U.S. patent application number 15/919649 was filed with the patent office on 2019-09-19 for display device and method for preparing the same.
The applicant listed for this patent is InnoLux Corporation. Invention is credited to Kuan-Feng Lee, Jui-Jen Yueh.
Application Number | 20190288007 15/919649 |
Document ID | / |
Family ID | 67906049 |
Filed Date | 2019-09-19 |
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United States Patent
Application |
20190288007 |
Kind Code |
A1 |
Yueh; Jui-Jen ; et
al. |
September 19, 2019 |
Display device and method for preparing the same
Abstract
A display device is disclosed, which includes: a substrate,
including a first via, a first surface and a second surface
opposite to the first surface, wherein the first via has a first
sidewall having a first roughness; a connecting element disposed in
the first via; a bonding element disposed on the first surface,
wherein the bonding element includes a third surface in contact
with the connecting element, and the third surface has a second
roughness; and a circuit element disposed on the second surface,
wherein the circuit element electrically connects to the bonding
element through the connecting element, wherein the first roughness
of the first sidewall is greater than the second roughness of the
third surface. In addition, a method for preparing the aforesaid
display device is also disclosed.
Inventors: |
Yueh; Jui-Jen; (Miao-Li
County, TW) ; Lee; Kuan-Feng; (Miao-Li County,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
InnoLux Corporation |
Miao-Li County |
|
TW |
|
|
Family ID: |
67906049 |
Appl. No.: |
15/919649 |
Filed: |
March 13, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/124 20130101;
H01L 27/156 20130101; H01L 23/481 20130101; H01L 21/30604 20130101;
H01L 27/1218 20130101; H01L 51/502 20130101; H01L 27/1262 20130101;
H01L 21/76898 20130101; H01L 2227/323 20130101; H01L 27/3276
20130101; H01L 33/06 20130101; H01L 27/3288 20130101 |
International
Class: |
H01L 27/12 20060101
H01L027/12; H01L 21/768 20060101 H01L021/768; H01L 21/306 20060101
H01L021/306; H01L 23/48 20060101 H01L023/48 |
Claims
1. A display device, comprising: a substrate comprising a first
via, a first surface and a second surface opposite to the first
surface, wherein the first via has a first sidewall having a first
roughness; a connecting element disposed in the first via; a
bonding element disposed on the first surface, wherein the bonding
element comprises a third surface in contact with the connecting
element, and the third surface has a second roughness; a circuit
element disposed on the second surface, wherein the circuit element
electrically connects to the bonding element through the connecting
element; and an insulating layer disposed between the substrate and
the bonding element, wherein the first roughness of the first
sidewall is greater than the second roughness of the third surface,
wherein the insulating layer extends beyond the first sidewall by a
first distance, the insulating layer overlaps the bonding element
by a second distance, and the second distance is greater than the
first distance.
2. The display device of claim 1, wherein the insulating layer has
a second via, the second via connects to the first via and exposes
the third surface.
3. The display device of claim 2, wherein the second via has a
second sidewall having a third roughness, and the first roughness
of the first sidewall is greater than the third roughness of the
second sidewall.
4. The display device of claim 1, wherein the first distance is
greater than 0 .mu.m and less than or equal to 2 .mu.m.
5. (canceled)
6. The display device of claim 2, wherein a first angle is included
between the first sidewall of the first via and the third surface
of the bonding element, a second angle is included between a second
sidewall of the second via and the third surface of the bonding
element, and the first angle is different from the second
angle.
7. The display device of claim 6, wherein the first angle is
greater than the second angle.
8. The display device of claim 1, wherein a first angle is included
between the first sidewall of the first via and the third surface
of the bonding element, and the first angle is greater than 90
degrees and less than or equal to 160 degrees.
9. The display device of claim 1, further comprising a supporting
film disposed between the substrate and the circuit element.
10. The display device of claim 1, further comprising a first
conductive layer electrically connected to the bonding element.
11. The display device of claim 10, further comprising a display
medium disposed on the first conductive layer.
12. The display device of claim 1, further comprising a protruding
element disposed on a side of the circuit element facing the
bonding element.
13. The display device of claim 12, further comprising a second
conductive layer disposed between the circuit element and the
protruding element
14. The display device of claim 12, further comprising a second
conductive layer, wherein the protruding element is disposed
between the circuit element and the second conductive layer.
15. The display device of claim 1, wherein the connecting element
comprises an anisotropic conductive film.
