U.S. patent application number 16/338260 was filed with the patent office on 2020-05-07 for chip bonding apparatus and bonding method.
The applicant listed for this patent is SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.. Invention is credited to Feibiao CHEN, Xiaoyu JIANG, Tianming WANG, Hai XIA.
Application Number | 20200144218 16/338260 |
Document ID | / |
Family ID | 61763126 |
Filed Date | 2020-05-07 |
United States Patent
Application |
20200144218 |
Kind Code |
A1 |
WANG; Tianming ; et
al. |
May 7, 2020 |
CHIP BONDING APPARATUS AND BONDING METHOD
Abstract
Provided are a chip bonding apparatus and bonding method. The
apparatus comprises: a chip supply unit (10); a substrate supply
unit (20); a first pick-up assembly (30) arranged between the chip
supply unit (10) and the substrate supply unit (20), comprising a
first rotating component and a first pick-up head arranged on the
first rotating component; a second pick-up assembly (40) comprising
a second rotating component and a second pick-up head arranged on
the second rotating component, wherein the first pick-up assembly
(30) picks up a chip (60) from the chip supply unit (10) or the
second pick-up assembly (40), and delivers the chip (60) onto a
substrate of the substrate supply unit (20) to complete the
bonding; and a vision unit (50) for realizing the alignment of the
chip (60) and the substrate on the first pick-up assembly (30),
wherein the chip supply unit (10), the substrate supply unit (20),
the second pick-up assembly (40) and the vision unit (50) are
respectively located on four work positions of the first pick-up
head. The chip (60) is transported through rotation, improving the
productivity of chip (60) bonding; and the chip (60) is reversed by
utilizing the second pick-up assembly (40), which is compatible
with two ways of bonding, i.e. a mark face of the chip (60) facing
upwards and downwards.
Inventors: |
WANG; Tianming; (Shanghai,
CN) ; JIANG; Xiaoyu; (Shanghai, CN) ; XIA;
Hai; (Shanghai, CN) ; CHEN; Feibiao;
(Shanghai, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD. |
Shanghai |
|
CN |
|
|
Family ID: |
61763126 |
Appl. No.: |
16/338260 |
Filed: |
September 26, 2017 |
PCT Filed: |
September 26, 2017 |
PCT NO: |
PCT/CN2017/103331 |
371 Date: |
March 29, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/67144 20130101;
H01L 2224/7565 20130101; H01L 21/681 20130101; H01L 2224/75822
20130101; H01L 24/75 20130101; H01L 2224/75753 20130101; H01L
2224/75745 20130101 |
International
Class: |
H01L 23/00 20060101
H01L023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 30, 2016 |
CN |
201610877730.9 |
Claims
1. A chip bonding apparatus, comprising: a chip supply unit
configured to provide a chip to be bonded; a substrate supply unit
configured to provide a substrate, the substrate supply unit being
disposed opposite to the chip supply unit; a first pickup assembly
disposed between the chip supply unit and the substrate supply unit
and comprising a first rotating part and a first pickup head
disposed on the first rotating part; a second pickup assembly
disposed between the chip supply unit and the substrate supply unit
and comprising a second rotating part and a second pickup head
disposed on the second rotating part, wherein the first pickup
assembly is configured to pick up the chip from the chip supply
unit or from the second pickup assembly and convey the chip to the
substrate on the substrate supply unit to accomplish bonding; and a
vision unit configured to align the chip on the first pickup
assembly with the substrate, wherein the chip supply unit, the
substrate supply unit, the second pickup assembly and the vision
unit are respectively located at four work positions of the first
pickup head.
2. The chip bonding apparatus according to claim 1, wherein the
first pickup assembly comprises one first pickup head which is
switchable, when driven by the first rotating part, among the four
work positions where the chip supply unit, the substrate supply
unit, the second pickup assembly and the vision unit are
respectively located.
3. The chip bonding apparatus according to claim 1, wherein the
first pickup assembly comprises a plurality of first pickup heads
which are uniformly disposed on the first rotating part and spaced
apart from one another along a circumference of the first rotating
part, and each of the plurality of first pickup heads is driven by
the first rotating part to switch among the four work positions
where the chip supply unit, the substrate supply unit, the second
pickup assembly and the vision unit are respectively located.
