U.S. patent application number 16/141885 was filed with the patent office on 2020-03-26 for ceramic weave for low-cost, structural, antenna-permeable watch case.
The applicant listed for this patent is Apple Inc.. Invention is credited to Colin M. Ely, Scott W. Slabaugh.
Application Number | 20200096948 16/141885 |
Document ID | / |
Family ID | 69883891 |
Filed Date | 2020-03-26 |
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United States Patent
Application |
20200096948 |
Kind Code |
A1 |
Ely; Colin M. ; et
al. |
March 26, 2020 |
CERAMIC WEAVE FOR LOW-COST, STRUCTURAL, ANTENNA-PERMEABLE WATCH
CASE
Abstract
A composite housing of an electronic device can include a
substrate having a shape that partially defines an internal volume
of the electronic device and includes ceramic fibers arranged in a
weave pattern and embedded in a matrix material. The composite
housing can also include an overmold material at least partially
surrounding the substrate and an antenna integrated into the
overmold material.
Inventors: |
Ely; Colin M.; (Sunnyvale,
CA) ; Slabaugh; Scott W.; (Gilroy, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Apple Inc. |
Cupertino |
CA |
US |
|
|
Family ID: |
69883891 |
Appl. No.: |
16/141885 |
Filed: |
September 25, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01Q 15/08 20130101;
C04B 2235/5224 20130101; B29C 70/023 20130101; B29L 2031/3481
20130101; B29C 70/22 20130101; H01Q 1/273 20130101; D03D 15/00
20130101; B29K 2309/02 20130101; B29C 70/545 20130101; G04G 17/08
20130101; D10B 2505/02 20130101; H01Q 1/243 20130101; B29C 45/14786
20130101; B29C 2793/009 20130101; B29C 64/00 20170801; C04B
2235/5236 20130101; H05K 5/0217 20130101; H01Q 1/40 20130101; D10B
2101/08 20130101 |
International
Class: |
G04G 17/08 20060101
G04G017/08; B29C 70/02 20060101 B29C070/02; B29C 70/22 20060101
B29C070/22; D03D 15/00 20060101 D03D015/00; H01Q 1/24 20060101
H01Q001/24; H01Q 1/27 20060101 H01Q001/27; H05K 5/02 20060101
H05K005/02 |
Claims
1. A housing of an electronic device, comprising: a substrate
partially defining an internal volume of the electronic device and
including ceramic fibers arranged in a weave pattern and embedded
in a matrix material; an overmold material at least partially
surrounding the substrate and at least partially defining an
exterior surface of the electronic device; and an operational
component integrated into the overmold material and positioned
between the substrate and the exterior surface.
2. The housing of claim 1, further comprising: an aperture passing
through the substrate and the overmold material; a transparent
element positioned within the aperture; and the overmold material
including an attachment feature.
3. The housing of claim 1, wherein the operational component
comprises an antenna.
4. The housing of claim 3, wherein the substrate amplifies a signal
transmitted by the antenna.
5. The housing of claim 1, wherein the ceramic fibers comprise
zirconia or alumina.
6. The housing of claim 1, wherein the matrix material comprises a
thermoset polymer, thermoplastic polymer, or combinations
thereof.
7. The housing of claim 1, wherein the overmold material comprises
a polymer.
8. The housing of claim 1, wherein the weave pattern comprises a
fabric weave pattern.
9. The housing of claim 8, wherein the weave pattern comprises a
satin weave.
10. A component of an electronic device, comprising: a substrate
including a ceramic material; an overmold material at least
partially surrounding the substrate and at least partially defining
an exterior surface of the electronic device; and an operational
component at least partially surrounded by the overmold material,
the operational component positioned between the substrate and the
exterior surface.
11. The component of claim 10, wherein the substrate comprises
ceramic fibers embedded in a matrix material.
12. The component of claim 11, wherein the ceramic fibers are
arranged in a weave pattern.
13. The component of claim 11, wherein the ceramic fibers are
substantially randomly oriented throughout the substrate.
14. The component of claim 11, wherein the matrix material
comprises a thermoset polymer, thermoplastic polymer, or
combinations thereof.
15. The component of claim 10, wherein the ceramic material
comprises zirconia or alumina.
16. The component of claim 10, wherein the overmold material
comprises a polymer.
17. A method of forming a component of an electronic device,
comprising: solidifying a matrix material at least partially around
ceramic fibers to form a substrate; cutting the substrate into a
desired shape; disposing an operational component adjacent to the
substrate; and overmolding the substrate and the operational
component with a moldable material so the moldable material at
least partially surrounds the substrate and the operational
component, the moldable material contacting the substrate and
comprising a material different from the substrate.
18. The method of claim 17, wherein cutting the substrate comprises
laser-cutting the substrate to form an aperture.
19. The method of claim 17, wherein the ceramic fibers are arranged
in a weave pattern.
20. The method of claim 17, wherein the ceramic fibers are
substantially randomly oriented throughout the matrix material.
Description
FIELD
[0001] The described embodiments relate generally to composite
articles for electronic devices. More particularly, the present
embodiments relate to ceramic composite articles for electronic
devices and methods of forming the same.
BACKGROUND
[0002] Electronic devices are widespread in society and can take a
variety of forms, from wristwatches to computers. Electronic
devices, including portable electronic devices such as handheld
phones, tablet computers, and watches, can experience contact with
various surfaces during use. Further, the use, transportation, and
storage of such devices can exert mechanical and thermal stresses
thereon.
[0003] Components for these devices, such as housings, can benefit
from exhibiting different combinations of properties relating to
the use of the device. A housing for a portable electronic device
can have a combination of properties, such as strength, appearance,
toughness, abrasion resistance, electromagnetic shielding, and
cost, in order for the device to function as desired. Certain
materials can provide a desired level of performance with respect
to some properties, but not others. For example, a metal housing
can be strong and tough, but can provide varying levels of
electromagnetic shielding. A plastic housing can be
electromagnetically transparent, but can have lower levels of
strength, toughness, and abrasion resistance. Ceramic materials can
be stronger than plastic, but can be more expensive to form and
machine.
SUMMARY
[0004] One aspect of the present disclosure relates to a housing of
an electronic device including a substrate having a shape partially
defining an internal volume of the electronic device and including
ceramic fibers arranged in a weave pattern. The weave pattern can
be embedded in a matrix material. Additionally, an overmold
material can at least partially surround the substrate. An
operational component, such as an antenna, can be integrated into
the overmold material.
[0005] In some embodiments, the housing can further include an
aperture passing through the substrate and overmold material. A
transparent element can be positioned within the aperture, and the
overmold material can include an attachment feature to attach a
component of the electronic device to the housing. The antenna can
be a cellular antenna. The substrate can amplify a signal
transmitted or received by the operational component, such as an
antenna. The ceramic fibers can include zirconia or alumina. The
matrix material can include a thermoset polymer, thermoplastic
polymer, or combinations thereof. The overmold material can include
a polymer. The weave pattern can be a fabric weave pattern. The
weave pattern can be a satin weave pattern.
[0006] Another aspect of the present disclosure relates to a
component of an electronic device including a substrate. The
substrate can include a ceramic material, an overmold material at
least partially surrounding the substrate, and an operational
component, such as an antenna, at least partially surrounded by the
overmold material.
[0007] In some embodiments, the ceramic material can include
ceramic fibers, and the substrate can include the ceramic fibers
embedded in a matrix material. The ceramic fibers can be arranged
in a weave pattern. The ceramic fibers can be substantially
randomly oriented throughout the substrate. The matrix material can
include a thermoset polymer, thermoplastic polymer, or combinations
thereof. The ceramic material can include zirconia or alumina. The
overmold material can include a polymer.
[0008] Another aspect of the present disclosure relates to a method
of forming a component of an electronic device, including
solidifying a matrix material at least partially around ceramic
fibers to form a substrate, cutting the substrate into a desired
shape, disposing an antenna or other operational component adjacent
to the substrate, and overmolding the substrate and the operational
component with a moldable material so that the moldable material at
least partially surrounds the substrate and the operational
component.
[0009] In some embodiments, cutting the substrate can include
laser-cutting the substrate to form an aperture therein. The
ceramic fibers can be arranged in a weave pattern. The ceramic
fibers can be substantially randomly oriented throughout the matrix
material.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The disclosure will be readily understood by the following
detailed description in conjunction with the accompanying drawings,
wherein like reference numerals designate like structural elements,
and in which:
[0011] FIG. 1 shows a perspective view of an electronic device.
[0012] FIG. 2 shows and exploded view of the electronic device of
FIG. 1.
[0013] FIG. 3 shows a sectional view of an electronic device.
[0014] FIG. 4A shows a perspective view of a component of an
electronic device.
[0015] FIG. 4B shows a top view of a component of the electronic
device of FIG. 4A.
