U.S. patent application number 15/867713 was filed with the patent office on 2019-07-11 for multi-outlet-inlet liquid-cooling heat dissipation structure.
The applicant listed for this patent is ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to Wen-Ji Lan.
Application Number | 20190212076 15/867713 |
Document ID | / |
Family ID | 67140590 |
Filed Date | 2019-07-11 |
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United States Patent
Application |
20190212076 |
Kind Code |
A1 |
Lan; Wen-Ji |
July 11, 2019 |
MULTI-OUTLET-INLET LIQUID-COOLING HEAT DISSIPATION STRUCTURE
Abstract
A multi-outlet-inlet liquid-cooling heat dissipation structure
includes a liquid-containing plate body assembly. The
liquid-containing plate body assembly has an upper
liquid-containing plate body having an upper liquid chamber, a
lower liquid-containing plate body having a lower liquid chamber, a
first communication tube communicating with the upper and lower
liquid chambers for a working fluid to flow between the upper and
lower liquid chambers and multiple communication passages. Each
communication passage has a communication opening respectively in
communication with the upper and lower liquid chambers as an inlet
or an outlet of the working fluid.
Inventors: |
Lan; Wen-Ji; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASIA VITAL COMPONENTS CO., LTD. |
New Taipei City |
|
TW |
|
|
Family ID: |
67140590 |
Appl. No.: |
15/867713 |
Filed: |
January 11, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 2250/08 20130101;
H01L 23/473 20130101; F28D 9/0056 20130101; F28F 3/025 20130101;
F28F 3/06 20130101; H05K 7/20763 20130101; F28F 2250/102 20130101;
F28F 13/06 20130101; F28F 3/12 20130101; H05K 7/20263 20130101;
H01L 23/36 20130101 |
International
Class: |
F28F 3/12 20060101
F28F003/12; F28F 13/06 20060101 F28F013/06 |
Claims
1. A multi-outlet-inlet liquid-cooling heat dissipation structure
comprising a liquid-containing plate body assembly, the
liquid-containing plate body assembly having: an upper
liquid-containing plate body having an upper liquid chamber; a
lower liquid-containing plate body having a lower liquid chamber,
the upper and lower liquid-containing plate bodies being arranged
at an interval; a first communication tube communicating with the
upper and lower liquid chambers for a working fluid to flow between
the upper and lower liquid chambers; and multiple communication
passages, each communication passage having a communication opening
respectively in communication with the upper and lower liquid
chambers as an inlet or an outlet of the working fluid.
2. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 1, wherein the lower liquid-containing plate
body has a first top plate and a first bottom plate, the first top
plate being mated with the first bottom plate to define the lower
liquid chamber, the upper liquid-containing plate body having a
second top plate and a second bottom plate, the second top plate
being mated with the second bottom plate to define the upper liquid
chamber, one end of the first communication tube penetrating
through the first top plate to communicate with the lower liquid
chamber, the other end of the first communication tube penetrating
through the second bottom plate to communicate with the upper
liquid chamber for the working fluid to flow between the upper and
lower liquid chambers through the first communication tube.
3. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 2, wherein a lower flow way is disposed in the
lower liquid chamber, the lower flow way being windingly formed on
one face of any of the first top plate and the first bottom board
proximal to the lower liquid chamber, an upper flow way being
disposed in the upper liquid chamber, the upper flow way being
windingly formed on one face of any of the second top plate and the
second bottom board proximal to the upper liquid chamber as a flow
path for guiding the working fluid.
4. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 1, wherein the communication passages include a
first communication passage with a first communication opening and
a second communication passage with a second communication opening
respectively in communication with the lower liquid chamber, the
communication passages further including a third communication
passage with a third communication opening in communication with
the upper liquid chamber.
5. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 2, wherein a first partitioning member is
disposed in the lower liquid chamber to partition the lower liquid
chamber into a first liquid chamber and a second liquid chamber, a
second partitioning member being disposed in the upper liquid
chamber to partition the upper liquid chamber into a third liquid
chamber and a fourth liquid chamber.
6. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 5, wherein the liquid-containing plate body
assembly further includes a second communication tube, one end of
the second communication tube penetrating through the first top
plate to communicate with the lower liquid chamber, the other end
of the second communication tube penetrating through the second
bottom plate to communicate with the upper liquid chamber for the
working fluid to flow between the upper and lower liquid chambers
through the second communication tube, the first communication tube
communicating with the first and third liquid chamber, while the
second communication tube communicating with the second and fourth
liquid chambers.
7. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 6, wherein the communication passages include a
first communication passage, a second communication passage, a
third communication passage and a fourth communication passage, a
first communication opening of the first communication passage
communicating with the first liquid chamber, a second communication
opening of the second communication passage communicating with the
second liquid chamber, a third communication opening of the third
communication passage communicating with the third liquid chamber,
a fourth communication opening of the fourth communication passage
communicating with the fourth liquid chamber.
8. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 6, wherein a first flow way, a second flow way,
a third flow way and a fourth flow way are respectively disposed in
the first, second, third and fourth liquid chambers, the first and
second flow ways being windingly formed on one face of any of the
first top plate and the first bottom board proximal to the lower
liquid chamber, the third and fourth flow ways being windingly
formed on one face of any of the second top plate and the second
bottom board proximal to the upper liquid chamber as a flow path
for guiding the working fluid, the liquid-containing plate body
assembly further including a first pump disposed in any of the
first and third liquid chambers and a second pump disposed in any
of the second and fourth liquid chambers.
