U.S. patent application number 16/377125 was filed with the patent office on 2020-01-30 for thermoelectric device having circuitry that facilitates manufacture.
The applicant listed for this patent is Gentherm Incorporated. Invention is credited to Vladimir Jovovic, Eric Poliquin.
Application Number | 20200035898 16/377125 |
Document ID | / |
Family ID | 69178759 |
Filed Date | 2020-01-30 |
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United States Patent
Application |
20200035898 |
Kind Code |
A1 |
Jovovic; Vladimir ; et
al. |
January 30, 2020 |
THERMOELECTRIC DEVICE HAVING CIRCUITRY THAT FACILITATES
MANUFACTURE
Abstract
A thermoelectric device includes a thermally conductive first
plate and a plurality of thermoelectric sub-assemblies, each having
a thermally conductive second plate and a plurality of
thermoelectric elements in a region between the first plate and the
second plate. At least some electrically conductive portions of the
first plate are positioned at least partially outside the regions,
in electrical communication with the plurality of thermoelectric
sub-assemblies, and include a first electrically conductive portion
and a second electrically conductive portion. The first
electrically conductive portion is configured to be in electrical
communication with an input electrical conduit and the second
electrically conductive portion is configured to be in electrical
communication with an output electrical conduit. The first
electrically conductive portion and the second electrically
conductive portion are positioned at a first edge of the first
plate without a thermoelectric sub-assembly of the plurality of
thermoelectric sub-assemblies between the first electrically
conductive portion and the second electrically conductive
portion.
Inventors: |
Jovovic; Vladimir; (Ann
Arbor, MI) ; Poliquin; Eric; (Claremont, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Gentherm Incorporated |
Northville |
MI |
US |
|
|
Family ID: |
69178759 |
Appl. No.: |
16/377125 |
Filed: |
April 5, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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62712112 |
Jul 30, 2018 |
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62712131 |
Jul 30, 2018 |
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62715709 |
Aug 7, 2018 |
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62712143 |
Jul 30, 2018 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 35/34 20130101;
H01L 35/32 20130101; H01L 35/02 20130101; H01L 35/30 20130101; H01L
35/04 20130101 |
International
Class: |
H01L 35/32 20060101
H01L035/32; H01L 35/34 20060101 H01L035/34 |
Claims
1. A thermoelectric device comprising: a thermally conductive first
plate comprising: a layer comprising a plurality of electrically
conductive portions and a plurality of electrically insulating
portions separating the electrically conductive portions from one
another; and a plurality of thermoelectric sub-assemblies, each
thermoelectric sub-assembly of the plurality of thermoelectric
sub-assemblies comprising: a thermally conductive second plate; and
a plurality of thermoelectric elements in a region between the
first plate and the second plate, the plurality of thermoelectric
elements in electrical communication with the electrically
conductive portions of the first plate, in electrical communication
with electrically conductive portions of the second plate, and in
thermal communication with the first plate and the second plate, at
least some of the electrically conductive portions of the first
plate positioned at least partially outside the region, in
electrical communication with the plurality of thermoelectric
sub-assemblies, and comprising: a first electrically conductive
portion configured to be in electrical communication with an input
electrical conduit; and a second electrically conductive portion
configured to be in electrical communication with an output
electrical conduit, the first electrically conductive portion and
the second electrically conductive portion positioned at a first
edge of the first plate without a thermoelectric sub-assembly of
the plurality of thermoelectric sub-assemblies between the first
electrically conductive portion and the second electrically
conductive portion.
2. The thermoelectric device of claim 1, wherein the plurality of
electrically conductive portions comprises copper.
3. The thermoelectric device of claim 1, wherein the plurality of
electrically insulating portions does not contain an electrically
conductive material.
4. The thermoelectric device of claim 3, wherein the plurality of
electrically insulating portions comprises portions of the layer
from which an electrically conductive material has been
removed.
5. The thermoelectric device of claim 1, further comprising a
series electrical circuit comprising the at least some of the
electrically conductive portions of the first plate and the
thermoelectric elements of the thermoelectric sub-assemblies with
the first electrically conductive portion at a first end of the
series electrical circuit and the second electrically conductive
portion at a second end of the series electrical circuit.
6. The thermoelectric device of claim 1, further comprising at
least one material along at least a first portion of a perimeter of
the region, the at least one material in mechanical communication
with the first plate and the second plate, wherein the at least one
material extends over at least some of the electrically conductive
portions of the first plate.
7. A thermoelectric module for thermally conditioning a component,
the module comprising: the thermoelectric device of claim 1; first
and second heat spreaders spaced apart from one another and
configured to respectively provide cold and hot sides and to be
mechanically coupled together by at least one fastener, the first
and second heat spreaders operatively engaged with the
thermoelectric device; and a material arranged between the first
and second heat spreaders.
8. The thermoelectric module of claim 7, wherein the material has a
thermal conductivity less than 10 W/mK and is configured to reduce
heat transfer along a thermal path between the first and second
heat spreaders that does not extend through the thermoelectric
device.
