to a segment 204, 206 of the
ultrasound probe handle 202. As will be appreciated, the 3D vapor
chamber 208 is a heat transfer device that is vacuum sealed.
Further, the 3D vapor chamber 208 typically includes an evaporator
end and a condenser end. In addition, as depicted in the embodiment
of FIG. 2, each of the 3D vapor chambers 208 is designed in the
shape of a corresponding segment 204, 206 of the ultrasound probe
handle 202.
[0035] Moreover, the 3D vapor chamber 208 has hermetic chamber
walls that extend around and define an enclosed chamber.
Additionally, a material is disposed within the hermetic chamber
walls. This material is configured to change phase in response to
heat received from a component of the ultrasound probe 200. In the
example of FIG. 2, the material is a working fluid that is
configured to transition between a liquid phase and a vapor phase.
It may be noted that in certain embodiments, the hermetic chamber
walls may include openings or ports. In one example, these openings
or ports may be used to fill the working fluid within the chamber
walls.
[0036] Reference numeral 210 is used to represent an expanded view
of a cross-section of one embodiment of the enclosed chamber of the
3D vapor chamber 208. In certain embodiments, the 3D vapor chamber
208 includes an external wall 212 and an internal wall 214.
Moreover, each of the external wall 212 and the internal wall 214
includes an interior surface and an exterior surface. Also, a
cavity is formed between the external wall 212 and the internal
wall 214.
[0037] Additionally, the 3D vapor chamber 208 includes a porous
wick structure 216 configured to facilitate transport of the
working fluid in the 3D vapor chamber 208. In particular, the
porous wick structure 216 is disposed such that the porous wick
structure 216 lines one or more interior surfaces of the external
wall 212 and/or the internal wall 214 of the 3D vapor chamber 208.
In some embodiments, the porous wick structure 216 may be formed on
interior surfaces of the external and internal walls 212, 214. The
porous wick structure 216 includes pores that are configured to
hold the working fluid in the liquid phase. More particularly, the
pores in the porous wick structure 216 are configured to hold the
working fluid in the liquid phase in the 3D vapor chamber 204 until
heat received from a heat generating component of the ultrasound
probe 200 vaporizes the working fluid into a vapor phase in the
enclosed 3D vapor chamber 208. Also, the porous wick structure 216
aids in returning the working fluid from the condenser end to the
evaporator end of the 3D vapor chamber 208.
[0038] Also, the 3D vapor chamber 208 includes a vapor transport
column or vapor space 218. The vapor transport column 218 is
configured to aid in the transport of the working fluid in a vapor
phase within the 3D vapor chamber 208.
[0039] Moreover, in some embodiments, the 3D vapor chamber 208 may
include one or more support columns (not shown in FIG. 2) that
extend between the external and internal walls 212, 214. These
columns are employed to prevent the external and internal walls
212, 214 from moving toward each other or to reduce the distance by
which the external and internal walls 212, 214 move toward each
other.
[0040] Furthermore, the working fluid such as water is used in the
3D vapor chamber 208 to aid in the transfer of heat from the heat
generating components of the ultrasound probe 200. It may be noted
that the working fluid is in a liquid phase and housed in the pores
of the porous wick structure 216, Once the 3D vapor chamber 208 is
placed in contact with a heat source such as a heat generating
component in the ultrasound probe 200, the heat from the heat
source is absorbed by the working fluid at the evaporator end of
the 3D vapor chamber 208. The absorbed heat results in the working
fluid being transformed from a liquid phase to a vapor phase. The
working fluid in the vapor phase travels from the evaporator end
toward the condenser end via the vapor transport column 218 of the
3D vapor chamber 208. Subsequently, the working fluid in the vapor
phase is cooled at the condenser end by releasing the latent heat.
In some embodiments, the latent heat is transferred to an outer
surface of the 3D vapor chamber 208 and the heat is then dissipated
into the surrounding environment. The condensed working fluid is
then returned to the evaporator end of the 3D vapor chamber 208 via
the porous wick structure 216.
[0041] As previously noted, one or more components of the
ultrasound probe 200 generate heat during operation of the
ultrasound probe 200, Some examples of the heat generating
components in the ultrasound probe 200 include a transducer
assembly, ASICs, processors, batteries, sensors (not shown in FIG.
2), and the like. Reference numeral 220 is used to depict the
transducer assembly in the ultrasound probe 200. It is desirable to
efficiently dissipate the heat generated by the internal components
of the ultrasound probe 200 such as the transducer assembly 220 to
ensure safe and continuous operation of the ultrasound probe 200 to
image the patient 102.
[0042] In accordance with aspects of the present specification, the
3D vapor chanter 208 is configured to provide enhanced thermal
management of the ultrasound probe 200. In particular, the 3D vapor
chamber 208 is configured to facilitate enhanced heat transfer from
the heat generating components of the ultrasound probe 200 by
thermally contacting one or more surfaces of the heat generating
components of the ultrasound probe 200. Accordingly, the 3D vapor
chamber 208 is in thermal communication with the heat generating
components of the ultrasound probe 200. In the example of FIG. 2,
the transducer assembly 220 is thermally coupled to the 3D vapor
chamber 208 of the ultrasound probe 200, More specifically, in one
example, the internal wall 214 is configured to be in thermal
communication with the heat generating components such as the
transducer assembly 220 of the ultrasound probe 200. Reference
numeral 222 is representative of a portion of the internal wall 214
of the 3D vapor chamber 208 that is in direct thermal communication
with the transducer assembly 220. In some embodiments, the 3D vapor
chamber 208 may be directly thermally coupled to the heat
generating components via use of a thermal interface material. Some
non-limiting examples of the thermal interface material include
thermal pads, grease, adhesive, and the like. By way of a
non-limiting example, an adhesive material may be employed to
effect a thin adhesive joint between the 3D vapor chamber 208 and
the heat generating components of the ultrasound probe 200. Some
non-limiting examples of the adhesive material include thermally
non-conductive epoxy, thermally conductive epoxy, filled epoxy, and
the like.
[0043] Moreover, the 3D vapor chamber 208 is configured to provide
enhanced thermal management in the ultrasound probe 200 by
absorbing the heat/thermal energy generated by the heat generating
components of the ultrasound probe 200. The heat absorbed by the 3D
vapor chamber 208 is in turn transferred to the working fluid in
the 3D vapor chamber 208. As the working fluid absorbs the heat,
the working fluid in the liquid phase is transformed to a gas/vapor
phase. The working fluid in the vapor/gas phase then travels down
in the vapor transport column 218 toward the condenser end of the
3D vapor chamber 208 where the working fluid in the vapor phase is
cooled, releasing its latent heat. In particular, the heat is
transferred from the working fluid to an outer surface of the 3D
vapor chamber 208 and is dissipated to the surrounding environment.
Subsequent to the cooling, the working fluid is transformed from
the vapor phase to the liquid phase. The porous wick structure 216
and capillary action aid in recirculating the working fluid in the
liquid phase to the evaporator end, where the working fluid once
again absorbs thermal energy from the external and/or internal
walls 212, 214 of the 3D vapor chamber 208.
[0044] Further, to facilitate rapid and efficient
removal/dissipation of heat or thermal energy from internal
components of the ultrasound probe 200, the 3D vapor chamber 208 is
formed using a material with a high thermal conductivity. By way of
example, the 3D vapor chamber 208 may be formed using materials
such as, but not limited to, titanium, aluminum, copper, and the
like.
[0045] It may be noted that for ease of illustration and
description, the 3D vapor chamber 208 is depicted as including two
3D vapor chamber portions. These portions may be sealed to form the
3D vapor chamber 208. Accordingly, in one embodiment, the 3D vapor
chamber 208 is a continuous structure.
[0046] The ultrasound probe 200 including the ultrasound probe
handle 202 and the 3D vapor chamber 208 may be formed using
additive manufacturing, such as by being formed using
three-dimensional (3D) printing, rapid prototyping (RP), direct
digital manufacturing (DDM), selective laser melting (SLM),
electron beam melting (EBM), direct metal laser melting (DMLM), and
the like. Some other exemplary methods of additive fabricating
usable with the present specification may include processes, such
as, but not limited to, direct writing, electron beam deposition,
laser deposition, stereo-lithography, and the like. Alternatively,
the ultrasound probe 200 may be formed in any another manner.
[0047] Additionally, the porous wick structure 216 may also be
formed using additive manufacturing and may be formed from sintered
powder. Alternatively, the porous wick structure 216 may be formed
using other techniques and/or from other materials. It may be noted
that in certain embodiments, the porous wick structure 216 may line
the entire interior surface of the hermetic external and internal
chamber walls 212, 214 of the 3D vapor chamber 208 and is
configured to hold the working fluid in the liquid phase.
[0048] Additively manufacturing the 3D vapor chamber 204 as
described hereinabove results in a 3D vapor chamber 208 that is a
single, monolithic structure and configured to interface with one
or more heat sources in the ultrasound probe 200 to facilitate the
enhanced dissipation of heat generated by the internal components
of the ultrasound probe 200. In particular, the 3D vapor chamber
208 is configured to facilitate transfer of thermal energy from the
heat generating components of the ultrasound probe 200 such as the
transducer assembly 220 and internal electronics of the ultrasound
probe 200 to the outer surface of the 3D vapor chamber 208 for
cooling by the ambient environment.
[0049] In accordance with aspects of the present specification, in
some embodiments, at least a portion of the 3D vapor chamber 208 is
configured to conform to a shape of the ultrasound probe handle 202
of the ultrasound probe 200. Accordingly, in this example, the 3D
vapor chamber 208 conforms to the shape of the ultrasound probe
handle 202. In other embodiments, an outer coating such as an outer
electrically insulating cover may be disposed on an outer/exterior
surface of the 3D vapor chamber 208. In this example, the 3D vapor
chamber 208 having the outer coating forms the ultrasound probe
handle 202 of the ultrasound probe 200.
