U.S. patent application number 16/721740 was filed with the patent office on 2020-04-23 for semiconductor device and method of fabricating the same.
This patent application is currently assigned to SK hynix Inc.. The applicant listed for this patent is SK hynix Inc.. Invention is credited to In Su PARK, Dong Sun SHEEN.
Application Number | 20200127008 16/721740 |
Document ID | / |
Family ID | 65809290 |
Filed Date | 2020-04-23 |
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United States Patent
Application |
20200127008 |
Kind Code |
A1 |
PARK; In Su ; et
al. |
April 23, 2020 |
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Abstract
Provided herein may be a semiconductor device and a method of
manufacturing the same. The semiconductor device may include a
memory string including memory cells coupled to each other in
series via a channel layer, the memory string coupled between a bit
line and a second source line. The semiconductor device may include
a first source line electrically coupled to the second source line
through the channel layer.
Inventors: |
PARK; In Su; (Icheon-si
Gyeonggi-do, KR) ; SHEEN; Dong Sun; (Seongnam-si
Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SK hynix Inc. |
Icheon-si Gyeonggi-do |
|
KR |
|
|
Assignee: |
SK hynix Inc.
Icheon-si Gyeonggi-do
KR
|
Family ID: |
65809290 |
Appl. No.: |
16/721740 |
Filed: |
December 19, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15972395 |
May 7, 2018 |
10559589 |
|
|
16721740 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11C 16/14 20130101;
H01L 23/5226 20130101; H01L 29/40117 20190801; G11C 16/3445
20130101; H01L 21/31111 20130101; H01L 21/0217 20130101; H01L
27/11582 20130101; G11C 16/08 20130101; G11C 16/0483 20130101; H01L
21/02164 20130101; G11C 16/26 20130101; H01L 29/0847 20130101; H01L
29/1037 20130101; H01L 29/1095 20130101; G11C 16/0466 20130101;
G11C 16/3459 20130101 |
International
Class: |
H01L 27/11582 20060101
H01L027/11582; H01L 29/10 20060101 H01L029/10; H01L 29/08 20060101
H01L029/08; H01L 23/522 20060101 H01L023/522; G11C 16/04 20060101
G11C016/04 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 25, 2017 |
KR |
10-2017-0123410 |
Claims
1. A method of manufacturing a semiconductor device, comprising:
successively stacking and forming, on a semiconductor substrate, a
first conductive layer for a first source line, a separation layer,
a sacrificial layer, an etch stop layer and a plurality of first
and second material layers; etching the first material layers, the
second material layers, the etch stop layer, the sacrificial layer
and the separation layer and forming a plurality of channel holes
through which portions of the first conductive layer are exposed;
forming channel plugs by successively stacking a multilayer layer
and a channel layer on inner sidewalls of the channel holes;
etching a bottom of each of the channel holes to expose the first
conductive layer, and additionally forming the channel layer on the
bottom of each of the channel holes such that the first conductive
layer comes into contact with the channel layer; etching the first
material layers, the second material layers, the etch stop layer
and forming a second source contact hole through which the
sacrificial layer is exposed; exposing a portion of a sidewall of a
lower portion of each of the channel plugs by removing the exposed
sacrificial layer; and exposing a portion of the channel layer by
removing the multilayer layer of the exposed lower portion of each
of the channel plugs, and filling a region from which the
sacrificial layer has been removed with a second conductive layer
for a second source line such that the second conductive layer
comes into contact with the channel layer.
2. The method according to claim 1, further comprising, after the
second conductive layer is formed, forming a second source contact
plug by filling the second source contact hole with conductive
material.
3. The method according to claim 1, further comprising: after the
second conductive layer is formed, etching the first material
layers, the second material layers, the etch stop layer, the second
conductive layer and the separation layer, and forming a first
source contact hole through which the first conductive layer is
exposed; and forming a first source contact plug by filling the
first source contact hole with conductive material.
4. The method according to claim 3, wherein the first source
contact plug passes through a predetermined thickness of the first
conductive layer.
5. The method according to claim 1, wherein the first conductive
layer is formed of a conductive layer doped with a P-type
impurity.
6. The method according to claim 1, wherein the second conductive
layer is formed of a conductive layer doped with an N-type impurity
or an undoped conductive layer.
7. The method according to claim 1, further comprising, after the
separation layer is formed, forming a first buffer layer on the
separation layer before the sacrificial layer is formed; and after
the sacrificial layer is formed, forming a second buffer layer on
the sacrificial layer before the etch stop layer is formed.
8. The method according to claim 1, wherein the exposing of the
portion of the channel layer by removing the multilayer layer
comprises etching the multilayer layer upward to a region higher
than a region through which the channel layer is exposed.
9. The method according to claim 1, wherein a thickness of a region
of the second conductive layer that comes into contact with the
channel layer is greater than a thickness of an other region of the
second conductive layer.
10. The method according to claim 1, wherein a region of the second
conductive layer that comes into contact with the channel layer
protrudes upward.
11. The method according to claim 1, wherein the multilayer layer
is divided into a first multilayer pattern and a second multilayer
pattern based on a region in which the second conductive layer
comes into contact with the channel layer, and wherein a thickness
of a region of the second conductive layer between the first
multilayer pattern and the second multilayer pattern is greater
than a thickness outside the region between the first multilayer
pattern and the second multilayer pattern.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application is a continuation application of
U.S. patent application Ser. No. 15/972,395, filed on May 7, 2018,
and claims priority under 35 U.S.C. .sctn. 119(a) to Korean patent
application number 10-2017-0123410 filed on Sep. 25, 2017 in the
Korean Intellectual Property Office, the entire disclosure of which
is incorporated herein by reference.