9. The multi-outlet-inlet liquid-cooling heat dissipation structure
as claimed in claim 5, wherein a third partitioning member is
further disposed in the lower liquid chamber to partition the first
and second liquid chambers to respectively form a fifth liquid
chamber and a sixth liquid chamber.
10. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 9, wherein the liquid-containing
plate body assembly further includes a second communication tube, a
third communication tube and a fourth communication tube, one end
of the second, third and fourth communication tubes penetrating
through the first top plate to communicate with the lower liquid
chamber, the other end of the second, third and fourth
communication tubes penetrating through the second bottom plate to
communicate with the upper liquid chamber for the working fluid to
flow between the upper and lower liquid chambers through the
second, third and fourth communication tubes, the first
communication tube communicating with the first and third liquid
chamber, the second communication tube communicating with the
second and third liquid chambers, the third communication tube
communicating with the fifth and fourth liquid chambers, while the
fourth communication tube communicating with the sixth and fourth
liquid chambers.
11. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 10, wherein the communication
passages include a first communication passage, a second
communication passage, a third communication passage and a fourth
communication passage, the first communication passage
communicating with the first liquid chamber, the second
communication passage communicating with the second liquid chamber,
the third communication passage communicating with the fifth liquid
chamber, while the fourth communication passage communicating with
the sixth liquid chamber.
12. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 10, wherein a first flow way, a
second flow way, a third flow way, a fourth flow way, a fifth flow
way and a sixth flow way are respectively disposed in the first,
second, third, fourth, fifth and sixth liquid chambers, the first,
second, fifth and sixth flow ways being windingly formed on one
face of any of the first top plate and the first bottom board
proximal to the lower liquid chamber, the third and fourth flow
ways being windingly formed on one face of any of the second top
plate and the second bottom board proximal to the upper liquid
chamber as a flow path for guiding the working fluid, the
liquid-containing plate body assembly further including a first
pump disposed in any of the first, second and third liquid chambers
and a second pump disposed in any of the fourth, fifth and sixth
liquid chambers.
13. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 9, wherein a fourth partitioning
member is further disposed in the upper liquid chamber to partition
the third and fourth liquid chambers to respectively form a seventh
liquid chamber and an eighth liquid chamber.
14. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 13, wherein the liquid-containing
plate body assembly further includes a second communication tube, a
third communication tube and a fourth communication tube, one end
of the second, third and fourth communication tubes penetrating
through the first top plate to communicate with the lower liquid
chamber, the other end of the second, third and fourth
communication tubes penetrating through the second bottom plate to
communicate with the upper liquid chamber for the working fluid to
flow between the upper and lower liquid chambers through the
second, third and fourth communication tubes, the first
communication tube communicating with the first and third liquid
chamber, the second communication tube communicating with the
second and fourth liquid chambers, the third communication tube
communicating with the fifth and seventh liquid chambers, while the
fourth communication tube communicating with the sixth and eighth
liquid chambers.
15. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 14, wherein the communication
passages include a first communication passage, a second
communication passage, a third communication passage, a fourth
communication passage, a fifth communication passage, a sixth
communication passage, a seventh communication passage and an
eighth communication passage, the first communication passage
communicating with the first liquid chamber, the second
communication passage communicating with the second liquid chamber,
the third communication passage communicating with the third liquid
chamber, the fourth communication passage communicating with the
fourth liquid chamber, the fifth communication passage
communicating with the fifth liquid chamber, the sixth
communication passage communicating with the sixth liquid chamber,
the seventh communication passage communicating with the seventh
liquid chamber, while the eighth communication passage
communicating with the eighth liquid chamber.
16. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 14, wherein a first flow way, a
second flow way, a third flow way, a fourth flow way, a fifth flow
way, a sixth flow way, a seventh flow way and an eighth flow way
are respectively disposed in the first, second, third, fourth,
fifth, sixth, seventh and eighth liquid chambers, the first flow
way being windingly formed on one face of any of the first top
plate and the first bottom board proximal to the first liquid
chamber, the second flow way being windingly formed on one face of
any of the first top plate and the first bottom board proximal to
the second liquid chamber, the third flow way being windingly
formed on one face of any of the second top plate and the second
bottom board proximal to the third liquid chamber, the fourth flow
way being windingly formed on one face of any of the second top
plate and the second bottom board proximal to the fourth liquid
chamber, the fifth flow way being windingly formed on one face of
any of the first top plate and the first bottom board proximal to
the fifth liquid chamber, the sixth flow way being windingly formed
on one face of any of the first top plate and the first bottom
board proximal to the sixth liquid chamber, the seventh flow way
being windingly formed on one face of any of the second top plate
and the second bottom board proximal to the seventh liquid chamber,
while the eighth flow way being windingly formed on one face of any
of the second top plate and the second bottom board proximal to the
eighth liquid chamber as a flow path for guiding the working fluid,
the liquid-containing plate body assembly further including a first
pump disposed in any of the first and third liquid chambers, a
second pump disposed in any of the second and fourth liquid
chambers, a third pump disposed in any of the fifth and seventh
liquid chambers and a fourth pump disposed in any of the sixth and
eighth liquid chambers.
17. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 1, wherein the liquid-containing
plate body assembly further includes a pump disposed in the upper
liquid chamber or the lower liquid chamber or any of the
communication passages.
18. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 4, wherein the liquid-containing
plate body assembly further includes a pump disposed in the upper
liquid chamber or the lower liquid chamber or any of the
communication passages.
19. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 2, wherein the communication passages
include a first communication passage with a first communication
opening and a second communication passage with a second
communication opening respectively in communication with the lower
liquid chamber, the communication passages further including a
third communication passage with a third communication opening in
communication with the upper liquid chamber.
20. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 19, wherein the liquid-containing
plate body assembly further includes a pump disposed in the upper
liquid chamber or the lower liquid chamber or any of the
communication passages.
21. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 3, wherein the communication passages
include a first communication passage with a first communication
opening and a second communication passage with a second
communication opening respectively in communication with the lower
liquid chamber, the communication passages further including a
third communication passage with a third communication opening in
communication with the upper liquid chamber.
22. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 21, wherein the liquid-containing
plate body assembly further includes a pump disposed in the upper
liquid chamber or the lower liquid chamber or any of the
communication passages.
23. The multi-outlet-inlet liquid-cooling heat dissipation
structure as claimed in claim 3, wherein the liquid-containing
plate body assembly further includes a pump disposed in the upper
liquid chamber or the lower liquid chamber or any of the
communication passages.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] The present invention relates generally to a heat
dissipation structure, and more particularly to a
multi-outlet-inlet liquid-cooling heat dissipation structure.
2. Description of the Related Art
[0002] Currently, liquid-cooling heat dissipation devices are
widely applied to communication, electrical implements, vehicle
industry, instruction, etc.
[0003] for manufacturing various parts and products. With the
fields of communication and electrical implements taken as an
example, when a computer operates, many internal components of the
computer will generate high heat. Therefore, a good heat
dissipation system is a critical factor determining the operation
performance and reliability of the computer. Among all the heat
generation components, the central processing unit (CPU) and the
graphics processing unit (GPU) generally have higher working loads
and the heat dissipation issue of these two components is the most
knotty problem. Especially, the pictures of various current
computer games have become finer and finer and the function of the
computer-assistant graphics software has become stronger and
stronger. In operation, such software often makes the central
processing unit and the graphics processing unit in a highly loaded
state. As a result, the central processing unit and the graphics
processing unit will generate high heat. The heat must be
effectively dissipated. Otherwise, in a minor case, the performance
of the central processing unit and the graphics processing unit
will be deteriorated, while in a serious case, the central
processing unit and the graphics processing unit may be damaged or
the lifetime of the central processing unit and the graphics
processing unit will be shortened.
[0004] Please refer to FIG. 1. In order to lower the working
temperature of the heat generation electronic component, a common
commercially available water-cooling device includes a
water-cooling radiator 1, two water conduits 51, a water-cooling
head 5 in contact with a heat generation component (such as central
processing unit) and a pump 6. The water conduits 51 are connected
between the water-cooling radiator 1 and the water-cooling head 5.
The pump 6 serves to drive the water-cooling liquid (or so-called
working fluid) to flow to the water-cooling radiator 1 to dissipate
the heat and continuously circulate the working fluid to cool the
heat generation component and quickly dissipate the heat. The
conventional water-cooling radiator 1 is composed of multiple
radiating fins 11, multiple flat tubes 12 and two lateral water
tanks 13. The radiating fins 11 are disposed between the straight
flat tubes 12. The two lateral water tanks 13, the radiating fins
11 and two sides of the straight flat tubes 12 are soldered with
each other so that the two lateral water tanks 13, the radiating
fins 11 and the straight flat tubes 12 are connected to form the
water-cooling radiator 1. A water inlet 131 and a water outlet 132
are disposed on one of the lateral water tanks 13. The water inlet
131 and the water outlet 132 are respectively connected with the
two water conduits 51.
[0005] After the working fluid flows from the water inlet 13 into
one of the lateral water tanks 13, the working fluid quickly flows
through the straight flat tubes 12 into the other lateral water
tank 13. Then, the working fluid is exhausted from the water outlet
132. Therefore, the flowing time of the working fluid carrying the
heat within the water-cooling radiator 1 is quite short so that the
heat exchange time of the working fluid carrying the heat with the
water-cooling radiator 1 is not long. As a result, the heat
dissipation effect of the conventional water-cooling radiator for
the working fluid carrying the heat is poor. This leads to poor
heat dissipation efficiency. Moreover, the entire structure of the
conventional water-cooling radiator cannot be adjusted or changed
in adaptation to the internal space of an electronic device.
Therefore, when installed in an electronic device (such as a
computer or a server), the conventional water-cooling radiator
necessitates an independent space inside the electronic device for
placing the conventional water-cooling radiator.
[0006] It is therefore tried by the applicant to provide a
multi-outlet-inlet liquid-cooling heat dissipation structure to
solve the above problems existing in the conventional water-cooling
device.
SUMMARY OF THE INVENTION
[0007] It is therefore a primary object of the present invention to
provide a multi-outlet-inlet liquid-cooling heat dissipation
structure, which has better heat dissipation performance.
[0008] It is a further object of the present invention to provide
the above multi-outlet-inlet liquid-cooling heat dissipation
structure, in which two liquid-containing plate bodies are stacked
at an interval. Each of the liquid-containing plate bodies has a
liquid chamber in which a flow way is disposed. Accordingly, the
flowing time of a working fluid within the multi-outlet-inlet
liquid-cooling heat dissipation structure is effectively increased
(or prolonged). Therefore, the heat dissipation efficiency is
effectively enhanced.
[0009] To achieve the above and other objects, the
multi-outlet-inlet liquid-cooling heat dissipation structure of the
present invention includes a liquid-containing plate body assembly.
