U.S. patent application number 16/477725 was filed with the patent office on 2019-11-07 for a heating system and a heating method.
The applicant listed for this patent is Minnoy BVBA. Invention is credited to Chris MINNOY.
Application Number | 20190338962 16/477725 |
Document ID | / |
Family ID | 58547291 |
Filed Date | 2019-11-07 |
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United States Patent
Application |
20190338962 |
Kind Code |
A1 |
MINNOY; Chris |
November 7, 2019 |
A HEATING SYSTEM AND A HEATING METHOD
Abstract
A heating system and method for heating by means of at least one
processing unit having at least one processor for performing
computational tasks. A container unit is arranged for holding a
medium, wherein the at least one processing unit is thermally
coupled with at least a portion of the container unit for
transferring thermal energy produced by the at least one processing
unit to the at least one portion of the container unit for heating
medium inside the container unit.
Inventors: |
MINNOY; Chris; (Holsbeek,
BE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Minnoy BVBA |
Holsbeek |
|
BE |
|
|
Family ID: |
58547291 |
Appl. No.: |
16/477725 |
Filed: |
January 12, 2018 |
PCT Filed: |
January 12, 2018 |
PCT NO: |
PCT/EP2018/050704 |
371 Date: |
July 12, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
Y02B 10/20 20130101;
Y02B 30/18 20130101; F24D 17/001 20130101; F24D 19/1051 20130101;
Y02B 30/52 20130101; F24D 2200/29 20130101; F24H 1/201 20130101;
F24H 9/2021 20130101; F24D 17/02 20130101; Y02B 10/70 20130101 |
International
Class: |
F24D 17/00 20060101
F24D017/00; F24D 17/02 20060101 F24D017/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 16, 2017 |
BE |
2017/5024 |
Claims
1. A heating system for heating by means of a processing unit, the
system comprising at least one processing unit having at least one
processor for performing computational tasks, and a container unit
for holding a medium, wherein the at least one processing unit is
thermally coupled with at least a portion of the container unit by
means of at least one heat pipe, wherein the at least one heat pipe
is arranged for transferring thermal energy produced by the at
least one processing unit to the at least one portion of the
container unit for heating the medium inside the container
unit.
2. The heating system according to claim 1, wherein the at least
one processing unit is arranged below the container unit.
3. A heating system for heating by means of a processing unit, the
system comprising at least one processing unit having at least one
processor for performing computational tasks, and a container unit
for holding a medium, wherein the at least one processing unit is
arranged below the container unit, preferably by means of at least
one heat pipe arranged for transferring thermal energy produced by
the at least one processing unit to the portion of the container
unit for heating the medium inside the container unit.
4. The heating system according to any one of the preceding claims,
wherein the at least one heat pipe includes at least one
thermosiphon heat pipe.
5. The heating system according to any one of the preceding claims,
wherein the at least one processing unit is directly thermally
coupled with a wall portion of the container unit by means of the
at least one heat pipe.
6. The heating system according to any one of the preceding claims,
wherein the at least one processing unit is directly thermally
coupled with the medium inside the container unit by means of the
at least one heat pipe.
7. The heating system according to claim 6, wherein the system
further comprises a thermal coupling member arranged for forming a
thermal coupling between the at least one processing unit and a
portion of the container unit.
8. The heating system according to claim 7, wherein the thermal
coupling member comprises a heat pump arranged for transferring
thermal energy from the at least one processing unit towards the
container unit.
9. The heating system according to claim 7 or 8, wherein the
thermal coupling member comprises a thermoelectric cooler for
adjusting a rate of thermal energy transfer to the container
unit.
10. The heating system according to any one of the claims 7-9,
wherein the thermal coupling member comprises means for coupling
the at least one processing unit to a heat exchanger arranged
within the container unit.
11. The heating system according to any one of the claims 7-10,
wherein the thermal coupling member comprises means for coupling
the at least one processing unit to a heat exchanger arranged
outside around the container unit.
12. The heating system according to claim 10 or 11, wherein the
heat exchanger is a spiral heat exchanger.
13. The heating system according to any one of the preceding
claims, wherein at least two processing units are arranged, wherein
a first processing unit of the at least two processing units is
thermally coupled to a first location at or in the container unit
by means of a first heat pipe, and a second processing unit of the
at least two processing units is thermally coupled to a second
location at or in the container unit by means of a second heat
pipe, wherein the first location is different from the second
location.
14. The heating system according to claim 13, wherein the first
processing unit is coupled with a first heat exchanger positioned
at the first location at or in the container unit and the second
processing unit is coupled with a second heat exchanger positioned
at the second location at or in the container unit, wherein the
first heat exchanger and the second heat exchanger are offset with
respect to each other in a longitudinal direction of the container
unit.
15. The heating system according to claim 14, wherein, in use, the
first processing unit has a higher thermal energy output capacity
than that of the second processing unit, wherein the first heat
exchanger is arranged closer to an upper end of the container unit
than the second heat exchanger.
16. The heating system according to any one of the preceding
claims, wherein the at least one processing unit comprises a
plurality of components, wherein at least a first component is
thermally coupled to a third location at or in the container unit
by means of a third heat pipe and at least a second component is
thermally coupled to a fourth location at or in the container unit
by a fourth heat pipe, the third location being different from the
fourth location.
17. The heating system according to claim 16, wherein at least the
first component is coupled with a first heat exchanger positioned
at the third location at or in the container unit and/or at least
the second component is coupled with a second heat exchanger
positioned at the fourth location at or in the container unit,
wherein the first heat exchanger and the second heat exchanger are
offset with respect to each other in a longitudinal direction of
the container unit.
18. The heating system according to claim 17, wherein, in use, the
at least one first component has a higher thermal energy output
capacity than the at least one second component, wherein the first
heat exchanger is arranged closer to an upper end of the container
unit than the second heat exchanger.
19. The heating system according to any one of the preceding
claims, wherein the at least one processing unit is arranged on a
bottom side of the container unit and is coupled to a bottom
portion of the container unit.
20. The heating system according to any one of the preceding
claims, further comprising a module holder arranged for holding at
least one processing unit, wherein the module holder is thermally
coupled with the container unit by means of at least one heat
pipe.
21. The heating system according to claim 20, wherein a plurality
of processing units are received in the module holder.
22. The heating system according to claim 20 or 21, wherein at
least one processing unit is detachably connected with the module
holder.
23. The heating system according to any one of the claims 20-22,
wherein the module holder comprises at least one receiving slot
arranged for receiving a processing unit, wherein a processing unit
of the at least one processing unit is arranged to be sled in a
receiving slot of the module holder, e.g. in a position underneath
the container unit, wherein the module holder is arranged for
providing a thermal coupling between the at least one processing
unit inserted in the at least one receiving slot and a portion of
the container unit.
24. The heating system according to claim 23, wherein the module
holder comprises a plurality of receiving slots each configured for
receiving a processing unit.
25. The heating system according to any one of the claims 20-24,
wherein the at least one processing unit in the module holder is
cooled by means of a cooling arrangement arranged for transferring
heat from the at least one processing unit in the module holder to
the medium in the container unit.
26. The heating system according to any one of the claims, wherein
the at least one processing unit is cooled by means of immersion
cooling.
27. The heating system according to any one of the preceding
claims, wherein the container unit comprises an inlet opening for
receiving a fluid and an outlet opening for releasing a fluid,
wherein the heating system is arranged for increasing the
temperature of fluid received at the inlet opening before releasing
the fluid at the outlet opening.
28. The heating system according to claim 27, wherein the inlet
opening and outlet opening are the same.
29. The heating system according to any one of the preceding
claims, wherein the medium inside the container unit is water and
the container unit includes a warm water tank arranged for storing
warm water.
30. The heating system according to claim 29, wherein the container
unit is a warm water tank arranged for storing warm water.
31. The heating system according to any one of the preceding
claims, wherein the container unit includes an inner tank contained
inside an outer containing tank.
32. The heating system according to claim 31, wherein the inner
tank comprises an inlet opening for receiving a fluid and an outlet
opening for releasing the fluid.
33. The heating system according to claim 31 or 32, wherein the
outer containing tank includes a heating fluid at least partially
surrounding the inner tank.
34. The heating system according to claim 31, 32 or 33, wherein the
outer containing tank includes at least one compartment containing
a phase change material.
35. The heating system according to any one of claims 31-34,
wherein the outer containing tank includes at least one heat pipe
arranged for transporting heat from a bottom of the outer
containing tank upwards.
36. The heating system according to any one of the preceding
claims, including a thermal isolation positioned between at least
one processing unit and the container unit, and at least one
thermal diode allowing thermal energy to be transferred in a single
direction only, from the at least one processing unit to the
container unit.
37. The heating system according to any one of the claims 1-36,
wherein the medium inside the container unit is an oil.
38. The heating system according to any one of the claims 1-37,
wherein the medium inside the container unit is phase-change
material.
39. The heating system according to any one of the preceding
claims, wherein the system further comprises a controlling unit
arranged for: determining a need for thermal energy output for
heating the medium inside the container unit, selecting one or more
computational tasks to be carried out by the at least one
processing unit depending on the needed thermal energy output,
operating the at least one processing unit to carry out the one or
more computational tasks for obtaining a resulting thermal energy
output substantially corresponding to the needed thermal energy
output.
40. The heating system according to claim 39, wherein the resulting
thermal energy output is increased by selecting more computational
tasks.
41. The heating system according to claim 39 or 40, wherein the
resulting thermal energy output is increased by reducing an
interval between successive tasks.
42. The heating system according to any one of the claims 39-41,
wherein the thermal energy output is increased by selecting a more
computational intensive task.
43. The heating system according to any one of the claims 39-42,
wherein the at least one processing unit is connected to an
electric power source, wherein the controlling unit is configured
for obtaining data representative of a parameter of electricity of
the power source and for allocating the one or more computational
calculation tasks over time on the basis of the parameter.
44. The heating system according to claim 43, wherein the power
source is at least one of a power grid, a local photovoltaic solar
unit, or a rechargeable battery.
45. The heating system according to claim 43 or 44, wherein the
parameter is one or more of a voltage of the electricity of the
power grid, a cost per unit of the electricity of the power grid,
an availability of renewable energy, or a frequency of electricity
of the power source.
46. The heating system according to any one of the claims 43-45,
wherein the data representative of the parameter is based on a
prediction.
47. The heating system according to any one of the claims 43-46,
wherein the controlling unit is configured for: determining data
representative of a quantity of thermal energy needed within a time
frame for heating the medium inside the container unit to a desired
temperature, determining a prediction of the parameter of
electricity of the power source for at least a part of the time
frame, and allocating the one or more computational calculation
tasks over the time frame on the basis of the prediction of the
parameter and the data representative of the quantity of thermal
energy needed.
48. The heating system of claim 47, wherein the data representative
of the quantity of thermal energy needed is based on a
prediction.
49. The heating system according to claim 47 or 48, wherein the
prediction of the parameter and/or the prediction of the quantity
of thermal energy needed is an ongoing prediction.
50. The heating system according to any one of the preceding
claims, wherein the container unit is thermally insulated so as to
store thermal energy in the medium inside the container unit.
51. The heating system according to any one of the preceding
claims, wherein the container unit is an upstanding vessel.
52. The heating system according to any one of the preceding
claims, arranged to guard the temperature in the vessel so as to
protect from overheating the electronic computer equipment of the
at least one processing unit.
53. The heating system according to claim 52, arranged to, when the
temperature in the vessel exceeds a first temperature threshold,
indicate to a that a limited time is remaining before the
processing unit will be slowed down and/or halted, and/or, when the
temperature in the vessel exceeds a second temperature threshold,
slowing down and/or halting the processing unit.
54. The heating system according to claim 53, arranged to present
the user with an estimated time remaining before the second
temperature threshold may be reached.
55. A heating system for heating a medium by means of a processing
unit, the system comprising at least one processing unit having at
least one processor for performing computational tasks, and a
container unit for holding the medium, wherein the at least one
processing unit is thermally coupled for transferring thermal
energy produced by the at least one processing unit to the medium,
wherein the at least one processing unit is connectable to an
electric power source, wherein the controlling unit is configured
for obtaining data representative of a parameter of electricity of
the power source and for allocating one or more computational
calculation tasks over time on the basis of the parameter, wherein
the data representative of the parameter is based on a prediction
of said parameter.
56. The heating system according to claim 55, wherein the
controlling unit is configured for determining data representative
of a quantity of thermal energy needed within a time frame for
heating the medium to a desired temperature, determining the
prediction of the parameter of electricity of the power source for
at least a part of the time frame, and allocating the one or more
computational calculation tasks over the time frame on the basis of
the prediction of the parameter and the data representative of the
quantity of thermal energy needed.
57. The heating system of claim 56, wherein the data representative
of the quantity of thermal energy needed is based on a
prediction.