[0016] FIG. 4C shows a bottom view of a component of the electronic
device of FIG. 4A.
[0017] FIG. 4D shows a side view of a component of the electronic
device of FIG. 4A.
[0018] FIG. 4E shows a side view of a component of the electronic
device of FIG. 4A.
[0019] FIG. 4F shows a front view of a component of the electronic
device of FIG. 4A.
[0020] FIG. 5A shows a top view of a component of an electronic
device.
[0021] FIG. 5B shows a perspective cut-away view of a component of
the electronic device of FIG. 5A.
[0022] FIG. 5C shows a sectional view of a component of the
electronic device of FIG. 5A.
[0023] FIG. 6A shows a top schematic view of a component of an
electronic device.
[0024] FIG. 6B shows a top schematic view of a component of an
electronic device.
[0025] FIG. 7A shows a top view of a component of an electronic
device.
[0026] FIG. 7B shows a perspective cut-away view of a component of
the electronic device of FIG. 7A.
[0027] FIG. 7C shows a sectional view of a component of the
electronic device of FIG. 7A.
[0028] FIG. 8A shows a top view of a component of an electronic
device.
[0029] FIG. 8B shows a perspective cut-away view of a component of
the electronic device of FIG. 8A.
[0030] FIG. 8C shows a sectional view of a component of the
electronic device of FIG. 8A.
[0031] FIG. 9A shows an exploded view of an electronic device.
[0032] FIG. 9B shows a sectional view of a component of the
electronic device of FIG. 9A.
[0033] FIG. 10A shows an exploded view of an electronic device.
[0034] FIG. 10B shows a sectional view of a component of the
electronic device of FIG. 10A.
[0035] FIG. 11 shows a process flow diagram of a process for
forming a component of an electronic device.
[0036] FIG. 12 shows a process flow diagram of a process for
forming a component of an electronic device.
[0037] FIG. 13 shows a process flow diagram of a process for
forming a component of an electronic device.
DETAILED DESCRIPTION
[0038] The present description provides examples, and is not
limiting of the scope, applicability, or configuration as set forth
in the claims. Thus, it will be understood that changes can be made
in the function and arrangement of elements discussed without
departing from the spirit and scope of the disclosure, and various
embodiments can omit, substitute, or add other procedures or
components as appropriate. For instance, methods described can be
performed in an order different from that described, and various
steps can be added, omitted, or combined. Also, features described
with respect to some embodiments can be combined in other
embodiments.
[0039] One aspect of the present disclosure relates to composite
components of electronic devices, such as, for example, all or a
portion of a housing of an electronic device. The composite housing
can include a substrate and an overmolded material at least
partially surrounding the substrate. In some examples, an
operational component, such as an antenna, can be integrated into
or at least partially surrounded by the overmolded material. The
antenna can transmit and/or receive wireless signals, for example,
via a cellular network, Wi-Fi network, Bluetooth, and other similar
wireless networks.
[0040] In some cases, the composite housing can allow wireless
signals to be transmitted or received with less interference,
attenuation, or shielding than if the housing were constructed
entirely of a single material, such as a ceramic or metal material.
In some cases, the composite housing, or a portion thereof, can
amplify a wireless signal transmitted or received by the antenna.
In some cases, the composite housing can have a high strength,
toughness, and durability relative to a housing formed of a single
material, such as a polymer. Further, the overmold material can
provide a pleasing aesthetic appearance to the housing.
[0041] The substrate of the composite housing can include a ceramic
material at least partially embedded in a matrix material. In some
cases, the ceramic material can include ceramic fibers that can be
arranged in a pattern, such as a weave pattern. A matrix material,
such as a resin or epoxy, can partially, substantially, or entirely
surround the ceramic fibers such that the ceramic fiber weave can
be embedded in the matrix material. In some cases, the ceramic
fibers can serve to amplify or reduce interference, attenuation, or
shielding of wireless signals received or transmitted by the
antenna.
[0042] A moldable material can be overmolded to at least partially
surround the substrate. The overmold material can include any
moldable material, such as a polymeric material. For example, the
overmold material can include a polyamide material. Further, in
some cases, the overmold material can include glass fibers embedded
therein. The overmold material can be formed around the substrate
such that the substrate and the overmold material form a single
component. The overmold material can coat substantially an entire
surface of the substrate defining an exterior portion of the
housing, such that the overmold material forms an exterior portion
of the housing.
[0043] The overmold material can have a higher durability and
resistance to chemical attack than the substrate or a material
forming the substrate. As such, the overmold material can provide
for a housing with high durability and toughness, while the
substrate can provide for a housing that has a very high strength.
In this way, the substrate and the overmold material can cooperate
to provide a housing with any number of desirable properties.
Further, because the housing is not formed from a single material,
such as a ceramic, the material and the processing costs of the
housing can be greatly reduced relative to an entirely ceramic
housing.
[0044] The materials and structures of the components, substrates,
overmold materials, and antennas discussed herein can include any
desired design or shape to serve any number of functions, or to
provide any number of specifically tailored properties. The
following discussion of composite components illustrates a variety
of different embodiments and designs for use in electronic devices.
Further, the materials, structures, and features discussed herein
can be combined in any number or manner.
[0045] In some examples, the substrate can be designed to enhance a
number of mechanical or other characteristics of a component, such
as a housing. For example, the substrate can have a design that
includes one or more ceramic structures that span the substrate in
one or more directions. Such a structure can include a
substantially solid ceramic component or ceramic fibers. In some
cases, the ceramic fibers can be substantially randomly positioned
throughout the substrate. In some other examples, however, the
ceramic fibers can be arranged in a pattern, such as a weave. These
ceramic structures can enhance the resistance of the component to
bending or flexure, thereby providing a component that is much
stronger and stiffer than, for example, a polymer housing. The
ceramic material can include zirconia, alumina, or combinations
thereof.
[0046] In some examples, the ceramic material is at least partially
embedded in a matrix material. Thus, in some cases, the substrate
can be a ceramic composite material. The matrix material can be a
moldable or curable material, such as an epoxy or a resin. In some
cases, the matrix material can include metallic material, amorphous
materials such as glass, polymeric materials, or other compatible
materials. The substrate can have a substantially uniform
thickness, or in some cases, can vary in thickness along one or
more dimensions. In some examples, the substrate can be from about
0.25 mm thick to about 1 mm thick, or even thicker. In some
examples, the substrate can be about 0.5 mm thick.
[0047] The substrate can have any desired shape or design and, in
some cases, can partially define an internal volume of an
electronic device. In some examples, the substrate can include one
or more apertures to allow one or more components of the electronic
device to have visual or physical access to the environment
exterior to the device. In some cases, a material, such as a
visually transparent material, can have a peripheral shape
corresponding to a shape of an aperture in the substrate and can be
positioned therein. In some cases, the aperture and the transparent
material can cooperate to allow for a component, such as a sensor,
to detect one or more properties of the environment exterior to the
electronic device. The transparent material can be a visually
transparent material, such as sapphire or a transparent
polymer.
[0048] The overmold material that, in some examples, can at least
partially surround the substrate, can include any moldable material
or combinations thereof. In some examples, the overmold material
can be a metallic material, an amorphous material, or a polymeric
material such as a polyamide. Further, in some cases, one or more
additional materials can be included in the overmold material. For
example, the overmold material can be a polyamide with glass fibers
embedded therein.
[0049] In some cases, the overmold material can form or be an
exterior surface of the component. Further, in some examples where
the composite component is a housing of an electronic device, the
overmold material can form or be an exterior surface of the
electronic device. In some cases, the overmold material can have a
thickness of from about 0.1 mm to about 0.5 mm, or from about 0.25
mm to about 0.45 mm.
[0050] An operational component, such as an antenna, can be
integrated into or at least partially surrounded by the overmold
material of the composite component. In some examples, the antenna
can be substantially or entirely surrounded by the overmold
material. In one example, one or more portions of the antenna
configured to connect to or communicate with other components of
the electronic device may protrude from or otherwise be exposed
from the overmold material.
[0051] The antenna can include, or be formed from, a metal. In some
cases, the antenna can include a substantially flat sheet of metal.
In some other cases, however, the antenna can include any desired
shape to receive and/or transmit wireless signals, such as signals
of one or more desired frequencies. In some examples, the antenna
can receive and/or transmit wireless signals at one or more
frequencies, and can be, for example, one or more of a cellular
antenna such as an LTE antenna, a Wi-Fi antenna, a Bluetooth
antenna, a GPS antenna, a multi-frequency antenna, or another
suitable antenna. The antenna can be communicatively coupled to one
or more additional components of the electronic device. Further, in
some cases, the ceramic material of the substrate can allow the
antenna to transmit and/or receive wireless signals with less
interference, attenuation, or shielding, than if the housing were
constructed entirely of, for example, a metal material. In some
cases, the substrate may amplify or otherwise enhance, for example,
by reducing noise or increasing the amplification of, wireless
signals received and/or transmitted by the antenna.