The liquid-containing plate body assembly has an upper
liquid-containing plate body having an upper liquid chamber, a
lower liquid-containing plate body having a lower liquid chamber, a
first communication tube communicating with the upper and lower
liquid chambers for a working fluid to flow between the upper and
lower liquid chambers and multiple communication passages. The
upper and lower liquid-containing plate bodies are disposed at an
interval. Each communication passage has a communication opening
respectively in communication with the upper and lower liquid
chambers as an inlet or an outlet of the working fluid.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein:
[0011] FIG. 1 is a perspective view of a conventional water-cooling
device;
[0012] FIG. 2A is a perspective exploded view of a first embodiment
of the multi-outlet-inlet liquid-cooling heat dissipation structure
of the present invention;
[0013] FIG. 2B is a perspective exploded view of the first
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention, seen from another
angle;
[0014] FIG. 2C is a perspective assembled view of the first
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention;
[0015] FIG. 2D is a partially sectional view of the first
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention;
[0016] FIG. 3A is a perspective exploded view of a modified
embodiment of the first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0017] FIG. 3B is a perspective exploded view of another modified
embodiment of the first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0018] FIG. 3C is a partially sectional view of a modified
embodiment of the first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0019] FIG. 3D is a perspective exploded view of another modified
embodiment of the first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0020] FIG. 3E is a perspective exploded view of another modified
embodiment of the first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0021] FIG. 3F is a sectional view of another modified embodiment
of the first embodiment of the multi-outlet-inlet liquid-cooling
heat dissipation structure of the present invention;
[0022] FIG. 4A is a perspective exploded view of a modified
embodiment of the first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0023] FIG. 4B is a perspective assembled view of another modified
embodiment of the first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0024] FIG. 5A is a perspective exploded view of a second
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention;
[0025] FIG. 5B is a perspective assembled view of the second
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention;
[0026] FIG. 5C is a partially sectional view of a modified
embodiment of the second embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0027] FIG. 5D is a perspective exploded view of another modified
embodiment of the second embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0028] FIG. 5E is a perspective exploded view of another modified
embodiment of the second embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0029] FIG. 6A is a perspective exploded view of a third embodiment
of the multi-outlet-inlet liquid-cooling heat dissipation structure
of the present invention;
[0030] FIG. 6B is a perspective assembled view of the third
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention;
[0031] FIG. 6C is a partially sectional view of a modified
embodiment of the third embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0032] FIG. 6D is a perspective exploded view of another modified
embodiment of the third embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0033] FIG. 6E is a perspective exploded view of another modified
embodiment of the third embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0034] FIG. 7A is a perspective exploded view of a fourth
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention;
[0035] FIG. 7B is a perspective assembled view of the fourth
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention;
[0036] FIG. 7C is a partially sectional view of a modified
embodiment of the fourth embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention;
[0037] FIG. 7D is a perspective exploded view of another modified
embodiment of the fourth embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present invention;
and
[0038] FIG. 7E is a perspective exploded view of another modified
embodiment of the fourth embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0039] Please refer to FIGS. 2A to 2D. FIG. 2A is a perspective
exploded view of a first embodiment of the multi-outlet-inlet
liquid-cooling heat dissipation structure of the present invention.
FIG. 2B is a perspective exploded view of the first embodiment of
the multi-outlet-inlet liquid-cooling heat dissipation structure of
the present invention, seen from another angle. FIG. 2C is a
perspective assembled view of the first embodiment of the
multi-outlet-inlet liquid-cooling heat dissipation structure of the
present invention. FIG. 2D is a partially sectional view of the
first embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention. The
multi-outlet-inlet liquid-cooling heat dissipation structure of the
present invention includes a liquid-containing plate body assembly
2. The liquid-containing plate body assembly 2 has an upper
liquid-containing plate body 21, a lower liquid-containing plate
body 23, a first communication tube 251 and multiple communication
passages 27. In this embodiment, the liquid-containing plate body
assembly 2 has, but not limited to, two liquid-containing plate
bodies (the upper and lower liquid-containing plate bodies 21, 23),
which are stacked at an interval. In a modified embodiment, the
liquid-containing plate body assembly 2 can have three
liquid-containing plate bodies, which are stacked at intervals. The
number of the stacked liquid-containing plate bodies is not
limited.
[0040] The lower liquid-containing plate body 23 has a first top
plate 231 and a first bottom plate 232. The first top plate 231 is
mated with the first bottom plate 232 to define a lower liquid
chamber 233. The upper liquid-containing plate body 21 has a second
top plate 211 and a second bottom plate 212. The second top plate
211 is mated with the second bottom plate 212 to define an upper
liquid chamber 213. The upper and lower liquid-containing plate
bodies 21, 23 are stacked at an interval. The first communication
tube 251 communicates the upper liquid chamber 213 with the lower
liquid chamber 233. One end of the first communication tube 251
penetrates through the first top plate 231 to communicate with the
lower liquid chamber 233. The other end of the first communication
tube 251 penetrates through the second bottom plate 212 to
communicate with the upper liquid chamber 213. A working fluid
flows between the upper and lower liquid chambers 213, 233 through
the first communication tube 251.
[0041] In this embodiment, the communication passages 27 include a
first communication passage 271 with a first communication opening
271a and a second communication passage 272 with a second
communication opening 272a respectively in communication with the
lower liquid chamber 233. The first and second communication
openings 271a, 272a are the inlets of the working fluid. In
addition, the communication passages 27 are a third communication
opening 273a of a third communication passage 273 in communication
with the upper liquid chamber 213. The third communication opening
273a is the outlet of the working fluid. Reversely, alternatively,
the first and second communication openings 271a, 272a are the
outlets of the working fluid, while the third communication opening
273a is the inlet of the working fluid.