58. The heating system according to any one of claims 43-57,
wherein the electric power source is at least one of a power grid,
a local photovoltaic solar unit, or a rechargeable battery.
59. The heating system according to claim 43-58, wherein the
parameter of electricity of the power source is one or more of a
voltage of the electricity of the power grid, a cost per unit of
the electricity of the power grid, an availability of renewable
energy, or a frequency of electricity of the power source.
60. Container unit for use in the heating system according to
claims 1-59.
61. Processing unit for use in the heating system according to
claims 1-59.
62. Module holder for use in the heating system according to claims
20-54.
63. Method for heating by means of a processing unit, the method
comprising providing at least one processing unit having at least
one processor for performing computational tasks, and a container
unit holding a medium inside, thermally coupling the at least one
processing unit with at least a portion of the container unit by
means of at least one heat pipe arranged transferring thermal
energy produced by the at least one processing unit to the at least
one portion of the container unit so as to heat the medium inside
the container unit.
64. Method according to claim 63, wherein a controlling unit is
employed for: determining a need for thermal energy output for
heating the medium inside the container unit, selecting one or more
computational tasks to be carried out by the at least one
processing unit depending on the needed thermal energy output,
operating the at least one processing unit to carry out the one or
more computational tasks for obtaining a resulting thermal energy
output substantially corresponding to the needed thermal energy
output.
Description
FIELD OF THE INVENTION
[0001] The invention relates to heating systems, and methods for
heating. The invention further relates to a container unit for heat
storage.
BACKGROUND TO THE INVENTION
[0002] Heating systems are extensively used for providing heating
to a designated space and/or for heating a designated medium for
example for the provision of hot water in a building or facility.
Heating may be performed by using a combustion heating system, e.g.
using natural gas, oil fuel, wood pellets, etc., a heat pump
system, solar heating system and/or an electrical heating system.
Other heating systems are also well known. However, there exists a
constant need for improvement of the efficiency of these heating
systems. An efficient use of energy during heat generation and heat
transfer may play an important role for the reduction of net energy
consumption and hence also the emissions of greenhouse gases.
Rising costs of energy resources such as fossil fuels is expected
to become a relevant concern in many industries and households.
Furthermore, global warming and climate change seems to be at the
forefront of world attention, further necessitating the need of an
enhanced heating efficiency. There is a desire to significantly
reduce carbon footprints and/or significantly improve the
efficiency of the use of renewable energy.
[0003] Data centers come in various sizes and types and tend to
consume a relatively high amount of (electrical) energy for its
operation. A data center can comprise one or more processing units.
Energy consumption may form a central issue for data centers, which
may range from a few kW or even lower for a rack of servers in a
datacenter closet to several tens of MW for large datacenter
facilities. The electrical energy may be provided by means of power
plants, which may be powered by natural gas, coal and/or other
energy resources, such as nuclear, wind energy, hydroelectric, etc.
Data centers are becoming more important as they provide
computational resources for performing a wide variety of
computational tasks. A data center may comprise one or more
computer servers which may be arranged for acting primarily as a
compute node (CPU and/or GPU intensive tasks) or as a data node
(mainly data storage), or a combination of both. Typically, a data
center comprises a relatively large processing capacity and a large
storage capacity. As a result of the ever increasing connectivity,
a large number of computers/servers, typically housed in a data
center, are becoming available for direct or indirect use. The
computers/servers of the data center may comprise computational or
processing units which may for example be configured to perform
computational tasks for an extensive period of time. Many online
services, which may for example be used by means of a mobile phone,
desktop, laptop, etc., employ large data centers for providing and
powering their digital (online) services. Furthermore, it is
expected that additional data centers arranged for managing the
Internet Of Things (IoT) will increase the demand of electricity
even further, so that a need for energy efficient systems may
become even more important.
SUMMARY OF THE INVENTION
[0004] It is an object of the invention to provide for a system and
a method for heating by means of at least one processing unit that
obviates at least one of the above mentioned drawbacks.
[0005] It is a further object of the invention to improve the
efficiency and/or reduce costs for heating.
[0006] Thereto, according to an aspect is provided a system for
heating by means of a processing unit. The system comprises at
least one processing unit having at least one processor for
performing computational tasks. The system further comprises a
container unit for holding a medium. The at least one processing
unit can be thermally coupled with at least a portion of the
container unit by means of at least one heat pipe. The at least one
heat pipe can be arranged for transferring thermal energy produced
by the at least one processing unit to the at least one portion of
the container unit for heating medium inside the container
unit.
[0007] Advantageously, thermal energy generated by the at least one
processing unit as a result of performing computational tasks can
be transferred to the medium inside the container unit by means of
a heat pipe cooling. In this way, the system possesses the capacity
to recover thermal energy, otherwise exhausted to environment, and
channel the heat by means of the heat pipe to the medium inside the
container unit where this heat energy can be converted to produce
hot water and/or provide heat, carried by the medium, to occupants
in buildings. In an example, a plurality of heat pipes may be
arranged for drawing heat away from the at least one processing
unit to the medium inside the container unit, instead of carrying
the heat to for example a heat sink for dissipation into the
ambient. In an embodiment, the container unit can be in the form of
a vessel or a tank for storage of the medium. Advantageously, the
container unit may be isolated so as to reduce heat loss. In this
way, the thermal energy of the heated medium can be collected for
later use. Such a container unit may be a storage water tank
arranged for domestic water heating so as to enable a fast delivery
of hot water on demand for commercial, industrial and/or private
use.
[0008] The heat pipe is arranged to facilitate the transfer of heat
generated at the one or more heat producing processing units of the
system into the medium inside the container unit. A heat pipe
typically comprises a liquid in a tube, which start boiling and
thereby removing local heat. The formed vapour as a result of the
boiling can then condense some distance away, giving up its heat.
The condensated liquid is then allowed to flow back by gravity
and/or capillary means through narrow passages. As a result of the
capillary means, the flow of the liquid can occur without requiring
a gravitational force. In this way, an input end of the heat pipe,
i.e. an end where the liquid starts boiling in use, can be arranged
higher than an output end of the heat pipe, i.e. an end where the
vapour formed from the liquid starts condensing. Therefore, a heat
pipe can be seen as a two-phase heat transfer (boiling liquid).
Typically such heat transfer is more efficient and/or faster than
heat transfer through a solid heat transfer material, such as
copper.
[0009] Optionally, the system is arranged, e.g. optimized, for
private domestic use, e.g. in a single household home.
[0010] Optionally, the container unit 4 can have a volume of
smaller than 500 liters, preferably smaller than 250 liters, more
preferably smaller than 200 liters. Hence the container can be
optimized for private domestic use, e.g. in single household
homes.
[0011] Optionally, the at least one processing unit is arranged
below and/or underneath the container unit.
[0012] In this way, the heat pipes can transfer the heat upwards to
the container unit, allowing efficient cooling of the at least one
processing unit performing one or more computational tasks. In an
example, a computer equipment comprising the at least one
processing unit may be cooled at all times as a result of arranging
the processing unit below/underneath the container unit.
[0013] In accordance with a second aspect, there is provided
herewith a system for heating by means of a processing unit. The
system comprises at least one processing unit having at least one
processor for performing computational tasks. The system further
comprises a container unit for holding a medium. The at least one
processing unit can be arranged below or underneath the container
unit. At least one heat pipe can be arranged for transferring
thermal energy produced by the at least one processing unit to the
portion of the container unit for heating medium inside the
container unit.
[0014] In this way, advantageously, an increased amount of thermal
energy generated by the at least one processing unit can be
retrieved for usage of tap water or heating a building.
Advantageously, a processing unit (e.g. a computer server) can be
arranged underneath the container unit.
[0015] The generated heat as a result of the at least one
processing unit performing one or more computational tasks may be
transferred by a heat pipe to the medium inside the container unit,
forming at least a part of a thermal path between the at least one
processing unit and the medium inside the container unit.
[0016] Optionally, a radiator can be arranged with one or more heat
pipes so as to extract residual heat of said computer equipment of
the processing unit and to transfer this efficiently to the
container unit containing a medium inside for thermal storage. The
medium can be but is not limited to water, oil or a phase-change
material (PCM). In this way, advantageously, a stable temperature
range can be provided for the electronic equipment.
[0017] Optionally, the processing unit is arranged next to the
container unit. Heat generated by means of the processing unit as a
result of performing computational tasks can be transferred by
means of one or more heat pipes arranged between the processing
unit and the container unit. In this way, heat may be transferred
through the heat pipes from the processing unit to the container
unit. The heat pipe may for example be connected to a wall portion
of the container unit. This allows for transferring generated heat
to the medium inside the container unit.
[0018] Optionally, the heat pipes are arranged to use the capillary
effect, so that other orientations of the processing unit with
respect to the container unit can also be employed.
[0019] Optionally, the at least one heat pipe includes at least one
thermosiphon heat pipe. For example, all heat pipes are
thermosiphon heat pipes. The thermosiphon heat pipe is a heat pipe
without a wick. The thermosiphon heat pipe can provide a higher
level of protection for the electronics since it can act as a
thermal diode, allowing thermal energy to be transferred in a
single direction only, e.g. away from the electronics.
[0020] Optionally, the at least one processing unit is directly
thermally coupled with a wall portion of the container unit by
means of the at least one heat pipe.
[0021] The heat generated by the at least one processing unit can
be guided to a wall portion of the container unit by means of the
at least one heat pipe, wherein the heated wall portion of the
container unit can transfer the heat further to the medium inside
the container unit, forming a thermal path between the processing
unit and the medium inside the container unit. Advantageously, the
wall portion of the container unit can be formed from a thermally
conductive material.
[0022] Optionally, the at least one processing unit is directly
thermally coupled with the medium inside the container unit by
means of the at least one heat pipe.
[0023] In this way, heat transfer between the at least one
processing unit and the medium inside the container can be
improved. The loss of heat to the surroundings can thus be reduced
by employing a direct thermal coupling.
[0024] Optionally, the system further comprises a thermal coupling
member arranged for forming a thermal coupling between the at least
one processing unit and a portion of the container unit.
[0025] Other means can also be used for forming said thermal path
from the at least one processing unit to a portion of the container
unit so as to transfer heat to the medium inside the container
unit, such as, but not limited to, a plate (e.g. in copper)
arranged for improving the heat transfer, a heat sink, a heat pump
element, a Peltier element, etc. A combination of different means
can also be employed as a thermal coupling member. For example, one
or more heat pipes can be thermally coupled to a heat sink.
[0026] Optionally, the thermal coupling member comprises a heat
pump arranged for transferring thermal energy from the at least one
processing unit towards the container unit.
[0027] By means of a heat pump the rate of heat transfer from the
at least one processing unit towards a portion of the container
unit can be adjusted. In an example, the rate of heat transfer by
the heat pump is controlled, depending on the amount of heat
generated by the at least one processing unit. Advantageously, the
temperature of the at least one processing unit can be monitored,
while allowing efficient energy transfer to the medium inside the
container unit.
[0028] Optionally, the thermal coupling member comprises a
thermoelectric cooler for adjusting a rate of thermal energy
transfer to the container unit.
[0029] Typically, such a thermoelectric cooler (TEC) uses the
Peltier effect to create a heat flux between the junction of two
types of materials. Such a heat pump uses electrical energy and is
configured to transfer heat from one side of the arrangement to the
other side of the arrangement, depending on the direction of the
current. In fact, a Peltier heat pump can be used for either
heating or for cooling. In an example, the thermoelectric cooler is
arranged for controlling cooling of the at least one processing
unit. Advantageously, the thermoelectric cooler lacks a circulating
liquid (cf. heat pipe) and moving parts and can have a small
size.
[0030] Optionally, the thermal coupling member comprises means for
coupling the at least one processing unit to a heat exchanger
arranged within the container unit.
[0031] In this way, the heat transfer can be further improved.
Also, advantageously, losses of heat to the surroundings can be
reduced as the heat exchanger is located substantially inside the
container unit.
[0032] Optionally, the thermal coupling member comprises means for
coupling the at least one processing unit to a heat exchanger
arranged outside around the container unit.
[0033] In this way, the system can be simplified, while improving
the heat transfer. In an example, the heat exchanger is arranged
over at least a portion of a wall of the container unit.
[0034] Optionally, the heat exchanger is a spiral heat
exchanger.
[0035] The spiral heat exchanger can be arranged to improve the
transfer of heat from the at least one processing unit to the
medium inside the container unit. Many types of spiral heat
exchangers exist. The heat exchanger may be arranged inside,
outside, or both inside and outside of the container unit.
[0036] Optionally, at least two processing units are arranged,
wherein a first processing unit of the at least two processing
units is thermally coupled to a first location at or in the
container unit by means of a first heat pipe, and a second
processing unit of the at least two processing units is thermally
coupled to a second location at or in the container unit by means
of a second heat pipe, wherein the first location is different from
the second location. In this way, the processing units can have
independent thermal paths to the container unit. This may improve
the heat transfer and may also make the system more robust.
