U.S. patent application number 16/482986 was filed with the patent office on 2019-11-14 for led package and method for manufacturing same.
The applicant listed for this patent is CITIZEN ELECTRONICS CO., LTD., CITIZEN WATCH CO., LTD.. Invention is credited to Yoshihito KITTA, Toshiyuki MIZUNO.
Application Number | 20190348579 16/482986 |
Document ID | / |
Family ID | 63040753 |
Filed Date | 2019-11-14 |
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United States Patent
Application |
20190348579 |
Kind Code |
A1 |
MIZUNO; Toshiyuki ; et
al. |
November 14, 2019 |
LED PACKAGE AND METHOD FOR MANUFACTURING SAME
Abstract
Provided is an LED package and a method for manufacturing the
same wherein, if its sealing resin containing phosphor particles
each having a coating layer is cut or ground, age deterioration of
the phosphor particles in the cut or ground surface is prevented.
The method includes: mounting LED elements on a substrate; filling
a first resin on the substrate to seal the LED elements, the first
resin being transparent or translucent and containing wavelength
conversion particles configured by forming a coating layer on at
least part of the surface of each phosphor particle which converts
the wavelength of light emitted from the LED elements; cutting or
grinding the first resin; and forming a protective layer with a
second resin on a cut surface of the first resin exposed as a
result of the cutting or on a ground surface of the first resin,
the second resin not containing the wavelength conversion
particles.
Inventors: |
MIZUNO; Toshiyuki;
(Minamitsuru-gun, Yamanashi, JP) ; KITTA; Yoshihito;
(Fuefuki-shi, Yamanashi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CITIZEN ELECTRONICS CO., LTD.
CITIZEN WATCH CO., LTD. |
Fujiyoshida-shi, Tamanashi
Nishitokyo-shi, Tokyo |
|
JP
JP |
|
|
Family ID: |
63040753 |
Appl. No.: |
16/482986 |
Filed: |
February 2, 2018 |
PCT Filed: |
February 2, 2018 |
PCT NO: |
PCT/JP2018/003689 |
371 Date: |
August 1, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2933/0025 20130101;
H01L 33/502 20130101; H01L 33/54 20130101; H01L 25/0753 20130101;
H01L 2933/005 20130101; H01L 33/50 20130101; H01L 2933/0041
20130101; H01L 33/44 20130101; H01L 33/507 20130101 |
International
Class: |
H01L 33/54 20060101
H01L033/54; H01L 33/50 20060101 H01L033/50 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 2, 2017 |
JP |
2017-017853 |
Claims
1. A method for manufacturing an LED package, comprising the steps
of: mounting LED elements on a substrate; filling a first resin on
the substrate to seal the LED elements, the first resin being
transparent or translucent and containing wavelength conversion
particles configured by forming a coating layer on at least part of
the surface of each phosphor particle which converts the wavelength
of light emitted from the LED elements; cutting or grinding the
first resin; and forming a protective layer with a second resin on
a cut surface of the first resin exposed as a result of the cutting
or on a ground surface of the first resin, the second resin not
containing the wavelength conversion particles.
2. The method according to claim 1, wherein the first resin is cut
in the cutting or grinding step, the cut surface is a side surface
of the first resin, and the second resin is applied to the side
surface of the first resin in the forming step.
3. The method according to claim 1, wherein in the cutting or
grinding step, the first resin is cut while the substrate is left
uncut, the cut surface is a side surface of the first resin, and
the forming step comprises filling the second resin into a groove
of the first resin formed by cutting the first resin, curing the
second resin, and entirely cutting the cured second resin and the
substrate in the thickness direction thereof, thereby obtaining
diced LED packages wherein the side surface of the first resin is
coated with the second resin.
4. The method according to claim 1, wherein an upper surface of the
first resin is ground in the cutting or grinding step, and the
protective layer is formed on the upper surface of the first resin
in the forming step.