BACKGROUND
1. Technical Field
[0002] Various embodiments of the present disclosure generally
relate to a semiconductor device and a method of fabricating the
same, and more particularly, to a three-dimensional semiconductor
memory device and a method of fabricating the same.
2. Related Art
[0003] A semiconductor device includes a plurality of memory cell
transistors capable of storing data. The memory cell transistors
may be coupled in series between select transistors, thus forming a
memory string. To embody high integration of a semiconductor
device, a three-dimensional semiconductor device has been proposed.
Gate electrodes of the memory cell transistors and the select
transistors may be stacked on a substrate to form the
three-dimensional semiconductor device. The three-dimensional
semiconductor device further includes a channel layer passing
through the gate electrodes. With regard to the realization of such
a three-dimensional semiconductor device, various techniques for
improving the operational reliability of the semiconductor device
are being developed.
SUMMARY
[0004] An embodiment of the present disclosure may provide for a
semiconductor device. The semiconductor device may include a well
plate. The semiconductor device may include a separation layer
disposed on the well plate. The semiconductor device may include an
auxiliary source line layer disposed on the separation layer and
spaced apart from the well plate. The semiconductor device may
include a stack structure formed on the auxiliary source line
layer. The semiconductor device may include channel layers
configured to pass through the stack structure, and electrically
coupled to the well plate and the auxiliary source line layer.
[0005] An embodiment of the present disclosure may provide for a
method of manufacturing a semiconductor device. The method may
include successively stacking and forming, on a semiconductor
substrate, a first conductive layer for a first source line, a
separation layer, a sacrificial layer, an etch stop layer and a
plurality of first and second material layers. The method may
include etching the first material layers, the second material
layers, the etch stop layer, the sacrificial layer and the
separation layer and forming a plurality of channel holes through
which portions of the first conductive layer are exposed. The
method may include forming channel plugs by successively stacking a
multilayer layer and a channel layer on inner sidewalls of the
channel holes. The method may include etching a bottom of each of
the channel holes to expose the first conductive layer, and
additionally forming the channel layer on the bottom of each of the
channel holes such that the first conductive layer comes into
contact with the channel layer. The method may include etching the
first material layers, the second material layers, the etch stop
layer and forming a second source contact hole through which the
sacrificial layer is exposed. The method may include exposing a
portion of a sidewall of a lower portion of each of the channel
plugs by removing the exposed sacrificial layer. The method may
include exposing a portion of the channel layer by removing the
multilayer layer of the exposed lower portion of each of the
channel plugs, and filling a region from which the sacrificial
layer has been removed with a second conductive layer for a second
source line such that the second conductive layer comes into
contact with the channel layer.
[0006] An embodiment of the present disclosure may provide for a
semiconductor device. The semiconductor device may include a memory
string including memory cells coupled to each other in series via a
channel layer, the memory string coupled between a bit line and a
second source line. The semiconductor device may include a first
source line electrically coupled to the second source line through
the channel layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a perspective view illustrating memory strings of
a semiconductor device in accordance with an embodiment of the
present disclosure.
[0008] FIG. 2 is a circuit diagram illustrating memory strings of a
semiconductor device in accordance with an embodiment of the
present disclosure.
[0009] FIGS. 3A to 3H are sectional views illustrating a method of
manufacturing a semiconductor device in accordance with an
embodiment of the present disclosure.
[0010] FIG. 4 is a block diagram illustrating a memory system
including a semiconductor device in accordance with an embodiment
of the present disclosure.
[0011] FIG. 5 is a block diagram illustrating an example of
application of the memory system of FIG. 4.
[0012] FIG. 6 is a block diagram illustrating a computing system
including the memory system illustrated with reference to FIG.
5.
DETAILED DESCRIPTION
[0013] Examples of embodiments will now be described hereinafter
with reference to the accompanying drawings; however, they may be
embodied in different forms and should not be construed as limited
to the embodiments set forth herein. Rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope of the examples of the embodiments to
those skilled in the art.
[0014] In the drawing figures, dimensions may be exaggerated for
clarity of illustration. It will be understood that when an element
is referred to as being "between" two elements, it can be the only
element between the two elements, or one or more intervening
elements may also be present.
[0015] Hereinafter, embodiments will be described with reference to
the accompanying drawings. Embodiments are described herein with
reference to cross-sectional illustrations that are schematic
illustrations of embodiments (and intermediate structures). As
such, variations from the shapes of the illustrations as a result,
for example, of manufacturing techniques and/or tolerances, are to
be expected. Thus, embodiments should not be construed as limited
to the particular shapes of regions illustrated herein but may
include deviations in shapes that result, for example, from
manufacturing. In the drawings, lengths and sizes of layers and
regions may be exaggerated for clarity. Like reference numerals in
the drawings denote like elements.
[0016] Terms such as "first" and "second" may be used to describe
various components, but they should not limit the various
components. Those terms are only used for the purpose of
differentiating a component from other components. For example, a
first component may be referred to as a second component, and a
second component may be referred to as a first component and so
forth without departing from the spirit and scope of the present
disclosure. Furthermore, "and/or" may include any one of or a
combination of the components mentioned.
[0017] Furthermore, a singular form may include a plural from as
long as it is not specifically mentioned in a sentence.
Furthermore, "include/comprise" or "including/comprising" used in
the specification represents that one or more components, steps,
operations, and elements exist or are added.
[0018] Furthermore, unless defined otherwise, all the terms used in
this specification including technical and scientific terms have
the same meanings as would be generally understood by those skilled
in the related art. The terms defined in generally used
dictionaries should be construed as having the same meanings as
would be construed in the context of the related art, and unless
clearly defined otherwise in this specification, should not be
construed as having idealistic or overly formal meanings.
