U.S. patent application number 16/716870 was filed with the patent office on 2020-04-23 for method and circuit enabling ferroelectric memory to be fixed to a stable state.
The applicant listed for this patent is Texas Instruments Incorporated. Invention is credited to Robert C. Baumann, John A. Rodriguez.
Application Number | 20200126607 16/716870 |
Document ID | / |
Family ID | 54069538 |
Filed Date | 2020-04-23 |
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United States Patent
Application |
20200126607 |
Kind Code |
A1 |
Baumann; Robert C. ; et
al. |
April 23, 2020 |
METHOD AND CIRCUIT ENABLING FERROELECTRIC MEMORY TO BE FIXED TO A
STABLE STATE
Abstract
A system includes a ferroelectric random access memory (FRAM)
array having one or more memory elements. A cycle controller cycles
data to be fixed in a subset of the one or more memory elements by
reading or writing the data a predetermined number of times to fix
the data to a non-volatile stable state.
Inventors: |
Baumann; Robert C.; (Dallas,
TX) ; Rodriguez; John A.; (Dallas, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Texas Instruments Incorporated |
Dallas |
TX |
US |
|
|
Family ID: |
54069538 |
Appl. No.: |
16/716870 |
Filed: |
December 17, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15944666 |
Apr 3, 2018 |
10546626 |
|
|
16716870 |
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|
14642375 |
Mar 9, 2015 |
9934840 |
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15944666 |
|
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|
61951285 |
Mar 11, 2014 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11C 11/2275 20130101;
G11C 11/2273 20130101 |
International
Class: |
G11C 11/22 20060101
G11C011/22 |
Claims
1. A circuit comprising: a ferroelectric random access memory
(FRAM) array having one or more memory elements; a cycle controller
to cycle data to be fixed in a subset of the one or more memory
elements by reading or writing the data a predetermined number of
times to fix the data to a non-volatile stable state; and a heater
controlled by the cycle controller to heat the FRAM array to a
predetermined temperature to facilitate fixing the data in less
cycles to read or write the data the predetermined number of
times.
2. The circuit of claim 1, wherein the heater is a resistive
heating element that applies heat within a package that houses the
FRAM array.
3. The circuit of claim 1, wherein the heater is a resistive
heating element that resides on an integrated circuit die that
provides heat to one or more of the memory elements.
4. The circuit of claim 1, wherein the heater supplies heat that is
above an ambient temperature of the FRAM array.
5. The circuit of claim 4, wherein the temperature above the
ambient temperature of the FRAM array is within a range of about 85
degrees Celsius to about 200 degrees Celsius.
6. The circuit of claim 1, wherein the cycle controller further
comprises a cycle adjuster to cycle the data stored in the subset
of the one or more memory elements by reading or writing the data
in a range of about 5 cycles to about 10,000 cycles.
7. The circuit of claim 1, wherein the cycle controller further
comprises a voltage adjuster to set a programming read or write
voltage applied to the one or more memory elements to an elevated
voltage about ten percent above a nominal voltage setting and less
than a breakdown voltage setting for the one or more memory
elements to facilitate fixing the data in less cycles to read or
write the data the predetermined number of times.
8. A method comprising: applying heat, via a controller, to a
ferroelectric random access memory (FRAM) array having one or more
memory elements; increasing an operating voltage above a nominal
voltage setting, via the controller, to read or write to the one or
more memory cells; and cycling the data, via the controller, to be
fixed in the subset of the one or more memory elements by reading
the data a predetermined number of times to fix the data to a
non-volatile stable state.
9. The method of claim 8, further comprising cycling the data
stored in the subset of the one or more memory elements by reading
the data in a range of about 5 cycles to about 10,000 cycles.
10. The method of claim 9, further comprising increasing the
operating voltage applied to the one or more memory cells to an
elevated voltage about ten percent above the nominal voltage
setting and less than a breakdown voltage setting for the one or
more memory elements to facilitate fixing the data in fewer cycles
to read the data the predetermined number of times.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 15/944,666, filed Apr. 3, 2018, which is a
continuation of U.S. patent application Ser. No. 14/642,375, filed
Mar. 9, 2015, now U.S. Pat. No. 9,934,840, which claims the benefit
of and priority to U.S. Provisional Patent Application No.
61/951,285, filed Mar. 11, 2014, all of which are incorporated
herein by reference in their entirety.
TECHNICAL FIELD
[0002] This disclosure relates to memory circuits, and more
particularly to a ferroelectric memory having data that is fixed to
a stable state.
