U.S. patent application number 16/332786 was filed with the patent office on 2019-11-28 for system for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom.
The applicant listed for this patent is Modumetal, Inc.. Invention is credited to Leslie Ann Collinson, John Thomas Cox, Shamus F. Patry.
Application Number | 20190360116 16/332786 |
Document ID | / |
Family ID | 59969251 |
Filed Date | 2019-11-28 |
![](/patent/app/20190360116/US20190360116A1-20191128-D00000.png)
![](/patent/app/20190360116/US20190360116A1-20191128-D00001.png)
![](/patent/app/20190360116/US20190360116A1-20191128-D00002.png)
![](/patent/app/20190360116/US20190360116A1-20191128-D00003.png)
![](/patent/app/20190360116/US20190360116A1-20191128-D00004.png)
![](/patent/app/20190360116/US20190360116A1-20191128-D00005.png)
![](/patent/app/20190360116/US20190360116A1-20191128-D00006.png)
![](/patent/app/20190360116/US20190360116A1-20191128-D00007.png)
United States Patent
Application |
20190360116 |
Kind Code |
A1 |
Collinson; Leslie Ann ; et
al. |
November 28, 2019 |
SYSTEM FOR RELIABLE, HIGH THROUGHPUT, COMPLEX ELECTRIC FIELD
GENERATION, AND METHOD FOR PRODUCING COATINGS THEREFROM
Abstract
Embodiments of the present disclosure include a system for
depositing a layered nanolaminate alloy including a controller for
an electrodeposition process that includes a waveform synthesizer
circuit configured to generate a complex waveform signal
corresponding to a desired electrodeposition waveform to be output
from an electrodeposition power supply. The controller also
includes a synthesizer control circuit configured to control the
waveform synthesizer circuit. Based at least in part on a recipe
having information related to the electrodeposition process, the
synthesizer control circuit controls the generation of the complex
waveform signal by modulating in real-time at least one of a
waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, and a derivative of the complex
waveform signal. The controller further includes a controller
output circuit configured to transmit the complex waveform signal
to an input of the electrodeposition power supply.
Inventors: |
Collinson; Leslie Ann;
(Seattle, WA) ; Cox; John Thomas; (Issaquah,
WA) ; Patry; Shamus F.; (Redmond, WA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Modumetal, Inc. |
Seattle |
CA |
US |
|
|
Family ID: |
59969251 |
Appl. No.: |
16/332786 |
Filed: |
September 14, 2017 |
PCT Filed: |
September 14, 2017 |
PCT NO: |
PCT/US2017/051606 |
371 Date: |
March 12, 2019 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
62394552 |
Sep 14, 2016 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01N 27/42 20130101;
C25D 5/18 20130101; C25D 21/12 20130101 |
International
Class: |
C25D 21/12 20060101
C25D021/12; C25D 5/18 20060101 C25D005/18; G01N 27/42 20060101
G01N027/42 |
Claims
1. A system, comprising: an electrochemical processing tank; a set
of electrodes configured for depositing a multilayer nanolaminate
coating on a workpiece; an electrodeposition power supply connected
to the set of electrodes, the electrodeposition power supply
comprising an input connection configured to receive a complex
waveform signal, the electrodeposition power supply configured to
amplify the complex waveform signal to generate a desired
electrodeposition waveform, the desired electrodeposition waveform
configured to deposit at least one layer of the multilayer
nanolaminate coating on the workpiece; and a processor-based
controller comprising: a waveform synthesizer circuit configured to
generate the complex waveform signal; a synthesizer control circuit
configured to control the waveform synthesizer circuit based at
least in part on a recipe having parameters related to the
depositing at least one layer of the multilayer nanolaminate
coating, the synthesizer control circuit configured to control the
complex waveform signal generated by modulating in real-time a
waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, a derivative of the complex
waveform signal, or a combination thereof; and a controller output
circuit connected to the input of the electrodeposition power
supply, the controller output circuit configured to transmit the
complex waveform signal to the input.
2. The system of claim 1, wherein the synthesizer control circuit
comprises a field-programmable gate array.
3. The system of claim 1 or 2, wherein the recipe is stored in the
processor-based controller.
4. The system of any one of claims 1 to 3, wherein the recipe
comprises instructions for generating the desired electrodeposition
waveform; and wherein the instructions comprise a current density
of the desired electrodeposition waveform, a current waveform
profile of the desired electrodeposition waveform, a voltage
waveform profile of the desired electrodeposition waveform, or a
combination thereof.
5. The system of any one of claims 1 to 4, wherein the modulating
in real-time comprises modulating a first characteristic of a base
first-order waveform using a second characteristic of a second
first-order waveform based on a functional relationship between the
first characteristic and the second characteristic to generate the
complex waveform signal.
6. The system of claim 5, wherein the base first-order waveform and
the second first-order waveform are independently selected from a
plurality of preloaded waveforms that are stored in the
processor-based controller.
7. The system of claim 6, wherein the electrodeposition power
supply is one of a plurality of electrodeposition power supplies
that are connected to the processor-based controller; and wherein
the plurality of electrodeposition power supplies independently
control individual portions of a cathode bus bar positioned along
at least a portion of a length of the electrochemical processing
tank.
8. The system of any one of claims 5 to 7, wherein the first
characteristic of the base first-order waveform and the second
characteristic of the second first-order waveform independently
comprise a waveform shape, a frequency, an amplitude, an offset, a
slew, a wavelength, a phase, a velocity, a derivative of the
respective first-order waveform, or a combination thereof.
9. The system of claim 5, wherein the base first-order waveform is
the complex waveform signal; and wherein the second first-order
waveform is selected from a plurality of preloaded waveforms that
are stored in the processor-based controller.
10. The system of any one of claims 1 to 4, wherein the modulating
in real-time comprises serially combining sub-waveform sequences to
generate the complex waveform signal.
11. The system of claim 10, wherein the modulating in real-time
comprises generating the sub-waveform sequences for a desired
number of cycle counts and in a desired sequence order.
12. The system of claim 11, wherein at least one of the desired
number of cycle counts and the desired sequence order is
independently dynamically modified based on a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the depositing at least one layer of the nanolaminate coating, a
feedback signal related to the depositing at least one layer of the
nanolaminate coating, or a combination thereof.
13. The system of claim 12, wherein at least one of the desired
number of cycle counts and the desired sequence order is
independently dynamically modified based on the feedback signal,
and wherein the feedback signal relates to an electrolyte
concentration, an electrolyte level, an electrolyte temperature, a
coating thickness, a coating resistance, or a combination
thereof.
14. The system of any one of claims 1 to 13, wherein the
processor-based controller further comprises a network
communications circuit communicatively connected to an external
communications network, the network communications circuit
configured to receive the recipe from a remote computing
device.
15. The system of claim 14, further comprising one or more other
processor-based controllers configured to be connected to the
external communications network; wherein the processor-based
controller is configured to be connected to the one or more other
processor-based controllers via the external communications
network; and wherein each of the processor-based controllers
represents a node on the external communications network.
16. The system of claim 15, wherein each node of the external
communications network is configured to receive the recipe.
17. The system of claim 15 or 16, wherein the processor-based
controller is further configured to transmit at least a portion of
the instructions of the recipe to the one or more other
processor-based controllers via the external communications
network.
18. The system of any one of claims 2 to 17, wherein the
processor-based controller is configured to generate a plurality of
complex waveform signals, and the field-programmable gate array has
parallel processing capability to simultaneously and independently
control the waveform synthesizer circuit to generate each of the
plurality of complex waveform signals.
19. The system of claim 18, wherein the processor-based controller
is configured to adjust a current density, a voltage, a waveform
phase, or a combination thereof, of the desired electrodeposition
waveform to compensate for variations in the deposition of the at
least one layer of the nanolaminate coating on the workpiece.
20. The system of any one of claims 1 to 19, wherein the
processor-based controller is configured to use a power supply
driver file corresponding to the electrodeposition power supply to
take into account a characteristic of the electrodeposition power
supply.
21. The system of claim 20, wherein the power supply driver file is
based on a calibration procedure performed on the electrodeposition
power supply by the processor-based controller; and wherein the
calibration procedure comprises: transmitting a calibration
waveform signal to the electrodeposition power supply; placing a
known load across output terminals of the electrodeposition power
supply; measuring a slew rate, a percent overshoot, or a
combination thereof, of the electrodeposition power supply; and
creating the power supply driver file using at least results of the
measuring the slew rate, the percent overshoot, or the combination
thereof.
22. The system of any one of claims 1 to 21, further comprising a
tank automation controller configured to control an electrolyte
level, an electrolyte temperature, an agitation rate, a flow rate
of the respective electrochemical processing tank, or a combination
thereof.
23. The system of any one of claims 1 to 22, wherein the
electrodeposition power supply is configured to transmit the
desired electrodeposition waveform to the set of electrodes.
24. The system of any one of claims 1 to 22, wherein the
processor-based controller is configured to transmit the desired
electrodeposition waveform to the set of electrodes.
25. A controller for an electrodeposition process, comprising: a
waveform synthesizer circuit configured to generate a complex
waveform signal corresponding to an electrodeposition waveform, the
waveform synthesizer circuit being further configured to transmit
the complex waveform signal to an electrodeposition power supply; a
synthesizer control circuit configured to control the waveform
synthesizer circuit based at least in part on a recipe having
parameters related to depositing at least one layer of a multilayer
nanolaminate coating, the synthesizer control circuit configured to
control the complex waveform signal generated by modulating in
real-time a waveform shape, a frequency, an amplitude, an offset, a
slew, a wavelength, a phase, a velocity, a derivative of the
complex waveform signal, or a combination thereof; and a controller
output circuit configured to transmit the complex waveform signal
to an input of the electrodeposition power supply.
26. The controller of claim 25, wherein the synthesizer control
circuit comprises a field-programmable gate array.
27. The controller of claim 25 or 26, wherein the recipe comprises
instructions for generating the electrodeposition waveform; and
wherein the instructions comprise a current density of the
electrodeposition waveform, a current waveform profile of the
electrodeposition waveform, a voltage waveform profile of the
electrodeposition waveform, or a combination thereof.
28. The controller of any one of claims 25 to 27, wherein the
recipe is stored in the controller.
29. The controller of any one of claims 25 to 28, wherein the
modulating in real-time comprises modulating a first characteristic
of a base first-order waveform using a second characteristic of a
second first-order waveform based on a functional relationship
between the first and second characteristics to generate the
complex waveform signal.
30. The controller of claim 29, wherein the base first-order
waveform and the second first-order waveform are independently
selected from a plurality of preloaded waveforms that are stored in
the controller.
31. The controller of claim 30, wherein the plurality of preloaded
waveforms comprises a triangular waveform, a sinewave, a square
wave, or a custom waveform.
32. The controller of any one of claims 29 to 31, wherein the first
characteristic of the base first-order waveform and the second
characteristic of the second first-order waveform independently
comprise a waveform shape, a frequency, an amplitude, an offset, a
slew, a wavelength, a phase, a velocity, a derivative of the
respective first-order waveform, or a combination thereof.
33. The controller of claim 29, wherein the base first-order
waveform is the complex waveform signal, and wherein the second
first-order waveform is selected from a plurality of preloaded
waveforms that are stored in the controller.
34. The controller of any one of claims 25 to 28, wherein the
modulating in real-time comprises serially combining sub-waveform
sequences to generate the complex waveform signal.
35. The controller of claim 34, wherein the modulating in real time
comprises generating the sub-waveform sequences for a sub-waveform
cycle count and in a sub-waveform sequence order.
36. The controller of claim 35, wherein at least one of the
sub-waveform cycle count and the sub-waveform sequence order is
independently dynamically modified based on a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the electrodeposition process, a feedback signal related to the
electrodeposition process, or a combination thereof.
37. The controller of claim 36, wherein at least one of the
sub-waveform cycle count and the sub-waveform sequence order is
independently dynamically modified based on the feedback signal;
and wherein the feedback signal relates to an electrolyte
concentration, an electrolyte level, an electrolyte temperature, a
coating thickness, a coating resistance, or a combination
thereof.
38. The controller of any one of claims 25 to 37, further
comprising a network communications circuit communicatively
connected to an external communications network, the network
communications circuit configured to receive the recipe via the
external communications network.
39. The controller of claim 38, wherein the external communications
network is connected to one or more other controllers, and each of
the one or more other controllers represents a node on the external
communications network.
40. The controller of claim 39, wherein the network communication
circuit is configured to transmit at least a portion of the
instructions of the recipe to the one or more other controllers via
the external communications network.
41. The controller of claim 26, wherein the controller is
configured to generate a plurality of complex waveform signals
corresponding to a plurality of electrodeposition waveforms; and
wherein the field-programmable gate array comprises parallel
processing capability to simultaneously and independently control
the waveform synthesizer circuit to generate each of the plurality
of complex waveform signals.
42. The controller of claim 41, wherein the controller is
configured to adjust a current density, a voltage, a waveform
phase, or a combination thereof, of the respective
electrodeposition waveform to compensate for variations in the
electrodeposition process.
43. The controller of any one of claims 25 to 42, wherein the
controller is configured to use a power supply driver file
corresponding to the electrodeposition power supply to take into
account a characteristic of the electrodeposition power supply.
44. The controller of claim 43, wherein the characteristic
comprises a slew-rate, a percent overshoot, or a combination
thereof.
45. The controller of claim 43 or 44, wherein the power supply
driver file is based on a calibration procedure performed by the
controller on the electrodeposition power supply, and wherein the
calibration procedure comprises: transmitting a calibration
waveform signal to the electrodeposition power supply; placing a
known load across output terminals of the electrodeposition power
supply; measuring a slew rate, a percent overshoot, or a
combination thereof, of the electrodeposition power supply; and
creating the power supply driver file using at least results of the
measuring the slew rate, the percent overshoot, or the combination
thereof.
46. A method for electrodepositing a coating on a workpiece, the
method comprising: selecting a recipe corresponding to an
electrodeposition process; producing a specialized recipe by
adjusting the recipe based on information related to workpiece
geometry, workpiece surface area, an electrodeposition power
supply, or a combination thereof; generating a complex waveform
signal corresponding to a desired electrodeposition waveform that
is based on the adjusted recipe, the generating comprising
modulating in real-time a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity, a
derivative of the complex waveform signal, or a combination
thereof, based at least on the recipe; providing the complex
waveform signal to the electrodeposition power supply; generating
an electrodeposition waveform based on the complex waveform signal
by the power supply; and transmitting the electrodeposition
waveform to an electrode set in an electrodeposition processing
tank, thereby depositing the coating on the workpiece.
47. The method of claim 46, wherein the complex waveform signal is
generated using a field-programmable gate array.
48. The method of claim 46 or 47, wherein the recipe comprises
instructions for generating the electrodeposition waveform, and
wherein the instructions comprise at least one of a current density
of the electrodeposition waveform, a current waveform profile of
the electrodeposition waveform, a voltage waveform profile of the
electrodeposition waveform, or a combination thereof.
49. The method of any one of claims 46 to 48, wherein the
generating the complex waveform signal comprises modulating a first
characteristic of a base first-order waveform using a second
characteristic of a second first-order waveform based on a
functional relationship between the first and second
characteristics.
50. The method of claim 49, wherein the base first-order waveform
and the second first-order waveform are independently selected from
a plurality of preloaded waveforms that are stored in a
processor-based controller.
51. The method of claim 50, wherein the plurality of preloaded
waveforms comprises a triangular waveform, a sinewave, a square
wave, or a custom waveform.
52. The method of claim 49, wherein the first characteristic of the
base first-order waveform and the second characteristic of the
second first-order waveform independently comprise a waveform
shape, a frequency, an amplitude, an offset, a slew, a wavelength,
a phase, a velocity, a derivative of the first-order waveform, or a
combination thereof.
53. The method of claim 49, wherein the base first-order waveform
is the complex waveform signal; and wherein the second first-order
waveform is selected from a plurality of preloaded waveforms.
54. The method of any one of claims 46 to 48, wherein the
generating the complex waveform signal comprises serially combining
sub-waveform sequences.
55. The method of claim 54, wherein the serially combining
sub-waveform sequences comprises generating the sub-waveforms for a
sub-waveform cycle count and in a sub-waveform sequence order.
56. The method of claim 55, wherein the sub-waveform cycle count,
the sub-waveform sequence order, or a combination thereof, is
independently dynamically modified based on a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the depositing the coating, a feedback signal related to the
depositing the coating, or a combination thereof.
57. The method of claim 56, wherein the sub-waveform cycle count,
the sub-waveform sequence order, or a combination thereof, is
independently dynamically modified based on the feedback signal,
and wherein the feedback signal relates to an electrolyte
concentration, an electrolyte level, an electrolyte temperature, a
coating thickness, a coating resistance, or a combination
thereof.
58. The method of any one of claims 47 to 57, further comprising
generating a plurality of complex waveform signals by the
field-programmable gate array, which has parallel processing
capability to simultaneously and independently generate each of the
plurality of complex waveform signals.
59. The method of any one of claims 46 to 58, wherein the
generating the complex waveform signal takes into account a
characteristic of the electrodeposition power supply.
60. The method of claim 59, wherein the characteristic comprises a
slew-rate, a percent overshoot, or a combination thereof.
61. The method of any one of embodiments 46 to 60, wherein the
electrodeposition waveform is transmitted from the power supply to
the electrode set.
62. The method of any one of embodiments 50 to 60, wherein the
electrodeposition waveform is transmitted from the processor-based
controller to the electrode set.
