U.S. patent application number 16/573086 was filed with the patent office on 2020-05-07 for bonding apparatus and bonding method.
The applicant listed for this patent is SAMSUNG DISPLAY CO., LTD.. Invention is credited to Hyun Chul JIN, Myong Soo OH, Doo San PARK, Hee Jong SHIN.
Application Number | 20200144221 16/573086 |
Document ID | / |
Family ID | 70458961 |
Filed Date | 2020-05-07 |
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United States Patent
Application |
20200144221 |
Kind Code |
A1 |
OH; Myong Soo ; et
al. |
May 7, 2020 |
BONDING APPARATUS AND BONDING METHOD
Abstract
A bonding apparatus includes: an anisotropic conductive film
("ACF") attachment unit which attaches a first ACF and a second ACF
onto a display panel assembly; a compression unit which compresses
a first chip-on-film ("COF") on the first ACF and compresses a
second COF on the second ACF; and a buffer unit which rotates the
display panel assembly, on which the first ACF and the second COF
are compressed, on a plane.
Inventors: |
OH; Myong Soo; (Yongin-si,
KR) ; PARK; Doo San; (Yongin-si, KR) ; JIN;
Hyun Chul; (Yongin-si, KR) ; SHIN; Hee Jong;
(Yongin-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG DISPLAY CO., LTD. |
Yongin-si |
|
KR |
|
|
Family ID: |
70458961 |
Appl. No.: |
16/573086 |
Filed: |
September 17, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 2201/10128
20130101; H01L 24/86 20130101; G02F 1/1333 20130101; H01L 24/79
20130101; H05K 1/181 20130101 |
International
Class: |
H01L 23/00 20060101
H01L023/00; H05K 1/18 20060101 H05K001/18 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 5, 2018 |
KR |
10-2018-0134621 |
Claims
1. A bonding apparatus comprising: an anisotropic conductive film
attachment unit which attaches a first anisotropic conductive film
and a second anisotropic conductive film onto a display panel
assembly; a compression unit which compresses a first chip-on-film
on the first anisotropic conductive film and compresses a second
chip-on-film on the second anisotropic conductive film; and a
buffer unit which rotates the display panel assembly, on which the
first anisotropic conductive film and the first chip-on-film are
compressed.
2. The bonding apparatus of claim 1, wherein each of the
anisotropic conductive film attachment unit, the compression unit
and the buffer unit includes a conveyor which transfers the display
panel assembly in a first direction toward the compression unit
from the anisotropic conductive film attachment unit and in a
second direction toward the anisotropic conductive film attachment
unit from the compression unit.
3. The bonding apparatus of claim 1, wherein the buffer unit is
disposed prior to the anisotropic conductive film attachment unit,
and rotates the display panel assembly transferred from the
anisotropic conductive film attachment unit by about 180 degrees
and then transfers the rotated display panel assembly to the
anisotropic conductive film attachment unit.
4. The bonding apparatus of claim 3, wherein the anisotropic
conductive film attachment unit transfers the display panel
assembly, to which the first anisotropic conductive film is
attached, to the compression unit, and attaches the second
anisotropic conductive film onto the display panel assembly rotated
in the buffer unit.
5. The bonding apparatus of claim 3, wherein the compression unit
transfers the display panel assembly, on which the first
chip-on-film is compressed, to the anisotropic conductive film
attachment unit, and transfers the display panel assembly, on which
the second chip-on-film is compressed, to an outside.
6. The bonding apparatus of claim 1, wherein the buffer unit is
disposed after the compression unit, and rotates the display panel
assembly transferred from the compression unit by about 180 degrees
and then transfers the rotated display panel assembly to the
compression unit.
7. The bonding apparatus of claim 6, wherein the anisotropic
conductive film attachment unit transfers the display panel
assembly, to which the first anisotropic conductive film is
attached, to the compression unit, and attaches the second
anisotropic conductive film to the display panel assembly
transferred from the compression unit.
8. The bonding apparatus of claim 6, wherein the compression unit
transfers the display panel assembly, on which the first
chip-on-film and the second chip-on- film are compressed, to the
buffer unit, and conveys the display panel assembly rotated in the
buffer unit to the anisotropic conductive film attachment unit.
9. The bonding apparatus of claim 2, further comprising: a first
anisotropic conductive film transfer unit disposed at a side of the
anisotropic conductive film attachment unit, wherein the first
anisotropic conductive film transfer unit provides the first
anisotropic conductive film; and a second anisotropic conductive
film transfer unit disposed at an opposing side of the anisotropic
conductive film attachment unit, wherein the second anisotropic
conductive film transfer unit provides the second anisotropic
conductive film.