9. The thermoelectric module of claim 7, wherein the material
provides hermetic sealing and/or a moisture barrier for the volume
occupied by the thermoelectric device.
10. A method of fabricating a thermoelectric device, the method
comprising: providing a first plate comprising an electrically
conductive layer; and removing portions of the electrically
conductive layer to form: a first electrically conductive portion
configured to be in electrical communication with an input
electrical conduit and a series electrical circuit comprising a
plurality of thermoelectric sub-assemblies; a second electrically
conductive portion configured to be in electrical communication
with an output electrical conduit and the series electrical
circuit; and a plurality of third electrically conductive portions
configured to be in electrical communication and in thermal
communication with a plurality of thermoelectric elements of the
plurality of thermoelectric sub-assemblies, the first electrically
conductive portion and the second electrically conductive portion
positioned at a first edge of the first plate without the plurality
of electrically conductive portions between the first electrically
conductive portion and the second electrically conductive
portion.
11. The method of claim 10, wherein removing portions of the
electrically conductive layer comprises forming a plurality of
electrically insulating portions separating the first electrically
conductive portion, the second electrically conductive portion, and
the plurality of electrically conductive portions from one
another.
12. The method of claim 10, wherein removing portions of the
electrically conductive layer comprises etching the electrically
conductive layer.
13. The method of claim 10, further comprising forming the
plurality of thermoelectric sub-assemblies on the first plate,
wherein said forming the plurality of thermoelectric sub-assemblies
comprises: connecting the plurality of thermoelectric elements in
electrical communication and in thermal communication with the
plurality of electrically conductive portions of the first plate;
and connecting a plurality of second plates to the plurality of
thermoelectric elements, wherein each thermoelectric sub-assembly
of the plurality of thermoelectric sub-assemblies comprises a
corresponding portion of the plurality of thermoelectric elements
in a region between the first plate and the corresponding second
plate.
14. The method of claim 13, further comprising depositing at least
one material along at least a first portion of a perimeter of the
region, the at least one material in mechanical communication with
the first plate and the second plate.
Description
INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS
[0001] Any and all applications for which a foreign or domestic
priority claim is identified in the Application Data Sheet as filed
with the present application are incorporated by reference and made
a part of this specification.
BACKGROUND
Field
[0002] This application relates to thermoelectric devices and
modules used for thermal management of components and/or systems,
including but not limited to batteries.
Description of the Related Art
[0003] Power electronics and other electrical devices, such as
batteries, can be sensitive to overheating, cold temperatures,
extreme temperatures, and operating temperature limits. The
performance of such devices may be diminished, sometimes severely,
when the devices are operated outside of recommended temperature
ranges. In semiconductor devices, integrated circuit dies can
overheat and malfunction. In batteries, including, for example,
batteries used for automotive applications in electrified or
electrical vehicles, battery cells and their components can degrade
when overheated or overcooled. Such degradation can manifest itself
in reduced battery storage capacity and/or reduced ability for the
battery to be recharged over multiple duty cycles. Furthermore,
high performance batteries for use in large systems (including, for
example, lithium based batteries used in electrical vehicles) have
certain properties (e.g., charging characteristics) and/or
safety-related events (e.g., potential fires due to
over-temperature conditions) that make thermal management of the
batteries and/or containment system desirable.
SUMMARY
[0004] In certain embodiments, a thermoelectric device is provided.
The thermoelectric device comprises a thermally conductive first
plate and a plurality of thermoelectric sub-assemblies. The first
plate comprises a layer comprising a plurality of electrically
conductive portions and a plurality of electrically insulating
portions separating the electrically conductive portions from one
another. Each thermoelectric sub-assembly of the plurality of
thermoelectric sub-assemblies comprises a thermally conductive
second plate and a plurality of thermoelectric elements in a region
between the first plate and the second plate. The plurality of
thermoelectric elements is in electrical communication with the
electrically conductive portions of the first plate, in electrical
communication with electrically conductive portions of the second
plate, and in thermal communication with the first plate and the
second plate. At least some of the electrically conductive portions
of the first plate are positioned at least partially outside the
region, in electrical communication with the plurality of
thermoelectric sub-assemblies, and comprise a first electrically
conductive portion and a second electrically conductive portion.
The first electrically conductive portion is configured to be in
electrical communication with an input electrical conduit and the
second electrically conductive portion is configured to be in
electrical communication with an output electrical conduit. The
first electrically conductive portion and the second electrically
conductive portion are positioned at a first edge of the first
plate without a thermoelectric sub-assembly of the plurality of
thermoelectric sub-assemblies between the first electrically
conductive portion and the second electrically conductive
portion.
[0005] In certain embodiments, a thermoelectric module for
thermally conditioning a component is provided. The module
comprises the thermoelectric device as described herein and first
and second heat spreaders spaced apart from one another and
configured to respectively provide cold and hot sides and to be
mechanically coupled together by at least one fastener. The first
and second heat spreaders are operatively engaged with the
thermoelectric device. The module further comprises a material
arranged between the first and second heat spreaders.
