U.S. patent application number 15/936544 was filed with the patent office on 2019-08-29 for heat dissipation device.
The applicant listed for this patent is AURAS Technology Co., Ltd.. Invention is credited to CHIEN-AN CHEN, CHIEN-YU CHEN, MU-SHU FAN.
Application Number | 20190264986 15/936544 |
Document ID | / |
Family ID | 65431737 |
Filed Date | 2019-08-29 |
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United States Patent
Application |
20190264986 |
Kind Code |
A1 |
CHEN; CHIEN-AN ; et
al. |
August 29, 2019 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device includes a storage structure, plural
pipes, plural heat sink fin groups and a vaporization-enhancing
structure. The heat sink fin groups are disposed on outer surfaces
of the pipes. The storage structure includes a chamber. The storage
structure is in thermal contact with a heat source. Each pipe has a
channel. A first end of the channel is in fluid communication with
the chamber. A working medium is filled in the chamber and the
channels of the pipes. The vaporization-enhancing structure is
disposed within the chamber and in thermal contact with at least a
portion of the working medium. After the vaporization-enhancing
structure receives heat energy from the heat source, the heat
energy is transferred to the working medium. The
vaporization-enhancing structure facilitates liquid-gas
transformation of the working medium. Consequently, the working
medium moves toward a second end of the first channel.
Inventors: |
CHEN; CHIEN-AN; (New Taipei
City, TW) ; FAN; MU-SHU; (New Taipei City, TW)
; CHEN; CHIEN-YU; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
AURAS Technology Co., Ltd. |
New Taipei City |
|
TW |
|
|
Family ID: |
65431737 |
Appl. No.: |
15/936544 |
Filed: |
March 27, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 1/24 20130101; F28D
1/0476 20130101; H05K 7/20309 20130101; F28D 1/0233 20130101; F28F
1/04 20130101; F28F 2009/0292 20130101; F28F 1/40 20130101; F28F
2215/02 20130101; F28D 1/05366 20130101; H01L 23/427 20130101; F28D
1/0226 20130101; F28D 15/0266 20130101; H05K 7/2029 20130101; H05K
7/20318 20130101; F28D 2021/0028 20130101; H01L 23/3672 20130101;
F28D 15/0275 20130101; F28D 2021/0064 20130101 |
International
Class: |
F28D 15/02 20060101
F28D015/02; F28D 1/02 20060101 F28D001/02; F28F 1/04 20060101
F28F001/04; F28F 1/40 20060101 F28F001/40 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 27, 2018 |
TW |
107106603 |
Claims
1. A heat dissipation device, comprising: a first storage structure
comprising a first chamber, wherein the first storage structure is
in thermal contact with a heat source; at least one first pipe,
wherein an inner portion of each first pipe has a first channel, a
first end of the first channel is in fluid communication with the
first chamber, and a working medium is filled in the first chamber
and the first channel; at least one heat sink fin group disposed on
an outer surface of the at least one first pipe; and a
vaporization-enhancing structure disposed within the first chamber
and in thermal contact with the first storage structure and at
least a portion of the working medium, wherein after the
vaporization-enhancing structure receives heat energy from the heat
source, the heat energy is transferred to the working medium,
wherein the vaporization-enhancing structure facilitates liquid-gas
transformation of the working medium, so that the working medium
moves in a direction toward a second end of the first channel.
2. The heat dissipation device according to claim 1, wherein the at
least one first pipe comprises plural first pipes, and the at least
one heat sink fin group comprises plural heat sink fin groups,
wherein each of the plural first pipes is arranged between two
adjacent ones of the plural heat sink fin groups.
3. The heat dissipation device according to claim 1, wherein the
vaporization-enhancing structure comprises plural skived fins.
4. The heat dissipation device according to claim 1, wherein the
first storage structure further comprises a first plate, a second
plate and plural lateral plates, wherein the plural lateral plates
are connected between the first plate and the second plate, and the
first chamber is defined by the first plate, the second plate and
the plural lateral plates collaboratively.