5. The method according to claim 1, wherein the LED elements are
blue LED elements emitting blue light, and the phosphor particles
are particles of KSF phosphor absorbing part of the blue light to
emit red light.
6. An LED package comprising: a substrate; an LED element mounted
on the substrate; a first resin filled on the substrate to seal the
LED element, the first resin being transparent or translucent and
containing wavelength conversion particles configured by forming a
coating layer on at least part of the surface of each phosphor
particle which converts the wavelength of light emitted from the
LED element; and a protective layer covering a surface of the first
resin and made of a second resin not containing the wavelength
conversion particles, wherein the surface of the first resin
includes broken surfaces of the wavelength conversion particles
whose coating layers are cut.
7. The LED package according to claim 6, wherein the second resin
contains a scattering agent.
8. The LED package according to claim 6, wherein the second resin
is a transparent or translucent resin.
Description
FIELD
[0001] The present invention relates to an LED package and a method
for manufacturing the same.
BACKGROUND
[0002] Light-emitting devices (LED packages) are known in which a
light-emitting diode (LED) element is mounted on a substrate and
sealed with a translucent resin containing a phosphor. In such a
light-emitting device, light emitted from the LED element is mixed
with light generated by exciting the phosphor with the emitted
light, thereby producing light of a desired color, such as white,
according to the purpose.
[0003] Patent Literature 1 describes a method for manufacturing
light-emitting diodes. This method includes coating multiple LED
elements mounted on a substrate with a translucent resin, partially
removing the cured translucent resin from space between the LED
elements, filling a light-reflecting resin into grooves thus
formed, and cutting the substrate so as to leave the cured
light-reflecting resin around each LED element, thereby separating
light-emitting diodes from each other.
[0004] Patent Literature 2 describes a surface-light-emitter unit
wherein surface light emitters formed by sealing light-emitting
elements with a sealing light-transmitting member mixed with a
phosphor are provided on a substrate, a scattering
light-transmitting member is filled between adjacent surface light
emitters on the substrate, and exposed surfaces of the surface
light emitters and scattering light-transmitting member are coated
with a translucent film.
CITATION LIST
Patent Literature
[0005] Patent Literature 1: Japanese Unexamined Patent Publication
No. 2002-368281
[0006] Patent Literature 2: Japanese Unexamined Patent Publication
No. 2015-026778
SUMMARY
[0007] Particles of some phosphors have a coating layer, in order
to prevent deterioration caused by external factors, such as heat,
humidity and ultraviolet rays. If such phosphor particles are mixed
in a sealing resin of LED elements and the sealing resin is cut or
ground to manufacture LED packages, the coating layer of some
phosphor particles is also cut by this cutting or grinding, causing
broken surfaces of these particles to be exposed in the cut or
ground surface of the sealing resin. Since this causes the effect
of the coating layer preventing deterioration to be lost, phosphor
particles in the cut surface deteriorate, which leads to partial
discoloration of the sealing resin and deviation of the emission
color from the designed color with the passage of time.
[0008] It is an object of the present invention to provide an LED
package and a method for manufacturing the same wherein, if its
sealing resin containing phosphor particles each having a coating
layer is cut or ground, age deterioration of the phosphor particles
in the cut or ground surface is prevented.
[0009] Provided is a method for manufacturing an LED package,
including the steps of: mounting LED elements on a substrate;
filling a first translucent resin on the substrate to seal the LED
elements, the first translucent resin containing wavelength
conversion particles configured by forming a coating layer on at
least part of the surface of each phosphor particle which converts
the wavelength of light emitted from the LED elements; cutting the
first translucent resin; and forming a protective layer with a
second translucent resin on a side surface of the first translucent
resin which is an exposed cut surface, the second translucent resin
not containing the wavelength conversion particles.
[0010] Preferably, in the forming step, the second translucent
resin is applied to the side surface of the first translucent resin
of each LED package having diced in the cutting step.
