U.S. patent application number 16/508068 was filed with the patent office on 2019-11-07 for systems and methods for electrodepositing multi-component alloys, and products made from the same.
The applicant listed for this patent is ARCONIC INC.. Invention is credited to Andreas Kulovits, Dharma Maddala, Raphael S. Morales, Vivek Sample, Shawn Sullivan, Kelly M. Weiler.
Application Number | 20190338434 16/508068 |
Document ID | / |
Family ID | 62908251 |
Filed Date | 2019-11-07 |
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United States Patent
Application |
20190338434 |
Kind Code |
A1 |
Maddala; Dharma ; et
al. |
November 7, 2019 |
SYSTEMS AND METHODS FOR ELECTRODEPOSITING MULTI-COMPONENT ALLOYS,
AND PRODUCTS MADE FROM THE SAME
Abstract
The present application relates to systems and methods for
electrodepositing multi-component alloys, and products made by the
same. The electrodeposition may be accomplished to deposit one or
more multi-component alloy layers on a substrate. In one
embodiment, a substrate is a bulk metal glass. In one embodiment, a
substrate is an aluminum alloy substrate. In one embodiment,
preconfigured cathode and/or anode configurations are used, which
may facilitate, among other things, a uniform current density.
Inventors: |
Maddala; Dharma;
(Monroeville, PA) ; Sullivan; Shawn; (Oakmont,
PA) ; Sample; Vivek; (Murrysville, PA) ;
Kulovits; Andreas; (Pittsburgh, PA) ; Morales;
Raphael S.; (Verona, PA) ; Weiler; Kelly M.;
(Oakmont, PA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ARCONIC INC. |
Pittsburgh |
PA |
US |
|
|
Family ID: |
62908251 |
Appl. No.: |
16/508068 |
Filed: |
July 10, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
PCT/US2018/014242 |
Jan 18, 2018 |
|
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|
16508068 |
|
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62447840 |
Jan 18, 2017 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C25D 3/56 20130101; C25D
17/007 20130101; C25D 5/10 20130101; C25D 17/12 20130101 |
International
Class: |
C25D 3/56 20060101
C25D003/56 |
Claims
1. A method comprising: (a) preparing a surface of the substrate
for electrodeposition; (i) wherein the substrate is selected from
the group consisting of metallic aluminum and aluminum alloys; (b)
placing the substrate in an electrolyte; (c) electrodepositing a
first composition on a surface of the substrate, thereby producing
a first layer located on at least a portion of the substrate,
wherein the first composition is a multi-component alloy.
2. The method of claim 1, wherein the substrate is a
lithium-containing aluminum alloy.
3. The method of claim 1, wherein the electrolyte is an
organic.
4. The method of claim 1, wherein the electrolyte is aqueous.
5. The method of claim 1, wherein after the electrodepositing step
the first layer is adherent to the substrate.
6. The method of claim 1, wherein, after the electrodepositing
step, the first layer is absent of pin-hole and blob defects.
7. The method claim 1, wherein the first layer is continuous.
8. A method comprising: (a) placing a bulk metal glass substrate in
an electrolyte; (b) electrodepositing a multi-component alloy on
the bulk metal glass substrate, thereby producing a multi-component
alloy layer located on at least a portion of the bulk metal glass
substrate.
9. The method of claim 8, comprising: depositing a second
composition on the first layer.
10. The method of claim 9, wherein the second composition is
metallic, a metal alloy, or another different multi-component
alloy.
11. An electrodeposition system comprising: (a) an electrolyte (b)
a anode at least partially disposed in the electrolyte and
connected to an external current source; (c) a cathode at least
partially disposed in the electrolyte and connected to the external
current source; (i) wherein the cathode comprises a non-planar
exterior surface; (ii) wherein the anode comprises a predetermined
volume and opposing exterior surface that corresponds to the
non-planar exterior surface of the cathode.
12. The electrodeposition system of claim 11, wherein the
predetermined volume and opposing exterior surface of the anode
facilitates a generally uniform current density during
electrodeposition operations of the electrodeposition system.
13. The electrodeposition system of claim 11, wherein the anode is
dissolvable.
14. The electrodeposition system of claim 11, wherein the anode is
non-consumable.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of International Patent
Application No. PCT/US2018/014242, filed Jan. 18, 2018, which
claims the benefit of priority to U.S. Provisional Patent
Application No. 62/447,840, filed Jan. 18, 2017, each of which is
incorporated herein by reference in its entirety.
FIELD OF THE INVENTION
[0002] The present invention relates to systems and methods for
electrodepositing multi-component alloys, and producing products
made from the same.
BACKGROUND
[0003] The article "Investigation of electrodeposition of
Ni--Co--Fe--Zn alloys in DMSO with MHD effect" by Ebadia et al.
states "Alloy electrodeposition, is a surface finishing technique
which has been used to improve properties such as grain size,
hardness, and corrosion resistance compared to the parent metals.
The main problem of metal electrodeposition process in an aqueous
bath is the Hydrogen Evolution Reaction (HER) which affects the
morphology of the electrodeposited surface."
SUMMARY OF THE INVENTION
[0004] Broadly, the present disclosure relates to methods of
electrodepositing metals and alloys on substrates, and products
produced by the same. In one approach, a method relates to
depositing a multi-component alloy on an aluminum or aluminum alloy
substrate. In this regard, a method may include the steps of (a)
preparing surface of a metallic aluminum or aluminum alloy
substrate for electrodeposition, (b) placing the substrate in an
electrolyte, and (c) electrodepositing at least a first composition
on a surface of the substrate, thereby producing a first layer
located on at least a portion of the substrate, wherein the first
composition is a multi-component alloy. In one particular
embodiment, the substrate is a lithium-containing aluminum alloy.
After the electrodeposition step, the first layer comprising the
multi-component alloy may be adherent to the metallic aluminum or
aluminum alloy substrate. The first layer may also be free of
defects, such as pinhole defects and/or and blob defects. The first
layer may also be continuous. Thus, the final product may be
commercially viable, and comprise a metallic aluminum or aluminum
alloy substrate with an adherent, defect-free, continuous
multi-component alloy layer thereon. Additional layers (metallic,
alloy, or other) may be deposited on this first multi-component
alloy layer.