16. The display device of claim 1, wherein the substrate comprises
a display region and a border region adjacent to the display
region, the substrate has a first thickness in the display region
and a second thickness at a periphery of the first via in the
border region, and the first thickness is greater than the second
thickness.
17. A method for preparing a display device, comprising: providing
a substrate comprising a first surface and a second surface
opposite to the first surface; foil ring an insulating layer on the
first surface; forming a bonding element on the insulating layer;
forming a first via penetrating the substrate; etching a part of
the substrate at a periphery of the first via; disposing a
connecting element in the first via; and disposing a circuit
element on the connecting element, wherein the circuit element
electrically connects to the bonding element through the connecting
element, wherein the first via has a first sidewall having a first
roughness, the bonding element comprises a third surface in contact
with the connecting element, the third surface has a second
roughness, and the first roughness of the first sidewall is greater
than the second roughness of the third surface, wherein the
insulating layer extends beyond the first sidewall by a first
distance, the insulating layer overlaps the bonding element by a
second distance, and the second distance is greater than the first
distance.
18. The method of claim 17, further comprising: forming a second
via penetrating the insulating layer, wherein the second via
connects to the first via and exposes the third surface.
19. The method of claim 17, further comprising: forming a first
conductive layer on the bonding element.
20. The method of claim 17, further comprising: disposing a
supporting film on the second surface of the substrate.
21. A display device, comprising: a substrate comprising a first
via, a first surface and a second surface opposite to the first
surface, wherein the first via has a first sidewall having a first
roughness; a connecting element disposed in the first via; a
bonding element disposed on the first surface, wherein the bonding
element comprises a third surface in contact with the connecting
element, and the third surface has a second roughness; and a
circuit element disposed on the second surface, wherein the circuit
element electrically connects to the bonding element through the
connecting element, wherein the first roughness of the first
sidewall is greater than the second roughness of the third surface,
wherein a first angle is included between the first sidewall of the
first via and the third surface of the bonding element, and the
first angle is greater than 90 degrees and less than or equal to
160 degrees.
Description
BACKGROUND
1. Field
[0001] The present disclosure relates to a display device and a
method for preparing the same.
2. Description of Related Art
[0002] With the continuous advancement of technologies related to
electronic devices, all the electronic devices are now developed
toward compactness, thinness, and lightness. For example, thin
display devices are the mainstream display devices on the market.
Even though the available electronic devices on the market are
compact, thin and/or light, efforts are still needed. For example,
in the display devices, the circuit arrangement in the border
region still has to be optimized, to achieve the purpose of a
display device with a narrow border region.
[0003] Hence, it is desirable to provide a display device with a
narrow border region to meet the customer's requirement.
SUMMARY
[0004] The present disclosure provides a display device, which
comprises: a substrate comprising a first via, a first surface and
a second surface opposite to the first surface, wherein the first
via has a first sidewall having a first roughness; a connecting
element disposed in the first via; a bonding element disposed on
the first surface, wherein the bonding element comprises a third
surface in contact with the connecting element, and the third
surface has a second roughness; and a circuit element disposed on
the second surface, wherein the circuit element electrically
connects to the bonding element through the connecting element,
wherein the first roughness of the first sidewall is greater than
the second roughness of the third surface.
[0005] The present disclosure also provides a method for preparing
the aforementioned display device, which comprises: providing a
substrate comprising a first surface and a second surface opposite
to the first surface; forming a bonding element on the first
surface; forming a first via penetrating the substrate; etching a
part of the substrate at a periphery of the first via; disposing a
connecting element in the first via; and disposing a circuit
element on the connecting element, wherein the circuit element
electrically connects to the bonding element through the connecting
element, wherein the first via has a first sidewall having a first
roughness, the bonding element comprises a third surface in contact
with the connecting element, the third surface has a second
roughness, and the first roughness of the first sidewall is greater
than the second roughness of the third surface.
[0006] Other novel features of the disclosure will become more
apparent from the following detailed description when taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1A to FIG. 1C are cross-sectional views of a part of a
display device, which show a method for preparing the display
device according to Embodiment 1 of the present disclosure.
[0008] FIG. 2 is a cross-sectional view of a part of a display
device according to Embodiment 1 of the present disclosure.
[0009] FIG. 3 is a cross-sectional view of a part of a display
device according to Embodiment 2 of the present disclosure.
[0010] FIG. 4 is a cross-sectional view of a part of a display
device according to Embodiment 3 of the present disclosure.
[0011] FIG. 5 is a cross-sectional view of a part of a display
device according to Embodiment 4 of the present disclosure.
