U.S. patent application number 16/105531 was filed with the patent office on 2020-02-20 for proximity sensor module with two sensors.
The applicant listed for this patent is LITE-ON SINGAPORE PTE. LTD.. Invention is credited to SENG-YEE CHUA, ARAKCRE DINESH GOPALASWAMY, GUANG-LI SONG.
Application Number | 20200057158 16/105531 |
Document ID | / |
Family ID | 69523889 |
Filed Date | 2020-02-20 |
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United States Patent
Application |
20200057158 |
Kind Code |
A1 |
CHUA; SENG-YEE ; et
al. |
February 20, 2020 |
PROXIMITY SENSOR MODULE WITH TWO SENSORS
Abstract
A proximity sensor module with two sensors, including a package
housing, a circuit substrate, an light emitter and a sensing
assembly. The package housing includes a first package structure, a
second package structure, a partition structure, a first
accommodating space defined by the first package structure and the
partition structure, and a second accommodation space defined by
the second package structure and the partition structure. The light
emitter is arranged in the first accommodating space and is
disposed on the circuit substrate. The sensing assembly includes a
first sensor and a second sensor. The first sensor and the second
sensor are arranged in the second accommodating space, and the
first sensor is farther from the light emitter than the second
sensor.
Inventors: |
CHUA; SENG-YEE; (SINGAPORE,
SG) ; GOPALASWAMY; ARAKCRE DINESH; (Bangalore,
IN) ; SONG; GUANG-LI; (SINGAPORE, SG) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LITE-ON SINGAPORE PTE. LTD. |
MIDVIEW CITY |
|
SG |
|
|
Family ID: |
69523889 |
Appl. No.: |
16/105531 |
Filed: |
August 20, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01S 7/4811 20130101;
G01S 7/4813 20130101; G01S 7/4816 20130101; G01S 17/04
20200101 |
International
Class: |
G01S 17/02 20060101
G01S017/02; G01S 7/481 20060101 G01S007/481 |
Claims
1. A proximity sensor module with two sensors, comprising: a
package housing including a first package structure, a second
package structure, a partition structure, a first accommodating
space defined by the first package structure and the partition
structure, and a second accommodation space defined by the second
package structure and the partition structure; a circuit substrate
supporting the first package structure and the second package
structure; a light emitter arranged in the first accommodating
space and disposed on the circuit substrate; and a sensing assembly
including a first sensor and a second sensor arranged in the second
accommodating space and disposed on the circuit substrate, the
first sensor being farther from the light emitter than the second
sensor; wherein the first sensor is configured to receive a first
reflected light emitted by the light emitter and reflected by a
near-distance object, and the second sensor is configured to
receive a second reflected light emitted from the light emitter and
reflected by a far-distance object.
2. The proximity sensor module with two sensors according to claim
1, further comprising a first lens arranged in the first
accommodating space and disposed on the circuit substrate, wherein
the first lens covers the light emitter.
3. The proximity sensor module with two sensors according to claim
1, further comprising an optical isolator disposed on the partition
structure for limiting the sensing angle of the second sensor.
4. The proximity sensor module with two sensors according to claim
1, wherein the light emitter is an infrared light emitting
diode.
5. The proximity sensor module with two sensors according to claim
1, further comprising an optical path correcting element arranged
in the second accommodating space, wherein the sensing angle of the
first sensor is adjusted to shift toward a direction of the light
emitter by the optical path correcting element, and the sensing
angle of the second sensor is adjusted to shift away from the
direction of the light emitter by the optical path correcting
element.
6. The proximity sensor module with two sensors according to claim
5, wherein the optical path correcting element is a second lens
covering the first sensor and the second sensor, wherein the first
sensor and the second sensor respectively are disposed on opposite
sides of the main axis of the second lens.
