U.S. patent application number 16/415486 was filed with the patent office on 2020-03-19 for fabric items with electrical components.
The applicant listed for this patent is Apple Inc.. Invention is credited to Peter F. Coxeter, Didio V. Gomes, Benjamin J. Grena, Steven J. Keating, David M. Kindlon, Maurice P. May, Daniel A. Podhajny, Andrew L. Rosenberg, Daniel D. Sunshine.
Application Number | 20200087823 16/415486 |
Document ID | / |
Family ID | 69773809 |
Filed Date | 2020-03-19 |
United States Patent
Application |
20200087823 |
Kind Code |
A1 |
Coxeter; Peter F. ; et
al. |
March 19, 2020 |
Fabric Items with Electrical Components
Abstract
A fabric-based item may include fabric formed from intertwined
strands of material. The fabric may include first and second fabric
layers that at least partially surround a pocket. Initially, the
pocket may be completely enclosed by the first and second layers of
fabric. A shim may be placed in the pocket before the pocket is
closed. An opening may be formed in the first layer of fabric to
expose a conductive strand in the pocket. The shim may prevent the
cutting tool from cutting all the way through to the second layer
of fabric. After cutting the hole in the first layer of fabric, the
shim may be removed and an electrical component may be soldered to
the conductive strand in the pocket. A polymer material may be
injected into the pocket to encapsulate the electrical component.
The polymer material may interlock with the surrounding pocket
walls.
Inventors: |
Coxeter; Peter F.;
(Sunnyvale, CA) ; Gomes; Didio V.; (Sunnyvale,
CA) ; Grena; Benjamin J.; (Sunnyvale, CA) ;
Keating; Steven J.; (Sunnyvale, CA) ; Kindlon; David
M.; (Felton, CA) ; May; Maurice P.;
(Sunnyvale, CA) ; Podhajny; Daniel A.; (San Jose,
CA) ; Rosenberg; Andrew L.; (Sunnyvale, CA) ;
Sunshine; Daniel D.; (Sunnyvale, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Apple Inc. |
Cupertino |
CA |
US |
|
|
Family ID: |
69773809 |
Appl. No.: |
16/415486 |
Filed: |
May 17, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62733461 |
Sep 19, 2018 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 3/3442 20130101;
D03D 1/0088 20130101; H05K 2201/029 20130101; H05K 3/34 20130101;
H05K 1/038 20130101; H05K 2201/10106 20130101; H05K 3/284 20130101;
D10B 2401/18 20130101; D02G 3/441 20130101; D03D 11/02 20130101;
H05K 2201/10151 20130101; H05K 2201/0281 20130101 |
International
Class: |
D03D 1/00 20060101
D03D001/00; D02G 3/44 20060101 D02G003/44; H05K 1/03 20060101
H05K001/03 |
Claims
1. A fabric-based item comprising: a first layer of fabric; a
second layer of fabric intertwined with the first layer of fabric,
wherein the first and second layers of fabric at least partially
surround a pocket; and an electrical component mounted in the
pocket, wherein the first layer of fabric has an opening that
overlaps the electrical component and wherein the second layer of
fabric completely overlaps the electrical component.
2. The fabric-based item defined in claim 1 further comprising: a
conductive strand of material that passes through the pocket,
wherein the electrical component is mounted to the conductive
strand.
3. The fabric-based item defined in claim 2 further comprising: an
encapsulant in the pocket that encapsulates the electrical
component.
4. The fabric-based item defined in claim 3 wherein the encapsulant
comprises polymer.
5. The fabric-based item defined in claim 3 wherein the first layer
of fabric has protruding edges that surround the opening and
wherein the encapsulant interlocks with the protruding edges.
6. The fabric-based item defined in claim 3 further comprising
solder that electrically couples the electrical component to the
conductive strand.
7. The fabric-based item defined in claim 3 wherein the electrical
component is selected from the group consisting of: a sensor and a
light-emitting diode.
8. The fabric-based item defined in claim 3 further comprising an
additional conductive strand that passes through the pocket,
wherein the electrical component comprises a first terminal coupled
to the conductive strand and a second terminal coupled to the
additional conductive strand.
9. A fabric-based item, comprising: a first fabric layer having a
first opening; a second fabric layer having a second opening,
wherein the first and second openings have different dimensions,
wherein the first and second fabric layers are intertwined together
and at least partially surround a cavity; and an electrical
component mounted to a conductor in the cavity.
10. The fabric-based item defined in claim 9 wherein the conductor
comprises a conductive strand that passes through the cavity.
11. The fabric-based item defined in claim 10 further comprising:
polymer material that fills the cavity and encapsulates the
electrical component.
12. The fabric-based item defined in claim 11 wherein the first
fabric layer has a first edge that surrounds the first opening,
wherein the second fabric layer has a second edge that surrounds
the second opening, and wherein the polymer material interlocks
with the first and second edges.