[0052] In some cases, the antenna can be integrated or otherwise
incorporated into the overmold material during a forming process of
the overmold material. For example, in some cases the antenna can
be positioned relative to the substrate and the overmold material
can be formed or solidified around the antenna and the substrate in
a single step. In some other cases, a portion of the overmold
material can be formed at least partially surrounding the substrate
in a first stage, then the antenna can be positioned relative to
the first portion of the overmold material while a second portion
of the overmold material is formed in a second stage, resulting in
the antenna being substantially or entirely surrounded by the
overmold material.
[0053] Methods and processes for forming composite components are
also provided herein. For example, a method of forming a composite
component can include overmolding a substrate including a ceramic
material and an operational component, such as an antenna, with a
moldable material so that the moldable material at least partially
surrounds the substrate and the operational component. In some
cases, the method can further include forming the substrate
including a ceramic material by solidifying a matrix material at
least partially around ceramic fibers. The methods can further
include cutting or otherwise shaping the substrate into a desired
shape. For example, the substrate can be machined, etched, cut with
a laser, or otherwise processed to achieve a desired shape.
[0054] Although one or more of these components and/or processes
can be described in the context of handheld devices, such as mobile
phones, laptops, and notebooks, the embodiments disclosed herein
should not be interpreted or otherwise used as limiting the scope
of the disclosure, including the claims. In addition, the following
description has broad application. Accordingly, the discussion of
any embodiment is meant only to be exemplary and is not intended to
suggest that the scope of the disclosure, including the claims, is
limited to these embodiments.
[0055] These and other embodiments are discussed below with
reference to FIGS. 1-14. However, the detailed description given
herein with respect to these Figures is for explanatory purposes
only and should not be construed as limiting.
[0056] FIG. 1 shows an embodiment of an electronic device 100. The
electronic device shown in FIG. 1 is a watch, such as a smartwatch.
The smartwatch of FIG. 1 is merely one representative example of a
device that can be used in conjunction with the systems and methods
disclosed herein. Electronic device 100 can correspond to any form
of wearable electronic device, a portable media player, a media
storage device, a portable digital assistant ("PDA"), a tablet
computer, a computer, a mobile communication device, a GPS unit, a
remote control device, or other electronic device. The electronic
device 100 can be referred to as an electronic device, or a
consumer device. Further details of the electronic device are
provided below with reference to FIG. 2.
[0057] Referring now to FIG. 2, the electronic device 100 can
include a housing 101 and a cover 103 attached to the housing 101.
The housing 101 can substantially define at least a portion of an
exterior surface of the device 100. The cover 103 can include
glass, plastic, or any other substantially transparent material,
component, or assembly. The cover 103 can cover or otherwise
overlay a display, a camera, a touch sensitive surface such as a
touchscreen, or other component of the device 100. The cover 103
can define a front exterior surface of the device 100. Together,
the housing 101 and the cover 103 can substantially define the
exterior surface of the device 100.
[0058] In some examples, the housing 101 can include a component
110 that defines at least an exterior surface of the device 100.
The component 110 can be referred to as a back case or a back
cover, and in some cases, can be attached to one or more other
components, such as frame 120, to form the housing 101. The
component 110 can be attached to the frame 120 by any method known
in the art or developed in the future, such as adhesive bonding,
brazing, welding, overmolding, interference fitting, or other
securing methods. In some cases, however, the component 110 can
form or be the entire housing 101 of the electronic device 100. The
component 110 can be a composite component, and can include a
substrate having a ceramic material, an overmold material at least
partially surrounding the substrate and forming an exterior surface
of the component 110, and an operational component, such as an
antenna, integrated or embedded into the overmold material.
[0059] The component 110 can include one or more apertures or
through holes. A transparent material 111 can be disposed in the
one or more apertures. In some cases, the transparent material 111
can be visually transparent and can include a ceramic material such
as sapphire, or a polymer material such as a polyamide. The
transparent material 111 can provide visual access to an exterior
environment for one or more components of the device 100, as
described with respect to FIG. 3.
[0060] The housing 101 can include one or more features to receive
or couple to other components of the device 100. For example, the
frame 120 can include features, such as an indentation 113 to
receive strap 102, and an aperture 112 to receive a button 114. The
component 110 can include any number of features such as apertures,
cavities, indentations, and other mating features to receive and/or
attach to one or more other components of the device 100.
[0061] Additionally or alternatively, other components of the
electronic device 100, such as individual internal structural
components or exterior input components, can be formed from or can
include a substrate including a ceramic material and an overmold
material at least partially surrounding the substrate and forming
an exterior surface thereof. For example, in some cases, the device
100 can include input components, such as one or more buttons 114
and/or a crown 115, that can be formed from a composite component,
as described herein. The composite component can provide strong and
durable, yet relatively inexpensive, input components 114, 115.
Further, the overmold material can result in input components 114,
115 that can have an aesthetically pleasing look and feel for the
user.
[0062] The device 100 of FIGS. 1 and 2 is merely one example of an
electronic device 100 that can include a composite component, such
as the housing 101. Alternatively, the device 100 can include other
components including or formed from composite components. For
example, the device 100 can include components such as a stiffener,
a frame, or other components that are formed from or can include a
substrate that includes a ceramic material and an overmold
material, at least partially surrounding the substrate, as
described herein. Additional electronic devices and designs
thereof, including one or more composite components as discussed
herein, are expressly contemplated. Further details of example
components are provided below with reference to FIG. 3.
[0063] FIG. 3 shows a sectional view of electronic device 100,
including internal components such as processors, memory, circuit
boards, batteries, and sensors. Such components can be disposed
within an internal volume defined at least partially by the housing
101, and can be affixed to the housing 101, via internal surfaces,
attachment features, threaded connectors, studs, posts, and/or
other fixing features, that are formed into, defined by, or
otherwise part of the housing 101.
[0064] The device 100 can include internal components, such as a
system in package (SiP) 141, including one or more integrated
circuits such as a processors, sensors, and memory. The device 100
can also include a wireless charging coil 142. The wireless
charging coil 142 can be coupled to a battery (not shown) housed in
the internal volume of the device 100. The device 100 can also
include one or more sensors 144, such as optical or other sensors,
that can sense or otherwise detect information regarding the
environment exterior to the housing 101. Additional components,
such as a haptic engine 145, can also be included in the device
100. Other components, such as a battery, a display, and a speaker
(all not shown) can be included or housed within the internal
volume of the device 100.
[0065] As can be seen in FIG. 3, the housing 101 can include a back
case or a back cover 110 and a frame 120. In some cases, the back
cover 110 can be joined to the frame 120, and a gasket or seal 143
can be positioned between the back cover 110 and frame 120 to
provide for a housing 101 that is substantially impervious to water
and/or gases. The frame 120 can include one or more of a variety of
materials. For example, the frame 120 can be formed from a metallic
material, a ceramic material, an amorphous material such as glass,
a polymeric material, and combinations thereof. In some examples,
however, the entire housing 101 can be formed from or can be a
composite component.
[0066] The back cover 110 can include a substrate 132 including a
ceramic material. The substrate 132 can be, for example, ceramic
fibers embedded in or at least partially surrounded by a matrix
material. In some examples, the ceramic fibers can be substantially
randomly positioned throughout the matrix material, while in some
other examples the ceramic fibers can be arranged in a pattern such
as a weave. In some cases, the substrate 132 can be a substantially
unitary ceramic article and may not include a matrix material. The
back cover 110 further includes an overmold material 131 at least
partially surrounding the substrate 132 and forming at least a
portion of an exterior surface of the back cover 110. In this
example, the overmold material 131 forms a portion of the exterior
surface of the device 100. In some cases where the overmold
material 131 can include a polymer material, such as a polyamide
material including glass fibers, the overmold material 131 can
provide a pleasing look and feel to the exterior of the device 100,
in addition to providing durability, resistance to environmental
degradation, and other tangible benefits.
[0067] An operational component, such as an antenna 133, can be
embedded in the overmold material 131 and can be communicatively
coupled to one or more of the internal components of the device
100. The antenna 133 is illustrated as a metal sheet, although
other forms of antennas are expressly contemplated. Further, in
some cases, the back cover 110 can include two or more antennas
embedded or at least partially surrounded by the overmold material
131. Additionally, although the antenna 133 is illustrated as being
positioned along an edge of the back cover 110, the antenna 133 can
be disposed at any location in the overmold material 131 of the
back cover 110.
