U.S. patent application number 16/075111 was filed with the patent office on 2020-05-28 for heat exchanging device.
The applicant listed for this patent is Jongsoo LIM. Invention is credited to Jongsoo LIM.
Application Number | 20200166292 16/075111 |
Document ID | / |
Family ID | 56712121 |
Filed Date | 2020-05-28 |
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United States Patent
Application |
20200166292 |
Kind Code |
A1 |
LIM; Jongsoo |
May 28, 2020 |
HEAT EXCHANGING DEVICE
Abstract
A heat exchanging device includes a fluid
distribution/integration part for distributing/integrating fluid
flowing in or out; a fluid pipeline plate coupled to the fluid
distribution/integration part and in which a fluid pipeline is
formed such that at least one pipeline is branched into a plurality
of pipelines on the basis of a flow rate per unit area in a
plurality of plates, and each of the branched pipelines is
re-branched in at least one or more stages on the basis of the flow
rate per unit area; and a micro-pipeline plate including a pipeline
in a straight direction, which corresponds to each of the pipelines
branched in a final step of the fluid pipeline plate in the
plurality of plates. The fluid distribution/integration part and
the fluid pipeline plate are characterized by being formed
symmetrically with respect to the micro-pipeline plate.
Inventors: |
LIM; Jongsoo; (Seoul,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LIM; Jongsoo |
Seoul |
|
KR |
|
|
Family ID: |
56712121 |
Appl. No.: |
16/075111 |
Filed: |
January 18, 2017 |
PCT Filed: |
January 18, 2017 |
PCT NO: |
PCT/KR2017/000587 |
371 Date: |
August 2, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 3/00 20130101; B29C
67/00 20130101; F28F 9/16 20130101; F28F 2275/04 20130101; F28D
9/00 20130101 |
International
Class: |
F28F 3/00 20060101
F28F003/00; F28D 9/00 20060101 F28D009/00; F28F 9/16 20060101
F28F009/16 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 3, 2016 |
KR |
10-2016-0013512 |
Claims
1. A heat exchange device comprising: fluid
distribution/integration units configured to distribute or
integrate a fluid to be introduced or discharged; fluid pipeline
plates coupled to the fluid distribution/integration units, and
having fluid pipelines formed in a plurality of plates such that at
least one pipeline is branched into a plurality pipelines based on
a flow rate per unit area, and that each branched pipeline is
re-branched in at least one stage based on a flow rate per unit
area; intermediate pipeline plates having intermediate fluid
pipelines formed such that pipelines are formed in a plurality of
plates to correspond to the respective pipelines branched by a
final stage of the fluid pipeline plates, and that each pipeline is
branched into a plurality of pipelines in at least one stage based
on a flow rate per unit area; and a micro-pipeline plate having
pipelines linearly formed in a plurality of plates to correspond to
the respective pipelines branched by a final stage of the
intermediate pipeline plates, wherein the fluid
distribution/integration units, the fluid pipeline plates, and the
intermediate pipeline plates are formed symmetrically with respect
to the micro-pipeline plate.
2. The heat exchange device of claim 1, wherein the fluid pipeline
plates, the micro-pipeline plate, and the intermediate pipeline
plates take the form of a plate in which convex surfaces and
concave surfaces are repeated to predetermined depth and width.
3. The heat exchange device of claim 1, wherein a plurality of
ignition points are formed in the micro-pipeline plate or the
intermediate pipeline plate on a lower side with respect to the
micro-pipeline plate.
4. The heat exchange device of claim 1, wherein, in the fluid
pipeline plates and the intermediate pipeline plates, each pipeline
is branched into a ratio of 1:2 or 1:3.
5. The heat exchange device of claim 1, wherein circular pipelines
are formed in the fluid pipeline plates by die casting or cutting,
and pipelines are formed in the intermediate pipeline plates and
the micro-pipeline plate by etching.
6. The heat exchange device of claim 1, wherein the fluid pipeline
plates, the intermediate pipeline plates, and the micro-pipeline
plate are configured such that two plates with pipelines installed
therein are adhered to each other by brazing or soldering.
7. The heat exchange device of claim 1, wherein the fluid pipeline
plates and the intermediate pipeline plates are configured such
that a plurality of layers are coupled to each other according to
stages into which each pipeline is branched.