5. The heat dissipation device according to claim 4, wherein the
second plate comprises at least one opening, and the opening is in
communication with the first end of the first channel.
6. The heat dissipation device according to claim 1, wherein the
heat dissipation device further comprises a second storage
structure, and the second storage structure comprises a second
chamber, wherein the second chamber is in fluid communication with
the second end of the first channel, and a sealed space is defined
by the first chamber, the second chamber and the at least one first
channel.
7. The heat dissipation device according to claim 6, wherein the
heat dissipation device further comprises a heat dissipation
element, wherein the heat dissipation element is disposed on an
outer surface of the second storage structure.
8. The heat dissipation device according to claim 6, wherein the
heat dissipation device further comprises a liquefaction-enhancing
structure, wherein the liquefaction-enhancing structure is disposed
within the second chamber and in thermal contact with the second
storage structure and at least a portion of the working medium,
wherein the liquefaction-enhancing structure facilitates gas-liquid
transformation of the working medium, so that the working medium
moves in a direction toward the first end of the first channel.
9. The heat dissipation device according to claim 8, wherein the
liquefaction-enhancing structure comprises plural skived fins.
10. The heat dissipation device according to claim 1, wherein the
second end of the first channel is closed.
11. The heat dissipation device according to claim 1, wherein the
first end and the second end of the at least one first pipe are
connected with the first storage structure.
12. The heat dissipation device according to claim 1, wherein an
inner portion of the at least one first pipe is equipped with a
liquefaction-enhancing structure, wherein the
liquefaction-enhancing structure facilitates gas-liquid
transformation of the working medium, so that the working medium
moves in a direction toward the first end of the first channel.
13. The heat dissipation device according to claim 12, wherein the
liquefaction-enhancing structure comprises plural capillary
structures or recesses, which are formed on an inner surface of the
at least one first pipe and disposed within the first channel.
14. The heat dissipation device according to claim 1, wherein the
heat dissipation device further comprises: a third storage
structure comprising a third chamber, wherein the third storage
structure is in thermal contact with the heat source or an
additional heat source; at least one second pipe, wherein an inner
portion of each second pipe has a second channel, a first end of
the second channel is in fluid communication with the third
chamber, and an additional working medium is filled in the third
chamber and the second channel; at least one additional heat sink
fin group disposed on an outer surface of the at least one second
pipe; and an additional vaporization-enhancing structure disposed
within the third chamber and in thermal contact with the third
storage structure and at least a portion of the additional working
medium, wherein after the vaporization-enhancing structure receives
heat energy from the heat source or the additional heat source, the
heat energy is transferred to the additional working medium,
wherein the additional vaporization-enhancing structure facilitates
liquid-gas transformation of the additional working medium, so that
the additional working medium moves in a direction toward a second
end of the second channel.
15. The heat dissipation device according to claim 14, wherein at
least one of the first storage structure and the at least one first
pipe and at least one of the third storage structure and the at
least one second pipe are directly connected with each other and
linked with each other, or at least one of the first storage
structure and the at least one first pipe and at least one of the
third storage structure and the at least one second pipe are linked
with each other through an intermediate coupling mechanism.
16. The heat dissipation device according to claim 14, wherein the
first pipe is a vertical pipe, and the second pipe is a horizontal
pipe.
17. The heat dissipation device according to claim 14, wherein the
additional vaporization-enhancing structure comprises plural skived
fins.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a heat dissipation device,
and more particularly to a heat dissipation device for dissipating
heat through two phase changes.
BACKGROUND OF THE INVENTION
[0002] With increasing development of computers and various
electronic devices, people in the modern societies are used to
using the computers and the electronic devices for a long time.
During operations of the computers and the electronic devices, a
great deal of heat is generated. If the heat cannot be effectively
dissipated away, some drawbacks occur.
[0003] For solving the above drawbacks, various heat dissipation
mechanisms such as airflow convection mechanisms (e.g., through
fans), water cooling mechanisms or thermosyphon mechanisms are
widely used. For example, thermosiphon is heat dissipation method
for allowing a working medium (e.g., water) to flow along a
circular loop without the need of using a pump to push the working
medium. Nowadays, many literatures about the researches and
technologies of the thermosiphon mechanisms have been disclosed.
