U.S. patent application number 16/003030 was filed with the patent office on 2019-10-10 for face sensing module and computing device using same.
The applicant listed for this patent is HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to HSUEH-YUNG TANG, CHEN-KUANG YEH.
Application Number | 20190311180 16/003030 |
Document ID | / |
Family ID | 67764055 |
Filed Date | 2019-10-10 |
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United States Patent
Application |
20190311180 |
Kind Code |
A1 |
TANG; HSUEH-YUNG ; et
al. |
October 10, 2019 |
FACE SENSING MODULE AND COMPUTING DEVICE USING SAME
Abstract
A face sensing module for a computing device includes a frame, a
depth sensor, and an RGB camera. The frame includes first and
second side portions and a cross portion. The depth sensor includes
first and second infrared cameras, and an infrared light emitting
unit. The first infrared camera is mounted on the first side
portion. The second infrared camera is mounted on the second side
portion. The infrared light emitting unit is mounted on the cross
portion, with an infrared emitter and an infrared guide. Infrared
light emitted is guided out. The RGB camera is mounted on the first
side portion. The first and second infrared cameras and the RGB
camera are optically aligned before being mounted together inside
the housing of the computing device to ensure precise mountings and
the durability of precise alignment notwithstanding handling by a
user.
Inventors: |
TANG; HSUEH-YUNG; (Taoyuan,
TW) ; YEH; CHEN-KUANG; (New Taipei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HON HAI PRECISION INDUSTRY CO., LTD. |
New Taipei |
|
TW |
|
|
Family ID: |
67764055 |
Appl. No.: |
16/003030 |
Filed: |
June 7, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04N 5/2253 20130101;
H04N 5/2258 20130101; H04N 5/2256 20130101; G06K 9/209 20130101;
H04N 5/33 20130101; G06K 9/00255 20130101; H04N 5/2252 20130101;
G06K 9/00288 20130101; H04N 5/2226 20130101; H04N 5/2257
20130101 |
International
Class: |
G06K 9/00 20060101
G06K009/00; H04N 5/225 20060101 H04N005/225; H04N 5/33 20060101
H04N005/33 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 10, 2018 |
TW |
107112341 |
Claims
1. A face sensing module comprising: a frame comprising: a first
side portion having a first infrared camera receiving opening and
an RGB camera receiving opening; a second side portion having a
second infrared camera receiving opening; and a cross portion
having a light opening; a depth sensor comprising: a first infrared
camera unit mounted on the first side portion of the frame, and the
first infrared camera unit comprising: a first camera mount
received in the first infrared camera receiving opening of the
first side portion; and a first infrared camera secured to the
first camera mount; a second infrared camera unit mounted on the
second side portion of the frame, and the second infrared camera
unit comprising: a second camera mount received in the second
infrared camera receiving opening of the second side portion; and a
second infrared camera secured to the second camera mount; and an
infrared light emitting unit mounted on the cross portion of the
frame, and the infrared light emitting unit comprising: an infrared
emitter corresponding to the light opening of the cross portion;
and an infrared guide covering the light opening of the cross
portion; and an RGB camera unit mounted on the first side portion
of the frame, and the RGB camera unit comprising: a third camera
mount received in the RGB camera receiving opening of the first
side portion; and an RGB camera secured to the third camera
mount.
2. The face sensing module of claim 1, wherein the first side
portion, the cross portion, and the second side portion are
positioned in a straight line.
3. The face sensing module of claim 2, wherein the cross portion is
recessed.
4. The face sensing module of claim 1, wherein the first infrared
camera unit further comprises a first circuit board connecting the
first infrared camera to a first connector; wherein the second
infrared camera unit further comprises a second circuit board
connecting the second infrared camera to a second connector;
wherein the infrared emitter is coupled to a side portion of the
second circuit board; and wherein the RGB camera unit further
comprises a third circuit board connecting the RGB camera to a
third connector.
5. The face sensing module of claim 4, wherein the infrared light
emitting unit further comprises an infrared controller coupled to
the side portion of the second circuit board.