[0037] Optionally, the first processing unit is coupled with a
first heat exchanger positioned at the first location at or in the
container unit and the second processing unit is coupled with a
second heat exchanger positioned at the second location at or in
the container unit, wherein the first heat exchanger and the second
heat exchanger are offset with respect to each other in a height
direction of the container unit. The height direction of the
container can e.g. be a longitudinal direction of an upstanding
container unit.
[0038] The temperature of the medium inside the container unit may
be dependent on the location. Typically, in certain conditions,
during use, the temperature of the medium inside the container unit
depends on the height with respect to a height direction of the
container unit. The heat transfer can be improved by arranging the
first and second heat exchanger on different heights. In an
example, the rate of heat (heat flux) generated by the first
processing unit and the rate of heat generated by the second
processing unit are different, so that the heat transfer can be
improved by thermally coupling the first processing unit with the
first heat exchanger and the second processing unit with the second
heat exchanger.
[0039] Optionally, in use, the first processing unit has a higher
thermal energy output capacity than that of the second processing
unit, wherein the first heat exchanger is arranged closer to an
upper end of the container unit than the second heat exchanger.
[0040] As a result of the formed thermal paths from the first
processing unit to the first heat exchanger and from the second
processing unit to the second heat exchanger, the overall heat
transfer of the heat generated from the first processing unit and
the second heat processing unit to the medium inside the container
unit can be improved.
[0041] Optionally, the at least one processing unit comprises a
plurality of components, wherein at least a first component is
thermally coupled to a third location at or in the container unit
by means of a third heat pipe and at least a second component is
thermally coupled to a fourth location at or in the container unit
by a fourth heat pipe, the third location being different from the
fourth location.
[0042] Different components of the at least one processing unit
may, in use, result in different heat fluxes. By forming different
thermal paths from the different components to different locations
at or in the container unit, the overall heat transfer may be
improved.
[0043] Optionally, at least the first component is coupled with a
first heat exchanger positioned at the third location at or in the
container unit and/or at least the second component is coupled with
a second heat exchanger positioned at the fourth location at or in
the container unit, wherein the first heat exchanger and the second
heat exchanger are offset with respect to each other in a height
direction of the container unit.
[0044] Advantageously, the overall heat transfer from the first and
second component to the medium inside the container unit can be
further improved.
[0045] Optionally, in use, the at least one first component has a
higher thermal energy output capacity than the at least one second
component, wherein the first heat exchanger is arranged closer to
an upper end of the container unit than the second heat
exchanger.
[0046] Optionally, the at least one processing unit is arranged on
a bottom side of the container unit and is coupled to a bottom
portion of the container unit.
[0047] Optionally, the system further comprises a module holder
arranged for holding at least one processing unit, wherein the
module holder is thermally coupled with the container unit by means
of at least one heat pipe.
[0048] Such a module holder may be advantageous for installation of
a processing unit. Also, replacement of processing unit can be
facilitated. In this way, a modular design can be obtained in which
every processing unit can be seen as a module. The module holder
may already comprise means for forming a thermal path from a
processing unit placed in a module holder slot to the container
unit. Advantageously the module holder may be adapted to reduce
loss of heat to the surroundings, so as to increase the efficiency
of the heat transfer from the processing unit held by the module
holder to the medium inside the container unit.
[0049] Optionally, a plurality of processing units are received in
the module holder.
[0050] The module holder may be arranged to hold the plurality of
processing units and allow a thermal coupling between the
processing units and the medium inside the container unit. The
module holder may comprise a plurality of slots, wherein a slot is
arranged for holding a processing unit.
[0051] Optionally, at least one processing unit is detachably
connected with the module holder.
[0052] The module holder may comprise a slot for allowing insertion
and removal of a processing unit. By means of the slot a thermal
coupling and electrical connection for powering the processing unit
may be provided. A slot may be arranged for holding a single
processing unit. Additionally or alternatively, a slot may also be
arranged for holding one or more processing units. Further, in an
example, a slot may comprise a cover so as to reduce heat loss to
the surroundings. The slots may have a designation, forming a
thermal path to a location of the container unit. In an example, a
plurality of slots are arranged allowing a thermal path to
different locations of the container unit. A single slot may allow
different thermal paths to different locations at or inside the
container unit. This may improve the transfer of the generated heat
from the at least one processing unit to the medium inside the
container unit.
[0053] Optionally, the module holder comprises at least one
receiving slot arranged for receiving a processing unit, wherein a
processing unit of the at least one processing unit is arranged to
be sled in a receiving slot of the module holder, wherein the
module holder is arranged for providing a thermal coupling between
the at least one processing unit inserted in the at least one
receiving slot and a portion of the container unit.
[0054] The receiving slot may also comprise locking means arranged
for locking a processing unit inside the receiving slot. Further,
actuation means may be arranged for allowing at least partial
automatic insertion of the processing unit inside the receiving
slot of the module holder. Advantageously, the processing unit may
be arranged to be sled in a receiving slot in a position underneath
the container unit.
[0055] Optionally, the module holder comprises a plurality of
receiving slots each configured for receiving a processing
unit.
[0056] In an example, a stack of receiving slots are arranged in
the module holder. In this way, the plurality of receiving slots
may be easily accessible, which may also be beneficial for
maintenance. In a further embodiment, a module holder may comprise
an opening and actuation means for automatically moving a
processing unit inserted in the opening to a certain available
slot. Such a solution may particularly be advantageous when the
module holder comprises a relatively large number of receiving
slots. The system may be simplified, as a plurality of receiving
slots may be occupied by using only one insertion opening. By means
of the actuation means, potentially difficult to reach receiving
slots can be easily selected. Also, the system may be arranged to
automatically detect specifications of the processing unit and
select a receiving slot on the basis of the available
specifications. For instance, a power requirement or heat
generation of a processing unit can be taken into account by the
system for selecting the receiving slot. The receiving slots may
enable a thermal path to different locations in or at the container
unit.
[0057] Optionally, the at least one processing unit in the module
holder is cooled by means of a cooling arrangement arranged for
transferring heat from the at least one processing unit in the
module holder to the medium in the container unit. The cooling
arrangement may allow active and/or passive cooling of the
processing unit.
[0058] Optionally, the system includes a sealed enclosure for
housing the at least one processing unit. Optionally, the system
includes a plurality of sealed enclosures, each housing a
respective processing unit. The sealed enclosure can form a
detachable module, detachable from the system.
[0059] Optionally, the at least one processing unit is cooled by
means of immersion cooling. The at least one processing unit may be
immersed in a liquid inside a sealed enclosure so as to improve
heat transfer. Immersion cooling may also allow higher power usage
by the electronic components of the processing unit, since a more
efficient cooling may be provided.
[0060] Optionally, the container unit comprises an inlet opening
for receiving a fluid and an outlet opening for releasing a fluid,
wherein the heating system is arranged for increasing the
temperature of fluid received at the inlet opening before releasing
the fluid at the outlet opening. A better heat transfer can be
obtained when the fluid is a liquid. Advantageously, the fluid
inside container unit is water.
[0061] Optionally, the inlet opening and outlet opening are the
same.
[0062] Optionally, the medium inside the container unit is water
and the container unit includes a warm water tank arranged for
storing warm water. Optionally, the container unit is a warm water
tank arranged for storing warm water.
[0063] Water can be supplied to the container unit through the
inlet opening for being heated inside the container unit. When
necessary, hot water can be taken through the outlet opening of the
container unit. The hot water can be hot tap water.
[0064] Optionally, the container unit includes an inner tank
contained inside an outer containing tank. The inner tank can
comprise an inlet opening for receiving a fluid and an outlet
opening for releasing the fluid. The inner tank can e.g. be a warm
water tank for storing hot tap water. The outer containing tank can
include a heating fluid at least partially surrounding the inner
tank. Thus, the heating fluid in the outer containing tank can be
used for indirectly heating the fluid, such as tap water, in the
inner tank.
[0065] Optionally, the outer containing tank includes at least one
compartment containing a phase change material. The phase change
material can acts as a secondary heat source, e.g. during times
that a large amount of water is extracted from the inner tank. The
phase change material can also aid in preventing overheating the at
least one processing unit.
[0066] Optionally, the outer containing tank includes at least one
heat pipe arranged for transporting heat from a bottom of the outer
containing tank upwards.
[0067] Optionally, the heating system includes a thermal isolation
positioned between at least one processing unit and the container
unit, and at least one thermal diode allowing thermal energy to be
transferred in a single direction only, from the at least one
processing unit to the container unit. The thermal isolation may be
positioned between a sealed enclosure enclosing the at least one
processing unit and the container unit.
[0068] Optionally, the medium inside the container unit is an
oil.
[0069] Optionally, the medium inside the container unit is
phase-change material. A phase-change material (PCM) is a substance
capable of storing and releasing energy. A PCM can be a latent heat
storage unit, wherein for example heat is absorbed or released when
the material changes from solid to liquid and vice versa.
[0070] Optionally, the container unit comprises one or more
sub-tanks within an outer tank of the container unit. The at least
one heat pipe can be thermally coupled with at least one of the one
or more sub-tank and/or the medium inside at least one of the one
or more sub-tanks.
[0071] Optionally, the system further comprises a controlling unit
arranged for determining a need for thermal energy output for
heating the medium inside the container unit, selecting one or more
computational tasks to be carried out by the at least one
processing unit depending on the needed thermal energy output, and
operating the at least one processing unit to carry out the one or
more computational tasks for obtaining a resulting thermal energy
output substantially corresponding to the needed thermal energy
output.
[0072] In this way, the computational tasks can be adapted to the
demand of the thermal energy needed for warming up the medium
inside the container unit (e.g. water).
[0073] Optionally, the resulting thermal energy output is increased
by selecting more computational tasks.
[0074] Optionally, the resulting thermal energy output is increased
by reducing an interval between successive tasks.
[0075] Optionally, the thermal energy output is increased by
selecting a more computational intensive task.
[0076] Optionally, the thermal energy output is increased by
selecting more or different processing devices. The thermal energy
output generated by a CPU and GPU may differ. In an example, the
energy output is increased by selecting more GPU tasks performed on
a GPU processing device. Furthermore, also an application-specific
integrated circuit (ASIC) may be employed for the purpose of
changing the thermal energy output by selecting more or different
processing devices.
[0077] Optionally, the thermal energy output is programmatically
controlled based on a pressure level or liquid level in the
enclosure. Preferably the enclosure is a sealed enclosure.
[0078] Optionally, the thermal energy output is programmatically
controlled based on a pressure level or liquid level in the
container.
[0079] Optionally, the at least one processing unit is connected to
an electric power source, wherein the controlling unit is
configured for obtaining data representative of a parameter of
electricity of the power source and for allocating the one or more
computational calculation tasks over time on the basis of the
parameter. Hence, the local consumption of electric power for
performing the computational tasks can be controlled on the basis
of the parameter of electricity of the power source.
[0080] Optionally, the power source is at least one of a power
grid, a local photovoltaic solar unit, or a rechargeable
battery.
[0081] Optionally, the parameter is one or more of a voltage of the
electricity of the power grid, a cost per unit of the electricity
of the power grid, an availability of renewable energy, or a
frequency of electricity of the power source.
[0082] Optionally, the data representative of the parameter is
based on a prediction. The value of the parameter can be variable
in time. The prediction can predict the variable value in time.
[0083] Optionally, the controlling unit is configured for
determining data representative of a quantity of thermal energy
needed within a time frame for heating the medium inside the
container unit to a desired temperature, determining a prediction
of the parameter of electricity of the power source for at least a
part of the time frame, and allocating the one or more
computational calculation tasks over the time frame on the basis of
the prediction of the parameter and the data representative of the
quantity of thermal energy needed. Hence, the local consumption of
electric power for performing the computational tasks can be
controlled in time on the basis of the prediction of the parameter
of electricity of the power source and on the basis of the thermal
energy need within the time frame.
[0084] Optionally, the data representative of the quantity of
thermal energy needed is based on a prediction. The prediction can
e.g. be based on historical data about a usage pattern of thermal
energy in time.
[0085] Optionally, the prediction of the parameter and/or the
prediction of the quantity of thermal energy needed is an ongoing
prediction.
[0086] Optionally, the computational tasks are adapted to the mode
of operation, such as gaming, media streaming, batch computations,
etc. Also, the system can be arranged for providing grid power
quality management while heating up the container unit.
[0087] Optionally, the heating system is arranged to guard the
temperature in the vessel so as to protect from overheating the
electronic computer equipment of the at least one processing unit.
Optionally, the heating system is arranged to, when the temperature
in the vessel exceeds a first temperature threshold, indicate to a
user that a limited time is remaining before the processing unit
will be slowed down and/or halted, and/or, when the temperature in
the vessel exceeds a second temperature threshold, slowing down
and/or halting the processing unit.