[0019] It is also noted that in this specification,
"connected/coupled" refers to one component not only directly
coupling another component but also indirectly coupling another
component through an intermediate component. On the other hand,
"directly connected/directly coupled" refers to one component
directly coupling another component without an intermediate
component.
[0020] Various embodiments of the present disclosure may be
directed to a three-dimensional semiconductor device which has
improved operational reliability, and a method of fabricating the
same.
[0021] FIG. 1 is a perspective view illustrating memory strings of
a semiconductor device in accordance with an embodiment of the
present disclosure. Referring to FIG. 1, to schematically
illustrate the structure of the semiconductor device according to
an embodiment of the present disclosure, the illustration of
interlayer insulating layers has been omitted.
[0022] The semiconductor device according to an embodiment of the
present disclosure may include a three-dimensional memory string
String. The three-dimensional memory string String may have a
straight type, as illustrated in FIG. 1.
[0023] A straight memory string String may include memory cells and
select transistors which are stacked along a straight channel layer
CH. Gates of the memory cells and gates of the select transistors
may be coupled to conductive patterns CP1 to Cpn.
[0024] The channel layer CH may be formed in the form of a tube
which encloses an insulating pillar with which a central region of
a straight hole is filled, or may be formed such that the central
region of the straight type hole is completely filled
therewith.
[0025] An upper end of the channel layer CH may be electrically
coupled to a corresponding one of bit lines BL1 to BL5. In an
embodiment, there is illustrated five bit lines, but the present
disclosure is not limited thereto, and more or less bit lines may
be disposed. The bit lines BL1 to BL5 may extend in a second
direction II. A drain contact plug (not illustrated) may be further
formed between each of the bit lines BL1 to BL5 and the
corresponding channel layer CH.
[0026] Channel layers CH may be substantially parallel to each
other and each may be coupled to a well plate SL1 and an auxiliary
source line layer SL2. The well plate SL1 and the auxiliary source
line layer SL2 may be respectively defined as a first source line
layer and a second source line layer. The first source line layer
SL1 may be formed on a semiconductor substrate, and the second
source line layer SL2 may be formed over the first source line
layer SL1. A separation layer SP is formed at the interface between
the first source line layer SL1 and the second source line layer
SL2 and electrically and physically separates the first source line
layer SL1 from the second source line layer SL2. A side surface of
a lower end of each channel layer CH may be coupled to the second
source line layer SL2, and the bottom of the lower end of the
channel layer CH may be coupled to the first source line layer SL1.
The channel layer CH may pass through the second source line layer
SL2 and be coupled to the first source line layer SL1. In other
words, the second source line layer SL2 may enclose the channel
layer CH.
[0027] The first source line layer SL1 may be formed of a doped
polysilicon layer doped with a P-type impurity. The second source
line layer SL2 may be formed of an undoped polysilicon layer or a
doped polysilicon layer doped with an N-type impurity. The lower
end of the channel layer CH may be coupled to the first source line
layer SL1 and the second source line layer SL2, and extend in a
third direction III toward the bit lines BL1 to BL5.
[0028] Although not illustrated, the first source line layer SL1
and the second source line layer SL2 may be respectively coupled to
a first source contact plug and a second source contact plug and
thus may be respectively coupled to a first common source line and
a second common source line. In other words, the first source line
layer SL1 and the second source line layer SL2 may be respectively
coupled to the first common source line and the second common
source line that are electrically separated from each other.
[0029] A side surface of the channel layer CH may be generally
enclosed by a multilayer layer ML. In an embodiment, for example, a
side surface of the channel layer CH may be enclosed by first and
second multilayer patterns ML1 and ML2. In an embodiment, for
example, a side surface of the channel layer CH may be enclosed by
one or more multiplayer patterns. The portion of the channel layer
CH that comes into contact with the second source line layer SL2
may not be enclosed by a multilayer layer, whereby the channel
layer CH may come into direct contact with the second source line
layer SL2.
[0030] An outer surface of the channel layer CH may be enclosed by
the first multilayer pattern ML1, or be enclosed by the second
multilayer pattern ML2. Each of the first multilayer pattern ML1
and the second multilayer pattern ML2 may include a tunnel
insulating layer, a data storage layer and a blocking insulating
layer. The first multilayer pattern ML1 is formed to enclose a side
surface of a portion of the channel layer CH over the portion of
the channel layer CH that comes into contact with the second source
line layer SL2. The second multilayer pattern ML2 is formed to
enclose a side surface of a portion of the channel layer CH under
the portion of the channel layer CH that comes into contact with
the second source line layer SL2. The first multilayer pattern ML1
and the second multilayer pattern ML2 may be separated from each
other with the second source line layer SL2 interposed
therebetween.
[0031] The conductive patterns CP1 to CPn may be disposed in n
layers spaced apart from each other between the bit lines BL1 to
BL5 and the second source line layer SL2. The conductive patterns
CP1 to CPn may enclose the channel layer CH and be stacked and
spaced apart from each other. The conductive patterns CP1 to CPn
may include a source select line SSL, word lines WL and a drain
select line DSL. The source select line SSL may be disposed over
the second source line layer SL2. The word lines WL may be disposed
over the source select line SSL. The drain select line DSL may be
disposed over the word lines WL. The conductive patterns CP1 to CPn
may be separated into a plurality of sub-structures by a slit
SI.
[0032] The source select line SSL may be disposed to have a single
layered or two or more layered structure below the word lines WL.