[0050] In yet another embodiment, the 3D vapor chamber 208 is
configured to conform to the shape of one or more components of the
ultrasound probe 200. In this example, the 3D vapor chamber 208 may
conform to one or more aspects of the shape of the component. By
way of example, if the component has a shape of a cube, then the 3D
vapor chamber 208 may be configured to conform to one or more faces
of the cube. Moreover, in this example, the 3D vapor chamber 208 is
an internal structure that conforms to the shape of the internal
components of the ultrasound probe 200. Furthermore, in one
embodiment, an outer shell that encompasses the 3D vapor chamber
208 may be disposed around the 3D vapor chamber 208. Accordingly,
in this example, the outer shell functions as the ultrasound probe
handle 200 of the ultrasound probe 200. Moreover, the 3D vapor
chamber 208 forms an ergonomic exterior shape of the ultrasound
probe handle 202 of the ultrasound probe 200.
[0051] Accordingly, the design of the ultrasound probe 200 having
the 3D vapor chamber 208 provides enhanced thermal management in
the ultrasound probe 200 via the 3D vapor chamber 208. As will be
appreciated, the currently available techniques rely on the thermal
conductivity of the material such as copper and titanium to
transport the heat. However, the exemplary 3D vapor chamber 208
uses evaporation and condensation of the working fluid to transport
the heat in the 3D vapor chamber 208. Consequently, use of the 3D
vapor chamber 208 provides up to a 20.times. improvement over that
provided via use of copper for heat transportation.
[0052] In accordance with further aspects of the present
specification, in addition to facilitating enhanced thermal
management in the ultrasound probe 200, the 3D vapor chamber 208
may also be configured to provide mechanical support to the
internal components of the ultrasound probe 200. This aspect will
be described in greater detail with reference to FIGS. 6-9.
[0053] Turning now to FIG. 3, a diagrammatical illustration 300 of
another embodiment of an ultrasound probe for use in the system 100
of FIG. 1 is depicted. FIG. 3 is described in conjunction with the
components of FIGS. 1-2.
[0054] The ultrasound probe 300 includes an ultrasound probe handle
302. As previously described with reference to FIG. 2, in certain
embodiments, the ultrasound probe handle 302 may include two or
more segments that are operatively coupled to one another. FIG. 3
depicts the ultrasound probe handle 302 as having a first segment
304 and a second segment 306. Each segment 304, 306 is
representative of one half of the ultrasound probe handle 302. In
accordance with further aspects of the present specification, use
of a single segment or other number of segments for the ultrasound
probe handle 302 is envisioned.
[0055] In addition, the ultrasound probe 300 includes a thermal
management assembly in the form of a phase change chamber 308 that
is configured to provide enhanced thermal management for the
ultrasound probe 300. As previously noted, that the phase change
chamber 308 is monolithic with respect to a portion of the
ultrasound probe handle 302 and is configured to thermally
interface with one or more heat generating components in the
ultrasound probe 300 to dissipate the heat generated by the
components of the ultrasound probe 300. Further, in certain
embodiments, the phase change chamber 308 may include two or more
phase change chambers.
[0056] In the example illustrated in FIG. 3, the phase change
chamber is a thermal energy storage chamber 308. The embodiment
illustrated in FIG. 3 depicts the phase change chamber 308 as
including two thermal energy storage chambers. Each thermal energy
storage chamber 308 corresponds to each segment 304, 306 of the
ultrasound probe handle 302. Additionally, as depicted in the
embodiment of FIG. 3, each of the thermal energy storage chambers
308 is designed in the shape of a corresponding segment 304, 306 of
the ultrasound probe handle 302.
[0057] Furthermore, the thermal energy storage chamber 308 has
hermetic chamber walls that extend around and define an enclosed
chamber and a material is disposed within the hermetic chamber
walls. This material is configured to change phase in response to
heat received from a component of the ultrasound probe 300. In the
example of FIG. 3, the material is a phase change material that is
configured to transition between a solid phase and a liquid phase.
Further, the phase change material is configured to transition from
a first state to a second state to absorb and/or release heat. In
some embodiments, the first and second states may be the same,
while in some other embodiments, the first and second states may be
different, By way of example, the phase change material may
transition from a solid state to a liquid state upon receiving a
determined level of heat from the component of the ultrasound probe
300. Other non-limiting examples of the transition of the phase
change material include a solid-to-solid phase transition, a
liquid-to-solid phase transition, or a liquid-to-liquid phase
transition. In yet another embodiment, the phase change material
may undergo chemical reactions to absorb and/or release heat.
Additionally, one or more phase change materials may have the same
or different phase transition temperatures. It may, be noted that
in certain embodiments, the hermetic chamber walls may include
openings or ports. In one example, these openings or ports may be
used to fill the phase change material within the chamber
walls.
[0058] Reference numeral 310 is used to represent an expanded view
of a cross-section of one embodiment of the enclosed chamber of the
thermal energy storage chamber 308. In one embodiment, the thermal
energy storage chamber 308 includes an external wall 312 and an
internal wall 314. Each of the external wall 312 and the internal
wall 314 includes an interior surface and an exterior surface.
Also, the external wall 312 and the internal wall 314 form a cavity
or space 316.
[0059] In the example of FIG. 3, the material that is disposed
within the thermal energy storage chamber 308 is a phase change
material 318. More particularly, the phase change material 318 is
disposed in a cavity 316 between the external and internal walls
312, 314 of the thermal storage energy chamber 308. The phase
change material 318 has a solid phase, a liquid phase, or a
combination thereof. Also, the phase change material 318 may
include materials such as, but not limited to, organic materials,
inorganic materials, metallic alloys, eutectic alloys, or
combinations thereof. Also, in certain embodiments, the phase
change material 318 may also include thermally conductive fillers
such as, but not limited to, particles, spheres, and ribbons of
materials such as graphite, copper, aluminum, and the like to
improve heat transfer. In yet another embodiment, the phase change
material 318 may be an encapsulated phase change material where the
phase change material is contained within a polymeric shell.
Further, the phase change material 318 may be configured to
facilitate the bidirectional transfer of heat between the heat
generating components of the ultrasound probe 300 and the phase
change material 318 in the thermal energy storage chamber 308.
[0060] Moreover, in certain embodiments, the thermal energy storage
chamber 308 may include one or more support columns (not shown in
FIG. 3) that extend between the external and internal walls 312,
314. These columns are employed to prevent the external and
internal walls 312, 314 from moving toward each other or to reduce
the distance by which the external and internal walls 312, 314 move
toward each other.
[0061] As previously noted, one or more components of the
ultrasound probe 300 generate heat during operation of the
ultrasound probe 300. Some examples of the heat generating
components in the ultrasound probe 300 include a transducer
assembly, ASICs, processors, batteries, sensors (not shown in FIG.
3), and the like. Reference numeral 320 is used to depict the
transducer assembly in the ultrasound probe 300. It is desirable to
efficiently dissipate the heat generated by the components of the
ultrasound probe 300 to ensure safe and continuous operation of the
ultrasound probe 300 to image the patient 102.
[0062] In accordance with aspects of the present specification, the
thermal energy, storage chamber 308 is configured to facilitate
enhanced thermal management of the ultrasound probe 300. In
particular, the thermal energy storage chamber 308 is configured to
provide enhanced heat transfer from the heat generating components
of the ultrasound probe 300 by directly thermally contacting one or
more surfaces of the heat generating components of the ultrasound
probe 300, By way of example, in FIG. 3, the transducer assembly
320 is thermally coupled to the thermal energy storage chamber 308
of the ultrasound probe 300. More specifically, the internal wall
314 is configured to be in thermal communication with the heat
generating components such as the transducer assembly 320 of the
ultrasound probe 300. Reference numeral 322 is used to represent a
portion of the internal wall 314 of the thermal energy storage
chamber 308 that is in direct thermal communication with the
transducer assembly 320. In some embodiments, the thermal energy
storage chamber 308 may be directly thermally coupled to the heat
generating components via use of a thermal interface material such
as, but not limited to, thermal pads, grease, adhesive, and the
like. By way of a non-limiting example, an adhesive material such
as, but not limited to, thermally non-conductive epoxy, thermally
conductive epoxy, filled epoxy, and the like, may be employed to
effect a thin adhesive joint between the thermal energy storage
chamber 308 and the heat generating components of the ultrasound
probe 300.
[0063] Moreover, the thermal energy storage chamber 308 is
configured to absorb the heat/thermal energy generated by the heat
generating components of the ultrasound probe 300. The heat
absorbed by the thermal energy storage chamber 308 is in turn
transferred to the phase change material 318 for storage in the
thermal energy storage chamber 308. As the phase change material
318 absorbs the heat, the phase change material in the solid phase
is transformed to a liquid phase. By way of example, the phase
change material 318 may absorb the heat from the heat generating
component when the heat generating component exceeds the melting
point of phase change material 318, thereby lowering the
temperature rise of heat generating component. Accordingly, the
absorbed heat is stored in the thermal energy storage chamber 308.
In certain embodiments, the heat may be transferred to an outer
surface of the thermal energy storage chamber 308 and is dissipated
to the surrounding environment. It may, be noted that in certain
embodiments the thermal energy storage chamber 308 is designed such
that the phase change material 318 does not impede the heat
transfer from the heat generating component through the chamber
walls to the surrounding ambient.
[0064] In certain embodiments, it may be desirable to dissipate the
stored heat to the ambient. Accordingly, in this example, the
thermal energy stored in the phase change material 318 in the
thermal energy storage chamber 308 may be dissipated to the
surrounding environment. Consequent to this dissipation of the
stored heat, the phase change material 318 is cooled, thereby
transitioning the phase change material 318 from the liquid phase
to the solid phase.
[0065] In yet another embodiment, it may be desirable to transfer
heat to a component of the ultrasound probe 300, In this example,
the thermal energy stored in the phase change material 318 in the
thermal energy storage chamber 308 may be conveyed to the component
to be heated. Consequent to this transfer of heat, the phase change
material 318 is cooled, thereby transitioning the phase change
material 318 from the liquid phase to the solid phase. Moreover, in
other embodiments, the ultrasound probe may include multiple
thermal energy storage chambers. In this example, the heat may be
transferred from one thermal energy storage chamber to another
thermal energy storage chamber.
