U.S. patent application number 16/192018 was filed with the patent office on 2019-07-18 for power tube connection structure of power amplifier and power amplifier.
The applicant listed for this patent is Huawei Technologies Co., Ltd.. Invention is credited to Songlin LI, Pengbo TIAN, Qingyun WANG, Liang XU.
Application Number | 20190223293 16/192018 |
Document ID | / |
Family ID | 53432113 |
Filed Date | 2019-07-18 |
![](/patent/app/20190223293/US20190223293A1-20190718-D00000.png)
![](/patent/app/20190223293/US20190223293A1-20190718-D00001.png)
![](/patent/app/20190223293/US20190223293A1-20190718-D00002.png)
![](/patent/app/20190223293/US20190223293A1-20190718-D00003.png)
United States Patent
Application |
20190223293 |
Kind Code |
A1 |
LI; Songlin ; et
al. |
July 18, 2019 |
POWER TUBE CONNECTION STRUCTURE OF POWER AMPLIFIER AND POWER
AMPLIFIER
Abstract
A power tube connection structure includes a substrate, a
printed circuit board, and a power tube, where a through groove
allowing the power tube to pass through is cut into the printed
circuit board, a mounting groove is cut into the upper surface of
the substrate at a location corresponding to the through groove,
one end of the power tube extends through the through groove, and
is welded onto a bottom face of the mounting groove, the end of the
power tube that extends into the mounting groove abuts onto a side
wall of the mounting groove close to an output end of the power
amplifier, and a solder flux escape channel is made into the side
wall of the mounting groove close to the output end of the power
amplifier.
Inventors: |
LI; Songlin; (Shenzhen,
CN) ; TIAN; Pengbo; (Xi'an, CN) ; WANG;
Qingyun; (Xi'an, CN) ; XU; Liang; (Shanghai,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Huawei Technologies Co., Ltd. |
Shenzhen |
|
CN |
|
|
Family ID: |
53432113 |
Appl. No.: |
16/192018 |
Filed: |
November 15, 2018 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
15676352 |
Aug 14, 2017 |
10165687 |
|
|
16192018 |
|
|
|
|
PCT/CN2016/073380 |
Feb 3, 2016 |
|
|
|
15676352 |
|
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H03F 3/22 20130101; H05K
3/3442 20130101; H05K 2201/09036 20130101; H05K 2203/1178 20130101;
H05K 1/183 20130101 |
International
Class: |
H05K 1/18 20060101
H05K001/18; H03F 3/22 20060101 H03F003/22 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 15, 2015 |
CN |
201520112293.2 |
Claims
1. A circuit, comprising: a substrate; a printed circuit board
covering an upper surface of the substrate; and a power tube of a
power amplifier; wherein the printed circuit board comprises a
through groove configured to allow the power tube to pass through;
wherein the substrate comprises a mounting groove cut into the
upper surface of the substrate at a location that corresponds to
the through groove; wherein one end of the power tube extends
through the through groove, is welded to a bottom face of the
mounting groove, and abuts a side wall of the mounting groove; and
wherein the mounting groove comprises a solder flux escape channel
disposed in the side wall of the mounting groove.
2. The circuit according to claim 1, wherein an output end of the
power amplifier is arranged against the side wall of the mounting
groove.
3. The circuit according to claim 1, wherein the solder flux escape
channel comprises a first opening disposed in the side wall of the
mounting groove; and wherein there is a gap between an inner wall
of the through groove in the printed circuit board and an outer
wall of the power tube.
4. The circuit according to claim 3, wherein the power tube
comprises a pin disposed over an upper surface of the printed
circuit board, and the pin comprises a through hole at a location
that corresponds to the first opening.
5. The circuit according to claim 3, wherein the first opening is a
semi-circular opening perpendicular to the bottom face of the
mounting groove.
6. The circuit according to claim 1, wherein the solder flux escape
channel comprises a first opening disposed in the side wall of the
mounting groove; and wherein the printed circuit board comprises a
second opening at a location that corresponds to the first
opening.
7. The circuit according to claim 6, wherein the power tube
comprises a pin disposed over an upper surface of the printed
circuit board, and the pin comprises a through hole at a location
that corresponds to the first opening.
8. The circuit according to claim 6, wherein the first opening is a
semi-circular opening perpendicular to the bottom face of the
mounting groove.