[0005] In another approach, the substrate may be any metallic,
metal alloy or multi-component alloy, and may include multiple
layers thereon. In one embodiment, a method may include the steps
of (a) preparing a surface of a substrate for electrodeposition,
(b) first depositing a first composition on a surface of the
substrate, thereby producing a first layer located on at least a
portion of the substrate, and (c) second depositing a second
composition on a surface of the first layer, thereby producing a
second layer located on at least a portion of the first layer. In
this approach, at least one of the first and second compositions is
a multi-component alloy, and at least one of the first and second
depositing steps comprises electrodeposition. In one embodiment,
the first depositing step comprises electrodeposition. In one
embodiment, the first layer is a multi-component alloy, and the
second layer is metallic, a metal alloy, or another different
multi-component alloy. In another embodiment, the second layer is a
multi-component alloy, and the first layer is metallic or a metal
alloy. In one embodiment, the second depositing step comprises at
least one of spraying, additive manufacturing and
electrodeposition.
[0006] In another approach, electrodeposition is used to produce
one or more multi-component alloy layers on a bulk metal glass
substrate. In one embodiment, a method includes (a) placing a bulk
metal glass substrate in an electrolyte, and (b) electrodepositing
a multi-component alloy on at least a portion of the bulk metal
glass substrate, thereby producing a multi-component alloy layer
located on at least a portion of the bulk metal glass substrate.
Optionally, one or more other layers may be deposited (e.g.,
electrodeposited) on this multi-component alloy layer and/or the
substrate. In one embodiment, a second layer is metallic, a metal
alloy, or another different multi-component alloy, and at least
partially overlays the first layer. In one embodiment, prior to the
placing step (a), the substrate may be prepared for
electrodeposition, such as via one or more pretreatments.
[0007] In one approach, a method includes the steps of (a) placing
a bulk metal glass substrate in an electrolyte, (b) first
depositing a first composition on a surface of the substrate,
thereby producing a first layer located on at least a portion of
the substrate, and (c) second depositing a second composition on a
surface of the first layer and/or the bulk metal glass substrate,
thereby producing a second layer located on at least a portion of
the first layer and/or the bulk metal glass substrate. In this
approach, at least one of the first and second compositions is a
multi-component alloy, and at least one of the first and second
depositing steps comprises electrodeposition. In one embodiment,
the first depositing step comprises electrodeposition. In one
embodiment, the first layer is a multi-component alloy and the
second layer is metallic, a metal alloy, or another different
multi-component alloy. In one embodiment, the second layer is a
multi-component alloy and the first layer is metallic or a metal
alloy. In one embodiment, prior to the placing step (a), the
substrate may be prepared for electrodeposition, such as via one or
more pretreatments.
[0008] In one embodiment, a consumable anode is used to produce the
electrodeposited multi-component alloy layer(s). For instance, a
method may include electrodepositing a first multi-component alloy
composition on a surface of the substrate, thereby producing a
first multi-component alloy layer located on at least a portion of
the substrate. This electrodepositing step may include dissolving
at least a portion of an anode in an electrolyte, thereby producing
at least a portion of the multi-component alloy composition. In one
embodiment, the complete multi-component alloy composition is
provided by the anode. In another embodiment, only a portion of the
multi-component alloy composition is provided by the anode, and
metal salts (or other suitable additives) are used to provide the
remaining elements of the multi-component alloy composition.
[0009] In one approach, an electrodeposition system includes a
predetermined cathode shape and a predetermined anode shape to
facilitate electrodeposition. In one embodiment, an
electrodeposition system includes (a) an electrolyte, (b) an anode
at least partially disposed in the electrolyte and connected to an
external current source, and (c) a cathode at least partially
disposed in the electrolyte and connected to the external current
source. The cathode comprises a predetermined, non-planar exterior
surface, and the anode comprises a predetermined volume and
opposing exterior surface that corresponds to the non-planar
exterior surface of the cathode. Due to, for instance, the
predetermined volume and opposing exterior surface of the anode, a
generally uniform current density during electrodeposition
operations of the electrodeposition system may be facilitated.
Thus, in one embodiment, a method includes operating the
electrodeposition system, and forming a uniform electrodeposited
volume on the exterior surface of the cathode. The method may also
include using a generally constant current during the operating
step. The predetermined anode may be dissolvable (consumable) or
non-consumable, as appropriate. Any suitable substrates (metallic,
metal alloy, or multi-component alloy) may be used as the
cathode.
Definitions
[0010] The following definitions apply to the present application,
unless otherwise clearly indicated.
[0011] As used herein, "substrate" and the like means a material on
to which electrodeposition of a material may successfully take
place. In one embodiment, the substrate is a metal substrate. In
another embodiment, the substrate is a bulk metallic glass
substrate. In one embodiment, the substrate is a metal-matrix
composite substrate.
[0012] As used herein, "metal substrate" and the like means a
substrate made of a metal (i.e., is metallic) or a metal alloy.
Examples of suitable metal substrates include metallic Al, Ti, Co,
Ni, Cu and Cr substrates, among others. Examples of suitable metal
alloy substrates include Al metal alloy, Ti metal alloy, Co metal
alloy, Ni metal alloy, Cu metal alloy, Cr metal alloy, and steel
(including stainless steel) substrates, among others. In some
embodiments, the substrate may be a multi-component alloy (defined
below) or "MCA". For the purposes of the present patent
application, "metal alloys" do not include multi-component alloys,
as these are two distinct groups of materials relative to the
present patent application. In one embodiment, the metal substrate
is an aluminum-lithium metal alloy. In one embodiment, a metal
substrate is crystalline (e.g., is generally non-amorphous).
[0013] As used herein, an aluminum metal alloy is a metal alloy
having aluminum as the predominant alloying element. A titanium
metal alloy is a metal alloy having titanium as the predominant
alloying element. A cobalt metal alloy is a metal alloy having
cobalt as the predominant alloying element. A nickel metal alloy is
a metal alloy having nickel as the predominant alloying element. A
copper metal alloy is a metal alloy having copper as the
predominant alloying element. A chromium metal alloy is a metal
alloy having chromium as the predominant alloying element. Steel is
a metal alloy having iron as the predominant alloying element.
[0014] As used herein, an "aluminum-lithium metal alloy" or
"Al--Li" metal alloy and the like means an aluminum metal alloy
having from 0.1 to 5.0 wt. % Li. Examples of "Al--Li" metal alloys
useful as substrates include the 2xxx, 5xxx and 7xxx aluminum metal
alloys, as defined by the Aluminum Association, and having 0.1 to
5.0 wt. % Li therein. In one embodiment, an Al--Li metal alloy
substrate is a 2099 or a 2199 alloy. In another embodiment, an
Al--Li metal alloy substrate is a 2055 alloy. In another
embodiment, an Al--Li metal alloy substrate is a 2060 alloy. Other
Al--Li metal alloy substrates may be used.