10. The bonding apparatus of claim 9, further comprising: a first
chip-on-film transfer unit disposed at a side of the compression
unit, wherein the first chip-on-film transfer unit provides the
first chip-on-film; and a second chip-on-film transfer unit
disposed at an opposing side of the compression unit, wherein the
second chip-on-film transfer unit provides the second
chip-on-film.
11. The bonding apparatus of claim 10, wherein a connection pad on
the display panel assembly is aligned adjacent to the first
anisotropic conductive film transfer unit, and is aligned adjacent
to the second anisotropic conductive film transfer unit when the
display panel assembly is rotated by the buffer unit.
12. The bonding apparatus of claim 1, wherein the first
chip-on-film is electrically connected to a first connection pad on
the display panel assembly, and the second chip-on-film is
electrically connected to a second connection pad on the display
panel assembly.
13. The bonding apparatus of claim 12, wherein the first connection
pad and the second connection pad are connected to a first
sub-pixel and a second sub-pixel, respectively.
14. The bonding apparatus of claim 12, wherein the first
chip-on-film and the second chip-on-film are not aligned with each
other in an extending direction of a gate line.
15. The bonding apparatus of claim 1, wherein the compression unit
includes: a preliminary compression unit which preliminarily
compresses the first chip-on-film on the first anisotropic
conductive film, and preliminary compresses the second chip-on-film
on the second anisotropic conductive film; and a primary
compression unit which primarily compresses the preliminarily
compressed first chip-on-film and the preliminarily compressed
second chip-on-film.
16. A bonding method comprising: a first tape automated bonding
process including attaching a first anisotropic conductive film and
a first chip-on-film onto a display panel assembly while the
display panel assembly is transferred in a first direction; a
retransferring process including conveying the display panel
assembly in a second direction opposite to the first direction, and
rotating the display panel assembly on a plane; and a second tape
automated bonding process including attaching a second anisotropic
conductive film and a second chip-on-film onto the display panel
assembly while the rotated display panel assembly is retransferred
in the first direction.
17. The bonding method of claim 16, wherein the first tape
automated bonding process, the retransferring process, and the
second tape automated bonding process are performed by a bonding
apparatus including a conveyor which conveys the display panel
assembly in the first direction and the second direction.
18. The bonding method of claim 16, wherein the retransferring
process includes: retransferring, in the second direction, the
display panel assembly transferred in the first direction; and
rotating the retransferred display panel assembly by about 180
degrees.
19. The bonding method of claim 16, wherein the retransferring
process includes: rotating the display panel assembly transferred
in the first direction; and retransferring the display panel
assembly in the second direction.
20. A bonding method comprising: a first tape automated bonding
process including attaching a first anisotropic conductive film
onto a display panel assembly in an anisotropic conductive film
attachment unit, and compressing a first chip-on-film on the first
anisotropic conductive film in a compression unit, while the
display panel assembly is transferred in a first direction; a
retransferring process including retransferring the display panel
assembly in a second direction opposite to the first direction, and
rotating the display panel assembly on a plane; and a second tape
automated bonding process including attaching a second anisotropic
conductive film onto the display panel assembly in the anisotropic
conductive film attachment unit, and compressing a second
chip-on-film on the second anisotropic conductive film in the
compression unit, while the rotated display panel assembly is
transferred in the first direction.
Description
[0001] This application claims priority to Korean patent
application 10-2018-0134621, filed on Nov. 5, 2018, and all the
benefits accruing therefrom under 35 U.S.C. .sctn. 119, the content
of which in its entirety is herein incorporated by reference.
BACKGROUND
1. Field
[0002] The disclosure generally relates to a bonding apparatus and
a bonding method.
2. Description of Related Art
[0003] In general, a display device includes a driving circuit
connected to a signal line to supply signal. The driving circuit is
typically implemented with an integrated circuit ("IC") chip. The
IC chip may include or be configured with a chip-on-film ("COF") in
which a plurality of conductive lead lines are formed on an
insulating film such as polyimide. The COF may be referred to as a
tape-carrier-package ("TCP"). The COF may be attached onto a
display panel assembly through a tape automated bonding ("TAB")
process. The driving circuit attached as described above is
electrically connected to a signal line of the display panel
assembly through the lead line of the COF.
