U.S. patent application number 16/229935 was filed with the patent office on 2019-08-29 for display substrate and manufacturing method thereof, display device.
The applicant listed for this patent is BOE TECHNOLOGY GROUP CO., LTD., CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.. Invention is credited to Zhiliang JIANG, Zi QIAO, Pan ZHAO.
Application Number | 20190267557 16/229935 |
Document ID | / |
Family ID | 62930162 |
Filed Date | 2019-08-29 |
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United States Patent
Application |
20190267557 |
Kind Code |
A1 |
ZHAO; Pan ; et al. |
August 29, 2019 |
DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY
DEVICE
Abstract
A display substrate and manufacturing method thereof, and a
display device is provided. The display substrate includes a base
substrate and at least one convex-concave structure and an
inorganic layer sequentially disposed on the base substrate. The
base substrate includes a display region and a non-display region
located around the display region, the at least one convex-concave
structure is located in the non-display region, and an orthographic
projection of the at least one convex-concave structure on the base
substrate is within an orthographic projection of the inorganic
layer on the base substrate.
Inventors: |
ZHAO; Pan; (Beijing, CN)
; JIANG; Zhiliang; (Beijing, CN) ; QIAO; Zi;
(Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BOE TECHNOLOGY GROUP CO., LTD.
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
Beijing
Chengdu |
|
CN
CN |
|
|
Family ID: |
62930162 |
Appl. No.: |
16/229935 |
Filed: |
December 21, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2251/5338 20130101;
H01L 51/5256 20130101; H01L 27/3246 20130101; H01L 51/56 20130101;
H01L 51/5253 20130101; G03F 7/0007 20130101; H01L 51/0097
20130101 |
International
Class: |
H01L 51/00 20060101
H01L051/00; H01L 27/32 20060101 H01L027/32; H01L 51/52 20060101
H01L051/52; H01L 51/56 20060101 H01L051/56; G03F 7/00 20060101
G03F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 28, 2018 |
CN |
201810166555.1 |
Claims
1. A display substrate, comprising: a base substrate, comprising a
display region and a non-display region located around the display
region; an inorganic layer, located on the base substrate; and at
least one convex-concave structure, located in the non-display
region and between the base substrate and the inorganic layer,
wherein an orthographic projection of the at least one
convex-concave structure on the base substrate is within an
orthographic projection of the inorganic layer on the base
substrate.
2. The display substrate according to claim 1, further comprising a
barrier, wherein the barrier is located in the non-display region
and on a side of the inorganic layer away from the base
substrate.
3. The display substrate according to claim 2, wherein the
orthographic projection of the at least one convex-concave
structure on the base substrate is within an orthographic
projection of the barrier on the base substrate.
4. The display substrate according to claim 1, wherein the base
substrate comprises an organic material, and the at least one
convex-concave structure is a protrusion contacting the base
substrate.
5. The display substrate according to claim 4, wherein the
protrusion is integrally formed with the base substrate.
6. The display substrate according to claim 1, wherein the base
substrate comprises an organic material, and the at least one
convex-concave structure is a recess, and a portion of the base
substrate facing the inorganic layer is configured to be the
recess.
7. The display substrate according to claim 1, wherein the
orthographic projection of the convex-concave structure on the base
substrate is a closed loop and surrounds the display region.
8. The display substrate according to claim 7, wherein the at least
one convex-concave structure comprises a plurality of
convex-concave structures spaced from each other from inside to
outside of the display region.
9. The display substrate according to claim 1, wherein a cross
section of the at least one convex-concave structure in a direction
perpendicular to an extension direction of the at least one
convex-concave structure is at least one of an arc, a sector, a
rectangle and a trapezoid.
10. The display substrate according to claim 2, further comprising:
an inorganic encapsulation layer, located on a side of the barrier
away from the base substrate, wherein an orthographic projection of
the barrier on the base substrate is within an orthographic
projection of the inorganic encapsulation layer on the base
substrate.
11. The display substrate according to claim 2, further comprising:
a pixel defining layer, located in the display region, wherein at
least a portion of the barrier and the pixel defining layer are
formed in a same layer by using a same material.
12. The display substrate according to claim 1, wherein the
inorganic layer comprises at least one of a buffer layer, a gate
insulating layer, an interlayer dielectric layer and a passivation
layer.
13. The display substrate according to claim 1, further comprising:
a transition layer, located between the inorganic layer and the at
least one convex-concave structure, wherein the transition layer
comprises an inorganic material, and the orthographic projection of
the at least one convex-concave structure on the base substrate is
located within an orthographic projection of the transition layer
on the base substrate.
14. The display substrate according to claim 13, wherein the base
substrate comprises a first material layer and a second material
layer laminated with the first material layer, the second material
layer is located between the first material layer and the
transition layer, the first material layer is an organic material
layer, and the second material layer comprises an inorganic
material and an organic material.
15. The display substrate according to claim 14, wherein the
transition layer comprises an organic material, a content of the
inorganic material is greater than a content of the organic
material in the transition layer, and a content of the organic
material is greater than a content of the inorganic material in the
second material layer.
16. A display device, comprising the display substrate according to
claim 1.
17. A manufacturing method of a display substrate, comprising:
providing a base substrate, the base substrate comprising a display
region and a non-display region located around the display region;
forming at least one convex-concave structure on the base
substrate, the at least one convex-concave structure being in the
non-display region; and forming an inorganic layer on the base
substrate on which the at least one convex-concave structure is
formed, wherein an orthographic projection of the at least one
convex-concave structure on the base substrate is within an
orthographic projection of the inorganic layer on the base
substrate.
18. The manufacturing method according to claim 17, further
comprising: forming a barrier on the inorganic layer, the barrier
being in the non-display region.
19. The manufacturing method according to claim 18, wherein the
orthographic projection of the at least one convex-concave
structure on the base substrate is within an orthographic
projection of the barrier on the base substrate.
20. The manufacturing method according to claim 17, wherein the
forming the at least one convex-concave structure comprises:
patterning a surface of the base substrate, so that a portion of
the surface of the base substrate facing the inorganic layer is
formed to be the at least one convex-concave structure.
Description
[0001] The present disclosure claims priority of the Chinese patent
application No. 201810166555.1, filed on Feb. 28, 2018, the
disclosure of which is incorporated herein by reference as part of
the present disclosure.
TECHNICAL FIELD
[0002] At least one embodiment of the present disclosure relates to
a display substrate and a manufacturing method thereof, and a
display device.