[0012] FIG. 6 is a cross-sectional view of a part of a display
device according to Embodiment 5 of the present disclosure.
DETAILED DESCRIPTION OF EMBODIMENT
[0013] The following embodiments when read with the accompanying
drawings are made to clearly exhibit the above-mentioned and other
technical contents, features and/or effects of the present
disclosure. Through the exposition by means of the specific
embodiments, people would further understand the technical means
and effects the present disclosure adopts to achieve the
above-indicated objectives. Moreover, as the contents disclosed
herein should be readily understood and can be implemented by a
person skilled in the art, all equivalent changes or modifications
which do not depart from the concept of the present disclosure
should be encompassed by the appended claims.
[0014] Furthermore, the ordinals recited in the specification and
the claims such as "first", "second" and so on are intended to
describe the elements claimed and imply or represent neither that
the claimed elements have any proceeding ordinals, nor that
sequence between one claimed element and another claimed element or
between steps of a manufacturing method. The use of these ordinals
is merely to differentiate one claimed element having a certain
designation from another claimed element having the same
designation.
[0015] Furthermore, the ordinals recited in the specification and
the claims such as "above", "over", or "on" are intended not only
directly contact with the other element, but also intended
indirectly contact with the other element. Similarly, the ordinals
recited in the specification and the claims such as "below", or
"under" are intended not only directly contact with the other
element but also intended indirectly contact with the other
element.
[0016] In addition, the features in different embodiments of the
present disclosure can be mixed to form another embodiment.
Embodiment 1
[0017] FIG. 1A to FIG. 1C are cross-sectional views of a part of a
display device, which show a method for preparing the display
device according to the present embodiment, and FIG. 2 is a
cross-sectional view of a part of a display device of the present
embodiment. It could be understood that the present disclosure is
not limited to the order of the following steps.
[0018] First, as shown in FIG. 1A, a substrate 11 is provided,
which can be a rigid substrate and the material of which can
comprise quartz, glass, wafer, sapphire, or etc. The substrate 11
also can be a flexible substrate and the material of which can
comprise PC, PI, PP, PET, or other plastic material. The substrate
11 comprises a first surface 111 and a second surface 112 opposite
to the first surface 111, and a bonding element 13 is formed on the
first surface 111. Optionally, in the present embodiment, an
insulating layer 12 is formed on the first surface 111 and the
bonding element 13 is formed on the insulating layer 12, and the
material of the insulating layer 12 can be, for example, silicon
oxide, silicon nitride, silicon oxynitride or a combination
thereof. However, in other embodiment of the present disclosure,
the insulating layer 12 is not necessarily to be disposed.
Furthermore, a first conductive layer 14 is further formed on the
bonding element 13, and the first conductive layer 14 electrically
connects to the bonding element 13. The first conductive layer 14
can be, for example, a pixel electrode, a transistor, a data line,
a gate line, a gate in array (GIA) circuit, a gate on panel (GOP)
circuit, or a combination thereof. Herein, the bonding element 13
can comprise a metal oxide layer, and the material of the metal
oxide layer can be, for example, ITO, IZO, ITZO, IGZO, AZO or a
combination thereof, which can protect the first conductive layer
14 from corrosion. However, the present disclosure is not limited
thereto.
[0019] Next, a first via 113 penetrating the substrate 11 is
formed. The method for forming the first via 113 can be laser
drilling, but the present disclosure is not limited thereto.
Herein, the laser drilling is performed to form the first via 113,
to ensure the first via 113 aligned with the bonding element 13
well.
[0020] As shown in FIG. 1B, a supporting film 15 is disposed on the
second surface 112 of the substrate 11. More specifically, the
supporting film 15 is disposed on a region of the second surface
112 outside the first via 113. The material of the supporting film
15 can be a plastic film, a resin film, a photoresist film, or
other film which can resist the following etching process. Herein,
the supporting film 15 is used as an etching barrier layer to
protect the region of the substrate 11 which is not going to be
etched in the following etching process. Or, the supporting film 15
is used as a supporting base providing additional mechanical
strength to the substrate 11.
[0021] As shown in FIG. 1C, a part of the substrate 11 at the
periphery of the first via 113 is etched, which can be accomplished
by dry etching, for example, plasma etching. It could be understood
that the term "periphery of an object" refers to an area lying
beyond a limited range of distances from the object. In addition,
the insulating layer 12 is also etched, a second via 121
penetrating the insulating layer 12 is formed, and the second via
121 connects to the first via 113 and exposes a third surface 131
of the bonding element 13. In some embodiment of the present
disclosure, the supporting film 15 may be removed after the etching
process.