[0088] Optionally, the heating system is arranged to present the
user with an estimated time remaining before the second temperature
threshold may be reached. The time remaining can e.g. be calculated
based on the current temperature, the maximum temperature allowed,
the average power output while operating the processing unit and
the properties of the storage medium (water, oil or PCM). This
information can be presented locally, e.g. on a display, e.g. via
LED indication, via sound, and/or on a remote device. The remote
device may for example be a TV, smart-TV, mobile phone, smart
watch, tablet, VR-glasses, etc. It is possible that when the second
temperature threshold is reached the processing performed on the
processing unit continues on another computer server and may be
streamed over the internet.
[0089] Optionally, the container unit is thermally insulated so as
to store thermal energy in the medium inside the container
unit.
[0090] Optionally, the container unit is an upstanding vessel.
[0091] In accordance with a further aspect, there is provided
herewith a heating system for heating a medium by means of a
processing unit. The system comprises at least one processing unit
having at least one processor for performing computational tasks,
and a container unit for holding the medium. The at least one
processing unit can be thermally coupled for transferring thermal
energy produced by the at least one processing unit to the medium.
The at least one processing unit can be connectable to an electric
power source. The controlling unit can be configured for obtaining
data representative of a parameter of electricity of the power
source and for allocating one or more computational calculation
tasks over time on the basis of the parameter. The data
representative of the parameter can be based on a prediction of
said parameter.
[0092] Optionally, the controlling unit is configured for
determining data representative of a quantity of thermal energy
needed within a time frame for heating the medium to a desired
temperature, determining the prediction of the parameter of
electricity of the power source for at least a part of the time
frame, and allocating the one or more computational calculation
tasks over the time frame on the basis of the prediction of the
parameter and the data representative of the quantity of thermal
energy needed.
[0093] Optionally, the data representative of the quantity of
thermal energy needed is based on a prediction.
[0094] Optionally, the electric power source is at least one of a
power grid, a local photovoltaic solar unit, or a rechargeable
battery.
[0095] Optionally, the parameter of electricity of the power source
is one or more of a voltage of the electricity of the power grid, a
cost per unit of the electricity of the power grid, an availability
of renewable energy, or a frequency of electricity of the power
source.
[0096] The invention further relates to a container unit,
processing unit and module holder for use in the described heating
system.
[0097] In accordance with a further aspect, there is provided
herewith a method for heating by means of a processing unit. The
method comprises: providing at least one processing unit having at
least one processor for performing computational tasks, and a
container unit holding a medium inside, and thermally coupling the
at least one processing unit with at least a portion of the
container unit by means of at least one heat pipe arranged
transferring thermal energy produced by the at least one processing
unit to the at least one portion of the container unit so as to
heat the medium inside the container unit.
[0098] Optionally, a controlling unit is employed for determining a
need for thermal energy output for heating the medium inside the
container unit, selecting one or more computational tasks to be
carried out by the at least one processing unit depending on the
needed thermal energy output, operating the at least one processing
unit to carry out the one or more computational tasks for obtaining
a resulting thermal energy output substantially corresponding to
the needed thermal energy output.
[0099] It will also be clear that any one or more of the above
aspects, features and options can be combined. It will be
appreciated that any one of the options described in view of one of
the aspects can be applied equally to any of the other aspects. It
will also be clear that all aspects, features and options mentioned
in view of the systems apply equally to the methods and vice
versa.
BRIEF DESCRIPTION OF THE DRAWING
[0100] The invention will further be elucidated on the basis of
exemplary embodiments which are represented in a drawing. The
exemplary embodiments are given by way of non-limitative
illustration. It is noted that the figures are only schematic
representations of embodiments of the invention that are given by
way of non-limiting example.
[0101] In the drawing:
[0102] FIG. 1 shows an example of a heating system;
[0103] FIG. 2 shows an example of a heating system;
[0104] FIG. 3 shows an example of a heating system;
[0105] FIG. 4 shows an example of a heating system;
[0106] FIG. 5 shows an exemplary radiator element;
[0107] FIG. 6 shows an example of a heating system;
[0108] FIG. 7 (a), (b), (c) and (d) show examples of heating
systems;
[0109] FIG. 8 shows an example of a heating system;
[0110] FIG. 9 shows an example of a heating system;
[0111] FIG. 10 shows an example of a heating system;
[0112] FIG. 11 shows an example of a heating system;
[0113] FIG. 12 shows an example of a heating system;
[0114] FIG. 13 shows an example of a heating system;
[0115] FIG. 14 shows an example of a heating system;
[0116] FIG. 15 shows an example of a heating system;
[0117] FIG. 16 shows an example of a heating system;
[0118] FIGS. 17a and 17b show an example of a heating system;
and
[0119] FIGS. 18a and 18b show an example of a heating system.
DETAILED DESCRIPTION
[0120] FIG. 1 shows a heating system 1 for heating by means of a
processing unit 2. The heating system 1 comprises at least one
processing unit 2 having at least one processor for performing
computational tasks. The heating system 1 further comprises a
container unit 4 for holding a medium 10 held inside the container
unit 4. The at least one processing unit 2 is thermally coupled
with at least a portion 6 of the container unit 4 by means of heat
pipes 8, here two heat pipes 8, arranged for transferring thermal
energy produced by the at least one processing unit 2 to the at
least one portion 6 of the container unit 4 for heating medium 10
inside the container unit 4. In this example, the processing unit 2
is arranged below or underneath the container unit 4 with the
gravitational force directed downwards. This can be beneficial for
the heat pipes 8, wherein as a result of the gravitational force G
the condensed liquid from vapour inside the heat pipe 8 at an upper
side 8a of the heat pipe 8 can flow back to a lower side 8b of the
heat pipe 8 which is thermally connected/coupled with the
processing unit 2. In an example, additional means can be arranged
for improving the transfer of heat from the components of the
processing unit 2 to the heat pipe 8, such as but not limited to a
heat sink, heat pump, conduction plate, etc.
[0121] FIG. 2 shows a heating system 1 for heating by means of the
processing unit 2. The processing unit 2 is arranged next to the
container unit 4. Heat generated by the processing unit 2 as a
result of performing computational tasks is transferred by means of
a plurality of heat pipes 8. A thermal path is formed by the heat
pipes 8 from the processing unit 2 to a wall portion of the
container unit 4 so as to transfer the generated heat to the medium
10 inside the container unit 4. Also in this example condensed
liquid from vapour inside the heat pipe 8 at an upper side 8a of
the heat pipe 8 can flow back to a lower side 8b of the heat pipe 8
as a result of the gravitational force G. This may improve the
robustness of the system, as the heat pipes are not dependent on
the capillary effect. However, one or more heat pipes using the
capillary effect can also be used.
[0122] FIG. 3 shows a heating system 1 comprising a container unit
4 in the form of a vessel 4 arranged for providing a heated medium
10. In this example, the medium 10 inside the vessel 4 is water 10.
The water 10 can be heated inside the vessel 4 by the heat
generated by the processing unit 2 performing one or more
computational tasks. In this example, the processing unit 2 is
formed by a computer server being enclosed in an enclosure 12
arranged underneath the vessel 4. The vessel 4 comprises an inlet
14 at a bottom portion for obtaining unheated and/or cold water 10
inside the vessel 4, and an outlet 16 at the top for warm water.
The destination of the heated or warm water 10 tapped through the
outlet can be for usage for commercial, industrial or private use.
Hot tap water generation in a single household home would be an
advantageous usage. The water vessel 4 has multiple contact
surfaces to exchange energy in the form of heat with the computer
equipment. The computer server used can adapt its computational
tasks, and as such the power consumption of the server based on
user requirements, grid power quality and the required heat. In an
advantageous example, the vessel 4 can have a volume smaller than
500 liters, preferably smaller than 250 liters, more preferably
smaller than 200 liters.
[0123] In an example, model A, the system is optimized for heating
water with the purpose of daily hygiene. The usage of tap water
during a working day of a family may be focused around early
morning and late evening. During the weekend a more spread usage of
heated water can be expected, although still with moments of high
and low usage may be possible. Model A can be capable of achieving
a maximum temperature for stopping the growth of legionella
bacteria, e.g. at or higher than 65 degrees Celsius. To achieve
this high temperatures, the water in the tank 4 may need to stand
still for a certain amount of time, depending on the thermal power
output of the electronic components of the at least one processing
unit 2. The thermal output of the components of the at least one
processing unit 2 depends on the type of components and its active
usage.
[0124] In another example, model B, the system can be optimized for
heating homes or buildings, with a lower maximum temperature. Model
A can be designed to heat water that stands still in the vessel 4
for a longer duration than model B. This model has no need for the
water to stand still but can be also operated for some time while
the water is not circulating, up to a safe maximum temperature.
When the maximum water temperature has been reached the computer
server(s) of one or more processing units 2 may stop or reduce
their computational activities. In an alternative manner when the
maximum temperature has been reached the surplus of energy can be
delivered to an outside radiator, a different nearby dwelling, a
swimming pool, a geothermal heatsink, a green house or a public
heat distribution network. Most often for Model B purposes the
vessel 4 may be larger than for model A purposes, although this is
not always needed. To heat building areas, often more energy is
needed which is translated in more computer equipment being
installed.
[0125] In an example, a model can be employed which fulfils the
purposes of both models A and B.
[0126] Model A can be intended for hot tap water usage in private
homes or in commercial, industrial or public buildings. Its design
is optimized to heat tap water that stands still during different
moments of the day in the vessel 4. At irregular intervals a user
may use hot water 10 from the vessel or tank 4, allowing at the
same time to flow cold tap water inside the tank 4 at a bottom of
the tank 4. As such, the heat from the tank 4 is partially or
completely removed. Fresh tap water that comes in at the bottom
through inlet 14 can have a typical temperature range between 10
and 25 degrees Celsius. The target temperature of the warm water
leaving the vessel through outlet 16 may typically be between 45
and 65 degrees Celsius. Other medium temperatures may also be
used.
[0127] The cold water entering in the tank 4 through inlet 14 can
be heated up in different ways inside the tank 4, wherein some or
all may be applied at the same time. Due to the tendency of water
to create temperature layers inside a tank 4, we have envisioned
multiple distinct ways to heat up the water 10 to the desired usage
temperature.
[0128] One or more processing units 2, which may be in the form of
one or more computer servers, may be placed underneath the vessel 4
using at least one heat pipe 8 to transfer the heat generated by
the one or more computer servers upwards. This may ensure that the
computer equipment stays cool at all times. Cold water at the
bottom of the tank 4 is warmed up by heat transferred from one or
more heat absorbing radiating elements 18 through one or more heat
pipes 8. These heat pipes 8 are constructed as best fit for optimal
heat exchange. The diameter, the material and liquid/gas of the
heat pipe 8 are selected based on the expected heat to be
transferred from the computer server(s) 2 inside the enclosure 12.
A heat pipe 8 may transfer the heat from the bottom 8b (warm side)
to the top 8a of its tube (cold side). The top side 8a of the heat
pipes 8 may be attached to the vessel 4 containing water 10. The
heat pipes 8 might be attached directly to the vessel 4 or via an
intermediate heat transfer body to improve contact area, heat
transfer and more evenly spread the thermal energy. This could be
in the form of a metal ring fitting cleanly around the vessel 4 or
it could be metal alloy blocks where the heat pipes 8 are attached
to. It is also possible to use Pyrolytic Highly Oriented Graphite
sheets (PGS Graphite) to improve the heat transfer. The efficiency
of the heat transfer body might be further improved by applying
horizontally one or more heat pipes 8 around the vessel 4, allowing
a more even spread of energy flow around the contact surface.
Alternatively these horizontal heat pipes 8 may be replaced by a
sheet of PGS which has excellent heat transfer properties. The
bottom side of the heat pipes 8 are attached to the radiating
elements 18. The vessel or water tank 4 can be made of a metal or
metal alloy, e.g. copper or stainless steel. This metal may improve
the efficiency of the heat transfer to the water 10 contained in
the vessel 4.
[0129] The heat absorbing radiator element 18 is most often
designed from anodised aluminum. However it could be designed using
other materials capable of heat transfer like for example copper.
The radiator element 18 may be assembled as one piece, or be an
assembly of multiple smaller radiators. The radiator element 18 may
make use of horizontal or vertical heat pipes 8 to improve its
efficiency and/or to connect smaller radiators together (not shown
in FIG. 3).
[0130] A heat pipe 8 can be designed from a metal tube, most often
copper, containing inside a gas under very low pressure. One or
more heat pipes 8 can be attached to the radiator heat absorbing
element 18. The number depends on the amount of thermal heat that
is expected to be transferred from the enclosure 12 to the water
vessel 4. In this example, the bottom of the heat pipe 8 is the
evaporator. The heat pipes 8 are attached at their top to the water
tank 4 (as explained above). This side is called the condenser. In
the example shown in FIG. 3 the top of the heat pipe 8 has a higher
temperature with respect to the bottom of the heat pipe 8,
indicating a heat transfer (flux) from the bottom to the top of the
heat pipe 8. In different examples it is possible to use heat pipes
8 with or without a wick (thermosiphon). In one example, the used
heat pipes 8 are Variable Conductance Heat Pipes (VCHP), which
allow to keep the enclosure and the contained equipment at a
substantially stable temperature.
