U.S. patent application number 16/419015 was filed with the patent office on 2020-05-28 for heat dissipation module manufacturing method, heat dissipation module and electronic device.
This patent application is currently assigned to HTC Corporation. The applicant listed for this patent is HTC Corporation. Invention is credited to Chun-Lung Chu, Chih-Yao Kuo, Wei-Cheng Liu, Chin-Kai Sun.
Application Number | 20200170143 16/419015 |
Document ID | / |
Family ID | 70771180 |
Filed Date | 2020-05-28 |
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United States Patent
Application |
20200170143 |
Kind Code |
A1 |
Kuo; Chih-Yao ; et
al. |
May 28, 2020 |
HEAT DISSIPATION MODULE MANUFACTURING METHOD, HEAT DISSIPATION
MODULE AND ELECTRONIC DEVICE
Abstract
A heat dissipation module manufacturing method, a heat
dissipation module and an electronic device are provided. The heat
dissipation module manufacturing method includes the steps:
providing a first substrate, the first substrate has a first
portion, a second portion, a connecting portion connected to the
first portion and the second portion; performing a first etching on
a surface of the first substrate to form a plurality of grooves;
providing a plurality of second substrates, and bonding the second
substrates to the first substrate to cover the grooves and form a
plurality of chambers; filling the chambers with a working fluid;
and sealing the chambers. The heat dissipation module includes the
first substrate, the working fluid, and the second substrates. The
electronic device includes the heat dissipation module and a
plurality of electronic modules. The first portion and the second
portion of the heat dissipation module respectively contact the
electronic modules.
Inventors: |
Kuo; Chih-Yao; (Taoyuan
City, TW) ; Sun; Chin-Kai; (Taoyuan City, TW)
; Chu; Chun-Lung; (Taoyuan City, TW) ; Liu;
Wei-Cheng; (Taoyuan City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HTC Corporation |
Taoyuan City |
|
TW |
|
|
Assignee: |
HTC Corporation
Taoyuan City
TW
|
Family ID: |
70771180 |
Appl. No.: |
16/419015 |
Filed: |
May 22, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62770755 |
Nov 22, 2018 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/20254 20130101;
H05K 7/20272 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A heat dissipation module manufacturing method, comprising:
providing a first substrate, wherein the first substrate has a
first portion, a second portion, and a connecting portion connected
to the first portion and the second portion; performing a first
etching on a surface of the first substrate to form a plurality of
grooves; providing a plurality of second substrates, and bonding
the second substrates to the first substrate to cover the grooves
and form a plurality of chambers; filling the chambers with a
working fluid; and sealing the chambers.
2. The heat dissipation module manufacturing method as recited in
claim 1, wherein the steps of bonding the second substrates to the
first substrate and filling the chambers with the working fluid
comprise: placing the second substrates on the first substrate;
soldering each of the second substrates on the first substrate to
cover each of the grooves and respectively reserve an injection
hole; filling the chamber with the working fluid through the
corresponding injection hole; and soldering each of the injection
holes by using a solder to seal each of the injection holes.
3. The heat dissipation module manufacturing method as recited in
claim 2, wherein the step of soldering each of the second
substrates on the first substrate comprises performing diffusion
bonding or applying solder bonding.
4. The heat dissipation module manufacturing method as recited in
claim 1, after sealing the chambers, further comprising: bending
the connecting portion.
5. The heat dissipation module manufacturing method as recited in
claim 1, further comprising: performing a second etching on a
surface of the first substrate to form at least one accommodating
space.
6. The heat dissipation module manufacturing method as recited in
claim 1, further comprising: performing a second etching on a
surface of the first substrate to form at least one through
hole.
7. A heat dissipation module, comprising: a first substrate, having
a first portion, a second portion, a connecting portion, and a
plurality of grooves, wherein the connecting portion is connected
to the first portion and the second portion, the grooves are
respectively formed on the first substrate by etching; a plurality
of second substrates, respectively covering the grooves on the
first substrate to form a plurality of chambers; and a working
fluid, filled into the chambers.