BACKGROUND
[0003] With a popularization of electronic display products, users
have higher requirements for the quality reliability of the
electronic display products. For example, an organic light emitting
diode (OLED) is an organic thin film electroluminescent member,
which has received great attention because of having advantages
such as simple preparation process, low cost, low power
consumption, high brightness, wide viewing angle, high contrast,
flexible display and the like. However, in a process of production
or application of the electronic display products, a crack may
occur in an internal component of the electronic display products.
If the crack is extended, the important component may be damaged,
thereby affecting product yield and increasing production cost.
SUMMARY
[0004] At least one embodiment of the present disclosure provides a
display substrate. The display substrate comprises a base substrate
and at least one convex-concave structure and an inorganic layer
sequentially disposed on the base substrate. The base substrate
comprises a display region and a non-display region located around
the display region, the at least one convex-concave structure is
located in the non-display region, and an orthographic projection
of the at least one convex-concave structure on the base substrate
is within an orthographic projection of the inorganic layer on the
base substrate.
[0005] For example, the display substrate provided by at least one
embodiment of the present disclosure further comprises a barrier,
and the barrier is located in the non-display region and on a side
of the inorganic layer away from the base substrate.
[0006] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the orthographic
projection of the at least one convex-concave structure on the base
substrate is within an orthographic projection of the barrier on
the base substrate.
[0007] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the base substrate
comprises an organic material, the at least one convex-concave
structure is a protrusion contacting the base substrate.
[0008] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the protrusion is
integrally formed with the base substrate.
[0009] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the base substrate
comprises an organic material, and the at least one convex-concave
structure is a recess, and a portion of the base substrate facing
the inorganic layer is configured to be the recess.
[0010] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the orthographic
projection of the convex-concave structure on the base substrate is
a closed loop and surrounds the display region.
[0011] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the at least one
convex-concave structure comprises a plurality of convex-concave
structures spaced from each other from inside to outside of the
display region.
[0012] For example, in the display substrate provided by at least
one embodiment of the present disclosure, a cross section of the at
least one convex-concave structure in a direction perpendicular to
an extension direction of the at least one convex-concave structure
is at least one of an arc, a sector, a rectangle and a
trapezoid.
[0013] For example, the display substrate provided by at least one
embodiment of the present disclosure further comprises an inorganic
encapsulation layer located on a side of the barrier away from the
base substrate, and an orthographic projection of the barrier on
the base substrate is within an orthographic projection of the
inorganic encapsulation layer on the base substrate.
[0014] For example, the display substrate provided by at least one
embodiment of the present disclosure further comprises a pixel
defining layer located in the display region, and the pixel
defining layer and at least a portion of the barrier are formed in
a same layer and by a same material.
[0015] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the inorganic layer
comprises at least one of a buffer layer, a gate insulating layer,
an interlayer dielectric layer and a passivation layer.
[0016] For example, the display substrate provided by at least one
embodiment of the present disclosure further comprises a transition
layer located between the inorganic layer and the at least one
convex-concave structure, the transition layer comprises an
inorganic material, and the orthographic projection of the at least
one convex-concave structure on the base substrate is located
within an orthographic projection of the transition layer on the
base substrate.
[0017] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the base substrate
comprises a first material layer and a second material layer
laminated with the first material layer, the second material layer
is located between the first material layer and the transition
layer, the first material layer is an organic material layer, and
the second material layer comprises an inorganic material and an
organic material.
[0018] For example, in the display substrate provided by at least
one embodiment of the present disclosure, the transition layer
comprises an organic material, a content of the inorganic material
is greater than a content of the organic material in the transition
layer, and a content of the organic material is greater than a
content of the inorganic material in the second material layer.
[0019] At least one embodiment of the present disclosure provides a
display device, and the display device comprises the display
substrate according to any one of the above embodiments.
[0020] At least one embodiment of the present disclosure provides a
manufacturing method of a display substrate, comprising: providing
a base substrate, the base substrate comprising a display region
and a non-display region located around the display region; forming
at least one convex-concave structure on the base substrate, the at
least one convex-concave structure being in the non-display region;
and forming an inorganic layer on the base substrate on which the
at least one convex-concave structure is formed, wherein an
orthographic projection of the at least one convex-concave
structure on the base substrate is within an orthographic
projection of the inorganic layer on the base substrate.
[0021] For example, the manufacturing method of a display substrate
provided by at least one embodiment of the present disclosure,
further comprising: forming a barrier in the non-display region on
the inorganic layer.
[0022] For example, in the manufacturing method of a display
substrate provided by at least one embodiment of the present
disclosure, the orthographic projection of the at least one
convex-concave structure on the base substrate is within an
orthographic projection of the barrier on the base substrate.
[0023] For example, in the manufacturing method of a display
substrate provided by at least one embodiment of the present
disclosure, the forming the at least one convex-concave structure
comprises: patterning a surface of the base substrate, so that a
portion of the surface of the base substrate facing the inorganic
layer is formed to be the at least one convex-concave
structure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to demonstrate clearly technical solutions of the
embodiments of the present disclosure, the accompanying drawings in
relevant embodiments of the present disclosure will be introduced
briefly. It is apparent that the drawings may only relate to some
embodiments of the disclosure and not intended to limit the present
disclosure.
[0025] FIG. 1 is a plan view of a display substrate according to an
embodiment of the present disclosure;
[0026] FIG. 2 is a cross-sectional view of the display substrate of
FIG. 1 taken along line A-B;
[0027] FIG. 3 is another cross-sectional view of the display
substrate of FIG. 1 taken along line A-B;
[0028] FIG. 4 is a partial cross-sectional view of another display
substrate according to an embodiment of the present disclosure;
[0029] FIG. 5 is a partial cross-sectional view of another display
substrate according to an embodiment of the present disclosure;
and
[0030] FIG. 6A to FIG. 6D are process diagrams of a manufacturing
method of a display substrate according to an embodiment of the
present disclosure.
DETAILED DESCRIPTION
[0031] In order to make objects, technical details and advantages
of the embodiments of the disclosure apparent, the technical
solutions of the embodiment will be described in a clearly and
fully understandable way in connection with the drawings related to
the embodiments of the disclosure. It is apparent that the
described embodiments are just a part but not all of the
embodiments of the disclosure. Based on the described embodiments
herein, those skilled in the art can obtain other embodiment,
without any creative work, which shall be within the scope of the
disclosure.