For example, US Patent Publication No. 20100315781 discloses a
thermosyphon heat exchanger. Moreover, a water cooling radiator is
one of the widely-used heat exchanger in the associated application
fields. The water cooling radiator cooperates with a fan to cool
down the high temperature liquid or condense the vaporized stem
into liquid. Consequently, the liquid flows along a circular loop
without any pump. In other words, the processes of vaporizing and
condensing the liquid are sufficient for circulating the liquid.
The principles of the thermosiphon and the operations of the water
cooling radiator are well known to those skilled in the art, and
are not redundantly described herein.
[0004] However, in some usage situations, the thermosyphon heat
exchanger is unable to effectively remove the heat from the
computer or the electronic device because the circulating efficacy
of the working liquid within the thermosyphon heat exchanger is
unsatisfied. The applicant found that the vaporizing efficiency and
the liquefying efficiency of the working liquid in the heat
dissipation device are important factors influencing the
circulation of the working medium. Therefore, it is important to
enhance the circulation of the working medium in the heat
dissipation device.
SUMMARY OF THE INVENTION
[0005] For solving the drawbacks of the conventional technologies,
the present invention provides a heat dissipation device with a
vaporization-enhancing structure for increasing the thermal contact
area and enhancing the efficiency of vaporizing the working medium.
Consequently, the circulation of the working medium in the heat
dissipation device is enhanced, and the overall heat dissipation
performance is effectively enhanced.
[0006] In accordance with an aspect of the present invention, there
is provided a heat dissipation device. The heat dissipation device
includes a first storage structure, at least one first pipe, at
least one heat sink fin group and a vaporization-enhancing
structure. The first storage structure includes a first chamber.
The first storage structure is in thermal contact with a heat
source. An inner portion of each first pipe has a first channel. A
first end of the first channel is in fluid communication with the
first chamber. A working medium is filled in the first chamber and
the first channel. The at least one heat sink fin group is disposed
on an outer surface of the at least one first pipe. The
vaporization-enhancing structure is disposed within the first
chamber and in thermal contact with the first storage structure and
at least a portion of the working medium. After the
vaporization-enhancing structure receives heat energy from the heat
source, the heat energy is transferred to the working medium. The
vaporization-enhancing structure facilitates liquid-gas
transformation of the working medium, so that the working medium
moves in a direction toward a second end of the first channel.
[0007] In an embodiment, the at least one first pipe includes
plural first pipes, and the at least one heat sink fin group
includes plural heat sink fin groups. Each of the plural first
pipes is arranged between two adjacent ones of the plural heat sink
fin groups.
[0008] In an embodiment, the vaporization-enhancing structure
includes plural skived fins.
[0009] In an embodiment, the first storage structure further
includes a first plate, a second plate and plural lateral plates.
The plural lateral plates are connected between the first plate and
the second plate. The first chamber is defined by the first plate,
the second plate and the plural lateral plates collaboratively.
[0010] In an embodiment, the second plate includes at least one
opening, and the opening is in communication with the first end of
the first channel.
[0011] In an embodiment, the heat dissipation device further
includes a second storage structure, and the second storage
structure includes a second chamber. The second chamber is in fluid
communication with the second end of the first channel. Moreover, a
sealed space is defined by the first chamber, the second chamber
and the at least one first channel.
[0012] In an embodiment, the heat dissipation device further
includes a heat dissipation element. The heat dissipation element
is disposed on an outer surface of the second storage
structure.
[0013] In an embodiment, the heat dissipation device further
includes a liquefaction-enhancing structure. The
liquefaction-enhancing structure is disposed within the second
chamber and in thermal contact with the second storage structure
and at least a portion of the working medium. The
liquefaction-enhancing structure facilitates gas-liquid
transformation of the working medium, so that the working medium
moves in a direction toward the first end of the first channel.