[0011] Preferably, the substrate is left uncut in the cutting step,
and the forming step includes filling the second translucent resin
into a groove of the first translucent resin formed by cutting,
curing the second translucent resin, and entirely cutting the cured
second translucent resin and the substrate in the thickness
direction thereof, thereby obtaining diced LED packages wherein the
side surface of the first translucent resin is coated with the
second translucent resin.
[0012] The protective layer may also be formed on an upper surface
of the first translucent resin in the forming step.
[0013] Provided is an LED package including: a substrate; an LED
element mounted on the substrate; a first translucent resin filled
on the substrate to seal the LED element, the first translucent
resin containing wavelength conversion particles configured by
forming a coating layer on at least part of the surface of each
phosphor particle which converts the wavelength of light emitted
from the LED element, the first translucent resin having a side
surface which is a cut surface including the wavelength conversion
particles whose coating layers are cut; and a protective layer
covering the cut surface of the first translucent resin and made of
a second translucent resin not containing the wavelength conversion
particles.
[0014] Provided is a method for manufacturing an LED package,
including the steps of: mounting LED elements on a substrate;
filling a first resin on the substrate to seal the LED elements,
the first resin being transparent or translucent and containing
wavelength conversion particles configured by forming a coating
layer on at least part of the surface of each phosphor particle
which converts the wavelength of light emitted from the LED
elements; cutting or grinding the first resin; and forming a
protective layer with a second resin on a cut surface of the first
resin exposed as a result of the cutting or on a ground surface of
the first resin, the second resin not containing the wavelength
conversion particles.
[0015] Preferably, the first resin is cut in the cutting or
grinding step, the cut surface is a side surface of the first
resin, and the second resin is applied to the side surface of the
first resin in the forming step.
[0016] Preferably, in the cutting or grinding step, the first resin
is cut while the substrate is left uncut, the cut surface is a side
surface of the first resin, and the forming step includes filling
the second resin into a groove of the first resin formed by cutting
the first resin, curing the second resin, and entirely cutting the
cured second resin and the substrate in the thickness direction
thereof, thereby obtaining diced LED packages wherein the side
surface of the first resin is coated with the second resin.
[0017] An upper surface of the first resin may be ground in the
cutting or grinding step, and the protective layer may be formed on
the upper surface of the first resin in the forming step.
[0018] Preferably, the LED elements are blue LED elements emitting
blue light, and the phosphor particles are particles of KSF
phosphor absorbing part of the blue light to emit red light.
[0019] Provided is an LED package including: a substrate; an LED
element mounted on the substrate; a first resin filled on the
substrate to seal the LED element, the first resin being
transparent or translucent and containing wavelength conversion
particles configured by forming a coating layer on at least part of
the surface of each phosphor particle which converts the wavelength
of light emitted from the LED element; and a protective layer
covering a surface of the first resin and made of a second resin
not containing the wavelength conversion particles, wherein the
surface of the first resin includes broken surfaces of the
wavelength conversion particles whose coating layers are cut.
[0020] Preferably, the second resin contains a scattering
agent.
[0021] Preferably, the second resin is a transparent or translucent
resin.
[0022] According to the above LED package and method, if its
sealing resin containing phosphor particles each having a coating
layer is cut or ground, age deterioration of the phosphor particles
in the cut or ground surface can be prevented.
BRIEF DESCRIPTION OF DRAWINGS
[0023] FIG. 1 is a perspective view of an LED package 1.
[0024] FIGS. 2(A) to 2(C) are diagrams for explaining manufacturing
steps of the LED package 1.
[0025] FIG. 3 is a cross-sectional view of the LED package 1 taken
along line III-III in FIG. 1.
[0026] FIG. 4 is a perspective view of an LED package 2.
[0027] FIGS. 5(C) to 5(E) are diagrams for explaining manufacturing
steps of the LED package 2.
[0028] FIG. 6 is a cross-sectional view of an LED package 3.