4. The chip bonding apparatus according to claim 3, wherein the
first pickup assembly comprises four first pickup heads.
5. The chip bonding apparatus according to claim 3, wherein an
angle of each rotation of the first rotating part is equal to an
angle between adjacent first pickup heads.
6. The chip bonding apparatus according to claim 1, wherein the
second pickup head picks up the chip from the chip supply unit and
is driven by the second rotating part to rotate and transfers the
chip to the first pickup head.
7. The chip bonding apparatus according to claim 6, wherein a
rotational angle of the second rotating part is 90 degrees.
8. The chip bonding apparatus according to claim 6, wherein each of
the first pickup head and the second pickup head is a vacuum
suction head.
9. The chip bonding apparatus according to claim 8, wherein the
vacuum suction head is able to translate axially.
10. A chip bonding method used with the chip bonding apparatus
according to claim 1, comprising the following steps: (S1) loading
a chip onto a chip supply unit with a mark surface of the chip
facing upward, and loading a substrate onto a substrate supply
unit; (S2) determining a required orientation of the mark surface
of the chip during bonding; (S3) if the mark surface is required to
face downward during bonding, a first pickup assembly picks up the
chip from the chip supply unit and conveys the chip to the
substrate on the substrate supply unit to complete bonding; and
(S4) if the mark surface is required to face upward during bonding,
a second pickup assembly picks up the chip from the chip supply
unit and conveys the chip to the first pickup assembly which
further conveys the chip to the substrate on the substrate supply
unit to complete bonding.
11. The chip bonding method according to claim 10, wherein steps S3
and S4 each comprise scanning a position of the chip on the first
pickup assembly by a vision unit and aligning the chip with the
substrate.
Description
TECHNICAL FIELD
[0001] The present invention relates to the field of chip bonding
and, in particular, to a chip bonding apparatus and bonding
method.
BACKGROUND
[0002] Chip bonding is an interconnection approach for bonding
chips to a substrate. The chips to be bonded are usually placed on
a separation table with marks thereon facing upward and then are
bonded onto a bonding table by a chip carrier. Existing chip
bonding apparatus needs to pick up the chip from the separation
table, pass it through a long-distance linear transportation to
reach the bonding table, and bond it onto the bonding table, which
significantly limits the bonding throughput. In addition, when
bonding the chips to the substrate on the bonding table, there are
different requirements on the orientation of the mark surfaces on
the chip. Some of the chips are required to be bonded with the mark
surfaces facing upward, while others are required to be bonded with
the mark surfaces facing downward. Thus, it is necessary to choose
a corresponding bonding apparatus to meet the requirement of mark
surface orientation during bonding, leading to an additional
reduction in throughput.
SUMMARY
[0003] It is an object of the present invention to provide a chip
bonding apparatus and bonding method to overcome the existed
problem of low bonding throughput of chips.
[0004] To solve the above technical problem, the present invention
provides a chip bonding apparatus comprising:
[0005] a chip supply unit configured to provide a chip to be
bonded;
[0006] a substrate supply unit configured to provide a substrate,
the substrate supply unit being disposed opposite to the chip
supply unit;
[0007] a first pickup assembly disposed between the chip supply
unit and the substrate supply unit and comprising a first rotating
part and a first pickup head disposed on the first rotating
part;
[0008] a second pickup assembly disposed between the chip supply
unit and the substrate supply unit and comprising a second rotating
part and a second pickup head disposed on the second rotating part,
wherein the first pickup assembly is configured to pick up the chip
from the chip supply unit or from the second pickup assembly and
convey the chip to the substrate on the substrate supply unit to
accomplish bonding; and
[0009] a vision unit configured to align the chip on the first
pickup assembly with the substrate, wherein the chip supply unit,
the substrate supply unit, the second pickup assembly and the
vision unit are respectively located at four work stations of the
first pickup head.
[0010] Preferably, the first pickup assembly comprises one first
pickup head which is switchable, when driven by the first rotating
part, among the four work positions where the chip supply unit, the
substrate supply unit, the second pickup assembly and the vision
unit are respectively located.
