U.S. patent application number 16/277454 was filed with the patent office on 2020-05-28 for capacitor component and method for manufacturing the same.
The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Seok Keun Ahn, Gi Seok Jeong, Ji Hong Jo, A Reum Jun, Ho In Jun, Hye Won Ryoo, Seon Young Yoo, Ji Hye Yu.
Application Number | 20200168397 16/277454 |
Document ID | / |
Family ID | 68420750 |
Filed Date | 2020-05-28 |
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United States Patent
Application |
20200168397 |
Kind Code |
A1 |
Ryoo; Hye Won ; et
al. |
May 28, 2020 |
CAPACITOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Abstract
A method for manufacturing a capacitor component includes an
operation of sintering under a moderately-or-more reducing
atmosphere for hydrogen, a body in which a plurality of dielectric
layers having internal electrodes printed thereon are laminated,; a
first reoxidation operation of subjecting the sintered body to a
first reoxidation heat treatment under an oxidizing atmosphere; and
a second reoxidation operation of subjecting the body having
undergone the first reoxidation heat treatment to a second
reoxidation heat treatment under an oxidizing atmosphere.
Inventors: |
Ryoo; Hye Won; (Suwon-si,
KR) ; Jo; Ji Hong; (Suwon-si, KR) ; Jun; Ho
In; (Suwon-si, KR) ; Ahn; Seok Keun;
(Suwon-si, KR) ; Yu; Ji Hye; (Suwon-si, KR)
; Jun; A Reum; (Suwon-si, KR) ; Jeong; Gi
Seok; (Suwon-si, KR) ; Yoo; Seon Young;
(Suwon-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Suwon-si |
|
KR |
|
|
Family ID: |
68420750 |
Appl. No.: |
16/277454 |
Filed: |
February 15, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01G 4/232 20130101;
H01G 4/224 20130101; H01G 4/008 20130101; H01G 4/30 20130101; C04B
35/4682 20130101; H01G 4/012 20130101; H01G 4/12 20130101; H01G
4/1227 20130101 |
International
Class: |
H01G 4/12 20060101
H01G004/12; H01G 4/30 20060101 H01G004/30; H01G 4/008 20060101
H01G004/008; C04B 35/468 20060101 C04B035/468 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 22, 2018 |
KR |
10-2018-0145453 |
Claims
1. A method for manufacturing a capacitor component, comprising: an
operation of sintering, under a moderately-or-more reducing
atmosphere for hydrogen, a body in which a plurality of dielectric
layers having internal electrodes printed thereon are laminated; a
first reoxidation operation of subjecting the sintered body to a
first reoxidation heat treatment under an oxidizing atmosphere; and
a second reoxidation operation of subjecting the body having
undergone the first reoxidation heat treatment to a second
reoxidation heat treatment under the oxidizing atmosphere.
2. The method for manufacturing a capacitor component of claim 1,
wherein each of the first and second reoxidation heat treatments is
performed at a temperature of 800-1,200.degree. C.
3. The method for manufacturing a capacitor component of claim 1,
wherein each of the first and second reoxidation heat treatments is
performed for a duration of 8-12 hours.
4. The method for manufacturing a capacitor component of claim 1,
wherein the moderately-or-more reducing atmosphere for hydrogen is
a gas atmosphere in which nitrogen gas (N.sub.2) is mixed with 1%
or more to 2% or less hydrogen gas (H.sub.2).
5. The method for manufacturing a capacitor component of claim 1,
wherein the oxidizing atmosphere is a gas atmosphere in which
nitrogen gas (N.sub.2) is mixed with more than 0% to 0.1% or less
hydrogen gas (H.sub.2), or a gas atmosphere in which nitrogen gas
(N.sub.2) is mixed with more than 0% to 0.01% or less hydrogen gas
(H.sub.2).
6. The method for manufacturing a capacitor component of claim 1,
further comprising an operation of cooling the body having
undergone the first reoxidation heat treatment before the second
reoxidation heat treatment.
7. The method for manufacturing a capacitor component of claim 1,
wherein the operation of sintering is performed at a temperature of
1,000-1,200.degree. C.
8. The method for manufacturing a capacitor component of claim 1,
wherein the operation of sintering is performed at a temperature
higher than temperatures of the first and second re-oxidation heat
treatments.
9. A capacitor component comprising: a body including a dielectric
layer and first and second internal electrodes opposing each other
with the dielectric layer interposed therebetween, and having first
and second surfaces opposing each other, third and fourth surfaces
connected to the first and second surfaces and opposing each other,
and fifth and sixth surfaces connected to the first to fourth
surfaces and opposing each other; and first and second external
electrodes disposed on an outer side of the body and electrically
connected to the first and second internal electrodes,
respectively, wherein the body includes a capacitance forming
portion including the first and second internal electrodes opposing
each other with the dielectric layer interposed therebetween to
form capacitance, cover portions disposed in upper and lower
surfaces of the capacitance forming portion and including a
plurality of pores, and margin portions disposed on side surfaces
of the capacitance forming portion, and 80% or higher of the
plurality of pores are filled with glass, wherein a diameter of
each of the plurality of pores is in the range of 1-2 .mu.m.