Although, in the drawing, there is illustrated an example in which
the source select line SSL is formed both of a first pattern CP1
that is disposed in a lowermost layer of the conductive patterns
CP1 to CPn and of a second pattern CP2 disposed over the first
pattern CP1, the present disclosure is not limited to this.
[0033] The drain select line DSL may be disposed to have a single
layered or two or more layered structure over the word lines WL.
Although, in the drawing, there is illustrated an example in which
the drain select line DSL is formed both of an n-th pattern CPn
that is disposed in an uppermost layer of the conductive patterns
CP1 to CPn and of an n-1-th pattern CPn-1 disposed below the n-th
pattern CPn, the present disclosure is not limited to this.
[0034] The conductive patterns CP1 to CPn may be separated from
each other by the slit SI. Either the source select line SSL or the
drain select line DSL may be separated into unit lines smaller than
that of the word lines WL. For example, the channel layers CH that
are enclosed in common by each word line WL may be separated into a
first group and a second group which are respectively enclosed by
drain select lines DSL that are separated from each other. In this
case, the drain select line DSL may be separated not only by the
slit SI but also by an upper slit USI so that the width thereof is
less than that of each of the word lines WL.
[0035] The memory cells are formed at intersections between the
channel layer CH and the word lines WL, a drain select transistor
is formed at an intersection between the channel layer CH and the
drain select line DSL, and a source select transistor is formed at
an intersection between the channel layer CH and the source select
line SSL. The source select transistor, the memory cells and the
drain select transistor that are arranged in a line along the
single channel layer CH are coupled in series to each other through
the channel layer CH and thus define a straight memory string
String. The word lines WL may transmit signals to the gates of the
memory cells. The source select line SSL may transmit a signal to a
gate of the source select transistor. The drain select line DSL may
transmit a signal to a gate of the drain select transistor.
[0036] FIG. 2 is a circuit diagram illustrating memory strings of a
semiconductor device in accordance with an embodiment of the
present disclosure.
[0037] Referring to FIG. 2, the semiconductor device according to
an embodiment of the present disclosure may include a memory cell
array 100 having a three-dimensional structure. The memory cell
array 100 includes a plurality of memory strings String. Each of
the memory strings String may include a source select transistor
SST, a plurality of memory cell transistors MC1 to MCn and a drain
select transistor DST that are coupled in series to each other. The
number of source select transistors SST or the number of drain
select transistors DST that are coupled to each of the memory
strings String may be two or more without being limited to one.
[0038] The memory strings String may be arranged in a matrix form
in a row direction and a column direction. The memory strings
String may be coupled on a column basis to the bit lines BL1 to BL5
extending in the column direction. The memory strings String may be
coupled on a row basis to gate lines SSL, WL1 to WLn and DSL
extending in the row direction.
[0039] The source select transistor SST, the plurality of memory
cell transistors MC1 to MCn, and the drain select transistor DST
may be coupled in series to each other by the channel layer and
form a single memory string String. The memory strings String may
be disposed between the bit lines BL1 to BL5 and first and second
source lines SL1 and SL2. The gate lines SSL, WL1 to WLn and DSL
are stacked between the bit lines BL1 to BL5 and the first and
second source lines SL1 to SL2, and are spaced apart from each
other.
[0040] The gate lines may include a source select line SSL, word
lines WL1 to WLn and a drain select line DSL. The source select
line SSL is used as a gate electrode of the source select
transistor SST. The word lines WL1 to WLn are used as gate
electrodes of the memory cell transistors MC1 to MCn. The drain
select line DSL is used as a gate electrode of the drain select
transistor DST. The word lines WL1 to WLn are stacked and spaced
apart from each other. The source select line SSL is disposed below
the word lines WL1 to WLn. The drain select line DSL is disposed
over the word lines WL1 to WLn. In other words, the word lines WL1
to WLn are disposed between the source select line SSL and the
drain select line DSL.
[0041] The first source line SL1 and the second source line SL2 are
disposed below the source select line SSL, and are coupled in
parallel to the source select transistors SST of the memory strings
String. Each of the bit lines BL1 to BL5 is coupled to the drain
select transistor DST of the corresponding memory string
String.
[0042] The memory strings String coupled in common to a single
drain select line DSL are coupled to different bit lines BL1 to
BL5. Therefore, when one drain select line DSL is selected and one
of the bit lines BL1 to BL5 is selected, one of the memory strings
String may be selected.
[0043] The first source line SL1 and the second source line SL2 are
respectively electrically coupled to a first common source line
CSL1 and a second common source line CSL2. During an erase
operation of the semiconductor device, when an erase voltage is
applied to the first common source line CSL1, the erase voltage is
applied to the channel layers of the memory strings String through
the first source line SL1. Furthermore, during a program verify
operation or a read operation of the semiconductor device, when an
operating voltage (e.g., a ground voltage) is applied to the second
common source line CSL2, a path of current flowing from the channel
layers of the memory strings String to the second source line SL2
and the second common source line CSL2 may be formed.
[0044] During the erase operation of the semiconductor device, the
second source line SL2 and the second common source line CSL2
remain floating, and during the program verify operation or the
read operation of the semiconductor device, the first source line
SL1 and the first common source line CSL1 remain floating.
[0045] Whether the channel layer of each memory string String is
electrically coupled to the first source line SL1 or the second
source line SL2 may be determined depending on a signal to be
applied to the source select line SSL.
