U.S. patent application number 15/880458 was filed with the patent office on 2019-07-25 for magnetic head for perpendicular magnetic recording including two side shields configured to enable a reduction in width of an en.
This patent application is currently assigned to HEADWAY TECHNOLOGIES, INC.. The applicant listed for this patent is Hironori ARAKI, Yukinori IKEGAWA, Hiroyuki ITO, Yoji NOMURA, Yoshitaka SASAKI, Kazuki SATO. Invention is credited to Hironori ARAKI, Yukinori IKEGAWA, Hiroyuki ITO, Yoji NOMURA, Yoshitaka SASAKI, Kazuki SATO.
Application Number | 20190228795 15/880458 |
Document ID | / |
Family ID | 67298206 |
Filed Date | 2019-07-25 |
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United States Patent
Application |
20190228795 |
Kind Code |
A1 |
SASAKI; Yoshitaka ; et
al. |
July 25, 2019 |
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING INCLUDING TWO
SIDE SHIELDS CONFIGURED TO ENABLE A REDUCTION IN WIDTH OF AN END
FACE OF THE MAIN POLE LOCATED IN A MEDIUM FACING SURFACE AND AN
INCREASE IN CROSS-SECTIONAL AREA OF THE MAIN POLE IN THE VICINITY
OF THE MEDIUM FACING SURFACE
Abstract
A first side shield has a first sidewall and a second sidewall,
and a second side shield has a third sidewall and a fourth
sidewall. The first to fourth sidewalls have first to fourth edges,
respectively, that are farthest from a top surface of a substrate.
The distance between a rear end of the first edge and a rear end of
the third edge in a track width direction is greater than the
distance between a front end of the first edge and a front end of
the third edge in the track width direction. The distance between
the second edge and the fourth edge in the track width direction
increases with increasing distance from the medium facing
surface.
Inventors: |
SASAKI; Yoshitaka; (Los
Gatos, CA) ; ITO; Hiroyuki; (Milpitas, CA) ;
SATO; Kazuki; (Milpitas, CA) ; ARAKI; Hironori;
(Milpitas, CA) ; IKEGAWA; Yukinori; (Milpitas,
CA) ; NOMURA; Yoji; (Milpitas, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SASAKI; Yoshitaka
ITO; Hiroyuki
SATO; Kazuki
ARAKI; Hironori
IKEGAWA; Yukinori
NOMURA; Yoji |
Los Gatos
Milpitas
Milpitas
Milpitas
Milpitas
Milpitas |
CA
CA
CA
CA
CA
CA |
US
US
US
US
US
US |
|
|
Assignee: |
HEADWAY TECHNOLOGIES, INC.
Milpitas
CA
|
Family ID: |
67298206 |
Appl. No.: |
15/880458 |
Filed: |
January 25, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11B 5/6082 20130101;
G11B 5/315 20130101; G11B 5/112 20130101; G11B 5/3116 20130101;
Y10T 29/49052 20150115; Y10T 29/49046 20150115; G11B 5/11 20130101;
G11B 5/3163 20130101; G11B 5/1278 20130101 |
International
Class: |
G11B 5/39 20060101
G11B005/39 |
Claims
1. A magnetic head for perpendicular magnetic recording,
comprising: a medium facing surface configured to face a recording
medium; a coil configured to produce a magnetic field corresponding
to data to be written on the recording medium; a main pole
configured to pass a magnetic flux corresponding to the magnetic
field produced by the coil, and to produce a write magnetic field
for writing the data on the recording medium by means of a
perpendicular magnetic recording system; a write shield formed of a
magnetic material; a gap section formed of a nonmagnetic material
and provided between the main pole and the write shield; and a
substrate having a top surface, wherein the coil, the main pole,
the write shield and the gap section are disposed above the top
surface of the substrate, the write shield includes a first side
shield and a second side shield located on opposite sides of the
main pole in a track width direction, the first side shield has a
first end face located in the medium facing surface, and has a
first sidewall and a second sidewall facing the main pole, the
second side shield has a second end face located in the medium
facing surface, and has a third sidewall and a fourth sidewall
facing the main pole, the first sidewall is connected to the first
end face, the second sidewall is located farther from the medium
facing surface than is the first sidewall, the third sidewall is
connected to the second end face, the fourth sidewall is located
farther from the medium facing surface than is the third sidewall,
the first sidewall has a first edge farthest from the top surface
of the substrate, the second sidewall has a second edge farthest
from the top surface of the substrate, the third sidewall has a
third edge farthest from the top surface of the substrate, the
fourth sidewall has a fourth edge farthest from the top surface of
the substrate, each of the first and third edges has a front end
located in the medium facing surface and a rear end opposite to the
front end, each of the second and fourth edges has a front end
closest to the medium facing surface, a distance between the rear
end of the first edge and the rear end of the third edge in the
track width direction is greater than a distance between the front
end of the first edge and the front end of the third edge in the
track width direction, a distance between the second edge and the
fourth edge in the track width direction increases with increasing
distance from the medium facing surface, the first edge and the
second edge are contiguous to each other to form a first contour
line, the rear end of the first edge and the front end of the
second edge coinciding with each other, the third edge and the
fourth edge are contiguous to each other to form a second contour
line, the rear end of the third edge and the front end of the
fourth edge coinciding with each other, the front end of the second
edge is an inflection point or a corner at which there occurs a
change in an angle of inclination of the first contour line
relative to a first direction at a first point on the first contour
line when the first point is shifted from the first edge to the
second edge, the first direction being perpendicular to the medium
facing surface, the change being a decrease, the front end of the
fourth edge is an inflection point or a corner at which there
occurs a change in an angle of inclination of the second contour
line relative to the first direction at a second point on the
second contour line when the second point is shifted from the third
edge to the fourth edge, the change being a decrease, the main pole
has an end face located in the medium facing surface, and has a
first side surface and a second side surface, part of the first
side surface is opposed to the first sidewall, part of the second
side surface is opposed to the third sidewall, the gap section
includes a first portion interposed between the first side surface
and the first and second sidewalls, and a second portion interposed
between the second side surface and the third and fourth sidewalls,
a distance from the medium facing surface to the front end of the
second edge, and a distance from the medium facing surface to the
front end of the fourth edge are each within a range of 20 to 90
nm, and a distance between the front end and the rear end of the
first edge in the track width direction, and a distance between the
front end and the rear end of the third edge in the track width
direction are each within a range of 40 to 290 nm.
2. The magnetic head for perpendicular magnetic recording according
to claim 1, wherein in the medium facing surface, a distance
between the first sidewall and the third sidewall in the track
width direction decreases toward the top surface of the substrate,
an angle that the second sidewall forms with a direction
perpendicular to the top surface of the substrate is smaller than
an angle that the first sidewall forms with the direction
perpendicular to the top surface of the substrate in the medium
facing surface, and an angle that the fourth sidewall forms with
the direction perpendicular to the top surface of the substrate is
smaller than an angle that the third sidewall forms with the
direction perpendicular to the top surface of the substrate in the
medium facing surface.
3. The magnetic head for perpendicular magnetic recording according
to claim 2, wherein the first sidewall includes a first front
portion connected to the first end face, and a first rear portion
connected to the second sidewall, the third sidewall includes a
second front portion connected to the second end face, and a second
rear portion connected to the fourth sidewall, an angle that the
first rear portion forms with the direction perpendicular to the
top surface of the substrate is smaller than an angle that the
first front portion forms with the direction perpendicular to the
top surface of the substrate, and an angle that the second rear
portion forms with the direction perpendicular to the top surface
of the substrate is smaller than an angle that the second front
portion forms with the direction perpendicular to the top surface
of the substrate.
4. The magnetic head for perpendicular magnetic recording according
to claim 1, wherein the first side shield includes a first magnetic
layer having the first sidewall, and a second magnetic layer having
the second sidewall, and the second side shield includes a third
magnetic layer having the third sidewall, and a fourth magnetic
layer having the fourth sidewall.
5. The magnetic head for perpendicular magnetic recording according
to claim 4, wherein the first magnetic layer and the second
magnetic layer have equal saturation flux densities, and the third
magnetic layer and the fourth magnetic layer have equal saturation
flux densities.
6. The magnetic head for perpendicular magnetic recording according
to claim 4, wherein the second magnetic layer is higher in
saturation flux density than the first magnetic layer, and the
fourth magnetic layer is higher in saturation flux density than the
third magnetic layer.
7. The magnetic head for perpendicular magnetic recording according
to claim 4, wherein the second magnetic layer is lower in
saturation flux density than the first magnetic layer, and the
fourth magnetic layer is lower in saturation flux density than the
third magnetic layer.
8. The magnetic head for perpendicular magnetic recording according
to claim 1, wherein a minimum distance between the second sidewall
and the first side surface is greater than a minimum distance
between the first sidewall and the first side surface, and a
minimum distance between the fourth sidewall and the second side
surface is greater than a minimum distance between the third
sidewall and the second side surface.
9. The magnetic head for perpendicular magnetic recording according
to claim 1, wherein each of the first and third edges includes a
portion projecting toward the main pole.
10. The magnetic head for perpendicular magnetic recording
according to claim 1, wherein each of the second and fourth edges
includes a portion projecting toward the main pole.
11. A manufacturing method for the magnetic head for perpendicular
magnetic recording of claim 1, comprising the steps of: forming a
first initial side shield and a second initial side shield, the
first initial side shield becoming the first side shield later, the
second initial side shield becoming the second side shield later;
forming the first and second portions of the gap section after the
first and second initial side shields are formed; forming an
initial main pole after the first and second portions of the gap
section are formed; forming the coil; and forming the medium facing
surface so that the first initial side shield becomes the first
side shield, the second initial side shield becomes the second side
shield, and the initial main pole becomes the main pole.
12. The manufacturing method according to claim 11, wherein the
step of forming the first initial side shield and the second
initial side shield includes the steps of: forming a magnetic layer
having at least part of the first sidewall and at least part of the
third sidewall; and partially etching the magnetic layer so as to
provide the magnetic layer with the second sidewall and the fourth
sidewall.
13. The manufacturing method according to claim 12, wherein the
step of forming the first initial side shield and the second
initial side shield further includes the steps of: forming a
planarization layer to cover the magnetic layer, which is performed
after the step of forming the magnetic layer and before the step of
partially etching the magnetic layer; and forming a mask on the
planarization layer, which is performed after the step of forming
the planarization layer and before the step of partially etching
the magnetic layer, wherein, in the step of partially etching the
magnetic layer, the mask is used to partially etch the magnetic
layer.
14. The manufacturing method according to claim 11, wherein the
first side shield includes a first magnetic layer having the first
sidewall, and a second magnetic layer having the second sidewall,
the second side shield includes a third magnetic layer having the
third sidewall, and a fourth magnetic layer having the fourth
sidewall, and the step of forming the first initial side shield and
the second initial side shield includes the steps of: forming the
first magnetic layer and the third magnetic layer; and forming the
second magnetic layer and the fourth magnetic layer after the first
magnetic layer and the third magnetic layer are formed.
15. The manufacturing method according to claim 14, wherein the
step of forming the first magnetic layer and the third magnetic
layer includes the steps of: forming a mask having two
accommodation sections in which the first magnetic layer and the
third magnetic layer are to be accommodated later; and forming the
first magnetic layer and the third magnetic layer in the two
accommodation sections.
16. The manufacturing method according to claim 15, wherein the
first magnetic layer and the third magnetic layer are formed by
plating.
17. The manufacturing method according to claim 15, wherein the
first magnetic layer and the third magnetic layer are formed by
sputtering.
18. The manufacturing method according to claim 14, wherein the
first sidewall includes a first front portion connected to the
first end face, and a first rear portion connected to the second
sidewall, the third sidewall includes a second front portion
connected to the second end face, and a second rear portion
connected to the fourth sidewall, and the step of forming the first
magnetic layer and the third magnetic layer includes the steps of:
forming an initial first magnetic layer including the first front
portion and an initial third magnetic layer including the second
front portion; and partially etching the initial first magnetic
layer to provide the initial first magnetic layer with the first
rear portion so as to make the initial first magnetic layer into
the first magnetic layer, and partially etching the initial third
magnetic layer to provide the initial third magnetic layer with the
second rear portion so as to make the initial third magnetic layer
into the third magnetic layer.
19. The manufacturing method according to claim 18, wherein an
angle that the first rear portion forms with a direction
perpendicular to the top surface of the substrate is smaller than
an angle that the first front portion forms with the direction
perpendicular to the top surface of the substrate, and an angle
that the second rear portion forms with the direction perpendicular
to the top surface of the substrate is smaller than an angle that
the second front portion forms with the direction perpendicular to
the top surface of the substrate.
20. The manufacturing method according to claim 14, wherein the
step of forming the second magnetic layer and the fourth magnetic
layer includes the steps of: forming a mask having two
accommodation sections in which the second magnetic layer and the
fourth magnetic layer are to be accommodated later; and forming the
second magnetic layer and the fourth magnetic layer in the two
accommodation sections.
21. The manufacturing method according to claim 20, wherein the
second magnetic layer and the fourth magnetic layer are formed by
plating.
22. The manufacturing method according to claim 20, wherein the
second magnetic layer and the fourth magnetic layer are formed by
sputtering.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] The present invention relates to a magnetic head for
perpendicular magnetic recording that is used for writing data on a
recording medium by means of a perpendicular magnetic recording
system, and more specifically, to a magnetic head for perpendicular
magnetic recording that has two side shields.
2. Description of the Related Art
[0002] The recording systems of magnetic read/write apparatuses
include a longitudinal magnetic recording system wherein signals
are magnetized in a direction along the plane of a recording medium
(the longitudinal direction) and a perpendicular magnetic recording
system wherein signals are magnetized in a direction perpendicular
to the plane of a recording medium. It is known that the
perpendicular magnetic recording system is harder to be affected by
thermal fluctuation of the recording medium and capable of
providing higher linear recording density when compared with the
longitudinal magnetic recording system.