[0015] As used herein, "bulk metal glass substrate" and the like
means a substrate generally comprising an amorphous metal
structure. Bulk metal glasses generally include two or more metals.
In one embodiment, the bulk metal glass is aluminum based. In one
embodiment, the bulk metal glass is copper based. In one
embodiment, the bulk metal glass is iron based. In one embodiment,
the bulk metal glass is palladium based. In one embodiment, the
bulk metal glass is zirconium based. In one embodiment, the bulk
metal glass is titanium based. In one embodiment, the bulk metal
glass is at least 50 vol. % amorphous, and the remaining volume
fraction may be crystalline (e.g., nano-crystalline). In another
embodiment, the bulk metal glass is at least 75 vol. % amorphous.
In another embodiment, the bulk metal glass is at least 90 vol. %
amorphous. In another embodiment, the bulk metal glass is at least
99 vol. % amorphous.
[0016] As used herein, "irregular substrate" and the like means a
substrate having a non-uniform geometric shape/complex geometry
(e.g., V-shaped U-shaped, W-shaped, impeller-shaped, vanes, among
other shapes). An irregular substrate may have one or more
non-planar exterior surfaces.
[0017] As used herein, "multi-component alloy" or "MCA" and the
like means an alloy with a metal matrix, where at least four
different elements make up the matrix, and where the
multi-component alloy comprises 5-35 at. % of the at least four
elements. In one embodiment, at least five different elements make
up the matrix, and the multi-component alloy comprises 5-35 at. %
of the at least five elements. In one embodiment, at least six
different elements make up the matrix, and the multi-component
alloy comprises 5-35 at. % of the at least six elements. In one
embodiment, at least seven different elements make up the matrix,
and the multi-component alloy comprises 5-35 at. % of the at least
seven elements. In one embodiment, at least eight different
elements make up the matrix, and the multi-component alloy
comprises 5-35 at. % of the at least eight elements.
[0018] As used herein, "pretreating a substrate" and the like means
to prepare the substrate for deposition of a coating thereon. In
one embodiment, a pretreatment comprises a electrolytic
pretreatment. In one embodiment, a pretreatment comprises an anodic
treatment, where the substrate is stripped of a portion of its
surface material by making it anodic. In one embodiment, a
pretreatment comprises a cathodic pretreatment, where the substrate
is made cathodic and a coating is thereby deposited on at least a
portion of its surface. In one embodiment, a pretreatment comprises
a chemical pretreatment. In one embodiment, the chemical
pretreatment may include one or more of caustic cleaning and
etching. In one embodiment, a pretreatment comprises a mechanical
abrasion process. Any of the above may be used above or in
combination, as appropriate, to pretreat the substrate.
[0019] As used herein, "caustic cleaning of a substrate" and the
like means using a caustic substance to prepare the surface of the
substrate for deposition of a coating thereon. One example of
caustic cleaning is the removal of oils and other polar substances
using a strong base (e.g., NaOH or KOH, among others).
[0020] As used herein, "etching of a substrate" and the like means
the process of subjecting the substrate to a liquid (e.g., an acid)
to remove undesired oxides, optionally with consuming a portion of
the substrate surface, depending on the liquid utilized.
[0021] As used herein, "electrodeposit" and the like means to
deposit one or more coatings on a substrate via an electrochemical
potential induced by one or more external current sources.
[0022] As used herein, "coating" and the like means a layer
(bottom, intermediate, or upper) of a substrate. A coating (e.g.,
an electrodeposited layer) may have a thickness of from 1 nanometer
to 500 microns. Coating thickness is generally application
dependent.
[0023] As used herein, "uniform coating" and the like means a
coating whose thickness varies not greater than 25% from its
average thickness. In one embodiment, a uniform coating achieves a
thickness that varies not greater than 15% from its average
thickness. In one embodiment, a uniform coating achieves a
thickness that varies not greater than 10% from its average
thickness. Coating uniformity may be measured by cross-sectioning
the part and inspecting the coating by visual means, including
microscopy inspection.
[0024] As used herein, "adherent coating" and the like may mean a
coating that, when tested in accordance with ASTM G171, produces a
scratch hardness number of at least 0.5 GPa, and without
catastrophic fracture, spallation, or extensive delamination of the
coating. In one embodiment, the scratch hardness is at least 1 GPa.
In one embodiment, the scratch hardness is at least 3 GPa. In one
embodiment, the scratch hardness is at least 5 GPa. In one
embodiment, the scratch hardness is at least 8 GPa. In one
embodiment, the scratch hardness is at least 10 GPa. Alternatively,
as used herein, "adherent coating" and the like may mean that all
or nearly all (e.g., .gtoreq.95%) of the coating passes the Scotch
610 tape pull test, as defined by ASTM D3359-09 (2009).
[0025] As used herein, additive manufacturing and the like, means
"a process of joining materials to make an atomized objects from 3D
model data, usually layer upon layer, as opposed to subtractive
manufacturing methodologies", as per ASTM F2792-12a entitled
"Standard Terminology for Additively Manufacturing
Technologies."
[0026] As used herein, "spray deposition" and the like means the
deposition of a material by spray onto a surface to provide a
coating.
[0027] As used herein, a "continuous coating" and the like means a
coating having a continuous layer of material on the applicable
surface, free of breaks.
[0028] As used herein, a "defect-free coating" is a coating
generally free of pinholes and blobs, as observed by visual
inspection or via an optical microscope. When a single-layer
product is produced, a single layer is deposited on a substrate,
and this single layer is generally electrodeposited and may be
defect-free (i.e., may be a defect-free electrodeposited layer).
When a multi-layer product is produced, at least one of the layers
may be defect-free. In one embodiment, at least a top, an
intermediate, or a bottom layer of a multi-layer product is
defect-free (e.g., to restrict/avoid diffusion of material toward
and/or to the surface of the underlying substrate; to
restrict/avoid corrosion of the underlying substrate). In one
embodiment, at least the top layer of a multi-layer product is
defect-free. In another embodiment, at least an intermediate layer
of a multi-layer product is defect-free. In another embodiment, at
least the bottom layer of a multi-layer product is defect-free. In
one embodiment, at least the top layer and one other layer of a
multi-layer product are defect-free (e.g., at least the top layer
and an intermediate layer are defect-free; at least the top layer
and the bottom layer are defect-free). In one embodiment, at least
the bottom layer and one other layer of a multi-layer product are
defect-free (e.g., at least the bottom layer and an intermediate
layer are defect-free; at least the bottom layer and the top layer
are defect-free). In one embodiment, at least an intermediate layer
and one other layer of a multi-layer product are defect-free (e.g.,
at least an intermediate layer and the top layer are defect-free;
at least an intermediate layer and the bottom layer are
defect-free). In one embodiment, all layers are defect free. The
defect-free layer(s) of a multi-layer product may be
electrodeposited, sprayed, or additively manufactured, as described
herein. In one embodiment, a product includes at least one
defect-free electrodeposited layer.