7. A proximity sensor module with two sensors, comprising: a
package housing including a first package structure, a second
package structure, a first partition structure, a second partition
structure, a first accommodating space defined by the first package
structure and the first partition structure, a second accommodation
space defined by the first partition structure and the second
partition structure, and a third accommodating space defined by the
second partition structure and the second package structure; a
circuit substrate supporting the first package structure and the
second package structure; a light emitter arranged in the first
accommodating space and disposed on the circuit substrate; a
sensing assembly including a first sensor and a second sensor, the
first sensor being arranged in the second accommodating space and
disposed on the circuit substrate, the second sensor being arranged
in the third accommodating space and disposed on the circuit
substrate, and the first sensor being closer to the light emitter
than the second sensor; and an optical isolator disposed on the
second partition structure for limiting the sensing angle of the
second sensor; wherein the first sensor is configured to receive a
first reflected light emitted from the light emitter and reflected
by a near-distance object, and the second sensor is configured to
receive a second reflected light emitted from the light emitter and
reflected by a far-distance object.
8. The proximity sensor module with two sensors according to claim
7, further comprising a first lens arranged in the first
accommodating space and disposed on the circuit substrate, wherein
the first lens covers the light emitter.
9. The proximity sensor module with two sensors according to claim
7, further comprising an optical isolator disposed on the second
partition structure for limiting the sensing angle of the second
sensor.
10. The proximity sensor module with two sensors according to claim
7, wherein the light emitter is an infrared light emitting diode.
Description
FIELD OF THE DISCLOSURE
[0001] The present disclosure relates to a proximity sensor module,
and more particularly to a proximity sensor module with two
sensors.
BACKGROUND OF THE DISCLOSURE
[0002] The proximity sensor module is provided in the display
screen of the mobile device to detect the user's face, ears, or
hair, and would temporarily turn off the display screen when the
near-distance object is detected, thereby saving battery power. In
addition, during a call, the proximity sensor module may also
prevent the mobile devices from being mistouched by the user's ears
or face, which may interfere with the ongoing call.
[0003] Proximity sensors with small or no exterior openings are in
demand in the mobile device market. However, in a proximity sensor
with small or no exterior openings, the far-infrared signal emitted
outward by the proximity sensor from the inner side of the display
screen would be significantly decreased, and the cross-talk effect
caused by the signals being reflected from the inner side of the
display screen would be increased.
[0004] Moreover, conventional mobile devices generally use a
surface coated glass panel, which is coated with various color
coating and functional coating according to particular
implementation, as a display screen. However, the coated glass
panel has higher transmittance and reflectivity than a non-coated
glass panel or an opaque panel. As a result, a stronger cross-talk
effect is produced, and the cross-talk effect reduces the
signal-to-noise ratio detected by the proximity sensor and makes
the proximity sensor fail to effectively detect nearby objects.
[0005] In view of the above reasons, how the proximity sensor can
be enabled to sense the near-distance object in low far infrared
transmission efficiency and high cross-talk effect by the
improvement of the structural design has become a project to be
solved.
SUMMARY OF THE DISCLOSURE
[0006] In response to the above-referenced technical inadequacies,
the present disclosure provides a proximity sensor module with two
sensors, one of the two sensors receives the reflected light
reflected by a near-distance test object, and the other sensor
receives the reflected light reflected by a far-distance object, so
that the proximity sensor module with two sensors can detect the
near-distance object even in a high cross-talk effect
environment.
[0007] In one aspect, the present disclosure provides a proximity
sensor module with two sensors including a package housing, a
circuit substrate, a light emitter, and a sensing assembly. The
package housing includes a first package structure, a second
package structure, a partition structure, a first accommodating
space which is defined by the first package structure and the
partition structure, and a second accommodation space which is
defined by the second package structure and the partition
structure. The circuit substrate supports the first package
structure and the second package structure. The light emitter is
arranged in the first accommodating space and is disposed on the
circuit substrate. The sensing assembly includes a first sensor and
a second sensor. The first sensor and the second sensor are
arranged in the second accommodating space, and the first sensor is
farther from the light emitter than the second sensor. The first
sensor is configured to receive a first reflected light emitted
from the light emitter and reflected by a near-distance object, and
the second sensor is configured to receive a second reflected light
emitted from the light emitter and reflected by a far-distance
object.
