U.S. patent application number 16/408695 was filed with the patent office on 2019-12-05 for plasmon resonance imaging apparatus having metal-insulator-metal nanocups.
The applicant listed for this patent is The Board of Trustees of the University of Illinois. Invention is credited to Abid Ameen, Faiza Khawar Dar, Lynford L. Goddard, Lisa Anne Plucinski Hackett, Gang Logan Liu.
Application Number | 20190369019 16/408695 |
Document ID | / |
Family ID | 68694690 |
Filed Date | 2019-12-05 |
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United States Patent
Application |
20190369019 |
Kind Code |
A1 |
Liu; Gang Logan ; et
al. |
December 5, 2019 |
Plasmon Resonance Imaging Apparatus Having Metal-Insulator-Metal
Nanocups
Abstract
Provided are plasmon resonance imaging devices having
metal-insulator-metal nanocups and methods of use thereof.
Inventors: |
Liu; Gang Logan; (Champaign,
IL) ; Goddard; Lynford L.; (Champaign, IL) ;
Ameen; Abid; (Chandler, AZ) ; Hackett; Lisa Anne
Plucinski; (Albuquerque, NM) ; Dar; Faiza Khawar;
(Chandler, AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
The Board of Trustees of the University of Illinois |
Urbana |
IL |
US |
|
|
Family ID: |
68694690 |
Appl. No.: |
16/408695 |
Filed: |
May 10, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62669417 |
May 10, 2018 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B82Y 15/00 20130101;
B82B 3/0019 20130101; B82Y 40/00 20130101; G01N 21/554 20130101;
B82B 3/0014 20130101; B82Y 20/00 20130101; G01N 33/54373 20130101;
B82B 1/001 20130101; G01N 33/54366 20130101 |
International
Class: |
G01N 21/552 20060101
G01N021/552; G01N 33/543 20060101 G01N033/543 |
Goverment Interests
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0002] This invention was made with government support under
DE-FG02-07ER46471 awarded by the Department of Energy. The
government has certain rights in the invention.
Claims
1. An apparatus, comprising: a substrate layer having a top surface
and a bottom surface, wherein a plurality of nanocups are defined
in the substrate layer, wherein the plurality of nanocups each have
at least one sidewall surface and a bottom surface; a first metal
layer disposed on the top surface of the substrate layer and a
second metal layer disposed on the bottom surface of each of the
plurality of nanocups; a first layer of titanium dioxide disposed
on the first metal layer disposed on the top surface of the
substrate layer and a second layer of titanium dioxide disposed on
the second metal layer disposed on the bottom surface of each of
the plurality of nanocups; a third metal layer disposed on the
first layer of titanium dioxide and a fourth metal layer disposed
on the second layer of titanium dioxide; and a layer of titanium
dioxide and a plurality of metal nanoparticles on the at least one
sidewall surface of the plurality of nanocups.
2. The apparatus of claim 1, wherein the nanocups have a
frustoconical shape.
3. The apparatus of claim 1, wherein the substrate is a
polymer.
4. The apparatus of claim 1, wherein the substrate is transparent
or translucent.
5. The apparatus of claim 1, wherein the metal layers and metal
nanoparticles are gold.
6. The apparatus of claim 1, wherein the metal layers and the metal
nanoparticles are a mixture of gold and silver.
7. The apparatus of claim 1, wherein the metal layers and the
plurality of metal nanoparticles comprise gold, silver, aluminum,
copper, platinum, or alloys thereof.
8. The apparatus of claim 1, wherein the first, second, third, and
fourth metal layers are about 50 nm to about 100 nm thick, and
wherein the first and second titanium dioxide layers are about 50
nm to about 100 nm thick.
9. The apparatus of claim 1, wherein the first and second metal
layers are about 80 nm to about 90 nm thick, and wherein the first
and second titanium dioxide layers are about 70 nm to about 80 nm
thick.
10. The apparatus of claim 1, wherein the nanocups are about 25 nm
to about 1,000 nm deep.
11. The apparatus of claim 1, wherein the nanocups have a top
diameter of about 30 nm to about 300 nm and a bottom diameter of
about 25 nm to about 295 nm.
12. The apparatus of claim 1, wherein the metal nanoparticles are
about 20 nm to about 40 nm in diameter.
13. The apparatus of claim 1, wherein the substrate comprises about
20, 50, 100, 500, 1,000 or more nanocups.
14. The apparatus of claim 1, wherein the plurality of metal
nanoparticles are arranged in a discontinuous manner.
15. The apparatus of claim 1, wherein one or more specific binding
substances or one or more analytes are present on the at least one
sidewall, the bottom surface of the nanocups, or both the at least
one sidewall and the bottom surface of the nanocups.
16. The apparatus of claim 1, wherein when light is directed to the
surface of the device, a superstrate refractive index increase
causes a transmission intensity increase at the peak resonance
wavelength and there is no spectral shift at the peak.
17. The apparatus of claim 1, wherein the apparatus comprises
spectral regions having no transmission intensity change.
18. A system comprising an apparatus of claim 1, and a white light
source or an LED light source.
19. A method of detecting binding of one or more specific binding
substances and their respective binding partners using the
apparatus of claim 15, comprising: (a) applying one or more binding
partners to the apparatus; (b) illuminating the apparatus with a
light source; (c) detecting relative intensity; wherein, where the
one or more specific binding substances have bound to their
respective binding partners, the relative intensity is
increased.
20. A method of detecting of one or more analytes on the apparatus
of claim 1 comprising: (a) applying one or more analytes to the
apparatus; (b) illuminating the apparatus with a light source; (c)
detecting relative intensity; (d) wherein, where the one or more
analytes are present on the at least one sidewall, the bottom
surface of the nanocups, or both the at least one sidewall and the
bottom surface of the nanocups the relative intensity is
increased.
21. A method of making a nanocup array device comprising: (a)
depositing a metal layer by e-beam evaporation on a substrate
comprising a plurality of nanocups; (b) depositing a titanium
dioxide layer by sputtering deposition on the metal layer on the
substrate; and (c) depositing another metal layer by e-beam
evaporation on the substrate.
22. The method of claim 21, further comprising immobilizing one or
more specific binding substances or analytes to the sidewalls of
the nanocups or both the sidewalls and bottoms of the nanocups.
Description
PRIORITY
[0001] This application claims the benefit of U.S. Ser. No.
62/669,417, filed on May 10, 2018, which is incorporated by
reference herein in its entirety.
BACKGROUND
[0003] Plasmonic sensors are appealing for biosensing applications
due to the high sensitivity of the generated evanescent fields to
local refractive index (RI) changes. These sensors are currently
based on surface plasmon resonance (SPR), extraordinary optical
transmission (EOT), localized surface plasmon resonance (LSPR), or
a combination of these mechanisms with applications including gas
detection, cancer biomarker screening, and cell imaging. EOT
plasmonic devices, which primarily rely on the generation of
grating-coupled SPR on metallic nanohole arrays, are of particular
interest for biosensing applications due to excitation and spectral
detection in transmission mode at normal incidence, which
simplifies the instrumentation requirements. However, the
performance of these devices in terms of limit of detection (LOD)
is significantly worse than SPR sensors in the Kretschmann
configuration, which has a high angular sensitivity that can exceed
500.degree./RIU. Current work in plasmonic sensors seeks to match
or outperform SPR sensors while simplifying the instrumentation
requirements to lead to more widespread applications of these
tools.
SUMMARY
[0004] An embodiment provides an apparatus, comprising a substrate
layer having a top surface and a bottom surface, wherein a
plurality of nanocups are defined in the substrate layer, wherein
the plurality of nanocups each have at least one sidewall surface
and a bottom surface; a first metal layer disposed on the top
surface of the substrate layer and a second metal layer disposed on
the bottom surface of each of the plurality of nanocups; a first
layer of titanium dioxide disposed on the first metal layer
disposed on the top surface of the substrate layer and a second
layer of titanium dioxide disposed on the second metal layer
disposed on the bottom surface of each of the plurality of
nanocups; a third metal layer disposed on the first layer of
titanium dioxide and a fourth metal layer disposed on the second
layer of titanium dioxide; and a layer of titanium dioxide and a
plurality of metal nanoparticles on the at least one sidewall
surface of the plurality of nanocups.
[0005] The nanocups can have a frustoconical shape. The substrate
can be a polymer. The substrate can be transparent or translucent.
The metal layers and metal nanoparticles can be gold, a mixture of
gold and silver, silver, aluminum, copper, platinum, or alloys
thereof.
[0006] The first, second, third, and fourth metal layers can be
about 50 nm to about 100 nm thick, and the first and second
titanium dioxide layers can be about 50 nm to about 100 nm thick.
The first and second metal layers can be about 80 nm to about 90 nm
thick, and the first and second titanium dioxide layers can be
about 70 nm to about 80 nm thick. The nanocups can be about 25 nm
to about 1,000 nm deep. The nanocups can have a top diameter of
about 30 nm to about 300 nm and a bottom diameter of about 25 nm to
about 295 nm. The metal nanoparticles can be about 20 nm to about
40 nm in diameter. The substrate can comprise about 20, 50, 100,
500, 1,000 or more nanocups. The plurality of metal nanoparticles
can be arranged in a discontinuous manner. The layer of titanium
dioxide on the at least one sidewall surface of the plurality of
nanocups can be discontinuous.
[0007] In an embodiment, an apparatus can have one or more specific
binding substances or one or more analytes present on the at least
one sidewall, the bottom surface of the nanocups, or both the at
least one sidewall and the bottom surface of the nanocups.
[0008] In an embodiment, when light is directed to the surface of
the device, a superstrate refractive index increase causes a
transmission intensity increase at the peak resonance wavelength
and there is little to no spectral shift at the peak. The apparatus
can comprise spectral regions having no transmission intensity
change.
[0009] An embodiment provides a system comprising an apparatus as
described herein and a white light source or an LED light
source.
[0010] Another embodiment provides a method of detecting binding of
one or more specific binding substances and their respective
binding partners using an apparatus described herein, wherein an
apparatus has one or more specific binding substances present on
the at least one sidewall, the bottom surface of the nanocups, or
both the at least one sidewall and the bottom surface of the
nanocups. The method comprises applying one or more binding
partners to the apparatus; illuminating the apparatus with a light
source; and detecting relative intensity; wherein, where the one or
more specific binding substances have bound to their respective
binding partners, the relative intensity is increased.