[0029] The figures constitute a part of this specification and
include illustrative embodiments of the present disclosure and
illustrate various objects and features thereof. In addition, any
measurements, specifications and the like shown in the figures are
intended to be illustrative, and not restrictive. Therefore,
specific structural and functional details disclosed herein are not
to be interpreted as limiting, but merely as a representative basis
for teaching one skilled in the art to variously employ the present
invention.
[0030] Among those benefits and improvements that have been
disclosed, other objects and advantages of this invention will
become apparent from the following description taken in conjunction
with the accompanying figures. Detailed embodiments of the present
invention are disclosed herein; however, it is to be understood
that the disclosed embodiments are merely illustrative of the
invention that may be embodied in various forms. In addition, each
of the examples given in connection with the various embodiments of
the invention is intended to be illustrative, and not
restrictive.
[0031] Throughout the specification and claims, the following terms
take the meanings explicitly associated herein, unless the context
clearly dictates otherwise. The phrases "in one embodiment" and "in
some embodiments" as used herein do not necessarily refer to the
same embodiment(s), though it may. Furthermore, the phrases "in
another embodiment" and "in some other embodiments" as used herein
do not necessarily refer to a different embodiment, although it
may. Thus, as described below, various embodiments of the invention
may be readily combined, without departing from the scope or spirit
of the invention.
[0032] In addition, as used herein, the term "or" is an inclusive
"or" operator, and is equivalent to the term "and/or," unless the
context clearly dictates otherwise. The term "based on" is not
exclusive and allows for being based on additional factors not
described, unless the context clearly dictates otherwise. In
addition, throughout the specification, the meaning of "a," "an,"
and "the" include plural references, unless the context clearly
dictates otherwise. The meaning of "in" includes "in" and "on",
unless the context clearly dictates otherwise.
BRIEF DESCRIPTION OF THE FIGURES
[0033] FIG. 1 is a flow chart illustrating one embodiment, of an
electrodeposition method useful in accordance with the present
disclosure.
[0034] FIG. 2a illustrates various potential substrates for the
selecting step (100) of FIG. 1.
[0035] FIG. 2b illustrates various potential materials for the
deposition step (200) of FIG. 1.
[0036] FIG. 2c illustrates various potential pretreatments for the
preparing step (300) of FIG. 1.
[0037] FIG. 2d illustrates various potential electrolytes for the
placing step (400) of FIG. 1.
[0038] FIG. 3a is schematic side view of one embodiment of an
electrodeposition system useful in accordance with the present
disclosure.
[0039] FIG. 3b is schematic side view of another embodiment of an
electrodeposition system useful in accordance with the present
disclosure.
[0040] FIG. 3c is a cross-sectional view of an embodiment of a
non-homogeneous anode that may be used in the electrodeposition
systems disclosed herein.
[0041] FIG. 3d is a perspective view illustrating one embodiment of
a non-planar cathode and a corresponding non-planar anode.
[0042] FIG. 3e is a cross-sectional view of a portion of FIG.
3d.
[0043] FIG. 3f is a perspective view illustrating of one embodiment
of a non-planar cathode and a corresponding non-planar anode.
[0044] FIG. 3g is a cross-sectional view of a portion of FIG.
3f.
[0045] FIG. 3h is a perspective view illustrating one embodiment of
a non-planar cathode and a corresponding non-planar anode.
[0046] FIG. 3i is a cross-sectional view of a portion of FIG.
3h.
[0047] FIGS. 4a-4r illustrate various multi-layered products
producible via the methods described in the present patent
application.
DETAILED DESCRIPTION
[0048] Referring now to FIG. 1, one embodiment of a method for
producing multi-layer products is illustrated. In the illustrated
embodiment, the method includes the steps of selecting a substrate
(100), selecting one or more deposition compositions to
electrodeposit on the substrate (200), preparing the substrate, if
needed, for deposition (300), placing the substrate in a suitable
electrolyte bath (400), and electrodepositing the selected
compositions on the selected substrate (500).
[0049] Referring now to FIG. 2a, various suitable substrates that
may be selected for electrodeposition are shown. For instance, in
one approach, the substrate is a metal substrate. In one
embodiment, the metal substrate is a metallic substrate. In another
embodiment, the metal substrate is a metal alloy. In one
embodiment, the substrate is an Al metal alloy. In one embodiment,
the substrate is a Ti metal alloy. In one embodiment, the substrate
is a Co metal alloy. In one embodiment, the substrate is a Ni metal
alloy. In one embodiment, the substrate is a Cu metal alloy. In one
embodiment, the substrate is a Cr metal alloy. In one embodiment,
the substrate is a multi-component alloy (MCA). In another
approach, the substrate is a bulk metal glass substrate. In one
embodiment, the solidus temperature of the substrate (e.g., a metal
alloy substrate) is higher than that of any of the coatings
thereon. In one embodiment, the glass transition temperature of the
substrate (e.g., of a bulk metal glass substrate) is higher than
that of any of the coatings thereon.
[0050] Referring now to FIG. 2b, various example deposition
compositions suitable for electrodeposition are shown. In one
embodiment, the deposition composition is a multi-component alloy
(MCA). In one embodiment, the deposition composition is a metallic
material. In another embodiment, the deposition composition is a
metal alloy. In one embodiment, the deposition composition is an Al
metal alloy. In one embodiment, the deposition composition is a Cr
metal alloy. In one embodiment, the deposition composition is a Cu
metal alloy. In one embodiment, the deposition composition is a Fe
metal alloy. In one embodiment, the deposition composition is a Mn
metal alloy. In one embodiment, the deposition composition is a Mg
metal alloy. In one embodiment, the deposition composition is a Co
metal alloy. In one embodiment, the deposition composition is a Ni
metal alloy.
[0051] Referring now to FIG. 2c, optional substrate surface
preparation steps are shown, which may be one or more of
electrolytic pretreatment, mechanical abrasion and chemical
pretreatment steps, among others. In one approach, the preparation
step comprises an electrolytic pretreatment. In one embodiment, the
electrolytic treatment comprises an anodic pretreatment (e.g.,
stripping surface(s) of the substrate). In one embodiment, the
electrolytic pretreatment comprises a cathodic pretreatment (e.g.,
electrodeposition of a coating as a pretreatment). The electrolytic
treatment may be a combination of anodic and cathodic treatments.