BACKGROUND
[0003] Ferroelectric RAM (also referred to as FeRAM, F-RAM or FRAM)
is a random-access memory similar in construction to DRAM but uses
a ferroelectric material layer instead of a dielectric layer to
achieve non-volatility. The FRAM is one of a growing number of
alternative non-volatile random-access memory technologies that
offer the same functionality as flash memory. However, FRAM offers
advantages over flash that include that include lower power usage,
faster write performance, and a much greater maximum number of
write-erase cycles, for example.
[0004] Ferroelectric material in the FRAM has a nonlinear
relationship between the applied electric field and the apparent
stored charge. Specifically, the ferroelectric characteristic of
the material has the form of a hysteresis loop, which is very
similar in shape to the hysteresis loop of ferromagnetic materials.
The dielectric constant of a ferroelectric material is typically
much higher than that of a linear dielectric because of the effects
of semi-permanent electric dipoles formed in the crystal structure
of the ferroelectric material. When an external electric field is
applied across a dielectric, the dipoles in the material tend to
align themselves with the field direction, produced by small shifts
in the positions of atoms and shifts in the distributions of
electronic charge in the crystal structure. After the charge is
removed, the dipoles retain their polarization state, where binary
"0"s and "1"s are stored as one of two possible electric
polarizations in each data storage cell. Over extreme environmental
conditions and/or over time however, stored data in FRAM material
can be lost.
[0005] In high-reliability (automotive, medical, space, and so
forth) non-volatile (NV) memory applications, stable memory
technologies are needed where data is preserved regardless of the
underlying time (e.g., time between accesses or time in one
particular data state) or conditions involved. In many systems, the
memory is used to store a set of critical system values that once
written are never changed. In many of these systems, a read only
memory (ROM) may be a better solution except that the data that
would be stored in ROM is often not determined or known until the
product is made and the final application software revised or
optimized. In such cases, a reliable non-volatile memory is
needed.
SUMMARY
[0006] This disclosure relates to a ferroelectric memory having
data that is fixed to a stable state. In one aspect, a system
includes a ferroelectric random access memory (FRAM) array having
one or more memory elements. A cycle controller cycles data to be
fixed in a subset of the one or more memory elements by reading or
writing the data a predetermined number of times to fix the data to
a non-volatile stable state.
[0007] In another aspect, a circuit includes a ferroelectric random
access memory (FRAM) array having one or more memory elements. A
cycle controller cycles the data to be fixed in in a subset of the
one or more memory elements by reading or writing the data a
predetermined number of times to fix the data to a non-volatile
stable state. A heater controlled by the cycle controller heats the
FRAM array to a predetermined temperature to facilitate fixing the
data in fewer cycles to read or write the data the predetermined
number of times.
[0008] In yet another aspect, a method includes applying heat to a
ferroelectric random access memory (FRAM) array having one or more
memory elements to store data. The method includes increasing an
operating voltage above a nominal voltage setting to read or write
to the one or more memory cells. The method includes cycling the
data to be fixed in the subset of the one or more memory elements
by reading the data a predetermined number of times to fix the data
to a non-volatile condition.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 illustrates an example a system to fix data to a
non-volatile stable state in a ferroelectric random access
memory.
[0010] FIG. 2 illustrates example heater configurations for a
system to fix data to a non-volatile stable state in a
ferroelectric random access memory.
[0011] FIG. 3 illustrates an example voltage programming diagram to
fix data to a non-volatile stable state in a ferroelectric random
access memory.
[0012] FIG. 4 illustrates an example a circuit to fix data to a
non-volatile stable state in a ferroelectric random access
memory.
[0013] FIG. 5 illustrates an example method to fix data to a
non-volatile stable state in a ferroelectric random access
memory.
