U.S. patent application number 16/447478 was filed with the patent office on 2019-10-03 for manufacturing device for light emitting element.
The applicant listed for this patent is Japan Display Inc.. Invention is credited to Noriyuki Hirata, Takaaki ISHIKAWA, Takaaki Kamimura.
Application Number | 20190305259 16/447478 |
Document ID | / |
Family ID | 61070200 |
Filed Date | 2019-10-03 |
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United States Patent
Application |
20190305259 |
Kind Code |
A1 |
ISHIKAWA; Takaaki ; et
al. |
October 3, 2019 |
MANUFACTURING DEVICE FOR LIGHT EMITTING ELEMENT
Abstract
Disclosed is a manufacturing apparatus of a light-emitting
element including: a main transporting route extending in a first
direction, the main transporting route comprising first and second
transfer devices connected through a first transporting chamber; a
sub-transporting route extending in a second direction intersecting
the first direction, the sub-transporting route comprising a second
transporting chamber connected to the first or second transfer
device and a delivery chamber connected to the second transfer
chamber; and a plurality of first treatment chambers connected to
the delivery chamber. The main transporting route is configured to
transfer a substrate to be treated in a horizontal state, and one
of the plurality of treatment chambers is configured to hold the
substrate in a vertical state during treatment.
Inventors: |
ISHIKAWA; Takaaki; (Tokyo,
JP) ; Kamimura; Takaaki; (Tokyo, JP) ; Hirata;
Noriyuki; (Tokyo, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Japan Display Inc. |
Tokyo |
|
JP |
|
|
Family ID: |
61070200 |
Appl. No.: |
16/447478 |
Filed: |
June 20, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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16162528 |
Oct 17, 2018 |
10367174 |
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16447478 |
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15644923 |
Jul 10, 2017 |
10164218 |
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16162528 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/0008 20130101;
H01L 21/67184 20130101; C23C 14/568 20130101; H01L 27/3246
20130101; H01L 51/56 20130101; H01L 51/0011 20130101; C23C 14/24
20130101; H01L 21/67745 20130101; H01L 21/67173 20130101; H01L
21/67748 20130101; H01L 21/67751 20130101; H01L 51/0021
20130101 |
International
Class: |
H01L 51/56 20060101
H01L051/56; H01L 27/32 20060101 H01L027/32; H01L 21/677 20060101
H01L021/677; H01L 51/00 20060101 H01L051/00; C23C 14/24 20060101
C23C014/24; C23C 14/56 20060101 C23C014/56; H01L 21/67 20060101
H01L021/67 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 4, 2016 |
JP |
2016-153361 |
Claims
1. A manufacturing device for a light emitting element, the
manufacturing device comprising: a main transporting route
extending in a first direction, the main transporting route
including first and second transfer devices connected to each other
through a first transporting chamber; a sub-transporting route
extending in a second direction intersecting the first direction,
the sub-transporting route including a second transporting chamber
connected to the first or second transfer device, and a delivery
chamber connected to the second transfer chamber; and a plurality
of first treatment chambers connected to the delivery chamber,
wherein the main transporting route is configured to hold a
substrate so that a surface thereof is parallel to a horizontal
plane, and one of the plurality of treatment chambers is configured
to hold the substrate so that the surface is in a direction
intersecting the horizontal plane.
2. The manufacturing device according to claim 1, wherein another
one of the plurality of treatment chambers is configured to hold
the substrate so that the surface is parallel to the horizontal
plane.
3. The manufacturing device according to claim 1, wherein the first
transporting chamber has two layers of transporting conveyors so
that transportation of the substrate from the first transfer device
to the second transfer device and transportation of another
substrate from the second transfer device to the first transfer
device can be simultaneously executed.
4. The manufacturing device according to claim 1, wherein each of
the first transfer device and the second transfer device comprises
a first port to which the first transporting chamber is connected,
a second port connectable to the second transporting chamber, and a
third port to which a buffer for storing the substrate is
connected, and the delivery chamber has a fourth port to which the
second transporting chamber is connected and a fifth port to which
one of the plurality of first treatment chambers is connected.
5. The manufacturing device according to claim 4, wherein each of
the first to fifth ports has airtightness.
6. The manufacturing device according to claim 1, wherein each of
the first transfer device, the second transfer device, and the
delivery chamber has an arm for transporting the substrate, and the
arm of the delivery chamber has a rotation axis for rotating the
substrate between a state where the surface is parallel to the
horizontal plane and a state where the surface is in the direction
intersecting the horizontal plane.
7. The manufacturing device according to claim 1, further
comprising an inlet/outlet connected to the first transfer device
at a terminal of the main transporting route, wherein the
inlet/outlet is configured so that the substrate before treatment
is input and a substrate after treatment is output therethrough.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is based on and claims the benefit of
priority from the prior Japanese Patent Application No.
2016-153361, filed on Aug. 4, 2016, the entire contents of which
are incorporated herein by reference.
FIELD
[0002] The present invention relates to a manufacturing apparatus
and a manufacturing method of a light-emitting element.
Particularly, the present invention relates to a manufacturing
apparatus and a manufacturing method of an organic layer and an
electrode layer which structure an organic EL element of a display
device.
BACKGROUND
[0003] In recent years, a display device using an organic
electroluminescence element (organic EL element) in a display
portion has been widely employed in a variety of electronic devices
including a portable information terminal such as a smartphone. An
organic EL element has a structure in which organic layers having
respective functions are stacked and sandwiched between a pair of
electrodes. Manufacture of an organic EL element is achieved by
sequentially forming, over a substrate over which one of the
electrodes is fabricated, organic layers with an evaporation
method, an application method, and the like and then forming the
other electrode with a sputtering method, an application method,
and the like.
[0004] A stacked structure of a hole-injection
layer/hole-transporting layer/emission layer/electron-transporting
layer/electron-injection layer is represented as a typical
structure of organic layers of an organic EL element. A
manufacturing apparatus for sequentially and appropriately forming
stacked layers constructing an organic EL element, which are
exemplified by the aforementioned stacked structure, has been
proposed (for example, see Japanese patent application publication
No. 2004-288463).
SUMMARY
[0005] An organic EL element is structured with a stack of organic
layers sandwiched between a pair of electrodes, and its structure
strongly depends on the required characteristics. Therefore, a
proposal of an element having a material and a stacked-layer
structure different from those of conventional organic EL elements
requires construction of a manufacturing apparatus suitable for the
element. For example, in the manufacturing apparatus described in
the Japanese patent application publication No. 2004-288463,
delivery chambers to which a plurality of treatment chambers is
connected are connected in series through transporting chambers. In
the case of such a structure, when the stacked-layer structure is
changed or a new layer is additionally provided, a large-scale
reconstruction is necessary which includes dismantling and
rearranging a part of the apparatus groups already arranged or
adding and connecting a new delivery chamber. Additionally, each
treatment is different in treatment time. Hence, there is a
difference in treatment so that a chamber may have a high treatment
ability in a certain process but exhibit a poor treatment ability
in another process. When delivery chambers are connected in series,
a process conducted in a treatment chamber with a poor ability
becomes a bottleneck and determines throughput of the whole of the
manufacturing process.