[0006] In certain embodiments, a method of fabricating a
thermoelectric device is provided. The method comprises providing a
first plate comprising an electrically conductive layer. The method
further comprises removing portions of the electrically conductive
layer to form a first electrically conductive portion, a second
electrically conductive portion, and a plurality of third
electrically conductive portions. The first electrically conductive
portion is configured to be in electrical communication with an
input electrical conduit and a series electrical circuit comprising
a plurality of thermoelectric sub-assemblies. The second
electrically conductive portion is configured to be in electrical
communication with an output electrical conduit and the series
electrical circuit. The plurality of third electrically conductive
portions is configured to be in electrical communication and in
thermal communication with a plurality of thermoelectric elements
of the plurality of thermoelectric sub-assemblies. The first
electrically conductive portion and the second electrically
conductive portion are positioned at a first edge of the first
plate without the plurality of electrically conductive portions
between the first electrically conductive portion and the second
electrically conductive portion.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1A schematically illustrates a top view of an example
thermoelectric device in accordance with certain embodiments
described herein.
[0008] FIGS. 1B and 1C schematically illustrate two cross-sectional
views of the example thermoelectric device of FIG. 1A.
[0009] FIGS. 2A-2B schematically illustrate a perspective view and
an exploded view, respectively, of an example thermoelectric device
comprising a plurality of thermoelectric sub-assemblies in
accordance with certain embodiments described herein.
[0010] FIG. 3A schematically illustrates an example first plate in
accordance with certain embodiments described herein.
[0011] FIG. 3B schematically illustrates an example series
electrical path in accordance with certain embodiments described
herein.
[0012] FIG. 4A schematically illustrates the example first plate of
FIG. 3A with a solder mask layer in accordance with certain
embodiments described herein.
[0013] FIG. 4B schematically illustrates a magnified view of a
corner of the first plate of FIG. 4A.
[0014] FIG. 5 schematically illustrates a thermoelectric module for
thermally conditioning a component in accordance with certain
embodiments described herein.
[0015] FIG. 6 is a flow diagram of an example method of fabricating
a thermoelectric device in accordance with certain embodiments
described herein.
DETAILED DESCRIPTION
[0016] Certain embodiments described herein advantageously provide
a thermoelectric device having circuitry that facilitates
manufacture of the thermoelectric device and/or of a thermoelectric
module comprising the thermoelectric device. For example, by having
the circuitry arranged such that the input electrical conduit and
output electrical conduit are in close proximity (e.g., next) to
one another, the electrical conduits of certain embodiments can be
run parallel to one another through the other structures of the
thermoelectric module, and the process of connecting the electrical
conduits to the thermoelectric device can be easier than if the two
electrical conduits were spaced further apart from one another.
[0017] FIG. 1A schematically illustrates a top view of an example
thermoelectric device 100 in accordance with certain embodiments
described herein. FIGS. 1B and 1C schematically illustrate two
cross-sectional views of the example thermoelectric device 100 of
FIG. 1A.
[0018] The thermoelectric device 100 of FIGS. 1A-1B comprises a
thermally conductive first plate 110 and a plurality of
thermoelectric sub-assemblies 114, each thermoelectric sub-assembly
114 comprising a thermally conductive second plate 120 and a
plurality of thermoelectric ("TE") elements 130. As shown
schematically in FIG. 1A, the first plate 110 comprises a layer 116
comprising a plurality of electrically conductive portions 118 and
a plurality of electrically insulating portions 119 separating the
electrically conductive portions 118 from one another. The
plurality of TE elements 130 is in a region 132 bounded by and
including (e.g., between) the first plate 110 and the second plate
120 and is in electrical communication with the electrically
conductive portions 118 of the first plate 110, in electrical
communication with electrical conductive portions 122 of the second
plate 120, and in thermal communication with the first plate 110
and the second plate 120. At least some of the electrically
conductive portions 118 of the first plate 110 are positioned at
least partially outside the regions 132, are in electrical
communication with the plurality of thermoelectric sub-assemblies
114, and comprise a first electrically conductive portion 118a
configured to be in electrical communication with an input
electrical conduit (not shown) and a second electrically conductive
portion 118b configured to be in electrical communication with an
output electrical conduit (not shown). The first electrically
conductive portion 118a and the second electrically conductive
portion 118b are positioned at a first edge 112 of the first plate
110 without a thermoelectric sub-assembly 114 of the plurality of
thermoelectric sub-assemblies 114 between the first electrically
conductive portion 118a and the second electrically conductive
portion 118b.