[0029] FIG. 7 is a cross-sectional view of an LED package 4.
[0030] FIG. 8 is a cross-sectional view of an LED package 5.
DESCRIPTION OF EMBODIMENTS
[0031] Hereinafter, with reference to the accompanying drawings, an
LED package and a method for manufacturing the same will be
explained in detail. However, note that the present invention is
not limited to the drawings or the embodiments described below.
[0032] FIG. 1 is a perspective view of an LED package 1. The LED
package 1 is a light-emitting device including an LED element as a
light-emitting element and utilizing wavelength conversion of a
phosphor for emitting white light, for example, and is used as an
LED light source for various kinds of lighting equipment, for
example. Major components of the LED package 1 include a mounting
substrate 10, an LED element 20, a sealing resin 30 and a
transparent resin coat 40. The LED package need not include only
one LED element 20, but may include multiple LED elements 20
mounted on the mounting substrate 10.
[0033] The mounting substrate 10 includes two connecting electrodes
(not shown) for connecting the LED element 20 to an external power
source, and has an upper surface on which the LED element 20 is
mounted. For example, the mounting substrate 10 may be a ceramic
substrate, or a substrate constructed by bonding a metal board made
of aluminum or copper, which excels in heat resistance and heat
dissipation, to an insulating circuit board on which conductive
patterns and connecting electrodes are formed for the LED element
20. Alternatively, the mounting substrate 10 may be a base of the
LED package including a concave portion in which the LED element 20
is mounted and the sealing resin 30 is filled and two lead
electrodes for connecting the LED element 20 to an external power
source.
[0034] The LED element 20 is made of a gallium nitride compound
semiconductor which emits light having a wavelength in the
ultraviolet to blue regions, for example. In the following
description, the LED element 20 is assumed to be a blue LED element
which emits blue light having a wavelength in the range of about
450 to 460 nm, but may be an element which emits light having
another wavelength. The LED element 20 is die-bonded on the upper
surface of the mounting substrate 10, and has positive and negative
electrodes electrically connected to the connecting electrodes on
the mounting substrate 10 via two bonding wires (hereinafter,
simply referred to as "wires") 21. If the LED package includes
multiple LED elements 20, the LED elements 20 are also electrically
connected via the wires 21 with each other.
[0035] The sealing resin 30 is an example of the first resin (or
first translucent resin), and is transparent or translucent.
"Translucent" means being not completely transparent but
semitransparent and allowing light to pass through. The sealing
resin 30 contains phosphor particles (wavelength conversion
particles) for converting the wavelength of light emitted from the
LED element 20, and is filled on the mounting substrate 10 to
integrally seal the LED element 20 and wires 21. The phosphor
particles may be uniformly dispersed in the sealing resin 30, or
deposited near the upper surface of the mounting substrate 10 so
that the density thereof increases downward in the sealing resin
30. The sealing resin 30 is an epoxy or silicone resin, for
example.
[0036] The sealing resin 30 may contain only one phosphor, or two
or more phosphors. For example, the sealing resin 30 contains KSF
and YAG phosphors, which are a yellow and a red phosphor,
respectively. Of these, KSF phosphor (K.sub.2SiF.sub.6:Mn.sup.4+)
absorbs part of blue light emitted by the LED element 20 to emit
red light having a peak in the wavelength range of 610 to 650 nm.
In this case, the LED package 1 mixes blue light emitted from the
LED element 20 and yellow and red light generated by exciting the
yellow and red phosphors with the blue light, thereby emitting
white light.