[0046] During a program verify operation of the semiconductor
device, the potentials of the channel layers of the memory strings
String are precharged to a predetermined level through the bit
lines BL1 to BL5, and an operating voltage (e.g., a ground voltage)
is applied to the second common source line CSL2 and the second
source line SL2. Thereafter, when a program verify voltage is
applied to a selected word line of the word lines WL1 to WLn, and a
pass voltage is applied to the other word lines, the memory cells
coupled with the selected word line are turned on or off depending
on a program state thereof. Consequently, the potential of the
channel layer of each memory string String is maintained at a
predetermined level, or is discharged to a low level by the path of
current flowing through the second source line SL2 and the second
common source line CSL2. Thereafter, the program verify operation
is performed by measuring the potential levels or current of the
bit lines BL1 to BL5.
[0047] During an erase verify operation, the potentials of the
channel layers of the memory strings String are precharged to a
predetermined level through the bit lines BL1 to BL5, and an
operating voltage (e.g., a ground voltage) is applied to the second
common source line CSL2 and the second source line SL2. Thereafter,
when an erase verify voltage is applied to all of the word lines
WL1 to WLn, the memory cells MC1 to MCn coupled to the word lines
WL1 to WLn are turned on or at least one memory cell is turned off,
depending on erase states of the memory cells MC1 to MCn.
Consequently, the potential of the channel layer of each memory
string String is maintained at a predetermined level, or is
discharged to a low level by the path of current flowing through
the second source line SL2 and the second common source line CSL2.
Thereafter, the erase verify operation is performed by measuring
the potential levels or current of the bit lines BL1 to BL5.
[0048] In the above description, the erase verify operation has
been described as being simultaneously performed on the memory
cells MC1 to MCn included in the memory strings String, but the
present disclosure is not limited thereto. For example, in the same
manner as that of the program verify operation, an erase verify
voltage may be applied to a selected word line, and a pass voltage
may be applied to the other word lines so that the erase verify
operation may be performed on each of the memory cells MC1 to
MCn.
[0049] During a read operation of the semiconductor device, the
potentials of the channel layers of the memory strings String are
precharged to a predetermined level through the bit lines BL1 to
BL5, and an operating voltage (e.g., a ground voltage) is applied
to the second common source line CSL2 and the second source line
SL2. Thereafter, when a read voltage is applied to a selected word
line of the word lines WL1 to WLn, and a pass voltage is applied to
the other word lines, the memory cells coupled with the selected
word line are turned on or off depending on a program state
thereof. Consequently, the potential of the channel layer of each
memory string String is maintained at a predetermined level, or is
discharged to a low level by the path of current flowing through
the second source line SL2 and the second common source line CSL2.
Thereafter, the read operation is performed by measuring the
potential levels or current of the bit lines BL1 to BL5.
[0050] During an erase operation, a voltage having a predetermined
level is applied to the bit lines BL1 to BL5, and a turn-off
voltage is applied to the drain select line DSL to turn off the
drain select transistor DST, whereby the electrical coupling of the
bit lines BL1 to BL5 to the memory strings String is
interrupted.
[0051] Thereafter, while the word lines WL1 to WLn are floating, an
erase voltage is applied to the first common source line CSL1 and
the first source line SL1, and a turn-on voltage is applied to the
source select line SSL to turn on the source select transistor SST
so that the erase voltage is applied to the channel layers of the
memory strings String. Thereafter, when a ground voltage is applied
to the word lines WL1 to WLn, electrons charged in the memory cells
MC1 to MCn are detrapped by difference in potential level between
the channel layers and the word lines WL1 to WLn. Consequently,
data programmed in the memory cells MC1 to MCn is erased.
[0052] As described above, in an embodiment of the present
disclosure, during a program verify operation, an erase verify
operation or a read operation, a current path is formed through the
second common source line CSL2 and the second source line SL2.
During an erase operation, an erase voltage is applied to the
channel layers of the memory strings through the first common
source line CSL1 and the first source line SL1. As described above,
a source line is divided into the first source line SL1 and the
second source line SL2 that are electrically and physically
separated from each other. Therefore, the second source line SL2
for a program verify operation, an erase verify operation or a read
operation may be formed of an N-type conductive layer, and the
first source line SL1 for an erase operation may be formed of a
P-type conductive layer, so that electrical characteristics of each
operation may be improved.
[0053] FIGS. 3A to 3H are sectional views illustrating a method of
manufacturing a semiconductor device according to an embodiment of
the present disclosure.
[0054] Referring to FIG. 3A, a first stack structure A for forming
a source line is formed on a substrate (not illustrated) including
a lower structure.
[0055] For example, a first conductive layer 101, a separation
layer 103, a first buffer layer 105, a sacrificial layer 107, a
second buffer layer 109 and an etch stop layer 111 are successively
stacked and formed on the substrate (not illustrated) including the
lower structure.
[0056] The first conductive layer 101 may be a conductive layer for
forming the first source line SL1 illustrated in FIG. 1, and be
formed of a doped polysilicon layer. The separation layer 103 may
be an insulating layer for electrically and physically separating
the first conductive layer 101 from a second source line SL2 to be
formed later, and be formed of a silicon oxide layer. The first
buffer layer 105 may be a layer for preventing the separation layer
103 from being etched during a subsequent etching process, and be
formed of a nitride layer. The sacrificial layer 107 may be a layer
to secure a space for forming the second source line SL2 to be
formed later, and be formed of an undoped poly layer. The second
buffer layer 109 may be a layer for preventing the etch stop layer
111 from being damaged during a process of etching a multilayer
layer on a sidewall of a channel to be formed later, and be formed
of a silicon oxide layer.
[0057] Thereafter, a second stack structure B is formed on the
first stack structure A.
[0058] For example, first material layers 113 and second material
layers 115 are alternately stacked on the etch stop layer 111. The
second material layers 115 may be formed of material different from
that of the first material layers 113. For example, the first
material layers 113 may be formed of insulating material for
interlayer insulating layers, whereas the second material layers
115 may be formed of conductive material for conductive
patterns.