In another approach, the pretreatment comprises mechanical
abrasion. In another approach, the pretreatment comprises a
chemical pretreatment. In one embodiment, the chemical pretreatment
comprises caustic cleaning (e.g., using NaOH to remove oils or
other contaminants from the surface of the substrate). In one
embodiment, the chemical pretreatment comprises a deoxidizing
process (e.g., etching the surface of the substrate to remove
undesirable oxides, such as by an alkaline or acidic chemical
treatment). The chemical pretreatment may be a combination of an
etching step and a caustic cleaning step. The pretreatment may be
any combination of the steps of an electrolytic pretreatment,
mechanical abrasion and a chemical pretreatment.
[0052] Referring now to FIG. 2d, various electrolytic solvents
useful for electrodeposition are shown. In one embodiment, the
electrolyte solvent comprises one or more organic solvents (e.g.,
dimethyl sulfoxide, dimethylformamide and/or acetonitrile, among
others). In another embodiment, the electrolyte solvent is an
aqueous solvent. In one embodiment, the aqueous solvent comprises
dissolved Zn-based salts. In one embodiment, the aqueous solvent
comprises dissolved Ni-based salts. In one embodiment, the aqueous
solvent comprises dissolved Cu-based salts. Other salts may be
used.
[0053] Referring now to FIG. 3a, a system (1a) for
electrodeposition is shown. In the illustrated embodiment, a
container (10) comprises an electrolyte bath (20), a cathode in the
form of an irregular substrate (30) and an anode (40). Cathode (30)
and anode (40) are connected to current source (50) in electrical
series. The electrolyte bath (20) includes metal ions (60). During
the process of the electrodeposition, the metal ions (60) are
deposited on surfaces of irregular cathode (30), thereby forming a
coating (e.g., a uniform coating) thereon. An optional reference
electrode (70) may be used to monitor potential of the electrolyte
bath. The system (1a) of FIG. 3a may be used to electrodeposit a
commercially viable coating (e.g., an adherent, uniform,
continuous, and defect free coating).
[0054] In the embodiment, the anode (40) is consumable (e.g.,
dissolvable) and the metal ions (60) are formed in the electrolyte
(20) by oxidation of the anode (40). When an electrical current is
applied via current source (50), the consumable anode (40) begins
to oxidize, and metal ions from the consumable anode are therefore
present in the electrolyte bath (20) as a result of the oxidation
of the anode. The electrochemical driving potential of the bath
causes the metal ions to be deposited on the surfaces of the
cathode (30) to form a coating thereon. In one embodiment, the
deposited coating is homogeneous (e.g., when the anode is made of a
pure metal or a suitable alloy). In another embodiment, the coating
may be non-homogeneous (e.g., when the anode comprises alloys
having sufficiently different electrochemical potentials). In one
embodiment, a post-deposition thermal treatment may be used to
provide a homogeneous coating as, described below.
[0055] In one embodiment, the anode (40) is homogeneous and
comprises one of a metal, a metal alloy or an MCA to be deposited
on the surface of the irregular substrate (30). In another
embodiment, the anode (40) is non-homogeneous, (e.g., as per FIG.
3c, described below).
[0056] In one embodiment, the anode (40) comprises one or more MCAs
to be deposited on the surface of the cathode (30). In one
embodiment, the anode is homogeneous and comprises an MCA. In one
embodiment, the anode is non-homogeneous and comprises an MCA.
[0057] In one embodiment, and referring now to FIG. 3c, a
non-homogeneous anode (45) comprises an outer layer (47) and a core
(46) disposed within the outer layer (47). The outer layer (47)
comprises a first composition, and the core (46) comprises a second
composition, different from the first composition. The
non-homogeneous anode (45) of FIG. 3c may be used as an anode in
any suitable electrodeposition system, including the systems of 1a
and 1b of FIGS. 3a-3b, among others. During electrodeposition, the
material of the outer layer (47) is deposited on the surface of the
cathode (30). The deposition of material from the outer layer (47)
onto the cathode (30) may continue until the outer layer (47) of
the non-homogeneous anode (45) has been partially or completely
oxidized. In the case where the outer layer (47) is fully utilized,
the core (46) of the anode may be exposed, at which point the
cathode (30) may be coated with the deposition composition of the
core (46). In one embodiment, the outer layer (47) of the
non-homogeneous anode (45) corresponds to the first deposited layer
(2000) of any of the products of FIGS. 4a-4r. Accordingly, the core
(46) of the non-homogeneous anode (45) may correspond to the second
deposited layer (3000) of any of the products of FIGS. 4a-4r. Thus,
the core (46) and outer layer (47) of the non-homogeneous anode
(45) may be comprised of any materials described as suitable for
the layers (2000) and (3000), relative to FIGS. 4a-4r, described
below. Although the configuration of FIG. 3c shows a single layer
around a cylindrical core, it will be appreciated that the
non-homogeneous anode (45) may comprise multiple layers (47 l-n)
around a core (46) to facilitate electrodeposition of multiple
different layers on the cathode.
[0058] In another approach, the anode is non-consumable or
marginally dissolvable in the electrolyte. In this approach, metal
salts may be fed to the electrolyte bath (20) to provide metal ions
in solution. The one or more metal salts dissolve in the
electrolyte bath (20) providing the metal ions (60) necessary to
electrodeposit a coating on the surface of the irregular substrate
(30). The deposition composition may be altered by selecting the
appropriate one or more metal salts to provide the appropriate
concentration of metal ions. In one embodiment, the electrolyte
bath (20) comprises a single metal salt in order to allow for the
deposition of a single metal coating (e.g., AlCl.sub.3 to deposit
aluminum). In another embodiment, a blend of metal salts comprises
several metal salts that, when dissolved in the electrolyte
solvent, will allow for the correct concentration of metal ions to
electrodeposit a desired metal alloy. In one embodiment, a blend of
metal salts comprises several metal salts that, when dissolved in
the electrolyte solvent, will allow for the correct concentration
of metal ions to electrodeposit a desired MCA.
