U.S. patent application number 16/246663 was filed with the patent office on 2020-01-30 for package structure and antenna device using the same.
The applicant listed for this patent is InnoLux Corporation. Invention is credited to Tang-Chin HUNG, I-Yin LI.
Application Number | 20200036081 16/246663 |
Document ID | / |
Family ID | 69178735 |
Filed Date | 2020-01-30 |
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United States Patent
Application |
20200036081 |
Kind Code |
A1 |
LI; I-Yin ; et al. |
January 30, 2020 |
PACKAGE STRUCTURE AND ANTENNA DEVICE USING THE SAME
Abstract
An antenna device is provided. The antenna device includes a
first substrate and a second substrate facing the first substrate.
The first substrate includes an inner surface and an outer surface
opposite the inner surface of the first substrate. The second
substrate includes an inner surface and an outer surface opposite
the inner surface of the second substrate. The antenna device also
includes a die disposed between the first substrate and the second
substrate, a redistribution layer disposed between the die and the
inner surface of the second substrate, and an antenna unit
electrically connected to the die via the redistribution layer. The
antenna unit is arranged on at least one of the inner surface of
the first substrate, the outer surface of the first substrate, the
inner surface of the second substrate and the outer surface of the
second substrate.
Inventors: |
LI; I-Yin; (Miao-Li County,
TW) ; HUNG; Tang-Chin; (Miao-Li County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
InnoLux Corporation |
Miao-Li County |
|
TW |
|
|
Family ID: |
69178735 |
Appl. No.: |
16/246663 |
Filed: |
January 14, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62711671 |
Jul 30, 2018 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/49833 20130101;
H01L 2223/6616 20130101; H01L 23/20 20130101; H01L 2223/6677
20130101; H01L 23/66 20130101; H01L 23/053 20130101; H01Q 1/2283
20130101; H01L 23/3121 20130101; H01L 23/49838 20130101; H01L
23/552 20130101; H01L 23/3135 20130101; H01L 2224/16225
20130101 |
International
Class: |
H01Q 1/22 20060101
H01Q001/22; H01L 23/552 20060101 H01L023/552; H01L 23/498 20060101
H01L023/498; H01L 23/66 20060101 H01L023/66 |
Claims
1. An antenna device, comprising: a first substrate, wherein the
first substrate comprises an inner surface and an outer surface
opposite the inner surface of the first substrate; a second
substrate facing the first substrate, wherein the second substrate
comprises an inner surface and an outer surface opposite the inner
surface of the second substrate; a die disposed between the first
substrate and the second substrate; a redistribution layer disposed
between the die and the inner surface of the second substrate; and
an antenna unit electrically connected to the die via the
redistribution layer; wherein the antenna unit is arranged on at
least one of the inner surface of the first substrate, the outer
surface of the first substrate, the inner surface of the second
substrate and the outer surface of the second substrate.
2. The antenna device of claim 1, comprising: a first sealant
disposed between the first substrate and the second substrate;
wherein the first sealant surrounds the die.
3. The antenna device of claim 2, comprising: a second sealant,
wherein the first sealant is disposed between the second sealant
and the die.
4. The antenna device of claim 2, comprising: a plurality of
spacers disposed between the first substrate and the second
substrate.
5. The antenna device of claim 2, wherein a remaining space between
the first substrate and the second substrate inside the first
sealant is vacant or filled with air, inert gases or low
loss-tangent materials.
6. The antenna device of claim 1, comprising: a wire; wherein the
second substrate comprises at least one via hole, and the wire
passes through the via hole and is electrically connected the
antenna unit and the redistribution layer.
7. The antenna device of claim 1, further comprising: a wire;
wherein the first substrate comprises at least one via hole, and
the wire passes through the via hole and is electrically connected
the antenna unit and the redistribution layer.
8. The antenna device of claim 1, comprising: at least one
shielding layer disposed on at least one of the inner surface of
the first substrate and the inner surface of the second
substrate.
9. The antenna device of claim 1, wherein a material of one of the
first substrate and the second substrate comprises at least one of
glass, polyimide, liquid-crystal polymer, polycarbonate,
polypropylene, and polyethylene terephthalate.