[0004] The lead line of the COF may include a plurality of
output-side lead lines and a plurality of input-side lead lines,
which are respectively connected to an output end and an input end
of the IC chip. The signal line of the display panel assembly may
include a plurality of connection pads located in the vicinity of
an edge of the display panel assembly. The output-side lead line of
the COF may be mechanically and electrically connected to the
connection pad of the display panel assembly, and the input-side
lead line of the COF may be connected a printed circuit board
("PCB") for transmitting several signals to a driving IC through
soldering or the like. An output end of the COF and the connection
pad of the display panel assembly may be attached to each other
through an anisotropic conductive film ("ACF").
SUMMARY
[0005] Embodiments provide a bonding apparatus and a bonding
method, which simplifies the layout of process facilities through
conveyance and rotation in a tape automated bonding ("TAB") process
of a chip-on-film ("COF").
[0006] According to an embodiment of the disclosure, a bonding
apparatus includes: an anisotropic conductive film ("ACF")
attachment unit which attaches a first ACF and a second ACF onto a
display panel assembly; a compression unit which compresses a COF
on the first ACF and compresses a second COF on the second ACF; and
a buffer unit which rotates the display panel assembly, on which
the first ACF and the second COF are compressed.
[0007] In an embodiment, each of the ACF attachment unit, the
compression unit and the buffer unit may include a conveyor which
transfers the display panel assembly in a first direction toward
the compression unit from the ACF attachment unit and in a second
direction toward the ACF attachment unit from the compression
unit.
[0008] In an embodiment, the buffer unit may be disposed prior to
the ACF attachment unit, and rotate the display panel assembly
transferred from the ACF attachment unit by about 180 degrees and
then transfer the rotated display panel assembly to the ACF
attachment unit.
[0009] In an embodiment, the ACF attachment unit may transfer the
display panel assembly, to which the first ACF is attached, to the
compression unit, and attach the second ACF onto the display panel
assembly rotated by the buffer unit.
[0010] In an embodiment, the compression unit may transfer the
display panel assembly, on which the first COF is compressed, to
the ACF attachment unit, and transfer the display panel assembly,
on which the second COF is compressed, to an outside.
[0011] In an embodiment, the buffer unit may be disposed prior to
the compression unit, and rotate the display panel assembly
transferred from the compression unit by about 180 degrees and then
retransfer the rotated display panel assembly to the compression
unit.
[0012] In an embodiment, the ACF attachment unit may transfer the
display panel assembly, to which the first ACF is attached, to the
compression unit, and attach the second ACF to the display panel
assembly transferred from the compression unit.
[0013] In an embodiment, the compression unit may transfer the
display panel assembly, on which the first COF and the second COF
are compressed, to the buffer unit, and convey the display panel
assembly rotated in the buffer unit to the ACF attachment unit.
[0014] In an embodiment, the bonding apparatus may further include:
a first ACF transfer unit disposed at a side of the ACF attachment
unit, where the first ACF transfer unit may provide the first ACF;
and a second ACF transfer unit disposed at an opposing side of the
ACF attachment unit, where the second ACF transfer unit may provide
the second ACF.
[0015] In an embodiment, the bonding apparatus may further include:
a first COF transfer unit disposed at a side of the compression
unit, where the first COF transfer unit may provide the first COF;
and a second COF transfer unit disposed at an opposing side of the
compression unit, where the second COF transfer unit may provide
the second COF.
[0016] In an embodiment, a connection pad on the display panel
assembly may be aligned adjacent to the first ACF transfer unit,
and be aligned adjacent to the second ACF transfer unit when the
display panel assembly is rotated by the buffer unit.
[0017] In an embodiment, the first COF may be electrically
connected to a first connection pad on the display panel assembly,
and the second COF may be electrically connected to a second
connection pad on the display panel assembly.
[0018] In an embodiment, the first connection pad and the second
connection pad may be connected to a first sub-pixel and a second
sub-pixel, respectively.
[0019] In an embodiment, the first COF and the second COF may not
be aligned with each other in an extending direction of a gate
line.
[0020] In an embodiment, the compression unit may include: a
preliminary compression unit which preliminarily compresses the
first COF on the first ACF, and preliminary compresses the second
COF on the second ACF; and a primary compression unit which
primarily compresses the preliminarily compressed first COF and the
preliminarily compressed second COF.
[0021] According to another embodiment of the disclosure, a bonding
mthod includes: a first TAB process including attaching a first ACF
and a first COF onto a display panel assembly while the display
panel assembly is transferred in a first direction; a
retransferring process including conveying the display panel
assembly in a second direction opposite to the first direction, and
rotating the display panel assembly on a plane; and a second TAB
process including attaching a second ACF and a second COF onto the
display panel assembly while the rotated display panel assembly is
retransferred in the first direction.