[0011] Yet another embodiment provides a method of detecting of one
or more analytes on an apparatus as described herein, wherein the
apparatus has one or more analytes present on the at least one
sidewall, the bottom surface of the nanocups, or both the at least
one sidewall and the bottom surface of the nanocups. The method
comprises applying one or more analytes to the apparatus;
illuminating the apparatus with a light source; detecting relative
intensity; wherein, where the one or more analytes are present on
the at least one sidewall, the bottom surface of the nanocups, or
both the at least one sidewall and the bottom surface of the
nanocups the relative intensity is increased.
[0012] Still another embodiment provides a method of making a
nanocup array device. The method comprises depositing a metal layer
by e-beam evaporation on a substrate comprising a plurality of
nanocups; depositing a titanium dioxide layer by sputtering
deposition on the metal layer on the substrate; and depositing
another metal layer by e-beam evaporation on the substrate. The
method can further comprise immobilizing one or more specific
binding substances or analytes to the sidewalls of the nanocups or
both the sidewalls and bottoms of the nanocups.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The patent or application file contains at least one drawing
executed in color. Copies of this patent or patent application
publication with color drawing(s) will be provided by the Office
upon request and payment of the necessary fee.
[0014] The features, objects and advantages other than those set
forth above will become more readily apparent when consideration is
given to the detailed description below. Such detailed description
makes reference to the following drawings, wherein:
[0015] FIG. 1. Fabrication and characterization of Au-titanium
dioxide-Au nanocup arrays. (a) Schematic and (b) camera image of
wafer-scale MIM nanocup array with 90 nm top and bottom Au layers
and 80 nm titanium dioxide cavity layer. The reflected light off
the device is diffracted due to the periodic nanocup array. (c)
Top-down SEM image of the device. (d) Experimental transmission
spectra with increasing RI values. The spectral features show an
increase in transmission intensity at the resonance wavelength with
spectral locations of no transmission change with RI increase.
[0016] FIG. 2. Simulated near-field electric field distributions
shown on resonance for the cross-section of the nanocup device with
different Au and titanium dioxide layers. (a) Cross-section
schematic of the MIM nanocup 3D-FEM model, which has periodic
boundary conditions along x and y. Au nanoparticles are modelled
along the cup sidewalls. (b) Top-down schematic and (c) 3D rotated
view of the MIM nanocup. |E| and E.sub.x for nanocup with 90 nm Au
layer (d) and Au layer with additional 40 nm titanium dioxide layer
(e). |E| (f) and E.sub.x (g) near-field electric field
distributions are shown for Au-titanium dioxide-Au MIM nanocup with
a 50 nm top Au layer with increasing RI values.
[0017] FIG. 3. Simulated spectral and near-field assessment of
plasmon-cavity coupling in MIM nanocup arrays. (a) Simulated
transmission spectra with increasing titanium dioxide cavity
thickness. (b) Resonant wavelength as a function of cavity
thickness. (c) Transmission intensity at the peak resonance
wavelength as a function of cavity thickness. (d) Refractometric
sensitivity as a function of cavity thickness. Near-field electric
field distributions |E| (e) and E.sub.x (f) for different cavity
thicknesses.
[0018] FIG. 4. Spectrometer-free sensing assessment of the MIM
nanocup array device. (a) A schematic of the testing setup used for
wavelength selection and imaging. (b) Relative intensity increase
as a function of refractive index of the superstrate solution. (c)
Intensity at the peak (700 nm) and reference (623 nm) wavelengths
as a function of refractive index increase. The images of the
sensor surface are shown at the peak wavelength (d) and the
reference wavelength (e).
[0019] FIG. 5. Spectrometer-free detection of CEA with MIM nanocup
arrays. (a) Schematic of anti-CEA immobilization and CEA detection.
Images of the sensor surface are shown (b) before and (c) after
immersion in CEA solutions with varying concentrations indicated.
(d) Relative intensity increase for different CEA samples and (e)
relative intensity increase plotted as a function of CEA
concentration on a log scale.
[0020] FIG. 6. A tilted SEM image of the MIM nanocup array is shown
to visualize the Au nanoparticles that form along the nanocup
sidewall.
[0021] FIG. 7. Schematic of the planar multilayer sensor simulated
using the TMM. Each layer is assigned a RI value and a
thickness.
[0022] FIG. 8. Spectral features of different device configurations
with RI changes. Transmission spectra with increasing superstrate
RI values for the (a) planar MIM structure, (b) MIM nanohole array,
and (c) MIM nanocup array.
[0023] FIG. 9. E.sub.z for different nanocup structures. E.sub.z is
shown for the nanocup array with 90 nm bottom Au layer only (A),
with bottom Au layer and 40 nm titanium dioxide layer (B) and for
the MIM structure with 50 nm top Au layer for RI=1.33 (C), RI=1.34
(D), and RI=1.4 (E).
[0024] FIG. 10. Cavity thickness dependence in planar MIM sensor.
(a) Transmission spectra for increasing titanium dioxide cavity
thicknesses. (b) Transmission intensity at the peak cavity
resonance wavelength as a function of cavity thickness. (c)
Transmission ratio for the cavity resonance and PL resonance as a
function of cavity thickness. (d) Refractometric sensitivity as a
function of cavity thickness.
[0025] FIG. 11. Field confinement and spectral effects of varying
top Au thickness. |E| and E.sub.x are shown for RI=1.33 for a
nanocup with a bottom Au layer of 90 nm, titanium dioxide cavity
layer of 60 nm, and top Au layer of 25 nm (a), 50 nm (b), 75 nm
(c), and 90 nm (d). Transmission spectra with increasing RI values
(1.33, 1.34, 1.37, and 1.4) for top Au layers of 25 nm (e), 50 nm
(f), 75 nm (g), and 90 nm (h).
[0026] FIG. 12. Field confinement and spectral effects of varying
bottom Au thickness. |E| and E.sub.x are shown for RI=1.33 for a
nanocup with a titanium dioxide cavity layer of 60 nm, top Au layer
of 90 nm, and bottom Au layer of 25 nm (a), 50 nm (b), 75 nm (c),
and 90 nm (d). Transmission spectra with increasing RI values
(1.33, 1.34, 1.37, and 1.4) for bottom Au layers of 25 nm (e), 50
nm (f), 75 nm (g), and 90 nm (h).
[0027] FIG. 13. Comparison of MIM nanocup sensors with different
metal materials. Transmission spectra with increasing RI values for
MIM nanocups with Au layers (a), Ag layers (b), Cu layers (c), and
Ti layers (d). Comparison of MIM nanocup sensors with different
metal materials. (e) Normalized electric field distribution |E| for
Ag (left) and Ti (right). (f) E.sub.x near-field distribution for
Ag (left) and Ti (right).
[0028] FIG. 14. Comparison of planar MIM sensors with different
materials for the metal layers. Transmission spectra with
increasing RI values for Au layers (a), Ag layers (b), Cu layers
(c), and Ti layers (d).
[0029] FIG. 15 Analysis of added cavity layer loss for MIM nanocup
and planar MIM sensors. (a) Transmission spectra at RI=1.33 for Au
MIM nanocup array with increasing k values. Transmission spectra
for the MIM nanocup array with increasing RI values for k=0.1 (b),
k=0.5. Analysis of added cavity layer loss for MIM nanocup and
planar MIM sensors. Transmission spectra for the MIM nanocup array
with increasing RI values for k=0.5 (c), and k=1 (d). Normalized
electric field distribution |E| for increasing k values (e). (f) A
cross-section of a single nanocup showing E.sub.x with increasing k
values. Transmission spectra at RI=1.33 for Au planar MIM sensor
with increasing k values (g). (h) Transmission spectra with
increasing RI values for the planar MIM sensor where k=0.1
[0030] FIG. 16. Comparison of simulation and experiment for
sensitivity optimization in MIM nanocup arrays. The simulated
sensitivity values are shown as a function of top Au thickness (a),
cavity thickness (b). Comparison of simulation and experiment for
sensitivity optimization in MIM nanocup arrays. The simulated
sensitivity values are shown as a function of bottom Au thickness
(c), and total Au thickness (d). For comparison, the experimental
sensitivity values are shown as a function of top Au thickness (e)
and cavity thickness (f). For comparison, the experimental
sensitivity values are shown as a function of bottom Au thickness
(g), and total Au thickness (h).
[0031] FIG. 17 shows the detail of a nanocup.
[0032] While the present invention is susceptible to various
modifications and alternative forms, exemplary embodiments thereof
are shown by way of example in the drawings and are herein
described in detail. It should be understood, however, that the
description of exemplary embodiments is not intended to limit the
invention to the particular forms disclosed, but on the contrary,
the intention is to cover all modifications, equivalents and
alternatives falling within the spirit and scope of the invention
as defined by the embodiments above and the claims below. Reference
should therefore be made to the embodiments above and claims below
for interpreting the scope of the invention.
DETAILED DESCRIPTION
[0033] Unless defined otherwise, all technical and scientific terms
used herein have the same meaning as commonly understood by one of
skill in the art to which the systems and methods pertain.
[0034] As used herein, the term "and/or" includes any and all
combinations of one or more of the associated listed items. As used
herein, the singular forms "a," "an," and "the" are intended to
include the plural forms as well as the singular forms, unless the
context clearly indicates otherwise.
[0035] The embodiments illustratively described herein suitably can
be practiced in the absence of any element or elements, limitation
or limitations that are not specifically disclosed herein. Thus,
for example, in each instance herein any of the terms "comprising,"
"consisting essentially of," and "consisting of" may be replaced
with either of the other two terms, while retaining their ordinary
meanings.
[0036] The term "about" in association with a numerical value means
that the numerical value can vary plus or minus by 5% or less of
the numerical value. All patents, patent applications, and other
scientific or technical writings referred to anywhere herein are
incorporated by reference herein in their entirety.
