U.S. patent application number 16/198551 was filed with the patent office on 2020-04-30 for cooling device.
This patent application is currently assigned to INVENTEC (PUDONG) TECHNOLOGY CORPORATION. The applicant listed for this patent is INVENTEC (PUDONG) TECHNOLOGY CORPORATION INVENTEC CORPORATION. Invention is credited to Hung-Ju CHEN, Tsai-Kuei CHENG.
Application Number | 20200132388 16/198551 |
Document ID | / |
Family ID | 64875392 |
Filed Date | 2020-04-30 |
United States Patent
Application |
20200132388 |
Kind Code |
A1 |
CHENG; Tsai-Kuei ; et
al. |
April 30, 2020 |
COOLING DEVICE
Abstract
A cooling device is configured to cool a heat source. The
cooling device includes a tank, a cover and a cooling liquid. The
tank includes a bottom surface, a tank inlet and a tank outlet. The
cover is disposed on the tank. The cover and the tank form a space
therebetween, and the space is configured to accommodate the heat
source. The cooling liquid is located in the space.
Inventors: |
CHENG; Tsai-Kuei; (Taipei
City, TW) ; CHEN; Hung-Ju; (Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INVENTEC (PUDONG) TECHNOLOGY CORPORATION
INVENTEC CORPORATION |
Shanghai City
Taipei City |
|
CN
TW |
|
|
Assignee: |
INVENTEC (PUDONG) TECHNOLOGY
CORPORATION
Shanghai City
CN
INVENTEC CORPORATION
Taipei City
TW
|
Family ID: |
64875392 |
Appl. No.: |
16/198551 |
Filed: |
November 21, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28D 2021/0028 20130101;
F28D 15/025 20130101; F28D 15/0266 20130101 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 26, 2018 |
CN |
201811263995.5 |
Claims
1. A cooling device, configured to cool a heat source, comprising:
a tank, including a bottom surface, a tank inlet and a tank outlet;
a cover, disposed on the tank, the cover and the tank forming a
space therebetween, and the space configured to accommodate the
heat source; and a cooling liquid, located in the space.
2. The cooling device according to claim 1, wherein the tank inlet
of the tank is closer to the bottom surface of the tank than the
tank outlet.
3. The cooling device according to claim 2, further comprising a
liquid channel and a vapor channel, the liquid channel connected to
the tank via the tank inlet, and the vapor channel connected to the
tank via the tank outlet.
4. The cooling device according to claim 3, wherein the vapor
channel includes an inlet end and an outlet end, the inlet end is
connected to the tank outlet of the tank, and the inlet end is
closer to the bottom surface of the tank than the outlet end.
5. The cooling device according to claim 4, wherein the cover
includes a first side and a second side, the first side is closer
to the tank outlet of the tank than the second side, and the first
side is farther away from the bottom surface of the tank than the
second side.
6. The cooling device according to claim 3, further comprising a
heat exchange portion, wherein the vapor channel is connected to
the liquid channel via the heat exchange portion.
7. The cooling device according to claim 6, further comprising a
heat dissipation device connected to the heat exchange portion.
8. The cooling device according to claim 1, further comprising an
electrical connector connected to the cover, wherein the electrical
connector is configured to be electrically connected to the heat
source.
9. The cooling device according to claim 1, further comprising a
liquid pump device connected to the tank.
10. The cooling device according to claim 1, further comprising an
air pump device connected to the tank.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This non-provisional application claims priority under 35
U.S.C. .sctn. 119(a) on Patent Application No(s). 201811263995.5
filed in China, P.R.C. on Oct. 26, 2018, the entire contents of
which are hereby incorporated by reference.
TECHNICAL FIELD
[0002] The present disclosure relates to a cooling device, more
particularly to a cooling device including a tank inlet and a tank
outlet.