10. A package structure, comprising: a first substrate; a second
substrate facing the first substrate; a redistribution layer
disposed between the first substrate and the second substrate; a
die disposed between the redistribution layer and the first
substrate; a metal layer electrically connected to the
redistribution layer; and a sealant disposed between the first
substrate and the second substrate and surrounding the die.
11. The package structure of claim 10, wherein a remaining space
between the first substrate and the second substrate inside the
sealant is vacant or filled with air, inert gases or low
loss-tangent materials.
12. The package structure of claim 10, comprising: a transmission
line disposed between the first substrate and the second substrate;
wherein the transmission line is electrically connected to the die
through the redistribution layer, and the transmission line is
electrically connected to the metal layer.
13. The package structure of claim 12, comprising: at least one via
hole penetrating one of the first substrate and the second
substrate; wherein the transmission line passes through the at
least one via hole to connect to the metal layer.
14. The package structure of claim 10, comprising: a plurality of
spacers disposed between the first substrate and the second
substrate.
15. The package structure of claim 10, comprising: at least one
shielding layer disposed on at least one inner surface of the first
substrate and the second substrate.
16. The package structure of claim 10, comprising: at least one
bonding element disposed between the first substrate and the second
substrate.
17. The package structure of claim 10, wherein the metal layer is
disposed on an inner surface of one of the first substrate and the
second substrate or on an outer surface of one of the first
substrate and the second substrate.
18. The package structure of claim 10, wherein the metal layer is
an antenna unit.
19. The package structure of claim 10, wherein a material of one of
the first substrate and the second substrate comprises at least one
of glass, polyimide, liquid-crystal polymer, polycarbonate,
polypropylene, and polyethylene terephthalate.
20. The package structure of claim 10, comprising: a potting
compound layer disposed outside sealant.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Application No. 62/711,671, filed Jul. 30, 2018, and the entirety
of which is incorporated by reference herein.
BACKGROUND
Technical Field
[0002] Embodiments of the present disclosure relate to a package
structure and an antenna device using the same, and in particular
they relate to a package structure for communication applications
and an antenna device using the same.
Description of the Related Art
[0003] Antennas are typically used for enabling wireless
communication. In a high frequency application, such as 5th
generation wireless systems (5G), satellites and automotive radars,
these antennas need to have good, adjustable directivity.
Therefore, phase array antennas are commonly used in high frequency
applications.
[0004] However, traditional package structures for phase array
antennas may not meet demands for antenna devices in high frequency
applications nowadays because of their high manufacturing cost,
high dielectric loss, and larger areas.
SUMMARY
[0005] In accordance with some embodiments of the present
disclosure, an antenna device is provided. The antenna device
includes a first substrate and a second substrate facing the first
substrate. The first substrate includes an inner surface and an
outer surface opposite the inner surface of the first substrate.
The second substrate includes an inner surface and an outer surface
opposite the inner surface of the second substrate. The antenna
device also includes a die disposed between the first substrate and
the second substrate, a redistribution layer disposed between the
die and the inner surface of the second substrate, and an antenna
unit electrically connected to the die via the redistribution
layer. The antenna unit is arranged on at least one of the inner
surface of the first substrate, the outer surface of the first
substrate, the inner surface of the second substrate and the outer
surface of the second substrate.
[0006] In accordance with some other embodiments of the present
disclosure, a package structure is provided. The package structure
includes a first substrate and a second substrate facing the first
substrate, a redistribution layer disposed between the first
substrate and the second substrate, a die disposed between the
redistribution layer and the first substrate, a metal layer
electrically connected to the redistribution layer, and a sealant
disposed between the first substrate and the second substrate and
surrounding the die.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Aspects of the embodiments of the present disclosure are
understood from the following detailed description when read with
the accompanying figures. It should be noted that, in accordance
with the standard practice in the industry, various features are
not drawn to scale. In fact, the dimensions of the various features
may be arbitrarily increased or reduced for clarity of
discussion.
[0008] FIG. 1 is a partial top view illustrating a package
structure according to one embodiment of the present
disclosure.
[0009] FIG. 2 is a partial cross-sectional view illustrating along
line A-A in FIG. 1.
[0010] FIG. 3 is a partial cross-sectional view illustrating a
package structure according to another embodiment of the present
disclosure.
[0011] FIG. 4 is a partial cross-sectional view illustrating a
package structure according to still another embodiment of the
present disclosure.