8. The heat dissipation module as recited in claim 7, wherein
thicknesses of portions having the chambers of the heat dissipation
module are between 0.3 millimeters and 0.5 millimeters.
9. The heat dissipation module as recited in claim 7, wherein the
first portion and the second portion present a flat plate
shape.
10. The heat dissipation module as recited in claim 7, wherein the
connecting portion is partially is partially bent.
11. The heat dissipation module as recited in claim 7, wherein the
first substrate is etched to form at least one accommodating
space.
12. The heat dissipation module as recited in claim 11, wherein a
thickness of the first substrate is between 0.3 millimeters and 0.4
millimeters except for a portion having the accommodating
space.
13. The heat dissipation module as recited in claim 7, wherein the
first substrate is etched to form at least one through hole.
14. An electronic device, comprising: a plurality of electronic
modules; and a heat dissipation module, comprising: a first
substrate, having a first portion, a second portion, a connecting
portion, and a plurality of grooves, wherein the connecting portion
is connected to the first portion and the second portion, the
connecting portion is partially bent, the grooves are respectively
formed on the first substrate by etching, and the first portion and
the second portion are respectively in contact with the electronic
modules; a plurality of second substrates, respectively covering
the grooves on the first substrate to form a plurality of chambers;
and a working fluid, filled into the chambers.
15. The electronic device as recited in claim 14, wherein
thicknesses of portions having the chambers of the heat dissipation
module are between 0.3 millimeters and 0.5 millimeters.
16. The electronic device as recited in claim 14, wherein the first
portion and the second portion present a flat plate shape.
17. The electronic device as recited in claim 14, wherein the first
substrate is etched to form at least one accommodating space.
18. The electronic device as recited in claim 17, wherein a
thickness of the first substrate is between 0.3 millimeters and 0.4
millimeters except for a portion having the accommodating
space.
19. The electronic device as recited in claim 14, wherein the first
substrate is etched to form at least one through hole.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of U.S.
provisional application Ser. No. 62/770,755, filed on Nov. 22,
2018. The entirety of the above-mentioned patent application is
hereby incorporated by reference herein and made a part of this
specification.
TECHNICAL FIELD
[0002] The disclosure relates to a manufacturing method, a module
and a device, more particularly, relates to a heat dissipation
module manufacturing method, a heat dissipation module and an
electronic device.
DESCRIPTION OF RELATED ART
[0003] The performance of electronic device is constantly improved.
Therefore, the heat generated when the electronic device operates
becomes higher and higher. How to improve the heat dissipation
effect of electronic device having a limited space has become the
goal of each manufacturer.
SUMMARY
[0004] The disclosure provides a heat dissipation module
manufacturing method, a heat dissipation module, and an electronic
device, capable of solving the problems that the space utilization
rate and the heat dissipation efficiency in the existing heat
dissipation module and the electronic device cannot be both
considered.
[0005] The heat dissipation module manufacturing method of the
disclosure includes the following steps: providing a first
substrate, wherein the first substrate has a first portion, a
second portion, and a connecting portion connected to the first
portion and the second portion; performing a first etching on a
surface of the first substrate to form a plurality of grooves;
providing a plurality of second substrates, and bonding the second
substrates to the first substrate to cover the grooves and form a
plurality of chambers; filling the chambers with a working fluid;
and sealing the chambers.
[0006] The heat dissipation module of the disclosure includes a
first substrate, a working fluid, and a plurality of second
substrates. The first substrate has a first portion, a second
portion, a connecting portion, and a plurality of grooves. The
connecting portion is connected to the first portion and the second
portion. The grooves are respectively formed on the first substrate
by etching. The plurality of second substrates respectively cover
the grooves on the first substrate to form a plurality of chambers.
The working fluid is filled into the chambers.
[0007] The electronic device of the disclosure includes the heat
dissipation module and a plurality of electronic modules. The heat
dissipation module includes the first substrate, the working fluid,
and the second substrates. The first substrate has a first portion,
a second portion, a connecting portion, and a plurality of grooves.