[0059] Alternatively, the first material layers 113 may be formed
of insulating material for interlayer insulating layers, and the
second material layers 115 may be used as sacrificial layers and be
formed of sacrificial insulating material having an etching
selectivity different from that of the first material layers 113.
In this case, the first material layers 113 may be formed of a
silicon oxide layer, and the second material layers 115 may be
formed of a silicon nitride layer. In the case where all of the
first and second material layers 113 and 115 are formed of
insulating material, etching processes for forming a channel hole
or a slit may be facilitated.
[0060] Alternately, the first material layers 113 may be used as
sacrificial layers and be formed of sacrificial conductive material
having an etching selectivity different from that of the second
material layers 115, whereas the second material layers 115 may be
formed of conductive material for conductive patterns. In this
case, the first material layers 113 may be formed of an undoped
polysilicon layer, whereas the second material layers 115 may be
formed of a doped polysilicon layer. In the case where all of the
first and second material layers 113 and 115 are formed of
conductive material, etching processes for forming a channel hole
or a slit may be facilitated.
[0061] Referring to FIG. 3B, channel holes H1 and H2 passing
through portions of the second stack structure B and the first
stack structure A are formed. Each of the channel holes H1 and H2
may be formed such that portions of an upper surface of the first
conductive layer 101 are exposed.
[0062] Thereafter, a multilayer layer ML and a channel layer 123
are sequentially formed along a sidewall and the bottom of each of
the channel holes H1 and H2.
[0063] The multilayer layer ML may be formed by successively
stacking a tunnel insulating layer 117, a data storage layer 119
and a blocking insulating layer 121. Thereafter, the channel layer
123 may be formed along the surface of the blocking insulating
layer 121. The blocking insulating layer 121, the data storage
layer 119, the tunnel insulating layer 117 may be formed to enclose
the channel layer 123. The channel layer 123 may be formed such
that a central region of each of the channel holes H1 and H2 is
open.
[0064] The tunnel insulating layer 117 may be formed of an oxide
layer. The data storage layer 119 may be formed of a nitride layer.
The blocking insulating layer 121 may be formed of an oxide layer.
The multilayer layer ML may be formed of an ONO structure (an oxide
layer-a nitride layer-an oxide layer). Furthermore, each of oxide
layers of the multilayer layer ML may be formed of a single oxide
layer, or be formed of a structure in which different material
layers including an oxide layer are stacked.
[0065] Referring to FIG. 3C, the channel layer 123 and the
multilayer layer ML that are formed on the bottom of each of the
channel holes H1 and H2 are removed through an etching process,
whereby the first conductive layer 101 is exposed. Thereafter, an
additional channel layer 123 is formed on the exposed first
conductive layer 101 so that the channel layer 123 is electrically
and physically coupled to the first conductive layer 101.
[0066] Thereafter, the central region of each of the opened channel
holes H1 and H2 may be filled with a core insulating layer 125. As
a result, channel plugs CP each of which are configured with the
core insulating layer 125, the channel layer 123 and the multilayer
layer ML are formed.
[0067] Referring to FIG. 3D, a second source contact hole H3 is
formed through an etching process. The second source contact hole
H3 is formed to pass through the second stack structure B, the etch
stop layer 111 and the second buffer layer 109 and expose the
sacrificial layer 107.
[0068] Thereafter, the exposed sacrificial layer 107 is removed to
form a space in which a conductive layer for a second source line
is to be formed. When the sacrificial layer 107 is removed, a lower
portion of the sidewall of each channel plug CP is exposed. In
other words, a lower portion of the tunnel insulating layer 117 of
the channel plug CP is exposed.
[0069] Referring to FIG. 3E, the exposed portions of the tunnel
insulating layer 117, the data storage layer 119 and the blocking
insulating layer 121 are removed through an etching process,
whereby a portion of the channel layer 123 is exposed. During a
process of etching the tunnel insulating layer 117, the second
buffer layer 109 may be removed, and during a process of etching
the data storage layer 119, the first buffer layer 105 may be
removed. Here, the tunnel insulating layer 117, the data storage
layer 119 and the blocking insulating layer 121 may be further
etched upward from the exposed portions thereof. Consequently, the
tunnel insulating layer 117, the data storage layer 119 and the
blocking insulating layer 121 may be etched to a position higher
than the space that is formed by removing the sacrificial layer 107
as described in FIG. 3D. Therefore, the space in which the
conductive layer for the second source line is to be formed may
protrude a predetermined height upward at a position at which the
space comes into contact with the channel layer 123.
[0070] Referring to FIG. 3F, a second conductive layer 127 for the
second source line is formed in the space from which the
sacrificial layer has been removed. The second conductive layer 127
may be formed of an undoped polysilicon layer or a polysilicon
layer doped with an N-type impurity. The second conductive layer
127 is electrically and physically coupled with the channel layer
123. The portion of the second conductive layer 127 that comes into
contact with the channel layer 123 may protrude a predetermined
height upward. For example, the thickness of the portion of the
second conductive layer 127 that comes into contact with the
channel layer 123 may be greater than that of the portion of the
second conductive layer 127 that is formed between the separation
layer 103 and the etch stop layer 111. In an embodiment, for
example, a thickness of a region of the auxiliary source line layer
SL2 that comes into contact with each of the channel layers 123 is
greater than a thickness of the other regions of the auxiliary
source line layer SL2. In an embodiment, for example, a thickness
of a region of the auxiliary source line layer SL2 between the
first multilayer pattern ML1 and the second multilayer pattern ML2
is greater than a thickness of the auxiliary source line layer SL2
outside the region between the first multilayer pattern ML1 and the
second multilayer pattern ML2. In an embodiment, for example, a
thickness of a region of the auxiliary source line layer SL2
between the etch stop layer 11 and the separation layer 103 may be
narrower than a thickness of a region of the auxiliary source line
layer SL2 between the first multilayer pattern ML1 and the second
multilayer pattern ML2. In an embodiment, for example, a thickness
of a region of the auxiliary source line layer SL2 between the etch
stop layer 11 and the separation layer 103 may be narrower than a
thickness of a region of the auxiliary source line layer SL2 that
comes into contact with each of the channel layers 123.
