U.S. patent application number 16/040337 was filed with the patent office on 2020-01-23 for integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of .
This patent application is currently assigned to Micron Technology, Inc.. The applicant listed for this patent is Micron Technology, Inc.. Invention is credited to Si-Woo Lee, Deepak Chandra Pandey.
Application Number | 20200027486 16/040337 |
Document ID | / |
Family ID | 69141174 |
Filed Date | 2020-01-23 |
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United States Patent
Application |
20200027486 |
Kind Code |
A1 |
Pandey; Deepak Chandra ; et
al. |
January 23, 2020 |
Integrated Assemblies Which Include
Non-Conductive-Semiconductor-Material and
Conductive-Semiconductor-Material, and Methods of Forming
Integrated Assemblies
Abstract
Some embodiments include an integrated assembly which has
digit-line-contact-regions laterally spaced from one another by
intervening regions. Non-conductive-semiconductor-material is over
the intervening regions. Openings extend through the
non-conductive-semiconductor-material to the
digit-line-contact-regions.
Conductive-semiconductor-material-interconnects are within the
openings and are coupled with the digit-line-contact-regions. Upper
surfaces of the conductive-semiconductor-material-interconnects are
beneath a lower surface of the
non-conductive-semiconductor-material. Metal-containing-digit-lines
are over the non-conductive-semiconductor-material. Conductive
regions extend downwardly from the metal-containing-digit-lines to
couple with the conductive-semiconductor-material-interconnects.
Some embodiments include methods of forming integrated
assemblies.
Inventors: |
Pandey; Deepak Chandra;
(Uttarakhand, IN) ; Lee; Si-Woo; (Boise,
ID) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Micron Technology, Inc. |
Boise |
ID |
US |
|
|
Assignee: |
Micron Technology, Inc.
|
Family ID: |
69141174 |
Appl. No.: |
16/040337 |
Filed: |
July 19, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11C 5/10 20130101; H01L
27/10876 20130101; H01L 27/10823 20130101; H01L 27/10805 20130101;
G11C 11/401 20130101; H01L 27/10882 20130101; H01L 27/10814
20130101; H01L 27/10888 20130101; H01L 27/10885 20130101 |
International
Class: |
G11C 5/10 20060101
G11C005/10; G11C 11/401 20060101 G11C011/401; H01L 27/108 20060101
H01L027/108 |
Claims
1-27. (canceled)
28. An integrated assembly, comprising: laterally-spaced
digit-line-contact-regions; the digit-line-contact-regions being
comprised by pillars of active-region-material; intervening regions
being between the laterally-spaced digit-line-contact-regions;
non-conductive-semiconductor-material over the intervening regions;
openings extending through the
non-conductive-semiconductor-material to the
digit-line-contact-regions; a lower surface of the
non-conductive-semiconductor-material being vertically-spaced from
upper surfaces of the digit-line-contact-regions;
conductive-semiconductor-material-interconnects within the openings
and coupled with the digit-line-contact-regions, upper surfaces of
the conductive-semiconductor-material-interconnects being beneath
the lower surface of the non-conductive-semiconductor-material; and
metal-containing-digit-lines over the
non-conductive-semiconductor-material; conductive regions extending
downwardly from the metal-containing-digit-lines to couple with the
conductive-semiconductor-material-interconnects.
29. The integrated assembly of claim 28 wherein the
conductive-semiconductor-material-interconnects are directly
against the digit-line-contact-regions.
30. The integrated assembly of claim 28 wherein the
digit-line-contact-regions have a first lateral thickness along a
cross-section, and wherein the
conductive-semiconductor-material-interconnects have a second
lateral thickness along the cross-section; the second lateral
thickness being about the same as the first lateral thickness.
31. The integrated assembly of claim 28 wherein the
digit-line-contact-regions have a first lateral thickness along a
cross-section, and wherein the
conductive-semiconductor-material-interconnects have a second
lateral thickness along the cross-section; the second lateral
thickness being different than the first lateral thickness.
32. The integrated assembly of claim 28 wherein the
digit-line-contact-regions have a first lateral thickness along a
cross-section, and wherein the
conductive-semiconductor-material-interconnects have a second
lateral thickness along the cross-section; the second lateral
thickness larger than the first lateral thickness.
33. The integrated assembly of claim 28 wherein the
conductive-semiconductor-material-interconnects and the
active-region-material comprise a same semiconductor composition as
one another.
34. The integrated assembly of claim 28 wherein the
conductive-semiconductor-material-interconnects and the
active-region-material comprise different semiconductor
compositions relative to one another.
35. The integrated assembly of claim 28 wherein the
non-conductive-semiconductor-material and the
conductive-semiconductor-material-interconnects comprise a same
semiconductor composition as one another.
36. The integrated assembly claim 35 wherein said same composition
comprises silicon.
37. The integrated assembly of claim 28 wherein the
non-conductive-semiconductor-material and the
conductive-semiconductor-material-interconnects comprise different
semiconductor compositions relative to one another.
38. The integrated assembly of claim 28 wherein segments of the
metal-containing-digit-lines extend across the intervening regions
between the laterally-spaced digit-line-contact-regions; and
wherein said segments have lower surfaces directly against an upper
surface of the non-conductive-semiconductor-material.
39. The integrated assembly of claim 28 wherein segments of the
metal-containing-digit-lines extend across the intervening regions
between the laterally-spaced digit-line-contact-regions; and
further comprising at least one insulative material between lower
surfaces of said segments and an upper surface of the
non-conductive-semiconductor-material.
40. The integrated assembly of claim 39 wherein said at least one
insulative material includes silicon nitride.
41. The integrated assembly of claim 28 comprising:
charge-storage-device-contact-regions gatedly coupled with the
digit-line-contact-regions; and charge-storage-devices coupled with
the charge-storage-device-contact-regions.