[0032] Unless otherwise defined, all the technical and scientific
terms used herein have the same meanings as commonly understood by
one of ordinary skill in the art to which the present disclosure
belongs. The terms, such as "first," "second," or the like, which
are used in the description and the claims of the present
disclosure, are not intended to indicate any sequence, amount or
importance, but for distinguishing various components. The terms,
such as "comprise/comprising," "include/including," or the like are
intended to specify that the elements or the objects stated before
these terms encompass the elements or the objects and equivalents
thereof listed after these terms, but not preclude other elements
or objects. The terms, such as "connect/connecting/connected,"
"couple/coupling/coupled" or the like, are not limited to a
physical connection or mechanical connection, but may include an
electrical connection/coupling, directly or indirectly. The terms,
"on," "under," "left," "right," or the like are only used to
indicate relative position relationship, and when the position of
the object which is described is changed, the relative position
relationship may be changed accordingly.
[0033] Some structures such as film layers in a display substrate
are composed of an inorganic material, and the film layer composed
of the inorganic material has high density and may play the
spacing, insulating and packaging functions and the like. However,
the film layer composed of the inorganic material is generally
inferior in flexibility, and the film layer is prone to be cracked
under an action of external force. For example, a display substrate
(or an electronic display product comprising the display substrate)
may be affected by factors such as a cutting process,
transportation, bending and the like during a process of production
and application, and correspondingly, a crack is easily generated
in the film layers composed of the inorganic material in an edge
region and the like of the display substrate. If the crack extends
into inside of the display substrate, important elements of the
display substrate may be damaged, and external substance such as
water, oxygen and the like may invade into inside of the display
substrate, thereby affecting product yield and increasing
production cost.
[0034] At least one embodiment of the present disclosure provides a
display substrate. The display substrate comprises a base substrate
and at least one convex-concave structure and an inorganic layer.
The base substrate comprises a display region and a non-display
region located around the display region, the inorganic layer is
disposed on the base substrate, and the at least one convex-concave
structure is located in the non-display region and between the base
substrate and the inorganic layer, wherein an orthographic
projection of the at least one convex-concave structure on the base
substrate is within an orthographic projection of the inorganic
layer on the base substrate. For example, in at least one
embodiment of the present disclosure, the display substrate further
includes a barrier, the barrier is located within the non-display
region and on a side of the inorganic layer away from the base
substrate. It should be noted that, in at least one embodiment of
the present disclosure, the at least one convex-concave structure
may comprise one convex-concave structure, and may also comprise a
plurality of convex-concave structures. In the display substrate,
in a case where a crack is generated in the inorganic layer between
the barrier and the base substrate, if the crack extends to a
region where the convex-concave structure is located, an extension
direction of the crack may change due to the function of the
convex-concave structure, so that the crack will not extend further
or an extension speed of the crack may be slow down; in addition,
in the region where the convex-concave structure is located, the
convex-concave structure increases the surface area of the
inorganic layer, which is equivalent to increase the extension path
of the crack. Therefore, the convex-concave structure can block the
crack from extending from the non-display region to the display
region, thereby preventing damage to structures in the display
region and improving the yield of the display substrate.
[0035] In at least one embodiment of the present disclosure, the
structure of the convex-concave structure is not limited as long as
the convex-concave structure may cause a surface of the inorganic
layer facing the base substrate not to be in a same plane. In this
way, the convex-concave structure can increase a surface area of
the surface of the inorganic layer facing the base substrate, so as
to increase the extension path of the crack in the inorganic layer
and change the extension direction of the crack extends in the
region where the convex-concave structure is located.
[0036] Hereinafter, a display substrate and a method manufacturing
thereof, and a display device according to at least one embodiment
of the present disclosure will be described with reference to the
accompanying drawings.
[0037] FIG. 1 is a plan view of a display substrate according to an
embodiment of the present disclosure; FIG. 2 is a cross-sectional
view of the display substrate of FIG. 1 taken along line A-B; and
FIG. 3 is another cross-sectional view of the display substrate of
FIG. 1 taken along line A-B.
[0038] As shown in FIG. 1, FIG. 2 and FIG. 3, a display substrate
provided by at least one embodiment of the present disclosure
comprises a base substrate 100 and an inorganic layer 200 and at
least one convex-concave structure 400 disposed on the base
substrate 100. The base substrate 100 comprises a display region
101 and a non-display region 102 located around the display region
101. The convex-concave structure 400 is located in the non-display
region 102 and located between the base substrate 100 and the
inorganic layer 200, and an orthographic projection of the at least
one convex-concave structure 400 on the base substrate 100 is
within an orthographic projection of the inorganic layer 200 on the
base substrate 100. Since the inorganic layer 200 covers the
convex-concave structure 400, in a region where the convex-concave
structure 400 is located, the inorganic layer 200 is conformally
formed on the convex-concave structure 400. Therefore, in the
region where the convex-concave structure 400 is located, the
convex-concave structure 400 increases a surface area of the
inorganic layer 200, which is equivalent to increase the extension
path of the crack; and when the crack extends to the region, the
crack needs to change its extension direction to further extend,
and the extension speed of the crack will slow or even stop, that
is, the convex-concave structure 400 can slow or prevent further
extension of the crack.
[0039] For example, in at least one embodiment of the present
disclosure, the conformal may denote that surface shapes of two
adjacent structures are the same or similar. Illustratively, as
shown in FIG. 2 and FIG. 3, in a direction perpendicular to a plane
in which the base substrate 100 is located, and in a case where a
cross-sectional shape of a surface of the convex-concave structure
400 is an arc (the cross-sectional shape of the convex-concave
structure 400 is a sector), the cross-sectional shape of the
surface of a portion of the inorganic layer 200 (or a transition
layer 600 in the following embodiments) that overlaps the
convex-concave structure 400 is also an arc.
[0040] It should be noted that, in at least one embodiment of the
present disclosure, the specific shape of the convex-concave
structure is not limited as long as the convex-concave structure
can increase the surface area of the inorganic layer and can have
an effect of changing the extension direction of the crack. For
example, in at least one embodiment of the present disclosure, at
least one convex-concave structure may be a protrusion or a recess
or a combination of a protrusion and a recess. For example, in some
embodiments of the present disclosure, as shown in FIG. 2, the
convex-concave structure 400 is a protrusion. For example, in other
embodiments of the present disclosure, as shown in FIG. 3, the
convex-concave structure 400 is a recess. For example, in at least
one embodiment of the present disclosure, the convex-concave
structure may also be a combination of a protrusions and a
recess.
[0041] Hereinafter, in a case where it is not explicitly explained,
the technical solution in at least one embodiment of the present
disclosure will be described by taking the convex-concave structure
400 which is configured to be a protrusion shown in FIG. 2 as an
example.