10. (canceled)
11. The capacitor component of claim 9, wherein the glass includes
at least one selected from silicon oxide, aluminum oxide, and
complex oxides thereof.
12. The capacitor component of claim 9, wherein the cover portions
have a hardness of 1,000 kgf/mm.sup.2 or more.
13. (canceled)
14. The capacitor component of claim 9, wherein a thickness of each
of the first and second internal electrodes is less than 1 .mu.m,
and a thickness of the dielectric layer is less than 2.8 .mu.m.
15. The capacitor component of claim 9, wherein the relationship of
td>2* te is satisfied, where "te" is a thickness of each of the
first and second internal electrodes, and "td" is a thickness of
the dielectric layer.
16. The capacitor component of claim 9, wherein each of the first
and second external electrodes includes an electrode layer and a
conductive resin layer disposed on the electrode layer.
17. The capacitor component of claim 16, wherein the electrode
layer includes glass and at least one conductive metal selected
from a group consisting of copper (Cu), silver (Ag), nickel (Ni),
and alloys thereof.
18. The capacitor component of claim 16, wherein the conductive
resin layer includes a base resin and at least one conductive metal
selected from a group consisting of copper (Cu), silver (Ag),
nickel (Ni), and alloys thereof.
19. The capacitor component of claim 16, wherein the first external
electrode is disposed on the third surface and includes a band
portion extending to portions of the first and second surfaces, and
a distance from the third surface to an end of a band portion of
the electrode layer is smaller than a distance from the third
surface to an end of a band portion of the conductive resin
layer.
20. The capacitor component of claim 16, wherein each of the first
and second external electrodes further includes a Ni-plated layer
disposed on the conductive resin layer, and a Sn-plated layer
disposed on the Ni-plated layer.
21. The capacitor component of claim 9, wherein 90% or higher of
the plurality of pores are filled with the glass.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of priority to Korean
Patent Application No. 10-2018-0145453 filed on Nov. 22, 2018 in
the Korean Intellectual Property Office, the disclosure of which is
incorporated herein by reference in its entirety.
TECHNICAL FIELD
[0002] The present disclosure relates to a capacitor component and
a method for manufacturing the same.
BACKGROUND
[0003] Amultilayer ceramic capacitor is a chip-type condenser
mounted on the printed circuit boards of a variety of electronic
products such as image display devices, including liquid crystal
displays (LCDs), plasma display panels (PDPs), and the like,
computers, smartphones, mobile phones, and the like, serving to
charge or discharge electricity.
[0004] Such a multilayer ceramic capacitor may be used as a
component of various electronic devices as it is relatively small
in size, and is able to secure high capacitance and convenient to
install. As electronic devices such as computers and mobile devices
are becoming increasingly miniaturized and increased in power,
there has been increased demand for a multilayer ceramic capacitor
having a compact size and high capacitance.
[0005] Further, as there has been increasing interest in vehicle
components in related industries, multilayer ceramic capacitors are
increasingly required to have high reliability and high strength
characteristics in order to be used in vehicles or infotainment
systems.
[0006] In the above context, to achieve high capacitance
characteristics and reliable temperature coefficient of capacitance
(TCC) characteristics, sintering may be performed under a
moderately-or-more reducing atmosphere for hydrogen, rather than
under mildly reducing sintering conditions commonly used in
conventional manufacturing processes. However, as sintering is
performed under a moderately-or-more reducing atmosphere for
hydrogen, a large quantity of oxygen vacancies may be formed inside
dielectric layers, thus causing an undesirable decrease in
reliability.
SUMMARY
[0007] An aspect of the present disclosure is to provide a
capacitor component having excellent reliability and a method for
manufacturing the same.
[0008] According to an aspect of the present disclosure, a method
for manufacturing a capacitor component includes an operation of
sintering a body in which a plurality of dielectric layers having
internal electrodes printed thereon are laminated, under a
moderately-or-more reducing atmosphere for hydrogen; a first
reoxidation operation of subjecting the sintered body to a first
reoxidation heat treatment under an oxidizing atmosphere; and a
second reoxidation operation of subjecting the body having
undergone the first reoxidation heat treatment to a second
reoxidation heat treatment under the oxidizing atmosphere.
[0009] According to another aspect of the present disclosure, a
multilayer ceramic capacitor includes: a body including a
dielectric layer and first and second internal electrodes opposing
each other with the dielectric layer interposed therebetween, and
having first and second surfaces opposing each other, third and
fourth surfaces connected to the first and second surfaces and
opposing each other, and fifth and sixth surfaces connected to the
first to fourth surfaces and opposing each other; and first and
second external electrodes disposed on an outer side of the body
and electrically connected to the first and second internal
electrodes, respectively. The body includes a capacitance forming
portion including the first and second internal electrodes opposing
each other with the dielectric layer interposed therebetween to
form capacitance, cover portions disposed in upper and lower
surfaces of the capacitance forming portion and including a
plurality of pores, and margin portions disposed on side surfaces
of the capacitance forming portion, and a substantial portion of
the plurality of pores are filled with glass.