42-44. (canceled)
45. An integrated assembly, comprising: an access transistor
including a digit-line-contact-region;
non-conductive-semiconductor-material over the access transistor,
the non-conductive-semiconductor-material including an opening that
is vertically aligned with the digit-line-contact-region;
insulative material between the
non-conductive-semiconductor-material and the access transistor; a
digit line over the non-conductive-semiconductor-material, the
digit line including a conductive interconnect protruding from a
part of the digit line toward the digit-line-contact-region;
wherein each of the digit line and the conductive interconnect
comprises metal; wherein the conductive interconnect penetrates
through the opening and is in electrical contact with the
digit-line-contact-region; wherein the insulative material includes
an additional opening that is vertically aligned with the
digit-line-contact-region; and wherein the conductive interconnect
of the digit line further penetrates through the additional
opening.
46. The integrated assembly of claim 45, further comprising
additional insulative material between the
non-conductive-semiconductor-material and the digit line; wherein
the additional insulative material includes a further additional
opening that is vertically aligned with the
digit-line-contact-region; and wherein the conductive interconnect
of the digit line further penetrates through the further additional
opening.
47. An integrated assembly comprising: a plurality of access
transistors, each of the plurality of access transistor including a
digit-line-contact-region; non-conductive material over the
plurality of access transistors, the non-conductive material
comprising insulative material and
non-conductive-semiconductor-material over the insulative material,
the non-conductive material including a plurality of openings to
expose at least one part of the digit-line-contact-region of an
associated one of the plurality of access transistors; a plurality
of conductive-semiconductor-material-interconnects each in an
associated one of the plurality of openings to make an electrical
contact with the at least one part of the digit-line-contact-region
of an associated one of the plurality of access transistors, each
of the plurality of conductive-semiconductor-material-interconnects
being recessed to leave a part of an associated one of the
plurality of openings so that each of the plurality of
conductive-semiconductor-material-interconnects is free from being
contact with the non-conductive-semiconductor-material; and at
least one digit line over the non-conductive material, the at least
one digit line including a plurality of conductive interconnects
each protruded downwardly to fill the part of an associated one of
the plurality of openings.
48. The integrated assemble of claim 47, wherein each of at least
one digit line and the plurality of conductive interconnects
comprises metal.
49. The integrated assembly of claim 47, wherein the non-conductive
material further comprises additional insulative material over the
non-conductive-semiconductor-material.
50. The integrated assembly of claim 48, wherein the
non-conductive-semiconductor-material comprises polysilicon doped
with substantially no impurities to indicate no conductivity and
each of the conductive-semiconductor-material-interconnects
comprises polysilicon doped with impurities to indicate
conductivity.
51. The integrated assembly of claim 48, wherein each of the
plurality of access transistors further includes a
charge-storage-device-contact region; and wherein the integrated
assembly further comprises a plurality of charge storage devices
each coupled to the charge-storage-device-contact region of an
associated one of the plurality of access transistors.
52. The integrated assembly of claim 51, wherein each of the
plurality of charge storage devices comprises a capacitor.
Description
TECHNICAL FIELD
[0001] Integrated assemblies which include
non-conductive-semiconductor-material and
conductive-semiconductor-material, and methods of forming
integrated assemblies.
BACKGROUND
[0002] Memory is one type of integrated circuitry, and is used in
computer systems for storing data. An example memory is DRAM
(dynamic random-access memory). DRAM cells may each comprise a
transistor in combination with a capacitor. The DRAM cells may be
arranged in an array; with wordlines extending along rows of the
array, and digit lines extending along columns of the array. The
wordlines may be coupled with the transistors of the memory cells.
Each memory cell may be uniquely addressed through a combination of
one of the wordlines with one of the digit lines.
[0003] It is desirable to develop new methods for fabricating
highly-integrated DRAM, and to develop new architectures fabricated
with such methods.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIGS. 1-4 are diagrammatic views of a region of an example
construction at an example initial process stage of an example
method of forming an example integrated assembly. FIGS. 1 and 3 are
diagrammatic cross-sectional top-down views; and FIGS. 2 and 4 are
diagrammatic cross-sectional side views. The view of FIG. 1 is a
diagrammatic top view. The view of FIG. 2 is along the lines 2-2 of
FIGS. 1, 3 and 4. The view of FIG. 3 is along the lines 3-3 of
FIGS. 2 and 4. The view of FIG. 4 is along the lines 4-4 of FIGS.
1, 2 and 3.
[0005] FIG. 5-7 are diagrammatic views of the region of the example
construction of FIGS. 1-4 at an example processing stage subsequent
to that of FIGS. 1-4. FIG. 5 is a diagrammatic top view; FIG. 6 is
a diagrammatic cross-sectional side view along the lines 6-6 f
FIGS. 5 and 7; and FIG. 7 is a diagrammatic cross-sectional side
view along the lines 7-7 of FIGS. 5 and 6.
[0006] FIG. 8-10 are diagrammatic views of the region of the
example construction of FIGS. 1-4 at an example processing stage
subsequent to that of FIGS. 5-7. FIG. 8 is a diagrammatic top view;
FIG. 9 is a diagrammatic cross-sectional side view along the lines
9-9 of FIGS. 8 and 10; and FIG. 10 is a diagrammatic
cross-sectional side view along the lines 10-10 of FIGS. 8 and
9.
[0007] FIG. 11-13 are diagrammatic views of the region of the
example construction of FIGS. 1-4 at an example processing stage
subsequent to that of FIGS. 8-10. FIG. 11 is a diagrammatic top
view; FIG. 12 is a diagrammatic cross-sectional side view along the
lines 12-12 of FIGS. 11 and 13; and FIG. 13 is a diagrammatic
cross-sectional side view along the lines 13-13 of FIGS. 11 and
12.