[0037] Likewise, many modifications and other embodiments of the
apparatus and methods described herein will come to mind to one of
skill in the art to which the invention pertains having the benefit
of the teachings presented in the foregoing descriptions and the
associated drawings. Therefore, it is to be understood that the
invention is not to be limited to the specific embodiments
disclosed and that modifications and other embodiments are intended
to be included within the scope of the appended claims. Although
specific terms are employed herein, they are used in a generic and
descriptive sense only and not for purposes of limitation.
[0038] Unless defined otherwise, all technical and scientific terms
used herein have the same meaning as commonly understood by one of
skill in the art to which the invention pertains. Although any
methods and materials similar to or equivalent to those described
herein can be used in the practice or testing of the present
invention, the preferred methods and materials are described
herein.
[0039] Unless defined otherwise, all technical and scientific terms
used herein have the same meaning as commonly understood by one of
skill in the art to which the systems and methods pertain.
[0040] As used herein, the term "and/or" includes any and all
combinations of one or more of the associated listed items. As used
herein, the singular forms "a," "an," and "the" are intended to
include the plural forms as well as the singular forms, unless the
context clearly indicates otherwise.
[0041] The embodiments illustratively described herein suitably can
be practiced in the absence of any element or elements, limitation
or limitations that are not specifically disclosed herein. Thus,
for example, in each instance herein any of the terms "comprising,"
"consisting essentially of," and "consisting of" may be replaced
with either of the other two terms, while retaining their ordinary
meanings.
[0042] The term "about" in association with a numerical value means
that the numerical value can vary plus or minus by 5% or less of
the numerical value. All patents, patent applications, and other
scientific or technical writings referred to anywhere herein are
incorporated by reference herein in their entirety.
[0043] The present disclosure provides a metal-insulator-metal
plasmonic nanocup array device (e.g. gold-titanium dioxide-gold
metal-insulator-metal plasmonic nanocup array device) for
spectrometer-free refractometric sensing with a performance
exceeding conventional surface plasmon resonance sensors. The
devices show distinct spectral properties such that a superstrate
refractive index increase causes a transmission intensity increase
at the peak resonance wavelength. There is no spectral shift at
this peak and there are spectral regions with no transmission
intensity change, which can be used as internal device references.
The devices demonstrate a sensitivity exceeding 800 .DELTA.% T/RIU.
The high performance and distinct spectral features of
metal-insulator-metal plasmonic nanocup arrays make these devices
ideal for portable optical sensing systems with minimal
instrumentation requirements.
[0044] Here, for the first time, multilayered plasmonic devices are
provided for spectrometer-free refractometric sensing with a
performance exceeding SPR sensors in the Kretschmann configuration.
Instrumentation costs, such as for a high-resolution spectrometer,
are a limiting factor towards the development of portable
optics-based molecular diagnostic systems. While the development of
miniaturized, low-cost spectrometers is an active area of research,
an alternative approach taken herein is to design a sensor and
sensing system that no longer requires spectroscopic measurements,
but still maintains a high sensing performance.
[0045] Provided are metal-titanium dioxide-metal MIM plasmonic
nanocup array for spectrometer-free refractometric sensing based on
transmission intensity variations at a fixed resonance wavelength.
The sensing mechanism is dominated by the MIM cavity structure,
however, the sensitivity and overall transmission of the sensor are
determined primarily by the degree of cavity-plasmon coupling, the
degree of confinement, and the ability of the chosen materials to
generate SPR and LSPR resonances. This sensor design and sensing
mechanism are well-suited for the development of compact, portable
optical sensors for applications in areas such as drug discovery
and diagnostics.
[0046] The sensing method comprises transmission resonance
intensity measurements occurring in, for example, a metal, titanium
dioxide (titanium dioxide), metal plasmonic metal-insulator-metal
(MIM) nanocup array. The spectral characteristics of this device
show sensitive on-resonance transmission changes with
refractometric changes due to plasmon-cavity coupling in the
multilayered structure. In addition, spectral locations with no
intensity change can be used as internal device references, which
is important for reliable transmission measurements outside of a
controlled laboratory. FIG. 1(d) demonstrates one of these spectral
locations with not intensity change. In FIG. 1(d), there is a
spectral location at approximately 625 nm where going from water
(refractive index=1.333) to higher refractive index values there is
a negligible intensity change compared to the peak intensity
change. The intensity value at this spectral location can be used
as an internal reference for the device.
[0047] While conventional plasmonic sensors can also operate as
refractometers based on intensity changes, the LOD for this
operating mode is worse than that of angular or spectral methods,
and spectral features such as shifts, unreliable intensity changes,
and lack of reference points make the data difficult to collect and
analyze accurately.
[0048] In one embodiment, the metal-titanium dioxide-metal nanocup
array sensor comprises a nanostructured polymer substrate,
fabricated by a wafer-scale nanoreplica molding process, with
deposited layers of metal and titanium dioxide. Au can be chosen
for the metal layers due to its plasmonic properties, its high
field confinement capability due to high reflectivity, and its
chemical stability. Titanium dioxide is chosen as the cavity layer
material due to its high RI, zero extinction coefficient (k), and
good manufacturability. A schematic of the device is shown in FIG.
1a and a camera image is shown in FIG. 1b. A schematic of a nanocup
is shown in FIG. 17. In an embodiment, a sensor has a bottom Au
layer of 90 nm, titanium dioxide cavity layer of 80 nm, and top Au
layer of 90 nm, which is optimized based on simulation and
experimental studies that are described later in detail. The camera
image shows polychrome color due to the diffraction of the
reflected light from the periodic nanocup array structures. A
top-down SEM image of the device is shown in FIG. 1c. A
well-ordered, periodic array is maintained after the full device
fabrication. The inset shows a SEM image at a higher magnification
of the top-down view of the individual nanocups. A tilted SEM image
of the device, where the sidewall Au nanoparticles are visible, is
shown in FIG. 6.
[0049] Substrate
[0050] An apparatus can comprise a substrate (10) having a top
surface (11) and a bottom surface (12). A plurality of nanocups
(20) (e.g., 2, 10, 20, 50, 100, 144, 250, 500, 1,000 or more) are
defined in the top surface (11) of the substrate (10) and the
plurality of nanocups (20) each have at least one sidewall surface
(22) and a bottom surface (21).
[0051] The nanocups can be about 25 nm to about 1,000 nm deep
(e.g., about 25, 50, 75, 100, 200, 300, 400, 500, 600, 700, 800,
900, 1,000 nm or more). The nanocups can have a top diameter of
about 25 nm to about 300 nm (e.g. about 25, 30, 50, 75, 100, 125,
150, 175, 200, 225, 250, 275, 295, 300 nm or more) and a bottom
diameter of about 25 nm to about 300 nm (e.g. about 25, 30, 50, 75,
100, 125, 150, 175, 200, 225, 250, 275, 295, 300 nm or more). The
top diameter of a nanocup can be larger than the bottom
diameter.
[0052] The nanocups can have a frustoconical shape. The nanocups
can have tapered side wall surfaces. In an embodiment the taper
angle of a nanocup sidewall (22) is about 60 to about 89.99 degrees
(e.g., about 60, 65, 70, 75, 80, 85, 86, 87, 88, 89, 89.5 or 89.99
degrees). If the angle is too shallow, then poor optical
confinement and lack of formation of a cavity can result. If the
angle is too great, then poor coating of the sidewall can
result.
[0053] The substrate can be any suitable material including, for
example, a polymer. In an embodiment, the substrate is a UV-curable
polymer such as acrylated epoxies, acrylated polyesters, or
acrylated silicones. A substrate can be transparent or
translucent.
[0054] Metal-Titanium Dioxide-Metal Layers
[0055] A first metal film or layer (30) is present on the top
surface of the substrate (11) and a second metal film or layer (31)
is present on the bottom surface of each of the plurality of
nanocups (20). The metal film or layer can be selected from
plasmonic metals such as gold, silver, a mixture of gold and
silver, aluminum, copper, platinum, and combinations or alloys
thereof. An adhesion layer of, for example, titanium or chrome can
be present between the first metal film layer and the top surface
of the substrate. An adhesion layer of, for example, titanium or
chrome can be present between the second metal film layer and the
bottom surface of the nanocups. In an embodiment the first and
second metal layers are one metal or alloy (e.g., gold) and the
third and fourth metal layers are a different metal or alloy (e.g.,
silver).
[0056] The deposition of the first and second metal film layers,
which occurs at the same time, results in a thin coating of the
metal or deposition of metal nanoparticles on the sidewalls of the
nanocups. This layer can be discontinuous.
[0057] A first layer of titanium dioxide (40) can be present on the
first metal film or layer (30) that is on the top surface of the
substrate (11) and a second layer of titanium dioxide (41) can be
present on the second metal film or layer (31) disposed on the
bottom surface (21) of each of the plurality of nanocups (20). The
deposition of the first and second titanium dioxide layers, which
occurs at the same time, results in a thin coating of titanium
dioxide on the sidewalls of the nanocups. The TiO.sub.2 coating can
be discontinuous.
[0058] A third metal film or layer (32) can be present on the first
layer of titanium dioxide (40) and a fourth metal film or layer
(33) can be present on the second layer of titanium dioxide (41).
An adhesion layer of, for example, titanium can be present between
the third metal film layer and the first layer of titanium dioxide.
Due to the manufacturing process (described in detail below) the
fourth metal layer can have a thin layer of titanium dioxide (which
can be discontinuous) between the metal layer and the sidewalls of
the nanocup. See FIG. 17. The deposition of the third and fourth
metal film layers, which occurs at the same time, results in a thin
coating of the metal or deposition of metal nanoparticles on the
sidewalls of the nanocups. This layer can be discontinuous.
[0059] It is expected that some of the adhesion layer material may
occur on the sidewall. The adhesion layer material will form in
nanoparticles due to the directional deposition. The nanoparticles
will be very small because the layer thickness is so much less than
the other layers.