Description
BACKGROUND
Technical Field
[0001] Depositing multilayer nanolaminate coatings on a workpiece
via electrochemical manufacturing methods at relatively high rates
or throughput requires stable and precise electric field generators
(e.g., waveform generators). Additionally, varying the composition
and microstructure of the deposited coatings (e.g., deposited
species and/or microstructure) requires precise control of the
waveform provided (e.g., the current and/or the voltage waveform)
to one or more sets of electrodes simultaneously. Further, based on
the desired galvanic interaction among or between individual layers
of the coating and/or between the coating layers and the workpiece,
electrodeposition may require complex features in the waveform
and/or the waveform may have to be modified in real-time based on a
process step and/or process feedback in order to achieve specific
combinations of properties.
Description of the Related Art
[0002] Traditional electrodeposition systems typically use current
pulses, based on abrupt voltage or current transitions, which limit
the degree of precision that can be applied to the
electrodeposition process. Although in some related electroplating
systems, for example, electroplating systems in the semiconductor
industry or coatings industries, the power supplies may include
analog circuitry and micro-controllers that are capable of a range
of waveforms. However, the range of waveforms in these
electroplating systems is limited in both the number of available
waveforms and the type of waveforms that can be created. In
addition, the types of waveforms that can be created are further
limited to pre-loaded full-length waveforms and/or limited to
standard waveform profile patterns. That is, the waveforms cannot
be modified in real-time. Further, power supplies and controllers
in traditional systems typically only control the voltage or
current to one pair of electrodes (i.e., an anode and a
cathode).
[0003] While some traditional systems provide flexibility in the
controller by including field-programmable gate arrays, in known
power supply systems the controller is required to be connected to
a specific bulk power supply or power supplies. That is, each
controller is configured to be used with, for example, a power
supply of a specific model or a limited range of models, power
supplies from a specific manufacturer, and/or power supplies having
specific output ranges. This means that a user is required to
purchase and learn different software for each power supply.
Moreover, known systems have varying degrees of instability, which
can adversely affect the coating process. Known systems cannot
calibrate for and/or modify the output waveform to account for
process instabilities. Accordingly, there is a need for improved
power control systems and methods. The present disclosure provides
this and related advantages.
BRIEF SUMMARY
[0004] In embodiments of the present technology, the power supply
systems, which include a controller and a power supply, dynamically
generate electrodeposition waveforms having any desired waveform
profile (e.g., generate a complex waveform) by modulating or
changing in real-time the waveform shape, the frequency, the
amplitude, the offset, the slew, the wavelength, the phase, the
velocity, the derivative, and/or some other waveform parameter. The
desired waveform profile can apply to the voltage and/or the
current profile of the electrodeposition waveform. The
electrodeposition waveform is then output to a set of electrodes in
an electrochemical tank to perform the electrodeposition
process.
[0005] In embodiments, the present disclosure provides a system,
comprising: an electrochemical processing tank; a set of electrodes
configured to be used in depositing a multilayer nanolaminate
coating on a workpiece; an electrodeposition power supply connected
to the set of electrodes, the electrodeposition power supply
comprising an input connection configured to receive a complex
waveform signal, the electrodeposition power supply configured to
amplify the complex waveform signal to generate a desired
electrodeposition waveform, the desired electrodeposition waveform
configured to deposit at least one layer of the multilayer
nanolaminate coating on the workpiece; and a processor-based
controller comprising: a waveform synthesizer circuit configured to
generate the complex waveform signal; a synthesizer control circuit
configured to control the waveform synthesizer circuit based at
least in part on a recipe having parameters related to the
depositing at least one layer of the multilayer nanolaminate
coating, the synthesizer control circuit configured to control the
complex waveform signal generated by modulating in real-time a
waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, a derivative of the complex
waveform signal, or a combination thereof; and a controller output
circuit connected to the input of the electrodeposition power
supply, the controller output circuit configured to transmit the
complex waveform signal to the input.
[0006] In other embodiments, the present disclosure provides a
controller for an electrodeposition process, comprising: a waveform
synthesizer circuit configured to generate a complex waveform
signal corresponding to an electrodeposition waveform, and
configured to transmit the complex waveform signal to an
electrodeposition power supply; a synthesizer control circuit
configured to control the waveform synthesizer circuit based at
least in part on a recipe having parameters related to depositing
at least one layer of a multilayer nanolaminate coating, the
synthesizer control circuit configured to control the complex
waveform signal generated by modulating in real-time a waveform
shape, a frequency, an amplitude, an offset, a slew, a wavelength,
a phase, a velocity, a derivative of the complex waveform signal,
or a combination thereof; and a controller output circuit
configured to transmit the complex waveform signal to an input of
the electrodeposition power supply.
[0007] In further embodiments, the present disclosure provides a
method for electrodepositing a coating on a workpiece, the method
comprising: selecting a recipe corresponding to a electrodeposition
process; producing a specialized recipe by adjusting the recipe
based on information related to workpiece geometry, workpiece
surface area, an electrodeposition power supply, or a combination
thereof; generating a complex waveform signal corresponding to a
desired electrodeposition waveform that is based on the adjusted
recipe, the generating comprising modulating in real-time a
waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, a derivative of the complex
waveform signal, or a combination thereof, based at least on the
recipe; providing the complex waveform signal to the
electrodeposition power supply; generating an electrodeposition
waveform based on the complex waveform signal by the power supply;
and transmitting the electrodeposition waveform to an electrode set
in an electrodeposition processing tank, thereby depositing the
coating on the workpiece.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0008] The detailed description is described with reference to the
accompanying figures. In the figures, the left-most digit(s) of a
reference number identifies the figure in which the reference
number first appears. The use of the same reference numbers in
different figures indicates similar or identical components or
features.
[0009] FIG. 1 illustrates an embodiment of an electrodeposition
system depicting the control of electrochemical processing tanks
via network connected controllers.
[0010] FIG. 2A illustrates an embodiment of a controller that can
be used in the system of FIG. 1.
[0011] FIG. 2B illustrates another embodiment of a controller that
can be used in the system of FIG. 1.
[0012] FIG. 3 illustrates a method of calibrating an
electrodeposition power supply to create a power supply driver
file.
[0013] FIGS. 4A-4C illustrate a high-level overview of the steps
for operating a system to perform an electrodeposition process on a
workpiece surface.
[0014] FIG. 5A illustrates generation of a second-order waveform
using the characteristics of two first-order waveforms.
[0015] FIG. 5B illustrates an embodiment of a complex waveform that
can be generated by the system of FIG. 1.
DETAILED DESCRIPTION
[0016] Described herein is a system and apparatus for
electrodeposition of coating (e.g., a laminated coating) on a
workpiece. In embodiments, such systems are used to electrodeposit
one or more nanolaminated or microlaminated metal or metal alloy
coatings on all or part of a workpiece, e.g., the surface of the
workpiece. The workpiece can be an activated workpiece in that it
has been prepared (i.e., pretreated) for the deposition process. In
some embodiments, the workpiece is activated, at least in part, by
electrochemical etching controlled by an etching waveform or a
portion of a complex waveform that produces the one or more
nanolaminated or microlaminated coatings on the workpiece.
[0017] Prior to setting forth this disclosure in more detail, it
may be helpful to an understanding thereof to provide definitions
of certain terms to be used herein. Additional definitions are set
forth throughout this disclosure.
[0018] A "set of electrodes" or "electrode set," as used herein,
refers to at least one anode and the corresponding at least one
cathode. In embodiments, a set of electrodes is an anode/cathode
pair. However, in such embodiments, either the anode or the cathode
may be common between two or more sets of electrodes. For example,
an electrochemical tank can have one, two, three, four, or more
anodes and a common cathode, and an "electrode set" may refer to a
respective anode in combination with the common cathode. In other
embodiments, an electrode set refers to a common cathode that
corresponds to a plurality of anodes.
[0019] "Electrolyte," as used herein, means an electrolyte bath,
plating bath, or electroplating solution from which one or more
metals may be electrodeposited.
[0020] "Electrodeposition" or "electrodeposited" refers to a
process or a resultant product, respectively, in which electrolysis
is used to deposit a coating onto a workpiece. In other words, a
workpiece is contacted with (e.g., partially immersed in, or fully
immersed in) an electrolyte solution containing one or more ions
(e.g., metal, ceramic, etc.) while an electric current is passed
through the workpiece and the electrolyte solution, resulting in a
thin coating being deposited on the surface of the workpiece.
[0021] "Coatings" include thin layers that are electrodeposited
onto a surface of a workpiece. Therefore "coatings," as used
herein, includes claddings, which are made of a series of thin
electrodeposited layers on a surface of a mandrel, where the
mandrel is removed after formation of the electrodeposited layers.
Claddings are generally fastened to another article as a protective
layer after formation.
[0022] "Laminated," or "laminate" as used herein, refers to
materials (e.g., coatings) that comprise two or more layers. In
embodiments, laminate or laminated refers to materials that
comprise, consist essentially of, or consist of, a series of layers
that may be in an alternating or non-alternating pattern.
Alternating layers may comprise two types of layers (e.g., A, B, A,
B, A, B . . . ), three types of layers (e.g., A, B, C, A, B, C, A,
B, C . . . ), four types of layers (e.g., A, B, C, D, A, B, C, D .
. . ), or more types of layers. Non-alternating layers may comprise
three or more, four or more, or five or more different types of
layers. Laminated, as used herein includes nanolaminated.
[0023] "Nanolaminate" or "nanolaminated," within the meaning of
this disclosure includes coatings comprising two or more layers in
which each of the individual layers has a thickness of less than
10,000 nanometers (i.e., 10 microns). In other words, the term
"nanolaminated" in "nanolaminated coatings" in this disclosure
refers to the thickness of the layers in the coating, not the
overall thickness of the coating made up of the individual layers.
In embodiments, "nanolaminated" refers to materials or coatings
that comprise, consist essentially of, or consist of, a series of
laminated layers less than 1 micron. The processes described herein
are particularly suited for providing nanolaminated coatings,
however, they certainly also can be used to make articles in which
the individual layers that are thicker than 10 microns.
[0024] "Workpiece" includes any item with a surface onto which a
coating is electrodeposited. Workpieces include substrates, which
are objects on which a coating is applied, and mandrels, which are
substrates from which the coating is removed after formation.
Workpieces can be formed of a conductive material (e.g., a metal),
formed of a mixture of conductive and non-conductive materials
(e.g., a polymer-metal mixture), or coated with a conductive
material (e.g., non-conductive material coated with a metal layer
through electroless deposition).
[0025] A workpiece employed in embodiments of the present
disclosure may be any suitable workpiece. In embodiments, a
workpiece is made of a polymeric material. In some embodiments, a
polymeric material is a plastic material. In other embodiments, a
workpiece is made of a metal or an alloy. In some embodiments, the
metal is a steel alloy.
[0026] The term "wavelength" refers to the thickness of two
adjacent layers that are formed in a single deposition cycle in
embodiments where the current density is a periodic function.
[0027] "Complex waveform" as used herein refers to any arbitrary
waveform that can be generated or modified during the
electrodeposition process, including waveforms consisting of a
fundamental frequency, waveforms with a fundamental frequency
having superimposed harmonics, and/or waveforms consisting of a
combination of two or more waveforms. The complex waveform can
include off periods and periods where current is reversed (e.g.,
pulse and pulse reverse plating waveforms).
[0028] As used herein, "generate" includes the initial creation of
a new waveform and/or subsequent modifications or changes to the
waveform. The generation of the full waveform can use a nested loop
sequence control in which the final electrodeposition waveform is
generated by looping the sequenced sub-waveforms for a
predetermined cycle count, a predetermined time period, or
indefinitely until the electrodeposition process is stopped or
changed for some reason. In some embodiments, the custom
electrodeposition waveform is generated by modulating a base
waveform using characteristics of a second waveform to generate a
"second-order" waveform that is then used as the electrodeposition
waveform. Characteristics of the second waveform may include one,
two, three, or more of amplitude, frequency, offset, slew,
overshoot, wavelength, phase, velocity, and derivative of the
waveform (to account for sharp or continuous transitions of the
waveform). The waveforms that are used to generate the second-order
waveform are also referred to herein as "first-order" waveforms.
The first-order waveforms can be selected from a plurality of
preloaded waveforms and can be standard waveforms such as, for
example, sinusoidal waveforms, triangular waveforms, square waves,
etc., and/or another custom waveform. Information from one or more
of the first-order waveforms (e.g., information related to the
amplitude, frequency, offset, slew, wavelength, phase, velocity,
derivative of the waveform, etc.) can be used to modify another
first-order waveform or an existing electrodeposition waveform to
generate an electrodeposition waveform that is output to one or
more set of electrodes in the electrochemical processing tanks.
[0029] The terms "a," "an," "the," and similar articles or terms
used in the context of describing the disclosure (especially in the
context of the following claims) are to be construed to cover both
the singular and the plural (i.e., "one or more"), unless otherwise
indicated herein or clearly contradicted by context. Ranges of
values recited herein are intended to serve as a shorthand method
of referring individually to each separate value falling within the
range. In the present description, any concentration range,
percentage range, ratio range, or integer range is to be understood
to include the value of any integer within the recited range and,
when appropriate, fractions thereof (such as one tenth and one
hundredth of an integer), unless otherwise indicated. Also, any
number range recited herein relating to any physical feature, such
as size or thickness, are to be understood to include any integer
within the recited range, unless otherwise indicated. Unless
otherwise indicated herein, each individual value is incorporated
into the specification as if it were individually recited
herein.
[0030] The use of the alternative (e.g., "or") should be understood
to mean one, both, or any combination thereof of the alternatives.
The various embodiments described above can be combined to provide
further embodiments. Groupings of alternative elements or
embodiments of the disclosure described herein should not be
construed as limitations. Each member of a group may be referred to
and claimed individually, or in any combination with other members
of the group or other elements found herein. The phrase "or," as
used herein in the specification and in the claims, should be
understood to mean "either or both" of the elements so conjoined,
i.e., elements that are conjunctively present in some cases and
disjunctively present in other cases. Multiple elements listed with
"or" should be construed in the same fashion, i.e., "one or more"
of the elements so conjoined. Other elements may optionally be
present other than the elements specifically identified by the "or"
clause, whether related or unrelated to those elements specifically
identified. Thus, as an example, a reference to "A or B", when used
in conjunction with open-ended language such as "comprising" can
refer, in one embodiment, to A only (optionally including elements
other than B); in another embodiment, to B only (optionally
including elements other than A); in yet another embodiment, to
both A and B (optionally including other elements); etc.
[0031] The phrase "and/or," as used herein, should be understood to
mean "either or both" of the elements so conjoined, i.e., elements
that are conjunctively present in some cases and disjunctively
present in other cases. Multiple elements listed with "and/or"
should be construed in the same fashion, i.e., "one or more" of the
elements so conjoined. Other elements may optionally be present
other than the elements specifically identified by the "and/or"
clause, whether related or unrelated to those elements specifically
identified. Thus, as an example, a reference to "A and/or B", when
used in conjunction with open-ended language such as "comprising"
can refer, in one embodiment, to A only (optionally including
elements other than B); in another embodiment, to B only
(optionally including elements other than A); in yet another
embodiment, to both A and B (optionally including other elements);
etc.
[0032] As used herein, the phrase "at least one," in reference to a
list of one or more elements, should be understood to mean at least
one element selected from any one or more of the elements in the
list of elements, but not necessarily including at least one of
each and every element specifically listed within the list of
elements and not excluding any combinations of elements in the list
of elements. This definition also allows that elements may
optionally be present other than the elements specifically
identified within the list of elements to which the phrase "at
least one" refers, whether related or unrelated to those elements
specifically identified. Thus, as an example, "at least one of A
and B" (or, equivalently, "at least one of A or B," or,
equivalently "at least one of A and/or B") can refer, in one
embodiment, to at least one, optionally including more than one, A,
with no B present (and optionally including elements other than B);
in another embodiment, to at least one, optionally including more
than one, B, with no A present (and optionally including elements
other than A); in yet another embodiment, to at least one,
optionally including more than one, A, and at least one, optionally
including more than one, B (and optionally including other
elements); etc.
[0033] In the context of this disclosure, the words "process" and
"method" are synonymous. It should also be understood that, unless
clearly indicated to the contrary, processes described herein and
claimed below can include steps in addition to the steps recited,
and the order of the steps or acts of the process is not
necessarily limited to the order in which the steps or acts of the
process are recited.
[0034] Each embodiment disclosed herein can comprise, consist
essentially of, or consist of a particular stated element, step,
ingredient, or component. The term "comprise" or "comprises" means
"includes, but is not limited to," and allows for the inclusion of
unspecified elements, steps, ingredients, or components, even in
major amounts. The phrase "consisting of" excludes any element,
step, ingredient, or component that is not specified. The phrase
"consisting essentially of" limits the scope of the embodiment to
the specified elements, steps, ingredients, or components, and to
those that do not materially affect the basic and novel
characteristics of the claimed disclosure.
[0035] In embodiments, a system for depositing a layered
nanolaminate alloy includes one or more electrochemical processing
tanks, with each electrochemical processing tank having one or more
sets of electrodes for use in depositing multilayer nanolaminate
coatings on one or more workpieces. Such a system may also include
one or more electrodeposition power supplies, with each power
supply respectively connected to an electrode set of the one or
more sets of electrodes. In embodiments, each power supply has an
input connection configured to receive a complex waveform signal
corresponding to a desired electrodeposition waveform to be output
from the power supply, and each power supply is configured to
amplify the received complex waveform signal to generate the
desired electrodeposition waveform. Each electrodeposition power
supply may transmit the desired electrodeposition waveform to the
corresponding electrode set in the one or more sets of electrodes.