[0003] Magnetic heads for perpendicular magnetic recording
typically have, like those for longitudinal magnetic recording, a
structure in which a read head unit having a magnetoresistive
element (hereinafter, also referred to as MR element) for reading
and a write head unit having an induction-type electromagnetic
transducer for writing are stacked on the top surface of a
substrate. The write head unit includes a main pole configured to
produce a write magnetic field in the direction perpendicular to
the plane of the recording medium. The main pole has an end face
that is located in a medium facing surface configured to face the
recording medium.
[0004] In a magnetic head for use in a magnetic disk drive of the
perpendicular magnetic recording system, from the viewpoint of
increasing the recording density, the end face of the main pole
located in the medium facing surface is preferably smaller in
width. On the other hand, from the viewpoint of improving the write
characteristics of the write head unit, e.g., overwrite property
which represents the overwriting capability, the main pole
preferably has a larger cross-sectional area in the vicinity of the
medium facing surface.
[0005] A magnetic disk drive of the perpendicular magnetic
recording system may sometimes exhibit a phenomenon in which
signals already written on one or more tracks in the neighborhood
of a track targeted for writing are erased or attenuated during
writing of a signal on the track targeted for writing. In the
present application, such a phenomenon will be referred to as
unwanted erasure. Unwanted erasure includes adjacent track erasure
(ATE) and wide-area track erasure (WATE). Achieving higher
recording densities requires minimizing the occurrence of unwanted
erasure.
[0006] Known techniques for minimizing the occurrence of unwanted
erasure include the technique of providing two side shields on
opposite sides of the main pole in the track width direction, as
disclosed in, for example, U.S. Pat. No. 9,251,812 B2 and U.S. Pat.
No. 9,406,318 B2.
[0007] Each of U.S. Pat. Nos. 9,251,812 B2 and 9,406,318 B2
discloses a magnetic head including a first side shield and a
second side shield. The first side shield has a first sidewall and
a second sidewall, the first sidewall being closer to the medium
facing surface than the second sidewall. The second side shield has
a third sidewall and a fourth sidewall, the third sidewall being
closer to the medium facing surface than the fourth sidewall. Each
of the second and fourth sidewalls has an edge that is farthest
from the top surface of the substrate and parallel to the medium
facing surface. The main pole has a first to a fourth side surface.
The first side surface is opposed to the first sidewall. Part of
the second side surface is opposed to the second sidewall. The
third side surface is opposed to the third sidewall. Part of the
fourth side surface is opposed to the fourth sidewall.
[0008] The magnetic head disclosed in each of U.S. Pat. Nos.
9,251,812 B2 and 9,406,318 B2 achieves a large cross-sectional area
of the main pole in the vicinity of the medium facing surface by
reducing the distance between the medium facing surface and the
edge of each of the second to fourth sidewalls. This results in
improved write characteristics. On the other hand, the reduced
distance between the medium facing surface and the edge of each of
the second to fourth sidewalls in this magnetic head
disadvantageously renders the first and second side shields more
susceptible to saturation of magnetic flux, thus causing the first
and second side shields to become unable to function
satisfactorily, resulting in insufficient increase in recording
density.
SUMMARY OF THE INVENTION
[0009] It is an object of the present invention to provide a
magnetic head for perpendicular magnetic recording including a main
pole and two side shields, the magnetic head being capable of
providing both of improved write characteristics and increased
recording density, and to provide a manufacturing method for the
magnetic head.
[0010] A magnetic head for perpendicular magnetic recording of the
present invention includes: a medium facing surface configured to
face a recording medium; a coil; a main pole; a write shield formed
of a magnetic material; a gap section; and a substrate having a top
surface. The coil is configured to produce a magnetic field
corresponding to data to be written on the recording medium. The
main pole is configured to pass a magnetic flux corresponding to
the magnetic field produced by the coil, and to produce a write
magnetic field for writing data on the recording medium by means of
a perpendicular magnetic recording system. The gap section is
formed of a nonmagnetic material and provided between the main pole
and the write shield. The coil, the main pole, the write shield and
the gap section are disposed above the top surface of the
substrate.
[0011] The write shield includes a first side shield and a second
side shield located on opposite sides of the main pole in the track
width direction. The first side shield has a first end face located
in the medium facing surface, and has a first sidewall and a second
sidewall facing the main pole. The second side shield has a second
end face located in the medium facing surface, and has a third
sidewall and a fourth sidewall facing the main pole. The first
sidewall is connected to the first end face. The second sidewall is
located farther from the medium facing surface than is the first
sidewall. The third sidewall is connected to the second end face.
The fourth sidewall is located farther from the medium facing
surface than is the third sidewall.
[0012] The first sidewall has a first edge farthest from the top
surface of the substrate. The second sidewall has a second edge
farthest from the top surface of the substrate. The third sidewall
has a third edge farthest from the top surface of the substrate.
The fourth sidewall has a fourth edge farthest from the top surface
of the substrate. Each of the first and third edges has a front end
located in the medium facing surface and a rear end opposite to the
front end. Each of the second and fourth edges has a front end
closest to the medium facing surface.
[0013] The distance between the rear end of the first edge and the
rear end of the third edge in the track width direction is greater
than the distance between the front end of the first edge and the
front end of the third edge in the track width direction. The
distance between the second edge and the fourth edge in the track
width direction increases with increasing distance from the medium
facing surface.
[0014] The first edge and the second edge are contiguous to each
other to form a first contour line, the rear end of the first edge
and the front end of the second edge coinciding with each other.
The third edge and the fourth edge are contiguous to each other to
form a second contour line, the rear end of the third edge and the
front end of the fourth edge coinciding with each other.
[0015] The front end of the second edge is an inflection point or a
corner at which there occurs a change in an angle of inclination of
the first contour line relative to a first direction at a first
point on the first contour line when the first point is shifted
from the first edge to the second edge, the first direction being
perpendicular to the medium facing surface, the change being a
decrease. The front end of the fourth edge is an inflection point
or a corner at which there occurs a change in an angle of
inclination of the second contour line relative to the first
direction at a second point on the second contour line when the
second point is shifted from the third edge to the fourth edge, the
change being a decrease.
[0016] The main pole has an end face located in the medium facing
surface, and has a first side surface and a second side surface.
Part of the first side surface is opposed to the first sidewall.
Part of the second side surface is opposed to the third
sidewall.
[0017] The gap section includes a first portion interposed between
the first side surface and the first and second sidewalls, and a
second portion interposed between the second side surface and the
third and fourth sidewalls.
[0018] The distance from the medium facing surface to the front end
of the second edge, and the distance from the medium facing surface
to the front end of the fourth edge are each within the range of 20
to 90 nm. The distance between the front end and the rear end of
the first edge in the track width direction, and the distance
between the front end and the rear end of the third edge in the
track width direction are each within the range of 40 to 290
nm.
[0019] In the magnetic head for perpendicular magnetic recording of
the present invention, in the medium facing surface, the distance
between the first sidewall and the third sidewall in the track
width direction may decrease toward the top surface of the
substrate. In such a case, an angle that the second sidewall forms
with a second direction perpendicular to the top surface of the
substrate may be smaller than an angle that the first sidewall
forms with the second direction in the medium facing surface.
Further, an angle that the fourth sidewall forms with the second
direction may be smaller than an angle that the third sidewall
forms with the second direction in the medium facing surface.
[0020] The first sidewall may include a first front portion
connected to the first end face, and a first rear portion connected
to the second sidewall. The third sidewall may include a second
front portion connected to the second end face, and a second rear
portion connected to the fourth sidewall. An angle that the first
rear portion forms with a direction perpendicular to the top
surface of the substrate may be smaller than an angle that the
first front portion forms with the direction perpendicular to the
top surface of the substrate. An angle that the second rear portion
forms with the direction perpendicular to the top surface of the
substrate may be smaller than an angle that the second front
portion forms with the direction perpendicular to the top surface
of the substrate.
[0021] In the magnetic head for perpendicular magnetic recording of
the present invention, the first side shield may include a first
magnetic layer having the first sidewall, and a second magnetic
layer having the second sidewall. The second side shield may
include a third magnetic layer having the third sidewall, and a
fourth magnetic layer having the fourth sidewall. In such a case,
the first magnetic layer and the second magnetic layer may have
equal saturation flux densities, and the third magnetic layer and
the fourth magnetic layer may have equal saturation flux densities.
Alternatively, the second magnetic layer may be higher in
saturation flux density than the first magnetic layer, and the
fourth magnetic layer may be higher in saturation flux density than
the third magnetic layer. Alternatively, the second magnetic layer
may be lower in saturation flux density than the first magnetic
layer, and the fourth magnetic layer may be lower in saturation
flux density than the third magnetic layer.
[0022] In the magnetic head for perpendicular magnetic recording of
the present invention, the minimum distance between the second
sidewall and the first side surface may be greater than the minimum
distance between the first sidewall and the first side surface, and
the minimum distance between the fourth sidewall and the second
side surface may be greater than the minimum distance between the
third sidewall and the second side surface.
[0023] In the magnetic head for perpendicular magnetic recording of
the present invention, each of the first and third edges may
include a portion projecting toward the main pole. Each of the
second and fourth edges may include a portion projecting toward the
main pole.
[0024] A manufacturing method for the magnetic head for
perpendicular magnetic recording of the present invention includes
the steps of: forming a first initial side shield and a second
initial side shield, the first initial side shield becoming the
first side shield later, the second initial side shield becoming
the second side shield later; forming the first and second portions
of the gap section after the first and second initial side shields
are formed; forming an initial main pole after the first and second
portions of the gap section are formed; forming the coil; and
forming the medium facing surface so that the first initial side
shield becomes the first side shield, the second initial side
shield becomes the second side shield, and the initial main pole
becomes the main pole.
[0025] In the manufacturing method of the present invention, the
step of forming the first initial side shield and the second
initial side shield may include the step of forming a magnetic
layer having at least part of the first sidewall and at least part
of the third sidewall, and the step of partially etching the
magnetic layer so as to provide the magnetic layer with the second
sidewall and the fourth sidewall.
[0026] The step of forming the first initial side shield and the
second initial side shield may further include the step of forming
a planarization layer to cover the magnetic layer, which is
performed after the step of forming the magnetic layer and before
the step of partially etching the magnetic layer, and the step of
forming a mask on the planarization layer, which is performed after
the step of forming the planarization layer and before the step of
partially etching the magnetic layer. In such a case, in the step
of partially etching the magnetic layer, the mask is used to
partially etch the magnetic layer.
[0027] In the manufacturing method of the present invention, the
first side shield may include a first magnetic layer having the
first sidewall, and a second magnetic layer having the second
sidewall. The second side shield may include a third magnetic layer
having the third sidewall, and a fourth magnetic layer having the
fourth sidewall. In such a case, the step of forming the first
initial side shield and the second initial side shield may include
the step of forming the first magnetic layer and the third magnetic
layer, and the step of forming the second magnetic layer and the
fourth magnetic layer after the first magnetic layer and the third
magnetic layer are formed.
[0028] The step of forming the first magnetic layer and the third
magnetic layer may include the step of forming a mask having two
accommodation sections in which the first magnetic layer and the
third magnetic layer are to be accommodated later, and the step of
forming the first magnetic layer and the third magnetic layer in
the two accommodation sections. In such a case, the first magnetic
layer and the third magnetic layer may be formed by plating or
sputtering.
[0029] The first sidewall may include a first front portion
connected to the first end face, and a first rear portion connected
to the second sidewall. The third sidewall may include a second
front portion connected to the second end face, and a second rear
portion connected to the fourth sidewall. In such a case, the step
of forming the first magnetic layer and the third magnetic layer
may include the step of forming an initial first magnetic layer
including the first front portion and an initial third magnetic
layer including the second front portion, and the step of partially
etching the initial first magnetic layer to provide the initial
first magnetic layer with the first rear portion so as to make the
initial first magnetic layer into the first magnetic layer, and
partially etching the initial third magnetic layer to provide the
initial third magnetic layer with the second rear portion so as to
make the initial third magnetic layer into the third magnetic
layer.
[0030] An angle that the first rear portion forms with the
direction perpendicular to the top surface of the substrate may be
smaller than an angle that the first front portion forms with the
direction perpendicular to the top surface of the substrate. An
angle that the second rear portion forms with the direction
perpendicular to the top surface of the substrate may be smaller
than an angle that the second front portion forms with the
direction perpendicular to the top surface of the substrate.
[0031] In the manufacturing method of the present invention, when
the first side shield includes the first and second magnetic layers
and the second side shield includes the third and fourth magnetic
layers, the step of forming the second magnetic layer and the
fourth magnetic layer may include the step of forming a mask having
two accommodation sections in which the second magnetic layer and
the fourth magnetic layer are to be accommodated later, and the
step of forming the second magnetic layer and the fourth magnetic
layer in the two accommodation sections. In such a case, the second
magnetic layer and the fourth magnetic layer may be formed by
plating or sputtering.
[0032] According to the magnetic head for perpendicular magnetic
recording and its manufacturing method of the present invention,
the first side shield has the first and second sidewalls, and the
second side shield has the third and fourth sidewalls. This
configuration enables a reduction in width of the end face of the
main pole located in the medium facing surface and an increase in
cross-sectional area of the main pole in the vicinity of the medium
facing surface, and prevents saturation of magnetic flux in the
first and second side shields. The present invention thus makes it
possible to achieve both of improved write characteristics and
increased recording density.
[0033] Other objects, features and advantages of the present
invention will become fully apparent from the following
description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] FIG. 1 is a plan view showing part of a main pole and first
and second side shields in the vicinity of a medium facing surface
in a magnetic head according to a first embodiment of the
invention.
[0035] FIG. 2 is a front view showing respective end faces of the
main pole and the first and second side shields located in the
medium facing surface in the magnetic head according to the first
embodiment of the invention.
[0036] FIG. 3 is a cross-sectional view showing a cross section of
each of the main pole and the first and second side shields
parallel to the medium facing surface in the magnetic head
according to the first embodiment of the invention.
[0037] FIG. 4 is an explanatory diagram illustrating a portion of a
first contour line in the magnetic head according to the first
embodiment of the invention.
[0038] FIG. 5 is a perspective view showing a portion of the main
pole in the vicinity of the medium facing surface in the magnetic
head according to the first embodiment of the invention.