[0008] FIG. 14-16 are diagrammatic views of the region of the
example construction of FIGS. 1-4 at an example processing stage
subsequent to that of FIGS. 11-13. FIG. 14 is a diagrammatic top
view; FIG. 15 is a diagrammatic cross-sectional side view along the
lines 15-15 of FIGS. 14 and 16; and FIG. 16 is a diagrammatic
cross-sectional side view along the lines 16-16 of FIGS. 14 and
15.
[0009] FIG. 17-19 are diagrammatic views of the region of the
example construction of FIGS. 1-4 at an example processing stage
subsequent to that of FIGS. 14-16. FIG. 17 is a diagrammatic top
view; FIG. 18 is a diagrammatic cross-sectional side view along the
lines 18-18 of FIGS. 17 and 19; and FIG. 19 is a diagrammatic
cross-sectional side view along the lines 19-19 of FIGS. 17 and
18.
[0010] FIG. 20-22 are diagrammatic views of the region of the
example construction of FIGS. 1-4 at an example processing stage
subsequent to that of FIGS. 17-19. FIG. 20 is a diagrammatic top
view; FIG. 21 is a diagrammatic cross-sectional side view along the
lines 21-21 of FIGS. 20 and 22; and FIG. 22 is a diagrammatic
cross-sectional side view along the lines 22-22 of FIGS. 20 and
21.
[0011] FIG. 23 is diagrammatic cross-sectional side view along the
same cross-section as FIG. 21 at an example process stage which may
follow the process stage of FIG. 21.
[0012] FIG. 24 is a diagrammatic schematic view of a region of an
example memory array.
[0013] FIG. 25 is diagrammatic cross-sectional side view along the
same cross-section as FIG. 2 at an example process stage which may
be utilized alternatively to that of FIG. 2.
[0014] FIGS. 26-30 are diagrammatic cross-sectional views of the
construction of FIG. 25 at example process stages which may follow
the process stage of FIG. 25.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0015] Some embodiments include methods of forming connections to
digit-line-contact-regions. A non-conductive-semiconductor-material
may be formed across a construction comprising the
digit-line-contact-regions, and openings may be formed to extend
through the non-conductive-semiconductor-material to the
digit-line-contact-regions. Conductive-semiconductor-material may
be formed within the openings, and recessed so that an upper level
of the conductive-semiconductor-material is beneath a lower level
of the non-conductive-semiconductor-material. Accordingly, dopant
will not migrate from the conductive-semiconductor-material to the
non-conductive-semiconductor-material. Subsequently, digit lines
may be formed to extend across the
non-conductive-semiconductor-material, and may be coupled with the
conductive-semiconductor-material. Some embodiments include
integrated assemblies having interconnects of
conductive-semiconductor-material coupled with
digit-line-contact-regions. The interconnects have upper surfaces
beneath a lower surface of an expanse of
non-conductive-semiconductor-material. Digit lines extend across
the expanse and are coupled with the interconnects. Example
embodiments are described below with reference to FIGS. 1-30.
[0016] Referring to FIGS. 1-4, a portion of an example construction
10 is illustrated. Such construction may be formed with any
suitable methodology. The construction 10 may be an initial
construction utilized for some of the embodiments described herein.
The construction 10 is an example of an initial construction which
may be utilized for some of the embodiments described herein, and
it is to be understood that other constructions may be utilized
alternatively to the construction 10.
[0017] The construction 10 includes a plurality of active regions
12 extending upwardly from a semiconductor base 14. Some of the
active regions 12 are labeled as 12a-f so that they may be
distinguished relative to one another, and relative to others of
the active regions. All of the active regions 12 may be
substantially identical to one another; with the term
"substantially identical" meaning identical to within reasonable
tolerances of fabrication and measurement. The active regions 12
are illustrated with dashed lines (phantom view) in FIG. 1 in order
to indicate that they are under other materials.
[0018] The active regions 12 and semiconductor base 14 comprise
semiconductor material 16. Such semiconductor material may comprise
any suitable composition(s); and in some embodiments may comprise,
consist essentially of, or consist of one or more of silicon,
germanium, III/V semiconductor material (e.g., gallium phosphide),
semiconductor oxide, etc.; with the term III/V semiconductor
material referring to semiconductor materials comprising elements
selected from groups III and V of the periodic table (with groups
III and V being old nomenclature, and now being referred to as
groups 13 and 15). In some embodiments, the semiconductor material
16 may comprise, consist essentially of, or consist of
appropriately-doped silicon. The silicon may be in any suitable
form; and in some embodiments may be monocrystalline silicon. In
some embodiments, the semiconductor material 16 of the active
regions may be referred to as active-region-material. Such
active-region-material 16 is configured as pillars extending
upwardly from the base 14, as shown in FIGS. 2 and 4.
[0019] The base 14 may be referred to as a semiconductor substrate.
The term "semiconductor substrate" means any construction
comprising semiconductive material, including, but not limited to,
bulk semiconductive materials such as a semiconductive wafer
(either alone or in assemblies comprising other materials), and
semiconductive material layers (either alone or in assemblies
comprising other materials). The term "substrate" refers to any
supporting structure, including, but not limited to, the
semiconductor substrates described above.
[0020] The active regions 12 are spaced from one another by
intervening regions comprising insulative materials 18 and 28. The
insulative material 18 may comprise any suitable composition or
combination of compositions; and in some embodiments may comprise,
consist essentially of, or consist of silicon dioxide. The
insulative material 28 may comprise any suitable composition(s);
and in some embodiments may comprise, consist essentially of, or
consist of silicon dioxide and/or silicon nitride. The insulative
28 may be the same composition as the insulative material 18, or
may be a different composition relative to the insulative material
18.
