U.S. patent application number 16/419127 was filed with the patent office on 2019-11-28 for adhesive composite and method of forming an adhesive composite.
The applicant listed for this patent is Saint-Gobain Performance Plastics Biolink GmbH. Invention is credited to Andreas ROTH-ROSENKRANZ, Jan SCHEFFEL.
Application Number | 20190359865 16/419127 |
Document ID | / |
Family ID | 66676496 |
Filed Date | 2019-11-28 |
![](/patent/app/20190359865/US20190359865A1-20191128-D00000.png)
![](/patent/app/20190359865/US20190359865A1-20191128-D00001.png)
![](/patent/app/20190359865/US20190359865A1-20191128-D00002.png)
![](/patent/app/20190359865/US20190359865A1-20191128-D00003.png)
![](/patent/app/20190359865/US20190359865A1-20191128-D00004.png)
![](/patent/app/20190359865/US20190359865A1-20191128-D00005.png)
United States Patent
Application |
20190359865 |
Kind Code |
A1 |
SCHEFFEL; Jan ; et
al. |
November 28, 2019 |
ADHESIVE COMPOSITE AND METHOD OF FORMING AN ADHESIVE COMPOSITE
Abstract
An adhesive composite is provided that may include a substrate
and an adhesive layer overlying the substrate. The adhesive layer
may include at least a first region of a high Tg adhesive material
and a second region of a low Tg adhesive material. The first region
of the adhesive layer may be co-planar with the second region of
the adhesive layer. The high Tg adhesive material may include a
first glass transition temperature Tg1 and the low Tg adhesive
material may include a second glass transition temperature Tg2,
where Tg1 is greater than Tg2.
Inventors: |
SCHEFFEL; Jan; (Munich,
DE) ; ROTH-ROSENKRANZ; Andreas; (Munchen,
DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Saint-Gobain Performance Plastics Biolink GmbH |
WAAKIRCHEN |
|
DE |
|
|
Family ID: |
66676496 |
Appl. No.: |
16/419127 |
Filed: |
May 22, 2019 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
62675231 |
May 23, 2018 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C09J 133/08 20130101;
C09J 11/06 20130101; C09J 2301/312 20200801; C09J 2301/21 20200801;
B32B 27/08 20130101; C09J 2301/416 20200801; C09J 7/385 20180101;
F16D 65/0006 20130101; C09J 2433/00 20130101 |
International
Class: |
C09J 133/08 20060101
C09J133/08; B32B 27/08 20060101 B32B027/08; C09J 11/06 20060101
C09J011/06 |
Claims
1. An adhesive composite comprising: a substrate; and an adhesive
layer overlying the substrate, wherein the adhesive layer comprises
at least a first region of a high Tg adhesive material and a second
region of a low Tg adhesive material; wherein the first region of
the adhesive layer is co-planar with the second region of the
adhesive layer; wherein the high Tg adhesive material comprises a
first glass transition temperature Tg1 and the low Tg adhesive
material comprises a second glass transition temperature Tg2; and
wherein Tg1 is greater than Tg2.
2. The adhesive composite of claim 1, wherein the adhesive
composite comprises a damping factor of not greater than about 2.4%
over a temperature range of between -20.degree. C. and 60.degree.
C. as measured according to industrial standard SAE J 3001.
3. The adhesive composite of claim 1, wherein the first adhesive
comprises a stainless steel peel strength SS.sub.PS1 of at least
about 8.4 N/cm and not greater than about 12 N/cm.
4. The adhesive composite of claim 1, wherein the second adhesive
comprises a stainless steel peel strength SS.sub.PS2 of at least
about 7.6 N/cm and not greater than about 9.6 N/cm.
5. The adhesive composite of claim 1, wherein the first region
comprises a plurality of zones of the high Tg adhesive material and
wherein the second region comprises a plurality of zones of the low
Tg adhesive material.
6. The adhesive composite of claim 5, wherein plurality of zones of
the high Tg adhesive material and the plurality of zones of the low
Tg adhesive material are arranged on the substrate in a repeating
pattern.
7. The adhesive composite of claim 5, wherein each zone of the high
Tg adhesive material is substantially contiguous with a zone of the
low Tg adhesive material.
8. The adhesive composite of claim 6, wherein a portion of the
substrate covered by the high Tg adhesive material is equal to a
portion of the substrate covered by the low Tg adhesive
material.
9. The adhesive composite of claim 6, wherein the repeating pattern
of the plurality of zones of the high Tg adhesive material and the
plurality of zones of the low Tg adhesive material is a checkered
pattern of alternating squares of the high Tg adhesive material and
the low Tg adhesive material.
10. The adhesive composite of claim 6, wherein the repeating
pattern of the plurality of zones of the high Tg adhesive material
and the plurality of zones of the low Tg adhesive material is a
pattern of alternating dots of the high Tg adhesive material and
the low Tg adhesive material.
11. The adhesive composite of claim 6, wherein the repeating
pattern of the plurality of zones of the high Tg adhesive material
and the plurality of zones of the low Tg adhesive material is a
pattern of alternating strips of the high Tg adhesive material and
the low Tg adhesive material.
12. The adhesive composite of claim 11, wherein each of the
alternating strips are parallel with each other.
13. The adhesive composite of claim 12, wherein each of the
alternating strips have a width of at least about 3 mm and not
greater than about 7 mm.
14. An adhesive composite comprising: a substrate; and an adhesive
layer overlying the substrate, wherein the adhesive layer comprises
at least a first region of a high Tg adhesive material and a second
region of a low Tg adhesive material; wherein the first region of
the adhesive layer is co-planar with the second region of the
adhesive layer; wherein the high Tg adhesive material comprises a
complex shear modules G*.sub.(60)1 as measured at 60.degree. C. and
the low Tg adhesive material comprises a complex shear modules
G*.sub.(60)2 as measured at 60.degree. C.; and wherein G*.sub.(60)1
is greater than G*.sub.(60)2.
15. The adhesive composite of claim 14, wherein the first adhesive
comprises a stainless steel peel strength SS.sub.PS1 of at least
about 8.4 N/cm and not greater than about 12 N/cm.
16. The adhesive composite of claim 14, wherein the second adhesive
comprises a stainless steel peel strength SS.sub.PS2 of at least
about 7.6 N/cm and not greater than about 9.6 N/cm.
17. The adhesive composite of claim 14, wherein the first region
comprises a plurality of zones of the high Tg adhesive material and
wherein the second region comprises a plurality of zones of the low
Tg adhesive material.
18. The adhesive composite of claim 17, wherein plurality of zones
of the high Tg adhesive material and the plurality of zones of the
low Tg adhesive material are arranged on the substrate in a
repeating pattern.
19. The adhesive composite of claim 17, wherein each zone of the
high Tg adhesive material is substantially contiguous with a zone
of the low Tg adhesive material.
20. An adhesive composite comprising: a substrate; and an adhesive
layer overlying the substrate, wherein the adhesive layer comprises
at least a first region of a high Tg adhesive material and a second
region of a low Tg adhesive material; wherein the first region of
the adhesive layer is co-planar with the second region of the
adhesive layer; wherein the high Tg adhesive material comprises: a
high Tg adhesive monomer component A at a concentration of at least
about 76 wt. % and not greater than about 90 wt. % for a total
weight of the high Tg adhesive material; a high Tg adhesive monomer
component B at a concentration of at least about 7 wt. % and not
greater than about 15 wt. % for a total weight of the high Tg
adhesive material; a high Tg adhesive monomer component C at a
concentration of at least about 5 wt. % and not greater than about
10 wt. % for a total weight of the high Tg adhesive material; and
difunctional acrylate at a concentration of not greater than about
0.2 wt. % for a total weight of the high Tg adhesive material;
wherein the low Tg adhesive material comprises: a low Tg adhesive
monomer component A at a concentration of at least about 88 wt. %
and not greater than about 92 wt. % for a total weight of the low
Tg adhesive material; a low Tg adhesive monomer component B at a
concentration of at least about 3.5 wt. % and not greater than
about 7 wt. % for a total weight of the low Tg adhesive material; a
low Tg adhesive monomer component C at a concentration of at least
about 3 wt. % and not greater than about 6 wt. % for a total weight
of the low Tg adhesive material; resin of hydrogen rosin at a
concentration of at least about 3 wt. % and not greater than about
7 wt. % for a total weight of the low Tg adhesive material; and
difunctional acrylate at a concentration of at least about 0.1 wt.
% and not greater than about 0.2 wt. % for a total weight of the
low Tg adhesive material.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application claims priority under 35 U.S.C. .sctn.
119(e) to U.S. Provisional Patent Application No. 62/675,231,
entitled "ADHESIVE COMPOSITE AND METHOD OF FORMING AN ADHESIVE
COMPOSITE," filed on May 23, 2018, naming as inventors Jan SCHEFFEL
et al., which is assigned to the current assignee hereof and
incorporated herein by reference in its entirety.
FIELD OF THE DISCLOSURE
[0002] The present disclosure relates to adhesive composites, and
more particularly to, adhesive composites useful in sound dampening
applications.
BACKGROUND
[0003] Adhesive composites that include pressure sensitive
adhesives (PSA), in particular, adhesive composites used in sound
dampening applications (i.e., brake shim applications) can be
utilized to affect sound propagation through a given material.
However, particular pressure sensitive adhesives can only affect
sound propagation when used within certain temperature ranges. For
example, particular pressure sensitive adhesives are known to
dampen noise, i.e., brake noise or the brake squeal of brake
systems, when operating within certain low temperature ranges,
i.e., from -20.degree. C. to 20.degree. C., within certain medium
temperature ranges, i.e. 0.degree. C. to 40.degree. C. or within
certain high temperature ranges, i.e., 30.degree. C. up to
80.degree. C. When these pressure sensitive adhesives operate
outside of their known working temperature range, they break down,
fail to maintain their adhesive performance and fail to maintain
their sound propagation capabilities. Accordingly, there is a
continuing need for improved adhesive composite designs that are
able to maintain sound propagation capabilities (i.e., sound
dampening capabilities) over broad temperature ranges.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] Embodiments are illustrated by way of example and are not
limited to the accompanying figures.
[0005] FIG. 1 includes an illustration of an adhesive composite
according to embodiments described herein;
[0006] FIG. 2 includes an illustration of an adhesive composite
according to embodiments described herein;
[0007] FIG. 3 includes an illustration of an adhesive composite
according to embodiments described herein;
[0008] FIG. 4 includes an illustration of an adhesive composite
according to embodiments described herein; and
[0009] FIG. 5 includes an illustration of an adhesive composite
according to embodiments described herein.
[0010] Skilled artisans appreciate that elements in the figures are
illustrated for simplicity and clarity and have not necessarily
been drawn to scale.
SUMMARY
[0011] According to a first aspect, an adhesive composite may
include a substrate and an adhesive layer overlying the substrate.
The adhesive layer may include at least a first region of a high Tg
adhesive material and a second region of a low Tg adhesive
material. The first region of the adhesive layer may be co-planar
with the second region of the adhesive layer. The high Tg adhesive
material may include a first glass transition temperature Tg1 and
the low Tg adhesive material may include a second glass transition
temperature Tg2, where Tg1 is greater than Tg2.
[0012] According to yet another aspect, an adhesive composite may
include a substrate and an adhesive layer overlying the substrate.
The adhesive layer may include at least a first region of a high Tg
adhesive material and a second region of a low Tg adhesive
material. The first region of the adhesive layer may be co-planar
with the second region of the adhesive layer. The high Tg adhesive
material may include a complex shear modules G*.sub.(-20)1 as
measured at -20.degree. C. and the low Tg adhesive material may
include a complex shear modules G*.sub.(-20)2 as measured at
-20.degree. C., where G*.sub.(-20)1 is greater than
G*.sub.(-20)2.
[0013] According to yet another aspect, an adhesive composite may
include a substrate and an adhesive layer overlying the substrate.
The adhesive layer may include at least a first region of a high Tg
adhesive material and a second region of a low Tg adhesive
material. The first region of the adhesive layer may be co-planar
with the second region of the adhesive layer. The high Tg adhesive
material may include a complex shear modules G*.sub.(60)1 as
measured at 60.degree. C. and the low Tg adhesive material may
include a complex shear modules G*.sub.(60)2 as measured at
60.degree. C., where G*.sub.(60)1 is greater than G*.sub.(60)2.
[0014] According to yet another aspect, an adhesive composite may
include a substrate and an adhesive layer overlying the substrate.
The adhesive layer may include at least a first region of a high Tg
adhesive material and a second region of a low Tg adhesive
material. The first region of the adhesive layer may be co-planar
with the second region of the adhesive layer. The high Tg adhesive
material may include a peel adhesion PA1 and the low Tg adhesive
material may include a peel adhesion PA2, where PA1 is less than
PA2.
[0015] According to yet another aspect, an adhesive composite may
include a substrate and an adhesive layer overlying the substrate.
The adhesive layer may include at least a first region of a high Tg
adhesive material and a second region of a low Tg adhesive
material. The first region of the adhesive layer may be co-planar
with the second region of the adhesive layer. The high Tg adhesive
material may include a dynamic shear strength DS1 and the low Tg
adhesive material may include a dynamic shear strength DS2, where
DS1 is greater than DS2.
[0016] According to yet another aspect, an adhesive composite may
include a substrate and an adhesive layer overlying the substrate.
The adhesive layer may include at least a first region of a high Tg
adhesive material and a second region of a low Tg adhesive
material. The first region of the adhesive layer may be co-planar
with the second region of the adhesive layer. The high Tg adhesive
material may include a high Tg adhesive monomer component A at a
concentration of at least about 76 wt. % and not greater than about
90 wt. % for a total weight of the high Tg adhesive material. The
high Tg adhesive material may further include a high Tg adhesive
monomer component B at a concentration of at least about 7 wt. %
and not greater than about 15 wt. % for a total weight of the high
Tg adhesive material. The high Tg adhesive material may further
include a high Tg monomer C at a concentration of at least about 5
wt. % and not greater than about 10 wt. % for a total weight of the
high Tg adhesive material. The high Tg adhesive material may
further include difunctional acrylate at a concentration of not
greater than about 0.2 wt. % for a total weight of the high Tg
adhesive material. The low Tg adhesive material may include a low
Tg adhesive monomer component A at a concentration of at least
about 88.0 wt. % and not greater than about 92.0 wt. % for a total
weight of the low Tg adhesive material. The low Tg adhesive
material may further include a low Tg adhesive monomer component B
at a concentration of at least about 3.5 wt. % and not greater than
about 7 wt. % for a total weight of the low Tg adhesive material.
The low Tg adhesive material may further include a low Tg adhesive
monomer component C at a concentration of at least about 3 wt. %
and not greater than about 6 wt. % for a total weight of the low Tg
adhesive material. The low Tg adhesive material may further include
resin of hydrogen rosin at a concentration of at least about 3.0
wt. % and not greater than about 7 wt. % for a total weight of the
low Tg adhesive material. The low Tg adhesive material may further
include difunctional acrylate at a concentration of at least about
0.1 wt. % and not greater than about 0.2 wt. % for a total weight
of the low Tg adhesive material.
DETAILED DESCRIPTION
[0017] The following discussion will focus on specific
implementations and embodiments of the teachings. The detailed
description is provided to assist in describing certain embodiments
and should not be interpreted as a limitation on the scope or
applicability of the disclosure or teachings. It will be
appreciated that other embodiments can be used based on the
disclosure and teachings as provided herein.