8. The heat exchange device of claim 1, wherein each of the fluid
pipeline plates, the micro-pipeline plate, and the intermediate
pipeline plates is formed as flat plates, the flat plates being
coupled to each other, and at least one heating wire is
horizontally installed in the micro-pipeline plate or at a position
of the intermediate pipeline plate on a lower side with respect to
the micro-pipeline plate.
9. The heat exchange device of claim 1, wherein the intermediate
pipeline plates and the micro-pipeline plate are integrally formed
using a 3D printer.
Description
TECHNICAL FIELD
[0001] The present invention relates to a heat exchange device, and
more particularly, to a heat exchange device that has a
significantly reduced heat resistance, and thus is capable of
minimizing consumption of energy such as gas or oil and increasing
the efficiency of hot water and heating.
BACKGROUND ART
[0002] Generally, heat exchange devices are devices which transfer
heat from a high-temperature fluid to a low-temperature fluid via a
heat exchanger having high thermal conductivity, and are mainly
used in products such as air conditioners, boilers, refrigerators,
heaters, and the like.
[0003] Among these, boilers are devices that generate hot water or
high-temperature and high-pressure steam by heating water contained
in a sealed container internally or externally, and since hot water
or steam generated by a boiler is in a high temperature state, this
is used in a variety of fields, such as heating in winter using
such high-temperature properties, steam turbines of thermal power
stations which use high-pressure properties of generated steam to
generate power, and the like.
[0004] In particular, the consumption of natural gas having less
environmental pollution than other fossil fuels is significantly
increasing globally, and thanks to recent extraction of shale gas,
the use of heating and hot water, which use natural gas, is
expected to increasingly expand.
[0005] Currently, heat exchange devices such as domestic and
industrial gas boilers for heating or hot water have been widely
used, and thanks to the development of condensing technology for
recovering and recycling waste heat, the efficiency thereof is also
considerably increased by 20% or more. However, due to abnormal
weather phenomena caused by global warming, the average temperature
in winter is gradually decreasing, and severe cold continues for
several days, and thus the consumption of energy resources such as
oil, gas, and the like has been further increasing.
[0006] Therefore, there is an urgent need to develop a heat
exchange device capable of minimizing consumption of energy such as
gas, oil, electricity, or the like and increasing the efficiency of
hot water and heating.
PRIOR ART DOCUMENT
Patent Document
[0007] (Patent Document 1) Utility Model Registration Gazette No.
20-0255210 (Registration Date: 12 November, 2001)
DISCLOSURE
Technical Problem
[0008] Therefore, the present invention has been made in view of
the above problems, and it is one object of the present invention
to provide a heat exchange device that has a significantly reduced
heat resistance, and thus is capable of minimizing consumption of
energy such as gas, oil, or electricity and increasing the
efficiency of hot water and heating.
Technical Solution
[0009] In accordance with one aspect of the present invention,
provided is a heat exchange device including: fluid
distribution/integration units configured to distribute or
integrate a fluid to be introduced or discharged; fluid pipeline
plates coupled to the fluid distribution/integration units, and
having fluid pipelines formed in a plurality of plates such that at
least one pipeline is branched into a plurality pipelines based on
a flow rate per unit area, and that each branched pipeline is
re-branched in at least one stage based on a flow rate per unit
area; and a micro-pipeline plate having pipelines linearly formed
in a plurality of plates to correspond to the respective pipelines
branched by a final stage of the fluid pipeline plates, wherein the
fluid distribution/integration units and the fluid pipeline plates
are formed symmetrically with respect to the micro-pipeline
plate.
[0010] The heat exchange device may further include intermediate
pipeline plates having intermediate fluid pipelines formed such
that pipelines are formed in a plurality of plates to correspond to
the respective pipelines branched by a final stage of the fluid
pipeline plates, and that each pipeline is branched into a
plurality of pipelines in at least one stage based on a flow rate
per unit area. In this case, the micro-pipeline plate has pipelines
linearly formed in a plurality of plates to correspond to the
respective pipelines branched by a final stage of the intermediate
pipeline plates, and the intermediate pipeline plates are formed
symmetrically with respect to the micro-pipeline plate.
[0011] In this regard, the fluid pipeline plates, the
micro-pipeline plate, and the intermediate pipeline plates take the
form of a plate in which convex surfaces and concave surfaces are
repeated to predetermined depth and width.
[0012] In addition, a plurality of ignition points are formed in
the micro-pipeline plate or the intermediate pipeline plate on a
lower side with respect to the micro-pipeline plate.