The connecting portion is connected to the first portion and the
second portion, and the connecting portion is partially bent. The
grooves are respectively formed on the first substrate by etching.
The first portion and the second portion respectively contact the
electronic modules. The plurality of second substrates respectively
cover the grooves on the first substrate to form a plurality of
chambers. The working fluid is filled into the chambers.
[0008] Based on the above, in the heat dissipation module
manufacturing method, the heat dissipation module, and the
electronic device of the disclosure, the heat dissipation
efficiency is improved, and it meets the design trend towards
developing thinner electronic device.
[0009] In order to make the aforementioned and other features and
advantages of the disclosure more comprehensible, embodiments
accompanying figures are described in detail belows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIGS. 1A to 1E are schematic views illustrating a heat
dissipation module manufacturing method according to one embodiment
of the disclosure.
[0011] FIG. 2 is three-dimensional schematic view illustrating a
heat dissipation module formed by a heat dissipation module
manufacturing method according to one embodiment of the
disclosure.
[0012] FIG. 3 is a schematic view of an electronic device according
to one embodiment of the invention.
DESCRIPTION OF THE EMBODIMENTS
[0013] FIGS. 1A to 1E are schematic views illustrating a heat
dissipation module manufacturing method according to one embodiment
of the disclosure. In the heat dissipation module manufacturing
method of the present embodiment, firstly, the first substrate 110
is provided as shown in FIG. 1A. The first substrate 110 is divided
into the first portion 112a, the second portion 112b, and a
connecting portion 112c. The connecting portion 112c is connected
to the first portion 112a and the second portion 112b. After that,
as shown in FIG. 1B, the first etching is performed on a surface
118b of the first substrate 110 to form a groove 113. Subsequently,
as shown in FIG. 1C, the second substrate 120 is provided, and the
second substrate 120 is bonded to the first substrate 110 to cover
the groove 113 and form a chamber 116. Next, as shown in FIG. 1D,
the working fluid 130 is filled into the chamber 116, and the
chamber 116 is sealed. Finally, as shown in FIG. 1E, the connecting
portion 112c is bent to obtain a heat dissipation module 100.
[0014] It should be noted here, for convenience of description,
FIG. 1A to FIG. 1E simply show a single one of connecting portion
112c, a single one of the second portion 112b, a single one of the
groove 113, a single one of the second substrate 120, and a single
one of the chamber 116. However, the number of the connecting
portion 112c, the second portion 112b, the groove 113, the second
substrate 120, and the chamber 116 may also more than one, the
disclosure is not limited thereto.
[0015] In the present embodiment, the steps of bonding the second
substrate 120 to the first substrate 110 and filling the chamber
116 with the working fluid 130 may include, firstly, placing the
second substrate 120 on the first substrate 110. Subsequently, the
second substrate 120 is soldered on the first substrate 110 to
cover the groove 113 in order to form the chamber 116 and to
reserve an injection hole 122. The method for soldering the second
substrate 120 to the first substrate 110 includes diffusion bonding
but is not limited thereto. After that, the chamber 116 is
vacuumized. Next, the working fluid 130 is filled into the chamber
116 through the injection hole 122. Finally, the injection hole 122
is soldered by using a solder in order to seal the injection hole
122. In other embodiments, the method for soldering the second
substrate 120 on the first substrate 110 includes applying solder
bonding.
[0016] Referring to FIG. 1A and FIG. 1B, in the present embodiment,
the heat dissipation module manufacturing method further includes
performing the second etching on a surface 118a of the first
substrate 110 to form at least one accommodating space 114. It
should be noted here, the sequence of the steps of performing the
first etching and the second etching on the surface 118b and the
surface 118a of the first substrate 110 are not restricted in the
present embodiment and are determined according to
requirements.
[0017] As shown in FIG. 1E, the first substrate 110 has a thickness
T1 except for a portion having the accommodating space 114. The
thickness T1 is between 0.3 millimeters and 0.4 millimeters as an
example. The heat dissipation module 100 has a thickness T2 at a
portion having the chamber 116. The thickness T2 is between 0.3
millimeters and 0.5 millimeters as an example.