BACKGROUND
[0003] A common immersion cooling device includes a tank, which is
divided to a liquid portion and a vapor portion. The liquid portion
is located below the vapor portion and configured to accommodate a
cooling liquid which is volatile and low boiling, and there is a
heat dissipation device in the vapor portion. A server can be
immersed into the cooling liquid for the cooling liquid to absorb
heat generated by the server. A portion of the cooling liquid would
evaporate into vapor by the heat. When the vapor flows to the vapor
portion, the heat in the vapor can be removed by the heat
dissipation device, the then the vapor is condensed into the
cooling liquid and drops back to the liquid portion of the tank due
to gravity.
SUMMARY
[0004] According to one aspect of the present disclosure, a cooling
device is configured to cool a heat source. The cooling device
includes a tank, a cover and a cooling liquid. The tank includes a
bottom surface, a tank inlet and a tank outlet. The cover is
disposed on the tank. The cover and the tank form a space
therebetween, and the space is configured to accommodate the heat
source. The cooling liquid is located in the space.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The present disclosure will become more fully understood
from the detailed description given hereinbelow and the
accompanying drawings which are given by way of illustration only
and thus are not intending to limit the present disclosure and
wherein:
[0006] FIG. 1 is an exploded cross-sectional view of a cooling
device and a heat source according to one embodiment of the present
disclosure;
[0007] FIG. 2 is a cross-sectional view of the cooling device when
the heat source is disposed in the cooling device;
[0008] FIG. 3 is a cross-sectional view of the cooling device
during the operation of the heat source in FIG. 1;
[0009] FIG. 4 is a cross-sectional view of a cooling device
according to another embodiment of the present disclosure during
the operation of the heat source;
[0010] FIG. 5 is a cross-sectional view of a cooling device
according to yet another embodiment of the present disclosure
during the operation of the heat source;
[0011] FIG. 6 is a cross-sectional view of a cooling device
according to still another embodiment of the present disclosure
during the operation of the heat source;
[0012] FIG. 7 is a cross-sectional view of a cooling device
according to still yet another embodiment of the present disclosure
during the operation of the heat source;
[0013] FIG. 8 is a cross-sectional view of a cooling device
according to still yet another embodiment of the present disclosure
during the operation of the heat source;
[0014] FIG. 9 is a cross-sectional view of a cooling device
according to still yet another embodiment of the present disclosure
during the operation of the heat source;
[0015] FIG. 10 is a cross-sectional view of a cooling device
according to still yet another embodiment of the present disclosure
during the operation of the heat source; and
[0016] FIG. 11 is a cross-sectional view of the cooling device and
the heat source in FIG. 10 when the operation is completed.
DETAILED DESCRIPTION
[0017] In the following detailed description, for purposes of
explanation, numerous specific details are set forth in order to
provide a thorough understanding of the disclosed embodiments. It
will be apparent, however, that one or more embodiments may be
practiced without these specific details. In other instances,
well-known structures and devices are schematically shown in order
to simplify the drawing.
[0018] Please refer to FIG. 1 to FIG. 2, FIG. 1 is an exploded
cross-sectional view of a cooling device and a heat source
according to one embodiment of the present disclosure, and FIG. 2
is a cross-sectional view of the cooling device when the heat
source is disposed in the cooling device.
[0019] This embodiment provides a cooling device 10a (e.g., an
immersion cooling device) configured to cool a heat source 20
(e.g., a server). The cooling device 10a includes a tank 100a, a
cover 200a and a cooling liquid 300a. The tank 100a includes a
bottom surface 110a, a tank inlet 120a and a tank outlet 130a. As
shown in the figure, the tank 100a may be placed on a platform P
(e.g., a table) in a way that the bottom surface 110a of the tank
100a faces the platform P. The cover 200a is disposed on the tank
100a. In this embodiment and some embodiments of the present
disclosure, the cover 200a and the bottom surface 110a are
respectively located at two opposite sides of the tank 100a, but
the disclosure is not limited thereto. In some other embodiments,
the cover and the bottom surface may be located adjacent to each
other. In this embodiment, the cover 200a and the tank 100a form a
space S therebetween. The space S is configured to accommodate the
heat source 20. The cooling liquid 300a is located in the space S.
