U.S. patent application number 16/201968 was filed with the patent office on 2020-03-19 for camera module.
The applicant listed for this patent is TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.. Invention is credited to SHIN-WEN CHEN, SHENG-JIE DING, JING-WEI LI, JIAN-CHAO SONG.
Application Number | 20200089084 16/201968 |
Document ID | / |
Family ID | 69723429 |
Filed Date | 2020-03-19 |
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United States Patent
Application |
20200089084 |
Kind Code |
A1 |
CHEN; SHIN-WEN ; et
al. |
March 19, 2020 |
CAMERA MODULE
Abstract
A camera module with good heat dissipation efficiency and
stability includes a base. The base comprises a first receiving
groove. At least one escaping hole is defined at the base and the
escaping hole forms a connection between the first receiving groove
and the ambient environment. At least one heat dissipation block is
received in each escaping hole.
Inventors: |
CHEN; SHIN-WEN; (Tu-Cheng,
TW) ; SONG; JIAN-CHAO; (Shenzhen, CN) ; LI;
JING-WEI; (Shenzhen, CN) ; DING; SHENG-JIE;
(Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. |
Shenzhen |
|
CN |
|
|
Family ID: |
69723429 |
Appl. No.: |
16/201968 |
Filed: |
November 27, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04N 5/225 20130101;
H05K 1/181 20130101; H05K 2201/10151 20130101; H04N 5/22521
20180801; H05K 7/20445 20130101; H05K 2201/10121 20130101; G03B
17/55 20130101; G03B 17/12 20130101 |
International
Class: |
G03B 17/55 20060101
G03B017/55; H05K 7/20 20060101 H05K007/20; G03B 17/12 20060101
G03B017/12 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 13, 2018 |
CN |
201811069806.0 |
Claims
1. A camera module comprising: a base, wherein the base comprises a
first receiving groove, a plurality of sidewalls, and a bottom wall
connected to each of the sidewalls, the first receiving groove is
defined by the bottom wall and the plurality of sidewalls; at least
one escaping hole, wherein the at least one escaping hole is
defined at the base and connects to the first receiving groove and
ambient environment, the at least one escaping hole comprises a
first escaping hole, the first escaping hole is defined in the
bottom wall; and at least one heat dissipation block, wherein the
heat dissipation block is received in each of the at least one
escaping hole, each of the at least one heat dissipation block
comprises a first heat dissipation block, the first heat
dissipation block is received in the first escaping hole.
2. The camera module of claim 1, wherein the heat dissipation block
is made of metal or other materials having good heat dissipation
efficiency.
3. The camera module of claim 1, wherein each of the at least one
heat dissipation block is fixed in each of the at least one
escaping hole by adhesive.
4. (canceled)
5. (canceled)
6. The camera module of claim 1, wherein the camera module further
comprises a printed circuit board, the base is formed on the
printed circuit board; the first escaping hole is defined at the
bottom wall along a direction perpendicular to the printed circuit
board.
7. The camera module of claim 1, wherein each of the at least one
first escaping hole comprises a first hole portion and a second
hole portion connecting to the first hole portion; the first hole
portion is positioned adjacent to the first receiving groove.
8. The camera module of claim 7, wherein a width of the second hole
portion is greater than a width of the first hole portion.
9. The camera module of claim 7, wherein the first heat dissipation
block comprises a first heat dissipation portion and a second heat
dissipation portion connecting to the first heat dissipation
portion, the first heat dissipation portion is received in the
first hole portion, the second heat dissipation portion is received
in the second hole portion.
10. The camera module of claim 9, wherein a width of the second
heat dissipation portion is greater than a width of the first heat
dissipation portion.
11. The camera module of claim 9, wherein a width of the second
hole portion is greater than a width of the second heat dissipation
portion, a first gap is defined between the second hole portion and
the second heat dissipation portion, the first gap receives the
adhesive.