[0008] In one aspect, the present disclosure provides a proximity
sensor module with two sensors including a package housing, a
circuit substrate, a light emitter, a sensing assembly, and an
optical isolator. The package housing includes a first package
structure, a second package structure, a first partition structure,
a second partition structure, a first accommodating space which is
defined by the first package structure and the first partition
structure, a second accommodation space which is defined by the
first partition structure and the second partition structure, and a
third accommodation space which is defined by the second package
structure and the second partition structure. The circuit substrate
supports the first package structure and the second package
structure. The light emitter is arranged in the first accommodating
space and is disposed on the circuit substrate. The sensing
assembly includes a first sensor and a second sensor, the first
sensor is arranged in the second accommodating space and is
disposed on the circuit substrate, the second sensor is arranged in
the third accommodating space and is disposed on the circuit
substrate, and the first sensor is closer to the light emitter than
the second sensor. The optical isolator is disposed on the second
partition structure for limiting the sensing angle of the second
sensor. The first sensor is for receiving a first reflected light
emitted from the light emitter and reflected by a near-distance
object, and the second sensor for receiving a second reflected
light emitted from the light emitter and reflected by a
far-distance object.
[0009] Therefore, the first sensor can receive a first reflected
light emitted from the light emitter and reflected by a
near-distance object, and the second sensor can receive a second
reflected light emitted from the light emitter and reflected by a
far-distance object by the features of "the light emitter is
arranged in the first accommodating space and is disposed on the
circuit substrate" and "the first sensor and the second sensor are
arranged in the second accommodating space and the first sensor is
farther from the light emitter than the second sensor".
[0010] These and other aspects of the present disclosure will
become apparent from the following description of the embodiment
taken in conjunction with the following drawings and their
captions, although variations and modifications therein may be
affected without departing from the spirit and scope of the novel
concepts of the disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The present disclosure will become more fully understood
from the detailed description and the accompanying drawings, in
which:
[0012] FIG. 1 is a cross-sectional view of a mobile device using a
proximity sensor module with two sensors according to a first
embodiment of the present disclosure.
[0013] FIG. 2 is a cross-sectional view of a mobile device using a
proximity sensor module with two sensors according to a second
embodiment of the present disclosure.
[0014] FIG. 3 is a cross-sectional view of a mobile device using a
proximity sensor module with two sensors according to a third
embodiment of the present disclosure.
[0015] FIG. 4 shows a signal-to-noise ratio of the proximity sensor
module with two sensors according to a third embodiment of the
present disclosure during operation.
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0016] The present disclosure is more particularly described in the
following examples that are intended as illustrative only since
numerous modifications and variations therein will be apparent to
those skilled in the art. Like numbers in the drawings indicate
like components throughout the views. As used in the description
herein and throughout the claims that follow, unless the context
clearly dictates otherwise, the meaning of "a", "an", and "the"
includes plural reference, and the meaning of "in" includes "in"
and "on". Titles or subtitles can be used herein for the
convenience of a reader, which shall have no influence on the scope
of the present disclosure.
[0017] The terms used herein generally have their ordinary meanings
in the art. In the case of conflict, the present document,
including any definitions given herein, will prevail. The same
thing can be expressed in more than one way. Alternative language
and synonyms can be used for any term(s) discussed herein, and no
special significance is to be placed upon whether a term is
elaborated or discussed herein. A recital of one or more synonyms
does not exclude the use of other synonyms. The use of examples
anywhere in this specification including examples of any terms is
illustrative only, and in no way limits the scope and meaning of
the present disclosure or of any exemplified term. Likewise, the
present disclosure is not limited to various embodiments given
herein. Numbering terms such as "first", "second" or "third" can be
used to describe various components, signals or the like, which are
for distinguishing one component/signal from another one only, and
are not intended to, nor should be construed to impose any
substantive limitations on the components, signals or the like.