[0066] It may be noted that to facilitate rapid and efficient
removal/dissipation of heat or thermal energy from internal
components of the ultrasound probe 300, the thermal energy storage
chamber 308 is formed using a material with a high thermal
conductivity. By way of example, the thermal energy storage chamber
308 may be formed using materials such as, but not limited to,
titanium, aluminum, copper, and the like. In some embodiments, the
internal walls such as the internal wall 314 may also be
retrofitted with heat conducting elements such as heat pipes,
copper, graphite sheets, rods, and the like.
[0067] Further, for case of illustration and description, the
thermal energy storage chamber 308 is depicted as including two
phase change chamber portions. These portions may be sealed to form
the thermal energy storage chamber 308. Accordingly, in one
embodiment, the thermal energy storage chamber 308 is a continuous
structure.
[0068] It may also be noted that in some embodiments, the cavity
316 may also include fins (not shown in FIG. 3) extending from the
inner surfaces of the external wall 312 and/or the internal wall
314 to aid in heat transport to the phase change material 318. In
this example, the fins may be in the form of studs or may extend in
an annular fashion around the radius of the ultrasound probe 300.
It may be noted that the annular fins may have openings or ports to
facilitate filling and/or transport of the phase change material
318. Moreover, it may also be noted that the fins in the cavity 316
of the thermal energy storage chamber 308 are internal fins.
[0069] Additionally, in certain embodiments, multiple such fins may
be dispersed along the length of the thermal energy storage chamber
308. The fins or studs serve to increase the surface area of the
thermal energy storage chamber 308, which in turn improves heat
transfer. In certain embodiments, the fins and/or studs may be
formed using the same material as the external wall 312 and the
internal wall 314 of the thermal energy storage chamber 308.
Moreover, as previously noted, the phase change material 318 may
also include thermally conductive fillers such as particles,
spheres, and/or ribbons of graphite, copper, aluminum, and the like
to improve heat transfer.
[0070] The ultrasound probe 300 including the ultrasound probe
handle 302 and the thermal energy storage chamber 308 may be formed
using additive manufacturing, such as by being formed using
three-dimensional (3D) printing, rapid prototyping (RP), direct
digital manufacturing (DDM), selective laser melting (SLM),
electron beam melting (EBM), direct metal laser melting (DMLM), and
the like. Some other exemplary methods of additive fabricating
usable with the present specification may include processes, such
as, but not limited to, direct writing, electron beam deposition,
laser deposition, stereo-lithography, and the like. Alternatively,
the ultrasound probe 300 may be formed in any another manner such
as, but not limited to, casting, welding, machining, and the like.
Additively manufacturing the thermal energy storage chamber 308 as
described hereinabove results in a thermal energy storage chamber
308 that is a single, monolithic structure and configured to
interface with one or more heat sources in the ultrasound probe 300
to facilitate the enhanced dissipation of heat generated by the
internal components of the ultrasound probe 300.
[0071] In accordance with further aspects of the present
specification, the ultrasound probe 300 may include two or more
thermal energy storage chambers 308. These thermal energy storage
chambers 308 may be distributed within an inner volume of the
ultrasound probe 300. Additionally, each of the two or more thermal
energy storage chambers may include a corresponding phase change
material disposed within a corresponding thermal energy storage
chamber. Moreover, each phase change material may have a different
melting point, thereby facilitating maintaining different
components of the ultrasound probe 300 at different temperatures.
In certain other embodiments, the thermal energy storage chambers
308 may be distributed within the volume of phase change chamber
due to space constraints.
[0072] As previously described with respect to FIG. 2, at least a
portion of the thermal energy storage chamber 308 may be configured
to conform to a shape of the ultrasound probe handle 302 of the
ultrasound probe 300. Furthermore, in some other embodiments, an
outer coating such as an outer electrically insulating cover may be
disposed on an outer/exterior surface of the thermal energy storage
chamber 308. Moreover, the thermal energy storage chamber 308 may
form an ergonomic exterior shape of the ultrasound probe handle 302
of the ultrasound probe 300.
[0073] Accordingly, the design of the ultrasound probe 300 having
the thermal energy storage chamber 308 provides enhanced thermal
management in the ultrasound probe 300. As will be appreciated, the
currently available techniques rely on the thermal conductivity of
the material such as copper and titanium to transport the heat.
However, the exemplary 3D vapor chamber 208 uses evaporation and
condensation of the working fluid to transport the heat in the 3D
vapor chamber 208. Consequently, use of the 3D vapor chamber 208
provides up to a 20.times. improvement over that provided via use
of copper for heat transportation.
[0074] Furthermore, in accordance with further aspects of the
present specification, in addition to facilitating enhanced thermal
management in the ultrasound probe 300, the thermal energy storage
chamber 308 may also be configured to provide mechanical support to
the internal components of the ultrasound probe 300. This aspect
will be described in greater detail with reference to FIGS.
6-9.
[0075] FIG. 4 is a diagrammatical illustration 400 of yet another
embodiment of an ultrasound probe for use in the system 100 of FIG.
1 is depicted. FIG. 4 is described in conjunction with the
components of FIGS. 1-3, In accordance with aspects of the present
specification, in the embodiment 400 of FIG. 4, a phase change
chamber of the ultrasound probe 400 is a nested configuration of
the 3D vapor chamber 208 of FIG. 2 and the thermal energy storage
chamber 308 of FIG. 3.
[0076] The ultrasound probe 400 includes an ultrasound probe handle
402. In one embodiment, the ultrasound probe handle 402 may include
two or more segments that are operatively coupled to one another.
In FIG. 4, the ultrasound probe handle 402 is depicted as having a
first segment 404 and a second segment 406, where each segment 404,
406 is representative of one half of the ultrasound probe handle
402.
[0077] Moreover, the ultrasound probe 400 includes a thermal
management assembly in the form of a phase change chamber 408 that
is configured to provide enhanced thermal management for the
ultrasound probe 400. The phase change chamber 408 is monolithic
with respect to a portion of the ultrasound probe handle 402 and is
configured to thermally interface with one or more heat generating
components in the ultrasound probe 400 to dissipate the heat
generated by the components of the ultrasound probe 400. In one
embodiment, the phase change chamber 408 is directly/thermally
coupled to one or more components of the ultrasound probe 400 to
facilitate dissipation of heat from the heat generating components
of the ultrasound probe. Also, in certain embodiments, the phase
change chamber 408 may include two or more phase change
chambers.
[0078] In a presently contemplated configuration, the phase change
chamber 408 has a nested configuration. More particularly, the
phase change chamber 408 includes a 3D vapor chamber 410 such as
the 3D vapor chamber 208 of FIG. 2 and a thermal energy storage
chamber 412 such as the thermal energy storage chamber 308 of FIG.
3. Reference numeral 414 is used to represent an expanded view of a
cross-section of one embodiment of the phase change chamber
408.
[0079] The phase change chamber 408 has hermetic chamber walls that
extend around and define an enclosed chamber. In certain
embodiments, the 3D vapor chamber 410 includes an external wall
416. Further, the phase change chamber 408 includes a common wall
418 that is shared by the 3D vapor chamber 410 and the thermal
energy storage chamber 412. In one example, the external wall 416
and the common wall 418 form a cavity, Additionally, the 3D vapor
chamber 410 includes a working fluid that is disposed within the
cavity. Further, the 3D vapor chamber 410 includes a porous wick
structure 420 configured to facilitate transport of the working
fluid in the 3D vapor chamber 410. In particular, the porous wick
structure 420 is disposed such that the porous wick structure 420
lines one or more interior surfaces of the external wall 416 of the
3D vapor chamber 410 and/or the common wall 418. Also, the porous
wick structure 420 includes pores that are configured to hold the
working fluid in a liquid phase in the 3D vapor chamber 410 until
heat received from a heat generating component of the ultrasound
probe 400 vaporizes the working fluid into a vapor phase in the
enclosed 3D vapor chamber 410. Moreover, the porous wick structure
420 aids in returning the working fluid from the condenser end to
the evaporator end of the 3D vapor chamber 410. In addition, the 3D
vapor chamber 410 includes a vapor transport column or vapor space
422. The vapor transport column 422 is configured to aid in the
transport of the working fluid in a vapor phase within the 3D vapor
chamber 410.
[0080] In accordance with further aspects of the present
specification, the phase change chamber 408 also includes the
thermal energy storage chamber 412. Furthermore, the thermal energy
storage chamber 412 has a hermetic chamber wall such as an internal
wall 424. Also, a cavity 426 is formed between the common wall 418
and the internal wall 424. A phase change material 428 such as wax
is housed in this cavity 426 and the phase change material 428 is
configured to change phase in response to heat received from a
component of the ultrasound probe 400, in particular, the phase
change material 428 is configured to transition between a solid
phase and a liquid phase.
[0081] It may also be noted that in some embodiments, the cavity
426 may also include fins (not shown in FIG. 4) extending from the
common wall 418 and/or the internal wall 424 into the phase change
material 428 to aid in heat transport to the phase change material
428. As noted hereinabove, the fins in the cavity 426 are internal
tins. In this example, the fins may be in the form of studs or may
extend in an annular fashion around the radius of the ultrasound
probe 400. It may be noted that the annular fins may have openings
or ports to facilitate filling and/or transport of the phase change
material 428. Also, the fins may have a structure that is similar
to the structure of the 3D vapor chamber 410 and/or the thermal
energy storage chamber 412. Also, as previously noted, the phase
change material 428 may also include thermally conductive fillers
such as particles, spheres, and/or ribbons of graphite, copper,
aluminum, and the like to improve heat transfer.
[0082] Moreover, in certain embodiments, multiple such fins may be
dispersed along the length of the 3D vapor chamber 410. It may be
noted the fins used in the 3D vapor chamber 410 are external fins.
The fins or studs serve to increase the surface area of the 3D
vapor change chamber 410, which in turn improves heat transfer. In
certain embodiments, the fins and/or studs may be formed using the
same material as the common wall 418, the external wall 416, and/or
the internal wall 424 of the phase change chamber 408.