9. The circuit according to claim 1, wherein another side wall of
the mounting groove comprises a side push hole perpendicular to the
bottom face of the mounting groove, wherein the another side wall
of the mounting groove is next to an input end of the power
amplifier.
10. The circuit according to claim 1, further comprising: multiple
protruding supports disposed in one plane on the bottom face of the
mounting groove, wherein a height difference between the protruding
supports and the bottom face of the mounting groove is in the range
of 0.1-0.2 mm.
11. The circuit according to claim 10, wherein the multiple
protruding supports comprise four protruding supports, wherein two
protruding supports of the four protruding supports are disposed at
a location corresponding to an output end of the power amplifier,
and the other two protruding supports of the four protruding
supports are disposed at a location corresponding to an input end
of the power amplifier.
12. An apparatus comprising circuitry, the circuitry comprising: a
substrate; a printed circuit board covering an upper surface of the
substrate; and a power tube of a power amplifier; wherein the
printed circuit board comprises a through groove configured to
allow the power tube to pass through; wherein the substrate
comprises a mounting groove cut into the upper surface of the
substrate at a location that corresponds to the through groove;
wherein one end of the power tube extends through the through
groove, is welded to a bottom face of the mounting groove, and
abuts a side wall of the mounting groove; and wherein the mounting
groove comprises a solder flux escape channel disposed in the side
wall of the mounting groove.
13. The apparatus according to claim 12, wherein the side wall of
the mounting groove is next to an output end of the power
amplifier.
14. The apparatus according to claim 12, wherein the solder flux
escape channel comprises a first opening disposed in the side wall
of the mounting groove; and wherein there is a gap between an inner
wall of the through groove in the printed circuit board and an
outer wall of the power tube.
15. The apparatus according to claim 14, wherein the power tube
comprises a pin disposed over an upper surface of the printed
circuit board, and the pin comprises a through hole at a location
that corresponds to the first opening.
16. The apparatus according to claim 14, wherein the first opening
is a semi-circular opening perpendicular to the bottom face of the
mounting groove.
17. The apparatus according to claim 12, wherein the solder flux
escape channel comprises a first opening disposed in the side wall
of the mounting groove; and wherein the printed circuit board
comprises a second opening at a location that corresponds to the
first opening.
18. The apparatus according to claim 17, wherein the power tube
comprises a pin disposed over an upper surface of the printed
circuit board, and the pin comprises a through hole at a location
that corresponds to the first opening.
19. The apparatus according to claim 17, wherein the first opening
is a semi-circular opening perpendicular to the bottom face of the
mounting groove,
20. The apparatus according to claim 12, wherein another side wall
of the mounting groove comprises a side push hole perpendicular to
the bottom face of the mounting groove, wherein the another side
wall of the mounting groove is next to an input end of the power
amplifier.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 15/676,352, filed on Aug. 14, 2017, which is a
continuation of International Application No. PCT/CN2016/073380,
filed on Feb. 3, 2016, which claims priority to Chinese Patent
Application No. 201520112293.2 filed on Feb. 15, 2015. All of the
afore-mentioned patent applications are hereby incorporated by
reference in their entireties.
TECHNICAL FIELD
[0002] The present invention relates to the field of power
amplifier technologies, and in particular, to a power tube
connection structure of a power amplifier and a power
amplifier.
BACKGROUND
[0003] Conventional power amplifiers include two types: drop-in
power amplifiers and surface mount power amplifiers. FIG. 1 is a
schematic structural diagram of a drop-in power amplifier in the
prior art, including a substrate 01, a printed circuit board 02
covering an upper surface of the substrate 01, and a power tube 03.
A through groove 04 allowing the power tube 03 to pass through is
cut into the printed circuit board 02. A mounting groove 05 is cut
into the upper surface of the substrate 01 at a location that is
corresponding to the through groove 04. One end of the power tube
03 extends through the through groove 04, and is welded onto a
bottom face of the mounting groove 05.
[0004] To make it convenient for the power tube 03 to pass through
the through groove 04 and drop in the mounting groove 05, a size of
the mounting groove 05 is 0.25 mm greater than that of the power
tube 03 on one side. To improve power amplification consistency,
assembly design of a power amplifier requires that the power tube
03 is pushed toward a side of the mounting groove that is close to
an output end of the power amplifier, to ensure that there is no
gap left between the output end of the power amplifier and a side
wall of the mounting groove that is close to the output end of the
power amplifier. However, there is consequently no escape channel
for gas solder flux during reflow soldering, and a solder void is
formed at the bottom of the power tube 03.