DETAILED DESCRIPTION
[0012] The following disclosure provides many different
embodiments, or examples, for implementing different features of
the subject matter provided. Specific examples of components and
arrangements are described below to simplify the present
disclosure. These are, of course, merely examples and are not
intended to be limiting. For example, the formation of a first
feature over or on a second feature in the description that follows
may include embodiments in which the first and second features are
formed in direct contact, and may also include embodiments in which
additional features may be formed between the first and second
features, such that the first and second features may not be in
direct contact.
[0013] It should be understood that additional steps may be
implemented before, during, or after the illustrated methods, and
some steps might be replaced or omitted in other embodiments of the
illustrated methods.
[0014] Furthermore, spatially relative terms, such as "beneath,"
"below," "lower," "on," "above," "upper" and the like, may be used
herein for ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. The spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. The apparatus
may be otherwise oriented (rotated 45 degrees or at other
orientations) and the spatially relative descriptors used herein
may likewise be interpreted accordingly.
[0015] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
disclosure belongs. It should be understood that terms such as
those defined in commonly used dictionaries should be interpreted
as having a meaning that is consistent with their meaning in the
context of the relevant art and will not be interpreted in an
idealized or overly formal sense unless expressly so defined in the
embodiments of the present disclosure.
[0016] FIG. 1 is a partial top view illustrating a package
structure 100 according to one embodiment of the present
disclosure, and FIG. 2 is a partial cross-sectional view
illustrating along line A-A in FIG. 1. It should be noted that not
all components of the package structure 100 are shown in FIGS. 1-2,
for the sake of brevity.
[0017] Referring to FIGS. 1 and 2, the package structure 100
includes a first substrate 11 which is not shown in FIG. 1, a
second substrate 12 facing the first substrate 11, a redistribution
layer (RDL) 20 disposed between the first substrate 11 and the
second substrate 12, a die 30 disposed on the redistribution layer
20, a metal layer 41 electrically connected to the redistribution
layer 20, and a sealant 51 disposed between the first substrate 11
and the second substrate 12 and surrounding the die 30.
[0018] As shown in FIG. 2, the first substrate 11 has an inner
surface 11-1 and an outer surface 11-2 opposite the inner surface
11-1. The second substrate 12 faces the first substrate 11, and
similarly has an inner surface 12-1 and an outer surface 12-2
opposite the inner surface 12-1. Here, the first substrate 11 and
the second substrate 12 may be exclusive of elemental semiconductor
substrates (e.g., silicon, germanium), compound semiconductor
substrates (e.g., tantalum carbide, gallium arsenide, indium
arsenide or indium phosphide), alloy semiconductor substrates
(e.g., silicon germanium, silicon germanium carbide, gallium
arsenic phosphide or gallium indium phosphide), and so on.
[0019] In this embodiment, a material of one of the first substrate
11 and the second substrate 12 comprises at least one of glass,
polyimide (PI), liquid-crystal polymer (LCP), polycarbonate (PC),
polypropylene (PP), polyethylene terephthalate (PET) and other
plastic or polymer materials. But the present disclosure is not
limited thereto.
[0020] The redistribution layer 20 and the die 30 are both disposed
between the first substrate 11 and the second substrate 12. As
shown in FIGS. 1 and 2, the redistribution layer 20 is disposed
between the die 30 and the inner surface 12-1 of the second
substrate 12. In other words, the die 30 is disposed between the
redistribution layer 20 and the first substrate 11. The die 30 may
be a bare die, and the redistribution layer 20 may include a
plurality of wire 21 and a plurality of insulating layers 22 that
make the I/O pads 31 of integrated circuit of the die 30 available
in other locations. It should be noted that some components of the
redistribution layer 20 in FIGS. 1 and 2 have been omitted here,
for the sake of brevity. That is, the structure of the
redistribution layer 20 should not be limited to the structure as
shown in FIGS. 1 and 2.
[0021] In this embodiment, the metal layer 41 may be an antenna
unit, so that the package structure 100 may be an antenna device.