6. The face sensing module of claim 5, wherein the first connector
is located outside of the first side portion; wherein the second
connector is located outside of the second side portion; and
wherein the third connector is located outside of the first side
portion.
7. The face sensing module of claim 1, wherein the infrared guide
is made of a transparent and flexible material.
8. The face sensing module of claim 1, wherein the infrared guide
is columnar.
9. The face sensing module of claim 1, wherein the infrared emitter
is an LED device.
10. The face sensing module of claim 1, wherein the frame is made
of a rigid material.
11. A computing device comprising: a housing; and a face sensing
module mounted inside the housing, and the face sensing module
comprising: a frame comprising: a first side portion having a first
infrared camera receiving opening and an RGB camera receiving
opening; a second side portion having a second infrared camera
receiving opening; and a cross portion having a light opening; a
depth sensor comprising: a first infrared camera unit mounted on
the first side portion of the frame, and the first infrared camera
unit comprising: a first camera mount received in the first
infrared camera receiving opening of the first side portion; and a
first infrared camera secured to the first camera mount; a second
infrared camera unit mounted on the second side portion of the
frame, and the second infrared camera unit comprising: a second
camera mount received in the second infrared camera receiving
opening of the second side portion; and a second infrared camera
secured to the second camera mount; and an infrared light emitting
unit mounted on the cross portion of the frame, and the infrared
light emitting unit comprising: an infrared emitter corresponding
to the light opening of the cross portion; and an infrared guide
covering the light opening of the cross portion; and an RGB camera
unit mounted on the first side portion of the frame, and the RGB
camera unit comprising: a third camera mount received in the RGB
camera receiving opening of the first side portion; and an RGB
camera secured to the third camera mount.
12. The computing device of claim 11, wherein the first side
portion, the cross portion, and the second side portion are
positioned in a straight line.
13. The computing device of claim 12, wherein the cross portion is
recessed.
14. The computing device of claim 11, wherein the first infrared
camera unit further comprises a first circuit board connecting the
first infrared camera to a first connector; wherein the second
infrared camera unit further comprises a second circuit board
connecting the second infrared camera to a second connector;
wherein the infrared emitter is coupled to a side portion of the
second circuit board; and wherein the RGB camera unit further
comprises a third circuit board connecting the RGB camera to a
third connector.
15. The computing device of claim 14, wherein the infrared light
emitting unit further comprises an infrared controller coupled to
the side portion of the second circuit board.
16. The computing device of claim 15, wherein the first connector
is located outside of the first side portion; wherein the second
connector is located outside of the second side portion; and
wherein the third connector is located outside of the first side
portion.
17. The computing device of claim 11, wherein the infrared guide is
made of a transparent and flexible material.
18. The computing device of claim 11, wherein the infrared guide is
columnar.
19. The computing device of claim 11, wherein the infrared emitter
is an LED device.
20. The computing device of claim 11, wherein the frame is made of
a rigid material.
Description
FIELD
[0001] The present disclosure relates to facial recognition
technology.
BACKGROUND
[0002] A computing device, such as a smart phone, with facial
recognition includes a housing, a depth sensor, and an RGB camera.
The depth sensor and the RGB camera are mounted inside the housing
and at the top front of the computing device to facilitate face
recognition when a user looks at the computing device. The depth
sensor captures data as to depth of the user's face, and the RGB
camera is configured to capture data as to color of the user's
face. The depth sensor includes two infrared cameras. The infrared
cameras and the RGB camera need to be optically aligned inside the
housing. However, optical alignment of the infrared cameras and the
RGB camera is often difficult. Additionally, the infrared cameras
and the RGB camera may become misaligned due to handling and other
everyday forces applied to the computing device.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Many aspects of the disclosure can be better understood with
reference to the following drawings. The components in the drawings
are not necessarily drawn to scale, the emphasis instead being
placed upon clearly illustrating the principles of the disclosure.
Moreover, in the drawings, like reference numerals designate
corresponding parts throughout the several views.
[0004] FIG. 1A is a top perspective view of an embodiment of a face
sensing module.
[0005] FIG. 1B is a bottom perspective view of the face sensing
module of FIG. 1A.