[0060] The first metal layer can be about 40 to about 120 nm thick
(e.g., about 40, 50, 60, 70, 80, 90, 100, 110, 120 nm thick) on the
top surface of the substrate. The second metal layer can be about
40 to about 120 nm thick (e.g., about 40, 50, 60, 70, 80, 90, 100,
110, 120 nm thick) on the bottom surface of the nanocup. The third
metal layer can be about 40 to about 120 nm thick (e.g., about 40,
50, 60, 70, 80, 90, 100, 110, 120 nm thick) on the surface of the
first titanium dioxide layer. The fourth metal layer can be about
40 to about 120 nm thick (e.g., about 40, 50, 60, 70, 80, 90, 100,
110, 120 nm thick) on the surface of the second titanium dioxide
layer. The first titanium dioxide layer can be about 40 nm to about
120 nm thick (e.g., about 40, 50, 60, 70, 80, 90, 100, 110, 120 nm
thick) on the surface of the first metal layer. The second titanium
dioxide layer can be about 40 nm to about 120 nm thick (e.g., about
40, 50, 60, 70, 80, 90, 100, 110, 120 nm thick) on the surface of
the second metal layer. In an embodiment the first, second, third,
and fourth metal layers are about 80 to about 90 nm thick. In an
embodiment the first and second titanium dioxide layers are about
70 to about 80 nm thick.
[0061] The thickness of the first and second metal layers can be
about the same. The thickness of the third and fourth metal layers
can be about the same. The thickness of the first and second metal
layers can be different from the third and fourth metal layers.
[0062] As the layers of metal and titanium dioxide are deposited
onto the substrate, these materials also coat the sidewall of the
nanocups. However, due to the glancing angle deposition, the
thicknesses of the metal and titanium dioxide on the sidewalls is
less than the metal and titanium dioxide layers on the top surface
of the substrate and the bottom surfaces of the nanocups. The metal
layers and titanium dioxide layers on the sidewalls can be
discontinuous (that is, they may not completely cover the
sidewalls). During fabrication, the metal and titanium dioxide on
the sidewall are deposited at the same time as what is deposited on
the flat surfaces. The thickness of the titanium dioxide layer is
approximately the thickness of the titanium dioxide layer on the
top of the substrate multiplied by the cosine of the taper angle of
the nanocup sidewall. Therefore, if the taper angle is about 85%,
the thickness of the titanium dioxide layer on the sidewalls will
be about 9% of the thickness of the titanium dioxide on the top of
the substrate. This layer may be continuous or discontinuous due to
the relatively small amount of titanium dioxide deposited on the
sidewalls. Therefore, the thickness of the titanium dioxide on the
sidewalls can be about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 nm or
more.
[0063] Due to the manufacturing process, a very thin layer of metal
or a plurality of metal nanoparticles (50) (e.g., gold, silver, a
mixture of gold and silver, aluminum, copper, platinum, and
mixtures thereof) can be present on the at least one sidewall
surface of the plurality of nanocups.
[0064] The metal nanoparticles on the sidewalls are formed in a
similar manner as to the titanium dioxide deposition through
glancing angle deposition. The metal nanoparticles can be single
monolayer of metal with an about 20 to about 40 nm diameter (e.g.
about 20, 25, 30, 35, 40 nm diameter). In an alternative
embodiment, the metal nanoparticles are a single, double or triple
layer or combinations thereof of metal. The properties of the metal
nanoparticles, the ability for titanium dioxide to coat the
sidewalls, and the ability for metal nanoparticles to form will
change with the thickness of the second metal layer. The plurality
of metal nanoparticles can be arranged in a discontinuous
manner.
[0065] In an embodiment one or more analytes or specific binding
substances are present on the sidewalls of the nanocups, on the
bottoms of the nanocups, or on a combination of the sidewalls and
the bottoms of the nanocups. The presence of analytes or specific
binding substances on the sidewalls can shift the resonances more
noticeably than when present on the top of the substrate surface or
the bottom or the nanocups because the optical field is very strong
on the sidewalls.
[0066] Method of Manufacture
[0067] In an embodiment an array of polymer nanocups can be
fabricated using a nanoreplica molding process. For example, a
UV-curable polymer (e.g., NOA-61) can be applied on top of a
wafer-scale quartz mold (e.g., a quartz mold) having an array of
tapered nanopillars. A backing sheet or layer, such as a
polyethylene terephthalate (PET) sheet backing can be placed on top
of the UV-curable polymer and the polymer can be evenly spread and
then cured in a UV oven. The polymer nanocups can then peeled from
the mold.
[0068] The metal-titanium dioxide-metal multilayer structure on the
polymer nanocup array can be fabricated by, for example, e-beam and
sputtering deposition. A metal layer can first deposited by e-beam.
A Ti adhesion layer, for example a 5, 6, 7, 8, 9, 10, 11, 12 nm or
more adhesion layer can be used. A titanium dioxide layer is then
deposited by, e.g., sputtering deposition followed by the second
metal layer with, optionally, another Ti adhesion layer (e.g., a 5,
6, 7, 8, 9, 10, 11, 12 nm or more thick adhesion layer). E-beam
evaporation can be used to deposit the metallic layers since the
directional deposition method can result in metallic nanoparticles
on the tapered nanocup sidewalls, which can enhance the LSPR
plasmonic effect. Sputtering deposition can be used for the
titanium dioxide layers to make the cavity layer as conformal as
possible.
[0069] Directional deposition can be used for the metal layers (in
the examples, by e-beam deposition) and non-directional/conformal
deposition for the titanium dioxide layer (in the examples by
sputtering). This can lead to the different physical properties of
the materials on the nanocup sidewalls.
[0070] Specific Binding Substances, Analytes, and Binding
Partners
[0071] In an embodiment, one or more specific binding substances or
analytes are present on the bottom, sidewalls, or both the bottom
and sidewalls of the plurality of nanocups. A specific binding
substance can bind to binding partner. A binding partner is a
substance that forms a complex with a specific binding substance
through, for example, ionic bonds, hydrogen bonds, Van der Waals
forces, covalent bonds, non-covalent bonds, electrostatic
interactions, 7-effects, or hydrophobic effects.
[0072] In an example, a specific binding substance is an antibody
and a binding partner is a polypeptide that specifically binds to
the antibody. In another example, a specific binding substance is a
polypeptide and a binding partner is an antibody that specifically
binds to the specific binding substance. An analyte can be detected
by methods described herein, and can be capable of interacting with
molecules added to the nanaocups (such as an enzyme).
[0073] A specific binding substance or analyte can be covalently or
non-covalently bound to the bottom of the plurality of nanocups.
The binding can be due to natural adsorption of molecules on the
surface (e.g., due to Van der Waals reaction). In an embodiment,
specific binding substances or analytes can be bound to the
nanocups via linkers. A specific binding substance can specifically
bind to or otherwise interact with one or more binding partners. An
analyte, specific binding substance, or binding partner can be, for
example, a nucleic acid (DNA, RNA or analogs thereof), polypeptide,
protein solution, peptide solution, single- or double-stranded DNA
solution, RNA solution, RNA-DNA hybrid solution, solution
containing compounds from a combinatorial chemical library,
antigen, polyclonal antibody, monoclonal antibody, single chain
antibody (scFv), F(ab) fragment, F(ab')2 fragment, Fv fragment, or
other specific binding fragment of an antibody, small molecule or
metabolite, cell (e.g., a eukaryotic cell, prokaryotic cell,
mammalian cell, or any other type of cell), virus, bacteria,
polymer, enzyme, peptidomimmetic, ion, aptamer, environmental
sample, a food sample, a drug sample, or biological sample. A small
molecule or metabolite means a multi-atom molecule other than
proteins, peptides and DNA: the term can include but is not limited
to amino acids, steroid and other small hormones, metabolic
intermediate compounds, drugs, drug metabolites, toxicants and
their metabolites, and fragments of larger biomolecules
[0074] A biological sample can be, for example, blood, plasma,
serum, gastrointestinal secretions, tissues, tumors, homogenates of
tissues or tumors, synovial fluid, feces, saliva, sputum, cyst
fluid, amniotic fluid, cerebrospinal fluid, peritoneal fluid, lung
lavage fluid, semen, lymphatic fluid, tears, prostatic fluid, or
any other type of biological sample.
[0075] A surface chemistry to immobilize specific binding
substances or analytes on the surface of a sensor can be employed.
In one embodiment, thiol chemistry can be used to bond thiol
modified molecules to the sensor (i.e., an array apparatus
containing 1 or more nanocups). In another embodiment, a multilayer
assembly based on electrostatic interaction of carboxylate
(11-mercaptoundecanoic acid (MUA)) and amino group
(poly(ethylenimine)) (MUA-PEI chemistry) can be used. In various
other embodiments, methods to functionalize a surface of a sensor
include (i) poly (ethylene glycol)-carboxylate (PEG-carboxylate)
activated with EDC-NHS and (ii) dextran chemistry.
[0076] Devices described herein can be used to detect analytes,
specific binding substances, and binding partners in a sample.
[0077] Specifically binds means that a specific binding substance
binds to binding partner with greater affinity than other
non-specific molecules. In the case of antigen/antibody binding a
non-specific molecule is an antigen that shares no common epitope
with a first antigen that is known to bind to the antibody. In an
embodiment a non-specific molecule is not known or recognized to
bind to the specific binding substance. For example, an antibody
raised against a first antigen to which it binds more efficiently
than to a non-specific antigen can be described as specifically
binding to the first antigen.
[0078] The interaction of specific binding substances and binding
partners can be characterized in terms of a binding affinity. For
example, a specific binding substance can bind a binding partner
with a K.sub.d equal to or less than about 10.sup.-7 M, such as but
not limited to, 0.1-9.9.times.10.sup.-3, 10.sup.-4, 10.sup.-5,
10.sup.-6, 10.sup.-7, 10.sup.-8, 10.sup.-9, 10.sup.-10, 10.sup.-11,
10.sup.-12, 10.sup.-13, 10.sup.-14, 10.sup.-15 or any range or
value therein. A ligand can bind an analyte with an off rate
(K.sub.off) of less than or equal to 0.1-9.9.times.10.sup.-3
sec.sup.-1, 10.sup.-4 sec.sup.-1, 10.sup.-5 sec.sup.-1, 10.sup.-6
sec.sup.-1, 10.sup.-7 sec.sup.-1. A specific binding partner can
bind a binding partner with an on rate (K.sub.m) greater than or
equal to 0.1-9.9.times.10.sup.3 M.sup.-1 sec.sup.-1,
10.sup.4M.sup.-1 sec.sup.-1, 10.sup.5 M.sup.-1 sec.sup.-1, 10.sup.6
M.sup.-1sec.sup.-1, 10.sup.7 M.sup.-1sec.sup.-1, 10.sup.8
M.sup.-1sec.sup.-1.