The metal layer (or the antenna unit) 41 may be electrically
connected to the die 30 via the redistribution layer 20. The die 30
may receive and/or transmit an electronic-magnetic wave through the
metal layer (or the antenna unit) 41. As shown in FIG. 2, the metal
layer (or the antenna unit) 41 is arranged on the outer surface
12-2 of the second substrate 12, but the present disclosure is not
limited thereto. In some embodiments, the metal layer (or the
antenna unit) 41 may be arranged on the outer surface 11-2 of the
first substrate 11, the inner surface 11-1 of the first substrate
11, or the inner surface 12-1 of the second substrate 12.
[0022] In this embodiment, the sealant 51 is disposed between the
first substrate 11 and the second substrate 12, and the sealant 51
surrounds the die 30. The sealant 51 is used to keep the package
structure 100 sealed. In some embodiments, the sealant 51 may be a
conductive sealant.
[0023] In this embodiment, the remaining space 15 between the first
substrate 11 and the second substrate 12 inside the sealant 51 is
vacant. In some embodiments, the remaining space 15 between the
first substrate 11 and the second substrate 12 inside the sealant
51 may be filled with air, inert gases or low loss-tangent
materials (such as fluoropolymer). Compared to traditional package
structures using molding compounds, since the remaining space 15
between the first substrate 11 and the second substrate 12 inside
the sealant 51 is vacant or filled with air or inert gases, the
effects due to the different coefficients of thermal expansion
(CTE) between different components may be low. Therefore, the
reliability of the package structure (or the antenna device) 100
may be effectively enhanced.
[0024] Referring to FIGS. 1 and 2, in this embodiment, the package
structure 100 further includes a wire 43 disposed between the first
substrate 11 and the second substrate 12. In more detail, the wire
43 may be a transmission line which is electrically connected to
the die 30 through the redistribution layer 20 and electrically
connected to the metal layer 41. In the embodiment as shown in FIG.
2, at least one via hole 60 penetrates the second substrate 12, and
the wire (transmission line) 43 passes through the via hole 60 to
connect to the metal layer 41. However, the present disclosure is
not limited thereto. In other embodiments, if the metal layer 41 is
disposed on the outer surface 11-2 of the first substrate 11 (as
shown in following FIG. 4), then the via hole 60 may penetrate the
first substrate 11, and the wire (transmission line) 43 passes
through the via hole 60 to connect to the metal layer 41.
[0025] In other words, the second substrate 12 (or the first
substrate 11) may include at least one via hole 60, and the wire 43
may pass through the via hole 60 and electrically connect the metal
layer (or the antenna unit) 41 to the redistribution layer 20 and
the die 30.
[0026] Since the wire 43 passes through the second substrate 12 (or
the first substrate 11), the remaining space 15 (which is vacant or
filled with air, inert gases or low loss-tangent materials), and
the redistribution layer 20 to electrically connect the metal layer
(or the antenna unit) 41 and the die 30, dielectric loss may be
lower than in traditional structures (e.g., the antenna, antennas
or phase array antenna made through printed circuit board
(PCB)).
[0027] Moreover, the die 30 is sealed between the first substrate
11 and the second substrate 12 inside the sealant 51, so that the
package structure 100 may have better corrosion resistance than
traditional packages.
[0028] Furthermore, the manufacturing cost of the antenna device
using the package structure 100 according to the embodiments of the
present disclosure may be lower than the manufacturing cost of the
traditional AiP (Antenna in Package).
[0029] It should be noted that the number and the location of the
sealant 51 and the number and the location of the spacers 70 may be
different from FIGS. 1 and 2, depending on demand.
[0030] In some embodiments, the package structure 100 may further
include at least one shielding layer 45 disposed on at least one of
the inner surface 11-1 of the first substrate 11 and the inner
surface 12-1 of the second substrate 12. For example, the shielding
layers 45 are disposed on both the inner surface 11-1 of the first
substrate 11 and the inner surface 12-1 of the second substrate 12
as shown in FIG. 2. The shielding layer 45 may be another metal
layer (e.g., a ground layer) for electromagnetic shielding that
blocks radio frequency electromagnetic radiation.
[0031] In some embodiments, the package structure 100 may further
include at least one bonding element 80 disposed between first
substrate 11 and the second substrate 12. For example, the package
structure 100 includes solder balls disposed on the redistribution
layer 20. These solder balls are used as bonding elements 80 to
electrically connect the conductive component (e.g., the shielding
layer 45) on the inner surface 11-1 of the first substrate 11 to
the conductive component (e.g., the shielding layer 45) on the
inner surface 12-1 of the second substrate 12.