[0131] In the processing unit 2 enclosure 12 or computer server
enclosure 12, it is optionally possible to have fans installed that
help to circulate the air inside the enclosure 12. The intent is to
enhance the transfer of heat to the radiator element 18.
[0132] To further improve the transfer of heat towards the vessel
4, the radiator element 18 can be equipped with one or more Peltier
elements 20. A Peltier element 20 is a thermo-electric heat pump.
By applying a current at the element, one side becomes warmer and
the other side becomes colder. The Peltier element 20 may force a
movement of thermal energy from the cold side to the warm side. For
efficient installation, we envision the cold side to be connected
directly to the radiator element 18 while the warm side may be
attached to a heat pipe 8 that connects to the vessel 4. By using
heat pipes 8, like a thermosiphon or loop heat pipe with valves, it
is possible to arrange a one way thermal path from the server
enclosure 12 to the vessel 4, protecting the electronics against
sudden thermal shock.
[0133] The one or more Peltier elements 20 can be controlled by the
computer server or by a separate micro-controller (not shown on
FIG. 3). When the temperature in the computer enclosure 12, as
measured by a temperature sensor, is within safe limits, the
Peltier element(s) 20 is/are not actively used. When the
temperature in the enclosure 12 is higher than the upper safe limit
the Peltier element 20 may be activated to pump extra heat from the
enclosure 12 to the water vessel 4. The presence of and the
type/amount of Peltier elements 20 depends on the characteristics
of the computer server installed. The Peltier element 20 may
receive an optimal control signal, most often a Pulse Width
Modulation (PWM) signal by the control unit.
[0134] In the vessel 4 one or more special temperature probe
entries (tubes) 41 can be arranged. These temperature probes 41 can
also be connected to the computer server or the special purpose
micro-controller for being used in changing and/or controlling the
heat transfer. The probes 41 may provide information about the
status of the temperature inside the vessel 4. At least one
temperature probe 41 could be envisioned at the top of the vessel 4
to measure the highest temperature inside the tank.
[0135] As an optional step, heat can be extracted directly from
computer components by a flow of water or similar coolant (transfer
fluid). The components envisioned are those with a modest thermal
output. Water blocks attached to the components transfer the heat
to the cooling fluid. The coolant fluid is pumped in a closed loop
using a pump 24. This closed loop is attached with the bottom
spiral 26. After the water has absorbed the heat from the
components using the water block(s), it enters at the top of the
bottom spiral 26, flowing through the spiral delivering its thermal
energy to the water 10 inside the vessel 4. The water is then
returned to the components of the at least one processing unit 2 to
cool again the components. The pump 24 itself is best placed in the
loop just before entering the first water block, but can be
positioned anywhere in the loop.
[0136] The components that are envisioned to be connected to this
loop are, but not limited to, one or more central processing units
(CPU), the computer motherboard (Southbridge/Northbridge/voltage
controllers), the internal RAM of the computer (Random Access
Memory, often referred to as DDR memory or DIMMs), the hard drives
installed into the system. The exact set of components of the
processing unit 2 may depend on the computers and/or servers used.
The amount and design of the water blocks can depend on the
components used by the manufacturer of the computer hardware.
[0137] The pump 24 used can be of any suitable type, such as a
rotary pump. The pump 24 may have a set of sensors built inside to
determine its functioning. These sensors could consist of voltage
measurement, current measurement, water flow meter, temperature
measurement, vibration measurement. The exact set of sensors may
depend on the pump type used. The value of the sensors can be
captured by the computer server using a connection to the pump (USB
or other interfacing). It could also be envisioned that one or more
special purpose controllers may be built inside the system to
control the pump(s) 24, the fans and the Peltier element(s) 20,
also being able to read out all the sensory information required.
This special purpose controller may be connected to a network (for
example the internet) to allow remote monitoring and control. A
display 28 with control buttons (or touch interface) may be used to
visualize the state of the apparatus to the user and to accept
control requests from the user, like for example to increase or
lower the desired maximum temperature in the vessel 4.
[0138] The liquid flowing through the water blocks and pump 24 is
not pressurized, to avoid possible leaks within the computer
enclosure. This liquid could be distilled water. Additives may be
added to suppress growth of bacteria and fungi inside the water.
Special purpose cooling liquids may be used. The area around the
bottom spiral 26 is expected to be warmed up to a temperature
between 45 to 50 degrees Celsius, but could be higher depending on
the arranged electronics and components.
[0139] Optionally, the system may have means to further increase
the temperature of the medium 10 (e.g. water) inside the tank 4.
For hygiene usage of tap water a maximum temperature of 45 to 50
degrees may not be enough to stop the growth of certain types of
bacteria. Some countries have installed legislation that mandates
that a boiler is able to at least reach a temperature of 65
degrees. To reach this kind of temperatures a top spiral 30 can be
arranged at the top of the vessel 4. This spiral can be arranged to
transfer heat generated from computer components of the at least
one processing unit 2 which can generate and handle higher
temperatures. For example, a Graphic Processing Unit (GPU) is
commonly known to be designed to handle higher temperatures, some
even up to temperatures of close to 100 degrees Celsius. Therefore
these kind of computer components can advantageously be connected
to the top spiral 30 using water blocks and a closed loop. The pump
24 can be installed in the closed loop before the cooling fluid
enters the water block of the GPU card. The most warm water may
enter at the top of the spiral 30 where the heat may be transferred
to the water 10 in the vessel 4. After the transfer of generated
heat to the water 10 in the vessel 4, the colder water may be
transferred again to the GPU card via the pump 24. The temperature
of the water entering the top spiral may be in the range of 65 to
70 degrees Celsius, while the water leaving the spiral 30 is
expected to be no more than 55 to 60 degrees Celsius. Other
temperature ranges are possible depending on the technical
specifications of the graphic processors or other high grade
temperature semiconductors used. It is envisioned that besides
graphic processors also co-processors like for example the Intel
Phi can be used.
[0140] Optionally, the system may comprise auxiliary heating. At
certain moments it might be possible that more warm water is
requested during a certain period in time than the computer server
equipment can warm up in the same period of time. Therefore an
optional electrical heating element 32 can be installed in and/or
to the vessel 4. This can be of the same type as commonly used in
existing boiler systems. The heating element can be controlled by
the computer server or by the micro-controller. It could be
envisioned that a Pulse Width Modulation (PWM) signal is used to
control the heating element to only add the heat that is needed to
reach the desired temperature. It could also be controlled using a
standard dual-metal thermo-switch as commonly found on the
market.
[0141] The system may comprise other parts that are sometimes found
in existing boiler systems. The maintenance hatch 34 is a closed
entrance for a technician to inspect the inner surface of the
vessel and to remove deposits in the vessel 4. An optional anode 36
may be used to avoid corrosion of the vessel 4. It is of a similar
type as found in similar boilers on the market today. A maintenance
door 38 can be arranged, which can be used by a technician to have
access to the processing unit 2, computer server equipment, the
pump 24 and/or the other components that are inside the enclosure
12. For both closed loops, namely the top spiral 30 and bottom
spiral 26 the technician has to be able to add coolant fluid and/or
to extract air. Therefor two small fill systems 40 are envisioned
for allowing this, e.g. one for each loop. Extra fluid and air is
held in the fill tube to allow for the needed expansion of the
fluid during warming up (fluid may expand with higher temperature
in the vessel 4).
[0142] The vessel 4 has the possibility to make use of a retour
system, to have a higher level of comfort to the users. The retour
system may comprise a retour inlet 17. This is similar as in
existing hot tap water constructions. The pump of the retour system
is not shown on the figure. The pump of the retour system might be
controlled by the compute server or by a dedicated control unit, or
by a clock outside of the apparatus.
[0143] FIG. 4 shows a system 1 according to another example using
temperature grade semiconductors 42. The system comprises high
temperature grade equipment, such as for example hash-calculating
semiconductors. It may be possible that there is no need to make
use of the spirals inside the vessel 4, such as the bottom spiral
26 and the top spiral 30 of the example of FIG. 3. In this example,
the semiconductors 42 might be placed in close vicinity of the
radiator element 18, or might be directly attached to the radiator
or via a heat pipe 8 or spreader. In such an example the spirals
26, 30 may be omitted for economic reasons, and all the heat
transfer may happen through the heat pipes 8 at the bottom of the
vessel 4.
[0144] FIG. 5 shows the semiconductors attached directly to the
radiator element 18, which purpose is to transfer the heat produced
by the semiconductors 42 efficiently towards the heat pipes 8. In
one example a sheet of PGS Graphite was placed between the
semiconductors and the radiator to improve heat transfer
properties. In one example, the radiator element 18 can be
thermally shielded from the enclosure 12. Different isolation
materials can be used, like for example a NASBIS insulating sheet
from Panasonic.
[0145] FIG. 6 shows another example wherein the computer equipment
2 or high grade semiconductors 42 are placed inside a module or
sealed enclosure 44 filled with an electrically non-conducting
fluid. In an advantageous example the sealed enclosure 44 is a
metal enclosure. The sealed enclosure 44 can slide at the bottom
and be pressed to the radiator 18. The non-conducting fluid may be
transformer oil or mineral oil; or may be a more advanced fluid
like 3M.TM. Fluorinert.TM. FC-72, 3M.TM. Novec.TM. 7000, 3M.TM.
Novec.TM. 7100, 3M.TM. Novec.TM. 649 or any mixture their off. The
metal enclosure 44 may be attached to the radiator or be pressed to
the radiator element 18 using a pressure mechanism (not show on
picture). In this example the radiator might take the form of a
flat plate or any other suitable form to easily press the sealed
enclosure 44 to the radiator element 18. The main advantage of
using a sealed enclosure 44 is the ability to better resist
corrosion and to easily replace the computer server. When using a
two phase emersion cooling fluid one has also the possibility of
omitting moving parts to transfer fluids and as such to reduce
audible noise and power consumption. In the example of the system
in FIG. 6, a sealed enclosure 44 is shown that can be sled beneath
the radiator element 18. By using quick connect plugs at the back
of the enclosure and slide unit, the heat producing computer can
easily be placed or replaced by a skilled technician.
[0146] Alternatively, or additionally, drip free fluid and/or gas
connectors can be employed to connect the fluid inside the sealed
enclosure 44 to a piping system at the back of the vessel in case
there is a need to transfer heat towards spirals 30,26, in such
case there is a need to have a higher thermal output towards the
vessel 4. The spirals may be filled directly with the cooling fluid
(as mentioned above) or be filled with an intermediate cooling
fluid, like for example distilled water. In case of using an
intermediate cooling fluid an extra pump might be arranged for
circulating the intermediate cooling fluid. The pump(s) for moving
the fluid around might be installed in the enclosure or inside the
sealed enclosure.
[0147] FIG. 7a shows a heating system 1 comprising a sealed
two-phase immersion cooling enclosure. The computer equipment is
immersed in a liquid, shown in FIG. 7a by a liquid level 46. Inside
the enclosure a heat pipe 8c is placed, attached to the top of the
sealed enclosure. The bottom part of this heat pipe 8c has heat
pipe fins 48 attached to improve heat transfer. The heat pipe 8c
and fins 48 are placed above the liquid level 46. The main function
of the heat pipe 8c is to cool the formed gas and to transfer the
heat quickly toward the top of the enclosure where it can be
transferred via the PGS sheet to the heat pipes 8 connected to the
tank or container unit 4. When the gas cools it may become liquid
and drip down making this a closed loop. In another example the
heat pipe 8c inside the sealed enclosure is replaced by a folded
PGS Graphite sheet, attached to the top inside of the sealed
enclosure (not shown in figure). The connectors for power and
network interface are placed above the liquid level to avoid
leakage and preferably above the level of the heat pipe 8c, where
the gas concentration is the lowest. The sealed enclosure may be
slightly over or under pressurized to change the boiling point of
the two-phase cooling liquid. When using a two-phase immersion
fluid the CPU and/or GPU used can be treated with a microporous
metallic boiling enhancement coating to improve the heat transfer
towards the fluid and improve the boiling process.
[0148] FIG. 7b shows a heating system 1 comprising a sealed
enclosure 44 using a heat pipe 8c to transfer the heat to a
backplate 50. In an advantageous example the sealed enclosure 44 is
a metal enclosure 44. In another example the heat pipe 8c in the
sealed enclosure 44 may be brought to the outside of the sealed
enclosure 44, penetrating the wall of the sealed enclosure 44.
During installation the part of the heat pipe 8c outside the
enclosure 44 may be inserted into the manifold of the backplate 50.
