U.S. patent application number 16/425953 was filed with the patent office on 2020-04-16 for heat transferring module and manufacturing method thereof.
This patent application is currently assigned to HTC Corporation. The applicant listed for this patent is HTC Corporation. Invention is credited to Shuo-Hsiu Chang, Chun-Lung Chu, Chih-Yao Kuo, Tien-Tso Liu, Wei-Cheng Liu, Chin-Kai Sun.
Application Number | 20200116436 16/425953 |
Document ID | / |
Family ID | 70159565 |
Filed Date | 2020-04-16 |
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United States Patent
Application |
20200116436 |
Kind Code |
A1 |
Kuo; Chih-Yao ; et
al. |
April 16, 2020 |
HEAT TRANSFERRING MODULE AND MANUFACTURING METHOD THEREOF
Abstract
A heat transferring module includes a first conductor plate, a
second conductor plate, a working fluid and a reinforcing layer.
The second conductor plate is connected to the first conductor
plate to form a cavity. The working fluid is located in the cavity.
The reinforcing layer is formed on an outer surface of at least one
of the first conductor plate and the second conductor plate,
wherein at least one of the first conductor plate and the second
conductor plate has a capillary structure. The capillary structure
is located on an inner surface of at least one of the first
conductor plate and the second conductor plate, and a structural
strength of the reinforcing layer is greater than a structural
strength of the first conductor plate and a structural strength of
the second conductor plate. In addition, a manufacturing method of
a heat transferring module is also provided.
Inventors: |
Kuo; Chih-Yao; (Taoyuan
City, TW) ; Sun; Chin-Kai; (Taoyuan City, TW)
; Chu; Chun-Lung; (Taoyuan City, TW) ; Liu;
Wei-Cheng; (Taoyuan City, TW) ; Liu; Tien-Tso;
(Taoyuan City, TW) ; Chang; Shuo-Hsiu; (Taoyuan
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HTC Corporation |
Taoyuan City |
|
TW |
|
|
Assignee: |
HTC Corporation
Taoyuan City
TW
|
Family ID: |
70159565 |
Appl. No.: |
16/425953 |
Filed: |
May 30, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62744655 |
Oct 12, 2018 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B21D 53/04 20130101;
F28D 15/0283 20130101; F28D 15/04 20130101; F28F 2225/04 20130101;
F28D 15/046 20130101 |
International
Class: |
F28D 15/04 20060101
F28D015/04; F28D 15/02 20060101 F28D015/02; B21D 53/04 20060101
B21D053/04 |
Claims
1. A heat transferring module, comprising: a first conductor plate;
a second conductor plate, connected to the first conductor plate to
form a cavity; a working fluid, located in the cavity; and a
reinforcing layer, formed on an outer surface of at least one of
the first conductor plate and the second conductor plate, wherein
at least one of the first conductor plate and the second conductor
plate has a capillary structure, the capillary structure is located
on an inner surface of the at least one of the first conductor
plate and the second conductor plate, and a structural strength of
the reinforcing layer is greater than a structural strength of the
first conductor plate and a structural strength of the second
conductor plate.
2. The heat transferring module according to claim 1, wherein a
material of the first insulating layer comprises a tungsten-nickel
alloy or a nickel-cobalt alloy.
3. The heat transferring module according to claim 1, wherein the
reinforcing layer is an electroplated reinforcing layer.
4. The heat transferring module according to claim 1, wherein the
reinforcing layer comprises a first reinforcing layer and a second
reinforcing layer, the first reinforcing layer is formed on the
outer surface of the first conductor plate, and the second
reinforcing layer is formed on the outer surface of the second
conductor plate.
5. The heat transferring module according to claim 1, wherein a
material of at least one of the first conductor plate and the
second conductor plate is selected from a group consisting of
copper, aluminum and titanium.
6. The heat transferring module according to claim 1, wherein a
maximum thickness of the heat transferring module is less than or
equal to 0.5 mm.
7. The heat transferring module according to claim 1, wherein a
thickness of the first conductor plate ranges between 0.1 mm and
0.4 mm, and a thickness of the second conductor plate ranges
between 0.1 mm and 0.4 mm.