[0013] In this regard, in the fluid pipeline plates and the
intermediate pipeline plates, each pipeline may be branched into a
ratio of 1:2 or 1:3.
[0014] In addition, circular pipelines may be formed in the fluid
pipeline plates by die casting or cutting, and pipelines may be
formed in the intermediate pipeline plates and the micro-pipeline
plate by etching.
[0015] In addition, the fluid pipeline plates, the intermediate
pipeline plates, and the micro-pipeline plate may be configured
such that two plates with pipelines installed therein are adhered
to each other by brazing or soldering.
[0016] In addition, the fluid pipeline plates and the intermediate
pipeline plates may be configured such that a plurality of layers
are coupled to each other according to stages into which each
pipeline is branched.
[0017] In addition, each of the fluid pipeline plates, the
micro-pipeline plate, and the intermediate pipeline plates may be
formed as flat plates, the flat plates being coupled to each other,
and at least one heating wire may be horizontally installed in the
micro-pipeline plate or at a position of the intermediate pipeline
plate on a lower side with respect to the micro-pipeline plate.
[0018] In addition, the intermediate pipeline plates and the
micro-pipeline plate may be integrally formed using a 3D
printer.
Advantageous Effects
[0019] According to the present invention, thermal resistance of a
heat exchange device such as a water heater or a boiler is
significantly reduced, and thus consumption of energy such as gas,
oil, or electricity can be minimized and the efficiency of hot
water and heating can be increased.
[0020] In addition, according to the present invention, a pipeline
through which a fluid flows is branched into several stages, based
on a flow rate per unit area, such that the flow of a fluid from
introduction into a heat exchanger to discharge therefrom can
smoothly occur.
[0021] In addition, according to the present invention, a branched
structure of a pipeline and micro-pipelines form a plate structure,
thereby facilitating manufacture of a boiler and significantly
reducing manufacturing costs.
[0022] In addition, according to the present invention, the heat
exchange device forms a symmetrical structure with respect to a
micro-pipeline plate and has a structure in which a pipeline is
branched based on a flow rate per unit area of each of a plurality
of pipelines, thereby reducing pressure loss of a fluid flowing in
the pipelines, preventing air bubbles from being generated, and
preventing the occurrence of an obstacle to the flow of a
fluid.
[0023] In addition, according to the present invention, a fluid is
heated using electricity instead of using fossil fuel via electric
heating wires, thereby reducing the use of fossil fuel and heating
the fluid within a short time period.
DESCRIPTION OF DRAWINGS
[0024] FIG. 1 is a view illustrating an outer case of a heat
exchange device according to an embodiment of the present
invention, wherein FIG. 1(a) is a perspective view of the outer
case, FIG. 1(b) is a plan view of the outer case, and FIG. 1(c) is
a side view of the outer case.
[0025] FIG. 2 is a schematic view illustrating a structure of the
heat exchange device according to an embodiment of the present
invention.
[0026] FIG. 3 is a schematic view illustrating an example of fluid
distribution/integration units of the heat exchange device
illustrated in FIG. 2.
[0027] FIG. 4 is a schematic view of a fluid pipeline plate of the
heat exchange device illustrated in FIG. 2.
[0028] FIG. 5 is a schematic view of a micro-pipeline plate of the
heat exchange device illustrated in FIG. 2.
[0029] FIG. 6 is a schematic view of an intermediate pipeline plate
of the heat exchange device illustrated in FIG. 2.
[0030] FIG. 7 is a view illustrating an example of installation of
ignition points of the intermediate pipeline plate illustrated in
FIG. 6.
[0031] FIG. 8 is a perspective view of the heat exchange device in
which the fluid pipeline plate, the micro-pipeline plate, and the
intermediate pipeline plate are coupled to one another.
[0032] FIG. 9 is a cross-sectional view illustrating an example of
pipelines of the heat exchange device illustrated in FIG. 2.
[0033] FIG. 10 is a side cross-sectional view of a heat exchange
device according to another embodiment of the present
invention.
[0034] FIG. 11 is a plan view of the heat exchange device
illustrated in FIG. 10.
BEST MODE
[0035] Hereinafter, heat exchange devices according to embodiments
of the present invention will be described in detail with reference
to the accompanying drawings.