13. The fabric-based item defined in claim 9 wherein the electrical
component is selected from the group consisting of: a sensor and a
light-emitting diode.
14. The fabric-based item defined in claim 9 further comprising
solder that electrically couples the electrical component to the
conductor.
15. A method for forming a fabric-based item, comprising:
intertwining first and second layers of fabric to form a pocket;
inserting a shim into the pocket; cutting a hole into the first
layer of fabric, wherein the hole overlaps the shim; and inserting
an electrical component through the hole and mounting the
electrical component to a conductor in the pocket.
16. The method defined in claim 15 wherein cutting the hole into
the first layer of fabric comprises laser cutting the hole into the
first layer of fabric using a laser beam and wherein the laser beam
is absorbed by the shim so that the laser beam does not cut the
second layer of fabric.
17. The method defined in claim 16 further comprising: removing the
shim from the pocket after cutting the hole into the first layer of
fabric.
18. The method defined in claim 15 further comprising: injecting
polymer material into the pocket to encapsulate the electrical
component.
19. The method defined in claim 15 wherein the conductor comprises
a conductive strand and wherein mounting the electrical component
to the conductor comprises soldering the electrical component to
the conductive strand.
20. The method defined in claim 15 wherein cutting the hole into
the first layer of fabric comprises cutting the hole into the first
layer of fabric without cutting the second layer of fabric.
Description
[0001] This application claims the benefit of provisional patent
application No. 62/733,461, filed Sep. 19, 2018, which is hereby
incorporated by reference herein in its entirety.
FIELD
[0002] This relates generally to fabric-based items and, more
particularly, to fabric-based items with electrical components.
BACKGROUND
[0003] It may be desirable to form bags, furniture, clothing,
wearable electronic devices, and other items using fabric. In some
arrangements, it may be desirable to incorporate electrical
circuitry into fabric. If care is not taken, however, fabric-based
items may not offer desired features. For example, fabric-based
items may include circuitry that is bulky, heavy, unattractive, and
susceptible to damage.
SUMMARY
[0004] A fabric-based item may include fabric formed from
intertwined strands of material. The fabric may include first and
second fabric layers that are intertwined to form a pocket. During
weaving, a shim may be placed in the pocket before the pocket is
closed. After the shim is placed into the pocket, the pocket may be
closed.
[0005] A cutting tool may be used to create an opening in the first
layer of fabric to expose a conductive strand in the pocket. The
shim may prevent the cutting tool from cutting all the way through
to the second layer of fabric. After cutting the hole in the first
layer of fabric, the shim may be removed and an electrical
component may be soldered to the conductive strand in the pocket. A
polymer material may be injected into the pocket to encapsulate the
electrical component. The polymer material may interlock with the
surrounding pocket walls.
[0006] In some arrangements, the cutting tool may create openings
in the first and second layers of fabric. To create openings with
different dimensions or shapes, one or more shims may be used to
prevent the cutting tool from cutting all the way through to the
other side of the fabric.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a side view of illustrative woven fabric in
accordance with an embodiment.
[0008] FIG. 2 is a top view of illustrative knit fabric in
accordance with an embodiment.
[0009] FIG. 3 is a schematic diagram of an illustrative
fabric-based item in accordance with an embodiment.
[0010] FIG. 4 is a diagram of illustrative equipment for forming a
fabric-based item in accordance with an embodiment.
[0011] FIG. 5 is a cross-sectional side view of an illustrative
fabric-based item having an electrical component mounted in a
pocket and having a fabric opening filled with encapsulant in
accordance with an embodiment.
[0012] FIG. 6 is a cross-sectional side view of an illustrative
fabric-based item having an electrical component mounted in a
pocket and having first and second fabric openings filled with
encapsulant in accordance with an embodiment.
[0013] FIG. 7 is a cross-sectional side view of an illustrative
fabric-based item of the type shown in FIG. 5 showing how a shim
may be placed in a pocket in accordance with an embodiment.
[0014] FIG. 8 is a cross-sectional side view of an illustrative
fabric-based item of the type shown in FIG. 5 showing how a shim
may prevent a cutting tool from penetrating through an overlapping
fabric layer in accordance with an embodiment.
[0015] FIG. 9 is a cross-sectional side view of an illustrative
fabric-based item of the type shown in FIG. 5 showing how an
electrical component may be soldered to a conductive strand in a
pocket in accordance with an embodiment.
[0016] FIG. 10 is a cross-sectional side view of an illustrative
fabric-based item of the type shown in FIG. 6 showing how multiple
shims may be placed in a pocket in accordance with an
embodiment.
[0017] FIG. 11 is a cross-sectional side view of an illustrative
fabric-based item of the type shown in FIG. 6 showing how multiple
shims may prevent a cutting tool from penetrating through
overlapping fabric layers in accordance with an embodiment.
[0018] FIG. 12 is a cross-sectional side view of an illustrative
fabric-based item of the type shown in FIG. 6 showing how an
electrical component may be soldered to a conductive strand in a
pocket in accordance with an embodiment.