[0021] Wordlines (i.e., access lines) 20 extend along a first
direction which may ultimately correspond to a row direction of a
memory array. The wordlines 20 are illustrated with dashed lines
(phantom view) indicated in FIG. 1 in order to indicate that they
are under other materials. Digit lines (i.e., sense lines,
bitlines) 22 will be formed with processing described herein
(example digit lines 22 are shown in FIGS. 20-22), and such digit
lines will extend along a second direction which may ultimately
correspond to a column direction of the memory array.
[0022] The wordlines 20 comprise conductive material 24. The
conductive material 24 may comprise any suitable electrically
conductive composition(s); such as, for example, one or more of
various metals (e.g., titanium, tungsten, cobalt, nickel, platinum,
ruthenium, etc.), metal-containing compositions (e.g., metal
silicide, metal nitride, metal carbide, etc.), and/or
conductively-doped semiconductor materials (e.g.,
conductively-doped silicon, conductively-doped germanium,
etc.).
[0023] The insulative material 28 is over the wordlines 20.
[0024] Gate dielectric material 30 extends around lower regions of
the wordlines 20, and is between the wordlines and the active
regions 12. The gate dielectric material 30 may comprise any
suitable composition(s); and in some embodiments may comprise,
consist essentially of, or consist of silicon dioxide.
[0025] The wordlines 20 comprise transistor gates along the active
regions 12. Each of the active regions may be considered to
comprise a digit-line-contact-region 32, and a
charge-storage-device-contact-region 34. The transistor gates
electrically couple the digit-line-contact-regions with the
charge-storage-device-contact-regions. The
digit-line-contact-regions 32 and the
charge-storage-device-contact-regions 34 are indicated in FIG. 3 to
assist the reader in understanding the relative locations of the
wordlines 20 relative to the digit-line-contact-regions 32 and the
charge-storage-device-contact-regions 34. However, it is to be
understood that the digit-line-contact-regions 32 and the
charge-storage-device-contact-regions 34 are actually higher up on
the active regions than the section of FIG. 3, as is indicated in
FIGS. 2 and 4.
[0026] The digit-line-contact-regions 32 are eventually coupled
with digit lines, and the charge-storage-device-contact-regions 34
are eventually coupled with charge-storage-devices (e.g.,
capacitors) as described in more detail below.
[0027] The digit-line-contact-regions 32 are laterally spaced from
one another by intervening regions 40, as shown in FIGS. 2 and
4.
[0028] A first insulative material 42 is formed to extend across
the digit-line-contact-regions 32, and across the intervening
regions 40 between the digit-line-contact regions 32. The first
insulative material 42 may comprise any suitable composition(s);
and in some embodiments may comprise, consist essentially of, or
consist of silicon nitride.
[0029] Non-conductive-semiconductor-material 44 is formed over the
first insulative material 42. The
non-conductive-semiconductor-material may comprise any suitable
semiconductor composition(s); and in some embodiments may comprise,
consist essentially of, or consist of one or more of silicon,
germanium, III/V semiconductor material, semiconductor oxide, etc.
In some embodiments, the non-conductive-semiconductor-material 44
may comprise, consist essentially of, or consist of silicon (e.g.,
polycrystalline silicon). Any level of doping within such material
is too low to place the material in an electrically-conductive
configuration, and accordingly the material is referred to as being
non-conductive (i.e., electrically insulative). In some
embodiments, the material 44 comprises silicon, and any
concentration of conductivity-enhancing dopant within such material
44 is less than or equal to about 10.sup.15 atoms/cm.sup.3 (i.e.,
no greater than about an intrinsic dopant level). In some
embodiments, the material 44 may comprise polysilicon doped with
substantially no impurities to indicate no conductivity; with the
phrase "doped with substantially no impurities to indicate no
conductivity" meaning that the material 44 is nonconductive. In
some embodiments, the material 44 may comprise polysilicon doped
with substantially no impurities to represent non-conductivity;
with the phrase "doped with substantially no impurities to
represent non-conductivity" meaning that the material 44 is
nonconductive.
[0030] A second insulative material 46 is formed over the
non-conductive-semiconductor-material 44. The second insulative
material 46 may comprise any suitable composition(s); and in some
embodiments may comprise, consist essentially of, or consist of
silicon dioxide.
[0031] FIG. 2 diagrammatically illustrates example thicknesses
T.sub.1, T.sub.2, T.sub.3 and T4 of various regions of materials
across the example construction 10. In some example embodiments,
the thickness T.sub.1 (i.e., the thickness between a bottom surface
of the insulative material 42 and top surfaces of the
active-material-regions 16) may be within a range of from about 10
angstroms (.ANG.) to about 300 .ANG.; the thickness T.sub.2 of the
first insulative material 42 may be within a range of from about 10
.ANG. to about 300 .ANG.; the thickness T.sub.3 of the
non-conductive-semiconductor-material 44 may be within a range of
from about 30 .ANG. to about 300 .ANG.; and the thickness T.sub.4
of the second insulative material 46 may be within a range of from
about 5 nanometers (nm) to about 500 nm.
[0032] In some embodiments, the
non-conductive-semiconductor-material 44 may be considered to be
configured as an expanse which extends across the
digit-line-contact-regions 32 and the intervening regions 40. Such
expanse has a lower surface 41 which is vertically-spaced from
upper surfaces of the digit-line-contact-regions 32. Such vertical
spacing corresponds to the combined thicknesses T.sub.1 and
T.sub.2.
[0033] Referring to FIGS. 5-7, openings 48 are formed to extend
through the second insulative material 46, the
non-conductive-semiconductor-material 44, and the first insulative
material 42; with such openings extending to the
digit-line-contact-regions 32. The openings 48 may be patterned
utilizing a mask (not shown) and any suitable etches.