[0036] FIG. 1 is a view illustrating an outer case of a heat
exchange device according to an embodiment of the present
invention, wherein FIG. 1(a) is a perspective view of the outer
case, FIG. 1(b) is a plan view of the outer case, and FIG. 1(c) is
a side view of the outer case.
[0037] Referring to FIG. 1, the heat exchange device according to
an embodiment of the present invention may be installed in the
outer case 10 as illustrated in FIG. 1. In this regard, the outer
case 10 may have a rectangular parallelepiped form, and may be
provided, at upper and lower surfaces thereof, with pipeline holes
12 through which pipelines for introducing and discharging a fluid
such as gas, oil, water, or the like pass.
[0038] FIG. 2 is a schematic view illustrating a structure of the
heat exchange device according to an embodiment of the present
invention.
[0039] Referring to FIG. 2, the heat exchange device according to
an embodiment of the present invention may include fluid
distribution/integration units 110, fluid pipeline plates 120, a
micro-pipeline plate 130, and intermediate pipeline plates 140.
[0040] The fluid distribution/integration units 110 are
respectively installed on fluid inlet and fluid outlet sides of the
heat exchange device, and are configured to distribute or integrate
a fluid to be introduced or discharged. In this regard, as
illustrated in FIG. 3, the fluid distribution unit 110 distributes
a fluid introduced into the heat exchange device from a primary
distributor 112 into a plurality of pipelines 114, and distributes
the fluid flowing through each pipeline 114 into a plurality of
plate distributors 116.
[0041] The fluid integration unit 110 has the same structure as
that of the fluid distribution unit 110, and is installed
symmetrically with the fluid distribution unit 110, and thus the
like reference numeral 110 is given to the fluid
distribution/integration units. Here, the fluid integration unit
110 integrates a fluid discharged from the heat exchange device
using a plurality of plate integrators 116, and reintegrates the
fluid flowing through each plate integrator 116 into the plurality
of pipelines 114, and a final integrator 112 integrates the fluid
discharged via each pipeline 114 and discharges the fluid to the
outside. In the following description, for the description of the
fluid integration unit 110, refer to the description of the fluid
distribution unit 110.
[0042] The fluid pipeline plates 120 are respectively coupled to
the fluid distribution/integration units 110, and have fluid
pipelines formed in a plurality of plates such that at least one
pipeline is branched into a plurality of pipelines on the basis of
a flow rate per unit area, and that each branched pipeline is
re-branched into at least one stage on the basis of a flow rate per
unit area. At this time, as illustrated in FIG. 4, the fluid
pipeline plate 120 may take the form of a plate in which convex
surfaces and concave surfaces are repeated to predetermined depth
and width. In addition, the fluid pipeline plate 120 may be
fabricated such that semicircular pipeline grooves are formed at
one plate by die casting or cutting, semicircular pipeline grooves
are formed at another plate to be opposite to those of the one
plate, and then the two plates are adhered to each other by brazing
or soldering. In addition, as illustrated in FIG. 4, the fluid
pipeline plate 120 may be formed as a plurality of layers according
to stages into which a pipeline is branched. That is, fluid
introduction holes 125 through which a fluid is introduced from the
fluid distribution unit 110 may be vertically formed in the fluid
pipeline plate 122 formed as the uppermost layer, and an upper
pipeline 126 through which the fluid flowing down through each
fluid introduction hole 125 flows and branched introduction holes
126 having a form into which each fluid introduction hole 125 is
branched may be vertically formed at an upper end of the fluid
pipeline plate 124 formed as the second layer. Such a layer
structure may be formed as a plurality of layers according to
stages into which pipelines are branched. At this time, each
pipeline may be branched into a ratio of 1:2 or 1:3, and the
diameter of each branched pipeline may be determined based on a
flow rate per unit area of a pipeline before branching. That is,
assuming that A pipeline is branched into three B pipelines, a flow
rate per unit area may satisfy the condition in Equation 1.
(.pi./4).times.(diameter of A pipeline).sup.2.times.fluid rate of A
pipeline
=3.times.(.pi./4).times.(diameter of B pipeline).sup.2.times.fluid
rate of B pipeline [Equation 1]
[0043] In this regard, when the flow rate of a pipeline before
branching is different from a sum of flow rates of pipelines after
branching, the flow of a fluid may be obstructed, and thus a flow
rate between the pipelines may be kept constant. Therefore, the
diameter of each branched pipeline may be determined based on the
flow rate per unit area as in Equation 1.