[0079] One or more specific binding substances or analytes can be
attached to a sensor surface (i.e., a nanocup array device) by
physical adsorption (i.e., without the use of chemical linkers). In
an embodiment one or more specific binding substances or analytes
can be attached to a sensor surface by chemical binding (i.e., with
the use of chemical linkers). Chemical binding can generate
stronger attachment of specific binding substances on a surface and
can provide defined orientation and conformation of the
surface-bound molecules. Chemical binding can include, for example,
amine activation, aldehyde activation, and nickel activation. These
surfaces can be used to attach several different types of chemical
linkers to a sensor surface. An amine surface can be used to attach
several types of linker molecules, while an aldehyde surface can be
used to bind proteins directly, without an additional linker. A
nickel surface can be used to bind molecules that have an
incorporated histidine ("his") tag.
[0080] A specific binding substance or analyte can be applied to
one nanocup or can be applied across 2, 5, 10, 20, 30 or more
nanocups.
[0081] Systems
[0082] A system can comprise a nanocup apparatus as described
herein and a white light source or an LED light source. In an
embodiment, a system comprises a nanocup apparatus as described
herein, a white light source or an LED light source, a beam
collimator, a beam expander, an objective lens and an imaging
camera. In an embodiment a system does not comprise a spectrometer.
In an embodiment, a system is handheld, compact, and portable. In
an embodiment a system is about 5 pounds, 4 pounds, 3 pounds, 2
pounds, 1 pound or less. In an embodiment, the system is about 12
inches by 12 inches by 12 inches; about 6 inches by 6 inches by 6
inches; about 3 inches by 3 inches by 3 inches; about 1 inch by 1
inch by 1 inch or smaller.
[0083] In an embodiment, a system comprises a white light or LED
light source, and a computing device having a camera; an opaque
housing defining a chamber, wherein the housing has a slot or
opening that is configured to permit ingress and egress of a
nanocup device within the chamber. The light source can be
positioned within the chamber or outside of the chamber. If the
light source is outside of the chamber, then an opening is provided
in the housing for the light source. Regardless of the position of
the light source, it is positioned so that the light from the light
source can be directed to the nanocup device. The computing device
and camera can be positioned within the chamber or outside of the
chamber. If the computing device and camera are outside of the
chamber, then an opening is provided in the housing for the
computing device and camera. Regardless of the position of the
computing device and camera, they are positioned so that the light
transmitted or reflected from the nanocup device can be detected by
the camera. A computing device and/or camera can be user-supplied
and can be simple as, for example, a phone.
[0084] Methods of Use
[0085] An embodiment provides a method of detecting binding of one
or more specific binding substances and their respective binding
partners using the nanocup device described herein. The methods can
comprise applying one or more binding partners to a nanocup device
wherein one or more specific binding substances are immobilized on
the at least one sidewall, the bottom surface of the nanocups, or
both of the at least one sidewall and the bottom surface of the
nanocups. The device can be washed to remove unbound binding
partners. The nanocup device can be illuminated with a white light
source or LED light source. In an embodiment the light has a
wavelength of 700 nm (peak) or 623 nm (reference) wavelength. It is
noted that the peak and the reference wavelengths can change
depending on the geometry of the sensor. If different materials,
different thicknesses, or a different nanocup geometry is used then
the peak and reference wavelengths can change. One of skill in the
art can determine the peak and reference wavelengths for a
particular sensor. A relative intensity is detected by a camera.
Where the one or more specific binding substances have bound to
their respective binding partners, the relative intensity is
increased as compared to a situation where one or more specific
binding substances have not bound to their respective binding
partners. For control or comparison purposes a reading of relative
intensity can be completed prior to the application of the one or
more binding partners to the device or a previously determined
control number can be used.
[0086] An embodiment provides a method of detecting one or more
analytes on a nanocup device described herein. One or more analytes
can be applied or immobilized to the device. The device can be
washed. The device can be illuminated with a white light source or
a LED light source. In an embodiment the light has a wavelength of
700 nm (peak) or 623 nm (reference) wavelength. A relative
intensity is detected by a camera. Where the one or more analytes
are present on the at least one sidewall, the bottom surface of the
nanocups, or both of the at least one sidewall and the bottom
surface of the nanocups the relative intensity is increased as
compared to a situation where the one or more analytes are not
present on the device. For control or comparison purposes a reading
of relative intensity can be completed prior to the addition of the
one or more analytes or a previously determined control number can
be used.
[0087] In an embodiment, one or more analytes can be applied to the
nanocup device so that the one or more analytes are present on the
at least one sidewall, the bottom surface of the nanocups, or both
of the at least one sidewall and the bottom surface of the
nanocups. A relative intensity reading can be taken. Then one or
more compounds or molecules can be added to the nanocup device. The
one or more compounds or molecules can be washed from the nanocup
device. A relative intensity reading can be taken. Where the one or
more compounds or molecules alter the one or more analytes (e.g.,
alter the conformation, cleave a portion of the analyte, bind to
the analyte, etc.) the relative intensity can change as compared to
a situation where the one or more analytes have not been altered by
a molecule or compound. A relative intensity can be increased where
a compound or molecule has bound to the one or more analytes. A
relative intensity can be decreased where, for example, a portion
of the one or more analytes are cleaved from the surface of the
nanocups. An optional step of detecting a relative intensity can be
done prior to the addition of the analytes to the nanocup
device.
[0088] Advantageously, increases in relative transmission intensity
at the peak resonance wavelength with increasing superstrate RI and
with no spectral shift can be detected. It is noted that a
reflectance measurement instead of a transmission measurement can
also be used. Furthermore, there are spectral regions where there
is little or no change in transmission intensity. These spectral
regions can be used as internal device references. These changes
can be detected without a spectrometer. The sensitivity can be
greater than 500, 600, 700, or 800 .DELTA.% T/RIU. Additionally,
specific binding substance-binding partner binding reactions (e.g.,
antigen-antibody binding) can be detected at a limit of detection
of 100, 50, 20, 10 ng/mL or better.
[0089] Manufacture
[0090] Methods are provided for making a nanocup array device as
described herein. A substrate can be made having a plurality of
nanocups. An initial metal layer can be deposited by e-beam
evaporation on the substrate having a plurality of nanocups. An
adhesion layer for the metal layer, such as titanium, can be used.
The adhesion layer can be about 3, 4, 5, 6, 7, 8, 9, 10, 15 nm or
more thick. A titanium dioxide layer is then deposited by
sputtering deposition onto the substrate. Another metal layer is
deposited by e-beam evaporation on the substrate. An adhesion layer
for the metal layer, such as titanium, can be used. The adhesion
layer can be about 3, 4, 5, 6, 7, 8, 9, 10, 15 nm or more thick.
Due to the application process the metal/titanium dioxide/metal
layers are deposited on the sidewalls of the nanocups is at a
thickness that is less than the thickness of the metal/titanium
dioxide/metal layers on the top of the substrate surface and the
bottom of the nanocups. The metal/titanium dioxide/metal layers on
the sidewalls may be discontinuous. The method can further comprise
immobilizing one or more specific binding substances or analytes to
the sidewalls of the nanocups, the bottoms of the nanocups, or both
the sidewalls and bottoms of the nanocups.
[0091] The present disclosure provides an unexpected improvement
over U.S. Pat. No. 9,464,985 (Liu et. al.), which is hereby
incorporated by reference.
[0092] The following are provided for exemplification purposes only
and are not intended to limit the scope of the invention described
in broad terms above.
EXAMPLES
Example 1. Metal-Insulator-Metal Nanocup Device Fabrication
[0093] The processing steps for the complete MIM plasmonic nanocup
array sensors begin by fabrication of the polymer nanocups using a
nanoreplica molding process. A pipette is used to deposit 2 mL of
UV-curable polymer (NOA-61) on top of a wafer-scale quartz mold
consisting of an array of tapered nanopillars. A polyethylene
terephthalate (PET) sheet backing is placed on top of the
UV-curable polymer and once the polymer is evenly spread, it is
cured in a UV oven. The polymer nanocups are then peeled from the
quartz mold. The Au-titanium dioxide-Au multilayer structure on the
polymer nanocup array is fabricated by e-beam and sputtering
deposition. The Au layer is first deposited by e-beam with a 9 nm
Ti adhesion layer. The titanium dioxide layer is then deposited by
sputtering deposition followed by the second Au layer with a 5 nm
Ti adhesion layer. E-beam evaporation is used to deposit the
metallic layers since the directional deposition method will result
in metallic nanoparticles on the tapered nanocup sidewalls, which
will enhance the LSPR plasmonic effect. Sputtering deposition is
used for the titanium dioxide to make the cavity layer as conformal
as possible.
Example 2. Tilted SEM Image of Metal-Insulator-Metal Nanocup
Array
[0094] A tilted SEM image of the metal-insulator-metal (MIM)
nanocup array device consisting of a 90 nm bottom Au layer, 80 nm
titanium dioxide insulator layer, and 90 nm top Au layer is shown
in FIG. 6. From the tilted image, the Au nanoparticles that form
along the cup sidewall are more clearly visualized.
Example 3. Schematic of Simulated Planar Multilayer
[0095] A schematic of the planar multilayered structure, simulated
using the transfer matrix method (TMM), is shown in FIG. 7. The
multilayer consists of 7 layers and therefore 6 interfaces and it
is assumed that each layer is flat, homogeneous, and extends
infinitely in x and y directions.
Example 4. Transmission Spectra for Different Device
Configurations
[0096] An effective MIM nanocup device design can obtain spectral
features where an increase in RI results in an increase in
transmission intensity at the peak resonance wavelength with no
spectral shift. Therefore, a 3D-FEM study was used to investigate
whether these spectral properties can be obtained with different
device configurations. The transmission spectra for the planar
multilayer structure, MIM nanohole array, and MIM nanocup array
with increasing RI values are shown in FIGS. 8a-8c, respectively.