DETAILED DESCRIPTION
[0014] This disclosure relates to a ferroelectric memory having
data that is fixed to a non-volatile stable state. A system and/or
circuit can be provided that includes a ferroelectric random access
memory (FRAM) array having one or more memory elements to store
data, where the data can be cycled at elevated temperatures and/or
voltages to place the FRAM into the non-volatile stable state in an
efficient manner. A cycle controller cycles the data stored in a
subset of the one or more memory elements (e.g., where subset
includes all or a portion of the FRAM) by reading or writing the
data a predetermined number of times to fix the data to the
non-volatile stable state. A heater can be provided that heats the
FRAM array to a predetermined temperature to facilitate fixing the
data in fewer cycles to read or write the data the predetermined
number of times. A voltage adjuster can also be provided that
allows reading or writing of the FRAM memory cells above the
nominal access range to also facilitate fixing the data in a faster
cycle time to read or write the data the predetermined number of
times. It is noted that the term "fixing" relates to the conversion
of a non-volatile (NV) FRAM that can be read and written to a
permanent state non-volatile FRAM that now operates like a read
only memory (ROM) where writes can no longer change the state of
the memory that has been fixed as disclosed herein. Thus,
non-volatile after fixing is the property of being fixed in a
preferred state, based on the cycling, voltage, and/or temperature
methods disclosed herein such that the FRAM can be read but no
longer written, and thus the fixed data is more stable than in the
un-modified non-volatile FRAM where the data may still be
over-written.
[0015] Existing FRAM technology can be employed and cycled via the
cycle controller to act as a programmable memory and thus can be
changed at any time until data is "fixed" by multiple read (or
write) cycling at elevated temperatures and/or voltages. This
allows flexibility while developing final products/applications in
that the data in the FRAM is fully reprogrammable until it is
"fixed" by the cycling process disclosed herein. Also, since both
temperature and cycling can be utilized to fix the stored bits in a
stable non-volatile condition, small sections of memory can be
fixed while leaving the remainder of the memory in its original
(e.g., bistable) random access form. Conventional ROM technologies
are stable but the final values must be ready when the ROM is made
(e.g., it is not programmable after the fact). Thus, in many
systems, the values are not finalized until production and/or are
part specific (e.g., trim bits) thus a ROM solution is not viable.
Using FRAM with data cycling allows the FRAM to be used as a
programmable non-volatile memory while having a subset or the
entire address space fixed in a more stable "ROM state" at any time
after the chip/system is up and running. This allows substantial
optimization capability (prior to fixing the data) and enhanced
stability after the data is fixed in FRAM by the systems, circuits,
and processes described herein.
[0016] FIG. 1 illustrates an example a system 100 to fix data to a
non-volatile stable state in a ferroelectric random access memory
(FRAM) 110. The FRAM 110 can include one or more memory elements
120 to store data and can be fixed to a stable non-volatile
condition as disclosed herein. In some examples, all of the FRAM
110 can be set to a fixed non-volatile condition. In other
examples, a subset of the memory elements 120 can be fixed with the
remaining subset left in its native random access form. As used
herein, the term subset can include all or a portion of the memory
elements 120 in the FRAM 110. A cycle controller 130 cycles the
data to be fixed in a subset of the one or more memory elements 120
by reading or writing the data a predetermined number of times to
fix the data to a non-volatile stable state. As used herein, the
term cycles the data can apply when the data was stored prior to
the cycling. Another possibility cycling the data applies to the
case where is the data is being written for the first time, and it
is then written (or read) repeatedly a predetermined number of
times. Another possibility is the data is read out from the
respective memory elements 120, placed in a temporary buffer, and
then written back (or read from) repeatedly a predetermined number
of cycles.
[0017] Typically, cycling involves reading of the FRAM 110 and
respective memory elements 120. As used herein, the term reading
involves applying a voltage to the memory elements 120 and sensing
the data state of the memory element. Similarly, writing also
involves applying a voltage to the respective memory element 120 to
place it in a known data state such as a "0" state or a "1" state.
A heater 140 can be provided to heat the FRAM array 110 to a
predetermined temperature to facilitate fixing the data to a
non-volatile state in fewer read or write cycles to read or write
the data the predetermined number of times. As will be illustrated
and described below with respect to FIG. 2, the heater can be an
external heater that applies heat externally to a package that
houses the FRAM array 110. In another example, the heater 140 can
be a resistive heating element that applies heat within a package
(or to a socket holding the package) that houses the FRAM array
110. In another example, the heater 140 can be a resistive heating
element that resides on an integrated circuit die that provides
heat to one or more of the memory elements 120 (e.g., silicon
resistor or transistor that is heated next to a memory element in
circuit). The heater 140 can supply heat that is above an ambient
temperature of the FRAM array 110, where the temperature above the
ambient temperature of the FRAM array can be within a range of
about 85 degrees Celsius to about 200 degrees Celsius, for
example.
[0018] The cycle controller 130 can include a cycle adjuster 150
that indicates a number of times to cycle the data stored in a
subset of the one or more memory elements by reading or writing the
data. For example, the cycle adjuster 150 can specify a range of
about 5 cycles to about 10,000 cycles to the cycle controller 130.