[0037] The transparent resin coat 40 is an example of the
protective layer made of the second resin (or second translucent
resin), contains no phosphor particles, and covers the four side
surfaces of the sealing resin 30. As described later, the side
surfaces of the sealing resin 30 are cut surfaces formed during
manufacture of the LED package 1. The transparent resin coat 40 is
a dampproof coating applied to these cut surfaces. Since the upper
surface of the sealing resin 30 (surface opposite to the mounting
substrate 10) is not a cut surface, the transparent resin coat 40
is not provided on the upper surface thereof. The transparent resin
coat 40 is also an epoxy or silicone resin, for example. The
material of the sealing resin 30 may be the same as or different
from that of the transparent resin coat 40. Preferably, the sealing
resin 30 and transparent resin coat 40 have a light transmittance
of 80% or more, and a water absorption of 1% or less.
[0038] FIGS. 2(A) to 2(C) are diagrams for explaining manufacturing
steps of the LED package 1. In manufacturing the LED package 1, as
shown in FIG. 2(A), LED elements 20 are first die-bonded on the
upper surface of the mounting substrate 10, and then the positive
and negative electrodes of the LED elements 20 are connected to the
connecting electrodes on the mounting substrate 10 via bonding
wires (mounting step). Subsequently, as shown in FIG. 2(B), the
sealing resin 30 containing the above-mentioned phosphors is filled
on the upper surface of the mounting substrate 10, to integrally
seal the LED elements 20 and wires 21 (sealing step). At this time,
the sealing resin 30 may be kept uncured for several hours, for
example, thereby causing the phosphors in the sealing resin 30 to
be naturally deposited on the upper surfaces of the mounting
substrate 10 and LED elements 20, and then the sealing resin 30 may
be cured.
[0039] Thereafter, as shown in FIG. 2(C), the mounting substrate 10
and sealing resin 30 are cut lengthwise and crosswise along cutting
lines L to divide the LED elements 20 (cutting step). Then, for
each diced LED package, the transparent resin coat 40 is applied to
the side surfaces of the sealing resin 30, which are exposed cut
surfaces, by spraying or vapor deposition, for example (forming
step of the protective layer). In this way, the LED package 1 shown
in FIG. 1 is completed.
[0040] FIG. 3 is a cross-sectional view of the LED package 1 taken
along lines III-III in FIG. 1. In FIG. 3, KSF phosphor particles
are exaggerated in order to illustrate the cut surface of the
sealing resin 30, and thus the proportions of the illustrated
elements are not necessarily correct. Since KSF phosphor is
water-soluble and has lower resistance to moisture than YAG or
other phosphors, a coating layer (dampproof coating) 62 is formed
on each phosphor particle 61 as shown in enlarged form in FIG. 3.
Hereinafter, phosphor particles 61 each having a coating layer 62
are also referred to as "wavelength conversion particles 60" for
convenience sake.
[0041] When the sealing resin 30 is cut in the cutting step during
manufacture of the LED package 1, the coating layer 62 of the
wavelength conversion particles 60 are cut and their broken
surfaces are exposed in the side surfaces of the sealing resin 30,
as shown in FIG. 3. KSF phosphor has lower resistance to moisture,
and cutting the wavelength conversion particles 60 in this way
causes the effect of the coating layers 62 to be lost. Thus, if
left as it is, the phosphor included in the cut surface
deteriorates due to moisture in the air, causing the color of
emitted light to differ from the designed color. In particular, if
phosphor particles are deposited in the sealing resin 30, these
particles are crowded near the upper surface of the mounting
substrate 10 and that portion is cut; thus, deterioration of KSF
phosphor may occur more conspicuously.
[0042] However, in the LED package 1, even if broken surfaces of
the wavelength conversion particles 60 are exposed in the cutting
step, the transparent resin coat 40 applied to the cut surfaces of
the sealing resin 30 covers the broken surfaces and thus prevent
them from being exposed to the air. Since the upper surface of the
sealing resin 30 is not a cut surface, broken surfaces of the
wavelength conversion particles 60 are not exposed there.
Accordingly, in the LED package 1, even if KSF phosphor, which
easily deteriorates over time, is used, deterioration of the
phosphor and discoloration of the emitted light are prevented.