[0014] In an embodiment, the liquefaction-enhancing structure
includes plural skived fins.
[0015] In an embodiment, the second end of the first channel is
closed.
[0016] In an embodiment, the first end and the second end of the at
least one first pipe are connected with the first storage
structure.
[0017] In an embodiment, an inner portion of the at least one first
pipe is equipped with a liquefaction-enhancing structure. The
liquefaction-enhancing structure facilitates gas-liquid
transformation of the working medium, so that the working medium
moves in a direction toward the first end of the first channel.
[0018] In an embodiment, the liquefaction-enhancing structure
includes plural capillary structures or recesses, which are formed
on an inner surface of the at least one first pipe and disposed
within the first channel.
[0019] In an embodiment, the heat dissipation device further
includes a third storage structure, at least one second pipe, at
least one additional heat sink fin group and an additional
vaporization-enhancing structure. The third storage structure
includes a third chamber. The third storage structure is in thermal
contact with the heat source or an additional heat source. An inner
portion of each second pipe has a second channel. A first end of
the second channel is in fluid communication with the third
chamber. An additional working medium is filled in the third
chamber and the second channel. The at least one additional heat
sink fin group is disposed on an outer surface of the at least one
second pipe. The additional vaporization-enhancing structure is
disposed within the third chamber and in thermal contact with the
third storage structure and at least a portion of the additional
working medium. After the vaporization-enhancing structure receives
heat energy from the heat source or the additional heat source, the
heat energy is transferred to the additional working medium. The
additional vaporization-enhancing structure facilitates liquid-gas
transformation of the additional working medium, so that the
additional working medium moves in a direction toward a second end
of the second channel.
[0020] In an embodiment, at least one of the first storage
structure and the at least one first pipe and at least one of the
third storage structure and the at least one second pipe are
directly connected with each other and linked with each other, or
at least one of the first storage structure and the at least one
first pipe and at least one of the third storage structure and the
at least one second pipe are linked with each other through an
intermediate coupling mechanism.
[0021] In an embodiment, the first pipe is a vertical pipe, and the
second pipe is a horizontal pipe.
[0022] In an embodiment, the additional vaporization-enhancing
structure includes plural skived fins.
[0023] From the above descriptions, the heat dissipation device of
the present invention is equipped with the vaporization-enhancing
structure to increase the thermal contact area and enhance the
vaporizing efficiency of the working medium. Consequently, the
circulating efficacy of the working medium within the heat
dissipation device is enhanced, and the overall heat dissipation
performance of the heat dissipation device is increased. In an
embodiment, the vaporization-enhancing structure comprises plural
skived fins. Since the skived fins have the advantages of high
density fins, the thermal contact area between the
vaporization-enhancing structure and the liquid working medium is
increased. Since the vaporizing speed of the liquid working medium
is increased, the circulating efficacy of the liquid working medium
within the heat dissipation device is further enhanced and the
overall heat dissipation performance of the heat dissipation device
is increased. Moreover, since the vaporization-enhancing structure
is composed of the plural skived fins, the fabricating cost is
reduced.
[0024] The above objects and advantages of the present invention
will become more readily apparent to those ordinarily skilled in
the art after reviewing the following detailed description and
accompanying drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] FIG. 1 is a schematic perspective view illustrating the
outer appearance of a heat dissipation device according to a first
embodiment of the present invention;
[0026] FIG. 2 is a schematic exploded view illustrating a portion
of the heat dissipation device as shown in FIG. 1;
[0027] FIG. 3 is a schematic cross-sectional view illustrating a
portion of the heat dissipation device as shown in FIG. 1;
[0028] FIG. 4 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a second
embodiment of the present invention;
[0029] FIG. 5 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a third
embodiment of the present invention;
[0030] FIG. 6 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a fourth
embodiment of the present invention;
[0031] FIG. 7 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a fifth
embodiment of the present invention;
[0032] FIG. 8 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a sixth
embodiment of the present invention; and
[0033] FIG. 9 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a seventh
embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0034] In this context, the term "thermal contact" is the contact
via thermal conduction. In accordance with the present invention,
the thermal contact has two types, including a direct contact
mechanism and an indirect contact mechanism. In some embodiments,
the thermal contact also includes the contact between two
components that are close to each other but not contacted with each
other. If two components are directly attached on each other, these
two components are in direct contact. If a thermally conductive
medium (e.g., thermal paste) is arranged between two components,
these two components are in indirect contact. The examples are
presented herein for purpose of illustration and description
only.