The backplate 50, can be made of a metal alloy like for example
aluminum or copper. The backplate 50 may be cooled by a heat
transfer fluid (for example water). The heat transfer fluid may be
pumped around by means of a pump 49 and may be cooled as disclosed
above. Multiple heat pipes 8c may be used with a single backplate
50 if a single heat pipe 8c is not sufficient to cool the gas
inside the sealed enclosure 44. It is possible also to add extra
heat pipes 8c that are inside the enclosure 44, partially or
completely below the liquid level 46 to cool the contained liquid,
if necessary.
[0149] FIG. 7c shows a heating system 1 with a sealed enclosure 44
filled with a dielectric fluid. In this example the sealed
enclosure 44 is filled with mineral oil, transformer oil or
bio-based oil. The electronics of the processing unit is arranged
below the liquid level 46 of the oil. At the bottom of a top lid of
the sealed enclosure 44 a large radiator 52 is arranged comprising
a plurality of fins which may partially be submerged into the oil.
This radiator 52 may transfer the heat from the cooling oil towards
the top of the sealed enclosure 44. In order to improve the heat
transfer of the sealed enclosure 44 to the heat pipes 8 attached to
the radiator 52, a PGS Graphite sheet can be used similarly as in
above examples. Optionally, to improve heat transfer towards the
vessel 4, the oil may be pumped outside of the sealed enclosure 44
by means of a pump 49, e.g. through drip-free plugs, transferring
the oil e.g. to spirals or heat pipes 8 installed on the vessel.
Heat sinks may be attached to the components producing more heat.
Those heat sinks may allow the oil to pass through them, to
transfer the heat produced by those components efficiently to the
oil. Another way to cool the oil would be to use one or more heat
pipes 8 penetrating the sealed enclosure 44 and cooled by the
backplate 50 as described above.
[0150] FIG. 7d shows a heating system 1 with a sealed enclosure 44
filled with a fluid, such as a dielectric fluid. This fluid may for
example be an oil. The fluid remains inside the sealed enclosure 44
and is pumped around using a pump 49 arranged inside the enclosure
44. The oil may pass through heat sinks attached or coupled to heat
producing computer components of the processing unit. The order of
transfer may be from those components with the least heat flux
first towards those components with the highest heat flux last. The
oil is then passed towards heat transfer elements 44h at the top of
the sealed enclosure 44. Those heat transfer elements 44h, having
fluid ports, are attached underneath or on the heat pipes 8i and 8j
to efficiently transfer the heat onto the evaporator of the heat
pipe. Two heat pipes are shown, but another number of heat pipes
can be employed. The enclosure may also have a radiator 58 to
improve heat from the oil towards the heat pipes 8i, 8j as
explained in FIG. 7c. The example shows the use of two heat pipes
with different lengths. More or less heat pipes 8i, 8j could be
used if needed. By using different lengths for the heat pipes 8i,
8j, different areas of the medium 10 inside the container 4 could
be prioritized for heat delivery. It is envisioned that the longest
heat pipes will deliver the most energy at the top part of the
container 4 first, while the shortest heat pipes will deliver the
remaining energy at the bottom part of the container 4 last. As
such the order of delivery is best kept longest first--shortest
last.
[0151] In the example shown in FIG. 7d, the sealed enclosure 44
comprises a processing unit including a CPU unit and a GPU unit.
Fluid (e.g. oil) is guided to the CPU unit for enabling heat
transfer, and subsequently guided to the GPU unit. The power output
of the GPU unit may be higher than the power output of the CPU
unit, so that more heat can be generated by the GPU unit. As a
result, the fluid may be first heated by the CPU unit and
subsequently heated by the GPU unit to a higher temperature. It is
envisaged that more stages can be employed for step-wise increasing
the temperature of the fluid (e.g. oil or other dielectric fluid).
It will be appreciated that other configurations are possible, e.g.
wherein the fluid is first heated by a GPU unit and then downstream
by a CPU unit.
[0152] FIG. 8 shows a heating system 1 according to a further
example comprising (heat exchanging) spirals 26a, 30a arranged on
an outside of the vessel 4. A top outer spiral 30a and a bottom
outer spiral 26a is arranged. This may be advantageous in a
domestic setting. The functionality is similar to using spirals
inside the vessel. As seen above, it is possible to use one or two
spirals. If using one, the spiral may cover the whole vessel, or a
part of the vessel. Advantageously, a safer system can be obtained,
especially when the medium inside the vessel 4 is water used as
drinking water. In this case, no toxic substances can be released
into the water as a result of leakage of the spiral(s).
[0153] FIG. 9 shows a heating system 1 according to a further
example. The system 1 employs one or more heat pipes 8d inside the
vessel 4. The outer spirals 26a and 30a can be replaced by heat
pipes 8d inserted into the vessel 4. Those heat pipes 8d can have
fluid ports and a heat transfer body at the outside of the vessel
4. The heat transfer body transfers the energy from the fluid
flowing through the body onto the heat pipe 8d. The heat pipe 8d
itself transfers the energy to the water 10.
[0154] FIG. 10 shows a heating system 1 according to a further
example, the system 1 comprising a, e.g. pressureless, vessel 4 or
container unit 4. Water, or another medium, can be provided to the
vessel 4 comprising a medium at a higher temperature than the water
provided. A heat exchanger 63 is arranged inside the vessel 4, at
least partially surrounded by the medium 10 inside the vessel 4,
through which heat exchanger 63 the water is guided so as to heat
up the water by means of heat transfer between the medium 10 inside
the vessel 4 and the water pumped through the heat exchanger 63
(e.g. spiral). The heated water can then be received at an outlet,
for use. The vessel 4 itself may contain water 10 as the medium
inside the vessel 4. The hot tap water can be stored in a large
spiral inside the vessel where the cold water enters at the bottom
of the spiral and leaves at the top. The advantage of this example
is that the water contained in the vessel is used as a heat storage
medium and never leaves the vessel. This prohibits calcification in
the vessel and thus reduces the maintenance cost and durability of
the installation. Another advantage is that because the hot tap
water is inside the spirals 63, no formation of the legionella
bacteria can occur. As such the maximum temperature that the vessel
needs to reach does not have to be 60 degrees Celsius or more, but
can be lowered to 55 degrees which may save on energy costs. The
pressureless vessel may be filled with water during installation.
When the vessel is filled the valve at the inlet is closed by the
technician. In FIG. 10 a pressureless vessel is shown using an
optional heat pipe 8d as an auxiliary heating device. This could
optionally also be one or more spirals if enough space is available
inside the vessel.
[0155] FIG. 11 illustrates a heating system 1 according to a
further example, the system 1 comprising a, e.g. pressureless,
vessel 4 containing a phase change material (PCM) as the heat
storage medium 10 inside the vessel 4. Paraffin based PCMs are
known to be expensive and have under specific circumstances been
identified as carcinogenic. Paraffin may be distilled form fossil
oil and as such may contribute to climate change. Due to the recent
breakthroughs in the field of vegetable based phase change
materials, PCMs have become readily available at affordable prices.
Melting points are now brought in the range where they can be used
in household environments. Vegetable based PCMs are not
carcinogenic and have no negative effect on human health nor the
environment and can even be used in food sensitive environments. In
an example, a vegetable based PCM 10 can be used with a sharp
melting point of approximately 48 degrees Celsius. The PCM may be
completely solid below 47 degrees Celsius and may be completely
liquefied from 51 degrees and above. Another melting point of the
PCM 10 could be used but this may need to be in the usable
temperature range for its purpose, for example domestic hot water
usage (35 to 60 degrees Celsius). During the phase change from
solid to liquid the PCM 10 absorbs a high amount of energy without
increasing its temperature. This is called latent heat. Only after
the PCM 10 has completely melted, the temperature may steadily
increase (sensible heat) when adding more energy. Because of this
effect the PCM 10 is ideal for usage in a hot tap water vessel
where a processing unit or a computer server is used as the heating
device.
[0156] As an alternative PCM an inorganic phase change material can
be used, like for example a salt. Again a heat exchanger 63 in the
form of a spiral is arranged inside the vessel 4 for allowing heat
transfer between the PCM medium 10 inside the vessel 4 and the
water pumped through the heat exchanger. In this way, the
temperature of the water can be increased so as to obtain heated
water, which can for example be used for domestic, commercial
and/or industrial purposes.
[0157] The temperature of the computer servers can be kept at a
more constant temperature due to the phase change effect of the
PCM. Typically the CPU of a server is designed to safely operate at
their junction at temperatures up to 70 degrees Celsius and a GPU
up to 100 degrees. To cool those electronics efficiently, the
cooling medium should not be more than 10 degrees below the
components maximum junction temperature, preferably less. By using
a PCM the temperature inside the sealed enclosure may not be above
such limit as there is no need to stop the growth of bacteria
inside the vessel by applying a high temperature. When the user
uses hot water the temperature fluctuation inside the vessel may be
temperate as the latent heat in the PCM may be used to heat up the
water flowing through the heat exchanger 63 (spirals). Using a PCM
the vessel may be able to absorb about 3 times as much energy than
a comparable vessel containing water. This feature can be used to
store energy during longer periods of time, up to days, which is
important for balancing the electricity supply grid and charging of
the vessel during specific moments like for example on sunny
days.
[0158] In this example the computer server is contained in a sealed
enclosure 44. Different examples, as described above can be used.
The sealed enclosure 44 can be placed by the technician underneath
the vessel 4 using sliding bars and be pressed against the radiator
element 18 using a pressing mechanism. The radiator element 18,
similar to the radiators described above, has a large contact
surface with the sealed enclosure 44. The radiator may be enhanced
using a PGS sheet, heat spreaders and/or heat pipes to enhance its
thermal characteristics. The radiator is attached to one or more
large vertical heat pipes 8 which brings the heat from the radiator
18 to the PCM 10. The one or more heat pipes 8 can be of the type
thermosiphon (without a wick) because of its vertical position
which reduces the overall cost and provides a higher level of
protection for the electronics due to its single direction thermal
path of operation. It is also possible to use other types of heat
pipes 8 to improve the heat transfer properties, like heat pipes 8
with a wick, diode heat pipes 8 or variable conductance heat pipes
8. Each heat pipe 8 has a large contact surface with the PCM 10.
PCMs can have a lower thermal conductivity than water (usually
about half or less). Therefore, a large surface area is needed to
transfer enough energy to the PCM. Additionally, additives that
improve the thermal conductivity of the PCM can be added to the
PCM, like for example graphite foams or metal-micro structures.
Other means of improving the heat transfer inside the PCM can be a
thin metal structure that enhances the transfer of heat inside the
vessel 4. For example a lightweight grid structure made of aluminum
improves the heat transfer several times without reducing the
effectiveness of the PCM. The aim of the structure is to have the
PCM have a uniform temperature in the vessel 4, making the phase
change occur smoothly. In case even a higher contact area with the
PCM would be needed, a secondary heat exchanger, for example spiral
inside vessel, spiral outside vessel and/or heat pipe, as described
above, could be employed. In another example, the PCM 10 can be
contained in (micro-)capsules immersed in a liquid, notably
water.
[0159] The spiral 63 inside the vessel (heat exchanger) containing
the water to be heated for domestic usage also can have a large
contact area with the PCM 10 to ensure enough energy is transferred
to the water. The vessel has a maintenance hatch 34 for filling the
vessel 4 with the PCM 10. As most PCMs 10 expand considerably
during their phase change from solid to liquid, the vessel 4 has an
area for expansion 54. This area may be filled by the PCM 10 when
the PCM 10 is in a liquid state. The area needed depends on the
expansion coefficient of the PCM 10. A pressure valve 56 may
safeguard the vessel from rupture in case a malfunction would
occur.
[0160] FIG. 12 shows an example with a processing unit 2 arranged
in a two-phase (liquid to gas) sealed enclosure 44, which is being
cooled by two thermosiphon using a PCM as a heat storage medium 10
inside the container unit 4. Multiple heat pipes 8i, 8j, 8k are
arranged between the processing unit 2 and the medium 10 (PCM)
inside the container unit 4. The heat pipes 8i, 8j are arranged
through a wall portion of the container unit 2 and a thermal
isolation is placed between the container unit 4 and the processing
unit 2, surrounding the heat pipes 8i, 8j, so as to reduce heat
losses to the surroundings and/or improve the heat transfer of the
generated heat by the processing unit 2 to the medium inside the
container unit 4, as a result of performing one or more
computational tasks. Further, in the shown example, a third heat
pipe 8k is used together with a Peltier element 20, as already
described above. The radiator is improved with gas pockets 9a, 9b
underneath the heat pipes 8i, 8j that may partially trap produced
gas above the GPU and/or CPU, respectively. The gas may deliver its
heat content more direct to the heat pipe above. When the gas
pocket is full the gas overflows to the other parts of the
radiator. The heat pipes 8i,8j are of different lengths, allow
delivery of heat to different parts of the medium 10 where the
electronic components with the highest heat flux may be directed
underneath the heat pipe to deliver its heat to the top part of the
vessel 4. The sealed enclosure 44 may be connected to a back plate
allowing power, network to pass into the enclosure. The liquid
inside the enclosed container 44 may be in contact with a pressure
sense tube 45. This tube may be partially made of a plastic or of
glass. When the liquid in the sealed enclosure 44 partially
transforms to gas, the created pressure by the expansion may push
the liquid in the pressure sense tube outwards, moving the floating
ball in the tube. A sensor may detect the movement. Advantageously,
the processing unit 2 may change its power delivery based on the
level detected in the pressure sense tube. A pressure valve is
attached to the tube allowing build up pressure to be released.