In this embodiment and some embodiments of the present disclosure,
a liquid level 310a of the cooling liquid 300a is located farther
away from the bottom surface 110a of the tank 100a than the heat
source 20, and the heat source 20 is completely immersed in the
cooling liquid 300a, but the disclosure is not limited thereto. In
some other embodiments, as long as heat generated by the heat
source is able to be transferred to the cooling liquid, the heat
source may be partially immersed in the cooling liquid. In this
embodiment and some embodiments of the present disclosure, the
cooling liquid 300a is volatile, non-conductive and low boiling
liquid, such as refrigerant, but the disclosure is not limited
thereto. In some other embodiments, the cooling liquid may be pure
water or liquid fluoride. In this embodiment, when a signal of a
wire of the heat source 20 contacting the cooling liquid 300a is 1
kHz, a permittivity of the cooling liquid 300a is close to 1. In
this embodiment and some embodiments of the present disclosure, the
permittivity of the cooling liquid 300a is approximately 1.8. In
this embodiment, when the heat source 20 and the cooling liquid
300a are both accommodated in the space S, heat generated by the
heat source 20 is absorbed by the cooling liquid 300a so as to
cause the cooling liquid 300a to evaporate into vapor form (e.g.,
vapor 320a shown in FIG. 2), and the vapor 320a may be discharged
out of the space S via the tank outlet 130a, thereby dissipating
the heat. Therefore, there would not be too much vapor 320a
remaining in the space S, such that less of the vapor 320a would
escape from the opening for receiving the cover 200a when the cover
is removed.
[0020] In this embodiment and some embodiments of the present
disclosure, the cooling device 10a further includes a liquid
channel 400a and a vapor channel 500a, the liquid channel 400a is
connected to the tank inlet 120a, and the vapor channel 500a is
connected to the tank outlet 130a. The cooling liquid 300a may be
poured into the liquid channel 400a to flow into the space S and to
replenish the evaporated cooling liquid 300a. The vapor 320a may
flow into the vapor channel 500a via the tank outlet 130a. The
vapor 320a has a lower density than that of the cooling liquid
300a, a volume flow rate of the vapor 320a is higher than that of
the cooling liquid 300a; therefore, to reach a balance of mass flow
rate between the tank inlet 120a and the tank outlet 130a, an inner
diameter of the vapor channel 500a may be larger than an inner
diameter of the liquid channel 400a, but the disclosure is not
limited thereto. In some other embodiments, the balance may also be
reached by increasing the quantity of the vapor channel.
[0021] Please refer to FIG. 3, which is a cross-sectional view of
the cooling device during the operation of the heat source in FIG.
1. During the operation of the heat source 20, a part of the
cooling liquid 300a was evaporated into vapor form (i.e., vapor
320a), and then the liquid level 310a of the cooling liquid 300a is
fallen to a liquid level 310a'. The vapor 320a leaves the space S
from the tank outlet 130a, and the cooling liquid 300a flows into
the space S via the tank inlet 120 to replenish the evaporated
cooling liquid 300a. Generally, liquid tends to flow down and gas
tends to go up, thus, in this embodiment and some embodiments of
the present disclosure, the tank inlet 120a of the tank 100a is
located closer to the bottom surface 110a of the tank 100a than the
tank outlet 130a, but the disclosure is not limited thereto. In
some other embodiments, the tank inlet and the tank outlet may be
located at the same level.
[0022] In this embodiment and some embodiments of the present
disclosure, the vapor channel 500a includes an inlet end 510a and
an outlet end 520a. The inlet end 510a is connected to the tank
outlet 130a of the tank 100a, and a distance Dla between the inlet
end 510a and the bottom surface 110a is substantially equal to a
distance D2a between the outlet end 520a and the bottom surface
110a. In other words, the inlet end 510a and the outlet end 520a
are substantially located at the same level, but the disclosure is
not limited thereto. Please refer to FIG. 4, which is a
cross-sectional view of a cooling device according to another
embodiment of the present disclosure during the operation of the
heat source. This embodiment provides a cooling device 10b, which
is similar to the aforementioned cooling device 10a, thus a
detailed description of the similar features between these
embodiments may not be repeated. In this embodiment and some
embodiments of the present disclosure, a distance Dlb of an inlet
end 510b and a bottom surface 110b of the cooling device 10b is
smaller than a distance D2b of an outlet end 520b and the bottom
surface 110b of the cooling device 10b. In other words, a vapor
channel 500b is disposed to a tank 100b in an inclined manner.