8. The heat transferring module according to claim 1, wherein the
capillary structure comprises a first capillary structure and a
second capillary structure, the first capillary structure is formed
by a part of the first conductor plate, and the second capillary
structure is formed by a part of the second conductor plate.
9. A manufacturing method of a heat transferring module,
comprising: providing a first conductor plate and a second
conductor plate; etching at least one of the first conductor plate
and the second conductor plate to form a capillary structure;
combining the first conductor plate and the second conductor plate
to form a cavity; forming a reinforcing layer on an outer surface
of at least one of the first conductor plate and the second
conductor plate, wherein a structural strength of the reinforcing
layer is greater than that of at least one of the first conductor
plate and the second conductor plate; and vacuuming the cavity and
providing a working fluid to the cavity.
10. The manufacturing method of the heat transferring module
according to claim 9, wherein among the steps, performing in
sequence the steps of etching to form the capillary structure;
combining the first conductor plate and the second conductor plate;
and forming the reinforcing layer.
11. The manufacturing method of the heat transferring module
according to claim 9, wherein among the steps, performing in
sequence the steps of etching to form the capillary structure;
forming the reinforcing layer; and combining the first conductor
plate and the second conductor plate.
12. The manufacturing method of the heat transferring module
according to claim 9, wherein among the steps, performing in
sequence the steps of forming the reinforcing layer; etching to
form the capillary structure; and combining the first conductor
plate and the second conductor plate.
13. The manufacturing method of the heat transferring module
according to claim 9, wherein a material of the first insulating
layer comprises a tungsten-nickel alloy or a nickel-cobalt
alloy.
14. The manufacturing method of the heat transferring module
according to claim 9, wherein the method of forming the reinforcing
layer on the outer surface of the at least one of the first
conductor plate and the second conductor plate further comprises:
forming the reinforcing layer on the outer surface of the at least
one of the first conductor plate and the second conductor plate by
means of electroplating.
15. The manufacturing method of the heat transferring module
according to claim 9, wherein the reinforcing layer comprises a
first reinforcing layer and a second reinforcing layer, and the
method of forming the reinforcing layer on the outer surface of the
at least one of the first conductor plate and the second conductor
plate further comprises: forming the first reinforcing layer on the
outer surface of the first conductor plate by means of
electroplating; and forming the second reinforcing layer on the
outer surface of the second conductor plate by means of
electroplating.
16. The manufacturing method of the heat transferring module
according to claim 9, wherein the capillary structure comprises a
first capillary structure and a second capillary structure, and the
method of etching the at least one of the first conductor plate and
the second conductor plate to form the capillary structure further
comprises: etching a part of the first conductor plate to form the
first capillary structure; and etching a part of the second
conductor plate to form the second capillary structure.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of U.S.
provisional application Ser. No. 62/744,655, filed on Oct. 12,
2018. The entirety of the above-mentioned patent application is
hereby incorporated by reference herein and made a part of this
specification.
BACKGROUND
Technical Field
[0002] The application relates to a heat transferring device and
more particularly, to a heat transferring module.
Description of Related Art
[0003] In recent years, along with development of the technology
industry, information products, such as notebook computers, tablet
computers, mobile phones, or other electronic devices, have been
widely used in daily life. Electronic devices are diverse in their
styles and functions, and the convenience and the usefulness enable
the popularity of those electronic devices. A central processing
unit (CPU), a processing chip, or other electronic elements are
disposed in an electronic device, and heat is generated during the
operation of the electronic elements. However, as a volume of the
electronic device is reduced, the electronic elements are disposed
more and more densely, so that an issue of heat accumulation inside
the electronic device becomes more and more difficult to handle and
usually causes a crash to the electronic device due to heat. Thus,
improvement of heat dissipation becomes more and more
important.
[0004] Currently, a maximum thickness of an ordinary vapor chamber
is about 1 mm or more and not applicable to a miniaturized
electronic device. In a preferred condition, the miniaturized
electronic device requires a thin vapor chamber with a maximum
thickness less than 0.5 mm therein side. However, a material
currently adopted by the vapor chamber is copper, a titanium alloy
or aluminum. However, it may result in insufficient structural
strength in a scenario that copper or aluminum is used as the
material, while an issue of high cost may occur in a scenario that
the titanium alloy is used as the material.