BRIEF DESCRIPTION OF DRAWINGS
[0010] The above and other aspects, features, and advantages of the
present disclosure will be more clearly understood from the
following detailed description, taken in conjunction with the
accompanying drawings, in which:
[0011] FIG. 1 is a schematic graph illustrating a heat treatment
process for a body according to an exemplary embodiment in the
present disclosure;
[0012] FIG. 2 illustrates the change in oxygen vacancy before a
first reoxidation operation and after a second reoxidation
operation;
[0013] FIG. 3 illustrates the change in pores before a first
reoxidation operation and after a second reoxidation operation;
[0014] FIG. 4 is a graph showing changes in hardness in accordance
with the number of reoxidation operations performed;
[0015] FIG. 5 is a graph showing the pore frequency in a cover
portion in accordance with the number of reoxidation operations
performed;
[0016] FIG. 6 is a schematic perspective view of a capacitor
component according to another exemplary embodiment in the present
disclosure;
[0017] FIG. 7 is a schematic cross-sectional view of the capacitor
component taken along line I-I' in FIG. 6;
[0018] FIG. 8 is a schematic cross-sectional view of the capacitor
component taken along line II-II' in FIG. 6;
[0019] FIG. 9A illustrates a ceramic green sheet in which a first
internal electrode is printed on a dielectric layer;
[0020] FIG. 9B illustrates a ceramic green sheet in which a second
internal electrode is printed on a dielectric layer;
[0021] FIG. 10 is an enlarged view of region P1 shown in FIG.
7;
[0022] FIG. 11 is an enlarged view of region P2 shown in FIG. 7;
and
[0023] FIG. 12 is an enlarged view of region P3 shown in FIG.
10.
DETAILED DESCRIPTION
[0024] Hereinafter, embodiments of the present disclosure will be
described in detail with reference to the accompanying drawings.
The embodiments of the present disclosure may, however, be modified
in many different forms, and accordingly, the scope of the present
disclosure should not be construed as being limited to the
embodiments set forth herein. Rather, these embodiments are
provided to provide thorough understanding to those skilled in the
art. Accordingly, in the drawings, the shapes and dimensions of
elements maybe exaggerated for clarity, and the same reference
numerals will be used throughout to designate the same or like
elements.
[0025] Further, in the drawings, irrelevant descriptions will be
omitted to clearly describe the present disclosure, and to clearly
express a plurality of layers and areas, thicknesses may be
magnified. Elements having the same function within the scope of
the same concept will be described with use of the same reference
numeral. Further, throughout the specification, it will be
understood that when a part "includes" an element, it may further
include another element, not excluding another element, unless
otherwise indicated.
[0026] In the drawings, an X direction may be defined as a second
direction, an L direction, or a length direction, a Y direction as
a third direction, a W direction, or a width direction, and a Z
direction as a first direction, a laminating direction, a T
direction, or a thickness direction.
[0027] Hereinbelow, a method for manufacturing a capacitor
component according to an exemplary embodiment in the present
disclosure will be described, and subsequently, a capacitor
component according to an exemplary embodiment in the present
disclosure will be described.
[0028] Method for Manufacturing Capacitor Component
[0029] FIG. 1 is a schematic graph showing a heat treatment process
for a body according to an exemplary embodiment.
[0030] Referring to FIG. 1, the method for manufacturing a
capacitor component according to the exemplary embodiment includes:
an operation of sintering a body in which a plurality of dielectric
layers having internal electrodes printed thereon are laminated,
under a reducing atmosphere; a first reoxidation operation of
subjecting the sintered body to a first reoxidation heat treatment
under an oxidizing atmosphere; and a second reoxidation operation
of subjecting the body having undergone the first reoxidation heat
treatment to a second reoxidation heat treatment under an oxidizing
atmosphere.
[0031] In addition, prior to the operation of sintering a body, an
operation of preparing a body may be performed.
[0032] The operation of preparing a body may involve preparing a
conductive paste for an internal electrode, which contains a metal
powder, a ceramic powder, and a binding resin.
[0033] The metal powder may include silver (Ag) , lead (Pb),
platinum (Pt), nickel (Ni), copper (Cu), or the like. For example,
of the aforementioned metal powders, only one kind may be used
singly or two or more kinds may be used in combination without
being limited thereto.
[0034] In addition, the metal powder may have a different particle
size according to exemplary embodiments. For example, the metal
powder may have a particle size of 50-400 nm.
[0035] The method for dispersing the metal powder in the conductive
paste is not limited to any particular method. For example, the
metal powder may be dispersed in a conductive paste composition by
using a 3-roll mill.
[0036] The resin is not limited to any particular material. For
example, the resin may include at least one of polyvinyl butyral
(PVB) and ethyl cellulose (EC), or a mixture thereof.
[0037] The ceramic powder is not limited to any particular material
as long as it is for controlling the sintering shrinkage of metal
powder. For example, the ceramic powder may be at least one
selected from the group consisting of BaTiO.sub.3, Ba(TiZr)O.sub.3,
CaZrO.sub.3, and SrZrO.sub.3.