[0022] In an embodiment, the first TAB process, the retransferring
process and the second TAB process may be performed by a bonding
apparatus including a conveyor which conveys the display panel
assembly in the first direction and the second direction.
[0023] In an embodiment, the retransferring process may include:
retransferring, in the second direction, the display panel assembly
transferred in the first direction; rotating the retransferred
display panel assembly by about 180 degrees; and transferring the
rotated display panel assembly in the first direction.
[0024] In an embodiment, the retransferring process may include:
rotating the display panel assembly transferred in the first
direction; and retransferring the display panel assembly in the
second direction.
[0025] According to still another embodiment of the disclosure, a
bonding method includes: a first TAB process including attaching a
first ACF onto a display panel assembly in an ACF attachment unit,
and compressing a first ACF on the first ACF in a compression unit,
while the display panel assembly is transferred in a first
direction; a retransferring process including retransferring the
display panel assembly in a second direction opposite to the first
direction, and rotating the display panel assembly on a plane; and
a second TAB process including attaching a second ACF onto the
display panel assembly in the ACF attachment unit, and compressing
a second COF on the second ACF in the compression unit, while the
rotated display panel assembly is transferred in the first
direction.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The above and other features of the invention will become
more apparent by describing in further detail exemplary embodiments
thereof with reference to the accompanying drawings, in which:
[0027] FIG. 1 is a plan view illustrating a display device
according to an embodiment of the disclosure;
[0028] FIG. 2 is an enlarged plan view of portion A of FIG. 1;
[0029] FIG. 3 is a side view of the portion A of FIG. 1;
[0030] FIG. 4 is a block diagram illustrating a structure of a
bonding apparatus according to an embodiment of the disclosure;
[0031] FIG. 5 is a block diagram illustrating a structure of a
bonding apparatus according to an alternative embodiment of the
disclosure; and
[0032] FIGS. 6 to 9 are plan views illustrating a bonding method
according to an embodiment of the disclosure.
DETAILED DESCRIPTION
[0033] The invention now will be described more fully hereinafter
with reference to the accompanying drawings, in which various
embodiments are shown. This invention may, however, be embodied in
many different forms, and should not be construed as limited to the
embodiments set forth herein. Rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope of the invention to those skilled in
the art. Like reference numerals refer to like elements
throughout.
[0034] In the drawings, the thickness of certain lines, layers,
components, elements or features may be exaggerated for clarity. It
will be understood that, although the terms "first", "second", etc.
may be used herein to describe various elements, these elements
should not be limited by these terms. These terms are only used to
distinguish one element from another element. Thus, a "first"
element discussed below could also be termed a "second" element
without departing from the teachings of the disclosure. As used
herein, the singular forms are intended to include the plural forms
as well, unless the context clearly indicates otherwise.
[0035] It will be further understood that the terms "includes"
and/or "including", when used in this specification, specify the
presence of stated features, integers, steps, operations, elements,
and/or components, but do not preclude the presence and/or addition
of one or more other features, integers, steps, operations,
elements, components, and/or groups thereof. Further, an expression
that an element such as a layer, region, substrate or plate is
placed "on" or "above" another element indicates not only a case
where the element is placed "directly on" or "just above" the other
element but also a case where a further element is interposed
between the element and the other element. In contrast, when an
element is referred to as being "directly on" another element,
there are no intervening elements present. On the contrary, an
expression that an element such as a layer, region, substrate or
plate is placed "beneath" or "below" another element indicates not
only a case where the element is placed "directly beneath" or "just
below" the other element but also a case where a further element is
interposed between the element and the other element.
[0036] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting. As
used herein, the singular forms "a," "an," and "the" are intended
to include the plural forms, including "at least one," unless the
content clearly indicates otherwise. "Or" means "and/or." "At least
one of A and B" means "A and/or B." As used herein, the term
"and/or" includes any and all combinations of one or more of the
associated listed items.
[0037] "About" or "approximately" as used herein is inclusive of
the stated value and means within an acceptable range of deviation
for the particular value as determined by one of ordinary skill in
the art, considering the measurement in question and the error
associated with measurement of the particular quantity (i.e., the
limitations of the measurement system).
[0038] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
disclosure belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and the present
disclosure, and will not be interpreted in an idealized or overly
formal sense unless expressly so defined herein.
[0039] Hereinafter, embodiments of the invention will be described
in detail with reference to the accompanying drawings.
[0040] FIG. 1 is a plan view illustrating a display device
according to an embodiment of the disclosure.