[0018] The terms "comprises," "comprising," "includes,"
"including," "has," "having" or any other variation thereof, are
intended to cover a non-exclusive inclusion. For example, a method,
article, or apparatus that comprises a list of features is not
necessarily limited only to those features but may include other
features not expressly listed or inherent to such method, article,
or apparatus. Further, unless expressly stated to the contrary,
"or" refers to an inclusive-or and not to an exclusive-or. For
example, a condition A or B is satisfied by any one of the
following: A is true (or present) and B is false (or not present),
A is false (or not present) and B is true (or present), and both A
and B are true (or present).
[0019] Also, the use of "a" or "an" is employed to describe
elements and components described herein. This is done merely for
convenience and to give a general sense of the scope of the
invention. This description should be read to include one, at least
one, or the singular as also including the plural, or vice versa,
unless it is clear that it is meant otherwise. For example, when a
single item is described herein, more than one item may be used in
place of a single item. Similarly, where more than one item is
described herein, a single item may be substituted for that more
than one item.
[0020] Embodiments described herein are generally directed to
adhesive composites that may include a substrate and an adhesive
layer overlying the substrate. The adhesive layer may include at
least a first region of a high Tg adhesive material and a second
region of a low Tg adhesive material. According to certain
embodiments, the first region of the adhesive layer may be
co-planar with the second region of the adhesive layer.
[0021] For purposes of illustration, FIG. 1 shows an adhesive
composite according to embodiments described herein. As shown in
FIG. 1, an adhesive composite 100 may include a substrate 110 and
an adhesive layer 120 overlying the substrate 110. The adhesive
layer 120 may include a first region 130 of a high Tg adhesive
material and a second region 140 of a low Tg adhesive material. As
further shown in FIG. 1, the first region 130 may be generally
co-planar with the second region 140. The first region 130 and the
second region 140 may each make up a single zone of the adhesive
layer 120, where the single zone of first region 130 is contiguous
with the single zone of the second region 140.
[0022] According to still other embodiments, the first region of
the adhesive layer may include multiple zones, where each zone of
the first region includes the high Tg adhesive material and the
second region of the adhesive layer may include multiple zone,
where each zone of the second region include the low Tg adhesive
material. The multiple zones of the first region and the multiple
zones of the second region may be co-planar. The multiple zones of
the first region and the multiple zone of the second region may be
arranged in repeating or alternating pattern. It will be
appreciated that embodiments described herein may include any
repeating or alternating patterns where at least a portion of the
multiple zones of the first region are contiguous with at least a
portion of the multiple zones of the second region.
[0023] FIG. 2 shows an adhesive composite according to certain
embodiments wherein the alternating pattern of the materials making
up the adhesive layer is a striped pattern. As shown in FIG. 2, an
adhesive composite 200 may include a substrate 210 and an adhesive
layer 220 overlying the substrate 210. The adhesive layer 220 may
include a first region 230 of a high Tg adhesive material and a
second region 230 of a low Tg adhesive material. The first region
230 of the high Tg adhesive material may be divided into multiple
striped zones 230A. The second region 240 of the low Tg adhesive
material may be divided into multiple striped zones 240B. As shown
in FIG. 2, the multiple striped zones 230A and the multiple striped
zones 240B may be arranged as a pattern of laterally aligned
alternating stripes.
[0024] According to certain embodiments, the alternating stripe
zones 230A and 240B may have substantially the same width.
According to yet other embodiments, the alternating stripe zones
230A and 240B may be substantially parallel with each other.
[0025] According to still other embodiments the alternating stipe
zones 230A may have a particular width. For example, the
alternating stripe zones 230A may have a width of at least about
0.01 mm, such as, at least about 0.02 mm or at least about 0.03 or
at least about 0.04 or at least about 0.05 mm or at least about
0.06 mm or at least about 0.07 mm or at least about 0.08 mm or at
least about 0.09 mm or at least about 0.1 mm or at least about 0.5
mm or at least about 1.0 mm or at least about 1.5 mm or at least
about 2.0 mm or at least about 2.5 mm or at least at least about
3.0 mm or at least about 3.5 mm or even at least about 4.0 mm.
According to yet other embodiments, the alternating stipe zones
230A may have a width of not greater than about 7 mm, such as, not
greater than about 6.9 mm or not greater than about 6.8 mm or not
greater than about 6.7 mm or not greater than about 6.6 mm or not
greater than about 6.5 mm or not greater than about 6.4 mm or not
greater than about 6.3 mm or not greater than about 6.2 mm or not
greater than about 6.1 mm or not greater than about 6.0 mm or not
greater than about 5.9 mm or not greater than about 5.8 mm or not
greater than about 5.7 mm or not greater than about 5.6 mm or even
not greater than about 5.5 mm. It will be appreciated that the
width of the alternating stipe zones 230A may be any value between
any of the minimum and maximum values noted above. It will be
further appreciated that the width of the alternating stipe zones
230A may be any value within a range between any of the minimum and
maximum values noted above.
[0026] According to still other embodiments the alternating stipe
zones 240B may have a particular width. For example, the
alternating stripe zones 240B may have a width of at least about
0.01 mm, such as, at least about 0.02 mm or at least about 0.03 or
at least about 0.04 or at least about 0.05 mm or at least about
0.06 mm or at least about 0.07 mm or at least about 0.08 mm or at
least about 0.09 mm or at least about 0.1 mm or at least about 0.5
mm or at least about 1.0 mm or at least about 1.5 mm or at least
about 2.0 mm or at least about 2.5 mm or at least at least about
3.0 mm or at least about 3.5 mm or even at least about 4.0 mm.
According to yet other embodiments, the alternating stipe zones
240B may have a width of not greater than about 7 mm, such as, not
greater than about 6.9 mm or not greater than about 6.8 mm or not
greater than about 6.7 mm or not greater than about 6.6 mm or not
greater than about 6.5 mm or not greater than about 6.4 mm or not
greater than about 6.3 mm or not greater than about 6.2 mm or not
greater than about 6.1 mm or not greater than about 6.0 mm or not
greater than about 5.9 mm or not greater than about 5.8 mm or not
greater than about 5.7 mm or not greater than about 5.6 mm or even
not greater than about 5.5 mm. It will be appreciated that the
width of the alternating stipe zones 240B may be any value between
any of the minimum and maximum values noted above. It will be
further appreciated that the width of the alternating stipe zones
240B may be any value within a range between any of the minimum and
maximum values noted above.
[0027] FIG. 3 shows an adhesive composite according to certain
embodiments wherein the alternating pattern of the materials making
up the adhesive layer is a checkered box pattern. As shown in FIG.
3, an adhesive composite 300 may include a substrate 310 and an
adhesive layer 320 overlying the substrate 310. The adhesive layer
320 may include a first region 330 of a high Tg adhesive material
and a second region 340 of a low Tg adhesive material. The first
region 330 of the high Tg adhesive material may be divided into
multiple boxed zones 330A. The second region 340 of the low Tg
adhesive material may be divided into multiple boxed zones 340B. As
shown in FIG. 3, the multiple boxed zones 330A and the multiple
striped zones 340B may be arranged as a checkered box pattern.
[0028] According to certain embodiments, the boxed zones 330A and
340B may have substantially the same width and height.
[0029] According to still other embodiments the boxed zones 330A
may have a particular width. For example, the boxed zones 330A may
have a width of at least about 0.01 mm, such as, at least about
0.02 mm or at least about 0.03 or at least about 0.04 or at least
about 0.05 mm or at least about 0.06 mm or at least about 0.07 mm
or at least about 0.08 mm or at least about 0.09 mm or at least
about 0.1 mm or at least about 0.5 mm or at least about 1.0 mm or
at least about 1.5 mm or at least about 2.0 mm or at least about
2.5 mm or at least at least about 3.0 mm or at least about 3.5 mm
or even at least about 4.0 mm. According to yet other embodiments,
the boxed zones 330A may have a width of not greater than about 7
mm, such as, not greater than about 6.9 mm or not greater than
about 6.8 mm or not greater than about 6.7 mm or not greater than
about 6.6 mm or not greater than about 6.5 mm or not greater than
about 6.4 mm or not greater than about 6.3 mm or not greater than
about 6.2 mm or not greater than about 6.1 mm or not greater than
about 6.0 mm or not greater than about 5.9 mm or not greater than
about 5.8 mm or not greater than about 5.7 mm or not greater than
about 5.6 mm or even not greater than about 5.5 mm. It will be
appreciated that the width of the boxed zones 330A may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the width of the boxed zones 330A may
be any value within a range between any of the minimum and maximum
values noted above.
[0030] According to still other embodiments the boxed zones 340B
may have a particular width. For example, the boxed zones 340B may
have a width of at least about 0.01 mm, such as, at least about
0.02 mm or at least about 0.03 or at least about 0.04 or at least
about 0.05 mm or at least about 0.06 mm or at least about 0.07 mm
or at least about 0.08 mm or at least about 0.09 mm or at least
about 0.1 mm or at least about 0.5 mm or at least about 1.0 mm or
at least about 1.5 mm or at least about 2.0 mm or at least about
2.5 mm or at least at least about 3.0 mm or at least about 3.5 mm
or even at least about 4.0 mm. According to yet other embodiments,
the boxed zones 340B may have a width of not greater than about 7
mm, such as, not greater than about 6.9 mm or not greater than
about 6.8 mm or not greater than about 6.7 mm or not greater than
about 6.6 mm or not greater than about 6.5 mm or not greater than
about 6.4 mm or not greater than about 6.3 mm or not greater than
about 6.2 mm or not greater than about 6.1 mm or not greater than
about 6.0 mm or not greater than about 5.9 mm or not greater than
about 5.8 mm or not greater than about 5.7 mm or not greater than
about 5.6 mm or even not greater than about 5.5 mm. It will be
appreciated that the width of the boxed zones 340B may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the width of the boxed zones 340B may
be any value within a range between any of the minimum and maximum
values noted above.
[0031] According to still other embodiments the boxed zones 330A
may have a particular height. For example, the boxed zones 330A may
have a height of at least about 0.01 mm, such as, at least about
0.02 mm or at least about 0.03 or at least about 0.04 or at least
about 0.05 mm or at least about 0.06 mm or at least about 0.07 mm
or at least about 0.08 mm or at least about 0.09 mm or at least
about 0.1 mm or at least about 0.5 mm or at least about 1.0 mm or
at least about 1.5 mm or at least about 2.0 mm or at least about
2.5 mm or at least at least about 3.0 mm or at least about 3.5 mm
or even at least about 4.0 mm. According to yet other embodiments,
the boxed zones 330A may have a height of not greater than about 7
mm, such as, not greater than about 6.9 mm or not greater than
about 6.8 mm or not greater than about 6.7 mm or not greater than
about 6.6 mm or not greater than about 6.5 mm or not greater than
about 6.4 mm or not greater than about 6.3 mm or not greater than
about 6.2 mm or not greater than about 6.1 mm or not greater than
about 6.0 mm or not greater than about 5.9 mm or not greater than
about 5.8 mm or not greater than about 5.7 mm or not greater than
about 5.6 mm or even not greater than about 5.5 mm. It will be
appreciated that the height of the boxed zones 330A may be any
value between any of the minimum and maximum values noted above. It
will be further appreciated that the height of the boxed zones 330A
may be any value within a range between any of the minimum and
maximum values noted above.
[0032] According to still other embodiments the boxed zones 340B
may have a particular height. For example, the boxed zones 340B may
have a height of at least about 0.01 mm, such as, at least about
0.02 mm or at least about 0.03 or at least about 0.04 or at least
about 0.05 mm or at least about 0.06 mm or at least about 0.07 mm
or at least about 0.08 mm or at least about 0.09 mm or at least
about 0.1 mm or at least about 0.5 mm or at least about 1.0 mm or
at least about 1.5 mm or at least about 2.0 mm or at least about
2.5 mm or at least at least about 3.0 mm or at least about 3.5 mm
or even at least about 4.0 mm. According to yet other embodiments,
the boxed zones 340B may have a height of not greater than about 7
mm, such as, not greater than about 6.9 mm or not greater than
about 6.8 mm or not greater than about 6.7 mm or not greater than
about 6.6 mm or not greater than about 6.5 mm or not greater than
about 6.4 mm or not greater than about 6.3 mm or not greater than
about 6.2 mm or not greater than about 6.1 mm or not greater than
about 6.0 mm or not greater than about 5.9 mm or not greater than
about 5.8 mm or not greater than about 5.7 mm or not greater than
about 5.6 mm or even not greater than about 5.5 mm. It will be
appreciated that the height of the boxed zones 340B may be any
value between any of the minimum and maximum values noted above. It
will be further appreciated that the height of the boxed zones 340B
may be any value within a range between any of the minimum and
maximum values noted above.
[0033] FIG. 4 shows an adhesive composite according to certain
embodiments where the alternating pattern of the materials making
up the adhesive layer is a dotted pattern. As shown in FIG. 4, an
adhesive composite 400 may include a substrate 410 and an adhesive
layer 420 overlying the substrate 410. The adhesive layer 420 may
include a first region 430 of a high Tg adhesive material and a
second region 440 of a low Tg adhesive material. The first region
430 of the high Tg adhesive material may be divided into multiple
circular dot zones 430A. The second region 440 of the low Tg
adhesive material may be an encircling zone 440B. As shown in FIG.
4, the circular dot zones 430A may be encircled by the encircling
zone 440B.
[0034] According to still other embodiments the circular dot zones
430A may have a particular average diameter. For example, the
circular dot zones 430A may have an average diameter of at least
about 0.01 mm, such as, at least about 0.02 mm or at least about
0.03 or at least about 0.04 or at least about 0.05 mm or at least
about 0.06 mm or at least about 0.07 mm or at least about 0.08 mm
or at least about 0.09 mm or at least about 0.1 mm or at least
about 0.5 mm or at least about 1.0 mm or at least about 1.5 mm or
at least about 2.0 mm or at least about 2.5 mm or at least at least
about 3.0 mm or at least about 3.5 mm or even at least about 4.0
mm. According to yet other embodiments, the circular dot zones 430A
may have an average diameter of not greater than about 7 mm, such
as, not greater than about 6.9 mm or not greater than about 6.8 mm
or not greater than about 6.7 mm or not greater than about 6.6 mm
or not greater than about 6.5 mm or not greater than about 6.4 mm
or not greater than about 6.3 mm or not greater than about 6.2 mm
or not greater than about 6.1 mm or not greater than about 6.0 mm
or not greater than about 5.9 mm or not greater than about 5.8 mm
or not greater than about 5.7 mm or not greater than about 5.6 mm
or even not greater than about 5.5 mm. It will be appreciated that
the average diameter of the circular dot zones 430A may be any
value between any of the minimum and maximum values noted above. It
will be further appreciated that the average diameter of the
circular dot zones 430A may be any value within a range between any
of the minimum and maximum values noted above.
[0035] According to certain embodiments, the circular dot zones
430A may have a uniform shape. According to still other
embodiments, the circular dot zones 430A may have a uniform size.
According to yet other embodiments, the circular dot zones 430A may
have varying shapes. According to other embodiments, the circular
dot zones 430A may have varying sizes.
[0036] FIG. 5 shows an adhesive composite according to certain
embodiments where the alternating pattern of the materials making
up the adhesive layer is a dotted pattern. As shown in FIG. 5, an
adhesive composite 500 may include a substrate 510 and an adhesive
layer 520 overlying the substrate 510. The adhesive layer 520 may
include a first region 530 of a high Tg adhesive material and a
second region 540 of a low Tg adhesive material. The second region
540 of the low Tg adhesive material may be divided into multiple
circular dot zones 540B. The first region 530 of the high Tg
adhesive material may be an encircling zone 530A. As shown in FIG.
5, the circular dot zones 540B may be encircled by the encircling
zone 530A.