[0044] The micro-pipeline plate 130 has pipelines formed linearly
in a plurality of plates to correspond to the respective pipelines
branched by the final stage of the fluid pipeline plate 120. That
is, as illustrated in FIG. 5, the micro-pipeline plate 130 is
formed as a plurality of plates having the same shape as that of
the fluid pipeline plate 120, and pipelines 132 are linearly formed
inside each plate to correspond to the pipelines branched by the
final stage of the fluid pipeline plate 120. At this time, the
micro-pipeline plate 130 may be fabricated such that semicircular
pipelines are formed by etching in two plates to correspond to each
other, and the two plates are then adhered to each other by brazing
or soldering. In this regard, the fluid distribution/integration
units 110 and the fluid pipeline plates 120 may be formed
symmetrically with respect to the micro-pipeline plate 130.
[0045] Meanwhile, etching is a technique used to form a desired
pattern on a selected portion of a surface of a material by
performing a removal process by chemical etching using an acid or
other etchants, and is used in manufacturing processes or the like
of semiconductor integrated circuits. There are three etching
methods such as wet etching, dry etching (plasma etching), and ion
milling. Wet etching is a method using an etching solution, and is
performed at low cost and has high selectivity, but causes surface
contamination and also easily forms a resist undercut. Plasma
etching includes a method using neutral plasma and a method using
charged plasma. This method significantly reduces the formation of
undercut (particularly in the case of charged plasma), but causes
reduced selectivity. Lastly, ion milling is a method used to remove
a resist using ion beams and has high selectivity and high
accuracy, but the operation is slow and this method may be used
only for the case of a positive resist (for a negative resist, it
is easy to form undercut due to thickness variation).
[0046] Brazing or soldering is a technique using brazing to adhere
thin metal plates together, is also referred to as hard soldering,
and is performed by heating portions to be adhered using brass
brazing, silver solder, or the like as an adhesive and melting and
adhering the portions. In this regard, the adhesive is called hard
solder and hard solder is mainly in the form of a powder or a
plate. A hard solder having a lower melting point than that of an
adherend is used, and a flux (a solvent) is used to clean adhesion
surfaces and boron-based fluxes are mainly used. A complete heating
and adhering operation is referred to as furnace brazing.
[0047] The intermediate pipeline plate 140 may be installed between
the fluid pipeline plate 120 and the micro-pipeline plate 130.
Pipelines of the micro-pipeline plate 130 may have a diameter of 1
mm or less to generate a capillary pressure phenomenon, and for
this, several stages of branching processes may be needed in
consideration of the diameter of pipelines at the uppermost end of
the fluid pipeline plate 120.
[0048] Here, the capillary pressure phenomenon refers to a
phenomenon in which a liquid flows upward in a very narrow, hollow
tube, and it was proven by Giovanni Borelli that the height of
liquid flowing upward into a tube is inversely proportional to the
inner diameter of the tube. Generally, assuming that the diameter
of a tube is 0.5 mm, the height of water moving upward is about 50
mm.
[0049] The intermediate pipeline plates 140 are formed as a
plurality of plates in the same form as that of the fluid pipeline
plates 120 and the micro-pipeline plate 130, and intermediate fluid
pipelines are formed such that pipelines are formed in each plate
to correspond to the respective pipelines branched by the final
stage of the fluid pipeline plate 120 and that each pipeline is
branched into a plurality of pipelines in at least one stage based
on a flow rate per unit area. At this time, the intermediate
pipeline plate 140 may be formed such that each pipeline is
branched into a ratio of 1:2 or 1:3 by etching, or as illustrated
in FIG. 6, a plurality of layers with vertical pipelines formed
therein according to branching stages may be coupled to each other.
In this case, the shape of each layer is similar to that of a
layered structure of the fluid pipeline plate 120, and thus a
detailed description thereof will be omitted herein. In addition,
like the micro-pipeline plate 130, the intermediate pipeline plate
140 may be fabricated such that thin plates are adhered to each
other by brazing or soldering. In addition, the intermediate
pipeline plates 140 and the micro-pipeline plate 130 may be
integrally formed using a 3D printer. At this time, various known
techniques may be applied as a method using a 3D printer, and thus
a detailed description thereof will be omitted herein.