[0006] A manufacturing apparatus of stacked films according to an
embodiment of the present invention includes: a main transporting
route having first and second transfer devices connected through a
first transporting chamber; a sub-transporting route extending in a
direction intersecting the main transporting route, the
sub-transporting route having a second transporting chamber
connected to the first or second transfer device and a delivery
chamber connected to the second transfer chamber; and a plurality
of first treatment chambers connected to the delivery chamber. The
main transporting route is configured to transfer a substrate to be
treated in a horizontal state. One of the plurality of treatment
chambers is configured to hold the substrate in a vertical state
during treatment.
[0007] A manufacturing apparatus of stacked films according to
another embodiment of the present invention includes: a main
transporting route having first and second transfer devices
connected through a first transporting chamber; a first
sub-transporting route extending in a direction intersecting the
main transporting route, the first sub-transporting having a second
transporting chamber connected to the first transfer device and a
first delivery chamber connected to the second transporting
chamber; a second sub-transporting route extending in a direction
intersecting the main transporting route, the second
sub-transporting route having a third transporting chamber
connected to the second transfer device and a second delivery
chamber connected to the third transporting chamber; a plurality of
first treatment chambers connected to the first delivery chamber;
and a plurality of second treatment chambers connected to the
second transporting chamber. The main transporting route is
configured to transfer a substrate to be treated in a horizontal
state. One of the plurality of first treatment chambers is
configured to hold the substrate in a vertical state during
treatment. One of the plurality of second treatment chambers is
configured to hold the substrate in a horizontal state.
[0008] A manufacturing method of stacked layers according to an
embodiment of the present invention is a manufacturing method of
stacked layers with a manufacturing apparatus. The manufacturing
apparatus includes: a main transporting route having first and
second transfer devices connected through a first transporting
chamber; a sub-transporting route extending in a direction
intersecting the main transporting route, the sub-transporting
route having a second transporting chamber connected to the first
or second transfer device and a delivery chamber connected to the
second transfer chamber; and a plurality of first treatment
chambers connected to the delivery chamber. The manufacturing
method includes: preparing a substrate to be treated, the substrate
having, over an insulating surface, a pixel electrode and a bank
covering an edge portion of the pixel electrode and exposing a part
of an upper surface of the pixel electrode; transporting the
substrate to the first transfer device provided on the main
transporting route of the manufacturing apparatus; transporting the
substrate from the first transfer device to the delivery chamber
through the second transporting chamber; transporting the substrate
from the delivery chamber to one of the first treatment chambers;
forming a first organic layer over the pixel electrode and the bank
while maintaining the substrate in a horizontal state; returning
the substrate from the one of the first treatment chambers to the
delivery chamber; returning the substrate from the delivery chamber
to another one of the first treatment chambers; forming a second
organic layer over the first organic layer in a region overlapping
with the pixel electrode while maintaining the substrate in a
vertical state; returning the substrate from the another one of the
plurality of first treatment chambers to the delivery chamber; and
returning the substrate from the delivery chamber to the first
transfer device through the second transporting chamber. The
manufacturing method further includes a step of rotating the
substrate from the horizontal state to the vertical state while the
substrate is transported from the delivery chamber to the another
one of the plurality of first treatment chambers.
[0009] A manufacturing method of stacked layers according to
another embodiment of the present invention is a manufacturing
method of stacked layers with a manufacturing apparatus. The
manufacturing apparatus includes: a main transporting route having
first and second transfer devices connected through a first
transporting chamber; a first sub-transporting route extending in a
direction intersecting the main transporting route, the first
sub-transporting having a second transporting chamber connected to
the first transfer device and a first delivery chamber connected to
the second transporting chamber; a second sub-transporting route
extending in a direction intersecting the main transporting route,
the second sub-transporting route having a third transporting
chamber connected to the second transfer device and a second
delivery chamber connected to the third transporting chamber; a
plurality of first treatment chambers connected to the first
delivery chamber; and a plurality of second treatment chambers
connected to the second transporting chamber. The manufacturing
method includes: preparing a substrate to be treated, the substrate
having, over an insulating surface, a pixel electrode and a bank
covering an edge portion of the pixel electrode and exposing a part
of an upper surface of the pixel electrode; transporting the
substrate to the first transfer device provided on the main
transporting route of the manufacturing apparatus; transporting the
substrate from the first transfer device to the first delivery
chamber through the second transporting chamber; transporting the
substrate from the first delivery chamber to one of the first
treatment chambers; forming a first organic layer over the pixel
electrode and the bank while maintaining the substrate in a
horizontal state; returning the substrate from the one of the first
treatment chambers to the first delivery chamber; returning the
substrate from the first delivery chamber to the first transfer
device through the second transporting chamber; transporting the
substrate from the first transfer device to the second transfer
device through the first transporting chamber; transporting the
substrate from the second transfer device to the second delivery
chamber through the third transporting chamber; transporting the
substrate from the second delivery chamber to one of the second
treatment chambers; forming a second organic layer over the first
organic layer in a region overlapping with the pixel electrode
while maintaining the substrate in a vertical state; returning the
substrate from the one of the plurality of second treatment
chambers to the second delivery chamber; and returning the
substrate from the second delivery chamber to the second transfer
device through the third transporting chamber. The manufacturing
method further includes a step of rotating the substrate from the
horizontal state to the vertical state while the substrate is
transported from the second delivery chamber to the second
transporting chamber or from the second delivery chamber to the one
of the plurality of second treatment chambers.
BRIEF DESCRIPTION OF DRAWINGS
[0010] FIG. 1 is a drawing showing a manufacturing apparatus of a
light-emitting element according to an embodiment of the present
invention:
[0011] FIG. 2 is a drawing showing a manufacturing apparatus of a
light-emitting element according to an embodiment of the present
invention:
[0012] FIG. 3 is a drawing showing a manufacturing apparatus of a
light-emitting element according to an embodiment of the present
invention:
[0013] FIG. 4 is a drawing showing a structural example of a
conventional manufacturing apparatus of a light-emitting
element:
[0014] FIG. 5A to FIG. 5F are drawings showing a fabrication
process of an organic EL element;
[0015] FIG. 6 is a drawing showing a manufacturing apparatus of a
light-emitting element according to an embodiment of the present
invention:
[0016] FIG. 7 is a drawing showing a manufacturing apparatus of a
light-emitting element according to an embodiment of the present
invention;
[0017] FIG. 8A to FIG. 8E are drawings of a manufacturing apparatus
of a light-emitting element according to an embodiment of the
present invention; and
[0018] FIG. 9A and FIG. 9B are drawings showing an evaporation mode
of an organic layer of a light-emitting element.