[0037] According to still other embodiments the circular dot zones
540B may have a particular average diameter. For example, the
circular dot zones 540B may have an average diameter of at least
about 0.01 mm, such as, at least about 0.02 mm or at least about
0.03 or at least about 0.04 or at least about 0.05 mm or at least
about 0.06 mm or at least about 0.07 mm or at least about 0.08 mm
or at least about 0.09 mm or at least about 0.1 mm or at least
about 0.5 mm or at least about 1.0 mm or at least about 1.5 mm or
at least about 2.0 mm or at least about 2.5 mm or at least at least
about 3.0 mm or at least about 3.5 mm or even at least about 4.0
mm. According to yet other embodiments, the circular dot zones 540B
may have an average diameter of not greater than about 7 mm, such
as, not greater than about 6.9 mm or not greater than about 6.8 mm
or not greater than about 6.7 mm or not greater than about 6.6 mm
or not greater than about 6.5 mm or not greater than about 6.4 mm
or not greater than about 6.3 mm or not greater than about 6.2 mm
or not greater than about 6.1 mm or not greater than about 6.0 mm
or not greater than about 5.9 mm or not greater than about 5.8 mm
or not greater than about 5.7 mm or not greater than about 5.6 mm
or even not greater than about 5.5 mm. It will be appreciated that
the average diameter of the circular dot zones 540B may be any
value between any of the minimum and maximum values noted above. It
will be further appreciated that the average diameter of the boxed
zones 540B may be any value within a range between any of the
minimum and maximum values noted above.
[0038] According to certain embodiments, the circular dot zones
530B may have a uniform shape. According to still other
embodiments, the circular dot zones 540B may have a uniform size.
According to yet other embodiments, the circular dot zones 540B may
have varying shapes. According to other embodiments, the circular
dot zones 540B may have varying sizes.
[0039] According to certain embodiments, the high Tg adhesive
material may have a particular glass transition temperature Tg1.
According to yet other embodiments, the low Tg adhesive material
may have a particular glass transition temperature Tg2. For
purposes of embodiments described herein, a glass transition
temperature of a particular material (i.e., Tg1 or Tg2) is measured
according to ISO 6721-1/ASTM D4065.
[0040] According to certain embodiments, the glass transition
temperature Tg1 may be greater than the second glass transition
temperature Tg2.
[0041] According to yet other embodiments, the glass transition
temperature Tg1 may be at least about 0.5.degree. C., such as, at
least about 0.6.degree. C. or at least about 0.7.degree. C. or at
least about 0.8.degree. C. or at least about 0.9.degree. C. or at
least about 1.0.degree. C. or at least about 1.1.degree. C. or at
least about 1.2.degree. C. or at least about 1.3.degree. C. or at
least about 1.4.degree. C. or at least about 1.5.degree. C. or at
least about 1.6.degree. C. or at least about 1.7.degree. C. or at
least about 1.8.degree. C. or at least about 1.9.degree. C. or at
least about 2.0.degree. C. or at least about 2.5.degree. C. or even
at least about 3.0.degree. C. According to still other embodiments,
the glass transition temperature Tg1 may be not greater than about
not greater than about 8.degree. C., such as, not greater than
about 7.9.degree. C. or not greater than about 7.8.degree. C. or
not greater than about 7.7.degree. C. or not greater than about
7.6.degree. C. or not greater than about 7.5.degree. C. or not
greater than about 7.4.degree. C. or not greater than about
7.3.degree. C. or not greater than about 7.2.degree. C. or not
greater than about 7.1.degree. C. or not greater than about
7.0.degree. C. or not greater than about 6.9.degree. C. or not
greater than about 6.8.degree. C. or not greater than about
6.7.degree. C. or not greater than about 6.6.degree. C. or not
greater than about 6.5.degree. C. or not greater than about
6.4.degree. C. or not greater than about 6.3.degree. C. or not
greater than about 6.2.degree. C. or not greater than about
6.1.degree. C. or not greater than about 6.0.degree. C. or not
greater than about 5.5.degree. C. or even not greater than about
5.0.degree. C. It will be appreciated that the glass transition
temperature Tg1 may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
glass transition temperature Tg1 may be any value within a range
between any of the minimum and maximum values noted above.
[0042] According to yet other embodiments, the glass transition
temperature Tg2 may be at least about -40.degree. C., such as, at
least about -39.5.degree. C. or at least about -39.degree. C. or at
least about -38.5.degree. C. or at least about -38.degree. C. or at
least about -37.5.degree. C. or at least about -37.degree. C. or at
least about -36.5.degree. C. or even at least about -36.degree. C.
According to still other embodiments, the glass transition
temperature Tg2 may be is not greater than about -22.degree. C.,
such as, not greater than about -22.5 or not greater than about
-23.degree. C. or not greater than about -23.5.degree. C. or not
greater than about -24.degree. C. or not greater than about
-24.5.degree. C. or not greater than about -25.degree. C. or not
greater than about -25.5.degree. C. or not greater than about
-26.degree. C. or not greater than about -26.5.degree. C. or not
greater than about -27.degree. C. or not greater than about
-27.5.degree. C. or not greater than about -28.degree. C. or not
greater than about -28.5.degree. C. or not greater than about
-29.degree. C. not greater than about -29.5.degree. C. or not
greater than about -30.degree. C. or not greater than about
-30.5.degree. C. or not greater than about -31.degree. C. or not
greater than about -31.5.degree. C. or not greater than about
-32.degree. C. or not greater than about -32.5.degree. C. or not
greater than about -33.degree. C. or not greater than about
-33.5.degree. C. or even not greater than about -34.degree. C. It
will be appreciated that the glass transition temperature Tg2 may
be any value between any of the minimum and maximum values noted
above. It will be further appreciated that the glass transition
temperature Tg2 may be any value within a range between any of the
minimum and maximum values noted above.
[0043] According to certain embodiments, the high Tg adhesive
material may have a particular complex shear modules G*.sub.(-20)1.
According to yet other embodiments, the low Tg adhesive material
may have a particular complex shear modules G*.sub.(-20)2. For
purposes of embodiments described herein, a complex shear modules
(i.e., G*.sub.(-20)1 or G*.sub.(-20)2) is measured according to ISO
6721-1/ASTM D4065 at -20.degree. C.
[0044] According to certain embodiments, the complex shear modules
G*.sub.(-20)1 may be greater than the complex shear modules
G*.sub.(-20)2.
[0045] According to still other embodiments, the adhesive layer of
the adhesive composite may have a particular ratio G*.sub.(-20)1 to
G*.sub.(-20)2. For example, the ratio of G*.sub.(-20)1 to
G*.sub.(-20)2 may be at least about 3, such as, at least about 4 or
at least about 5 or at least about 6 or at least about 7 or at
least about 8 or at least about 9 or at least about 10 or at least
about 11 or at least about 12 or even at least about 12. According
to yet other embodiments, the ratio of G*.sub.(-20)1 to
G*.sub.(-20)2 may be not greater than about 50, such as, not
greater than about 48 or not greater than about 45 or not greater
than about 43 or not greater than about 40 or not greater than
about 38 or not greater than about 35 or not greater than about 33
or not greater than about 30 or not greater than about 29 or not
greater than about 28 or not greater than about 27 or not greater
than about 26 or not greater than about 25 or not greater than
about 24 or not greater than about 23 or not greater than about 22
or not greater than about 21 or even not greater than about 20. It
will be appreciated that the ratio of G*.sub.(-20)1 to
G*.sub.(-20)2 may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
ratio of G*.sub.(-20)1 to G*.sub.(-20)2 may be any value within a
range between any of the minimum and maximum values noted
above.
[0046] According to still other embodiments, the complex shear
modules G*.sub.(-20)1 may be at least about 4.5 MPa, such as, at
least about 5.0 MPa or at least about 5.5 MPa or at least about 6.0
MPa or at least about 6.5 MPa or even at least about 7 MPa.
According to yet other embodiments, the complex shear modules
G*.sub.(-20)1 may be not greater than about 10 MPa, such as, not
greater than about 9.5 MPa or not greater than about 9.0 MPa or not
greater than about 8.5 MPa or not greater than about 8.0 MPa. It
will be appreciated that the complex shear modules G*.sub.(-20)1
may be any value between any of the minimum and maximum values
noted above. It will be further appreciated that the complex shear
modules G*.sub.(-20)1 may be any value within a range between any
of the minimum and maximum values noted above.
[0047] According to still other embodiments, the complex shear
modules G*.sub.(-20)2 may be at least about 0.2 MPa, such as, at
least about 0.25 MPa or at least about 0.3 MPa or at least about
0.35 MPa or even at least about 0.4 MPa. According to yet other
embodiments, the complex shear modules G*.sub.(-20)2 may be not
greater than about 1.5 MPa, such as, not greater than about 1.4 MPa
or not greater than about 1.3 MPa or not greater than about 1.2 MPa
or not greater than about 1.1 MPa or not greater than about 1.0 MPa
or not greater than about 0.9 MPa or not greater than about 0.8 MPa
or not greater than about 0.7 MPa or even not greater than about
0.6 MPa. It will be appreciated that the complex shear modules
G*.sub.(-20)2 may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
complex shear modules G*.sub.(-20)2 may be any value within a range
between any of the minimum and maximum values noted above.
[0048] According to certain embodiments, the high Tg adhesive
material may have a particular complex shear modules G*.sub.(60)1.
According to yet other embodiments, the low Tg adhesive material
may have a particular complex shear modules G*.sub.(60)2. For
purposes of embodiments described herein, a complex shear modules
(i.e., G*.sub.(60)1 or G*.sub.(60)2) is measured according to ISO
6721-1/ASTM D4065 at 60.degree. C.
[0049] According to certain embodiments, the complex shear modules
G*.sub.(60)1 may be greater than the complex shear modules
G*.sub.(60)2.
[0050] According to still other embodiments, the adhesive layer of
the adhesive composite may have a particular ratio G*.sub.(60)1 to
G*.sub.(60)2. For example, the ratio of G*.sub.(60)1 to
G*.sub.(60)2 may be at least about 0.4, such as, at least about 0.5
or at least about 0.6 or at least about 0.7 or at least about 0.8
or at least about 0.9 or at least about 1.0 or at least about 1.1
or at least about 1.2 or at least about 1.3 or at least about 1.4
or at least about 1.5 or at least about 1.6 or at least about 1.7
or at least about 1.8 or at least about 1.9 or at least about 2.0.
According to yet other embodiments, the ratio of G*.sub.(60)1 to
G*.sub.(60)2 may be not greater than about 6.4, such as, not
greater than about 6.2 or not greater than about 6.0 or not greater
than about 5.8 or not greater than about 5.6 or not greater than
about 5.4 or not greater than about 5.2 or not greater than about
5.0 or not greater than about 4.8 or not greater than about 4.6 or
not greater than about 4.4 or not greater than about 4.2 or not
greater than about 4.0 or not greater than about 3.8 or not greater
than about 3.6 or not greater than about 3.4 or not greater than
about 3.2 or not greater than about 3.0 or even not greater than
about 2.8. It will be appreciated that the ratio of G*.sub.(60)1 to
G*.sub.(60)2 may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
ratio of G*.sub.(60)1 to G*.sub.(60)2 may be any value within a
range between any of the minimum and maximum values noted
above.
[0051] According to still other embodiments, the complex shear
modules G*.sub.(60)1 may be at least about 0.01 MPa, such as, at
least about 0.011 MPa or at least about 0.012 MPa or at least about
0.013 MPa or at least about 0.014 MPa or at least about 0.015 MPa
or at least about 0.016 MPa or at least about 0.017 MPa or at least
about 0.018 MPa or at least about 0.019 MPa or even at least about
0.02 MPa. According to yet other embodiments, the complex shear
modules G*.sub.(60)1 may be not greater than about 0.045 MPa, such
as, not greater than about 0.04 MPa or not greater than about 0.035
MPa or not greater than about 0.03 MPa or even not greater than
about 0.025 MPa. It will be appreciated that the complex shear
modules G*.sub.(60)1 may be any value between any of the minimum
and maximum values noted above. It will be further appreciated that
the complex shear modules G*.sub.(60)1 may be any value within a
range between any of the minimum and maximum values noted
above.
[0052] According to still other embodiments, the complex shear
modules G*.sub.(60)2 may be at least about 0.007 MPa, such as, at
least about 0.0075 MPa or at least about 0.008 MPa or at least
about 0.0085 MPa or even at least about 0.009 MPa. According to yet
other embodiments, the complex shear modules G*.sub.(60)2 may be
not greater than about 0.025 MPa, such as, not greater than about
0.023 MPa or not greater than about 0.020 MPa or not greater than
about 0.018 MPa or not greater than about 0.015 MPa or not greater
than about 0.013 MPa or even not greater than about 0.01 MPa. It
will be appreciated that the complex shear modules G*.sub.(60)2 may
be any value between any of the minimum and maximum values noted
above. It will be further appreciated that the complex shear
modules G*.sub.(60)2 may be any value within a range between any of
the minimum and maximum values noted above.
[0053] According to certain embodiments, the high Tg adhesive
material may have a particular tan .delta..sub.(-20) 1. According
to yet other embodiments, the low Tg adhesive material may have tan
.delta..sub.(-20)2. For purposes of embodiments described herein, a
tan .delta..sub.(-20) (i.e., tan .delta..sub.(-20)1 or tan
.delta..sub.(-20)2) is measured according to ISO 6721-1/ASTM D4065
at -20.degree. C.
[0054] According to still other embodiments, the adhesive layer of
the adhesive composite may have a particular tan .delta..sub.(-20)
combo value C-tan .delta..sub.(-20), where C-tan
.delta..sub.(-20)=(tan .delta..sub.(-20)1+tan
.delta..sub.(-20)2)/2. For example, the C-tan .delta..sub.(-20) may
be at least about 0.75, such as, at least about 0.76 or at least
about 0.77 or even at least about 0.78. According to yet other
embodiments, the C-tan .delta..sub.(-20) may be not greater than
about 0.92, such as, not greater than about 0.91 or not greater
than about 0.91 or not greater than about 0.90 or not greater than
about 89 or not greater than about 0.88 or not greater than about
0.87 or not greater than about 0.86 or not greater than about 0.85
or not greater than about 0.84 or not greater than about 0.83 or
not greater than about 0.82 or even not greater than about 0.81. It
will be appreciated that the C-tan .delta..sub.(-20) may be any
value between any of the minimum and maximum values noted above. It
will be further appreciated that the C-tan .delta..sub.(-20) may be
any value within a range between any of the minimum and maximum
values noted above.
[0055] According to still other embodiments, the tan
.delta..sub.(-20)1 may be at least about 0.42, such as, at least
about 0.43 or at least about 0.44 or at least about 0.45 or at
least about 0.46. According to yet other embodiments, the tan
.delta..sub.(-20)1 may be not greater than about 0.52, such as, not
greater than about 0.51 or not greater than about 0.50 or not
greater than about 0.49 or not greater than about 0.48. It will be
appreciated that the tan .delta..sub.(-20)1 may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the tan .delta..sub.(-20)1 may be any
value within a range between any of the minimum and maximum values
noted above.
[0056] According to still other embodiments, the tan
.delta..sub.(-20)2 may be at least about 1.10, such as, at least
about 1.11 or at least about 1.12 or even at least about 1.13.
According to yet other embodiments, the tan .delta..sub.(-20)2 may
be not greater than about 1.31, such as, not greater than about
1.30 or not greater than about 1.29 or not greater than about 1.28
or not greater than about 1.27 or not greater than about 1.26 or
not greater than about 1.25 or not greater than about 1.24 or not
greater than about 1.23 or not greater than about 1.21 or not
greater than about 1.20 or not greater than about 1.19 or not
greater than about 1.18 or not greater than about 1.17 or not
greater than about 1.16 or not greater than about 1.15 or even not
greater than about 1.14. It will be appreciated that the tan
.delta..sub.(-20)2 may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
tan .delta..sub.(-20)2 may be any value within a range between any
of the minimum and maximum values noted above.