[0019] In certain embodiments, each of the first plate 110 and the
second plate 120 comprises a planar laminate structure (e.g., a
printed circuit board or PCB) having one or more electrically
conductive layers (e.g., copper; aluminum; metal; metal alloy or
composite) and one or more electrically insulating layers (e.g.,
fiberglass; resin; polymer; fibrous material preimpregnated with a
resin material such as epoxy). The one or more electrically
conductive layers can be configured to provide electrical
connections to the plurality of TE elements 130. For example, the
layer 116 can comprises an electrically conductive layer of the
first plate 110 wherein at least some of the electrically
conductive portions 118 comprise electrically conductive pads on a
surface of the first plate 110 in the region 132. The pads can be
configured to be coupled (e.g., soldered) to the TE elements 130,
and the pads can be in electrical communication with other pads of
the first plate 110 (e.g., by electrically conductive lines formed
by selective chemical etching of the electrically conductive layers
and by electrically conductive vias formed through the electrically
insulating layers). Similarly, at least some portions 122 of an
electrically conductive layer of the second plate 120 can comprise
electrically conductive pads on a surface of the second plate 120
in the region 132 which are configured to be coupled (e.g.,
soldered) to the TE elements 130, and the pads can be in electrical
communication with other pads of the second plate 120 (e.g., by
electrically conductive lines formed by selective chemical etching
of the electrically conductive layers and by electrically
conductive vias formed through the electrically insulating
layers).
[0020] In certain embodiments, the first plate 110 has a planar
parallelogram shape (e.g., rhombus shape; rectangular shape; square
shape) with four edges (e.g., a rectangular shape with two shorter
edges and two longer edges). The first plate 110 can have other
planar shapes (e.g., polygonal) with other numbers of edges in
accordance with certain embodiments described herein (e.g.,
triangular shapes with three edges; trapezoidal shapes with four
edges; pentagonal shapes with five edges; hexagonal shapes with six
edges; etc.). In certain embodiments, the second plate 120 has a
planar parallelogram shape (e.g., rhombus shape; rectangular shape;
square shape) with four edges 126 (e.g., a rectangular shape with
two shorter edges and two longer edges). The second plate 120 can
have other planar shapes (e.g., polygonal) with other numbers of
edges 126 in accordance with certain embodiments described herein
(e.g., triangular shapes with three edges; trapezoidal shapes with
four edges; pentagonal shapes with five edges; hexagonal shapes
with six edges; etc.).
[0021] In certain embodiments, the plurality of TE elements 130
comprises p-type TE elements and n-type TE elements in electrical
communication with one another through a plurality of shunts (e.g.,
electrically conductive pads of the first plate 110 and the second
plate 120). For example, the plurality of TE elements 130 can be
arranged in a "stonehenge" configuration in which p-type and n-type
TE elements alternate with one another and are in series electrical
communication with one another by shunts (e.g., electrically
conductive portions 118 of the first plate 110 and electrically
conductive portions 122 of the second plate 120) which are
alternately positioned on the first plate 110 and the second plate
120 such that electrical current can flow serially through the TE
elements 130 and the shunts in a serpentine fashion. In certain
embodiments, the plurality of TE elements 130 are in thermal
communication with the first plate 110 through the shunts (e.g.,
electrically conductive pads) on the surface of the first plate 110
and in thermal communication with the second plate 120 through the
shunts (e.g., electrically conductive pads) on the surface of the
second plate 120. In certain embodiments, the region 132 containing
the plurality of TE elements 130 is bounded by and includes (e.g.,
between) the first plate 110 and the second plate 120 and has a
perimeter defined by the second plate 120 (e.g., the perimeter is
coincident with the plurality of edges 126 of the second plate
120).
[0022] In certain embodiments, a top surface of the first plate 110
(e.g., a surface of the first plate 110 closest to the second plate
120) has a first surface area and a top surface of the second plate
120 (e.g., a surface of the second plate 120 farthest from the
first plate 110) has a second surface area less than the first
surface area. For example, each thermoelectric sub-assembly 114 of
the plurality of thermoelectric sub-assemblies 114 can comprise a
corresponding second plate 120 and a corresponding plurality of TE
elements 130 (e.g., the plurality of second plates 120 are mounted
to a common first plate 110), and the first plate 110 can have a
surface area larger than the sum of the surface areas of the second
plates 120. In certain embodiments, the first plate 110 and the
second plate 120 are spaced from one another by a gap having a gap
height. For example, the gap between the top surface of the first
plate 110 and a bottom surface of the second plate 120 (e.g., a
surface of the second plate 120 closest to the first plate 110) is
equal to the height of the TE elements 130 within the region 132,
as schematically illustrated by FIGS. 1B and 1C.
[0023] In certain embodiments, the plurality of electrically
conductive portions 118 of the layer 116 comprises an electrically
conductive material, examples of which include but are not limited
to: copper; aluminum; metal; metal alloy or composite, and the
plurality of electrically insulating portions 119 of the layer 116
does not contain an electrically conductive material. For example,
the layer 116 can comprise a copper layer from which some of the
copper has been removed (e.g., etched) such that the electrically
conductive portions 118 comprise copper remaining after this
removal (e.g., etching) from the layer 116, and the electrically
insulating portions 119 comprise portions of the layer 116 from
which the electrically conductive material (e.g., copper) has been
removed (e.g., etched), so the portions 119 comprise etched
portions of the layer 116.