[0039] FIG. 6 is a cross-sectional view showing the main part of
the magnetic head according to the first embodiment of the
invention.
[0040] FIG. 7 is a cross-sectional view showing the configuration
of the magnetic head according to the first embodiment of the
invention.
[0041] FIG. 8 is a front view showing the medium facing surface of
the magnetic head according to the first embodiment of the
invention.
[0042] FIG. 9 is a plan view showing a first coil portion of the
magnetic head according to the first embodiment of the
invention.
[0043] FIG. 10 is a plan view showing a second coil portion of the
magnetic head according to the first embodiment of the
invention.
[0044] FIG. 11 is a plan view showing a step of a manufacturing
method for the magnetic head according to the first embodiment of
the invention.
[0045] FIG. 12A and FIG. 12B are cross-sectional views showing a
step that follows the step shown in FIG. 11.
[0046] FIG. 13A to FIG. 13C are explanatory diagrams showing a step
that follows the step shown in FIG. 12A and FIG. 12B.
[0047] FIG. 14A to FIG. 14C are explanatory diagrams showing a step
that follows the step shown in FIG. 13A to FIG. 13C.
[0048] FIG. 15A to FIG. 15C are explanatory diagrams showing a step
that follows the step shown in FIG. 14A to FIG. 14C.
[0049] FIG. 16A and FIG. 16B are cross-sectional views showing a
step that follows the step shown in FIG. 15A to FIG. 15C.
[0050] FIG. 17A to FIG. 17C are explanatory diagrams showing a step
that follows the step shown in FIG. 16A and FIG. 16B.
[0051] FIG. 18 is a perspective view showing part of a main pole
and first and second side shields in the vicinity of a medium
facing surface in a magnetic head according to a second embodiment
of the invention.
[0052] FIG. 19 is a perspective view showing a step of a
manufacturing method for the magnetic head according to the second
embodiment of the invention.
[0053] FIG. 20 is a perspective view showing a step that follows
the step shown in FIG. 19.
[0054] FIG. 21 is a perspective view showing part of a main pole
and first and second side shields in the vicinity of a medium
facing surface in a first modification example of the magnetic head
according to the second embodiment.
[0055] FIG. 22 is a plan view showing part of the main pole and the
first and second side shields in the vicinity of the medium facing
surface in the first modification example of the magnetic head
according to the second embodiment.
[0056] FIG. 23 is an explanatory diagram illustrating a portion of
a first contour line in the first modification example of the
magnetic head according to the second embodiment of the
invention.
[0057] FIG. 24 is a plan view showing part of a main pole and first
and second side shields in the vicinity of a medium facing surface
in a second modification example of the magnetic head according to
the second embodiment.
[0058] FIG. 25 is a plan view showing part of a main pole and first
and second side shields in the vicinity of a medium facing surface
in a magnetic head according to a third embodiment of the
invention.
[0059] FIG. 26 is a plan view showing a step of a manufacturing
method for the magnetic head according to the third embodiment of
the invention.
[0060] FIG. 27 is a plan view showing a step that follows the step
shown in FIG. 26.
[0061] FIG. 28 is a plan view showing a step that follows the step
shown in FIG. 27.
[0062] FIG. 29 is a plan view showing a step that follows the step
shown in FIG. 28.
[0063] FIG. 30 is a plan view showing a step that follows the step
shown in FIG. 29.
[0064] FIG. 31 is a plan view showing a step that follows the step
shown in FIG. 30.
[0065] FIG. 32 is a plan view showing part of a main pole and first
and second side shields in the vicinity of a medium facing surface
in a modification example of the magnetic head according to the
third embodiment.
[0066] FIG. 33 is a plan view showing a part of a main pole and
first and second side shields in the vicinity of a medium facing
surface in a magnetic head according to a fourth embodiment of the
invention.
[0067] FIG. 34 is a plan view showing a step of a manufacturing
method for the magnetic head according to the fourth embodiment of
the invention.
[0068] FIG. 35 is a plan view showing a step that follows the step
shown in FIG. 34.
[0069] FIG. 36 is a plan view showing a step that follows the step
shown in FIG. 35.
[0070] FIG. 37 is a plan view showing a step that follows the step
shown in FIG. 36.
[0071] FIG. 38 is a plan view showing a step that follows the step
shown in FIG. 37.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
First Embodiment
[0072] Preferred embodiments of the present invention will now be
described in detail with reference to the drawings. First,
reference is made to FIG. 7 to FIG. 10 to describe the
configuration of a magnetic head for perpendicular magnetic
recording (hereinafter simply referred to as magnetic head)
according to a first embodiment of the invention. FIG. 7 is a
cross-sectional view of the magnetic head according to the present
embodiment. The arrow T in FIG. 7 indicates the direction of travel
of a recording medium. FIG. 8 is a front view showing the medium
facing surface of the magnetic head according to the present
embodiment. FIG. 9 is a plan view showing a first coil portion of
the magnetic head according to the present embodiment. FIG. 10 is a
plan view showing a second coil portion of the magnetic head
according to the present embodiment. In FIG. 8 to FIG. 10, the
arrow TW indicates the track width direction.
[0073] The magnetic head according to the present embodiment is for
use in, for example, a magnetic disk drive, and is incorporated in
a slider configured to fly over the surface of a rotating recording
medium 90. The slider has a medium facing surface 80 configured to
face the recording medium 90. The medium facing surface 80 has an
air inflow end (a leading end) and an air outflow end (a trailing
end). An airflow that comes from the leading end into the space
between the medium facing surface 80 and the recording medium 90
causes the slider to slightly fly over the surface of the recording
medium 90.
[0074] As shown in FIG. 7, the magnetic head has the medium facing
surface 80. Further, as shown in FIG. 7 and FIG. 8, the magnetic
head includes a substrate 1 having a top surface 1a. The substrate
1 is formed of a ceramic material such as aluminum oxide-titanium
carbide (Al.sub.2O.sub.3--TiC).
[0075] For the positions of the components of the magnetic head,
the term "above" as used herein refers to positions located in the
direction that is perpendicular to the top surface 1a and away from
the top surface 1a with respect to a reference position, and
"below" refers to positions located in the direction that is
perpendicular to the top surface 1a and toward the top surface 1a
with respect to the reference position. For each of layers included
in the magnetic head, the term "top surface" as used herein refers
to the surface farthest from the top surface 1a, and "bottom
surface" refers to the surface closest to the top surface 1a.
[0076] The magnetic head further includes: an insulating layer 2
formed of an insulating material such as alumina (Al.sub.2O.sub.3)
and disposed on the top surface 1a of the substrate 1; a first read
shield layer 3 formed of a magnetic material and disposed on the
insulating layer 2; a first read shield gap film 4 which is an
insulating film disposed to cover the first read shield layer 3; a
magnetoresistive (MR) element 5 serving as a read element disposed
on the first read shield gap film 4; a second read shield gap film
6 which is an insulating film disposed on the MR element 5; and a
second read shield layer 7 formed of a magnetic material and
disposed on the second read shield gap film 6.
[0077] An end of the MR element 5 is located in the medium facing
surface 80. The MR element 5 may be an element formed of a
magneto-sensitive film that exhibits a magnetoresistive effect,
such as an anisotropic magnetoresistive (AMR) element, a giant
magnetoresistive (GMR) element, or a tunneling magnetoresistive
(TMR) element. The GMR element may be of either the
current-in-plane (CIP) type in which a current for use in magnetic
signal detection is fed in a direction generally parallel to the
plane of layers constituting the GMR element or the
current-perpendicular-to-plane (CPP) type in which the current for
use in magnetic signal detection is fed in a direction generally
perpendicular to the plane of the layers constituting the GMR
element.
[0078] The parts from the first read shield layer 3 to the second
read shield layer 7 constitute a read head unit 8. The magnetic
head further includes: a nonmagnetic layer 71 formed of a
nonmagnetic material and lying on the second read shield layer 7; a
contact sensor 72 lying on the nonmagnetic layer 71; and a
nonmagnetic layer 73 formed of a nonmagnetic material and disposed
to cover the nonmagnetic layer 71 and the contact sensor 72. The
nonmagnetic layers 71 and 73 are formed of alumina, for
example.
[0079] The magnetic head further includes: a middle shield 75
formed of a magnetic material and lying on the nonmagnetic layer
73; a magnetic layer 74 formed of a magnetic material and
connecting the second read shield layer 7 and the middle shield 75;
a nonmagnetic layer 76 formed of a nonmagnetic material and lying
on the middle shield 75; and a write head unit 9 lying on the
nonmagnetic layer 76. The magnetic layer 74 is located away from
the medium facing surface 80 and embedded in the nonmagnetic layers
71 and 73. The middle shield 75 has the function of shielding the
MR element 5 from magnetic fields generated in the write head unit
9. The nonmagnetic layer 76 is formed of alumina, for example.
[0080] The write head unit 9 includes a coil, a main pole 15, a
write shield 16, and a gap section 17. The coil is configured to
produce a magnetic field corresponding to data to be written on the
recording medium 90. The coil includes a first coil portion 10 and
a second coil portion 20. The first coil portion 10 and the second
coil portion 20 are both formed of a conductive material such as
copper. The first coil portion 10 and the second coil portion 20
are connected in series or in parallel. The main pole 15 has an end
face 15a located in the medium facing surface 80. The main pole 15
is configured to pass a magnetic flux corresponding to the magnetic
field produced by the coil, and to produce a write magnetic field
for writing data on the recording medium 90 by means of a
perpendicular magnetic recording system. FIG. 7 shows a cross
section that intersects the end face 15a of the main pole 15 and
that is perpendicular to the medium facing surface 80 and to the
top surface 1a of the substrate 1. Such a cross section will
hereinafter be referred to as the main cross section.
[0081] As shown in FIG. 8, the write shield 16 includes a first
side shield 16A, a second side shield 16B, a bottom shield 16C, and
a top shield 16D. The first and second side shields 16A and 16B are
located on opposite sides of the main pole 15 in the track width
direction TW. The bottom shield 16C is located closer to the top
surface 1a of the substrate 1 than is the main pole 15. The top
shield 16D is located farther from the top surface 1a of the
substrate 1 than is the main pole 15. The first and second side
shields 16A and 16B magnetically couple the bottom shield 16C and
the top shield 16D to each other.
[0082] As shown in FIG. 8, the first side shield 16A has a first
end face 16Aa located in the medium facing surface 80. The second
side shield 16B has a second end face 16Ba located in the medium
facing surface 80. The bottom shield 16C has an end face 16Ca
located in the medium facing surface 80. The top shield 16D has an
end face 16Da located in the medium facing surface 80.
[0083] The first and second end faces 16Aa and 16Ba are located on
opposite sides of the end face 15a of the main pole 15 in the track
width direction TW. The end face 16Ca is located on the rear side
in the direction T of travel of the recording medium 90 relative to
the end face 15a of the main pole 15. The end face 16Da is located
on the front side in the direction T of travel of the recording
medium 90 relative to the end face 15a of the main pole 15. In the
medium facing surface 80, the end faces 16Aa, 16Ba, 16Ca and 16Da
are arranged to surround the end face 15a of the main pole 15.
[0084] The write shield 16 is formed of a magnetic material. The
material employed for the write shield 16 may be CoFeN, CoNiFe,
NiFe, or CoFe, for example.
[0085] The write head unit 9 further includes a first return path
section 30 and a second return path section 40. The first and
second return path sections 30 and 40 are both formed of a magnetic
material. For example, the first and second return path sections 30
and 40 may each be formed of one of CoFeN, CoNiFe, FeNi and CoFe.
The first return path section 30 is located closer to the top
surface 1a of the substrate 1 than is the main pole 15 and connects
the write shield 16 to part of the main pole 15 located away from
the medium facing surface 80, thereby magnetically coupling the
write shield 16 to the main pole 15. The second return path section
40 is located farther from the top surface 1a of the substrate 1
than is the main pole 15, and connects the write shield 16 to part
of the main pole 15 located away from the medium facing surface 80,
thereby magnetically coupling the write shield 16 to the main pole
15.
[0086] The first return path section 30 includes a yoke 31 and
coupling sections 32, 33 and 34. The yoke 31 lies on the
nonmagnetic layer 76. The coupling sections 32 and 33 lie on the
yoke 31. The coupling section 32 is located near the medium facing
surface 80. The coupling section 33 is located farther from the
medium facing surface 80 than is the coupling section 32. The yoke
31 has an end face that faces toward the medium facing surface 80
and located at a distance from the medium facing surface 80. The
coupling section 32 has an end face located in the medium facing
surface 80.
[0087] As shown in FIG. 9, the first coil portion 10 is wound
around the coupling section 33. The write head unit 9 further
includes: an insulating layer 51 formed of an insulating material
and lying on the nonmagnetic layer 76 to surround the yoke 31; an
insulating film 52 formed of an insulating material and separating
the first coil portion 10 from the yoke 31 and the coupling
sections 32 and 33; and an insulating layer (not illustrated)
formed of an insulating material and disposed around the first coil
portion 10 and the coupling section 32. The top surfaces of the
first coil portion 10, the coupling sections 32 and 33, the
insulating film 52 and the non-illustrated insulating layer are
even with each other. The insulating layer 51, the insulating film
52 and the non-illustrated insulating layer are formed of alumina,
for example.
[0088] The bottom shield 16C lies on the coupling section 32. The
coupling section 34 lies on the coupling section 33. The write head
unit 9 further includes an insulating layer 53 formed of an
insulating material, and a nonmagnetic layer 54 formed of a
nonmagnetic material. The insulating layer 53 lies on the first
coil portion 10, the insulating film 52 and the non-illustrated
insulating layer. The nonmagnetic layer 54 lies on the insulating
layer 53 and surrounds the bottom shield 16C and the coupling
section 34. The insulating layer 53 and the nonmagnetic layer 54
are formed of alumina, for example.
[0089] The first and second side shields 16A and 16B lie on the
bottom shield 16C. The main pole 15 has the end face 15a, and
further has: a bottom end 15L (see FIG. 7) facing toward the top
surface 1a of the substrate 1; a top surface 15T (see FIG. 7)
opposite to the bottom end 15L; and a first side surface S1 and a
second side surface S2 (see FIG. 9 and FIG. 10) opposite to each
other in the track width direction TW. Each of the first and second
side shields 16A and 16B has a plurality of sidewalls. The
sidewalls of the first side shield 16A and the sidewalls of the
second side shield 16B will be described in detail later.