In some embodiments, an electrodeposition power supply
independently provides electrodeposition waveforms to more than one
corresponding electrode set. Such electrodeposition waveforms
provided by the corresponding power supply drives the deposition of
the nanolaminate coatings on the corresponding workpiece. A given
electrodeposition power supply has a maximum switching speed, which
measures how fast the power supply changes from a first amplitude
level to a second amplitude level.
[0036] In embodiments, the system also includes a processor-based
controller having a waveform synthesizer circuit configured to
generate each complex waveform signal to be transmitted to the
input of the respective electrodeposition power supply. In some
embodiments, the processor-based controller also includes a
synthesizer control circuit that is configured to control the
waveform synthesizer circuit. Based at least in part on a recipe
having information related to the depositing of the multilayer
nanolaminate coatings, the synthesizer control circuit controls the
generating of the respective complex waveform signal by modulating
in real-time at least one of a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity,
and a derivative of the complex waveform signal. As such, in some
embodiments, the processor-based controller provides for, and
modulates in real-time, off periods, forward pulse times, reverse
pulse times, or a combination thereof. In further embodiments, the
processor-based controller further includes one or more controller
output circuits respectively connected to the input of each
electrodeposition power supply, with each controller output circuit
configured to transmit the corresponding complex waveform signal to
the input of each electrodeposition power supply. In embodiments,
the synthesizer control circuit includes a field-programmable gate
array (FPGA). In some embodiments, the modulating in real-time of
at least one of a waveform shape, a frequency, an amplitude, an
offset, a slew, a wavelength, a phase, a velocity, and a derivative
of the complex waveform signal includes modulating one or more
first characteristics of a base first-order waveform using one or
more second characteristics of at least one other first-order
waveform based on a functional relationship between the first and
second characteristics to generate the respective complex waveform
signal. In some embodiments, the modulating in real-time of at
least one of a waveform shape, a frequency, an amplitude, an
offset, a slew, a wavelength, a phase, a velocity, and a derivative
of the complex waveform signal includes serially combining
sub-waveform sequences to generate the respective complex waveform
signal.
[0037] A processor-based controller has a maximum sample rate (also
called the clock rate or clock frequency), which is the rate at
which the power output is sampled. Generally, to produce accurate
waveforms a sample rate is many times greater than the signal's
highest frequency. A sample rate defines the step width of the
generated signal as well as the maximum achievable signal
frequency. In embodiments, sampling rates are range from DC to 12
GHz. In other embodiments, sampling rates range from DC to 350 KHz.
In embodiments, a processor-based controller modulates a sample
rate. In some embodiments, a processor-based controller has a
sample rate that is higher than the maximum sample rate for a given
power supply. In such embodiments, a processor-based controller may
modulate the sample speed to meet the maximum sample rate of the
power supply, for example, in order to conserve resources.
[0038] In further embodiments, a processor-based controller
controls and/or modulates a switching speed of an electrodeposition
power supply. The switching speed may range from 1 picosecond to
500 milliseconds. In embodiments, a switching speed is less than
about 5 milliseconds. In further embodiments, a switching speed is
about 5 milliseconds.
[0039] Embodiments of the systems discussed herein demonstrate
improved stability over extended operational periods when compared
to existing systems by, in part, incorporating a controller having
a waveform synthesizer circuit and a synthesizer control circuit to
dynamically change the electrodeposition waveform based on a
process step and/or process feedback, such as temperature of the
electrolyte, total thickness of a deposited coating, thickness of a
deposited layer or deposited layers, coating resistivity, current
and/or voltage readings between individual electrodes, and/or other
process and/or system feedback. In some embodiments, the
synthesizer control circuit is a FPGA that provides parallel
processing capability. Additionally, the controller enables the
generation of waveforms having any desired waveform profiles (e.g.,
a complex waveform having any desired waveform shape, frequency,
amplitude, offset, slew, wavelength, phase, velocity, and
derivative, and/or other waveform parameter(s)), to produce a
desired coating composition and/or microstructure. The desired
waveform profile can apply to the voltage and/or to the current
profile of the waveform.
[0040] The ability to generate complex waveforms provides
significantly more flexibility in the electrodeposition process
than traditional power supplies. The additional flexibility may be
necessary in order to produce nanolaminated coatings that are
within a desired range of deposited species, microstructures,
and/or thicknesses. Thus, power supply systems that are capable of
producing a variety of waveforms having any desired waveform
profile represent an improvement over traditional power supply
systems for controlling the production of nanolaminated coatings.
In contrast, traditional power supply systems may be preloaded
and/or have a limited number of waveform profile patterns (e.g.,
only square waves).
[0041] In embodiments of the present disclosure, the
electrodeposition power supply provides electrodeposition
waveforms, including periodic waveforms and non-periodic waveforms
having any desired parameter. In some embodiments, the
electrodeposition waveform is selected from a plurality of
waveforms that have been preloaded into, for example, a controller
or another device in the electrodeposition system.
[0042] Alternatively, or in addition to preloaded waveforms, the
electrodeposition waveform can be custom-built using waveform
software that can create entirely new waveforms and/or modify
existing waveforms (e.g., existing waveforms that have been
preloaded into the system). In some embodiments, the custom
electrodeposition waveform is generated from sub-waveforms, which
can also be preloaded into the system, that are then sequenced
together to generate the full electrodeposition waveform.
[0043] Another embodiment of the present disclosure is directed to
a controller for an electrodeposition process that includes a
waveform synthesizer circuit configured to generate a complex
waveform signal corresponding to a desired electrodeposition
waveform to be output from an electrodeposition power supply. In
embodiments, the controller also includes a synthesizer control
circuit configured to control the waveform synthesizer circuit.
Based at least in part on a recipe having information related to
the electrodeposition process, the synthesizer control circuit
controls the generating of the complex waveform signal by
modulating in real-time at least one of a waveform shape, a
frequency, an amplitude, an offset, a slew, a wavelength, a phase,
a velocity, and a derivative of the complex waveform signal. In
some embodiments, the controller further includes a controller
output circuit configured to transmit the complex waveform signal
to an input of the electrodeposition power supply. In embodiments,
the synthesizer control circuit includes a FPGA. In some
embodiments, the modulating in real-time of at least one of a
waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, and a derivative of the complex
waveform signal includes modulating one or more first
characteristics of a base first-order waveform using one or more
second characteristics of at least one other first-order waveform
based on a functional relationship between the first and second
characteristics to generate the respective complex waveform signal.
In some embodiments, the modulating in real-time of at least one of
a waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, and a derivative of the complex
waveform signal includes serially combining sub-waveform sequences
to generate the respective complex waveform signal.
[0044] Another embodiment of the present disclosure is directed to
a method for electrodepositing a coating on a workpiece. In
embodiments, the method includes selecting a standardized recipe
corresponding to a desired electrodeposition process and adjusting
the standardized recipe based on information related to at least
one of the workpiece geometry, the workpiece surface area, and an
electrodeposition power supply used for the electrodepositing of
the coating on the workpiece. In some embodiments, the method also
includes generating a complex waveform signal corresponding to a
desired electrodeposition waveform based on the adjusted recipe and
providing the complex waveform to the electrodeposition power
supply. The method may further include generating an
electrodeposition waveform in the power supply based on the complex
waveform signal and outputting the electrodeposition waveform from
the power supply to an electrode set corresponding to the
workpiece. In some embodiments, the method includes depositing
coatings on the workpiece based on the electrodeposition waveform.
The method further involves modulating in real-time at least one of
a waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, and a derivative of the complex
waveform signal based at least in part on a recipe having
information related to the depositing of the coatings. In any of
the described embodiments, the workpiece may be a substrate.
[0045] FIG. 1 illustrates an embodiment of an electrodeposition
operating environment 100 depicting the control of one or more
electrochemical processing tanks 114, 116, 118 via one or more
respective controllers 106, 108, 110. The system is operative to
deposit a coating, e.g., nanolayered, nanolaminate coating, on
workpieces 120, 122, 124. The workpieces 120, 122, 124 in the
respective tanks 114, 116, 118 may be a metal (e.g., iron, steel,
etc.), metal alloy, or polymeric material (e.g., thermoplastic,
thermoset, and/or composite thereof, etc.). The workpieces 120,
122, 124 are connected to electrodes 140a, 142a, 144a,
respectively. In embodiments, pumps 132, 134, 136 pump the
electrolytic solution to the respective electrochemical processing
tanks 114, 116, 118 prior to the electrodeposition process. In some
embodiments, pumps 132, 134, 136 are used to add electrolytic
solution during the electrodeposition process, if needed. Control
valves 156, 158, 160 are respectively connected to processing tanks
114, 116, 118 to remove the electrolytic solution from the
respective tanks. Agitators 170, 172, 174 mix the electrolyte
solution in the respective tanks 114, 116, 118.
[0046] In embodiments, agitators 170, 172, 174, pumps 132, 134, 136
and control valves 156, 158, 160 are respectively controlled by
tank automation controllers 150, 152, 154. The tank automation
controllers 150, 152, 154 control at least one of an electrolyte
level, an electrolyte concentration, an electrolyte temperature,
and a flow rate in each of the electrochemical processing tanks
114, 116, 118, respectively. In other embodiments, a single tank
automation controller controls at least one of an electrolyte
level, an electrolyte concentration, an electrolyte temperature,
and a flow rate in each of the electrochemical processing tanks
independently. The tank automation controllers 150, 152, 154 can
operate autonomously or can operate based on commands received from
the respective controllers 106, 108, 110. In embodiments, the
controllers 106, 108, 110 communicate with the respective tank
automation controllers 150, 152, 154 using a direct communication
connection (either wired or wireless) and/or are connected to a
common network 180. The common network may be any suitable network,
such as an Ethernet network, a Modbus network, a CAN bus network,
or some other appropriate communications network.
[0047] Each of the electrochemical processing tanks 114, 116, 118
can have sensor assemblies 162, 164, 166 that measure or sense
process parameters such as temperature, level, electrolyte
concentration, coating thickness, coating resistivity, voltage or
current between the electrodes, and/or some other process
parameter. In embodiments, the output from the sensor assemblies
162, 164, 166 is sent directly to the controllers 106, 108, 110. In
other embodiments, the output from the sensor assemblies 162, 164,
166 is sent to the controllers 106, 108, 110 via the respective
tank automation controllers 150, 152, 154, which may also use the
sensor signals for controlling, e.g., the temperature, level,
electrolyte concentration, etc., in the respective processing tanks
114, 116, 118. In each of the controllers 106, 108, 110, the sensor
data can then be used to appropriately control, modify, adjust,
etc. the electrodeposition process, including modifying the process
sequence steps and/or modifying the electrodeposition waveform, if
necessary.
[0048] As seen in FIG. 1, in embodiments, each of the controllers
106, 108, 110 are connected to a network 104 and can communicate
with a central control station 102 via the network 104. The network
104 can be wireless and/or wired and can be a WAN, LAN, cloud
network, and/or the Internet. In embodiments, the controllers 106,
108, 110 include a webserver and the central control station 102
communicates with the controllers 106, 108, 110 using a web
browser. By using a browser interface, the central control station
102 does not have to include specialized software for communicating
with the controllers 106, 108, 110 and can be any standard
computer, smart phone, mobile device, or any other device that has
a web browser. Any required process monitoring and/or process
configuration software can be incorporated into one or all of the
controllers 106, 108, 110. In some embodiments, the central control
station 102 is a specialized computer that includes software for
monitoring and/or configuring the electrodeposition process of the
electrochemical processing tanks 114, 116, 118. In some
embodiments, the central control station 102 is disposed locally,
i.e., in the same location as the controllers 106, 108, 110. In
some embodiments, the central control station 102 is located
remotely (e.g., in a central control room, another facility, or in
another geographic location). In some embodiments, a central
control station is not used, and the electrodeposition process is
controlled using one or all of the controllers 106, 108, 110.
[0049] In operation, the control station 102 transmits commands to
one or more of the controllers 106, 108, 110 to control the
electrodeposition process. The commands can be in the form of a
"recipe" for the deposition of a coating layer (e.g., a nanolayered
metal or metal alloy coating) on a workpiece. In embodiments, the
recipe is in a standardized format for features common to a type of
electrodeposition process so that the same recipe can be used,
(i.e., a "standardized recipe"). For example, in many cases, the
sequence of steps for coating a workpiece, the criteria for adding
back solution during the process, and/or the output waveform of the
power supply used in the electrodeposition process may be the same
despite the scale of the electrodeposition process. However,
differences in the workpiece size, workpiece geometry, power supply
amperage rating, chemical addback quality, etc. from that used for
configuring the standardized recipe should be taken into account
when the actual process deviates from that of the standardized
recipe, which is typically the case. To this end, once the operator
selects the desired standardized recipe, the operator inputs
details of the actual process (e.g., details of the power supplies,
the workpiece, etc.). These operator inputs are then used by the
respective controllers 106, 108, 110 to adjust for the differences
between the standardized recipe and the actual process. In
embodiments, the operator inputs are simplified by having the
operator select from predetermined selection lists. For example,
the operator may be presented with a list of workpiece sizes and/or
geometries and a list of power supply model numbers having various
amperages that are compatible with the selected recipe, to name a
few. The controllers 106, 108, 110 are configured to use the
operator inputted information to confirm and/or adjust, if needed,
the set points for the electrodeposition process (e.g., power
supply amperage, chemical concentration, pump flow, etc.) and/or
the criteria for satisfying each recipe step of the recipe (e.g., a
predetermined time duration, a predetermined amp-hour accumulation,
process feedback such as solution concentration satisfying a
predetermined value, etc.). Alternatively, or in addition to
predetermined lists, the operator can also have the option of
inputting information directly.
[0050] In embodiments, the recipe is in a generic (e.g.,
non-proprietary) format that is received and used by controllers of
different models, manufacturers, etc. In some embodiments, the
recipe is in human-readable form to identify the coating that will
be produced by the recipe. In embodiments, the recipe includes
information on the sequencing steps for controlling each of the
coating layers of the electrodeposition process. For example, the
sequencing steps can include instructions for controlling the
various equipment (e.g., pumps 132, 134, 136, agitators 170, 172,
174, control valves 156, 158, 160, etc.) used in the
electrodeposition process, the time duration for each step, the
amp-hour accumulation for each step, and/or information for
creating and/or criterial for modifying an electrodeposition
waveform profile (e.g., a current and/or voltage waveform profile,
to be transmitted to one or more sets of electrodes 140a, 140b,
142a, 142b, 144a, 144b in electrochemical processing tanks 114,
116, 118). The recipe can also include instructions for the current
density used in the various steps of the electrodeposition process
(e.g., the current density for each of the coating layers in a
multilayer nanolaminate process).
[0051] Based on the geometric shape and size of the respective
workpieces 120, 122, 124, in some embodiments, the controllers 106,
108, 110 use the current density information to appropriately
control the output power of the respective power supplies 126, 128,
130 during the various steps of the electrodeposition process. The
geometric shape and size of the workpiece 120, 122, 124 can also be
transmitted via the recipe and/or can be manually input in the
controller 106, 108, 110. Operational instructions, such as, for
example, setting the flow rate, temperature, and/or the electrolyte
concentration in the electrochemical processing tanks 114, 116,
118, can be directly executed by the controllers 106, 108, 110
and/or be transmitted to the respective tank automation controllers
150, 152, 154 for further processing and execution. The recipe can
also include instructions for responding to a change in system
conditions such as, for example, instructions for modifying the
electrodeposition waveform and/or the sequence steps based on, for
example, a predetermined time period or duration, a predetermined
amp-hour accumulation, and/or feedback from sensor assemblies 162,
164, 166 in the electrochemical processing tanks 114, 116, 118.
[0052] In embodiments, one or more of the controllers 106, 108, 110
receive the instructions from the control station 102 (e.g., via a
web browser interface), and then respectively transmit, via the
communication network 104, appropriate commands to at least one
other controller. Thus, each controller 106, 108, 110 on the
network 104 can act as a node of a mesh network. The mesh network
of controllers improves the stability of the system by reducing the
system's reliance on a single external control station, such as
control station 102, for providing a master control of the
controllers in the system. For example, once the instructions are
sent by the control station 102 to one or more of the controllers
106, 108, 110, all the other controllers can cooperate to ensure
that the instruction data is properly distributed. The controllers
106, 108, 110 can act autonomously when controlling their
respective tanks 114, 116, 118 based on the respective recipes.
However, when needed, the controllers 106, 108, 110 can also share
data (e.g., the instructions from control station 102, process
data, etc.) via the network 104 to improve system stability. In
some embodiments, rather than a separate control station 102, one
or more of the controllers 106, 108, 110 store the recipes for the
entire electrodeposition process and act as the master control
station. In some embodiments, at least one of the controllers 106,
108, 110 includes a database for storing data related to the
deposition processes. For example, each of the controllers 106,
108, 110 can include a database to store the instruction data
received from the control station 102.
[0053] In still further embodiments, the one or more controllers
106, 108, 110 are deployed in a single tank and cooperate to ensure
that the instruction data is properly distributed to individual
portions of the single tank. A single tank system may be deployed
for depositing coatings on large structures (e.g., oil and natural
gas production tubulars having lengths ranging between
approximately 15 and 45 feet). In the foregoing embodiments,
controllers 106, 108, 110 may individually control portions of a
bus bar in a large electrodeposition tank having a single power
supply or multiple supplies. In some embodiments, a single
controller controls a plurality of power supplies (e.g.,
distributed along the length of a bus bar).