[0034] Referring to FIGS. 8-10, conductive-semiconductor-material
50 is formed over the second insulative material 46 and within the
openings 48. The conductive-semiconductor-material 50 may comprise
any suitable semiconductor composition(s); and in some embodiments
may comprise, consist essentially of, or consist of one or more of
silicon, germanium, III/V semiconductor material, semiconductor
oxide, etc. In some embodiments, the
conductive-semiconductor-material 50 may comprise, consist
essentially of, or consist of silicon (e.g., polycrystalline
silicon). The conductive-semiconductor-material 50 may comprise a
same semiconductor composition as the
non-conductive-semiconductor-material 44 in some embodiments (e.g.,
both may comprise, consist essentially of, or consist of silicon),
and may comprise a different semiconductor composition relative to
the non-conductive-semiconductor-material 44 in other
embodiments.
[0035] The level of doping within the semiconductor material 50 is
sufficient to place the material in an electrically-conductive
configuration. In some embodiments, the material 50 comprises
silicon, and the concentration of conductivity-enhancing dopant
within such material 50 is at least about 10.sup.20 atoms/cm.sup.3;
and preferably at least about 10.sup.21 atoms/cm.sup.3. In some
embodiments, the material 50 may comprise polysilicon with
impurities to indicate conductivity; with the phrase "with
impurities to indicate conductivity" meaning that the material 50
is conductively doped. In some embodiments, the material 50 may
comprise polysilicon with impurities to represent conductivity;
with the phrase "with impurities to represent conductivity" meaning
that the material 50 is conductively doped.
[0036] The conductive-semiconductor-material 50 within the openings
48 is electrically coupled with the digit-line-contact-regions 32.
In the illustrated embodiment, the
conductive-semiconductor-material 50 directly contacts the
active-region-material 16 of the digit-line-contact-regions 32. In
other embodiments, one or more electrically-conductive materials
may be provided between the conductive-semiconductor-material 50
and the digit-line-contact regions 32.
[0037] The conductive-semiconductor-material 50 within the openings
48 may be considered to be configured as
conductive-semiconductor-material-interconnects 52 which are
electrically coupled with the digit-line-contact-regions 32.
[0038] The materials 42, 44, 46 and 50 may be considered together
to form a subassembly (or stack) 54. Such stack is subjected to a
planarization process (e.g., chemical-mechanical polishing) to form
a planarized upper surface 55 extending across the
non-conductive-semiconductor-material 44 and the
conductive-semiconductor-material 50, as shown in FIGS. 11-13. The
planarization removes the second insulative material 46 (FIGS.
8-10), and removes some of the conductive-semiconductor-material
50.
[0039] Referring to FIGS. 14-16, the
conductive-semiconductor-material 50 is recessed within the
openings 48. The conductive-semiconductor-material-interconnects 52
have uppermost surfaces 57, and such uppermost surfaces are
recessed to a level below the level of the lower surface 41 of the
non-conductive-semiconductor-material 44. FIG. 15 shows that the
uppermost surface 57 of the recessed
conductive-semiconductor-material 50 is below the lower surface 41
of the non-conductive-semiconductor-material 44 by a distance D.
The distance D may be any suitable distance; and in some
embodiments may be at least about 5 .ANG., at least about 10 .ANG.,
at least about 100 .ANG., etc. The recessing of the
conductive-semiconductor-material 50 within the openings 48
eliminates contact between the conductive-semiconductor-material 50
and the non-conductive-semiconductor-material 44, which can
eliminate transfer of dopant from the
conductive-semiconductor-material 50 to the
non-conductive-semiconductor-material 44. Accordingly, the
conductivity of the conductive-semiconductor-material-interconnects
52 is not reduced due to loss of dopant to the material 44, and
insulative properties of the material 44 are not altered due to
diffusion of dopant into the material 44.
[0040] Referring to FIGS. 17-19, conductive-digit-line-material 56
is formed over the non-conductive-semiconductor-material 44 and
within the openings 48. The conductive-digit-line-material 56 may
comprise any suitable electrically conductive composition(s); such
as, for example, one or more of various metals (e.g., titanium,
tungsten, cobalt, nickel, platinum, ruthenium, etc.),
metal-containing compositions (e.g., metal silicide, metal nitride,
metal carbide, etc.), and/or conductively-doped semiconductor
materials (e.g., conductively-doped silicon, conductively-doped
germanium, etc.). In some embodiments, the
conductive-digit-line-material 56 may comprise metal (e.g.,
titanium, tungsten, titanium silicide, titanium nitride, tungsten
silicide, tungsten nitride, etc.) and may be referred to as
metal-containing-digit-line-material.
[0041] In some embodiments, regions of the digit-line-material 56
within the openings 48 may be referred to as conductive regions 58
(or conductive interconnects) which extend downwardly to
electrically couple with the upper surfaces 57 of the
conductive-semiconductor-material-interconnects 52.
[0042] Insulative material 60 is formed over the
digit-line-material 56. The insulative material 60 may comprise any
suitable composition(s); and in some embodiments may comprise,
consist essentially of, or consist of silicon nitride.
[0043] Referring to FIGS. 20-22, the digit-line-material 56 is
patterned into digit lines 22. In embodiments in which the
digit-line-material 56 is a metal-containing material, the digit
lines 22 may be referred to as metal-containing-digit-lines.
[0044] In the shown embodiment, the insulative material 60 is
patterned into insulative capping structures 59 which extend along
top surfaces of the digit lines 22.