[0038] The method for dispersing the ceramic powder in the
conductive paste is not limited to any particular method. For
example, the ceramic powder may be dispersed in the conductive
paste by using a beads mill.
[0039] The ceramic powder may have a different particle size
according to exemplary embodiments. For example, the ceramic powder
may have an average particle size of 10-200 nm.
[0040] The particle size of the ceramic powder may be determined
proportionally to the particle size of the metal powder, and may be
preferably in the range of 10-200 nm as described above.
[0041] Subsequently, a plurality of green sheets may be
prepared.
[0042] The ceramic green sheet may be prepared by mixing a ceramic
powder, a binder, and a solvent to prepare a slurry, and then,
forming the slurry into a sheet type having several micrometers by
a doctor blade method.
[0043] Subsequently, an internal electrode may be formed by
applying the conductive paste onto the green sheet.
[0044] Once the internal electrode is formed as described above,
the green sheet may be separated from a carrier film, and then, a
plurality of the green sheets may be laminated one on top of the
other to form a laminate.
[0045] Thereafter, the laminate of green sheets may be compressed
under high temperature and high pressure, and the compressed sheet
laminate may be cut in a predetermined size through a cutting
process to produce a body.
[0046] When the compression is performed, a compression pressure
may be preferably set to 500-1,300 kgf/cm.sup.2.
[0047] Sintering Operation
[0048] Next, a sintering operation may be performed to sinter a
body in which a plurality of dielectric layers having internal
electrodes printed thereon are laminated, under a
moderately-or-more reducing atmosphere for hydrogen.
[0049] The reducing atmosphere refers to a gas atmosphere capable
of reducing oxides, and may be classified into a strongly reducing
atmosphere, a moderately reducing atmosphere, and a mildly reducing
atmosphere, depending on the reducing power of the atmosphere.
[0050] When the sintering operation is performed under a reducing
atmosphere, oxygen vacancies maybe formed, which gain mobility
under high-temperature conditions where an electric field is
transferred, thus causing degradation in reliability of the
capacitor component.
[0051] In particular, the oxygen vacancies, as illustrated on the
left in FIG. 2, refer to empty pores formed in the positions of
oxygen atoms.
[0052] Since capacitor components for vehicles are required to have
high capacitance and high reliability, the sintering operation has
been performed under a moderately-or-more reducing atmosphere for
hydrogen, not under mildly reducing sintering conditions often used
in conventional manufacturing processes, in order to achieve high
capacitance characteristics and reliable temperature coefficient of
capacitance (TCC) characteristics.
[0053] However, when the sintering operation is performed under a
moderately-or-more reducing atmosphere for hydrogen, a larger
quantity of oxygen vacancies may be formed inside dielectric layers
compared to under mildly reducing sintering conditions, thus giving
rise to issues including an undesirable decrease in reliability and
the like.
[0054] Conventionally, a reoxidation process was performed to
reduce the quantity of oxygen vacancies, however, as the sintering
operation is performed under a moderately-or-more reducing
atmosphere for hydrogen, a large quantity of oxygen vacancies is
formed inside dielectric layers. Thus, it may be difficult to
reduce the quantity of oxygen vacancies to a level that would not
adversely affect reliability only through a conventional
reoxidation process.
[0055] However, as will be described below, the quantity of oxygen
vacancies may be significantly reduced through controlling the
conditions of the reoxidation process.
[0056] In detail, the moderately-or-more reducing atmosphere for
hydrogen may be a gas atmosphere in which nitrogen gas (N.sub.2) is
mixed with 1% or more to 2% or less hydrogen gas (H.sub.2).
[0057] In general, a sintering time (hs) for the body may widely
vary from one hour to 30 hours, and may further vary depending on
the capacitance, the ceramic composition, the composition of
internal electrodes, and the like. Therefore, the sintering time
(hs) is not limited to any particular duration.
[0058] The sintering temperature (T.sub.s) is not limited to any
particular temperature, however, the sintering operation may be
performed at a temperature higher than first and second reoxidation
temperatures, which will be described below. For example, the
sintering temperature (T.sub.s) may be in the range of
1,000-1,200.degree. C.
[0059] Reoxidation Operation
[0060] A reoxidation operation according to the present disclosure
includes a first reoxidation operation of subjecting the sintered
body to a first reoxidation heat treatment under an oxidizing
atmosphere, and a second reoxidation operation of subjecting the
body having undergone the first reoxidation operation to a second
reoxidation heat treatment under an oxidizing atmosphere.
[0061] FIG. 2 illustrates the change in oxygen vacancy before a
first reoxidation operation and after a second reoxidation
operation.
[0062] As described above, since the sintering operation according
to the present disclosure is performed under a moderately-or-more
reducing atmosphere for hydrogen, a large quantity of oxygen
vacancies may be formed. However, once the first and second
reoxidation operations according to the present disclosure are
performed, the oxygen vacancies are filled as illustrated in FIG.
2, significantly reducing the quantity of oxygen vacancies.
[0063] FIG. 3 illustrates changes in pores before the first
reoxidation operation and after the second reoxidation operation.