[0011] Preferably, the first pickup assembly comprises a plurality
of first pickup heads which are uniformly disposed on the first
rotating part and spaced apart from one another along the
circumference of the first rotating part, and each of the plurality
of first pickup heads is driven by the first rotating part to
switch among the four work positions where the chip supply unit,
the substrate supply unit, the second pickup assembly and the
vision unit are respectively located.
[0012] Preferably, the first pickup assembly comprises four first
pickup heads.
[0013] Preferably, the angle of each rotation of the first rotating
part is equal to the angle between the adjacent first pickup
heads.
[0014] Preferably, the second pickup head picks up the chip from
the chip supply unit, is driven by the second rotating part to
rotate, and transfers the chip to the first pickup head.
[0015] Preferably, the rotational angle of the second rotating part
is 90 degrees.
[0016] Preferably, each of the first pickup head and the second
pickup head is a vacuum suction head.
[0017] Preferably, the vacuum suction head is able to translate
axially.
[0018] The present invention also provides a chip bonding method
used with the chip bonding apparatus as defined above, comprising
the following steps:
[0019] (S1) loading a chip onto the chip supply unit with a mark
surface of the chip facing upward, and loading a substrate onto the
substrate supply unit;
[0020] (S2) determining a required orientation of the mark surface
of the chip when bonding;
[0021] (S3) if the mark surface is required to face downward during
bonding, the first pickup assembly picks up the chip from the chip
supply unit and conveys the chip to the substrate on the substrate
supply unit to complete bonding; and
[0022] (S4) if the mark surface is required to face upward during
bonding, the second pickup assembly picks up the chip from the chip
supply unit and conveys the chip to the first pickup assembly which
further conveys the chip to the substrate on the substrate supply
unit to complete bonding.
[0023] Preferably, steps S3 and S4 each comprise scanning the
position of the chip on the first pickup assembly by the vision
unit and aligning the chip with the substrate.
[0024] Compared to the prior art, the chip bonding apparatus and
bonding method provided in the present invention offer the
following advantages:
[0025] 1. In the present invention, the opposite arrangement
between the substrate supply unit and the chip supply unit in
combination with the rotation of the first rotating part, enables
the transmission of the chip from the chip supply unit to the
substrate supply unit, and converts the conventional long-distance
linear transmission to vertical flip transmission, thereby
resulting in a largely improved bonding productivity of chips.
[0026] 2. The first pickup assembly alone can be used to accomplish
pickup and bonding of the chip when the chip is required to be
bonded with its mark surface facing downward, and in the case when
the chip is required to be bonded with its mark surface facing
upward, the handover from the second pickup assembly to the first
pickup assembly is utilized to accomplish the flip of the chip
after the chip is picked up by the second pickup assembly, thereby
enabling both cases that the chip is bonded with its mark surface
facing upward and downward.
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] FIG. 1 is a schematic structural diagram of a chip bonding
apparatus according to an embodiment of the present invention.
[0028] FIG. 2 is a schematic structural diagram of a chip according
to an embodiment of the present invention.
[0029] FIG. 3 is a schematic structural diagram of a first pickup
assembly according to an embodiment of the present invention.
[0030] FIG. 4 is a schematic diagram of a transfer process between
a first pickup assembly and a second pickup assembly when the mark
surface of a chip is required to face upward according to an
embodiment of the present invention.
[0031] In the figures: 10--chip supply unit; 20--substrate supply
unit; 30--first pickup assembly; 31--first rotating part; 32--first
pickup head; 40--second pickup assembly; 41--second rotating part;
42--second pickup head; 50--vision unit; 60--chip; and 61--mark
surface.
DETAILED DESCRIPTION
[0032] To make the objects, advantages and features of the present
invention more clear, the embodiments of the present invention will
be described in greater detail below with reference to accompanying
figures. It should be noted that the accompanying drawings are
presented in a very simplified form and not necessarily presented
to scale, with the only intention to facilitate convenience and
clarity in explaining the object of the present invention.