[0032] It should be noted that the bonding element 80 is not
limited to the form of solder balls as shown in FIGS. 1 and 2.
Other suitable forms may be applied in the package structure 100.
Similarly, the number and the location of the bonding element 80
may be different from FIGS. 1 and 2, depending on demand.
[0033] In some embodiments, the package structure 100 may further
include a potting compound layer 52 disposed outside the sealant
51. In more detail, the potting compound layer 52 may be a second
sealant, and the sealant 51 is disposed between the potting
compound layer 52 and the die 30. The potting compound layer 52 may
provide better protection for the die 30 between the first
substrate 11 and the second substrate 12.
[0034] FIG. 3 is a partial cross-sectional view illustrating a
package structure 101 according to another embodiment of the
present disclosure. In this embodiment, the package structure 101
is used as an antenna device. The package structure (or the antenna
device) 101 includes a first substrate 11 and a second substrate 12
facing the first substrate 11. The package structure (or the
antenna device) 101 also includes a die 30 disposed between the
first substrate 11 and the second substrate 12, a redistribution
layer (RDL) 20 disposed between the die 30 and the second substrate
12, and a metal layer (or the antenna unit) 41 electrically
connected to the die via the redistribution layer 20.
[0035] As shown in FIG. 3, the first substrate 11 has an inner
surface 11-1 and an outer surface 11-2 opposite the inner surface
11-1, and the second substrate 12 has an inner surface 12-1 and an
outer surface 12-2 opposite the inner surface 12-1. In this
embodiment, the metal layer (or the antenna unit) 41 is arranged on
the outer surface 12-2 of the second substrate 12.
[0036] In this embodiment, the first substrate 11 and the second
substrate 12 may be glass substrates. However, the present
disclosure is not limited thereto. In other embodiments, the first
substrate 11 and the second substrate 12 may be polyimide (PI)
substrates, liquid-crystal polymer (LCP) substrates, polycarbonate
(PC) substrates, polypropylene (PP) substrates, polyethylene
terephthalate (PET) substrates or other plastic or polymer
substrates.
[0037] As shown in FIG. 3, the redistribution layer 20 and the die
30 are both disposed between the first substrate 11 and the second
substrate 12, and some portions of the redistribution layer 20 is
disposed between the die 30 and the inner surface 12-1 of the
second substrate 12. In other words, the die 30 is disposed between
the redistribution layer 20 and the first substrate 11. The die 30
may be a bare die, and the redistribution layer 20 may include a
plurality of wire 21 and a plurality of insulating layers 22 that
make the I/O pads 31 of integrated circuit of the die 30 available
in other locations. Similarly, some components of the
redistribution layer 20 in FIG. 3 have been omitted here, for the
sake of brevity. That is, the structure of the redistribution layer
20 should not be limited to the structure as shown in FIG. 3.
[0038] The metal layer (or the antenna unit) 41 may be electrically
connected to the die 30 via the redistribution layer 20. The die 30
may receive and/or transmit an electronic-magnetic wave through the
metal layer (or the antenna unit) 41. As shown in FIG. 3, the metal
layer (or the antenna unit) 41 is arranged on the outer surface
12-2 of the second substrate 12, but the present disclosure is not
limited thereto.
[0039] Moreover, the package structure (or the antenna device) 101
may include a sealant 51' disposed between the first substrate 11
and the second substrate 12, and the sealant 51' surrounds the die
30. The difference between the package structure 101 and the
package structure 100 is that a portion of the sealant 51' (the
sealant 51' on the left side in FIG. 3) in the package structure
(or the antenna device) 101 is disposed on the redistribution layer
20 as shown in FIG. 3, while the sealant 51 in the package
structure (or the antenna device) 100 is disposed outside the
redistribution layer 20 as shown in FIG. 2.