[0054] Embodiments of the controller 106, 108, 110 will now be
described. For clarity, the embodiments will be described with
respect to the tank system associated with controller 106. However,
those skilled in the art will understand that the description will
also be applicable to the tank systems associated with controllers
108 and 110. The controller 106 can include any type of
programmable processor-based computer. In embodiments, the
controller 106 is a stand-alone controller in that the controller
is not connected to other computers. However, it is contemplated
that the controller 106 will be part of a network with other
computers and processor-based controllers that are interconnected
(e.g., via network 104, as seen in FIG. 1).
[0055] In some embodiments, the controller 106 is a single-board
reconfigurable I/O device (sbRIO). For example, as seen in FIG. 2A,
the controller 106 is a sbRIO that includes a processor 202 to
execute the steps for controlling the electrodeposition process.
The controller 106 also includes computer-readable media 204, which
can be, for example, a disk drive, optical drive, solid-state
drive, flash drive, or another type of drive to store, for example,
the operating system and/or application software such as, for
example, waveform generation software to be executed by the
processor 202 to generate the electrodeposition waveform signal 222
and/or process software to perform other operational functions with
respect to the electrodeposition process. In some embodiments, the
processor 202 generates the electrodeposition waveform signal 222
in real-time. The controller 106 can be used to control and/or
monitor the electrodeposition process via a GUI circuit 212. The
GUI circuit 212 can include a display 220 (e.g., an LCD, an LED
display or another type of display). In some embodiments, the
display 220 is integral to the controller 106 and/or a remote GUI
(graphical user interface) is attached to the controller 106 via
appropriate hardware. A user can use the display 220 and/or a
remote GUI to monitor and/or control the deposition process of tank
114 and/or another tank via the network 104.
[0056] The controller 106 includes a network communication device
210 that can be connected to an external network 104 (see FIG. 1).
The external network can be a LAN, WAN, cloud, Internet, or some
other network, and can be wired and/or wireless. In some
embodiments, a separate communication circuit is included for the
controller 106 to communicate with tank automation controller 150
via, for example, network 180. Depending on the network and/or the
portion of the network, the protocol used in network 104 and/or the
network 180 can be any standard protocol, such as, for example,
Ethernet, Modbus, CAN bus, TCP/IP, or any other appropriate
protocol. Of course, the protocol between the network 104 and
network 180 need not be the same and can be different. In some
embodiments, the tank automation controller 150 communicates with
other tank automation controllers 152, 154 via the network 180.
[0057] The controller 106 can include a database 206 for storing
the recipe and/or other instructions. The database 206 can be
stored in computer-readable media 204 and/or the database 206 can
be stored on a separate device or devices. Along with the database
206, the computer-readable media 204 can include the operating
system and/or application software, such as, for example, waveform
generation software and/or process software, for controlling the
electrodeposition process. In some embodiments, the controller 106
includes a waveform synthesizer circuit 208 that is operatively
connected to an a synthesizer control circuit configured to control
the waveform synthesizer circuit 208 to generate the
electrodeposition waveform signal 222 based at least in part on the
recipe. In embodiments, the synthesizer control circuit is an FPGA
circuit 216. In embodiments, the FPGA circuit 216 has a plurality
of logic blocks or logic cells that are configurable. The logic
blocks on the FPGA circuit 216 can be configured into functional
control blocks, such as, for example, sequence controllers, PID
controllers, comparators, multipliers, upper and/or lower limit
blocks for process parameters, summers, multiplexers, amplifiers,
and/or any other type of functional logic circuit. The functional
control blocks from one or more independent control circuits, such
as, for example, generation of the electrodeposition waveform by
controlling the waveform synthesizer circuit 208 and/or circuits to
control the sequence steps of the electrodeposition process. For
brevity, embodiments of the controller 106 will be described using
the FPGA circuit 216. However, the synthesizer control circuit
and/or the circuits to control the sequence steps are not limited
to an FPGA, and other type of programmable logic circuits can be
used.
[0058] The FPGA circuit 216 controls the generating of the waveform
signal 222 by modulating in real-time a waveform shape, a
frequency, an amplitude, an offset, a slew, a wavelength, a phase,
a velocity, a derivative, and/or another waveform parameter of the
waveform signal 222. Specifically, the FPGA circuit 216 controls
the waveform synthesizer circuit 208 to generate a digital waveform
signal based on the instructions in the recipe. That is, based on
the recipe that is stored in database 206 and/or received from the
control station 102 or another controller, the FPGA circuit 216 can
control the waveform synthesizer 208 to generate an
electrodeposition waveform signal 222 having any desired waveform
profile (e.g., any desired amplitude, any desired frequency
(including steady-state, e.g., zero frequency and up to the
capability of the electrodeposition power supply), any desired
waveform shape (e.g., a sinusoidal shape, a triangular shape (e.g.,
sawtooth), a square wave and/or another type of waveform shape),
any desired offset, any desired slew, any desired wavelength, any
desired phase, any desired velocity, and/or any desired
derivative). Of course, those skilled in the art understand that
"any desired" amplitude, frequency, offset, shape, etc. means up to
the limits and rating of the power supplies and the other
components used in the electrodeposition system.
[0059] In addition, the desired waveform profile can be based at
least in part on the desired current density generated throughout
the workpiece, which can also be transmitted as part of the recipe.
The controller 106 can use the information related to the current
density and the information related to the geometric shape of
workpiece 120 to generate the desired electrodeposition waveform
signal 222. For example, at least one of the amplitude, frequency,
offset, slew, wavelength, phase, velocity, and derivative of the
electrodeposition waveform signal 222 can depend on the desired
current density and the geometric shape and size of the workpiece
120. The digital waveform signal may then be converted to an analog
signal (e.g., electrodeposition waveform signal 222) by a
digital-to-analog circuit, which can be incorporated in the
waveform synthesizer circuit 208 and/or the FPGA circuit 216. In
some embodiments, the waveform signal 222 is then output from the
controller 106 via a controller output circuit 218 to the input of
the power supply 126. In embodiments, the electrodeposition signal
222 output from controller output circuit 218 is an analog signal
that is transmitted to a plurality of different types of power
supplies. In some embodiments, the digital waveform signal from the
waveform synthesizer circuit 208 is not converted to an analog
signal, and the digital waveform signal is sent directly to the
power supply 126.
[0060] In some embodiments, the controller 106 has more than one
output circuit 218. For example, the controller 106 can have up to
eight output circuits. Of course, in other embodiments, the
controller 106 has more than eight output circuits. The power
supply 126 is configured to track or follow the waveform signal 222
and output the electrodeposition waveform 224 to, for example,
electrodes 140a, 140b. That is, the power supply 126 amplifies the
waveform signal 222 to generate the electrodeposition waveform
224.
[0061] In some embodiments, the controller 106 includes a means for
receiving the feedback from the electrodeposition process tank 114.
For example, the controller 106 can include a sensor management
circuit 214 that receives process feedback signals from one or more
sensors in sensor assembly 162 disposed in the electrochemical
processing tank 114. The feedback signals can be sent to sensor
management circuit 214 from sensor assembly 162 either directly or
via tank automation controller 150. Sensor management circuit 214
can be configured to receive digital and/or analog signals.
However, in some embodiments, the sensor management circuit
receives the feedback via network communications. For example,
sensor assembly 162 can be directed connected to tank automation
controller 150, which can then transmit the feedback signals via
network 180. The sensor management circuit 214 can include a
network communications circuit for communication with network 180,
which can also be connected to sensor assemblies 164, 166 via the
respective tank automation controllers 152, 154, and the feedback
signals from sensor assemblies 164, 166 can be used in controlling
power supply 126, if desired. In embodiments, the sensor assembly
162 include one or more sensors such as, for example, a temperature
sensor, an electrolyte level sensor, a electrolyte concentration
sensor, a sensor to determine agitation rate, a sensor to determine
coating thickness, and/or a sensor to determine coating
resistivity. In embodiments, the sensor assembly 162 also includes
a current sensor and/or a voltage sensor for determining current
and/or voltage between individual electrodes 140a, 140b in the tank
114. Alternatively, or in addition to the current/voltage sensors
of sensor assembly 162, the power supply 126 can include current
and/or voltage sensors that are then fed back to controller 106. Of
course, other types of sensors can be used based on the process
parameter to be monitored. Based on the feedback signals, the
controller 106 can modify the output electrodeposition waveform
(e.g., the current and/or voltage waveform) to improve the accuracy
of the electrodeposition process for producing the desired coating
composition and/or microstructure. For example, based on the
feedback signals, the FPGA circuit 216 can dynamically control, in
real time, waveform synthesizer circuit 208 to adjust the
amplitude, frequency, offset, slew, wavelength, phase, velocity,
derivative, and/or another waveform characteristic to precisely
control the electrodeposition process.
[0062] The information on generating the electrodeposition waveform
224 can be sent via the recipe. For example, in addition to
including the instructions for initially generating an
electrodeposition waveform, which can be any complex waveform, the
recipe can also include instructions for modifying, in real-time,
waveform parameters such as the waveform profile, current density,
etc., of the electrodeposition waveform 224. For example, any one
of the waveform profile characteristics such as, for example, the
waveform shape, frequency, amplitude, offset, slew, wavelength,
phase, velocity, derivative, or some other waveform profile
characteristic, can be dynamically changed or modified. The
instructions to change one or more of the waveform parameters, such
as waveform profile, current density, etc., can be based on a
predetermined time duration, based on a process step being
performed or to be performed, based on a feedback from process
sensors, and/or based on some other basis for modifying a waveform
parameter. For example, the recipe can include instructions to use
a sinusoidal waveform for a predetermined time duration (e.g., the
first half of a deposition process, and then to use a square wave
for the second half of the deposition process). In addition, the
electrodeposition process can include different waveform profiles
for some or each of the coating layers being deposited. That is,
the recipe can specify the type of waveform profile and/or current
density to be used for each deposition layer, and at least one of
the layers can be deposited using a waveform that is different than
those used to deposit the other layers. In embodiments, based on
the recipe, the FPGA circuit 216 appropriately controls the
waveform synthesizer circuit 208 to produce the desired waveform
for each layer being deposited.
[0063] Further, in some embodiments, the FPGA circuit 216 is
configured such that the electrodeposition waveform signal 222 is
modified based on the process feedback signals from, for example,
sensor assembly 162. For example, based on data from sensor
assembly 162 (which can relate to, e.g., process temperatures,
electrolyte concentration, electrolyte level, coating thicknesses,
coating resistivity, current and/or voltage readings between
individual electrodes, and/or some other process/system feedback),
the FPGA circuit 216 can control the waveform synthesizer circuit
208 to appropriately adjust the current density, waveform profile
(e.g., frequency, amplitude, offset, slew, wavelength, phase,
velocity, derivative, etc.), and/or any other waveform parameter of
the electrodeposition waveform signal 222.
[0064] After the controller 106 generates the waveform signal 222,
the waveform signal 222 is then output from controller output
circuit 218 of the controller 106 and sent to, for example an input
of an electrodeposition power supply 126. The electrodeposition
power supply 126 then generates the output electrodeposition
waveform 224 based on the received waveform signal 222. In
embodiments, the electrodeposition power supply 126 acts as an
amplifier that precisely tracks or follows the input waveform 222
from the controller 106 and outputs an appropriate
electrodeposition waveform 224, which is transmitted to the
electrodes 140a, 140b in tank 114. The waveform profile (e.g.,
frequency, amplitude, shape, etc.) of the output electrodeposition
waveform 224 corresponds to the waveform profile of the waveform
signal 222 and provides the appropriate current density.
[0065] In some embodiments, to ensure that the output
electrodeposition waveform 224 from the electrodeposition power
supply matches the waveform signal 222 from the controller, the
controller takes into account the capabilities of the
electrodeposition power supply 126. For example, the control 106
can take into account one or more waveform parameters, such as, for
example, slew rate, percentage overshoot, and/or another waveform
parameter that can be dependent on the characteristic of the
electrodeposition power supply 126 when generating the waveform
signal 222. That is, in some embodiments, when generating the
waveform using the waveform synthesizer circuit 208, the waveform
instructions from the recipe are implemented using known
characteristics of the electrodeposition power supply 126. In some
embodiments, the characteristics are common to a group of power
supplies. For example, the slew-rate, percentage overshoot, or some
other characteristic can be common to all power supplies of a
specific type, such as, for example, the same model, the same
manufacturer, the same rating or rating range, and/or some other
distinguishing feature for a class of power supplies. Knowing the
characteristics of the individual electrodeposition power supply
and/or a class of electrodeposition power supplies provides
advantages not found in prior art controllers because embodiments
of controllers of the present disclosure can use the power supply
characteristics information to precisely control the output
electrodeposition waveform of the power supply.
[0066] Information related to the characteristics of the individual
power supplies and/or a group of power supplies can be stored in
power supply driver files corresponding to the individual power
supplies and/or a group of power supplies. The power supply driver
files can be physically stored in, for example, the database 206
and/or some other location. The power supply driver file functions
similar to a printer driver file that provides information on
converting the data to be printed to correspond to the type of
printer being used. In this case, the power supply driver file
includes information on the type of power supply being used or,
more particularly, the characteristics of the power supply being
used. For example, the power supply driver file can include
information as to whether the power supply 126 can be a forward
and/or a reverse power supply and/or can include information as to
the output current rating of the power supply 126. The
characteristic information can be associated to individual power
supplies (e.g., via the serial numbers of the power supplies)
and/or associated to a class that the power supply belong to (e.g.,
manufacturer, model, output power range, any combination thereof,
etc.).
[0067] The waveform generation software uses the information in the
power supply driver file when generating the electrodeposition
waveform based on the recipe. For example, the FPGA circuit 216 can
modify how it controls the waveform synthesizer circuit 208 based
on the information in the power supply driver file. The power
supply diver file ensures that the electrodeposition waveform
signal 222 matches as close as possible the waveform requested in
the recipe but also ensures the electrodeposition waveform signal
222 does not go beyond the capabilities of the electrodeposition
power supply 126. For example, the driver file will ensure that
parameters such as the slew rate rating and percent overshoot of
the electrodeposition power supply 126 are considered when
generating the electrodeposition waveform signal 222. The slew rate
can identify to the waveform generation software the maximum
frequency and amplitude that the electrodeposition power supply 126
can be driven at and still be within acceptable limits. The percent
overshoot identifies the response of the electrodeposition power
supply 126 to a step change in the input signal. By considering
these and other waveform parameters, the information in the power
supply driver file ensures there is minimal distortion of the
electrodeposition waveform 224 during the deposition process (e.g.,
little or no overshoot or undershoot of the electrodeposition
waveform 224). In addition, the power supply driver file allows the
waveform instructions in the recipe to be standardized for a range
of power supplies. For example, a single controller 106 can control
a range of power supplies that can provide electrodeposition
currents from, for example, about 200 A to about 15,000 kA. That
is, by using the power supply driver file, the waveform
instructions in the recipe can be generic in that the instructions
are not tailored to a specific power supply or to a class of power
supplies. Further, a power supply driver file may include
information regarding a maximum switching speed and/or a maximum
sample rate of the electrodeposition power supply. In such
embodiments, a controller that has a higher sample rate than the
maximum sample rate of the electrodeposition power supply may
reduce the sample rate used in order to conserve resources.
[0068] The same standardized or generic instructions can be used
for different types of power supplies, for example, power supplies
of different manufactures, different models, different power
ratings, etc. For example, the recipe can merely provide
standardized or generic instructions to produce a square wave and
the FPGA circuit 216 will control the waveform synthesizer circuit
208 based on the driver file to output a waveform signal 222 with
the proper characteristics, such as, for example, the frequency,
amplitude, slew rate, etc., for the electrodeposition power supply
126 to prevent undesired distortion on the output electrodeposition
waveform 224, such as, for example, undesired overshoot and/or
undershoot in the waveform 224. In embodiments, if the requested
waveform in the recipe exceeds the capabilities of the
electrodeposition power supply 126 (e.g., the requested frequency,
amplitude, etc. is beyond the capabilities of the power supply),
the information in the power supply driver file alerts the
controller 106 and ultimately the operator that the requested
deposition process will not work with the present equipment. In
this case, in some embodiments, the FPGA circuit 216 is configured
to not perform the requested operation and/or stop the
electrodeposition process. In still further embodiments, the
controller 106 receives a measure of the output electrodeposition
waveform between a set of electrodes and compare the measured
output to ensure that the output electrodeposition waveform 224
from the electrodeposition power supply matches the waveform signal
222 from the controller.
[0069] In some embodiments, the controller 106 creates the power
supply driver file. For example, the response of the
electrodeposition power supply 126 (e.g., slew rate, percent
overshoot, etc.) can be measured with respect to a test waveform
signal (e.g., a "calibration" waveform signal) that is output by
the controller 106. For example, as seen in FIG. 3, in step 302,
the controller 106 receives a recipe that includes instructions for
a test or calibration waveform. In some embodiments, the test or
calibration waveform or waveforms are stored in the controller 106,
and the controller 106 reads a stored calibration waveform when
performing the calibration procedure. The test or calibration
waveform can include instructions for generating a waveform having
various subsections that test the capabilities of the
electrodeposition power supply. Each subsection can have a
different waveform shape (e.g., sinusoidal, triangular, square
wave, etc.), a different frequency, a different amplitude, a
different offset, a different slew, a different wavelength, a
different phase, a different velocity, a different derivative,
and/or some other difference between the subsections.