[0041] Referring to FIG. 1, an embodiment of the display device
1000 includes a display panel 900 and a driver 300. The display
panel 900 may include a thin film transistor ("TFT") substrate 100
and a counter substrate 200. The display panel 900 may include a
display area DA, in which the TFT substrate 100 and the counter
substrate 200 overlap each other, and a peripheral area PA, in
which the TFT substrate 100 and the counter substrate 200 do not
overlap each other when viewed from a plan view in a thickness
direction of the display panel 900.
[0042] The TFT substrate 100 may include gate lines GL1 to GLn,
source lines SL1 to SLm, and sub-pixels (or pixels) PX connected to
the gate lines GL1 to GLn and the source lines SL1 to SLm.
[0043] The driver 300 includes a source driving circuit 320 and a
gate driving circuit 310. The driver 300 is disposed in the
peripheral area PA to provide a gate signal and a source signal,
which are provided from a printed circuit board ("PCB") 2000,
respectively to the gate lines GL1 to GLn and the source lines SL1
to SLm.
[0044] The driver 300 is disposed on or adhered to the peripheral
area PA of the display panel 900. FIG. 1 shows an embodiment in
which the gate driving circuit 310 is provided or formed at only
one side of the display area DA. Alternatively, the gate driving
circuit 310 may be provided at one side or both sides of the
display area DA to be connected to the gate lines GL1 to GLn. The
source driving circuit 320 may be provided or formed at an upper
side of the display area DA to be connected to one ends of the
source lines SL1 to SLm.
[0045] In an embodiment, three source driving circuits 320 and
three gate driving circuit 310 may be provided as illustrated in
FIG. 1, but the disclosure is not limited thereto.
[0046] FIG. 2 is an enlarged plan view of portion A of FIG. 1. FIG.
3 is a side view of the portion A of FIG. 1.
[0047] Referring to FIGS. 1 to 3, an embodiment of the display
device 1000 includes a display panel assembly 110, source
connection pads SP1 and SP2 and source driving circuits 321 and
322.
[0048] The display panel assembly 110 may include the TFT substrate
100, in which at least one sub-pixel PX1 and PX2 is disposed, and
the counter substrate 200. The TFT substrate 100 may be provided in
the display area DA on the counter substrate 200.
[0049] A plurality of sub-pixels PX1 and PX2 are defined or formed
in the display area DA. The sub-pixels PX1 and PX2 may be connected
to source lines SL1 and SL2, respectively. In an embodiment, as
shown in FIG. 2, a first sub-pixel PX1 and a second sub-pixel PX2
are disposed on different rows that do not overlap each other in a
horizontal direction.
[0050] The source connection pads SP1 and SP2 extending from the
source lines SL1 and SL2, respectively, may be disposed or formed
in the peripheral area PA on the TFT substrate 100. In an
embodiment, as shown in FIG. 2, a first source connection pad SP1
extends from a first source line SL1 connected to the first
sub-pixel PX1, and a second source connection pad SP2 extends from
a second source line SL2 connected to the second sub-pixel PX2. In
such an embodiment, the first source connection pad SP1 and the
second source connection pad SP2 may be disposed on different rows
that do not overlap each other in a horizontal direction. Herein,
the horizontal direction may be a direction perpendicular to an
extending direction of the source lines SL1 and SL2 when viewed
from the plan view as shown in FIG. 2.
[0051] The source driving circuits 321 and 322 may be formed with a
chip-on-film ("COF") that includes a base film (not shown) and a
plurality of conductive lead lines (not shown) formed on the base
film. The base film may be an insulating film including or made of
polyimide or the like. The conductive lead lines may include or be
made of a conductive material such as copper (Cu), nickel (Ni) or
gold (Au).
[0052] Some conductive lead lines (e.g., input-side lead lines)
among the conductive lead lines may be electrically connected to
the source lines SL1 and SL2 through the source connection pads SP1
and SP2 when the base film is attached to the source connection
pads SP1 and SP2. In an embodiment, a conductive lead line of a
first source driving circuit 321 may be electrically connected to
the first source connection pad SP1. In addition, a conductive lead
line of a second source driving circuit 322 may be electrically
connected to the second source connection pad SP2.
[0053] In an embodiment, the second source driving circuit 322 may
have an area wider than that of the first source driving circuit
321 as shown in FIG. 3 to be electrically connected to the second
source connection pad SP2 disposed on a row different from that of
the first source connection pad SP1.
[0054] The source driving circuits 321 and 322 extend to the
outside of the TFT substrate 100, to be adhered to the PCB 2000.
Some conductive lead lines (e.g., output-side lead lines) provided
at an extension part among the conductive lead lines of the source
driving circuits 321 and 322 may be electrically connected to the
PCB 2000.