DESCRIPTION OF EMBODIMENTS
[0019] Hereinafter, the embodiments of the present invention are
explained with reference to the drawings. The drawings may be
illustrated so that the width, thickness, shape, and the like are
illustrated more schematically compared with those of the actual
modes in order to provide a clearer explanation. However, unless
particularly specified, they are only an example and do not limit
the interpretation of the invention. In addition, in the
specification and the drawings, the same reference number is
provided to an element that is the same as that which appears in
preceding drawings, and a detailed explanation may be omitted as
appropriate.
[0020] Furthermore, in the specification, unless specifically
stated, when a state is expressed where a structure is arranged
"over" another structure, such an expression includes both a case
where the substrate is arranged immediately above the "other
structure" so as to be in contact with the "other structure" and a
case where the structure is arranged over the "other structure"
with an additional structure therebetween.
[0021] FIG. 1 shows a structural example of a manufacturing
apparatus 100 of a light-emitting element according to an
embodiment of the present invention. In FIG. 1, a section
structured by transfer devices 101 to 103 and conveyors
(transporting chambers) 111 to 113 is a main transporting route,
and treatment devices A to E are connected, through conveyors 131
to 135, to the main transporting route in a branch form in a
direction intersecting the main transporting route. Reference
number 110 is an inlet/outlet for a substrate and is connected to a
substrate stocker (not shown), for example. The conveyors 111 to
113 and 131 to 135 undergo transportation of a substrate to be
treated between the adjacent transfer devices or between the
transfer device and delivery chambers 191 to 195 of the treatment
devices A to E. In FIG. 1, the main transporting route has a linear
shape. However, the main transporting route is not limited to this
shape, and the transfer devices 101 to 103 and the conveyors 111 to
113 constructing the main transporting route may be connected in a
unicursal line shape in this example.
[0022] The transfer device 101 has a plurality of ports, and the
conveyors 111, 112, 131, and 134 are connected thereto through the
ports. The transfer device 101 possesses a transfer arm 161 and
transfers a substrate to be treated to/from the conveyors 111, 112,
131, and 134. One or a plurality of buffers 162 may be connected to
the transfer device 101. The buffers 162 are used in order to
temporally retract a substrate to be treated in a waiting state for
being input to the apparatus. When the treatment chambers A to E
are different in treatment ability, it is possible to prevent the
substrates from being piled up on the main transporting route
without interference between the substrates arranged in the
transport sequence. In FIG. 1, two buffers 162 are connected to the
transfer device 101. However, it is sufficient that only a
necessary number of the buffers 162 are connected to each transfer
device, and the transfer device may possess a vacant port 163.
[0023] The treatment device A is structured by the delivery chamber
191 having a transfer arm 152 to which a plurality of chambers
(treatment chambers) 152 in which each treatment is conducted is
connected. Each chamber 151 is connected to the delivery chamber
191 through a port. Each port possesses a load lock gate 153. The
load lock gate 153 is airtight so as to place each section of the
apparatus under a vacuum environment or a specific atmosphere
depending on necessity and possesses a mechanism to insulate a
space continuing inside the load lock gate 153 from a space outside
the load lock gate 153. In FIG. 1, the delivery chamber 191 has 8
ports, and one of the ports is occupied for connection to the
conveyor 131. Thus, a maximum of 7 chambers 151 can be connected
thereto. It is sufficient that only a necessary number of the
chambers 151 for each process are connected, and the delivery
chamber 191 may possess a vacant port 154. The same is applied to
other treatment devices B to E.
[0024] The conveyors 111 to 113 and 131 to 135 of FIG. 1 have a
conveyor structure where a substrate is transported therein.
However, in the case where a distance between the transfer devices
or between the transfer device and the treatment device is not
relatively long and a substrate to be treated can be transferred
within an operation range of the transfer arm 161, the conveyors
may simply have a structure in which a stage over which a substrate
to be treated is disposed is provided.
[0025] In the manufacturing apparatus of a light-emitting element
of the present invention, a region in which the transfer devices
101 to 103, the conveyors 111 to 113 provided on the main
transporting route, and the conveyors 131 to 135 arranged in a
branch shape are connected is kept in a vacuum state. Therefore,
when a substrate to be treated is shuttled between the plurality of
treatment devices, the substrate is not exposed to air during
processing.
[0026] FIG. 2 shows an example of a treatment process. The arrows
roughly indicate a route of a substrate to be treated. A substrate
to be treated is transported to the transfer device 101 from the
inlet/outlet 110 through the conveyor 111. The transfer device 101
inputs, via the conveyor 131, the substrate to be treated to the
delivery chamber 191 of the treatment device A in which a first
treatment is performed. In the treatment device A, respective
treatments are carried out while transferring the substrate to be
treated between the delivery chamber 191 and treatment chambers
151. After all of the process steps are completed in the treatment
device A, the transfer device 101 receives the substrate to be
treated from the conveyor 131 and transports the substrate to the
conveyor 134.
[0027] After that, the process is sequentially carried out in the
treatment devices B, C, D, and then E, and the substrate to be
treated is brought back again to the inlet/outlet 110 after all
steps in the treatment chambers are completed.
[0028] A main characteristic of the manufacturing apparatus of a
light-emitting element of the present invention is that each of the
treatment devices A to E is connected to the main transporting
route in a branch form through the conveyors 131 to 135. For
example, as shown in FIG. 2, it is possible not only to
sequentially execute a process according to the order of the
treatment devices A, B, C, D, and then E but also adapt the
manufacturing apparatus to a variation of the order of the
treatment devices to A, E, C, D, and then B due to a change of the
stacked-layer structure even though the connection of each
treatment device is not changed.
[0029] Additionally, process steps conducted in the chambers
connected to each of the treatment devices may not be always
carried out sequentially, and a treatment in the same chamber may
be conducted a plurality of times in different process steps. In
such a case, a substrate to be treated is also readily shuttled on
the main transporting route.
[0030] Even if the order of the treatment devices employed becomes
complicated, the buffer 162 permits the substrates to be readily
retracted and pass each other. The same can be applied in the case
where a plurality of substrates to be treated is input to the
manufacturing apparatus 100.
[0031] The vacant port 164 of the transfer device 102 and the
vacant port 165 of the transfer device 103 provide future
extensibility. For example, it is possible to additionally connect
a treatment device 170 (see FIG. 1) and increase a process number
by further connecting a conveyor.