[0068] All or a portion of one or more internal components, for
example, the SiP 141, can be formed from or include a composite
component. In some embodiments, the composite component can allow
for one or more of such internal components to be light, durable,
strong, and inexpensive, as discussed herein. Further, the design
of such components can allow for component architectures that may
not have previously been able to be achieved.
[0069] The internal components, such as one or more of components
141, 142, 144, and 145, can be disposed within an internal volume
defined, at least partially, by the housing 101. These components
141, 142, 144, and 145 can be affixed to the housing 101 via
internal surfaces, attachment features, threaded connectors, studs,
posts, and/or other fixing features, that are formed into, defined
by, or otherwise part of the housing 101 and/or the cover 103.
[0070] The housing 101, including the back cover 110 formed from a
composite component, can be conformable to interior dimensional
requirements, as defined by the internal components, such as
components 141, 142, 144, and 145. For example, the structure of
the housing 101 including a composite back cover 110 can be defined
or limited exclusively or primarily by the internal components the
housing is designed to accommodate. That is, because a housing 101
including a composite back cover 110 can be extremely light and
strong, the housing 101 can be shaped to house the interior
components in a dimensionally efficient manner without being
constrained by factors other than the dimensions of the components,
such as the need for additional structural elements.
[0071] The composite component 110 of the housing 101 can also be
formed by a variety of processes, as discussed herein. In some
embodiments, these formation processes can allow for the housing
101 to have a detailed shape or design that is tailored
specifically to satisfy one or more needs, such as internal
dimensional requirements, without the need for additional features
to reinforce the structure of the housing. Additionally, artifacts
of the manufacturing process of the housing can be eliminated.
[0072] Any number or variety of components of an electronic device,
for example, electronic device 100, can be formed from or can
include a composite component. The structure of these composite
components can be, for example, a substrate including a ceramic
material and an overmold material at least partially surrounding
the substrate. The structure and materials of the substrate and
overmold material, and of the composite component itself, can apply
not only to the specific examples discussed herein, but to any
number or variety of embodiments. Various embodiments of composite
components are described below, with specific reference to FIG.
4A.
[0073] FIG. 4A shows a perspective view of an example composite
component 210 that can be, for example, part of a housing of an
electronic device. In some cases, the composite component 210 can
be a back cover of a housing for an electronic device. In some
examples, the composite component 310 can be the entire housing of
an electronic device.
[0074] The composite component 210 can include a substrate 232,
including a ceramic material, and an overmold material 231 at least
partially surrounding the substrate 232. In some examples, the
overmold material 231 can form an exterior surface of the component
210. The component 210 can also include an antenna, or other
electronic or operational component, integrated or embedded into
the overmold material 231.
[0075] The substrate 232 can include a ceramic material. In some
cases, the ceramic material can include, for example, ceramic
fibers. The ceramic fibers can be embedded in or be at least
partially surrounded by a matrix material to form the substrate
232, as described herein. In some instances, the ceramic fibers can
be substantially randomly positioned throughout the matrix
material. In other examples, the ceramic fibers can be arranged in
a pattern, such as a weave. In some other examples, however, the
ceramic material can include any shape or form of ceramic material.
For example, the ceramic material can include ceramic particles,
pellets, spheres, rods, tubes, fibers, or another form, in any
amount or combination, embedded or at least partially surrounded by
a matrix material to form the substrate 232. Additionally, the
substrate 232 can include ceramic material and may not include a
matrix material. For example, the substrate 232 can be a
substantially unitary ceramic body having the shape and design of
the substrate 232.
[0076] The ceramic material of the substrate 232 can include
zirconia, alumina, or combinations thereof. Although, in some
cases, the ceramic material of the substrate 232 can include any
ceramic material known in the art or discovered in the future.
[0077] The substrate 232 can include one or more apertures 234
formed therein. For example, where the component 210 can be the
back cover of an electronic device, the aperture or apertures 234
can allow one or more internal components of the electronic device
to have visual or physical access to the environment exterior to
the device. Thus, in some cases, the apertures 234 can be
positioned, sized, and/or arranged to correspond to one or more
internal components of an electronic device. In some cases,
however, the apertures 234 can have alternative or additional
purposes. For example, in some cases, the apertures 234 can serve
to reduce the weight or amount of material included in the
component 210.
[0078] The aperture or apertures 234 can be formed in the substrate
at any point during the formation or manufacturing of the component
210. For example, the apertures 234 can be formed during the
initial forming process of the substrate 232, such as an initial
molding process. Alternatively, the apertures can be formed by a
cutting process, such as a laser cutting process, that occurs at
other stages during formation of the component 210.
[0079] The apertures 234 can have a material 211 disposed therein.
In some examples, the material 211 disposed in the apertures 234
can have a peripheral shape corresponding to the shape of the
apertures in which it is disposed. The material 211 can be a
transparent material, such as an optically or visually transparent
material. In some examples, the material 211 can be transparent to
a desired wavelength of light. The transparent material 211 can
serve to allow one or more internal components of an electronic
device to have visual access to the environment exterior to the
device, while still providing environmental protection to the
internal components. In some cases, the transparent material 211
can be a polymeric material, a ceramic material, an amorphous
material such as glass, or combinations thereof. For example, the
transparent material 211 can be sapphire or a polyamide
material.
[0080] An overmold material 231 can at least partially surround the
substrate 232. The overmold material 231 can be any moldable
material that is capable of being overmolded at least partially
around the substrate 232. In some examples, the overmold material
231 can be a metallic material, an amorphous material such as
glass, a polymeric material, or other appropriate material. In some
cases, the overmold material 231 can be a polymer material, such as
a polyamide material, although any polymeric material can be used.
Further, one or more additional materials can be included in the
moldable material of the overmold material 231. The overmold
material 231 can be a polymeric material and can include additional
materials disposed therein, such as glass or ceramic material. For
example, the overmold material 231 can be a polyamide material and
can include glass or ceramic fibers at least partially embedded
therein.
[0081] As can be seen in FIGS. 4B and 4C, the overmold material 231
can surround and cover one or more exterior surfaces of the
substrate 232, while one or more other exterior surfaces of the
substrate 232 can be free of overmold material 231. For example,
where the component 210 is a part of a housing of an electronic
device, the overmold material 231 can cover a surface of the
substrate 232 defining an exterior surface of the housing, while a
surface of the substrate 232 defining an interior volume of the
electronic device can be free of the overmold material 231.
Alternatively, the overmold material 231 can completely or
substantially surround the substrate 232. Thus, in some examples,
an electronic device including the component 210 can have an
exterior surface defined by the overmold material 231. Further, one
or more electronic or operational components, such as an antenna,
can be integrated into and/or at least partially surrounded by the
overmold material 231.
[0082] While the overmold material 231 is depicted as a
substantially unitary article in FIGS. 4A-F, the overmold material
231 can include one or more discrete or non-contiguous portions
overmolded onto the substrate 232. Thus, in some examples, the
overmold material 231 can define a portion of an external surface
of a device including the component 210, while the substrate 231
may define a second, different portion of an external surface of
the device. Similarly, a surface of the component 210 defining an
internal volume or surface of an electronic device can be defined
by one or more portions of the overmold material 231 and one or
more different portions of the substrate.
[0083] In some examples where the overmold material 231 defines an
exterior surface of a device including the component 210, the
overmold material 231 can provide a pleasing look and/or feel to
the surface of the device. The overmold material 231 can also serve
to enhance the durability or toughness of the component 210. For
example, the overmold material 231 can serve to absorb shocks and
impacts during use to prevent or reduce cracking or chipping of the
substrate 232.
[0084] The overmold material 231 can have any desired shape or
design. For example, as illustrated in FIGS. 4A-4F, the overmold
material 231 can at least partially surround the substrate 232 at a
fixed or variable thickness and can additionally include one or
more features, structures, protrusions, or elements. For example,
the overmold material 231 can include one or more attachment
features 236. The attachment features 236 can be, for example,
positioned around a periphery of the substrate 232 and can secure
the component 210 to one or more other components of an electronic
device. The attachment features 236 can be designed or shaped to
receive and engage a fixing member, such as a screw. For example,
the engagement features 236 can include threads corresponding to
threads of a screw. In some examples, the attachment features 236
can include a cavity, such as a cavity capable of receiving and
retaining a fastener, like a nut that can receive a bolt. Other
forms of attachment features 236 are expressly contemplated.
[0085] The ability to include an attachment feature 236 in the
overmold material 231 of the component 210 can provide for
significantly reduced processing costs and times for attaching the
component 210, relative to a similarly structured component formed
entirely of a ceramic material. In order to form attachment
features in a component formed entirely of a ceramic material,
extensive and delicate processing may be utilized to prevent
defects. Accordingly, by forming attachment features 236 in the
moldable and relatively easier to process or machine overmold
material 231, the component 210 can have significantly reduced
material and processing costs. Meanwhile, the substrate 232
including the ceramic material can still provide for a strong and
rigid component 210 compared to a similar component formed entirely
of the overmold material 231.