Since the transparent resin coat 40 is made of a resin having a
high light transmittance, brightness of the LED package 1 hardly
decreases even with the transparent resin coat 40.
[0043] FIG. 4 is a perspective view of an LED package 2. Major
components of the LED package 2 include a mounting substrate 10, an
LED element 20, a sealing resin 30 and a transparent resin wall 50.
The LED package 2 is identical in structure to the LED package 1 of
FIG. 1, except that the transparent resin coat 40 of the LED
package 1 is replaced with the transparent resin wall 50.
[0044] The transparent resin wall 50 is an example of the
protective layer made of the second resin (or second translucent
resin), contains no phosphor particles, and covers the four side
surfaces of the sealing resin 30, similarly to the transparent
resin coat 40. The transparent resin wall 50 is made of the same
resin as the transparent resin coat 40 of the LED package 1, for
example, but laterally thicker than the transparent resin coat 40,
and corresponds to a resin frame enclosing the sealing resin 30.
Preferably, the transparent resin wall 50 also has a light
transmittance of 80% or more, and a water absorption of 1% or
less.
[0045] FIGS. 5(C) to 5(E) are diagrams for explaining manufacturing
steps of the LED package 2. In manufacturing the LED package 2, LED
elements 20 are first mounted on the upper surface of the mounting
substrate 10, and sealed with the sealing resin 30 containing the
above-mentioned phosphors, together with wires 21. Since figures
corresponding to these step are the same as FIGS. 2(A) and 2(B) for
the LED package 1, they are omitted from illustration.
[0046] Subsequently, as shown in FIG. 5(C), the sealing resin 30 is
entirely cut in the thickness direction while the mounting
substrate 10 is left uncut, for example, thereby forming grooves
31. Then, as shown in FIG. 5(D), a transparent resin is filled into
the grooves 31 of the sealing resin 30, and cured to form the
transparent resin wall 50. Further, as shown in FIG. 5(E), the
transparent resin wall 50 and mounting substrate 10 are entirely
cut in the thickness direction along cutting lines L to divide the
LED elements 20. In this way, the LED package 2 shown in FIG. 4 is
completed.
[0047] Also in the LED package 2, even if KSF phosphor, which
easily deteriorates over time, is used, deterioration of the
phosphor and discoloration of the emitted light are prevented,
similarly to the LED package 1. Since the transparent resin wall 50
is made of a resin having a high light transmittance, the LED
package 2 can emit light even from its side surfaces, which ensures
wide-ranging emission.
[0048] If manufacturing steps of the LED package include cutting
the sealing resin 30 or grinding a surface thereof, the protective
layer formed on the cut or ground surface of the sealing resin 30
has the same effect of preventing deterioration of the phosphor and
discoloration of the emitted light; the cutting is not limited to
the step for dividing the elements into pieces.
[0049] FIG. 6 is a cross-sectional view of an LED package 3. FIG. 6
shows a vertical cross section of the LED package 3, similarly to
FIG. 3. Major components of the LED package 3 include a mounting
substrate 10, an LED element 20, a sealing resin 30 and a
transparent resin coat 40'. The LED package 3 differs from the LED
package 1 of FIG. 1 in that the upper surface of the sealing resin
30 is also provided with the transparent resin coat 40', but is
otherwise identical thereto.
[0050] The transparent resin coat 40' is an example of the
protective layer made of the second resin (or second translucent
resin), contains no phosphor particles, and covers the four side
surfaces and upper surface of the sealing resin 30. As in the LED
package 3, the protective layer for preventing deterioration of the
phosphor may be formed to cover not only the side surfaces but all
of the exposed surfaces of the sealing resin 30. For example, if
the upper surface of the sealing resin 30 is ground during
manufacture of the LED package, this grinding causes broken
surfaces of the wavelength conversion particles 60 to be exposed in
the upper surface of the sealing resin 30; accordingly, the
transparent resin coat 40' may also he formed on the upper surface
of the sealing resin 30.