DETAILED DESCRIPTION
[0019] Items may include fabric. A cross-sectional side view of
illustrative woven fabric 12 is shown in FIG. 1. As shown in FIG.
1, fabric 12 may include strands 20 such as warp strands 20A and
weft strands 20B. In the illustrative configuration of FIG. 1,
fabric 12 has a single layer of woven strands 20. Multi-layer
fabric constructions may be used for fabric 12 if desired.
[0020] As shown in FIG. 2, fabric 12 may be a knit fabric. In the
illustrative configuration of FIG. 2, fabric 12 has a single layer
of knit strands 20 that form horizontally extending rows of
interlocking loops (courses 22) and vertically extending wales 24.
Other types of knit fabric may be used in item 10, if desired.
[0021] An illustrative fabric-based item is shown in FIG. 3.
Fabric-based item 10 may be an electronic device or an accessory
for an electronic device such as a laptop computer, a computer
monitor containing an embedded computer, a tablet computer, a
cellular telephone, a media player, or other handheld or portable
electronic device, a smaller device such as a wrist-watch device, a
pendant device, a headphone or earpiece device, a device embedded
in eyeglasses or other equipment worn on a user's head, or other
wearable or miniature device, a television, a computer display that
does not contain an embedded computer, a gaming device, a
navigation device, a remote control, an embedded system such as a
system in which fabric-based item 10 is mounted in a kiosk, in an
automobile, airplane, or other vehicle, other electronic equipment,
or may be equipment that implements the functionality of two or
more of these devices. If desired, item 10 may be a removable
external case for electronic equipment, may be a strap, may be a
wrist band or head band, may be a removable cover for a device, may
be a case or bag that has straps or that has other structures to
receive and carry electronic equipment and other items, may be a
necklace or arm band, may be a wallet, sleeve, pocket, or other
structure into which electronic equipment or other items may be
inserted, may be part of a chair, sofa, or other seating (e.g.,
cushions or other seating structures), may be part of an item of
clothing or other wearable item (e.g., a hat, belt, wrist band,
headband, sock, glove, shirt, pants, etc.), or may be any other
suitable fabric-based item.
[0022] Item 10 may include intertwined strands of material that
form fabric 12. Fabric 12 may form all or part of a housing wall or
other layer in an electronic device, may form internal structures
in an electronic device, or may form other fabric-based structures.
Item 10 may be soft (e.g., item 10 may have a fabric surface that
yields to a light touch), may have a rigid feel (e.g., the surface
of item 10 may be formed from a stiff fabric), may be coarse, may
be smooth, may have ribs or other patterned textures, and/or may be
formed as part of a device that has portions formed from non-fabric
structures of plastic, metal, glass, crystalline materials,
ceramics, or other materials.
[0023] The strands of material in fabric 12 may be single-filament
strands (sometimes referred to as fibers or monofilaments), may be
yarns or other strands that have been formed by intertwining
multiple filaments (multiple monofilaments) of material together,
or may be other types of strands (e.g., tubing that carries fluids
such as gases or liquids). The strands may include extruded strands
such as extruded monofilaments and yarn formed from multiple
extruded monofilaments. Monofilaments for fabric 12 may include
polymer monofilaments and/or other insulating monofilaments and/or
may include bare wires and/or insulated wires. Monofilaments formed
from polymer cores with metal coatings and monofilaments formed
from three or more layers (cores, intermediate layers, and one or
more outer layers each of which may be insulating and/or
conductive) may also be used.
[0024] Yarns in fabric 12 may be formed from polymer, metal, glass,
graphite, ceramic, natural materials as cotton or bamboo, or other
organic and/or inorganic materials and combinations of these
materials. Conductive coatings such as metal coatings may be formed
on non-conductive material. For example, plastic yarns and
monofilaments in fabric 12 may be coated with metal to make them
conductive. Reflective coatings such as metal coatings may be
applied to make yarns and monofilaments reflective. Yarns may be
formed from a bundle of bare metal wires or metal wire intertwined
with insulating monofilaments (as examples).
[0025] Strands of material may be intertwined to form fabric 12
using intertwining equipment such as weaving equipment, knitting
equipment, or braiding equipment. Intertwined strands may, for
example, form woven fabric, knit fabric, braided fabric, etc.
Conductive strands and insulating strands may be woven, knit,
braided, or otherwise intertwined to form contact pads that can be
electrically coupled to conductive structures in item 10 such as
the contact pads of an electrical component. The contacts of an
electrical component may also be directly coupled to an exposed
metal segment along the length of a conductive yarn or
monofilament.
[0026] Conductive and insulating strands may also be woven, knit,
or otherwise intertwined to form conductive paths. The conductive
paths may be used in forming signal paths (e.g., signal buses,
power lines, etc.), may be used in forming part of a capacitive
touch sensor electrode, a resistive touch sensor electrode, or
other input-output device, or may be used in forming other
patterned conductive structures. Conductive structures in fabric 12
may be used in carrying power signals, digital signals, analog
signals, sensor signals, control signals, data, input signals,
output signals, or other suitable electrical signals.