[0070] In step 304, a known shunt resistor or other known load is
placed across the output terminals of the electrodeposition power
supply being tested. In step 306, the controller 106 generates the
waveform requested in the recipe and outputs a waveform signal 222
to the input of the electrodeposition power supply 126 being
tested. In step 308, desired parameters, such as, for example, the
frequency, amplitude, slew rate, percentage overshoot, etc., are
measured at the output of the electrodeposition power supply 126,
for example, across the shunt resistor or load. In step 310, the
measured parameters are compared to the waveform signal 222 output
by the controller 106 and any differences/similarities in the
waveform profiles of the signal 222 and the electrodeposition
waveform 224 are captured for analysis. In step 312, based on the
analysis of, for example, at least one of frequency, amplitude,
slew rate, and percentage overshoot, a power supply driver file is
created and stored in, for example, database 206 or another
location for later use by controller 106. As discussed above, the
controller 106 can then use the power supply driver file when
generating the waveform signal 222 such that the waveform signal
222 matches the characteristics of the power supply 126. The power
supply driver file can be associated to the specific power supply
being tested, for example, based on the serial number, and/or be
associated with a class of power supplies that have a similar
structure as the power supply being tested.
[0071] The embodiments of the electrodeposition system discussed
above can be used in, for example, in barrel, rack, basket, and
brush processing systems. However, for the sake of brevity, a
generic electrodeposition process method is illustrated in FIGS. 4A
to 4C. FIGS. 4A to 4C illustrate a high-level overview of an
electrodeposition process 400 using a controller (e.g., an
electrodeposition process that can perform a layered nanolaminate
alloy coating having two or more periodic nanoscale layers that
vary in electrodeposited species and/or electrodeposited
structure). For purposes of brevity, the description is provided
with respect to controller 106 and related equipment. However,
those skilled in the art will understand that the description is
also applicable to a series or a number of controllers including
controllers 108 and 110. In step 410, the operator starts the
electrodeposition either remotely (e.g., at remote computer 102) or
locally at the controller 106.
[0072] In step 412, the operator selects the standardized recipe to
be used in the electrodeposition process. Once selected, the
controller 106 can request to receive the recipe from a remote
control station 102, another controller, and/or, if stored in the
controller, read the recipe that corresponds to the selected
electrodeposition process from database 206. As discussed above,
the recipe includes instructions for generating an
electrodeposition waveform 224 based on, for example, the
sequencing step, the nanoscale layer to be deposited, the species
to be deposited, the structure to be deposited, and/or feedback
from the electrodeposition process. The recipe can also include the
current density, voltage, waveform phase, and/or another waveform
parameter to be used for the electrodeposition process and/or each
step of the electrodeposition process. In addition, the recipe can
include instructions for controlling other devices (e.g., pump 132,
agitator 170, control valve 156, etc.).
[0073] Also, as discussed above, the recipe information is in a
standardized format so that a single generic recipe can be used
with various workpieces, power supplies, etc. In step 414, the
operator inputs process specific configuration information
regarding the deposition process. The inputted information can be
information related to the geometry and/or size of the workpiece
(e.g., surface area) to be electroplated, information related to
the electrodeposition power supply (e.g., model no., manufacturer,
the amperage rating, slew rate, etc.), and information related to
the add back chemicals (e.g., the type and/or quantity of chemicals
to add back, amp-hour at which the chemicals are added, the
concentrations of the chemicals, etc.). Of course, the operator can
also input any other desired information related to the process. In
step 416, the controller makes adjustments to the standardized
recipe based on the process specific information input by the
operator in step 414. For example, based on the inputted workpiece
surface geometry and/or area, the controller 106 can make
adjustments to, for example, the waveform profile, the time
duration and amp-hour accumulation, and/or some other adjustment,
as appropriate, for the recipe steps. In step 418, the controller
106 executes the steps of the recipe, which are shown in FIG.
4B.
[0074] As shown in FIG. 4B, the controller 106 sequences through
the process steps for the deposition process. For each of the
process steps, based on the recipe, the controller 106 controls the
species and/or the structure of the layer to be deposited by
setting and/or controlling the current density, the profile of the
electrodeposition waveform, the flow rate, the process temperature,
the electrolyte level, the electrolyte concentration, any
combination thereof, etc. The number and nature of the process
steps in the recipe can vary depending on the type of deposition
process. Turning to FIG. 4B, in step 422, the controller 106 reads
the next step in the recipe. In step 424a, the controller 106 sets
the output waveform 224 of the power supply 126 to electrodes 140a,
140b. For example, based on the geometry of workpiece 120 and/or
other information in the current recipe step, the controller 106
generates the electrodeposition waveform signal 222 having, for
example, the desired waveform profile and the desired current
density using, for example, the waveform algorithms discussed
below. As discussed above, the waveform signal 222 can have any
desired waveform profile (e.g., based on the recipe, the controller
106 can generate any complex waveform profile by modulating or
changing in real-time the waveform shape, the frequency, the
amplitude, the offset, the slew, the wavelength, the phase, the
velocity, the derivative, and/or some other waveform parameter). In
some embodiments, in generating the waveform signal 222, the
controller 106 uses the power supply driver file for
electrodeposition power supply 126 to ensure the waveform signal
222 matches the characteristics of the electrodeposition power
supply 126. As discussed above, the electrodeposition waveform
signal 222 is output from the controller 106 to an input of an
electrodeposition power supply 126. The electrodeposition power
supply 126 then tracks and amplifies the electrodeposition waveform
signal 222 and outputs the electrodeposition waveform 224, which
corresponds to the electrodeposition waveform signal 222.
[0075] During the setting of the output waveform in step 424a, the
controller 106 concurrently performs step 424b, which monitors the
process steps and/or process feedback from sensor assembly 162
related to, for example, electrolyte temperature, electrolyte
level, electrolyte concentration, thickness of the coating layers,
coating resistivity, current, and/or voltage readings between
individual electrodes and/or some other process/system feedback.
During step 424b, the controller 106 executes the steps shown in
FIG. 4C. During step 432 of FIG. 4C, the controller 106 receives
process feedback signals as discussed above. For example, in step
432, the controller 106 and/or the tank controller 150 can receive
feedback such as coating resistivity, electrolyte temperature, or
process chemistries such as electrolyte concentration, etc. In
addition, in step 434, the accumulated amp-hours for the power
supply 126 are received from the power supply 126 or calculated by
controller 106. The accumulated amp-hours can be used to control
various equipment in the deposition process. For example, the
accumulated amp-hours can be used to control pump 132 to add back
some of the chemicals used in the electrodeposition process. In
addition, the accumulated amp-hours and feedback of the process
chemistries can be used to determine coating thickness.
[0076] In step 436, based on the instructions in the recipe and/or
on the monitored feedback signals and/or the calculations of steps
432 and 434, the controller 106 determines whether the
electrodeposition waveform 224 should remain the same, be switched
(e.g., to a preloaded waveform), or be modified, or whether an
entirely new custom waveform should be created. For example, if the
determination is to keep the same waveform, the controller 106
continues to generate the present electrodeposition waveform signal
222. If the determination is to switch waveforms, the controller
106 switches to a different electrodeposition waveform signal
(e.g., to a preloaded waveform such as a standard sine wave, square
wave, triangular wave, etc.). If the determination is to modify the
waveform, the controller 106 modifies the present electrodeposition
waveform 222 using, for example, the examples of waveform
algorithms discussed below and/or another algorithm, and if the
determination is to create a new custom waveform, the controller
creates a new electrodeposition waveform 222 using, for example,
the waveform algorithms discussed below, and/or another
algorithm.
[0077] Once step 436 is completed, the controller loops back to
step 424b and advances to step 426. In step 426, the controller
determines whether the criteria for completing the current process
step have been met. For example, the criteria for completing the
current process step can be based on the amount of time the system
has been in the current step, the accumulated amp-hours, the
process chemistries, the calculated coating thickness, and/or some
other criteria. If the criteria have not been met, the controller
106 loops back to the step 424b. If the criteria have been met, the
controller 106 advances to step 428. In step 428, the controller
106 checks to see if there are additional process steps or not. If
so, the controller loops back to step 422 and starts the next step.
If there are no additional steps, the controller returns to step
418 of FIG. 4A and advances to step 420 to stop the process. Of
course, the controller 106 can be configured such that the process
can also be terminated at any time due to, for example, a manual
stop command, a feedback signal, an error signal, etc.
[0078] As discussed above, waveform algorithms can be used to
create the initial electrodeposition waveform signal 222 and/or to
subsequently change or modify the electrodeposition waveform signal
222. In some embodiments, to generate the electrodeposition
waveform signal 222, the controller 106 includes a loop waveform
algorithm that initiates a nested loop-type control sequence to
generate a waveform that forms, at least in part, the
electrodeposition waveform signal 222. In some embodiments, to
generate the electrodeposition waveform signal 222, the controller
106 includes a second-order waveform algorithm that combines the
characteristics of two or more base or first-order waveforms to
generate a second-order waveform that forms, at least in part, the
electrodeposition waveform signal 222. In some embodiments, the
controller 106 includes both the loop waveform algorithm and the
second-order waveform algorithm to generate a waveform that forms,
at least in part, the electrodeposition waveform signal 222.
[0079] In the nested loop-type control sequence of the loop
waveform algorithm, an output waveform is generated by using, for
example, waveform synthesizer circuit 208 to serially combine (or
sequence) sub-waveform sequences (e.g., serially combine different
waveforms or portions of different waveforms), and then repeat the
sequencing steps to produce one full cycle of the electrodeposition
waveform signal 222. The full waveform cycle, which includes the
nested sub-waveform cycles, can then be repeated or looped as
desired (e.g., the nested loop control sequence can be repeated or
looped for a predetermined number of cycles, for a predetermined
time period, for a given process step or steps, and/or continuously
until stopped based on, e.g., a process feedback signal from sensor
assembly 162 (e.g., coating thickness, coating resistance,
electrolyte concentration, or some other feedback signal) and/or a
stop command for the deposition process). In some embodiments, the
FPGA circuit 216 is configured to control to waveform synthesizer
circuit 208 such that sub-waveforms are generated a desired number
of times and in a desired sequence order to generate the full
electrodeposition waveform signal 222. For example, if an
electrodeposition waveform signal 222 that has three sinewave
cycles followed by three triangle-shaped waveform cycles is
required, the FPGA circuit 216 can be configured to control
waveform synthesizer circuit 208 such that three cycles of a
sinewave sub-waveform are generated and then immediately two cycles
of a triangle-shaped sub-waveform are generated to create one full
cycle of the electrodeposition waveform signal 222. The FPGA
circuit 216 then repeats or loops the full waveform generation
cycle, which includes the nested sub-waveform generation cycles, as
desired. Of course, the type and number of cycles of sub-waveforms
and the sequencing order of the sub-waveforms is not limited to the
above embodiment, and any desired sub-waveform type, sub-waveform
cycle count, and sub-waveform sequence order can be used. In
addition, the sub-waveform types, the sub-waveform cycle count,
and/or the sub-waveform sequencing order used in the
electrodeposition waveform signal 222 can be changed dynamically by
the controller 106 based on the process step, a feedback signal
from sensor assembly 162, a predetermined time period, a
predetermined cycle count, etc. For example, the sinewave/triangle
waveform discussed above can be changed to a sinewave/square wave
waveform based on a predetermined criteria related to, for example,
electrolyte concentration, electrolyte level, electrolyte
temperature, coating thickness, coating resistance, the process
step, a predetermined time period, number of cycles, any
combination thereof, etc.
[0080] In addition to the loop waveform algorithm, the controller
106 can also include a second-order waveform algorithm. The
second-order waveform algorithm modulates one or more
characteristics (e.g., frequency, amplitude, offset, slew,
wavelength, phase, velocity, derivative or some other waveform
property) of a base or first-order waveform using characteristics
(e.g., frequency, amplitude, offset, slew, wavelength, phase,
velocity, derivative, and/or some other waveform property) of one
or more additional first-order waveforms to generate a desired
output waveform (or second-order waveform). The modulation
algorithm can include, for example, additive functions, subtractive
functions, multiplying functions, and/or some other functional
relationship between the one or more characteristics of the base
first-order waveform and the characteristics of the one or more
additional first-order waveforms to modify the base first-order
waveform and generate a second-order waveform.
[0081] The modulation of the characteristic(s) of the base
first-order waveform can be selective in that not all of the base
waveform characteristics are subject to being changed. For example,
only the amplitude of the base first-order waveform can be changed
while the remaining characteristics, such as, for example, the
frequency, offset, etc., are not modified. The functional
relationship can be between characteristics that are the same
between the waveforms (e.g., amplitude to amplitude, frequency to
frequency, offset to offset, etc.). For example, the amplitude
A.sub.1 of a base first-order waveform can be modified using the
information (e.g., magnitude and/or polarity) of an amplitude
A.sub.2 of another first-order waveform to generate a second-order
waveform with an amplitude A.sub.3 that can be, for example,
c.sub.1A.sub.1+c.sub.2A.sub.2, c.sub.1A.sub.1-c.sub.2A.sub.2,
c.sub.1A.sub.1*c.sub.2A.sub.2, c.sub.1A.sub.1/c.sub.2A.sub.2 (where
c.sub.1 and c.sub.2 are constants), or some other functional
relationship. The frequency, offset, or another waveform
characteristic of a base first-order waveform can similarly be
modulated using the respective same characteristic of other
waveforms. However, the functional relationship can also be between
waveform characteristics that are not the same. For example, the
amplitude of the base first-order waveform can be modified using
the frequency or some characteristic other than the amplitude of
another first-order waveform to generate the second-order waveform.
The functional relationship can have a one-to-one characteristic
correlation in that one characteristic (e.g., amplitude) of the
base first-order waveform is modulated by one characteristic (e.g.,
frequency) of another first-order waveform. However, the functional
relationship need not be a one-to-one characteristic relationship.
For example, the amplitude of a first-order waveform can be used to
modify both the amplitude and frequency of the base first-order
waveform to generate the second-order waveform or both the
amplitude and frequency of the first-order waveform can be used to
modify just the amplitude (or another characteristic) of the base
first-order waveform to generate the second-order waveform. That
is, one or more waveform characteristics of a base first-order
waveform can be modified based on one or more characteristics of
another first-order waveform to generate the second-order
waveform.
[0082] In the above embodiments, the "base" first order-waveform
can itself be a combination of two or more first-order waveforms.
Accordingly, any combination of waveform characteristics of a first
set of one or more first-order waveforms can be used to modify any
combination of waveform characteristics of a second set of one or
more first-order waveforms in generating a second-order waveform.
The resulting second-order waveforms can be periodic or
non-periodic and can result from a modulation of the same type of
first-order waveforms (e.g., two or more sinusoidal waveforms, two
or more square waves, two or more triangular waveforms, etc.) or
can result from a modulation of two or more different types of
waveforms (e.g., one or more sinusoidal waveforms with one or more
square waves or one or more triangular waveforms, etc.). In some
embodiments, the current electrodeposition waveform signal 222 is
the base first-order waveform that is then modulated by using the
characteristics of one or more other first order waveforms to
generate a new electrodeposition waveform signal 222.
[0083] The modulation of a first-order waveform based on the
characteristics of another first-order waveform to generate a
second-order waveform is graphically illustrated in FIG. 5A. FIG.
5A illustrates a second order waveform 506 that was generated using
two first-order waveforms 502 and 504. The secondary waveform 506
can be either a voltage waveform or a current waveform. In the
embodiment of FIG. 5A, a base first-order waveform 504 is modulated
using the characteristics of another first-order waveform 502 to
generate the second-order waveform 506. The base first-order
waveform signal 504 is a sinusoidal waveform having, for example, a
frequency F.sub.1 and an amplitude A.sub.1. However, the waveform
504 can have any desired waveform profile. During the deposition
process, the controller 106 may determine that the current
electrodeposition waveform signal 222 (which can be the waveform
504) should be switched, for example, to preloaded waveform, or be
modified or that an entirely new electrodeposition waveform signal
222 should be created because, e.g., the current process step
and/or feedback signal(s) from the sensor assembly 162 requires it.
If it is determined that the waveform signal 222 should be modified
or a new waveform created, the controller 106 can generate a
second-order waveform 506 using the characteristics of the base
first-order waveform 504 and another first-order waveform 502. The
second-order waveform 506 will then be the new electrodeposition
waveform signal 222 that can then be transmitted to the
electrodeposition power supply 126, as discussed above.
[0084] As seen in the embodiment of FIG. 5A, the second-order
waveform 506 is generated by modifying the amplitude A.sub.1 of the
base first-order waveform 504 based on the absolute magnitude of
amplitude A.sub.2 of first-order waveform 502. In this example, the
frequency F.sub.1 of the first order waveform 504 remains
unchanged. Thus, in this example, after the modification, a
sinusoidal second-order waveform 504 is generated having a
frequency F.sub.1 and an amplitude (A.sub.1+|A.sub.2|). That is,
the second order waveform oscillates at a fixed frequency while
varying the amplitude over time. Of course, any combination of
waveform characteristics of the two or more first-order waveforms
can be employed to generate the second-order waveform. For example,
in another embodiment, the second order waveform has a frequency
that varies and amplitude that remains the same. By dynamically
changing the second-order waveform profile (e.g., the combination
of frequency, amplitude, waveform shape, offset, slew, wavelength,
phase, velocity, derivative, etc.), the current and/or voltage
applied during the electrochemical deposition adjusts for and/or
drives variations in the composition and/or the microstructure of
the nanolaminate composite coating.