SUMMARY
[0005] The application provides a heat dissipation module, capable
of improving structural rigidity.
[0006] The application provides a heat transferring module,
including a first conductor plate, a second conductor plate, a
working fluid and a reinforcing layer. The second conductor plate
is connected to the first conductor plate to form a cavity. The
working fluid is located in the cavity. The reinforcing layer is
formed on an outer surface of at least one of the first conductor
plate and the second conductor plate, wherein at least one of the
first conductor plate and the second conductor plate has a
capillary structure. The capillary structure is located on an inner
surface of at least one of the first conductor plate and the second
conductor plate, and a structural strength of the reinforcing layer
is greater than a structural strength of the first conductor plate
and a structural strength of the second conductor plate.
[0007] The application further provides a manufacturing method of a
heat transferring module, including steps of providing a first
conductor plate and a second conductor plate; etching at least one
of the first conductor plate and the second conductor plate to form
a capillary structure; combining the first conductor plate and the
second conductor plate to form a cavity; forming a reinforcing
layer on an outer surface of at least one of the first conductor
plate and the second conductor plate, wherein a structural strength
of the reinforcing layer is greater than a structural strength of
at least one of the first conductor plate and the second conductor
plate; and vacuuming the cavity and providing a working fluid to
the cavity.
[0008] To sum up, in the heat transferring module and the
manufacturing method thereof provided by the application. The
reinforcing layer having the structural strength greater than that
of each of the first conductor plate and the second conductor plate
is formed on the outer surface of at least one of the first
conductor plate and the second conductor plate. Thus, when the
first conductor plate and the second conductor plate are combined
together, a preferable heat transfer effect can brought by the
capillary structure, and a preferable structural stability can be
brought by the reinforcing layer.
[0009] To make the above features and advantages of the invention
more comprehensible, embodiments accompanied with drawings are
described in detail below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a schematic cross-sectional diagram illustrating a
heat transferring module according to an embodiment of the
invention.
[0011] FIG. 2 is a schematic cross-sectional diagram illustrating a
heat transferring module according to another embodiment of the
invention.
[0012] FIG. 3A to FIG. 3E are respectively schematic
cross-sectional diagrams illustrating a manufacturing process of
the heat transferring module depicted in FIG. 2.
[0013] FIG. 4 is a flowchart illustrating steps of a manufacturing
method of a heat transferring module according to an embodiment of
the invention.
[0014] FIG. 5 is a flowchart illustrating steps of a manufacturing
method of a heat transferring module according to another
embodiment of the invention.
[0015] FIG. 6 is a flowchart illustrating steps of a manufacturing
method of a heat transferring module according to another
embodiment of the invention.
DESCRIPTION OF EMBODIMENTS
[0016] FIG. 1 is a schematic cross-sectional diagram illustrating a
heat transferring module according to an embodiment of the
invention. Referring to FIG. 1, the present embodiment provides a
heat transferring module 100 adapted to contact a heating element
and transfer heat generated by the heating element to a heat
dissipation element, such as a fan or heat dissipation fins, or to
outside by means of heat conduction, so as to achieve a heat
dissipation effect. For instance, the heat transferring module 100
is a thin vapor chamber with a maximum thickness T, for example,
less than or equal to 0.5 mm. The heating element is, for example,
a central processing unit, a processor chip or other heat
generating electronic elements of a portable electronic device
(e.g., a smart cell phone). The heat transferring module 100
transfers the heat by means of heat convection and transfers the
heat by means of heat conduction. Thus, the heat generated by the
heating element may be transferred to a heat dissipation element
such as a fan or heat dissipation fins or to outside by means of
heat convection and heat conduction, so as to achieve a heat
dissipation effect. For descriptive convenience, a size of the heat
transferring module 100 is merely schematically illustrated in FIG.
1 and does not represent an actual size ratio of the heat
transferring module 100.