SUMMARY
[0005] Embodiments of the present invention provide a power tube
connection structure of a power amplifier and a power amplifier, to
prevent a solder void at the bottom of a power tube.
[0006] To achieve the foregoing objective, according to a first
aspect, an embodiment of the present invention provides a power
tube connection structure of a power amplifier, including a
substrate, a printed circuit board covering an upper surface of the
substrate, and a power tube, where a through groove allowing the
power tube to pass through is cut into the printed circuit board, a
mounting groove is cut into the upper surface of the substrate at a
location that is corresponding to the through groove, one end of
the power tube extends through the through groove, and is welded
onto a bottom face of the mounting groove, the end of the power
tube that extends into the mounting groove abuts onto a side wall
of the mounting groove that is close to an output end of the power
amplifier, and a solder flux escape channel is made into the side
wall of the mounting groove that is close to the output end of the
power amplifier.
[0007] In a first possible implementation manner, with reference to
the first aspect, the solder flux escape channel is a first opening
made into the side wall of the mounting groove that is close to the
output end of the power amplifier, and there is a gap left between
an inner wall of the through groove in the printed circuit board
and an outer wall of the power tube.
[0008] In a second possible implementation manner, with reference
to the first aspect, the solder flux escape channel is a first
opening made into the side wall of the mounting groove that is
close to the output end of the power amplifier, and a second
opening is made into the printed circuit board at a location that
is corresponding to the first opening.
[0009] In a third possible implementation manner, according to the
first or the second possible implementation manner, the power tube
includes a pin laid over an upper surface of the printed circuit
board, and a through hole is made into the pin at a location that
is corresponding to the first opening.
[0010] In a fourth possible implementation manner, according to the
first or the second possible implementation manner, the first
opening is a semi-circular opening perpendicular to the bottom face
of the mounting groove.
[0011] In a fifth possible implementation manner, with reference to
the first aspect, a side push hole perpendicular to the bottom face
of the mounting groove is made into a side wall of the mounting
groove that is close to an input end.
[0012] In a sixth possible implementation manner, with reference to
the first aspect, multiple protruding supports are laid in one
plane on the bottom face of the mounting groove, and a height
difference between the protruding supports and the bottom face of
the mounting groove is 0.1-0.2 mm.
[0013] In a seventh possible implementation manner, according to
the sixth possible implementation manner, there are four protruding
supports, two protruding supports are laid close to the output end
of the power amplifier, and the rest two protruding supports are
laid close to an input end of the power amplifier.
[0014] According to the power tube connection structure of a power
amplifier provided in this embodiment of the present invention, a
solder flux escape channel is made into a side wall of a mounting
groove that is close to an output end of a power amplifier, and
during welding, gas solder flux can flow out of the power amplifier
through the solder flux escape channel, preventing a solder void
from forming at the bottom of a power tube.
[0015] According to a second aspect, an embodiment of the present
invention provides a power amplifier, including the power tube
connection structure of a power amplifier according to any one of
the foregoing technical solutions.
[0016] According to the power amplifier provided in this embodiment
of the present invention, a solder flux escape channel is made into
a side wall of a mounting groove that is close to an output end of
the power amplifier. During welding, gas solder flux can flow out
of the power amplifier through the solder flux escape channel,
preventing a solder void from forming at the bottom of a power
tube.
BRIEF DESCRIPTION OF DRAWINGS
[0017] To describe the technical solutions in the embodiments of
the present invention or in the prior art more clearly, the
following briefly describes the accompanying drawings required for
describing the embodiments or the prior art. Apparently, the
accompanying drawings in the following description show merely some
embodiments of the present invention, and a person of ordinary
skill in the art may still derive other drawings from these
accompanying drawings without creative efforts.
[0018] FIG. 1 is a schematic structural diagram of a drop-in power
amplifier in the prior art;
[0019] FIG. 2 is a schematic diagram of a power tube connection
structure of a power amplifier according to an embodiment of the
present invention; and
[0020] FIG. 3 is a schematic structural diagram of a substrate in a
power tube connection structure of a power amplifier according to
an embodiment of the present invention.