[0032] The manufacturing apparatus 100 of a light-emitting element
of the present invention has flexibility to such expansion. For
example, a treatment conducted in a treatment device 170
additionally connected to the vacant port 164 may be a treatment
which is carried out during another treatment conducted in another
treatment device. For example, when a new treatment device F is
additionally required to reconstruct a process performed in the
order of the treatment devices A, B, C, D, and then E into a
process performed in the order of the treatment devices A, F, B, C,
D, and then E, such a reconstruction can be readily achieved by
adding the treatment device F by using the vacant port 164. It is
not necessary to move the existing equipment including other
treatment devices A to E, the transfer devices 101 to 103, and the
like.
[0033] All of the process steps conducted in the treatment devices
do not always take the same treatment time, and it is not rare that
a certain step requires a longer treatment time than the other
steps. Thus, the treatment device which requires a long treatment
time acts as a bottleneck, decreasing throughput of the whole of
the manufacturing apparatus of a light-emitting element. In such a
case, a treatment chamber used for the process requiring a long
treatment time may be added and arranged in parallel by utilizing
the vacant port 164. A plurality of substrates to be treated is
divided for a parallel treatment, and the buffers 162 of each
section are utilized, by which a process conducted in one treatment
device and a process conducted in a plurality of treatment devices
in parallel can be appropriately combined.
[0034] For example, fabrication of an organic EL element requires
formation of each of a plurality of organic layers at a high purity
in an individual step, and the film-formation is carried out under
a vacuum, at a reduced pressure, or under a specific atmosphere.
Hence, a large number of treatment chambers is necessary.
Therefore, a scale of a manufacturing apparatus may become large,
and a layout of a manufacturing apparatus may be difficult in view
of a shape of a clean room and floorage. In the manufacturing
apparatus 100 of a light-emitting element of the present invention,
a degree of freedom in arrangement of the treatment devices
connected in a branch shape can be increased by arranging the
plurality of transfer devices on the main transporting route,
thereby appropriately solving the aforementioned problem.
[0035] Additionally, when a device layout is strictly limited, a
distance between the transfer devices, between the treatment
devices, or between the transfer device and the treatment device
may be increased by elongating a part of the conveyors. For
example, as demonstrated by the manufacturing apparatus 600 shown
in FIG. 6, when the treatment devices A and C respectively possess
treatment chambers 601 and 602 for single-wafer processing, and the
treatment chambers B and D respectively have treatment chambers 603
and 604 for two-wafer processing, an arrangement of the
manufacturing apparatus may be inadequate because the floorage of
the treatment chambers 603 and 604 is obviously large. In such a
case, the degree of freedom in arrangement of the treatment devices
B and D can be increased by making the conveyors 620 longer than
the conveyor 610.
[0036] FIG. 6 is illustrated so that the treatment chambers 601 and
602 of the treatment devices A and C are each a chamber for
single-wafer processing, while the treatment chambers 603 and 604
of the treatment devices B and D are each a chamber for two-wafer
processing. However, the manufacturing apparatus is not limited
thereto, and a treatment chamber for single-wafer processing and a
treatment chamber for two-wafer processing may be combined in one
treatment device.
[0037] A X-X' cross section of FIG. 1 is shown in FIG. 3. Elements
already explained in FIG. 1 are provided with the same reference
numbers. In FIG. 3, a section shown by 310, that is, the conveyor
111 and the transfer device 101 correspond to the main transporting
route, and a section shown by 320, that is, the conveyor 131 and
the treatment device A are arranged in a branch shape from the main
transporting route.
[0038] A substrate cassette 301 which stores substrates before
being input to the manufacturing apparatus is provided to the
inlet/outlet 110. A transfer arm 302 picks out a substrate to be
treated from the substrate cassette 301 and transfers it to the
conveyor 111. In FIG. 3, the conveyor 111 is illustrated so as to
have a two-layer structure. This structure is used in order to
increase efficiency in the case where the substrates to be treated
shuttle on the main transporting route in the same period. As shown
in FIG. 3, the conveyor 111 may be a one-way transport type in
which an upper-layer conveyor and a lower-layer conveyor are
respectively used for a forward direction and a reverse direction
or a dual-direction transport type in which each of the conveyors
can freely move in the forward and reverse directions. This
structure allows the plurality of substrates to be treated pass
each other on the main transporting route. Moreover, the conveyor
111 has two vertically stacked layers in FIG. 3. However, the
conveyor 111 is not limited thereto, and the two layers may be
arranged in a horizontal direction or a diagonal direction.
[0039] The transfer device 101 has the transfer arm 161 and
transfers a substrate to be treated between the conveyor 111 and
the conveyor 112 (not illustrated in FIG. 3) on the main
transporting route or between the conveyor 111 on the main
transporting route and the conveyor 132 linked to the delivery
chamber 191 of the treatment chamber A. The conveyor 131 transfers
a substrate to be treated to the delivery chamber 191 of the
treatment device A. It is not necessary that a plurality of
substrates to be treated be shuttled in the same period in this
path. Hence, unlike the conveyor 111 belonging to the main
transporting route, the conveyor 131 may be a dual-direction
transport type having a single-layer structure. Of course, the
conveyor 131 may also be a two-layer structure. When the main
transporting route and the treatment device A can be brought
sufficiently close to each other, the conveyor 131 may be simply a
stage for disposing a substrate to be treated.
[0040] The treatment apparatus A takes a substrate to be treated
with the transfer arm 152 provided to the delivery chamber 191 from
the conveyor 131 and inputs the substrate to the chamber 151.
Generally, a plurality of chambers is connected to the delivery
chamber 191, and the treatment is conducted while a substrate to be
treated is shuttled between the delivery chamber 191 and each
chamber. After the treatment in the treatment chamber A is
completed, a substrate to be treated is returned along the conveyor
131 and transported to the main transporting route.
[0041] The inlet/outlet 110, the conveyor 111, the transfer device
101, the conveyor 131, and the delivery chamber 191 are connected
through ports. The chamber 151 is connected to the delivery chamber
191 through a port. The ports each have respective load lock gates
351 to 357. Since some of the steps implemented in the
manufacturing apparatus 100 of a light-emitting element require a
vacuum, a reduced pressure, or a specific atmosphere, each load
lock gate possesses sufficient airtightness. In the treatment
device, each chamber is able to possess a different atmosphere, and
a region of minimum necessity is opened while transferring a
substrate, thereby efficiently conducing substitution of an
atmosphere and reduction of pressure.