[0090] The gap section 17 is provided between the main pole 15 and
the write shield 16. The write head unit 9 further includes a first
gap layer 18 and a second gap layer 19. The first gap layer 18 is
formed of a nonmagnetic material and includes a portion that forms
a portion of the gap section 17. The second gap layer 19 is formed
of a nonmagnetic material and includes a portion that forms another
portion of the gap section 17. The aforementioned portion of the
first gap layer 18 forming the portion of the gap section 17 is
located between the main pole 15 and each of the first and second
side shields 16A and 16B and the bottom shield 16C. The
aforementioned portion of the second gap layer 19 forming the other
portion of the gap section 17 is located between the main pole 15
and the top shield 16D.
[0091] The first gap layer 18 is disposed along the sidewalls of
the first side shield 16A, the sidewalls of the second side shield
16B, the top surface of the bottom shield 16C, and the top surface
of the nonmagnetic layer 54. The nonmagnetic material used to form
the first gap layer 18 may be an insulating material or a
nonmagnetic metal material. Alumina is an example of an insulating
material that can be used to form the first gap layer 18. Ru is an
example of a nonmagnetic metal material that can be used to form
the first gap layer 18.
[0092] A portion of the main pole 15 lies above the top surfaces of
the bottom shield 16C and the nonmagnetic layer 54. The first gap
layer 18 is interposed between the aforementioned portion of the
main pole 15 and the top surfaces of the bottom shield 16C and the
nonmagnetic layer 54. As shown in FIG. 8, the first gap layer 18 is
interposed also between the main pole 15 and the first and second
side shields 16A and 16B.
[0093] The bottom end 15L of the main pole 15 is in contact with
the top surface of the coupling section 34 at a location away from
the medium facing surface 80. The main pole 15 is formed of a
ferromagnetic material containing one or more elements selected
from the group consisting of Ni, Fe and Co, such as FeNi, CoNiFe,
or CoFe. The shape of the main pole 15 will be described in detail
later.
[0094] The write head unit 9 further includes a nonmagnetic layer
55 formed of a nonmagnetic material and disposed around the main
pole 15 and the first and second side shields 16A and 16B. The
nonmagnetic layer 55 is shown in FIG. 1, which will be described
later. The nonmagnetic layer 55 is formed of alumina, for
example.
[0095] The write head unit 9 further includes a nonmagnetic layer
58 formed of a nonmagnetic material and lying on a first portion of
the top surface 15T of the main pole 15, the first portion being
located at a distance from the medium facing surface 80. For
example, the nonmagnetic layer 58 is formed of a nonmagnetic metal
material such as Ru, NiCr or NiCu.
[0096] The second gap layer 19 is disposed to cover the main pole
15 and the nonmagnetic layer 58. The material of the second gap
layer 19 may be a nonmagnetic insulating material such as alumina,
or a nonmagnetic conductive material such as Ru, NiCu, Ta, W, NiB,
or NiP.
[0097] The write head unit 9 further includes a nonmagnetic layer
60 formed of a nonmagnetic material and lying on the second gap
layer 19. The nonmagnetic layer 60 has an end that is closest to
the medium facing surface 80 and located at a distance from the
medium facing surface 80. The nonmagnetic layer 60 is formed of
alumina, for example.
[0098] The top shield 16D lies on the first and second side shields
16A and 16B, the second gap layer 19 and the nonmagnetic layer 60,
and is in contact with the top surfaces of the first and second
side shields 16A and 16B, the second gap layer 19 and the
nonmagnetic layer 60. In the medium facing surface 80, part of the
end face 16Da of the top shield 16D is spaced a predetermined
distance apart from the end face 15a of the main pole 15, the
predetermined distance being created by the thickness of the second
gap layer 19. The thickness of the second gap layer 19 preferably
falls within the range of 5 to 60 nm, and may be 30 to 60 nm, for
example. The end face 15a of the main pole 15 has a side in contact
with the second gap layer 19. This side of the end face 15a defines
the track width.
[0099] The second return path section 40 includes coupling sections
41 and 42. The coupling section 41 lies on a second portion of the
top surface 15T of the main pole 15, the second portion being
located at a distance from the medium facing surface 80. The second
portion of the top surface 15T of the main pole 15 is located
farther from the medium facing surface 80 than is the first portion
of the top surface 15T of the main pole 15.
[0100] As shown in FIG. 10, the second coil portion 20 is wound
around the coupling section 41. The write head unit 9 further
includes: a first insulating film 61 formed of an insulating
material and separating at least part of the second coil portion 20
from the second gap layer 19, the coupling section 41 and the
nonmagnetic layers 58 and 60; and a second insulating film 62
formed of an insulating material and disposed to cover at least
part of the second coil portion 20 and the first insulating film
61. The first and second insulating films 61 and 62 are formed of
alumina, for example.
[0101] The coupling section 42 lies on the top shield 16D, the
coupling section 41 and the second insulating film 62. The coupling
section 42 has an end face located in the medium facing surface
80.
[0102] The magnetic head further includes a protective layer 70
formed of a nonmagnetic material and disposed to cover the write
head unit 9. The protective layer 70 is formed of, for example, an
inorganic insulating material such as alumina.
[0103] As has been described, the magnetic head according to the
present embodiment includes the medium facing surface 80, the read
head unit 8, the write head unit 9, and the middle shield 75. The
read head unit 8, the middle shield 75 and the write head unit 9
are arranged in this order above the top surface 1a of the
substrate 1, the read head unit 8 being closest to the top surface
1a.
[0104] The write head unit 9 includes the coil including the first
and second coil portions 10 and 20, the main pole 15, the write
shield 16, the gap section 17, and the first and second return path
sections 30 and 40. The coil, the main pole 15, the write shield
16, the gap section 17, and the first and second return path
sections 30 and 40 are disposed above the top surface 1a of the
substrate 1. The write shield 16 includes the first side shield
16A, the second side shield 16B, the bottom shield 16C and the top
shield 16D. The gap section 17 is composed of part of the first gap
layer 18 and part of the second gap layer 19. Since the first and
second gap layers 18 and 19 are both formed of nonmagnetic
material, the gap section 17 is formed of nonmagnetic material.
[0105] The first return path section 30 includes the yoke 31 and
the coupling sections 32 to 34. The first return path section 30 is
located closer to the top surface 1a of the substrate 1 than is the
main pole 15, and connects the write shield 16 to part of the main
pole 15 located away from the medium facing surface 80 so that a
first space is defined by the main pole 15, the gap section 17 (the
gap layer 18), the write shield 16 and the first return path
section 30 (the yoke 31 and the coupling sections 32 to 34). The
coupling section 32 magnetically couples the bottom shield 16C of
the write shield 16 to the yoke 31. The coupling sections 33 and 34
magnetically couple the main pole 15 to the yoke 31. The first coil
portion 10 passes through the first space.
[0106] The second return path section 40 includes the coupling
sections 41 and 42. The second return path section 40 is located
farther from the top surface 1a of the substrate 1 than is the main
pole 15, and connects the write shield 16 to part of the main pole
15 located away from the medium facing surface 80 so that a second
space is defined by the main pole 15, the gap section 17 (the gap
layer 19), the write shield 16 and the second return path section
40 (the coupling sections 41 and 42). The coupling sections 41 and
42 magnetically couple the top shield 16D of the write shield 16 to
the main pole 15. The second coil portion 20 passes through the
second space.
[0107] The write shield 16 captures a disturbance magnetic field
applied to the magnetic head from the outside thereof. This makes
it possible to prevent the disturbance magnetic field from being
intensively captured into the main pole 15 and thereby causing
erroneous writing on the recording medium 90. The write shield 16
further has the function of capturing a magnetic flux that is
produced from the end face 15a of the main pole 15 and spreads in
directions other than the direction perpendicular to the plane of
the recording medium 90, and thereby preventing the magnetic flux
from reaching the recording medium 90. Furthermore, the write
shield 16 and the first and second return path sections 30 and 40
have the function of allowing a magnetic flux that has been
produced from the end face 15a of the main pole 15 and has
magnetized a portion of the recording medium 90 to flow back.
[0108] The magnetic head according to the present embodiment
further includes the contact sensor 72. The contact sensor 72 is
provided for detecting contact of part of the medium facing surface
80 with the recording medium 90. For example, the contact sensor 72
is a resistor that varies in resistance with a change in its own
temperature upon contact of part of the medium facing surface 80
with the recording medium 90. The resistor extends in the track
width direction TW. The magnetic head according to the present
embodiment includes a pair of leads (not illustrated) that are
connected to opposite ends of the resistor.
[0109] The first and second side shields 16A and 16B will now be
described in detail with reference to FIG. 1 to FIG. 3. FIG. 1 is a
plan view showing part of the main pole 15 and the first and second
side shields 16A and 16B in the vicinity of the medium facing
surface 80. FIG. 2 is a front view showing respective end faces of
the main pole 15 and the first and second side shields 16A and 16B
located in the medium facing surface 80. FIG. 3 is a front view
showing a cross section of each of the main pole 15 and the first
and second side shields 16A and 16B parallel to the medium facing
surface 80. FIG. 3 shows a cross section taken along line 3-3 of
FIG. 1.
[0110] As shown in FIG. 1 to FIG. 3, the first side shield 16A has:
a first end face 16Aa located in the medium facing surface 80; and
a first sidewall SW1 and a second sidewall SW2 facing toward the
main pole 15. The first sidewall SW1 is connected to the first end
face 16Aa. The second sidewall SW2 is located farther from the
medium facing surface 80 than is the first sidewall SW1.
[0111] The second side shield 16B has: a second end face 16Ba
located in the medium facing surface 80; and a third sidewall SW3
and a fourth sidewall SW4 facing toward the main pole 15. The third
sidewall SW3 is connected to the second end face 16Ba. The fourth
sidewall SW4 is located farther from the medium facing surface 80
than is the third sidewall SW3.
[0112] The first side shield 16A further has a fifth sidewall SW5.
The fifth sidewall SW5 is located on a side of the second sidewall
SW2 opposite from the first sidewall SW1, and connected to the
second sidewall SW2. The second side shield 16B further has a sixth
sidewall SW6. The sixth sidewall SW6 is located on a side of the
fourth sidewall SW4 opposite from the third sidewall SW3, and
connected to the fourth sidewall SW4. The fifth and sixth sidewalls
SW5 and SW6 are shown in FIG. 14C and FIG. 17C, which will be
described later.
[0113] As shown in FIG. 2, in the medium facing surface 80, the
distance between the first sidewall SW1 and the third sidewall SW3
in the track width direction TW decreases toward the top surface 1a
(see FIG. 7 and FIG. 8) of the substrate 1. A direction
perpendicular to the top surface 1a of the substrate 1 is herein
referred to as the second direction and denoted by symbol D2. An
angle that the first sidewall SW1 forms with the second direction
D2 is herein referred to as the first angle, and an angle that the
third sidewall SW3 forms with the second direction D2 is herein
referred to as the third angle. The first angle in the medium
facing surface 80 and the third angle in the medium facing surface
80 fall within the range of, for example, 7.degree. to 17.degree.,
and preferably within the range of 10.degree. to 15.degree..
[0114] An angle that the second sidewall SW2 forms with the second
direction D2 is herein referred to as the second angle, and an
angle that the fourth sidewall SW4 forms with the second direction
D2 is herein referred to as the fourth angle. As shown in FIG. 3,
the second angle is smaller than the first angle in the medium
facing surface 80, and the fourth angle is smaller than the third
angle in the medium facing surface 80. The second angle and the
fourth angle may be 0.degree..
[0115] The first angle at any position except in the medium facing
surface 80 is greater than or equal to the second angle, and
smaller than or equal to the first angle in the medium facing
surface 80. The third angle at any position except in the medium
facing surface 80 is greater than or equal to the fourth angle, and
smaller than or equal to the third angle in the medium facing
surface 80.
[0116] Although not illustrated, an angle that the fifth sidewall
SW5 forms with the second direction D2 is smaller than the first
angle in the medium facing surface 80 as is the second angle, and
an angle that the sixth sidewall SW6 forms with the second
direction D2 is smaller than the third angle in the medium facing
surface 80 as is the fourth angle.
[0117] As shown in FIG. 1, the first sidewall SW1 has a first edge
E1 farthest from the top surface 1a (see FIG. 7 and FIG. 8) of the
substrate 1. The second sidewall SW2 has a second edge E2 farthest
from the top surface 1a of the substrate 1. The first edge E1 has a
front end E1a located in the medium facing surface 80 and a rear
end E1b opposite to the front end E1a. The second edge E2 has a
front end E2a closest to the medium facing surface 80. The first
edge E1 and the second edge E2 are contiguous to each other to form
a first contour line L1, the rear end E1b of the first edge E1 and
the front end E2a of the second edge E2 coinciding with each
other.
[0118] In the present embodiment, the first edge E1 includes a
portion projecting toward the main pole 15. In the present
embodiment, the projecting portion is particularly a curved portion
passing through a portion closer to the main pole 15 relative to a
straight line connecting the front end E1a and the rear end
E1b.
[0119] As shown in FIG. 1, the third sidewall SW3 has a third edge
E3 farthest from the top surface 1a (see FIG. 7 and FIG. 8) of the
substrate 1. The fourth sidewall SW4 has a fourth edge E4 farthest
from the top surface 1a of the substrate 1. The third edge E3 has a
front end E3a located in the medium facing surface 80 and a rear
end E3b opposite to the front end E3a. The fourth edge E4 has a
front end E4a closest to the medium facing surface 80. The third
edge E3 and the fourth edge E4 are contiguous to each other to form
a second contour line L2, the rear end E3b of the third edge E3 and
the front end E4a of the fourth edge E4 coinciding with each
other.
[0120] In the present embodiment, the third edge E3 includes a
portion projecting toward the main pole 15. In the present
embodiment, the projecting portion is particularly a curved portion
passing through a portion closer to the main pole 15 relative to a
straight line connecting the front end E3a and the rear end
E3b.