Please note that the drawing is schematic and simplified to retain
clarity of the drawing; the reader will assume similar parts as
show in FIG. 11 such as isolation, a surrounding container,
expansion area and other parts.
[0161] According to another model, model B, the system can be used
for heating in a building and/or facility. For purposes of heating
a building a less high temperature is often required. The building
that the user wants to warm up, can have a high thermal insulation
so a low temperature heating system can be used. Because a higher
amount of energy is needed to warm up a building more server
equipment must be used. Often also a larger vessel 4 size may be
used. While this is often between 100 and 300 liters for a warm tap
water application, it is envisioned that for heating up buildings,
such as single family homes, a vessel 4 between 150 and 1000 liters
may be used.
[0162] FIG. 13 shows an example of a system 1 for use in the second
model B. The boiler is similar to model A described above. An
important difference is that there is no need for the water (heat
transfer fluid) to stand still during the warm-up phase. Often one
spiral 57 is sufficient to transfer the heat from the enclosure to
the water in the tank 4. However a plurality of spirals may be
used. There is as such also only one closed loop using one or more
pumps 24. The cold water in the loop after leaving the pump first
enters into the water blocks of those elements of the one or more
processing units 2 that generate less heat (CPU, hard drives,
motherboard, etc.). After leaving these elements the water may
enter into the water blocks of those elements that can handle
higher temperatures and produce more heat, like GPUs. The system of
FIG. 13 comprises a plurality of processing units 2. In this
example three computer servers are stacked on top of each other.
Other numbers and/or arrangements are also possible. This could be
more or less depending on the energy requirements of the building.
As less high temperatures are needed to warm a building it could be
envisioned that a server could have one or more CPUs, and little or
no GPUs. This depends on the computational tasks that needs to be
performed. It could be envisioned that inside the enclosure 12
other equipment could be installed that is needed to operate this
cluster of computers, like for example a network switch and/or an
uninterruptable power supply unit (UPS). The main principle of
transferring the heat of the computer equipment of the at least one
processing unit 2 into the vessel 4 remains the same, using one or
more heat pipes 8, an optional Peltier element 20 and in this
example a spiral 57.
[0163] The temperature of the cold water entering the vessel 4 can
be expected to range between 15 and 25 degrees Celsius. The
temperature of the warm water leaving the vessel 4 can be expected
to range between 18 and 35 degrees Celsius.
[0164] Also model B can be designed using the examples as described
for model A to support sealed enclosures or high grade temperature
semiconductors.
[0165] An optional Peltier element 20 is shown which can be
arranged for controlling and/or changing the heat flow towards the
vessel 4, if needed.
[0166] Also here, at least one heat exchanging spiral in or on a
vessel 4 is used so as to facilitate the heat exchange of specific
computer components of the at least one processing unit 2 to the
medium 10 inside the vessel 4 (e.g. water).
[0167] The at least one processing unit 2 can have an enclosure
which is arranged to be sled underneath the vessel 4, the enclosure
containing the computer equipment to be cooled. The equipment
inside the sealed enclosure can be water cooled, cooled by a
two-phase immersive fluid or by mineral or transformer oil. Other
solutions can be envisaged. A phase change material can be used to
store the heat of the at least one processing unit 2 (e.g. computer
server(s)).
[0168] FIG. 14 shows an example for model B using a PCM 10 as the
medium inside the vessel 4. A backplate 50 is arranged containing
one or more manifolds where the heat pipes can make contact with
the cooling medium (in case of a two-phase immersion model). The
cooling medium may be pumped to a spiral 57 inside the vessel 4. In
case the sealed enclosures is of the oil containing type, the
backplate 50 may also be arranged with drip free connectors to
directly use the oil as cooling medium in the spiral 57.
Advantageously, in this example the melting point of the PCM 10 can
be chosen depending on the storage capacity and the heating
delivery system of the building. The water to be heated flows
through a dedicated heat exchanger 63 (e.g. spiral) to absorb the
heat from the medium 10 (e.g. PCM).
[0169] A plurality of sealed enclosures may be placed next to each
other, each containing a computer server or similar electronics.
All of those may make contact with the radiator attached to the
heat pipe 8. The sealed enclosures 44 may be placed on their side
to save on space such that enough room remains underneath the
vessel 4 to place multiple pieces.
[0170] FIG. 15 shows an example usable as model A or B, using a PCM
10 as the medium 10 inside the vessel 4, similar to the example of
FIG. 14. The container unit 4 comprises a sub-tank 62 within an
outer tank. A heat pipe 8 is thermally coupled with the medium 10
within the container unit 4 and with the water in the sub-tank 62
of the container unit 4. The water tank 62 is surrounded by the PCM
10. The heat pipe 8 may also be in thermal contact with the
sub-tank 62, so as to transfer heat efficiently to the water. A
plurality of sub-tanks may be enclosed by an outer tank of the
container unit 4. Additionally or alternatively, the heat pipe may
also be coupled with a wall portion of one or more sub-tanks of the
container unit so as to improve heat transfer. The water inside the
tank 62 is ready for immediate use. The sub-tank may be connected
to a heat exchanger 63 to be able to heat up the water flowing
through more easily. The cooling medium of the sealed enclosure 44
may be pumped through a spiral 57 to enhance heat transfer. The
principles as explained before can be applied also to this
model.
[0171] FIG. 16 shows a system 1 according to a further example. The
heating system 1 comprises a module holder 58 which is arranged for
holding a plurality of, here four, processing units 2. The module
holder is thermally coupled with the container unit 4 by means of
one or more, here two, heat pipes 8. A plurality of processing
units are received in the module holder 58. A processing unit 2 can
be detachably connected with the module holder 58, so that it can
be removed and/or replaced, automatically by means of actuation
means or manually by a user. In this example, the module holder 58
comprises four receiving slots 60 arranged on a stack, each adapted
for receiving a processing unit 2. In an example, the processing
unit 2 is arranged to be sled in a receiving slot 60 of the module
holder 58. The module holder 58 is arranged underneath/below the
container unit 4. The module holder is adapted to provide a thermal
coupling, by defining one or more a thermal paths, between at least
one processing unit 2 inserted in a receiving slot 60 and a portion
of the container unit 4 or vessel 4.
[0172] The receiving slots 60 of the module holder 58 are arranged
horizontally on top of each other. However, other configurations
are also envisaged. For example, the receiving slots may be
arranged to be vertical. The receiving slots 60 of the module
holder 58 may also be angled. Further, the receiving slots 60 may
also be arranged next to each other rather than on top of each
other. Many variants are possible.
[0173] FIG. 17a shows a frontal cross section of an example where
the usable drinking water 10 is stored in an inner tank 62. The
inner tank 62 can be pressurized, e.g. up to 8 bar; as such a
rounded form can be beneficial. The sides of the inner tank 62 may
be curved to allow for easy expansion and contraction of the vessel
during thermal changes. The inner tank 62 is filled with drinkable
water 10 and has an inlet 16 for cold drinking water, and outlet 14
for warm drinking water and a retour 17. The inner tank 62 is
submerged in an outer containing tank 4. The inner tank 62 protects
the contained drinkable water 10 inside from the (potentially)
undrinkable water 10a of the outer tank 4. The outer tank 4 could
also be filled with an alternative heating fluid, such as glycol.
The outer tank 4 can be slightly pressurized, e.g. up to 2 bar. In
this example the outer containing tank 4 is rectangular, but a
round form could be used.
[0174] The outer tank 4 has an inlet 64 and an outlet 66 to be
connected to an external heating device (not shown in the figure),
like for example a heat pump. The heat pump can heat up the water
10a in the outer tank 4 to indirectly heat up the water 10 inside
the inner tank 62. In this example, inside the outer tank 4 are
compartments, here four compartments, or chambers 72 which contain
a phase change material (PCM) 10b. The phase change material can
act as a secondary heat source during the time that a large amount
of water is extracted from the inner tank. Due to the modest heat
production capability of the computer server, the PCM will assist
the computer server in quickly heating up the water 10 inside the
inner tank. Another benefit of the PCM is that due to its latent
heat capacity, the computer server will not overheat as quickly as
the PCM will absorb the extraneous energy output from the computer
server; here the PCM acting as a heat sink while e.g. the PCM goes
from a solid to a liquid state; as a result the sensible heat will
remain within a safe limit for the server equipment. Another number
than four PCM chambers could be applied, but four fits the amount
of corners of the outer rectangular vessel 4. The chambers 72 could
have another shape. The phase change material could also be in a
separate shell around the outer vessel 4. However, to reduce space
here they are placed inside the tank 4. The phase change material
contained inside the chambers 72 in this example is an inorganic
salt with a melting point of about 58 degrees Celsius, but could be
any other suitable phase change material. The compartments 72 are
sealed and protect the PCM 10b from the medium 10a, here water,
inside the outer tank 4. Each chamber can store the same type of
PCM 10b, or different types of PCM 10b could be used in each
separate chamber 72. A chamber 72 could also be subdivided
containing different PCMs 10b for each thermal layer of the boiler
1. Fins or other heat conducting elements could be added to or on
the chambers to improve thermal conductivity.
[0175] In this example the sealed, e.g. metal, enclosure 44 is
placed underneath the outer tank 4 and is in direct thermal contact
therewith. The sealed enclosure 44 is in this example mostly filled
with a mineral oil 70. Here heat pipes 81 inside the sealed
enclosure 44 are attached to specific heat generating parts like
the CPU/GPU and transfer the thermal energy to the top of the
sealed container 44. Here, the heat pipes 81 are with their top
part connected to a central place of the top plate of the sealed
container 44. This will allow for a higher energy flux to the heat
pipes 8m inside the outer tank 4, which have their evaporators
placed above or in close vicinity of the condensers of heat pipes
8l. By reducing the distance between the condensers of heat pipes
8l and the evaporators of heat pipes 8m a low thermal resistance
can be achieved. The heat pipes 8m (in this embodiment four, but
any number could do) transfer the heat from the bottom of the tank
4 to a higher level inside the tank, closer to the top of the tank.
In this example the heat pipes 8m are partially connected to the
bottom of the tank 4 (evaporator part of the heat pipe) and are
connected for the remaining part to the wall of the PCM container
72. The wall of the PCM container 72 may act as a heat spreader.
Here, the heat pipes 8m stretch completely to the top of the tank
4, where they can deliver their energy most efficient to the medium
10a inside the outer tank 4. Beneficially, by using heat pipes 8m
of the type thermosiphon the energy of the warm water at the top of
the tank 4 will not transfer downwards to the bottom of the tank 4
where there is often more cold water 10a, thus avoiding mixing of
energy layers. This is a large benefit making the system overall
more efficient. Thermal sensitive electronics 68, like e.g. hard
drives are best placed outside hot areas, like in this example in a
separate area underneath.
[0176] FIG. 17b shows a top view of the example of FIG. 17a. Here,
each thermosiphon heat pipe 8m is attached to a wall part of the
PCM container 72. Optionally a thermal connection between the top
part of the inner vessel 62 could be made with the heat pipes 8m to
further improve the thermal transfer.
[0177] FIG. 18a shows another example more suitable to be connected
to a, e.g. gas, furnace instead of to a heat pump. A gas furnace
has a higher energy output than a heat pump, as such the
electronics in the sealed enclosure need to be protected extra.
Here, this is done by placing a thermal isolation 22 between the
sealed enclosure 44 and the outer tank 4. To allow heat to travel
from the sealed enclosure 44 to the tank 4 but not the other way
around, here thermosiphon heat pipes 8n are used. It is also
possible to use a loop heat pipe with valves. The heat pipes 8n
will act as thermal diodes, allowing thermal energy to be
transferred in a single, often upward, direction only, protecting
the electronics from thermal shock. FIG. 18b show the top view of
the example as explained for FIG. 18a. It will be clear to the
knowledgeable engineer that a combination can be made between what
is disclosed in FIG. 18a/FIG. 18b and FIG. 17a/FIG. 17b.
[0178] The heating system 1 can employ different modes of
operation. Advantageously, the at least one processing unit, e.g.
computer server(s), can be able to provide services to the home
users and to provide batch like computational services to a central
server (distributed computing). The computer server can be
configured to adapt its computational tasks based on the priorities
linked to certain operational modes. Three modes can be identified:
an exclusive user mode (for example for gaming), a shared user mode
(multi-media applications), and a shared batch mode (distributed
computing).