[0040] In this embodiment, the remaining space 15 between the first
substrate 11 and the second substrate 12 inside the sealant 51' is
vacant. In some embodiments, the remaining space 15 between the
first substrate 11 and the second substrate 12 inside the sealant
51' may be filled with air, inert gases or low loss-tangent
materials (such as fluoropolymer). Compared to traditional package
structures using molding compounds, since the remaining space 15
between the first substrate 11 and the second substrate 12 inside
the sealant 51' is vacant or filled with air or inert gases, the
effects due to the different coefficients of thermal expansion
(CTE) between different components may be low. Therefore, the
reliability of the package structure (or the antenna device) 101
may be effectively enhanced.
[0041] Referring to FIG. 3, in this embodiment, the package
structure 101 further includes a wire 43 disposed between the first
substrate 11 and the second substrate 12. In more detail, the wire
43 may be a transmission line which is electrically connected to
the die 30 through the redistribution layer 20 and electrically
connected to the metal layer 41. In the embodiment as shown in FIG.
3, at least one via hole 60 penetrates the second substrate 12, and
the wire (transmission line) 43 passes through the via hole 60 to
connect to the metal layer 41. However, the present disclosure is
not limited thereto.
[0042] In other words, the second substrate 12 may include at least
one via hole 60, and the wire 43 may pass through the via hole 60
and electrically connect the metal layer (or the antenna unit) 41
to the redistribution layer 20 and the die 30.
[0043] Since the wire 43 passes through the second substrate 12,
the remaining space 15 (which is vacant or filled with air, inert
gases or low loss-tangent materials), and the redistribution layer
20 to electrically connect the metal layer (or the antenna unit) 41
and the die 30, dielectric loss may be lower than in traditional
structures (e.g., the antenna made through printed circuit board
(PCB)).
[0044] Moreover, the die 30 is sealed between the first substrate
11 and the second substrate 12 inside the sealant 51', so that the
package structure 101 may have better corrosion resistance than
traditional packages.
[0045] Furthermore, the manufacturing cost of the antenna device
using the package structure 101 according to the embodiments of the
present disclosure may be lower than the manufacturing cost of the
traditional AiP (Antenna in Package).
[0046] In this embodiment, the package structure 101 may further
include a plurality of spacers 70' disposed between the first
substrate 11 and the second substrate 12 as shown in FIG. 3. The
spacers 70' may be used to maintain the gap between the first
substrate 11 and the second substrate 12. For example, the spacers
70' may be cell gap spacers, such as a ball spacer, a photo spacer,
glass fiber, or another suitable spacer.
[0047] In this embodiment, the package structure 101 may further
include shielding layers 45 disposed on both the inner surface 11-1
of the first substrate 11 and the inner surface 12-1 of the second
substrate 12 as shown in FIG. 3. Each of the shielding layers 45
may be another metal layer (e.g., a ground layer) for
electromagnetic shielding that blocks radio frequency
electromagnetic radiation.
[0048] In this embodiment, the package structure 101 may further
include at least one bonding element 80' disposed between first
substrate 11 and the second substrate 12. For example, the package
structure 101 includes solder balls disposed on the redistribution
layer 20. These solder balls are used as bonding elements 80' to
electrically connect the conductive component (e.g., the shielding
layer 45) on the inner surface 11-1 of the first substrate 11 to
the conductive component (e.g., the shielding layer 45) on the
inner surface 12-1 of the second substrate 12.
[0049] Moreover, the number and the location of the spacers 70' and
the number and the location of the bonding element 80' in the
package structure 101 as shown in FIG. 3 are different from the
number and the location of the spacers 70 and the number and the
location of the bonding element 80 in the package structure 100 as
shown in FIG. 2.
[0050] Similarly, the package structure 101 may further include a
potting compound layer 52 disposed outside the sealant 51'. In more
detail, the potting compound layer 52 may be a second sealant, and
the sealant 51' is disposed between the potting compound layer 52
and the die 30. The potting compound layer 52 may provide better
protection for the die 30 between the first substrate 11 and the
second substrate 12.
[0051] FIG. 4 is a partial cross-sectional view illustrating a
package structure 102 according to still another embodiment of the
present disclosure. Referring to FIG. 4, the package structure 102
includes a first substrate 11 and a second substrate 12 opposite
each other, a redistribution layer (RDL) 20 disposed between the
first substrate 11 and the second substrate 12, a die 30 disposed
on the redistribution layer 20, a metal layer 41' electrically
connected to the redistribution layer 20, and a sealant 51 disposed
between the first substrate 11 and the second substrate 12 and
surrounding the die 30.