The cycle controller 130 can also include a voltage adjuster 160 to
set a programming read or write voltage applied to the one or more
memory elements 120 to an elevated voltage above a nominal voltage
setting to facilitate fixing the data in fewer cycles to read or
write the data the predetermined number of times. For example, the
voltage adjuster 160 can set the programming read or write voltage
applied to the one or more memory elements 120 to an elevated
voltage in the range of about ten percent above the nominal voltage
setting to less than a breakdown voltage setting for the one or
more memory cells, where breakdown setting refers to a voltage that
will cause a failure in the respective memory element 120.
[0019] As noted above, the heater 140 can be provided as a chip
socket, an embedded package, or integrated heater element to raise
the FRAM 110 temperature above its normal operating range (but not
high enough to cause a hard failure in the FRAM). Concurrently, the
FRAM 110 can be accessed with repetitive read cycles (or write
cycles) to allow the cycle controller 130 to "fix" the data states
stored in memory elements 120 such that they are thermodynamically
stable. After being exposed to higher temperatures and a number of
identical memory read or write cycles, the data in memory elements
is "fixed" or imprinted such that the opposite data state is no
longer stable, thus substantially only the original data in the
memory is recalled, even if the bits are accidently overwritten
with the wrong data, since only the fixed data state is now stable
(after cycling), where the bits quickly revert to the original
fixed data state. Thus, the FRAM 110 that has been fixed acts as a
read only memory (ROM) since the bistable nature of the memory is
transformed into a single preferred stable state (if the opposite
state is written into the cell, it automatically reverts to the
state which was imprinted) by the fixing process. The heater 140
can be used to accelerate the imprinting process. Additionally, a
higher voltage can be used during the repetitive read or write
cycles to further accelerate the imprinting. At high temperature
and higher voltage, this imprinting process can be achieved in a
plurality of read cycles (e.g., 5 to 10,000) representing seconds
or minutes of real time to achieve the stable fixing of the FRAM
110.
[0020] In one dedicated example implementation, a cycle memory port
could be defined where only a small subset of memory elements 120
are defined for the port and can be employed to allow read or write
cycling at much higher frequencies thus significantly cutting down
the fixing time. Since the extra port may utilize additional area,
in this implementation only a small part of the memory would be of
this type and only used to store critical system variables that are
usually stored in ROM. One advantage of this capability would be
achieved in a single process technology not requiring extra
components (such as fuses, ROM, OTP, and so forth). Additionally,
the FRAM 110 can act as a non-volatile programmable memory until
critical code had been finalized then the desired section of FRAM
defined as the stress port could be converted to ROM-like memory
with the aforementioned fixing process.
[0021] FIG. 2 illustrates example heater configurations 200 for a
system to fix data to a non-volatile stable state in a
ferroelectric random access memory. In one example configuration
200, the heater is an external heater that applies heat externally
at 210 to a package that houses the FRAM array and memory elements
214. For example, a set of FRAM arrays could be placed into a
heating chamber while the cycling/fixing processes described herein
were applied. In another example, the heater could be a resistive
heating element that applies heat within a package at 220 that
houses the FRAM array and memory elements 214. For example, a
ceramic or plastic package could have an internal heating element
built therein. Also, heat could be applied to a chip socket that
the FRAM array was plugged into. In yet another example, the heater
can be a resistive heating element that resides on an integrated
circuit die at 230 that provides heat to one or more of the memory
elements. For example, a resistor, diode, or transistor could be
heated in circuit to heat all or portion of the FRAM array. As
noted previously, the respective heater configurations 200 can
supply heat that is above an ambient temperature of the FRAM array,
where the temperature above the ambient temperature of the FRAM
array is within a range of about 85 degrees Celsius to about 200
degrees Celsius.
[0022] In other examples, ceramic heaters that can be placed on top
of a packaged chip which can raise the temperature up to 200 or 300
degrees Celsius, for example. This would allow a normal (room
temperature) ambient with local heating as another approach.
Another heating method could be a heating lamp which can achieve
high temperatures within seconds. This would resemble a rapid
thermal anneal process. In the case of external heaters, fixing
procedures could be applied at product test where the ambient is at
room temperature.