[0085] The first-order waveforms 502, 504 can be "template
waveforms" that are stored in the controller 106 or another
location. The controller 106 can have a plurality of first-order
template waveforms that are configured to facilitate the generation
of second-order waveforms that correspond to specific process steps
and/or specific deposition processes. For example, a first set of
template waveforms may be beneficial in generating second-order
waveforms for the deposition of a first coating layer and a second
set of template waveforms may be beneficial in generating
second-order waveforms for the deposition of another coating layer
in the deposition process. The controller 106 can be configured to
use the proper set of template waveforms based on, for example, the
type of deposition process, the process step being performed,
and/or the feedback signal(s) from sensor assembly 162.
[0086] By incorporating either or both the loop waveform algorithm
and/or the second-order waveform algorithm, embodiments of the
controller 106 are able to produce complex waveforms that are
highly complex as shown in FIG. 5B. As seen in FIG. 5B, the
electrodeposition waveform 510, includes sinusoidal waveform
portions, triangular waveform portions and square wave portions of
different frequencies, amplitudes, and offsets. Prior art
electrodeposition systems are not capable of dynamically creating
or subsequently modifying such complex electrodeposition
waveforms.
[0087] In the above embodiments, although one electrodeposition
waveform signal 222 is shown being output from the controller 106,
the waveform synthesizer circuit 208 and associated circuitry can
provide a plurality of electrodeposition waveform signals, each of
which can be connected via a separate controller output circuit 218
to respective electrodeposition power supplies that generate the
respective electrodeposition waveforms. For example, in some
embodiments, the controller 106 outputs up to eight waveform
signals. Of course, depending on the application, the controller
106 can be configured to provide more than eight waveform signals.
Because the FPGA circuit 216 can provide parallel processing, the
control circuits in the FPGA circuit 216 can be configured to
simultaneously and independently control the waveform synthesizer
circuit 208 to generate each of the different electrodeposition
waveforms. The electrodeposition waveform signals can all be the
same, all different, or any combination thereof.
[0088] The plurality of electrodeposition waveforms can be
transmitted to respective sets of electrodes that are disposed in
the same tank, in respectively different tanks, or any combination
thereof. For example, as shown in FIG. 2B, an electrodeposition
power supply 126' is connected to a first set of electrodes 140a,
140b and an electrodeposition power supply 126'' is connected to a
second set of electrodes 140a, 140c. The controller 106 generates
the electrodeposition waveform signals that are then transmitted to
the respective power supplies 126' and 126'' and thus controls the
electrodeposition waveforms transmitted to the electrode sets. In
some embodiments, the controller 106 simultaneously and
independently controls the waveform parameters of the individual
electrodeposition waveforms transmitted to the electrode sets
(e.g., in order to account for variances in the process). For
example, in some embodiments, the controller 106 is configured to
simultaneously and independently control a current density, a
voltage, a waveform phase, or combination thereof, of an
electrodeposition waveform from power supply 126' to a set of
electrodes 140a, 140b and control a current density, a voltage, a
waveform phase, or combination thereof, of an electrodeposition
waveform from power supply 126'' to a set of electrodes 140a, 140c
in the electrochemical processing tank 114.
[0089] By controlling the current densities, the voltages and/or
the waveform phases of the respective electrodeposition waveforms,
the deposition process on workpiece 120 can be adjusted or modified
to compensate for variations in the electrodeposition process on
the workpiece 120. For example, variations in the electrolyte
concentration (e.g., from one end of the workpiece 120 to the other
end, from the ends to the middle of workpiece 120, or variations in
the process due to some other reason) can be compensated for by
individually adjusting the current density, the voltage, and/or the
waveform phase of the respective electrodeposition waveform
transmitted to the set of electrodes 140a, 140b and 140a, 140c.
These variations can be sensed by one or more sensors in, for
example, sensor assembly 162, and/or these variations may be known
to occur theoretically and/or by subsequent analysis of the
workpiece. By compensating for these variations, the coating layers
across workpiece 120 can be deposited evenly or be deposited to
have any other desired layering profile.
[0090] The current densities, voltages, and/or the waveform phases,
respectively, between the corresponding electrodeposition waveforms
can be the same or different. Of course, the controlling of
multiple electrode sets by the controller 106 is not limited to
electrode sets in a single tank. In other embodiments, the
controller controls a plurality of electrodeposition waveforms from
respective power supplies to one or more sets of electrodes in
different tanks (e.g., in systems where each tank has its own
workpiece (e.g., see FIG. 1) and/or in systems where a workpiece or
workpieces are transferred from one tank to another during the
electrodeposition process). In such systems, the controller
appropriately controls the current density, the voltage, and/or the
waveform phase of each electrodeposition waveform to the respective
electrode sets in order to ensure the workpiece(s) transferred from
tank to tank and/or in the respective tanks have the desired layer
profile. Of course, the adjustments in the current densities,
voltages, and/or waveform phases between the electrode sets can be
in addition to the electrodeposition waveform profile and current
density adjustments discussed above. That is, along with modulating
the electrodeposition waveform signal 222 based on the process step
and/or feedback signal(s) as discussed above, in systems that
provide more than one electrodeposition waveform signal to more
than one set of electrodes, the electrodeposition waveform signal
222 can be further adjusted based on variations in the process
between the electrode sets.
[0091] In the above embodiments that include a plurality of
electrode sets, the controller 106 was configured to generate more
than one electrodeposition waveform signal corresponding to each of
the electrode sets. However, multiple controllers that communicate
with each other via, for example, network 104 (see FIG. 1) can also
provide the same functionality of adjusting for variances in the
electrodeposition process. That is, the controllers 106, 108, 110
can communicate with each other to appropriately adjust the
electrodeposition process in the respective tanks 114, 116, 118 to
adjust for variances in the deposition process as discussed
above.
[0092] In addition, along with controlling the waveform, the FPGA
circuit 216 of controller 106 can be configured to simultaneously
control other process devices such as, for example, the pump 132,
agitator 170, control valve 156, etc. Because the FPGA circuit 216
can provide parallel processing, the control circuits in the FPGA
circuit 216 can be configured to simultaneously and independently
control each of the different electrodeposition waveforms and/or
other control functions without adversely affecting the real-time
processing capability of controller 106.
[0093] The following embodiments are included within the scope of
the disclosure:
[0094] 1. A system for depositing a layered nanolaminate alloy,
comprising:
[0095] one or more electrochemical processing tanks, each
electrochemical processing tank having one or more sets of
electrodes for use in depositing multilayer nanolaminate coatings
or claddings on one or more substrates;
[0096] one or more electrodeposition power supplies, each power
supply respectively connected to a corresponding electrode set of
the one or more sets of electrodes, each power supply having an
analog input connection for receiving a complex waveform signal
corresponding to a desired electrodeposition waveform to be output
from the power supply, each power supply configured to amplify the
received complex waveform signal to generate the desired
electrodeposition waveform and transmit the desired
electrodeposition waveform to the corresponding electrode set in
the one or more sets of electrodes, each desired electrodeposition
waveform from the corresponding power supply generating the
deposition of at least one layer of the multilayer nanolaminate
coatings or claddings on the corresponding substrate; and
[0097] a processor-based controller having [0098] a waveform
synthesizer circuit configured to generate each complex waveform
signal to be transmitted to the analog input of the respective
electrodeposition power supply, [0099] a synthesizer control
circuit configured to control the waveform synthesizer circuit, the
synthesizer control circuit, based at least in part on a recipe
having information related to the depositing of the multilayer
nanolaminate coatings or claddings, controlling the generating of
the respective complex waveform signal by modulating in real-time
at least one of a waveform shape, a frequency, an amplitude, an
offset, a slew, a wavelength, a phase, a velocity, and a derivative
of the complex waveform signal, and [0100] one or more controller
output circuits respectively connected to the analog input of each
electrodeposition power supply, each controller output circuit
configured to transmit the corresponding complex waveform signal to
the analog input of each electrodeposition power supply.
[0101] 2. The system of embodiment 1, wherein the synthesizer
control circuit includes a field-programmable gate array.
[0102] 3. The system of embodiment 1, wherein the recipe is stored
in the processor-based controller and wherein the recipe includes
instructions for generating the respective electrodeposition
waveform,
[0103] wherein the instructions include at least one of a current
density, a current waveform profile, and a voltage waveform profile
of the respective electrodeposition waveform.
[0104] 4. The system of embodiment 1, wherein the one or more sets
of electrodes includes a cathode and one, two, three, four, or more
anodes and wherein the processor-based controller transmits the
desired electrodeposition waveform to the one or more sets of
electrodes.
[0105] 5. The system of embodiment 1, wherein the modulating in
real-time at least one of a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity,
and a derivative of the complex waveform signal includes modulating
one or more first characteristics of a base first-order waveform
using one or more second characteristics of at least one other
first-order waveform based on a functional relationship between the
first and second characteristics to generate the respective complex
waveform signal.
[0106] 6. The system of embodiment 5, wherein the base first-order
waveform and the at least one other first-order waveform are
selected from a plurality of preloaded waveforms that are stored in
the processor-based controller.
[0107] 7. The system of embodiment 6, wherein two or more
electrodeposition power supplies are connected to the
processor-based controller and wherein the power supplies control
individual portions of a cathode bus bar along a length of
individual ones of the one or more electrochemical processing
tanks.
[0108] 8. The system of embodiment 5, wherein the first
characteristics of the base first-order waveform and the second
characteristics of the one or more other first-order waveforms
include a waveform shape, a frequency, an amplitude, an offset, a
slew, a wavelength, a phase, a velocity, or a derivative of the
respective first-order waveform.
[0109] 9. The system of embodiment 5, wherein the base first-order
waveform is the respective complex waveform signal, and
[0110] wherein the at least one other first-order waveform is
selected from a plurality of preloaded waveforms that are stored in
the processor-based controller.
[0111] 10. The system of embodiment 1, wherein the modulating in
real-time at least one of a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity,
and a derivative of the complex waveform signal includes serially
combining sub-waveform sequences to generate the respective complex
waveform signal.
[0112] 11. The system of embodiment 10, wherein the serially
combining sub-waveform sequences includes generating the
sub-waveforms for a desired number of cycle counts and in a desired
sequence order.
[0113] 12. The system of embodiment 11, wherein at least one of the
sub-waveform cycle count and the sub-waveform sequence order is
dynamically modified based on at least one of a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the deposition of the nanolaminate coatings or claddings, and a
feedback signal related to the deposition of the nanolaminate
coatings or claddings.
[0114] 13. The system of embodiment 12, wherein at least one of the
sub-waveform cycle count and the sub-waveform sequence order is
dynamically modified based on the feedback signal, and
[0115] wherein the feedback signal relates to at least one of an
electrolyte concentration, an electrolyte level, an electrolyte
temperature, a coating thickness, and a coating resistance.
[0116] 14. The system of embodiment 1, wherein the processor-based
controller further includes a network communications circuit
communicatively connected to an external communications network,
and a communication input circuit operatively connected to the
network communication circuit and configured to receive, from a
remote computing device, the recipe.
[0117] 15. The system of embodiment 14, further comprising:
[0118] one or more other processor-based controllers connected to
the external communications network,
[0119] wherein the processor-based controller is connected to the
one or more other processor-based controllers via the external
communications network and each of the processor-based controllers
represents a node on the external communication network, and [0120]
wherein the recipe from the remote computing device is received by
each of the nodes of the external communication network.
[0121] 16. The system of embodiment 14, further comprising:
[0122] one or more other processor-based controllers connected to
the external communications network,
[0123] wherein the processor-based controller is connected to the
one or more other processor-based controllers via the external
communications network and each of the processor-based controllers
represents a node on the external communications network, and
[0124] wherein the processor-based controller is further configured
to transmit the instructions or a portion of the instructions in
the recipe to the one or more other processor-based controllers via
the external communications network.
[0125] 17. The system of embodiment 2, wherein the processor-based
controller is configured to generate a plurality of complex
waveform signals and the field-programmable gate array includes
parallel processing capability to simultaneously and independently
control the waveform synthesizer circuit to generate each of the
plurality of complex waveform signals.
[0126] 18. The system of embodiment 17, wherein the processor-based
controller is configured to adjust at least one of a current
density, a voltage and a waveform phase of the respective desired
electrodeposition waveform to compensate for variations in the
deposition of the nanolaminate coatings or claddings on the
corresponding substrate.
[0127] 19. The system of embodiment 1, wherein the processor-based
controller is configured to use a power supply driver file
corresponding to at least one of the one or more electrodeposition
power supplies to take into account at least one characteristic of
the at least one of the one or more electrodeposition power
supplies.
[0128] 20. The system of embodiment 19, wherein the at least one
characteristic includes at least one of a slew-rate and a percent
overshoot.
[0129] 21. The system of embodiment 19, wherein the power supply
driver file is based on a calibration procedure performed by the
processor-based controller on the at least one of the one or more
electrodeposition power supplies, and
[0130] wherein the calibration procedure includes transmitting a
calibration waveform signal to the at least one of the one or more
electrodeposition power supplies, placing a known load across
output terminals of the at least one of the one or more
electrodeposition power supplies, measuring at least one of a slew
rate and a percent overshoot of the at least one of the one or more
electrodeposition power supplies, and creating the power supply
driver file using, at least in part, the measured results of the
calibration procedure.
[0131] 22. The system of embodiment 1, further comprising:
[0132] one or more tank automation controllers to control at least
one of an electrolyte level, an electrolyte temperature, an
agitation rate, and a flow rate of the respective electrochemical
processing tank.
[0133] 23. A controller for an electrodeposition process,
comprising:
[0134] a waveform synthesizer circuit configured to generate a
complex waveform signal corresponding to a desired
electrodeposition waveform to be output from an electrodeposition
power supply,
[0135] a synthesizer control circuit configured to control the
waveform synthesizer circuit, the synthesizer control circuit,
based at least in part on a recipe having information related to
the electrodeposition process, controlling the generating of the
complex waveform signal by modulating in real-time at least one of
a waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, and a derivative of the complex
waveform signal, and
[0136] a controller output circuit configured to transmit the
complex waveform signal to an analog input of the electrodeposition
power supply.
[0137] 24. The controller of embodiment 23, wherein the synthesizer
control circuit includes a field-programmable gate array.
[0138] 25. The controller of embodiment 23, wherein the recipe
includes instructions for generating the electrodeposition
waveform, and
[0139] wherein the instructions include at least one of a current
density, a current waveform profile, and a voltage waveform profile
of the electrodeposition waveform.
[0140] 26. The controller of embodiment 23, wherein the recipe is
stored in the controller.
[0141] 27. The controller of embodiment 23, wherein the modulating
in real-time at least one of a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity,
and a derivative of the complex waveform signal includes modulating
one or more first characteristics of a base first-order waveform
using one or more second characteristics of at least one other
first-order waveform based on a functional relationship between the
first and second characteristics to generate the complex waveform
signal.
[0142] 28. The controller of embodiment 27, wherein the base
first-order waveform and the at least one other first-order
waveform are selected from a plurality of preloaded waveforms that
are stored in the controller.
[0143] 29. The controller of embodiment 28, wherein the plurality
of preloaded waveforms includes a triangular waveform, a sinewave,
a square wave, or a custom waveform.
[0144] 30. The controller of embodiment 27, wherein the first
characteristics of the base first-order waveform and the second
characteristics of the at least one other first-order waveform
include a waveform shape, a frequency, an amplitude, an offset, a
slew, a wavelength, a phase, a velocity, or a derivative of the
respective first-order waveform.
[0145] 31. The controller of embodiment 27, wherein the base
first-order waveform is the complex waveform signal, and
[0146] wherein the at least one other first-order waveform is
selected from a plurality of preloaded waveforms that are stored in
the controller.
[0147] 32. The controller of embodiment 23, wherein the modulating
in real-time at least one of a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity,
and a derivative of the complex waveform signal includes serially
combining sub-waveform sequences to generate the complex waveform
signal.
[0148] 33. The controller of embodiment 32, wherein the serially
combining sub-waveform sequences includes generating the
sub-waveforms for a desired number of cycle counts and in a desired
sequence order.
[0149] 34. The controller of embodiment 33, wherein at least one of
the sub-waveform cycle count and the sub-waveform sequence order is
dynamically modified based on at least one of a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the electrodeposition process, and a feedback signal related to the
electrodeposition process.
[0150] 35. The controller of embodiment 34, wherein at least one of
the sub-waveform cycle count and the sub-waveform sequence order is
dynamically modified based on the feedback signal, and
[0151] wherein the feedback signal relates to at least one of an
electrolyte concentration, an electrolyte level, an electrolyte
temperature, a coating thickness, and a coating resistance.
[0152] 36. The controller of embodiment 23, wherein the controller
further includes a network communications circuit communicatively
connected to an external communications network, and a
communication input circuit operatively connected to the network
communications circuit and configured to receive, from a remote
computing device, the recipe.
[0153] 37. The controller of embodiment 36, wherein the controller
is connected to one or more other controllers via the external
communications network and each of the controllers represents a
node on the external communications network.
[0154] 38. The controller of embodiment 37, wherein the controller
is further configured to transmit the instructions or a portion of
the instructions in the recipe to the one or more other controllers
via the external communications network.
[0155] 39. The controller of embodiment 24, wherein the controller
is configured to generate a plurality of complex waveform signals
corresponding to a plurality of electrodeposition waveforms,
and
[0156] wherein the field-programmable gate array includes parallel
processing capability to simultaneously and independently control
the waveform synthesizer circuit to generate each of the plurality
of complex waveform signals.