[0045] The cross-section of FIG. 22 shows a
digit-line-contact-region 32 having a first lateral thickness
(i.e., width) W.sub.1 and shows a
conductive-semiconductor-material-interconnect having a second
lateral thickness W.sub.2. The second lateral thickness W.sub.2 may
be about the same as the first lateral thickness W.sub.1 in some
embodiments (with the term "about the same" meaning the same to
within reasonable tolerances of fabrication and measurement), and
may be different than the first lateral thickness in other
embodiments. For instance, the second lateral thickness W.sub.2 may
be larger than the first lateral thickness in some embodiments, and
may be smaller than the first lateral thickness in other
embodiments.
[0046] In some embodiments, the active-region-material 16 may
comprise a same composition as the
conductive-semiconductor-material 50 (e.g., both may comprise
conductively-doped silicon having the same dopant types and
concentrations as one another), and accordingly the materials 16
and 50 may merge together into a single conductive structure. In
other embodiments, the materials 16 and 50 may comprise different
compositions relative to one another (e.g., may comprise different
semiconductor compositions relative to one another, may comprise
different dopant concentrations relative to one another and/or may
comprise different dopant types relative to one another).
[0047] In some embodiments, the digit lines 22 may be considered to
comprise segments 53 extending across the intervening regions 40
(with such intervening regions being shown in FIGS. 2 and 4, and
being described above). Lower surfaces 61 of the digit lines 22
along the segments 53 directly contact an upper surface 63 of the
non-conductive-semiconductor-material 44 in the illustrated
embodiment of FIGS. 20-22 (as shown along the cross-sections of
FIGS. 21 and 22).
[0048] The conductive interconnects 52 and 58 may be considered
together to be configured as conductive plugs 52/58. In the
embodiment of FIGS. 20-22, the digit-line-material terial 56 is
directly against an upper surface of the
non-conductive-semiconductor-material 44 across intervening regions
between the conductive plugs 52/58 (with such intervening regions
being analogous to the intervening regions 40 described above with
reference to FIGS. 1-4). In other embodiments, one or more
materials may be provided between the
non-conductive-semiconductor-material 44 and the
digit-line-material 56. An example of such other embodiments is
described below with reference to FIGS. 25-29.
[0049] Referring next to FIG. 23, a region of construction 10 is
shown at a processing stage following that of FIGS. 20-22; with
such region being shown along the same cross-section as FIG. 21.
The processing stage of FIG. 23 shows the
charge-storage-device-contact-regions 34 exposed and coupled with
example charge-storage-devices corresponding to capacitors 74. Each
of the capacitors 74 has a node connected with a reference voltage
78. The reference voltage may be ground or any other suitable
voltage.
[0050] In the shown embodiment, insulative-material-spacers 72 are
provided along sidewalls of the digit lines 22. The spacers 72 may
comprise any suitable composition(s); and in some embodiments may
comprise, consist essentially of, or consist of one or both of
silicon dioxide and silicon nitride.
[0051] The configuration of FIG. 23 may be considered to correspond
to a region of a memory array 82 (for instance, a DRAM array). The
memory array comprises memory cells which include an access
transistor (e.g., a transistor comprising a gate along one of the
wordlines 20, with the wordlines being shown in FIG. 22) coupled
with a charge-storage device (e.g., a capacitor 74). An example
memory array 82 is described with reference to FIG. 24. The memory
array includes digit lines (DL1-DL4) corresponding to the digit
lines 22, and includes wordlines (WL1-WL4) corresponding to the
wordlines 20. Memory cells 80 comprise transistors coupled with the
capacitors 74. Each of the memory cells 80 is uniquely addressed
through the combination of a wordline and a digit line.
[0052] The memory array 82 of FIG. 24 is a DRAM array in which each
of the memory cells 80 comprises a transistor and a capacitor. In
other embodiments, configurations analogous to those described
herein may be utilized in other memory arrays.
[0053] The methodology described above forms the insulative
material 46 directly against an upper surface of the
non-conductive-semiconductor-material 44, and planarizes down to an
upper surface of the non-conductive-semiconductor-material 44 at
the processing stage of FIGS. 11-13. In other embodiments,
protective material may be provided over the
non-conductive-semiconductor-material 44 to protect the material 44
during the planarization. Further, the protective material may be
"harder" then the material 44 and may thus provide a better
stopping point for the planarization process. FIG. 25 shows a
region of construction 10 at a processing stage analogous to that
of FIGS. 1-4 in accordance with an embodiment in which a protective
material 90 is provided between the
non-conductive-semiconductor-material 44 and the insulative
material 46. The illustrated region of FIG. 25 is shown along the
same cross-section as FIG. 2.
[0054] The protective material 90 may comprise any suitable
composition(s); and in some embodiments may comprise, consist
essentially of, or consist of silicon nitride. The protective
material 90 is formed over the
non-conductive-semiconductor-material 44, and may be formed with
any suitable processing. Subsequently, the insulative material 46
is formed over the protective material 90.
[0055] Referring to FIG. 26, the construction 10 is shown at a
processing stage subsequent to that of FIG. 25, and analogous to
that of FIG. 9. The openings 48 have been formed through the
materials 46, 90, 44 and 42; and the
conductive-semiconductor-material 50 has been formed across the
insulative 46 and within the openings 48. The materials 42, 44, 90,
46 and 50 may be considered together to be a subassembly (or stack)
54a analogous to the subassembly 54 shown in FIG. 9.
[0056] Referring to FIG. 27, the construction 10 is shown at a
processing stage subsequent to that of FIG. 26, and analogous to
that of FIG. 12. The assembly 54a (FIG. 26) is subjected to
planarization to form a planarized upper surface 55 extending
across the protective material 90 and the
conductive-semiconductor-material 50.