[0042] In at least one embodiment of the present disclosure, as
shown in FIG. 1 and FIG. 2, a spatial coordinate system is
established with reference to a surface on which the base substrate
100 is located, so as to directionally describe a position of each
structure in the display substrate. For example, in the spatial
coordinate system, directions of the X-axis and the Y-axis are
parallel to a plane on which the base substrate 100 is located, and
direction of the Z-axis is perpendicular to the plane on which the
base substrate 100 is located. In addition, "above" and "below" are
distinguished by a distance from the base substrate 100, "above" is
a position close to the base substrate 100, and "below" is a
position away from the base substrate 100. Illustratively, taking
the inorganic layer 200 shown in FIG. 2 as an example, the
protrusion 400 is located below the inorganic layer 200; the
inorganic layer 200 is located above the protrusion 400; a surface
of the inorganic layer 200 near the base substrate 100 is a lower
surface of the inorganic layer 200; and a surface of the inorganic
layer 200 away from the base substrate 100 is a upper surface of
the inorganic layer 200.
[0043] For example, in at least one embodiment of the present
disclosure, the orthographic projection of the convex-concave
structure on the base substrate is a closed loop and distributed
around the display region. Illustratively, as shown in FIG. 1, the
protrusions 400 are annularly distributed around the display region
101. As such, the effect of the protrusion 400 blocking the crack
from extending toward the display region 101 can be enhanced. It
should be noted that, in at least one embodiment of the present
disclosure, the distributing manner of the convex-concave structure
on the base substrate is not limited. For example, a planar shape
of the convex-concave structure may comprise a non-closed ring
shape, a line segment shape and the like, as long as the
distribution of the convex-concave structure can block the crack
from extending to the display region.
[0044] For example, in at least one embodiment of the present
disclosure, the at least one convex-concave structure comprises a
plurality of convex-concave structures spaced from inside to
outside of the display region. Illustratively, as shown in FIG. 1
and FIG. 2, a plurality of protrusions 400 are disposed on the base
substrate 100, the plurality of protrusions 400 are spaced apart
from each other, and in a plane parallel to the X-axis and the
Y-axis, the protrusions 400 are arranged in sequence around the
display region 101. As such, the protrusions 400 can act as
multiple layers of protection for the display region 101, and
further reducing a risk of the crack extending to the display
region 101.
[0045] For example, in the display substrate provided by at least
one embodiment of the present disclosure, a cross section of the at
least one convex-concave structure taken along a direction
perpendicular to an extending direction thereof comprises at least
one of an arc, a sector, a rectangle, and a trapezoid.
Illustratively, as shown in FIG. 2, the shape of the cross section
of the protrusion 400 may be a sector, for example, may further be
a semicircular. The cross-sectional shape of the convex-concave
structure may be designed according to actual process requirements,
which is not limited in at least one embodiment of the present
disclosure, as long as the convex-concave structure has an effect
of changing the extension direction of the crack.
[0046] In at least one embodiment of the present disclosure, a
material of the base substrate in the display substrate is not
limited. For example, in a display substrate provided by some
embodiments of the present disclosure, the base substrate comprises
an organic material, and the at least one of the convex-concave
structures is a protrusion contacting the base substrate. For
example, in a display substrate provided by other embodiments of
the present disclosure, the base substrate comprises an organic
material, the at least one of the convex-concave structures is a
recess, and the recess is located on a side of the base substrate
facing the inorganic layer. The flexibility of the organic material
is high, so that the base substrate has a certain flexibility, and
the display substrate can be used in a field of flexible display.
Accordingly, the flexible display substrate is subjected to a large
degree of bending during actual application process, which result
in a higher probability of occurrence of the crack in the inorganic
layer and an increased risk of further extension of the crack.
Illustratively, as shown in FIG. 2, the base substrate 100 and the
protrusion 400 are in direct contact, such that for the inorganic
material layer (comprising the inorganic layer 200) overlying the
protrusion 400, when the crack occur in the inorganic material
layer, the protrusion 400 can block further extension of the crack.
For example, a material of the flexible base substrate may comprise
an organic resin-based material such as a polyimide-based material,
a polyethylene terephthalate (PET), a polymethyl methacrylate
(PMMA) and the like.
[0047] It should be noted that, in at least one embodiment of the
present disclosure, a type of the base substrate in the display
substrate is not limited. For example, the base substrate in the
display substrate may also be a rigid substrate. For example, a
material of the rigid substrate may comprise at least one of a
glass material, a metal, a resin material and the like, and the
resin material may comprise at least one of a polyethylene
terephthalate (PET), a polymethyl methacrylate (PMMA) and the
like.
[0048] Hereinafter, the technical solution in at least one
embodiment of the present disclosure will be described by taking
that the base substrate in the display substrate is a flexible base
substrate and the material of the base substrate comprises an
organic material as an example.
[0049] In at least one embodiment of the present disclosure, as
shown in FIG. 2, the protrusion 400 and the base substrate 100 may
be a non-integrated structure. Illustratively, in a process of
manufacturing the display substrate, after the base substrate 100
is provided, a material layer may be formed on the base substrate
100, and then the material layer is patterned to form the
protrusion 400.
[0050] For example, in a display substrate provided by at least one
embodiment of the present disclosure, at least one convex-concave
structure is integrally formed with the base substrate, that is,
the convex-concave structure and the base substrate are an
integrated structure. For example, when the convex-concave
structure is a protrusion, the protrusion is integrally formed with
the base substrate; or, when the convex-concave structure is a
recess, a portion of a surface of the base substrate facing the
inorganic layer may be configured as the recess. Hereinafter, the
convex-concave structure will be described by taking a protrusion
as an example. In a case where the protrusion and the base
substrate are integrally formed, separation between the protrusion
and the base substrate can be avoided, and the yield of the display
substrate can be improved.
[0051] FIG. 4 is a partial cross-sectional view of another display
substrate according to an embodiment of the present disclosure.
Illustratively, as shown in FIG. 4, the protrusion 400 and the base
substrate 100 may be integrally formed, that is, the protrusion 400
and the base substrate 100 may be obtained from a same material
layer. Illustratively, in a manufacturing process of the display
substrate, a material layer may be provided, and then an imprinting
template is used to form the protrusion 400 on a surface of the
material layer by an imprint process, and the base substrate 100 is
simultaneously obtained; or, the material layer is subjected to a
patterning process (for example, a wet etching, a dry etching or
the like), and a portion of a surface of the material layer is
formed to be the protrusion 400, and the base substrate 100 is
simultaneously obtained. Compared with the display substrate shown
in FIG. 2, the base substrate 100 and the protrusion 400 in the
display substrate shown in FIG. 4 will not be separated, and the
risk of the protrusion 400 and the inorganic layer 200 and the like
being detached from the base substrate 100 is lowered, and the
yield of the display substrate is improved.