[0017] In the present embodiment, the heat transferring module 100
includes a first conductor plate 110, a second conductor plate 120,
a working fluid F and a reinforcing layer 130. The first conductor
plate 110 and the second conductor plate 120 are connected to each
other to form a cavity G, and the working fluid F is located in the
cavity. A thickness of the first conductor plate 110 ranges between
0.1 mm and 0.4 mm, and a thickness of the second conductor plate
ranges between 0.1 mm and 0.4 mm. In the present embodiment, the
thickness of the first conductor plate 110 is 0.4 mm, and the
thickness of the first conductor plate 110 is 0.1 mm. In the
present embodiment, a material of the first conductor plate 110 and
the second conductor plate 120 includes a copper alloy. However, in
other embodiments, a material of at least one of the first
conductor plate 110 and the second conductor plate 120 is selected
from a group consisting of copper, aluminum and titanium, but the
application is not limited thereto. A shape of at least one of the
first conductor plate 110 and the second conductor plate 120 may be
formed by stamping design, so as to form the cavity G after the
first conductor plate 110 and the second conductor plate 120 are
combined. In the present embodiment, a method of connecting the
first conductor plate 110 and the second conductor plate 120 to
each other is, for example, welding, but the application is not
limited thereto.
[0018] To be detailed, at least one of the first conductor plate
110 and the second conductor plate 120 has a capillary structure P,
and this capillary structure P is located on an inner surface of at
least one of the first conductor plate 110 and the second conductor
plate 120. For example, in the present embodiment, the thickness of
the first conductor plate 110 is greater than the thickness of the
second conductor plate 120, and thus, the first conductor plate 110
may be designed with the capillary structure P, as illustrated in
FIG. 1. In the present embodiment, the capillary structure P is
formed by, for example, etching a plate body of a conductor plate
to form a micro structure capable of generating a capillarity
phenomenon. The working fluid F may be condensed from a gas into a
liquid by the capillary structure P, so as to achieve a purpose of
heat transfer.
[0019] Specifically, during the process of heat dissipation, the
heat of the heating element is transferred to the heat transferring
module 100, and the working fluid F which is more adjacent to the
heating element is heated and evaporated into a gas which flows
upward and fills up the entire cavity G. When the evaporated
working fluid F flows to a location which is relatively far away
from the heating element, as this location has a relatively low
temperature, the working fluid F, after exchanging heat with
another medium (e.g., the capillary structure P, the first
conductor plate 110, the second conductor plate 120 or cool air)
and being condensed into a liquid, flows back by the capillarity
phenomenon of the first conductor plate 110 and the second
conductor plate 120. The evaporation and condensation operations
are repeatedly performed inside the cavity G. Thus, the heat
transferring module 100 may dissipate the heat generated by the
heating element to other media.
[0020] The reinforcing layer 130 is formed on an outer surface of
at least one of the first conductor plate 110 and the second
conductor plate 120, and a structural strength of the reinforcing
layer 130 is greater than a structural strength of the first
conductor plate 110 and a structural strength of the second
conductor plate 120. Thus, the structural strength of at least one
of the first conductor plate 110 and the second conductor plate 120
may be improved, such that the thickness of at least one of the
first conductor plate 110 and the second conductor plate 120 may be
reduced for being used in manufacturing a thin vapor chamber.
[0021] To be detailed, a material of the reinforcing layer 130
includes a tungsten-nickel alloy or a nickel-cobalt alloy, and, in
the present embodiment, the reinforcing layer 130 is formed on the
outer surface of the second conductor plate 120 by means of
electroplating. In other words, the reinforcing layer 130 is an
electroplated reinforcing layer. In this way, the structural
strength of the second conductor plate 120 may be further improved.
It is to be mentioned that in the heat transferring module 100, two
conductor plates which respectively include a thick one and a thin
one may be selected to serve as the first conductor plate 110 and
the second conductor plate 120, the thicker conductor plate is
etched to form the capillary structure P, and the thinner conductor
plate is electroplated to form the reinforcing layer 130. The
relative thickness and the manufacturing process of each of the
first conductor plate 110 and the second conductor plate 120 are
not limited in the application. In this way, when the first
conductor plate 110 and the second conductor plate 120 are combined
together, a preferable heat transfer effect may be brought by the
capillary structure P, and a preferable structural stability may be
brought by the reinforcing layer 130.