[0022] As shown in FIG. 2, after the etching process, a connecting
element 34 is disposed in the first via 113 as well as in the
second via 121. Herein, the connecting element 34 may be a film or
a gel comprising plural conductive particles. An example of the
connecting element 34 can comprise an anisotropic conductive film
(ACF) or the like, but the present disclosure is not limited
thereto.
[0023] Next, a circuit element 31 is disposed on the connecting
element 34, wherein the circuit element 31 electrically connects to
the bonding element 13 through the connecting element 34. Herein,
the circuit element 31 can be any flexible circuit element, for
example, a flexible print circuit (FPC) or the like, but the
present disclosure is not limited thereto.
[0024] As shown in FIG. 2, the display device of the present
embodiment comprises: a substrate 11, comprising a first via 113, a
first surface 111 and a second surface 112 opposite to the first
surface 111, wherein the first via 113 has a first sidewall 1131
having a first roughness; a connecting element 34, disposed in the
first via 113; a bonding element 13, disposed on the first surface
111, wherein the bonding element 13 comprises a third surface 131
in contact with the connecting element 34, and the third surface
131 has a second roughness; and a circuit element 31, disposed on
the second surface 112, wherein the circuit element 31 electrically
connects to the bonding element 13 through the connecting element
34, wherein the first roughness of the first sidewall 1131 is
greater than the second roughness of the third surface 131.
[0025] In the present embodiment, the first roughness of the first
sidewall 1131 is greater than the second roughness of the third
surface 131. The material of the bonding element 13 can be a metal
oxide layer, which is more compact compared to the material of the
substrate 11, so the second roughness of the third surface 131 is
less than the first roughness of the first sidewall 1131 after the
etching process. In addition, the greater first roughness of the
first sidewall 1131 can increase the surface of the first sidewall
1131 contacting the connecting element 34 to prevent the circuit
element 31 being peeled from the substrate 11. Furthermore, because
the circuit element 31 can be embedded into the periphery of the
first via 113 of the substrate 11, the width of the border region B
can further be reduced, and a display device with a narrow border
region can be achieved.
[0026] In the present disclosure, FIG. 2 is a perspective view
showing possible profiles of the first sidewall 1131 and the third
surface 131, but the present disclosure is not limited thereto. In
addition, the first roughness and the second roughness can
respectively refer to R.sub.z of the first sidewall 1131 and the
third surface 131. The first roughness and the second roughness can
be respectively defined by the following definition. The value of
the "roughness" of a surface or a sidewall is obtained based on the
ten-point height of irregularities (R.sub.z) which is defined as
the average distance between the five highest peaks and the five
deepest valleys within the evaluation length. In more details, the
ten-point height of irregularities (R.sub.z) is calculated
according to the following equation:
R z = 1 5 i = 1 5 R pi - R vi ##EQU00001##
wherein R.sub.pi and R.sub.vi are the i.sup.th highest peak, and
the i.sup.th lowest valley respectively.
[0027] In the present embodiment, the display device further
comprises: a first conductive layer 14 disposed on and electrically
connected to the bonding element 13. Moreover, the display device
further comprises: an insulating layer 12 disposed between the
substrate 11 and the bonding element 13, wherein the insulating
layer 12 has a second via 121, the second via 121 connects to the
first via 113 and exposes the third surface 131 of the bonding
element 13. Herein, the second via 121 has a second sidewall 1211
having a third roughness, and the first roughness of the first
sidewall 1131 is greater than the third roughness of the second
sidewall 1211. In addition, the insulating layer 12 extends beyond
the first sidewall 1131 of the first via 113 by a first distance
d1, and the first distance d1 is greater than 0 .mu.m and less than
or equal to 2 .mu.m. Furthermore, the insulating layer 12 overlaps
the bonding element 13 by a second distance d2, and the second
distance d2 is greater than the first distance d1. When the second
distance d2 is greater than the first distance d1, the bonding
element 13 can protect the first conductive layer 14 from corrosion
caused by the moisture penetrating into the first conductive layer
14. Herein, the first distance d1 refers to the minimum distance
between the first sidewall 1131 and an edge of the insulating layer
12 and the second distance d2 refers to a minimum distance between
the edge of the insulating layer 12 and a bonding edge 132 of the
bonding element 13.