[0024] In certain embodiments, at least some of the electrically
conductive portions 118 of the first plate 110 are positioned at
least partially outside the regions 132 and are in electrical
communication with the plurality of thermoelectric sub-assemblies
114. For example, as schematically illustrated in FIGS. 1A-1C,
electrically conductive portions 118a, 118b, 118c are positioned
partially outside the regions 132 of the thermoelectric
sub-assemblies 114 and are in electrical communication with the TE
elements 130 of the thermoelectric sub-assemblies 114. The
electrically conductive portions 118a, 118b of the layer 116 are
separated from one another by an electrically insulating portion
119 of the layer 116 and are configured to be in electrical
communication with an input electrical conduit (e.g., wire) and an
output electrical conduit (e.g., wire), respectively. The
electrically conductive portions 118a, 118b are positioned at the
first edge 112 of the first plate 110 without a thermoelectric
sub-assembly between the first electrically conductive portion 118a
and the second electrically conductive portion 118b.
[0025] The electrically conductive portion 118c is in electrical
communication with TE elements 130 of both thermoelectric
sub-assemblies 114 of FIGS. 1A-1C. For example, the TE elements 130
of the two thermoelectric sub-assemblies 114 are in series
electrical communication with one another by being in electrical
communication with the electrically conductive portion 118c. As
schematically illustrated in FIGS. 1A-1C, the series electrical
circuit comprises the electrically conductive portions 118a, 118b
of the first plate 110 and the thermoelectric elements 130 of the
thermoelectric sub-assemblies 114 with the first electrically
conductive portion 118a at a first end of the series electrical
circuit and the second electrically conductive portion 118b at a
second end of the series electrical circuit.
[0026] In certain embodiments, one or more of the thermoelectric
sub-assemblies 114 comprises at least one material (e.g., an
electrically insulating material; epoxy; polymer) along at least a
first portion of a perimeter of the region 132. The at least one
material is in mechanical communication with the first plate 110
and the second plate 120, and the at least one material extends
over at least some of the electrically conductive portions of the
first plate 110 (e.g., over the electrically conductive portions
118a, 118b, 118c). The at least one material can also extend over
the at least some of the electrically insulating portions 119 of
the first plate 110.
[0027] FIGS. 2A and 2B schematically illustrate a perspective view
and an exploded view, respectively, of an example thermoelectric
device 100 comprising a plurality of thermoelectric sub-assemblies
114 (e.g., four thermoelectric sub-assemblies 114) in accordance
with certain embodiments described herein. In FIGS. 2A and 2B, the
thermoelectric device 100 comprises a first plate 110 (e.g., PCB)
having a rectangular shape with a length L.sub.1 and a width
W.sub.1. The first plate 110 further comprises a plurality of holes
160 (e.g., configured to mount the thermoelectric device 100 within
a thermoelectric module) between the thermoelectric sub-assemblies
114. Each of the four thermoelectric sub-assemblies 114 of FIGS. 2A
and 2B comprises a plurality of TE elements 130, and a second plate
120 having a rectangular shape with a length L.sub.2 and a width
W.sub.2, and having a plurality of electrically conductive shunts
(not shown) (e.g., solder pads) configured to be in electrical and
thermal communication with the plurality of TE elements 130.
[0028] FIG. 2A also shows a pair of electrical conduits 162a, 162b
(e.g., wires) configured to be in electrical communication with
(e.g., soldered to) the first electrically conductive portion 118a
and the second electrically conductive portion 118b, respectively,
to transmit electrical power to and/or from the thermoelectric
sub-assemblies 114. The electrically conductive portions 118c
electrically connect the TE elements 130 of different
thermoelectric sub-assemblies 114 in series with one another. In
certain embodiments, the portions of the electrical conduits 162a,
162b that are coupled to (e.g., soldered onto) the electrically
conductive portions 118a, 118b is covered by at least one
electrically insulating material (e.g., epoxy; polymer) configured
to provide electrical insulation and/or structural rigidity to the
portions of the electrical conduits 162a, 162b that are coupled to
the electrically conductive portions 118a, 118b.
[0029] The thermoelectric sub-assemblies 114 of FIGS. 2A and 2B are
substantially equally spaced from one another (e.g., within .+-.5%;
within .+-.1%) across the first plate 110 with a pair of holes 160
between the longer edges of the second plates 120 of adjacent
thermoelectric sub-assemblies 114. In certain other embodiments,
the thermoelectric sub-assemblies 114 are not substantially equally
spaced from one another, and/or the number of holes 160 between the
adjacent thermoelectric sub-assemblies 114 is not equal to two
(e.g., one; more than two). The two shorter edges of the second
plates 120 of each of the thermoelectric sub-assemblies 114 of
FIGS. 2A and 2B are aligned (e.g., flush) with longer edges of the
first plate 110, and the two thermoelectric sub-assemblies 114 at
opposite ends of the thermoelectric device 100 have one of the
longer edges of the second plate 120 aligned (e.g., flush) with a
respective shorter edge of the first plate 110. In certain other
embodiments, other edges of the first plate 110 and other edges of
the second plate 120 can be aligned (e.g., flush) with one another
or can extend past one another.