[0059] FIG. 3b illustrates a variation of FIG. 3a where an anode
(80) of the system 1b comprises a predetermined volume and opposing
exterior surface (34) that corresponds to a non-planar exterior
surface (32) of the cathode (irregular substrate) (30). Such an
arrangement may facilitate a generally uniform current density
during the electrodeposition process. Due to the
arrangement/configuration of the opposing exterior surface (34) of
the anode (80) and the non-planar exterior surface (32) of the
cathode (30), a coating may be uniformly deposited on the surface
of the cathode (30). In some embodiments, the current source (50)
utilizes a generally constant current, which may be facilitated by
the use of a non-planar anode (80) with a predetermined opposing
exterior surface (34) that corresponds to the non-planar exterior
surface (32) of the cathode (30). The anode (80) and or cathode
(30) may be additively manufactured, stamped, forged, or shape
cast, among others, to facilitate production of complex shapes for
these electrodes. In one embodiment, one or both of the cathode and
anode used in the electrodeposition process may be produced via
additive manufacturing. In one embodiment, the anode is additively
manufactured, and may be homogeneous or non-homogeneous, as
described above. Similarly, a cathode may be homogeneous or
non-homogeneous. In one embodiment, the cathode and the anode are
both additively manufactured. In another embodiment, only one of
the cathode and anode are additively manufactured. In one
embodiment, at least one of the electrodes is produced using
additive manufacturing, wherein the at least one corresponding
electrode is produced using a 3-dimensional image produced via
3-dimensional imaging techniques. For instance, a cathode (32) may
be scanned using 3-dimensional imaging techniques, and at least one
corresponding 3-dimensional image used to additively manufacture at
least one anode (80). The corresponding anode(s) (80) may have a
pre-determined volume and opposing exterior surface (34) that may
facilitate a generally uniform current density during the
electrodeposition process. In this regard, the 3-dimensional
imaging technique may include using one or more digital cameras,
where the one or more of digital cameras may produce one or more
digital images. Such one or more digital images may be utilized by
computer software to construct one or more 3-dimensional images of
the corresponding electrode(s) to be fabricated. For instance, the
computer software may be configured to utilize one or more digital
images to produce one or more electrodes generally having a
structure that mirrors that of the corresponding electrode. The
computer may use electrodeposition modeling software to optimize
the current density of the electrodeposition process. For instance,
the current density of the electrodeposition process may be modeled
using by constructing a 3-dimensional model of the electrode(s) to
be utilized in the electrodeposition process.
[0060] Referring now to FIGS. 3a and 3d-3e, another example of a
non-planar anode (20,000) and a non-planar cathode (10,000) is
shown. The cathode (10,000) comprises a non-planar exterior surface
(10,500) and the anode (20,000) comprises a corresponding
predetermined opposing exterior surface (20,500), generally
matching the shape of the cathode's exterior surface (10,500). In
some embodiments, the current source (50) utilizes a generally
constant current, which may be facilitated by the use of a
non-planar anode (20,000) with a predetermined opposing exterior
surface (20,500) that corresponds to the non-planar exterior
surface (10,500) of the cathode (10,000).
[0061] Referring now to FIGS. 3a, and 3f-3g, another embodiment of
a non-planar anode (40,000) and a corresponding non-planar cathode
(30,000) is shown. The cathode (30,000) comprises a non-planar
exterior surface (30,500) and the anode (40,000) comprises a
corresponding predetermined opposing exterior surface (40,500). The
non-planar exterior surface (30,500) of the cathode (30,000) is
comprised of a first portion (30,600), a second portion (30,700),
and a third portion (30,800). The third portion (30,800) is
connected to the first portion (30,600) via the second portion
(30,700). The predetermined opposing exterior surface (40,500) of
the anode (40,000) comprises a first portion (40,600), a second
portion (40,700), and a third portion (40,800). The third portion
(40,800) is connected to the first portion (40,600) via the second
portion (40,700). The first portion (30,600) of the non-planar
exterior surface (30,500) of the cathode (30,000) corresponds to
the size and shape of the first portion (40,600) of the
predetermined opposing exterior surface (40,500) of the anode
(40,000). The second portion (30,700) of the non-planar exterior
surface (30,500) of the cathode (30,000) corresponds to the size
and shape of the second portion (40,700) of the predetermined
opposing exterior surface (40,500) of the anode (40,000). The third
portion (30,800) of the non-planar exterior surface (30,500) of the
cathode (30,000) corresponds to the size and shape of the third
portion (40,800) of the predetermined opposing exterior surface
(40,500) of the anode (40,000). As illustrated, the remainder of
the anode (40,000) corresponds to the remainder of the cathode
(30,000). In some embodiments, the current source (50) utilizes a
generally constant current, which may be facilitated by the use of
a non-planar anode (40,000) with a predetermined opposing exterior
surface (40,500) that corresponds to the non-planar exterior
surface (30,500) of the cathode (30,000). The generally constant
current may facilitate a uniform coating.
[0062] Referring now to FIGS. 3a and 3h-3i, another embodiment of a
combination of a non-planar cathode (50,000) and a non-planar anode
(60,000) is shown. The cathode (50,000) comprises a non-planar
exterior surface (50,500) and the anode (60,000) comprises the
predetermined opposing exterior surface (60,500). In some
embodiments, the current source (50) utilizes a generally constant
current, which may be facilitated by the use of a non-planar anode
(60,000) with a predetermined opposing exterior surface (60,500)
that corresponds to the non-planar exterior surface (50,500) of the
cathode (50,000). The generally constant current may facilitate a
uniform coating.
[0063] Referring now to FIG. 4a, a schematic cross-sectional view
of an embodiment of a multilayered product (600a) is shown. The
illustrated multi-layered product (600a) comprises a substrate
(1000), a first coating (2000) and an optional second coating
(3000). Other layers may be used. In one embodiment, the first
coating (2000) is a final or a capping layer. In another
embodiment, the first coating (2000) is an intermediate layer, and
accordingly, the second coating (3000) is a final or capping layer.
In another embodiment, the second layer (3000) is an intermediate
layer.
[0064] The substrate (1000) may be any suitable substrate useful as
a cathode in an electrodeposition bath, including any of the
substrates described above. In one approach, the substrate (1000)
is a metal substrate. In one embodiment, the metal substrate is a
metallic substrate. In one embodiment, the metal substrate is a
metal alloy substrate (e.g., one of Al, Ti, Co, Ni, Cu and Cr metal
alloys, among others). In one embodiment, the metal substrate
(1000) is a multi-component alloy substrate. In another embodiment,
the substrate (1000) is a bulk metal glass substrate.
[0065] The first coating (2000) may be any suitable coating
producible via electrodeposition, spray deposition and/or additive
manufacturing, including any of the coatings described above. In
one embodiment, the first coating (2000) is electrodeposited. In
another embodiment, the first coating (2000) is produced by
additive manufacturing. In another embodiment, the first coating
(2000) is produced by spray deposition.