[0052] In at least one embodiment of the present disclosure, a
barrier may also be comprised in the display substrate, and the
barrier is located within the non-display region and on a side of
the inorganic layer away from the base substrate. Illustratively,
as shown in FIG. 2, FIG. 3, and FIG. 4, the barrier 300 is located
in the non-display region 102 and located on a side of the
inorganic layer 200 away from the base substrate 100. The barrier
300 can increase an intrusion path of foreign substance such as
water and oxygen, thereby protecting the internal components of the
display substrate. Taking the inorganic encapsulation layer 500 in
the following embodiments as an example, as shown in FIG. 2, FIG. 3
and FIG. 4, the barrier 300 increases an area of a lower surface of
the inorganic encapsulation layer 500 and increases the path of
water and oxygen and the like of invading the inside of the display
substrate along the lower surface of the inorganic encapsulation
layer 500 and reduces the risk of water, oxygen and the like
entering the inside of the display substrate, thereby protecting
elements (for example, an organic light emitting member) inside the
display substrate.
[0053] In a manufacturing process of the display substrate, the
barrier may also be used to store a material to prevent the
material from overflowing, thereby improving the yield of the
display substrate. For example, the display substrate is an organic
light emitting diode display substrate, and an organic light
emitting layer of the organic light emitting member may be
manufactured by a process of inkjet printing. The barrier can
prevent the corresponding inkjet printing material from
overflowing, which can reduce material waste and increase a
thickness of the organic light emitting layer, so that the organic
light emitting member has a good light emitting function. In
addition, in a packaging process of the display substrate, in a
case of manufacturing an organic package layer by inkjet printing,
the barrier can prevent the corresponding inkjet printing material
from overflowing, thereby increasing the thickness and the
uniformity of the organic package layer.
[0054] In at least one embodiment of the present disclosure,
relative positions of the convex-concave structure and the barrier
are not limited in a direction parallel to a plane on which the
base substrate is located. For example, in at least one embodiment
of the present disclosure, an orthographic projection of the at
least one convex-concave structure on the base substrate is within
an orthographic projection of the barrier on the base
substrate.
[0055] Illustratively, the convex-concave structure is a
protrusion. As shown in FIG. 2 and FIG. 4, an orthographic
projection of the protrusion 400 on the base substrate 100 is
located within an orthographic projection of the barrier 300 on the
base substrate 100. As such, the protrusion 400 may increase a
height of the barrier 300 (a distance from a surface of the barrier
300 away from the base substrate 100 to the base substrate 100), or
in a case where a design height of the barrier 300 is constant, the
usage amount of the material for forming the barrier 300 can be
reduced. An upper surface of the inorganic layer 200 is in contact
with the barrier 300, and the inorganic layer 200 and the barrier
300 have a certain bonding force, and a cooperation between the
bonding force and the protrusion 400 can reduce the risk of an
occurrence of the crack in the inorganic layer 200 located on the
protrusion 400, or further prevent an extension of the crack. At a
position where the protrusion 400 is disposed, the inorganic layer
200 may have a problem of stress accumulation due to shape
deformation, and in a case where materials of the barrier 300 and
the protrusion 400 are materials having a certain elasticity (for
example, organic material), the barrier 300 and the protrusion 400
may facilitate uniform release of stress in the inorganic layer
200, thereby further reducing the risk of an occurrence of the
crack in the inorganic layer or preventing an extension of the
crack. In addition, the protrusion 400 increases a surface area of
the inorganic layer 200, accordingly, in a case where the size of
the barrier 300 is fixed, a contact area of the barrier 300 with
the inorganic layer 200 is correspondingly increased, the adhesion
of the barrier 300 to the inorganic layer 200 is increased, and the
barrier 300 can be prevented from falling off.
[0056] For example, a description is provided by taking a
convex-concave structure as a recess. Illustratively, as shown in
FIG. 3, an orthographic projection of the recess 400 on the base
substrate 100 is within an orthographic projection of the barrier
300 on the base substrate 100. An upper surface of the inorganic
layer 200 is in contact with the barrier 300, and the inorganic
layer 200 and the barrier 300 and the inorganic layer 200 have a
certain bonding force, and the cooperation between the bonding
force and the recess 400 can reduce the risk of an occurrence of
the crack in the inorganic layer 200 located on the recess 400, or
further prevent an extension of the crack. At a position where the
recess 400 is disposed, the inorganic layer 200 may have a problem
of stress accumulation due to shape deformation, and in a case
where materials of the barrier 300 and the base substrate 100 are
materials having a certain elasticity (for example, organic
material), the barrier 300 and the recess 400 may facilitate
uniform release of stress in the inorganic layer 200, thereby
further reducing the risk of an occurrence of the crack in the
inorganic layer or preventing an extension of the crack. In
addition, the recess 400 increases a surface area of the inorganic
layer 200, accordingly, in a case where the size of the barrier 300
is fixed, a contact area of the barrier 300 with the inorganic
layer 200 is correspondingly increased, the adhesion of the barrier
300 to the inorganic layer 200 is increased, and the barrier 300
can be prevented from falling off.
[0057] In at least one embodiment of the present disclosure,
parameters such as a thicknesses and a widths of the convex-concave
structure and the barrier are not limited. For example, as shown in
FIG. 4, the thickness of the protrusion 400 (a distance from an end
of the protrusion 400 away from the base substrate 100 to an end of
the protrusion 400 near the base substrate 100) may be 0 to 1.5
.mu.m, for example, may further be 0.5 .mu.m, 1 .mu.m, 1.2 .mu.m or
the like; the width of the protrusion 400 (for example, a width W
shown in FIG. 4) may be 10-20 .mu.m, for example, may further be 12
.mu.m, 15 .mu.m, 18 .mu.m or the like. For example, the thickness
of the barrier 300 (a distance from an end of the barrier 300 away
from the base substrate 100 to an end of the barrier 300 near the
base substrate 100) may be 1.5 to 3 .mu.m, and the barrier 300 may
have a width of 40 to 50 .mu.m. For example, in at least one
embodiment of the present disclosure, in a case where the
convex-concave structure is a recess, parameters such as a depth
and a width of the recess may refer to the numerical range of the
thickness and the width of the protrusion, which will not be
described herein.