[0030] FIG. 3A schematically illustrates an example first plate 110
in accordance with certain embodiments described herein. The first
plate 110 is configured to support four thermoelectric
sub-assemblies 114 and for each thermoelectric sub-assembly 114,
the first plate 110 comprises a plurality of electrically
conductive portions 118 and a plurality of electrically insulating
portions 119. In addition, at least some of the electrically
conductive portions 118a, 118b, 118c are positioned at least
partially outside the regions 132 of the thermoelectric
sub-assemblies 114 and are configured to form a series electrical
circuit 164 with the TE elements 130 of the thermoelectric
sub-assemblies 114. FIG. 3B schematically illustrates an example
electrical current path of the series electrical circuit 164 among
the various thermoelectric sub-assemblies 114 as a dashed arrowed
line. The electrical current path begins at the first electrical
conduit 162a and extends in series through the following: [0031]
the electrically conductive portion 118a; [0032] the TE elements
130 of a first thermoelectric sub-assembly 114a; [0033] an
electrically conductive portion 118c extending from the first
thermoelectric sub-assembly 114a to a second thermoelectric
sub-assembly 114b; [0034] a first set of TE elements 130 of the
second thermoelectric sub-assembly 114b; [0035] an electrically
conductive portion 118c extending from the second thermoelectric
sub-assembly 114b to a third thermoelectric sub-assembly 114c;
[0036] a first set of TE elements 130 of the third thermoelectric
sub-assembly 114b; [0037] an electrically conductive portion 118c
extending from the third thermoelectric sub-assembly 114c to a
fourth thermoelectric sub-assembly 114d; [0038] the TE elements of
the fourth thermoelectric sub-assembly 114d; [0039] an electrically
conductive portion 118c extending from the fourth thermoelectric
sub-assembly 114d to the third thermoelectric sub-assembly 114c;
[0040] a second set of TE elements 130 of the third thermoelectric
sub-assembly 114c; [0041] an electrically conductive portion 118c
extending from the third thermoelectric sub-assembly 114c to the
second thermoelectric sub-assembly 114b; [0042] a second set of TE
elements 130 of the second thermoelectric sub-assembly 114b; and
[0043] the second electrically conductive portion 118b to the
second electrical conduit 162b. Other configurations with other
series electrical circuits, electrical current paths,
thermoelectric sub-assemblies are also compatible with certain
embodiments described herein.
[0044] FIG. 4A schematically illustrates the example first plate
110 of FIG. 3A (excluding the plurality of holes 160) with a solder
mask layer 170 overlaying the plurality of electrically conductive
portions 118 and the plurality of electrically insulating portions
119 in accordance with certain embodiments described herein. FIG.
4B schematically illustrates a magnified view of a corner of the
first plate 110 of FIG. 4A, showing the solder mask layer 170
overlying peripheral regions 172 of the portions 118 and not
overlying central regions 174 (e.g., solder pad regions) of the
portions 118. The central regions 174 are configured to be used as
shunts which provide electrical communication and thermal
communication to the TE elements 130 of the thermoelectric
sub-assemblies 114. FIG. 4B also schematically illustrates that the
example first plate 110 has a laminate structure with a metal base
layer 180 (e.g., copper; aluminum; metal; metal alloy or
composite), an electrically insulating layer 182 (e.g., fiberglass;
resin; polymer; fibrous material preimpregnated with a resin
material such as epoxy) overlying the metal base, the layer 116
overlaying the electrically insulating layer, and the solder mask
layer overlaying the layer 116.
[0045] FIG. 5 schematically illustrates a thermoelectric module 400
for thermally conditioning a component (e.g., an electronics
component; a battery) in accordance with certain embodiments
described herein. The module 400 comprises a first heat spreader
410 and a second heat spreader 420 spaced apart from one another
and configured to respectively provide cold and hot sides. The
module 400 further comprises a material 430 arranged between the
first heat spreader 410 and the second heat spreader 420. The
module 400 further comprises a thermoelectric device 100
operatively engaged with the first heat spreader 410 and the second
heat spreader 420. In certain embodiments, the first heat spreader
410 and the second heat spreader 420 are configured to be
mechanically coupled together by at least one fastener (e.g., bolt;
screw; pin; rivet) (not shown).
[0046] The thermoelectric device 100 comprises a thermally
conductive first plate 110 in thermal communication with the first
heat spreader 410 and a plurality of thermoelectric sub-assemblies
114. For example, the first plate 110 can comprise at least one
hole 160 configured to have the at least one fastener extend
therethrough and the plurality of thermoelectric sub-assemblies 114
can be arranged to have the at least one fastener between adjacent
thermoelectric sub-assemblies 114 (see, e.g., FIG. 5). Although not
shown in FIG. 5, the first plate 110 comprises electrically
conductive portions 118 and electrically insulating portions 119 in
accordance with certain embodiments described herein (see, e.g.,
FIGS. 1A-1C, 2A-2B, and 3A-3B). Each thermoelectric sub-assembly
114 comprises a thermally conductive second plate 120 in thermal
communication with the second heat spreader 420 and having a
plurality of edges 126, and a plurality of TE elements 130 in a
region 132 bounded by and including (e.g., between) the first plate
110 and the second plate 120 and in thermal communication with the
first plate 110 and the second plate 120.