[0057] Referring to FIG. 28, the construction 10 is shown at a
processing stage subsequent to that of FIG. 27 and analogous to
that of FIG. 15. The conductive-semiconductor-material 50 is
recessed within the openings 48. The protective material 90 may or
may not be removed. If the protective material 90 is removed, such
removal may occur before or after the recessing of the
conductive-semiconductor-material 50. The process stage of FIG. 28
is an example process stage in which the protective material 90
remains after the recessing of the
conductive-semiconductor-material 50.
[0058] Referring to FIG. 29, the construction 10 is shown at a
processing stage subsequent to that of FIG. 28 and identical to
that of FIG. 21. The protective material 90 (FIG. 28) has been
removed, and the patterned digit-line-material 56 and insulative
material 60 are formed to extend across the construction; with the
patterned digit-line-material 56 being configured as the digit
lines 22. The construction of FIG. 29 may be subsequently processed
to form memory structures and arrays of the types described above
with reference to FIGS. 23 and 24.
[0059] In some embodiments, the protective material 90 may not be
removed, but may instead remain in a final construction. FIG. 30
shows construction 10 at a processing stage analogous to that of
FIG. 29, but in accordance with an embodiment in which the
protective material 90 remains between the
non-conductive-semiconductor-material 44 and the
digit-line-material 56. In the embodiment of FIG. 30, the digit
lines 22 have the segments 53 along the intervening regions between
the spaced-apart digit-line-contact regions 32, analogous to the
segments 53 described above with reference to FIGS. 20-22. However,
in contrast to the embodiment described above with reference to
FIGS. 20-22, the embodiment of FIG. 30 has lower surfaces 61 of the
digit-line-segments 53 directly against an upper surface 91 the
protective material 90. In some embodiments, the protective
material 90 may be representative of one or more insulative
materials provided between lower surfaces 61 of the segments 53 and
the upper surface 63 of the non-conductive-semiconductor-material
44.
[0060] The construction of FIG. 30 may be subsequently processed to
form memory structures and arrays of the types described above with
reference to FIGS. 23 and 24.
[0061] The methods and configurations described above pertain to
DRAM. However, it is to be understood that the methods and
configurations may be extended to any suitable applications; with
example suitable applications including, but not being limited to,
DRAM.
[0062] The assemblies and structures discussed above may be
utilized within integrated circuits (with the term "integrated
circuit" meaning an electronic circuit supported by a semiconductor
substrate); and may be incorporated into electronic systems. Such
electronic systems may be used in, for example, memory modules,
device drivers, power modules, communication modems, processor
modules, and application-specific modules, and may include
multilayer, multichip modules. The electronic systems may be any of
a broad range of systems, such as, for example, cameras, wireless
devices, displays, chip sets, set top boxes, games, lighting,
vehicles, clocks, televisions, cell phones, personal computers,
automobiles, industrial control systems, aircraft, etc.
[0063] Unless specified otherwise, the various materials,
substances, compositions, etc. described herein may be formed with
any suitable methodologies, either now known or yet to be
developed, including, for example, atomic layer deposition (ALD),
chemical vapor deposition (CVD), physical vapor deposition (PVD),
etc.
[0064] The terms "dielectric" and "insulative" may be utilized to
describe materials having insulative electrical properties. The
terms are considered synonymous in this disclosure. The utilization
of the term "dielectric" in some instances, and the term
"insulative" (or "electrically insulative") in other instances, may
be to provide language variation within this disclosure to simplify
antecedent basis within the claims that follow, and is not utilized
to indicate any significant chemical or electrical differences.
[0065] The particular orientation of the various embodiments in the
drawings is for illustrative purposes only, and the embodiments may
be rotated relative to the shown orientations in some applications.
The descriptions provided herein, and the claims that follow,
pertain to any structures that have the described relationships
between various features, regardless of whether the structures are
in the particular orientation of the drawings or are rotated
relative to such orientation.
[0066] The cross-sectional views of the accompanying illustrations
only show features within the planes of the cross-sections, and do
not show materials behind the planes of the cross-sections, unless
indicated otherwise, in order to simplify the drawings.
[0067] When a structure is referred to above as being "on",
"adjacent" or "against" another structure, it can be directly on
the other structure or intervening structures may also be present.
In contrast, when a structure is referred to as being "directly
on", "directly adjacent" or "directly against" another structure,
there are no intervening structures present.
[0068] Structures (e.g., layers, materials, etc.) may be referred
to as "extending vertically" to indicate that the structures
generally extend upwardly from an underlying base (e.g.,
substrate). The vertically-extending structures may extend
substantially orthogonally relative to an upper surface of the
base, or not.
[0069] Some embodiments include a method of forming an integrated
assembly. A construction is provided to have laterally-spaced
digit-line-contact-regions, and to have intervening regions between
the laterally-spaced digit-line-contact-regions. An expanse of
non-conductive-semiconductor-material is formed to extend across
the digit-line-contact-regions and the intervening regions. A lower
surface of the non-conductive-semiconductor-material is
vertically-spaced from upper surfaces of the
digit-line-contact-regions. Openings are formed to extend through
the non-conductive-semiconductor-material to the
digit-line-contact-regions.
Conductive-semiconductor-material-interconnects are formed within
the openings and are coupled with the digit-line-contact-regions.
Upper surfaces of the
conductive-semiconductor-material-interconnects are beneath the
lower surface of the non-conductive-semiconductor-material.
Metal-containing-digit-lines are formed over the
non-conductive-semiconductor-material, with conductive regions
extending downwardly from the metal-containing-digit-lines to
couple with the
conductive-semiconductor-material-interconnects.