[0057] According to certain embodiments, the high Tg adhesive
material may have a particular tan .delta..sub.(-20)1. According to
yet other embodiments, the low Tg adhesive material may have tan
.delta..sub.(-20)2. For purposes of embodiments described herein, a
tan .delta..sub.(20) (i.e., tan .delta..sub.(20)1 or tan
.delta..sub.(20)2) is measured according to ISO 6721-1/ASTM D4065
at 20.degree. C.
[0058] According to still other embodiments, the adhesive layer of
the adhesive composite may have a particular tan .delta..sub.(20)
combo value C-tan .delta..sub.(20), where C-tan
.delta..sub.(20)=(tan .delta..sub.(20)1+tan .delta..sub.(20)2)/2.
For example, the C-tan .delta..sub.(-20) may be at least about
0.78, such as, at least about 0.79 or at least about 0.80 or at
least about 0.81 or at least about 0.82 or even at least about
0.83. According to yet other embodiments, the C-tan
.delta..sub.(20) may be not greater than about 0.93, such as, not
greater than about 0.92 or not greater than about 0.91 or not
greater than about 0.90 or not greater than about 89 or not greater
than about 0.88 or not greater than about 0.87 or not greater than
about 0.86 or even not greater than about 0.85. It will be
appreciated that the C-tan .delta..sub.(-20) may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the C-tan .delta..sub.(20) may be any
value within a range between any of the minimum and maximum values
noted above.
[0059] According to still other embodiments, the tan
.delta..sub.(-20)1 may be at least about 0.85, such as, at least
about 0.86 or at least about 0.87 or at least about 0.88 or at
least about 0.89 or at least about 0.90 or at least about 0.91 or
at least about 0.92 or at least about 0.93 or even at least about
0.94. According to yet other embodiments, the tan
.delta..sub.(-20)1 may be not greater than about 0.99, such as, not
greater than about 0.98 or not greater than about 0.97 or even not
greater than about 0.96. It will be appreciated that the tan
.delta..sub.(20)1 may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
tan .delta..sub.(20)1 may be any value within a range between any
of the minimum and maximum values noted above.
[0060] According to still other embodiments, the tan
.delta..sub.(-20)2 may be at least about 0.71, such as, at least
about 0.715 or even at least about 0.72. According to yet other
embodiments, the tan .delta..sub.(20)2 may be not greater than
about 0.87, such as, not greater than about 0.86 or not greater
than about 0.85 or not greater than about 0.84 or not greater than
about 0.83 or not greater than about 0.82 or not greater than about
0.81 or not greater than about 0.80 or not greater than about 0.79
or not greater than about 0.78 or not greater than about 0.76 or
not greater than about 0.75 or even not greater than about 0.74. It
will be appreciated that the tan .delta..sub.(20)2 may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the tan .delta..sub.(-20)2 may be any
value within a range between any of the minimum and maximum values
noted above.
[0061] According to certain embodiments, the high Tg adhesive
material may have a particular tan .delta..sub.(60)1. According to
yet other embodiments, the low Tg adhesive material may have tan
.delta..sub.(60)2. For purposes of embodiments described herein, a
tan .delta.(60) (i.e., tan .delta..sub.(60)1 or tan
.delta..sub.(60)2) is measured according to ISO 6721-1/ASTM D4065
at 60.degree. C.
[0062] According to still other embodiments, the adhesive layer of
the adhesive composite may have a particular tan .delta..sub.(60)
combo value C-tan .delta..sub.(60), where C-tan
.delta..sub.(60)=(tan .delta..sub.(60)1+tan .delta..sub.(60)2)/2.
For example, the C-tan .delta..sub.(60) may be at least about 0.42,
such as, at least about 0.43 or at least about 0.44 or at least
about 0.45 or at least about 0.46 or at least about 0.47 or at
least about 0.48 or at least about 0.49 or at least about 0.50 or
even at least about 0.51. According to yet other embodiments, the
C-tan .delta..sub.(60) may be not greater than about 0.66, such as,
not greater than about 0.65 or not greater than about 0.64 or not
greater than about 0.63 or not greater than about 0.62 or not
greater than about 0.61 or not greater than about 0.60 or not
greater than about 0.59 or not greater than about 0.58 or not
greater than about 0.57 or not greater than about 0.56 or not
greater than about 0.55 or not greater than about 0.54 or even not
greater than about 0.53. It will be appreciated that the C-tan
.delta..sub.(60) may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
C-tan .delta..sub.(60) may be any value within a range between any
of the minimum and maximum values noted above.
[0063] According to still other embodiments, the tan
.delta..sub.(60)1 may be at least about 0.3, such as, or at least
about 0.33 or at least about 0.35 or at least about 0.38 or at
least about 0.40 or at least about 0.41 or even at least about
0.42. According to yet other embodiments, the tan .delta..sub.(60)1
may be not greater than about 0.46, such as, not greater than about
0.45 or not greater than about 0.44 or even not greater than about
0.43. It will be appreciated that the tan .delta..sub.(60)1 may be
any value between any of the minimum and maximum values noted
above. It will be further appreciated that the tan .delta..sub.(60)
1 may be any value within a range between any of the minimum and
maximum values noted above.
[0064] According to still other embodiments, the tan
.delta..sub.(60)2 may be at least about 0.54, such as, at least
about 0.55 or at least about 0.56 or at least about 0.57 or at
least about 0.58 or at least about 0.59 or even at least about 0.6.
According to yet other embodiments, the tan .delta..sub.(60)2 may
be not greater than about 0.87, such as, not greater than about
0.85 or not greater than about 0.82 or not greater than about 0.80
or not greater than about 0.77 or not greater than about 0.75 or
not greater than about 0.72 or not greater than about 0.70 or not
greater than about 0.67 or not greater than about 0.65 or even not
greater than about 0.63. It will be appreciated that the tan
.delta..sub.(60)2 may be any value between any of the minimum and
maximum values noted above. It will be further appreciated that the
tan .delta..sub.(60)2 may be any value within a range between any
of the minimum and maximum values noted above.
[0065] According to certain embodiments, the high Tg adhesive
material may have a particular stainless steel peel strength
SS.sub.PS1. According to yet other embodiments, the low Tg adhesive
material may have a particular steel peel strength SS.sub.PS2. For
purposes of embodiments described herein, a stainless steel peel
strength (i.e., SS.sub.PS1 or SS.sub.PS2) is measured according to
AFERA 5001.
[0066] According to yet other embodiments, the stainless steel peel
strength SS.sub.PS1 may be at least about 8.4 N/cm, such as, at
least about 8.5 N/cm or at least about 8.6 N/cm or at least about
8.7 N/cm or at least about 8.8 N/cm or at least about 8.9 N/cm or
at least about 9.0 N/cm or at least about 9.1 N/cm or at least
about 9.2 N/cm or at least about 9.3 N/cm or at least about 9.4
N/cm or at least about 9.5 N/cm or at least about 9.6 N/cm or at
least about 9.7 N/cm or at least about 9.8 N/cm or at least about
9.9 N/cm or even at least about 10.0 N/cm. According to still other
embodiments, the stainless steel peel strength SS.sub.PS1 may be
not greater than about 12 N/cm, such as, not greater than about
11.9 N/cm or not greater than about 11.8 N/cm or not greater than
about 11.7 N/cm or not greater than about 11.6 N/cm or not greater
than about 11.5 N/cm or not greater than about 11.4 N/cm or not
greater than about 11.3 N/cm or not greater than about 11.2 N/cm or
not greater than about 11.1 N/cm or not greater than about 11.0
N/cm or not greater than about 10.9 N/cm or not greater than about
10.8 N/cm or not greater than about 10.7 N/cm or not greater than
about 10.6 N/cm or even not greater than about 10.5 N/cm. It will
be appreciated that the stainless steel peel strength SS.sub.PS1
may be any value between any of the minimum and maximum values
noted above. It will be further appreciated that the stainless
steel peel strength SS.sub.PS1 may be any value within a range
between any of the minimum and maximum values noted above.
[0067] According to still other embodiments, the stainless steel
peel strength SS.sub.PS2 may be at least about 7.6 N/cm, such as,
at least about 7.7 N/cm or at least about 7.8 N/cm or at least
about 7.9 N/cm or at least about 8.0 N/cm or at least about 8.1
N/cm or at least about 8.2 N/cm or at least about 8.3 N/cm or at
least about 8.4 N/cm or even at least about 8.5 N/cm. According to
yet other embodiments, the stainless steel peel strength SS.sub.PS2
may be not greater than about 9.6 N/cm, such as, not greater than
about 9.5 N/cm or not greater than about 9.4 N/cm or not greater
than about 9.3 N/cm or not greater than about 9.2 N/cm or not
greater than about 9.1 N/cm or even not greater than about 9.0
N/cm. It will be appreciated that the stainless steel peel strength
SS.sub.PS2 may be any value between any of the minimum and maximum
values noted above. It will be further appreciated that the
stainless steel peel strength SS.sub.PS2 may be any value within a
range between any of the minimum and maximum values noted
above.
[0068] According to certain embodiments, the high Tg adhesive
material may have a particular MSE peel strength MSE.sub.PS1.
According to yet other embodiments, the low Tg adhesive material
may have a particular MSE peel strength MSE.sub.PS2. For purposes
of embodiments described herein, a MSE peel strength (i.e.,
MSE.sub.PS1 or MSE.sub.PS2) is measured according to ASTM D
4498.
[0069] According to yet other embodiments, the stainless steel peel
strength MSE.sub.PS1 may be at least about 6.4 N/cm, such as, at
least about 6.5 N/cm or at least about 6.6 N/cm or at least about
6.7 N/cm or at least about 6.8 N/cm or at least about 6.9 N/cm or
even at least about 7.0 N/cm. According to still other embodiments,
the stainless steel peel strength MSE.sub.PS1 may be not greater
than about 8.8 N/cm, such as, not greater than about 8.7 N/cm or
not greater than about 8.6 N/cm or not greater than about 8.5 N/cm
or not greater than about 8.4 N/cm or not greater than about 8.3
N/cm or not greater than about 8.2 N/cm or not greater than about
8.1 N/cm or not greater than about 8.0 N/cm or not greater than
about 7.9 N/cm or not greater than about 7.8 N/cm or not greater
than about 7.7 N/cm or not greater than about 7.6 N/cm or even not
greater than about 7.5 N/cm. It will be appreciated that the
stainless steel peel strength MSE.sub.PS1 may be any value between
any of the minimum and maximum values noted above. It will be
further appreciated that the stainless steel peel strength
MSE.sub.PS1 may be any value within a range between any of the
minimum and maximum values noted above.
[0070] According to still other embodiments, the stainless steel
peel strength MSE.sub.PS2 may be at least about 7.6 N/cm, such as,
at least about 7.7 N/cm or at least about 7.8 N/cm or at least
about 7.9 N/cm or even at least about 8.0 N/cm. According to yet
other embodiments, the stainless steel peel strength MSE.sub.PS2
may be not greater than about 8.8 N/cm, such as, not greater than
about 8.7 N/cm or not greater than about 8.6 N/cm or not greater
than about 8.5 N/cm or not greater than about 8.4 N/cm or not
greater than about 8.3 N/cm or even not greater than about 8.2
N/cm. It will be appreciated that the stainless steel peel strength
MSE.sub.PS2 may be any value between any of the minimum and maximum
values noted above. It will be further appreciated that the
stainless steel peel strength MSE.sub.PS2 may be any value within a
range between any of the minimum and maximum values noted
above.
[0071] According to certain embodiments, the high Tg adhesive
material may have a particular dynamic shear DS1. According to yet
other embodiments, the low Tg adhesive material may have a
particular dynamic shear DS1. For purposes of embodiments described
herein, a dynamic shear (i.e., DS1 or DS2) is measured according to
FTM 8.
[0072] According to certain embodiments, the dynamic shear DS1 may
be at least about 0.7 MPa, such as, at least about 0.75 MPa or at
least about 0.8 MPa or at least about 0.85 MPa or at least about
0.9 MPa or at least about 0.95 MPa or at least about 1.0 MPa or
even at least about 1.05 MPa. According to still other embodiments,
the dynamic shear DS1 may be not greater than about 2.0 MPa, such
as, not greater than about 1.95 MPa or not greater than about 1.9
MPa or not greater than about 1.85 MPa or not greater than about
1.8 MPa or not greater than about 1.75 MPa or not greater than
about 1.7 MPa or not greater than about 1.65 MPa or not greater
than about 1.6 MPa or not greater than about 1.55 MPa or not
greater than about 1.5 MPa or not greater than about 1.45 MPa. It
will be appreciated that the dynamic shear DS1 may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the dynamic shear DS1 may be any value
within a range between any of the minimum and maximum values noted
above.
[0073] According to certain embodiments, the dynamic shear DS2 may
be at least about 0.15 MPa, such as, at least about 0.17 MPa or at
least about 0.20 MPa or at least about 0.22 MPa or at least about
0.25 MPa. According to still other embodiments, the dynamic shear
DS2 may be not greater than about 1.0 MPa, such as, not greater
than about 0.95 MPa or not greater than about 0.9 MPa or not
greater than about 0.85 MPa or not greater than about 0.8 MPa or
not greater than about 0.75 MPa or not greater than about 0.7 MPa
or not greater than about 0.65 MPa or not greater than about 0.6
MPa or even not greater than about 0.55 MPa. It will be appreciated
that the dynamic shear DS2 may be any value between any of the
minimum and maximum values noted above. It will be further
appreciated that the dynamic shear DS2 may be any value within a
range between any of the minimum and maximum values noted
above.
[0074] According to still other embodiments, the adhesive composite
may have a particular damping factor. For purposes of embodiments
described herein, a damping factor is measured according to SAEJ
3001.
[0075] According to certain embodiments, the adhesive composite may
have a damping factor of at least about 0.5% over a temperature
range of between -20.degree. C. and 60.degree. C., such as, at
least about 0.6% over a temperature range of between -20.degree. C.
and 60.degree. C. or at least about 0.7% over a temperature range
of between -20.degree. C. and 60.degree. C. or at least about 0.8%
over a temperature range of between -20.degree. C. and 60.degree.
C. or at least about 0.9% over a temperature range of between
-20.degree. C. and 60.degree. C. or at least about 1.0% over a
temperature range of between -20.degree. C. and 60.degree. C. or at
least about 1.1% over a temperature range of between -20.degree. C.
and 60.degree. C. or at least about 1.2% over a temperature range
of between -20.degree. C. and 60.degree. C. or at least about 1.3%
over a temperature range of between -20.degree. C. and 60.degree.
C. or at least about 1.4% over a temperature range of between
-20.degree. C. and 60.degree. C. or even at least about % over a
temperature range of between -20.degree. C. and 60.degree. C. It
will be appreciated that the damping factor of the adhesive
composite may be any value between any of the values noted above.
It will be further appreciated that the damping factor of the
adhesive composite may be any value within a range between any of
the values noted above.