[0157] 40. The controller of embodiment 39, wherein the controller
is configured to adjust at least one of a current density, a
voltage, and a waveform phase of the respective electrodeposition
waveform to compensate for variations in the electrodeposition
process.
[0158] 41. The controller of embodiment 23, wherein the controller
is configured to use a power supply driver file corresponding to at
least one of one or more electrodeposition power supplies to take
into account at least one characteristic of the at least one of the
one or more electrodeposition power supplies.
[0159] 42. The controller of embodiment 41, wherein the at least
one characteristic includes at least one of a slew-rate and a
percent overshoot.
[0160] 43. The controller of embodiment 41, wherein the power
supply driver file is based on a calibration procedure performed by
the controller on the at least one of the one or more
electrodeposition power supplies, and
[0161] wherein the calibration procedure includes transmitting a
calibration waveform signal to the at least one of the one or more
electrodeposition power supplies, placing a known load across
output terminals of the at least one of the one or more
electrodeposition power supplies, measuring at least one of a slew
rate and a percent overshoot of the at least one of the one or more
electrodeposition power supplies, and creating the power supply
driver file using, at least in part, the measured results of the
calibration procedure.
[0162] 44. A method for electrodepositing a coating or cladding on
a substrate, the method comprising:
[0163] selecting a standardized recipe corresponding to a desired
electrodeposition process;
[0164] adjusting the standardized recipe based on information
related to at least one of the substrate geometry, the substrate
surface area, and an electrodeposition power supply used for
electrodepositing the coating or cladding on the substrate;
[0165] generating a complex waveform signal corresponding to a
desired electrodeposition waveform based on the adjusted
recipe;
[0166] providing the complex waveform signal to the
electrodeposition power supply;
[0167] generating an electrodeposition waveform in the power supply
based on the complex waveform signal;
[0168] outputting the electrodeposition waveform from the power
supply to an electrode set corresponding to the substrate; and
[0169] depositing nanolaminate coatings or claddings on the
substrate based on the electrodeposition waveform;
[0170] wherein the outputting includes modulating in real-time at
least one of a waveform shape, a frequency, an amplitude, an
offset, a slew, a wavelength, a phase, a velocity, and a derivative
of the complex waveform signal based, at least in part, on a recipe
having information related to the depositing of the nanolaminate
coatings or claddings.
[0171] 45. The method of embodiment 44, wherein the generation of
the complex waveform signal includes synthesizing the complex
waveform signal using a field-programmable gate array.
[0172] 46. The method of embodiment 44, wherein the recipe includes
instructions for generating the electrodeposition waveform, and
[0173] wherein the instructions include at least one of a current
density, a current waveform profile and a voltage waveform profile
of the electrodeposition waveform.
[0174] 47. The method of embodiment 44, wherein the modulating in
real-time of at least one of a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity,
and a derivative of the complex waveform signal includes modulating
one or more first characteristics of a base first-order waveform
using one or more second characteristics of at least one other
first-order waveform based on a functional relationship between the
first and second characteristics to generate the complex waveform
signal.
[0175] 48. The method of embodiment 47, wherein the base
first-order waveform and the at least one other first-order
waveform are selected from a plurality of preloaded waveforms that
are stored in the processor-based controller.
[0176] 49. The method of embodiment 48, wherein the plurality of
preloaded waveforms includes a triangular waveform, a sinewave, a
square wave, or a custom waveform.
[0177] 50. The method of embodiment 47, wherein the first
characteristics of the base first-order waveform and the second
characteristics of the one or more other first-order waveforms
include a waveform shape, a frequency, an amplitude, an offset, a
slew, a wavelength, a phase, a velocity, or a derivative of the
respective first-order waveform.
[0178] 51. The method of embodiment 47, wherein the base
first-order waveform is the complex waveform signal, and
[0179] wherein the at least one other first-order waveform is
selected from a plurality of preloaded waveforms.
[0180] 52. The method of embodiment 44, wherein the modulating in
real-time of at least one of a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity,
and a derivative of the complex waveform signal includes serially
combining sub-waveform sequences to generate the complex waveform
signal.
[0181] 53. The method of embodiment 52, wherein the serially
combining sub-waveform sequences includes generating the
sub-waveforms for a desired number of cycle counts and in a desired
sequence order.
[0182] 54. The method of embodiment 53, wherein at least one of the
sub-waveform cycle count and the sub-waveform sequence order is
dynamically modified based on at least one of a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the deposition of the coatings or claddings, and a feedback signal
related to the deposition of the coatings or claddings.
[0183] 55. The method of embodiment 54, wherein at least one of the
sub-waveform cycle count and the sub-waveform sequence order is
dynamically modified based on the feedback signal, and
[0184] wherein the feedback signal relates to at least one of an
electrolyte concentration, an electrolyte level, an electrolyte
temperature, a coating thickness, and a coating resistance.
[0185] 56. The method of embodiment 45, further comprising
generating a plurality of complex waveform signals,
[0186] wherein the field-programmable gate array includes parallel
processing capability to simultaneously and independently generate
each of the plurality of complex waveform signals.
[0187] 57. The method of embodiment 44, wherein the generating of
the complex waveform signal takes into account at least one
characteristic of the electrodeposition power supply.
[0188] 58. The method of embodiment 57, wherein the at least one
characteristic includes at least one of a slew-rate and a percent
overshoot.
[0189] 59. A system, comprising:
[0190] an electrochemical processing tank;
[0191] a set of electrodes configured to be used in depositing a
multilayer nanolaminate coatings on a workpiece;
[0192] an electrodeposition power supply connected to the set of
electrodes, the electrodeposition power supply comprising an input
connection configured to receive a complex waveform signal, the
electrodeposition power supply configured to amplify the complex
waveform signal to generate a desired electrodeposition waveform,
the desired electrodeposition waveform configured to deposit at
least one layer of the multilayer nanolaminate coating on the
workpiece; and
[0193] a processor-based controller comprising:
[0194] a waveform synthesizer circuit configured to generate the
complex waveform signal;
[0195] a synthesizer control circuit configured to control the
waveform synthesizer circuit based at least in part on a recipe
having parameters related to the depositing at least one layer of
the multilayer nanolaminate coating, the synthesizer control
circuit configured to control the complex waveform signal generated
by modulating in real-time a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity, a
derivative of the complex waveform signal, or a combination
thereof; and
[0196] a controller output circuit connected to the input of the
electrodeposition power supply, the controller output circuit
configured to transmit the complex waveform signal to the
input.
[0197] 60. A system, comprising:
[0198] an electrochemical processing tank;
[0199] a set of electrodes, in use, depositing a multilayer
nanolaminate coatings on a workpiece;
[0200] an electrodeposition power supply connected to the set of
electrodes, the electrodeposition power supply comprising an input
connection that, in use, receives a complex waveform signal, the
electrodeposition power supply, in use, amplifies the complex
waveform signal to generate a desired electrodeposition waveform,
wherein the desired electrodeposition waveform, in use, deposits at
least one layer of the multilayer nanolaminate coating on the
workpiece; and
[0201] a processor-based controller comprising:
[0202] a waveform synthesizer circuit that, in use, generates the
complex waveform signal;
[0203] a synthesizer control circuit that, in use, controls the
waveform synthesizer circuit based at least in part on a recipe
having parameters related to the depositing at least one layer of
the multilayer nanolaminate coating, the synthesizer control
circuit, in use, controlling the complex waveform signal generated
by modulating in real-time a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity, a
derivative of the complex waveform signal, or a combination
thereof; and
[0204] a controller output circuit connected to the input of the
electrodeposition power supply, wherein the controller output
circuit, in use, transmits the complex waveform signal to the
input.
[0205] 61. A system, comprising:
[0206] an electrochemical processing tank;
[0207] a set of electrodes for use in depositing a multilayer
nanolaminate coatings on a workpiece;
[0208] an electrodeposition power supply for amplifying a complex
waveform signal to generate a desired electrodeposition waveform
for depositing at least one layer of the multilayer nanolaminate
coating on the workpiece, the electrodeposition power supply
comprising an input connection for receiving the complex waveform
signal; and
[0209] a processor-based controller comprising: [0210] a waveform
synthesizer circuit for generating the complex waveform signal;
[0211] a synthesizer control circuit for controlling the waveform
synthesizer circuit based at least in part on a recipe having
parameters related to the depositing at least one layer of the
multilayer nanolaminate coating, the synthesizer control circuit
controlling the complex waveform signal generated by modulating in
real-time a waveform shape, a frequency, an amplitude, an offset, a
slew, a wavelength, a phase, a velocity, a derivative of the
complex waveform signal, or a combination thereof; and [0212] a
controller output circuit for transmitting the complex waveform
signal to the input of the electrodeposition power supply.
[0213] 62. The system of any one of embodiments 59 to 61, wherein
the synthesizer control circuit comprises a field-programmable gate
array.
[0214] 63. The system of any one of embodiments 59 to 62, wherein
the recipe is stored in the processor-based controller;
[0215] 64. The system of any one of embodiments 59 to 63, wherein
the recipe comprises instructions for generating the desired
electrodeposition waveform; and
[0216] wherein the instructions comprise a current density of the
desired electrodeposition waveform, a current waveform profile of
the desired electrodeposition waveform, a voltage waveform profile
of the desired electrodeposition waveform, or a combination
thereof.
[0217] 65. The system of any one of embodiments 59 to 64, wherein
the set of electrodes comprises a cathode and one, two, three,
four, or more anodes.
[0218] 66. The system of any one of embodiments 59 to 65, wherein
the electrodeposition power supply is configured to transmit the
desired electrodeposition waveform to the set of electrodes.
[0219] 67. The system of any one of embodiments 59 to 65, wherein
the electrodeposition power supply, in use, transmits the desired
electrodeposition waveform to the set of electrodes.
[0220] 68. The system of any one of embodiments 59 to 67, wherein
the processor-based controller is configured to transmit the
desired electrodeposition waveform to the set of electrodes.
[0221] 69. The system of any one of embodiments 59 to 67, wherein
the processor-based controller, in use, transmits the desired
electrodeposition waveform to the set of electrodes.
[0222] 70. The system of any one of embodiments 59 to 69, wherein
the modulating in real-time comprises modulating a first
characteristic of a base first-order waveform using a second
characteristic of a second first-order waveform based on a
functional relationship between the first characteristic and the
second characteristic to generate the complex waveform signal.
[0223] 71. The system of embodiment 70, wherein the base
first-order waveform and the second first-order waveform are
independently selected from a plurality of preloaded waveforms that
are stored in the processor-based controller.
[0224] 72. The system of embodiment 71, wherein the
electrodeposition power supply is one of a plurality of
electrodeposition power supplies that are connected to the
processor-based controller.
[0225] 73. The system of embodiment 73, wherein the plurality of
electrodeposition power supplies independently control individual
portions of a cathode bus bar positioned along at least a portion
of a length the electrochemical processing tank.
[0226] 74. The system of any one of embodiments 70 to 73, wherein
the first characteristic of the base first-order waveform and the
second characteristic of the second first-order waveform
independently comprise a waveform shape, a frequency, an amplitude,
an offset, a slew, a wavelength, a phase, a velocity, a derivative
of the respective first-order waveform, or a combination
thereof.
[0227] 75. The system of embodiment 74, wherein the base
first-order waveform is the complex waveform signal; and wherein
the second first-order waveform is selected from a plurality of
preloaded waveforms that are stored in the processor-based
controller.
[0228] 76. The system of any one of embodiments 59 to 75, wherein
the modulating in real-time comprises serially combining
sub-waveform sequences to generate the complex waveform signal.
[0229] 77. The system of embodiment 76, wherein the modulating in
real-time comprises generating the sub-waveform sequences for a
desired number of cycle counts and in a desired sequence order.
[0230] 78. The system of embodiment 77, wherein at least one of the
desired number of cycle counts and the desired sequence order is
independently dynamically modified based on a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the depositing at least one layer of the nanolaminate coating, a
feedback signal related to the depositing at least one layer of the
nanolaminate coating, or a combination thereof.
[0231] 79. The system of embodiment 78, wherein at least one of the
desired number of cycle counts and the desired sequence order is
independently dynamically modified based on the feedback signal,
and
[0232] wherein the feedback signal relates to an electrolyte
concentration, an electrolyte level, an electrolyte temperature, a
coating thickness, a coating resistance, or a combination
thereof.
[0233] 80. The system of any one of embodiments 59 to 79, wherein
the processor-based controller further comprises a network
communications circuit communicatively connected to an external
communications network, the network communications circuit
configured to receive the recipe from a remote computing
device.
[0234] 81. The system of any one of embodiments 59 to 79, wherein
the processor-based controller further comprises a network
communications circuit communicatively connected to an external
communications network, the network communications circuit, in use,
receives the recipe from a remote computing device.
[0235] 82. The system of embodiment 80 or 81, further comprising
one or more other processor-based controllers configured to be
connected to the external communications network;
[0236] wherein the processor-based controller is configured to be
connected to the one or more other processor-based controllers via
the external communications network; and
[0237] wherein each of the processor-based controllers represents a
node on the external communications network.
[0238] 83. The system of embodiment 80 or 81, further comprising
one or more other processor-based controllers that, in use, are
connected to the external communications network;
[0239] wherein the processor-based controller, in use, is connected
to the one or more other processor-based controllers via the
external communications network; and
[0240] wherein each of the processor-based controllers represents a
node on the external communications network.
[0241] 84. The system of embodiment 82 or 83, wherein each node of
the external communications network is configured to receive the
recipe.
[0242] 85. The system of embodiment 82 or 83, wherein each node of
the external communications network, in use, receives the
recipe.
[0243] 86. The system of any one of embodiments 82 to 85, wherein
the processor-based controller is further configured to transmit at
least a portion of the instructions of the recipe to the one or
more other processor-based controllers via the external
communications network.
[0244] 87. The system of any one of embodiments 82 to 85, wherein
the processor-based controller, in use, transmits at least a
portion of the instructions of the recipe to the one or more other
processor-based controllers via the external communications
network.
[0245] 88. The system of any one of embodiments 62 to 87, wherein
the processor-based controller is configured to generate a
plurality of complex waveform signals and the field-programmable
gate array has parallel processing capability to simultaneously and
independently control the waveform synthesizer circuit to generate
each of the plurality of complex waveform signals.
[0246] 89. The system of any one of embodiments 62 to 77, wherein
the processor-based controller, in use, generates a plurality of
complex waveform signals and the field-programmable gate array has
parallel processing capability to simultaneously and independently
control the waveform synthesizer circuit to generate each of the
plurality of complex waveform signals.
[0247] 90. The system of embodiment 88 or 89, wherein the
processor-based controller is configured to adjust a current
density, a voltage, a waveform phase, or a combination thereof, of
the desired electrodeposition waveform to compensate for variations
in the deposition of the at least one layer of the nanolaminate
coating on the workpiece.
[0248] 91. The system of embodiment 88 or 89, wherein the
processor-based controller, in use, compensates for variations in
the deposition of the at least one layer of the nanolaminate
coating on the workpiece by adjusting a current density, a voltage,
a waveform phase, or a combination thereof, of the desired
electrodeposition waveform.
[0249] 92. The system of any one of embodiments 59 to 91, wherein
the processor-based controller is configured to use a power supply
driver file corresponding to the electrodeposition power supply to
take into account a characteristic of the electrodeposition power
supply.
[0250] 93. The system of any one of embodiments 59 to 91, wherein
the processor-based controller, in use, uses a power supply driver
file corresponding to the electrodeposition power supply to take
into account a characteristic of the electrodeposition power
supply.
[0251] 94. The system of embodiment 92 or 93, wherein the
characteristic of the electrodeposition power supply comprises a
slew-rate, a percent overshoot, or a combination thereof.
[0252] 95. The system of embodiment 92 or 93, wherein the power
supply driver file is based on a calibration procedure performed on
the electrodeposition power supply by the processor-based
controller.
[0253] 96. The system of embodiment 95, wherein the calibration
procedure comprises:
[0254] transmitting a calibration waveform signal to the
electrodeposition power supply;
[0255] placing a known load across output terminals of the
electrodeposition power supply;
[0256] measuring a slew rate, a percent overshoot, or a combination
thereof, of the electrodeposition power supply; and
[0257] creating the power supply driver file using at least results
of the measuring the slew rate, the percent overshoot, or the
combination thereof.
[0258] 97. The system of any one of embodiments 59 to 96, further
comprising a tank automation controller configured to control an
electrolyte level, an electrolyte temperature, an agitation rate, a
flow rate of the respective electrochemical processing tank, or a
combination thereof.
[0259] 98. The system of any one of embodiments 59 to 96, further
comprising a tank automation controller that, in use, controls an
electrolyte level, an electrolyte temperature, an agitation rate, a
flow rate of the respective electrochemical processing tank, or a
combination thereof.
[0260] 99. The system of embodiment 59 to 98, further comprising a
sensor assembly configured to detect temperature, level,
electrolyte concentration, coating thickness, coating resistivity,
voltage or current between the electrodes, agitation rate, or a
combination thereof.
[0261] 100. The system of embodiment 59 to 98, further comprising a
sensor assembly that, in use, detects temperature, level,
electrolyte concentration, coating thickness, coating resistivity,
voltage or current between the electrodes, agitation rate, or a
combination thereof.
[0262] 101. The system of embodiment 99 or 100, wherein the sensor
assembly is configured to provide a feedback signal to the
processor-based controller.