[0083] Furthermore, the phase change material 428 such as wax is
used in the thermal energy storage chamber 412 to aid in the
absorption of heat from the heat generating components of the
ultrasound probe 400. The phase change material 428 is in a solid
phase and housed in the cavity 426. Once the thermal energy storage
chamber 412 is placed in contact with a heat source such as a heat
generating component in the ultrasound probe 400, the heat from the
heat source is absorbed by the phase change material 428 in the
thermal energy storage chamber 412. It may be noted that in certain
embodiments, the heat source may also be the heat from the 3D vapor
chamber 410. The absorbed heat results in the phase change material
428 being transformed from a solid phase to a liquid phase. As
previously noted, transitions between other phases and/or chemical
reactions may also occur during the transportation of the heat. In
some embodiments, the absorbed heat may be stored in the thermal
energy storage chamber 412. However, in other embodiments, the
latent heat may be transferred to an outer surface of the phase
change chamber 408 and the heat is dissipated into the surrounding
environment.
[0084] In accordance with farther aspects of the present
specification, in some embodiments, the 3D vapor chamber 410 may be
placed in direct contact with the heat dissipating component(s) in
the ultrasound probe 400 (see FIG. 5) since the 3D vapor chamber
410 effectively has a very high thermal conductivity. Accordingly,
the 3D vapor chamber 410 is configured to absorb the heat generated
by the heat dissipating component(s) in the ultrasound probe 400.
Further, in this example, the 3D vapor chamber 410 is configured to
carry the absorbed heat to another part of the ultrasound probe 400
having the nested configuration of the 3D vapor chamber 410 and the
thermal energy storage chamber 412, and the heat is stored in the
thermal energy storage chamber 412.
[0085] As previously noted, one or more components of the
ultrasound probe 400 generate heat during operation of the
ultrasound probe 400. Reference numeral 430 is used to depict a
heat generating component of the ultrasound probe 400 such as a
transducer assembly. It is desirable to efficiently dissipate the
heat generated by the transducer assembly to ensure safe and
continuous operation of the ultrasound probe 400 to image the
patient 102.
[0086] In accordance with aspects of the present specification, the
3D vapor chamber 410 and the thermal energy storage chamber 412 are
configured to facilitate enhanced thermal management of the
ultrasound probe 400. In particular, the 3D vapor chamber 410
and/or the thermal energy storage chamber 412 are configured to
provide enhanced heat transfer from the heat generating components
of the ultrasound probe 400 by directly thermally contacting one or
more surfaces of the heat generating components of the ultrasound
probe 400. In the example of FIG. 4, the transducer assembly 430 is
thermally coupled to the 3D vapor chamber 410 and/or the thermal
energy storage chamber 412 of the ultrasound probe 400. In one
example, the transducer assembly 430 is directly thermally coupled
to a portion 432 of an interior surface of the phase change chamber
408. In some embodiments, the phase change chamber 408 may be
directly thermally coupled to the heat generating components via
use of a thermal interface material such as thermal pads, grease,
adhesive, and the like.
[0087] It may be noted that to facilitate rapid and efficient
removal/dissipation of heat or thermal energy from internal
components of the ultrasound probe 400, the phase change chamber
408 is formed using a material with a high thermal conductivity. By
way of example, the phase change chamber 408 may be formed using
materials such as, but not limited to, titanium, aluminum, copper,
and the like.
[0088] Further, for ease of illustration and description, the phase
change chamber 408 is depicted as including two phase change
chamber portions. These portions may be sealed to form the phase
change chamber 408. Accordingly, in one embodiment, the phase
change chamber 408 is a continuous structure.
[0089] The ultrasound probe 400 including the ultrasound probe
handle 402, the 3D vapor chamber 410 and thermal energy storage
chamber 208 may be formed using additive manufacturing, such as by
being formed using three-dimensional (3D) printing, rapid
prototyping (RP), direct digital manufacturing (DDM), selective
laser melting (SLM), electron beam melting (EBM), direct metal
laser melting (DMLM), and the like. Some other exemplary methods of
additive fabricating usable with the present specification may
include processes, such as, but not limited to, direct writing,
electron beam deposition, laser deposition, stereo-lithography, and
the like. Alternatively, the ultrasound probe 400 may be formed in
any another manner.
[0090] Additively manufacturing the phase change chamber 408 as
described hereinabove results in a phase change chamber 408 that is
a single, monolithic structure and configured to interface with one
or more heat sources in the ultrasound probe 400 to facilitate the
enhanced dissipation of heat generated by the internal components
of the ultrasound probe 400. In particular, the phase change
chamber 408 is configured to facilitate transfer of thermal energy
from the heat generating components of the ultrasound probe 400
such as the transducer assembly 430 and internal electronics of the
ultrasound probe 400 for dissipation, storage, or both. By way of
example, the 3D vapor chamber 410 is used to absorb the heat
generated by the ultrasound components and transfer the absorbed
heat to an outer surface of the phase change chamber 408 for
cooling by the ambient environment. Additionally, the thermal
energy storage chamber 412 is used to absorb the heat generated by
the ultrasound components and stored the absorbed heat in the phase
change material 428.
[0091] Accordingly, the design of the ultrasound probe 400 having
the 3D vapor chamber 410 and the thermal energy storage chamber 412
provides enhanced thermal management in the ultrasound probe 400.
As previously noted, the currently available techniques rely on the
thermal conductivity of the material such as copper and titanium to
transport the heat. Also, typically, phase change materials have a
poor thermal conductivity and hence need thick conducting walls or
fillers within the phase change material to transport heat into the
phase change material. Using the exemplary 3D vapor chamber 410
high heat transport capabilities in conjunction with the thermal
energy storage chamber 412 aids in enhanced heat spreading along
the phase change material 428, thereby facilitating uniform melting
of the phase change material 428. Consequently, this design of the
ultrasound probe 400 having the 3D vapor chamber 410 and the
thermal energy storage chamber 412 results in higher heat
absorption and hence longer duration of temperature control of the
heat generating component.
[0092] Referring now to FIG. 5, a diagrammatical illustration 500
of yet another embodiment of an ultrasound probe for use in the
system 100 of FIG. 1 is depicted. FIG. 5 is described in
conjunction with the components of FIGS. 1-4. In a presently
contemplated configuration of Ha 5, a phase change chamber of the
ultrasound probe 500 is a nested configuration of the 3D vapor
chamber 410 and the thermal energy storage chamber 412 of FIG. 4.
Additionally, the 3D vapor chamber in the nested configuration
includes a projection that is configured to be in thermal contact
with a heat generating component of the ultrasound probe 500.
[0093] The ultrasound probe 500 includes an ultrasound probe handle
502. Also, the ultrasound probe handle 502 may include two or more
segments such as a first segment 504 and a second segment 506 that
are operatively coupled to one another.
[0094] In accordance with aspects of the present specification, the
ultrasound probe 500 includes a thermal management assembly in the
form of a phase change chamber 508 that is configured to provide
enhanced thermal management for the ultrasound probe 500, The phase
change chamber 508 is monolithic with respect to a portion of the
ultrasound probe handle 502 and is configured to thermally
interface with one or more heat generating components in the
ultrasound probe 500 to dissipate the heat generated by the
components of the ultrasound probe 500. As depicted in FIG. 5, the
phase change chamber 508 has a nested configuration such as the
nested configuration 400 of FIG. 4. More particularly, the phase
change chamber 508 includes a 3D vapor chamber 510 such as the 3D
vapor chamber 410 and a thermal energy storage chamber 512 such as
the thermal energy storage chamber 412 of FIG. 4. An expanded view
of a cross-section of one embodiment of the phase change chamber
508 is generally referenced by reference numeral 514.
[0095] Moreover, as previously noted with reference to FIG. 4, the
3D vapor chamber 510 has hermetic chamber walls that extend around
and define an enclosed chamber. The 3D vapor chamber 510 includes
an external wall 516. Also, the phase change chamber 508 includes a
common wall 518 that is shared by the 3D vapor chamber 510 and the
thermal energy storage chamber 512. Additionally, the 3D vapor
chamber 510 includes a working fluid that is disposed within a
cavity between the external wall 516 and the common wall 518. The
working fluid is configured to change phase in response to heat
received from a component of the ultrasound probe 500. Moreover,
the 3D vapor chamber 510 includes a porous wick structure 520
configured to facilitate transport of the working fluid in the 3D
vapor chamber 510. The porous wick structure 520 includes pores
that are configured to hold the working fluid in a liquid phase in
the 3D vapor chamber 510. Also, the porous wick structure 520 aids
in returning the working fluid from the condenser end to the
evaporator end of the 3D vapor chamber 410. Further, the 3D vapor
change chamber 510 includes a vapor transport column or vapor space
configured to aid in the transport of the working fluid in a vapor
phase within the 3D vapor chamber 510.
[0096] In a presently contemplated configuration, one or more
portions of the 3D vapor chamber 510 may extend inward from at
least one of the hermetic chamber walls and at least partially
towards an inner section of the ultrasound probe handle 502. This
extension may be generally referred to as a projection 524. It may
be noted that tier ease of illustration the configuration of the 3D
vapor chamber 510 of FIG. 5 is depicted as including one projection
524. However, the 3D vapor chamber 510 may include more than one
projection 524. In this embodiment, the projection 524 of the 3D
vapor chamber 510 is disposed in direct thermal contact with one or
more components 526 of the ultrasound probe 500 and configured to
facilitate dissipation of heat generated by the components 526 of
the ultrasound probe 500. In certain embodiments, the ultrasound
probe 500 may also include a heat dissipating component 528. The
heat dissipating component 528 is configured to thermally couple
the 3D phase change chamber 510 to one or more heat generating
components of the ultrasound probe 500. Accordingly, in this
example, the heat dissipating component 528 is positioned in direct
thermal contact with one or more heat generating components 526 of
the ultrasound probe 500 and the projection 524 is thermally
coupled to the heat dissipating component 528. Hence, the heat
generated by the components 526 of the ultrasound probe 500 is
transferred to the projection 524 in the 3D vapor chamber 510 via
the heat dissipating component 528.