12-16. (canceled)
17. The camera module of claim 1, wherein the camera module further
comprises a lens cone formed on the base and a lens received in the
lens cone.
18. The camera module of claim 4, wherein the camera module further
comprises an optical filter, the optical filter is fixed on the
bottom wall and received in the first receiving groove.
19. The camera module of claim 18, wherein an opening is defined at
the bottom wall, a portion of the optical filter is exposed from
the opening.
20. A camera module comprising: a base, wherein the base comprises
a first receiving groove, a plurality of sidewalls, and a bottom
wall connected to each of the sidewalls, the first receiving groove
is defined by the bottom wall and the plurality of sidewalls; at
least one escaping hole, wherein the at least one escaping hole is
defined at the base and connects to the first receiving groove and
ambient environment, the at least one escaping hole comprises a
second escaping hole, the second escaping hole is defined at the
sidewall along a direction inclined with respect to the sidewall;
and at least one heat dissipation block, wherein the heat
dissipation block is received in each of the at least one escaping
hole, each of the at least one heat dissipation block comprises a
second heat dissipation block, the second heat dissipation block is
received in the second escaping hole.
21. The camera module of claim 20, wherein the second escaping hole
comprises a third hole portion and a fourth hole portion connecting
to the third hole portion, the third hole portion is positioned
adjacent to the first receiving groove; the second heat dissipation
block comprises a third heat dissipation portion and a fourth heat
dissipation portion connecting to the third heat dissipation
portion, the third heat dissipation portion is received in the
third hole portion, the fourth heat dissipation portion is received
in the fourth hole portion.
22. The camera module of claim 21, wherein a width of the fourth
hole portion is greater than a width of the fourth heat dissipation
portion, a second gap is defined between the fourth hole portion
and the fourth heat dissipation portion, the second gap receives
the adhesive.
23. The camera module of claim 21, wherein a width of the fourth
hole portion is greater than a width of the third hole portion.
24. The camera module of claim 21, wherein a width of the fourth
heat dissipation portion is greater than a width of the third heat
dissipation portion.
Description
FIELD
[0001] The subject matter generally relates to a camera module.
BACKGROUND
[0002] Most camera modules on the market are composed of a lens, a
holder, a motor, a filter, a sensor chip, a plastic base, and a
circuit board. Cameras are used more frequently and cameras with
good reliability and quality are expected.
[0003] The holder, the lens, and the printed circuit board are made
of plastic materials. An enclosed space is defined by the holder,
the lens, and the printed circuit board to avoid dusts or debris
entering into the interior of the optical projection device of the
camera. Such arrangements may hinder heat dissipation from the
camera module and cause heating of the camera module which will
affect the precision and quality of the structures guiding light in
the camera module.
[0004] Therefore, there is room for improvement in the art.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Implementations of the present technology will now be
described, by way of embodiments only, with reference to the
attached figures.
[0006] FIG. 1 is a view of a first embodiment of a camera module of
the present disclosure.
[0007] FIG. 2 is an exploded view of the camera module of FIG.
1.
[0008] FIG. 3 is a cross-sectional view of the camera module along
line of FIG. 1.
[0009] FIG. 4 is similar to FIG. 1, but showing the camera module
from another angle.
[0010] FIG. 5 is a cross-sectional view of the camera module along
line V-V of FIG. 4.
DETAILED DESCRIPTION
[0011] It will be appreciated that for simplicity and clarity of
illustration, where appropriate, reference numerals have been
repeated among the different figures to indicate corresponding or
analogous elements. In addition, numerous specific details are set
forth in order to provide a thorough understanding of the
embodiments described herein. However, it will be understood by
those of ordinary skill in the art that the embodiments described
herein can be practiced without these specific details. In other
instances, methods, procedures, and components have not been
described in detail so as not to obscure the related relevant
feature being described. Also, the description is not to be
considered as limiting the scope of the embodiments described
herein. The drawings are not necessarily to scale, and the
proportions of certain portions may be exaggerated to better
illustrate details and features of the present disclosure.