[0042] The conveyors 111 and 131 each have a moving stage 303
supporting a substrate to be treated. In a manufacturing apparatus
for a display device, a substrate is adsorbed with a vacuum chuck
to avoid dislocation or a fall of the substrate from the stage 303
during movement. However, in an evaporation apparatus or the like
of an organic EL element, a transporting path is kept under a
vacuum to prevent exposure to air and adsorption with a vacuum
chuck is difficult. As a countermeasure to prevent the dislocation
and the fall of a substrate to be treated, a method is considered,
for example, whereby pins 140 to maintain a substrate to be treated
on the stage 303 are provided so that the pins 140 contact with a
vicinity of a peripheral portion of the substrate but do not
contact with a central portion of the substrate, allowing the
substrate to be transported in a state where a center of the
substrate is bent due to gravity. The central portion of the
substrate is located at a lower position than the tips of the pins
140 due to the bending, thereby preventing dislocation of the
substrate in a lateral direction.
[0043] Alternatively, although not specifically illustrated, pegs
for holding a substrate to be treated may be provided to the stage
303 to clamp an edge portion of the substrate, especially positions
which do not influence the film formation.
[0044] Next, a manufacturing process of an organic EL element is
explained by using FIG. 5A to FIG. 5F. FIG. 5A to FIG. 5F show a
cross-sectional view of a display region of a display device 500.
Pixel electrodes 502 and 503 are formed over an insulating surface
501. Here, a transistor for controlling each pixel, wirings for
supplying a power source to the light-emitting element, and the
like are fabricated in a layer under the insulating surface. A bank
504 is formed so as to cover edge portions of the pixel electrodes
502 and 503. Regions of the pixel electrodes 502 and 503 which are
exposed from the bank 504 serves as an emission region formed
later. The processes up to the formation of the pixel electrodes
502 and 503 and the bank 504 are conducted by photolithography and
etching. A substrate in a state shown in FIG. 5A corresponds to the
aforementioned substrate to be treated.
[0045] Here, a structure is explained where the pixel electrodes
502 and 503 serve as an anode of an organic EL element. When the
pixel electrodes 502 and 503 serve as an anode, it is preferred to
use a material with a high work function. In FIG. 5A, a structure
in which emitted light is extracted on a lower side is called a
bottom-emission mode. In this case, the pixel electrodes 502 and
503 are preferably prepared with a transparent conductive material
such as ITO, IZO, and ZnO. These materials are preferred because
transparency of the pixel electrodes allows light extraction and
the work function is high. On the other hand, in the case of a
top-emission mode where the emitted light is extracted on an upper
side, a structure is represented in which Ag and the like is used,
and the work function of a surface is increased by forming a thin
layer of ITO on the upmost surface because reflectivity is required
for the pixel electrodes 502 and 503.
[0046] As shown in FIG. 5B, a hole-transporting layer 505 is first
formed over the substrate to be treated. As a hole-transporting
material, a triarylamine derivative, a bisstyrylamine derivative,
or the like is preferred, and .alpha.-NPD, TPD, TPAC, Spiro-TPD,
PDA, m-MTDATA, and the like are represented as a typical compound.
A hole-injection layer may be provided between the pixel electrodes
502 and 503 and the hole-transporting layer 505 depending on the
work function of the surfaces of the pixel electrodes 502 and 503.
Furthermore, although the hole-transporting layer 505 is provided
as a continuous layer covering the pixel electrodes 502 and 503 and
the bank 504, it may be formed individually for the pixel
electrodes 502 and 503.
[0047] Next, as shown in FIG. 5C, emission layers 506 and 506 are
formed over the hole-transporting layer 505. In FIG. 5C, the
emission layer 506 is formed in a region overlapping with the pixel
electrode 502, whereas the light-emitting layer 507 is formed in a
region overlapping with the pixel electrode 503. This is because
emission layers including different materials are individually
prepared in view of the emission color of each pixel. In FIG. 5C, a
mask 550 having an opening in the region overlapping with the pixel
electrode 502 is arranged parallel to the substrate to form the
emission layer 506, by which the emission layer 506 is not formed
in the region overlapping with the pixel electrode 503. When the
emission layer 507 is formed over the pixel electrode 503, a mask
550 having an opening in a different position is used, and the
emission layer 507 is formed only in the region overlapping with
the pixel electrode 503. As shown in FIG. 5C, in the case where the
emission layers are prepared individually according to the emission
color, masks with the number equal to the number of the emission
colors are used, and the aforementioned process is repeated. As an
alternative method, similar to the formation of the
hole-transporting layer 505 and the like, an emission layer
continuously extending from over the pixel electrode 502 to over
the pixel electrode 503 may be formed by using a material from
which white emission is obtained. In this case, the emission color
is controlled with a color filter or a color-conversion layer
additionally fabricated.
[0048] As a material for the emission layers 506 and 507, a metal
complex such as an aluminum complex and a beryllium complex is
typically represented. Moreover, the emission layers 506 and 507
may be fabricated by using the aforementioned materials as a host
material and co-evaporating a slight amount of a dopant. As a
dopant material in such a case, an iridium complex, perylene,
rubrene, coumarin, and the like are representative. The
aforementioned materials are respectively selected depending on the
emission color desired for the emission layers 506 and 507.
[0049] Next, as shown in FIG. 5D, an electron-transporting layer
508 is formed over the hole-transporting layer 505 and the emission
layers 506 and 507. As an electron-transporting material, a
triazole derivative, an oxadiazole derivative, or the like is
preferred, and BND, PBD, TAZ, OXD, and the like are represented as
a representative compound. In FIG. 5D, the electron-transporting
layer 508 is formed as a continuous layer covering the
hole-transporting layer 505 and the emission layers 506 and 507.
However, the electron-transporting layer 508 may be formed
individually over each of the pixel electrodes 502 and 503.
[0050] Next, as shown in FIG. 5E, an opposing electrode 509 is
formed over the electron-transporting layer 508. The opposing
electrode 509 serves as a cathode of the organic EL element, and a
material with a low work function is typically used. MgAg, Al, or
the like is typically used. Since these materials are a metal
material, they are usually formed as a reflective electrode. In the
case of a bottom-emission mode, the opposing electrode 509 may be
used as a reflective electrode. However, in the case of a
top-emission mode, the aforementioned metal material is processed
to a thin film with a thickness of approximately 10 nm to several
tens of nanometers so as to have a transmitting property to some
extent because the opposing electrode 509 is required to transmit
the emitted light. The opposing electrode 509 may be prepared with
a transparent conductive material such as ITO, IZO, and ZnO. Note
that an electron-injection layer may be provided between the
electron-transporting layer 508 and the opposing electrode 509
because a work function of these transparent conductive materials,
Al, and the like is relatively high.