[0028] In the present embodiment, a first angle .theta.1 is
included between the first sidewall 1131 and the third surface 131,
and the first angle .theta.1 is greater than 90 degrees and less
than or equal to 160 degrees. If the first angle .theta.1 is too
small, the binding strength of the connecting element 34 to the
first sidewall 1131 and the third surface 131 may be decreased. In
addition, a second angle .theta.2 is included between the third
surface 131 and a second sidewall 1211 of the second via 121, and
the first angle .theta.1 can be different from the second angle
.theta.2. In one embodiment of the present disclosure, the first
angle .theta.1 is greater than the second angle .theta.2. It could
be understood that the first sidewall 1131, the third surface 131,
and the second sidewall 1211 may have certain roughness. Therefore,
the angle between a surface and a sidewall is measured according to
a mean line of the surface and a mean line of the sidewall. The
mean line is located so the sum of areas above the mean line is
equal to the sum of areas bellow the mean line.
[0029] In the present embodiment, the circuit element 31 is
disposed on the second surface 112 of the substrate 11. More
specifically, because the display device of the present embodiment
further comprises a supporting film 15 disposed between the second
surface 112 of the substrate 11 and the circuit element 31, the
circuit element 31 is not directly disposed on the second surface
112. However, in another embodiment of the present disclosure, a
part of the circuit element 31 may be directly disposed on the
second surface 112 of the substrate 11 if the supporting film 15 is
removed after the etching process.
[0030] In the present embodiment, the display device may further
comprise: a protruding element 33 disposed on a side of the circuit
element 31 facing the bonding element 13. In particular, the
protruding element 33 is disposed to correspond to the bonding
element 13. Herein, the material of the protruding element 33 can
be any conductive material, for example, a metal or an alloy (such
as Cu, Ag, Au or alloy thereof), or a metal oxide (such as ITO,
IZO, ITZO, IGZO, AZO or a combination thereof). The protruding
element 33 can provide a raised structure to ensure the electrical
connection between the circuit element 31 and the bonding element
13. In particular, the raised structure provided by the protruding
element 33 can ensure the electrical connection between the circuit
element 31 and the conductive particles comprised in the connecting
element 34 and between the bonding element 13 and the conductive
particles comprised in the connecting element 34. Furthermore, the
protruding element 33 may have a curved surface or a dome shape, so
the elements adjacent to the protruding element 33 may not be
easily broken.
[0031] In addition, the display device may further comprise: a
second conductive layer 32 disposed between the circuit element 31
and the protruding element 33, wherein the circuit element 31
electrically connects to the protruding element 33 via the second
conductive layer 32. Herein, an example of the second conductive
layer 32 may be a circuit layer.
[0032] In the display device of the present embodiment, the
substrate 11 comprises a display region AA and a border region B.
The border region B is adjacent to the display region AA. More
specifically, the border region B is disposed between the display
region AA and a substrate edge 114 of the substrate 11. The
substrate 11 has a first thickness T1 in the display region AA. The
substrate 11 has a second thickness T2 at the periphery of the
first via 113 in the border region B, and the first thickness T1 is
greater than the second thickness T2. Herein, the first thickness
T1 refers to the minimum thickness of the substrate 11 in the
display region AA, and the second thickness T2 also refers to the
minimum thickness of the substrate 11 at the periphery of the first
via 113. When the first thickness T1 is greater than the second
thickness T2, the circuit element 31 can be embedded into the
periphery of the first via 113, to ensure the electrical connection
between the circuit element 31 and the bonding element 13. Herein,
because the thickness of the substrate 11 is reduced in the border
region, the circuit element 31 can further be embedded into the
periphery of the first via 113 of the substrate 11, and a display
device with a narrow border region or thin thickness can be
achieved.
[0033] In the present embodiment, the display device further
comprises: a display medium 21 disposed on the first conductive
layer 14 and on the display region AA of the substrate 11; an
overcoating layer 22 disposed on the display medium 21; and a
sealing layer 23 disposed on the overcoating layer 22. In some
embodiments, the overcoating layer 22 can be omitted. In the
present embodiment, the display medium 21 can be a self-emission
display medium. Examples of the self-emission display medium may
comprise organic light-emitting diodes (OLEDs), inorganic
light-emitting diodes (LEDs), mini light-emitting diodes
(mini-LEDs), micro light-emitting diodes (micro-LEDs), or
quantum-dot light-emitting diodes (QLEDs). It could be understood
that the chip size of the LED is 300 .mu.m to 10 mm, the mini-LED
is 100 .mu.m to 300 .mu.m, and the micro-LED is 1 .mu.m to 100
.mu.m. But the present disclosure is not limited thereto. The
overcoating layer 22 can comprise resin, photoresist, or other
insulating material. The sealing layer 23 may be an inorganic
layer, organic layer, inorganic-organic-inorganic (MI) layer, or
the combination thereof. However, the present disclosure is not
limited thereto.