[0121] The distance between the rear end E1b of the first edge E1
and the rear end E3b of the third edge E3 in the track width
direction TW is greater than the distance between the front end E1a
of the first edge E1 and the front end E3a of the third edge E3 in
the track width direction TW. The distance between the second edge
E2 and the fourth edge E4 in the track width direction TW increases
with increasing distance from the medium facing surface 80.
[0122] The positions of the front end E2a of the second edge E2 and
the front end E4a of the fourth edge E4 will now be described in
detail. FIG. 4 is an explanatory diagram illustrating a portion of
the first contour line L1. As shown in FIG. 4, assume a first point
P1 on the first contour line L1. A direction perpendicular to the
medium facing surface 80 will be referred to as the first direction
and denoted by the symbol D1. An angle of inclination .theta.1 of
the first contour line L1 relative to the first direction D1 at the
first point P1 varies with varying position of the first point P1.
In the present embodiment, the front end E2a of the second edge E2
is an inflection point at which there occurs a change in the angle
of inclination .theta.1 when the first point P1 is shifted from the
first edge E1 to the second edge E2 as shown in FIG. 4, the change
being a decrease.
[0123] Although not illustrated, assume a second point P2 on the
second contour line L2 similarly to the first point P1. An angle of
inclination .theta.2 of the second contour line L2 relative to the
first direction D1 at the second point P2 varies with varying
position of the second point P2. In the present embodiment, the
front end E4a of the fourth edge E4 is an inflection point at which
there occurs a change in the angle of inclination .theta.2 when the
second point P2 is shifted from the third edge E3 to the fourth
edge E4, the change being a decrease.
[0124] As shown in FIG. 1, the distance from the medium facing
surface 80 to the front end E2a of the second edge E2 is denoted by
the symbol DE1, and the distance from the medium facing surface 80
to the front end E4a of the fourth edge E4 is denoted by the symbol
DE2. The distances DE1 and DE2 are within the range of 20 to 90 nm.
The distances DE1 and DE2 are preferably within the range of 30 to
70 nm.
[0125] Further, as shown in FIG. 1, the distance between the front
end E1a and the rear end E1b of the first edge E1 in the track
width direction TW is denoted by the symbol DE3, and the distance
between the front end E3a and the rear end E3b of the third edge E3
in the track width direction TW is denoted by the symbol DE4. The
distances DE3 and DE4 are within the range of 40 to 290 nm. The
distances DE3 and DE4 are preferably within the range of 60 to 200
nm, more preferably within the range of 80 to 160 nm.
[0126] As will be described later in relation to a first
modification example of a second embodiment, the front end E2a of
the second edge E2 may be a corner at which there occurs a change
in the angle of inclination .theta.1 when the first point P1 is
shifted from the first edge E1 to the second edge E2, the change
being a decrease. Likewise, the front end E4a of the fourth edge E4
may be a corner at which there occurs a change in the angle of
inclination .theta.2 when the second point P2 is shifted from the
third edge E3 to the fourth edge E4, the change being a
decrease.
[0127] The fifth sidewall SW5 has a fifth edge E5 farthest from the
top surface 1a of the substrate 1. The sixth sidewall SW6 has a
sixth edge E6 farthest from the top surface 1a of the substrate 1.
The fifth and sixth edges E5 and E6 are shown in FIG. 17C, which
will be described later. The fifth and sixth edges E5 and E6 are
parallel to the medium facing surface 80.
[0128] Now, the main pole 15 and the gap section 17 will be
described in detail with reference to FIG. 1, FIG. 2, FIG. 5 and
FIG. 6. FIG. 5 is a perspective view showing a portion of the main
pole 15 in the vicinity of the medium facing surface 80. FIG. 6 is
a cross-sectional view showing the main part of the magnetic head
according to the present embodiment. FIG. 6 shows the main cross
section.
[0129] As described previously, the main pole 15 has the end face
15a, the bottom end 15L, the top surface 15T, the first side
surface S1, and the second side surface S2. As shown in FIG. 2 and
FIG. 5, the end face 15a of the main pole 15 has a first side
located at an end of the top surface 15T, and has a second side and
a third side opposite to each other in the track width direction
TW. The first side is in contact with the second gap layer 19. The
distance between the second side and the third side in the track
width direction TW decreases toward the top surface 1a (see FIG. 7
and FIG. 8) of the substrate 1. Each of the second side and the
third side forms an angle in the range of, for example, 7.degree.
to 17.degree., or preferably in the range of 10.degree. to
15.degree., with the second direction D2. The first side has a
length in the range of 0.05 to 0.20 .mu.m, for example.
[0130] As shown in FIG. 5 and FIG. 6, the top surface 15T includes
an inclined portion 15T1 and a flat portion 15T2, the inclined
portion 15T1 being closer to the medium facing surface 80 than the
flat portion 15T2. The inclined portion 15T1 has a first end
located in the medium facing surface 80 and a second end opposite
thereto. The flat portion 15T2 is connected to the second end of
the inclined portion 15T1. The inclined portion 15T1 is inclined
such that its second end is located on the front side in the
direction T of travel of the recording medium 90 relative to its
first end. The flat portion 15T2 extends in a direction
substantially perpendicular to the medium facing surface 80.
[0131] As shown in FIG. 6, the bottom 15L includes an inclined
portion and a flat portion, the inclined portion being closer to
the medium facing surface 80 than the flat portion. The inclined
portion of the bottom end 15L has a first end located in the medium
facing surface 80 and a second end opposite thereto. The inclined
portion of the bottom end 15L may be an edge formed by two
intersecting planes, or may be a plane connecting two planes to
each other. The flat portion of the bottom end 15L is a plane
connected to the second end of the inclined portion of the bottom
end 15L. The inclined portion of the bottom end 15L is inclined
such that its second end is located on the rear side in the
direction T of travel of the recording medium 90 relative to its
first end. The flat portion of the bottom end 15L extends in a
direction substantially perpendicular to the medium facing surface
80.
[0132] As shown in FIG. 1 and FIG. 5, part of the first side
surface S1 is opposed to the first sidewall SW1 and part of the
second sidewall SW2. Part of the second side surface S2 is opposed
to the third sidewall SW3 and part of the fourth sidewall SW4.
[0133] As shown in FIG. 2 and FIG. 5, in the medium facing surface
80 the distance between the first side surface S1 and the second
side surface S2 in the track width direction TW decreases toward
the top surface 1a of the substrate 1. A preferable range of the
angle that each of the first and second side surfaces S1 and S2
forms with the second direction D2 in the medium facing surface 80
is the same as that for the first and third angles in the medium
facing surface 80.
[0134] As shown in FIG. 3 and FIG. 5, the angle that the first side
surface S1 forms with the second direction D2 at a position a
predetermined distance or more apart from the medium facing surface
80 is smaller than the angle that the first side surface S1 forms
with the second direction D2 in the medium facing surface 80, and
the angle that the second side surface S2 forms with the second
direction D2 at a position a predetermined distance or more apart
from the medium facing surface 80 is smaller than the angle that
the second side surface S2 forms with the second direction D2 in
the medium facing surface 80. At a position a predetermined
distance or more apart from the medium facing surface 80, each of
the first side surface S1 and the second side surface S2 may form
0.degree. with the second direction D2.
[0135] As shown in FIG. 1, the first gap layer 18 is disposed along
the first to fourth sidewalls SW1 to SW4. The first gap layer 18
includes a first portion 18A interposed between the first side
surface S1 and each of the first and second sidewalls SW1 and SW2,
and a second portion 18B interposed between the second side surface
S2 and each of the third and fourth sidewalls SW3 and SW4. Since
the first gap layer 18 is a portion of the gap section 17, one can
say that the gap section 17 includes the first and second portions
18A and 18B.
[0136] In the present embodiment, as shown in FIG. 1, the first
portion 18A of the first gap layer 18 and the nonmagnetic layer 55
are interposed between the first side surface S1 and a portion of
the second sidewall SW2, and the second portion 18B of the first
gap layer 18 and the nonmagnetic layer 55 are interposed between
the second side surface S2 and a portion of the fourth sidewall
SW4. On the other hand, the first portion 18A of the first gap
layer 18 is interposed between the first side surface S1 and each
of the entire first sidewall SW1 and the remaining portion of the
second sidewall SW2, but any portion of the nonmagnetic layer 55 is
not interposed therebetween. The second portion 18B of the first
gap layer 18 is interposed between the second side surface S2 and
each of the entire third sidewall SW3 and the remaining portion of
the fourth sidewall SW4, but any portion of the magnetic layer 55
is not interposed therebetween. The nonmagnetic layer 55 has the
function of magnetically separating the main pole 15 from the side
shields 16A and 16B at locations apart from the medium facing
surface 80.
[0137] In the present embodiment, the minimum distance between the
second sidewall SW2 and the first side surface S1 is equal to the
minimum distance between the first sidewall SW1 and the first side
surface S1, and the minimum distance between the fourth sidewall
SW4 and the second side surface S2 is equal to the minimum distance
between the third sidewall SW3 and the second side surface S2.
[0138] Reference is now made to FIG. 6, FIG. 9 and FIG. 10 to
describe the first and second coil portions 10 and 20 and the first
and second return path sections 30 and 40. As shown in FIG. 9, the
first coil portion 10 is wound approximately once around the
coupling section 33. The first coil portion 10 includes a first
coil element 11 extending to pass through the first space,
particularly through between the coupling section 32 and the
coupling section 33. A coil element refers to a portion of the
winding of a coil. The first coil portion 10 has a coil connection
10E electrically connected to the second coil portion 20.
[0139] As shown in FIG. 10, the second coil portion 20 is wound
approximately once around the coupling section 41. The second coil
portion 20 includes a second coil element 21 extending to pass
through the second space, particularly through between the coupling
section 41 and the coupling section 42.
[0140] The second coil portion 20 has a coil connection 20S
electrically connected to the coil connection 10E of the first coil
portion 10. The coil connection 20S is electrically connected to
the coil connection 10E via first and second connection layers of
columnar shape (not illustrated) that penetrate a plurality of
layers interposed between the first coil portion 10 and the second
coil portion 20. The first connection layer and the second
connection layer are stacked in this order on the coil connection
10E. The coil connection 20S lies on the second connection layer.
The first and second connection layers are each formed of a
conductive material such as copper. In the example shown in FIG. 9
and FIG. 10, the first coil portion 10 and the second coil portion
20 are connected in series.
[0141] As shown in FIG. 6, the first coil element 11 has a first
inclined surface 11a facing toward the medium facing surface 80.
The first inclined surface 11a has a front end portion closest to
the medium facing surface 80 and a rear end portion farthest from
the medium facing surface 80. The first inclined surface 11a is
inclined relative to the medium facing surface 80 and a direction
perpendicular to the medium facing surface 80 such that the rear
end portion is located closer to the top surface 1a (see FIG. 7 and
FIG. 8) of the substrate 1, that is, located at a lower position,
than is the front end portion. The coupling section 32 of the first
return path section 30 has an inclined surface opposed to the first
inclined surface 11a.
[0142] As shown in FIG. 6, the second coil element 21 has a second
inclined surface 21a facing toward the medium facing surface 80.
The second inclined surface 21a has a front end portion closest to
the medium facing surface 80 and a rear end portion farthest from
the medium facing surface 80. The second inclined surface 21a is
inclined relative to the medium facing surface 80 and a direction
perpendicular to the medium facing surface 80 such that the rear
end portion is located farther from the top surface 1a (see FIG. 7
and FIG. 8) of the substrate 1, that is, located at an upper
position, than is the front end portion. The coupling section 42 of
the second return path section 40 has an inclined surface opposed
to the second inclined surface 21a.
[0143] A manufacturing method for the magnetic head according to
the present embodiment will now be described. As shown in FIG. 2
and FIG. 3, the manufacturing method for the magnetic head
according to the present embodiment starts with forming the
insulating layer 2, the first read shield layer 3 and the first
read shield gap film 4 in this order into a stack on the substrate
1. Then, the MR element 5 and leads (not illustrated) connected to
the MR element 5 are formed on the first read shield gap film 4.
The MR element 5 and the leads are then covered with the second
read shield gap film 6. Next, the second read shield layer 7 and
the nonmagnetic layer 71 are formed in this order into a stack on
the second read shield gap film 6.
[0144] Next, the contact sensor 72 and a pair of leads (not
illustrated) connected to the contact sensor 72 are formed on the
nonmagnetic layer 71. The contact sensor 72 and the pair of leads
are then covered with the nonmagnetic layer 73. The nonmagnetic
layers 71 and 73 are then selectively etched, so that an opening
for exposing the top surface of the second read shield layer 7 is
formed through the nonmagnetic layers 71 and 73. Then, the magnetic
layer 74 is formed at the location of the opening. Then, the middle
shield 75 and the nonmagnetic layer 76 are formed in this order
into a stack over the nonmagnetic layer 73 and the magnetic layer
74.
[0145] Next, the yoke 31 is formed on the nonmagnetic layer 76 by
frame plating, for example. Then, the insulating layer 51 is formed
over the entire top surface of the stack. The insulating layer 51
is then polished by, for example, chemical mechanical polishing
(hereinafter referred to as CMP), until the yoke 31 is exposed.
Next, the coupling section 32 is formed on the yoke 31 and the
insulating layer 51, and the coupling section 33 is formed on the
yoke 31. For example, frame plating is employed to form the
coupling section 33.
[0146] The coupling section 32 is formed in the following manner,
for example. First, an initial coupling section which will later
become the coupling section 32 is formed by frame plating, for
example, Then, a photoresist mask is formed to cover a portion of
the initial coupling section. The photoresist mask is formed by
patterning a photoresist layer. Then, using the photoresist mask as
an etching mask, a portion of the initial coupling section is
taper-etched by, for example, ion beam etching (hereinafter
referred to as IBE) so as to provide the initial coupling section
with the aforementioned inclined surface of the coupling section
32. This makes the initial coupling section into the coupling
section 32. The photoresist mask is then removed.