[0052] As shown in FIG. 4, the first substrate 11 has an inner
surface 11-1 and an outer surface 11-2 opposite the inner surface
11-1. The second substrate 12 faces the first substrate 11, and
similarly has an inner surface 12-1 and an outer surface 12-2
opposite the inner surface 12-1.
[0053] In this embodiment, the first substrate 11 and the second
substrate 12 may be glass substrates. However, the present
disclosure is not limited thereto. In other embodiments, the first
substrate 11 and the second substrate 12 may be polyimide (PI)
substrates, liquid-crystal polymer (LCP) substrates, polycarbonate
(PC) substrates, polypropylene (PP) substrates, polyethylene
terephthalate (PET) substrates or other plastic or polymer
substrates.
[0054] The redistribution layer 20 and the die 30 are both disposed
between the first substrate 11 and the second substrate 12. As
shown in FIG. 4, the redistribution layer 20 is disposed between
the die 30 and the inner surface 12-1 of the second substrate 12.
In other words, the die 30 is disposed between the redistribution
layer 20 and the first substrate 11. The die 30 may be a bare die,
and the redistribution layer 20 may include a plurality of wire 21
and a plurality of insulating layers 22 that make the I/O pads 31
of integrated circuit of the die 30 available in other locations.
It should be noted that some components of the redistribution layer
20 in FIG. 4 have been omitted here, for the sake of brevity. That
is, the structure of the redistribution layer 20 should not be
limited to the structure as shown in FIG. 4.
[0055] In this embodiment, the metal layer 41' may be an antenna
unit, so that the package structure 102 may be an antenna device.
The metal layer (or the antenna unit) 41' may be electrically
connected to the die 30 via the redistribution layer 20. The die 30
may receive and/or transmit an electronic-magnetic wave through the
metal layer (or the antenna unit) 41'. The difference between the
package structure 102 and the package structure 100 is that the
metal layer 41' in the package structure 102 is disposed on the
outer surface 11-2 of the first substrate 11 as shown in FIG. 4,
while the metal layer 41 in the package structure 100 is disposed
on the outer surface 12-2 of the second substrate 12 as shown in
FIG. 2.
[0056] In this embodiment, the sealant 51 is disposed between the
first substrate 11 and the second substrate 12, and the sealant 51
surrounds the die 30. The sealant 51 is used to keep the package
structure 100 sealed. In some embodiments, the sealant 51 may be a
conductive sealant.
[0057] In this embodiment, the remaining space 15' between the
first substrate 11 and the second substrate 12 inside the sealant
51 is filled with low loss-tangent materials (such as
fluoropolymer).
[0058] Referring to FIG. 4, in this embodiment, the package
structure 102 further includes a wire 43' disposed between the
first substrate 11 and the second substrate 12. In more detail, the
wire 43' may be a transmission line which is electrically connected
to the die 30 through the redistribution layer 20 and electrically
connected to the metal layer 41'. In the embodiment as shown in
FIG. 4, at least one via hole 60' penetrates the first substrate
11, and the wire (transmission line) 43' passes through the via
hole 60' to connect to the metal layer 41'.
[0059] In other words, the first substrate 11 may include at least
one via hole 60', and the wire 43' may pass through the via hole
60' and electrically connect the metal layer (or the antenna unit)
41' to the redistribution layer 20 and the die 30.
[0060] Since the wire 43' passes through the first substrate 11,
the remaining space 15' (which is filled with low loss-tangent
materials), and the redistribution layer 20 to electrically connect
the metal layer (or the antenna unit) 41' and the die 30,
dielectric loss may be lower than in traditional structures (e.g.,
the antenna made through printed circuit board (PCB)).
[0061] Moreover, the die 30 is sealed between the first substrate
11 and the second substrate 12 inside the sealant 51, so that the
package structure 102 may have better corrosion resistance than
traditional packages.
[0062] Furthermore, the manufacturing cost of the antenna device
using the package structure 102 according to the embodiments of the
present disclosure may be lower than the manufacturing cost of the
traditional AiP (Antenna in Package).