FIG. 3 may be an enlarged view of a cover portion 112 adjacent to a
band portion B of an external electrode, or may be an enlarged view
of region P3 shown in FIG. 10.
[0064] A plurality of pores 11c may be present before the first
reoxidation operation, however, once the first and second
reoxidation operations are performed according to the present
disclosure, due to movement of glass 11d occurring at a reoxidation
temperature, the glass 11d may fill the plurality of pores 11c
present in cover portions 112 and 113 of the body.
[0065] Accordingly, the hardness of the body may be improved, and
paths through which a plating liquid or humidity could permeate may
be reduced, and thus, reliability may be improved.
[0066] In particular, the glass 11d may include at least one
selected from a silicon oxide, an aluminum oxide, and a complex
oxide thereof.
[0067] FIG. 4 is a graph showing changes in hardness of a cover
portion in accordance with the number of reoxidation operations
performed.
[0068] FIG. 5 is a graph showing pore frequency in a cover portion
in accordance with the number of reoxidation operations
performed.
[0069] Referring to FIG. 4 and FIG. 5, a binder was additionally
added in Sample 2 to secure a higher hardness than that of Sample
1, and each of the reoxidation heat treatments was performed at
1,060.degree. C. for 10 hours under an oxidizing atmosphere.
[0070] Referring to FIG. 4, twenty samples were prepared for each
Sample, and changes in hardness were observed while increasing the
number of reoxidation operations performed. It was observed that
when the reoxidation operation was performed twice, the mean value
of hardness had increased, while deviations in hardness had
decreased.
[0071] Referring to FIG. 5, after five points were arbitrarily
selected from the cover portion of the body, frequency of the pores
having a diameter of 1-2 .mu.m was observed in areas having the
size of 17 .mu.m*22.6 .mu.m. Changes in pore frequency were
observed while increasing the number of reoxidation operations
performed. It was observed that the pore frequency had decreased
when the reoxidation operation was performed twice, where the pore
frequency was measured as the number of empty pores not filled with
the glass 11d.
[0072] Also, when a percentage of the pores filled with the glass
11d, with respect to the total number of pores having a diameter of
1-2 .mu.m, was analyzed, the percentage of such pores in Sample 1
subjected to the reoxidation operation twice, was 81%, and the
percentage of such pores in Sample 2 subjected to the reoxidation
operation twice, was 94%.
[0073] Also, it was observed that even when the reoxidation
operation was performed three times, changes in hardness or pore
frequency were negligible compared to when the reoxidation
operation was performed twice. Accordingly, performing the
reoxidation operation twice may be both economical and
efficient.
[0074] In detail, each of first and second reoxidation heat
treatment temperatures T1 and T2 may be in the range of
800-1,200.degree. C.
[0075] At a temperature below 800.degree. C., the glass may have
insufficient mobility, resulting in insufficient filling of the
pores in the cover portions and the margin portions.
[0076] The reoxidation heat treatment temperature higher than a
sintering temperature of the previous step may be in an
oversintering region, which may cause degradations in properties,
such as a decrease in IR (Insulation Resistance) or dielectric
breakdown voltage, and the like. Since the sintering temperature
generally does not exceed 1,200.degree. C., the upper limit of the
sintering temperature may be limited to 1,200.degree. C. or
less.
[0077] Also, maintaining times h1 and h2 for the first and second
reoxidation heat treatments are not limited to any particular
duration. For example, each of the first and second reoxidation
heat treatments may be performed for a duration of 8-12 hours.
[0078] Also, the oxidizing atmosphere may be a gas atmosphere in
which nitrogen gas (N.sub.2) is mixed with more than 0% to 0.1% or
less hydrogen gas (H.sub.2) , or a gas atmosphere in which nitrogen
gas (N.sub.2) is mixed with more than 0% to 0.01% or less oxygen
gas (O.sub.2).
[0079] Hydrogen gas and oxygen gas may be used for the purpose of
controlling the oxygen partial pressure inside a heat treatment
furnace when the heat treatments are performed.
[0080] Hydrogen gas may be introduced for the purpose of
suppressing oxidation of internal electrodes, whereas oxygen gas
may be introduced more for the purpose of filling oxygen
vacancies.
[0081] In general, when the hydrogen gas is introduced in an amount
of 0.1%, the oxygen partial pressure may be in the range of
10.sup.-12-10.sup.-14 atm (where the atmospheric pressure is 1
atm).
[0082] The oxygen partial pressure may change in accordance with
the pressure of steam introduced together.
[0083] In addition, before the second reoxidation heat treatment is
performed, an operation of cooling a body having undergone the
first reoxidation heat treatment may be further comprised.
[0084] Capacitor Component
[0085] FIG. 6 is a schematic perspective view of a capacitor
component according to another exemplary embodiment in the present
disclosure.
[0086] FIG. 7 is a schematic cross-sectional view of the capacitor
component taken along line I-I' shown in FIG. 6.
[0087] FIG. 8 is a schematic cross-sectional view of the capacitor
component taken along line II-II' shown in FIG. 6.