Accordingly, a liquid level 310b of a cooling liquid 300b is
allowed to be closer to a cover 200b and the cooling liquid 300b is
allowed flows into the inlet end 510b and occupy a portion of the
vapor channel 500b, ensuring only the vapor form of the cooling
liquid 300b (i.e., vapor 320b) to pass through the outlet end 520b
of the vapor channel 500b.
[0023] In the previous embodiment, the cover 200a is placed
horizontally, but the disclosure is not limited thereto. Please
refer to FIG. 5, which is a cross-sectional view of a cooling
device according to yet another embodiment of the present
disclosure during the operation of the heat source. This embodiment
provides a cooling device 10c, which is similar to the
aforementioned cooling device 10a, thus a detailed description of
the similar features between these embodiments may not be repeated.
In this embodiment and some embodiments of the present disclosure,
a cover 200c of the cooling device 10c includes a first side 210c
and a second side 220c, a distance D3 between the first side 210c
and a bottom surface 110c is larger than a distance D4 between the
second side 220c and the bottom surface 110c. In other words, the
first side 210c is located farther away from the bottom surface
110c of the tank 100c than the second side 220c. In addition, the
first side 210c is closer to a tank outlet 130c of a tank 100c than
the second side 220c, such that the vapor form of the cooling
liquid 300c (i.e., vapor 320c) tends to flow toward the first side
210c. Consequently, the vapor 320c would easily leave the space S
via the tank outlet 130c.
[0024] Please refer to FIG. 6, which is a cross-sectional view of a
cooling device according to still another embodiment of the present
disclosure during the operation of the heat source. This embodiment
provides a cooling device 10d, which is similar to the
aforementioned cooling device 10a, thus a detailed description of
the similar features between these embodiments may not be repeated.
In this embodiment and some embodiments of the present disclosure,
the cooling device 10d further includes a heat exchange portion
600d. The heat exchange portion 600d is, for example, a tube, but
the disclosure is not limited thereto. In some other embodiments,
the heat exchange portion may be another tank. In this embodiment
and some embodiments of the present disclosure, the heat exchange
portion 600d includes a first end 610d and a second end 620d. The
first end 610d is connected to a vapor channel 500d and the second
end 620d is connected to a liquid channel 400d. The vapor 320d
flows to the first end 610d of the heat exchange portion 600d from
the vapor channel 500d. The heat exchange portion 600d is
configured to provide an extra space for the processes of
condensation and evaporation of a cooling liquid 300d to occur
(i.e., the transition from the cooling liquid 300d and vapor 320d).
The vapor 320d turns into the cooling liquid 300d in the heat
exchange portion 600d and flows back to the liquid channel 400d
through the second end 620d due to gravity. In short, the cooling
liquid 300d in the space S is able to be evaporated into the
gaseous phase and then is condensed to flow back to the space S,
forming a circulation without losing any of it.
[0025] Please refer to FIG. 7, which is a cross-sectional view of a
cooling device according to still yet another embodiment of the
present disclosure during the operation of the heat source. This
embodiment provides a cooling device 10e, which is similar to the
aforementioned cooling device 10a, thus a detailed description of
the similar features between these embodiments may not be repeated.
In this embodiment and some embodiments of the present disclosure,
the cooling device 10e further includes a heat dissipation device
700e. The heat dissipation device 700e is, for example, a liquid
cooling device and is connected to a heat exchange portion 600e.