[0035] Please refer to FIGS. 1, 2 and 3. FIG. 1 is a schematic
perspective view illustrating the outer appearance of a heat
dissipation device according to a first embodiment of the present
invention. FIG. 2 is a schematic exploded view illustrating a
portion of the heat dissipation device as shown in FIG. 1. FIG. 3
is a schematic cross-sectional view illustrating a portion of the
heat dissipation device as shown in FIG. 1. The heat dissipation
device 1A comprises a first storage structure 11, a second storage
structure 12, plural first pipes 13, plural heat sink fin groups 14
and a vaporization-enhancing structure 15. The second storage
structure 12 is located over the first storage structure 11. The
first storage structure 11 comprises a first chamber 111. The
second storage structure 12 comprises a second chamber 121. An
inner portion of each first pipe 13 has a first channel 131. A
first end 1311 of the first channel 131 is in fluid communication
with the first chamber 111. A second end 1312 of the first channel
131 is in fluid communication with the second chamber 121.
Moreover, a sealed space is defined by the first chamber 111 of the
first storage structure 11, the second chamber 121 of the second
storage structure 12 and the first channels 131 of the plural first
pipes 13. A working medium 2 is filled in the sealed space. The
heat sink fin groups 14 are disposed on outer surfaces of the first
pipes 13. After the heat sink fin groups 14 receive heat energy
from the first pipes 13, the heat energy is removed by the ambient
airflow. The vaporization-enhancing structure 15 is disposed within
the first chamber 111. Moreover, the vaporization-enhancing
structure 15 is in thermal contact with the first storage structure
11 and at least a portion of the working medium 2. For example, the
vaporization-enhancing structure 15 is immersed in at least a
portion of the working medium 2. The vaporization-enhancing
structure 15 is used for increasing the efficiency of vaporizing
the working medium 2. The operations of the vaporization-enhancing
structure 15 will be described herein.
[0036] In an embodiment, each first pipe 13 is arranged between two
adjacent heat sink fin groups 14. Each heat sink fin group 14
comprises heat sink fins 141. These heat sink fins 141 are
substantially parallel with each other and spaced apart from each
other in the vertical direction, and arranged on the outer surfaces
of the first pipes 13. In an embodiment, the first storage
structure 11 further comprises a first plate 112, a second plate
113 and plural lateral plates 114. The plural lateral plates 114
are connected between the first plate 112 and the second plate 113.
The first chamber 111 is defined by the first plate 112, the second
plate 113 and the plural lateral plates 114 collaboratively. The
vaporization-enhancing structure 15 comprises plural skived fins.
The vaporization-enhancing structure 15 is disposed on the first
plate 112. The second plate 113 comprises plural openings 1131. The
plural openings 1131 are in communication with the first ends 1311
of the first channels 131 of the first pipes 13. The structure of
the second storage structure 12 is similar to that of the first
storage structure 11, and is not redundantly described herein.
[0037] The above examples are presented herein for purpose of
illustration and description only. The constituents of the heat
sink fin groups 14, the arrangements of the heat sink fins 141, the
constituents of the first storage structure 11, the constituents of
the second storage structure 12 and the relationships between the
first storage structure 11, the second storage structure 12 and the
first pipes 13, the example of the vaporization-enhancing structure
15 and the relative positions between the vaporization-enhancing
structure 15 and the first chamber 111 of the first storage
structure 11 are not restricted. That is, numerous modifications
and alterations may be made according to the practical
requirements.