[0088] FIG. 9A illustrates a ceramic green sheet in which a first
internal electrode is printed on a dielectric layer, and FIG. 9B
illustrates a ceramic green sheet in which a second internal
electrode is printed on a dielectric layer.
[0089] FIG. 10 is an enlarged view of region P1 shown in FIG.
7.
[0090] FIG. 11 is an enlarged view of region P2 shown in FIG.
7.
[0091] A capacitor component according to another exemplary
embodiment will be described in detail with reference to FIGS. 6
through 11.
[0092] The capacitor component according to another exemplary
embodiment maybe manufactured by the method for manufacturing a
capacitor component according to the above-described exemplary
embodiment.
[0093] According to another exemplary embodiment in the present
disclosure, a capacitor component 100 includes: a body 110
including a dielectric layer 111 and first and second internal
electrodes 121 and 122 opposing each other with the dielectric
layer interposed therebetween, and having first and second surfaces
1 and 2 opposing each other, third and fourth surfaces 3 and 4
connected to the first and second surfaces and opposing each other,
and fifth and sixth surfaces 5 and 6 connected to the first to
fourth surfaces and opposing each other; and first and second
external electrodes 131 and 132 disposed on an outer side of the
body 110 and connected to the first and second internal electrodes
121 and 122, respectively, wherein the body 110 includes a
capacitance forming portion A including the first and second
internal electrodes 121 and 122 opposing each other with the
dielectric layer 111 interposed therebetween to form capacitance,
cover portions 112 and 113 disposed in upper and lower portions of
the capacitance forming portion and including a plurality of pores
11c, and margin portions 114 and 115 disposed on side surfaces of
the capacitance forming portion, and a substantial portion of the
plurality of pores 11c are filled with glass 11d.
[0094] In the body 110, the dielectric layer 111 and the internal
electrodes 121 and 122 may be alternately laminated.
[0095] The shape of the body 110 is not limited to any particular
shape, but as illustrated, the body 110 may have a hexahedron shape
or a shape similar thereto. Due to shrinkage of a ceramic powder
contained in the body 110 during a sintering process, the body 110
may not be an exact hexahedron with completely straight lines, but
may have a substantially hexahedron shape.
[0096] The body 110 may have first and second surfaces 1 and 2
opposing each other in a thickness direction (a Z direction), third
and fourth surfaces 3 and 4 connected to the first and second
surfaces 1 and 2 and opposing each other in a length direction (an
X direction) , and fifth and sixth surfaces 5 and 6 connected to
the first and second surfaces 1 and 2, connected to the third and
fourth surfaces 3 and 4, and opposing each other in a width
direction (a Y direction).
[0097] A plurality of dielectric layers 111 forming the body 110
may be in a sintered state and may be integrated with one another
such that boundaries between adjacent dielectric layers 111 are
difficult to identify without using a scanning electron microscope
(SEM).
[0098] According to the exemplary embodiment, the material forming
the dielectric layer 111 is not limited to any particular material
as long as sufficient capacitance can be obtained therefrom. For
example, as the material forming the dielectric layer 111, a barium
titanate-based material, a lead composite perovskite-based
material, or a strontium titanate-based material may be used.
[0099] As the material forming the dielectric layer 111, various
ceramic additives, organic solvents, plasticizers, binders,
dispersing agents, or the like, maybe added to powder particles
such as barium titanate (BaTiO.sub.3) powder particles or the like,
according to the purpose of the present disclosure.
[0100] A plurality of internal electrodes 121 and 122 may be
disposed opposing each other with the dielectric layer 111
interposed therebetween.
[0101] The internal electrodes 121 and 122 may include first and
second internal electrodes 121 and 122 alternately disposed while
opposing each other with the dielectric layer 111 interposed
therebetween.
[0102] The first and second internal electrodes 121 and 122 may be
exposed to the third and fourth surfaces 3 and 4 of the body 110,
respectively.
[0103] Referring to FIG. 7 and FIG. 8, the first internal electrode
121 may be spaced apart from the fourth surface 4 and exposed
through the third surface 3, and the second internal electrode 122
may be spaced apart from the third surface 3 and exposed through
the fourth surface 4. The first external electrode 131 maybe
disposed on the third surface 3 of the body 110 and connected to
the first internal electrode 121, and the second external electrode
132 may be disposed on the fourth surface 4 of the body 110 and
connected to the second internal electrode 122.
[0104] The first and second internal electrodes 121 and 122 may be
electrically insulated from each other by the dielectric layer 111
interposed therebetween. The body 110 may be formed by alternately
laminating in a thickness direction (a Z direction) a ceramic green
sheet of FIG. 9A, having a first internal electrode 121 printed on
a dielectric layer 111, and a ceramic green sheet of FIG. 9B,
having a second internal electrode 122 printed on a dielectric
layer 111, and sintering the laminated ceramic green sheets of
FIGS. 9a and 9b.
[0105] A printing method of the conductive paste may be a screen
printing method, a gravure printing method, or the like, but is not
limited thereto.