[0071] Thereafter, an insulating layer 129 is formed on the
sidewall of the second source contact hole H3, and the second
source contact hole H3 is filled with a conductive layer to form a
second source contact plug 131.
[0072] Referring to FIG. 3G, a first source contact hole H4 is
formed through an etching process. The first source contact hole H4
is formed to pass through the second stack structure B, the etch
stop layer 111 and the second conductive layer 127 and expose a
portion of the first conductive layer 101. The first source contact
hole H4 may be formed such that a portion of the first conductive
layer 101 is etched.
[0073] Thereafter, an insulating layer 133 is formed on the
sidewall of the first source contact hole H4, and the first source
contact hole H4 is filled with a conductive layer to form a first
source contact plug 135. The first source contact plug 135 may
extend into the first conductive layer 101 by a predetermined
depth. In other words, the first source contact plug 135 may pass
through a predetermined thickness of the first conductive layer
101.
[0074] Referring to FIG. 3H, a slit SI is formed to pass through
the first and second material layers 113 and 115 by etching a
portion of the first and second material layers 113 and 115 between
the channel plugs CP. During an etching process for forming the
slit SI, due to the etch stop layer 111, the second conductive
layer 127 disposed under the etch stop layer 111 is prevented from
being damaged.
[0075] Thereafter, the slit SI is filled with insulating material
to form a slit insulating layer 137.
[0076] In the case where the first material layers 113 are formed
of insulating material for interlayer insulating layers and the
second material layers 115 are formed of sacrificial insulating
material, before the slit insulating layer 137 is formed after the
slit SI has been formed, the second material layers 115 may be
selectively removed through the slit SI to open conductive pattern
regions, and then conductive patterns may be formed by filling the
conductive pattern regions with conductive material.
[0077] FIG. 4 is a block diagram illustrating a memory system 1000
including a semiconductor memory device 100 in accordance with an
embodiment of the present disclosure.
[0078] Referring to FIG. 4, the memory system 1000 includes a
controller 1100 and a semiconductor memory device 100. The
semiconductor memory device 100 may include the semiconductor
devices described with reference to FIGS. 1 and 2, and may employ
the semiconductor devices realized by the methods of manufacturing
the semiconductor devices described with reference to FIGS. 3A to
3H.
[0079] The semiconductor memory device 100 may include and operate
a memory cell array including the memory strings described with
reference to FIGS. 1 and 2. Consequently, the memory strings of the
memory cell array included in the semiconductor memory device 100
are coupled in parallel to the first source line and the second
source line. An erase voltage may be applied to the first source
line during an erase operation. An operating voltage (e.g., a
ground voltage) may be applied to the second source line during a
program verify operation, an erase verify operation or a read
operation. Hereinafter, repetitive explanations will be
omitted.
[0080] The controller 1100 may be coupled to a host Host and the
semiconductor memory device 100. The controller 1100 is configured
to access the semiconductor memory device 100 in response to a
request from the host Host. For example, the controller 1100 may
control read, write, erase, and background operations of the
semiconductor memory device 100. The controller 1100 may provide an
interface between the host Host and the semiconductor memory device
100. The controller 1100 is configured to drive firmware for
controlling the semiconductor memory device 100.
[0081] The controller 1100 includes a random access memory (RAM)
1110, a processing unit 1120, a host interface 1130, a memory
interface 1140, and an error correction block 1150. The RAM 1110 is
used as at least one of an operation memory of the processing unit
1120, a cache memory between the semiconductor memory device 100
and the host Host, and a buffer memory between the semiconductor
memory device 100 and the host Host.
[0082] The host interface 1130 may include a protocol for
performing data exchange between the host Host and the controller
1100. In an example of an embodiment, the controller 1100 may
communicate with the host Host through at least one of various
interface protocols such as a universal serial bus (USB) protocol,
a multimedia card (MMC) protocol, a peripheral component
interconnection (PCI) protocol, a PCI-express (PCI-E) protocol, an
advanced technology attachment (ATA) protocol, a serial-ATA
protocol, a parallel-ATA protocol, a small computer small interface
(SCSI) protocol, an enhanced small disk interface (ESDI) protocol,
and an integrated drive electronics (IDE) protocol, a private
protocol, and the like.
[0083] The memory interface 1140 interfaces with the semiconductor
memory device 100. For example, the memory interface includes a
NAND interface or a NOR interface.
[0084] The error correction block 1150 uses an error correcting
code (ECC) to detect and correct an error in data received from the
semiconductor memory device 100. The processing unit 1120 may
adjust the read voltage according to an error detection result from
the error correction block 1150, and control the semiconductor
memory device 100 to perform re-reading. In an example of an
embodiment, the error correction block 1150 may be provided as an
element of the controller 1100.
