U.S. patent application number 16/167517 was filed with the patent office on 2019-12-12 for circuit board, camera module, and method for labeling the circuit board.
The applicant listed for this patent is HON HAI PRECISION INDUSTRY CO., LTD., TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.. Invention is credited to SHIN-WEN CHEN, SHENG-JIE DING, JING-WEI LI, JIAN-CHAO SONG.
Application Number | 20190379808 16/167517 |
Document ID | / |
Family ID | 68764375 |
Filed Date | 2019-12-12 |
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United States Patent
Application |
20190379808 |
Kind Code |
A1 |
CHEN; SHIN-WEN ; et
al. |
December 12, 2019 |
CIRCUIT BOARD, CAMERA MODULE, AND METHOD FOR LABELING THE CIRCUIT
BOARD
Abstract
A circuit board includes an assembly and a labeling area. The
assembly area is for installation of the elements. The labeling
area is for marking of the circuit board. A paint layer is coated
on a surface of the labeling area. A two-dimensional code is
printed on the paint layer. A camera module having the circuit
board and a method for labeling the circuit board are also
provided.
Inventors: |
CHEN; SHIN-WEN; (Tu-Cheng,
TW) ; DING; SHENG-JIE; (Shenzhen, CN) ; LI;
JING-WEI; (Shenzhen, CN) ; SONG; JIAN-CHAO;
(Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
HON HAI PRECISION INDUSTRY CO., LTD. |
Shenzhen
New Taipei |
|
CN
TW |
|
|
Family ID: |
68764375 |
Appl. No.: |
16/167517 |
Filed: |
October 22, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 1/189 20130101;
H05K 1/148 20130101; H05K 1/0269 20130101; H05K 2201/09918
20130101; H04N 5/22521 20180801; H04N 5/2253 20130101; H04N 5/2254
20130101; H05K 2201/10151 20130101; H05K 2203/107 20130101; H05K
2201/10189 20130101; H05K 1/0266 20130101; H04N 5/2257 20130101;
H05K 2201/10121 20130101 |
International
Class: |
H04N 5/225 20060101
H04N005/225; H05K 1/02 20060101 H05K001/02; H05K 1/18 20060101
H05K001/18 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 11, 2018 |
CN |
201810599395.X |
Claims
1. A circuit board comprising: an assembly area; and a labeling
area connected to the assembly area; wherein a paint layer is
coated on a surface of the labeling area, a two-dimensional code is
printed on the paint layer.
2. The circuit board of claim 1, wherein the two-dimensional code
is formed by laser.
3. The circuit board of claim 1, wherein the paint layer is white
paint.
4. A camera module comprising: a circuit board comprising: an
assembly area for installation of the elements; a labeling area for
marking of the circuit board; wherein a paint layer is coated on a
surface of the labeling area, a two-dimensional code is printed on
the paint layer.
5. The camera module of claim 4, wherein the two-dimensional code
is printed on the paint layer by laser.
6. The camera module of claim 5, wherein the paint layer is white
paint.
7. The camera module of claim 5, further comprising a connector,
wherein the connector is fixed on the labeling area and is opposite
to the paint layer.
8. A method for labeling circuit board, comprising: providing a
circuit board, the circuit board comprising an assembly area and a
labeling area connected to the assembly area. painting a paint
layer on the assembly area; and printing a two-dimensional code on
the paint layer.
9. The method of claim 8, wherein the two-dimensional code is
printed on the paint layer by laser.
10. The method of claim 8, wherein the paint layer is white paint.
Description
FIELD
[0001] The subject matter relates to circuit board, and more
particularly, to a circuit board, a camera module having the
circuit board, and a method for labeling the circuit board.
BACKGROUND
[0002] Camera modules generally comprise carrier substrates, image
sensors, lens holders, and lens barrels. The image sensor and the
lens holder are fixed on the substrate. The lens barrel is housed
in the lens holder. During manufacturing, in order to track the
camera module, a barcode or a serial number is attached to the
camera module. Or, a steel sheet with laser printed two-dimensional
code is printed on a printed circuit board of the camera module.
However, the bar code or the serial number may be easily damaged
and fall off, causing it to be inconvenient for long-term
preservation. Furthermore, laser printing of the two-dimensional
codes on steel sheets has relatively high prices and increases the
cost of camera modules.
[0003] Accordingly, there is room for improvement within the
art.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] Implementations of the present technology will now be
described, by way of example only, with reference to the attached
figures, wherein:
[0005] FIG. 1 is a diagram of a first embodiment of a camera
module.
[0006] FIG. 2 is an exploded diagram of the camera module of FIG.
1.
[0007] FIG. 3 is a flow chart of a method for labeling a circuit
board of the camera module in FIG. 1.
DETAILED DESCRIPTION
[0008] It will be appreciated that for simplicity and clarity of
illustration, where appropriate, reference numerals have been
repeated among the different figures to indicate corresponding or
analogous elements. In addition, numerous specific details are set
forth in order to provide a thorough understanding of the
embodiments described herein. However, it will be understood by
those of ordinary skill in the art that the embodiments described
herein can be practiced without these specific details.
[0009] In other instances, methods, procedures, and components have
not been described in detail so as not to obscure the related
relevant feature being described. Also, the description is not to
be considered as limiting the scope of the embodiments described
herein. The drawings are not necessarily to scale and the
proportions of certain parts may be exaggerated to better
illustrate details and features of the present disclosure.
[0010] One definition that applies throughout this disclosure will
now be presented.
[0011] The term "substantially" is defined to be essentially
conforming to the particular dimension, shape, or other feature
that the term modifies, such that the component need not be exact.
For example, "substantially rectangular" means that the object
resembles a rectangle, but can have one or more deviations from a
true rectangle.