[0042] As shown in FIG. 2D, the working fluid carrying heat flows
from the first and second communication openings 271a, 272a into
the lower liquid chamber 233. After the lower liquid chamber 233 is
filled up with the working fluid, the working fluid passes through
the first communication tube 251 to flow into the upper liquid
chamber 213. The heat carried by the working fluid is conducted to
the upper liquid-containing plate body 21 and the lower
liquid-containing plate body 23 to dissipate the heat by way of
radiation.
[0043] Referring to FIGS. 3A and 2B, in a modified embodiment, a
lower flow way 233a is disposed in the lower liquid chamber 233. In
this embodiment, the lower flow way 233a is, but not limited to,
windingly formed on one face of the first top plate 231 proximal to
the lower liquid chamber 233. In another modified embodiment, the
lower flow way 233a is windingly formed on one face of the first
bottom plate 232 proximal to the lower liquid chamber 233. The
lower flow way 233a serves as a flow path for guiding the working
fluid. The working fluid is a liquid with high specific heat
coefficient such as water or pure water. In still another modified
embodiment, as shown in FIGS. 3B and 2A, an upper flow way 213a is
disposed in the upper liquid chamber 213. In this embodiment, the
upper flow way 213a is, but not limited to, windingly formed on one
face of the second bottom plate 212 proximal to the upper liquid
chamber 213 as a flow path for guiding the working fluid. In
another modified embodiment, the upper flow way 213a is selectively
windingly formed on one face of the second top plate 211 proximal
to the upper liquid chamber 213 as a flow path for guiding the
working fluid. As shown in FIG. 3C, by means of the upper and lower
flow ways 213a, 233a, the flowing time of the working fluid within
the upper and lower liquid chambers 213, 233 is prolonged so as to
prolong the heat exchange time of the working fluid with the upper
and lower liquid-containing plate bodies 21, 23. In this case, the
heat carried by the working fluid can be fully conducted to the
upper and lower liquid-containing plate bodies 21, 23 to dissipate
the heat.
[0044] In addition, as shown in FIGS. 3D and 3E, in another
modified embodiment, a pump 26 is, but not limited to, disposed in
the lower liquid chamber 233. In still another modified embodiment,
the pump 26 can be alternatively disposed in the upper liquid
chamber 213. As shown in FIG. 3F, in still another modified
embodiment, the pump 26 is, but not limited to, disposed near the
second communication opening 272a of the second communication
passage 272. In still another modified embodiment, the pump 26 can
be alternatively disposed at the first communication opening 271a
of the first communication passage 271 or the third communication
opening 273a of the third communication passage 273. The pump 26 of
the present invention can be selectively disposed in any chamber or
flow way. For example, the pump 26 includes a fan impeller and a
drive motor (such as submersible motor or waterproof water) for
driving the fan impeller to rotate so as to drive the working fluid
to flow.
[0045] As shown in FIGS. 4A, 4B as well as 2C, in another modified
embodiment, an open place is defined between the upper and lower
liquid-containing plate bodies 21, 23 as a first heat dissipation
space 291. An open place is positioned on one face of the lower
liquid-containing plate body 23 distal from the upper
liquid-containing plate body 21 as a second heat dissipation space
292. An open place is positioned on one face of the upper
liquid-containing plate body 21 distal from the lower
liquid-containing plate body 23 as a third heat dissipation space
293. A first radiating fin assembly 2911 is disposed in the first
heat dissipation space 291 between the upper and lower
liquid-containing plate bodies 21, 23. A second radiating fin
assembly 2921 is disposed in the second heat dissipation space 292
on one face of the lower liquid-containing plate body 23 distal
from the upper liquid-containing plate body 21. A third radiating
fin assembly 2931 is disposed in the third heat dissipation space
293 on one face of the upper liquid-containing plate body 21 distal
from the lower liquid-containing plate body 23. The first, second
and third radiating fin assemblies 2911, 2921, 2931 are
respectively formed of multiple radiating fins to enlarge the heat
exchange area and enhance heat dissipation efficiency.
[0046] The second radiating fin assembly 2921 disposed in the
second heat dissipation space 292 is equipped with a first
protection case 2922. The third radiating fin assembly 2931
disposed in the third heat dissipation space 293 is equipped with a
second protection case 2932. The first and second protection cases
2922, 2932 serve to protect the radiating fins and prevent the
radiating fins from being deformed due to external collision to
affect the heat dissipation efficiency as a whole. The upper and
lower liquid-containing plate bodies 21, 23 and the first, second
and third radiating fin assemblies 2911, 2921, 2931 together define
a lateral side 30.
[0047] At least one fan 31 is disposed on the lateral side. In this
embodiment, there are three fans 31. Please refer to FIGS. 4A and
4B again. The heat carried by the working fluid is conducted to the
upper and lower liquid-containing plate bodies 21, 23. Then, the
heat passes through the first, second and third radiating fin
assemblies 2911, 2921, 2931. The at least one fan 31 serves to
enhance the heat dissipation effect of the first, second and third
radiating fin assemblies 2911, 2921, 2931.
[0048] In the first embodiment, the upper and lower
liquid-containing plate bodies 21, 23, the first communication tube
251 and the communication passages 27 are, but not limited to, made
of titanium material. Alternatively, the upper and lower
liquid-containing plate bodies 21, 23, the first communication tube
251 and the communication passages 27 can be made of gold, silver,
copper, iron, aluminum, aluminum alloy or copper alloy
material.