[0058] For example, in at least one embodiment of the present
disclosure, an orthographic projection of the at least one
convex-concave structure on the base substrate is outside an
orthographic projection of the barrier on the base substrate. FIG.
5 is a partial cross-sectional view of another display substrate
according to an embodiment of the present disclosure.
Illustratively, as shown in FIG. 5, the orthographic projection of
the protrusion 400 on the base substrate 100 is outside the
orthographic projection of the barrier 300 on the base substrate
100. As such, the protrusion 400 can prevent not only an extension
of the crack in the inorganic layer 200 but also an extension of a
crack in other inorganic thin films (for example, the inorganic
encapsulation layer 500 described in FIG. 5 and the following
embodiments) provided on the display substrate. For example, the
protrusion 400 may be located on a side of the barrier 300 closer
to the display region 101, or the protrusion 400 may be located on
a side of the barrier 300 away from the display region 101. For
example, a plurality of protrusions may be disposed in the display
substrate, and orthographic projections of some of the plurality of
protrusions, on the base substrate are located within an
orthographic projection of the barrier on the base substrate, and
orthographic projections of the other of the plurality of
protrusions on the base substrate are located outside the
orthographic projection of the barrier on the base substrate.
[0059] In at least one embodiment of the present disclosure, a
method of disposing the barrier is not limited. For example, in a
process of manufacturing the display substrate, the barrier may be
formed separately, or the barrier may be simultaneously
manufactured in a process of manufacturing other structures of the
display substrate.
[0060] For example, the display substrate provided by at least one
embodiment of the present disclosure may further comprise a pixel
defining layer located within the display region. For example, at
least a portion of the barrier and the pixel defining layer may be
formed in a same layer and by a same material. The pixel defining
layer may define a plurality of pixel openings, to form an organic
light emitting member in each of the pixel openings. For example,
an organic light emitting layer of an organic light emitting member
may be formed in the pixel opening by inkjet printing, thus, the
process of manufacturing the display substrate can be simplified
and the cost can be reduced.
[0061] For example, a material of the pixel defining layer may
comprise polyimides, polyethylene terephthalate (PET), polymethyl
methacrylate (PMMA), and the like. For example, the material of the
pixel defining layer may comprise a photoresist material (for
example, a photoresist), and further, a material of a spacer layer
is a polyimide doped with a photoresist material. As such, in a
process of manufacturing the spacer layer by a patterning process,
the process of manufacturing the spacer layer is simplified and the
cost is reduced. For example, the pixel defining layer may be a
single layer structure or a double layer or a multilayer composite
structure. For example, the pixel defining layer is a double layer
structure, and the pixel defining layer comprises a first defining
layer and a second defining layer sequentially stacked on the base
substrate. The first defining layer is configured to be lyophilic
with respect to an ink of the inkjet printing, and the second
defining layer is configured to be lyophobic with respect to the
ink of the inkjet printing, such that in the process of inkjet
printing, the ink is bound in the pixel opening, thereby improving
the function of the light emitting member and the yield of the
display substrate.
[0062] For example, in at least one embodiment of the present
disclosure, a spacer layer may also be disposed in the display
substrate. For example, at least a portion of the barrier and the
spacer layer are formed in a same layer and by a same material. For
example, the barrier comprises a first film layer and a second film
layer sequentially stacked on the base substrate, and the first
film layer and the pixel defining layer may be formed in a same
layer and by a same material, and the second film layer and the
spacer layer may be formed in a same layer and by a same material.
As such, a thickness of the spacer can be increased, thereby the
path of water, oxygen, and the like invading to inside of the
display substrate can be increased, and the water, the oxygen and
the like can be prevented from invading the inside of the display
substrate. The spacer layer can be used to support the display
substrate or an overall thickness of a display panel comprising the
display substrate, so as to avoid problems such as thickness
unevenness caused by external force. For example, a cover plate may
be disposed on the display substrate to form a display panel, the
cover plate may protect the display substrate, and the spacer layer
may be used to support the cover plate and the display substrate to
maintain the thickness of the display panel.
[0063] For example, a material of the spacer layer may comprise
polyimides, polyethylene terephthalate (PET), polymethyl
methacrylate (PMMA), and the like. For example, the material of the
spacer layer may comprise a photoresist material (for example, a
photoresist), and further, the material of the spacer layer is a
polyimide doped with a photoresist material. As such, in a process
of manufacturing the spacer layer by a patterning process, the
process of manufacturing the spacer layer is simplified and the
cost is reduced.
[0064] In at least one embodiment of the present disclosure, the
type of the inorganic layer between the convex-concave structure
and the barrier is related to the specific structure of the display
substrate, which is not limited herein. For example, in the display
substrate provided by at least one embodiment of the present
disclosure, the inorganic layer comprises at least one of a buffer
layer, a gate insulating layer, an interlayer dielectric layer and
a passivation layer. For example, the material of the above
inorganic layer may comprise a silicon nitride, a silicon oxide, a
silicon oxynitride, or the like.
[0065] In the display substrate provided by at least one embodiment
of the present disclosure, the material of the base substrate is
mainly an organic material, which can make the base substrate more
flexible, so that the display substrate may be used for flexible
display. Since properties of the organic material and the inorganic
material are different, it is not easy to crystallize between the
organic material and the inorganic material, such that bonding
strength between the inorganic layer and the base substrate is low
and the inorganic layer and the base substrate are easily
separated. Therefore, in an actual process, a transition material
may be disposed between the inorganic layer and the base substrate,
and the transition material may have a large bonding strength with
the inorganic material and the organic material to prevent the
inorganic layer from separating from the base substrate.
[0066] For example, the display substrate provided by at least one
embodiment of the present disclosure further comprises a transition
layer located between the inorganic layer and the convex-concave
structure, the transition layer comprises an inorganic material,
and an orthographic projection of the convex-concave structure on
the base substrate is within an orthographic projection of the
transition layer on the base substrate. Illustratively, as shown in
FIG. 2 to FIG. 5, the display substrate comprises the transition
layer 600 disposed between the base substrate 100 and the inorganic
layer 200. For example, the transition layer 600 may comprise an
inorganic material. For example, the transition layer 600 may
comprise a composite material comprising an organic material and an
inorganic material. As such, the transition layer 600 and the base
substrate 100, and the transition layer 600 and the inorganic layer
200 have a strong bonding force. For example, an orthographic
projection of the protrusion 400 on the base substrate 100 is
within an orthographic projection of the transition layer 600 on
the base substrate 100. As such, the protrusions 400 can prevent an
extension of the crack in the transition layer 600.