[0086] The overmold material 231 can additionally include one or
more other desired structures or features. For example, the
overmold material 231 can include an aperture 214. In some
instances, the aperture 214 can be positioned in a protrusion or
other portion of the overmold material 231 such that the apertures
do not expose the substrate 232. Alternatively, a feature of the
overmold material 231, such as an aperture, can expose or reveal an
underlying portion of the substrate 232.
[0087] Further, in instances where the substrate 232 can include
one or more apertures 234, the overmold material 231 can also
include apertures corresponding in size, shape, and position to the
apertures 234 in the substrate 232. In some examples, the apertures
234 of the substrate and the corresponding apertures of the
overmold material 231 can be formed substantially simultaneously.
In some other examples, however, the apertures 234 of the substrate
232 can be formed initially and the corresponding apertures of the
overmold material 231 can be formed in a subsequent step.
[0088] The overmold material 231 can be formed at least partially
around the substrate 232 by any number of additive manufacturing or
molding processes. For example, the overmold material 231 can be
formed by an injection molding process using a mold that contains
the substrate 232. Alternatively, the overmold material 231 can be
formed by an additive process, such as a 3D printing process. For
example, an overmold material 231 can be 3D printed at least
partially around the substrate 232. Processes such as 3D printing
can allow for the formation of an overmold material 231 that can
have a shape or include features that are not formable by other
molding or manufacturing processes.
[0089] The overmold material 231 can be secured or adhered to the
substrate 232 by the mechanical engagement between the overmold
material 231 and the substrate 232. For example, in some examples,
one or more features of the substrate 232 can mechanically engage
with one or more corresponding features of the overmold material
231, to retain the overmold material 231 and the substrate 232
together. In some examples, an adhesive is not used to fasten or
retain the overmold material 231 and the substrate 232 together. In
other examples, and adhesive or other material can be included
between the overmold material 231 and the substrate 232.
Additionally, one or more surfaces of the substrate 232 can be
prepared or subjected to a treatment prior to overmolding in order
to retain the overmold material 231. For example, in some cases, a
surface of the substrate 232 can be subjected to an etching or
blasting process that can create microstructures for the overmold
material 231 to mechanically engage with.
[0090] The construction of the component 210, including a substrate
232 with a ceramic material and an overmold material 231 at least
partially surrounding the substrate, can provide for a component
210 that has a high level of strength and rigidity relative to a
similar component made substantially or entirely from the overmold
material. The enhanced strength provided by the substrate 232 can
allow the component 210 to be substantially smaller and lighter
than a component made entirely of a polymeric material that has a
similar or reduced strength. Further, the relatively low amount of
ceramic material included in the component 210 relative to a
component made entirely of ceramic material can result in
significantly decreased costs and processing time, while
maintaining a similar or only slightly reduced level of strength
and rigidity. The overmold material 231 can also serve to protect
the substrate 232 from chipping and environmental degradation
during use. As noted above, the substrate 232 and the overmold
material 231 can be combined in any number of configurations, as
described below with reference to FIGS. 5A-8C.
[0091] FIG. 5A shows a top view of an example composite component
310 that can be part of a housing of an electronic device, as
described herein. As shown in FIG. 5A, the composite component
includes a ceramic composite substrate 332 with an overmold
material 331 substantially covering the exterior portion of the
ceramic composite substrate. In some cases, the composite component
310 can be a housing or a back cover of a housing for an electronic
device. In some examples, the composite component 310 can be the
entire housing of an electronic device. The composite component 310
can be substantially similar to, and can include some or all of the
features of other composite components described herein, such as,
composite component 210 described with respect to FIGS. 4A-5F.
[0092] FIG. 5B shows a perspective cut-away view of the composite
component 310, while FIG. 5C shows a sectional view of the
component 310. As can be seen from the figures, the component 310
can include a substrate 332 including a ceramic material, and an
overmold material 331 at least partially surrounding the substrate
332. In some cases, the overmold material 331 can form an exterior
surface of the component 310. The component 310 can also include an
antenna 333 or other electronic or operational component integrated
or embedded into the overmold material 331.
[0093] As can be seen in FIG. 5C, the overmold material 332 can
substantially or entirely cover a lower surface of the substrate
332, and any side surfaces of the substrate 332. The overmold
material 332 can also at least partially cover a top surface of the
substrate 332. In some examples, such an arrangement of the
overmold material 331 can serve to retain the overmold material 331
around the substrate 332. The component 310 can also include one or
more apertures 334 including a transparent material 311 disposed
therein.
[0094] In some cases, the overmold material 331 covering the
substrate 332 can have a substantially uniform thickness. In other
embodiments, the thickness of the overmold material 331 can vary
along the substrate 332. The overmold material 331 can be from
about 0.25 mm thick to about 1 mm thick, or thicker. In some
examples, the overmold material 331 can have an average thickness
of about 0.5 mm, excluding any features or protrusions of the
overmold material 331. Structures or features of the overmold
material 331, for example, protrusions or attachment features, can
have a thickness of up to several millimeters or even a centimeter
or more.
[0095] The substrate 332 can include a ceramic material. The
ceramic material can include, for example, ceramic fibers. The
ceramic fibers can be embedded in, or at least partially surrounded
by, a matrix material to form the substrate 332, as described
herein. In some cases, the ceramic fibers can be arranged in a
pattern, such as a weave, with one or more fibers arranged in
specific orientations. In some examples, one or more ceramic fibers
can extend substantially an entire major dimension of the substrate
332, such as, one or more of a height, width, or length of the
substrate. In some cases where the fibers are arranged in a
pattern, the pattern can be a plain weave, a twill weave, a satin
weave, a jacquard weave, a unidirectional pattern, a tri-axial
pattern, or any other known fiber pattern.
[0096] In some cases, ceramic fibers can be randomly distributed or
positioned throughout the matrix material, while in other cases,
the ceramic fibers can be arranged in a pattern, such as a weave.
In some examples, however, the ceramic material can include any
shape or form of ceramic material. For example, the ceramic
material can include ceramic particles, pellets, spheres, rods,
tubes, fibers, or other geometries, in any amount or combination,
embedded or at least partially surrounded by a matrix material to
form the substrate 332. Additionally, in some cases, the substrate
332 can include ceramic material and may not include a matrix
material. For example, the substrate 332 can be a substantially
unitary ceramic body having the shape and design of the substrate
332.
[0097] Further, as shown in FIGS. 5B and 5C, the component 310 can
include an operational component, such as an antenna 333, at least
partially surrounded by the overmold material 331. In some cases,
the antenna 333 can be positioned substantially adjacent to the
substrate 332, although in other cases, the antenna 333 can be
positioned at any location at least partially within the overmold
material 331. One or more portions of the antenna 333 can be
configured to connect to, or communicate with, other components of
an electronic device.
[0098] The antenna 333 can include or be formed from a metal
material. For example, the antenna 333 can include copper, nickel,
aluminum, other conducting materials, and combinations thereof. In
some cases, however, the antenna 333 can include any desired
material, as long as it can molded with or covered by the overmold
material 331. In some examples, the antenna 333 can include a
substantially flat sheet of metal. In other examples, the antenna
333 can include any desired shape to receive and/or transmit
wireless signals of one or more desired frequencies. In some
examples, the antenna 333 can receive and/or transmit wireless
signals at one or more frequencies and can be one or more cellular
antenna such as an LTE antenna, a Wi-Fi antenna, a Bluetooth
antenna, a GPS antenna, a multi-frequency antenna, or other
wireless antenna. The antenna 333 can be communicatively coupled to
one or more additional components of an electronic device. Further,
in some cases, the ceramic material of the substrate 332 can allow
the antenna 333 to transmit and/or receive wireless signals with
less interference, attenuation, or shielding than if the antenna
333 was included in a component made entirely of a metal or other
housing material. In some cases, the substrate 332 may amplify or
otherwise enhance wireless signals received and/or transmitted by
the antenna, for example, by reducing noise or increasing the
amplification of the signals.
[0099] In some cases, the antenna 333 can be integrated or
otherwise incorporated into the overmold material 331 during a
forming process of the overmold material 331. For example, in some
cases, the antenna 333 can be positioned relative to the substrate
332, such as in a mold, and the overmold material 331 can be formed
or solidified around the antenna 333 in a single step. In other
examples, a portion of the overmold material 331 can first be
formed at least partially surrounding the substrate 332, followed
by the antenna 333 being disposed relative to the first portion of
the overmold material 331. A second portion of the overmold
material 331 can then be formed in a second stage, to substantially
or entirely surround the antenna 333 with the overmold material
331. Additional details of alternative component configurations are
provided with reference to FIGS. 6A-6B.