[0097] Additionally, the phase change chamber 508 also includes the
thermal energy storage chamber 512. The thermal energy storage
chamber 512 has a hermetic chamber wall such as an internal wall
530. Also, a phase change material 534 such as wax is housed in a
cavity 532 that is formed between the common wall 518 and the
internal wall 530. Moreover, this phase change material 534 is
configured to change phase in response to heat received from a
component 526 of the ultrasound probe 500. The phase change
material 534 that is configured to transition between a solid phase
and a liquid phase.
[0098] Further, for ease of illustration and description, the phase
change chamber 508 is depicted as including two phase change
chamber portions. These portions may be sealed to form the phase
change chamber 508. Accordingly, in one embodiment, the phase
change chamber 508 is a continuous structure.
[0099] The ultrasound probe 500 including the ultrasound probe
handle 502, the 3D vapor chamber 510 and thermal energy storage
chamber 512 may be formed using additive manufacturing, such as by
being formed using three-dimensional (3D) printing, rapid
prototyping (RP), direct digital manufacturing (DDM), selective
laser melting (SLM), electron beam melting (EBM), direct metal
laser melting (DMLM), and the like. Some other exemplary methods of
additive fabricating usable with the present specification may
include processes, such as, but not limited to, direct writing,
electron beam deposition, laser deposition, stereo-lithography, and
the like.
[0100] As will be appreciated, it is desirable to have an
ultrasound probe that is an ergonomically sound structure and a
light weight structure capable of dissipating heat generated in the
ultrasound probe by transferring and/or storing the generated heat
to an outer surface of the ultrasound probe, and subsequently to
the ambient environment. FIGS. 6-9 represent further embodiments of
an ultrasound probe having a thermal management assembly in the
form of an exemplary phase change chamber that is configured to
provide enhanced thermal management for the ultrasound probe by
facilitating enhanced dissipation and/or storage of heat generated
by internal components of the ultrasound probe. It may be noted
that phase change chambers depicted in FIGS. 6-9 may be created
using additive manufacturing, such as by being formed using
three-dimensional (3D) printing, rapid prototyping (RP), direct
digital manufacturing (DDM), selective laser melting (SLM),
electron beam melting (EBM), direct metal laser melting (DMLM), or
the like. Alternatively, the phase change chambers can be formed in
another manner.
[0101] Turning now to FIG. 6, a diagrammatical illustration 600 of
a cross-section of one embodiment of an ultrasound probe for use in
the system 100 of FIG. 1, in accordance with aspects of the present
specification, is depicted. FIG. 6 is described in conjunction with
the components of FIGS. 1-5.
[0102] In the example of FIG. 6, a cross-sectional view of a
wireless ultrasound probe 600 is depicted. As will be appreciated,
a wireless ultrasound probe 600 includes additional components such
as batteries, wireless transmitters, wireless receivers, and
corresponding electronics to support operation of the wireless
ultrasound probe 600. Moreover, these additional components are
distributed across the wireless ultrasound probe 600 serve as
additional heat sources. Further, due to the additional components
such as the batteries and/or wireless transmitters/receivers, the
heat generated in the ultrasound probe 600 is distributed and
higher in magnitude.
[0103] In the embodiment depicted in FIG. 6, the ultrasound probe
600 is depicted as including an ultrasound probe handle 602 and a
thermal management assembly in the form of a phase change chamber
604 within the ultrasound probe handle walls and configured to
provide enhanced thermal management for the ultrasound probe 600.
In the example of FIG. 6, the phase change chamber 604 is a 3D
vapor chamber configured to facilitate enhanced thermal management
of the ultrasound probe 600 having the additional heat sources. As
previously noted, the 3D vapor chamber 604 is monolithic with
respect to at least a portion of the ultrasound probe handle 602.
Additionally, the 3D vapor chamber 604 is configured to be a
thermally conductive structure. In certain embodiments, the 3D
vapor chamber 604 may also be configured to provide mechanical or
structural support to internal components of the ultrasound probe
600.
[0104] The ultrasound probe 600 includes a transducer assembly 606,
one or more processors, ASICs, batteries, sensors and the like.
Components such as processors, ASICs, batteries, sensors, and the
like are generally represented by reference numeral 608. Also,
these components 608 may be mounted on a mother board 610, As noted
hereinabove, the components 606, 608 are additional heat sources in
the ultrasound probe 600 and are distributed in the volume of the
ultrasound probe 600.
[0105] In the embodiment depicted in FIG. 6, the 3D vapor chamber
604 is configured to interface with the various heat sources 606,
608 within the 3D vapor chamber 604 to facilitate dissipation of
heat generated by the heat sources 606, 608. To that end, the vapor
chamber 604 includes one or more projections 612 configured to
facilitate the enhanced transfer of heat from the heat generating
internal components 606, 608 of the ultrasound probe 600. These
projections 612 may be similar to the projection 524 of FIG. 5 and
are depicted in greater detail in FIG. 6. In one embodiment, the
projections 612 may include finger-like protrusions. Additionally,
in the example depicted in FIG. 6, the projections 612 are disposed
on an interior surface of the 3D vapor chamber 604 such that each
projection 612 contacts at least one heat source 608. In
particular, each projection 612 is thermally coupled to at least
one heat source 608.
[0106] Moreover, as previously noted, the 3D vapor chamber 604 and
the 3D vapor chamber projections 612 may be created using additive
manufacturing, such as by being formed using three-dimensional (3D)
printing, rapid prototyping (RP), direct digital manufacturing
(DDM), selective laser melting (SLM), electron beam melting (EBM),
direct metal laser melting (DMLM), or the like. Alternatively, the
3D vapor chamber 604 can be formed in another manner.
[0107] The design of the ultrasound probe 600 having the 3D vapor
chamber 604, which in turn has the projections 612 provides a
single monolithic structure configured to access multiple heat
sources 608 and dissipate the heat generated by the heat sources
608. Moreover, the 3D vapor chamber 604 having the projections 612
is formed using a material having a high thermal conductivity,
Consequently, the heat generated by the components 608 is
efficiently transported to an outer surface of the ultrasound probe
handle 602 via the projections 612 in the 3D vapor chamber 604 for
dissipation into the surrounding environment.
[0108] It may be noted that the exemplary design of the 3D vapor
chamber 604 aids in replacing a spine, heat spreaders, heat pipes,
thermal pads, plastic PCB holders that are used in conventional
ultrasound probes. Additionally, the 3D vapor chamber 604 may be
used as a handle of an ultrasound probe. Moreover, the design of
FIG. 6 provides the ultrasound probe 600 having the ultrasound
probe handle 602 that has a lower weight, less complexity, higher
thermal performance, and faster installation time compared to the
conventional ultrasound probes. It may be noted that a
cross-section of one embodiment of a shell 614 of the 3D vapor
chamber 604 may have a structure that is substantially similar to
the cross-section 214 of the 3D vapor chamber 208 of FIG. 2.
[0109] Additionally, in certain embodiments, the ultrasound probe
600 and the 3D vapor chamber 604 in particular may include a
thermal mounting platform 616. In this example, the 3D vapor
chamber 604 extends along the length of the ultrasound probe handle
walls to the area of the thermal mounting platform 616. Further,
the thermal mounting platform 616 is directly coupled to the
transducer assembly 606 and configured to transfer heat generated
by the transducer assembly 606 to the 3D vapor chamber 604 for
dissipation to the surrounding environment. As will be appreciated,
the transducer assembly 606 typically includes a stack of
components such as a transducer array of one or more transducer
elements, processing electronics in the form of application
specific integrated circuits (ASICs), a thermal-acoustic backing,
and the like (not shown in FIG. 6). The thermal-acoustic backing of
the transducer assembly 606 may be mounted on and directly coupled
to the thermal mounting platform 616.
[0110] The heat generated by the transducer assembly 606 is
transferred from the transducer assembly 606 via the
thermal-acoustic backing to the thermal mounting platform 616. The
thermal mounting platform 616 in turn transfers this heat to the
enclosure or shell 614 of the 3D vapor chamber 604. The enclosure
614 provides an expansive surface area for the dissipation of the
heat generated by the transducer assembly 606 for cooling by the
ambient environment. Also, the thermal mounting platform 616 may be
formed using a strong and light weight material such as titanium,
Some non-limiting examples of the material used to form the thermal
mounting platform 616 include titanium, copper, aluminum, and the
like. However, other materials may also be used to form the thermal
mounting platform 616.
[0111] In accordance with further aspects of the present
specification, in addition to facilitating enhanced thermal
management in the ultrasound probe 600, the 3D vapor chamber 604
may also be configured to provide mechanical support to the
internal components of the ultrasound probe 600. By way of example,
the thermal mounting platform 616 in addition to facilitating
dissipation of heat from the transducer assembly 606 may also be
configured to provide mechanical support to the transducer assembly
606 in the ultrasound probe 600. As noted hereinabove, the
thermal-acoustic backing of the transducer assembly 606 may be
mounted on and directly coupled to the thermal mounting platform
616.
[0112] FIGS. 7-9 represent different embodiments of an ultrasound
probe. In particular, embodiments of the ultrasound probe depicted
in FIGS. 7-9 illustrate alternative configurations of the
ultrasound probe 600 depicted in FIG. 6. In addition, a
cross-section of one embodiment of the phase change chambers of the
embodiments depicted in FIGS. 7-9 may have a structure that is
substantially similar to the cross-sections 210, 310, 414, 514 of
the phase change chambers of FIGS. 2-5.
[0113] FIG. 7 is a diagrammatical illustration 700 of a
cross-section of another embodiment of an ultrasound probe, in
accordance with aspects of the present specification. Also, FIG. 7
is described in conjunction with the components of FIGS. 1-6.