[0047] In certain embodiments, the first heat spreader 410 and the
second heat spreader 420 are configured to transfer heat away from
the component to be thermally conditioned. For example, as
schematically illustrated by FIG. 5, the first heat spreader 410
can be configured to transfer heat to the thermoelectric device 100
from the component to be thermally conditioned, and the second heat
spreader 420 can be configured to transfer heat away from the
thermoelectric device 100. The first heat spreader 410 can comprise
at least one first surface 412 configured to be in thermal
communication with the thermoelectric device 100 and at least one
second surface 414 configured to be in thermal communication with
the component to be thermally conditioned by the module 400, and
the second heat spreader 420 can comprise at least one first
surface 422 configured to be in thermal communication with the
thermoelectric device 100. For example, at least one second surface
424 of the second heat spreader 420 can comprise at least one heat
dissipation structure (e.g., at least one fin) configured to
transfer heat from the second heat spreader 420 to the ambient
surroundings. For another example, the second heat spreader 420 can
be configured to have a fluid coolant (e.g., liquid; air;
refrigerant) flow therethrough. While FIG. 5 schematically
illustrates an example thermoelectric module 400 in which the first
heat spreader 410 provides at least one cold side that receives
heat from the component to be thermally conditioned and in which
the second heat spreader 420 provides at least one hot side that
serves as a heat sink which receives heat from the thermoelectric
device 100, in certain other embodiments, the second heat spreader
420 provides the at least one cold side and the first heat spreader
410 provides the at least one hot side.
[0048] In certain embodiments, the material 430 comprises a
compressible material (e.g., polymer; plastic; rubber; fiberglass)
and is configured to be at least partially compressed by the first
heat spreader 410 and the second heat spreader 420 during assembly
of the thermoelectric module 400 while keeping the first heat
spreader 410 and the second heat spreader 420 from contacting one
another. In certain embodiments, the material 430 generally
surrounds the thermoelectric device 100 (e.g., as shown in FIG. 5),
and comprises conduits (e.g., holes; recesses; cut-out portions)
(not shown) configured to accommodate one or more electrical
conduits (e.g., wires) in electrical communication with the
thermoelectric device 100 by allowing the one or more electrical
conduits to extend from the thermoelectric device 100 to outside
the thermoelectric module 400. In certain embodiments in which the
thermoelectric device 100 comprises a plurality of thermoelectric
sub-assemblies 114, the material 430 does not extend between the
thermoelectric sub-assemblies 114. In certain embodiments, the
material 430 provides thermal insulation between the first heat
spreader 410 and the second heat spreader 420. For example, the
material 430 can have a low thermal conductivity (e.g., less than
10 W/mK) and can be configured to reduce a thermal short between
the first heat spreader 410 and the second heat spreader 420 (e.g.,
heat transfer along a thermal path between the first and second
heat spreaders 410, 420 that does not extend through the
thermoelectric device 100). In certain embodiments, the material
430 provides hermetic sealing and/or a moisture barrier for the
volume occupied by the thermoelectric device 100. For example the
material 430 can comprise an insulation ring configured to prevent
dust, condensate, moisture, or other particulates and/or fluids
from entering the volume occupied by the thermoelectric device
100.
[0049] In certain embodiments, the thermoelectric module 400
comprises at least one seal (e.g., hermetic seal) at least
partially surrounding a volume containing the thermoelectric
elements 130 of the thermoelectric device 100. For example, the at
least one seal can comprise a material (e.g., an electrically
insulating material; epoxy; polymer) along at least a portion of a
perimeter of the region 132 containing the thermoelectric elements
130. For another example, the at least one seal can comprise a
material (e.g., epoxy; acrylic; polymer; silicone) between the
first heat spreader 410 and the second heat spreader 420 and at
least partially surrounding a volume containing the thermoelectric
device 100 (e.g., potting a portion of the volume between the at
least one first surface 412 of the first heat spreader 410 and the
at least one first surface 422 of the second heat spreader 420. The
material can be sufficiently rigid to provide mechanical strength
to the thermoelectric module 400. In certain embodiments,
additional material (e.g., epoxy; acrylic; polymer; silicone) is
located and forms at least one seal between at least one screw head
of the at least one fastener (not shown) and the at least one
second surface 424 of the second heat spreader 420.
[0050] FIG. 6 is a flow diagram of an example method 600 of
fabricating a thermoelectric device 100 in accordance with certain
embodiments described herein. The example method 600 of certain
embodiments can also be used for fabricating a thermoelectric
module 400. While the method 600 is described by referring to the
structures schematically illustrated in FIGS. 1A-1C, 2A-2B, 3A-3B,
4A-4B, and 5, the method 600 is also compatible with other
structures.