[0051] Through these processes, the fabrication of an organic EL
element is completed. Since an organic EL element is readily
degraded by moisture in air, it is preferred to avoid exposure to
air in each film-forming step and during transportation of a
substrate to be treated between the film-forming steps. Therefore,
it is preferred to configure the manufacturing apparatus 100 so
that the inside thereof is kept under vacuum or an atmosphere of a
specific gas and that a substrate to be treated is transported
therein.
[0052] Additionally, since the degradation promoted by moisture in
air may proceed after fabrication of an organic EL element is
completed, a sealing film may be formed as shown in FIG. 5F with a
purpose of preventing exposure of an organic EL element to air.
Here, the sealing film is prepared as a three-layer structure of a
silicon nitride film 510, an organic resin film 511, and a silicon
nitride film 512. Since the formation of the silicon nitride film
510 as the lowest layer of the sealing film provides a high
dampproofing property, the following formation of the organic resin
film 511 and the like may be performed under air. This sealing film
is also useful from a viewpoint of preventing attachment of foreign
objects to an organic EL element or damage to the stacked film by
sharp foreign objects.
[0053] When the emission layer explained by using FIG. 5C is
prepared, each emission layer is formed at a desired position by
placing the mask 550 on a surface where the emission layer is
fabricated. However, an increase in size of a substrate to be
treated accompanies an increase in size of the mask, and an
increase in resolution of a display device accompanies an aperture
ratio of the mask, which results in a reduction of the strength of
the mask. As a result, the substrate to be treated and the mask are
bent due to gravity, which leads to variation of a distance
therebetween and dislocation due to the bending. In order to avoid
this problem, the formation of the emission layer may be performed
while maintaining the substrate to be treated and the mask 500 in a
vertical state by rotating them by 90.degree.. In this case, a
mechanism for rotating the substrate to be treated is provided
between the main transporting route and the chambers 151.
[0054] FIG. 9A and FIG. 9B shows schematic views of the step for
forming the emission layer over a substrate to be treated. FIG. 9A
shows an example of the formation of the emission layer when a
substrate 910 to be treated and the mask 920 are maintained
horizontally so that a surface thereof faces a direction parallel
to gravity 930. Specifically, a mode is illustrated where an
organic material is evaporated from an evaporation source 901
provided under the substrate 910 and the emission layer is formed
on a side, that is, a lower face, of the substrate 910 facing the
evaporation source 901. In FIG. 9A, a structure is shown in which
the evaporation source 901 is a so-called linear source type
structured by a plurality of evaporation sources arranged in a line
and the evaporation source moves in a direction of an arrow 905.
However, the evaporation source is not limited to this structure.
In FIG. 5C, a mode is schematically illustrated where the emission
layer 506 is formed over an upper surface of the substrate 910.
However, the evaporation source 901, the substrate 910, and the
mask are actually arranged according to the positional relationship
shown in FIG. 9A due to the evaporation direction of the organic
material from the evaporation source 901. In this case, gravity 930
acts parallel to a thickness direction of the substrate 910 and the
mask 920, which readily leads to their bending. In the case where
the substrate 910 and the mask 920 are bent by the gravity 930, the
mask 920 may contact with the surface of the substrate 910, and a
plurality of organic layers formed on the substrate 910 may be
readily damaged. In order to prevent such a defect, convex spacers
can be formed on the bank 504 shown in FIG. 5A, which prevents the
mask 920 from contacting with the plurality of organic layers on
the substrate 910 even if the mask 920 bends.
[0055] FIG. 9B is an example of the formation of the emission layer
in which the substrate 910 to be treated is held vertically so that
its surface faces a direction perpendicular to gravity.
Specifically, a mode is demonstrated where the evaporation source
951 which is provided so that the organic material is evaporated in
a lateral direction, and the emission layer 911 is formed on a side
of the substrate 910 opposing the evaporation source. In FIG. 9B, a
structure is illustrated in which the evaporation source 951 is a
so-called linear source type structured with a plurality of
evaporation sources arranged in a line and the evaporation source
951 moves in a direction of an arrow 955. However, the evaporation
source is not limited to this structure. In this case, since
gravity 930 acts perpendicularly to the thickness direction of the
substrate 910 and the mask 920, their bending hardly occurs. Since
the contact of the mask 920 with the surface of the substrate 910
is negligible, it is not necessary to form the convex spacers on
the bank 504 as mentioned above.
[0056] FIG. 8A to FIG. 8E correspond to the cross-sectional view of
the manufacturing apparatus shown in FIG. 3 and shows an example of
a mode of the sub-transporting route 320 different in that a
mechanism for rotating a substrate to be treated is provided.
[0057] In the mode of the manufacturing apparatus shown in FIG. 3,
a substrate to be treated is transported and treated in a
horizontal state, while the treatment in the chambers 151 in the
mode of the manufacturing apparatus shown in FIG. 8A to FIG. 8E is
conducted by maintaining a substrate in a vertical state.
[0058] FIG. 8A shows a state in which a substrate 801 to be treated
is disposed over the stage 303 in the conveyor 131 in the
sub-transporting route. From this state, the load lock gate 355 is
opened, and the transfer arm receives the substrate 801 disposed
over the state 303 and drags the substrate to a side of the
transporting chamber 191 of the manufacturing apparatus. After
that, the load lock gate 355 is closed, by which the delivery
chamber 191 and the sub-transporting route are spatially separated
from each other (FIG. 8C).
[0059] Next, as shown in FIG. 8D, the road lock gate 356 linking to
the chamber 151 is opened, and the transfer arm 152 transfers the
substrate 801 to be treated to a side of the chamber 151. The
substrate to be treated is processed in the chamber 151 while
maintaining the substrate in a vertical state. The transfer arm 152
possesses a rotation axis in the middle of the arm. The arm rotates
while transferring the substrate to the chamber 151, by which the
substrate is rotated from the horizontal state to the vertical
state. A stage 802 has pegs for clamping an edge portion of the
substrate and receives and holds the substrate 801 rotated by the
transfer arm 152.
[0060] After that, as shown in FIG. 8E, the load lock gate 356 is
closed, the chamber 151 is spatially separated, and the treatment
is performed.
[0061] In FIG. 8A to FIG. 8E, the transfer arm 152 installed in the
delivery chamber 191 has a rotation axis. However, the present
embodiment is not limited thereto, and a transfer arm (not
illustrated in FIG. 8A to FIG. 8E) provided on a side of the main
transporting route may have a rotation axis. In this case, the
stage 303 of the conveyor 131 provided on a side of the
sub-transporting route has a mechanism for holding a substrate to
be treated in a vertical state.
[0062] An advantage of providing the rotation axis to the transfer
arm 152 of the delivery chamber 191 is that the holding style of a
substrate to be treated can be freely selected in each of the
plurality of chambers connected to the delivery chamber 191. For
example, a substrate to be treated can be processed in a horizontal
state in a chamber connected to the delivery chamber 191, whereas
the substrate to be treated can be processed in a vertical state in
another chamber connected to the delivery chamber.