[0114] As previously described with reference to FIG. 6, a digital
wireless probe includes additional heat sources and hence
experiences a higher internal heat load. Accordingly, it is
desirable that a surface area of the ultrasound probe be large
enough to maintain temperatures of the ultrasound probe to a value
below about 43.degree. C.
[0115] In the embodiment depicted in FIG. 7, the ultrasound probe
700 is depicted as including ultrasound probe handle 702 and a
thermal management assembly in the form of a phase change chamber
704 within walls of the ultrasound probe handle 702 and configured
to provide enhanced thermal management for the ultrasound probe
700. In a presently contemplated configuration, the phase change
chamber 704 includes a 3D vapor chamber 706 and a thermal energy
storage chamber 708 configured to facilitate enhanced thermal
management of the ultrasound probe 700 having the additional heat
sources.
[0116] The ultrasound probe 700 includes a transducer assembly 710,
one or more processors, ASICs, batteries, sensors, and the like.
Components such as processors, ASICs, batteries, sensors and the
like are generally represented by reference numeral 712. These
components 712 may be mounted on a mother board 714. As noted
hereinabove, the components 712 are additional heat sources in the
ultrasound probe 700 and are distributed in the volume of the
ultrasound probe 700.
[0117] The 3D vapor chamber 706 is configured to interface with the
various heat sources 712 of the ultrasound probe 700 to facilitate
dissipation of heat generated by the heat sources 712. Accordingly,
the 3D vapor chamber 706 includes one or more projections 716
configured to facilitate the enhanced transfer of heat from the
heat generating internal components 712 of the ultrasound probe
700. In one embodiment, the projections 716 may include finger-like
protrusions. Additionally, in the example depicted in FIG. 7, the
projections 716 are disposed on an interior surface of the 3D vapor
chamber 706 such that each projection 716 contacts at least one
heat source 712. In particular, each projection 716 is thermally
coupled to at least one heat source 712.
[0118] The design of the ultrasound probe 700 having the 3D vapor
chamber 706, which in turn has the projections 716 provides a
single monolithic structure configured to access multiple heat
sources 712 and dissipate generated by these heat sources 712.
Moreover, the 3D vapor chamber 706 having the projections 716 are
formed using a material having a high thermal conductivity.
Consequently, the heat generated by the components 712 is
efficiently transported to an outer surface of the ultrasound probe
handle 702 via the projections 716 in the 3D vapor chamber 706 for
dissipation into the surrounding environment.
[0119] In the example of FIG. 7, the ultrasound probe 700 and more
particularly the phase change chamber 704 additionally includes the
thermal energy storage chamber 708 that is configured to house a
phase change material (PCM) 720. As will be appreciated, a phase
change material is a material that melts and solidifies at a
determined temperature and is capable of storing and releasing
large amounts of energy. By way of example, heat is absorbed by the
phase change material 720 when the phase change material 720
changes from a solid phase to a liquid phase at a corresponding
melting temperature. Also, the stored energy is released when the
phase change material 720 cools down to a corresponding freezing
point to change phase from a liquid to a solid. It may be noted
that in certain embodiments, the freezing point and the melting
point of the phase change material 720 may be the same or
different. Moreover, the phase change material 720 may include
materials such as, but not limited to, organic materials, inorganic
materials, metallic alloys, eutectic alloys, paraffin wax, or
combinations thereof. Furthermore, in certain embodiments, the
phase change material 720 may be injected into or otherwise
disposed in the thermal energy storage chamber 708. In some
embodiments, the phase change material(s) 720 may also be
encapsulated within one or more polymeric shells. Accordingly, in
this example, the phase change material(s) 720 may be referred to
as encapsulated phase change material(s). Also, in one example, the
one or more polymeric shells may have a size of less than or about
5 mm.
[0120] In this embodiment of the ultrasound probe 700, a portion of
heat generated by the internal components 712 of the ultrasound
probe 700 may be dissipated through an outer surface of the phase
change chamber 704. The remaining heat is absorbed by, the phase
change material 720 and stored in the thermal energy storage
chamber 708 as the phase change material is transitioned from a
solid phase to a liquid phase.
[0121] Furthermore, in certain embodiments, the ultrasound probe
700 and the phase change chamber 704 in particular may include a
thermal mounting platform 718. In this example, the thermal
mounting platform 718 is directly coupled to the transducer
assembly 710 and configured to transfer heat generated by the
transducer assembly 710 to the 3D vapor chamber 706 for dissipation
to the surrounding environment. Moreover, the thermal mounting
platform 718 may also be configured to transfer heat generated by
the transducer assembly 710 to the phase change material 720 for
storage in the thermal energy storage chamber 708. It may be noted
that in addition to facilitating enhanced thermal management in the
ultrasound probe 700, the 3D vapor chamber 706 and the thermal
mounting platform 718 in particular may also be configured to
provide mechanical support to the internal components of the
ultrasound probe 700.
[0122] Additionally, the 3D vapor chamber 706 may also include one
or more fins (not shown in FIG. 7). As previously noted, the fins
in the 3D vapor chamber 706 may be external fins. In this
embodiment, the fins aid in dissipating the heat generated in the
ultrasound probe 700. In one embodiment, the fins may be integral
with an enclosure or shell 724 of the 3D vapor chamber 706. By way
of a non-limiting example, the fins may be integrated with the
enclosure 724 of the 3D vapor chamber 706 as a plain metal or as an
extension of the 3D vapor chamber 706, similar to the projection
524 of FIG. 5. More particularly, the fins 722 are in thermal
communication with the 3D vapor chamber 706 to facilitate the
dissipation of heat from the heat generating components 710, 712 of
the ultrasound probe 700.
[0123] Furthermore, by way of a non-limiting example, the fins may
have a rectangular cross-section or a circular cross-section. Also,
the fins may extend annularly along the radius of the ultrasound
probe handle 702. In certain embodiments, the annular fins may have
openings or ports to facilitate filling and/or transport of the
phase change material 722.
[0124] In addition, the fins may also be in the form of pins and/or
studs of various cross-sectional shapes that extend from the
enclosure or shell 724 of the 3D vapor chamber 706 into the thermal
energy storage chamber 708 such that the fins are in thermal
contact with the phase change material 720. The fins may also be
aligned along the length of the shell 724. In other embodiments,
the fins having varying shapes and/or forms may be dispersed in a
random fashion along the shell 724. These fins may be similar to
the projection 524 depicted in FIG. 5.
[0125] Furthermore, in certain embodiments, the thermal energy
storage chamber 708 may also include one or more of the fins 722.
As previously noted, the fins 722 in the thermal energy storage
chamber 708 are internal fins. In this example, the fins 722 may be
optimally spaced within a volume of phase change material 720 in
the thermal energy storage chamber 708 and configured to aid in
dissipating heat from the phase change material 720, Also, in one
embodiment, the fins 722 may be spaced uniformly within the volume
of the phase change material 720 in the thermal energy storage
chamber 708. However, in another embodiment, the tins 722 may be
disposed with variable spacing within the volume of phase change
material 720 in the thermal energy storage chamber 708. These fins
722 are configured to lower the heat conduction resistance from the
3D vapor chamber 706 to the phase change material 720 in the
thermal energy storage chamber 708 and also promote uniform change
in the state/phase of the phase change material 720, Moreover, the
fins 722 are also in thermal communication with the phase change
material 720 to facilitate the efficient bidirectional transfer of
heat between the heat generating components 710, 712 of the
ultrasound probe 700 and the phase change material 720, In one
example, the fins 722 may aid in transferring heat from the heat
generating components 710, 712 of the ultrasound probe 700 to the
phase change material 720 for storage in the thermal energy storage
chamber 708. In another example, the fins 722 may aid in
transferring the heat stored in the phase change material 720 in
the thermal energy storage chamber 708 to the components 710, 712
of the ultrasound probe 700 and/or the environment surrounding the
ultrasound probe 700.
[0126] Use of the phase change material 720 in the thermal energy
storage chamber 708 results in a lower surface area requirement of
the ultrasound probe 700, thereby, allowing the ultrasound probe
700 to be smaller in size than a corresponding size of an
ultrasound probe without the phase change material 720. Moreover, a
choice of the phase change material 720 may be customized based on
the heat generating sources in the ultrasound probe 700. By way of
non-limiting example, a phase change material 720 that is
configured to melt at 35.degree. C. may be selected. Moreover, use
of the phase change material 720 advantageously provides a
uniformity in temperature as the phase change processes take place
over a constant temperature. Accordingly, all the components of the
ultrasound probe 700 that are in contact with the phase change
material 720 may be maintained at a constant temperature for a
determined period of time, Hence, the ultrasound probe 700 may be
maintained at near isothermal device temperatures until all the
phase change material 720 has melted by transitioning from the
solid phase to the liquid phase. Accordingly, in the embodiment of
FIG. 7, heat generated by the transducer assembly 710 and/or the
components 712 of the ultrasound probe 700 may be transferred to
the 3D vapor chamber 706 for dissipation and/or to the thermal
energy storage chamber 708 for storage in the phase change material
720.
[0127] Moreover, as previously noted, the phase change chamber 704
having the 3D vapor chamber 706 and the thermal energy storage
chamber 708 may be created using additive manufacturing, such as by
being formed using three-dimensional (3D) printing, rapid
prototyping (RP), direct digital manufacturing (DDM), selective
laser melting (SLM), electron beam melting (EBM), direct metal
laser melting (DMLM), or the like.
[0128] Turning now to FIG. 8, a diagrammatical illustration 800 of
a cross-section of yet another embodiment of an ultrasound probe,
in accordance with aspects of the present specification, is
depicted. Ha 8 is described in conjunction with the components of
FIGS. 1-7.
[0129] In FIG. 7, the phase change material 720 was housed n one
thermal energy storage chamber 708 disposed at one end of the
ultrasound probe 700. However, in accordance with further aspects
of the present specification, the phase change material may also be
distributed within an internal volume/surface of an ultrasound
probe in one or more smaller volumes. Accordingly, in the
embodiment of FIG. 8, the ultrasound probe 800 includes two or more
thermal energy storage chambers disposed at different locations
along the inner surface of an enclosure of a phase change
chamber.