[0049] By means of the design of the upper and lower
liquid-containing plate bodies 21, 23 and the first communication
tube 251 of the present invention, the upper and lower
liquid-containing plate bodies 21, 23 themselves have larger heat
absorption area on the inner sides for directly contacting and
conducting the heat carried by the flowing working fluid. Also, the
upper and lower liquid-containing plate bodies 21, 23 themselves
have larger heat dissipation area on the outer sides for quickly
outward dissipating the heat by way of radiation. Accordingly, the
present invention has better heat dissipation performance and
enlarged heat dissipation area. Furthermore, the upper and lower
flow ways 213a, 233a are disposed in the upper and lower liquid
chambers 213, 233 to additionally increase (or prolong) the flowing
time of the working fluid. This can effectively prolong the heat
exchange time of the working fluid with the upper and lower
liquid-containing plate bodies 21, 23. Moreover, the first, second
and third radiating fin assemblies 2911, 2921, 2931 and the at
least one fan 31 serve to enhance the heat dissipation effect. In
addition, the first and second protection cases 2922, 2932 serve to
protect the second and third radiating fin assemblies 2921, 2931
from being deformed when impacted.
[0050] Please further refer to FIGS. 5A, 5B, 5C. FIG. 5A is a
perspective exploded view of a second embodiment of the
multi-outlet-inlet liquid-cooling heat dissipation structure of the
present invention. FIG. 5B is a perspective assembled view of the
second embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention. FIG. 5C is a
partially sectional view of a modified embodiment of the second
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention. As shown in FIGS.
5A and 5B as well as FIGS. 2A to 2D, the second embodiment is
substantially identical to the first embodiment in structure,
connection relationship and effect and thus will not be redundantly
described hereinafter. The second embodiment is different from the
first embodiment in that a first partitioning member 233b is
disposed in the lower liquid chamber 233 to partition the lower
liquid chamber 233 into a first liquid chamber 2331 and a second
liquid chamber 2332, which are independent from each other without
interfering with each other. A second partitioning member 213b is
disposed in the upper liquid chamber 213 to partition the upper
liquid chamber 213 into a third liquid chamber 2131 and a fourth
liquid chamber 2132, which are independent from each other without
interfering with each other. In this embodiment, the
liquid-containing plate body assembly 2 further includes a second
communication tube 252. One end of the second communication tube
252 penetrates through the first top plate 231 to communicate with
the lower liquid chamber 233. The other end of the second
communication tube 252 penetrates through the second bottom plate
212 to communicate with the upper liquid chamber 213. In this
embodiment, the first communication tube 251 communicates with the
first and third liquid chambers 2331, 2131 and the second
communication tube 252 communicates with the second and fourth
liquid chambers 2332, 2132.
[0051] In addition, in this embodiment, the communication passages
27 include a first communication passage 271, a second
communication passage 272, a third communication passage 273 and a
fourth communication passage 274. A first communication opening
271a of the first communication passage 271 communicates with the
first liquid chamber 2331. A second communication opening 272a of
the second communication passage 272 communicates with the second
liquid chamber 2332. A third communication opening 273a of the
third communication passage 273 communicates with the third liquid
chamber 2131. A fourth communication opening 274a of the fourth
communication passage 274 communicates with the fourth liquid
chamber 2132.
[0052] As shown in FIG. 5C, the working fluid flows through the
first and second communication openings 271a, 272a of the first and
second communication passages 271, 272 respectively into the first
and second liquid chambers 2331, 2332. The first partitioning
member 233b isolates the first and second liquid chambers 2331,
2332 from each other so that the working fluid flowing into the
first and second liquid chambers 2331, 2332 respectively passes
through the first and second communication tubes 251, 252 into the
third and fourth liquid chambers 2131, 2132. Finally, the working
fluid respectively flows from the third and fourth communication
openings 273a, 274a of the third and fourth communication passages
273, 274 out of the third and fourth liquid chambers 2131, 2132.
Accordingly, in this embodiment, the heat carried by the working
fluid can be also conducted to the upper and lower
liquid-containing plate bodies 21, 23 and dissipated by way of
radiation.
[0053] In addition, a first flow way 233c, a second flow way 233d,
a third flow way 213c and a fourth flow way 213d are respectively
disposed in the first, second, third and fourth liquid chambers
2331, 2332, 2131, 2132. The first and second flow ways 233c, 233d
are selectively windingly formed on one face of the first top plate
231 and one face of the first bottom board 232 proximal to the
lower liquid chamber 233. The third and fourth flow ways 213c, 213d
are selectively windingly formed on one face of the second top
plate 231 and one face of the second bottom board 212 proximal to
the upper liquid chamber 213 as a flow path for guiding the working
fluid.
[0054] By means of the first, second, third and fourth flow ways
233c, 233d, 213c, 213d, the flowing time of the working fluid
within the first, second, third and fourth liquid chambers 2331,
2332, 2131, 2132 is prolonged so as to prolong the heat exchange
time of the working fluid with the upper and lower
liquid-containing plate bodies 21, 23.
[0055] As shown in FIGS. 5D and 5E, in another modified embodiment,
a first pump 261 is, but not limited to, disposed in the first
liquid chamber 2331. In still another modified embodiment, the
first pump 261 can be alternatively disposed in the third liquid
chamber 2131. In addition, a second pump 262 is, but not limited
to, disposed in the second liquid chamber 2332. In still another
modified embodiment, the second pump 262 can be alternatively
disposed in the fourth liquid chamber 2132. The first and second
pumps serve to drive the working fluid to flow.
[0056] Please further refer to FIGS. 6A, 6B and 6C. FIG. 6A is a
perspective exploded view of a third embodiment of the
multi-outlet-inlet liquid-cooling heat dissipation structure of the
present invention. FIG. 6B is a perspective assembled view of the
third embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention. FIG. 6C is a
partially sectional view of a modified embodiment of the third
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention. As shown in FIGS.