[0051] In an operational block 610, the method 600 comprises
providing a first plate 110 comprising an electrically conductive
layer 116. In an operational block 620, the method further
comprises removing portions of the electrically conductive layer
116 to form a first electrically conductive portion 118a, a second
electrically conductive portion 118b, and a plurality of third
electrically conductive portions 118c. The first electrically
conductive portion 118a is configured to be in electrical
communication with an input electrical conduit 162a and a series
electrical circuit 164 comprising a plurality of thermoelectric
sub-assemblies 114. The second electrically conductive portion 118b
is configured to be in electrical communication with an output
electrical conduit 162b and the series electrical circuit 164. The
plurality of third electrically conductive portions 118c is
configured to be in electrical communication and in thermal
communication with a plurality of thermoelectric elements 130 of
the plurality of thermoelectric sub-assemblies 114. The first
electrically conductive portion 118a and the second electrically
conductive portion 118b are positioned at a first edge 112 of the
first plate 110 without the plurality of third electrically
conductive portions 118c between the first electrically conductive
portion 118a and the second electrically conductive portion
118b.
[0052] In certain embodiments, removing portions of the
electrically conductive layer 116 comprises forming a plurality of
electrically insulating portions 119 separating the first
electrically conductive portion 118a, the second electrically
conductive portion 118b, and the plurality of third electrically
conductive portions 118c from one another. For example, removing
portions of the electrically conductive layer 116 can comprise
etching the electrically conductive layer 116 to form the plurality
of electrically conductive portions 118 and the plurality of
electrically insulating portions 119.
[0053] In certain embodiments, the method 600 further comprises
forming the plurality of thermoelectric sub-assemblies 114 on the
first plate 110. For example, forming the plurality of
thermoelectric sub-assemblies can comprise connecting the plurality
of TE elements 130 in electrical communication and in thermal
communication with the plurality of electrically conductive
portions 118 of the first plate 110, and connecting a plurality of
second plates 120 to the plurality of TE elements 130. Each
thermoelectric sub-assembly can comprise a corresponding portion of
the plurality of thermoelectric elements 130 in a region 132
between the first plate 110 and the corresponding second plate 120.
In certain embodiments, the method 600 further comprises providing
the second plates 120. For example, providing the second plates 120
can comprise etching an electrically conductive layer of the second
plates to form the plurality of electrically conductive portions of
the second plates 120.
[0054] In certain embodiments, connecting the plurality of TE
elements 130 to the plurality of electrically conductive portions
118 of the first plate 110 and to the plurality of electrically
conductive portions of the second plate 120 comprises applying
solder to the electrically conductive portions 118 of the first
plate 110 and to the electrically conductive portions of the second
plate 120 and heating the solder to above a temperature above a
melting temperature of the solder while the TE elements 130 are in
contact with the solder. In certain embodiments, the method 600
further comprises applying a solder mask layer 170 over the first
plate 110 such that the solder mask layer 170 does not overlie
solder pad regions 174 of the electrically conductive first
portions 118, and the solder can be applied to the solder pad
regions 174. In certain embodiments, the method 600 further
comprises depositing at least one material along at least a first a
portion of a perimeter of the region 132, the at least one material
in mechanical communication with the first plate 110 and the second
plate 120 (e.g., to hermetically seal the TE elements 130; to
provide additional structural rigidity to the thermoelectric
assembly 100).
[0055] Discussion of the various embodiments herein has generally
followed the embodiments schematically illustrated in the figures.
However, it is contemplated that the particular features,
structures, or characteristics of any embodiments discussed herein
may be combined in any suitable manner in one or more separate
embodiments not expressly illustrated or described. In many cases,
structures that are described or illustrated as unitary or
contiguous can be separated while still performing the function(s)
of the unitary structure. In many instances, structures that are
described or illustrated as separate can be joined or combined
while still performing the function(s) of the separated structures.
Various features and aspects of the disclosed embodiments can be
combined with or substituted for one another. Any methods disclosed
herein need not be performed in the order recited.
[0056] The ranges disclosed herein also encompass any and all
overlap, sub-ranges, and combinations thereof. Language such as "up
to," "at least," "greater than," "less than," "between," and the
like includes the number recited. With respect to the use of any
plural and/or singular terms herein, those having skill in the art
can translate from the plural to the singular and/or from the
singular to the plural as is appropriate to the context and/or
application. The various singular/plural permutations may be
expressly set forth herein for sake of clarity. In general, terms
used herein are generally intended as "open" terms (e.g., the term
"including" should be interpreted as "including but not limited
to," the term "having" should be interpreted as "having at least,"
the term "includes" should be interpreted as "includes but is not
limited to," etc.). If a specific number is intended, such an
intent will be explicitly recited in the embodiment, and in the
absence of such recitation, no such intent is present.
[0057] Various embodiments have been described above. Although the
inventions have been described with reference to these specific
embodiments, the descriptions are intended to be illustrative and
are not intended to be limiting. Various modifications and
applications may occur to those skilled in the art without
departing from the spirit and scope of the inventions as defined in
the appended claims.
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