[0012] The disclosure is illustrated by way of example and not by
way of limitation in the figures of the accompanying drawings, in
which like references indicate similar elements. It should be noted
that references to "an" or "one" embodiment in this disclosure are
not necessarily to the same embodiment, and such references mean
"at least one."
[0013] The term "comprising," when utilized, means "including, but
not necessarily limited to"; it specifically indicates open-ended
inclusion or membership in the so-described combination, group,
series, and the like.
[0014] FIGS. 1-5 illustrate an embodiment of a camera module 100.
The camera module 100 includes a base 10, a lens cone 20, a lens
30, an optical filter 40, a sensor 50, and a printed circuit board
60. The lens 30 is received in the lens cone 20. The lens cone 20
is fixed on the base 10. The base 10 is fixed on the printed
circuit board 60. The optical filter 40 is received in the base 10.
The sensor 50 is received in the base 10 and formed on the printed
circuit board 60.
[0015] The base 10 includes a first surface 11, a second surface 12
opposite to the first surface 11, and a plurality of side surfaces
13 each perpendicularly connected to the first surface 11 and the
second surface 12.
[0016] The base 10 includes a plurality of sidewalls 101 and a
bottom wall 102 connected to each of the sidewalls 101. The bottom
wall 102 and the plurality of sidewalls 101 define a first
receiving groove 14.
[0017] The first receiving groove 14 receives the optical filter 40
and the sensor 50. The first receiving groove 14 runs through the
second surface 12.
[0018] An opening 141 is defined in the bottom wall 102, the
opening 141 runs through the bottom wall 102.
[0019] At least one escaping hole 15 is defined at the sidewalls
101 or in the bottom wall 102. The escaping hole 15 connects the
first receiving groove 14 and the ambient environment. A heat
dissipation block 16 is received in each of the at least one
escaping hole 15. The heat dissipation block 16 can be fixed in the
escaping hole 15 by adhesive 17. The heat dissipation block 16 can
be made of metal or other materials having good heat dissipation
efficiency.
[0020] In an embodiment, the at least one escaping hole 15 includes
a first escaping hole 151, a second escaping hole 152, and a
combination thereof. The heat dissipation block 16 includes a first
heat dissipation block 161, a second heat dissipation block 162,
and a combination thereof. The first heat dissipation block 161 is
received in the first escaping hole 151. The second heat
dissipation block 162 is received in the second escaping hole
152.
[0021] The first escaping hole 151 is defined at the bottom wall
102 along a direction that is perpendicular to the printed circuit
board 60. The first escaping hole 151 run through the first surface
11 and the second surface 12. The first escaping hole 151 is
connected to the first receiving groove 14.
[0022] The first escaping hole 151 includes a first hole portion
1511 and a second hole portion 1512 connected to the first hole
portion 1511. The first hole portion 1511 is positioned adjacent to
the first receiving groove 14. The second hole portion 1512 is
positioned adjacent to the first surface 11. A width of the second
hole portion 1512 is greater than a width of the first hole portion
1511, the width being larger to increase heat dissipation area of
the first heat dissipation block 161. The first heat dissipation
block 161 includes a first heat dissipation portion 1611 and a
second heat dissipation portion 1612 connected to the first heat
dissipation portion 1611. The first heat dissipation portion 1611
is received in the first hole portion 1511. The second heat
dissipation portion 1612 is received in the second hole portion
1512. A width of the second heat dissipation portion 1612 is
greater than a width of the first heat dissipation portion 1611. A
width of the second hole portion 1512 is greater than a width of
the second heat dissipation portion 1612, a first gap 1513 is
defined between the second hole portion 1512 and the second heat
dissipation portion 1612. The first gap receives the adhesive
17.