6A and 6B as well as FIGS. 5A to 5G, the third embodiment is
substantially identical to the second embodiment in structure,
connection relationship and effect and thus will not be redundantly
described hereinafter. The third embodiment is different from the
second embodiment in that a third partitioning member 233e is
further disposed in the lower liquid chamber 233 to partition the
first and second liquid chambers 2331, 2332 to respectively form a
fifth liquid chamber 2333 and a sixth liquid chamber 2334. In this
embodiment, the liquid-containing plate body assembly 2 has a first
communication tube 251, a second communication tube 252, a third
communication tube 253 and a fourth communication tube 254. One end
of the third and fourth communication tubes 253, 254 penetrates
through the first top plate 231 to communicate with the lower
liquid chamber 233. The other end of the third and fourth
communication tubes 253, 254 penetrates through the second bottom
plate 212 to communicate with the upper liquid chamber 213. The
first communication tube 251 communicates with the first and third
liquid chambers 2331, 2131. The second communication tube 252
communicates with the second and third liquid chambers 2332, 2131.
The third communication tube 253 communicates with the fifth and
fourth liquid chambers 2333, 2132. The fourth communication tube
254 communicates with the sixth and fourth liquid chambers 2334,
2132.
[0057] In this embodiment, the first communication opening 271a of
the first communication passage 271 communicates with the first
liquid chamber 2331. The first communication opening 271a is the
inlet of the working fluid. The second communication opening 272a
of the second communication passage 272 communicates with the
second liquid chamber 2332. The second communication opening 272a
is the outlet of the working fluid. The third communication opening
273a of the third communication passage 273 communicates with the
fifth liquid chamber 2333. The third communication opening 273a is
the inlet of the working fluid. The fourth communication opening
274a of the fourth communication passage 274 communicates with the
sixth liquid chamber 2334. The fourth communication opening 274a is
the outlet of the working fluid.
[0058] As shown in FIG. 6C, the working fluid flows through the
first communication opening 271a of the first communication passage
271 into the first liquid chamber 2331. The first partitioning
member 233b isolates the first and second liquid chambers 2331,
2332 from each other so that the working fluid flowing into the
first liquid chamber 2331 passes through the first communication
tube 251 into the third liquid chamber 2131 and the working fluid
flowing into the third liquid chamber 2131 thereafter passes
through the second communication tube 252 into the second liquid
chamber 2332 and flows out from the second communication opening
272a of the second communication passage 272. At the same time,
another working fluid flows through the third communication opening
273a of the third communication passage 273 into the fifth liquid
chamber 2333. The first partitioning member 233b isolates the fifth
and sixth liquid chambers 2333, 2334 from each other so that the
working fluid flowing into the fifth liquid chamber 2333 passes
through the third communication tube 253 into the fourth liquid
chamber 2132 and the working fluid flowing into the fourth liquid
chamber 2132 thereafter passes through the fourth communication
tube 254 into the sixth liquid chamber 2334 and flows out from the
fourth communication opening 274a of the fourth communication
passage 274. Accordingly, in this embodiment, the heat carried by
the working fluid can be also conducted to the upper and lower
liquid-containing plate bodies 21, 23 and dissipated by way of
radiation.
[0059] In a modified embodiment, a first flow way 233c, a second
flow way 233d, a third flow way 213c, a fourth flow way 213d, a
fifth flow way 233f and a sixth flow way 233g are respectively
disposed in the first, second, third, fourth, fifth and sixth
liquid chambers 2331, 2332, 2131, 2132, 2333, 2334. The first,
second, fifth and sixth flow ways 233c, 233d, 233f, 233g are
selectively windingly formed on one face of the first top plate 231
and one face of the first bottom board 232 proximal to the lower
liquid chamber 233. The third and fourth flow ways 213c, 213d are
selectively windingly formed on one face of the second top plate
231 and one face of the second bottom board 212 proximal to the
upper liquid chamber 213 as a flow path for guiding the working
fluid.
[0060] By means of the first, second, third, fourth, fifth and
sixth flow ways 233c, 233d, 213c, 213d, 233f, 233g, the flowing
time of the working fluid within the first, second, third, fourth,
fifth and sixth liquid chambers 2331, 2332, 2131, 2132, 2333, 2334
is prolonged so as to prolong the heat exchange time of the working
fluid with the upper and lower liquid-containing plate bodies 21,
23.
[0061] As shown in FIGS. 6D and 6E, as the second embodiment, the
first pump 261 can be disposed in any of the first, second and
third liquid chambers 2331, 2332, 2131, while the second pump 262
can be disposed in any of the fourth, fifth and sixth liquid
chambers 2132, 2333, 2334 to drive the working fluid to flow.
[0062] Please now refer to FIGS. 7A, 7B and 7C. FIG. 7A is a
perspective exploded view of a fourth embodiment of the
multi-outlet-inlet liquid-cooling heat dissipation structure of the
present invention. FIG. 7B is a perspective assembled view of the
fourth embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention. FIG. 7C is a
partially sectional view of a modified embodiment of the fourth
embodiment of the multi-outlet-inlet liquid-cooling heat
dissipation structure of the present invention. As shown in FIGS.
7A and 7B as well as FIGS. 6A to 6E, the fourth embodiment is
substantially identical to the third embodiment in structure,
connection relationship and effect and thus will not be redundantly
described hereinafter. The fourth embodiment is different from the
third embodiment in that a fourth partitioning member 213e is
further disposed in the upper liquid chamber 213 to partition the
third and fourth liquid chambers 2131, 2132 to respectively form a
seventh liquid chamber 2133 and an eighth liquid chamber 2134. In
this embodiment, the liquid-containing plate body assembly 2 has a
first communication tube 251, a second communication tube 252, a
third communication tube 253 and a fourth communication tube 254.