[0179] In the exclusive user mode the computer server may operate
with all or most of its computing resources allocated to the user
process so as to provide the best possible experience. The server
may be acting as a game console to provide a gaming experience to
one or more users. This can be in the form of streaming the video
output to a remote screen (television) or to one or more mobile
devices. The game output may be streamed over the local area
network (LAN), or other network technology to the output devices
(TV/smartphone/tablet or others) using cable or wireless (e.g.
Wi-Fi). Standardized equipment can be used, like HDMI, DisplayPort,
Miracast, Chromecast or others. It is also possible to stream the
gaming content over the internet to remote users or to have
multiple users participate in the same game. The game can be
controlled by a remote control, a joystick, joypad or mobile device
(like smartphone or tablet). The power output of the computer
server may fluctuate based on the input from the users and the
games at hand and as such may heat up the vessel in an accelerated
pace. The system 1 can be arranged to guard the temperature in the
vessel 4 so as to protect from overheating the electronic computer
equipment of the at least one processing unit 2. Two temperature
barriers can be identified: warning and danger. When the
temperature in the vessel 4 exceeds a certain temperature, the
user(s) who is/are playing the game may be warned that the
temperature is already quite high and that a limited time is
remaining before ending the game. It is possible to present the
user with an estimated time remaining before the danger threshold
may be reached. The time remaining can be calculated based on the
current temperature, the maximum temperature allowed, the average
power output while running the game and the properties of the
storage medium (water or PCM). While playing LED lighting on the
heating system 1 may change from color to indicate the remaining
time available for gameplay until the maximum allowed temperature
is reached. In one example it is possible that when a temperature
threshold is reached the game being played may continue on another
computer server streamed over the internet to the output device(s)
of the user(s). It is also possible that during the time the game
is played the grid power quality becomes deteriorated. This may be
indicated by a very low voltage and/or a very low grid frequency in
relation to the grid standard in that area or a signal from a local
grid operator. In such occasion the user(s) may be warned about
this event and may be given the choice to halt the game or not. In
such case the user(s) decides to halt the game, the computer server
may consume less electricity and aid in the recovery of the grid
power quality. The server may reduce also its computational
resources to the game to reduce energy consumption. The user may
have the possibility to request (schedule) the server to
temporarily reduce its target temperature during one or more
specific timeslots (plan ahead), with the intent to build up a
thermal reserve for gaming. This may insure the user(s) may have
enough time to play their game during that timeslot without
reaching the maximum temperature too quickly in the vessel 4. The
user may choose to disallow other computational resources to be
used during gameplay or to assign a percentage. In such case the
heating system 1 can be attached to a heat consuming device, such
as a dishwasher and/or washing machine, via its retour system 17,
the heating system 1 may send a start signal to these respective
devices and/or the retour pump, to start consuming warm water from
the heating system 1. Advantageously this will reduce the
temperature inside the vessel 4 and prolong the duration until the
maximum temperature is reached inside the tank 4.
[0180] Another identified mode is the shared user mode. This could
be used for providing the user(s) with a multimedia experience. In
this mode less computational resources of the computer server are
needed to provide content to the user. As such this mode can be
shared with other non-exclusive modes depending on the available
compute resources remaining. Media in the form of music, movies or
other content may be streamed directly to one or more screens
and/or media receivers by using technologies like DLNA, Chromecast,
Miracast or other over wireless (e.g. Wi-Fi) or cable. In this mode
the computer server is able to provide content also via file
sharing and web serving to local users on the local area network
(LAN) or to user(s) on the internet. It is possible to control the
playback of the content via an app on a mobile device, a web
browser, an application on a PC, a remote joystick, controller,
keyboard or other. The amount of compute resources needed highly
influences the rate at which the temperature in the vessel may
increase and is difficult to predict. In this mode the power output
of the computer equipment may most often not suffice to keep the
vessel up to temperature or to bring the vessel to the requested
temperature on a specific time of the day. Therefore this mode is
often shared with the batch computing mode.
[0181] In the batch computing mode the computer server may execute
pre-assigned tasks. The computer server may keep a list of tasks to
be executed. When the list is empty or the list is below a certain
threshold the computer server may request more tasks from a central
server which holds all the tasks to be assigned among all instances
available to the central server, i.e. distributed computing. In
another example the database is itself distributed among different
servers, or a blockchain database could be used. The computer
server may execute tasks sequentially or may execute multiple tasks
simultaneously (parallel execution). The tasks can be of any
suitable type, for example scientific, financial or medical
applications, crypto-currency calculations, 2D/3D animation
rendering and more. When the result of a batch process has been
calculated it is sent to the central server immediately over the
internet or at a later time. In case of usage of a blockchain
database the result may be placed on the blockchain itself. In the
batch computing mode the resources of the computer server can be
shared with the shared multi-media mode, where the multi-media
tasks have a higher precedence than the batch related tasks. A
major difference compared to the other modes is that the pace of
execution of the batch tasks depends not on the interaction with
the user(s) but on the energy required to heat up the vessel and/or
the grid power quality.
[0182] For the purpose of power to mode/process assignment, the
system 1 can be equipped with a power meter. The meter can be
configured to measure power (W), voltage to neutral (V), and grid
frequency (Hz). Other parameters can also be read if the meter is
capable to do so, like current (I), line voltage (V), cos-.PHI. and
more. By relating the measured power (W) to the power counters
inside the CPU, the process information in the operating system and
the performance counters of the GPU it is possible to clearly
assign the power consumption to each mode or task. This allows
reporting to the user about the energy used for gaming, multi-media
streaming and batch computing, instantaneously or cumulative over a
certain period. By using information from the operating system it
is possible to assign the consumed power to the level of the
process. The latter can be used for billing purposes.
[0183] Furthermore, power quality is becoming a major issue as more
distributed energy production is installed on low voltage lines.
The main parameters to regulate are the voltage and grid frequency.
To achieve this the boiler heating system 1 may behave differently
compared to a classic approach. A prior art boiler would heat up
the vessel during the night or when the low temperature threshold
has been crossed. A boiler heating system 1 according to the
current disclosure can be arranged to spread its power consumption
over the day. Power consumption is best performed when the local
grid has a very low load and/or when the distributed renewable
energy is available in sufficient quantities. By measuring line
voltage and grid frequency this can be achieved.
[0184] In first instance the power budget needs to be determined.
This is the amount of thermal energy the processing unit 2 (e.g.
computer server) needs to output to heat up the vessel 4 to the
desired temperature at the destined point in time (e.g. as
specified by the user preferences). To be able to determine this
budget a naive linear statistical implementation does not cope with
the variability in heat extraction from the vessel 4, the changes
in the water temperature at the inlet port, and in such case a
phase change material 10 is used as the thermal storage medium 10,
to cope with the changes in material state. Therefore a feedforward
neural network can be employed to predict the needed power budget
for the next timeslot (for example 24 hours). The neural network
can be trained with one or more (e.g. all) of the following input
parameters: current vessel temperature, target temperature,
available time until target temperature needs to be reached,
weekday and length of the daytime. Other input parameters may be
used in different settings, for example in different geographical
regions. The output parameter is the amount of energy needed
expressed in Wh for the following consecutive period. The neural
network may be configured to correct/train itself at the premises
of the user when the target temperature is not reached (over or
undershoot) at the destined period of time with a temperature
deviation of more than a given percentage, for example 5%. The cost
function of the neural network is the temperature difference
between the target temperature and the real temperature. During
factory time a pre-trained neural net may already be installed on
the computer server to reduce the time needed for the neural net to
converge to a good solution. By using a self-adapting feedforward
neural net any changes applied to the boiler heating system 1 after
installation, as well as any changes in user water consumption
patterns can be modelled by the used algorithm.
[0185] In a second stage a long-short term memory (LSTM) neural
network, a special form of recurrent neural network, is used to
predict the voltage pattern. A gated recurrent unit (GRU) neural
network can also be used. This network may be trained with the
following input parameters: voltage to neutral, voltage parameters
over the last sample period (e.g. 10 minutes) like min, max,
average and average absolute deviation, line voltage and line
voltage parameters, if available, length of the daytime, current
solar production as indicated by a grid operator, solar production
prediction of the day ahead as available from the grid operator,
current outside temperature and outside temperature prediction.
Solar information can be gathered over the internet from the
central server or from a website of the grid operator. Temperature
information is readily available on the internet as commonly known.
The output of the LSTM neural network are the expected minimum,
maximum, average and average absolute deviation for each sample
period until the target time. Often the neural network may predict
the voltage pattern up to 24 hours ahead with 10 minute timeslots.
This predicted pattern is used in the following step. The advantage
of using a recurrent neural network is that summer/winter patterns,
solar patterns and changes in the voltage tap regulator at the grid
operators side can be captured in the model.
[0186] In the following step the power budget as predicted by the
first feed forward neural network is spread over the predicted
voltage pattern. For each sample period the energy (Wh) is
determined that needs to be consumed per volt deviation from
nominal grid voltage, possibly with a spread around the average,
for achieving the power budget and improving grid power quality as
much as possible. As a result, the computer server may consume a
maximum amount of energy when the real measured voltage is the
highest within that timeslot, and the least amount of energy when
the real voltage is minimal within that timeslot. By this way of
predicting the computer server is able to consume the most energy
when the renewable energy from the sun is pushing the line voltage
upward and/or when the local grid is underutilized, often during
night times.
[0187] As a last step the computer server may execute the predicted
pattern by executing its batch jobs, controlling its power
consumption based on the predicted schedule. It is important to
note that the actual measured voltage may be used as a control
value instead of the predicted voltage. The predicted voltage range
is used to calculate the spread of the energy over the sample
period. As still irregular voltage patterns may happen that are not
or cannot be modelled during each sample period, the algorithm can
be extended with a controller, e.g. a proportional/integration
controller (PI-controller). This controller may correct the power
usage to the desired value, as known to the knowledgeable expert.
The PI-controller is able to incorporate the grid frequency in its
parameters allowing the power usage of the computer server also to
respond in some degree, temporarily, to changes in the grid
frequency. The recurrent neural network may be pre-trained at the
factory but may need to be updated at a regular interval to keep up
with changes in the patterns.
[0188] The computer server can be arranged to contact a central
server to report on the performance of the neural networks, its
parameters and to download new models of any such neural net when
such model becomes available.
[0189] Further, the heating system 1 can be smart grid ready. In a
smart grid not only generators may adapt to changing electricity
demand but also household devices like washing machines, dryers and
HVAC systems could be used. Those should modulate their energy
consumption based on the availability of electricity in the grid.
By means of smart meters household devices may be able to respond
to more or less electricity being produced by sun and wind. The
system 1 can be arranged so that not only its computing behavior
can be changed based on the user requested tasks or on demand of
heat (for domestic hot tap water/heating up a building), but also
based on external factors like the availability of sun and wind.
The communication and behavior expected of a Smart Appliance is
under investigation of the standard organization CENELEC. The
system 1 is advantageously arranged to respond to requests coming
from a smart meter, under control of the grid operator, to increase
or decrease its power consumption. In this way, the system 1 is
able to behave like a smart heating device, dependent or completely
independent from the grid operator, not only being very efficient
in its usage of resources, but also adding to the stability of the
electricity grid.
[0190] Certain members of most examples of the present invention
can be made in multiple parts designed for modular assembly of
different sizes and shapes and for easy removal and, if necessary
replacement of some members or parts of members without disassembly
of the entire assembly. Next to the processing unit 2, module
holder 58, heat pipe 8, container unit 4, the removable parts may
include for example one or more sensors, controllers, actuating
means, controlling unit, etc. Other parts can also be
removable.
[0191] Herein, the invention is described with reference to
specific examples of embodiments of the invention. It will,
however, be evident that various modifications and changes may be
made therein, without departing from the essence of the invention.
For the purpose of clarity and a concise description features are
described herein as part of the same or separate embodiments,
however, alternative embodiments having combinations of all or some
of the features described in these separate embodiments are also
envisaged.
[0192] However, other modifications, variations, and alternatives
are also possible. The specifications, drawings and examples are,
accordingly, to be regarded in an illustrative sense rather than in
a restrictive sense.
[0193] For the purpose of clarity and a concise description
features are described herein as part of the same or separate
embodiments, however, it will be appreciated that the scope of the
invention may include embodiments having combinations of all or
some of the features described.
[0194] In the claims, any reference signs placed between
parentheses shall not be construed as limiting the claim. The word
`comprising` does not exclude the presence of other features or
steps than those listed in a claim. Furthermore, the words `a` and
`an` shall not be construed as limited to `only one`, but instead
are used to mean `at least one`, and do not exclude a plurality.
The mere fact that certain measures are recited in mutually
different claims does not indicate that a combination of these
measures cannot be used to an advantage.
* * * * *