[0063] FIG. 4 shows a conventional manufacturing apparatus of a
light-emitting element in which treatment devices A to E are
connected in series between an inlet 401 for a substrate and an
outlet 402 for a substrate through transfer devices 421 to 424 and
conveyors 411 and 412. A substrate to be treated input from the
inlet 401 passes through the treating devices A, B, C, D, and E in
this order.
[0064] In such a structure, in the case where the treatment order
is changed, for example, in the case where a treatment is conducted
in the treatment device D instead of the treatment device B
immediately after a treatment in the treatment device A, the
substrate must pass through the treatment devices B and C
interposed therebetween. That is, since the treatment device is
arranged on a flow line of the substrate, treatments of a substrate
in the treatment devices B and C cannot be conducted after a
treatment in the treatment device A is completed and until a
treatment in the treatment device D is started. Moreover, an
attempt to add a new treatment device F between the treatment
devices A and B requires movement of at least the treatment device
A, the conveyor 411, and the inlet 401. Hence, in the conventional
manufacturing apparatus of a light-emitting element shown in FIG.
4, variation of the apparatus structure due to a change or addition
of a process cannot be readily conducted. Additionally, as
described above, when a specific treatment device in the middle
part works as a bottleneck, it is difficult in the conventional
structure to apply a method whereby this section is made parallel
to increase throughput of the whole process.
[0065] In addition, the inlet 401 and the outlet 402 of the
manufacturing apparatus of a light-emitting element shown in FIG. 4
are separated because the devices are connected in series. On the
other hand, in the manufacturing apparatus of a light-emitting
element of the present invention shown in FIG. 1, input and output
of a substrate to be treated are accomplished with the inlet/outlet
110, which provides an advantage that the substrate to be treated
can be readily transferred to/from the other devices and the
stocker. Such a structure in which an inlet and an outlet are
commonly provided is called an inter-back mode. The inter-back mode
is applied not only to the inlet/outlet 110 but also to the
treatment devices A to E because the input and output from/to the
respective devices are achieved by the conveyors 131 to 135 in the
manufacturing apparatus 100. Furthermore, the employment of the
inter-back mode in each treatment device allows the treatment
devices to be arranged in a branch shape with respect to the main
transporting route, by which layout of the devices and connection
between the devices are facilitated and provided with a high degree
of freedom. Of course, since the inlet and outlet for a substrate
may be preferably separated depending on an environment where the
treatment devices are arranged, the structure may be appropriately
selected.
[0066] Moreover, the main transporting route of FIG. 1, which is
structured by the inlet/outlet 110 for a substrate, the transfer
devices 101 to 103, and the conveyors 111 to 113, may have a cyclic
structure by further connecting a head of a vacant port 180 of the
transfer device 103, which is not on a side connected to the
conveyor 113, to the inlet/outlet 110. In this case, the
manufacturing apparatus is not strictly the inter-back mode but is
almost the same as the inter-back mode because a substrate to be
treated is transferred on and around the main transporting route,
returned to the inlet/outlet 110, and then recovered.
[0067] A specific example is shown in FIG. 7. In a manufacturing
apparatus 700 of a light-emitting element, the inlet/outlet 110 for
a substrate is connected to a conveyor 731, and a substrate to be
treated is transferred between the inlet/outlet 110 and the
conveyor 731. A cyclic path constructed by the transfer devices 701
to 708 and conveyors 731 to 738 is the main transporting route. The
treatment device can be connected to each transfer device, via a
sub-transporting route, through a port other than the ports
connected to the conveyors forming the main transporting route. In
FIG. 7, the treatment devices B to H and J to L indicated with
dotted lines can be further connected in addition to the treatment
device A indicated by solid lines. In the example of FIG. 7, one or
two treatment devices are connected, via the sub-transporting
route, to each of the transfer devices 701 to 708 on the main
transporting route. However, three or more treatment devices may be
connected as long as an arrangement space permits.
[0068] Additionally, focus placed on the number of the chambers
connected to each treatment device reveals that a substrate-inlet
face for receiving a substrate from the treatment device of the
preceding process and a substrate-outlet face for transporting the
substrate to the treating device of the following process are
independently necessary for each treatment chamber according to the
conventional structure shown in FIG. 4. On the other hand, in the
structure of the present invention shown in FIG. 1, the
substrate-inlet face can be the same as the substrate-outlet face
because the treatment devices are arranged in a branch shape from
the main transporting route. In other words, there is an advantage
that the number of the chambers connectable to one treatment device
is larger by one.
[0069] From the aforementioned viewpoint, superiority of the
structure of the manufacturing apparatus of a light-emitting
element of the present invention is extremely remarkable.
[0070] Technical characteristics of the manufacturing device and
the manufacturing method of a light-emitting element of the present
invention are listed below as a supplementary note.
[0071] A manufacturing apparatus of a light-emitting element
according to an embodiment of the present invention includes: a
main transporting route having first and second transfer devices
connected through a first transporting chamber; a sub-transporting
route extending in a direction intersecting the main transporting
route, the sub-transporting route having a second transporting
chamber connected to the first or second transfer device and a
delivery chamber connected to the second transfer chamber; and a
plurality of first treatment chambers connected to the delivery
chamber. The main transporting route is configured to transfer a
substrate to be treated in a horizontal state. One of the plurality
of treatment chambers is configured to hold the substrate in a
vertical state during treatment.
[0072] Another one of the plurality of first treatment chambers is
configured to hold the substrate in a horizontal state.
[0073] A manufacturing apparatus of a light-emitting element
according to an embodiment of the present invention includes: a
main transporting route having first and second transfer devices
connected through a first transporting chamber; a first
sub-transporting route extending in a direction intersecting the
main transporting route, the first sub-transporting having a second
transporting chamber connected to the first transfer device and a
first delivery chamber connected to the second transporting
chamber; a second sub-transporting route extending in a direction
intersecting the main transporting route, the second
sub-transporting route having a third transporting chamber
connected to the second transfer device and a second delivery
chamber connected to the third transporting chamber; a plurality of
first treatment chambers connected to the first delivery chamber;
and a plurality of second treatment chambers connected to the
second transporting chamber. The main transporting route is
configured to transfer a substrate to be treated in a horizontal
state. One of the plurality of first treatment chambers is
configured to hold the substrate in a vertical state during
treatment. One of the plurality of second treatment chambers is
configured to hold the substrate in a horizontal state.