[0038] The principles of removing heat energy by the heat
dissipation device 1A will be described as follows. When the first
plate 112 of the first storage structure 11 is in thermal contact
with an underlying heat source 31, the heat energy of the heat
source 31 is transferred to the liquid working medium 2a through
the first plate 112 and the overlying vaporization-enhancing
structure 15. The liquid working medium 2a is disposed within the
first chamber 111 and in thermal contact with the first plate 112
and the vaporization-enhancing structure 15. After the liquid
working medium 2a absorbs sufficient heat energy, the liquid
working medium 2a is vaporized. Consequently, the liquid working
medium 2a is transformed into the gaseous working medium 2b. That
is, the liquid-gas transformation occurs. Then, the gaseous working
medium 2b enters the first channels 131 through the first ends 1311
of the first channels 131 of the first pipes 13 and moves in the
direction toward the second ends 1312 of the first channels 131.
The heat energy of the gaseous working medium 2b in the first
channels 131 is externally transferred to the heat sink fin groups
14, which are disposed on the outer surfaces of the first pipes 13.
Since the gaseous working medium 2b releases heat energy, the
gaseous working medium 2b is condensed and liquefied. The gaseous
working medium 2b is transformed into the liquid working medium 2a
again. The liquid working medium 2a flows back into the first
chamber 111 of the first storage structure 11 through the first
ends 1311 of the first channels 131 of the first pipes 13 and
accumulates in the first chamber 111.
[0039] Through the working loop of the two phase changes, the heat
energy generated by the heat source 31 can be quickly dissipated
away by the heat dissipation device 1A. As mentioned above, the
vaporization-enhancing structure 15 comprises the plural skived
fins. Since the skived fins have the advantages of high density
fins, the thermal contact area between the vaporization-enhancing
structure 15 and the liquid working medium 2a is increased. That
is, the heat transfer area is increased. Moreover, since the
vaporizing speed of the liquid working medium 2a is increased, the
circulating efficacy of the working medium 2 within the heat
dissipation device 1A is enhanced and the overall heat dissipation
performance of the heat dissipation device 1A is increased.
Moreover, since the vaporization-enhancing structure 15 is composed
of the plural skived fins, the fabricating cost is reduced.
[0040] FIG. 4 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a second
embodiment of the present invention. The structures of the
components of the heat dissipation device 1B which are similar to
those of the heat dissipation device of the first embodiment are
not redundantly described herein. In comparison with the first
embodiment, the heat dissipation device 1B of this embodiment
further comprises a liquefaction-enhancing structure 16. The
liquefaction-enhancing structure 16 is disposed within the second
chamber 121 and in thermal contact with the second storage
structure 12 and at least a portion of the gaseous working medium
2b. The liquefaction-enhancing structure 16 is used for enhancing
the efficiency of liquefying the gaseous working medium 2b during
the gas-liquid transformation process. In an embodiment, the
liquefaction-enhancing structure 16 comprises plural skived
fins.
[0041] Similarly, after the gaseous working medium 2b in the first
channels 131 of the first pipes 13 releases heat energy, the
gaseous working medium 2b is liquefied into the liquid working
medium 2a. The liquid working medium 2a flows back into the first
chamber 111. However, a portion of the gaseous working medium 2b in
the first channels 131 of the first pipes 13 is possibly not
liquefied and enters the second chamber 121 through the second ends
1312 of the first channels 131.
[0042] In this embodiment, the liquefaction-enhancing structure 16
is disposed within the second chamber 121, and the
liquefaction-enhancing structure 16 is composed of plural skived
fins. As mentioned above, the skived fins have the advantages of
high density fins, and thus the thermal contact area between the
liquefaction-enhancing structure 16 and the gaseous working medium
2b is increased. Since the heat transfer area is increased, the
speed of liquefying the gaseous working medium 2b is increased. The
liquid working medium 2a flows back into the first chamber 111 of
the first storage structure 11 through the first ends 1311 of the
first channels 131 of the first pipes 13 and accumulates in the
first chamber 111. In other words, the use of the
liquefaction-enhancing structure 16 also enhances the circulating
efficacy of the working medium 2 within the heat dissipation device
1B and increases the overall heat dissipation performance of the
heat dissipation device 1B. It is noted that the example of the
liquefaction-enhancing structure 16 is not restricted. That is, any
other structure capable of increasing the thermal contact area to
increase the speed of liquefying the gaseous working medium 2b can
be used as the liquefaction-enhancing structure 16.