[0100] FIGS. 6A and 6B show a top schematic view of a composite
component 410, according to one example. The component 410 can be,
for example, part of a housing of an electronic device. In some
examples, the composite component 410 can be a housing or a back
cover of a housing for an electronic device. In some examples, the
composite component 410 can be the entire housing of an electronic
device. The composite component 410 can be substantially similar to
and can include some or all of the features of other composite
components described herein, such as, composite component 210 and
310 described with respect to FIGS. 4A-5F and 5A-5C.
[0101] FIG. 6A illustrates one possible arrangement of ceramic
fibers 401, 402, that can be at least partially surrounded by a
matrix material to form a substrate 432 of a component 410. As
illustrated, in some cases, during or prior to the formation of the
substrate 432 the ceramic fibers 401, 402 arranged in a weave can
extend past the boundaries of the substrate 432. In some cases, the
fibers 401, 402 can be at least partially surrounded by a matrix
material and then cut or sized, as desired. In some cases, the
fibers 401, 402 of the pattern or weave can be substantially
entirely surrounded by a matrix material and any fibers 401, 402
and/or matrix material extending or disposed outside a desired
shape of the substrate 432 can be cut or otherwise removed from the
substrate 432.
[0102] In some cases, for example as depicted in FIG. 6B, the
fibers 401, 402 can be cut or otherwise sized prior to at least
partially surrounding with a matrix material, so that a weave or
pattern of the fibers 401, 402 has substantially a same peripheral
shape as the peripheral shape of the substrate 432. Thus, in some
other examples, the fibers 401, 402 can be cut, sized, or arranged,
as desired, prior to being partially surrounded by the matrix
material. The ceramic fibers 401, 402 can include any ceramic
material, such as zirconia, alumina, or combinations thereof.
Further, in some cases, the fibers 401, 402 can be cut or otherwise
formed to include one or more features of the substrate 432, such
as one or more apertures. For example, as illustrated in FIG. 6B,
the fibers 401, 402 of the pattern or weave can be cut to remove
those portions of the fibers 401, 402 that would otherwise overlay
or occlude an aperture formed in the substrate 432.
[0103] The ceramic material of the substrate 432 can include a
first set of fibers 401 arranged in a first direction and a second
set of fibers 402 arranged in a second direction. In some examples,
the first and second directions can be substantially perpendicular
to one another, although other arrangements are expressly
contemplated to vary the relative strength of the substrate in
specific directions and orientations. In some examples, the one or
more ceramic fibers 401, 402 can extend substantially across an
entire major dimension of the substrate 432, such as, one or more
of a height, width, or length of the substrate.
[0104] The fibers 401, 402 can be arranged in the substrate 432
according to a pattern, such as a weave. The fibers 401, 402 of
FIGS. 6A and 6B are shown as arranged in a twill weave pattern,
although any other desired pattern can be used. For example, in
some cases, the pattern can be a plain weave, a twill weave, a
satin weave, a jacquard weave, a unidirectional pattern, a
tri-axial pattern, or any other pattern. In some cases, the matrix
material at least partially surrounds the fibers 401, 402 and can
be a moldable or curable material, such as an epoxy or resin. In
some examples, the matrix material can be any thermoset polymer,
thermoplastic polymer, or combinations thereof. The matrix material
can include metallic material, amorphous materials such as glass,
polymeric materials, and/or combinations thereof. The matrix
material can also be substantially transparent to electromagnetic
signals. The design flexibility provided by the use of ceramic
fibers can allow for a composite component made entirely of the
composite material, without or substantially free of overmold
material, as detailed below with reference to FIGS. 7A-7C.
[0105] FIG. 7A shows a top view of an example composite component
510 that can be, for example, part of a housing of an electronic
device. As shown in FIGS. 7A-7C, the example composite component
510 is entirely formed of a ceramic composite substrate 532
without, or substantially free of, overmold material. In some
examples, the composite component 510 can be a back cover of a
housing for an electronic device. Alternatively, the composite
component 510 can be the entire housing of an electronic
device.
[0106] As seen in FIGS. 7B and 7C, the component 510 can be a
substantially contiguous and/or unitary body that can include a
ceramic material 437. That is, in some cases, the substrate 532 can
have a same shape as the component 510, and can be free of any
overmold material. Thus, in some examples, the component 510 can
include a ceramic material 437 at least partially embedded in a
matrix material. In some examples, and as illustrated in FIGS.
7A-7C, the ceramic material 437 can include ceramic fibers. The
ceramic fibers 437 can be randomly positioned and/or oriented
throughout the matrix material. The component 510 can also include
one or more apertures 534, including a transparent material 511
disposed therein.
[0107] Further, as shown in FIGS. 7B and 7C, the component 510 can
include an operational component, such as an antenna 533, at least
partially surrounded by the matrix material of the substrate 532.
In other examples, the antenna 533 can be positioned at any
location at least partially within the substrate 532. For example,
where the antenna 533 is substantially or entirely surrounded by
the substrate 532, one or more portions of the antenna 533
configured to connect to or communicate with other components of an
electronic device can be protruding from or be otherwise free of
the substrate 532.
[0108] The antenna 533 can include or be formed from a metal
material. For example, the antenna 533 can include copper, nickel,
aluminum, similar conductive metals, and combinations thereof. In
some cases, however, the antenna 533 can include any desired
material, as long as it can be formed with the substrate 532. In
some examples, the antenna 533 can include a substantially flat
sheet of metal. Although, in some other cases, the antenna 533 can
assume any desired shape configured to receive and/or transmit
wireless signals of one or more desired frequencies. In some cases,
the antenna 533 can receive and/or transmit wireless signals at one
or more frequencies and can be, for example, one or more of a
cellular antenna such as an LTE antenna, a Wi-Fi antenna, a
Bluetooth antenna, a GPS antenna, a multi-frequency antenna, or any
other wireless signal antenna. The antenna 533 can be
communicatively coupled to one or more additional components of an
electronic device. Further, in some cases, the ceramic material 537
of the substrate 532 can allow the antenna 533 to transmit and/or
receive wireless signals with less interference, attenuation, or
shielding, than if the antenna 533 was included in a component made
entirely of a metal or other housing material. In some cases, the
substrate 532 may amplify or otherwise enhance wireless signals
received and/or transmitted by the antenna, for example, by
reducing noise or increasing the amplification of the signals.
Additional configurations, including a composite component with a
partially exposed ceramic composite and a partially overmolded
portion, are detailed below with reference to FIGS. 8A-8C.
[0109] FIG. 8A shows a top view of an example composite component
610 that can be, for example, a housing or part of a housing of an
electronic device. As shown in FIGS. 8A-8C, the example composite
component can have a substrate 632 including a ceramic composite
and an overmold material 631 that partially covers or surrounds the
substrate. In some cases, the composite component 610 can be a back
cover of a housing for an electronic device. In some examples, the
composite component 610 can be the entire housing of an electronic
device. The composite component 610 can be substantially similar
to, and can include some or all of the features of other composite
components described herein.
[0110] FIG. 8B shows a sectional view of the composite component
610 and FIG. 8C illustrates a close-up sectional view of the
component 610. As can be seen from the figures, the component 610
can include a substrate 632 including a ceramic material and an
overmold material 631 at least partially surrounding the substrate
632. In some cases, the overmold material 631 can form an exterior
surface of the component 610. The component 610 can also include an
antenna 633 or other electronic component integrated or embedded
into the overmold material 631.
[0111] The substrate 632 can include a ceramic material. In some
cases, the ceramic material can include a substantially contiguous
and/or unitary body of ceramic material. Thus, in some cases, the
substrate 632 may not include a matrix material. For example, the
substrate 632 can include a unitary body of zirconia or alumina
material, although any ceramic material can be used. The substrate
can have any desired size or shape. As discussed herein, the
ceramic body of the substrate 632 can impart high strength and
rigidity to the component 610, while the use of an overmold
material 631 around the ceramic body of the substrate can provide
for reduced processing costs and time, as well as providing
protection to the substrate 632 from chipping or environmental
attack.
[0112] Further, as shown in FIGS. 8B and 8C, the component 610 can
include an operational component, such as an antenna 633, at least
partially surrounded by the overmold material 631. In some cases,
the antenna 633 can be positioned substantially adjacent to the
substrate 632, while in other examples, the antenna 633 can be
positioned at any location at least partially within the overmold
material 631. In some examples, where the antenna 633 is
substantially or entirely surrounded by the overmold material 631,
one or more portions of the antenna 633 configured to connect to or
communicate with other components of an electronic device can
extend from or beyond the overmold material 631.