[0263] 102. The system of embodiment 99 or 100, wherein the sensor
assembly, in use, provides a feedback signal to the processor-based
controller.
[0264] 103. The system of embodiment 101 or 102, wherein the
modulating in real-time comprises adjusting the waveform shape, the
frequency, the amplitude, the offset, the slew, the wavelength, the
phase, the velocity, the derivative of the complex waveform signal,
or the combination thereof in response to receiving the feedback
signal.
[0265] 104. The system of any one of embodiment 99 or 100, wherein
the sensor assembly is configured to provide a feedback signal to
the tank automation controller.
[0266] 105. The system of any one of embodiment 99 or 100, wherein
the sensor assembly, in use, provides a feedback signal to the tank
automation controller.
[0267] 106. The system of embodiment 104 or 105, wherein the tank
automation controller is configured to provide the feedback signal
to the processor-based controller.
[0268] 107. The system of embodiment 104 or 105, wherein the tank
automation controller, in use, provides the feedback signal to the
processor-based controller.
[0269] 108. The system of any one of embodiments 97 to 107, wherein
the tank automation controller is configured to adjust the
electrolyte level, the electrolyte temperature, the agitation rate,
the flow rate of the respective electrochemical processing tank, or
the combination thereof in response to receiving the feedback
signal.
[0270] 109. The system of any one of embodiments 97 to 107, wherein
the tank automation controller, in use, adjusts the electrolyte
level, the electrolyte temperature, the agitation rate, the flow
rate of the respective electrochemical processing tank, or the
combination thereof in response to receiving the feedback
signal.
[0271] 110. The system of any one of embodiments 59 to 109, wherein
the processor-based controller has a sample rate ranging from DC to
about 350 KHz.
[0272] 111. The system of any one of embodiments 59 to 110, wherein
the electrodeposition power supply has a switching speed of about 5
milliseconds or less.
[0273] 112. A controller for an electrodeposition process,
comprising:
[0274] a waveform synthesizer circuit configured to generate a
complex waveform signal corresponding to an electrodeposition
waveform, the waveform synthesizer circuit being further configured
to transmit the complex waveform signal to an electrodeposition
power supply;
[0275] a synthesizer control circuit configured to control the
waveform synthesizer circuit based at least in part on a recipe
having parameters related to depositing at least one layer of a
multilayer nanolaminate coating, the synthesizer control circuit
configured to control the complex waveform signal generated by
modulating in real-time a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity, a
derivative of the complex waveform signal, or a combination
thereof; and
[0276] a controller output circuit configured to transmit the
complex waveform signal to an input of the electrodeposition power
supply.
[0277] 113. A controller for an electrodeposition process,
comprising:
[0278] a waveform synthesizer circuit that, in use, generates a
complex waveform signal corresponding to an electrodeposition
waveform and transmits the complex waveform signal to an
electrodeposition power supply;
[0279] a synthesizer control circuit that, in use, controls the
waveform synthesizer circuit based at least in part on a recipe
having parameters related to depositing at least one layer of a
multilayer nanolaminate coating, wherein the synthesizer control
circuit, in use, controls the complex waveform signal generated by
modulating in real-time a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity, a
derivative of the complex waveform signal, or a combination
thereof; and
[0280] a controller output circuit that, in use, transmits the
complex waveform signal to an input of the electrodeposition power
supply.
[0281] 114. A controller for an electrodeposition process,
comprising:
[0282] a waveform synthesizer circuit that, in use, generates a
complex waveform signal corresponding to an electrodeposition
waveform and transmits the complex waveform signal to an
electrodeposition power supply;
[0283] a synthesizer control circuit that, in use, controls the
waveform synthesizer circuit based at least in part on a recipe
having parameters related to depositing at least one layer of a
multilayer nanolaminate coating, wherein the synthesizer control
circuit, in use, controls the complex waveform signal generated by
modulating in real-time a waveform shape, a frequency, an
amplitude, an offset, a slew, a wavelength, a phase, a velocity, a
derivative of the complex waveform signal, or a combination
thereof; and
[0284] a controller output circuit that, in use, transmits the
complex waveform signal to an input of the electrodeposition power
supply.
[0285] 115. The controller of any one of embodiments 112 to 114,
wherein the synthesizer control circuit comprises a
field-programmable gate array.
[0286] 116. The controller of any one of embodiments 112 to 115,
wherein the recipe comprises instructions for generating the
electrodeposition waveform; and
[0287] wherein the instructions comprise a current density of the
electrodeposition waveform, a current waveform profile of the
electrodeposition waveform, a voltage waveform profile of the
electrodeposition waveform, or a combination thereof.
[0288] 117. The controller of any one of embodiments 112 to 116,
wherein the recipe is stored in the controller.
[0289] 118. The controller of any one of embodiments 112 to 117,
wherein the modulating in real-time comprises modulating a first
characteristic of a base first-order waveform using a second
characteristic of a second first-order waveform based on a
functional relationship between the first and second
characteristics to generate the complex waveform signal.
[0290] 119. The controller of embodiment 118, wherein the base
first-order waveform and the second first-order waveform are
independently selected from a plurality of preloaded waveforms that
are stored in the controller.
[0291] 120. The controller of embodiment 119, wherein the plurality
of preloaded waveforms comprises a triangular waveform, a sinewave,
a square wave, or a custom waveform.
[0292] 121. The controller of embodiment 118 to 120, wherein the
first characteristic of the base first-order waveform and the
second characteristic of the second first-order waveform
independently comprise a waveform shape, a frequency, an amplitude,
an offset, a slew, a wavelength, a phase, a velocity, a derivative
of the respective first-order waveform, or a combination
thereof.
[0293] 122. The controller of embodiment 118, wherein the base
first-order waveform is the complex waveform signal, and
[0294] wherein the second first-order waveform is selected from a
plurality of preloaded waveforms that are stored in the
controller.
[0295] 123. The controller of any one of embodiments 112 to 122,
wherein the modulating in real-time comprises serially combining
sub-waveform sequences to generate the complex waveform signal.
[0296] 124. The controller of embodiment 123, wherein the
modulating in real time comprises generating the sub-waveform
sequences for a sub-waveform cycle count and in a sub-waveform
sequence order.
[0297] 125. The controller of embodiment 124, wherein at least one
of the sub-waveform cycle count and the sub-waveform sequence order
is independently dynamically modified based on a predetermined time
period, a predetermined sub-waveform cycle count, a process step of
the electrodeposition process, a feedback signal related to the
electrodeposition process, or a combination thereof 5126. The
controller of embodiment 125, wherein at least one of the
sub-waveform cycle count and the sub-waveform sequence order is
independently dynamically modified based on the feedback signal;
and
[0298] wherein the feedback signal relates to an electrolyte
concentration, an electrolyte level, an electrolyte temperature, a
coating thickness, a coating resistance, or a combination
thereof.
[0299] 127. The controller of any one of embodiments 112 to 126,
further comprising a network communications circuit communicatively
connected to an external communications network, the network
communications circuit configured to receive the recipe via the
external communications network.
[0300] 128. The controller of any one of embodiments 112 to 126,
further comprising a network communications circuit communicatively
connected to an external communications network, the network
communications circuit, in use, receives the recipe via the
external communications network.
[0301] 129. The controller of embodiment 127 or 128, wherein the
external communications network is connected to one or more other
controllers and each of the one or more other controllers
represents a node on the external communications network.
[0302] 130. The controller of embodiment 129, wherein the network
communication circuit is configured to transmit at least a portion
of the instructions of the recipe to the one or more other
controllers via the external communications network.
[0303] 131. The controller of embodiment 129, wherein the network
communication circuit, in use, transmits at least a portion of the
instructions of the recipe to the one or more other controllers via
the external communications network.
[0304] 132. The controller of any one of embodiments 115 to 131,
wherein the controller is configured to generate a plurality of
complex waveform signals corresponding to a plurality of
electrodeposition waveforms; and
[0305] wherein the field-programmable gate array comprises parallel
processing capability to simultaneously and independently control
the waveform synthesizer circuit to generate each of the plurality
of complex waveform signals.
[0306] 133. The controller of any one of embodiments 115 to 131,
wherein the controller, in use, generates a plurality of complex
waveform signals corresponding to a plurality of electrodeposition
waveforms; and
[0307] wherein the field-programmable gate array comprises parallel
processing capability to simultaneously and independently control
the waveform synthesizer circuit to generate each of the plurality
of complex waveform signals.
[0308] 134. The controller of embodiment 132 or 133, wherein the
controller is configured to adjust a current density, a voltage, a
waveform phase, or a combination thereof, of the respective
electrodeposition waveform to compensate for variations in the
electrodeposition process.
[0309] 135. The controller of embodiment 132 or 133, wherein the
controller, in use, adjusts a current density, a voltage, a
waveform phase, or a combination thereof, of the respective
electrodeposition waveform to compensate for variations in the
electrodeposition process.
[0310] 136. The controller of any one of embodiments 112 to 135,
wherein the controller is configured to use a power supply driver
file corresponding to the electrodeposition power supply to take
into account a characteristic of the electrodeposition power
supply.
[0311] 137. The controller of any one of embodiments 112 to 135,
wherein the controller, in use, uses a power supply driver file
corresponding to the electrodeposition power supply to take into
account a characteristic of the electrodeposition power supply.
[0312] 138. The controller of embodiment 136 or 137, wherein the
characteristic comprises a slew-rate, a percent overshoot, or a
combination thereof.
[0313] 139. The controller of any one of embodiments 136 to 138,
wherein the power supply driver file is based on a calibration
procedure performed by the controller on the electrodeposition
power supply.
[0314] 140. The controller of embodiment 139, wherein the
calibration procedure comprises:
[0315] transmitting a calibration waveform signal to the
electrodeposition power supply;
[0316] placing a known load across output terminals of the
electrodeposition power supply;
[0317] measuring a slew rate, a percent overshoot, or a combination
thereof, of the electrodeposition power supply; and
[0318] creating the power supply driver file using at least results
of the measuring the slew rate, the percent overshoot, or the
combination thereof.
[0319] 141. The controller of any one of embodiments 112 to 140,
wherein the modulating in real-time comprises adjusting the
waveform shape, the frequency, the amplitude, the offset, the slew,
the wavelength, the phase, the velocity, the derivative of the
complex waveform signal, or the combination thereof in response to
receiving the feedback signal from a sensor assembly.
[0320] 142. The controller of any one of embodiments 112 to 141,
wherein the controller is configured to transmit the
electrodeposition waveform to a set of electrodes.
[0321] 143. The controller of any one of embodiments 112 to 142,
wherein the controller, in use, transmits the electrodeposition
waveform to a set of electrodes.
[0322] 144. The controller of any one of embodiments 112 to 143,
wherein the controller has a sample rate ranging from DC to about
350 KHz.
[0323] 145. A method for electrodepositing a coating on a
workpiece, the method comprising:
[0324] selecting a recipe corresponding to a electrodeposition
process;
[0325] producing a specialized recipe by adjusting the recipe based
on information related to workpiece geometry, workpiece surface
area, an electrodeposition power supply, or a combination
thereof;
[0326] generating a complex waveform signal corresponding to a
desired electrodeposition waveform that is based on the adjusted
recipe, the generating comprising modulating in real-time a
waveform shape, a frequency, an amplitude, an offset, a slew, a
wavelength, a phase, a velocity, a derivative of the complex
waveform signal, or a combination thereof, based at least on the
recipe;
[0327] providing the complex waveform signal to the
electrodeposition power supply;
[0328] generating an electrodeposition waveform based on the
complex waveform signal by the power supply; and
[0329] transmitting the electrodeposition waveform to an electrode
set in an electrodeposition processing tank, thereby depositing the
coating on the workpiece.
[0330] 146. The method of embodiment 145, wherein the complex
waveform signal is generated using a field-programmable gate
array.
[0331] 147. The method of embodiment 145 or 146, wherein the recipe
comprises instructions for generating the electrodeposition
waveform, and
[0332] wherein the instructions comprise at least one of a current
density of the electrodeposition waveform, a current waveform
profile of the electrodeposition waveform, a voltage waveform
profile of the electrodeposition waveform, or a combination
thereof.
[0333] 148. The method of any one of embodiments 145 to 147,
wherein the generating the complex waveform signal comprises
modulating a first characteristic of a base first-order waveform
using a second characteristic of a second first-order waveform
based on a functional relationship between the first and second
characteristics.
[0334] 149. The method of embodiment 148, wherein the base
first-order waveform and the second first-order waveform are
independently selected from a plurality of preloaded waveforms that
are stored in a processor-based controller.
[0335] 150. The method of embodiment 149, wherein the plurality of
preloaded waveforms comprises a triangular waveform, a sinewave, a
square wave, or a custom waveform.
[0336] 151. The method of any one of embodiments 148 to 150,
wherein the first characteristic of the base first-order waveform
and the second characteristic of the second first-order waveform
independently comprise a waveform shape, a frequency, an amplitude,
an offset, a slew, a wavelength, a phase, a velocity, a derivative
of the first-order waveform, or a combination thereof.
[0337] 152. The method of any one of embodiments 148 to 151,
wherein the base first-order waveform is the complex waveform
signal; and
[0338] wherein the second first-order waveform is selected from a
plurality of preloaded waveforms.
[0339] 153. The method of any one of embodiments 145 to 152,
wherein the generating the complex waveform signal comprises
serially combining sub-waveform sequences.
[0340] 154. The method of embodiment 153, wherein the serially
combining sub-waveform sequences comprises generating the
sub-waveforms for a sub-waveform cycle count and in a sub-waveform
sequence order.
[0341] 155. The method of embodiment 154, wherein the sub-waveform
cycle count, the sub-waveform sequence order, or a combination
thereof, is independently dynamically modified based on a
predetermined time period, a predetermined sub-waveform cycle
count, a process step of the depositing the coating, a feedback
signal related to the depositing the coating, or a combination
thereof.
[0342] 156. The method of embodiment 155, wherein the sub-waveform
cycle count, the sub-waveform sequence order, or a combination
thereof, is independently dynamically modified based on the
feedback signal, and wherein the feedback signal relates to an
electrolyte concentration, an electrolyte level, an electrolyte
temperature, a coating thickness, a coating resistance, or a
combination thereof.
[0343] 157. The method of any one of embodiments 146 to 156,
further comprising generating a plurality of complex waveform
signals by the field-programmable gate array, which has parallel
processing capability to simultaneously and independently generate
each of the plurality of complex waveform signals.
[0344] 158. The method of any one of embodiments 145 to 157,
wherein the generating the complex waveform signal takes into
account a characteristic of the electrodeposition power supply.
[0345] 159. The method of embodiment 158, wherein the
characteristic comprises a slew-rate, a percent overshoot, or a
combination thereof.
[0346] 160. The method of any one of embodiments 145 to 159,
further comprising detecting, by a sensor assembly, temperature,
level, electrolyte concentration, coating thickness, coating
resistivity, voltage or current between the electrodes, agitation
rate, or a combination thereof.
[0347] 161. The method of embodiment 160, further comprising
providing, by the sensor assembly, a feedback signal to the
processor-based controller.
[0348] 162. The method of embodiment 161, wherein the modulating in
real-time comprises adjusting the waveform shape, the frequency,
the amplitude, the offset, the slew, the wavelength, the phase, the
velocity, the derivative of the complex waveform signal, or the
combination thereof in response to receiving the feedback
signal.
[0349] 163. The method of embodiment 160, further comprising
providing, by the sensor assembly, a feedback signal to the tank
automation controller.
[0350] 164. The method of embodiment 163, further comprising
providing, by the tank automation controller, the feedback signal
to the processor-based controller.
[0351] 165. The method of embodiment 160, further comprising
adjusting, by the tank automation controller, the electrolyte
level, the electrolyte temperature, the agitation rate, the flow
rate of the respective electrochemical processing tank, or the
combination thereof in response to receiving the feedback
signal.
[0352] 166. The method of any one of embodiments 145 to 165,
wherein the electrodeposition waveform is transmitted from the
power supply to the electrode set.
[0353] 167. The method of any one of embodiments 149 to 165,
wherein the electrodeposition waveform is transmitted from the
processor-based controller to the electrode set.
[0354] 168. The method of any one of embodiments 149 to 167,
wherein the processor-based controller has a sample rate ranging
from DC to about 350 KHz.
[0355] 169. The method of any one of embodiments 145 to 168,
wherein the electrodeposition power supply has a switching speed of
about 5 milliseconds or less.
[0356] Although the subject matter has been described in language
specific to structural features and/or methodological acts, it is
to be understood that the subject matter defined in the appended
claims is not necessarily limited to the specific features or acts
described. Rather, the specific features and acts are disclosed as
illustrative forms of implementing the claims.
[0357] The various embodiments described above can be combined to
provide further embodiments. All of the U.S. patents, U.S. patent
application publications, U.S. patent applications, foreign
patents, foreign patent applications and non-patent publications
referred to in this specification and/or listed in the Application
Data Sheet, including U.S. Patent Application No. 62/394,552, are
incorporated herein by reference, in their entirety. Aspects of the
embodiments can be modified, if necessary to employ concepts of the
various patents, applications and publications to provide yet
further embodiments.
[0358] These and other changes can be made to the embodiments in
light of the above-detailed description. In general, in the
following claims, the terms used should not be construed to limit
the claims to the specific embodiments disclosed in the
specification and the claims, but should be construed to include
all possible embodiments along with the full scope of equivalents
to which such claims are entitled. Accordingly, the claims are not
limited by the disclosure.
* * * * *