DESCRIPTION OF EMBODIMENTS
[0021] The following clearly and completely describes the technical
solutions in the embodiments of the present invention with
reference to the accompanying drawings in the embodiments of the
present invention. Apparently, the described embodiments are merely
some but not all of the embodiments of the present invention. All
other embodiments obtained by a person of ordinary skill in the art
based on the embodiments of the present invention without creative
efforts shall fall within the protection scope of the present
invention.
[0022] In the descriptions of the present invention, it should be
understood that, position or location relationships indicated by
the terms "center", "upper", "lower", "ahead", "behind", "left",
"right", "perpendicular", "horizontal", "top", "bottom", "inner",
"outer", and the like are position or location relationships based
on the accompanying drawings, and are merely intended for ease of
describing the present invention and simplification of description,
instead of indicating or implying that the apparatuses or
components referred to need to be provided in a particular position
or be constructed and operated in a particular position, and
therefore, shall not be understood as limitations on the present
invention.
[0023] The terms "first" and "second" are merely intended for a
purpose of description, and shall not be understood as an
indication or implication of relative importance or an implicit
indication of a quantity of indicated technical features.
Therefore, a feature modified by "first" or "second" may explicitly
or implicitly include one or more such features. In the
descriptions of the present invention, unless otherwise indicated,
the meaning of "multiple" is two or more.
[0024] Referring to FIG. 2, FIG. 2 shows a specific embodiment of a
power tube connection structure of a power amplifier according to
an embodiment of the present invention. The power tube connection
structure of a power amplifier includes a substrate 1, a printed
circuit board 2 covering an upper surface of the substrate 1, and a
power tube 3. A through groove 21 allowing the power tube 3 to pass
through is cut into the printed circuit board 2. A mounting groove
11 is cut into the upper surface of the substrate 1 at a location
that is corresponding to the through groove 21. One end of the
power tube 3 extends through the through groove 21, and is welded
onto a bottom face of the mounting groove 11. The end of the power
tube 3 that extends into the mounting groove 11 abuts onto a side
wall of the mounting groove 11 that is close to an output end of
the power amplifier. A solder flux escape channel 12 is made into
the side wall of the mounting groove 11 that is close to the output
end of the power amplifier.
[0025] According to the power tube connection structure of a power
amplifier provided in this embodiment of the present invention, a
solder flux escape channel 12 is made into a side wall of a
mounting groove 11 that is close to an output end of the power
amplifier. During welding, gas solder flux can flow out of the
power amplifier through the solder flux escape channel 12,
preventing a solder void from forming at the bottom of a power tube
3.
[0026] In an embodiment of the present invention, the solder flux
escape channel 12 is a first opening made into the side wall of the
mounting groove 11 that is close to the output end of the power
amplifier. For the convenience of discharge of gas solder flux,
there is a gap (not shown in the figure) left between an outer wall
of the power tube 3 and an inner wall of the through groove 21 in
the printed circuit board 2. Gas solder flux flows into the first
opening from the bottom of the power tube 3, flows from the bottom
up in the first opening and flows out from the top of the first
opening, and is discharged out of the power amplifier through the
gap left between the outer wall of the power tube 3 and the inner
wall of the through groove 21 in the printed circuit board 2. This
is convenient for discharge of the gas solder flux.
[0027] In another embodiment of the present invention, referring to
FIG. 2, the solder flux escape channel 12 is a first opening made
into the side wall of the mounting groove 11 that is close to the
output end of the power amplifier. There is no gap left between an
outer wall of the power tube 3 and an inner wall of the through
groove 21 in the printed circuit board 2, but a second opening 22
is made into the printed circuit board 2 at a location that is
corresponding to the first opening. In this case, gas solder flux
flows sequentially from the bottom up through the first opening and
the second opening 22, and is discharged out of the power amplifier
from the top of the second opening 22.
[0028] Referring to FIG. 2, the power tube 3 usually includes a pin
31 laid over an upper surface of the printed circuit board 2, while
the pin 31 blocks discharge of gas solder flux to a degree. In
order that the gas solder flux is discharged more smoothly, a
through hole 311 is made into the pin 31 at a location that is
corresponding to the first opening. In this way, the blocking
effect of the pin 31 on the gas solder flux is reduced, and
therefore, discharge of the gas solder flux is smoother.