[0050] Here, the micro-pipeline plate 130 is configured such that
pipelines are linearly formed in a plurality of plates to
correspond to the respective finally branched pipelines of the
intermediate pipeline plate 140, and the intermediate pipeline
plates 140 are formed symmetrically with respect to the
micro-pipeline plate 130. In this regard, as illustrated in FIG. 7,
the intermediate pipeline plate 140 positioned on a lower side with
respect to the micro-pipeline plate 130 may include a plurality of
ignition points 146 between plates of the lowermost layer 144 of a
plurality of layers 142 and 144. Here, the ignition points 146 are
configured to increase the temperature of a fluid flowing through
pipelines, and may be in an irregular form between plates. In
addition, although it is illustrated that the ignition points 146
are formed in the intermediate pipeline plate 140, the ignition
points 146 may also be formed between plates at the lowermost end
of the micro-pipeline plate 130.
[0051] FIG. 8 is a perspective view of the heat exchange device in
which the fluid pipeline plate, the micro-pipeline plate, and the
intermediate pipeline plate are coupled to one another.
[0052] Referring to FIG. 8, the heat exchange device according to
an embodiment of the present invention is configured such that each
of the fluid pipeline plate 120 and the intermediate pipeline plate
140 is formed as a plurality of plates, and branched pipelines are
formed in each plate, thereby forming capillary tubes in the
micro-pipeline plate 130.
[0053] FIG. 9 is a cross-sectional view illustrating an example of
the formation of pipelines of the heat exchange device according to
an embodiment of the present invention.
[0054] As illustrated in FIG. 9, assuming that four pipelines are
branched into the ratio of 1:2->1:2->1:3->1:3->1:3, 432
pipelines are formed in the micro-pipeline plate 130. In such a
manner, the micro-pipeline plate 130 has capillary tubes having a
diameter of 1 mm or less, and may prevent the flow of a fluid from
being obstructed.
[0055] In the case of general boiler devices, a fluid inside pipes
is heated by heat supplied from the outside. At this time, to heat
water inside pipes, external heat should be transferred to internal
water through the pipes, and in this process, thermal resistance
due to the thickness of pipes, thermal resistance due to thermal
conductivity of pipes, thermal resistance due to space volume
inside pipes, and the like are generated.
[0056] In embodiments of the present invention, pipelines having a
diameter of 1 mm or less are formed unlike general pipelines having
a diameter of about 20 mm, thereby minimizing thermal resistance
and instantaneously heating a fluid. That is, in the case of a
pipeline having a diameter of 20 mm, the thickness of a wall
thereof is about 2 mm and a unit area in which a fluid flows in the
pipeline is 0.000314 m.sup.2. In contrast, in the case of a
pipeline having a diameter of 0.5 mm, the thickness of a wall
thereof is 0.15 mm and a unit area in which a fluid flows therein
is 0.000000196 m.sup.2. From simple arithmetic calculation, it can
be seen that a 13-fold decrease in thermal resistance due to
thickness and a 1,600-fold decrease in thermal resistance due to
area are exhibited. In other words, this indicates that, when a
heat exchanger in a bundle type of a combustor having 0.5
mm-diameter pipelines is heated, almost no thermal resistance is
generated. If existing boiler systems produce hot water having a
temperature of 100.degree. C. or less by heating at several hundred
degrees of Celsius, the heat exchange device according to an
embodiment of the present invention may product 90.degree. C. or
hotter hot water by heating at a temperature of 100.degree. C. or
less.
[0057] FIG. 10 is a side cross-sectional view of a heat exchange
device according to another embodiment of the present invention.
FIG. 11 is a plan view of the heat exchange device illustrated in
FIG. 10.
[0058] Referring to FIGS. 10 and 11, the heat exchange device
according to another embodiment of the present invention may be
configured such that, instead of the structure in which the fluid
pipeline plates 120, the micro-pipeline plate 130, and the
intermediate pipeline plates 140 take the form of a plate in which
convex surfaces and concave surfaces are repeated to predetermined
depth and width, each plate is formed as flat plates and the flat
plates may be coupled to each other. Here, at least one electric
heating wire 148 may be horizontally installed in the
micro-pipeline plate 130 or at a position of the intermediate
pipeline plate 140 on a lower side with respect to the
micro-pipeline plate 130. At this time, there is almost no thermal
resistance between the electric heating wire 148 and a fluid
flowing through micro-pipelines of the micro-pipeline plate 130 or
pipelines of the intermediate pipeline plate 140, and thus the
fluid may be heated within a short time period.
* * * * *