[0022] FIG. 2 is a schematic cross-sectional diagram illustrating a
heat transferring module according to another embodiment of the
invention. Referring to FIG. 2, a heat transferring module 100A of
the present embodiment is similar to the heat transferring module
100 illustrated in FIG. 1. The difference therebetween is as
follows. In the present embodiment, a second conductor plate 120A
also has the capillary structure P, and the reinforcing layer 130
is formed on the outer surface of each of a first conductor plate
110A and the second conductor plate 120A. For descriptive
convenience, a size of the heat transferring module 100A is merely
schematically illustrated in FIG. 2 and does not represent an
actual size ratio of the heat transferring module 100A.
[0023] To be detailed, in the present embodiment, each of the first
conductor plate 110A and the second conductor plate 120A has a
thickness of 0.25 mm, and the first conductor plate 110A and the
second conductor plate 120A are respectively etched to form a first
capillary structure P1 and a second capillary structure P2. In
other words, the first capillary structure P1 is formed by a part
of the first conductor plate 110A, and the second capillary
structure P2 is formed by a part of the second conductor plate
120A. The reinforcing layer 130 includes a first reinforcing layer
130_1 and a second reinforcing layer 130_2. The first reinforcing
layer 130_1 is formed on an outer surface of the first conductor
plate 100A, and the second reinforcing layer 130_2 is formed on an
outer surface of the second conductor plate 120A. Thus, when the
first conductor plate 110A and the second conductor plate 120A are
combined, a preferable heat transfer effect may be brought by the
first capillary structure P1 and the second capillary structure P2,
and a preferable structural stability may be brought by the first
capillary structure P1 and the second capillary structure P2.
[0024] FIG. 3A to FIG. 3E are respectively schematic
cross-sectional diagrams illustrating a manufacturing process of
the heat transferring module depicted in FIG. 2. FIG. 4 is a
flowchart illustrating steps of a manufacturing method of a heat
transferring module according to an embodiment of the invention.
Referring first to FIG. 2, FIG. 3A and FIG. 4 simultaneously, the
application provides a manufacturing method of a heat transferring
module, and the manufacturing method may be at least applied to the
heat transferring module 100A illustrated in FIG. 2. However, the
application is not limited thereto. In the present embodiment,
first, step S200 is performed, the first conductor plate 110A and
the second conductor plate 120A are provided, wherein shapes the
first conductor plate 110A and the second conductor plate 120A may
be formed by stamping design.
[0025] Referring to FIG. 2, FIG. 3B and FIG. 4 simultaneously,
then, step S201 is performed. At least one of the first conductor
plate 110A and the second conductor plate 120A is etched to form
the capillary structure P. Specifically, in the present embodiment,
the first conductor plate 110A is etched to form the first
capillary structure P1, and the second conductor plate 120A is
etched to form the second capillary structure P2.
[0026] Referring to FIG. 2, FIG. 3C and FIG. 4 simultaneously,
then, step S202 is performed. The first conductor plate 110A and
the second conductor plate 120A are combined to form the cavity G.
Specifically, in the present embodiment, the first conductor plate
110A and the second conductor plate 120A are combined by means of
welding, so as to form the cavity G inside the location that is
welded.
[0027] Referring to FIG. 2, FIG. 3D and FIG. 4 simultaneously,
then, step S203 is performed. The reinforcing layer 130 is formed
on an outer surface of at least one of the first conductor plate
110A and the second conductor plate 120A, wherein the structural
strength of the reinforcing layer 130 is greater than that of at
least one of the first conductor plate 110A and the second
conductor plate 120A. Specifically, in the present embodiment, the
first reinforcing layer 130_1 is formed on the outer surface of the
first conductor plate 110A by means of electroplating, and the
second reinforcing layer 130_2 is formed on the outer surface of
the second conductor plate 120A by means of electroplating.