[0027] Item 10 may include additional mechanical structures 14 such
as polymer binder to hold strands in fabric 12 together, support
structures such as frame members, housing structures (e.g., an
electronic device housing), and other mechanical structures.
[0028] Circuitry 16 may be included in item 10. Circuitry 16 may
include electrical components that are coupled to fabric 12,
electrical components that are housed within an enclosure formed by
fabric 12, electrical components that are attached to fabric 12
using welds, solder joints, adhesive bonds (e.g., conductive
adhesive bonds such as anisotropic conductive adhesive bonds or
other conductive adhesive bonds), crimped connections, or other
electrical and/or mechanical bonds. Circuitry 16 may include metal
structures for carrying current, electrical components such as
integrated circuits, sensors (e.g., sensors 26), light-emitting
diodes (see, e.g., light-emitting diodes 28), battery 30, and other
components 32 (e.g., controller circuitry for applying currents
and/or magnetic fields to materials, and other electrical devices).
Control circuitry in circuitry 16 (e.g., control circuitry formed
from one or more integrated circuits such as microprocessors,
microcontrollers, application-specific integrated circuits, digital
signal processors, etc.) may be used to control the operation of
item 10 by controlling electrically controllable (electrically
adjustable) components in circuitry 16 and may be used to support
communications with item 18 and/or other devices.
[0029] Item 10 may interact with additional items such as
electronic equipment 18. Items such as equipment 18 may be attached
to item 10 or item 10 and equipment (item) 18 may be separate items
that are configured to operate with each other (e.g., when one item
is a case and the other is a device that fits within the case,
etc.). Circuitry 16 may include antennas and other structures for
supporting wireless communications with item 18. Item 18 may also
interact with item 10 using a wired communications link or other
connection that allows information to be exchanged.
[0030] In some situations, item 18 may be an electronic device such
as a cellular telephone, computer, or other portable electronic
device and item 10 may form a cover, case, bag, or other structure
that receives the electronic device in a pocket, an interior
cavity, or other portion of item 10. In other situations, item 18
may be a wrist-watch device or other electronic device and item 10
may be a strap or other fabric-based item that is attached to item
18 (e.g., item 10 and item 18 may be used together to form a
fabric-based item such as a wristwatch with a strap). In still
other situations, item 10 may be an electronic device (e.g., a
wearable device such as a wrist device, clothing, etc.), fabric 12
may be used in forming the electronic device, and additional items
18 may include accessories or other devices that interact with item
10. Signal paths formed from conductive yarns and monofilaments
(e.g., insulated and bare wires) may be used to route signals in
item 10 and/or item(s) 18.
[0031] The fabric that makes up item 10 may be formed from strands
that are intertwined using any suitable intertwining equipment.
With one suitable arrangement, which may sometimes be described
herein as an example, fabric 12 may be woven fabric formed using a
weaving machine. In this type of illustrative configuration, fabric
may have a plain weave, a basket weave, a satin weave, a twill
weave, or variations of these weaves, may be a three-dimensional
woven fabric, or may be other suitable fabric. With other suitable
arrangements, fabric 12 is knit or braided.
[0032] Fabric-based item 10 may include non-fabric materials (e.g.,
structures such as structures 14 that are formed from plastic,
metal, glass, ceramic, crystalline materials such as sapphire,
etc.). These materials may be formed using molding operations,
extrusion, machining, laser processing, and other fabrication
techniques. In some configurations, some or all of fabric-based
item 10 may include one or more layers of material. The layers in
item 10 may include layers of polymer, metal, glass, fabric,
adhesive, crystalline materials, ceramic, substrates on which
components have been mounted, patterned layers of material, layers
of material containing patterned metal traces, thin-film devices
such as transistors, and/or other layers.
[0033] FIG. 4 is a diagram of illustrative equipment that may be
used in forming fabric-based item 10. As shown in FIG. 4, this
equipment may include cutting tools such as cutting equipment 34.
Cutting equipment such as a trimming tool in equipment 34 (e.g., a
laser cutting tool, a mechanical cutting tool, or other equipment
for cutting yarn) may be used in cutting fabric 12. For example, a
laser processing tool may be used to scan a beam of focused laser
light across the surface of fabric 12, thereby cutting (i.e.,
cutting by thermal dissociation, ablation, etc.) through portions
of fabric 12.
[0034] Packaging equipment 36 may include a soldering tool (e.g., a
pick and place tool or other equipment for soldering integrated
circuits and other components to conductive strands in fabric 12 in
item 10). Equipment 36 may also include injection molding
equipment, an encapsulation tool, or other equipment for molding or
otherwise forming desired encapsulation layer structures (mold
caps) on circuits 16 of item 10. Equipment 36 may, for example,
include equipment for depositing liquid polymer material that forms
a solid encapsulation layer after cooling and/or curing.