In all cases, the bottom Au layer is 90 nm, the titanium dioxide
cavity layer is 40 nm, and the top Au layer is 50 nm. As can be
seen, the optical effect of a sensitive relative transmission
intensity increase with increasing superstrate RI without a
spectral shift is only obtained for the MIM nanocup array. The MIM
nanohole array shows an increase in transmission intensity, but
with a spectral shift. Likely the nanohole array is insufficient to
form an adequate MIM cavity structure.
Example 5. Near-Field Electric Field Distribution (z Component)
[0097] The z component of the near-field electric field
distribution (E.sub.z) is shown in FIG. 9 for the nanocup with
different layers to visualize the field penetration into the metal
and dielectric materials. FIG. 9A shows E.sub.z for the nanocup
with a 90 nm gold (Au) layer only. The nanocup with a bottom Au
layer and 40 nm titanium dioxide (titanium dioxide) cavity layer is
shown in FIG. 9B. The E.sub.z distribution for the MIM nanocup with
a 50 nm top Au layer is shown for RI values of 1.33 (FIG. 9C), 1.37
(FIG. 9D), and 1.4 (FIG. 9E). For the nanocup device with the
bottom Au layer only or bottom Au layer with titanium dioxide
layer, the z component of the electric field is clearly confined at
the metal-dielectric interfaces. In both cases, the fields extend
similarly into the superstrate dielectric. However, for the device
with the cavity layer, there is some additional field confinement
at the bottom of the nanocup. In the case of the MIM nanocup
structure, there is additional field confinement at the bottom and
top of the nanocup such that there is relatively little extension
of the field into the dielectric superstrate. However, as the RI
increases, there is a clear enhancement in the amount of field
interacting with the superstrate dielectric at the top of the
nanocup.
Example 6. Resonance Tuning in Planar MIM Sensor
[0098] Resonance tuning the planar MIM sensor was carried out using
the TMM to compare the results to those obtained using the 3D-FEM
simulation of the MIM nanocup array. The transmission spectra for a
MIM structure with a 90 nm bottom Au layer and 90 nm top Au layer
are shown in FIG. 10A with cavity layers from 40 nm to 120 nm with
a 10 nm step size. For the smaller cavity thicknesses (40-60 nm),
there is only a single peak around 500 nm. However, as the cavity
layer increases, a second peak occurs at longer wavelengths. The
peak at 500 nm is due to well-known optical properties of Au thin
films and can be considered as a photoluminescence (PL) peak. The
second peak at longer wavelengths is the cavity mode of interest.
FIG. 15B shows the transmission intensity at this cavity peak as a
function of cavity thickness and FIG. 10C shows the ratio of the
transmission intensity for the cavity peak to the PL peak. The data
in FIG. 10B-10C are for top Au thicknesses of 50 nm, 75 nm, and 90
nm with a fixed bottom Au thickness of 90 nm. The sensitivity,
going from a RI value of 1.33 to 1.34, is shown in FIG. 10D.
Example 7. Varying Top and Bottom Au Layers
[0099] The field localization and spectral effects of changing the
top and bottom Au thicknesses are shown in FIG. 11-12. In FIG. 11,
the bottom Au layer is fixed at 90 nm, the titanium dioxide cavity
layer is fixed at 60 nm, and the top Au layer is varied. |E| and
E.sub.x are shown for top Au layers of 25 nm (FIG. 11A), 50 nm
(FIG. 11B), 75 nm (FIG. 11C), and 90 nm (FIG. 11D). An increase in
the top Au layer leads to increased field localization in the
bottom of the nanocup (and less field localization in the top of
the nanocup). However, a cavity mode is clearly visualized with the
given scaling for all cases. The spectral features with increasing
RI values (1.33, 1.34, 1.37, and 1.4) are shown for a top Au show
an increase in transmission intensity at the resonance wavelength
with increasing RI and no spectral shift.
[0100] The same study was repeated, but in this case the bottom Au
thickness was varied and the top Au thickness was fixed at 90 nm
with a 60 nm titanium dioxide cavity layer. |E| and E.sub.x are
shown for bottom Au layers of 25 nm (FIG. 12A), 50 nm (FIG. 12B),
75 nm (FIG. 12C), and 90 nm (FIG. 12D). Increasing the bottom Au
layer shows an increase in field localization in the top and bottom
of the nanocup. With the current scaling, a cavity mode is only
clearly visualized for the 75 nm and 90 nm cases. The spectral
features with increasing RI values (1.33, 1.34, 1.37, and 1.4) are
shown for a bottom Au layer of 25 nm (FIG. 12E), 50 nm (FIG. 12F),
75 nm (FIG. 12G), and 90 nm (FIG. 12H). Similarly to varying the
top Au layer thickness, there is a consistent increase in the
transmission intensity at the peak resonance wavelength for all
cases. However, there is a significant change in the spectral
features, such as the number of prominent peaks, which could
potentially impact the sensing performance.
Example 8. Comparing Cavity and Plasmonic Materials
[0101] A Fabry-Perot cavity should have low loss and high
reflectivity R given by R=((RI.sub.m-RI.sub.d))
((RI.sub.m+RI.sub.d).sup.2+k.sup.2) where RI.sub.m is the RI of the
reflector, RI.sub.d is the RI of the dielectric, and k is the
extinction coefficient of the reflector. An optimal metal will have
a small k and a real part of its RI that is quite dissimilar to
that of the cavity layer for high R. Au, silver (Ag), and copper
(Cu) have the second property whereas titanium (Ti) does not.
Consequently, the R of the titanium dioxide to Au, Ag, and Cu
interface is 96%, 99%, and 94%, respectively whereas it is only 54%
for Ti. The values of k for the four metals are comparable. The
transmission loss going through 90 nm of material will result in
transmission values of 0.14%, 0.043%, 0.12%, and 0.17% for Ag, Au,
Cu, and Ti, respectively.
[0102] An optimal plasmonic material should have a large number of
free electrons and low material loss. The Drude model is commonly
used to examine the properties of metals for plasmonic
applications, where the electrons in the metal are modelled as if
they are in a free electron gas. According to the Drude model, the
complex dielectric function (.epsilon.'(w)+i .epsilon.''(.omega.)
where .omega. is the frequency of the incident light,
.epsilon.'(.omega.) is the real part of the dielectric function,
and .epsilon.''(.omega.) is the imaginary part of the dielectric
function for a metal is given by .epsilon.'(.omega.)+i
.epsilon.''(.omega.)=.epsilon..sub.int-(.omega..sub.p.sup.2/.omega.(.omeg-
a.+i.GAMMA.)) where .epsilon..sub.int is the contribution to the
dielectric constant from interband transitions, .omega..sub.p is
the plasma frequency, and r is the damping term..sup.2 Both
.omega..sub.p and r are used to classify the metal's properties as
a suitable plasmonic material. The number of free electrons is
quantified primarily by .omega..sub.p=Ne.sup.2/.epsilon..sub.0m*
where N is the number of free electrons, e is the charge of the
single electron, .epsilon..sub.0 is the vacuum permittivity, and m*
is the reduced mass of the electron. The material loss is
quantified primarily by .GAMMA.=1/.tau. where .tau. is the mean
electron relaxation time. A summary of the important material
parameters for silver (Ag), Au, Copper (Cu), and Ti is shown in
Table 1 at .lamda.=700 nm. Overall, the calculations show that the
performances of the plasmonic and MIM devices will be optimized for
Ag metallic layers.
TABLE-US-00001 TABLE 1 Comparison of different metal parameters for
MIM and plasmonic sensing Material R .omega..sub.p (cm.sup.-1)
.GAMMA. (cm.sup.-1) Ag 0.99 7.27 .times. 10.sup.-4 1.45 .times.
10.sup.-2 Au 0.96 7.28 .times. 10.sup.-4 2.15 .times. 10.sup.-2 Cu
0.94 5.96 .times. 10.sup.-4 0.732 .times. 10.sup.-2 Ti 0.54 2.03
.times. 10.sup.-4 3.82 .times. 10.sup.-2
[0103] FEM and TMM simulation studies were also carried out on the
full device and planar sensor, respectively, to further examine the
impact of changing the metal material. FIG. 13 shows the
transmission spectra from the 3D-FEM study with the metal material
changed to Au (FIG. 13a), Ag (FIG. 13b), Cu (FIG. 13c), and Ti
(FIG. 13d), respectively. In all cases, the bottom metal layer is
90 nm, the insulator layer is a 60 nm thick titanium dioxide layer,
and the top metal layer is 50 nm. The RI values simulated were
1.33, 1.34, 1.37, and 1.4. For the Au device, the peak wavelength
occurs at 700 nm with a transmission intensity of 3% while for the
Ag device, the peak wavelength occurs at 625 nm with a transmission
intensity of 6%. For the Cu device, the peak wavelength occurs at
700 nm with a transmission intensity of 2% and for Ti the peak
wavelength occurs at 525 nm with a transmission intensity of 0.15%.
The sensitivity values of the Au, Ag, Cu, and Ti devices are 690
.DELTA. % T/RIU, 890 .DELTA. % T/RIU, 650 .DELTA. % T/RIU, and 250
.DELTA. % T/RIU, respectively. Therefore, when the metal layers are
changed from Au to Ag the transmission intensity doubles and the
sensitivity improves by 200 .DELTA. % T/RIU.
[0104] FIGS. 13e-13f shows the normalized near-field electric field
distributions |E| and E.sub.x, respectively, for the MIM nanocup
device with Ag and Ti metal layers. Each field distribution is
shown at the respective resonance wavelengths for the different
devices at a RI value of 1.33. As can be seen, on-resonance the Ag
device shows localized electric fields at the nanocup top, nanocup
bottom, and at the nanoparticles along the cup sidewalls associated
with a strong plasmonic component. In addition, a cavity mode with
high electric field intensity is strongly confined in the titanium
dioxide insulator layer at the bottom of the nanocup. However, for
the Ti device, the near-field electric field is weakly localized
and no cavity mode can be visualized in the near-field
distributions with the given scaling. This is expected since Ti is
both a poor plasmonic material and has a low R compared to the
other materials, which will result in a poor Q-factor for the
cavity. This dependence of the plasmon resonance generation and
cavity confinement on the metallic optical properties can explain
why the overall transmission of the Ti device is an order of
magnitude less than for the Ag device and why the sensitivity for
the Ag device is greater than for the Ti device by 640 .DELTA.%
T/RIU.