The heat dissipation device 700e is able to absorb and then
dissipate heat in the vapor 320e in the heat exchange portion 600e.
Therefore, the heat dissipation device 700e is able to accelerate
the phase transition of the cooling liquid 300e. In some other
embodiments, the heat dissipation device may be a fan that is not
in contact with the heat exchange portion; in such a case, the
airflow generated by the fan also helps to accelerate the phase
transition of the cooling liquid.
[0026] Please refer to FIG. 8, which is a cross-sectional view of a
cooling device according to still yet another embodiment of the
present disclosure during the operation of the heat source. This
embodiment provides a cooling device 10f, which is similar to the
aforementioned cooling device 10a, thus a detailed description of
the similar features between these embodiments may not be repeated.
In this embodiment and some embodiments of the present disclosure,
the cooling device 10f further includes an electrical connector
800f disposed at a cover 200f. In addition, the electrical
connector 800f is located in a hole (not shown in the figures) of
the cover 200f and is electrically connected to the heat source 20
via a wire 22 located in the tank 100f. The electrical connector
800f is configured to transmit electricity or signal to the heat
source 20 or receive electricity or signal from the heat source 20.
This allows the heat source 20 to exchange electrical power or
signal to another external device through the wire 22 and the
electrical connector 800f. In addition, the hole of the cover 200
may be, for example, in a square shape, and the electrical
connector 800f is easier to be sealed to the cover 200f with
respect to the conventional gap between the wire and the tank. As a
result, the air-tightness of the tank 100f is increased with
respect to the conventional tank.
[0027] Please refer to FIG. 9, which is a cross-sectional view of a
cooling device according to still yet another embodiment of the
present disclosure during the operation of the heat source. This
embodiment provides a cooling device 10g, which is similar to the
aforementioned cooling device 10a, thus a detailed description of
the similar features between these embodiments may not be repeated.
In this embodiment and some embodiments of the present disclosure,
the cooling device 10g further includes a liquid pump device 900g,
and a heat exchange portion 600g is a tank. The liquid pump device
900g is connected to and disposed on a liquid channel 400g and is
connected to a tank 100g and the heat exchange portion 600g via the
liquid channel 400g. In this embodiment and some embodiments of the
present disclosure, a cooling liquid 300g in the space S can be
completely pumped to the heat exchange portion 600g by the liquid
pump device 900g. By doing so, the vapor form of the cooling liquid
300g is prevented from escaping from the opening for receiving a
cover 200g when the cover 200g is removed. Further, there may be a
valve (not shown in the figures) disposed in the liquid pump device
900g for preventing the cooling liquid 300g from flowing back to
the space S. During the operating of the heat source 20, the valve
is switched on. However, the valve is optional, and the disclosure
is not limited thereto.
[0028] Please refer to FIG. 10 and FIG. 11, FIG. 10 is a
cross-sectional view of a cooling device according to still yet
another embodiment of the present disclosure during the operation
of the heat source, and FIG. 11 is a cross-sectional view of the
cooling device and the heat source in FIG. 10 when the operation is
completed. This embodiment provides a cooling device 10h, which is
similar to the aforementioned cooling device 10a, thus a detailed
description of the similar features between these embodiments may
not be repeated. In this embodiment and some embodiments of the
present disclosure, the cooling device 10h further includes an air
pump device 1000h located in a heat exchange portion 600h which is
connected to a tank 100g via a vapor channel 500h. In this
embodiment and some embodiments of the present disclosure, the
space S may be filled with air A with the help of the air pump
device 1000h so as to force a cooling liquid 300h and a vapor 320h
to move toward the heat exchange portion 600h. By doing so, most in
the space S is the air A and vapor form of the cooling liquid 300h
is prevented from escaping from the opening for receiving a cover
200h when the cover 200h is removed. Further, there may be a valve
(not shown in the figures) disposed in the air pump device 1000h
for preventing the air A from flowing back to the heat exchange
portion 600h. During the operating of the heat source 20, the valve
is switched on. However, the valve is optional, and the disclosure
is not limited thereto.