[0023] The second escaping hole 152 is defined at the sidewall 101
along a direction that is inclined with respect to the sidewall
101, the inclination allows the second heat dissipation block 162
received therein to have a larger heat dissipation area. The second
escaping hole 152 run through the sidewall 101 and is connected to
the first receiving groove 14.
[0024] The second escaping hole 152 includes a third hole portion
1521 and a fourth hole portion 1522 connected to the third hole
portion 1521. The third hole portion 1521 is positioned adjacent to
the first receiving groove 14. The fourth hole portion 1522 is
positioned adjacent to at least one of the side surfaces 13. A
width of the fourth hole portion 1522 is greater than a width of
the third hole portion 1521, to increase heat dissipation area of
the second heat dissipation block 162. The second heat dissipation
block 162 includes a third heat dissipation portion 1621 and a
fourth heat dissipation portion 1622 connected to the third heat
dissipation portion 1621. The third heat dissipation portion 1621
is received in the third hole portion 1521. The fourth heat
dissipation portion 1622 is received in the fourth hole portion
1522. A width of the fourth heat dissipation portion 1622 is
greater than a width of the third heat dissipation portion 1621. A
width of the fourth hole portion 1522 is greater than a width of
the fourth heat dissipation portion 1622, a second gap 1523 is
defined between the fourth hole portion 1522 and the fourth heat
dissipation portion 1622. The second gap receives the adhesive
17.
[0025] The lens cone 20 is fixed on the base 10. In an embodiment,
the lens cone 20 and the base 10 are integrally formed. In another
embodiment, the lens cone 20 can be connected to the base 10 by
screws or adhesive.
[0026] The lens cone 20 includes a third surface 21, a second
receiving groove 22 configured for the lens cone 20. The second
receiving groove 22 runs through the third surface 21. The second
receiving groove 22 receives and fixes the lens 30. The second
receiving groove 22 is connected to the first receiving groove
14.
[0027] The lens 30 is received and fixed in the second receiving
groove 22. The lens 30 includes an ophthalmic lens 31 facing the
opening 141.
[0028] The optical filter 40 filters out stray light entering into
the camera module 100. The optical filter 40 is fixed on the bottom
wall 102 and received in the first receiving groove 14. A portion
of the optical filter 40 is exposed from the opening 141.
[0029] The sensor 50 is fixed on and electrically connected to the
printed circuit board 60. The sensor 50 is received in the first
receiving groove 14 and faces the optical filter 40.
[0030] The camera module 100 further includes a stiffening adhesive
70. The stiffening adhesive 70 is formed on the first side surface
13 of the base 10 and the printed circuit board 60, to enhance
structural strength of the camera module 100.
[0031] The camera module 100 further includes a voice coil motor.
The voice coil motor surrounds the lens cone 20 and is electrically
connected to the lens 30. The voice coil motor can move the lens 30
up and down for focusing.
[0032] The camera module as disclosed, the escaping hole 15 is
defined at the sidewalls 101 or in the bottom wall 102. The heat
dissipation block 16 is received in each of the at least one
escaping hole 15. Heat can be dissipated from the camera module 100
quickly to have good heat dissipation efficiency, the heat
generated by the sensor 50 or other electronic components can be
dissipated to the ambient environment, further improving the
quality of the images of the camera module 100. Furthermore, the
heat dissipation block 16 can improve the stability of the camera
module 100.
[0033] The embodiments shown and described above are only examples.
Many details are often found in the art such as the other features
of a camera module. Therefore, many such details are neither shown
nor described. Even though numerous characteristics and advantages
of the present technology have been set forth in the foregoing
description, together with details of the structure and function of
the present disclosure, the disclosure is illustrative only, and
changes can be made in the detail, including in matters of shape,
size, and arrangement of the parts within the principles of the
present disclosure, up to and including the full extent established
by the broad general meaning of the terms used in the claims. It
will therefore be appreciated that the embodiments described above
can be modified within the scope of the claims.
* * * * *