[0012] The term "comprising," when utilized, means "including, but
not necessarily limited to"; it specifically indicates open-ended
inclusion or membership in the so-described combination, assembly,
series, and the like.
[0013] FIGS. 1 and 2 show an embodiment of a camera module 100. The
camera module 100 includes a circuit board 10, an image sensor 20,
a protective plate 30, a lens holder 40, and a lens barrel 50.
[0014] The circuit board 10 includes a first surface 12 and a
second surface 14. The first surface 12 and the second surface 14
are located on opposite surfaces of the circuit board 10 and,
typically, the first surface 12 will be an upper surface and the
second surface 14 will be a lower surface. In an embodiment, the
first surface 12 is parallel to the second surface 14. The first
surface 12 includes an assembly area 122 and a labeling area 124.
The assembly area 122 connects to the labeling area 124. In an
embodiment, the assembly area 122 and the labeling area 124 are
connected by a flexible board. The labeling area 124 is coated with
a paint layer 126. The color of the paint layer 126 can be varied
as needed. In an embodiment, the paint layer 126 is white. A
two-dimensional code 128 is printed on the paint layer 126. In an
embodiment, the two-dimensional code 128 is formed by laser
printing.
[0015] The image sensor 20 is fixed on the assembly area 122, and
is electrically connected to the circuit board 10.
[0016] The protective plate 30 is positioned on the assembly area
122, and covers the image sensor 20. The protective plate 30 is
configured to protect the image sensor 20 from being contaminated
by dust and other contaminants. The protective plate 30 may be a
glass substrate or a transparent plastic plate. In the embodiment,
the protective plate 30 is a glass substrate.
[0017] The lens holder 40 is fixed on the assembly area 122. The
lens holder 40 is made of plastic. The image sensor 20 and the
protective plate 30 are both accommodated in the lens holder 40.
The lens holder 40 includes a base 42 and a receiving portion 44.
The receiving portion 44 is disposed on the base 42.
[0018] The base 42 is substantially rectangular. The base 42
includes a top surface 422 and a bottom surface 424. The top
surface 422 and the bottom surface 424 are located at opposite ends
of the base 42. In the embodiment, the top surface 422 is parallel
to the bottom surface 424. A first opening 420 is defined in the
base 42. The first opening 420 penetrates the top surface 422 and
the bottom surface 424. The first opening 420 is rectangular. The
first opening 420 is configured for receiving the image sensor 20
and the protective plate 30.
[0019] The receiving portion 44 is substantially cylindrical. A
second opening 440 is defined in the receiving portion 44. The
second opening 440 is configured for receiving the lens barrel 50.
The second opening 440 goes through the receiving portion 44. The
second opening 440 is cylindrical. The second opening 440 connects
to the first opening 420.
[0020] The lens barrel 50 is made of a metal. The lens barrel 50 is
accommodated in the second opening 440. The diameter of the lens
barrel 50 matches the diameter of the second opening 440.
[0021] The camera module 100 also comprises a connector 60. The
connector 60 is configured to connect the camera module 100 to
other electronic devices (not shown). The connector 60 is fixed on
the second surface 14, and is opposite to the paint layer 126. In
other embodiments, the connector 60 can also be formed on the
labeling area 124. The paint layer 126 and the two-dimensional code
128 are formed on the second surface 14.
[0022] During installation, the image sensor 20 and the protective
plate 30 are fixed to the assembly area 122. The lens holder 40 is
fixed on the circuit board 10. The image sensor 20 and the
protective plate 30 are accommodated in the first opening 420. The
lens barrel 50 is positioned in the second opening 440. The
position of the lens barrel 50 is adjusted to cause the central
axis of the lens barrel 50 to be aligned with the center of the
image area of the image sensor 20.
[0023] FIG. 3 shows an embodiment of a method for marking the
circuit board 10. The method is provided by way of example, as
there are a variety of ways to carry out the method. Each block
shown in the figure represents one or more processes, methods, or
subroutines, carried out in the example method. Furthermore, the
illustrated order of blocks is illustrative only and the order of
the blocks can change. Additional blocks can be added or fewer
blocks may be utilized or the order of the blocks may be changed,
without departing from this disclosure. The method can begin at
block 31.
[0024] At block 31, a circuit board 10 is provided, the circuit
board 10 includes an assembly area 122 and a labeling area 124
connected to the assembly area 122.
[0025] The circuit board 10 includes a first surface 12 and a
second surface 14 opposite to each other. The first surface 12
includes the assembly area 122 and the labeling area 124.
[0026] At block 32, a paint layer 126 is painted on the assembly
area 122.
[0027] The paint layer 126 is formed on the labeling area 124.
[0028] At block 33, a two-dimensional code 128 is printed on the
paint layer 126.
[0029] The two-dimensional code 128 is printed on the paint layer
126.
[0030] In an embodiment, the paint layer 126 includes white paint.
The two-dimensional code 128 is formed by laser.
[0031] With the above configuration, the paint layer 126 is coated
on the circuit board 10, and the two-dimensional code 128 is
printed on the paint layer 126. The paint layer 126 and the
two-dimensional code 128 are not easily damaged and fall off, which
facilitates for long-term preservation. The method for marking the
circuit board 10 is simple which reduces the cost.
[0032] The embodiments shown and described above are only examples.
Many details are often found in the art. Therefore, many such
details are neither shown nor described. Even though numerous
characteristics and advantages of the present technology have been
set forth in the foregoing description, together with details of
the structure and function of the present disclosure, the
disclosure is illustrative only, and changes may be made in the
detail, especially in matters of shape, size, and arrangement of
the parts within the principles of the present disclosure, up to
and including the full extent established by the broad general
meaning of the terms used in the claims. It will therefore be
appreciated that the embodiments described above may be modified
within the scope of the claims.
* * * * *