The first communication tube 251 communicates with the first and
third liquid chambers 2331, 2131. The second communication tube 252
communicates with the second and fourth liquid chambers 2332, 2132.
The third communication tube 253 communicates with the fifth and
seventh liquid chambers 2333, 2133. The fourth communication tube
254 communicates with the sixth and eighth liquid chambers 2334,
2134.
[0063] In this embodiment, the first communication opening 271a of
the first communication passage 271 communicates with the first
liquid chamber 2331. The first communication opening 271a is the
inlet of the working fluid. The second communication opening 272a
of the second communication passage 272 communicates with the
second liquid chamber 2332. The second communication opening 272a
is the inlet of the working fluid. The third communication opening
273a of the third communication passage 273 communicates with the
third liquid chamber 2131. The third communication opening 273a is
the outlet of the working fluid. The fourth communication opening
274a of the fourth communication passage 274 communicates with the
fourth liquid chamber 2132. The fourth communication opening 274a
is the outlet of the working fluid.
[0064] The fifth communication opening 275a of the fifth
communication passage 275 communicates with the fifth liquid
chamber 2333. The fifth communication opening 275a is the inlet of
the working fluid. The sixth communication opening 276a of the
sixth communication passage 276 communicates with the sixth liquid
chamber 2334. The sixth communication opening 276a is the inlet of
the working fluid. The seventh communication opening 277a of the
seventh communication passage 277 communicates with the seventh
liquid chamber 2133. The seventh communication opening 277a is the
outlet of the working fluid.
[0065] The eighth communication opening 278a of the eighth
communication passage 278 communicates with the eighth liquid
chamber 2134. The eighth communication opening 278a is the outlet
of the working fluid.
[0066] As shown in FIG. 7C, the working fluid respectively flows
through the first, second, fifth and sixth communication openings
271a, 272a, 275a, 276a of the first, second, fifth and sixth
communication passages 271, 272, 275, 276 into the first, second,
fifth and sixth liquid chambers 2331, 2332, 2333, 2334. The working
fluid flowing into the first liquid chamber 2331 passes through the
first communication tube 251 into the third liquid chamber 2131.
The working fluid flowing into the third liquid chamber 2131
thereafter flows out from the third communication opening 272a of
the third communication passage 273. The working fluid flowing into
the second liquid chamber 2332 passes through the second
communication tube 252 into the fourth liquid chamber 2132. The
working fluid flowing into the fourth liquid chamber 2132
thereafter passes through the fourth communication opening 274a of
the fourth communication passage 274 and flows out.
[0067] The working fluid flowing into the fifth liquid chamber 2333
passes through the third communication tube 253 into the seventh
liquid chamber 2133. The working fluid flowing into the seventh
liquid chamber 2133 thereafter flows out from the seventh
communication opening 277a of the seventh communication passage
277. The working fluid flowing into the sixth liquid chamber 2334
passes through the fourth communication tube 254 into the eighth
liquid chamber 2134. The working fluid flowing into the eighth
liquid chamber 2134 thereafter passes through the eighth
communication opening 278a of the eighth communication passage 278
and flows out. Accordingly, in this embodiment, the heat carried by
the working fluid can be also conducted to the upper and lower
liquid-containing plate bodies 21, 23 and dissipated by way of
radiation.
[0068] In a modified embodiment, a first flow way 233c, a second
flow way 233d, a third flow way 213c, a fourth flow way 213d, a
fifth flow way 233f, a sixth flow way 233g, a seventh flow way 213f
and an eighth flow way 213g are respectively disposed in the first,
second, third, fourth, fifth, sixth, seventh and eighth liquid
chambers 2331, 2332, 2131, 2132, 2333, 2334, 2133, 2134. The first,
second, fifth and sixth flow ways 233c, 233d, 233f, 233g are
selectively windingly formed on one face of the first top plate 231
and one face of the first bottom board 232 proximal to the lower
liquid chamber 233. The third, fourth, seventh and eighth flow ways
213c, 213d, 213f, 213g are selectively windingly formed on one face
of the second top plate 231 and one face of the second bottom board
212 proximal to the upper liquid chamber 213 as a flow path for
guiding the working fluid.
[0069] By means of the first, second, third, fourth, fifth, sixth,
seventh and eighth flow ways 233c, 233d, 213c, 213d, 233f, 233g,
213f, 213g, the flowing time of the working fluid within the first,
second, third, fourth, fifth, sixth, seventh and eighth liquid
chambers 2331, 2332, 2131, 2132, 2333, 2334, 2133, 2134 is
prolonged so as to prolong the heat exchange time of the working
fluid with the upper and lower liquid-containing plate bodies 21,
23.
[0070] In a modified embodiment, the present invention further
includes a third pump 263 and a fourth pump 264. The first pump 261
can be disposed in any of the first and third liquid chambers 2331,
2131. The second pump 262 can be disposed in any of the second and
fourth liquid chambers 2332, 2132. The third pump 263 can be
disposed in any of the fifth and sixth liquid chambers 2333, 2133.
The fourth pump 264 can be disposed in any of the sixth and eighth
liquid chambers 2334, 2134 to drive the working fluid to flow.
[0071] The present invention has been described with the above
embodiments thereof and it is understood that many changes and
modifications in such as the form or layout pattern or practicing
step of the above embodiments can be carried out without departing
from the scope and the spirit of the invention that is intended to
be limited only by the appended claims.
* * * * *