[0067] It should be noted that in at least one embodiment of the
present disclosure, the base substrate may also be designed to be a
composite layer (a laminated layer) comprising a plurality of film
layers. For example, the base substrate may comprise a first
material layer and a second material layer laminated with the first
material layer, and the second material layer is located between
the first material layer and the transition layer (or the
convex-concave structure). For example, the first material layer is
an organic material layer, and the second material layer is a
composite material layer comprising an inorganic material and an
organic material. For example, in the second material layer, a
content of the organic material is greater than a content of the
inorganic material. For example, in the transition layer, a content
of the inorganic material is greater than a content of the organic
material. Therefore, the bonding strengths between the transition
layer and the inorganic layer, and the transition layer and the
base substrate are relatively high, such that a degree of firmness
of the inorganic layer fixed on the base substrate can be further
improved. For example, in the base substrate and the transition
layer, the inorganic material may comprise a silicon nitride, a
silicon oxide, a silicon oxynitride, and the like, and the organic
material may comprise a resin-based material such as polyimide and
the like.
[0068] For example, the display substrate provided by at least one
embodiment of the present disclosure further comprises an inorganic
encapsulation layer located on a side of the barrier away from the
base substrate, and an orthographic projection of the barrier on
the base substrate is within an orthographic projection of the
inorganic encapsulation layer on the base substrate.
Illustratively, as shown in FIG. 2 to FIG. 5, the display substrate
may comprise an inorganic encapsulation layer 500 disposed on a
side of the barrier 300 away from the base substrate 100. The
material of the inorganic encapsulating layer 500 is high in
density, so that the inorganic encapsulating layer 500 can cover
the surface of the display substrate to prevent water, oxygen, or
the like from intruding into the inside of the display substrate.
The inorganic encapsulating layer 500 covers the barrier 300, so
that the harrier 300 increases an area of the lower surface of the
inorganic encapsulating layer 500, that is, the path of water,
oxygen, and the like invading the inside of the display substrate
can be increased, and the water, the oxygen and the like can
further be prevented from invading the inside of the display
substrate. For example, the inorganic encapsulation layer 500 may
be formed by a process such as chemical vapor deposition (CVD) or
the like.
[0069] For example, the inorganic encapsulation layer 500 may be a
composite layer comprising a laminated layer of at least two film
layers. For example, the inorganic encapsulation layer 500 may
comprise a first inorganic encapsulation layer 510 and a second
inorganic encapsulation layer 520. An organic encapsulation layer
may also be disposed between the first inorganic encapsulation
layer 510 and the second inorganic encapsulation layer 520, and the
organic encapsulation layer is mainly located in the display
region. The organic encapsulation layer can planarize a surface of
the display substrate and has a certain flexibility to have a
buffering effect. For example, a material such as a desiccant or
the like may be provided in the organic encapsulating layer, and
the material may absorb intrusive elements such as water, oxygen
and the like to protect components disposed inside the display
substrate.
[0070] At least one embodiment of the present disclosure provides a
display device comprising the display substrate according to any
one of the above embodiments. For example, the display device may
be an organic light emitting diode display panel, and the display
substrate may serve as an array substrate in the display panel.
[0071] For example, in one example of the present disclosure, a
plurality of organic light emitting members which can emit light of
different colors (for example, red, green, blue and the like) may
be formed in an array substrate of a display device to display an
image. For example, after the array substrate is packaged, a
surface on a light exit side of the array substrate may be
planarized, and then the display device is obtained, therefore,
other structures (such as a touch panel or the like) may be easily
formed on the array substrate; or a package cover plate may also be
disposed on the light exit side of the array substrate, the package
cover plate and the array substrate may be bonded together by an
optical adhesive, and the package cover plate has a certain
strength such that the array substrate may be protected.
[0072] For example, in another example of the present disclosure,
the organic light emitting member in the array substrate emits
white light or a monochromatic short-wavelength light such as blue
light or the like. For example, a color filter substrate may be
disposed in the display device, and the color filter substrate and
the array substrate are cell-assembled, thereby a color display can
be realized. For example, different types of quantum dots may be
disposed in a color film layer of the color filter substrate, and
the quantum dots can emit different colors of light after being
excited by the monochromatic short-wavelength light, such that the
color display can also be realized. The quantum dots have good
scattering effect on light such that a viewing angle of the display
image of the display device can be increased.
[0073] For example, the display device provided by at least one
embodiment of the present disclosure may be any product or
component having a display function, such as a tablet computer, a
television set, a display, a notebook computer, a digital photo
frame, a navigator, and the like, which is not limited by at least
one embodiment of the present disclosure.
[0074] At least one embodiment of the present disclosure provides a
manufacturing method of a display substrate, comprising: providing
a base substrate, the base substrate comprising a display region
and a non-display region located around the display region; forming
at least one convex-concave structure on the base substrate, the at
least one convex-concave structure being located in the non-display
region; and forming an inorganic layer on the base substrate on
which the at least one convex-concave structure is formed, wherein
an orthographic projection of the at least one convex-concave
structure on the base substrate is within an orthographic
projection of the inorganic layer on the base substrate. For
example, the manufacturing method of the display substrate provided
by at least one embodiment of the present disclosure further
comprises forming a barrier on the inorganic layer, the barrier is
located in the non-display region. In the display substrate
obtained by the above manufacturing method, a crack may be
generated in the inorganic layer between the barrier and the base
substrate, if the crack extends to a region where the
convex-concave structure is located, an extension direction of the
crack may change, thus, the crack will not extend further or an
extension speed of the crack may be slow down; in addition, in the
region where the convex-concave structure is located, the
convex-concave structure increases a surface area of the inorganic
layer, which is equivalent to increase the extension path of the
crack. Therefore, the convex-concave structure can block the crack
from extending from the non-display region to the display region,
thereby preventing damage to the structures in the display region
and improving the yield of the display substrate.
[0075] For example, in the manufacturing method provided by at
least one embodiment of the present disclosure, an orthographic
projection of the at least one convex-concave structure on the base
substrate is within an orthographic projection of the barrier on
the base substrate. As such, in a case where the convex-concave
structure is a protrusion, a height of the barrier can be increased
or the usage amount of the material forming the barrier can be
decreased; in addition, a bonding force between the inorganic layer
and the barrier can block an extension of the crack in the
inorganic layer. And in a case where the barrier and the
convex-concave structure (for example, the protrusion) are
materials having a certain elasticity, the stress in the inorganic
layer can be uniformly and advantageously released, thereby further
blocking an extension of the crack in the inorganic layer;
furthermore, a contact area between the inorganic layer and the
barrier is increased such that the bonding force between the
barrier and the inorganic layer is increased.