[0043] FIG. 5 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a third
embodiment of the present invention. The structures of the
components of the heat dissipation device 1C which are similar to
those of the first embodiment and the second embodiment are not
redundantly described herein. In comparison with the first
embodiment and the second embodiment, the heat dissipation device
1C of this embodiment further comprises a heat dissipation element
17. The heat dissipation element 17 is disposed on the outer
surface of the second storage structure 12. The heat dissipation
element 17 can facilitate removing the heat energy from the second
storage structure 12 to the surroundings. Consequently, the gaseous
working medium 2b in the second storage structure 12 can be
liquefied into the liquid working medium 2a more quickly. The
liquid working medium 2a flows back into the first chamber 111 of
the first storage structure 11 through the first ends 1311 of the
first channels 131 of the first pipes 13 and accumulates in the
first chamber 111. In an embodiment, the heat dissipation element
17 comprises plural fins for receiving the heat energy from the
second storage structure 12. It is noted that the example of the
heat dissipation element 17 is not restricted.
[0044] FIG. 6 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a fourth
embodiment of the present invention. The structures of the
components of the heat dissipation device 1D which are similar to
those of the first embodiment, the second embodiment and the third
embodiment are not redundantly described herein. In comparison with
the first embodiment, the second embodiment and the third
embodiment, each first pipe 13 of the heat dissipation device 1D of
this embodiment further comprises a liquefaction-enhancing
structure 18. The liquefaction-enhancing structure 18 is formed on
an inner surface of the first pipe 13 and disposed within the first
channel 131. The liquefaction-enhancing structure 18 is used for
increasing the thermal contact area between the first channel 131
and the gaseous working medium 2b. Consequently, the efficiency of
liquefying the gaseous working medium 2b in the first channel 131
is enhanced. Preferably but not exclusively, the
liquefaction-enhancing structure 18 comprises plural capillary
structures or recesses.
[0045] FIG. 7 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a fifth
embodiment of the present invention. The structures of the
components of the heat dissipation device lE which are similar to
those of the heat dissipation device of the first embodiment are
not redundantly described herein. In comparison with the first
embodiment, the heat dissipation device lE of this embodiment is
not equipped with the second storage structure 12 and the second
end 1312 of the first channel 131 of each first pipe 13 is closed.
The principles of using the heat dissipation device lE to remove
heat energy are similar to those of the first embodiment, and are
not redundantly described herein.
[0046] FIG. 8 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a sixth
embodiment of the present invention. The structures of the
components of the heat dissipation device 1F which are similar to
those of the heat dissipation device of the fifth embodiment are
not redundantly described herein. In comparison with the fifth
embodiment, the first pipes 13F are distinguished. In this
embodiment, two ends of each first pipe 13F are connected with the
first storage structure 11. In other words, the first end 1311 and
the second end 1312 of the first channel 131 of each first pipe 13F
are in communication with the first chamber 111 of the first
storage structure 11. The principles of using the heat dissipation
device 1F to remove heat energy are similar to those of the first
embodiment, and are not redundantly described herein.