[0033] A chip bonding apparatus provided in the present invention,
as shown in FIG. 1 to FIG. 3, includes:
[0034] a chip supply unit 10 configured to separate a single chip
60 from a wafer and provide the chip 60 to be bonded to a pickup
assembly as described below;
[0035] a substrate supply unit 20 configured to provide a substrate
and disposed opposite to the chip supply unit 10, wherein the
substrate supply unit 20 is disposed over and inverted with respect
to the chip supply unit 10 in this embodiment;
[0036] a first pickup assembly 30 disposed between the chip supply
unit 10 and the substrate supply unit 20 and comprising a first
rotating part 31 and a first pickup head 32 disposed on the first
rotating part 31;
[0037] a second pickup assembly 40 also disposed between the chip
supply unit 10 and the substrate supply unit 20 and comprising a
second rotating part 41 and a second pickup head 42 disposed on the
second rotating part 41, wherein the first pickup assembly 30 picks
up the chip 60 from the chip supply unit 10 or from the second
pickup assembly 40 and conveys the chip to the substrate on the
substrate supply unit 20 to accomplish bonding; and
[0038] a vision unit 50 configured to align the chip 60 on the
first pickup assembly 30 with the substrate, wherein the chip
supply unit 10, the substrate supply unit 20, the second pickup
assembly 40 and the vision unit 50 are respectively located at four
work positions of the first pickup head 30.
[0039] Specifically, according to the present invention, the
reverted arrangement of the substrate supply unit 20 over the chip
supply unit 10 in combination with the rotation of the first
rotating part 31, enables the transmission of the chip 60 from the
chip supply unit 10 to the substrate supply unit 20, and converts
the conventional long-distance linear transmission to vertical flip
transmission, thereby resulting in a largely improved bonding
productivity of chips.
[0040] Preferably, the number of the first pickup head 32 may be
one and the first pickup head 32 is driven by the first rotating
part 31 to switch among the four work positions where the chip
supply unit 10, the substrate supply unit 20, the second pickup
assembly 40 and the vision unit 50 are respectively positioned.
Specifically, the first pickup head 32 picks up the chip 60 at the
work station corresponding to the chip supply unit 10 or the second
pickup assembly 40, receives a position scan at the work station
corresponding to the vision unit 50 and implements bonding at the
work station corresponding to the substrate supply unit 20.
[0041] Preferably, please particularly refer to FIG. 3, there are a
plurality of first pickup heads 32 (this embodiment takes four
first pickup heads 32 as an example). The four first pickup heads
32 are uniformly disposed on the first rotating part 31 and spaced
apart from one another in a circumferential direction. Each of the
first pickup heads 32 is driven by the first rotating part 31 to
switch among the four work positions where the chip supply unit 10,
the substrate supply unit 20, the second pickup assembly 40 and the
vision unit 50 are respectively positioned. Preferably, please
refer to FIG. 1, the substrate supply unit 20, the chip supply unit
10, the second pickup assembly 40 and the vision unit 50 are
respectively disposed above the first pickup assembly 30, under the
first pickup assembly 30, at the left of the first pickup assembly
30 and at the right of the first pickup assembly 30. When the first
rotating part 31 stops rotation, the four first pickup heads 32
respectively correspond to the chip supply unit 10, the substrate
supply unit 20, the second pickup assembly 40 and the vision unit
50. In this way, each of the first pickup heads 32 can perform
different actions at different work positions, thereby resulting in
a further improved bonding productivity.
[0042] Preferably, an angle of each rotation of the first rotating
part 31 is equal to an angle between adjacent first pickup heads
32. Continuously taking the four first pickup heads 32 as an
example, the angle of each rotation of the first rotating part 31
is 90 degrees.
[0043] Preferably, please particularly refer to FIG. 1 and FIG. 4,
the second pickup head 42 picks up the chip 60 from the chip supply
unit 10, is driven by the second rotating part 41 to rotate, and
transfers the chip 60 to the first pickup head 32. Preferably, the
angle of each rotation of the second rotating part 41 is 90
degrees. In the present invention, the chip 60 is transferred to
one of the first pickup heads 32 through the rotation of the second
rotating part 41 after the chip 60 is picked up by the second
pickup head 42, and thereby achieving the flip over of the chip 60
by the handover between the first pickup head 32 and the second
pickup head 42.