First Embodiment
[0018] Referring to FIG. 1, a first embodiment of the present
disclosure provides a cross-sectional view of a mobile device P1
using a proximity sensor module Z with two sensors according to a
first embodiment of the present disclosure. The proximity sensor
module Z is disposed inside of a panel M of the mobile device P1
and includes a package housing 1, a circuit substrate 2, a light
emitter 3, and a sensing assembly 4. In the first embodiment, the
panel M of the mobile device P1 using the proximity sensor module Z
is a surface-coated glass panel, but the present disclosure is not
limited thereto.
[0019] Moreover, the package housing 1 has a first package
structure 11, a second package structure 12, a partition structure
13, a first accommodating space R1 defined by the first package
structure 11 and the partition structure 13, and a second
accommodation space R2 defined by the second package structure 12
and the partition structure 13. The circuit substrate 2 supports
the first package structure 11 and the second package structure 12.
The light emitter 3 is arranged in the first accommodating space R1
and is disposed on the circuit substrate 2.
[0020] As shown in FIG. 1, the sensing assembly 4 includes a first
sensor 41 and a second sensor 42. The first sensor 41 and the
second sensor 42 are arranged in the second accommodating space R
and are disposed on the circuit substrate 2, and the first sensor
41 is farther from the light emitter 3 than the second sensor 42.
In addition, the first sensor 41 is for receiving a first reflected
light L1 emitted from the light emitter 3 and reflected by a
near-distance object, and the second sensor 42 is for receiving a
second reflected light L2 emitted from the light emitter 3 and
reflected by a far-distance object.
[0021] More particularly, since the second sensor 42 is adjacent to
the partition structure 13, the light from the side of the
partition structure 13 is blocked by the partition structure 13 and
may not be received by the second sensor 42. Therefore, a sensing
angle .phi.1 of the second sensor 42 which is adjacent to the side
of the partition structure 13 is limited. In other words, due to
the isolation of the partition structure 13, the second sensor may
be unable to receive the light emitted from the light emitter 3 and
reflected by the panel M. The view of the first sensor 41 is only
restricted by the second package structure 12 which is adjacent
thereto, so that a sensing angle .theta.1 of the first sensor 41
may cover the light from the side of the partition structure
13.
[0022] By the structures described above, most of the light that
the first sensor 41 receives can be a first reflected light L1
emitted from the light emitter 3 and reflected by the near-distance
object, and most of the light that the second sensor 42 receives
can be a second reflected light L2 emitted from the light emitter 3
and reflected by the far-distance object.
[0023] More specifically, as shown in FIG. 1, the proximity sensor
module Z further includes an optical isolator 5 disposed on the
partition structure 13 for limiting the sensing angle .phi.1 of the
second sensor 42. As shown in FIG. 1, since the optical isolator 5
elongates the height of the partition structure 13, the sensing
angle .phi.1 of the second sensor 42 can be, but is not limited to
being, further limited. In another embodiment, the sensing angle
.phi.1 of the second sensor 42 may be limited only by the partition
structure 13.
[0024] Furthermore, when the spacing between the panel M and the
proximity sensor module Z is narrow, the sensing angle .theta.1 of
the first sensor 41 can be limited without the optical isolator 5.
When the spacing between the panel M and the proximity sensor
module Z is wide, the disposition of the optical isolator 5 can not
only block the second sensor 42 from receiving cross-talk light
reflected by the panel M, but also obstruct leaked light from
between the panel M and the proximity sensor module Z and the
external light, so as to further reduce the cross-talk effect. In
addition, the optical isolator 5 is made from an opaque material.
Preferably, the optical isolator 5 is made from an opaque material
with stretchability.
[0025] Referring to FIG. 1, the proximity sensor module Z further
includes a first lens 6. As shown in FIG. 1, the first lens 6 is
arranged in the first accommodating space R1 and is disposed on the
circuit substrate 2, and the first lens 6 covers the light emitter
3. By the configuration of the first lens 6, the light path from
the light emitter 3 can be better controlled. In other embodiments
of the present disclosure, the light path from the light emitter 3
may be controlled by other methods.