[0130] In the embodiment depicted in FIG. 8, the ultrasound probe
800 is depicted as including an ultrasound probe handle 802 and a
thermal management assembly in the form of a phase change chamber
804 within the ultrasound probe handle walls and configured to
provide enhanced thermal management for the ultrasound probe 800.
In a presently contemplated configuration, the phase change chamber
804 includes a 3D vapor chamber 806 and two or more thermal energy
storage chambers 808 configured to facilitate enhanced thermal
management of the ultrasound probe 800 having the additional heat
sources.
[0131] As depicted in FIG. 8, the ultrasound probe 800 includes a
transducer assembly 810, one or more processors, ASICs, batteries,
sensors and the like. Reference numeral 812 is used to represent
components such as processors, ASICs, batteries, sensors, and the
like. The components 812 are additional heat sources in the
ultrasound probe 800 and are distributed in the volume of the
ultrasound probe 800. Also, these components 812 may be mounted on
a mother board 814.
[0132] The 3D vapor chamber 806 is configured to interface with the
various heat sources 812 of the ultrasound probe 800 to facilitate
dissipation of heat generated by the heat sources 812. In one
embodiment, the 3D vapor chamber 806 includes one or more
projections 816 such as finger-like protrusions configured to
facilitate the enhanced transfer of heat from the heat generating
internal components 812 of the ultrasound probe 800. Additionally,
each projection 816 is configured to be thermally coupled to at
least one heat source 812.
[0133] Moreover, in certain embodiments, the ultrasound probe 800
and the 3D vapor chamber 806 in particular may include a thermal
mounting platform 818 that is directly coupled to the transducer
assembly 810 and configured to transfer heat generated by the
transducer assembly 810 to the 3D vapor chamber 806 for dissipation
to the surrounding environment.
[0134] Furthermore, in the example of FIG. 8, the ultrasound probe
800 and more particularly the phase change chamber 804 additionally
includes a thermal energy storage chamber 808 that is configured to
house a phase change material (PCM) 820. Heat is absorbed by the
phase change material 820 when the phase change material 820
changes from a solid phase to a liquid phase. Also, the stored
energy is released when the phase change material 820 changes from
a liquid phase to a solid phase. Moreover, the phase change
material 820 may include materials such as, but not limited to,
organic materials, inorganic materials, metallic alloys, eutectic
alloys, paraffin wax, or combinations thereof. Furthermore, in
certain embodiments, the phase change material 820 may be injected
into or otherwise disposed in the thermal energy storage unit
808.
[0135] As previously noted, the heat generating components 812 are
distributed within the volume of the ultrasound probe 800.
Accordingly, in the example of FIG. 8, the ultrasound probe 800
additionally includes two or more thermal energy storage chambers
808 to facilitate enhanced heat dissipation from the heat
generating components 812 in the ultrasound probe 800. In
accordance with aspects of the present specification, the thermal
energy storage chambers 808 may be distributed within the volume of
the ultrasound probe handle 802.
[0136] Each of the thermal storage chambers 808 is configured to
house a corresponding phase change material 820. Furthermore, each
phase change material 820 may have a different phase transition
temperature and may be of different types. Use of this
configuration allows the added flexibility of having phase changing
materials (PCMs) 820 with different melting points in each of the
thermal energy storage chambers 808. By way of example, a phase
change material 820 having a desired melting temperature may be
selected based on a desired maximum temperature of the heat
generating component 812. Consequently, the heat generating
components 812 may be capped at different desirable peak
temperatures by using phase change materials 820 of varying melting
temperatures.
[0137] In the embodiment 800 of FIG. 8, a portion of heat generated
by the internal components 812 of the ultrasound probe 800 may be
dissipated through an outer surface of the 3D vapor chamber 806.
The remaining heat may be absorbed by the phase change materials
820 corresponding to the different thermal energy storage chambers
808 and stored in the respective thermal energy storage chambers
808 as the phase change materials 820 are transitioned from a solid
phase to a liquid phase at respective phase transition
temperatures.
[0138] Moreover, in some embodiments, the phase change chamber 804
may also include one or more fins (not shown in FIG. 8) configured
to aid in dissipating heat generated in the ultrasound probe 800.
In one embodiment, these fins may be integral with the enclosure
824 of the 3D vapor chamber 806. Also, these fins may be external
fins.
[0139] Also, in certain embodiments, each thermal energy storage
chamber 808 may also include a corresponding set of fins 822. These
fins 822 may be internal tins. Also, as previously noted, each set
of fins 822 may be uniformly spaced or disposed with variable
spacing within a volume of the corresponding phase change material
820 in the thermal energy storage chamber 808 and configured to aid
in dissipating heat from the phase change materials 820. In
particular, the phase change materials 820 are in thermal
communication with the corresponding set of fins 822 to facilitate
dissipation of heat stored within the phase change materials
820.
[0140] As will be appreciated, phase change materials are typically
poor heat conductors and hence disadvantageously need internal heat
spreading structures such as thermally conductive fins and foams.
Advantageously, the thermal energy storage chambers 808 having the
respective phase change materials 820 and the 3D vapor chamber 806
provide an ultrasound probe 800 having an enhanced heat dissipating
ability. Moreover, the fins 822 provide the enhanced heat
dissipating capability, thereby allowing effective storage of the
heat in the phase change materials 820. Furthermore, the phase
change materials 820 typically pose a containment risk as the phase
change materials 820 expand while melting. However, integrating the
thermal energy storage chambers 808 having the phase change
materials 820 with the monolithic structure of the phase change
chamber 804 alleviates any risk of leakage of the phase change
materials 820, thereby obviating the need for additional components
such as O-rings, fasteners, and thicker shells.
[0141] Use of the phase change material 820 in the thermal energy
storage chamber 808 results in a lower surface area requirement of
the ultrasound probe 800, thereby allowing the ultrasound probe 800
to be smaller in size than a corresponding size of an ultrasound
probe without the phase change material 820. Moreover, a choice of
the phase change material 820 may be customized based on the heat
generating sources in the ultrasound probe 800. By way of
non-limiting example, a phase change material 820 that is
configured to melt at a desirable temperature may be selected.
Also, in the embodiment of FIG. 8, heat generated by the transducer
assembly 810 and/or the components 812 of the ultrasound probe 800
may be transferred to the 3D vapor chamber 806 for dissipation
and/or to the thermal energy storage chambers 808 for storage.
[0142] Moreover, as previously noted, the phase change chamber 804
having the 3D vapor chamber 806 and the thermal energy storage
chamber 808 may be created using additive manufacturing, such as by
being formed using three-dimensional (3D) printing, rapid
prototyping (RP), direct digital manufacturing (DDM), selective
laser melting (SLM), electron beam melting (EBM), direct metal
laser melting (DMLM), or the like.
[0143] FIG. 9 is a diagrammatical illustration 900 of a
cross-section of yet another embodiment of an ultrasound probe for
use in the system 100 of FIG. 1, in accordance with aspects of the
present specification. Also, FIG. 9 is described in conjunction
with the components of FIGS. 1-8.
[0144] According to further aspects of the present specification,
the ultrasound probe 900 having an ultrasound probe handle 902 and
a thermal management assembly in the form of a phase change chamber
904 that is configured to provide enhanced thermal management for
the ultrasound probe 900 is depicted in FIG. 9. In the example of
FIG. 9, the phase change chamber 904 is a 3D vapor chamber.
Further, the 3D vapor chamber 904 includes projections finger-like
protrusions 906 that are integral to an interior surface of an
enclosure 908 of the 3D vapor chamber 904. Also, the ultrasound
probe 900 includes a transducer assembly 910. In addition, the
ultrasound probe 900 includes components 912 such as processors,
ASICs, batteries, sensors and the like that may be mounted on a
mother board 914. Moreover, the 3D vapor chamber 904 may include a
thermal mounting platform 916 configured to facilitate dissipation
of heat generated by the transducer assembly 910.
[0145] In the embodiment depicted in FIG. 9, the ultrasound probe
900 includes an outer protective shell 918 that is disposed such
that the outer protective shell 918 encompasses the enclosure 908
the 3D vapor chamber 904. Additionally, the ultrasound probe 900
may also include one or more extended surfaces such as fins and/or
studs 920 that are disposed at least on an outer surface of the
enclosure 908 of the 3D vapor chamber 904. The fins 920 are
external fins. Also, these fins and/or studs 920 aid in enhancing a
contact surface area of the enclosure 908 of the 3D vapor chamber
904 with the outer protective shell 918. It may be noted that the
studs and/or fins 920 may be integrated with the enclosure 908 of
the 3D vapor chamber 904.
[0146] Additionally, in some embodiments, the outer protective
shell 918 may be a thin plastic shell. However, in another
embodiment, the outer protective shell 918 may be fabricated by dip
coating the 3D vapor chamber 904 in a plastic coating. It may be
noted that the outer protective shell 918 is formed such that the
outer protective shell 918 conforms to a shape of the 3D vapor
chamber 904 and the studs and/or fins 920 disposed thereon.
Moreover, the outer protective shell 918 is configured to shield
the ultrasound probe 900 from electric contact. Also, the outer
protective shell 918 is configured to act as a sealing element,
thereby providing hygiene benefits to the ultrasound probe 900. In
addition, the material of the protective shell/coating 918 may be
chosen to have anti-scratch, anti-bacterial, and/or anti-fungal
properties.
[0147] As previously noted with reference to FIG. 1, the medical
imaging system 108 may include an ultrasound imaging system. FIG.
10 is a block diagram 1000 of an embodiment of an ultrasound
imaging system depicted in FIG. 1. The ultrasound system 1100
includes an acquisition subsystem, such as the acquisition
subsystem 110 of FIG. 1 and a processing subsystem, such as the
processing subsystem 112 of FIG. 1. The acquisition subsystem 110
may include a transducer assembly 1006. In addition, the
acquisition subsystem 110 includes transmit/receive switching
circuitry 1008, a transmitter 1010, a receiver 1012, and a
beamformer 1014. It may be noted that in certain embodiments, the
transducer assembly 1006 is disposed in the probe 104 (see FIG. 1).