[0047] FIG. 9 is a schematic cross-sectional view illustrating a
portion of a heat dissipation device according to a seventh
embodiment of the present invention. For succinctness, only some
components are shown in FIG. 9. That is, the first storage
structure 11, the second storage structure 12, the first pipes 13
and the heat sink fin groups 14 are not shown. The structures of
the components of the heat dissipation device 1G which are similar
to those of the heat dissipation device of the above embodiments
are not redundantly described herein. In comparison with the above
embodiments, the heat dissipation device 1G further comprises a
third storage structure 191, plural second pipes 192, plural heat
sink fin groups 193 and an additional vaporization-enhancing
structure 194. The third storage structure 191 is located beside a
lateral side (e.g., a left side) of the second storage structure
12. Alternatively, the third storage structure 191 is arranged
between the first storage structure 11 and the second storage
structure 12 and located near a lateral edge (e.g., located at the
lateral edge). The third storage structure 191 comprises a third
chamber 1911. An inner portion of each second pipe 192 has a second
channel 1921. A first end 1921 of the second channel 1921 is in
fluid communication with the third chamber 1911. A sealed space is
defined by the third chamber 1911 of the third storage structure
191 and the second channels 1921 of the second pipes 192
collaboratively. Another working medium 4 is filled in the sealed
space. The plural heat sink fin groups 193 are disposed on outer
surfaces of the second pipes 192. After the heat sink fin groups
193 receive heat from the second pipes 192, the heat energy is
removed by the ambient airflow. Preferably, the
vaporization-enhancing structure 194 comprises plural skived fins.
The vaporization-enhancing structure 194 is disposed within the
third chamber 1911. Moreover, the vaporization-enhancing structure
16 is in thermal contact with the third storage structure 191 and
at least a portion of the working medium 4. The
vaporization-enhancing structure 16 is used for increasing the
efficiency of vaporizing the working medium 4.
[0048] The constituents of the heat sink fin groups 193 and the
arrangements of their heat sink fins are similar to the
constituents of the heat sink fin groups 14 and the arrangements of
their heat sink fins 141. The constituents of the third storage
structure 191 and the relative positions between the third storage
structure 191 and the plural second pipes 192 are similar to the
constituents of the first storage structure 11 and the relative
positions between the first storage structure 11 and the plural
first pipes. The example of the vaporization-enhancing structure
194 and the relative positions between the vaporization-enhancing
structure 194 and the third chamber 1911 of the third storage
structure 191 are similar to the example of the
vaporization-enhancing structure 15 and the relative positions
between the vaporization-enhancing structure 15 and the first
chamber 111 of the first storage structure 11. The two phase
changes of the working loop of the working medium 4 in the third
chamber 1911 of the third storage structure 191 and the second
pipes 192 are similar to the two phase changes of the working loop
of the working medium 4 in the first chamber 111 of the first
storage structure 11, the first pipes 13 and the second chamber 121
of the second storage structure 12.
[0049] In an embodiment, at least one of the first storage
structure 11, the second storage structure 12, the first pipes 13
and the heat sink fin groups 14 and at least one of the third
storage structure 191, the second pipes 192 and the heat sink fin
groups 193 are directly connected with each other and thus linked
with each other. Alternatively, at least one of the first storage
structure 11, the second storage structure 12, the first pipes 13
and the heat sink fin groups 14 and at least one of the third
storage structure 191, the second pipes 192 and the heat sink fin
groups 193 are linked with each other through an intermediate
coupling mechanism (not shown). For example, the intermediate
coupling mechanism is an outer casing for fixing the first storage
structure 11, the second storage structure 12 and the third storage
structure 191. Preferably but not exclusively, the first pipes 13
are vertical pipes and the second pipes 192 are horizontal pipes.
In this embodiment, the heat dissipation device 1G comprises plural
storage structures (e.g., the first storage structure 11 and the
third storage structure 191) to be in thermal contact with plural
heat sources 31 and 32 in order to remove the heat energy.
Consequently, the heat dissipation device 1G can be flexibly placed
according to the application space. For example, according to the
application space, the heat dissipation device 1G is rotated 90
degrees. That is, the second pipes 192 are switched from the
horizontal pipes to the vertical pipes. Moreover, the third storage
structure 191 is located over the heat source 32 and in thermal
contact with the heat source 32. Consequently, the heat energy
generated by the heat source 32 can be quickly dissipated away by
the heat dissipation device 1G.
[0050] While the invention has been described in terms of what is
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention needs not be
limited to the disclosed embodiments. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all modifications and similar structures.
* * * * *