[0076] According to still other embodiments, the high Tg adhesive
material may include a high Tg adhesive monomer component A at a
particular concentration. For example, the high Tg adhesive
material may include a high Tg adhesive monomer component A at a
concentration of at least about 76 wt. % for a total weight of the
high Tg adhesive material, such as, at least about 76.5 wt. % or at
least about 77 wt. % or at least about 77.5 wt. % or at least about
78 wt. % or at least about 78.5 wt. % or at least about 79 wt. % at
least about 79.5 wt. % or at least about 80.0 wt. % or at least
about 80.5 wt. % or at least about 81.0 wt. % or at least about
81.5 wt. % or at least about 82.0 wt. % or even at least about 82.0
wt. %. According to still other embodiments, the high Tg adhesive
material may include a high Tg adhesive monomer component A at a
concentration of not greater than about 90 wt. % for a total weight
of the high Tg adhesive material, such as, not greater than about
89.5 wt. % or not greater than about 89.0 wt. % or not greater than
about 88.5 wt. % or not greater than about 88.0 wt. % or not
greater than about 87.5 wt. % or not greater than about 87.0 wt. %
or not greater than about 86.5 wt. % or not greater than about 86.0
wt. % or not greater than about 85.5 wt. % or not greater than
about 85.0 wt. % or not greater than about 84.5 wt. % or even not
greater than about 84.0 wt. %. It will be appreciated that the
concentration of the high Tg adhesive monomer component A in the
high Tg adhesive material may be any value between any of the
minimum and maximum values noted above. It will be further
appreciated that the concentration of the high Tg adhesive monomer
component A in the high Tg adhesive material may be any value
within a range between any of the minimum and maximum values noted
above.
[0077] According to particular embodiments, the high Tg adhesive
monomer component A may include 2-ethylhexl acrylate. According to
yet other embodiments, the high Tg adhesive monomer component A may
consist of 2-ethylhexl acrylate. According to particular
embodiments, the high Tg adhesive monomer component A may include
iso octyl acrylate. According to yet other embodiments, the high Tg
adhesive monomer component A may consist of iso octyl acrylate.
According to particular embodiments, the high Tg adhesive monomer
component A may include 2(2-ethoxyethoxy) ethyl acrylate. According
to yet other embodiments, the high Tg adhesive monomer component A
may consist of 2(2-ethoxyethoxy) ethyl acrylate. According to
particular embodiments, the high Tg adhesive monomer component A
may include isodecyl acrylate. According to yet other embodiments,
the high Tg adhesive monomer component A may consist of isodecyl
acrylate. According to particular embodiments, the high Tg adhesive
monomer component A may include tridecyl acrylate. According to yet
other embodiments, the high Tg adhesive monomer component A may
consist of tridecyl acrylate.
[0078] According to still other embodiments, the high Tg adhesive
material may include a high Tg adhesive monomer component B at a
particular concentration. For example, the high Tg adhesive
material may include a high Tg adhesive monomer component B at a
concentration of at least about 7.0 wt. % for a total weight of the
high Tg adhesive material, such as, at least about 7.5 wt. % or at
least about 8.0 wt. % or at least about 8.5 wt. % or at least about
9.0 wt. % or at least about 9.5 wt. % or at least about 10.0 wt. %.
According to still other embodiments, the high Tg adhesive material
may include a high Tg adhesive monomer component B at a
concentration of not greater than about 15 wt. % for a total weight
of the high Tg adhesive material, such as, not greater than about
14.75 wt. % or not greater than about 14.5 wt. % or not greater
than about 14.25 wt. % or not greater than about 14 wt. % or not
greater than about 13.75 wt. % or not greater than about 13.5 wt. %
or not greater than about 13 wt. % or not greater than about 12.75
wt. % or not greater than about 12.5 wt. % or not greater than
about 12.25 wt. % or not greater than about 12.0 wt. %. It will be
appreciated that the concentration of the high Tg adhesive monomer
component B in the high Tg adhesive material may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the concentration of the high Tg
adhesive monomer component B in the high Tg adhesive material may
be any value within a range between any of the minimum and maximum
values noted above.
[0079] According to particular embodiments, the high Tg adhesive
monomer component B may include isobornyylacrylate. According to
yet other embodiments, the high Tg adhesive monomer component B may
consist of isobornyylacrylate. According to particular embodiments,
the high Tg adhesive monomer component B may include acrylic acid.
According to yet other embodiments, the high Tg adhesive monomer
component B may consist of acrylic acid. According to particular
embodiments, the high Tg adhesive monomer component B may include
acryloly morpholine. According to yet other embodiments, the high
Tg adhesive monomer component B may consist of acryloly morpholine.
According to particular embodiments, the high Tg adhesive monomer
component B may include methacrylic acid. According to yet other
embodiments, the high Tg adhesive monomer component B may consist
of methacrylic acid.
[0080] According to still other embodiments, the high Tg adhesive
material may include a high Tg adhesive monomer component C at a
particular concentration. For example, the high Tg adhesive
material may include a high Tg adhesive monomer component C at a
concentration of at least about 5.0 wt. % for a total weight of the
high Tg adhesive material, such as, at least about 5.1 wt. % or at
least about 5.2 wt. % or at least about 5.3 wt. % or at least about
5.4 wt. % or at least about 5.5 wt. %. According to still other
embodiments, the high Tg adhesive material may include a high Tg
adhesive monomer component C at a concentration of not greater than
about 10.0 wt. % for a total weight of the high Tg adhesive
material, such as, not greater than about 9.9 wt. % or not greater
than about 9.8 wt. % or not greater than about 9.7 wt. % or not
greater than about 9.6 wt. % or not greater than about 9.5 wt. % or
not greater than about 9.4 wt. % or not greater than about 9.3 wt.
% or not greater than about 9.2 wt. % or not greater than about 9.1
wt. % or not greater than about 9.0 wt. % or not greater than about
8.9 wt. % or not greater than about 8.8 wt. % or not greater than
about 8.7 wt. % or not greater than about 8.6 wt. % or not greater
than about 8.5 wt. % or not greater than about 8.4 wt. % or not
greater than about 8.3 wt. % or not greater than about 8.2 wt. % or
not greater than about 8.1 wt. % or not greater than about 8.0 wt.
% or not greater than about 7.9 wt. % or not greater than about 7.8
wt. % or not greater than about 7.7 wt. % or not greater than about
7.6 wt. % or not greater than about 7.5 wt. % or not greater than
about 7.4 wt. % or not greater than about 7.3 wt. % or not greater
than about 7.2 wt. % or not greater than about 7.1 wt. % or not
greater than about 7.0 wt. % or not greater than about 6.9 wt. % or
not greater than about 6.8 wt. % or not greater than about 6.7 wt.
% or not greater than about 6.5 wt. % or not greater than about 6.4
wt. % or not greater than about 6.3 wt. % or not greater than about
6.2 wt. % or not greater than about 6.1 wt. % or not greater than
about 6.0 wt. %. It will be appreciated that the concentration of
the high Tg adhesive monomer component C in the high Tg adhesive
material may be any value between any of the minimum and maximum
values noted above. It will be further appreciated that the
concentration of the high Tg adhesive monomer component C in the
high Tg adhesive material may be any value within a range between
any of the minimum and maximum values noted above.
[0081] According to particular embodiments, the high Tg adhesive
monomer component C may include isobornyylacrylate. According to
yet other embodiments, the high Tg adhesive monomer component C may
consist of isobornyylacrylate. According to particular embodiments,
the high Tg adhesive monomer component C may include acrylic acid.
According to yet other embodiments, the high Tg adhesive monomer
component C may consist of acrylic acid. According to particular
embodiments, the high Tg adhesive monomer component C may include
acryloly morpholine. According to yet other embodiments, the high
Tg adhesive monomer component C may consist of acryloly morpholine.
According to particular embodiments, the high Tg adhesive monomer
component C may include methacrylic acid. According to yet other
embodiments, the high Tg adhesive monomer component C may consist
of methacrylic acid.
[0082] According to still other embodiments, the high Tg adhesive
material may include difunctional acrylate at a particular
concentration. For example, the high Tg adhesive material may
include difunctional acrylate at a concentration of at least about
0.2 wt. % for a total weight of the high Tg adhesive material, such
as, at least about 0.25 wt. % or at least about 0.3 wt. % or at
least about 0.35 wt. % or at least about 0.4 wt. %. It will be
appreciated that the concentration of difunctional acrylate in the
high Tg adhesive material may be any value between any of the
values noted above. It will be further appreciated that the
concentration of difunctional acrylate in the high Tg adhesive
material may be any value within a range between any of the values
noted above.
[0083] According to still other embodiments, the low Tg adhesive
material may include a low Tg adhesive monomer component A at a
particular concentration. For example, the low Tg adhesive material
may include a low Tg adhesive monomer component A at a
concentration of at least about 88.0 wt. % for a total weight of
the low Tg adhesive material, such as, at least about 88.1 wt. % or
at least about 88.2 wt. % or at least about 88.3 wt. % or at least
about 88.4 wt. % or at least about 88.5 wt. % or at least about
88.6 wt. % or at least about 88.7 wt. % or at least about 88.8 wt.
% or at least about 88.9 wt. % or at least about 89.0 wt. % or at
least about 89.1 wt. % or at least about 89.2 wt. % or at least
about 89.3 wt. % or at least about 89.4 wt. % or at least about
89.5 wt. % or at least about 89.6 wt. % or even at least about 89.7
wt. % or even at least about 89.8 wt. % or even at least about 89.9
wt. % or even at least about 90.0 wt. % or even at least about 90.1
wt. % or even at least about 90.2 wt. % or even at least about 90.3
wt. % or even at least about 90.4 wt. % or even at least about 90.5
wt. % or even at least about 90.6 wt. % or even at least about 90.7
wt. % or even at least about 90.8 wt. % or even at least about 90.9
wt. % or even at least about 91.0 wt. %. According to still other
embodiments, the low Tg adhesive material may include a low Tg
adhesive monomer component A at a concentration of not greater than
about 93.0 wt. % for a total weight of the low Tg adhesive
material, such as, not greater than about 92.9 wt. % or not greater
than about 92.8 wt. % or not greater than about 92.7 wt. % or not
greater than about 92.6 wt. % or not greater than about 92.5 wt. %
or not greater than about 92.4 wt. % or not greater than about 92.3
wt. % or not greater than about 92.2 wt. % or not greater than
about 92.1 wt. % or not greater than about 92.0 wt. %. It will be
appreciated that the concentration of the low Tg adhesive monomer
component A in the low Tg adhesive material may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the concentration of the low Tg
adhesive monomer component A in the low Tg adhesive material may be
any value within a range between any of the minimum and maximum
values noted above.
[0084] According to particular embodiments, the low Tg adhesive
monomer component A may include 2-ethylhexl acrylate. According to
yet other embodiments, the low Tg adhesive monomer component A may
consist of 2-ethylhexl acrylate. According to particular
embodiments, the low Tg adhesive monomer component A may include
iso octyl acrylate. According to yet other embodiments, the low Tg
adhesive monomer component A may consist of iso octyl acrylate.
According to particular embodiments, the low Tg adhesive monomer
component A may include 2(2-ethoxyethoxy) ethyl acrylate. According
to yet other embodiments, the low Tg adhesive monomer component A
may consist of 2(2-ethoxyethoxy) ethyl acrylate. According to
particular embodiments, the low Tg adhesive monomer component A may
include isodecyl acrylate. According to yet other embodiments, the
low Tg adhesive monomer component A may consist of isodecyl
acrylate. According to particular embodiments, the low Tg adhesive
monomer component A may include tridecyl acrylate. According to yet
other embodiments, the low Tg adhesive monomer component A may
consist of tridecyl acrylate.
[0085] According to still other embodiments, the low Tg adhesive
material may include a low Tg adhesive monomer component B at a
particular concentration. For example, the low Tg adhesive material
may include a low Tg adhesive monomer component B at a
concentration of at least about 3.5 wt. % for a total weight of the
low Tg adhesive material, such as, at least about 3.6 wt. % or at
least about 3.7 wt. % or at least about 3.8 wt. % or at least about
3.9 wt. % or at least about 4.0 wt. % or at least about 4.1 wt. %
or at least about 4.2 wt. % or at least about 4.3 wt. % or at least
about 4.4 wt. % or at least about 4.5 wt. %. According to still
other embodiments, the low Tg adhesive material may include a low
Tg adhesive monomer component B at a concentration of not greater
than about 7.0 wt. % for a total weight of the low Tg adhesive
material, such as, not greater than about 6.9 wt. % or not greater
than about 6.8 wt. % or not greater than about 6.7 wt. % or not
greater than about 6.6 wt. % or not greater than about 6.5 wt. % or
not greater than about 6.4 wt. % or not greater than about 6.3 wt.
% or not greater than about 6.2 wt. % or not greater than about 6.1
wt. % or not greater than about 6.0 wt. % or not greater than about
5.9 wt. % or not greater than about 5.8 wt. % or not greater than
about 5.7 wt. % or not greater than about 5.6 wt. % or not greater
than about 5.5 wt. % or not greater than about 5.4 wt. % or not
greater than about 5.3 wt. % or not greater than about 5.2 wt. % or
not greater than about 5.1 wt. % or not greater than about 5.0 wt.
%. It will be appreciated that the concentration of the low Tg
adhesive monomer component B in the low Tg adhesive material may be
any value between any of the minimum and maximum values noted
above. It will be further appreciated that the concentration of the
low Tg adhesive monomer component B in the low Tg adhesive material
may be any value within a range between any of the minimum and
maximum values noted above.
[0086] According to particular embodiments, the low Tg adhesive
monomer component B may include isobornyylacrylate. According to
yet other embodiments, the low Tg adhesive monomer component B may
consist of isobornyylacrylate. According to particular embodiments,
the low Tg adhesive monomer component B may include acrylic acid.
According to yet other embodiments, the low Tg adhesive monomer
component B may consist of acrylic acid. According to particular
embodiments, the low Tg adhesive monomer component B may include
acryloly morpholine. According to yet other embodiments, the low Tg
adhesive monomer component B may consist of acryloly morpholine.
According to particular embodiments, the low Tg adhesive monomer
component B may include methacrylic acid. According to yet other
embodiments, the low Tg adhesive monomer component B may consist of
methacrylic acid.
[0087] According to still other embodiments, the low Tg adhesive
material may include a low Tg adhesive monomer component C at a
particular concentration. For example, the low Tg adhesive material
may include a low Tg adhesive monomer component C at a
concentration of at least about 3.0 wt. % for a total weight of the
low Tg adhesive material, such as, at least about 3.25 wt. % or at
least about 3.5 wt. % or at least about 3.75 wt. % or at least
about 4.0 wt. %. According to still other embodiments, the low Tg
adhesive material may include a low Tg adhesive monomer component C
at a concentration of not greater than about 6.0 wt. % for a total
weight of the low Tg adhesive material, such as, not greater than
about 5.75 wt. % or not greater than about 5.5 wt. % or not greater
than about 5.25 wt. % or not greater than about 5.0 wt. % or not
greater than about 4.75 wt. % or not greater than about 4.5 wt. %.
It will be appreciated that the concentration of a low Tg adhesive
monomer component C in the low Tg adhesive material may be any
value between any of the minimum and maximum values noted above. It
will be further appreciated that the concentration of a low Tg
adhesive monomer component C in the low Tg adhesive material may be
any value within a range between any of the minimum and maximum
values noted above.
[0088] According to particular embodiments, the low Tg adhesive
monomer component C may include isobornyylacrylate. According to
yet other embodiments, the low Tg adhesive monomer component C may
consist of isobornyylacrylate. According to particular embodiments,
the low Tg adhesive monomer component C may include acrylic acid.
According to yet other embodiments, the low Tg adhesive monomer
component C may consist of acrylic acid. According to particular
embodiments, the low Tg adhesive monomer component C may include
acryloly morpholine. According to yet other embodiments, the low Tg
adhesive monomer component C may consist of acryloly morpholine.
According to particular embodiments, the low Tg adhesive monomer
component C may include methacrylic acid. According to yet other
embodiments, the low Tg adhesive monomer component C may consist of
methacrylic acid.