[0147] The manufacturing method for the magnetic head according to
the present embodiment then proceeds to forming the insulating film
52 over the entire top surface of the stack by atomic layer
deposition (ALD), for example. Next, a first initial coil portion,
which will later become the first coil portion 10, is formed on the
insulating film 52 by frame plating, for example. The first initial
coil portion is formed such that a portion thereof rides over the
coupling sections 32 and 33. The first initial coil portion, the
coupling sections 32 and 33, the insulating film 52 and the
non-illustrated insulating layer are then polished by CMP, for
example. This makes the first initial coil portion into the first
coil portion 10. Next, the insulating layer 53 is formed over the
entire top surface of the stack. The insulating layer 53 is then
selectively etched to form therein a first opening for exposing the
top surface of the coupling section 32, a second opening for
exposing the top surface of the coupling section 33, and a third
opening for exposing the coil connection 10E (see FIG. 9) of the
first coil portion 10.
[0148] Next, an initial bottom shield is formed on the coupling
section 32 at the location of the first opening, the coupling
section 34 is formed on the coupling section 33 at the location of
the second opening, and the first connection layer (not
illustrated) is formed on the coil connection 10E at the location
of the third opening, by performing frame plating, for example.
Next, the nonmagnetic layer 54 is formed over the entire top
surface of the stack. The nonmagnetic layer 54 is then polished by,
for example, CMP, until the initial bottom shield, the coupling
section 34 and the first connection layer are exposed. Next, the
initial bottom shield and the nonmagnetic layer 54 are taper-etched
in part by, for example, IBE to thereby provide the top surface of
the initial bottom shield with a portion to be opposed to the
inclined portion (see FIG. 6) of the bottom end 15L of the main
pole 15 to be formed later. This makes the initial bottom shield
into the bottom shield 16C. This etching process also etches the
coupling section 34 and the first connection layer in part.
[0149] A series of steps to be performed after the foregoing step
will now be described with reference to FIG. 11 to FIG. 17C. FIG.
11 to FIG. 17C each show a stack of layers formed in the process of
manufacturing the magnetic head. Each of FIG. 11, FIG. 13C, FIG.
14C, FIG. 15C and FIG. 17C shows the top surface of part of the
stack. Fig. nA (n is an integer between 12 and 17 inclusive) shows
a cross section of the stack taken at the location at which the
medium facing surface 80 is to be formed. Fig. nB shows a cross
section parallel to the main cross section and intersecting the
second sidewall SW2 to be formed later. In each of FIG. 11, FIG.
13C, FIG. 14C and FIG. 15C, the symbol "ABS" indicates the location
at which the medium facing surface 80 is to be formed.
[0150] FIG. 11 shows a step that follows the formation of the
bottom shield 16C. In this step, a magnetic layer 160 is formed
over the bottom shield 16C and the nonmagnetic layer 54 by frame
plating, for example. The magnetic layer 160 is patterned to have
the first sidewall SW1 of the first side shield 16A and the third
sidewall SW3 of the second side shield 16B. The magnetic layer 160
includes a first portion 160A and a second portion 160B separate
from each other. The first portion 160A has a sidewall 160Aa. The
sidewall 160Aa includes the first sidewall SW1. The second portion
160B has a sidewall 160Ba. The sidewall 160Ba includes the third
sidewall SW3.
[0151] FIG. 12A and FIG. 12B show the next step. FIG. 12B shows
part of a cross section taken along line 12B-12B of FIG. 11. In
this step, a planarization layer 81 is formed to cover the stack
including the magnetic layer 160. In the present embodiment, the
planarization layer 81 includes a first layer 81A formed of a resin
such as a photoresist and a second layer 81B formed of an inorganic
material such as alumina and lying on the first layer 81A. The
first layer 81A is formed such that its top surface is higher in
level than the top surface of the magnetic layer 160. The second
layer 81B is provided for preventing a mask to be formed on the
planarization layer 81 from losing its shape.
[0152] FIG. 13A to FIG. 13C show the next step. FIG. 13B shows part
of a cross section taken along line 13B-13B of FIG. 13C. In this
step, a mask 82 is formed on the planarization layer 81. FIG. 13C
omits the illustration of the planarization layer 81. As shown in
FIG. 13C, when viewed from above, the mask 82 covers the first
sidewall SW1 and the third sidewall SW3, and does not cover the
other portion of the sidewall 160Aa than the first sidewall SW1 or
the other portion of the sidewall 160Ba than the third sidewall
SW3. The mask 82 is formed by patterning a photoresist layer by
photolithography, for example.
[0153] FIG. 14A to FIG. 14C show the next step. FIG. 14B shows part
of a cross section taken along line 14B-14B of FIG. 14C. In this
step, first, the planarization layer 81 and the magnetic layer 160
are etched by, for example, IBE, using the mask 82. This step will
hereinafter be referred to as the etching step. In the etching
step, the magnetic layer 160 is partially etched so as to provide
the magnetic layer 160 with the second sidewall SW2 and the fourth
sidewall SW4. The second sidewall SW2 and the fifth sidewall SW5
are formed at the first portion 160A of the magnetic layer 160.
This makes the first portion 160A into a first initial side shield
16AP which will later become the first side shield 16A. The fourth
sidewall SW4 and the sixth sidewall SW6 are formed at the second
portion 160B of the magnetic layer 160. This makes the second
portion 160B into a second initial side shield 16BP which will
later become the second side shield 16B. Next, the planarization
layer 81 remaining after the etching and the mask 82 are removed.
FIG. 14C shows the stack having undergone the removal of the
planarization layer 81 and the mask 82.
[0154] FIG. 15A to FIG. 15C show the next step. FIG. 15B shows part
of a cross section taken along line 15B-15B of FIG. 15C. In this
step, the first gap layer 18 is formed over the entire top surface
of the stack. FIG. 15C omits the illustration of portions of the
first gap layer 18 that are formed on the first and second initial
side shields 16AP and 16BP. Where alumina is selected as the
material of the first gap layer 18, the first gap layer 18 is
formed by atomic layer deposition (ALD), for example. Where Ru is
selected as the material of the first gap layer 18, the first gap
layer 18 is formed by chemical vapor deposition (CVD), for example.
As described previously, the first gap layer 18 includes the first
and second portions 18A and 18B.
[0155] FIG. 16A and FIG. 16B show the next step. In this step,
first, the first gap layer 18 is selectively etched to form therein
an opening for exposing the top surface of the coupling section 34
(see FIG. 7) and an opening for exposing the top surface of the
first connection layer. Next, an initial main pole 15P, which will
later become the main pole 15, is formed on the first gap layer 18
and the coupling section 34, and the second connection layer (not
illustrated) is formed on the first connection layer. The initial
main pole 15P and the second connection layer are formed such that
their top surfaces are higher in level than portions of the first
gap layer 18 lying on the first and second initial side shields
16AP and 16BP.
[0156] FIG. 17A to FIG. 17C show the next step. FIG. 17B shows part
of a cross section taken along line 17B-17B of FIG. 17C. In this
step, first, the nonmagnetic layer 55 is formed over the entire top
surface of the stack. Next, the initial main pole 15P, the first
and second initial side shields 16AP and 16BP, the first gap layer
18, the nonmagnetic layer 55 and the second connection layer are
polished by, for example, CMP until the level of the top surface of
the initial main pole 15P reaches the level of the flat portion
15T2 (see FIG. 6) of the top surface 15T of the main pole 15. Then,
the nonmagnetic layer 58 (see FIG. 6 and FIG. 7) is formed on part
of the top surface of the initial main pole 15P. The initial main
pole 15P, the first and second initial side shields 16AP and 16BP,
the first gap layer 18 and the nonmagnetic layers 55 and 58 are
then etched in part by, for example, IBE so as to provide the
initial main pole 15P with the inclined portion 15T1. A portion of
the top surface of the etched initial main pole 15P, the portion
being covered with the nonmagnetic layer 58, makes the flat portion
15T2. FIG. 17C omits the illustration of the nonmagnetic layer
58.
[0157] FIG. 17C shows the first to sixth edges E1 to E6. The levels
of the first to sixth edges E1 to E6 in the second direction D2
(see FIG. 2) are defined by the polishing step and the etching step
described with reference to FIG. 17A to FIG. 17C.
[0158] Steps to follow the formation of the inclined portion 15T1
will now be described with reference to FIG. 7 and FIG. 8. First,
the second gap layer 19 is formed over the entire top surface of
the stack by sputtering or chemical vapor deposition, for example.
The nonmagnetic layer 60 is then formed on the second gap layer 19.
The nonmagnetic layer 60 may be formed by a lift-off process, or by
initially forming a nonmagnetic film on the second gap layer 19 and
then etching a portion of the nonmagnetic film. Next, the second
gap layer 19 is selectively etched by, for example, IBE so that the
top surfaces of the first and second initial side shields 16AP and
16BP are exposed in part. Then, the top shield 16D is formed over
the first and second initial side shields 16AP and 16BP, the second
gap layer 19 and the nonmagnetic layer 60 by frame plating, for
example. The top shield 16D, the second gap layer 19 and the
nonmagnetic layer 60 are then polished by, for example, CMP, until
the nonmagnetic layer 58 is exposed.
[0159] Next, the nonmagnetic layer 58 is selectively etched by, for
example, IBE, so that the flat portion 15T2 formed on the initial
main pole 15P is exposed in part. The coupling section 41 is then
formed on the initial main pole 15P by frame plating, for example.
Next, the first insulating film 61 is formed over the entire top
surface of the stack. The first insulating film 61 is then
selectively etched to form therein an opening for exposing the top
surface of the second connection layer. Next, a second initial coil
portion, which will later become the second coil portion 20, is
formed by frame plating, for example. The second initial coil
portion is formed such that a portion thereof rides over the
coupling section 41. Next, the second initial coil portion, the
coupling section 41 and the first insulating film 61 are polished
by CMP, for example. The second initial coil portion is then
taper-etched in part by, for example, IBE, so as to provide the
second initial coil portion with the second inclined surface 21a
(see FIG. 6). This makes the second initial coil portion into the
second coil portion 20.
[0160] Next, the first and second insulating films 61 and 62 are
selectively etched by, for example, reactive ion etching or IBE, so
that the top surfaces of the top shield 16D and the coupling
section 41 are exposed. The coupling section 42 is then formed over
the top shield 16D, the coupling section 41 and the second
insulating film 62 by frame plating, for example. Next, the
protective layer 70 is formed to cover the entire top surface of
the stack. Wiring, terminals and other components are then formed
on the protective layer 70, and the substrate 1 is cut near the
location ABS at which the medium facing surface 80 is to be formed.
Next, the cut surface is polished to form the medium facing surface
80 so that the first initial side shield 16AP becomes the first
side shield 16A, the second initial side shield 16BP becomes the
second side shield 16B, and the initial main pole 15P becomes the
main pole 15. Then, fabrication of flying rails and other processes
are performed to complete the magnetic head.
[0161] As has been described, the manufacturing method for the
magnetic head according to the present embodiment includes the
steps of: forming the first initial side shield 16AP and the second
initial side shield 16BP; forming the first and second portions 18A
and 18B of the gap section 17 after the first initial side shield
16AP and the second initial side shield 16BP are formed; forming
the initial main pole 15P and the first and second coil portions 10
and 20 of the coil after the first and second portions 18A and 18B
of the gap section 17 are formed; and forming the medium facing
surface 80. In the present embodiment, the step of forming the
first initial side shield 16AP and the second initial side shield
16BP includes: the step of forming the magnetic layer 160 having
the first sidewall SW1 and the third sidewall SW3; the step of
forming the planarization layer 81 after the magnetic layer 160 is
formed; the step of forming the mask 82 after the planarization
layer 81 is formed; and the etching step of partially etching the
magnetic layer 160 using the mask 82 after the mask 82 is formed,
so as to provide the magnetic layer 160 with the second sidewall
SW2 and the fourth sidewall SW4.
[0162] The specific functions and effects of the magnetic head
according to the present embodiment will now be described. In the
present embodiment, the write shield 16 includes the first side
shield 16A, the second side shield 16B, the bottom shield 16C and
the top shield 16D. The present embodiment makes it possible that,
in regions on opposite sides of the end face 15a of the main pole
15 in the track width direction TW and regions on the front and
rear sides in the direction T of travel of the recording medium 90
relative to the end face 15a of the main pole 15, a magnetic flux
that is produced from the end face 15a of the main pole 15 and
spreads in directions other than the direction perpendicular to the
plane of the recording medium 90 can be captured and thereby
prevented from reaching the recording medium 90. By virtue of this,
the present embodiment enables minimizing the occurrence of
unwanted erasure, thereby increasing the recording density.
[0163] In the present embodiment, in particular, the first and
second side shields 16A and 16B serves to minimize the spread in
the track width direction of the magnetic flux produced from the
end face 15a of the main pole 15. This results in increased track
density.
[0164] In the present embodiment, the first side shield 16A has the
first sidewall SW1, and the second side shield 16B has the third
sidewall SW3. Part of the first side surface S1 of the main pole 15
is opposed to the first sidewall SW1, and part of the second side
surface S2 of the main pole 15 is opposed to the third sidewall
SW3. The first sidewall SW1 has the first edge E1, and the third
sidewall SW3 has the third edge E3. The distance between the rear
end E1b of the first edge E1 and the rear end E3b of the third edge
E3 in the track width direction TW is greater than the distance
between the front end E1a of the first edge E1 and the front end
E3a of the third edge E3 in the track width direction TW. By virtue
of this, the present embodiment allows the main pole 15 to have a
large cross-sectional area in the vicinity of the medium facing
surface 80 while allowing the end face 15a of the main pole 15
located in the medium facing surface 80 to be small in width. As a
result, the present embodiment achieves higher track density and
improved write characteristics.
[0165] In the present embodiment, in the medium facing surface 80
the distance between the first sidewall SW1 and the third sidewall
SW3 in the track width direction TW decreases toward the top
surface 1a of the substrate 1. Thus, in the present embodiment the
width of the end face 15a of the main pole 15 decreases toward the
top surface 1a of the substrate 1. This configuration enables
minimizing the occurrence of unwanted erasure induced by a skew,
thereby increasing the track density.