[0106] A capacitor component 100 according to an exemplary
embodiment may include a capacitance forming portion A disposed
inside the body 110 and including a first internal electrode 121
and a second internal electrode 122 opposing each other with the
dielectric layer 111 interposed therebetween to form capacitance,
cover portions 112 and 113 disposed in upper and lower portions of
the capacitance forming portion A, and margin portions 114 and 115
disposed on side surfaces of the capacitance forming portion A.
[0107] The capacitance forming portion A contributes to forming the
capacitance of a capacitor, and may be formed by repeatedly
laminating a plurality of first and second internal electrodes 121
and 122 with a dielectric layer 111 disposed therebetween.
[0108] The upper cover portion 112 and the lower cover portion 113
may be formed by laminating a single dielectric layer, or two or
more dielectric layers on upper and lower surfaces of the
capacitance forming portion A in upward and downward directions,
respectively, and may serve to basically protect the internal
electrodes from being damaged by physical or chemical stress.
[0109] The upper cover portion 112 and the lower cover portion 113
may not include internal electrodes, and may contain the same
material as the dielectric layer 111.
[0110] In detail, as the material forming the upper cover portion
112 and the lower cover portion 113, various ceramic additives,
organic solvents, plasticizers, binders, dispersing agents, or the
like, maybe added to powder particles such as barium titanate
(BaTiO.sub.3) powder particles and the like, according to the
purpose of the present disclosure.
[0111] FIG. 12 is an enlarged view of region P3 shown in FIG. 10,
which is a cover portion 112 adjacent to a band portion B of an
external electrode.
[0112] Referring to FIG. 12, the cover portions 112 and 113 may
include a plurality of pores 11c, and a substantial portion (e.g.,
80% or higher) of the plurality of pores 11c may be filled with
glass 11d. More preferably, 90% or more of the plurality of pores
11c may be filled with the glass 11d.
[0113] In addition, the cover portions 112 and 113 may include a
plurality of dielectric grains 11a and dielectric grain boundaries
lib, and the plurality of pores 11c may be included in the
dielectric grain boundaries.
[0114] When 80% or higher of the plurality of pores 11c are filled
with the glass 11d, hardness may be improved, and paths through
which a plating liquid or humidity could permeate may be reduced,
and thus, reliability may be improved.
[0115] First and second oxidation operations maybe performed
according to the method described above to fill 80% or higher of a
total number of the plurality of pores 11c with the glass 11d.
[0116] For example, a diameter of each of the pores 11c may be in
the range of 1 to 2 .mu.m.
[0117] In addition, a hardness of the cover portions 112 and 113 is
not limited to any particular value since the hardness may vary
depending on additives, binders, or the like, contained therein.
However, referring to FIG. 4, when the first and second reoxidation
operations were performed according to the method described above,
such as in Sample 2, the cover portions 112 and 113 could achieve
hardness equal to, or even greater than, 1,000 kgf/mm.sup.2.
[0118] The margin portions 114 and 115 may include a margin portion
114 disposed on the sixth surface 6 of the body 110, and a margin
portion 115 disposed on the fifth surface 5 of the body 110.
[0119] In particular, the margin portions 114 and 115 may be
disposed on both side surfaces of the body 110 in a width
direction.
[0120] In a cross-section of the body 110 cut in a width-thickness
(W-T) direction, as illustrated in FIG. 8, the margin portions 114
and 115 refer to regions disposed between both ends of the first
and second internal electrodes 121 and 122 and outer surfaces of
the body 110.
[0121] The margin portions 114 and 115 may serve to basically
protect the internal electrodes 121 and 122 from being damaged by
physical or chemical stress.
[0122] The external electrodes 131 and 132 may be disposed on an
outer side of the body 110 and connected to the first and second
internal electrodes 121 and 122. As illustrated in FIG. 7, the
external electrodes 131 and 132 may include a first external
electrode 131 connected to a first internal electrode 121, and a
second external electrode 132 connected to a second internal
electrode 122.
[0123] The first and second external electrodes 131 and 132 may be
electrically connected to the first and second internal electrodes
121 and 122, respectively, to form capacitance, and the second
external electrode 132 may be connected to an electric potential
different from an electric potential of the first external
electrode 131.
[0124] The external electrodes 131 and 132 may include electrode
layers 131a and 132a connected to the internal electrodes 121 and
122, and conductive resin layers 131b and 132b disposed on the
electrode layers 131a and 132a.
[0125] Further, the external electrodes 131 and 132 may include
Ni-plated layers disposed on the conductive resin layers 131b and
132b, and Sn-plated layers 131d and 132d disposed on the Ni-plated
layers 131b and 132b.
[0126] When the external electrodes 131 and 132 include the first
external electrode 131 and the second external electrode 132, the
external electrode 131 may include a first electrode layer 131a, a
first conductive resin layer 131b, a first Ni-plated layer 131c,
and a first Sn-plated layer 131d, and the second external electrode
132 may include a second electrode layer 132a, a second conductive
resin layer 132b, a first Ni-plated layer 132c, and a first
Sn-plated layer 132d.
[0127] The electrode layers 131a and 132a may include a conductive
metal and glass.