[0055] The source driving circuits 321 and 322 may be attached to
the source connection pads SP1 and SP2 through an anisotropic
conductive film ACF, using a tape automated bonding ("TAB")
process.
[0056] The anisotropic conductive film ACF may include a polymer
resin PL cured by heat and conductive particles CP dispersed in the
polymer resin PL. When heat and pressure are applied to the
anisotropic conductive film ACF, the polymer resin PL may be
melted, and the conductive particles CP may electrically connect
the conductive lead lines and the source connection pads SP1 and
SP2. Thus, the anisotropic conductive film ACF has both
conductivity and adhesive properties. The conductive particles CP
may include a metal such as carbon fiber, nickel (Ni), and platinum
(Pt), or a compound thereof. In such an embodiment, the polymer
resin PL may include styrene butadiene rubber, polyvinyl, butylene,
epoxy resin, polyurethane, or acrylic resin.
[0057] The anisotropic conductive film ACF is interposed between
the source driving circuits 321 and 322 and the source connection
pads SP1 and SP2 to electrically and physically connect the source
driving circuits 321 and 322 to the source connection pads SP1 and
SP2.
[0058] In an embodiment, although not shown in the drawings, the
gate driving circuit 310 of FIG. 1 may be attached onto the display
panel assembly 110, using a method identical or similar to that
used for attaching the source driving circuit 320.
[0059] Hereinafter, embodiments of a bonding apparatus and a
bonding method for attaching the source driving circuits 321 and
322 onto the display panel assembly 110 will be described in
detail.
[0060] FIG. 4 is a block diagram illustrating a structure of a
bonding apparatus according to an embodiment of the disclosure.
FIG. 5 is a block diagram illustrating a structure of a bonding
apparatus according to an alternative embodiment of the disclosure.
Referring to FIGS. 4 and 5, embodiments of the bonding apparatus
according to the disclosure includes a COF adhesion process unit 10
and a PCB adhesion process unit 20.
[0061] A gate adhesion unit 11 performs a process of adhering or
connecting the gate driving circuit 310 to a gate connection pad
formed on the display panel assembly 110. The adhesion of the gate
driving circuit 310 may be performed using a method identical or
similar to that used for bonding the source driving circuit 320,
but a detailed process method is not particularly limited.
Alternatively, the gate adhesion unit 11 may be omitted.
[0062] A source adhesion unit 12 may include an ACF attachment unit
121, a preliminary compression unit 122, a primary compression unit
123, a buffer unit 124, a first ACF transfer unit 125, a second ACF
transfer unit 126, a first COF transfer unit 127 and a second COF
transfer unit 128.
[0063] The ACF attachment unit 121 attaches an ACF on the source
connection pads SP1 and SP2 disposed or formed on the display panel
assembly 110. In embodiments of the disclosure, the ACF attachment
unit 121 may receive an ACF transferred from the first ACF transfer
unit 125 or the second ACF transfer unit 126, and attach the
transferred ACF onto the source connection pads SP1 and SP2 of the
display panel assembly 110. In one embodiment, for example, the ACF
attachment unit 121 may attach a first ACF transferred from the
first ACF transfer unit 125 onto the source connection pads SP1 and
SP2 during a first TAB process which will be described later, and
attach a second ACF transferred from the second ACF transfer unit
126 onto the source connection pads SP1 and SP2 during a second TAB
process which will be described later.
[0064] The preliminary compression unit 122 may preliminarily
compress a COF defining the source driving circuits 321 and 322 on
an ACF. In embodiments of the disclosure, the preliminary
compression unit 122 may preliminarily compress, on the first ACF,
a first COF for forming the first source driving circuit 321 and
transferred from the first COF transfer unit 127, and preliminarily
compress, on the second ACF, a second COF for forming the second
source driving circuit 322 and transferred from the second COF
transfer unit 128.
[0065] The primary compression unit 123 may primarily compress the
preliminarily compressed COF. In embodiments of the disclosure, the
primary compression unit 123 may primarily compress the first COF
preliminarily compressed on the first ACF, and primarily compress
the second COF preliminarily compressed on the second ACF.
[0066] In embodiments of the disclosure, the preliminary
compression unit 122 and the primary compression unit 123 may
include a compression head, in which a heat source is installed,
and a compression tip attached to one end of the compression head
to compress a COF on an ACF. The heat source of the compression
head may be, for example, a heating coil, and heat generated from
the heat source is applied to the ACF, such that bonding may be
more effectively or easily performed through conductive particles
in the ACF. The compression tip may compress the COF toward the ACF
while ascending and descending through a tip lifter which may
include or be configured with a cylinder or motor.