[0066] In one approach, the first coating (2000) is metallic, as
shown in FIG. 4b-4d (e.g., is metallic aluminum). In one
embodiment, the metal of the first coating (2000) has one or more
elements in common with the substrate (1000) (e.g., in FIGS. 4k,
4l, 4o and 4q) (e.g., the substrate and the first coating both
comprise aluminum). In one embodiment, the metal of the first
coating (2000) does not have any elements in common with the
substrate (1000) (e.g., as shown in 4m, 4n, 4p and 4r) (e.g., if
the substrate (1000) is aluminum, then the metal of the first
coating (2000) would not contain aluminum, except as an
impurity).
[0067] In another approach, the first coating (2000) is a metal
alloy (e.g, as shown in FIG. 4e-FIG. 4g) (e.g., a metal alloy of
Al, Cr, Cu, Fe, Mn, Co or Ni, among other metal alloys). In one
embodiment, the metal alloy is a metal alloy of Al. In one
embodiment, the metal alloy is a metal alloy of Cr. In one
embodiment, the metal alloy is a metal alloy of Cu. In one
embodiment, the metal alloy is a metal alloy of Fe. In one
embodiment, the metal alloy is a metal alloy of Mn. In one
embodiment, the metal alloy is a metal alloy of Co. In one
embodiment, the metal alloy is a metal alloy of Ni. In one
embodiment, the metal alloy of the first coating (2000) has one or
more elements in common with the substrate (1000) (e.g., as shown
in FIGS. 4k, 4l, 4o and 4q) (e.g., if the substrate (1000)
comprises aluminum, the first coating (2000) comprises aluminum).
In one embodiment, the metal alloy of the first coating (2000) has
no elements in common with the substrate (1000) (e.g., as shown in
FIGS. 4m, 4n, 4p and 4r) (e.g., if the substrate (1000) is
aluminum, then the metal alloy of the first coating (2000) would
not contain aluminum, except as an impurity).
[0068] In one particular approach, the first coating (2000) is an
MCA (e.g., as shown in FIGS. 4h-4j). In one embodiment, the MCA of
the first coating (2000) does not share any common elements with
the substrate (1000) (e.g., as shown in FIGS. 4m, 4n, 4p and 4r)
(e.g., if the substrate (1000) includes aluminum, the MCA of the
first coating (2000) would not contain aluminum, except as an
impurity). In one embodiment, the MCA of the first coating (2000)
shares one or more common elements with the substrate (1000) (e.g.,
as shown in FIGS. 4k, 4l, 4o and 4q) (e.g., if the substrate (1000)
includes aluminum, then the MCA of the first coating would also
comprise aluminum as one of its at least four elements). In one
embodiment, the MCA of the first coating (2000) shares at least two
common elements with the substrate (1000) (e.g., both the substrate
(1000) and the first coating (2000) comprise aluminum and copper).
In one embodiment, the MCA of the first coating (2000) shares at
least three common elements with the substrate (1000) (e.g., both
the substrate (1000) and the first coating (2000) comprise
aluminum, copper and nickel).
[0069] In one embodiment, the first coating (2000) shares one or
more elements in common with the optional second coating (3000)
(e.g., as shown in FIGS. 4l, 4m, 4o, and 4p) (e.g., the first
coating (2000) and the second coating (3000) both comprise
aluminum). In another embodiment, the first coating (2000) shares
no elements in common with an optional second coating (3000) (e.g.,
as shown in FIGS. 4k, 4n, 4q, 4r) (e.g., if the first coating
(2000) comprises copper, then the second coating (3000) would not
contain copper except as an impurity). In one embodiment, the first
coating (2000) shares one or more common elements with both the
substrate (1000) and the optional second coating (3000) (e.g., as
shown in FIGS. 4l and 4o) (e.g., the substrate (1000), the first
coating (2000) and the second coating (3000) all comprise
aluminum).
[0070] The second coating (3000) may be any suitable coating
producible via electrodeposition, spray deposition, and/or additive
manufacturing, including any of the coatings described above. In
one embodiment, the second coating (3000) is electrodeposited. In
another embodiment, the second coating (3000) is produced by
additive manufacturing. In another embodiment, the second coating
(3000) is produced by spray deposition.
[0071] In one approach, the second coating (3000) is metallic
(e.g., metallic aluminum). In one embodiment, the metal of the
second coating (3000) has one or more elements in common with the
substrate (1000) (e.g., as shown in FIGS. 4l, 4n, 4p, and 4q)
(e.g., the substrate (1000) and the second coating (3000) both
comprise aluminum). In one embodiment, the metal of the second
coating (3000) does not have any elements in common with the
substrate (1000) (e.g., as shown in FIGS. 4k, 4m, 4o, and 4r)
(e.g., if the substrate (1000) were aluminum, the metal of the
second coating (3000) would not contain aluminum, except as an
impurity). In one embodiment, the metal of the second coating
(3000) has one or more elements in common with the first coating
(2000) (e.g., as shown in FIGS. 4l, 4m, 4o, and 4p) (e.g., the
first coating (2000) and the second coating (3000) both comprise
copper). In one embodiment, the metal of the second coating (3000)
does not have any elements in common with the first coating (2000)
(e.g., as shown in FIGS. 4k, 4n, 4q and 4r) (e.g., if the first
coating (2000) were copper, the metal of the second coating (3000)
would not contain copper except as an impurity).
[0072] In another approach, the second coating (3000) is a metal
alloy coating (e.g., a metal alloy of Al, Cr, Cu, Fe, Mn, Co or Ni,
among other metal alloys). In one embodiment, the metal alloy is a
metal alloy of Al. In one embodiment, the metal alloy is a metal
alloy of Cr. In one embodiment, the metal alloy is a metal alloy of
Cu. In one embodiment, the metal alloy is a metal alloy of Fe. In
one embodiment, the metal alloy is a metal alloy of Mn. In one
embodiment, the metal alloy is a metal alloy of Co. In one
embodiment, the metal alloy is a metal alloy of Ni. In one
embodiment, the metal alloy of the second coating (3000) has one or
more elements in common with the substrate (1000) (e.g., as shown
in FIGS. 4l, 4n, 4p, and 4q) (e.g., the substrate (1000) and the
second coating (3000) both comprise aluminum). In one embodiment,
the metal alloy of the second coating (3000) has no elements in
common with the substrate (1000) (e.g., as shown in FIGS. 4k, 4m,
4o, and 4r) (e.g., if the substrate (1000) were aluminum, the metal
alloy of the second coating (3000) would not contain aluminum,
except as an impurity). In one embodiment, the metal alloy of the
second coating (3000) has one or more elements in common with the
first coating (2000) (e.g., as shown in FIGS. 4l, 4m, 4o, and 4p)
(e.g., the first coating (2000) and the second coating (3000) both
comprise copper). In one embodiment, the metal alloy of the second
coating (3000) does not have any elements in common with the first
coating (2000) (e.g., as shown in FIGS. 4k, 4n, 4q and 4r) (e.g.,
if the first coating (2000) were copper, the metal alloy of the
second coating (3000) would not contain copper except as an
impurity).