Embodiment 2
[0034] FIG. 3 is a cross-sectional view of a part of a display
device according to the present embodiment. The display device of
the present embodiment is similar to that of Embodiment 1, except
that the display device of the present embodiment is not equipped
with the insulating layer.
[0035] Hence, in the present embodiment, the connecting element 34
is disposed in the first via 113. The bonding element 13 is
disposed on the first surface 111. In particular, the bonding
element 13 has a bonding edge 132 locating on the first surface 111
and near to the first sidewall 1131, and a distance d3 between the
bonding edge 132 and the first sidewall 1131 is greater than 0
.mu.m. When there is the distance d3 between the bonding edge 132
and the first sidewall 1131, the bonding element 13 can protect the
first conductive film 14 from corrosion caused by the moisture
penetrating into the first conductive film 14. Herein, the distance
d3 refers to the minimum distance between the bonding edge 132 and
the first sidewall 1131.
Embodiment 3
[0036] FIG. 4 is a cross-sectional view of a part of a display
device according to the present embodiment. The display device of
the present embodiment is similar to that of Embodiment 1, except
that the following differences.
[0037] As shown in FIG. 2, the display device of Embodiment 1 is a
display device comprising one substrate. However, in the present
embodiment, the display device comprises two substrates with a
display medium layer disposed therebetween. More specifically, the
display device of the present embodiment further comprises: a
counter substrate 41 disposed opposite to the substrate 11; and a
display medium 42 disposed between the counter substrate 41 and the
substrate 11. Herein, the counter substrate 41 can be a substrate
with or without a color filter layer and/or a black matrix layer
formed thereon. Or, in some embodiments, the color filter layer or
the black matrix layer is formed on the substrate 11. In addition,
the display medium 42 can be the self-emission display medium
illustrated in Embodiment 1, or a non-self-emission display medium
which may comprise liquid crystals (LCs). The sealing layer 23 used
in the present embodiment may be a sealant or a frit. In the
present embodiment, the overcoating layer 22 is disposed on the
first conductive layer 14 and the display medium 42 is disposed on
the overcoating layer 22. Herein, the overcoating layer 22 can be a
planer layer made of an insulating material, a resin, or a
photoresist.
Embodiment 4
[0038] FIG. 5 is a cross-sectional view of a part of a display
device of the present embodiment. The display device of the present
embodiment is similar to that of Embodiment 1, except for the
position of the second conductive layer.
[0039] In the present embodiment, the display device may further
comprise: a second conductive layer 32, wherein the protruding
element 33 is disposed between the circuit element 31 and the
second conductive layer 32. Herein, the material for the protruding
element 33 can be similar to that illustrated in Embodiment 1.
Alternatively, the material for the protruding element 33 can be an
insulating material, since the second conductive layer 32 is
disposed on the protruding element 33 to electrically connect the
circuit element 31 and the connecting element 34.
Embodiment 5
[0040] FIG. 6 is a cross-sectional view of a part of a display
device of the present embodiment. The display device of the present
embodiment is similar to that of Embodiment 2, except for the
following difference.
[0041] In Embodiment 2, as shown in FIG. 3, the first sidewall 1131
of the first via 113 and the periphery of the first via 113 has a
stepped profile. In the present embodiment, as shown in FIG. 6, the
first sidewall 1131 of the first via 113 and the periphery of the
first via 113 has a curved profile. However, in the present
disclosure, the shapes of the first sidewall 1131 are not limited
to the shapes shown in FIG. 1C to FIG. 6.
[0042] The display device made as described in any of the
embodiments of the present disclosure as described previously can
be co-used with a touch panel to form a touch display device.
Meanwhile, a display device or touch display device may be applied
to any electronic devices known in the art that need a display
screen, such as displays, mobile phones, laptops, video cameras,
still cameras, music players, mobile navigators, TV sets, and other
electronic devices that display images.
[0043] Although the present disclosure has been explained in
relation to its embodiment, it is to be understood that many other
possible modifications and variations can be made without departing
from the spirit and scope of the disclosure as hereinafter
claimed.
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