[0029] To reduce difficulty of processing, the first opening is a
semi-circular opening perpendicular to the bottom face of the
mounting groove 11. For the substrate 1, a semi-circular chamfer is
usually processed by using a milling technology, and therefore, the
semi-circular opening may be processed by using the same
technology. This reduces processing steps and therefore reduces the
difficulty of processing.
[0030] Referring to FIG. 3, to make it convenient to push the power
tube 3 toward a side of the mounting groove 11 that is close to the
output end of the power amplifier, a side push hole 13
perpendicular to the bottom face of the mounting groove 11 is made
into a side wall of the mounting groove 11 that is close to an
input end. A cylindrical pin may be inserted into the side push
hole 13. As the cylindrical pin is inserted, the cylindrical pin
may squeeze an edge of the power tube 3, so that the power tube 3
moves toward the side of the mounting groove 11 that is close to
the output end of the power amplifier, until there is no gap left
between the output end of the power amplifier and the side wall of
the mounting groove 11 that is close to the output end of the power
amplifier.
[0031] Different materials are used for the substrate 1 and the
power tube 3 whose thermal expansion rates also vary greatly. As a
result, tearing is likely to occur during welding, damaging the
materials. Therefore, as shown in FIG. 3, multiple protruding
supports 14 are laid in one plane on the bottom face of the
mounting groove 11. A height difference between the protruding
supports 14 and the bottom face of the mounting groove 11 is
0.1-0.2 mm. The protruding supports 14 provide support for the
power tube 3, making room for distortion buffer between the
substrate 1 and the power tube 3. This reduces the occurrence of
tearing.
[0032] To improve welding precision between the substrate 1 and the
power tube 3, there are four protruding supports 14. Two protruding
supports 14 are laid close to the output end of the power
amplifier. The rest two protruding supports 14 are laid close to an
input end of the power amplifier. In this way, the power tube 3 and
the substrate 1 are parallel to each other, and solder is more
evenly fed during welding. Therefore, the welding precision between
the substrate 1 and the power tube 3 is improved.
[0033] An embodiment of the present invention further provides a
power amplifier, including the power tube connection structure of a
power amplifier according to any one of the foregoing
embodiments.
[0034] According to the power amplifier provided in this embodiment
of the present invention, a solder flux escape channel 12 is made
into a side wall of a mounting groove 11 that is close to an output
end of the power amplifier. During welding, gas solder flux can
flow out of the power amplifier through the solder flux escape
channel 12, preventing a solder void from forming at the bottom of
a power tube 3.
[0035] Other components and the like of the power amplifier in this
embodiment of the present invention are well known to a person
skilled in the art, and details are not described herein.
EXAMPLE EMBODIMENTS
[0036] Further embodiments of the present application are provided
in the following. It should be noted that the numbering of these
embodiments in the following section does not necessarily comply
with the numbering of the previous sections.
[0037] 1. A power tube connection structure of a power amplifier,
comprising a substrate, a printed circuit board covering an upper
surface of the substrate, and a power tube, wherein a through
groove allowing the power tube to pass through is cut into the
printed circuit board, a mounting groove is cut into the upper
surface of the substrate at a location that is corresponding to the
through groove, one end of the power tube extends through the
through groove, and is welded onto a bottom face of the mounting
groove, the end of the power tube that extends into the mounting
groove abuts onto a side wall of the mounting groove that is close
to an output end of the power amplifier, and a solder flux escape
channel is made into the side wall of the mounting groove that is
close to the output end of the power amplifier.
[0038] 2. The power tube connection structure of a power amplifier
according to embodiment 1, wherein the solder flux escape channel
is a first opening made into the side wall of the mounting groove
that is close to the output end of the power amplifier, and there
is a gap left between an inner wall of the through groove in the
printed circuit board and an outer wall of the power tube.
[0039] 3. The power tube connection structure of a power amplifier
according to embodiment 2, wherein the power tube comprises a pin
laid over an upper surface of the printed circuit board, and a
through hole is made into the pin at a location that is
corresponding to the first opening.
[0040] 4. The power tube connection structure of a power amplifier
according to embodiment 2, wherein the first opening is a
semi-circular opening perpendicular to the bottom face of the
mounting groove.
[0041] 5. The power tube connection structure of a power amplifier
according to embodiment 1, wherein the solder flux escape channel
is a first opening made into the side wall of the mounting groove
that is close to the output end of the power amplifier, and a
second opening is made into the printed circuit board at a location
that is corresponding to the first opening.