[0076] For example, in the manufacturing method of a display
substrate provided by at least one embodiment of the present
disclosure, the forming the at least one convex-concave structure
comprises: patterning a surface of the base substrate such that a
portion of the surface of the base substrate facing the inorganic
layer is formed to be the at least one convex-concave structure. As
such, in a case where the convex-concave structure is a protrusion,
separation between the protrusion and the base substrate can be
avoided, and the yield of the display substrate can be
improved.
[0077] It should be noted that the specific structure of the
display substrate obtained by the above manufacturing method can
refer to the related description in the embodiments
above-mentioned, which is not described in the embodiments of the
present disclosure herein.
[0078] Hereinafter, in at least one embodiment of the present
disclosure, a manufacturing method of a display substrate will be
described. FIG. 6A to FIG. 6D are process diagrams of a
manufacturing method of a display substrate according to an
embodiment of the present disclosure. For example, by taking
manufacturing the display substrate shown in FIG. 4 as an example,
as shown in FIG. 6A to FIG. 6D, the method manufacturing of the
display substrate provided by at least one embodiment of the
present disclosure may comprise the following process.
[0079] As shown in FIG. 6A, a material layer is provided, and a
surface of the material layer is imprinted by an imprint template
to form a protrusion 400, then the material layer is cured. As
such, an integrated structure of a base substrate 100 and a
protrusion 400 is obtained. In addition, the surface portion of the
material layer may be patterned, so that a portion of a surface of
may be formed to be the protrusion 400, and the other portion of
the material layer is used as the base substrate 100. The specific
structure and distribution of the protrusion 400 may be referred to
the relevant content in the embodiments above-mentioned, which is
not described in the embodiments of the present disclosure
herein.
[0080] For example, in at least one embodiment of the present
disclosure, the patterning process may be a photolithographic
patterning process, for example, comprise: coating a photoresist
layer on a structure layer to be patterned, exposing the
photoresist layer using a mask, developing the exposed photoresist
layer to obtain a photoresist pattern, etching the structural layer
by using the photoresist pattern, and optionally removing the
photoresist pattern. It should be noted that, if the structural
layer to be patterned comprises a photoresist material, the process
of coating the photoresist layer may not be required.
[0081] For example, in at least one embodiment of the present
disclosure, the material layer may be formed to be the base
substrate 100 shown in FIG. 3 by an imprint template or a
patterning process, and a recess 400 is formed on a upper surface
of the base substrate 100. The specific method of forming the
recess may refer to the specific process of forming the protrusion
in the embodiments above-mentioned, which will not be described
herein.
[0082] As shown in FIG. 6B, a material layer comprising an
inorganic material is deposited on the base substrate 100 on which
the protrusion 400 is formed, to form the transition layer 600. A
material for manufacturing the transition layer may also comprise
an organic material or the like. The material composition and
distribution of the transition layer 600 may be referred to the
relevant content in the embodiments above-mentioned, which is not
described in the embodiments of the present disclosure herein.
[0083] As shown in FIG. 6C, an inorganic layer 200 is formed on the
base substrate 100. The inorganic layer 200 may be a composite
layer. For example, the inorganic layer 200 comprises a buffer
layer, a gate insulating layer, an interlayer dielectric layer, a
passivation layer and the like, and a manufacturing method of the
inorganic layer 200 may be designed according to the manufacturing
process of the thin film transistor, which is not described in the
embodiments of the present disclosure herein.
[0084] As shown in FIG. 6D, an insulating material film is
deposited on the base substrate 100 on which the inorganic layer
200 is formed, then the insulating material film is patterned to
form a barrier 300. The barrier 300 is formed in a non-display
region of the display substrate. For example, the barrier 300 and
the pixel defining layer are formed in a same layer and by a same
material, after the insulating material film is deposited on the
base substrate 100, a patterning process is performed on the
insulating material film. A portion of the insulating material film
located in the display region is formed to be a pixel defining
layer, and a portion of the insulating material film located in the
non-display region is formed to be the barrier 300.
[0085] As shown in FIG. 4, an inorganic material film is deposited
on the base substrate 100 by chemical vapor deposition, to form an
inorganic encapsulation layer 500. For example, the inorganic
encapsulation layer 500 may cover a surface of the display
substrate. The specific structure and distribution of the inorganic
encapsulation layer 500 may be referred to the relevant content in
the embodiments above-mentioned, which is not described in the
embodiments of the present disclosure herein.
[0086] The embodiments of the present disclosure provide a display
substrate and manufacturing method thereof, and a display device,
and may have at least one of the following advantageous
effects:
[0087] (1) In the display substrate provided by at least one
embodiment of the present disclosure, the convex-concave structure
increases a surface area of the inorganic layer, which is
equivalent to increase the extension path of the crack, and in a
region where the convex-concave structure is located, an extension
direction of the crack may be changed, thus, the crack will not
extend further or an extension speed of the crack may be slow
down.
[0088] (2) In the display substrate provided by at least one
embodiment of the present disclosure, an orthographic projection of
the at least one convex-concave structure on the base substrate is
within an orthographic projection of the barrier on the base
substrate, such that in a case where the convex-concave structure
is a protrusion, the height of the barrier can be increased or the
usage amount of the material forming the barrier can be decreased;
in addition, a bonding force between the inorganic layer and the
barrier can block an extension of the crack in the inorganic layer.
And in a case where the barrier and the convex-concave structure
(for example, the protrusion) are materials having a certain
elasticity, the stress in the inorganic layer can be uniformly and
advantageously released, thereby further blocking an extension of
the crack in the inorganic layer; furthermore, a contact area
between the inorganic layer and the barrier is increased such that
the bonding force between the barrier and the inorganic layer is
increased.
[0089] For the present disclosure, the following points should be
noted:
[0090] (1) The accompanying drawings in the embodiments of the
present disclosure only involve structures relevant to the
embodiments of the present disclosure, and other structures may
refer to the conventional design.
[0091] (2) For clarity, in the accompanying drawings of the
embodiments of the present disclosure, the thickness of layers or
regions is enlarged or reduced. That is, the accompanying drawings
are not drawn according to actual scales.
[0092] (3) The embodiments of the present disclosure and the
characteristics in the embodiments may be mutually combined without
conflict.
[0093] The described above are only specific embodiments of the
present disclosure, and the present disclosure is not limited
thereto. The scope of the present disclosure is defined by the
accompanying claims.
* * * * *