[0035] Intertwining equipment such as tool (equipment) 38 may
include equipment such as weaving equipment, knitting equipment,
and/or braiding equipment. Tool 38 may be used in forming fabric 12
from strands of material.
[0036] Additional equipment such as equipment 40 may be used to
help form fabric 12, strands of material for fabric 12 (e.g.,
strands 20 of FIGS. 1 and 2), circuitry that is coupled to
conductive structures in fabric 12, electrical components, housing
structures, and other structures for forming item 10. Equipment 40
may, for example, include equipment for laminating fabric to layers
of plastic, metal, and/or other materials, equipment for coating
strands of material and/or for depositing layers of material on
fabric 12, equipment for extruding strands of material, equipment
for placing fluid in tubing, equipment for mounting integrated
circuits, light-emitting diodes, sensors, buttons, and other
electrical circuitry to fabric 12 and/or other portions of item 10,
equipment for inserting structures into fabric 12 during
fabrication of fabric 12, machining equipment for machining parts
of item 10, robotic assembly equipment, and/or other equipment for
forming item 10. The equipment of FIG. 4 may be used to form
strands 20, to form fabric 12, to process fabric 12, to integrate
circuitry 16, fabric 12, and/or additional structures 14 into item
10, and/or to perform other fabrication and processing operations
on item 10.
[0037] A cross-sectional side view of an illustrative electrical
component mounted to fabric in item 10 is shown in FIG. 5.
Electrical components in item 10 such as illustrative electrical
component 42 of FIG. 5 (e.g., an electrical component that forms
part of circuitry 16 of FIG. 3) may include discrete electrical
components such as resistors, capacitors, and inductors, may
include connectors, may include input-output devices such as
switches, buttons, light-emitting components such as light-emitting
diodes, audio components such as microphones and speakers,
vibrators (e.g., piezoelectric actuators that can vibrate),
solenoids, electromechanical actuators, motors, and other
electromechanical devices, microelectromechanical systems (MEMs)
devices, pressure sensors, light detectors, proximity sensors
(light-based proximity sensors, capacitive proximity sensors,
etc.), force sensors (e.g., piezoelectric force sensors), strain
gauges, moisture sensors, temperature sensors, accelerometers,
gyroscopes, compasses, magnetic sensors (e.g., Hall effect sensors
and magnetoresistance sensors such as giant magnetoresistance
sensors), touch sensors, and other sensors, components that form
displays, touch sensors arrays (e.g., arrays of capacitive touch
sensor electrodes to form a touch sensor that detects touch events
in two dimensions), and other input-output devices, electrical
components that form control circuitry such as non-volatile and
volatile memory, microprocessors, application-specific integrated
circuits, system-on-chip devices, baseband processors, wired and
wireless communications circuitry, and other integrated circuits.
Electrical components such as component 42 may be bare
semiconductor dies (e.g., laser dies, light-emitting diode dies,
integrated circuits, etc.) or packaged components (e.g.
semiconductor dies or other devices packaged within plastic
packages, ceramic packages, or other packaging structures).
[0038] In the example of FIG. 5, component 42 is electrically
coupled to one or more conductive strands in fabric 12 such as
conductive strand 20C. Component 42 may have one or more electrical
terminals (e.g., protruding leads, planar contacts, etc.) such as
pad 44. Solder or other conductive material 46 may be used to
couple pad 44 to conductive strand 20C. In some arrangements,
component 42 may have two or more terminals (e.g., two or more
contact pads 44) and each terminal may be coupled to a respective
conductive strand 20C in fabric 12.
[0039] In some arrangements, it may be desirable to mount
components such as component 42 completely or partially within
fabric 12 rather than on the outer surface of fabric 12. As shown
in FIG. 5, for example, component 42 may be at least partially
embedded within fabric 12 by mounting component 42 within a pocket
(e.g., a cavity) in fabric 12 such as pocket 54. Pocket 54 may be
formed during weaving operations (or other fabric assembly
operations). In particular, intertwining equipment 38 (e.g.,
weaving equipment, knitting equipment, braiding equipment, or other
suitable intertwining equipment) may form pocket 54 by creating a
space between two or more layers of fabric 12 (e.g., between upper
fabric layer 12-1 and lower fabric layer 12-2). Pocket 54 may help
orient component 42 so that solder pads 44 (and solder 46 on pads
44) are aligned with respective conductive strands 20C. During
operation of item 10, conductive strands 20C may carry signals
between component 42 and other circuitry in item 10.
[0040] Conductive strands in fabric 12 such as conductive strand
20C may form part of upper fabric layer 12-1, lower fabric layer
12-2, or other suitable fabric layer in fabric 12. One or more of
conductive strands 20C may pass through pocket 54. Component 42 may
be mechanically and electrically coupled to the portion of
conductive strand 20C in pocket 54. Component 42 may be mounted to
strand 20C during weaving operations or after weaving
operations.