[0026] Specifically, the light emitter 3 of the proximity sensor
module Z is an infrared light emitting diode, but the present
disclosure is not limited thereto. In other embodiments, the light
emitter 3 may be other light sources used in proximity sensors.
[0027] The cross-talk light received by the second sensor 42 is
greatly reduced by the inclusion of the two sensors, the first
sensor 41 being disposed away from the light emitter 3, and the
second sensor 42 being disposed close to the light emitter 3, and
by the inclusion of the partition structure 13 between the light
emitter 3 and the second sensor 42. By the structure described
above, the proximity sensor module Z of the present disclosure can
allow the first sensor 41 to receive the light and the cross-talk
light emitted from the light emitter 3 and reflected by the panel
M, and allow the second sensor 42 to receive the light emitted from
the light emitter 3 and reflected by the far-distance object.
Second Embodiment
[0028] Referring to FIG. 2, a second embodiment of the present
disclosure is similar to the first embodiment, in which similar
elements have the same reference numerals and functions as those of
the first embodiment, and will not be repeated herein. The
difference between the two embodiments is that the proximity sensor
module Z of the second embodiment further includes an optical path
correcting element. As shown in FIG. 2, in the second embodiment,
the optical path correcting element is a second lens 7 which covers
the first sensor 41 and the second sensor 42, and the first sensor
41 and the second sensor 42 are respectively disposed on opposite
sides of the main axis of the second lens 7.
[0029] Furthermore, in FIG. 2, a sensing angle .theta.2 of the
first sensor 41 could be shifted towards the direction of the light
emitter 3 by the adjustment of the second lens 7, and a sensing
angle .phi.2 of the second sensor 42 could be shifted away from the
direction of the light emitter 3 by the adjustment of the second
lens 7.
[0030] By the structures described above, the proximity sensor
module Z of the present disclosure can allow the first sensor 41 to
receive more of the light from the light emitter 3 and reflected by
the panel M and the near-distance object, while allowing the second
sensor 42 to receive less of the light from the light emitter 3 and
reflected by the panel M and the near-distance object, thereby
achieving a better proximity sensing effect.
[0031] It should be noted that the optical path correcting element
is not limited to the implementation described above. In other
embodiments, the optical path correcting element may be an element
or a structure other than a lens.
Third Embodiment
[0032] Referring to FIG. 3, a third embodiment of the present
disclosure is substantially the same as the first and second
embodiments, and similar elements or configurations will not be
described again herein. One of the differences in the third
embodiment is that the package housing 1 of the proximity sensor
module Z of the third embodiment further includes a first package
structure 11, a second package structure 12, a first partition
structure 131, a second partition structure 132, a first
accommodating space R1 defined by the first package structure 11
and the first partition structure 131, a second accommodation space
R2 defined by the first partition structure 131 and the second
partition structure 132, and a third accommodation space R3 defined
by the second package structure 12 and the second partition
structure 132.
[0033] Further, another difference is that, in the first embodiment
and the second embodiment, the first sensor 41 is farther from the
light emitter 3 than the second sensor 42; however, in the third
embodiment, the first sensor 41 is closer to the light emitter 3
than the second sensor 42. Furthermore, in the third embodiment,
the first sensor 41 is arranged in the second accommodating space
R2 and is disposed on the circuit substrate 2, and the second
sensor 42 is arranged in the third accommodating space R3 and is
disposed on the circuit substrate 2. Moreover, the optical isolator
5 of the proximity sensor module Z of the third embodiment is
disposed on the second partition structure 132 for limiting the
sensing angle .phi.3 of the second sensor 42.
[0034] The first sensor 41 of the third embodiment is the same as
that of the first embodiment, for receiving the first reflected
light L1 emitted from the light emitter 3 and reflected by a
near-distance object; and the second sensor 42 of the third
embodiment is the same as that of the first embodiment, for
receiving a second reflected light L2 emitted from the light
emitter 3 and reflected by a far-distance object.