[0028] Referring to FIG. 2, FIG. 3E and FIG. 4 simultaneously,
then, step S204 is performed. The cavity G is vacuumed, and the
working fluid F is provided to the cavity G. Specifically, in the
present embodiment, the vacuuming may be performed via a reserved
through hole (not shown) on the first conductor plate 110A or the
second conductor plate 120A, the working fluid F is provided into
the cavity G after the vacuuming, and finally, the through hole is
sealed by means of welding. Thereby, the heat transferring module
100A may be formed.
[0029] FIG. 5 is a flowchart illustrating steps of a manufacturing
method of a heat transferring module according to another
embodiment of the invention. Referring to FIG. 2 and FIG. 5, the
manufacturing method of the heat transferring module may be at
least applied to the heat transferring module 100A illustrated in
FIG. 2. However, the application is not limited thereto. A
manufacturing method of the heat transferring module 100A of the
present embodiment is similar to the manufacturing method of the
heat transferring module illustrated in FIG. 4. The difference
therebetween is as follows. In the present embodiment, step S203 is
performed after step S201 of etching to form the capillary
structure P is performed. The reinforcing layer 130 is formed on
the outer surface of at least one of the first conductor plate 110A
and the second conductor plate 120A, wherein the structural
strength of the reinforcing layer 130 is greater than that of at
least one of the first conductor plate 110A and the second
conductor plate 120A. Then, after the aforementioned steps are
completed, step S202 is performed, wherein the first conductor
plate 110A and the second conductor plate 120A are combined to form
the cavity G. In other words, among the aforementioned steps, the
steps of etching to form the capillary structure P, forming the
reinforcing layer 130 and combining the first conductor plate 110A
and the second conductor plate 120A are performed in sequence.
Thus, the embodiments may have different manufacturing processes to
be adapted to structural requirements.
[0030] FIG. 6 is a flowchart illustrating steps of a manufacturing
method of a heat transferring module according to another
embodiment of the invention. Referring to FIG. 2 and FIG. 6, the
manufacturing method of the heat transferring module may be at
least applied to the heat transferring module 100A illustrated in
FIG. 2. However, the application is not limited thereto. A
manufacturing method of the heat transferring module 100A of the
present embodiment is similar to the manufacturing method of the
heat transferring module illustrated in FIG. 4. The difference
therebetween is as follows. In the present embodiment, step S203 is
performed after step S200 of providing the first conductor plate
110A and the second conductor plate 120A is performed, wherein the
reinforcing layer 130 is formed on the outer surface of at least
one of the first conductor plate 110A and the second conductor
plate 120A, wherein the structural strength of the reinforcing
layer 130 is greater than that of at least one of the first
conductor plate 110A and the second conductor plate 120A. Then,
after the aforementioned steps are completed, step S201 is
performed, where at least one of the first conductor plate 110A and
the second conductor plate 120A is etched to form the capillary
structure P. Then, after the aforementioned steps are completed,
step S202 is performed, where the first conductor plate 110A and
the second conductor plate 120A are combined to form the cavity G.
In other words, among the aforementioned steps, the steps of
forming the reinforcing layer 130, etching to form the capillary
structure P and combining the first conductor plate 110A and the
second conductor plate 120A are performed in sequence. Thus, the
embodiments may have different manufacturing processes to be
adapted to structural requirements.
[0031] In view of the foregoing, in the heat transferring module
and the manufacturing method thereof provided by the application,
the reinforcing layer having the structural strength greater than
that of each of the first conductor plate and the second conductor
plate is formed on the outer surface of at least one of the first
conductor plate and the second conductor plate. Thus, when the
first conductor plate and the second conductor plate are combined
together, a preferable heat transfer effect can brought by the
capillary structure, and a preferable structural stability can be
brought by the reinforcing layer.
[0032] Although the invention has been described with reference to
the above embodiments, the invention is not limited to the above
embodiments. It is apparent to one of ordinary skill in the art
that modifications and variations to the described embodiments may
be made without departing from the spirit and scope of the
invention. Accordingly, the scope of the invention will be defined
by the attached claims. What is claimed is:
* * * * *