[0042] 6. The power tube connection structure of a power amplifier
according to embodiment 5, wherein the power tube comprises a pin
laid over an upper surface of the printed circuit board, and a
through hole is made into the pin at a location that is
corresponding to the first opening.
[0043] 7. The power tube connection structure of a power amplifier
according to embodiment 5, wherein the first opening is a
semi-circular opening perpendicular to the bottom face of the
mounting groove.
[0044] 8. The power tube connection structure of a power amplifier
according to embodiment 1, wherein a side push hole perpendicular
to the bottom face of the mounting groove is made into a side wall
of the mounting groove that is close to an input end.
[0045] 9. The power tube connection structure of a power amplifier
according to embodiment 1, wherein multiple protruding supports are
laid in one plane on the bottom face of the mounting groove, and a
height difference between the protruding supports and the bottom
face of the mounting groove is 0.1-0.2 mm.
[0046] 10. The power tube connection structure of a power amplifier
according to embodiment 9, wherein there are four protruding
supports, two protruding supports are laid close to the output end
of the power amplifier, and the rest two protruding supports are
laid close to an input end of the power amplifier.
[0047] 11. A power amplifier, comprising a power tube connection
structure of a power amplifier, which comprises:
[0048] a substrate, a printed circuit board covering an upper
surface of the substrate, and a power tube, wherein a through
groove allowing the power tube to pass through is cut into the
printed circuit board, a mounting groove is cut into the upper
surface of the substrate at a location that is corresponding to the
through groove, one end of the power tube extends through the
through groove, and is welded onto a bottom face of the mounting
groove, the end of the power tube that extends into the mounting
groove abuts onto a side wall of the mounting groove that is close
to an output end of the power amplifier, and a solder flux escape
channel is made into the side wall of the mounting groove that is
close to the output end of the power amplifier.
[0049] 12. The power tube connection structure of a power amplifier
according to embodiment 11, wherein the solder flux escape channel
is a first opening made into the side wall of the mounting groove
that is close to the output end of the power amplifier, and there
is a gap left between an inner wall of the through groove in the
printed circuit board and an outer wall of the power tube.
[0050] 13. The power tube connection structure of a power amplifier
according to embodiment 12, wherein the power tube comprises a pin
laid over an upper surface of the printed circuit board, and a
through hole is made into the pin at a location that is
corresponding to the first opening.
[0051] 14. The power tube connection structure of a power amplifier
according to embodiment 12, wherein the first opening is a
semi-circular opening perpendicular to the bottom face of the
mounting groove.
[0052] 15. The power tube connection structure of a power amplifier
according to embodiment 11, wherein the solder flux escape channel
is a first opening made into the side wall of the mounting groove
that is close to the output end of the power amplifier, and a
second opening is made into the printed circuit board at a location
that is corresponding to the first opening.
[0053] 16. The power tube connection structure of a power amplifier
according to embodiment 15, wherein the power tube comprises a pin
laid over an upper surface of the printed circuit board, and a
through hole is made into the pin at a location that is
corresponding to the first opening.
[0054] 17. The power tube connection structure of a power amplifier
according to embodiment 15, wherein the first opening is a
semi-circular opening perpendicular to the bottom face of the
mounting groove.
[0055] 18. The power tube connection structure of a power amplifier
according to embodiment 11, wherein a side push hole perpendicular
to the bottom face of the mounting groove is made into a side wall
of the mounting groove that is close to an input end.
[0056] 19. The power tube connection structure of a power amplifier
according to embodiment 11, wherein multiple protruding supports
are laid in one plane on the bottom face of the mounting groove,
and a height difference between the protruding supports and the
bottom face of the mounting groove is 0.1-0.2 mm.
[0057] 20. The power tube connection structure of a power amplifier
according to embodiment 19, wherein there are four protruding
supports, two protruding supports are laid close to the output end
of the power amplifier, and the rest two protruding supports are
laid close to an input end of the power amplifier.
[0058] The foregoing descriptions are merely specific
implementation manners of the present invention, but are not
intended to limit the protection scope of the present invention.
Any variation or replacement readily figured out by a person
skilled in the art within the technical scope disclosed in the
present invention shall fall within the protection scope of the
present invention. Therefore, the protection scope of the present
invention shall be subject to the protection scope of the
claims.
* * * * *