[0041] It may be desired to cover component 42 with one or more
layers of material. For example, in configurations in which
component 42 is sensitive to moisture, it may be desirable to seal
component 42 within a waterproof material. In configurations in
which component 42 emits light, it may be desirable to cover
component 42 with a light-diffusing layer such as a polymer layer
including metal oxide particles (e.g., white particles of titanium
dioxide), other inorganic particles, organic particles, colored
particles, or other light-diffusing particles. Opaque materials
and/or materials with other optical, mechanical, and/or electrical
properties may also be used to cover some or all of component
42.
[0042] In the illustrative configuration of FIG. 5, a polymer such
as polymer 50 has been used to cover and encapsulate component 42,
solder pad 44, solder 46, and adjacent portions of conductive
strand 20C, thereby protecting component 42 from moisture and other
environmental contaminants. Polymer 50 may be a thermoset or
thermoplastic polymer and may sometimes be referred to as a mold
cap (e.g., when polymer 50 is formed by molding plastic over
component 42). If desired, other materials may be used to cover
electrical components such as component 42. For example, polymer 50
may be a light-diffusing material such as a white potting compound
(e.g., a polymer with white light scattering particles).
Arrangements in which polymer 50 is used to encapsulate and protect
electrical component 42 may sometimes be described herein as an
illustrative example.
[0043] With one illustrative arrangement, which is sometimes
described herein as an example, pocket 54 may be created using
intertwining equipment 38. Initially, pocket 54 may be free of
electrical components and may be fully enclosed by surrounding
portions of fabric 12. After weaving, cutting equipment 34 may be
used to cut an opening such as opening 56 in fabric 12 (e.g., in
upper layer 12-1 of fabric 12) to open pocket 54 and expose
conductive strands 20C. After removing the portion of fabric 12
covering pocket 54, packaging equipment 36 (e.g., a pick-and-place
tool, other soldering tool, or other mounting equipment) may be
used to solder or otherwise mount component 42 to conductive strand
20C. Packaging equipment 36 (e.g., an encapsulation tool) may then
be used to encapsulate component 42 by injecting polymer 50 into
pocket 54.
[0044] Polymer 50 may surround component 42, pad 44, solder 46, and
portions of conductive strands 20C. Some of polymer 50 that is
injected into pocket 54 may interlock with portions of fabric 12.
For example, fabric 12 may have protruding edges such as edges 52
resulting from cutting opening 56 in fabric 12. When polymer 50 is
injected into pocket 54, some of polymer 50 may surround (e.g.,
capture) protruding edges 52 of fabric 12. Polymer 50 may also
interlock with pocket walls 54W surrounding pocket 54. This helps
provide mechanical strength to the encapsulation provided by
polymer 50 when polymer 50 solidifies.
[0045] In addition to protecting component 42 from moisture and
other environmental contaminants, polymer 50 may be used to provide
strain relief to conductive strands such as conductive strands 20C.
In particular, polymer 50 may surround portions of conductive
strands 20C in pocket 54, thereby keeping strands 20C separate from
one another and helping to prevent component 42 from breaking off
of conductive strands 20C.
[0046] In some arrangements, fabric 12 may be a stretchable fabric
(e.g., for forming a wrist strap or other strap that is worn on a
user's body). Stretchable fabrics may be stretched during weaving
and may be stretched repeatedly during use. The presence of polymer
50 around conductive strands 20C and component 42 may help prevent
conductive strands 20C and component 42 from being damaged when
fabric 12 is stretched.
[0047] If desired, openings may be formed in fabric 12 on opposing
sides of pocket 54. This type of arrangement is illustrated in FIG.
6. As shown in FIG. 6, fabric 12 may have a first opening such as
opening 56A formed in upper layer 12-1 of fabric 12 and a second
opening such as opening 56B formed in lower layer 12-2 of fabric
12. If desired, fabric 12 may have one or more layers between upper
fabric layer 12-1 and lower fabric layer 12-2.
[0048] Openings 56A and 56B may be formed using cutting equipment
34. Openings 56A and 56B may have the same dimensions or may have
different dimensions. For example, in arrangements where openings
56A and 56B are circular, opening 56A may have a first diameter D1
and opening 56B may have a second diameter D2. D2 may be larger
than D1, or D1 may be larger than D2. If desired, openings 56A and
56B may be non-circular (e.g., may have a square shape, rectangular
shape, oval shape, or any other suitable shape) and/or opening 56A
may have a different shape from opening 56B.
[0049] Cutting openings 56A and 56B in fabric 12 may result in
upper protruding edges 52A and lower protruding edges 52B. Polymer
material 50 may extend up and over protruding edges 52A and 52B,
thereby interlocking with fabric 12. Polymer material 50 may also
interlock with fabric walls 54W surrounding pocket 54.