[0018] FIG. 2 is three-dimensional schematic view illustrating a
heat dissipation module formed by a heat dissipation module
manufacturing method according to one embodiment of the disclosure.
Referring to FIG. 1E and FIG. 2, the heat dissipation module
manufacturing method in the present embodiment further includes
bending the connecting portion 112c to form one of first portion
112a, two of second portions 112b, and two of connecting portions
112c. Each of the connecting portions 112c is connected to the
first portion 112a and the corresponding second portion 112b. Each
of the second portions 112b has the respective chamber 116 covered
by the second substrate 120. Each of the chambers 116 is filled by
the respective working fluid 130. In the present embodiment, the
first portion 112a and the second portion 112b present a flat plate
shape and are parallel to each other, but other embodiments (not
shown) are not limited thereto. Otherwise, the number of the first
portions 112a, the second portions 112b, and the connecting
portions 112c are not restricted.
[0019] Referring to FIG. 2, the second etching may further be
performed on the surface 118a of the first substrate 110 to form at
least one through hole 119. The through hole 119 may be used to
accommodate the electronic element having great height, such as
camera lens.
[0020] FIG. 3 is a schematic view of an electronic device according
to one embodiment of the invention. Referring to FIG. 3, the
electronic device 50 includes a heat dissipation module 100 and a
plurality of electronic modules (such as electronic modules 52b,
52c, 52d, and 52e). The first portion 112a and the second portion
112b are respectively in contact with the electronic modules 52b,
52c, 52d, and 52e disposed on a circuit board 52a. The heat of the
electronic modules 52b, 52c, 52d, and 52e is conducted through the
first substrate 110 to the working fluid 130 inside the chamber 116
of the first substrate 110, so as to perform heat dissipation.
[0021] For example, the second portion 112b is in contact with the
electronic module 52b having a small height. The first portion 112a
is in contact with the electronic module 52c and the electronic
module 52d having medium height. A part of the electronic module
52e having great height may be accommodated into the accommodating
space 114 and is in contact with the first portion 112a, so as to
reduce the overall thickness of the electronic device 50.
Therefore, the first substrate 110 having the accommodating space
114 and the connecting portion 112c may be in contact with more
parts of the electronic modules 52b, 52c, 52d, and 52e.
Accordingly, in the heat dissipation module manufacturing method,
the heat dissipation module 100, and the electronic device 50 of
the disclosure, the first substrate 110 has a plurality of chambers
116, and the electronic modules 52b, 52c, 52d, and 52e are
simultaneously in contact with the first substrate 110, so the heat
dissipation module 100 has a large heat transfer area to transfer
the heat of the electronic modules 52b, 52c, 52d, and 52e, in order
to improve the heat dissipation efficiency of the heat dissipation
module 100 and the electronic device 50. Moreover, the first
portion 112a of the first substrate 110 is etched to form the
accommodating space 114 which is used to accommodate the electronic
module 52e. Hence, the internal space of the electronic device 50
can be effectively utilized, and, at the same time, it meets the
design trend towards developing thinner electronic device 50.
[0022] Summarily, in the heat dissipation module manufacturing
method, the heat dissipation module, and the electronic device of
the disclosure, the first substrate has a plurality of chambers,
and the electronic modules are simultaneously in contact with the
first portion and the second portion of the first substrate, so the
heat dissipation module has a large heat transfer area to transfer
the heat of the electronic modules, in order to improve the heat
dissipation efficiency of the heat dissipation module and the
electronic device. Moreover, the first portion of the first
substrate is etched to form the accommodating space which is used
to accommodate the electronic module. Hence, the internal space of
the electronic device can be effectively utilized, and, at the same
time, it meets the design trend towards developing thinner
electronic device.
[0023] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
disclosed embodiments without departing from the scope or spirit of
the disclosure. In view of the foregoing, it is intended that the
disclosure cover modifications and variations of this disclosure
provided they fall within the scope of the following claims and
their equivalents.
* * * * *