[0105] The transmission spectra for the planar MIM sensor without
the plasmonic component, simulated by the TMM, are shown in FIG. 14
for Au (FIG. 14a), Ag (FIG. 14b), Cu (FIG. 14c), and Ti (FIG. 14d).
In all cases, the bottom metal layer was 90 nm, the titanium
dioxide cavity layer was 100 nm, and the top metal layer was 50 nm.
A cavity mode is evident for the Au, Ag, and Cu MIM sensors, but
not for the Ti MIM device. On resonance, the transmission intensity
for the Au device is 0.08% and the sensitivity is 56 .DELTA.%
T/RIU. The transmission intensity for the Ag device is 0.007% with
a sensitivity of 59 .DELTA.% T/RIU while the transmission intensity
for the Cu device is 0.05% with a sensitivity of 57 .DELTA.% T/RIU.
Therefore, the Au device shows the highest transmission intensity,
but the lowest performance while the Ag device shows the lowest
transmission intensity and the highest sensitivity. However, the
sensitivity increase from Au to Ag is only 3 .DELTA.% T/RIU and
therefore is relatively insignificant.
[0106] Overall, the results show that the device performance in
terms of overall transmission and sensitivity can be improved by
optimizing the plasmonic materials. However, for practical
biosensing applications Au is almost always chosen over Ag because
Au is chemically inert and has greatly improved device stability. A
combination of Au and Ag can be a good choice for this sensor, such
as using Ag for the bottom metal layer and Au for the top metal
layer, where there is a trade-off between device performance and
stability.
Example 9. Loss in the Insulator Cavity Layer
[0107] The dependence of the full device and planar sensor
performance on loss in the titanium dioxide cavity layer was also
studied by simulation with results shown in FIG. 15. In all
previous simulations, it was assumed that the extinction
coefficient (k) for the titanium dioxide layer is zero. However, if
for future applications we wanted to use a semiconductor material
instead of an insulating material, it will not be necessarily true
that k=0 in our wavelength range of interest. Therefore, it is
important to consider the performance of the device as a function
of loss in the cavity layer.
[0108] FIG. 15a shows the transmission spectra for the full MIM
plasmonic nanocup array device for a superstrate RI of 1.33 and
k=0, 0.1, 0.5, and 1. With an increase in k, there is a decrease in
the transmission intensity, as expected. The transmission spectra
with increasing superstrate RI are shown in FIG. 15b-15d for k=0.1,
k=0.5, and k=1, respectively. In all cases, the bottom Au layer is
90 nm, the titanium dioxide cavity layer is 60 nm, and the top Au
layer is 50 nm. The transmission intensity at the peak for k=0.1 is
1.5% and the sensitivity is 624 .DELTA.% T/RIU. For k=0.5, the
transmission intensity on resonance is 0.5% and the sensitivity is
545 .DELTA. % T/RIU, while for k=1 the transmission intensity is
0.25% and the sensitivity is 537 .DELTA.% T/RIU. Therefore, with
increasing k there is a decrease in both the transmission intensity
and the sensitivity. However, the sensing mechanism is still
maintained although in FIG. 15d when k=1 there is a spectral shift
in the peak because the high loss results in poor field confinement
in the cavity and thus the cavity effects are negligible compared
to the plasmonic effects. The near-field electric field
distributions on resonance are shown in FIG. 15e (|E|) and FIG. 15f
(E.sub.x) for different k values as indicated with a superstrate RI
of 1.33. As the k value increases, there is a loss in the localized
electric fields associated with the excitation of LSPR and the
cavity mode becomes less confined.
[0109] The transmission spectra for the planar MIM sensor with
increasing k values are shown in FIG. 15f. Similarly, with an
increase in k, there is a decrease in transmission intensity.
However, in contrast to the full device, for k=0.5 and k=1 a
resonance can no longer be sustained in the sensor. In all cases,
the bottom Au layer is 90 nm, the titanium dioxide cavity layer is
100 nm, and the top Au layer is 50 nm. At k=0 the transmission
intensity on resonance is 0.08% and the sensitivity is 56 .DELTA.%
T/RIU while at k=0.1 the transmission intensity on resonance is
0.02% and the sensitivity is 24 .DELTA.% T/RIU. With increasing k
there is a decrease in the transmission intensity and a significant
decrease in the sensitivity. In the full device, the plasmonic
component results in an overall increase in transmission intensity
and is used to tune the cavity loss and therefore the output
power.
Example 10. Cavity Parameter Tuning for Optimized Sensitivity
[0110] To assess the feasibility of using Au-titanium dioxide-Au
MIM plasmonic nanocavity devices for refractometric sensing, the
sensitivity values were determined by simulation and experiment for
various devices to identify the parameters that have the largest
effect on the sensitivity and to address the performance of these
devices. In total, devices with five different cavity thicknesses
(40 nm, 50 nm, 60 nm, 70 nm, 80 nm) and three different top and
bottom Au layers (50 nm, 75 nm, 90 nm) were simulated. Devices with
four different cavity thicknesses (40 nm, 60 nm, 80 nm, 100 nm),
two different top Au thicknesses (50 nm, 90 nm), and three
different bottom Au thicknesses (50 nm, 75 nm, 90 nm) were
fabricated and tested experimentally.
[0111] The simulation results of the sensitivity assessments are
shown in FIG. 16a-16d and the experimental results are shown in
FIG. 16e-16h. In total, devices with five different cavity
thicknesses (40 nm, 50 nm, 60 nm, 70 nm, 80 nm) and three different
top and bottom Au layers (50 nm, 75 nm, 90 nm) were simulated.
Devices with four different cavity thicknesses (40 nm, 60 nm, 80
nm, 100 nm), two different top Au thicknesses (50 nm, 90 nm), and
three different bottom Au thicknesses (50 nm, 75 nm, 90 nm) were
fabricated and tested experimentally. FIGS. 16a-16d show the
simulation results for the sensitivity as a function of the top Au
thickness, cavity thickness, bottom Au thickness, and total Au
thickness (adding together the bottom and top Au thicknesses),
respectively. FIGS. 16e-16h show the experimental results for the
sensitivity as a function of the top Au thickness, cavity
thickness, bottom Au thickness and total Au thickness,
respectively.
[0112] Both the simulation and experimental results show that a
larger top Au thickness will lead to a higher sensitivity (FIGS.
16a and 16e). FIGS. 16b and 16f show the simulation and
experimental results for the sensitivity as a function of the
cavity thickness for various different Au layer combinations.
However, while the simulation results show that the larger bottom
Au thickness will also give a higher sensitivity (FIG. 16c); the
experiment (FIG. 16g) does not show the same trend. This difference
could be due to several factors in the modelled device geometry.
For example, in the model the Au nanoparticles on the sidewalls
were fixed at a single layer with diameters of 30 nm. The
properties of the Au sidewall nanoparticles, the ability for
titanium dioxide to coat the sidewalls, and the ability for Au
nanoparticles to form on the top Au layer will change with the
bottom Au thickness, but were not taken into consideration in the
simulation. Both simulation and experiment show that a sufficient
total Au thickness is required to have a high sensitivity (FIG. 16d
and FIG. 16h), meaning that high field confinement is crucial for
refractometric sensing with this device design.
Example 11. Sensitivity of Device
[0113] The transmission spectra with increasing RI values are shown
in FIG. 1d. An increase in RI leads to an increase in transmission
intensity at a peak resonance wavelength of 700 nm. Here the
sensitivity is defined as the relative percent transmission
intensity change per refractive index unit (.DELTA.T %/RIU). For
this optimized device design, the experimental sensitivity value is
800 .DELTA.T %/RIU. There is no spectral shift at the primary
transmission resonance and there are also spectral locations with
no transmission intensity change with increasing RI, which can be
used as built-in reference points. Transmission measurements are
prone to large fluctuations based on factors such as sample defects
and contamination and therefore internal device references can help
to correct for these instabilities. This device is then suitable
for spectrometer-free measurements since it only requires
transmission values to be recorded on-resonance and at a reference
location.
[0114] A finite element method (FEM) model was used to study the
sensing mechanism, plasmon-cavity coupling, and cavity confinement
in this multilayered nanocup structure. Cross-sectional, top-down,
and 3D rotated views of the 3D-FEM model of the MIM plasmonic
nanocup device are shown in FIGS. 2a-2c. The simulation consists of
a single tapered polymer nanocup modelled in the center of the
simulation region with periodic boundary conditions along x and y
to simulate the array effect. The transfer matrix method (TMM) was
also used to simulate a planar multilayer sensor with no plasmonic
component, shown in FIG. 7. A FEM study was first used to
investigate whether the spectral properties of the MIM nanocup
array can be obtained with different device configurations. The
transmission spectra with increasing RI values were simulated for a
planar multilayer sensor, a MIM nanohole array, and the MIM nanocup
array studied in this work with the results shown in FIG. 8. The
optical effect of a sensitive relative transmission intensity
increase with increasing superstrate RI without a spectral shift is
only obtained for the MIM nanocup array. The MIM nanohole array
shows an increase in transmission intensity, but with a reduced
sensitivity and a spectral shift. Likely the nanohole array is
insufficient to form an adequate MIM cavity structure.
Example 12. Near-Field Electric Field Distributions in the MIM
Nanocup
[0115] Cross-sections of the near-field electric field
distributions in the MIM nanocup from the 3D-FEM simulation study
are shown in FIG. 2. All the near-field distributions shown are at
the transmission resonance wavelength. FIG. 2d shows the normalized
electric field (|E|) and the x-component of the electric field
(E.sub.x) with only a 90 nm bottom Au layer (no insulator and
second Au layer). E.sub.x is shown because the incident light in
the simulation is polarized along the x-axis. The z-component of
the electric field (E.sub.r), along the direction of simulated
light propagation, is shown in FIG. 9. In FIG. 2d, there is a
highly localized field at the bottom of the nanocup, at the rim of
the nanocup, and at the Au nanoparticles along the cup sidewalls,
which is expected due to the excitation of LSPR resonances in the
plasmonic device. FIG. 4e shows the electric field distributions
with the addition of a 40 nm titanium dioxide cavity layer. The
distributions of highly localized fields remain similar suggesting
that the sensor is still primarily operating as a plasmonic device.