[0113] The antenna 633 can include or be formed from a metal
material. For example, the antenna 633 can include copper, nickel,
aluminum, any other metal material, and combinations thereof. In
some cases, however, the antenna 633 can include any desired
material, as long as it is capable of being formed within the
overmold material 631. In some cases, the antenna 633 can include a
substantially flat sheet of metal. In other examples, the antenna
633 can assume any desired shape to receive and/or transmit
wireless signals of one or more desired frequencies. In some
examples, the antenna 633 can receive and/or transmit wireless
signals at one or more frequencies and can be, for example, one or
more of a cellular antenna such as an LTE antenna, a Wi-Fi antenna,
a Bluetooth antenna, a GPS antenna, a multi-frequency antenna,
and/or another similar antenna. The antenna 633 can be
communicatively coupled to one or more additional components of the
electronic device. Further, the ceramic material of the substrate
632 can allow the antenna 633 to transmit and/or receive wireless
signals with less interference, attenuation, or shielding, than if
the antenna 633 was included in a component made entirely of a
metal or another housing material. In some cases, the substrate 632
can amplify or otherwise enhance wireless signals received and/or
transmitted by the antenna, for example, by reducing noise or
increasing the amplification of the signals.
[0114] The antenna 633 can be integrated or otherwise incorporated
into the overmold material 631 during a forming process of the
overmold material 631 as part of the component 610. For example,
the antenna 633 can be positioned relative to the substrate 632,
such as in a mold, and the overmold material 631 can then be formed
or solidified around the antenna 633. In some other examples, a
portion of the overmold material 631 can first be formed at least
partially surrounding the substrate 632, followed by the antenna
633 being positioned relative to the first portion of the overmold
material 631. A second portion of the overmold material 631 can
then be formed to substantially or entirely surround the antenna
633. Additional configurations are provided below with reference to
FIGS. 9A-10B.
[0115] As shown in FIG. 9A, the present configuration can be used
in the formation of a housing 701 for any electronic device,
including a mobile phone or a smart phone 700. As shown, the smart
phone 700 includes a front screen cover 703 and a housing 701
defined by a composite component 710. As noted above, the composite
component 710 can be either a portion of the housing 701 or the
entire housing of the smart phone 700.
[0116] FIG. 9B shows a sectional view of the composite component
710. As can be seen in FIG. 9B, the composite component 710 can
include a substrate 732 including a ceramic material and an
overmold material 731 at least partially surrounding the substrate
732. In some cases, the overmold material 731 can form an exterior
surface of the composite component 710, and the resulting smart
phone 710. The composite component 710 can also include an antenna
733 or other electronic or operational component integrated or
embedded into the overmold material 731.
[0117] Similar to the embodiments detailed above, the substrate 732
can include a ceramic material as either a substantially contiguous
and/or unitary body of ceramic material, a ceramic weave in a
matrix, or as ceramic particles distributed within a matrix. As
detailed above, each of these configurations impart high strength
and rigidity to the component 710, while the use of an overmold
material 731 around the ceramic body of the substrate can provide
for reduced processing costs and time, as well as providing
protection to the substrate 732 from chipping or environmental
attack.
[0118] The antenna 733 can be at least partially surrounded by the
overmold material 731. In some examples, the antenna 733 can be
positioned substantially adjacent to the substrate 732, while in
other examples the antenna 733 can be positioned at any location at
least partially within the overmold material 731. Similar to the
antenna detailed above, the antenna 733 can include or be formed
from a metal material, such as copper, nickel, aluminum, any other
metal material, and combinations thereof. In some cases, the
ceramic material of the substrate 732 can allow the antenna 733 to
transmit and/or receive wireless signals with less interference,
attenuation, or shielding, than if the antenna 733 was included in
a component made entirely of a metal or another housing material.
In some cases, the substrate 732 can amplify or otherwise enhance
wireless signals received and/or transmitted by the antenna, for
example, by reducing noise or increasing the amplification of the
signals. Alternatively, the present configuration can be
incorporated into a tablet computer, as shown in FIGS. 10A and
10B.
[0119] As shown in FIG. 10A, the present configuration can also be
used in the formation of a housing 801 for a tablet computer 800.
As shown, the tablet computer 800 includes a front screen cover 803
and a housing 801 defined by a composite component 810. The
composite component 810 can be either a portion of the housing 801,
or the entire housing of the tablet computer 800.
[0120] FIG. 10B shows a sectional view of the composite component
810. As can be seen in FIG. 10B, the composite component 810 can
include a substrate 832 including a ceramic material and an
overmold material 831 at least partially surrounding the substrate
832. In some cases, the overmold material 831 can form an exterior
surface of the composite component 810, and the resulting smart
phone 810. The composite component 810 can also include an antenna
833 or other electronic component integrated or embedded into the
overmold material 831.
[0121] Similar to the embodiments detailed above, the substrate 832
can include a ceramic material as either a substantially contiguous
and/or unitary body of ceramic material, a ceramic weave in a
matrix, or as ceramic particles distributed within a matrix. As
detailed above, each of these configurations impart high strength
and rigidity to the component 810, while the use of an overmold
material 831 around the ceramic body of the substrate can provide
for reduced processing costs and time, as well as providing
protection to the substrate 832 from chipping or environmental
attack.
[0122] Similar to the examples provided above, the antenna 833 can
be at least partially surrounded by the overmold material 831. In
some examples, the antenna 833 can be positioned substantially
adjacent to the substrate 832, while in other examples the antenna
833 can be positioned at any location at least partially within the
overmold material 831. The antenna 733 can include or be formed
from a metal material, such as copper, nickel, aluminum, any other
metal material, and combinations thereof. In some cases, the
ceramic material of the substrate 832 can allow the antenna 833 to
transmit and/or receive wireless signals with less interference,
attenuation, or shielding, than if the antenna 833 was included in
a component made entirely of a metal or another housing material.
In some cases, the substrate 832 can amplify or otherwise enhance
wireless signals received and/or transmitted by the antenna, for
example, by reducing noise or increasing the amplification of the
signals. Details regarding forming the present antenna-permeable
structure is provided below, with reference to FIGS. 11-13.
[0123] FIG. 11 illustrates a process flow diagram of an exemplary
process for forming a composite component, as described herein. The
process 900 for forming the component can include positioning an
electronic or operational component, such as an antenna, relative
to a substrate including a ceramic material at block 910 and
overmolding a material at least partially around the substrate and
the electronic component at block 920.
[0124] At block 910, an electronic component is positioned relative
to a substrate including a ceramic material. The substrate can
include some or all of the features of the substrates described
herein. For example, the substrate can include a ceramic material
at least partially surrounded by a matrix material. The ceramic
material can include ceramic fibers, for example, randomly disposed
through the matrix material or arranged in a pattern such as a
weave.
[0125] The electronic component can be positioned relative to the
substrate, for example, in a desired position when at least
partially surrounded by the overmold material. The electronic
component and the substrate can be held in this arrangement by any
apparatus or method known in the art or developed in the future.
For example, the electronic component and the substrate can be held
relative to one another in a mold. In some cases, the electronic
component can be an antenna or another operational component, as
described herein.
[0126] At block 920, a moldable material can be overmolded so that
it at least partially surrounds the substrate and the electronic
component. In some examples, the material can be overmolded at
least partially around both the substrate and the electronic
component in a single step. For example, the substrate and the
electronic component can be positioned relative to one another in a
mold and the material can be injection molded over the substrate
and electronic component. In some cases, a portion of the overmold
material can first be formed to at least partially surround the
substrate, followed by the electronic component being positioned
relative to the first portion of the overmold material while a
second portion of the material is overmolded around both the
substrate and the antenna, substantially or entirely surrounding
the antenna with overmold material. Thus, in some cases, block 920
can occur or take place both before and after the positioning of
the electronic component in block 910.
[0127] The overmold material can be a metallic material, an
amorphous material, a polymeric material, a composite material, or
combinations thereof. In some cases, the overmold material can be a
polymer material such as a polyamide material, although any
polymeric material can be used. Further, in some cases, one or more
additional materials can be included in the moldable material of
the overmold material. For example, the overmold material can be a
polyamide material and can include glass fibers embedded
therein.
[0128] The material can be overmolded at block 920 by any number of
additive manufacturing or molding processes. For example, in some
cases, the overmold material can be formed by an injection molding
process using a mold that contains the substrate and the electronic
component. In other examples, the material can be overmolded by an
additive process, such as a 3D printing process. For example, a
material can be 3D printed at least partially around the substrate
and an electronic component, as described herein. 3D printing and
other precise manufacturing processes can allow for the formation
of an overmold material that can assume a shape or include features
that cannot be formed by other molding or manufacturing
processes.
[0129] FIG. 12 illustrates a process flow diagram of another
exemplary process for forming a composite component. According to
FIG. 12, the process 1000 for forming the component can include
solidifying a matrix material at least partially around a ceramic
material to form a substrate at block 1010. The substrate can then
be formed into a desired shape at 1020. An electronic component,
such as an antenna, can then be positioned relative to the
substrate at block 1030. As shown in block 1040, a material can
then be overmolded at least partially around the substrate and the
electronic component.