[0044] Preferably, in this embodiment, each of the first pickup
heads 32 and the second pickup heads 42 is a vacuum suction head
capable of linear movement along an axial direction to facilitate
the absorption and pickup of the chip 60.
[0045] Please particularly refer to FIG. 4, the present invention
also provides a chip bonding method used with the chip bonding
apparatus as defined above, comprising the following steps:
[0046] (S1) loading a wafer with a chip 60 onto the chip supply
unit 10, wherein the mark surface 61 of the chip 60 faces upward,
and loading a substrate onto the substrate supply unit 20;
[0047] (S2) determining a required orientation of the mark surface
61 of the chip 60 during its bonding;
[0048] (S3) if the mark surface 61 is required to face downward
during bonding, the first pickup assembly 30 picks up the chip 60
from the chip supply unit 10 and conveys the chip 60 to the
substrate on the substrate supply unit 20 to complete the bonding.
During this process, the second pickup assembly 40 keeps stationary
at the initial position;
[0049] (S4) if the mark surface 61 is required to face upward
during bonding, the second pickup assembly 40 picks up the chip 60
from the chip supply unit 10 and transfers the chip 60 to the first
pickup assembly 30. The entire handover is as shown in FIG. 4.
[0050] The second pickup head 42 firstly picks up the chip 60 and
switches to a transfer location. One of the first pickup heads 32
then stretches out to receive the chip 60 and retracts back with
the chip 60. Subsequently, the second pickup head 42 rotates
downward to the original position, meanwhile the first pickup head
32 rotates to the bonding station through the driving of the
rotating part 31, and extends upward to bond the chip 60. Of
course, after the handover of the chip 60 from the second pickup
head 42 to the first pickup head 32, the first pickup assembly
conveys the chip 60 onto the substrate on the substrate supply unit
20 to accomplish the bonding.
[0051] Preferably, steps S3 and S4 each include configuring a
vision unit 50 to scan the position of the chip 60 on the first
pickup assembly in order to achieve alignment between the chip 60
and the substrate.
[0052] In summary, the present invention provides a chip bonding
apparatus and bonding method. The chip bonding apparatus includes:
a chip supply unit 10 configured to provide a chip 60 to be bonded;
a substrate supply unit 20 configured to provide a substrate and
disposed opposite to the chip supply unit 10; a first pickup
assembly 30 disposed between the chip supply unit 10 and the
substrate supply unit 20 and comprising a first rotating part 31
and a first pickup head 32 disposed on the first rotating part 31;
a second pickup assembly 40 disposed between the chip supply unit
10 and the substrate supply unit 20 and comprising a second
rotating part 41 and a second pickup head 42 disposed on the second
rotating part 41, wherein the first pickup assembly 30 picks up the
chip 60 from the chip supply unit 10 or from the second pickup
assembly 40 and conveys the chip 60 to the substrate on the
substrate supply unit 20 to accomplish bonding; and a vision unit
50 configured to align the chip 60 on the first pickup assembly 30
with the substrate, wherein the chip supply unit 10, the substrate
supply unit 20, the second pickup assembly 40 and the vision unit
50 are respectively located at four work positions of the first
pickup head 42. In the present invention, the positional
relationship between the substrate supply unit 20 and the chip
supply unit 10, in combination with the rotation of the first
rotating part 31, enables the transmission of the chip 60 and
converts the long-distance linear transmission to vertical flip
transmission, thereby resulting in a largely improved bonding
productivity of chips. In addition, the first pickup assembly 30
alone can be used to accomplish pickup and bonding of the chip 60
when the chip 60 is required to be bonded with its mark surface 61
facing downward, and in the case when the chip is required to be
bonded with the its mark surface facing upward, the handover from
the second pickup assembly 40 to the first pickup assembly 30 is
utilized to accomplish the flip of the chip 60 after the chip 60 is
picked up by the second pickup assembly 40, thereby enabling both
cases that the chip is bonded with its mark surface facing upward
and downward.
[0053] It is apparent that those skilled in the art can make
various modifications and variations of the present invention
without departing from the spirit and scope thereof. Accordingly,
the invention is intended to embrace all such modifications and
variations if they fall within the scope of the appended claims and
equivalents thereof.
* * * * *