Also, in certain embodiments, the transducer assembly 1006 may
include a plurality of transducer elements (not shown) arranged in
a spaced relationship to form a transducer array, such as a
one-dimensional or two-dimensional transducer array, for example.
Additionally, the transducer assembly 1006 may include an
interconnect structure (not shown) configured to facilitate
operatively coupling the transducer array to an external device
(not shown), such as, but not limited to, a cable assembly or
associated electronics. In the illustrated embodiment, the
interconnect structure may be configured to couple the transducer
array to the T/R switching circuitry 1008.
[0148] The processing subsystem 112 includes a control processor
1016, a demodulator 1018, an imaging mode processor 1020, a scan
converter 1022, and a display processor 1024. The display processor
1024 is further coupled to a display monitor 1036, such as the
display 118 (see FIG. 1), for displaying images. User interface
1038, such as the user interface area 120 (see FIG. 1), interacts
with the control processor 1016 and the display monitor 1036. The
control processor 1016 may also be coupled to a remote connectivity
subsystem 1026 including a remote connectivity interface 1028 and a
web server 1030. The processing subsystem 112 may be further
coupled to a data repository 1032, such as the data repository 116
of FIG. 1, configured to receive and/or store ultrasound image
data. The data repository 1032 interacts with an imaging
workstation 1034.
[0149] The aforementioned components may be dedicated hardware
elements such as circuit boards with digital signal processors or
may be software running on a general-purpose computer or processor
such as a commercial, off-the-shelf personal computer (PC). The
various components may be combined or separated according to
various embodiments of the invention. Thus, those skilled in the
art will appreciate that the present ultrasound imaging system 1000
is provided by way of example, and the present specifications are
in no way limited by the specific system configuration.
[0150] In the acquisition subsystem 110, the transducer assembly
1006 is in contact with the patient 102. The transducer assembly
1006 is coupled to the transmit/receive (T/R) switching circuitry
1008. Also, the T/R switching circuitry 1008 is in operative
association with an output of transmitter 1010 and an input of the
receiver 1012. The output of the receiver 1012 is an input to the
beamformer 1014. In addition, the beamformer 1014 is further
coupled to the input of the transmitter 1010 and to the input of
the demodulator 1018. The beamformer 1014 is also operatively
coupled to the control processor 1016 as shown in FIG. 10.
[0151] In the processing subsystem 112, the output of demodulator
1018 is in operative association with an input of the imaging mode
processor 1020. Additionally, the control processor 1016 interfaces
with the imaging mode processor 1020, the scan converter 1022, and
the display processor 1024. An output of imaging mode processor
1020 is coupled to an input of scan converter 1022. Also, an output
of the scan converter 1022 is operatively coupled to an input of
the display processor 1024, The output of display processor 1024 is
coupled to the monitor 1036.
[0152] The ultrasound system 1000 transmits ultrasound energy into
the subject such as the patient 102 and receives and processes
backscattered ultrasound signals from the subject 102 to create and
display an image. To generate a transmitted beam of ultrasound
energy, the control processor 1016 sends command data to the
beamformer 1014 to generate transmit parameters to create a beam of
a desired shape originating from a certain point at the surface of
the transducer assembly 1006 at a desired steering angle. The
transmit parameters are sent from the beamformer 1014 to the
transmitter 1010. The transmitter 1010 uses the transmit parameters
to properly encode transmit signals to be sent to the transducer
assembly 1006 through the T/R switching circuitry 1008. The
transmit signals are set at certain levels and phases with respect
to each other and are provided to individual transducer elements
such as the source elements of the transducer assembly 1006. The
transmit signals excite the transducer elements to emit irradiating
energy or waves with the same phase and level relationships. As a
result, a transmitted beam of irradiating energy is formed in the
patient 102 within a scan plane along a scan line when the
transducer assembly 1006 is acoustically coupled to the patient 102
by using, for example, ultrasound gel. The process is known as
electronic scanning.
[0153] The transducer assembly 1006 may be a two-way transducer.
When the irradiating energy is transmitted into the patient 102,
the tissue being imaged may absorb at least a portion of the
delivered irradiating energy. The absorbed energy may result in a
thermoelastic expansion of the tissue, which in turn results in the
generation of acoustic or ultrasound waves. The acoustic or
ultrasound waves may be detected by the detector elements in the
transducer assembly 1006. The transducer assembly 1006 and more
particularly, the detector elements in the transducer assembly 1006
may be configured to receive the acoustic waves at different times,
depending on the distance into the tissue they return from and the
angle with respect to the surface of the transducer assembly 1006
at which they return. The detector elements may be configured to
convert the ultrasound energy from the acoustic waves into
electrical signals.
[0154] The electrical signals are then routed through the T/R
switching circuitry 1008 to the receiver 1012. The receiver 1012
amplifies and digitizes the received signals and provides other
functions such as gain compensation. The digitized received signals
corresponding to the backscattered waves received by each
transducer element at various times preserve the amplitude and
phase information of the backscattered waves.
[0155] The digitized signals are sent to the beamformer 1014. The
control processor 1016 sends command data to beamformer 1014. The
beamformer 1014 uses the command data to form a receive beam
originating from a point on the surface of the transducer assembly
1006 at a steering angle typically corresponding to the point and
steering angle of the previous irradiating energy transmitted along
a scan line. The beamformer 1014 operates on the appropriate
received signals by performing time delaying and focusing,
according to the instructions of the command data from the control
processor 1016, to create received beam signals corresponding to
sample volumes along a scan line in the scan plane within the
patient 102. The phase, amplitude, and timing information of the
received signals from the various transducer elements may be used
to create the received beam signals.
[0156] The received beam signals may be communicated to the
processing subsystem 112. The demodulator 1018 demodulates the
received beam signals to create pairs of I and Q demodulated data
values corresponding to sample volumes within the scan plane.
Demodulation is accomplished by comparing the phase and amplitude
of the received beam signals to a reference frequency. The I and Q
demodulated data values preserve the phase and amplitude
information of the received signals.
[0157] The demodulated data is transferred to the imaging mode
processor 1020. The imaging mode processor 1020 uses parameter
estimation techniques to generate imaging parameter values from the
demodulated data in scan sequence format. The imaging parameters
may include parameters corresponding to various possible imaging
modes such as B-mode, color velocity mode, spectral Doppler mode,
and tissue velocity imaging mode, for example. The imaging
parameter values are passed to the scan converter 1022. The scan
converter 1022 processes the parameter data by performing a
translation from scan sequence format to display format. The
translation includes performing interpolation operations on the
parameter data to create display pixel data in the display
format.
[0158] The scan converted pixel data is sent to the display
processor 1024 to perform any final spatial or temporal filtering
of the scan converted pixel data, to apply grayscale or color to
the scan converted pixel data, and to convert the digital pixel
data to analog data for display on the monitor 1036. The user
interface 1038 is coupled to the control processor 1016 to allow a
user to interface with the ultrasound system 1000 based on the data
displayed on the monitor 1036.
[0159] FIG. 11 is an example flow chart 1100 of a method of
additive fabrication of an ultrasound probe having an ultrasound
probe handle and a thermal management assembly in the form of a
phase change chamber that is configured to provide enhanced thermal
management for the ultrasound probe, in accordance with aspects of
the present specification.
[0160] At step 1102, the method commences by additively fabricating
first and second segments of an ultrasound probe handle. It may be
noted that at least one segment of the first and second segments of
the ultrasound probe handle includes a phase change chamber. The
phase change chamber is monolithic with respect to the
corresponding segment. Moreover, the phase change chamber includes
hermetic chamber walls that extend around and define an enclosed
chamber. In certain embodiments, the phase change chamber may be a
3D vapor chamber, a thermal energy storage chamber, or a
combination thereof.
[0161] Furthermore, a material is disposed within the hermetic
chamber walls. The material is configured to change phase in
response to heat received from a component of the ultrasound probe.
Also, the material may include a working fluid and/or a phase
change material. Various embodiments of the phase change chamber
have been described with reference to FIGS. 2-9. If the phase
change chamber is a 3D vapor change chamber, the material is a
working fluid that is filled in the 3D vapor chamber. The working
fluid has a liquid phase and a vapor phase and is configured to
facilitate the dissipation of heat from the heat generating
components of the ultrasound probe. Also, if the phase change
chamber includes one or more thermal energy storage chambers, the
material is a phase change material that may be filled in each of
the thermal energy storage chambers. The phase change materials are
configured to absorb and store at least a portion of the heat
generated in the ultrasound probe and facilitate storage of the
absorbed heat.
[0162] Additionally, the phase change chamber having the 3D vapor
chamber and/or and the thermal energy storage chamber may be
created using additive manufacturing, such as by being formed using
three-dimensional (3D) printing, rapid prototyping (RP), direct
digital manufacturing (DDM), selective laser melting (SLM),
electron beam melting (EBM), direct metal laser melting (DMLM), or
the like. In one embodiment, a single three-dimensional model of
the ultrasound probe handle and/or the phase change chamber to be
formed may be obtained. Further, the ultrasound probe handle may be
additively fabricated based on the 3D model.
[0163] Further, as previously noted, the phase change chamber is
configured to facilitate enhanced transfer of heat from the heat
generating components of the ultrasound probe. Accordingly, at step
1104, one or more components of the ultrasound probe may be
positioned in thermal communication with the phase change chamber.
Some non-limiting examples of the components of the ultrasound
probe include a transducer assembly, ASICs, processors, batteries,
sensors, and the like. Also, in some embodiments, the processor,
the battery, the sensor, and/or the ASIC may be mounted on a
support platform such as a mother board.
[0164] In particular, the phase change chamber is thermally coupled
to one or more heat generating components of the ultrasound probe.
In some embodiments, the phase change chamber may be directly
thermally coupled to the heat generating components via use of a
thermal interface material. Some non-limiting examples of the
thermal interface material include thermal pads, grease, adhesive,
and the like. For example, an adhesive material may be employed to
form a t