[0006] FIG. 2 is a schematic front view of an embodiment of a
computing device including the face sensing module of FIG. 1A.
[0007] FIG. 3A is a top perspective exploded view of the face
sensing module of FIG. 1A.
[0008] FIG. 3B is a bottom perspective exploded view of the face
sensing module of FIG. 1A.
[0009] FIGS. 4A-4D are top perspective views of steps of assembly
of the face sensing module of FIG. 1A.
DETAILED DESCRIPTION
[0010] It will be appreciated that for simplicity and clarity of
illustration, where appropriate, reference numerals have been
repeated among the different figures to indicate corresponding or
analogous elements. In addition, numerous specific details are set
forth in order to provide a thorough understanding of the
embodiments described herein. However, it will be understood by
those of ordinary skill in the art that the embodiments described
herein can be practiced without these specific details. In other
instances, methods, procedures, and components have not been
described in detail so as not to obscure the related relevant
feature being described. Also, the description is not to be
considered as limiting the scope of the embodiments described
herein. The drawings are not necessarily to scale and the
proportions of certain parts may be exaggerated to better
illustrate details and features of the present disclosure.
[0011] In FIGS. 1A-2, a computing device 200 includes a housing
230, a speaker 220, and a face sensing module 100. The computing
device 200 may include more or less components than as described.
The computing device 200 may be a smart phone, tablet, laptop, or
other device. In the present embodiment, the computing device 200
is a smart phone. The face sensing module 100, adjacent to the
speaker 220, is mounted inside the housing 230 for face recognition
when a user looks at the computing device 200.
[0012] With reference to FIGS. 3A-3B, the face sensing module 100
includes a frame 110, a depth sensor 120, and an RGB camera unit
150. The depth sensor 120 and the RGB camera unit 150 are secured
to the frame 110 as a modular structure.
[0013] The frame 110 is made of a rigid material, such as metal or
hard plastic, that is resistant to deformation. The frame 110
includes a first side portion 111, a second side portion 112, and a
cross portion 113. The cross portion 113 is connected between the
first side portion 111 and the second side portion 112. The first
side portion 111, the cross portion 113, and the second side
portion 112 are positioned in a straight line. The first side
portion 111 has a first infrared camera receiving opening 111a and
an RGB camera receiving opening 111b. The second side portion 112
has a second infrared camera receiving opening 112a. The cross
portion 113 has a light opening 113a. The cross portion 113 is
recessed for receiving the speaker 220 or other components inside
the housing 230.
[0014] The depth sensor 120 captures data on the depth of the
user's face. The depth sensor 120 includes a first infrared camera
unit 121, a second infrared camera unit 122, and an infrared light
emitting unit 140.
[0015] The first infrared camera unit 121 is mounted on the first
side portion 111 of the frame 110. The first infrared camera unit
121 includes a first camera mount 121b, a first infrared camera
121a, a first circuit board 121c, and a first connector 131. The
first camera mount 121b is received in the first infrared camera
receiving opening 111a of the first side portion 111. The first
infrared camera 121a is secured to the first camera mount 121b. The
first circuit board 121c connects the first infrared camera 121a to
the first connector 131. The first connector 131 is located outside
of the first side portion 111. The first infrared camera 121a is
electrically connected to components inside the housing 230,
through the first connector 131.
[0016] The second infrared camera unit 122 is mounted on the second
side portion 112 of the frame 110. The second infrared camera unit
122 includes a second camera mount 122b, a second infrared camera
122a, a second circuit board 122c, and a second connector 132. The
second camera mount 122b is received in the second infrared camera
receiving opening 112a of the second side portion 112. The second
infrared camera 122a is secured to the second camera mount 122b.
The second circuit board 122c connects the second infrared camera
122a to the second connector 132. The second connector 132 is
located outside of the second side portion 112. The second infrared
camera 122a is electrically connected to components inside the
housing 230, through the second connector 132.