[0023] FIG. 3 illustrates an example voltage programming diagram
300 to fix data to a non-volatile stable state in a ferroelectric
random access memory. In this example, voltage read or write access
levels are shown on the vertical axis versus time the voltage is
applied on the horizontal access. A typical voltage pulse 310 is
shown that falls between a nominal voltage range shown between
lines 320 and 330. As noted previously, a voltage adjuster can set
a programming read or write voltage that is applied to the one or
more memory elements to an elevated voltage above the nominal
voltage setting such as shown via pulse 340 to facilitate fixing
the data in a faster cycle time to read or write the data the
predetermined number of times. Such setting can be within a range
shown between lines 350 and 360. In one example, the elevated
voltage in the range can be about ten percent above the nominal
voltage setting shown at 350 to less than a breakdown voltage
setting shown at 360 for the one or more memory cells. Voltage
levels can be adjusted higher or lower than the example ranges
described herein based upon the time the pulse is applied or to
adjust the number of cycles required to fix the FRAM.
[0024] FIG. 4 illustrates an example a circuit 400 to fix data to a
non-volatile stable state in a ferroelectric random access memory.
As used herein, the term circuit can include a collection of active
and/or passive elements that perform a circuit function such as an
analog circuit or control circuit, for example. The term circuit
can also include an integrated circuit where all the circuit
elements are fabricated on a common substrate, for example. The
circuit 400 includes a ferroelectric random access memory (FRAM)
array 410 having one or more memory elements 420 to store data. A
cycle controller 430 cycles the data stored in a subset of the one
or more memory elements 420 by reading or writing the data a
predetermined number of times to fix the data to a non-volatile
stable state. A heater 440 is controlled by the cycle controller to
heat the FRAM array 410 (or portion thereof) to a predetermined
temperature to facilitate fixing the data in a faster cycle time to
read or write the data the predetermined number of times. As shown,
an external fix memory command that specifies which portions of
memory to fix can be provided to the cycle controller 430. The fix
memory command can also specify the number of cycles to execute by
the cycle controller 430. Although not shown, the cycle controller
430 can also include a voltage adjuster to set a programming read
or write voltage applied to the one or more memory elements to an
elevated voltage to read or write the data the predetermined number
of times.
[0025] In view of the foregoing structural and functional features
described above, an example method will be better appreciated with
reference to FIG. 5. While, for purposes of simplicity of
explanation, the method is shown and described as executing
serially, it is to be understood and appreciated that the method is
not limited by the illustrated order, as parts of the method could
occur in different orders and/or concurrently from that shown and
described herein. Such method can be executed by various components
configured in an IC or a controller, for example.
[0026] FIG. 5 illustrates an example method 500 to fix data to a
non-volatile stable state in a ferroelectric random access memory.
At 510, the method 500 includes applying heat to a ferroelectric
random access memory (FRAM) array having one or more memory
elements to store data (e.g., via heater 140 of FIG. 1). At 520,
the method 500 includes increasing an operating voltage above a
nominal voltage setting to read or write to the one or more memory
cells (via voltage adjuster 160 of FIG. 1). At 530, the method 500
includes reading addresses of a subset of the one or more memory
cells to be placed into a fixed non-volatile condition (e.g., via
cycle controller 130 of FIG. 1). At 540, the method includes
cycling the data stored in the subset of the one or more memory
elements by reading the data a predetermined number of times to fix
the data to the non-volatile condition (e.g., via cycle controller
130 of FIG. 1). At 550, the method 500 includes reducing chip
temperature to normal operation after the cycling process of 540
(e.g., via controller 430 and heater 440 of FIG. 4). At 560, the
method 500 includes reading fixed memory address to confirm FRAM
data is fixed (e.g., via controller 130 of FIG. 1). The method 500
can also include cycling the data stored in the subset of the one
or more memory elements by reading the data in a range of about 5
cycles to about 10,000 cycles. The method 500 can include
increasing the operating voltage applied to the one or more memory
cells to an elevated voltage about ten percent above the nominal
voltage setting and less than a breakdown voltage setting for the
one or more memory elements to facilitate fixing the data in a
faster cycle time to read the data the predetermined number of
times.
[0027] What have been described above are examples. It is, of
course, not possible to describe every conceivable combination of
components or methodologies, but one of ordinary skill in the art
will recognize that many further combinations and permutations are
possible. Accordingly, the disclosure is intended to embrace all
such alterations, modifications, and variations that fall within
the scope of this application, including the appended claims. As
used herein, the term "includes" means includes but not limited to,
the term "including" means including but not limited to. The term
"based on" means based at least in part on. Additionally, where the
disclosure or claims recite "a," "an," "a first," or "another"
element, or the equivalent thereof, it should be interpreted to
include one or more than one such element, neither requiring nor
excluding two or more such elements.
* * * * *