[0051] The transparent resin wail 50 of the LED package 2, which is
thicker than the transparent resin coat 40, may also be formed to
cover the four side surfaces and upper surface of the sealing resin
30.
[0052] FIG. 7 is a cross-sectional view of an LED package 4. FIG. 7
also shows a vertical cross section of the LED package 4, similarly
to FIG. 3. The LED package 4 differs from the LED packages 1, 3 of
FIGS. 1, 6 in that the transparent resin coat 40, 40' of the LED
package 1, 3 is replaced with a transparent resin coat 40'', but is
otherwise identical thereto. The transparent resin coat 40'' of the
LED package 4 is an example of the protective layer made of the
second resin (or second translucent resin), and is provided only on
the upper surface of the sealing resin 30. If manufacturing steps
of the LED package do not include cutting the side surfaces of the
sealing resin 30 but include grinding the upper surface thereof,
the transparent resin coat 40'' may be formed only on the upper
surface of the sealing resin 30 where broken surfaces of the
wavelength conversion particles 60 are exposed, as in the LED
package 4.
[0053] FIG. 8 is a cross-sectional view of an LED package 5. FIG. 8
also shows a vertical cross section of the LED package 5, similarly
to FIG. 3. The LED package 5 differs from the LED package 4 of FIG.
7 in that the mounting substrate 10 of the LED package 4 is
replaced with a lead frame 10', but is otherwise identical
thereto.
[0054] The lead frame 10' includes a die pad 11 on which the LED
element 20 is mounted, and terminals 12, 13 separated from the die
pad 11. Space between the die pad 11 and the terminals 12, 13 is
filled with an insulating resin 35, which electrically insulates
the die pad 11 from the terminals 12, 13. The cross sections of the
terminals 12, 13 are substantially J-shaped. Edges of the terminals
12, 13 correspond to outer leads 14, 15, respectively. The LED
element 20 is mounted on a mounting surface 11a of the die pad 11,
and electrically connected to the terminals 12, 13 via wires
21.
[0055] Manufacturing steps of the LED package 5 do not include
cutting the side surfaces of the sealing resin 30, but may include
grinding the upper surface thereof. Thus, the upper surface of the
sealing resin 30 where broken surfaces of the wavelength conversion
particles 60 are exposed is provided with a transparent resin coat
40''. If not only the upper surface but also the side surfaces of
the sealing resin 30 are ground, the transparent resin coat may
also be formed similarly on these ground surfaces.
[0056] The transparent resin coats 40, 40', 40'' and transparent
resin wall 50 need not be completely transparent, but may be a
translucent and semitransparent resin. In particular, the
transparent resin wall 50 of the LED package 2 may be replaced with
a white resin wall, if it is desired to emit light upward. In
particular, the transparent resin coats 40', 40'', which cover the
upper surface of the sealing resin 30, may contain a scattering
agent. The scattering agent diffuses light in the transparent resin
coat, allowing all the upper surface of the sealing resin 30 to
emit light uniformly.
[0057] Even if a phosphor other than KSF phosphor is used, the
transparent resin coat 40, 40', 40'' or transparent resin wall 50
may be formed similarly to the LED packages 1 to 5. If each
particle of the phosphor has a coating layer for preventing
deterioration and manufacturing steps of the LED package include
cutting or grinding the sealing resin 30, the effect of preventing
deterioration of the phosphor and discoloration of the emitted
light may be produced.
[0058] The LED element 20 need not be mounted by wire bonding, but
may be flip-chip mounted. Unlike the LED packages 1 to 5, even if a
phosphor board for wavelength conversion is placed on the upper
surface of the LED element 20, for example, a transparent resin
coat or wall may be formed similarly on that board. If the phosphor
board has a cut or ground surface, the effect of preventing
deterioration of the phosphor and discoloration of the emitted
light may be produced.
* * * * *