[0017] The infrared light emitting unit 140 is mounted on the cross
portion 113 of the frame 110. The infrared light emitting unit 140
includes an infrared emitter 141, an infrared controller 142, and
an infrared guide 143. The infrared emitter 141 and the infrared
controller 142 are coupled to a side portion 122d of the second
circuit board 122c, and are located under the cross portion 113.
The infrared emitter 141 corresponds to the light opening 113a of
the cross portion 113. The infrared emitter 141 is an LED device.
The infrared controller 142 is configured to control the infrared
emitter 141. The infrared guide 143 is mounted over the cross
portion 113, and covers the light opening 113a of the cross portion
113. Infrared light emitted by the infrared emitter 141 is emitted
outside of the housing 230 through the infrared guide 143. The
infrared guide 143 is columnar, and is made of a transparent and
flexible material. The infrared guide 143 can be bent inside the
housing 230 to guide the infrared light emitted by the infrared
emitter 141 to a specific portion of the housing 230 according to
the design of the computing device 200. Preferably, the infrared
guide 143 is a silicone stick.
[0018] The RGB camera unit 150 is mounted on the first side portion
111 of the frame 110. The RGB camera unit 150 is configured to
capture data as to color of the user's face. The RGB camera unit
150 includes a third camera mount 152, an RGB camera 151, a third
circuit board 154, and a third connector 153. The third camera
mount 152 is received in the RGB camera receiving opening 111b of
the first side portion 111. The RGB camera 151 is secured to the
third camera mount 152. The third circuit board 154 connects the
RGB camera 151 to the third connector 153. The third connector 153
is located outside of the first side portion 111. The RGB camera
151 is electrically connected to components inside the housing 230,
through the third connector 153.
[0019] The first infrared camera 121a, the second infrared camera
122a, and the RGB camera 151 can be optically aligned together
after being mounted on the frame 110 and before being mounted
inside the housing 230. Optical alignment of the first infrared
camera 121a, the second infrared camera 122a, and the RGB camera
151 outside of the housing 230 is thus easier. Additionally, the
frame 110 holds the first infrared camera 121a, the second infrared
camera 122a, and the RGB camera 151 to ensure against
displacement/misalignment.
[0020] FIGS. 4A-4D show assembly steps of the face sensing module
100.
[0021] In FIG. 4A, the infrared emitter 141 and the infrared
controller 142 of the infrared light emitting unit 140 are coupled
to the second circuit board 122c of the second infrared camera unit
122, to produce a first semi-finished product 100A.
[0022] In FIG. 4B, the first semi-finished product 100A and the
first infrared camera unit 121 are assembled on the frame 110 such
that the first camera mount 121b is received in the first infrared
camera receiving opening 111a. The second camera mount 122b is
received in the second infrared camera receiving opening 112a, and
the infrared emitter 141 corresponds to the light opening 113a. The
first infrared camera 121a and the second infrared camera 122a are
then optically aligned, and then adhesive used to secure the first
infrared camera unit 121 and the second infrared camera unit 122 to
the frame 110, to produce a second semi-finished product 100B.
[0023] In FIG. 4C, the RGB camera unit 150 is assembled on the
second semi-finished product 100B such that the third camera mount
152 is received in the RGB camera receiving opening 111b. The RGB
camera 151 is then optically aligned, and then adhesive used to
secure the RGB camera unit 150 to the frame 110, to produce a third
semi-finished product 100C.
[0024] In FIG. 4D, the infrared guide 143 of the infrared light
emitting unit 140 is assembled on the third semi-finished product
100C such that the infrared guide 143 corresponds to the infrared
emitter 141, thereby completing the assembly.
[0025] The embodiments shown and described above are only examples.
Many details are often found in this field of art thus many such
details are neither shown nor described. Even though numerous
characteristics and advantages of the present technology have been
set forth in the foregoing description, together with details of
the structure and function of the present disclosure, the
disclosure is illustrative only, and changes may be made in the
detail, especially in matters of shape, size, and arrangement of
the parts within the principles of the present disclosure, up to
and including the full extent established by the broad general
meaning of the terms used in the claims. It will therefore be
appreciated that the embodiments described above may be modified
within the scope of the claims.
* * * * *