[0130] At block 1010, a matrix material is solidified at least
partially around a ceramic material. The ceramic material can
include any of the ceramic materials described herein, in any
combination. For example, the ceramic material can include ceramic
fibers. In some cases, the ceramic fibers can be substantially
randomly positioned throughout the matrix material, while in some
other cases, the ceramic fibers can be arranged in a pattern such
as a weave. The ceramic material can include or assume any shape or
form of ceramic material. For example, the ceramic material can
include ceramic particles, pellets, spheres, rods, tubes, fibers,
or other geometries in any amount or combination. In some cases,
the ceramic material can be a substantially contiguous and/or a
substantially unitary ceramic body. The ceramic material can
include zirconia, alumina, or combinations thereof.
[0131] In some cases, the ceramic material can be positioned in a
mold or other apparatus in a desired orientation and the matrix
material can be molded at least partially around the ceramic
material. Any process for forming a matrix material around the
ceramic material can be used, such as, a molding or injection
molding process. In some cases, the matrix material can be a
thermoset polymer, such as an epoxy or resin. In some cases, the
matrix material can be a thermoplastic polymer. In some cases, the
matrix material can be a combination of any thermoset and
thermoplastic polymer. In some cases, the matrix material can be
provided at least partially around the ceramic material in a liquid
or viscous form and can then be solidified by curing or cooling to
form a substrate. In some other cases, the matrix material can
include any matrix material described herein.
[0132] At block 1020, the substrate can be formed into a desired
shape. In some cases, block 1020 can occur substantially
simultaneous with block 1010. That is, the matrix material can be
solidified around the ceramic material into a desired shape. In
some cases, however, further processing of the substrate can occur
after the matrix material has solidified to form the substrate into
a desired shape. For example, any subtractive manufacturing process
can be used to form the substrate into a desired shape, including
forming one or more features therein, such as apertures. In some
cases, the substrate can be cut or machined into a desired shape.
For example, a laser-cutter can be used to form the substrate into
a desired shape.
[0133] At block 1030, an electronic component is positioned
relative to a substrate including a ceramic material. The substrate
can include some or all of the features of the substrates described
herein. The electronic component can be positioned relative to the
substrate, in a desired position when at least partially surrounded
by the overmold material. The electronic component and the
substrate can be held in this arrangement by any apparatus or
method known in the art or developed in the future. For example,
the electronic component and the substrate can be held relative to
one another in a mold. In some cases, the electronic component can
be an antenna.
[0134] At block 1040, a moldable material can be overmolded so that
it at least partially surrounds the substrate and the electronic
component. In some cases, the material can be overmolded at least
partially around the substrate and the electronic component in a
single step process. For example, the substrate and electronic
component can be positioned relative to one another in a mold and
the material can be injection molded over the substrate and
electronic component. In some cases, a portion of the overmold
material can be formed at least partially surrounding the substrate
in a first stage, and the electronic component can be positioned
relative to the first portion of the overmold material while a
second portion of the material is overmolded around the substrate
and the electronic components so that the electronic component is
substantially or entirely surrounded by the overmold material.
Thus, in some cases, block 1030 can occur or take place both before
and after the positioning of the electronic component in block
1040.
[0135] The material overmolded at least partially around the
substrate and the electronic component can be a metallic material,
an amorphous material, a polymeric material, or any other moldable
material. In some cases, the overmold material can be a polymer
material such as a polyamide material, although any polymeric
material can be used. Further, in some cases, one or more
additional materials can be included in the moldable material of
the overmold material. For example, the overmold material can be a
polyamide material and can include glass fibers embedded
therein.
[0136] The material can be overmolded at block 1040 by any number
of additive manufacturing or molding processes. For example, in
some cases, the overmold material can be formed by an injection
molding process using a mold that contains the substrate and the
electronic component. In other examples, the material can be
overmolded by an additive process, such as a 3D printing process.
For example, a material can be 3D printed at least partially around
the substrate and an electronic component, as described herein. 3D
printing and other precise manufacturing processes can allow for
the formation of an overmold material that can assume a shape or
include features that cannot be formed by other molding or
manufacturing processes.
[0137] FIG. 13 illustrates a process flow diagram of another
exemplary process for forming a composite component. The process
1100 for forming the component can include positioning an
electronic component, such as an antenna, relative to a ceramic
material at block 1110 and solidifying a matrix material at least
partially around the electronic component and the ceramic material
at block 1120.
[0138] At block 1110, an electronic component is positioned
relative to a ceramic material. The ceramic material can include
some or all of the features of the ceramic materials described
herein. For example, the ceramic material can include ceramic
fibers, for example, randomly disposed or oriented, or arranged in
a pattern such as a weave.
[0139] The electronic component can be positioned relative to the
ceramic material, for example, in a desired position when at least
partially surrounded by the matrix material. The electronic
component and the ceramic material can be held in this arrangement
by any apparatus or method known in the art or developed in the
future. For example, the electronic component and the ceramic
material can be held or positioned relative to one another in a
mold. In some cases, the electronic component can be an
antenna.
[0140] At block 1120, a matrix material is solidified at least
partially around the ceramic material and the electronic component.
The ceramic material can include any of the ceramic materials
described herein, in any combination. For example, the ceramic
material can include ceramic fibers. In some cases, the ceramic
fibers can be substantially randomly positioned throughout the
matrix material, while in some other cases, the ceramic fibers can
be arranged in a pattern such as a weave. The ceramic material can
include any shape or form of ceramic material. For example, the
ceramic material can include ceramic particles, pellets, spheres,
rods, tubes, fibers, or other shape or form in any amount or
combination. In some cases, the ceramic material can be a
substantially contiguous and/or a substantially unitary ceramic
body. The ceramic material can include zirconia, alumina, or
combinations thereof.
[0141] In some cases, the ceramic material and electronic component
can be positioned in a mold or other apparatus in a desired
orientation and the matrix material can be molded at least
partially around the ceramic material and the electronic component.
Any process for forming a matrix material around the ceramic
material and electronic component can be used, for example, a
molding or injection molding process. In some cases, the matrix
material can be a thermoset polymer, such as an epoxy or resin. In
some cases, the matrix material can be a thermoplastic polymer. In
some cases, the matrix material can be any combination of thermoset
and thermoplastic polymers. In some cases, the matrix material can
be disposed at least partially around the ceramic material and/or
electronic component in a liquid or viscous form, and can then be
solidified by curing or cooling to form a substrate. In some other
cases, the matrix material can include any matrix material, as
described herein, or combinations thereof.
[0142] In some cases, the matrix material can be solidified around
the ceramic material and electronic component in a single step
process. For example, the ceramic material and electronic component
can be positioned relative to one another in a mold and the
material can be injection molded over the ceramic material and the
electronic component. In some examples, a portion of the matrix
material can be formed at least partially surrounding the ceramic
material in a first stage, and the electronic component can be
positioned relative to the first portion of the matrix material
while a second portion of the matrix material is solidified around
the ceramic material and the electronic component, so that the
electronic component is substantially or entirely surrounded by the
matrix material. Thus, in some cases, block 1120 can occur or take
place before, during, and/or after the positioning of the
electronic component in block 1110.
[0143] Any of the features or aspects of the composite components
discussed herein can be combined or included in any varied
combination. For example, the design and shape of the substrate
and/or overmold material is not limited in any way and can be
formed by any number of processes, including those discussed
herein. Further, the overmold material can be overmolded at least
partially around the substrate at any time, even during formation
of the substrate, and by any number of processes, including those
discussed herein. A composite component, as discussed herein, can
be or can form all or a portion of a component, such as a housing,
for an electronic device. The composite component can also be or
form any number of additional components of an electronic device,
including internal components, external components, cases,
surfaces, or partial surfaces.
[0144] Various inventions have been described herein with reference
to certain specific embodiments and examples. However, they will be
recognized by those skilled in the art that many variations are
possible without departing from the scope and spirit of the
inventions disclosed herein, in that those inventions set forth in
the claims below are intended to cover all variations and
modifications of the inventions disclosed without departing from
the spirit of the inventions. The terms "including:" and "having"
come as used in the specification and claims shall have the same
meaning as the term "comprising."
[0145] The foregoing description, for purposes of explanation, used
specific nomenclature to provide a thorough understanding of the
described embodiments. However, it will be apparent to one skilled
in the art that the specific details are not required in order to
practice the described embodiments. Thus, the foregoing
descriptions of the specific embodiments described herein are
presented for purposes of illustration and description. They are
not meant to be exhaustive or to limit the embodiments to the
precise forms disclosed. It will be apparent that many
modifications and variations are possible in view of the above
teachings.
* * * * *