[0128] The conductive metal used for the electrode layers 131a and
132a is not limited to any particular material as long as it can be
electrically connected to the internal electrodes 121 and 122 to
form capacitance. For example, the conductive metal may be at least
one selected from the group consisting of copper (Cu), silver (Ag),
nickel (Ni), and alloys thereof.
[0129] The electrode layers 131a and 132a may be formed by adding
glass frits to the conductive metal powder to prepare a conductive
paste, and applying and sintering the conductive paste.
[0130] The conductive resin layers 131b and 132b maybe formed on
the electrode layers 131a and 132a, and may be formed in a shape
that completely covers the electrode layers 131a and 132a.
[0131] The conductive resin layers 131b and 132b may include a
conductive metal and a base resin.
[0132] The base resin contained in the conductive resin layers 131b
and 132b is not limited to any particular material as long as it
has bonding properties and shock absorption abilities, and forms
paste when mixed with a conductive metal powder. For example, the
base resin may include an epoxy-based resin.
[0133] The conductive metal included in the conductive resin layers
131b and 132b is not limited to any particular material as long as
it can be electrically connected to the electrode layers 131a and
132a. For example, the conductive metal may include at least one
selected from the group consisting of copper (Cu), silver (Ag),
nickel (Ni), and alloys thereof.
[0134] The Ni-plated layers 131c and 132c may be formed on the
conductive resin layers 131b and 132b, and may be formed in a shape
that completely covers the conductive resin layers 131b and
132b.
[0135] The Sn-plated layers 131d and 132d may be formed on the
Ni-plated layers 131c and 132c, respectively, and may be formed in
a shape that completely covers the Ni-plated layers 131c and 132c,
respectively.
[0136] The Sn-plated layers 131d and 132d may serve to improve
mounting characteristics.
[0137] The first external electrode 131 may include a connection
portion C disposed on the third surface of the body 110 and a band
portion B extending from the connection portion C to portions of
the first and second surfaces. Similarly, the second external
electrode 132 may include a connection portion disposed on the
fourth surface of the body 110 and a band portion extending from
the connection portion to portions of the first and second
surfaces.
[0138] In particular, the band portion B may extend not only to the
portions of the first and second surfaces 1 and 2, but also to
portions of the fifth and sixth surfaces 5 and 6 from the
connection portion C.
[0139] Referring to FIG. 10, of the first external electrode 131, a
distance l1 from the third surface 3 of the body 110 to an end of
the band portion B of the first electrode layer 131a may be shorter
than a distance l2 from the third surface 3 of the body 110 to an
end of the band portion B of the first conductive resin layer
131b.
[0140] Similarly, of the second external electrode 132, a distance
from the fourth surface 4 of the body 110 to an end of the band
portion B of the second electrode layer 132a may be shorter than a
distance from the fourth surface 4 of the body 110 to an end of the
band portion B of the second conductive resin layer 132b.
[0141] Accordingly, the conductive resin layers 131b and 132b may
be formed in a shape that completely covers the electrode layers
131a and 132a, and may improve bending strength characteristics and
bonding strength between the external electrodes and the body.
[0142] Referring to FIG. 11, a capacitor component according to
another exemplary embodiment may satisfy td>2*te, where td is a
thickness of the dielectric layer 111, and te is a thickness of
each of the internal electrodes 121 and 122.
[0143] According to another exemplary embodiment, the thickness td
of the dielectric layer 111 may be twice the thickness te of each
of the internal electrodes 121 and 122.
[0144] In general, high-voltage vehicle electronic components tend
to suffer reliability issues caused by a decrease in dielectric
breakdown voltage in a high-voltage environment.
[0145] A capacitor component according to another exemplary
embodiment may have improved dielectric breakdown voltage
characteristics by setting the thickness td of the dielectric layer
111 to be more than twice the thickness te of each of the internal
electrodes 121 and 122 to prevent a decrease in dielectric
breakdown voltage in a high-voltage environment, thereby increasing
the thickness of the dielectric layer, which corresponds to a
distance between the internal electrodes.
[0146] When the thickness td of the dielectric layer 111 is twice
or less than the thickness te of each of the internal electrodes
121 and 122, the thickness of the dielectric layer may be too
small, thus causing an undesirable decrease in dielectric breakdown
voltage.
[0147] For example, the thickness te of the internal electrode may
be less than 1 .mu.m, and the thickness td of the dielectric layer
may be less than 2.8 .mu.m, without being limited thereto.
[0148] As set forth above, according to an exemplary embodiment in
the present disclosure, conditions of a reoxidation process may be
controlled to significantly reduce the quantity of oxygen
vacancies, significantly lower the number of pores present in cover
portions by filling the pores with glass, and achieve a highly
densified microstructure.
[0149] Accordingly, the reliability of a multilayer ceramic
capacitor may be improved, and the hardness of the cover portions
may be increased.
[0150] While the exemplary embodiments have been shown and
described above in detail, the present invention is not limited by
the above-described exemplary embodiments and accompanying
drawings, but by the appended claims. Accordingly, it will be
apparent to those skilled in the art that modifications and
variations could be made without departing from the scope of the
present invention as defined by the appended claims.
* * * * *