[0035] More particularly, the second sensor 42 of the third
embodiment is farther from the light emitter 3 than the second
sensor 42 of the first and second embodiments, and the optical
isolator 5 blocks the light emitted from the light emitter 3 and
reflected by the panel M. Therefore, the probability of the second
sensor 42 receiving the light (cross-talk light) emitted from the
light emitter 3 and reflected by the panel M is smaller than that
of the second sensor 42 of the first and second embodiments. In
addition, sensor is closer to the light emitter 3 than the first
sensor 41 of the first and second embodiments, so that the first
sensor 41 of the third embodiment can receive more light emitted
from the light emitter 3 and reflected by the panel M and the
near-distance object.
[0036] Accordingly, by the structures described above, the first
sensor 41 can receive the first reflected light L1 emitted from the
light emitter 3 and reflected by the near-distance object, and the
second sensor 42 can receive the second reflected light L2 emitted
from the light emitter 3 and reflected by a far-distance object, so
as to enhance the proximity sensing capability of the proximity
sensor module Z.
[0037] FIG. 4 shows a signal-to-noise ratio of the proximity sensor
module Z with two sensors according to the third embodiment of the
present disclosure during operation. As shown in FIG. 4, when the
first and second sensors 41, 42 are at a closest sensing distance
to the panel M, the first sensor 41 would have a higher
signal-to-noise ratio than the second sensor 42. As the sensing
distance increases, the signal received by the first sensor 41
would decrease while the signal received by the second sensor 42
would increase, and thus the second sensor 42 would have a higher
signal-to-noise ratio than the first sensor 41.
[0038] Further referring to FIG. 4, the first sensor 41 and the
second sensor 42 may respectively have a near threshold value and a
far threshold value. For instance, when the near threshold value of
the first sensor 41 and that of the second sensor 42 is 4 dB, the
far threshold value of the first sensor 41 and that of the second
sensor 42 is 3 dB, and an object to be sensed is approaching the
panel M, the object to be sensed would trigger the near threshold
values of the first and second sensors 41, 42 when the distance
from the panel M is d1 and d2, respectively. Then, the mobile
device P would determine that an object is nearing the panel M
according to the triggered near threshold values of the first and
second sensors 41, 42 and set the panel M to sleep mode. As the
object to be sensed continues approaching the panel M to the
distance d3, the far threshold value of the second sensor 42 would
be triggered. However, since the signal-to-noise ratio of the first
sensor 41 is higher than 3 dB at this time, the far threshold value
of the first sensor 41 will not be triggered. Therefore, the mobile
device P will not restart the screen since the determination of
whether the object has left the panel M is not determined only by
the far threshold value of the second sensor 42 being
triggered.
[0039] Therefore, the proximity sensor module Z can increase the
range of proximity sensing and reduce the probability of
misjudgments, and enhance the sensing capability toward low
reflectivity objects (e.g. hair).
[0040] In conclusion, by matching the features of "the light
emitter 3 is arranged in the first accommodating space R1 and is
disposed on the circuit substrate 2" and "the first sensor 41 and
the second sensor 42 are arranged in the second accommodating space
R2, and the first sensor 41 is farther from the light emitter 3
than the second sensor 42", the first sensor 41 can receive the
reflected light L1 emitted from the light emitter 3 and reflected
by sensor the near-distance object, and second sensor 42 can
receive the second reflected light L2 emitted from the light
emitter 3 and reflected by a far-distance object.
[0041] The foregoing description of the exemplary embodiments of
the disclosure has been presented only for the purposes of
illustration and description and is not intended to be exhaustive
or to limit the disclosure to the precise forms disclosed. Many
modifications and variations are possible in light of the above
teaching.
[0042] The embodiments were chosen and described in order to
explain the principles of the disclosure and their practical
application so as to enable others skilled in the art to utilize
the disclosure and various embodiments and with various
modifications as are suited to the particular use contemplated.
Alternative embodiments will become apparent to those skilled in
the art to which the present disclosure pertains without departing
from its spirit and scope.
* * * * *