[0089] According to still other embodiments, the low Tg adhesive
material may include resin of hydrogen rosin at a particular
concentration. For example, the low Tg adhesive material may
include resin of hydrogen rosin at a concentration of at least
about 3.0 wt. % for a total weight of the low Tg adhesive material,
such as, at least about 3.1 wt. % or at least about 3.2 wt. % or at
least about 3.3 wt. % or at least about 3.4 wt. % or at least about
3.5 wt. % or at least about 3.6 wt. % or at least about 3.7 wt. %
or at least about 3.8 wt. % or at least about 3.9 wt. % or at least
about 4.0 wt. % or at least about 4.1 wt. % or at least about 4.2
wt. % or at least about 4.3 wt. % or at least about 4.4 wt. % or at
least about 4.5 wt. % or at least about 4.6 wt. % or at least about
4.7 wt. % or at least about 4.8 wt. % or at least about 4.9 wt. %
or at least about 5.0 wt. % or at least about 5.1 wt. % or at least
about 5.2 wt. % or at least about 5.3 wt. % or at least about 5.4
wt. % or at least about 5.5 wt. %. According to still other
embodiments, the low Tg adhesive material may include resin of
hydrogen rosin at a concentration of not greater than about 6.0 wt.
% for a total weight of the low Tg adhesive material, such as, not
greater than about 5.9 wt. % or not greater than about 5.8 wt. % or
not greater than about 5.7 wt. % or not greater than about 5.6 wt.
%. It will be appreciated that the concentration of resin of
hydrogen rosin in the low Tg adhesive material may be any value
between any of the minimum and maximum values noted above. It will
be further appreciated that the concentration of resin of hydrogen
rosin in the low Tg adhesive material may be any value within a
range between any of the minimum and maximum values noted
above.
[0090] According to still other embodiments, the low Tg adhesive
material may include resin of hydrogen rosin at a particular
concentration. For example, the low Tg adhesive material may
include difunctional acrylate at a concentration of at least about
0.1 wt. % for a total weight of the low Tg adhesive material, such
as, at least about 0.11 wt. % or at least about 0.12 wt. % or at
least about 0.13 wt. % or at least about 0.14 wt. %. According to
still other embodiments, the low Tg adhesive material may include
difunctional acrylate at a concentration of not greater than about
0.2 wt. % for a total weight of the low Tg adhesive material, such
as, not greater than about 0.19 wt. % or not greater than about
0.18 wt. % or not greater than about 0.17 wt. % or not greater than
about 0.16 wt. %. It will be appreciated that the concentration of
difunctional acrylate in the low Tg adhesive material may be any
value between any of the minimum and maximum values noted above. It
will be further appreciated that the concentration of difunctional
acrylate in the low Tg adhesive material may be any value within a
range between any of the minimum and maximum values noted
above.
[0091] According to certain embodiments, an adhesive composite as
described herein can be formed according to particular depositions
methods. In general, forming the adhesive composite includes
providing a substrate as described herein, providing a high Tg
adhesive material as described herein, providing a low Tg adhesive
material as described herein, depositing the high Tg adhesive
material and the low Tg adhesive material as an adhesive layer
overlying the substrate such that the adhesive layer may include at
least a first region of the high Tg adhesive material and a second
region of the low Tg adhesive material. The first region of the
adhesive layer may be co-planar with the second region of the
adhesive layer. Further, forming the adhesive composite may include
curing the adhesive layer deposited on the substrate.
[0092] According to certain embodiments, deposition may include any
deposition method that facilitates depositing the adhesive layer
according to embodiments described herein. For example, depositing
may include coating, physical vapor deposition, sputtering,
magnetron sputtering or even three dimensional printing.
[0093] Many different aspects and embodiments are possible. Some of
those aspects and embodiments are described herein. After reading
this specification, skilled artisans will appreciate that those
aspects and embodiments are only illustrative and do not limit the
scope of the present invention. Embodiments may be in accordance
with any one or more of the embodiments as listed below.
Embodiment 1
[0094] An adhesive composite comprising: a substrate; and an
adhesive layer overlying the substrate, wherein the adhesive layer
comprises at least a first region of a high Tg adhesive material
and a second region of a low Tg adhesive material; wherein the
first region of the adhesive layer is co-planar with the second
region of the adhesive layer; wherein the high Tg adhesive material
comprises a first glass transition temperature Tg1 and the low Tg
adhesive material comprises a second glass transition temperature
Tg2; and wherein Tg1 is greater than Tg2.
Embodiment 2
[0095] An adhesive composite comprising: a substrate; and an
adhesive layer overlying the substrate, wherein the adhesive layer
comprises at least a first region of a high Tg adhesive material
and a second region of a low Tg adhesive material; wherein the
first region of the adhesive layer is co-planar with the second
region of the adhesive layer; wherein the high Tg adhesive material
comprises a complex shear modules G*.sub.(-20)1 as measured at
-20.degree. C. and the low Tg adhesive material comprises a complex
shear modules G*.sub.(-20)2 as measured at -20.degree. C.; and
wherein G*.sub.(-20)1 is greater than G*.sub.(-20)2.
Embodiment 3
[0096] An adhesive composite comprising: a substrate; and an
adhesive layer overlying the substrate, wherein the adhesive layer
comprises at least a first region of a high Tg adhesive material
and a second region of a low Tg adhesive material; wherein the
first region of the adhesive layer is co-planar with the second
region of the adhesive layer; wherein the high Tg adhesive material
comprises a complex shear modules G*.sub.(60)1 as measured at
60.degree. C. and the low Tg adhesive material comprises a complex
shear modules G*.sub.(60)2 as measured at 60.degree. C.; and
wherein G*.sub.(60)1 is greater than G*.sub.(60)2.
Embodiment 4
[0097] An adhesive composite comprising: a substrate; and an
adhesive layer overlying the substrate, wherein the adhesive layer
comprises at least a first region of a high Tg adhesive material
and a second region of a low Tg adhesive material; wherein the
first region of the adhesive layer is co-planar with the second
region of the adhesive layer; wherein the high Tg adhesive material
comprises a peel adhesion PA1 and the low Tg adhesive material
comprises a peel adhesion PA2; wherein PA1 is less than PA2.
Embodiment 5
[0098] An adhesive composite comprising: a substrate; and an
adhesive layer overlying the substrate, wherein the adhesive layer
comprises at least a first region of a high Tg adhesive material
and a second region of a low Tg adhesive material; wherein the
first region of the adhesive layer is co-planar with the second
region of the adhesive layer; and wherein the high Tg adhesive
material comprises a dynamic shear strength DS1 and the low Tg
adhesive material comprises a dynamic shear strength DS2; wherein
DS1 is greater than DS2.
Embodiment 6
[0099] An adhesive composite comprising: a substrate; and an
adhesive layer overlying the substrate, wherein the adhesive layer
comprises at least a first region of a high Tg adhesive material
and a second region of a low Tg adhesive material; wherein the
first region of the adhesive layer is co-planar with the second
region of the adhesive layer; wherein the high Tg adhesive material
comprises: a high Tg adhesive monomer component A at a
concentration of at least about 79 wt. % and not greater than about
90 wt. % for a total weight of the high Tg adhesive material; a
high Tg adhesive monomer component B at a concentration of at least
about 7 wt. % and not greater than about 13 wt. % for a total
weight of the high Tg adhesive material; a high Tg adhesive monomer
component C at a concentration of at least about 5 wt. % and not
greater than about 8 wt. % for a total weight of the high Tg
adhesive material; and difunctional acrylate at a concentration of
not greater than about 0.2 wt. % for a total weight of the high Tg
adhesive material; wherein the low Tg adhesive material comprises:
a low Tg adhesive monomer component A at a concentration of at
least about 88.0 wt. % and not greater than about 92.0 wt. % for a
total weight of the low Tg adhesive material; a low Tg adhesive
monomer component B at a concentration of at least about 3.5 wt. %
and not greater than about 7 wt. % for a total weight of the low Tg
adhesive material; a low Tg adhesive monomer component C at a
concentration of at least about 3 wt. % and not greater than about
6 wt. % for a total weight of the low Tg adhesive material; resin
of hydrogen rosin at a concentration of at least about 3.0 wt. %
and not greater than about 7 wt. % for a total weight of the low Tg
adhesive material; and difunctional acrylate at a concentration of
at least about 0.1 wt. % and not greater than about 0.2 wt. % for a
total weight of the low Tg adhesive material.
Embodiment 7
[0100] The adhesive composite of any one of the previous
embodiments, wherein the adhesive composite comprises a damping
factor of not greater than about 2.4% over a temperature range of
between -20.degree. C. and 60.degree. C. as measured according to
industrial standard SAE J 3001, not greater than about 2.3% or not
greater than about 2.2% or not greater than about 2.1% or not
greater than about 2.0%.
Embodiment 8
[0101] The adhesive composite of any one of the previous
embodiments, wherein Tg1 is at least about 0.5.degree. C. or at
least about 0.6.degree. C. or at least about 0.7.degree. C. or at
least about 0.8.degree. C. or at least about 0.9.degree. C. or at
least about 1.0.degree. C. or at least about 1.1.degree. C. or at
least about 1.2.degree. C. or at least about 1.3.degree. C. or at
least about 1.4.degree. C. or at least about 1.5.degree. C. or at
least about 1.6.degree. C. or at least about 1.7.degree. C. or at
least about 1.8.degree. C. or at least about 1.9.degree. C. or at
least about 2.0.degree. C. or at least about 2.5.degree. C. or at
least about 3.0.degree. C.
Embodiment 9
[0102] The adhesive composite of any one of the previous
embodiments, wherein Tg1 is not greater than about 8.degree. C. or
not greater than about 7.9.degree. C. or not greater than about
7.8.degree. C. or not greater than about 7.7.degree. C. or not
greater than about 7.6.degree. C. or not greater than about
7.5.degree. C. or not greater than about 7.4.degree. C. or not
greater than about 7.3.degree. C. or not greater than about
7.2.degree. C. or not greater than about 7.1.degree. C. or not
greater than about 7.0.degree. C. or not greater than about
6.9.degree. C. or not greater than about 6.8.degree. C. or not
greater than about 6.7.degree. C. or not greater than about
6.6.degree. C. or not greater than about 6.5.degree. C. or not
greater than about 6.4.degree. C. or not greater than about
6.3.degree. C. or not greater than about 6.2.degree. C. or not
greater than about 6.1.degree. C. or not greater than about
6.0.degree. C. or not greater than about 5.5.degree. C. or not
greater than about 5.0.degree. C.
Embodiment 10
[0103] The adhesive composite of any one of the previous
embodiments, wherein Tg2 is at least about -40.degree. C. or at
least about -39.5.degree. C. or at least about -39.degree. C. or at
least about -38.5.degree. C. or at least about -38.degree. C. or at
least about -37.5.degree. C. or at least about -37.degree. C. or at
least about -36.5.degree. C. or at least about -36.degree. C.
Embodiment 11
[0104] The adhesive composite of any one of the previous
embodiments, wherein Tg2 is not greater than about -22.degree. C.
or not greater than about -22.5.degree. C. or not greater than
about -23.degree. C. or not greater than about -23.5.degree. C. or
not greater than about -24.degree. C. or not greater than about
-24.5.degree. C. or not greater than about -25.degree. C. or not
greater than about -25.5.degree. C. or not greater than about
-26.degree. C. or not greater than about -26.5.degree. C. or not
greater than about -27.degree. C. or not greater than about
-27.5.degree. C. or not greater than about -28.degree. C. or not
greater than about -28.5.degree. C. or not greater than about
-29.degree. C. or not greater than about -29.5.degree. C. or not
greater than about -30.degree. C. or not greater than about
-30.5.degree. C. or not greater than about -31.degree. C. or not
greater than about -31.5.degree. C. or not greater than about
-32.degree. C. or not greater than about -32.5.degree. C. or not
greater than about -33.degree. C. or not greater than about
-33.5.degree. C. or not greater than about -34.degree. C.
Embodiment 12
[0105] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(-20)1 is at least about 4.5 MPa or at
least about 5.0 MPa or at least about 5.5 MPa or at least about 6.0
MPa or at least about 6.5 MPa or at least about 7 MPa.
Embodiment 13
[0106] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(-20)1 is not greater than about 10 MPa
or not greater than about 9.5 MPa or not greater than about 9.0 MPa
or not greater than about 8.5 MPa or not greater than about 8.0
MPa.
Embodiment 14
[0107] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(-20)2 is at least about 0.2 MPa or at
least about 0.25 MPa or at least about 0.3 MPa or at least about
0.35 MPa or at least about 0.4 MPa.
Embodiment 15
[0108] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(-20)2 is not greater than about 1.5
MPa or not greater than about 1.4 MPa or not greater than about 1.3
MPa or not greater than about 1.2 MPa or not greater than about 1.1
MPa or not greater than about 1.0 MPa or not greater than about 0.9
MPa or not greater than about 0.8 MPa or not greater than about 0.7
MPa or not greater than about 0.6 MPa.
Embodiment 16
[0109] The adhesive composite of any one of the previous
embodiments, wherein the ratio of G*.sub.(-20)1 to G*.sub.(-20)2 is
at least about 3 or at least about 4 or at least about 5 or at
least about 6 or at least about 7 or at least about 8 or at least
about 9 or at least about 10 or at least about 11 or at least about
12 or at least about 12.
Embodiment 17
[0110] The adhesive composite of any one of the previous
embodiments, wherein the ratio of G*.sub.(-20)1 to G*.sub.(-20)2 is
not greater than about 50 or not greater than about 48 or not
greater than about 45 or not greater than about 43 or not greater
than about 40 or not greater than about 38 or not greater than
about 35 or not greater than about 33 or not greater than about 30
or not greater than about 29 or not greater than about 28 or not
greater than about 27 or not greater than about 26 or not greater
than about 25 or not greater than about 24 or not greater than
about 23 or not greater than about 22 or not greater than about 21
or not greater than about 20.
Embodiment 18
[0111] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(60)1 is at least about 0.01 MPa or at
least about 0.011 MPa or at least about 0.012 MPa or at least about
0.013 MPa or at least about 0.014 MPa or at least about 0.015 MPa
or at least about 0.016 MPa or at least about 0.017 MPa or at least
about 0.018 MPa or at least about 0.019 MPa or at least about 0.02
MPa.
Embodiment 19
[0112] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(60)1 is not greater than about 0.045
MPa or not greater than about 0.04 MPa or not greater than about
0.035 MPa or not greater than about 0.03 MPa or not greater than
about 0.025 MPa.
Embodiment 20
[0113] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(60)2 is at least about 0.007 MPa or at
least about 0.0075 MPa or at least about 0.008 MPa or at least
about 0.0085 MPa or at least about 0.009 MPa.
Embodiment 21
[0114] The adhesive composite of any one of the previous
embodiments, wherein G*.sub.(60)2 is not greater than about 0.025
MPa or not greater than about 0.023 MPa or not greater than about
0.020 MPa or not greater than about 0.018 MPa or not greater than
about 0.015 MPa or not greater than about 0.013 MPa or not greater
than about 0.01 MPa.
Embodiment 22
[0115] The adhesive composite of any one of the previous
embodiments, wherein the ratio of G*.sub.(60)1 to G*.sub.(60)2 is
at least about 0.4 or at least about 0.5 or at least about 0.6 or
at least about 0.7 or at least about 0.8 or at least about 0.9 or
at least about 1.0 or at least about 1.1 or at least about 1.2 or
at least about 1.3 or at least about 1.4 or at least about 1.5 or
at least about 1.6 or at least about 1.7 or at least about 1.8 or
at least about 1.9 or at least about 2.0.