[0085] The controller 1100 and the semiconductor memory device 100
may be integrated into a single semiconductor device. In an example
of an embodiment, the controller 1100 and the semiconductor memory
device 100 may be integrated into a single semiconductor device to
form a memory card. For example, the controller 1100 and the
semiconductor memory device 100 may be integrated into a single
semiconductor device and form a memory card such as a personal
computer memory card international association (PCMCIA), a compact
flash card (CF), a smart media card (SM or SMC), a memory stick
multimedia card (MMC, RS-MMC, or MMCmicro), a SD card (SD, miniSD,
microSD, or SDHC), a universal flash storage (UFS), and the
like.
[0086] The controller 1100 and the semiconductor memory device 100
may be integrated into a single semiconductor device to form a
solid state drive (SSD). The SSD includes a storage device formed
to store data in a semiconductor memory. When the memory system
1000 is used as the SSD, an operation speed of the host Host
coupled to the memory system 1000 may be phenomenally improved.
[0087] In an embodiment, the memory system 1000 may be provided as
one of various elements of an electronic device such as a computer,
a ultra mobile PC (UMPC), a workstation, a net-book, a personal
digital assistants (PDA), a portable computer, a web tablet, a
wireless phone, a mobile phone, a smart phone, an e-book, a
portable multimedia player (PMP), a game console, a navigation
device, a black box, a digital camera, a 3-dimensional television,
a digital audio recorder, a digital audio player, a digital picture
recorder, a digital picture player, a digital video recorder, a
digital video player, a device capable of transmitting/receiving
information in an wireless environment, one of various devices for
forming a home network, one of various electronic devices for
forming a computer network, one of various electronic devices for
forming a telematics network, an RFID device, one of various
elements for forming a computing system, or the like.
[0088] In an embodiment, the semiconductor memory device 100 or the
memory system 1000 may be embedded in various types of packages.
For example, the semiconductor memory device 100 or the memory
system 1000 may be packaged in a type such as Package on Package
(PoP), Ball grid arrays (BGAs), Chip scale packages (CSPs), Plastic
Leaded Chip Carrier (PLCC), Plastic Dual In Line Package (PDIP),
Die in Waffle Pack, Die in Wafer Form, Chip On Board (COB), Ceramic
Dual In Line Package (CERDIP), Plastic Metric Quad Flat Pack
(MQFP), Thin Quad Flatpack (TQFP), Small Outline (SOIC), Shrink
Small Outline Package (SSOP), Thin Small Outline (TSOP), Thin Quad
Flatpack (TQFP), System In Package (SIP), Multi Chip Package (MCP),
Wafer-level Fabricated Package (WFP), Wafer-Level Processed Stack
Package (WSP), or the like.
[0089] FIG. 5 is a block diagram illustrating an example of
application of the memory system of FIG. 4. Referring FIG. 5, a
memory system 2000 includes semiconductor devices 2100 and a
controller 2200. The semiconductor memory device 2100 may include a
plurality of memory chips. The semiconductor memory chips are
divided into a plurality of groups.
[0090] In FIG. 5, it is illustrated that each of the plurality of
groups communicates with the controller 2200 through first to k-th
channels CH1 to CHk. Each semiconductor memory chip may include the
memory strings described with reference to FIGS. 1 and 2, and the
memory cell array including the memory strings. Each semiconductor
memory chip may include the semiconductor devices described with
reference to FIGS. 1 and 2, and may employ the semiconductor
devices realized by the methods of manufacturing the semiconductor
devices described with reference to FIGS. 3A to 3H.
[0091] Each group communicates with the controller 2200 through one
common channel. The controller 2200 has the same configuration as
that of the controller 1100 described with reference to FIG. 4 and
is configured to control a plurality of memory chips of the
semiconductor memory device 2100 through the plurality of channels
CH1 to CHk.
[0092] FIG. 6 is a block diagram illustrating a computing system
3000 including the memory system 2000 illustrated with reference to
FIG. 5.
[0093] Referring to FIG. 6, the computing system 3000 may include a
central processing unit 3100, a RAM 3200, a user interface 3300, a
power supply 3400, a system bus 3500, and a memory system 2000.
[0094] The memory system 2000 is electrically coupled to the CPU
3100, the RAM 3200, the user interface 3300, and the power supply
3400 through the system bus 3500. Data provided through the user
interface 3300 or processed by the CPU 3100 is stored in the memory
system 2000.
[0095] Referring to FIG. 6, the semiconductor memory device 2100 is
illustrated as being coupled to the system bus 3500 through the
controller 2200. However, the semiconductor memory device 2100 may
be directly coupled to the system bus 3500. The function of the
controller 2200 may be performed by the CPU 3100 and the RAM
3200.
[0096] Referring to FIG. 6, the memory system 2000 described with
reference to FIG. 5 may be provided. However, the memory system
2000 may be replaced with the memory system 1000 described with
reference to FIG. 4. In an embodiment, the computing system 3000
may include all of the memory systems 1000 and 2000 described with
reference to FIGS. 4 and 5.
[0097] In a three-dimensional semiconductor device according to the
technique of the present disclosure, a source line coupled to
memory strings is divided into a source line for a program
operation or a read operation and a source line for an erase
operation, so that electrical characteristics of each operation may
be improved.
[0098] Examples of embodiments have been disclosed herein, and
although specific terms are employed, they are used and are to be
interpreted in a generic and descriptive sense only and not for
purpose of limitation. In some instances, as would be apparent to
one of ordinary skill in the art as of the filing of the present
application, features, characteristics, and/or elements described
in connection with a particular embodiment may be used singly or in
combination with features, characteristics, and/or elements
described in connection with other embodiments unless otherwise
specifically indicated. Accordingly, it will be understood by those
of skill in the art that various changes in form and details may be
made without departing from the spirit and scope of the present
disclosure as set forth in the following claims.
* * * * *