[0029] According to the cooling device in the embodiments
abovementioned, when the heat source and the cooling liquid are
both accommodated in the space, heat generated by the heat source
is absorbed by the cooling liquid so as to cause the cooling liquid
to evaporate into vapor form, and the vapor may be discharged out
of the space via the tank outlet, thereby dissipating the heat.
Therefore, there would not be too much vapor remaining in the
space, such that less of the vapor would escape from the opening
for receiving the cover when the cover is removed.
[0030] In some embodiments, the cooling device further includes a
liquid channel and a vapor channel, the liquid channel is connected
to the tank inlet, and the vapor channel is connected to the tank
outlet. To reach a balance of mass flow rate between the tank inlet
and the tank outlet, an inner diameter of the vapor channel may be
larger than an inner diameter of the liquid channel.
[0031] In some embodiments, the tank inlet of the tank is located
closer to the bottom surface of the tank than the tank outlet.
Generally, liquid tends to flow down and gas tends to go up.
[0032] In some embodiments, the vapor channel is disposed to the
tank in an inclined manner. Accordingly, the liquid level of the
cooling liquid is allowed to be closer to the cover and the cooling
liquid is allowed flows into the inlet end and occupy a portion of
the vapor channel, ensuring only the vapor form of the cooling
liquid to pass through the outlet end of the vapor channel.
[0033] In some embodiments, the first side is located farther away
from the bottom surface than the second side. In addition, the
first side is closer to the tank outlet than the second side, such
that the vapor form of the cooling liquid tends to flow toward the
first side. Consequently, the vapor would easily leave the space
via the tank outlet.
[0034] In some embodiments, the cooling device further includes a
heat exchange portion. The heat exchange portion is configured to
provide an extra space for the processes of condensation and
evaporation of the cooling liquid to occur (i.e., the transition
from the cooling liquid and vapor). The vapor turns into the
cooling liquid in the heat exchange portion and flows back to the
liquid channel through the second end due to gravity. In short, the
cooling liquid in the space is able to be evaporated into the
gaseous phase and then is condensed to flow back to the space,
forming a circulation without losing any of it.
[0035] In some embodiments, the cooling device further includes a
heat dissipation device. The heat dissipation device is able to
absorb and then dissipate heat in the vapor in the heat exchange
portion. Therefore, the heat dissipation device is able to
accelerate the phase transition of the cooling liquid.
[0036] In some embodiments, the cooling device further includes an
electrical connector disposed at the cover. In addition, the
electrical connector is located in a hole of the cover and is
electrically connected to the heat source via a wire located in the
tank. The electrical connector is configured to transmit
electricity or signal to the heat source or receive electricity or
signal from the heat source. This allows the heat source to
exchange electrical power or signal to another external device
through the wire and the electrical connector. In addition, the
hole of the cover may be, for example, in a square shape, and the
electrical connector is easier to be sealed to the cover with
respect to the conventional gap between the wire and the tank. As a
result, the air-tightness of the tank is increased with respect to
the conventional tank.
[0037] In some embodiments, the cooling device further includes a
liquid pump device, and the heat exchange portion is a tank. The
cooling liquid in the space can be completely pumped to the heat
exchange portion by the liquid pump device. By doing so, the vapor
form of the cooling liquid is prevented from escaping from the
opening for receiving the cover when the cover is removed.
[0038] In some embodiments, the cooling device further includes an
air pump device. The space may be filled with air with the help of
the air pump device so as to force the cooling liquid and the vapor
to move toward the heat exchange portion. By doing so, most in the
space is the air and vapor form of the cooling liquid is prevented
from escaping from the opening for receiving the cover when the
cover is removed.
[0039] The embodiments are chosen and described in order to best
explain the principles of the present disclosure and its practical
applications, to thereby enable others skilled in the art best
utilize the present disclosure and various embodiments with various
modifications as are suited to the particular use being
contemplated. It is intended that the scope of the present
disclosure is defined by the following claims and their
equivalents.
* * * * *