[0067] In such an embodiment, configurations of the preliminary
compression unit 122 and the primary compression unit 123 are not
limited to those described above. In embodiments, the preliminary
compression unit 122 and the primary compression unit 123 may not
include some of the above-described components, or further include
other components.
[0068] The buffer unit 124 rotates the display panel assembly 110
by about 180 degrees during a retransferring process between the
first TAB process and the second TAB process, which will be
described later. In an embodiment, the buffer unit 124 may include
an ascending/descending member for allowing the display panel
assembly 110 to ascend/descend and a rotating member for rotating
the display panel assembly 110. In one embodiment, for example, the
ascending/descending member may hold the display panel assembly 110
and allow the display panel assembly 110 held by pressure of the
cylinder or rotary power of the motor to ascend or descend. In an
embodiment, the rotating member may include, for example, a motor
for rotating the display panel assembly 110 by about 180 degrees in
interlock with the ascending/descending member, and the like.
[0069] However, the configuration of the buffer unit 124 is not
limited thereto, but the buffer unit 124 may have any component
capable of rotating the display panel assembly 110 by 180 degrees
such that upper and lower sides of the display panel assembly 110
are reversed.
[0070] In an embodiment, each of the ACF attachment unit 121, the
preliminary compression unit 122, the primary compression unit 123
and the buffer unit 124 may include or be configured with a
conveyor that accommodates the display panel assembly 110 and is
transferable in both directions. Each of the conveyors of the ACF
attachment unit 121, the preliminary compression unit 122, the
primary compression unit 123 and the buffer unit 124 transfers
(firstly transfers) the display panel assembly 110 in a first
direction (i.e., a direction from the gate adhesion unit 11 to the
PCB adhesion process unit 20) during the first TAB process and the
second TAB process. In an embodiment, each of the conveyors of the
ACF attachment unit 121, the preliminary compression unit 122, the
primary compression unit 123 and the buffer unit 124 retransfers
(secondly transfers) the display panel assembly 110 in a second
direction (i.e., a direction from the PCB adhesion process unit 20
to the gate adhesion unit 11) during a conveying process between
the first TAB process and the second TAB process.
[0071] In an embodiment, as shown in FIG. 4, the buffer unit 124
may be provided between the gate adhesion unit 11 and the ACF
attachment unit 121, but the disclosure is not limited thereto. In
an alternative embodiment, the buffer unit 124 may be provided
between the primary compression unit 123 and the PCB adhesion
process unit 20 as shown in FIG. 5.
[0072] In an embodiment, when the buffer unit 124 is provided
between the gate adhesion unit 11 and the ACF attachment unit 121,
the display panel assembly 110 is transferred via the primary
compression unit 123, the preliminary compression unit 122 and the
ACF attachment unit 121 during the above-described transferring
process, to be transferred to the buffer unit 124. The buffer unit
124 may rotate the retransferred display panel assembly 110.
[0073] In such an embodiment, when the buffer unit 124 is provided
between the primary compression unit 123 and the PCB adhesion
process unit 20, the buffer unit 124 rotates the display panel
assembly 110 during the above-described transferring process and
then retransfers the rotated display panel assembly 110 to the
primary compression unit 123. Then, the rotated display panel
assembly 110 is conveyed via the primary compression unit 123, the
preliminary compression unit 122 and the ACF attachment unit
121.
[0074] The PCB adhesion process unit 20 performs a process of
allowing the PCB to be adhered to the first COF and the second COF,
which are attached onto the display panel assembly 110 transferred
from the COF adhesion process unit 10. The adhesion of the PCB may
be performed using a method identical or similar to that used for
the source driving circuit 320, but a detailed process method is
not particularly limited.
[0075] FIGS. 6 to 9 are plan views illustrating a bonding method
according to an embodiment of the disclosure.
[0076] Referring to FIGS. 1 to 9, an embodiment of the bonding
method may include a first TAB process, a retransferring process
and a second TAB process. The display panel assembly 110 is
transferred in the first direction (i.e., the direction from the
gate adhesion unit 11 to the PCB adhesion process unit 20) during
the first TAB process and the second TAB process, and is
transferred in the second direction (i.e., the direction from the
PCB adhesion process unit 20 to the gate adhesion unit 11) during
the retransferring process.