[0050] As in the example of FIG. 5, polymer 50 of FIG. 6 may be
used to provide environmental protection for component 42, may be
used to provide strain relief to conductive strands such as
conductive strands 20C, may be used to keep strands 20C separate
from one another, may help prevent component 42 from breaking off
of conductive strands 20C, and may help prevent conductive strands
20C and component 42 from being damaged when fabric 12 is
stretched.
[0051] It can be challenging to mount components such as component
42 in fabric. If care is not taken, the fabric may be bulky or
aesthetically unappealing, and/or the component may be susceptible
to falling off or becoming damaged.
[0052] FIGS. 7-12 illustrate various steps that may be taken during
manufacturing to ensure that component 42 may be securely and
discretely mounted in fabric 12. FIGS. 7-9 show illustrative steps
involved in forming item 10 of FIG. 5. FIGS. 10-12 show
illustrative steps involved in forming item 10 of FIG. 6.
[0053] As shown in FIG. 7, intertwining equipment 38 may be used to
form fabric 12 having a pocket such as pocket 54. Pocket 54 may be
formed by creating a gap between first and second layers of fabric
12 such as layers 12-1 and 12-2. Pocket 54 may be fully enclosed by
surrounding portions of fabric 12.
[0054] During weaving, a shim structure such as shim structure 58
may be inserted into pocket 54 before pocket 54 is completely
closed up. This may be achieved by leaving the shed (e.g., the
separation between upper and lower warp strands) open temporarily
while shim 58 is inserted into pocket 54. After shim 58 is inserted
into pocket 54, equipment 38 may resume weaving by closing up
pocket 54 and completing the remaining portions of fabric 12.
[0055] Shim 58 may be used as a backstop that prevents laser light
or other cutting tools from cutting all the way through fabric 12.
In particular, shim 58 of FIG. 7 may ensure that laser light or
other cutting tools penetrate only through upper fabric layer 12-1
and not through lower fabric layer 12-2. Shim 58 may be a thin
plate of metal (e.g., brass or other suitable metal), fiber glass,
and/or any other suitable material that is capable of absorbing
laser light and/or capable of preventing other cutting tools from
cutting past shim 58. When shim 58 is located in pocket 54, shim 58
may overlap conductive strand 20C in pocket 54.
[0056] After enclosing shim 58 in pocket 54, cutting equipment may
be used to remove a portion of fabric 12 over pocket 54. This step
is shown in FIG. 8. As shown in FIG. 8, cutting tool 34 (e.g., a
laser cutting tool, a die cutting tool, a knife cutting tool, or
other suitable cutting tool) may be used to cut opening 56 in upper
layer 12-1. If desired, cutting equipment 34 may include a camera
and/or other sensor that is used to monitor for location-specific
registration elements on strands 20 of fabric 12 (e.g., stitches,
marks, magnetic tags, conductive dots, and/or other markers that
are incorporated into fabric 12 to delineate the portions of fabric
12 where opening 56 is to be formed). This may enhance cutting
accuracy and thereby ensure that opening 56 is precisely in the
appropriate location.
[0057] The presence of shim 58 prevents cutting tool 34 from
cutting into lower fabric layer 12-2. For example, in arrangements
where cutting tool 34 is a laser, shim 58 may absorb laser light 80
so that it does not penetrate into lower fabric layer 12-1. Laser
light 80 may be a beam of focused laser light that is scanned
across the surface of fabric 12 to create opening 56 in upper
fabric layer 12-1. Opening 56 may expose conductors in pocket 54
such as conductive strand 20C. Lower fabric layer 12-2 may remain
intact (e.g., without openings) under shim 58 and pocket 54. By
cutting opening 56 in upper fabric layer 12-1, upper fabric layer
12-1 may be left with protruding edges 52. Protruding edges 52 may
surround opening 56.
[0058] After forming opening 56 in upper fabric layer 12-1, shim 58
may be removed and component 42 may be mounted in pocket 54. This
step is shown in FIG. 9. Packaging equipment 36 of FIG. 4 (e.g., a
pick-and-place tool, other soldering tool, or other mounting
equipment) may be used to insert component 42 through opening 56
and solder or otherwise mount component 42 to conductive strand 20C
in pocket 54. As shown in FIG. 9, solder 46 may mechanically and
electrically couple pad 44 of component 42 to conductive strand
20C. Packaging equipment 36 (e.g., an encapsulation tool) may then
be used to encapsulate component 42 by injecting polymer 50 into
pocket 54, thereby forming an encapsulated component 42 of the type
shown in FIG. 5. The use of shim 58 during manufacturing of item 10
may allow for one side of fabric 12 (e.g., the side of fabric 12
formed by lower layer 12-2) to remain smooth and intact, completely
overlapping component 42.
[0059] FIGS. 10-12 show illustrative steps involved in forming item
10 of FIG. 6.