[0074] The first transfer device and the second transfer device
each have a first port to which the first transporting chamber is
connected, a second port to which the second transporting chamber
is connected, and a third port to which a buffer for storing the
substrate is connected. The first transporting chamber has a fourth
port to which the second transporting chamber is connected and a
fifth port to which one of the plurality of first treatment
chambers is connected.
[0075] The first transfer device and the second transfer device
each have a first port to which the first transporting chamber is
connected, a second port to which the second transporting chamber
is connected, and a third port to which a buffer for storing the
substrate. The first delivery chamber and the second delivery
chamber each have a fourth port to which the second transporting
chamber is connected and a fifth port to which one of the plurality
of first treatment chambers or one of the second treatment chambers
is connected.
[0076] The first transfer device, the second transfer device, and
one of the plurality of first treatment chambers each have an arm
for transporting the substrate. The arm of the first transfer
device, the second transfer device, or the one of the plurality of
first treatment chambers has a rotation axis for rotating the
substrate from a horizontal state to a vertical state or
reversely.
[0077] The first transfer device, the second transfer device, one
of the plurality of first treatment chambers, and one of the
plurality of second treatment chambers each have an arm for
transporting the substrate. The arm of the first transfer device,
the second transfer device, one of the plurality of first treatment
chambers, and one of the plurality of second treatment chambers has
a rotation axis for rotating the substrate from a horizontal state
to a vertical state or reversely.
[0078] The plurality of first treatment chambers is arranged
radiatively with the first delivery chamber as a center.
[0079] The plurality of first treatment chambers is arranged
radiatively with the first delivery chamber as a center, and the
plurality of second treatment chambers is arranged radiatively with
the second delivery chamber as a center
[0080] The first to fifth ports each have airtightness.
[0081] The manufacturing apparatus further possesses an
inlet/outlet for a substrate at the first port of the first or
second transfer device located at a terminal of the main
transporting route. Input of the substrate before treatment and
output of the substrate after treatment are each performed through
the inlet/outlet.
[0082] The manufacturing apparatus further possesses: an inlet for
a substrate at the first port of the first or second transfer
device located at one of terminals of the main transporting route;
and an outlet for a substrate at the first port of the first or
second transfer device located at the other terminal of the main
transporting route. Input of the substrate before treatment is
performed through the inlet, and output of the substrate after
treatment are performed through the outlet.
[0083] The manufacturing apparatus further possesses an
inlet/outlet for a substrate at the first port of the first or
second transfer device on the main transporting route. The main
transporting route has a cyclic path passing through the first
transfer device, the first transporting chamber, the second
transfer device, and the inlet/outlet. Input of the substrate
before treatment and output of the substrate after treatment are
each performed through the inlet/outlet.
[0084] The main transporting route has an unicursal shape.
[0085] A plurality of first transporting chambers is provided in
parallel.
[0086] An embodiment of the present invention is a manufacturing
method of stacked layers with a manufacturing apparatus. The
manufacturing apparatus includes: a main transporting route having
first and second transfer devices connected through a first
transporting chamber; a sub-transporting route extending in a
direction intersecting the main transporting route, the
sub-transporting route having second transporting chamber connected
to the first or second transfer device and a delivery chamber
connected to the second transfer chamber; and a plurality of first
treatment chambers connected to the delivery chamber. The
manufacturing method includes: preparing a substrate to be treated,
the substrate having, over an insulating surface, a pixel electrode
and a bank covering an edge portion of the pixel electrode and
exposing a part of an upper surface of the pixel electrode;
transporting the substrate to the first transfer device provided on
the main transporting route of the manufacturing apparatus;
transporting the substrate from the first transfer device to the
delivery chamber through the second transporting chamber;
transporting the substrate from the delivery chamber to one of the
first treatment chambers; forming a first organic layer over the
pixel electrode and the bank while maintaining the substrate in a
horizontal state; returning the substrate from the one of the first
treatment chambers to the delivery chamber; returning the substrate
from the delivery chamber to another one of the first treatment
chambers; forming a second organic layer over the first organic
layer in a region overlapping with the pixel electrode while
maintaining the substrate in a vertical state; returning the
substrate from the another one of the plurality of first treatment
chambers to the delivery chamber; and returning the substrate from
the delivery chamber to the first transfer device through the
second transporting chamber. The manufacturing method further
includes a step of rotating the substrate from the horizontal state
to the vertical state while the substrate is transported from the
delivery chamber to the another one of the plurality of first
treatment chambers.
[0087] Another embodiment of the present invention is a
manufacturing method of stacked layers with a manufacturing
apparatus. The manufacturing apparatus includes: a main
transporting route having first and second transfer devices
connected through a first transporting chamber; a first
sub-transporting route extending in a direction intersecting the
main transporting route, the first sub-transporting having a second
transporting chamber connected to the first transfer device and a
first delivery chamber connected to the second transporting
chamber; a second sub-transporting route extending in a direction
intersecting the main transporting route, the second
sub-transporting route having a third transporting chamber
connected to the second transfer device and a second delivery
chamber connected to the third transporting chamber; a plurality of
first treatment chambers connected to the first delivery chamber;
and a plurality of second treatment chambers connected to the
second transporting chamber. The manufacturing method includes:
preparing a substrate to be treated, the substrate having, over an
insulating surface, a pixel electrode and a bank covering an edge
portion of the pixel electrode and exposing a part of an upper
surface of the pixel electrode; transporting the substrate to the
first transfer device provided on the main transporting route of
the manufacturing apparatus; transporting the substrate from the
first transfer device to the first delivery chamber through the
second transporting chamber; transporting the substrate from the
first delivery chamber to one of the first treatment chambers;
forming a first organic layer over the pixel electrode and the bank
while maintaining the substrate in a horizontal state; returning
the substrate from the one of the first treatment chambers to the
first delivery chamber; returning the substrate from the first
delivery chamber to the first transfer device through the second
transporting chamber; transporting the substrate from the first
transfer device to the second transfer device through the first
transporting chamber; transporting the substrate from the second
transfer device to the second delivery chamber through the third
transporting chamber; transporting the substrate from the second
delivery chamber to one of the second treatment chambers; forming a
second organic layer over the first organic layer in a region
overlapping with the pixel electrode while maintaining the
substrate in a vertical state; returning the substrate from the one
of the plurality of second treatment chambers to the second
delivery chamber; and returning the substrate from the second
delivery chamber to the second transfer device through the third
transporting chamber. The manufacturing method further includes a
step of rotating the substrate from the horizontal state to the
vertical state while the substrate is transported from the second
delivery chamber to the second transporting chamber or from the
second delivery chamber to the one of the plurality of second
treatment chambers.
[0088] The first organic layer includes a hole-transporting layer
or an electron-transporting layer of a light-emitting element.
[0089] The second organic layer includes an emission layer of a
light-emitting element.
* * * * *