[0063] In some embodiments, the package structure 102 may further
include a plurality of spacers 70 disposed between the first
substrate 11 and the second substrate 12. The spacers 70 may be
used to maintain the gap between the first substrate 11 and the
second substrate 12. For example, the spacers 70 may be cell gap
spacers, such as a ball spacer, a photo spacer, glass fiber, or
another suitable spacer.
[0064] In some embodiments, the package structure 102 may further
include shielding layers 45 disposed on both the inner surface 11-1
of the first substrate 11 and the inner surface 12-1 of the second
substrate 12 as shown in FIG. 4. Each of the shielding layers 45
may be another metal layer (e.g., a ground layer) for
electromagnetic shielding that blocks radio frequency
electromagnetic radiation.
[0065] In some embodiments, the package structure 102 may further
include at least one bonding element 80 disposed between first
substrate 11 and the second substrate 12. For example, the package
structure 102 includes solder balls disposed on the redistribution
layer 20. These solder balls are used as bonding elements 80 to
electrically connect the conductive component (e.g., the shielding
layer 45) on the inner surface 11-1 of the first substrate 11 to
the conductive component (e.g., the shielding layer 45) on the
inner surface 12-1 of the second substrate 12.
[0066] In some embodiments, the package structure 102 may further
include a potting compound layer 52 disposed outside the sealant
51. In more detail, the potting compound layer 52 may be a second
sealant, and the sealant 51 is disposed between the potting
compound layer 52 and the die 30. The potting compound layer 52 may
provide better protection for the die 30 between the first
substrate 11 and the second substrate 12.
[0067] It should be noted that the antenna device is used as an
example in the embodiments described above, but the present
disclosure is not limited thereto. In some embodiments, the package
structure 100 (or 101, 102) may be used in other devices for
communication application.
[0068] In summary, the package structure (or the antenna device) of
the embodiments of the present disclosure includes the first
substrate and the second substrate, and the remaining space between
the first substrate and the second substrate inside the sealant is
vacant or filled with air or inert gases, and thus the effects due
to the different coefficients of thermal expansion (CTE) between
different components may be low. Furthermore, in the package
structure (or the antenna device) of the embodiments of the present
disclosure, the wire (transmission line) passes through one of the
first substrate and the second substrate, the remaining space
(which is vacant or filled with air, inert gases or low
loss-tangent materials), and the redistribution layer to
electrically connect the metal layer (or the antenna unit) and the
die, and thus the dielectric loss may be effectively reduced.
Furthermore, the die in the package structure (or the antenna
device) of the embodiments of the present disclosure is sealed
between the first substrate and the second substrate inside the
sealant (and the sealant may be inside the potting compound layer
in some embodiments), and thus the package structure (or the
antenna device) may have better corrosion resistance and the
reliability of the package structure (or the antenna device) may be
effectively enhanced.
[0069] The foregoing outlines features of several embodiments so
that those skilled in the art may better understand the aspects of
the present disclosure. Those skilled in the art should appreciate
that they may readily use the present disclosure as a basis for
designing or modifying other processes and structures for carrying
out the same purposes and/or achieving the same advantages of the
embodiments introduced herein. Those skilled in the art should also
realize that such equivalent constructions do not depart from the
spirit and scope of the present disclosure, and that they may make
various changes, substitutions, and alterations herein without
departing from the spirit and scope of the present disclosure.
Therefore, the scope of protection should be determined by the
claims. In addition, although some embodiments of the present
disclosure are disclosed above, they are not intended to limit the
scope of the present disclosure.
[0070] Reference throughout this specification to features,
advantages, or similar language does not imply that all of the
features and advantages that may be realized with the present
disclosure should be or are in any single embodiment of the
disclosure. Rather, language referring to the features and
advantages is understood to mean that a specific feature,
advantage, or characteristic described in connection with an
embodiment is included in at least one embodiment of the present
disclosure. Thus, discussions of the features and advantages, and
similar language, throughout this specification may, but do not
necessarily, refer to the same embodiment.
[0071] Furthermore, the described features, advantages, and
characteristics of the disclosure may be combined in any suitable
manner in one or more embodiments. One skilled in the relevant art
will recognize, in light of the description herein, that the
disclosure can be practiced without one or more of the specific
features or advantages of a particular embodiment. In other
instances, additional features and advantages may be recognized in
certain embodiments that may not be present in all embodiments of
the disclosure.
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