[0060] As shown in FIG. 10, intertwining equipment 38 may be used
to form fabric 12 having a pocket such as pocket 54. Pocket 54 of
FIG. 10 may be formed by creating a gap between first and second
layers of fabric 12 such as layers 12-1 and 12-2. If desired, there
may be additional fabric layers between layers 12-1 and 12-2.
Pocket 54 may be fully enclosed by surrounding portions of fabric
12.
[0061] During weaving, shim structures such as shim structures 58A
and 58B may be inserted into pocket 54 before pocket 54 is
completely closed up. This may be achieved by leaving the shed
(e.g., the separation between upper and lower warp strands) open
temporarily while shims 58A and 58B are inserted into pocket 54.
After shims 58A and 58B are inserted into pocket 54, equipment 38
may resume weaving by closing up pocket 54 and completing the
remaining portions of fabric 12. Shims 58A and 58B may be separate
shim structures or may be different portions of one structure
(e.g., a U-shaped shim structure).
[0062] Shims 58A and 58B may be used as backstops that prevent
laser light or other cutting tools from cutting all the way through
fabric 12. In particular, shim 58A of FIG. 10 may ensure that laser
light or other cutting tools penetrate only through upper fabric
layer 12-1 and not through lower fabric layer 12-2, whereas shim
58B of FIG. 10 may ensure that laser light or other cutting tools
penetrate only through lower fabric layer 12-2 and not through
upper fabric layer 12-1. Shims 58A and 58B may be thin plates of
metal (e.g., brass or other suitable metal), fiber glass, and/or
any other suitable material that is capable of absorbing laser
light and/or capable of preventing other cutting tools from cutting
past shims 58A and 58B. Shims 58A and 58B may have the same size or
may have different sizes and may be formed from the same material
or different materials. When shims 58A and 58B are located in
pocket 54, shims 58A and 58B may overlap conductive strand 20C in
pocket 54 (e.g., conductive strand 20C may be interposed between
shims 58A and 58B).
[0063] After enclosing shims 58A and 58B in pocket 54, cutting
equipment may be used to remove portions of fabric 12 over pocket
54. This step is shown in FIG. 11. As shown in FIG. 11, cutting
tool 34 (e.g., a laser cutting tool, a die cutting tool, a knife
cutting tool, or other suitable cutting tool) may be used to cut
opening 56A in upper layer 12-1 and opening 56B in lower layer
12-2. Openings 56A and 56B may be cut at the same time or may be
cut at different times. If desired, cutting equipment 34 may
include a camera and/or other sensor that is used to monitor for
location-specific registration elements on strands 20 of fabric 12
(e.g., stitches, marks, magnetic tags, conductive dots, and/or
other markers that are incorporated into fabric 12 to delineate the
portions of fabric 12 where openings 56A and 56B are to be formed).
This may enhance cutting accuracy and thereby ensure that openings
56A and 56B are precisely in the appropriate locations.
[0064] The presence of shim 58A prevents cutting tool 34 from
cutting into lower fabric layer 12-2, and the presence of shim 58B
prevents cutting tool 34 from cutting into upper fabric layer 12-1.
For example, in arrangements where cutting tool 34 is a laser,
shims 58A and 58B may absorb laser light 80 so that it does not
penetrate past shims 58A and 58B, respectively. Laser light 80 may
be a beam of focused laser light that is scanned across the surface
of fabric 12 to create opening 56A in upper fabric layer 12-1 and
opening 56B in lower fabric layer 12-2. Openings 56A and 56B may
expose conductors in pocket 54 such as conductive strand 20C. The
use of shims 58A and 58B may allow openings 56A and 56B to have
different dimensions and/or different cross-sectional shapes. For
example, opening 56A may be round with one set of dimensions,
whereas opening 56B may be rectangular with a different set of
dimensions. This is merely illustrative, however. If desired,
openings 56A and 56B may have the same dimensions and/or
cross-sectional shape.
[0065] After forming opening 56A in upper fabric layer 12-1 and
opening 56B in lower fabric layer 12-2, shims 58A and 58B may be
removed and component 42 may be mounted in pocket 54. This step is
shown in FIG. 12. Packaging equipment 36 of FIG. 4 (e.g., a
pick-and-place tool, other soldering tool, or other mounting
equipment) may be used to solder or otherwise mount component 42 to
conductive strand 20C in pocket 54. As shown in FIG. 12, solder 46
may mechanically and electrically couple pad 44 of component 42 to
conductive strand 20C. Packaging equipment 36 (e.g., an
encapsulation tool) may then be used to encapsulate component 42 by
injecting polymer 50 into pocket 54, thereby forming an
encapsulated component 42 of the type shown in FIG. 6. The portion
of pocket 54 above component 42 and the portion of pocket 54 below
component 42 may be filled with the same or different polymer 50
and/or may be filled with polymer 50 at the same time or at
different times.
[0066] The foregoing is merely illustrative and various
modifications can be made to the described embodiments. The
foregoing embodiments may be implemented individually or in any
combination.
* * * * *