[0166] In the present embodiment, the first side shield 16A further
has the second sidewall SW2, and the second side shield 16B further
has the fourth sidewall SW4. If the second and fourth sidewalls SW2
and SW4 were not provided, the fifth sidewall SW5 and the sixth
sidewall SW6 would be connected to the first sidewall SW1 and the
third sidewall SW3, respectively. In such a case, the first and
second side shields 16A and 16B would become smaller in volume and
thus become more susceptible to saturation of magnetic flux.
[0167] In the present embodiment, in contrast, the distance between
the second edge E2 of the second sidewall SW2 and the fourth edge
E4 of the fourth sidewall SW4 in the track width direction TW
increases with increasing distance from the medium facing surface
80. This can prevent the occurrence of magnetic flux saturation in
the first and second side shields 16A and 16B and thereby allow the
the first and second side shields 16A and 16B to perform their
function satisfactorily. As a result, the present embodiment
provides higher track density.
[0168] By virtue of the foregoing, the present embodiment achieves
both of improved write characteristics and increased recording
density.
[0169] In the present embodiment, the second and fourth sidewalls
SW2 and SW4 are formed through the etching step that has been
described with reference to FIG. 14A to FIG. 14C. More
specifically, the position of the front end E2a of the second edge
E2 and the position of the front end E4a of the fourth edge E4 are
defined by etching. The present embodiment thus makes it possible
to accurately define the positions of the front end E2a of the
second edge E2 and the front end E4a of the fourth edge E4, and to
bring the front end E2a of the second edge E2 and the front end E4a
of the fourth edge E4 close to the medium facing surface 80.
According to the present embodiment, bringing the front end E2a of
the second edge E2 and the front end E4a of the fourth edge E4
close to the medium facing surface 80 results in a larger
cross-sectional area of the main pole 15 in the vicinity of the
medium facing surface 80.
Second Embodiment
[0170] A magnetic head according to a second embodiment of the
present invention will now be described with reference to FIG. 18.
FIG. 18 is a perspective view showing part of a main pole and first
and second side shields in the vicinity of a medium facing surface
in the magnetic head according to the present embodiment.
[0171] In the present embodiment, the shapes of the main pole 15
and the first and second side shields 16A and 16B are different
from those in the first embodiment. In the present embodiment, the
projecting portion of the first edge E1 of the first sidewall SW1
of the first side shield 16A projecting toward the main pole 15 is
a corner and its surroundings located closer to the main pole 15
relative to a straight line connecting the front end E1a and the
rear end E1b. The second edge E2 of the second sidewall SW2 of the
first side shield 16A is shaped into a curve concaved away from the
main pole 15. The fifth edge E5 of the fifth sidewall SW5 of the
first side shield 16A includes a first edge portion, a second edge
portion and a third edge portion arranged in this order, the first
edge portion being closest to the second edge E2 of the second
sidewall SW2. The first and third edge portions are parallel to the
medium facing surface 80. The second edge portion is inclined
relative to the first direction D1 which is perpendicular to the
medium facing surface 80. Part of the first side surface S1 of the
main pole 15 has a shape corresponding to the first and second
sidewalls SW1 and SW2 of the present embodiment.
[0172] In the present embodiment, the projecting portion of the
third edge E3 of the third sidewall SW3 of the second side shield
16B projecting toward the main pole 15 is a corner and its
surroundings located closer to the main pole 15 relative to a
straight line connecting the front end E3a and the rear end E3b.
The fourth edge E4 of the fourth sidewall SW4 of the second side
shield 16B is shaped into a curve concaved away from the main pole
15. The sixth edge E6 of the sixth sidewall SW6 of the second side
shield 16B includes a fourth edge portion, a fifth edge portion and
a sixth edge portion arranged in this order, the fourth edge
portion being closest to the fourth edge E4 of the fourth sidewall
SW4. The fourth and sixth edge portions are parallel to the medium
facing surface 80. The fifth edge portion is inclined relative to
the first direction D1. Part of the second side surface S2 of the
main pole 15 has a shape corresponding to the third and fourth
sidewalls SW3 and SW4 of the present embodiment.
[0173] Reference is now made to FIG. 19 and FIG. 20 to describe a
manufacturing method for the magnetic head according to the present
embodiment. FIG. 19 and FIG. 20 each show a stack of layers formed
in the process of manufacturing the magnetic head. Each of FIG. 19
and FIG. 20 shows part of the stack.
[0174] The manufacturing method for the magnetic head according to
the present embodiment is the same as the method according to the
first embodiment up to the step of forming the bottom shield 16C.
FIG. 19 shows the next step. In this step, first, a magnetic layer
260 is formed over the bottom shield 16C and the nonmagnetic layer
54 by frame plating, for example. The magnetic layer 260 is
patterned to include a portion of the first sidewall SW1 of the
first side shield 16A and a portion of the third sidewall SW3 of
the second side shield 16B. The magnetic layer 260 includes a first
portion 260A and a second portion 260B separate from each other.
Next, a first planarization layer (not illustrated) is formed to
cover the stack including the magnetic layer 260. The first
planarization layer has the same configuration as that of the
planarization layer 81 of the first embodiment. Next, a first mask
(not illustrated) is formed on the first planarization layer. When
viewed from above, the first mask covers part of the sidewall of
the first portion 260A and part of the sidewall of the second
portion 260B. The first mask is formed by patterning a photoresist
layer by photolithography, for example.
[0175] Next, the first planarization layer and the magnetic layer
260 are etched by, for example, IBE, using the first mask. This
step will hereinafter be referred to as the first etching step. The
first portion 260A after the etching has a sidewall 260Aa covered
by the first mask, and a sidewall 260Ab formed by the etching. The
sidewall 260Aa includes part of the first sidewall SW1. The
sidewall 260Ab includes the fifth sidewall SW5. The second portion
260B after the etching includes a sidewall 260Ba covered by the
first mask, and a sidewall 260Bb formed by the etching. The
sidewall 260Ba includes part of the third sidewall SW3. The
sidewall 260Bb includes the sixth sidewall SW6.
[0176] Next, the first planarization layer remaining after the
etching and the first mask are removed. Then, a second
planarization layer (not illustrated) is formed to cover the stack
including the magnetic layer 260. The second planarization layer
has the same configuration as that of the planarization layer 81 of
the first embodiment. Next, a second mask 83 is formed on the
second planarization layer. In FIG. 19 the region denoted by
reference numeral 83 represents the shape of the bottom surface of
the second mask 83. When viewed from above, the second mask 83 does
not cover part of any of the sidewalls 260Aa, 260Ab, 260Ba and
260Bb. The second mask 83 is formed by patterning a photoresist
layer by photolithography, for example.
[0177] FIG. 20 shows the next step. In this step, first, the second
planarization layer and the magnetic layer 260 are etched by, for
example, IBE, using the second mask 83. This step will hereinafter
be referred to as the second etching step. In the second etching
step, the magnetic layer 260 is partially etched so as to provide
the magnetic layer 260 with the second sidewall SW2 and the fourth
sidewall SW4, and also the rest of each of the first sidewall SW1
and the third sidewall SW3. This makes the first portion 260A into
a first initial side shield 16AP which will later become the first
side shield 16A, and makes the second portion 260B into a second
initial side shield 16BP which will later become the second side
shield 16B.
[0178] Next, the second planarization layer remaining after the
etching and the second mask 83 are removed. Then, the first gap
layer 18 is formed over the entire top surface of the stack. The
subsequent steps are the same as those in the first embodiment.
[0179] In the present embodiment, the second and fourth sidewalls
SW2 and SW4 are formed through the second etching step. More
specifically, the position of the front end E2a of the second edge
E2 and the position of the front end E4a of the fourth edge E4 are
defined by etching. Thus, like the first embodiment, the present
embodiment makes it possible to accurately define the positions of
the front end E2a of the second edge E2 and the front end E4a of
the fourth edge E4, and to bring the front end E2a of the second
edge E2 and the front end E4a of the fourth edge E4 close to the
medium facing surface 80.
Modification Examples
[0180] A first and a second modification example of the magnetic
head according to the present embodiment will now be described.
First, the first modification example will be described with
reference to FIG. 21 and FIG. 22. FIG. 21 is a perspective view
showing part of the main pole 15 and the first and second side
shields 16A and 16B in the vicinity of the medium facing surface 80
in the first modification example. FIG. 22 is a plan view showing
part of the main pole 15 and the first and second side shields 16A
and 16B in the vicinity of the medium facing surface 80 in the
first modification example.
[0181] In the first modification example, the projecting portion of
the first edge E1 of the first sidewall SW1 of the first side
shield 16A projecting toward the main pole 15 is a curved portion
passing through a portion closer to the main pole 15 relative to
the straight line connecting the front end E1a and the rear end
E1b. The second edge E2 of the second sidewall SW2 of the first
side shield 16A also includes a curved portion projecting toward
the main pole 15, as does the first edge E1.
[0182] In the first modification example, the projecting portion of
the third edge E3 of the third sidewall SW3 of the second side
shield 16B projecting toward the main pole 15 is a curved portion
passing through a portion closer to the main pole 15 relative to
the straight line connecting the front end E3a and the rear end
E3b. The fourth edge E4 of the fourth sidewall SW4 of the second
side shield 16B also includes a curved portion projecting toward
the main pole 15, as does the third edge E3.
[0183] The positions of the front end E2a of the second edge E2 and
the front end E4a of the fourth edge E4 in the first modification
example will now be described in detail. FIG. 23 is an explanatory
diagram illustrating a portion of the first contour line L1 formed
by the first edge E1 and the second edge E2. As shown in FIG. 23,
assume a first point P1 on the first contour line L1. As has been
described in relation to the first embodiment, the angle of
inclination .theta.1 of the first contour line L1 relative to the
first direction D1 at the first point P1 varies with varying
position of the first point P1. In the first modification example,
the front end E2a of the second edge E2 is a corner at which there
occurs a change in the angle of inclination .theta.1 when the first
point P1 is shifted from the first edge E1 to the second edge E2,
the change being a decrease.
[0184] Although not illustrated, assume a second point P2 on the
second contour line L2 similarly to the first point P1. The angle
of inclination .theta.2 of the second contour line L2 relative to
the first direction D1 at the second point P2 varies with varying
position of the second point P2. In the first modification example,
the front end E4a of the fourth edge E4 is a corner at which there
occurs a change in the angle of inclination .theta.2 when the
second point P2 is shifted from the third edge E3 to the fourth
edge E4, the change being a decrease.
[0185] Next, the second modification example will be described with
reference to FIG. 24. FIG. 24 is a plan view showing part of the
main pole 15 and the first and second side shields 16A and 16B in
the vicinity of the medium facing surface 80 in the second
modification example. In the second modification example, the first
edge E1 of the first sidewall SW1 of the first side shield 16A
includes a curved portion (hereinafter referred to as the first
curved portion) projecting toward the the main pole 15, and a first
linear portion. The first curved portion includes the front end E1a
of the first edge E1. The first linear portion includes the rear
end E1b of the first edge E1 and is parallel to the medium facing
surface 80.
[0186] In the second modification example, the third edge E3 of the
third sidewall SW3 of the second side shield 16B includes a curved
portion (hereinafter referred to as the second curved portion)
projecting toward the the main pole 15, and a second linear
portion. The second curved portion includes the front end E3a of
the third edge E3. The second linear portion includes the rear end
E3b of the third edge E3 and is parallel to the medium facing
surface 80.
[0187] The remainder of configuration, function and effects of the
present embodiment are similar to those of the first
embodiment.
Third Embodiment
[0188] A magnetic head according to a third embodiment of the
present invention will now be described with reference to FIG. 25.
FIG. 25 is a plan view of part of a main pole and first and second
side shields in the vicinity of a medium facing surface in the
magnetic head according to the present embodiment.
[0189] In the present embodiment, the first and second side shields
16A and 16B are configured differently than in the first
embodiment. In the present embodiment, the first side shield 16A
includes a first magnetic layer 161 and a second magnetic layer
162. The first magnetic layer 161 has the first end face 16Aa and
the first sidewall SW1. The second magnetic layer 162 has the
second sidewall SW2 and the fifth sidewall SW5. The first end face
16Aa and the first, second and fifth sidewalls SW1, SW2 and SW5 are
shaped and located basically in the same manner as in the first
embodiment. In the present embodiment, however, the first angle
that the first sidewall SW1 forms with the second direction D2
which is perpendicular to the top surface 1a (see FIG. 7 and FIG.
8) of the substrate 1 is substantially constant regardless of
distance from the medium facing surface 80.
[0190] The first magnetic layer 161 further has a seventh sidewall
SW7, the seventh sidewall SW7 being contiguous with the first
sidewall SW1 and in contact with the second magnetic layer 162. The
seventh sidewall SW7 is inclined relative to the second direction
D2, as is the first sidewall SW1.
[0191] In the present embodiment, the second side shield 16B
includes a third magnetic layer 163 and a fourth magnetic layer
164. The third magnetic layer 163 has the second end face 16Ba and
the third sidewall SW3. The fourth magnetic layer 164 has the
fourth sidewall SW4 and the sixth sidewall SW6. The second end face
16Ba and the third, fourth and sixth sidewalls SW3, SW4 and SW6 are
shaped and located basically in the same manner as in the first
embodiment. In the present embodiment, however, the third angle
that the third sidewall SW3 forms with the second direction D2 is
substantially constant regardless of distance from the medium
facing surface 80.
[0192] The third magnetic layer 163 further has an eighth sidewall
SW8, the eighth sidewall SW8 being contiguous with the third
sidewall SW3 and in contact with the fourth magnetic layer 164. The
eighth sidewall SW8 is inclined relative to the second direction
D2, as is the third sidewall SW3.
[0193] The first magnetic layer 161 and the second magnetic layer
162 may be formed of the same material or different materials. The
first magnetic layer 161 and the second magnetic layer 162 may have
equal saturation flux densities. Alternatively, the second magnetic
layer 162 may be higher or lower in saturation flux density than
the first magnetic layer 161. The third magnetic layer 163 and the
fourth magnetic layer 164 may be formed of the same material or
different materials. The third magnetic layer 163 and the fourth
magnetic layer 164 may have equal saturation flux densities.