FIGS. 4f-4g show |E| and E.sub.x, respectively, for a MIM plasmonic
nanocup array with a 90 nm bottom Au layer, 40 nm titanium dioxide
cavity layer, and 50 nm top Au layer with increasing superstrate RI
values. With the addition of the top Au layer, there is now a
confined mode in the cavity layer at the bottom of the nanocup with
high electric field intensity. There is also a localized field near
the top of the nanocup that is surrounded by the upper MIM
structure. As the RI value of the superstrate increases, there is
an increase in the electric field intensity at the top of the
nanocup.
[0116] The simulation results indicate that the sensing mechanism
is primarily driven by the MIM sensor. Light is incident from the
bottom of the nanocup and the confined optical energy is stored in
the titanium dioxide cavity layer. When there is a RI increase at
the superstrate, resonant light is coupled out from the cavity
layer to the far field resulting in a transmission intensity
increase. While the cavity design is inherently leaky, a sufficient
quality factor (Q-factor) is required for the sensor to show a
large relative change in transmission with no spectral shift. The
role of the plasmonic effect is two-fold. First, the plasmonic
properties of the nanostructured Au provide high field localization
and confinement. Second, the plasmonic effect will lead to
efficient light scattering and out-coupling of the light from the
cavity to the far-field such that the performance of this device
far exceeds what can be accomplished with a MIM structure without
any plasmonic component. Therefore, the Q-factor of the cavity and
degree of plasmon-cavity coupling are two crucial parameters for
refractometric sensing with this device.
Example 13. Effect of Cavity Thickness
[0117] To determine the degree to which cavity-plasmon coupling
affects the sensing performance of the MIM nanocup array, the
effect of the cavity thickness was modelled. FIG. 3a shows the
simulated transmission spectra for the MIM nanocup array with a
superstrate RI of 1.33 and changing cavity thickness values from 40
nm to 120 nm with a step size of 10 nm. Spectral changes with
increasing top and bottom Au layers are shown in FIGS. 11-12. In
FIG. 3a, the bottom and top Au layers were 90 nm. The changing
cavity layer thickness results in spectral shifts and changes to
the transmission intensity at the peak resonance wavelength. This
is shown in FIG. 3b-3c where the resonant wavelength and
transmission intensity, respectively, are plotted as a function of
the cavity thickness with a bottom Au thickness of 90 nm and a top
Au thickness of 50 nm, 75 nm, and 90 nm. The transmission intensity
for all top Au layers has a maximum value at a titanium dioxide
cavity layer of approximately 100 nm. It is assumed that the
transmission maximum will occur when there is optimal overlap and
coupling between the cavity resonance and the plasmonic
resonance.
[0118] In FIG. 3d, the sensitivity is plotted as a function of the
cavity thickness. The sensitivity value, here taken from a RI value
of 1.33 to 1.34, increases with increasing cavity thickness until
it reaches a peak value at a cavity thickness of 70 nm. The
sensitivity value then decreases with increasing cavity thickness.
At a cavity thickness of 100 nm, the sensitivity is at
approximately half of its peak value. This result suggests that to
have the optimal sensitivity, a MIM structure should be designed
such that the cavity resonance is off of the plasmonic resonance.
In particular, the cavity thickness where this doubly resonant
condition is approached, but is still off-resonance such that the
optimal increase in transmission intensity occurs with RI
increase.
[0119] This condition can also be understood by the near-field
electric field distributions for different cavity thicknesses as
shown in FIG. 3e (for |E|) and FIG. 3f (for E.sub.x). In these
electric field distributions, the top and bottom Au layers are both
90 nm. The field distributions for the 40 nm and 70 nm cavity
layers both show the confined mode in the titanium dioxide cavity
layer at the bottom of the nanocup. The electric field intensity
for this cavity mode is higher for the 70 nm cavity than for the 40
nm cavity, which may be an indication of the higher sensitivity for
the thicker cavity layer. Once the cavity layer is 100 nm, the
electric field intensity remains high at the bottom of the nanocup,
but there is no longer a clearly confined mode in the titanium
dioxide cavity layer. The optimal coupling between the cavity mode
and the plasmonic mode leads to highly efficient out-coupling to
the superstrate, even for low RI values, which makes this device
less sensitive for refractometric detection. At a cavity thickness
of 120 nm, where the sensitivity is significantly decreased, the
near-field electric field distribution shows greatly reduced field
confinement. Overall, the refractometric sensitivity is optimized
by choosing the cavity thickness such that it allows sufficient
optical energy storage. When the device is designed in this way,
the RI change will tune the plasmon resonance wavelength and
consequently the optical out-coupling from the device will
significantly change. Therefore, the sensing occurs by modulating
the internal loss of the cavity, which results in a power change
without a spectral shift. The cavity should not couple too strongly
with the plasmonic mode; otherwise, too much of the light will be
out-coupled and not available to contribute towards the sensing
mechanism.
Example 14. Cavity Resonance Tuning and Sensitivity in a Planar MIM
Sensor
[0120] Cavity resonance tuning and sensitivity was analyzed in a
planar MIM sensor using the TMM with the results shown in FIG. 10,
but from the MIM sensor data the same resonance tuning and
optimization as for the full 3D-FEM model cannot be recovered since
the plasmon-cavity coupling needs to be considered to optimize the
device properties. Studies of the properties of the metallic and
insulator layers for the full MIM plasmonic nanocup device and the
planar MIM sensor alone were also used to investigate
plasmon-cavity coupling and the device optimization as described
below with results shown in FIGS. 13-14 for the metal material
study and FIG. 15 for a study of added loss in the titanium dioxide
insulator layer. Overall, it was determined that the optimal
materials should be chosen to enhance both the plasmonic and cavity
properties of this coupled device to obtain an improved sensitivity
value.
[0121] Cavity parameter optimization was done by sweeping the top
and bottom Au thicknesses and titanium dioxide cavity layer
thickness in simulation and experiment to identify the parameters
with the largest impact on the device sensitivity. Both the
simulation and experimental results, plotted in FIG. 16, suggest
that a reliable way to obtain a high device sensitivity is to
combine thicker Au layers (higher confinement) with a cavity
thickness around 70-80 nm, which will allow the optimal storage of
optical energy in the titanium dioxide cavity layer. If the cavity
thickness is too large the sensitivity drops significantly as
discussed previously. Overall, the device with the highest
sensitivity, which exceeds 800 .DELTA.% T/RIU, was obtained for
bottom and top Au thicknesses of 90 nm and a cavity layer of 80
nm.
Example 15. Application in Spectrometer-Free Refractometric
Detection
[0122] The optimized MIM nanocup array device was then assessed for
applications in spectrometer-free refractometric detection. The
setup utilized is shown in FIG. 4a. A white light source passes
through a monochromator, which selects either the peak (700 nm) or
reference (623 nm) wavelength. The light at the selected wavelength
is then guided through a beam expander and incident on the
plasmonic sensor on a sample stage. The light is then collected by
a 5.times. objective lens and goes to an imaging camera. FIG. 4b
shows a linear (slope 600.+-.30 and R.sup.2=0.99) and consistent
relative intensity increase with increasing superstrate RI values
from 1.333 to 1.443 from solutions with increasing glycerol
concentrations. The increase in intensity at the peak (slope
16.+-.1 and R.sup.2=0.99) and reference wavelengths is shown in
FIG. 4c and the corresponding transmission intensity images of the
device surface are shown in FIG. 4d-4e for the peak and reference
wavelengths, respectively. For each intensity image normalization
was done with the light source intensity image at 700 nm for the
peak image and 623 nm for the reference image. An increase in RI
does lead to a consistent and reliable increase in transmission
intensity at the resonance wavelength in this spectrometer-free
format and the reference spectral location shows good stability
with negligible slope.
Example 16. MIM Nanocup Array and Sensing Method for the Detection
of Cancer Biomarker CEA
[0123] The MIM nanocup array and sensing method were then applied
for the detection of the cancer biomarker CEA. The normal
concentration of CEA in human serum is 3-5 ng/mL and it becomes
elevated (>10 ng/mL) in several cancers, such as breast, lung,
and colon, making low concentration detection crucial. A schematic
of the CEA detection protocol is shown in FIG. 5a. CEA antibody
(anti-CEA, 30 .mu.g/mL) is covalently bound on the Au MIM nanocup
surface by 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide (EDC) and
N-hydroxysuccinimide (NHS) coupling to an immobilized layer of
11-mercaptuoudecanoic acid (MUA). Nonspecific binding of CEA on the
sensor surface is suppressed by two steps. The first is incubation
in a bovine serum albumin (BSA) surface blocking agent and the
second is immersion in a 10% ethanolamine solution, which caps
unreacted NHS. Images of the sensor surface before and after CEA
immersion are shown in FIGS. 5b-5c, respectively. To reduce noise,
each image represents the peak intensity value (700 nm) divided by
the reference intensity value (623 nm) averaged over three
relatively defect-free areas (250.times.300 pixels). The relative
intensity increase for the different CEA concentrations studied in
this work is shown in FIG. 5d, where the error bar corresponds to
the standard deviation for two replicate samples. A LOD of 10 ng/mL
is demonstrated with a linear calibration curve (R.sup.2=0.98) over
a dynamic range of 10 ng/mL-500 ng/mL, as shown in FIG. 5e.
[0124] The CEA detection shows that this sensing system can detect
protein-protein interactions with a sufficient LOD. The detection
of CEA using a commercialized SPR sensing system using a protocol
like the one utilized in this work has been previously reported
with a label-free LOD of only 100 ng/mL (Altintas et al., Surface
plasmon resonance based immunosensor for the detection of the
cancer biomarker carcinoembryonic antigen. Talanta 2011, 86,
377-383). Therefore, surprisingly the LOD has been improved by an
order of magnitude. Therefore, the MIM nanocup array sensor and
sensing method presented here are a promising candidate for
portable sensing systems.
* * * * *