Embodiment 23
[0116] The adhesive composite of any one of the previous
embodiments, wherein the ratio of G*.sub.(60)1 to G*.sub.(60)2 is
not greater than about 6.4 or not greater than about 6.2 or not
greater than about 6.0 or not greater than about 5.8 or not greater
than about 5.6 or not greater than about 5.4 or not greater than
about 5.2 or not greater than about 5.0 or not greater than about
4.8 or not greater than about 4.6 or not greater than about 4.4 or
not greater than about 4.2 or not greater than about 4.0 or not
greater than about 3.8 or not greater than about 3.6 or not greater
than about 3.4 or not greater than about 3.2 or not greater than
about 3.0 or not greater than about 2.8.
Embodiment 24
[0117] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20)1 as measured at -20.degree. C. of at least about
0.42 or at least about 0.43 or at least about 0.44 or at least
about 0.45 or at least about 0.46.
Embodiment 25
[0118] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20)1 as measured at -20.degree. C. of not greater
than about 0.52 or not greater than about 0.51 or not greater than
about 0.50 or not greater than about 0.49 or not greater than about
0.48.
Embodiment 26
[0119] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20)2 as measured at -20.degree. C. of at least about
1.10 or at least about 1.11 or at least about 1.12 or at least
about 1.13.
Embodiment 27
[0120] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20)2 as measured at -20.degree. C. of not greater
than about 1.31 or not greater than about 1.30 or not greater than
about 1.29 or not greater than about 1.28 or not greater than about
1.27 or not greater than about 1.26 or not greater than about 1.25
or not greater than about 1.24 or not greater than about 1.23 or
not greater than about 1.21 or not greater than about 1.20 or not
greater than about 1.19 or not greater than about 1.18 or not
greater than about 1.17 or not greater than about 1.16 or not
greater than about 1.15 or not greater than about 1.14.
Embodiment 28
[0121] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20) combo value C-tan .delta..sub.(-20) of at least
about 0.75, where C-tan .delta..sub.(-20)=(tan
.delta..sub.(-20)1+tan .delta..sub.(-20)2)/2, or at least about
0.76 or at least about 0.77 or at least about 0.78.
Embodiment 29
[0122] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20) combo value C-tan .delta..sub.(-20) of not
greater than about 0.92, where C-tan .delta..sub.(-20)=(tan
.delta..sub.(-20)1+tan .delta..sub.(-20)2)/2, or not greater than
about 0.91 or not greater than about 0.91 or not greater than about
0.90 or not greater than about 89 or not greater than about 0.88 or
not greater than about 0.87 or not greater than about 0.86 or not
greater than about 0.85 or not greater than about 0.84 or not
greater than about 0.83 or not greater than about 0.82 or not
greater than about 0.81.
Embodiment 30
[0123] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20)1 as measured at 20.degree. C. of at least about
0.85 or at least about 0.86 or at least about 0.87 or at least
about 0.88 or at least about 0.89 or at least about 0.90 or at
least about 0.91 or at least about 0.92 or at least about 0.93 or
at least about 0.94.
Embodiment 31
[0124] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20)1 as measured at 20.degree. C. of not greater than
about 0.99 or not greater than about 0.98 or not greater than about
0.97 or not greater than about 0.96.
Embodiment 32
[0125] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20)2 as measured at 20.degree. C. of at least about
0.71 or at least about 0.715 or at least about 0.72.
Embodiment 33
[0126] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(20)2 as measured at 20.degree. C. of not greater than
about 0.87 or not greater than about 0.86 or not greater than about
0.85 or not greater than about 0.84 or not greater than about 0.83
or not greater than about 0.82 or not greater than about 0.81 or
not greater than about 0.80 or not greater than about 0.79 or not
greater than about 0.78 or not greater than about 0.76 or not
greater than about 0.75 or not greater than about 0.74.
Embodiment 34
[0127] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20) combo value C-tan .delta..sub.(-20) of at least
about 0.78, where C-tan .delta..sub.(20)=(tan .delta..sub.(20)1+tan
.delta..sub.(20)2)/2, or at least about 0.79 or at least about 0.80
or at least about 0.81 or at least about 0.82 or at least about
0.83.
Embodiment 35
[0128] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(-20) combo value C-tan .delta..sub.(-20) of not
greater than about 0.93, where C-tan .delta..sub.(20)=(tan
.delta..sub.(20)1+tan .delta..sub.(20)2)/2, or not greater than
about 0.92 or not greater than about 0.91 or not greater than about
0.90 or not greater than about 89 or not greater than about 0.88 or
not greater than about 0.87 or not greater than about 0.86 or not
greater than about 0.85.
Embodiment 36
[0129] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(60)1 as measured at 60.degree. C. of at least about
0.3 or at least about 0.33 or at least about 0.35 or at least about
0.38 or at least about 0.40 or at least about 0.41 or at least
about 0.42.
Embodiment 37
[0130] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(60)1 as measured at 60.degree. C. of not greater than
about 0.46 or not greater than about 0.45 or not greater than about
0.44 or not greater than about 0.43.
Embodiment 38
[0131] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(60)2 as measured at 60.degree. C. of at least about
0.54 or at least about 0.55 or at least about 0.56 or at least
about 0.57 or at least about 0.58 or at least about 0.59 or at
least about 0.6.
Embodiment 39
[0132] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(60)2 as measured at 60.degree. C. of not greater than
about 0.87 or not greater than about 0.85 or not greater than about
0.82 or not greater than about 0.80 or not greater than about 0.77
or not greater than about 0.75 or not greater than about 0.72 or
not greater than about 0.70 or not greater than about 0.67 or not
greater than about 0.65 or not greater than about 0.63.
Embodiment 40
[0133] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(60) combo value C-tan .delta..sub.(60) of at least
about 0.42, where C-tan .delta..sub.(60)=(tan .delta..sub.(60)1+tan
.delta..sub.(60)2)/2, or at least about 0.43 or at least about 0.44
or at least about 0.45 or at least about 0.46 or at least about
0.47 or at least about 0.48 or at least about 0.49 or at least
about 0.50 or at least about 0.51.
Embodiment 41
[0134] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a tan
.delta..sub.(60) combo value C-tan .delta..sub.(60) of not greater
than about 0.66, where C-tan .delta..sub.(60)=(tan
.delta..sub.(60)1+tan .delta..sub.(60)2)/2, or not greater than
about 0.65 or not greater than about 0.64 or not greater than about
0.63 or not greater than about 0.62 or not greater than about 0.61
or not greater than about 0.60 or not greater than about 0.59 or
not greater than about 0.58 or not greater than about 0.57 or not
greater than about 0.56 or not greater than about 0.55 or not
greater than about 0.54 or not greater than about 0.53.
Embodiment 42
[0135] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a stainless steel
peel strength SS.sub.PS1 of at least about 8.4 N/cm or at least
about 8.5 N/cm or at least about 8.6 N/cm or at least about 8.7
N/cm or at least about 8.8 N/cm or at least about 8.9 N/cm or at
least about 9.0 N/cm or at least about 9.1 N/cm or at least about
9.2 N/cm or at least about 9.3 N/cm or at least about 9.4 N/cm or
at least about 9.5 N/cm or at least about 9.6 N/cm or at least
about 9.7 N/cm or at least about 9.8 N/cm or at least about 9.9
N/cm or at least about 10.0 N/cm.
Embodiment 43
[0136] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a stainless steel
peel strength SS.sub.PS1 of not greater than about 12 N/cm or not
greater than about 11.9 N/cm or not greater than about 11.8 N/cm or
not greater than about 11.7 N/cm or not greater than about 11.6
N/cm or not greater than about 11.5 N/cm or not greater than about
11.4 N/cm or not greater than about 11.3 N/cm or not greater than
about 11.2 N/cm or not greater than about 11.1 N/cm or not greater
than about 11.0 N/cm or not greater than about 10.9 N/cm or not
greater than about 10.8 N/cm or not greater than about 10.7 N/cm or
not greater than about 10.6 N/cm or not greater than about 10.5
N/cm.
Embodiment 44
[0137] The adhesive composite of any one of the previous
embodiments, wherein the second adhesive comprises a stainless
steel peel strength SS.sub.PS2 of at least about 7.6 N/cm or at
least about 7.7 N/cm or at least about 7.8 N/cm or at least about
7.9 N/cm or at least about 8.0 N/cm or at least about 8.1 N/cm or
at least about 8.2 N/cm or at least about 8.3 N/cm or at least
about 8.4 N/cm or at least about 8.5 N/cm.
Embodiment 45
[0138] The adhesive composite of any one of the previous
embodiments, wherein the second adhesive comprises a stainless
steel peel strength SS.sub.PS2 of not greater than about 9.6 N/cm
or not greater than about 9.5 N/cm or not greater than about 9.4
N/cm or not greater than about 9.3 N/cm or not greater than about
9.2 N/cm or not greater than about 9.1 N/cm or not greater than
about 9.0 N/cm.
Embodiment 46
[0139] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a MSE peel
strength MSE.sub.PS1 of at least about 6.4 N/cm or at least about
6.5 N/cm or at least about 6.6 N/cm or at least about 6.7 N/cm or
at least about 6.8 N/cm or at least about 6.9 N/cm or at least
about 7.0 N/cm.
Embodiment 47
[0140] The adhesive composite of any one of the previous
embodiments, wherein the first adhesive comprises a MSE peel
strength MSE.sub.PS1 of not greater than about 8.8 N/cm or not
greater than about 8.7 N/cm or not greater than about 8.6 N/cm or
not greater than about 8.5 N/cm or not greater than about 8.4 N/cm
or not greater than about 8.3 N/cm or not greater than about 8.2
N/cm or not greater than about 8.1 N/cm or not greater than about
8.0 N/cm or not greater than about 7.9 N/cm or not greater than
about 7.8 N/cm or not greater than about 7.7 N/cm or not greater
than about 7.6 N/cm or not greater than about 7.5 N/cm.
Embodiment 48
[0141] The adhesive composite of any one of the previous
embodiments, wherein the second adhesive comprises a MSE peel
strength MSE.sub.PS2 of at least about 7.6 N/cm or at least about
7.7 N/cm or at least about 7.8 N/cm or at least about 7.9 N/cm or
at least about 8.0 N/cm.
Embodiment 49
[0142] The adhesive composite of any one of the previous
embodiments, wherein the second adhesive comprises a MSE peel
strength MSE.sub.PS2 of not greater than about 8.8 N/cm or not
greater than about 8.7 N/cm or not greater than about 8.6 N/cm or
not greater than about 8.5 N/cm or not greater than about 8.4 N/cm
or not greater than about 8.3 N/cm or not greater than about 8.2
N/cm.
Embodiment 50
[0143] The adhesive composite of any one of the previous
embodiments, wherein the first region comprises a plurality of
zones of the high Tg adhesive material; wherein the second region
comprises a plurality of zones of the low Tg adhesive material.
Embodiment 51
[0144] The adhesive composite of embodiment 50, wherein plurality
of zones of the high Tg adhesive material and the plurality of
zones of the low Tg adhesive material are arranged on the substrate
in a repeating pattern.
Embodiment 52
[0145] The adhesive composite of embodiment 50, wherein each zone
of the high Tg adhesive material is substantially contiguous with a
zone of the low Tg adhesive material.
Embodiment 53
[0146] The adhesive composite of embodiment 51, wherein a portion
of the substrate covered by the high Tg adhesive material is equal
to a portion of the substrate covered by the low Tg adhesive
material.
Embodiment 54
[0147] The adhesive composite of embodiment 51, wherein the
repeating pattern of the plurality of zones of the high Tg adhesive
material and the plurality of zones of the low Tg adhesive material
is a checkered pattern of alternating squares of the high Tg
adhesive material and the low Tg adhesive material.
Embodiment 55
[0148] The adhesive composite of embodiment 51, wherein the
repeating pattern of the plurality of zones of the high Tg adhesive
material and the plurality of zones of the low Tg adhesive material
is a pattern of alternating dots of the high Tg adhesive material
and the low Tg adhesive material.
Embodiment 56
[0149] The adhesive composite of embodiment 51, wherein the
repeating pattern of the plurality of zones of the high Tg adhesive
material and the plurality of zones of the low Tg adhesive material
is a pattern of alternating strips of the high Tg adhesive material
and the low Tg adhesive material.
Embodiment 57
[0150] The adhesive composite of embodiment 56, wherein the
alternating strips of the high Tg adhesive material and the low Tg
adhesive material have substantially the same width.
Embodiment 58
[0151] The adhesive composite of any one of the previous
embodiments, wherein each of the alternating strips are parallel
with each other.
Embodiment 59
[0152] The adhesive composite of any one of the previous
embodiments, wherein each of the alternating strips have a width of
at least about 3 mm or at least about 3.1 mm or at least about 3.2
mm or at least about 3.3 mm or at least about 3.4 mm or at least
about 3.5 mm or at least about 3.6 mm or at least about 3.7 mm or
at least about 3.8 mm or at least about 4.0 mm.
Embodiment 60
[0153] The adhesive composite of any one of the previous
embodiments, wherein each of the alternating strips have a width of
not greater than about 7 mm or not greater than about 6.9 mm or not
greater than about 6.8 mm or not greater than about 6.7 mm or not
greater than about 6.6 mm or not greater than about 6.5 mm or not
greater than about 6.4 mm or not greater than about 6.3 mm or not
greater than about 6.2 mm or not greater than about 6.1 mm or not
greater than about 6.0 mm or not greater than about 5.9 mm or not
greater than about 5.8 mm or not greater than about 5.7 mm or not
greater than about 5.6 mm or not greater than about 5.5 mm.
EXAMPLES
[0154] The concepts described herein will be further described in
the following Examples, which do not limit the scope of the
invention described in the claims.
Example 1
[0155] A first sample composite S1 was formed by depositing a high
Tg adhesive material and a low Tg adhesive material in a pattern of
alternating stipes on a substrate. Deposition of the sample
composite was carried out using a coating process with a comb blade
deposition head. The composition of the high Tg adhesive material
and the composition of the low Tg adhesive material are provided in
Table 1 below.
TABLE-US-00001 TABLE 1 High Tg Adhesive Low Tg Adhesive Material
Composition Material Raw 2-EHA 83.95 Raw 2-EHA 88.95 Material IBOA
10.0 Material IBOA 5.0 (wt. % of Acrylic Acid 6.0 (wt. % of Acrylic
Acid 6.0 total raw Irgacure 2022 0.05 total raw Irgacure 2022 0.05
material) material) Syrup Raw Polymer 94.10 Syrup Raw Polymer 93.3
Mixture 2-EHA 0.90 Mixture HDDA 0.1 (wt. % of HDDA 0.10 (wt. % of
Foral 85 E 6.0 total Cymel 303 0.30 total Irgacure 2100 0.6 syrup
Acrylic Acid 4.00 syrup mixture) Irgacure 651 0.60 mixture)
[0156] Measured characteristics of the high Tg adhesive material
and the low Tg adhesive material are provided in Table 2 below.
TABLE-US-00002 TABLE 2 High Tg Adhesive High Tg Adhesive Material
Composition Material Composition Tg 4.5.degree. C. Tg -35.degree.