[0070] Some embodiments include a method of forming an integrated
assembly. A construction is provided to have laterally-spaced
digit-line-contact-regions, and to have intervening regions between
the laterally-spaced digit-line-contact-regions. A first insulative
material is formed to extend across the digit-line-contact-regions
and across the intervening regions. A
non-conductive-semiconductor-material is formed over the first
insulative material. A second insulative material is formed over
the non-conductive-semiconductor-material. Openings are formed to
extend through the second insulative material, the
non-conductive-semiconductor-material and the first insulative
material to the digit-line-contact-regions.
Conductive-semiconductor-material is formed over the second
insulative material and within the openings. The
conductive-semiconductor-material within the openings electrically
couples with the digit-line-contact-regions. The first insulative
material, non-conductive-semiconductor-material, second insulative
material and conductive-semiconductor-material together form a
subassembly. An upper surface of the subassembly is planarized to
remove the second insulative material and the
conductive-semiconductor-material from over the
non-conductive-semiconductor-material. The planarized upper surface
extends across the non-conductive-semiconductor-material and the
conductive-semiconductor-material. The
conductive-semiconductor-material within the openings is recessed
after the planarizing until an upper surface of the
conductive-semiconductor-material is below a level of a lower
surface of the non-conductive-semiconductor-material.
Metal-containing-digit-lines are formed over the
non-conductive-semiconductor-material, with conductive regions
extending downwardly from the metal-containing-digit-lines to
electrically couple with the recessed
conductive-semiconductor-material.
[0071] Some embodiments include a method of forming an integrated
assembly. A construction is provided to have laterally-spaced
digit-line-contact-regions, and to have intervening regions between
the laterally-spaced digit-line-contact-regions. A first insulative
material is formed to extend across the digit-line-contact-regions
and across the intervening regions. A
non-conductive-semiconductor-material is formed over the first
insulative material. A protective material is formed over the
non-conductive-semiconductor-material. A second insulative material
is formed over the protective material. Openings are formed to
extend through the second insulative material, the protective
material, the non-conductive-semiconductor-material and the first
insulative material to the digit-line-contact-regions.
Conductive-semiconductor-material is formed over the second
insulative material and within the openings. The
conductive-semiconductor-material within the openings electrically
couples with the digit-line-contact-regions. The first insulative
material, non-conductive-semiconductor-material, protective
material, second insulative material and
conductive-semiconductor-material together form a subassembly. An
upper surface of the subassembly is planarized to remove the second
insulative material and the conductive-semiconductor-material from
over the protective material. The planarized upper surface extends
across the protective material and the
conductive-semiconductor-material. The
conductive-semiconductor-material is recessed within the openings
after the planarizing, until an upper surface of the
conductive-semiconductor-material is below a level of a lower
surface of the non-conductive-semiconductor-material.
Metal-containing-digit-lines are formed over the
non-conductive-semiconductor-material, with conductive regions
extending downwardly from the metal-containing-digit-lines to
electrically couple with the recessed
conductive-semiconductor-material.
[0072] Some embodiments include an integrated assembly which has
laterally-spaced digit-line-contact-regions. The
digit-line-contact-regions are comprised by pillars of
active-region-material. Intervening regions are between the
laterally-spaced digit-line-contact-regions.
Non-conductive-semiconductor-material is over the intervening
regions. Openings extend through the
non-conductive-semiconductor-material to the
digit-line-contact-regions. A lower surface of the
non-conductive-semiconductor-material is vertically-spaced from
upper surfaces of the digit-line-contact-regions.
Conductive-semiconductor-material-interconnects are within the
openings and are coupled with the digit-line-contact-regions. Upper
surfaces of the conductive-semiconductor-material-interconnects are
beneath the lower surface of the
non-conductive-semiconductor-material. Metal-containing-digit-lines
are over the non-conductive-semiconductor-material. Conductive
regions extend downwardly from the metal-containing-digit-lines to
couple with the
conductive-semiconductor-material-interconnects.
[0073] Some embodiments include an integrated assembly which has an
access transistor including a digit-line-contact-region;
non-conductive-semiconductor-material over the access transistor,
the non-conductive-semiconductor-material including an opening that
is vertically aligned with the digit-line-contact-region; and a
digit line over the non-conductive-semiconductor-material, the
digit line including a conductive interconnect protruding from a
part of the digit line toward the digit-line-contact-region. Each
of the digit line and the conductive interconnect comprises metal.
The conductive interconnect penetrates through the opening and is
in electrical contact with the digit-line-contact-region.
[0074] Some embodiments include an integrated assembly which has an
integrated assembly which has comprising: a plurality of access
transistors, each of the plurality of access transistor including a
digit-line-contact-region; non-conductive material over the
plurality of access transistors, the non-conductive material
comprising insulative material and
non-conductive-semiconductor-material over the insulative material,
the non-conductive material including a plurality of openings to
expose at least one part of the digit-line-contact-region of an
associated one of the plurality of access transistors; a plurality
of conductive-semiconductor-material-interconnects each in an
associated one of the plurality of openings to make an electrical
contact with the at least one part of the digit-line-contact-region
of an associated one of the plurality of access transistors, each
of the plurality of conductive-semiconductor-material-interconnects
being recessed to leave a part of an associated one of the
plurality of openings so that each of the plurality of
conductive-semiconductor-material-interconnects is free from being
contact with the non-conductive-semiconductor-material; and at
least one digit line over the non-conductive material, the at least
one digit line including a plurality of conductive interconnects
each protruded downwardly to fill the part of an associated one of
the plurality of openings.
[0075] In compliance with the statute, the subject matter disclosed
herein has been described in language more or less specific as to
structural and methodical features. It is to be understood,
however, that the claims are not limited to the specific features
shown and described, since the means herein disclosed comprise
example embodiments. The claims are thus to be afforded full scope
as literally worded, and to be appropriately interpreted in
accordance with the doctrine of equivalents.
* * * * *