[0073] In one particular approach, the second coating (3000) is an
MCA coating. In one embodiment, the MCA of the second coating
(3000) does not share any common elements with the substrate (1000)
(e.g., as shown in FIGS. 4k, 4m, 4o, and 4r) (e.g., if the
substrate (1000) were aluminum, the second coating (3000) would not
contain aluminum, except as an impurity). In one embodiment, the
MCA of the second coating (3000) shares one or more common elements
with the substrate (1000) (e.g., as shown in FIGS. 4l, 4n, 4p, and
4q) (e.g., if the substrate (1000) includes aluminum, then the MCA
would also comprise aluminum as one of its at least four elements).
In one embodiment, the MCA of the second coating (3000) and the
substrate (1000) share at least two common elements (e.g., both the
second coating (3000) and the substrate (1000) comprise aluminum
and copper). In one embodiment, the MCA of the second coating
(3000) and the substrate (1000) share at least three common
elements (e.g., both the second coating (3000) and the substrate
(1000) comprise aluminum, copper and nickel). In one embodiment,
the MCA of the second coating (3000) does not have elements in
common with the first coating (2000) (e.g., as shown in FIGS. 4k,
4n, 4q and 4r) (e.g., if the first coating (2000) includes copper,
the MCA of the second coating (3000) would not contain copper,
except as an impurity). In one embodiment, the MCA of the second
coating (3000) has elements in common with the first coating (2000)
(e.g., as shown in FIGS. 4l, 4m, 4o, and 4p) (e.g., if the first
coating (2000) includes copper, then the MCA of the second coating
(3000) would also contain copper as one of its at least four
elements). In one embodiment, the MCA of second coating (3000) and
the first coating (2000) share at least two common elements (e.g.,
both the second coating (3000) and the first coating (2000)
comprise aluminum, and copper). In one embodiment, the MCA of the
second coating (3000) and the first coating (2000) share at least
three common elements (e.g., both the second coating (3000) and the
first coating (2000) comprise aluminum, copper, and nickel). In one
embodiment, the second coating (3000) and the first coating (2000)
share one or more elements in common with the substrate (1000), but
the second coating (3000) does not share any elements in common
with the first coating (2000) (e.g., as shown in FIG. 4q). In
another embodiment, the second coating (3000) shares one or more
elements in common with the first coating (2000), and the first
coating (2000) shares one or more elements in common with the
substrate (1000), but the second coating (3000) does not share
elements in common with the substrate (1000) (e.g., as shown in
FIG. 4o). In one embodiment, the second coating (3000) shares one
or more elements in common with both the first coating (2000) and
the substrate (1000), but the first coating (2000) does not share
any elements in common with the substrate (1000) (e.g., as shown in
FIG. 4p). In one embodiment, one or more common elements are shared
by all of the substrate (1000), the first coating (2000) and the
second coating (3000) (e.g., as shown in FIG. 4l).
[0074] In one embodiment, the second coating (3000) is a final
capping coating. In one embodiment, the second coating (3000) is an
intermediate layer. In one embodiment, additional coatings (not
shown) are deposited onto the surface of the second coating (3000).
In one embodiment, the second coating (3000) shares common elements
with both the substrate (1000) and the first coating (2000). In one
embodiment, the second coating (3000) shares elements in common
with the first coating (2000) and at least some of any additional
coatings deposited on the surface of the second coating (3000). In
one embodiment, the second coating (3000) shares elements with the
substrate (1000) and at least some of any additional coatings
deposited on the surface of the second coating (3000).
[0075] The coatings in the multi-layered product can be deposited
using different manners of deposition. In one approach, the first
coating (2000) is electrodeposited. In one embodiment, the first
coating (2000) is electrodeposited and the second coating (3000) is
also electrodeposited. In another embodiment, the first coating
(2000) is electrodeposited and the second coating (3000) is spray
deposited. In another embodiment, the first coating (2000) is
electrodeposited and the second coating (3000) is deposited using
additive manufacturing.
[0076] In another approach, the first coating (2000) is spray
deposited. In one embodiment, the first coating (2000) is spray
deposited and the second coating (3000) is electrodeposited. In
another embodiment, the first coating (2000) is spray deposited and
the second coating (3000) is also spray deposited. In another
embodiment, the first coating (2000) is spray deposited and the
second coating (3000) is deposited using additive
manufacturing.
[0077] In another approach, the first coating (2000) is deposited
using additive manufacturing. In one embodiment, the first coating
(2000) is deposited using additive manufacturing and the second
coating (3000) is electrodeposited. In another embodiment, the
first coating (2000) is deposited using additive manufacturing and
the second coating (3000) is spray deposited. In another
embodiment, the first coating (2000) is deposited using additive
manufacturing and the second coating (3000) is also deposited using
additive manufacturing.
[0078] In one approach, after coating, the coated cathode (30)
undergoes one or more thermal treating processes to facilitate
realization of desired physical properties (e.g., homogeneity,
grain size, hardness and adherence to the irregular substrate among
others). In one embodiment, the thermal processing (e.g., annealing
or heat treating) takes place in a furnace. In one embodiment, the
thermal processing is intended to form a metal alloy or MCA out of
the components of the deposited coating (e.g., by allowing
diffusion and/or facilitating dissolving of the applicable
elements). In one embodiment, the thermal processing is intended to
improve homogeneity.
[0079] It is important to note that FIGS. 4a-4o depict planar
products only for the sake of simplicity with regards to explaining
the coatings involved in the invention. These figures are not
limiting. Substrates and finished products of the present invention
may take any complex or irregular shape, especially when
electrodeposition is used to deposit the first coating.
APPLICATIONS
[0080] Due to its unique properties, the new multi-layer materials
disclosed herein may find use in a variety of applications, such
as, by non-limiting example, high temperature applications for
aerospace or automotive engines (e.g., for turbochargers, such as a
turbocharger compressor wheel).
[0081] While a number of embodiments of the present invention have
been described, it is understood that these embodiments are
illustrative only, and not restrictive, and that many modifications
may become apparent to those of ordinary skill in the art. Further
still, the various steps may be carried out in any desired order
(and any desired steps may be added and/or any desired steps may be
eliminated).
* * * * *