Alternatively, the fourth magnetic layer 164 may be higher or lower
in saturation flux density than the third magnetic layer 163.
[0194] If the saturation flux densities of the first and third
magnetic layers 161 and 163 are relatively reduced by making the
saturation flux densities of the second and fourth magnetic layers
162 and 164 higher than those of the first and third magnetic
layers 161 and 163, respectively, it becomes possible to prevent
saturation of magnetic flux in the first and second side shields
16A and 16B by using the second and fourth magnetic layers 162 and
164, while reducing leakage of magnetic flux from the main pole 15
to the first and third magnetic layers 161 and 163 in the vicinity
of the medium facing surface 80.
[0195] If the distances DE1 and DE2 are small whereas the distances
DE3 and DE4 are great, saturation of magnetic flux is likely to
occur in a portion of the first magnetic layer 163 that extends
from the medium facing surface 80 to the first sidewall SW1 and in
a portion of the third magnetic layer 163 that extends from the
medium facing surface 80 to the third sidewall SW3. In such a case,
it is preferred that the saturation flux densities of the first and
third magnetic layers 161 and 163 be relatively increased by making
the saturation flux densities of the second and fourth magnetic
layers 162 and 164 lower than those of the first and third magnetic
layers 161 and 163, respectively. By doing so, it becomes possible
to prevent saturation of magnetic flux in the first and second side
shields 16A and 16B.
[0196] Whether to relatively decrease or increase the saturation
flux densities of the first and third magnetic layers 161 and 163
can be appropriately selected depending on how great the distances
DE1, DE2, DE3 and DE4 are.
[0197] The positions of the front end E2a of the second edge E2 and
the front end E4a of the fourth edge E4 in the present embodiment
will now be described in detail. As has been described in relation
to the first embodiment, the first edge E1 of the first sidewall
SW1 and the second edge E2 of the second sidewall SW2 constitute a
first contour line L1. Assume a first point P1 on the first contour
line L1 as in the first embodiment. The angle of inclination
.theta.1 of the first contour line L1 relative to the first
direction D1, which is perpendicular to the medium facing surface
80, at the first point P1 varies with varying position of the first
point P1. In the present embodiment, the front end E2a of the
second edge E2 is a corner at which there occurs a change in the
angle of inclination .theta.1 when the first point P1 is shifted
from the first edge E1 to the second edge E2, the change being a
decrease.
[0198] The third edge E3 of the third sidewall SW3 and the fourth
edge E4 of the fourth sidewall SW4 constitute a second contour line
L2. Assume a second point P2 on the second contour line L2 as in
the first embodiment. The angle of inclination .theta.2 of the
second contour line L2 relative to the first direction D1 at the
second point P2 varies with varying position of the second point
P2. In the present embodiment, the front end E4a of the fourth edge
E4 is a corner at which there occurs a change in the angle of
inclination .theta.2 when the second point P2 is shifted from the
third edge E3 to the fourth edge E4, the change being a
decrease.
[0199] A manufacturing method for the magnetic head according to
the present embodiment will now be described with reference to FIG.
26 to FIG. 31. FIG. 26 to FIG. 31 each show a stack of layers
formed in the process of manufacturing the magnetic head. Each of
FIG. 26 to FIG. 31 shows part of the top surface of the stack. In
FIG. 26 to FIG. 31 the symbol "ABS" indicates the location at which
the medium facing surface 80 is to be formed.
[0200] The manufacturing method for the magnetic head according to
the present embodiment is the same as the method according to the
first embodiment up to the step of forming the bottom shield 16C.
FIG. 26 shows the next step. In this step, a mask 84 is formed over
the bottom shield 16C and the nonmagnetic layer 54 (see FIG. 7).
The mask 84 includes an accommodation section 84a in which the
first magnetic layer 161 is to be accommodated later, and an
accommodation section 84b in which the third magnetic layer 163 is
to be accommodated later. The accommodation section 84a has a wall
face corresponding to the first and seventh sidewalls SW1 and SW7.
The accommodation section 84b has a wall face corresponding to the
third and eighth sidewalls SW3 and SW8. The mask 84 is formed by
patterning a photoresist layer by photolithography, for
example.
[0201] FIG. 27 shows the next step. In this step, first, the first
magnetic layer 161 is formed in the accommodation section 84a of
the mask 84, and the third magnetic layer 163 is formed in the
accommodation section 84b of the mask 84. The first magnetic layer
161 and the third magnetic layer 163 may be formed by plating or
sputtering. The first magnetic layer 161 has the first sidewall SW1
and the seventh sidewall SW7. The third magnetic layer 163 has the
third sidewall SW3 and the eighth sidewall SW8. The mask 84 is then
removed.
[0202] FIG. 28 shows the next step. In this step, a mask 85 is
formed over the first magnetic layer 161, the third magnetic layer
163, the bottom shield 16C and the nonmagnetic layer 54. The mask
85 includes an accommodation section 85a in which the second
magnetic layer 162 is to be accommodated later, and an
accommodation section 85b in which the fourth magnetic layer 164 is
to be accommodated later. The accommodation section 85a has a wall
face corresponding to the second and fifth sidewalls SW2 and SW5.
The accommodation section 85b has a wall face corresponding to the
fourth and sixth sidewalls SW4 and SW6. The mask 85 is formed by
patterning a photoresist layer by photolithography, for
example.
[0203] FIG. 29 shows the next step. In this step, first, the second
magnetic layer 162 is formed in the accommodation section 85a of
the mask 85, and the fourth magnetic layer 164 is formed in the
accommodation section 85b of the mask 85. The second magnetic layer
162 and the fourth magnetic layer 164 may be formed by plating or
sputtering. The second magnetic layer 162 has the second sidewall
SW2 and the fifth sidewall SW5. The fourth magnetic layer 164 has
the fourth sidewall SW4 and the sixth sidewall SW6. The mask 85 is
then removed.
[0204] By forming the second magnetic layer 162 and the fourth
magnetic layer 164 in the step of FIG. 29, a first initial side
shield 16AP and a second initial side shield 16BP are completed.
The first initial side shield 16AP becomes the first side shield
16A later. The second initial side shield 16BP becomes the second
side shield 16B later. The first initial side shield 16AP includes
the first magnetic layer 161 and the second magnetic layer 162. The
second initial side shield 16BP includes the third magnetic layer
163 and the fourth magnetic layer 164.
[0205] FIG. 30 shows the next step. In this step, the first gap
layer 18 is formed over the entire top surface of the stack. FIG.
30 omits the illustration of portions of the first gap layer 18
that are formed on the first and second initial side shields 16AP
and 16BP. The first gap layer 18 is formed by the same method as in
the first embodiment.
[0206] FIG. 31 shows the next step. In this step, first, the first
gap layer 18 is selectively etched to form therein an opening for
exposing the top surface of the coupling section 34 (see FIG. 7)
and an opening for exposing the top surface of the first connection
layer which has been described in relation to the first embodiment.
Next, an initial main pole 15P, which will later become the main
pole 15, is formed on the first gap layer 18 and the coupling
section 34, and the second connection layer (not illustrated) is
formed on the first connection layer. Next, the initial main pole
15P, the first and second initial side shields 16AP and 16BP, the
first gap layer 18, the nonmagnetic layer 55 and the second
connection layer are polished by, for example, CMP until the level
of the top surface of the initial main pole 15P reaches the level
of the flat portion 15T2 (see FIG. 6) of the top surface 15T of the
main pole 15. The subsequent steps are the same as those in the
first embodiment.
Modification Example
[0207] Reference is now made to FIG. 32 to describe a modification
example of the magnetic head according to the present embodiment.
FIG. 32 is a plan view showing part of the main pole 15 and the
first and second side shields 16A and 16B in the vicinity of the
medium facing surface 80 in the modification example. In the
modification example, the first portion 18A of the first gap layer
18 and the nonmagnetic layer 55 are interposed between the entire
second sidewall SW2 and the first side surface S1, and the second
portion 18B of the first gap layer 18 and the nonmagnetic layer 55
are interposed between the entire fourth sidewall SW4 and the
second side surface S2. As a result, in the modification example,
the minimum distance between the second sidewall SW2 and the first
side surface S1 is greater than the minimum distance between the
first sidewall SW1 and the first side surface S1, and the minimum
distance between the fourth sidewall SW4 and the second side
surface S2 is greater than the minimum distance between the third
sidewall SW3 and the second side surface S2.
[0208] The modification example enables reducing or eliminating the
leakage of magnetic flux from the main pole 15 to the first and
second side shields 16A and 16B.
[0209] The present embodiment cannot provide the effect resulting
from forming the second and fourth sidewalls SW2 and SW4 by
etching, which has been described in relation to the first
embodiment. The remainder of configuration, function and effects of
the present embodiment are similar to those of the first
embodiment.
Fourth Embodiment
[0210] A magnetic head according to a fourth embodiment of the
present invention will now be described with reference to FIG. 33.
FIG. 33 is a plan view of part of a main pole and first and second
side shields in the vicinity of a medium facing surface in the
magnetic head according to the present embodiment. In the present
embodiment, the first sidewall SW1 and the third sidewall SW3 are
configured differently than in the third embodiment.
[0211] In the present embodiment, as shown in FIG. 33, the first
sidewall SW1 includes a first front portion SW11 connected to the
first end face 16Aa, and a first rear portion SW12 connected to the
second sidewall SW2. The third sidewall SW3 includes a second front
portion SW31 connected to the second end face 16Ba, and a second
rear portion SW32 connected to the fourth sidewall SW4.
[0212] An angle that the first rear portion SW12 forms with the
second direction D2 which is perpendicular to the top surface 1a
(see FIG. 7 and FIG. 8) of the substrate 1 is smaller than an angle
that the first front portion SW11 forms with the second direction
D2. An angle that the second rear portion SW32 forms with the
second direction D2 is smaller than an angle that the second front
portion SW31 forms with the second direction D2.
[0213] A manufacturing method for the magnetic head according to
the present embodiment will now be described with reference to FIG.
34 to FIG. 38. FIG. 34 to FIG. 38 each show a stack of layers
formed in the process of manufacturing the magnetic head. Each of
FIG. 34 to FIG. 38 shows part of the top surface of the stack. In
FIG. 34 to FIG. 38 the symbol "ABS" indicates the location at which
the medium facing surface 80 is to be formed.
[0214] The manufacturing method for the magnetic head according to
the present embodiment is the same as the method according to the
third embodiment up to the step of forming the bottom shield 16C.
FIG. 34 shows the next step. In this step, a mask 86 is formed over
the bottom shield 16C and the nonmagnetic layer 54 (see FIG. 7).
The mask 86 includes an accommodation section 86a in which an
initial first magnetic layer is to be accommodated later, and an
accommodation section 86b in which an initial third magnetic layer
is to be accommodated later. The mask 86 is formed by patterning a
photoresist layer by photolithography, for example.
[0215] FIG. 35 shows the next step. In this step, first, the
initial first magnetic layer 161P having a sidewall 161Pa is formed
in the accommodation section 86a of the mask 86, and the initial
third magnetic layer 163P having a sidewall 163Pa is formed in the
accommodation section 86b of the mask 86. The sidewall 161Pa
includes the first front portion SW11 of the first sidewall SW1.
The sidewall 163Pa includes the second front portion SW31 of the
third sidewall SW3. The initial first magnetic layer 161P and the
initial third magnetic layer 163P may be formed by plating or
sputtering. Next, the mask 86 is removed.
[0216] FIG. 36 shows the next step. In this step, a mask 87 is
formed over the initial first magnetic layer 161P, the initial
third magnetic layer 163P, the bottom shield 16C and the
nonmagnetic layer 54. The mask 87 covers the first front portion
SW11 and the second front portion SW31 of the sidewalls 161Pa and
163Pa, and does not cover the other portions of the sidewalls 161Pa
and 163Pa.
[0217] FIG. 37 shows the next step. In this step, first, part of
the initial first magnetic layer 161P and part of the initial third
magnetic layer 163P are etched using the mask 87 by IBE, for
example. As a result of this etching, the initial first magnetic
layer 161P is provided with the first rear portion SW12 of the
first sidewall SW1 and the seventh sidewall SW7, and the initial
third magnetic layer 163P is provided with the second rear portion
SW32 of the third sidewall SW3 and the eighth sidewall SW8. This
makes the initial first magnetic layer 161P into the first magnetic
layer 161, and makes the initial third magnetic layer 163P into the
third magnetic layer 163. Next, the mask 87 is removed.
[0218] FIG. 38 shows the next step. In this step, the second and
fourth magnetic layers 162 and 164 are formed in the same manner as
in the third embodiment. The subsequent steps are the same as those
of the third embodiment.
[0219] In the present embodiment, the first rear portion SW12 is
formed in the step of FIG. 37 such that the first rear portion SW12
forms a smaller angle with the second direction D2 than does the
first front portion SW11. Further, the second rear portion SW32 is
formed in the step of FIG. 37 such that the second rear portion
SW32 forms a smaller angle with the second direction D2 than does
the second front portion SW31.
[0220] Further, in the present embodiment, the second and fourth
sidewalls SW2 and SW4 are formed by etching. More specifically, the
position of the front end E2a of the second edge E2 and the
position of the front end E4a of the fourth edge E4 are defined by
etching. Thus, the present embodiment makes it possible to
accurately define the positions of the front end E2a of the second
edge E2 and the front end E4a of the fourth edge E4, and to bring
the front end E2a of the second edge E2 and the front end E4a of
the fourth edge E4 close to the medium facing surface 80.
[0221] The remainder of configuration, function and effects of the
present embodiment are similar to those of the third
embodiment.
[0222] The present invention is not limited to the foregoing
embodiments, and various modifications may be made thereto. For
example, as far as the requirements of the appended claims are met,
the shapes and locations of the main pole 15, the first side shield
16A and the second side shield 16B are not limited to the
respective examples illustrated in the foregoing embodiments, and
can be freely chosen.
[0223] Obviously, many modifications and variations of the present
invention are possible in the light of the above teachings. Thus,
it is to be understood that, within the scope of the appended
claims and equivalents thereof, the invention may be practiced in
other than the foregoing most preferable embodiments.
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