[0077] During the first TAB process, the display panel assembly 110
is transferred to the ACF attachment unit 121 in a state in which
the gate driving circuit 310 is attached by the gate adhesion unit
11 as shown in FIG. 6. In an embodiment, as shown in FIG. 6, the
gate driving circuit 310 is attached to both sides of the display
panel assembly 110, but not being limited thereto. Alternatively,
the gate driving circuit 310 may be attached to only one side of
the display panel assembly 110.
[0078] The display panel assembly 110 is transferred in a state in
which side surfaces, at which the source connection pads SP1 and
SP2 are formed, are aligned adjacent to the first ACF transfer unit
125. In an embodiment, when the buffer unit 124 between the gate
adhesion unit 11 and the ACF attachment unit 121, the display panel
assembly 110 may be transferred to the ACF attachment unit 121 via
the buffer unit 124.
[0079] During the first TAB process, the ACF attachment unit 121
attaches a first ACF transferred from the first ACF transfer unit
125 to the first source connection pad SP1 on the display panel
assembly 110.
[0080] The preliminary compression unit 122 preliminarily
compresses a first COF transferred from the first COF transfer unit
127 on the first ACF, and the primary compression unit 123
primarily compresses the first COF. The first COF is used to form a
first source driving circuit 321, and may include a conductive lead
line to be electrically connected to the first source connection
pad SP1. The first COF attached on the display panel assembly 110
by such a process is illustrated in FIG. 7.
[0081] The retransferring process is performed after the first TAB
process. The display panel assembly 110 is rotated and
retransferred during the retransferring process.
[0082] In an embodiment, as shown in FIG. 4, the display panel
assembly 110 is conveyed to the buffer unit 124 via the preliminary
compression unit 122 and the ACF attachment unit 121 from the
primary compression unit 123 after the first COF is primarily
compressed. The buffer unit 124 rotates the retransferred display
panel assembly 110 by 180 degrees and then transfers the rotated
display panel assembly 110 to the ACF attachment unit 121.
[0083] In an alternative embodiment, as shown in FIG. 5, the
display panel assembly 110 is transferred to the buffer unit 124
after the first COF is primarily compressed. The buffer unit 124
rotates the conveyed display panel assembly 110 by 180 degrees.
Subsequently, the rotated display panel assembly 110 is
retransferred to the ACF attachment unit 121 via the primary
compression unit 123 and the preliminary compression unit 122 from
the buffer unit 124.
[0084] The upper and lower sides of the display panel assembly 110
are reversed by the rotation as shown in FIG. 8, so that the side
surfaces, at which the source connection pads SP1 and SP2 are
formed, are aligned adjacent to the second ACF transfer unit
126.
[0085] The second TAB process is performed after the retransferring
process. During the second TAB process, the ACF attachment unit 121
attaches a second ACF transferred from the second ACF transfer unit
126 to the second source connection pad SP2 on the display panel
assembly 110. The first ACF and the first COF, which are attached
in the first TAB process, are interposed between the second ACF and
the second source connection pad SP2.
[0086] The preliminary compression unit 122 preliminarily
compresses a second COF transferred from the second COF transfer
unit 128 on the second ACF, and the primary compression unit 123
primarily compresses the preliminarily compressed second COF. The
second COF is used to form the second source driving circuit 322,
and may include a conductive lead line to be electrically connected
to the second source connection pad SP2. The second COF attached
onto the display panel assembly 110 by such a process is
illustrated in FIG. 9.
[0087] After the source driving circuits 321 and 322 are adhered
onto the display panel assembly 110 as described above, the display
panel assembly 110 may be transferred to the PCB adhesion process
unit 20.
[0088] As described above, according to embodiments of the
disclosure, a bonding process may be efficiently performed while
not increasing the layout of bonding process facilities through two
TAB processes and a retransferring process provided
therebetween.
[0089] Herein, the bonding process for the source driving circuit
are described in detail. However, such bonding process may be
applied for the gate driving circuit and PCB adhesion without
departing from the technical spirit and scope of the
disclosure.
[0090] In embodiments of the bonding apparatus and the bonding
method according to the disclosure, the layout of process
facilities may be reduced in a TAB process of a COF.
[0091] Exemplary embodiments of the invention have been disclosed
herein, and although specific terms are employed, they are used and
are to be interpreted in a generic and descriptive sense only and
not for purpose of limitation. In some instances, as would be
apparent to one of ordinary skill in the art as of the filing of
the application, features, characteristics, and/or elements
described in connection with a particular embodiment may be used
singly or in combination with features, characteristics, and/or
elements described in connection with other embodiments unless
otherwise specifically indicated. Accordingly, it will be
understood by those of skill in the art that various changes in
form and details may be made without departing from the spirit and
scope of the invention as set forth in the following claims.
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