C. G* @ -20.degree. C. 7.1 MPa G* @ -20.degree. C. 0.55 MPa G* @
20.degree. C. 0.098 MPa G* @ 20.degree. C. 0.028 MPa G* @
60.degree. C. 0.02 MPa G* @ 60.degree. C. 0.011 MPa tan.delta. @
-20.degree. C. 0.47 tan.delta. @ -20.degree. C. 1.16 tan.delta. @
20.degree. C. 0.95 tan.delta. @ 20.degree. C. 0.73 tan.delta. @
60.degree. C. 0.42 tan.delta. @ 60.degree. C. 0.91 Peel Steel 10.4
N/cm Peel Steel 8.8 N/cm Peel PVC 7.2 N/cm Peel PVC 9.7 N/cm
Dynamic Shear 1.35 MPa
[0157] The raw material compositions for each adhesive material
were combined using UV initiated prepolymerisation. The polymerized
raw material mixtures were then added to the additional components
to form the syrup. After coating of the adhesive materials onto the
substrate to form the adhesive layer of the composite, the adhesive
composite was cured by UV-light in a coating line and wound on
roll.
[0158] Measured characteristics of the sample composite S1 provided
in Table 3 below.
TABLE-US-00003 TABLE 3 Sample Composite S1 G*(High Tg)/G*(Low Tg)
(-20.degree. C.) 12.9 G*(High Tg)/G*(Low Tg) (20.degree. C.) 3.5
G*(High Tg)/G*(Low Tg) (60.degree. C.) 1.8 (tan.delta. (low Tg) +
tan.delta. (high Tg))/2) (-20.degree. C.) 0.82 (tan.delta. (low Tg)
+ tan.delta. (high Tg))/2) (20.degree. C.) 0.84 (tan.delta. (low
Tg) + tan.delta. (high Tg))/2)) (60.degree. C.) 0.67
Example 2
[0159] A second sample composite S2 was formed by depositing a high
Tg adhesive material and a low Tg adhesive material in a pattern of
alternating stipes on a substrate. Deposition of the sample
composite was carried out using a coating process with a comb blade
deposition head. The composition of the high Tg adhesive material
and the composition of the low Tg adhesive material are provided in
Table 4 below.
TABLE-US-00004 TABLE 4 High Tg Adhesive Low Tg Adhesive Material
Composition Material Raw 2-EHA 83.95 Raw 2-EHA 89.45 Material IBOA
10.40 Material IBOA 6.8 (wt. % of Acrylic Acid 5.60 (wt. % of
Acrylic Acid 3.7 total raw Irgacure 2022 0.05 total raw Irgacure
2022 0.05 material) material) Syrup Raw Polymer 94.10 Syrup Raw
Polymer 94.9 Mixture 2-EHA 0.90 Mixture HDDA 0.2 (wt. % of HDDA
0.10 (wt. % of Foral 85 E 4.3 total Cymel 303 0.30 total Irgacure
2100 0.6 syrup Acrylic Acid 4.00 syrup mixture) Irgacure 651 0.60
mixture)
[0160] Measured characteristics of the high Tg adhesive material
and the low Tg adhesive material are provided in Table 5 below.
TABLE-US-00005 TABLE 5 High Tg Adhesive High Tg Adhesive Material
Composition Material Composition Tg 3.degree. C. Tg -36.degree. C.
G* @ -20.degree. C. 6.7 MPa G* @ -20.degree. C. 1.0 MPa G* @
20.degree. C. 0.085 MPa G* @ 20.degree. C. 0.035 MPa G* @
60.degree. C. 0.02 MPa G* @ 60.degree. C. 0.009 MPa tan.delta. @
-20.degree. C. 0.48 tan.delta. @ -20.degree. C. 1.14 tan.delta. @
20.degree. C. 0.93 tan.delta. @ 20.degree. C. 0.7 tan.delta. @
60.degree. C. 0.44 tan.delta. @ 60.degree. C. 0.59 Peel Steel 10.0
N/cm Peel Steel 7.3 N/cm Peel PVC 6.4 N/cm Peel PVC 7.0 N/cm
Dynamic Shear 1.3 MPa
[0161] The raw material compositions for each adhesive material
were combined using UV initiated prepolymerisation. The polymerized
raw material mixtures were then added to the additional components
to form the syrup. After coating of the adhesive materials onto the
substrate to form the adhesive layer of the composite, the adhesive
composite was cured by UV-light in a coating line and wound on
roll.
[0162] Measured characteristics of the sample composite S1 provided
in Table 6 below.
TABLE-US-00006 TABLE 6 Sample Composite S2 G*(High Tg)/G*(Low Tg)
(-20.degree. C.) 6.7 G*(High Tg)/G*(Low Tg) (20.degree. C.) 2.43
G*(High Tg)/G*(Low Tg) (60.degree. C.) 2.2 (tan.delta. (low Tg) +
tan.delta. (high Tg))/2) (-20.degree. C.) 0.81 (tan.delta. (low Tg)
+ tan.delta. (high Tg))/2) (20.degree. C.) 0.82 (tan.delta. (low
Tg) + tan.delta. (high Tg))/2)) (60.degree. C.) 0.52
Example 3
[0163] A second sample composite S3 was formed by depositing a high
Tg adhesive material and a low Tg adhesive material in a pattern of
alternating stipes on a substrate. Deposition of the sample
composite was carried out using a coating process with a comb blade
deposition head. The composition of the high Tg adhesive material
and the composition of the low Tg adhesive material are provided in
Table 7 below.
TABLE-US-00007 TABLE 7 High Tg Adhesive Low Tg Adhesive Material
Composition Material Raw 2-EHA 82.35 Raw 2-EHA 91.95 Material IBOA
11.70 Material IBOA 4.9 (wt. % of Acrylic Acid 5.90 (wt. % of
Acrylic Acid 3.1 total raw Irgacure 2022 0.05 total raw Irgacure
2022 0.05 material) material) Syrup Raw Polymer 94.10 Syrup Raw
Polymer 95.21 Mixture 2-EHA 0.90 Mixture HDDA 0.19 (wt. % of HDDA
0.10 (wt. % of Foral 85 E 4 total Cymel 303 0.30 total Irgacure
2100 0.6 syrup Acrylic Acid 4.00 syrup mixture) Irgacure 651 0.60
mixture)
[0164] Measured characteristics of the high Tg adhesive material
and the low Tg adhesive material are provided in Table 8 below.
TABLE-US-00008 TABLE 8 High Tg Adhesive High Tg Adhesive Material
Composition Material Composition Tg 5.degree. C. Tg -34.degree. C.
G* @ -20.degree. C. 8.7 MPa G* @ -20.degree. C. 0.3 MPa G* @
20.degree. C. 0.09 MPa G* @ 20.degree. C. 0.037 MPa G* @ 60.degree.
C. 0.02 MPa G* @ 60.degree. C. 0.011 MPa tan.delta. @ -20.degree.
C. 0.46 tan.delta. @ -20.degree. C. 1.11 tan.delta. @ 20.degree. C.
0.96 tan.delta. @ 20.degree. C. 0.69 tan.delta. @ 60.degree. C.
0.44 tan.delta. @ 60.degree. C. 0.57 Peel Steel 10.0 N/cm Peel
Steel 7.6 N/cm Peel PVC 6.8 N/cm Peel PVC 8.0 N/cm Dynamic Shear
1.4 MPa
[0165] The raw material compositions for each adhesive material
were combined using UV initiated prepolymerisation. The polymerized
raw material mixtures were then added to the additional components
to form the syrup. After coating of the adhesive materials onto the
substrate to form the adhesive layer of the composite, the adhesive
composite was cured by UV-light in a coating line and wound on
roll.
[0166] Measured characteristics of the sample composite S3 provided
in Table 9 below.
TABLE-US-00009 TABLE 9 Sample Composite S3 G*(High Tg)/G*(Low Tg)
(-20.degree. C.) 29.0 G*(High Tg)/G*(Low Tg) (20.degree. C.) 2.43
G*(High Tg)/G*(Low Tg) (60.degree. C.) 1.8 (tan.delta. (low Tg) +
tan.delta. (high Tg))/2) (-20.degree. C.) 0.79 (tan.delta. (low Tg)
+ tan.delta. (high Tg))/2) (20.degree. C.) 0.83 (tan.delta. (low
Tg) + tan.delta. (high Tg))/2)) (60.degree. C.) 0.51
Example 4
[0167] A second sample composite S4 was formed by depositing a high
Tg adhesive material and a low Tg adhesive material in a pattern of
alternating stipes on a substrate. Deposition of the sample
composite was carried out using a coating process with a comb blade
deposition head. The composition of the high Tg adhesive material
and the composition of the low Tg adhesive material are provided in
Table 10 below.
TABLE-US-00010 TABLE 10 High Tg Adhesive Low Tg Adhesive Material
Composition Material Raw 2-EHA 87.65 Raw 2-EHA 92.95 Material IBOA
7 Material IBOA 3.5 (wt. % of Acrylic Acid 5.3 (wt. % of Acrylic
Acid 3.5 total raw Irgacure 2022 0.05 total raw Irgacure 2022 0.05
material) material) Syrup Raw Polymer 94.10 Syrup Raw Polymer 95.21
Mixture 2-EHA 0.90 Mixture HDDA 0.11 (wt. % of HDDA 0.10 (wt. % of
Foral 85 E 4.8 total Cymel 303 0.30 total Irgacure 2100 0.6 syrup
Acrylic Acid 4.00 syrup mixture) Irgacure 651 0.60 mixture)
[0168] Measured characteristics of the high Tg adhesive material
and the low Tg adhesive material are provided in Table 11
below.
TABLE-US-00011 TABLE 11 High Tg Adhesive High Tg Adhesive Material
Composition Material Composition Tg -0.5.degree. C. Tg -40.degree.
C. G* @ -20.degree. C. 5.4 MPa G* @ -20.degree. C. 0.25 MPa G* @
20.degree. C. 0.085 MPa G* @ 20.degree. C. 0.027 MPa G* @
60.degree. C. 0.019 MPa G* @ 60.degree. C. 0.005 MPa tan.delta. @
-20.degree. C. 0.52 tan.delta. @ -20.degree. C. 1.29 tan.delta. @
20.degree. C. 0.85 tan.delta. @ 20.degree. C. 0.72 tan.delta. @
60.degree. C. 0.43 tan.delta. @ 60.degree. C. 0.87 Peel Steel 10.0
N/cm Peel Steel 9.6 N/cm Peel PVC 7.0 N/cm Peel PVC 9.6 N/cm
Dynamic Shear 1.4 MPa
[0169] The raw material compositions for each adhesive material
were combined using UV initiated prepolymerisation. The polymerized
raw material mixtures were then added to the additional components
to form the syrup. After coating of the adhesive materials onto the
substrate to form the adhesive layer of the composite, the adhesive
composite was cured by UV-light in a coating line and wound on
roll.
[0170] Measured characteristics of the sample composite S4 provided
in Table 12 below.
TABLE-US-00012 TABLE 12 Sample Composite S4 G*(High Tg)/G*(Low Tg)
(-20.degree. C.) 21.6 G*(High Tg)/G*(Low Tg) (20.degree. C.) 3.14
G*(High Tg)/G*(Low Tg) (60.degree. C.) 3.8 (tan.delta. (low Tg) +
tan.delta. (high Tg))/2) (-20.degree. C.) 0.91 (tan.delta. (low Tg)
+ tan.delta. (high Tg))/2) (20.degree. C.) 0.79 (tan.delta. (low
Tg) + tan.delta. (high Tg))/2)) (60.degree. C.) 0.65
Example 5
[0171] A second sample composite S5 was formed by depositing a high
Tg adhesive material and a low Tg adhesive material in a pattern of
alternating stipes on a substrate. Deposition of the sample
composite was carried out using a coating process with a comb blade
deposition head. The composition of the high Tg adhesive material
and the composition of the low Tg adhesive material are provided in
Table 13 below.
TABLE-US-00013 TABLE 13 High Tg Adhesive Low Tg Adhesive Material
Composition Material Raw 2-EHA 81.95 Raw 2-EHA 91.35 Material IBOA
11.1 Material IBOA 3 (wt. % of Acrylic Acid 6.9 (wt. % of Acrylic
Acid 5.6 total raw Irgacure 2022 0.05 total raw Irgacure 2022 0.05
material) material) Syrup Raw Polymer 94.10 Syrup Raw Polymer 95.21
Mixture 2-EHA 0.90 Mixture HDDA 0.2 (wt. % of HDDA 0.10 (wt. % of
Foral 85 E 4 total Cymel 303 0.30 total Irgacure 2100 0.6 syrup
Acrylic Acid 4.00 syrup mixture) Irgacure 651 0.60 mixture)
[0172] Measured characteristics of the high Tg adhesive material
and the low Tg adhesive material are provided in Table 14
below.
TABLE-US-00014 TABLE 14 High Tg Adhesive High Tg Adhesive Material
Composition Material Composition Tg 7.7.degree. C. Tg -29.degree.
C. G* @ -20.degree. C. 10 MPa G* @ -20.degree. C. 1.1 MPa G* @
20.degree. C. 0.12 MPa G* @ 20.degree. C. 0.05 MPa G* @ 60.degree.
C. 0.023 MPa G* @ 60.degree. C. 0.012 MPa tan.delta. @ -20.degree.
C. 0.42 tan.delta. @ -20.degree. C. 1.13 tan.delta. @ 20.degree. C.
1.02 tan.delta. @ 20.degree. C. 0.73 tan.delta. @ 60.degree. C.
0.44 tan.delta. @ 60.degree. C. 0.54 Peel Steel 10.8 N/cm Peel
Steel 9.0 N/cm Peel PVC 6.7 N/cm Peel PVC 8.4 N/cm Dynamic Shear
1.4 MPa
[0173] The raw material compositions for each adhesive material
were combined using UV initiated prepolymerisation. The polymerized
raw material mixtures were then added to the additional components
to form the syrup. After coating of the adhesive materials onto the
substrate to form the adhesive layer of the composite, the adhesive
composite was cured by UV-light in a coating line and wound on
roll.
[0174] Measured characteristics of the sample composite S5 provided
in Table 15 below.
TABLE-US-00015 TABLE 15 Sample Composite S5 G*(High Tg)/G*(Low Tg)
(-20.degree. C.) 7.0 G*(High Tg)/G*(Low Tg) (20.degree. C.) 2.4
G*(High Tg)/G*(Low Tg) (60.degree. C.) 1.9 (tan.delta. (low Tg) +
tan.delta. (high Tg))/2) (-20.degree. C.) 0.78 (tan.delta. (low Tg)
+ tan.delta. (high Tg))/2) (20.degree. C.) 0.88 (tan.delta. (low
Tg) + tan.delta. (high Tg))/2)) (60.degree. C.) 0.49
[0175] Note that not all of the activities described above in the
general description or the examples are required, that a portion of
a specific activity may not be required, and that one or more
further activities may be performed in addition to those described.
Still further, the order in which activities are listed is not
necessarily the order in which they are performed.
[0176] Benefits, other advantages, and solutions to problems have
been described above with regard to specific embodiments. However,
the benefits, advantages, solutions to problems, and any feature(s)
that may cause any benefit, advantage, or solution to occur or
become more pronounced are not to be construed as a critical,
required, or essential feature of any or all the claims.
[0177] The specification and illustrations of the embodiments
described herein are intended to provide a general understanding of
the structure of the various embodiments. The specification and
illustrations are not intended to serve as an exhaustive and
comprehensive description of all of the elements and features of
apparatus and systems that use the structures or methods described
herein. Separate embodiments may also be provided in combination in
a single embodiment, and conversely, various features that are, for
brevity, described in the context of a single embodiment, may also
be provided separately or in any subcombination. Further, reference
to values stated in ranges includes each and every value within
that range. Many other embodiments may be apparent to skilled
artisans only after reading this specification. Other embodiments
may be used and derived from the disclosure, such that a structural
substitution, logical substitution, or another change may be made
without departing from the scope of the disclosure. Accordingly,
the disclosure is to be regarded as illustrative rather than
restrictive.
* * * * *